A chip package carrier and a chip packaging method

Abstract

The present application provides a kind of chip package carrier, including the first carrier body attached to substrate, and the second carrier body can be detachably arranged in the first carrier body, and the integrated circumferential closure formed after the integration of the first carrier body and the second carrier body.The present application provides a kind of chip package carrier, and the chip mounting process can be saved in the chip packaging factory, and the carrier binding force is good, the difficulty of chip mounting and bonding process can be reduced, the operation is convenient, the bonding difficulty is reduced, and the product size is reduced.

Description

Technical Field

[0001] This invention belongs to the field of packaging technology, and specifically relates to a chip packaging carrier. Background Technology

[0002] As packaging technology advances towards smaller and lighter designs, the size of optical chip packages is also decreasing, inevitably increasing the complexity of the packaging process. As shown in Figure 1, an optical chip package typically consists of a substrate, the optical chip, a carrier, and a glass cover. To reduce package size, the carrier is being moved closer to the chip, which undoubtedly increases the difficulty of bonding. In the packaging process, the distance between the pads and the chip, as well as the distance between the pads and the package edge, needs to be strictly controlled. Unlike ordinary packaging, optical chip packages have a carrier between the package edge and the pads. Due to the presence of the carrier, the distance between the pads and the carrier becomes a limiting factor in the bonding process. If ordinary bonding specifications are followed, the distance between the pads and the carrier will increase, which will increase the package size.

[0003] If the carrier and substrate are delivered separately, meaning the carrier is not installed on the substrate when the chip is delivered, and the carrier is installed after the chip is bonded to the substrate, the bonding strength that the packaging and testing plant can provide in the subsequent carrier installation process is significantly poor. Summary of the Invention

[0004] The purpose of this invention is to solve one or more of the above-mentioned technical problems. This invention provides a chip packaging carrier.

[0005] On one hand, the present invention provides a chip packaging carrier, including a first carrier attached to a substrate and a second carrier detachably disposed on the first carrier, wherein the first carrier and the second carrier are integrated to form an overall circumferentially closed structure.

[0006] This invention provides a chip packaging carrier, which can save packaging and testing plants a step of installing the carrier. The carrier has good bonding strength, which can reduce the difficulty of die mounting and bonding processes, facilitate operation, reduce the difficulty of bonding, and reduce product size.

[0007] In some embodiments, the first carrier is provided with a locking portion, and the second carrier is provided with an object locking portion that mates with the locking portion.

[0008] In some embodiments, the engaging portion is provided with a recess, and the object engaging portion is provided with a protrusion for engaging the recess.

[0009] In some embodiments, the second carrier includes a transverse support shaft and a longitudinal support shaft, the pattern formed by the transverse support shaft and the longitudinal support shaft being circumferentially closed, and the first carrier includes a column fastened to the substrate.

[0010] In some embodiments, the second carrier includes a transverse support shaft and a longitudinal support shaft, and the first carrier includes a longitudinal mounting portion that is fastened to the substrate and cooperates with the longitudinal support shaft. The longitudinal mounting portion is a long strip-shaped plate arranged longitudinally.

[0011] In some embodiments, the second carrier includes a transverse support shaft and a longitudinal support shaft, and the first carrier includes a longitudinal mounting portion fastened to the substrate and cooperating with the longitudinal support shaft and a transverse mounting portion cooperating with the transverse support shaft, wherein the longitudinal mounting portion and the transverse mounting portion are in the shape of a long strip plate.

[0012] In some embodiments, the recess of the engaging portion is recessed in a horizontal direction and is disposed on the vertical surface of the first support body; the protrusion of the protrusion of the engaging portion is also in a horizontal direction and is disposed on the vertical surface of the second support body.

[0013] In some implementations, the lower part of the protrusion has a smooth transition or a sloped transition.

[0014] In some embodiments, the second support body includes a transverse support shaft and a longitudinal support shaft, with the longitudinal support shaft being movably connected to the transverse support shaft.

[0015] In some implementations, the transverse support shaft is configured with a track groove, and the longitudinal support shaft is configured with a track shaft that mates with the track groove.

[0016] In some embodiments, the protrusion is separately disposed from the second support body, and the protrusion is movably disposed on the second support body.

