Vehicle-mounted antenna module and vehicle-mounted communication terminal

Abstract

The present application provides a vehicle-mounted antenna module and a vehicle-mounted communication terminal. Among them, the vehicle-mounted antenna module and the vehicle-mounted communication terminal both include a heat exchange module, the heat exchange module includes a cold side and a hot side, the temperature of the cold side is lower than the temperature of the hot side, and the heat exchange module is used to conduct heat from the cold side to the hot side to form a low temperature on the cold side. By fitting the cold side of the heat exchange module with the heating element of the vehicle-mounted antenna module or the vehicle-mounted communication terminal, the heating element can be cooled. The hot side of the heat exchange module can be connected to a heat-saturating metal plate, a radiator, or a metal shell of a vehicle, etc. The heat absorbed by the heat exchange module can be conducted to the hot side and transferred to the environment using a heat-saturating metal plate, a radiator, or a metal shell of a vehicle. Therefore, the technical solution provided by the present application can reduce the temperature of the heating element when it is running in a high-temperature environment, so that the heating element can also operate stably in a high-temperature environment.

Description

Technical Field

[0001] The present application relates to the technical field of electronic component heat dissipation, and in particular to a vehicle-mounted antenna module and a vehicle-mounted communication terminal capable of reducing the operating temperature of a heating element in a high-temperature environment. Background Art

[0002] The development of mobile communication technologies, such as the fifth generation mobile networks (5G), has promoted the development of connected car and autonomous driving technologies. By adding 5G antennas to cars, cars can be connected to high-speed, low-latency 5G networks, enabling the interconnection of cars and cars, and cars and other communication devices, which has broad application prospects in improving vehicle driving experience and driving safety.

[0003] Figure 1 This is a schematic diagram of the car structure with an antenna installed. Figure 1 As shown, in order to improve the communication quality between the car and the outside world, the antenna and the electrical components for processing the antenna signal are usually installed on the roof of the car. These electrical components include a printed circuit board (PCB) and a crystal module (including various chips, etc.) installed on the printed circuit board for processing the antenna signal. Since the environment where the car is driven and parked is mostly outdoors, the roof will be directly exposed to the outdoor sunlight and have a high temperature. When the roof temperature rises, the crystal module installed on the roof will have abnormal phenomena such as overheating and frequency reduction. If the roof temperature reaches the threshold temperature of the crystal module (for example: the threshold temperature of the semiconductor chip is usually 105°C), the crystal module will overheat and self-protect or even be damaged. Therefore, the crystal module installed on the roof must have effective heat dissipation to work stably.

[0004] At present, the heat dissipation of heating elements such as crystal modules is mainly done by air cooling, that is, installing a fan on the heating element, using the fan to speed up the air flow near the heating element, and taking away the heat generated by the heating element for heat dissipation. The air cooling method cannot make the temperature of the heating element fall below the ambient temperature. The higher the ambient temperature, the higher the temperature of the heating element, and the worse the heat dissipation effect of the air cooling method. Therefore, air cooling cannot meet the heat dissipation requirements of the heating element when the roof temperature reaches or approaches the threshold temperature of the heating element. Summary of the invention

[0005] The present application provides a vehicle-mounted antenna module and a vehicle-mounted communication terminal, which can reduce the temperature of a heating element when operating in a high-temperature environment.

[0006] In the first aspect, the present application provides a vehicle-mounted antenna module, comprising: an antenna housing, a printed circuit board module, a heat exchange module, a soaking metal plate and a heat sink; the heat exchange module comprises a cold side and a hot side, the temperature of the cold side is lower than the temperature of the hot side, and the heat exchange module is used to conduct heat from the cold side to the hot side; the printed circuit board module comprises a printed circuit board, an antenna and a crystal module mounted on the printed circuit board, the printed circuit board module is bonded to the cold side; the soaking metal plate is bonded to the hot side; the heat sink is bonded to the side of the soaking metal plate facing away from the heat exchange module; the antenna housing is disposed on the side of the soaking metal plate facing the heat exchange module, the soaking metal plate and the antenna housing are provided with mutually cooperating fixed structures, the soaking metal plate and the antenna housing are fixedly connected by the fixed structure, and the printed circuit board module and the heat exchange module are enclosed in the antenna housing.

[0007] The technical solution provided by the present application utilizes the property that the heat exchange module can conduct heat from the cold side to the hot side, and the cold side is bonded to the printed circuit board module, and the hot side is bonded to the soaking metal plate, so that the heat exchange module can absorb the heat generated by the crystal module on the printed circuit board module on the cold side, cool the printed circuit board module, and transfer the absorbed heat to the soaking metal plate on the hot side, and use the soaking metal plate and the heat sink to dissipate the heat to the environment. Therefore, the technical solution provided by the present application can reduce the temperature of heating elements such as crystal modules when they are running in a high-temperature environment, so that the temperature of the heating element can be lower than the ambient temperature, and even if the ambient temperature rises to the threshold temperature of the heating element, the heating element can still operate stably.

[0008] Optionally, the crystal module is arranged on a side of the printed circuit board facing the heat exchange module; the cold side of the crystal module is bonded and connected. Thus, the heat exchange module can be directly bonded to the crystal module, so that the heat exchange module can directly cool the crystal module.

[0009] Optionally, the printed circuit board is bonded to the cold side; the crystal module is arranged on the side of the printed circuit board facing away from the heat exchange module. Thus, the heat exchange module can be bonded to the printed circuit board, so that a heat exchange channel is established between the crystal module and the heat exchange module via the printed circuit board, and the heat exchange module can indirectly cool the crystal module and other heating elements by cooling the printed circuit board.

[0010] Optionally, the soaking metal plate is recessed in a direction away from the heat exchange module to form a first groove; the heat exchange module is placed in the first groove, and the hot side surface is in contact with the bottom of the first groove; the heat sink is recessed in a direction away from the soaking metal plate to form a second groove that matches the shape of the first groove; the first groove is embedded in the second groove, and the first groove and the second groove are in close contact. As a result, the first groove and the second groove allow the heat exchange module, the soaking metal plate and the radiator to be nested and connected with each other, increasing the contact area between the heat exchange module, the soaking metal plate and the radiator, which is beneficial to improving the heat transfer efficiency between the heat exchange module, the soaking metal plate and the radiator.

