Automated silicon wafer conveyor

Abstract

The present application relates to the technical field of silicon wafer coating, and in particular to an automated silicon wafer conveying device, including a back film graphite boat for loading silicon wafers and performing back film coating; a positive film graphite boat for loading silicon wafers and performing front film coating; an intermediate transition pitch between the back film graphite boat and the positive film graphite boat, on which a plurality of bearing positions for carrying silicon wafers are arranged; a first mechanical arm for loading silicon wafers in the back film graphite boat into the bearing positions, and a second mechanical arm for loading silicon wafers in the bearing positions into the positive film graphite boat, wherein the movable ends of the first mechanical arm and the second mechanical arm are both provided with loading suction cups for adsorbing silicon wafers. With such an arrangement, the silicon wafers are transported by the first mechanical arm and the second mechanical arm, thereby avoiding the manual handling process from the back film process to the positive film process, which is conducive to saving manpower and resources; and the loading and unloading of silicon wafers is completed only once, thereby reducing damage to the silicon wafers.

Description

Technical Field

[0001] The present application relates to the technical field of silicon wafer coating, and more specifically, to an automated silicon wafer conveying device. Background Art

[0002] According to the existing solar cell SE+Prec production process, silicon wafers need to go through two processes: back coating and front coating, which are completed separately on different main machines and automated equipment, and the turnover of silicon wafers is completed manually; the process first uses the back passivation equipment to complete the aluminum oxide back film, and then manually transports the silicon wafer to the PECVD process to complete the front coating; however, the existing technology has the following disadvantages:

[0003] During the manual handling and operation process, the manufacturing time of the battery cell is prolonged, and the silicon wafer stays in the air for a long time, which easily pollutes the prepared oxide layer, reducing the yield and efficiency;

[0004] During the transportation and operation process, personnel may easily cause debris and other adverse losses;

[0005] Manual handling increases operational and labor costs;

[0006] The battery cells complete the loading and unloading process on two different automated equipment and are loaded and unloaded by the automated equipment multiple times, which can easily damage the surface of the silicon wafers and break the silicon wafers, increasing the defective rate.

[0007] Therefore, how to solve the problem in the existing silicon wafer coating process that the silicon wafers need to be manually loaded and unloaded, which easily causes damage to the silicon wafers and has high labor costs is a key technical problem that technical personnel in this field need to solve. Summary of the invention

[0008] In order to overcome the problems existing in the related art at least to a certain extent, the purpose of the present application is to provide an automated silicon wafer conveying device, which can solve the problem that in the existing silicon wafer coating process, silicon wafers need to be manually carried and unloaded, which easily causes damage to the silicon wafers and has high labor costs.

[0009] The present application provides an automated silicon wafer conveying device, comprising:

[0010] Back-film graphite boat for loading silicon wafers and performing back-film coating;

[0011] A positive film graphite boat for loading silicon wafers and coating the front side;

[0012] A middle transition pitch between the back film graphite boat and the front film graphite boat, wherein a plurality of bearing positions for bearing silicon wafers are arranged on the middle transition pitch;

[0013] A first robotic arm is used to load the silicon wafers in the back film graphite boat into the carrying position, and a second robotic arm is used to load the silicon wafers in the carrying position into the positive film graphite boat. The movable ends of the first robotic arm and the second robotic arm are both provided with loading suction cups for adsorbing silicon wafers.

[0014] Preferably, the first robot arm and the second robot arm are both provided with a plurality of loading suction cups, which respectively correspond to the carrying positions on the intermediate transition pitch.

[0015] Preferably, it also includes a missing wafer detection mechanism for detecting missing silicon wafers on the carrying position, a patch basket loaded with back-coated silicon wafers, and a patch mechanism for loading the silicon wafers in the patch basket onto the carrying position.

[0016] Preferably, the patch mechanism includes a first slide rail extending in the direction from the patch basket to the middle transition pitch, a first movable platform slidably connected to the first slide rail, a first drive driving the first movable platform to move along the first slide rail, a second slide rail extending in the vertical direction on the first movable platform, a second movable platform slidably connected to the second slide rail, a second drive driving the second movable platform to move, a third slide rail located on the second movable platform, a third movable platform slidably connected to the third slide rail, and a third drive driving the third movable platform to move, and a patch suction cup for adsorbing silicon wafers is provided on the third movable platform; the first slide rail, the second slide rail and the third slide rail are vertically arranged in pairs.