[0017] In some embodiments, the second carrier is provided with a mounting hole for receiving a portion of the protrusion, and an elastic member is also provided between the protrusion and the bottom of the mounting hole.

[0018] In some implementations, the elastic component is a spring.

[0019] In some embodiments, the first carrier is provided with a locking portion, and the second carrier is provided with a mating locking portion; the locking portion is provided with a recess, and the mating locking portion is provided with a protrusion for mating with the recess; the recess of the locking portion is recessed in a horizontal direction and is located on the vertical surface of the first carrier, and the protrusion of the mating locking portion is also protruding in a horizontal direction and is located on the vertical surface of the second carrier; the second carrier includes a transverse support shaft and a longitudinal support shaft, and the first carrier includes a longitudinal mounting portion fastened to the substrate and mating with the longitudinal support shaft and a transverse mounting portion mating with the transverse support shaft, the longitudinal mounting portion and the transverse mounting portion being elongated plate-shaped; the second carrier includes a transverse support shaft and a longitudinal support shaft, the longitudinal support shaft being movably connected to the transverse support shaft; the transverse support shaft is provided with a track groove, and the longitudinal support shaft is provided with a track shaft mating with the track groove.

[0020] On the other hand, the present invention also provides a chip packaging method, comprising the following steps:

[0021] Step 1: Mount the chip onto the substrate, with the first carrier firmly attached to the substrate;

[0022] Step 2: Connect the chip to the pads on the substrate using metal wires to transmit the chip's signals;

[0023] Step 3: Secure the second support to the first support to form a circumferentially closed whole.

[0024] Step 4: Combine the integrated first and second carriers with the glass cover.

[0025] In some embodiments, step 3 and step 4 may further include cutting the substrate with the first carrier and the second carrier attached together into a single circumferentially closed packaging unit. Attached Figure Description

[0026] To more clearly illustrate the technical solution of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 is a reference diagram of the usage state of a chip packaging carrier;

[0028] Figure 2 A schematic diagram of the structure of a first carrier and a substrate in one embodiment of a chip packaging carrier provided by the present invention;

[0029] Figure 3 is a schematic diagram of the structure of the second carrier in one embodiment of the chip packaging carrier provided by the present invention;

[0030] Figure 4 is a cross-sectional view of the second load-bearing body EE shown in Figure 3;

[0031] Figure 5 This is a schematic diagram of the structure of a second carrier, which is another embodiment of the chip packaging carrier provided by the present invention.

[0032] Figure 6 A schematic diagram of the first carrier and substrate in cooperation with another embodiment of the chip packaging carrier provided by the present invention;

[0033] Figure 7 shows the relationship with Figure 6 The diagram shows the structural diagram of the second support body that mates with the first support body;

[0034] Figure 8 is Figure 6 The cross-sectional view of the first load-bearing body AA is shown;

[0035] Figure 9 A schematic diagram of the first carrier and substrate in cooperation with another embodiment of the chip packaging carrier provided by the present invention;

[0036] Figure 10 is a schematic diagram of the structure of a second carrier in another embodiment of the chip packaging carrier provided by the present invention;

[0037] Figure 11 is Figure 9 The cross-sectional view of the first load-bearing body BB is shown;

[0038] Figure 12 is a schematic diagram of the first carrier and substrate in cooperation with another embodiment of the chip packaging carrier provided by the present invention.

[0039] Figure 13 is a cross-sectional view of the first support body CC shown in Figure 12;

[0040] Figure 14 is a cross-sectional view of the first support DD shown in Figure 12;

[0041] Figure 15 is a schematic diagram of the structure of the second carrier in a certain embodiment of the chip packaging carrier provided by the present invention, showing the movable cooperation between the transverse support axis and the longitudinal support axis of the carrier.

[0042] Figure 16 is a schematic diagram of the structure of a first carrier and a second carrier cooperating in another embodiment of a chip packaging carrier provided by the present invention;

[0043] Figure 17 is a schematic diagram of an embodiment of the chip packaging carrier provided by the present invention, in which the lower part of the second carrier protrusion has a smooth transition. Detailed Implementation

[0044] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0045] On the one hand, as shown in Figures 1, 2, 3, and 16, the present invention provides a chip packaging carrier, including a first carrier 2 attached to a substrate 1 and a second carrier 3 detachably disposed on the first carrier 2, wherein the first carrier 1 and the second carrier 3 are integrated to form an overall circumferential enclosure.