[0011] Optionally, a heat conducting medium is provided between the heat exchange module and the crystal module, and the cold side and the crystal module are connected by the heat conducting medium. The heat conducting medium can fill the gap between the heat exchange module and the crystal module, thereby improving the heat transfer efficiency between the cold side and the crystal module.

[0012] Optionally, the antenna is arranged on a side of the printed circuit board facing away from the heat exchange module, so that the antenna is directly exposed under the antenna housing and there is no other obstacle between the antenna and the antenna housing, so that the signal strength when the antenna communicates with the external device will not be affected.

[0013] Optionally, the heat exchange module is a thermoelectric cooler (TEC). Thus, by utilizing the Peltier effect of the thermoelectric cooler, the Peltier effect can be energized to form a cold side and a hot side, wherein the temperature of the cold side can be much lower than the ambient temperature. Therefore, using the cold side to cool the heating element can significantly reduce the temperature of the heating element.

[0014] Optionally, the thermoelectric cooler includes a plurality of thermocouple pairs, which are formed by connecting an N-type semiconductor and a P-type semiconductor; the plurality of thermocouple pairs are arranged between two ceramic electrodes; the thermocouple pairs are used to transfer heat from the cold side to the hot side when current passes through.

[0015] Optionally, the heat sink is provided with a fin structure on the side facing away from the soaking metal plate; the fin structure includes a plurality of fins, the fins extend away from the soaking metal plate; the plurality of fins are arranged in parallel at intervals. The fin structure can increase the heat dissipation area of ​​the heat sink and improve the heat dissipation efficiency of the heat sink.

[0016] In the second aspect, the present application provides a vehicle-mounted communication terminal, including: a terminal shell, a printed circuit board module, a heat conductive medium and a heat exchange module; the terminal shell is arranged on the inner side of the metal shell of the vehicle, and the terminal shell is provided with an opening, and the opening is arranged facing the metal shell; the heat exchange module is arranged in the opening, and the heat exchange module includes a cold side and a hot side, the cold side is arranged facing the terminal shell, and the hot side is arranged facing the metal shell, the temperature of the cold side is lower than the temperature of the hot side, and the heat exchange module is used to conduct heat from the cold side to the hot side; the printed circuit board module is arranged in the terminal shell, the printed circuit board module includes a printed circuit board, an antenna and a crystal module installed on the printed circuit board, and the printed circuit board module is bonded to the cold side; the heat conductive medium is arranged between the heat exchange module and the metal shell, and the hot side and the metal shell are bonded and connected by the heat conductive medium.

[0017] The technical solution provided by the present application utilizes the property that the heat exchange module can conduct heat from the cold side to the hot side, and the cold side is bonded to the printed circuit board module, and the hot side is bonded to the metal shell of the vehicle. The metal shell is used as a heat-saturating metal plate and a heat sink, so that the heat exchange module can absorb the heat generated by the crystal module on the printed circuit board module on the cold side, cool the printed circuit board module, and transfer the absorbed heat to the metal shell on the hot side, and dissipate the heat to the environment through the metal shell. Therefore, the technical solution provided by the present application can reduce the temperature of heating elements such as crystal modules when operating in a high-temperature environment, so that the temperature of the heating element can be lower than the ambient temperature, and even if the ambient temperature rises to the threshold temperature of the heating element, the heating element can still operate stably.

[0018] Optionally, the crystal module is arranged on a side of the printed circuit board facing the heat exchange module; the cold side of the crystal module is bonded and connected. Thus, the heat exchange module can be directly bonded to the crystal module, so that the heat exchange module can directly cool the crystal module.

[0019] Optionally, the printed circuit board is bonded to the cold side; the crystal module is arranged on the side of the printed circuit board facing away from the heat exchange module. Thus, the heat exchange module can be bonded to the printed circuit board, so that a heat exchange channel is established between the crystal module and the heat exchange module via the printed circuit board, and the heat exchange module can indirectly cool the crystal module and other heating elements by cooling the printed circuit board.

[0020] Optionally, the heat exchange module is a thermoelectric cooler (TEC). Thus, by utilizing the Peltier effect of the thermoelectric cooler, the Peltier effect can be energized to form a cold side and a hot side, wherein the temperature of the cold side can be much lower than the ambient temperature. Therefore, by using the cold side to cool the heating element, the temperature of the heating element can be greatly reduced.

[0021] Optionally, the thermoelectric cooler includes a plurality of thermocouple pairs, which are formed by connecting an N-type semiconductor and a P-type semiconductor; the plurality of thermocouple pairs are arranged between two ceramic electrodes; the thermocouple pairs are used to transfer heat from the cold side to the hot side when current passes through.

[0022] In a third aspect, the present application provides a vehicle, the vehicle comprising the vehicle-mounted antenna module provided in the first aspect. The roof shell of the vehicle is provided with a cavity for accommodating the vehicle-mounted antenna module, the vehicle-mounted antenna module is arranged in the cavity, and the roof shell is also provided with an antenna cover, which is buckled and installed on the cavity to close the cavity, so that the vehicle-mounted antenna module is hidden inside the roof shell without affecting the appearance of the roof.

[0023] In a fourth aspect, the present application provides a vehicle, which includes the vehicle-mounted communication terminal provided in the second aspect. The vehicle-mounted communication terminal is hidden inside the roof shell of the vehicle, and the vehicle-mounted communication terminal is connected to the vehicle's external antenna through a cable, etc., and the external antenna can be a shark fin antenna at the rear of the roof. The vehicle-mounted communication terminal establishes a communication connection with a mobile device through the external antenna to realize the vehicle information display and control of the mobile device APP. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the car structure with an antenna installed;

[0025] Figure 2 This is a schematic diagram of the structure of the current air-cooling solution;

[0026] Figure 3 is a structural exploded view of the heat dissipation device provided in the first embodiment of the present application;

[0027] Figure 4 is a schematic structural diagram of a soaking metal plate provided in the first embodiment of the present application;

[0028] Figure 5 is a schematic diagram of the structure of the heat sink provided in the first embodiment of the present application;

[0029] Figure 6 is a schematic structural diagram of a heat exchange module provided in the first embodiment of the present application;

[0030] Figure 7 is a cross-sectional view taken along line B of the heat dissipation device provided in the first embodiment of the present application;

