Method and system for forming COF fine circuit, COF and processing method thereof

Abstract

The present invention relates to a method and system for forming a COF fine circuit, a COF and a processing method thereof, wherein the system comprises a UV laser processing device, and the laser parameters output by the laser head of the UV laser processing device are: a spot size of 15-40 μm, and a spot moving speed of 1-3 m / s. The UV laser processing device performs laser engraving on an FCCL substrate transported to the device, and directly engraves the copper foil of the FCCL substrate into a fine circuit. The process and the device of the present invention are simple and have a high yield.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to a method and system for forming a COF fine circuit, a COF and a processing method thereof. Background Art

[0002] The prior art COF (Chip On Flex, or, Chip On Film, commonly known as chip on film) flexible circuit board, hereinafter referred to as COF, has a circuit diagram forming method including: covering a photosensitive layer on a substrate, exposing and imaging, developing, etching, removing the photosensitive layer to finally form a circuit diagram, and finally obtaining COF after mounting chips and electronic components through patching. The prior art method has complex processes and large investments in equipment and plant buildings; and the complex process steps lead to low product yields and high scrap rates of circuit boards; chemical etching also leads to pollution problems. In the above-mentioned exposure and imaging steps, laser equipment is also used for processing, but it is only used for exposure and imaging, and cannot form a circuit in one go. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a method and system for forming a COF fine circuit, a COF and a processing method thereof, so as to solve the problems of the existing method and system for forming a COF fine circuit, which are complex, require large investment, have low product yield and cause environmental pollution.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] A system for forming a COF fine circuit includes a UV laser processing device. The laser parameters output by the laser head of the UV laser processing device are: a spot size of 15-40 μm and a spot moving speed of 1-3 m / s. The UV laser processing device laser engraves an FCCL substrate transported to the device, and directly engraves the copper foil of the FCCL substrate into a fine circuit.

[0006] Furthermore, the output power of the laser equipment is 1~20W; the UV laser processing equipment includes a control center; the control center includes a storage space for storing COF circuit diagram data; the laser head is connected to the control center, and the control center controls the laser head to move in 3D to directly engrave and form a 3D COF fine circuit on the FCCL substrate.

[0007] Furthermore, the control center controls the laser head to perform 3D movement engraving of the circuit according to the input or stored COF circuit diagram data; the control center is the main control board in the UV laser processing equipment; the system also includes a feeding device for conveying FCCL substrate to the UV laser processing equipment.

[0008] The present invention also provides a method for forming a COF fine circuit, comprising the following steps:

[0009] Step 1, providing a FCCL substrate; and

[0010] Step 2: Directly etch the COF fine circuit on the FCCL substrate using a dry process;

[0011] Wherein, the step 2 uses the system for forming COF fine circuits as described above to perform the dry process.

[0012] Furthermore, the step 2 specifically includes:

[0013] Input the circuit diagram data corresponding to COF into the control center of the UV laser processing equipment or store it in the control center;

[0014] Adjust the parameters of the UV laser processing equipment to a spot size of 15-40 μm and a spot moving speed of 1-3 m / s;

[0015] Start the UV laser processing equipment, control the laser head to move 3D according to the input or stored COF circuit diagram data, and directly engrave the 3D COF fine circuit on the FCCL substrate.

[0016] Furthermore, in the step 2, UV laser processing equipment is used to perform laser engraving on the FCCL substrate delivered to the equipment, and the copper foil of the FCCL substrate is directly engraved into a fine circuit.

[0017] Furthermore, in the step 1, the copper foil thickness of the FCCL substrate is 2-8 μm, and the FCCL substrate includes an insulating base film and the copper foil covering the front and back surfaces or one side of the base film.

[0018] The present invention also provides a method for processing COF, including the method for forming a COF fine circuit as described above, and step three: patching to form a COF with electronic components.

[0019] The present invention also provides a COF, wherein the COF is prepared by the method for processing COF as described above, wherein the copper foil of the FCCL substrate of the COF is laser engraved to form a COF fine circuit.