[0046] This invention provides a chip packaging carrier, which can save packaging and testing plants a step of installing the carrier. The carrier has good bonding strength, which can reduce the difficulty of die mounting and bonding processes, facilitate operation, reduce the difficulty of bonding, and reduce product size.

[0047] The supplier provides a substrate 1 with the first carrier 2 already in place. The material of the first carrier 2 has good adhesion to the substrate 1. Subsequently, the packaging and testing plant completes the bonding process to secure the second carrier 3 to the first carrier 2, effectively reducing the difficulty of the die-packing and bonding processes and reducing product size.

[0048] In various embodiments of the chip packaging carrier provided by the present invention, the detachable assembly method of the first carrier 2 and the second carrier 3 is preferably a snap-fit ​​structure:

[0049] The first carrier 2 is provided with a locking part, and the second carrier 3 is provided with an object locking part that mates with the locking part.

[0050] Of course, the second carrier 3 of the first carrier 2 can also be detachably assembled by gluing, or by using gluing and other methods at the same time.

[0051] In various embodiments of the engaging structure, preferably, the engaging portion is provided with a recess 5, and the target engaging portion is provided with a protrusion 4 for engaging the recess.

[0052] This method facilitates insertion and is easy to operate. The first carrier body 2 and the second carrier body 3 engage with each other, and the engaging parts are glued together, making them secure and sealed.

[0053] In various embodiments of the chip packaging carrier provided by this invention, the overall circumferential closure formed by integrating the first carrier 2 and the second carrier 3 can adopt various shapes and mating methods.

[0054] As shown in Figures 6, 7, and 8, as one of the matching methods: the second carrier 3 includes a transverse support shaft 6 and a longitudinal support shaft 7, and the shape formed by the transverse support shaft 6 and the longitudinal support shaft 7 is circumferentially closed. The first carrier 2 includes a column that is fastened to the substrate 1.

[0055] The column design facilitates material handling and provides more operating space.

[0056] The first carrier 2 includes pillars fastened to the substrate 1. For the substrate 1 with a square grid layout, it can be a layout in which a pillar is placed at each of the four corners of the substrate 1; or several pillars are placed on each side of the substrate 1; or several pillars are arranged on the sides or corners of the substrate 1.

[0057] As a second type of cooperation: As shown in Figure 10, the second carrier 3 includes a transverse support shaft 6 and a longitudinal support shaft 7. As shown in Figures 9 and 11, the first carrier 2 includes a longitudinal mounting part that is fastened to the base plate 1 and cooperates with the longitudinal support 7. The longitudinal mounting part is a long strip plate that is arranged longitudinally.

[0058] The longitudinally arranged elongated plate-like structure, in conjunction with the second carrier 3, improves robustness. This allows for the installation of a thin, high-strength, elongated plate-like longitudinal mounting section before the material arrives at the packaging and testing plant, facilitating a reduction in the size of the incoming substrate 1 during the bonding process.

[0059] As a third type of fit: As shown in Figure 10, the second support body 3 includes a transverse support shaft 6 and a longitudinal support shaft. As shown in Figures 12, 13, and 14, the first support body 2 includes a longitudinal mounting portion fastened to the substrate 1 and fitting with the longitudinal support shaft 7, and a transverse mounting portion 23 fitting with the transverse support shaft 6. Preferably, the longitudinal mounting portion and the transverse mounting portion 23 are elongated plates. The elongated plate shape of the longitudinal mounting portion and the transverse mounting portion 23, when fitted with the second support body 3, can improve the sealing performance.

[0060] In various embodiments of the chip packaging carrier with a snap-fit ​​structure provided by the present invention, the preferred method is a vertical insertion method. The recess 5 of the snap-fit ​​portion is recessed in a horizontal direction and is disposed on the vertical surface of the first carrier 2. The protrusion 4 of the snap-fit ​​portion is also protruded in a horizontal direction and is disposed on the vertical surface of the second carrier 3.