[0031] Figure 8 It is a structural schematic diagram of a heat dissipation device applied to heat dissipation of a printed circuit board module;

[0032] Fig. 9 is another structural schematic diagram of a heat sink applied to a printed circuit board module for heat dissipation;

[0033] Fig.10 is a structural schematic diagram of a vehicle-mounted antenna module provided in a fourth embodiment of the present application;

[0034] Fig.11 is a cross-sectional view in the direction of B of the vehicle-mounted antenna module provided in the fourth embodiment of the present application;

[0035] Fig.12 is a schematic diagram of installing a vehicle-mounted antenna module on a vehicle roof provided in a fourth embodiment of the present application;

[0036] Fig.13 It is a schematic diagram of the communication between the vehicle-mounted communication terminal and the mobile device;

[0037] Fig.14 is a structural schematic diagram of a vehicle-mounted communication terminal provided in a fifth embodiment of the present application;

[0038] Fig.15 It is a flow chart of the temperature control method provided in the sixth embodiment of the present application.

[0039] Illustration Description:

[0040] Among them, 011-heat sink, 012-fan, 100-heat exchange module, 200-heat equalizing metal plate, 210-first groove, 220-fixed structure, 300-heat sink, 310-fin structure, 311-fin, 320-second groove, 400-heating element, 500-printed circuit board module, 510-printed circuit board, 520-antenna, 530-crystal module, 600-antenna housing, 610-fixed structure, 700-heat conductive medium, 800-terminal housing, 810-opening, 910-roof housing, 920-interior decoration, 930-vehicle antenna module, 940-cavity, 950-radome, 960-vehicle communication terminal, 970-external antenna, 980-mobile device. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present application will be described clearly below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments of the present application, other embodiments obtained by ordinary technicians in this field without making creative work all belong to the protection scope of the present application.

[0042] Figure 2 It is a structural diagram of the current air-cooling heat dissipation solution.

[0043] like Figure 1As shown, the current air-cooling heat dissipation scheme includes a heat sink 011 and a fan 012. The heat sink 011 is attached to the heating element 400 to absorb the heat generated by the heating element 400. The fan 012 is arranged on the heat sink 011 and blows air toward the heat sink 011 to accelerate the air flow near the heating element 400 and take away the heat generated by the heating element 400 for heat dissipation. The air-cooling heat dissipation method cannot make the temperature of the heating element 400 reach below the ambient temperature, and the higher the ambient temperature and the higher the temperature of the heating element 400, the worse the heat dissipation effect of the air-cooling heat dissipation method. When the ambient temperature reaches or approaches the threshold temperature of the heating element 400, the air-cooling heat dissipation method cannot meet the heat dissipation requirements of the heating element 400. In addition, the fan 012 will generate noise when running. If the fan 012 is arranged on the roof, it will also affect the riding experience of the passengers in the car. In addition, the air-cooling heat dissipation method requires good air flow, and the roof space is relatively closed, which cannot meet the air flow requirements of the air-cooling heat dissipation method. In addition, the roof space is relatively flat. If a fan 012 is to be placed on the roof, the thickness of the roof must be increased, which affects the aesthetic shape of the entire vehicle.

[0044] In order to solve the above problems, the present application provides a heat dissipation device, as well as a vehicle-mounted antenna module and a vehicle-mounted communication terminal including the vehicle-mounted heat dissipation device, which can reduce the temperature of the heating element 400 (for example: a crystal module such as a chip) to below the ambient temperature.

[0045] The following is the first embodiment of the present application.

[0046] A first embodiment of the present application provides a heat dissipation device. Figure 3 : is a structural exploded view of the heat dissipation device provided in the first embodiment of the present application. Figure 3 As shown, the heat dissipation device includes: a heat exchange module 100, a heat-saturating metal plate 200 and a heat sink 300. The heat exchange module 100, the heat-saturating metal plate 200 and the heat sink 300 are arranged along Figure 3 In the A-direction stacking arrangement, the heat-spreading metal plate 200 is located between the heat exchange module 100 and the heat sink 300.

[0047] The heat exchange module 100 includes a cold side and a hot side, and the cold side is opposite to the hot side. The heat exchange module 100 can transfer heat from the cold side to the hot side under external action (for example, voltage, current, pressure, light, etc.) or spontaneously, so that the cold side has a temperature lower than the environment. The hot side of the heat exchange module 100 is attached to one side of the soaking metal plate 200, and the heat sink 300 corresponds to the heat exchange module 100 attached to the other side of the soaking metal plate 200. A thermal conductive medium, such as thermal grease or a thermal conductive pad, can be filled between the heat exchange module 100 and the heat-absorbing metal plate 200 to fill any gaps that may exist after the heat exchange module 100 and the heat-absorbing metal plate 200 are bonded together, which is beneficial for heat transfer between the heat exchange module 100 and the heat-absorbing metal plate 200; a thermal conductive medium can also be filled between the heat-absorbing metal plate 200 and the heat sink 300 to fill any gaps that may exist after the heat-absorbing metal plate 200 and the heat sink 300 are bonded together, which is beneficial for heat transfer between the heat-absorbing metal plate 200 and the heat sink 300; the heat transfer path from the heat exchange module 100 to the heat-absorbing metal plate 200 and then to the heat sink 300 is uninterrupted, thereby achieving a higher heat transfer efficiency.

[0048] Figure 4 2 is a schematic diagram of the structure of the heat-saturating metal plate 200 provided in the first embodiment of the present application. Figure 4 As shown, the soaking metal plate 200 is recessed in the direction A away from the heat exchange module 100 to form a first groove 210. The size of the first groove 210 is greater than or equal to the size of the heat exchange module 100, so that the heat exchange module 100 can be placed in the first groove 210. The soaking metal plate 200 can be made of materials with excellent thermal conductivity such as copper and aluminum. The size of the soaking metal plate 200 is greater than the size of the heat exchange module 100, so that the soaking metal plate 200 can completely cover the heat exchange module 100, have a larger contact area with the heat exchange module 100, fully absorb the heat from the heat exchange module 100, and improve the heat dissipation performance of the heat exchange module 100.