[0017] Preferably, the missing sheet detection mechanism includes a negative pressure gauge connected to the loading suction cup and capable of detecting the negative pressure value of the loading suction cup.

[0018] Preferably, the missing wafer detection mechanism comprises a sensor arranged in the carrying position for sensing the silicon wafer.

[0019] Preferably, a control device is also included, and the chip shortage detection mechanism, the first drive, the second drive and the third drive can be communicatively connected to the control device, and the control device is used to control the driving status of the first drive, the second drive and the third drive according to the detection result of the chip shortage detection mechanism.

[0020] Preferably, a patch track is further included, and the patch basket is arranged on the patch track and can slide along the patch track.

[0021] Preferably, it also includes a loading variable pitch for carrying uncoated silicon wafers and a unloading variable pitch for carrying coated silicon wafers. The first robotic arm is used to load the silicon wafers in the loading variable pitch into the back film graphite boat, and the second robotic arm is used to load the silicon wafers in the positive film graphite boat into the unloading variable pitch.

[0022] Preferably, it also includes a loading track and a unloading track, the loading track is connected to the loading variable pitch transmission and is provided with a loading flower basket, and the unloading track is connected to the unloading variable pitch transmission and is provided with a unloading flower basket.

[0023] The technical solution provided by this application may have the following beneficial effects:

[0024] During the working process, the uncoated silicon wafer is loaded onto the back film graphite boat, so that the silicon wafer enters the back coating equipment with the back film graphite boat and then completes the back coating; after the back coating is completed, the first robot arm takes out the silicon wafer that has completed the back aluminum oxide process from the back film graphite boat and places it on the supporting position of the middle transition pitch; when the front side coating is required, the second robot arm grabs the silicon wafer that has completed the back aluminum oxide process from the supporting position of the middle transition pitch and places it in the positive film graphite boat to be coated with front silicon nitride, and then sends the silicon wafer into the front coating equipment with the positive film graphite boat to complete the positive film process.

[0025] The automated silicon wafer conveying device transfers silicon wafers through the first robotic arm and the second robotic arm, avoiding the manual handling process from the back film process to the front film process, which is beneficial to saving manpower and resources; and the loading and unloading of silicon wafers is completed only once, reducing damage to the silicon wafers.

[0026] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 is a schematic diagram of a top view of the structure of the automatic silicon wafer conveying device according to some exemplary embodiments;

[0030] Figure 2 is a perspective view of a patch mechanism according to some exemplary embodiments.

[0031] In the figure: 1. back film graphite boat; 2. positive film graphite boat; 3. first robotic arm; 4. second robotic arm; 5. intermediate variable pitch; 6. patch mechanism; 7. patch flower basket; 8. patch track; 9. loading variable pitch; 10. unloading variable pitch; 11. loading track; 12. unloading track; 61. first slide rail; 62. first moving platform; 63. first drive; 64. second moving platform; 65. second drive; 66. third moving platform; 67. third drive; 68. patch suction cup. DETAILED DESCRIPTION

[0032] Here, exemplary embodiments will be described in detail, and examples thereof are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are only examples of devices or methods consistent with some aspects of the present application.

[0033] To make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.

[0034] The following is an explanation of the embodiments with reference to the accompanying drawings. In addition, the embodiments shown below do not limit the invention described in the claims. In addition, the entire contents of the configurations shown in the following embodiments are not limited to the solutions required as the invention described in the claims.