[0061] In various embodiments of the chip packaging carrier using a snap-fit ​​structure provided by the present invention, the number of snap-fit ​​structures can be multiple, and they can all be vertically inserted, or partially vertically inserted and partially other insertion methods, such as horizontal insertion, or other non-vertical insertion methods.

[0062] Of course, as another type of non-vertical insertion method, the recess 5 of the engaging part is recessed in a vertical direction, and the recess 5 is disposed on the non-vertical surface of the first carrier 2. The protrusion 4 of the engaging part is also protruded in a vertical direction, and the protrusion 4 is disposed on the non-vertical surface of the second carrier 3.

[0063] In addition, a combination of longitudinal and non-longitudinal insertion can be used; as shown in Figures 2, 3, 4 or 17, the number of interlocking structures provided in this embodiment can be 3, of which 2 are longitudinally inserted and 1 is non-longitudinally inserted.

[0064] As shown in Figure 17, in the longitudinal insertion method, it is even more preferable that the lower part of the protrusion has a smooth transition or a sloped transition.

[0065] It facilitates direct insertion, and the extrusion pressure during the insertion process causes a certain deformation to the structure, which recovers after being in place, thus improving processing efficiency.

[0066] In the longitudinal insertion method, it is further preferred, or simultaneously preferred, that the second support body 3 includes a transverse support shaft 6 and a longitudinal support shaft 7.

[0067] Furthermore, as shown in Figure 15, the longitudinal support shaft 7 and the transverse support shaft 6 are movably connected.

[0068] It facilitates adaptive design of structural dimensions during the insertion process.

[0069] In one preferred embodiment where the longitudinal support shaft 7 and the transverse support shaft 6 are movably connected, the transverse support shaft 6 is provided with a track groove 61, and the longitudinal support shaft 7 is provided with a track shaft 71 that mates with the track groove.

[0070] Adjust the position of the longitudinal support shaft 7 in the track, and insert the first support body 2 and the second support body 3. No deformation is required as in the previous scheme. After the first support body 2 and the second support body 3 are inserted, they can also be fixed by sealing with glue.

[0071] In various embodiments employing a snap-fit ​​structure, the protrusion 4 and the second support body 3 are preferably separate, with the protrusion movably mounted on the second support body 3.

[0072] The second carrier 3 is provided with a mounting hole for accommodating a portion of the protrusion 4, and an elastic member is also provided between the protrusion 4 and the bottom of the mounting hole, preferably a spring.

[0073] In particular, in the longitudinal insertion scheme, this scheme can complete the insertion and positioning without deformation of the first carrier 2 and the second carrier 3.

[0074] In various embodiments of the chip packaging carrier provided by this invention, it can be:

[0075] The first carrier 2 is provided with a locking part, and the second carrier 3 is provided with a matching locking part; the locking part is provided with a recess 5, and the matching locking part is provided with a protrusion 4 for matching the recess 5; the recess 5 of the locking part is recessed in a horizontal direction and is located on the vertical surface of the first carrier 2; the protrusion 4 of the matching locking part is also protruding in a horizontal direction and is located on the vertical surface of the second carrier 3; the second carrier 3 includes a transverse support shaft 6 and a longitudinal support shaft 7; the first carrier 2 includes a longitudinal mounting part that is fastened to the base plate 1 and matches the longitudinal support shaft 7; the longitudinal mounting part is a long strip-shaped part arranged longitudinally; the second carrier 3 includes a transverse support shaft 6 and a longitudinal support shaft 7, and the longitudinal support shaft 7 is movably connected to the transverse support shaft 6; the transverse support shaft 6 is provided with a track groove 61, and the longitudinal support shaft 7 is provided with a track shaft 71 that matches the track groove.

[0076] Adjust the position of the longitudinal support shaft 7 in the track groove 61. After determining the position, glue can be used to fix the position. This setting can increase the reliability, facilitate material receiving, and facilitate packaging.