[0049] Figure 5 Schematic diagram of the structure of the heat sink 300 provided in the first embodiment of the present application. Figure 5As shown, the heat sink 300 is hollowed out on the side facing the soaking metal plate 200 to form a second groove 320 that matches the shape of the first groove 210. The first groove 210 of the soaking metal plate 200 can be embedded in the second groove 320 of the heat sink 300, so that the first groove 210 and the second groove 320 form a close contact, increase the contact area between the soaking metal plate 200 and the heat sink 300, and improve the heat transfer efficiency between the soaking metal plate 200 and the heat sink 300. A fin structure 310 is provided on the side of the heat sink 300 facing away from the soaking metal plate 200. The fin structure includes a plurality of fins 311 arranged in parallel at intervals, and the fins extend in a direction away from the soaking metal plate. The fin structure 310 can increase the surface area of ​​the heat sink 300, which is beneficial to improving the heat dissipation performance of the heat sink 300.

[0050] Figure 6 Schematic diagram of the structure of the heat exchange module 100 provided in the first embodiment of the present application. Figure 6 As shown, the heat exchange module 100 can be a thermoelectric cooler (TEC), which is a cooling device made by using the Peltier effect of semiconductors. The so-called Peltier effect refers to the phenomenon that when current passes through a galvanic couple composed of two semiconductor materials, heat transfer will occur at both ends of the galvanic couple, that is, heat will be transferred from one end to the other end, forming a phenomenon in which one end absorbs heat and the other end releases heat. N-type semiconductors and P-type semiconductors obtained based on heavily doped bismuth telluride are the main materials for making thermoelectric coolers. Bismuth telluride elements are electrically connected in series and generate heat in parallel. The thermoelectric cooler includes a plurality of thermocouple pairs (groups) formed by connecting N-type semiconductors and P-type semiconductors, which are connected together by electrodes and arranged between two ceramic electrodes. When current flows through the thermoelectric cooler, the thermocouple pair transfers heat from one side of the thermoelectric cooler to the other side of the thermoelectric cooler, so that the thermoelectric cooler generates a hot side (the side where heat is input) and a cold side (the side where heat is output), wherein the temperature of the cold side can be much lower than the ambient temperature.

[0051] It should be noted that the heat exchange module 100 in the present application can be other refrigerators besides a thermoelectric cooler. Figure 6 The thermoelectric cooler shown includes a hot side and a cold side, wherein the heat in the cooler can be transferred from the cold side to the hot side under external action (eg voltage, current, pressure, etc.) or spontaneously, so that the cold side has a lower temperature.

[0052] Figure 7 2 is a cross-sectional view of the heat dissipation device provided in the first embodiment of the present application in the direction of B. Figure 7As shown, the heat sink 300 and the soaking metal plate 200 form a tight embedded connection using their respective groove structures. The heat exchange module 100 is arranged in the first groove 210 of the soaking metal plate 200, the hot side of the heat exchange module 100 faces the first groove 210, and the hot side of the heat exchange module 100 contacts the bottom of the first groove 210. The depth H1 of the first groove 210 along the A direction can be less than or equal to the thickness B1 of the heat exchange module 100 along the A direction. In this way, when the heat exchange module 100 is arranged in the first groove 210, the cold side of the heat exchange module 100 is higher than the soaking metal plate 200, so that the cold side of the heat exchange module 100 can contact the heating element 400. The depth H1 of the first groove 210 along the direction A may also be greater than the thickness B1 of the heat exchange module 100 along the direction A. Thus, when the heat exchange module 100 is disposed in the first groove 210, the cold side of the heat exchange module 100 is lower than the heat-averaging metal plate 200, and the heating element 400 may be partially disposed in the first groove 210 and in contact with the heat exchange module 100, which is beneficial to reducing the total thickness of the heat dissipation device and the heating element 400 after contact.

[0053] The heating element 400 in the present application includes but is not limited to a printed circuit board (PCB), a crystal module (including various chips, such as a system on a chip (SOC), a radio frequency front-end chip, a modem chip, etc.), and other electronic components that can generate heat during operation.

[0054] Combine the following Figure 7 The working principle of the heat dissipation device provided in the first embodiment of the present application is described in detail. Figure 7 As shown, the heating element 400 is attached to the cold side of the heat exchange module 100; when the heat exchange module 100 is in operation, it can transfer heat from the cold side to the hot side, so that the cold side has a temperature lower than the environment; therefore, the heat exchange module 100 can cool the heating element 400 on the cold side, so that the temperature of the heating element 400 drops significantly and is lower than the ambient temperature, so that the components can operate stably in high ambient temperatures. The heat on the hot side of the heat exchange module 100 can diffuse to the heat-saturating metal plate 200, and further diffuse to the heat sink 300 through the heat-saturating metal plate 200. Since the heat sink 300 has a fin structure 310, it can have a larger contact area with the environment and efficiently diffuse the heat into the environment.

[0055] The technical solution provided in the first embodiment of the present application has the following beneficial effects: the heat dissipation device provided in the first embodiment of the present application forms a cooling and heat transfer channel from the components to the external environment, which can reduce the temperature of the heating element 400 itself to below the ambient temperature. Even if the ambient temperature is higher than the threshold temperature for normal operation of the heating element 400, the temperature of the heating element 400 can be reduced to below the threshold temperature, and overheating protection, frequency reduction (when the heating element 400 is a semiconductor chip) and damage will not occur, so that the heating element 400 can operate stably in high ambient temperature.

[0056] The following is a second embodiment of the present application.

[0057] The second embodiment of the present application provides an embodiment of applying a heat dissipation device to a printed circuit board module 500 to dissipate heat. Figure 8 FIG. 5 is a schematic diagram of a structure of a heat dissipation device applied to a printed circuit board module 500 for heat dissipation. Figure 8 As shown, the printed circuit board module 500 includes a printed circuit board 510 and various components mounted on the printed circuit board 510. For example, when the printed circuit board module 500 is a vehicle-mounted smart antenna system, the components mounted on the printed circuit board 510 may include an antenna 520 and a crystal module 530 (including various chips, etc.) for processing antenna signals.

[0058] In the second embodiment of the present application, the cold side of the heat exchange module 100 is attached to the surface of the crystal module 530, which can directly cool the crystal module 530 so that the temperature of the crystal module 530 is always lower than the ambient temperature. Therefore, even if the ambient temperature is higher than the threshold temperature for the normal operation of the heating element 400, the temperature of the crystal module 530 can be reduced to below the threshold temperature, and overheat protection, frequency reduction and damage will not occur, so that the crystal module 530 can operate stably.