[0020] The beneficial effects of the present invention are:

[0021] The present invention adopts UV laser processing equipment, sets specific output laser parameters, inputs circuit board drawing data into the control system of the laser processing equipment, controls the laser head to perform 3D movement, and directly engraves and forms COF fine circuits on FCCL. The method steps and the equipment adopted by the present invention are simple, low in cost, high in product yield, and have no environmental pollution.

[0022] The present invention is further described in detail below in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 4 is a process flow chart of processing COF according to an embodiment of the present invention.

[0024] Figure 2 FIG. 4 is a schematic diagram of a system for forming a COF fine circuit according to an embodiment of the present invention.

[0025] Figure 3 is a schematic cross-sectional view of the FCCL substrate of the COF of an embodiment of the present invention, wherein Figure 3 (a) and Figure 3 (b) shows examples of two different structures.

[0026] Figure 4 This is a schematic diagram of engraving a circuit diagram on the FCCL coil according to an embodiment of the present invention.

[0027] Figure 5 yes Figure 4 A partial enlarged view of the COF.

[0028] Figure 6 yes Figure 4 A magnified view of another section of the COF. DETAILED DESCRIPTION

[0029] It should be noted that, in the absence of conflict, the various embodiments in the present application and the features in the embodiments may be combined with each other. The present invention is further described in detail below in conjunction with the drawings and specific embodiments.

[0030] An embodiment of the present invention relates to a system 100 for forming a COF fine circuit ( Figure 2 ), including UV laser processing equipment 4 and a feeding device for feeding FCCL substrate 1 to the front of the laser head of the UV laser processing equipment. The laser parameters output by the UV laser processing equipment are: the spot size is 15~40μm, and the spot moving speed is 1~3m / s. The output power of the laser equipment is 1~20W; the UV laser processing equipment includes a control center; the control center includes a storage space for storing COF circuit diagram data; the laser head is connected to the control center, and the control center controls the laser head to move in 3D to engrave the copper foil of FCCL to form a COF fine circuit.

[0031] The control center of the UV laser processing equipment controls the laser head to move in 3D according to the input or stored COF circuit diagram data, so as to directly engrave the COF fine circuit on the FCCL substrate; the laser head of the UV laser processing equipment moves in the horizontal direction and the thickness direction of the copper foil of the FCCL to engrave the circuit, and directly engraves the copper foil of the FCCL substrate to form a 3D circuit structure. In a specific embodiment, the control center of the UV laser processing equipment can be a main control board in the UV laser processing equipment. The storage space can be RAM, ROM, flash memory, EEPROM, hard disk drive, solid state drive, or any other suitable memory or storage medium.

[0032] An embodiment of the present invention further provides a method for forming a COF fine circuit, comprising the following steps:

[0033] Step 1, providing a FCCL substrate; and

[0034] Step 2: Directly etch the COF fine circuit on the FCCL substrate using a dry process;

[0035] The step 2 uses the system 100 for forming a COF fine circuit to perform the dry process. The step 2 specifically includes:

[0036] Inputting circuit diagram data corresponding to COF into the control center of the UV laser processing equipment 4 or storing it in the control center;

[0037] Adjust the laser output parameters of the UV laser processing equipment to a spot size of 15-40 μm and a spot moving speed of 1-3 m / s; and

[0038] Start the UV laser processing equipment and control the laser head to perform 3D moving engraving of the circuit according to the input or stored COF circuit diagram data.

[0039] In step 1, the copper foil thickness of the FCCL substrate is 2-8 μm.

[0040] An embodiment of the present invention further relates to a method for processing a COF, including the above-mentioned method for forming a COF fine circuit, and step three, patching, to form a COF with electronic components.

[0041] The embodiment of the present invention further relates to a COF, wherein the circuit of the COF is formed by engraving the above method for forming a COF fine circuit.

[0042] In the specific example, refer to Figures 1 to 3 The method for processing COF in this embodiment mainly includes:

[0043] Step 1, providing a FCCL substrate 1; and

[0044] Step 2: directly engrave a COF fine circuit 2 on the FCCL substrate 1 using a dry process;

[0045] Step 3: bonding to form COF 3.