[0077] In various embodiments of the chip packaging carrier provided by the present invention, a first carrier 2 is provided with a locking portion, and a second carrier is provided with a mating locking portion; the locking portion is provided with a recess 5, and the mating locking portion is provided with a protrusion 4 for mating with the recess 5; the recess 5 of the locking portion is recessed in a horizontal direction and is disposed on the vertical surface of the first carrier 2, and the protrusion 4 of the mating locking portion is also protruding in a horizontal direction and is disposed on the vertical surface of the second carrier 3; the second carrier includes a transverse support shaft 6 and a longitudinal support shaft 7, and the pattern formed by the transverse support shaft 6 and the longitudinal support shaft 7 is circumferentially closed; the first carrier 2 includes a column fastened to the substrate 1; the second carrier 3 includes a transverse support shaft 6 and a longitudinal support shaft 7, and the longitudinal support shaft 7 is movably connected to the transverse support shaft 6; the transverse support shaft 6 is provided with a track groove 61, and the longitudinal support shaft 7 is provided with a track shaft 71 that mates with the track groove 61.

[0078] The column can be changed according to the incoming material, which is convenient for operation, reduces volume, and saves costs. However, it has the disadvantage that the joints are not as firm as those of the plate.

[0079] In various embodiments of the chip packaging carrier provided by this invention, it is also possible that...

[0080] The first carrier 2 is provided with a locking part, and the second carrier 3 is provided with a mating locking part; the locking part is provided with a recess 5, and the mating locking part is provided with a protrusion 4 for mating with the recess 5; the recess 5 of the locking part is recessed in a horizontal direction and is located on the vertical surface of the first carrier 2; the protrusion 4 of the mating locking part is also protruding in a horizontal direction and is located on the vertical surface of the second carrier 3; the second carrier 3 includes a transverse support shaft 6 and a longitudinal support shaft 7; the first carrier 2 includes a longitudinal mounting part fastened to the base plate 1 and mating with the longitudinal support shaft 7 and a transverse mounting part 23 mating with the transverse support shaft 6; the longitudinal mounting part and the transverse mounting part 23 are elongated plates; the second carrier 3 includes a transverse support shaft 6 and a longitudinal support shaft 7, and the longitudinal support shaft 7 is movably connected to the transverse support shaft 6; the transverse support shaft 6 is provided with a track groove 61, and the longitudinal support shaft 7... The track shaft 71 is configured to cooperate with the track groove 61, with 3 horizontal support shafts and 6 vertical support shafts.

[0081] The plates are more firmly bonded together, the sealing is better, and it does not affect the incoming materials.

[0082] In various embodiments of the chip packaging carrier provided by this invention, it can also be:

[0083] The first carrier 2 is provided with a locking part, and the second carrier 3 is provided with a mating locking part; the locking part is provided with a recess 5, and the mating locking part is provided with a protrusion 4 for mating with the recess 5; the recess 5 of the locking part is recessed in a horizontal direction and is located on the vertical surface of the first carrier 2; the protrusion 4 of the mating locking part is also protruding in a horizontal direction and is located on the vertical surface of the second carrier 3; the second carrier 3 includes a transverse support shaft 6 and a longitudinal support shaft 7; the first carrier 2 includes a longitudinal mounting part fastened to the substrate 1 and mating with the longitudinal support shaft 7 and a transverse mounting part 23 mating with the transverse support shaft 6; the longitudinal mounting part and the transverse mounting part 23 are elongated plates; the protrusion 4 is separately provided from the second carrier 3 and is movably provided on the second carrier 3; the second carrier 3 is provided with a mounting hole for accommodating a portion of the protrusion 4. An elastic component is also provided between the bottom of the mounting hole and the elastic component; the elastic component can be a spring.

[0084] It is easier to connect, saves steps, and is less prone to deformation.

[0085] In various embodiments of the chip packaging carrier provided by this invention, it can also be:

[0086] The second support body 3 includes multiple transverse support shafts 6 and multiple longitudinal support shafts 7, adapting to different arrangements of the first support body 2, for example... Figure 5 As shown, there are 3 horizontal support shafts 6 and 6 vertical support shafts 7.

[0087] On the other hand, the present invention also provides a chip packaging method, comprising the following steps:

[0088] Step 1: Mount the chip 11 onto the substrate, and secure the first carrier 2 to the substrate 1.