[0059] The following is the third embodiment of the present application.

[0060] The third embodiment of the present application provides another implementation of a heat dissipation device applied to a printed circuit board module 500 . Fig. 9 FIG. 2 is another schematic diagram of a heat dissipation device applied to a printed circuit board module 500 to dissipate heat. Fig. 9 As shown, the printed circuit board module 500 includes a printed circuit board 510 and various components mounted on the printed circuit board 510. For example, when the printed circuit board module 500 is a vehicle-mounted smart antenna module, the components mounted on the printed circuit board 510 may include an antenna 520 and a crystal module 530 (including various chips, etc.) for processing antenna signals.

[0061] In the third embodiment of the present application, the cold side of the heat exchange module 100 is directly attached to the printed circuit board 510, which can directly cool the printed circuit board 510, reduce the overall temperature of the printed circuit board 510, and make the local temperature of the printed circuit board 510 lower than the ambient temperature. When the crystal module 530 installed on the printed circuit board 510 generates heat, a greater temperature difference will be generated between the crystal module 530 and the printed circuit board 510, so that the heat of the crystal module 530 is accelerated to the printed circuit board 510, which is conducive to reducing the temperature of the crystal module 530.

[0062] It should be noted that the cold side of the heat exchange module 100 can be attached to the position of the printed circuit board 510 corresponding to the crystal module 530 with a large heat generation, so that the shortest heat exchange channel is established between the crystal module 530 and the heat exchange module 100 via the printed circuit board 510, which is conducive to reducing the temperature of the crystal module 530 below the ambient temperature. Therefore, even if the ambient temperature is higher than the threshold temperature for the normal operation of the heating element 400, the temperature of the crystal module 530 can be reduced to below the threshold temperature, and overheat protection, frequency reduction and damage will not occur, so that the crystal module 530 can operate stably.

[0063] The following is the fourth embodiment of the present application.

[0064] The fourth embodiment of the present application provides a vehicle-mounted antenna module, which includes the heat dissipation device of the above embodiments of the present application. Fig.10 Schematic diagram of the structure of the vehicle antenna module provided by the fourth embodiment of the present application. Fig.10As shown, the vehicle-mounted antenna module includes an antenna housing 600, a printed circuit board module 500, a heat-conducting medium 700, a heat exchange module 100, a soaking metal plate 200 and a heat sink 300. The heat exchange module 100, the soaking metal plate 200 and the heat sink 300 are stacked, the heat exchange module 100 is arranged on one side of the soaking metal plate 200, the heat sink 300 is arranged on the other side of the soaking metal plate 200, and the soaking metal plate 200 is located between the heat exchange module 100 and the heat sink 300. The hot side surface of the heat exchange module 100 is arranged facing the soaking metal plate, and the soaking metal plate 200 is recessed in a direction away from the heat exchange module 100 to form a first groove 210, and the size of the first groove 210 is greater than or equal to the size of the heat exchange module 100. The heat exchange module 100 is placed in the first groove 210, and the hot side surface of the heat exchange module is in contact with the bottom of the first groove 210. The soaking metal plate 200 can be made of materials with excellent thermal conductivity such as copper and aluminum. The size of the soaking metal plate 200 is larger than that of the heat exchange module 100, so that the soaking metal plate 200 can completely cover the heat exchange module 100, fully absorb the heat from the heat exchange module 100, and improve the heat dissipation performance of the heat exchange module 100. The heat sink 300 is recessed in a direction away from the soaking metal plate 200 on the side facing the soaking metal plate 200 to form a second groove 320 that matches the shape of the first groove 210. The first groove 210 of the soaking metal plate 200 can be embedded in the second groove 320 of the heat sink 300, so that the first groove 210 and the second groove 320 form a close fit, increase the contact area between the soaking metal plate 200 and the heat sink 300, and improve the heat transfer efficiency between the soaking metal plate 200 and the heat sink 300. The printed circuit board module 500 is arranged facing the cold side of the heat exchange module 100, and the printed circuit board module 500 includes a printed circuit board 510, an antenna 520 and a crystal module 530. The antenna 520 is arranged on the side of the printed circuit board 510 facing away from the heat exchange module 100. The crystal module 530 is arranged on the side of the printed circuit board 510 facing the heat exchange module 100, and the crystal module 530 is attached to the cold side of the heat exchange module 100. The heat-saturating metal plate 200 and the antenna housing 600 are provided with matching fixing structures 220 and fixing structures 610. The antenna housing 600 is arranged along the direction from the printed circuit board module 500 to the heat sink 300 (i.e. Fig. 9The A direction in the figure is buckled on the soaking metal plate 200, and is fixedly connected to the soaking metal plate 200 through the fixing structure 220 and the fixing structure 610, so that the printed circuit board module 500 and the heat exchange module 100 are enclosed in the antenna housing 600, so that the printed circuit board module 500 and the heat exchange module 100 are isolated from the external environment, and the printed circuit board module 500 and the heat exchange module 100 are prevented from being immersed in water or being affected by sunlight, dust, etc. The vehicle-mounted antenna module provided in the embodiment of the present application can be installed on the body of a car, such as the roof of a car, so that the car has the ability to communicate wirelessly with other network devices.

[0065] Fig.11 FIG. 2 is a cross-sectional view of the vehicle-mounted antenna module provided in the fourth embodiment of the present application in the direction of B. Fig.11 As shown, the antenna housing 600 has an arc structure that matches the curvature of the roof. The antenna 520 is arranged on the side of the printed circuit board 510 facing the antenna housing 600. The crystal module 530 is arranged on the side of the printed circuit board 510 facing the soaking metal plate. The crystal module 530 is attached to the cold side of the heat exchange module 100 through the heat conducting medium 700. The soaking metal plate 200 is attached to the hot side of the heat exchange module 100.