[0035] refer to Figure 1-Figure 2The present specific embodiment provides an automated silicon wafer conveying device, comprising a back film graphite boat 1, a positive film graphite boat 2, an intermediate transition pitch 5, a first robot arm 3 and a second robot arm 4, wherein the back film graphite boat 1 is used to load uncoated silicon wafers and complete the back coating of the silicon wafers; the positive film graphite boat 2 is used to load the silicon wafers after the back coating and complete the front coating of the silicon wafers; the intermediate transition pitch 5 is located between the back film graphite boat 1 and the positive film graphite boat 2, and is used to carry and transfer the silicon wafers after the back coating is completed, so as to facilitate the processing of the silicon wafers. Front side coating; the first robot arm 3 is used to load the silicon wafer in the back film graphite boat 1 onto the middle transition pitch 5, and the second robot arm 4 is used to load the silicon wafer on the middle transition pitch 5 onto the positive film graphite boat 2, and the movable ends of the first robot arm 3 and the second robot arm 4 are provided with loading suction cups, which are used to adsorb the silicon wafer. When adsorbing the silicon wafer, the loading suction cup is attached to the side of the silicon wafer, and the inside of the loading suction cup is vacuumed, and then the loading suction cup is adsorbed to the silicon wafer and can move with the first robot arm 3 or the second robot arm 4.

[0036] Specifically, a plurality of bearing positions are provided on the middle transition pitch 5, and the bearing positions are used to bear and hold silicon wafers. One bearing position holds one silicon wafer, and each silicon wafer can be placed separately, thereby avoiding adhesion of adjacent silicon wafers after back coating. Here, a plurality of bearing positions are stacked in a vertical direction and are used for inserting and placing silicon wafers.

[0037] It can be understood that the robot arm is a mechanical electronic device that anthropomorphizes the functions of human arms, wrists and hands; it can move any object or tool according to the time-varying requirements of spatial position and posture, thereby completing the operation requirements of a certain industrial production. Specifically, the first robot arm 3 and the second robot arm 4 are both configured as six-axis robots, which can flexibly move the silicon wafer, which is convenient and reliable, and avoids damage caused by belt transmission and manual handling.

[0038] During the operation, the uncoated silicon wafer is loaded onto the back film graphite boat 1, so that the silicon wafer enters the back coating equipment with the back film graphite boat 1 and then completes the back coating; after the back coating is completed, the first robot arm 3 takes out the silicon wafer that has completed the back aluminum oxide process from the back film graphite boat 1 and places it on the supporting position of the middle transition pitch 5; when front coating is required, the second robot arm 4 grabs the silicon wafer that has completed the back aluminum oxide process from the supporting position of the middle transition pitch 5 and places it in the positive film graphite boat 2 to be coated with front silicon nitride, and then the silicon wafer is sent to the front coating equipment with the positive film graphite boat 2 to complete the positive film process.

[0039] With this arrangement, the silicon wafers are transferred by the first robot arm 3 and the second robot arm 4, avoiding the manual handling process from the back film process to the front film process, which is beneficial to saving manpower and resources; and the loading and unloading of the silicon wafers is completed only once, reducing damage to the silicon wafers.

[0040] In this embodiment, the first robot arm 3 and the second robot arm 4 are both provided with a plurality of loading suction cups, and the number and position of the loading suction cups on the first robot arm 3 and the second robot arm 4 correspond to the bearing positions on the intermediate transition pitch 5, so that the first robot arm 3 and the second robot arm 4 can simultaneously absorb a plurality of silicon wafers and load and unload them on the intermediate transition pitch 5, which is beneficial to improve the loading efficiency. Of course, the number of bearing positions on the intermediate transition pitch 5 can be greater than the number of corresponding loading suction cups. Specifically, the number of bearing positions on the intermediate transition pitch 5 can be an integer multiple of the number of corresponding loading suction cups, so as to facilitate multiple loading, which is beneficial to improve the number of silicon wafers carried.

[0041] Specifically, the middle transition pitch 5 is provided with 28 carrying positions. When the first robot arm 3 loads 28 silicon wafers onto the middle transition pitch 5, the middle transition pitch 5 calibrates the silicon wafers at the carrying positions to ensure that the silicon wafers at the middle transition pitch 5 are regular when the second robot arm 4 grabs the silicon wafers.