[0046] Combination Figure 2-3 In step 1, the FCCL substrate 1 includes an insulating base film 10 and a plurality of insulating base films 10 on both sides (such as Figure 3 (a)) or one side (3(b)) is covered with a copper foil 11, and the thickness of the copper foil 11 can be but not limited to 2~8μm. The copper foil 11 is processed in the subsequent steps to form a COF fine circuit. In this embodiment, the FCCL substrate 1 coil is used as the original material, and the FCCL substrate 1 is continuously transported to the laser processing equipment 4 through a rolling roller. Of course, the FCCL substrate 1 can also be transported to the laser processing equipment 4 as a sheet or block, or through other feeding equipment other than the rolling roller.

[0047] Reference Figure 2 In step 2, through a dry process, i.e., laser engraving, laser processing equipment is used to directly engrave the copper foil 11 of the FCCL substrate through a laser beam to form a COF fine circuit. Engraving is essentially to use a laser to burn off the copper foil other than the circuit connection, leaving only the copper foil corresponding to the circuit diagram. Therefore, after the laser engraving process of step 2, the COF fine circuit 2 is directly obtained. In this step, the laser processing equipment is a UV laser processing equipment 4. The laser output unit of the laser processing equipment 4 is a laser head. The output laser beam with high beam quality is focused into a very small spot, forming a very high power density at the focus. The contacted material is instantly vaporized, thereby removing the copper foil in other areas outside the circuit diagram, and the remaining copper foil area forms a high-precision ultra-fine circuit. Figure 2 .

[0048] When UV laser processing equipment is engraving circuits, its parameters are adjusted as follows:

[0049] The spot size is 15~40μm, the spot moving speed is 1~3m / s, and the power of the laser equipment is 1~20W. The spot moving speed is also the laser engraving speed, and the laser equipment function can be selected to use 20W.

[0050] The specific step 2 is as follows: according to the specific FCCL substrate 1 of step 1 and the circuit to be formed, the corresponding COF circuit diagram data is input into the storage space of the control center of the UV laser processing equipment, the above parameters of the laser processing equipment are adjusted or selected, the FCCL substrate 1 of step 1 is started to be conveyed, and the laser processing equipment is turned on. The control center of the laser processing equipment controls the laser head to perform 3D mobile processing according to the input COF circuit diagram data, and the copper foil of the FCCL substrate 1 is moved in the plane according to the plane diagram of the circuit diagram, and at the same time, it is moved up and down in the thickness direction of the copper foil, so as to perform 3D engraving, so as to remove the remaining copper foil of the FCCL except for the connection line, and form a 3D fine circuit of COF, which is consistent with the circuit diagram data input into the control center of the laser processing equipment. After the FCCL substrate 1 of step 1 is conveyed to the laser processing equipment for engraving, the COF circuit is directly formed in one stop, the method is simple, the equipment is simple, and the movement of the laser head is precisely controlled by the control center of the laser equipment according to the circuit diagram data to form a high-precision COF circuit.

[0051] In this embodiment, FCCL substrate coil is used for laser engraving to form COF circuit. Figure 4-5 , through the UV laser processing equipment 4 of the present invention and step 2 to engrave the FCCL coil, according to the COF circuit diagram data input into the laser processing equipment control center, the copper foil 11 of the FCCL substrate is laser engraved to form a corresponding circuit, and a repeating unit of the COF circuit is formed on the coil, or a plurality of COF circuits are formed, or a whole large COF circuit is formed. Figure 4 The figure shows a COF circuit unit of the FCCL coil after laser engraving, on which a complex and detailed circuit diagram is formed. Figure 5 The enlarged partial view shows that the formed COF circuit includes a group of parallel conductive lines, which are copper foils retained after laser engraving, and the insulating intervals between the conductive connections are formed by the copper foil removed by laser engraving. Among them, the width of the conductive line at the rear end is 71μm, and the insulating interval between two adjacent conductive lines is 63μm; the conductive line extends forward and is dense after bending, the width of the front end of the conductive line is 20μm, and the interval between two adjacent conductive lines is 18μm. Figure 6 In the partial enlarged view shown, the COF circuit line includes a group of parallel conductive lines, the width of the conductive lines is 15.8μm, and the insulation interval between two adjacent conductive lines is 10.6μm. From the order of magnitude of the relevant dimensions of the COF circuit engraved by the laser in the above example, it can be seen that the circuit obtained by the method and system of the present invention is a fine COF circuit, and the conductive lines are conductive, so the product yield is high.