[0066] In the embodiment of the present application, the antenna housing 600 can be made of non-metallic materials such as plastic and fiber, so that the electromagnetic wave signal can penetrate the antenna housing 600 and be received by the antenna 520, and the electromagnetic wave signal emitted by the antenna 520 can also penetrate the antenna housing 600 and be received by other devices. The antenna housing 600 can also be made of metal material, and a gap is formed by removing material, and the gap is filled with non-metallic materials such as plastic to form a micro-slit antenna 520 structure.

[0067] Fig.12 FIG. 4 is a schematic diagram of the installation of the vehicle-mounted antenna module on the roof provided in the fourth embodiment of the present application. Fig.12 As shown, the roof shell 910 of the automobile is provided with a cavity 940 for accommodating the vehicle-mounted antenna module 930. The vehicle-mounted antenna module 930 is arranged in the cavity 940. The roof shell 910 is also provided with an antenna cover 950. The antenna cover 950 is snap-fitted and installed on the cavity 940 to close the cavity 940, so that the vehicle-mounted antenna module 930 is hidden inside the roof shell 910 without affecting the appearance of the roof.

[0068] Combine the following Fig.11The beneficial effects that can be achieved by the vehicle-mounted antenna module provided in the fourth embodiment of the present application are specifically described. The vehicle-mounted antenna module can usually be set on the shell of the car, such as the roof. Since the environment in which the car is driven and parked is mostly outdoors, the roof will often be exposed to the sun and the temperature is very high. The high temperature environment of the roof poses a challenge to the normal operation of the vehicle-mounted intelligent module. The high temperature environment and the heat generated when the crystal module 530 is running are superimposed, which can make the temperature of the crystal module 530 close to or even higher than the threshold temperature (for example: the threshold temperature of the semiconductor chip is about 105°C), resulting in overheating and frequency reduction, power-off self-protection or even damage to the crystal module 530. Traditional vehicle-mounted antenna module. Use fan heat dissipation, that is, use a fan to speed up the air flow near the crystal module 530, take away the heat, and achieve cooling of the crystal module 530. Since fan heat dissipation cannot make the temperature of the crystal module 530 lower than the ambient temperature, in a high temperature environment, the cooling effect of the fan heat dissipation on the crystal module 530 is very poor, and the crystal module 530 still has the risk of overheating. The vehicle-mounted antenna module provided in the fourth embodiment of the present application is cooled by the heat dissipation device provided in any of the above embodiments, and the temperature of the crystal module 530 can be reduced to below the ambient temperature. Even if the roof is exposed to the sun and reaches a very high temperature, the temperature of the crystal module 530 will not approach the threshold temperature, so that the crystal module 530 continues to operate stably without frequency reduction, self-protection triggering, or damage. In addition, the vehicle-mounted antenna module provided in the fourth embodiment of the present application is fanless, so it does not generate noise, does not need to add an air duct on the roof, has a compact structure, does not increase the thickness of the roof, does not affect the appearance of the entire vehicle, and improves the user experience.

[0069] The following is the fifth embodiment of the present application.

[0070] The fifth embodiment of the present application provides a vehicle-mounted communication terminal. The vehicle-mounted communication terminal partially includes the heat dissipation device of the aforementioned embodiments of the present application. The vehicle-mounted communication terminal is also called a vehicle-mounted T-BOX (Telematics BOX), which is one of the four major components of the Internet of Vehicles system (the Internet of Vehicles system includes: a host, a vehicle-mounted T-BOX, a mobile device APP and a background system). The vehicle-mounted communication terminal is mainly used to communicate with the background system / mobile device to realize the vehicle information display and control of the mobile device APP. Among them, the mobile device can be, for example, a mobile phone, a tablet computer, a smart wearable device, etc.

[0071] Fig.13 It is a schematic diagram of the communication between the vehicle-mounted communication terminal and the mobile device. Fig.13As shown, the vehicle-mounted communication terminal 960 is hidden inside the roof shell 910 of the car, and the vehicle-mounted communication terminal 960 is connected to the external antenna 970 of the car through a cable, etc., and the external antenna can be a shark fin antenna at the rear of the roof. The vehicle-mounted communication terminal 960 establishes a communication connection with the mobile device 980 through the external antenna 970 to realize the vehicle information display and control of the mobile device APP.

[0072] Fig.14 Schematic diagram of the structure of the vehicle-mounted communication terminal provided in the fifth embodiment of the present application. Fig.14 As shown, the vehicle-mounted communication terminal includes a terminal housing 800, a printed circuit board module 500, a heat-conducting medium 700 and a heat exchange module 100. The vehicle-mounted communication terminal can be arranged on the inner side of a vehicle metal housing, such as the inner side of a roof housing 910. In this way, the roof housing 910 is equivalent to the heat-saturating metal plate 200 in any of the aforementioned embodiments. The terminal shell 800 is provided with an opening 810, and the opening 810 is arranged facing the roof shell 910; the heat exchange module 100 is arranged in the opening 810, and the heat exchange module 100 includes a cold side and a hot side, the cold side is arranged facing the terminal shell 800, and the hot side is arranged facing the roof shell 910, the temperature of the cold side is lower than the temperature of the hot side, and the heat exchange module 100 is used to transfer heat from the cold side to the hot side; the printed circuit board module 500 is arranged in the terminal shell 800, the printed circuit board module 500 includes a printed circuit board 510, an antenna 520 and a crystal module 530 installed on the printed circuit board, and the printed circuit board module 510 is bonded to the cold side; the heat conductive medium 700 is arranged between the heat exchange module 100 and the roof shell 910, and the hot side and the roof shell 910 are bonded and connected by the heat conductive medium 700, so as to form a heat transfer channel from the printed circuit board module 500 to the roof shell 910. Among them, the printed circuit board module 500 is bonded to the cold side of the heat exchange module 100, which can specifically include: the crystal module 530 is bonded to the cold side of the heat exchange module 100 (for example: the second embodiment), or the printed circuit board 510 is connected to the cold side of the heat exchange module 100 (for example: the third embodiment).

[0073] Generally speaking, the roof shell 910 is usually made of metal materials such as steel plates, has good thermal conductivity, and has a large area; therefore, the heat-sinking metal plate 200 taken from the roof shell 910 will have good heat dissipation performance due to its large heat dissipation area; in this case, there is no need to configure an additional heat sink for the heat-sinking metal plate 200 (i.e., the roof shell 910), which is conducive to simplifying the structure of the vehicle-mounted communication terminal and reducing the volume of the vehicle-mounted communication terminal. In addition, the metal roof shell 910 can also be electrically coupled with the printed circuit board module 500 due to its good electrical conductivity, and used as the antenna of the vehicle-mounted communication terminal, which is conducive to further simplifying the structure of the vehicle-mounted communication terminal and reducing the volume of the vehicle-mounted communication terminal.