[0042] In some embodiments, the automated silicon wafer conveying device further includes a missing wafer detection mechanism, a patching basket 7 and a patching mechanism 6, wherein the missing wafer detection mechanism is used to detect the missing silicon wafers on each carrying position. When the first robotic arm 3 loads the silicon wafers onto the intermediate transition pitch 5, the missing wafer detection mechanism detects the missing silicon wafers on the corresponding carrying position and sends a missing silicon wafer signal, thereby facilitating processing of the missing silicon wafers. Specifically, the missing wafer detection mechanism may be a sensor arranged at each carrying position, or a sensor arranged on the first robotic arm 3; the patching basket 7 is used to load silicon wafers that have completed back-side coating, so as to perform patching processing on the corresponding carrying positions of the missing silicon wafers; the patching mechanism 6 is used to load the silicon wafers in the patching basket 7 into the corresponding carrying positions of the missing silicon wafers, thereby realizing the patching process. It can be understood that the patching mechanism 6 may be a structure of a robotic arm, or an existing structure such as a structure of a transmission line.

[0043] Specifically, the patch mechanism 6 includes a first slide rail 61, a first moving platform 62, a first drive 63, a second slide rail, a second moving platform 64, a second drive 65, a third slide rail, a third moving platform 66 and a third drive 67, wherein the first slide rail 61 extends in the direction from the patch basket 7 to the middle transition pitch 5, the first moving platform 62 is slidably connected to the first slide rail 61, and can be displaced in the extension direction of the first slide rail 61, so as to drive the silicon wafer to move along the patch basket 7 to the middle transition pitch 5; the second slide rail is positioned The second movable platform 64 is slidably connected to the second slide rail and can be displaced in the vertical direction to facilitate loading of silicon wafers at different heights of the carrying positions; the third track is located on the second movable platform 64 and is displaced in the direction approaching or away from the patch basket 7 or the intermediate transition pitch 5, the third movable platform 66 is slidably connected to the third slide rail and can be displaced in the extension direction of the third slide rail to facilitate grabbing silicon wafers from the patch basket 7 and placing the silicon wafers in the intermediate transition pitch 5.

[0044] It should be noted that the "vertical" direction described in this article refers to the situation in which the automated silicon wafer conveying device is in a Figure 1 The direction inside and outside the paper at medium viewing angle.

[0045] The first drive 63 is used to drive the first movable platform 62 to move along the first slide rail 61, the second drive 65 is used to drive the second movable platform 64 to move along the second slide rail, and the third drive 67 is used to drive the third movable platform 66 to move along the third slide rail. Specifically, the first drive 63, the second drive 65 and the third drive 67 can be set as a hydraulic cylinder drive structure or a motor drive structure, which is not specifically limited here.

[0046] Moreover, a patch suction cup 68 is provided on the third movable platform 66. The patch suction cup 68 extends out from the third movable platform 66 and can be used to absorb the silicon wafer, thereby completing the placement and removal of the silicon wafer; the extension directions of the first slide rail 61, the second slide rail and the third slide rail are perpendicular to each other to form a three-dimensional coordinate system with X, Y, and Z axes, which is conducive to accurately controlling the position of the patch suction cup 68 and patching the silicon wafer.

[0047] Among them, the missing wafer detection mechanism includes a negative pressure gauge, the loading suction cup is connected to the negative pressure device through a negative pressure pipeline, and the negative pressure device controls the adsorption of the silicon wafer by controlling the negative pressure condition of the loading suction cup. The negative pressure gauge is set on the first mechanical arm 3 and is connected to the negative pressure pipeline, and then connected to the loading suction cup to detect the negative pressure value of the loading suction cup. When the negative pressure value detected by the negative pressure gauge is greater than the preset value, the silicon wafer is adsorbed by the loading suction cup, and then it is judged that the corresponding silicon wafer at the bearing position is not missing; when the negative pressure value detected by the negative pressure gauge is less than the preset value, the silicon wafer is not adsorbed by the loading suction cup, and then it is judged that the corresponding silicon wafer at the bearing position is missing.

[0048] Of course, the missing wafer detection mechanism includes a sensor, which is set in the bearing position of the middle transition pitch 5. Each bearing position is provided with a sensor to sense whether the silicon wafer is inserted into the bearing position. This detection method is direct and clear, which is conducive to avoiding the influence of other indirect factors. Specifically, the sensor is set as a photoelectric sensor. When the silicon wafer is loaded into the bearing position, the sensor senses the silicon wafer and then determines that the silicon wafer is not missing. When the sensor does not sense the presence of the silicon wafer in the corresponding bearing position, it is determined that the silicon wafer in the bearing position is missing.