[0089] Step 2: Connect chip 11 to the pads on substrate 1 using metal wire 13 to output the signal of chip 11;

[0090] Step 3: Secure the second support 3 to the first support 2 to form a circumferentially closed whole.

[0091] Step 4: Combine the first support body 2 and the second support body 3 into the glass cover 12.

[0092] In some embodiments, step 3 and step 4 may further include cutting the substrate 1, to which the first carrier 2 and the second carrier 3 are attached, into individual circumferentially closed packaging units.

[0093] As shown in Figures 5 and 16, the second carrier 3 includes several transverse support shafts 6 and several longitudinal support shafts 7. When divided, adjacent transverse support shafts 6 are cut off from the middle to realize a single circumferentially closed encapsulation unit.

[0094] This invention provides a material that is easy to source, quick to connect and encapsulate, reduces the difficulty of die bonding and bonding processes, and has a simple structure.

[0095] This concludes the detailed description of the embodiments in conjunction with the accompanying drawings. Based on the above description, those skilled in the art should have a clear understanding of this application.

[0096] The above specific embodiments further illustrate the purpose, technical solution and beneficial effects of this application. It should be understood that the above are only specific embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A chip packaging carrier, characterized in that, It includes a first carrier (2) attached to a substrate (1) and a second carrier (3) detachably disposed on the first carrier (2), and the first carrier (2) and the second carrier (3) are integrated to form an overall circumferentially closed structure; The first carrier (2) is provided with a locking part, and the second carrier (3) is provided with an object locking part that cooperates with the locking part. The locking part is provided with a recess (5), and the object locking part is provided with a protrusion (4) for cooperating with the recess (5). The second carrier (3) includes a transverse support shaft (6) and a longitudinal support shaft (7), the pattern formed by the transverse support shaft (6) and the longitudinal support shaft (7) is circumferentially closed, and the first carrier (2) includes a column fastened to the substrate (1); The protrusion (4) is separately disposed from the second support body (3), and the protrusion (4) is movably disposed on the second support body (3). The second carrier (3) is provided with a mounting hole for accommodating a portion of the protrusion (4), and an elastic member is also provided between the protrusion (4) and the bottom of the mounting hole.

2. The chip packaging carrier according to claim 1, characterized in that, The recess (5) of the engaging part is recessed in a horizontal direction and is disposed on the vertical surface of the first support (2). The protrusion (4) of the engaging part is also protruded in a horizontal direction and is disposed on the vertical surface of the second support (3).

3. The chip packaging carrier according to claim 1, characterized in that, The lower part of the protrusion (4) has a smooth transition or a slope transition.

4. The chip packaging carrier according to any one of claims 1-3, characterized in that, The second support body (3) includes a transverse support shaft (6) and a longitudinal support shaft (7), wherein the longitudinal support shaft (7) is movably connected to the transverse support shaft (6).

5. The chip packaging carrier according to claim 4, characterized in that, The transverse support shaft (6) is configured with a track groove (61), and the longitudinal support shaft (7) is configured with a track shaft (71) that cooperates with the track groove (61).

6. The chip packaging carrier according to claim 5, characterized in that, The number of the transverse support shafts (6) is 3, and the number of the longitudinal support shafts (7) is 6.

7. A chip packaging method, characterized in that, This includes performing the following steps using the chip package carrier according to any one of claims 1-6: Step 1: Install the chip (11) onto the substrate (1), wherein the substrate (1) is tightly fitted with the first carrier (2). Step 2: Connect the chip (11) to the pads on the substrate (1) using metal wire (13) to receive the signal from the chip (11); Step 3: Secure the second support body (3) to the first support body (2) to form a circumferentially closed whole. The second support body (3) includes several transverse support shafts (6) and several longitudinal support shafts (7). Step 4: Combine the first support body (2) and the second support body (3) into the glass cover (12); Between steps 3 and 4, the substrate (1) with the first carrier (2) and the second carrier (3) attached as a whole is cut into a single circumferentially closed encapsulation unit; during the division, the adjacent transverse support shafts (6) are cut in the middle to realize a single circumferentially closed encapsulation unit.

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