[0074] Combine the following Fig.14 The beneficial effects that can be achieved by the vehicle-mounted communication terminal provided in the fifth embodiment of the present application are specifically described. The vehicle-mounted communication terminal provided in the fifth embodiment of the present application establishes a heat transfer channel from the printed circuit board module 500 to the roof shell 910, and uses the heat exchange module 100 to reduce the temperature of the crystal module 530 to below the ambient temperature, and transfers the heat generated by the crystal module 530 to the roof shell 910, and uses the larger heat dissipation area of ​​the roof shell 910 to quickly dissipate the heat into the environment. Therefore, even if the roof shell 910 is exposed to sunlight and reaches a very high temperature, the temperature of the crystal module 530 will not approach the threshold temperature under the cooling of the heat exchange module 100, thereby ensuring that the crystal module 530 continues to operate stably without frequency reduction, self-protection triggering, or damage. Moreover, the terminal shell, printed circuit board module 500, heat-conducting medium 700 and heat exchange module 100 of the vehicle-mounted communication terminal provided in the fifth embodiment of the present application are all arranged in the interlayer space between the roof shell 910 and the top of the vehicle interior decoration 920, without occupying additional vehicle body space and without increasing the thickness of the roof; in addition, the vehicle-mounted communication terminal provided in the fifth embodiment of the present application is fanless, does not generate noise, does not need to add air ducts on the roof, and does not affect the appearance of the entire vehicle.

[0075] The present application also provides a vehicle, which includes but is not limited to a car, a rail vehicle, an engineering vehicle, etc. Among them, the car can be, for example, a small passenger car, a medium-sized passenger car, a large passenger car, a truck, a special vehicle (for example: a fire truck, an ambulance, a police car, etc.), the rail vehicle can be, for example, a passenger train, a freight train, a maglev train, a subway train, etc.; the engineering vehicle can be, for example, a loader, an excavator, a harvester, a road roller, etc. The vehicle can include one or more of the heat dissipation device, the vehicle-mounted antenna module, or the vehicle-mounted communication terminal provided in any of the above embodiments of the present application.

[0076] For example, Fig.12 As shown, the vehicle includes a vehicle-mounted antenna module 930. The vehicle roof shell 910 is provided with a cavity 940 for accommodating the vehicle-mounted antenna module 930, and the vehicle-mounted antenna module 930 is arranged in the cavity 940. The roof shell 910 is also provided with an antenna cover 950, which is snap-fitted and installed on the cavity 940 to close the cavity 940, so that the vehicle-mounted antenna module 930 is hidden inside the roof shell 910 without affecting the appearance of the roof.

[0077] For example, Fig.13As shown, the vehicle includes an on-board communication terminal 960. The on-board communication terminal 960 is hidden inside the roof shell 910 of the vehicle, and the on-board communication terminal 960 is connected to the vehicle's external antenna 970 through a cable, etc. The external antenna can be a shark fin antenna at the rear of the roof. The on-board communication terminal 960 establishes a communication connection with a mobile device 980 through the external antenna 970 to realize the vehicle information display and control of the mobile device APP.

[0078] The following is the sixth embodiment of the present application.

[0079] The sixth embodiment of the present application provides a temperature control method, which can be applied to the heat dissipation device, vehicle-mounted antenna module or vehicle-mounted communication terminal provided in any of the above embodiments. Fig.15 is a flow chart of the temperature control method. Fig.15 As shown, the temperature control method includes:

[0080] Step S101, determining whether the temperature of the heating element is greater than or equal to a first threshold.

[0081] The heating elements in the present application include but are not limited to printed circuit boards (PCBs), crystal modules (including various types of chips, such as system on a chip (SOCs), RF front-end chips, modem chips, etc.), and other electronic components that can generate heat during operation.

[0082] The first threshold value is less than the threshold temperature of the heating element. For example, when the heating element is a crystal module, the first threshold value can be set to a temperature lower than the threshold temperature and prevent the crystal module from overheating and frequency reduction. The temperature of the heating element can be measured by a temperature sensor built into the heating element, or by other external sensors.

[0083] Step S102: If the temperature of the heating element is greater than or equal to a first threshold, the heat exchange module is turned on.

[0084] If the temperature of the heating element is greater than or equal to the first threshold, it means that the temperature of the heating element is high and may rise further. If the temperature of the heating element rises further, the heating element may be overheated and frequency reduced or even exceed the threshold temperature and be damaged. Therefore, the heat exchange module needs to be turned on to cool the heating element.

[0085] Step S103, determining whether the temperature of the heating element is less than or equal to a second threshold.

[0086] The second threshold may be equal to or lower than the first threshold.

[0087] Step S104: if the temperature of the heating element is less than or equal to the second threshold, the heat exchange module is turned off.

[0088] When the temperature of the heating element is less than or equal to the first threshold, it means that the temperature of the heating element drops within the normal temperature range and the heating element can operate normally. Therefore, the heat exchange module can be turned off to reduce the power consumption of the heat exchange module. After that, if the temperature of the heating element rises but is less than the first threshold, the heat exchange module will remain in the closed state. If the temperature of the heating element is greater than or equal to the first threshold, the heat exchange module will be turned on again.

[0089] The method provided in the sixth embodiment of the present application can control the temperature of the heating element between a first threshold value and a second threshold value that are lower than the threshold temperature, thereby ensuring the normal operation of the heating element. In addition, the method provided in the sixth embodiment of the present application controls the heat exchange module to be intermittently turned on and off according to the temperature of the heating element, which is also beneficial to reducing the power consumption of the heat exchange module. Therefore, if the heat exchange module is powered by a vehicle-mounted battery, the battery life in a non-charging state can be extended.