[0049] Furthermore, the present automated silicon wafer conveying device also includes a control device, and the wafer missing detection mechanism, the first drive 63, the second drive 65 and the three drives are communicatively connected to the control device, wherein the control device is used to control the driving states of the first drive 63, the second drive 65 and the third drive 67 according to the detection results of the wafer missing detection mechanism. Specifically, when the negative pressure value detected by the negative pressure gauge is less than a preset value, or the sensor senses that a silicon wafer is missing in the corresponding carrying position, the control device controls the first drive 63, the second drive 65 and the third drive 67 to patch the missing position of the silicon wafer, so that the missing position of the silicon wafer corresponds to the patching position, and the patching process is accurate and error-free.

[0050] Of course, the control device can also control the working states of the first robotic arm 3, the second robotic arm 4, the loading suction cup, and the patch suction cup 68, thereby realizing the automation of the silicon wafer coating process. Specifically, the control device is configured as a PLC control system.

[0051] Some preferred schemes further include a patch track 8, and the patch basket 7 is slidably connected to the patch track 8 and slides along the patch track 8 driven by the patch drive, thereby facilitating the loading and unloading of the patch basket 7 and improving work efficiency.

[0052] In some embodiments, the automated silicon wafer conveying device also includes a loading variable pitch 9 and a unloading variable pitch 10, wherein the loading variable pitch 9 is used to carry uncoated silicon wafers so as to adjust the silicon wafers into an arrangement state that is easy for the first robot arm 3 to grasp, and the first robot arm 3 is used to load the silicon wafers in the loading variable pitch 9 into the back film graphite boat 1; the unloading variable pitch 10 is used to carry coated silicon wafers so as to adjust the silicon wafers into an arrangement state that is easy for the second robot arm 4 to grasp, and the second robot arm 4 is used to load the silicon wafers in the positive film graphite boat 2 into the unloading variable pitch 10, and then by adjusting the loading variable pitch 9 and the unloading variable pitch 10, the conveying of silicon wafers in and out is facilitated.

[0053] Furthermore, it also includes a loading track 11 and a unloading track 12, wherein a loading basket is arranged on the loading track 11, and the loading track 11 is connected with the loading variable pitch 9 for transmission, so that the loading track 11 can transfer the silicon wafers in the loading basket to the loading variable pitch 9; the unloading track 12 is provided with a unloading basket, and the unloading track 12 is connected with the unloading variable pitch 10 for transmission, so that the unloading track 12 can transfer the silicon wafers in the unloading basket to the unloading variable pitch 10, thereby facilitating the loading and unloading of the silicon wafer coating process.

[0054] When in use, the operator places the loading basket of silicon wafers that have completed the oxidation process on the three-in-one automatic loading track 11, and the silicon wafers in the loading basket are transferred out one by one and transmitted to the loading variable pitch 9 in a beat transmission mode; when the back side aluminum oxide is not coated on the loading, the first robot arm 3 grabs the silicon wafer from the loading variable pitch 9 and places it in the back film graphite boat 1, and sends it to the back side coating equipment to complete the back film process; after the back film process is completed, the first robot arm 3 takes the silicon wafer that has completed the back side aluminum oxide process out of the back film graphite boat 1 and places it in the middle transition pitch 5, waiting to be grabbed by the second robot arm 4; the second robot arm 4 grabs the silicon wafer that has completed the back side aluminum oxide process from the middle transition pitch 5 and places it in the positive film graphite boat 2 to be coated with front side silicon nitride, and sends it to the front side coating equipment to complete the positive film process; when the front side silicon nitride coating process is completed, the second robot arm 4 takes the silicon wafer from the positive film graphite boat 2 and puts it into the unloading variable pitch 10.