[0052] In step three, the FCCL laser-engraved in step two is directly bonded to obtain a complete COF with electronic components.

[0053] The COF fine circuit obtained in step 2 has a high yield and can be directly mounted without quality inspection, further saving manpower and material resources.

[0054] The method for forming a COF fine circuit of the present invention can be obtained by using the aforementioned steps one and two.

[0055] Refer again Figure 2 The embodiment of the present invention also provides a system 100 for forming a COF fine circuit, including a UV ultraviolet processing device 4 for engraving the FCCL substrate 1 delivered to the device 4 to form a circuit; and also includes a feeding device for delivering the FCCL substrate 1 to the device 4. In this example, the feeding device uses a feeding roller.

[0056] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0057] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] The words "a" or "an" mentioned in the specification or claims of the present invention include both one or more cases, except when it is clearly stated that there is only one. Sometimes, the claims and specifications may include words such as "plurality", "one or more" or "at least one", but in the absence of such a limitation, it does not mean and should not be interpreted as meaning that a plurality cannot be envisioned.

[0059] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, all of which should fall within the scope of the present application. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A system for forming a COF fine circuit, Features: The system includes a UV laser processing device, wherein the laser parameters output by the laser head of the UV laser processing device are: the spot size is 15-40 μm, the spot moving speed is 1-3 m / s; the output power of the laser device is 20 W; The UV laser processing equipment includes a control center; the control center includes a storage space for storing COF circuit diagram data; the laser head is connected to the control center, and the control center controls the laser head to perform 3D movement circuit engraving according to the input or stored COF circuit diagram data; the FCCL substrate transported to the equipment is laser engraved, and the copper foil of the FCCL substrate is moved in a plane according to the plane diagram of the circuit diagram and moved up and down in the thickness direction of the copper foil, thereby performing 3D engraving to remove the remaining copper foil of the FCCL except the conductive wires to form a 3D fine circuit of the COF; the 3D fine circuit of the COF includes a group of parallel conductive wires, and the insulation interval between two adjacent conductive wires reaches 10.6μm.

2. The system according to claim 1, Features: The control center is a main control panel in the UV laser processing equipment; the system also includes a feeding device for feeding the FCCL substrate to the UV laser processing equipment.

3. A method for forming a COF fine circuit, The following steps are involved: Step 1, providing a FCCL substrate; as well as Step 2: Directly etch the COF fine circuit on the FCCL substrate using a dry process; Wherein, the step 2 adopts the system for forming COF fine circuits as described in any one of claims 1 to 2 to perform the dry process.

4. The method according to claim 3, Features: The step 2 specifically includes: Input the circuit diagram data corresponding to COF into the control center of the UV laser processing equipment or store it in the control center; Adjust the parameters of the UV laser processing equipment to a spot size of 15-40 μm and a spot moving speed of 1-3 m / s; Start the UV laser processing equipment, control the laser head to move 3D according to the input or stored COF circuit diagram data, and directly engrave the 3D COF fine circuit on the FCCL substrate.

5. The method according to claim 3, Features: In the step 2, UV laser processing equipment is used to laser engrave the FCCL substrate delivered to the equipment, and the copper foil of the FCCL substrate is directly engraved into a fine circuit.

6. The method according to claim 3, Features: In the step 1, the copper foil thickness of the FCCL substrate is 2-8 μm, and the FCCL substrate includes an insulating base film and the copper foil covering the front and back surfaces or one side of the base film.

7. A method for processing COF, comprising the method for forming a COF fine circuit as claimed in any one of claims 3 to 6, and step three: patching to form a COF with electronic components.

8. A COF, It is characterized in that The COF is prepared by the method for processing COF according to claim 7.

9. The COF according to claim 8, Features: The copper foil of the FCCL substrate of the COF is laser engraved to form a COF fine circuit.

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