[0090] The heat dissipation module provided in the embodiment of the present application can be used in various scenarios where equipment or components work in high temperature environments and have requirements for heat dissipation, such as: vehicle-mounted antennas, outdoor communication base stations, communication satellites, computer chips, etc. The application of the technical solution provided in the embodiment of the present application in other designs will not be described in detail here. Inspired by the technical concept of the embodiment of the present application, those skilled in the art can also think of applying the technical solution of the embodiment of the present application to other designs, and these designs do not exceed the protection scope of the embodiment of the present application.

[0091] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the application disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0092] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A vehicle-mounted antenna module, characterized in that: include: Antenna housing, printed circuit board module, heat exchange module, heat spreader and heat sink; The heat exchange module comprises a cold side and a hot side, the temperature of the cold side is lower than the temperature of the hot side, the heat exchange module is used to conduct heat from the cold side to the hot side, the heat exchange module comprises a refrigerator, the refrigerator is used to conduct heat from the cold side to the hot side under external action, the external action comprises pressure or light; The printed circuit board module comprises a printed circuit board, an antenna and a crystal module mounted on the printed circuit board, the printed circuit board module is bonded to the cold side; the soaking metal plate is bonded to the hot side; The heat sink is arranged on a side of the heat-saturating metal plate facing away from the heat exchange module; The heat-saturating metal plate is made of a material with excellent thermal conductivity and is used to absorb the heat of the heat exchange module so as to transfer the absorbed heat to the heat sink, and the heat is dissipated by the heat sink; The antenna housing is arranged on the side of the printed circuit board facing away from the heat exchange module. The heat-saturating metal plate and the antenna housing are provided with mutually cooperating fixing structures. The heat-saturating metal plate and the antenna housing are fixedly connected by the fixing structure, so that the printed circuit board module and the heat exchange module are enclosed in the antenna housing.

2. The vehicle-mounted antenna module according to claim 1, characterized in that: The crystal module is arranged on a side of the printed circuit board facing the heat exchange module; The cold side of the crystal module is bonded and connected.

3. The vehicle-mounted antenna module according to claim 1, characterized in that: The printed circuit board is bonded and connected to the cold side; The crystal module is arranged on a side of the printed circuit board facing away from the heat exchange module.

4. The vehicle-mounted antenna module according to claim 1, characterized in that: The soaking metal plate is recessed in a direction away from the heat exchange module to form a first groove; The heat exchange module is placed in the first groove, and the hot side surface is in contact with the bottom of the first groove; The heat sink is recessed in a direction away from the soaking metal plate to form a second groove matching the shape of the first groove; The first groove is embedded in the second groove, and the first groove fits tightly with the second groove.

5. The vehicle-mounted antenna module according to claim 2, characterized in that: A heat-conducting medium is arranged between the heat exchange module and the crystal module, and the cold side surface is bonded and connected to the crystal module through the heat-conducting medium.

6. The vehicle-mounted antenna module according to claim 1, characterized in that: The antenna is arranged on a side of the printed circuit board facing away from the heat exchange module.

7. The vehicle-mounted antenna module according to any one of claims 1 to 6, characterized in that: The heat exchange module is a thermoelectric cooler.

8. The vehicle-mounted antenna module according to claim 7, characterized in that: The thermoelectric cooler includes a plurality of thermocouple pairs, wherein the thermocouple pairs are formed by connecting an N-type semiconductor and a P-type semiconductor; A plurality of the thermocouple pairs are arranged between two ceramic electrodes; The thermocouple pair is used to transfer heat from the cold side to the hot side when an electric current is passed through it.

9. The vehicle-mounted antenna module according to claim 1, characterized in that: The heat sink is provided with a fin structure on a side facing away from the soaking metal plate; The fin structure includes a plurality of fins, and the fins extend in a direction away from the soaking metal plate; The plurality of fins are arranged in parallel at intervals.

10. A vehicle-mounted communication terminal, characterized in that: include: Terminal housing, printed circuit board module, heat transfer medium and heat exchange module; The terminal housing is arranged inside the metal housing of the vehicle, and the terminal housing is provided with an opening, and the opening is arranged facing the metal housing; The heat exchange module is arranged in the opening, the heat exchange module comprises a cold side and a hot side, the cold side is arranged facing the terminal shell, the hot side is arranged facing the metal shell, the temperature of the cold side is lower than the temperature of the hot side, and the heat exchange module is used to conduct heat from the cold side to the hot side; the heat exchange module comprises a refrigerator, and the refrigerator is used to conduct heat from the cold side to the hot side under external action, and the external action includes pressure or light; The printed circuit board module is arranged in the terminal housing, the printed circuit board module comprises a printed circuit board, an antenna and a crystal module mounted on the printed circuit board, and the printed circuit board module is attached to the cold side; The heat-conducting medium is arranged between the heat exchange module and the metal shell, and the hot side surface and the metal shell are connected by the heat-conducting medium.

11. The vehicle-mounted communication terminal according to claim 10, characterized in that: The crystal module is arranged on a side of the printed circuit board facing the heat exchange module; The cold side of the crystal module is bonded and connected.

12. The vehicle-mounted communication terminal according to claim 10, characterized in that: The printed circuit board is bonded and connected to the cold side; The crystal module is arranged on a side of the printed circuit board facing away from the heat exchange module.

13. The vehicle-mounted communication terminal according to any one of claims 10 to 12, characterized in that: The heat exchange module is a thermoelectric cooler.

14. The vehicle-mounted communication terminal according to claim 13, characterized in that: The thermoelectric cooler includes a plurality of thermocouple pairs, wherein the thermocouple pairs are formed by connecting an N-type semiconductor and a P-type semiconductor; A plurality of the thermocouple pairs are arranged between two ceramic electrodes; The thermocouple pair is used to transfer heat from one end of the thermocouple pair to the other end of the thermocouple pair when current passes through.

15. A vehicle, characterized in that: A vehicle-mounted antenna module comprising any one of claims 1 to 9; The roof shell of the vehicle is provided with a cavity for accommodating the vehicle-mounted antenna module; The vehicle-mounted antenna module is disposed in the cavity; The roof shell is also provided with an antenna cover, and the antenna cover is buckled and installed on the cavity to close the cavity.

16. A vehicle, characterized in that: The vehicle-mounted communication terminal and the external antenna comprise any one of claims 10 to 14; The vehicle-mounted communication terminal is arranged on the inner side of the roof shell of the vehicle; The vehicle-mounted communication terminal is connected to the external antenna via a cable.

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