[0055] If during the process of the alumina coated silicon wafer being sucked out of the back film graphite boat 1 by the first robot arm 3, the negative pressure gauge located on the first robot arm 3 detects that a silicon wafer is missing from any suction cup, or the sensor detects that a silicon wafer is missing from the supporting position, a silicon wafer missing limit number and a position signal will be issued, and then the patch mechanism 6 will pick up a silicon wafer from the patch basket 7 and put it into the middle transition pitch 5.

[0056] It should be noted that the words “first”, “second”, “third”, etc. expressed in this article are not intended to limit the specific order, but are merely used to distinguish between various components or functions.

[0057] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

[0058] It can be understood that the same or similar parts of the above embodiments can be referenced to each other, and the contents not described in detail in some embodiments can refer to the same or similar contents in other embodiments.

[0059] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. An automated silicon wafer conveying device, characterized in that: Included are: A back-film graphite boat (1) for loading silicon wafers and performing back-film coating; A positive film graphite boat (2) for loading silicon wafers and performing front-side coating; An intermediate transition pitch (5) located between the back film graphite boat (1) and the front film graphite boat (2), wherein a plurality of bearing positions for bearing silicon wafers are arranged on the intermediate transition pitch (5); A first mechanical arm (3) for loading the silicon wafer in the back film graphite boat (1) onto the carrying position, and a second mechanical arm (4) for loading the silicon wafer in the carrying position onto the positive film graphite boat (2), wherein the movable ends of the first mechanical arm (3) and the second mechanical arm (4) are both provided with loading suction cups for adsorbing the silicon wafer; The first mechanical arm (3) and the second mechanical arm (4) are both provided with a plurality of loading suction cups, which respectively correspond to the load-bearing positions on the intermediate transition pitch (5); It also includes a missing wafer detection mechanism for detecting missing silicon wafers on the carrying position, a patch basket (7) loaded with back-coated silicon wafers, and a patch mechanism (6) for loading the silicon wafers in the patch basket (7) onto the carrying position; The patch mechanism (6) comprises a first slide rail (61) extending in a direction from the patch basket (7) to the intermediate transition pitch (5), a first movable platform (62) slidably connected to the first slide rail (61), a first drive (63) driving the first movable platform (62) to move along the first slide rail (61), a second slide rail extending in a vertical direction on the first movable platform (62), a second movable platform (64) slidably connected to the second slide rail, a second drive (65) driving the second movable platform (64) to move, a third slide rail on the second movable platform (64), a third movable platform (66) slidably connected to the third slide rail, and a third drive (67) driving the third movable platform (66) to move, wherein a patch suction cup (68) for adsorbing a silicon wafer is arranged on the third movable platform (66); the first slide rail (61), the second slide rail and the third slide rail are arranged vertically in pairs; The missing piece detection mechanism includes a negative pressure gauge connected to the loading suction cup and capable of detecting the negative pressure value of the loading suction cup; It also comprises a patch track (8), and the patch flower basket (7) is arranged on the patch track (8) and is capable of sliding along the patch track (8).

2. The automated silicon wafer conveying device according to claim 1, characterized in that: The missing wafer detection mechanism includes a sensor arranged in the carrying position for sensing the silicon wafer.

3. The automated silicon wafer conveying device according to claim 1 or 2, characterized in that: A control device is also included, and the chip shortage detection mechanism, the first drive (63), the second drive (65) and the third drive (67) are communicatively connected to the control device, and the control device is used to control the driving states of the first drive (63), the second drive (65) and the third drive (67) according to the detection result of the chip shortage detection mechanism.

4. The automated silicon wafer conveying device according to claim 1, wherein: It also includes a loading variable pitch (9) for carrying uncoated silicon wafers and a unloading variable pitch (10) for carrying coated silicon wafers. The first robot arm (3) is used to load the silicon wafers in the loading variable pitch (9) into the back film graphite boat (1), and the second robot arm (4) is used to load the silicon wafers in the positive film graphite boat (2) into the unloading variable pitch (10).

5. The automated silicon wafer conveying device according to claim 4, characterized in that: It also includes a loading track (11) and a unloading track (12), wherein the loading track (11) is connected to the loading variable pitch (9) for transmission and is provided with a loading flower basket, and the unloading track (12) is connected to the unloading variable pitch (10) for transmission and is provided with a unloading flower basket.

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