A device for detecting flatness of pins of patch components

Abstract

The present invention is a device for detecting the flatness of the pins of a patch component, comprising a detection plane; the detection plane is distributed with conductive sheets corresponding to all the pins of the patch component to be tested, the conductive sheets comprising a first conductive sheet and a second conductive sheet which are insulated from each other and separated by a gap; and a detection device for detecting whether the first conductive sheet and the second conductive sheet are conductive when a bent portion at the end of the pin of the patch component is pressed on the conductive sheet. The present invention converts the flatness of the pins of the patch component into the problem of detecting whether two conductive sheets are conductive. The flatness of the patch component can be detected by using a detection device for detecting whether two conductive sheets are conductive, thereby avoiding misjudgment.

Description

Technical Field

[0001] The invention relates to the field of chip pin flatness detection, in particular to a chip component pin flatness detection device. Background Art

[0002] SMT is the surface assembly technology (surface mounting technology), the full name of which is Surface Mount Technology. It is the most popular technology and process in the current electronic assembly industry.

[0003] It is a circuit assembly technology that mounts pinless or short-lead surface mount components (SMC / SMD for short, chip components in Chinese, also known as patch components) on the surface of a printed circuit board (PCB) or other substrate, and assembles them by soldering through reflow soldering or dip soldering.

[0004] SMT requires patch components to have no pins or short pins. Because it is a patch, the bottom of the short pin needs to have a relatively flat surface, such as Figure 1 The figure shows a side view of a patch component. The patch component 100 has a pin 101. The pin 101 is led out from both sides of the patch component 100. There is also a bent portion 102 at the end of the pin 101. The lower side of the bent portion 102 is the patch portion. If the bent portion 102 of each pin 101 is not in the same plane as the others, that is, its flatness is relatively poor, the patch quality will be affected during patching, and even some patch component pins will have cold solder joints. If the flatness of the bent portion of a pin is not good, poor solder joints and other defects will also occur during patching. Therefore, the flatness of the patch component pin is an important indicator, and flatness detection is required when patching or leaving the factory. At present, the industry generally uses laser detection, which is to place the patch component flat on a flat plate, and then use light (usually laser) to irradiate it. If the light photo does not leak from the opposite side, it means that the flatness is good. This method generally uses naked eye observation for the irradiated light, which may lead to misjudgment. Therefore, some companies use automatic detection methods. For example, Chinese patent publication number CN 202975534U discloses a pin flatness detection device, which includes: a detection board and a signal processing circuit. The detection board has a plane with multiple strain gauges corresponding to the multiple pins to be tested; the strain gauge converts the pressure applied to the strain gauge into a corresponding electrical signal and transmits it to the signal processing circuit for processing. The voltage signal generated by the strain gauge corresponding to the pin position on the detection device determines which pin is protruding, so as to adjust the height of the protruding pin and ensure the flatness of the pin.

[0005] However, this detection method cannot detect whether the bent portion 102 at the end of the pin 101 is straight. Summary of the invention

[0006] The present invention aims at solving the current difficulties in flatness detection of patch component pins and provides a patch component pin flatness detection device.

[0007] The technical solution adopted by the present invention to achieve its technical purpose is: a device for detecting the flatness of the pins of a patch component, comprising a detection plane; the detection plane is distributed with conductive sheets corresponding to all the pins of the patch component to be detected, and the conductive sheets include two mutually insulated first conductive sheets and second conductive sheets separated by a gap;

[0008] It also includes a detection device for detecting whether the first conductive sheet and the second conductive sheet are conductive when a bent portion at the end of a patch component pin is pressed on the conductive sheet.

[0009] The present invention transforms the flatness of the pins of the patch component into a problem of detecting whether two conductive sheets are conductive. A detection device for detecting whether two conductive sheets are conductive can be used to detect the flatness of the patch component, thereby avoiding misjudgment.

[0010] Furthermore, in the above-mentioned patch component pin flatness detection device: the detection device includes a light-emitting diode D and a power supply, and the conductive sheet is connected in series to a circuit in which the power supply supplies power to the light-emitting diode D; wherein the first conductive sheet is connected to the light-emitting diode D, and the second conductive sheet is connected to the power supply.

[0011] Furthermore, in the above-mentioned device for detecting flatness of pins of patch components: the gaps are mutually meshing sawtooth gaps.

[0012] Furthermore, in the above-mentioned device for detecting flatness of pins of patch components: the gap is an irregular gap.

[0013] Furthermore, the detection plane described in the above-mentioned patch component pin flatness detection device is a printed circuit board, the conductive sheets are two mutually insulated copper sheets attached to the surface of the printed circuit board, and the circuit of the power supply and the light-emitting diode D is the circuit on the printed circuit board.

[0014] The present invention will be described in more detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is the left view of a commonly used patch component.

[0016] Figure 2 The present invention is a schematic diagram of using the flatness detection device of the present invention to detect the flatness of the pins of patch components.

[0017] Figure 3 yes Figure 2 A_A cross-section view.

[0018] Figure 4 yes Figure 2 B: Enlarged image.

[0019] Figure 5 This is the schematic diagram of the PCB used for detection in Example 1 of the present invention (I).

[0020] Figure 6 This is the schematic diagram (II) of the PCB used for detection in Example 1 of the present invention.

[0021] Figure 7 This is the schematic diagram of the PCB used for detection in Example 2 of the present invention (I).

[0022] Figure 8 This is the PCB schematic diagram (II) used for detection in Example 2 of the present invention. DETAILED DESCRIPTION

[0023] Embodiment 1, as Figure 2 , Figure 3 and Figure 4 As shown: This embodiment is a detection device for detecting the flatness of the pins of patch components. It is a necessary tooling for the SMT process. The patch quality can only be good if the pins of the patch components have good flatness.

[0024] In this embodiment, the device for detecting the flatness of the pins of the patch components includes a detection plane 200; the patch components to be detected are placed on it for flatness detection. In this embodiment, the detection plane 200 uses a PCB board, which is a flat board, such as Figure 2 As shown, it is a detection tool for a 2-on-12-pin patch component 100. On the detection plane 200, which is a PCB board in this embodiment, there are conductive sheets 201 corresponding to all the pins 101 of the patch component 100 to be tested. In practice, 12 copper sheets are pasted on the PCB board in a 2×6 order. The conductive sheet 201 includes two mutually insulated first conductive sheets 203 and second conductive sheets 204 separated by a gap 202. In this embodiment, the copper sheet is split into two mutually insulated copper sheets through an irregular crack in the middle; the gap 202 between the two copper sheets is separated in this embodiment using a serrated shape, such as Figure 4As shown, when the end bend 102 of the pin 101 of the patch component 100 is pressed onto the conductive sheet 201, it can have a larger amount of movement, unlike two regular straight lines that divide the conductive sheet 201 into two pieces. In this way, the end bend 102 of the pin 101 of the patch component 100 must be pressed on both sides shared by the two straight lines to achieve the detection purpose. If the conductive sheet 201 is divided into two pieces by a zigzag shape or other irregular curve, the patch component 100 can be pressed down more freely.

[0025] Thus, when testing, it is only necessary to detect whether the first conductive sheet 203 and the second conductive sheet 204 are conductive, so as to determine whether the bent portion 103 at the end of the pin 102 of the patch component 100 pressed thereon is flat. If the two pieces also include a detection device for detecting whether the first conductive sheet 203 and the second conductive sheet 204 are conductive when the bent portion 102 at the end of the pin 101 of the patch component 100 is pressed on the conductive sheet 201. At present, there are many such detection devices, and those skilled in the art can design such a circuit according to practice, such as Figure 5 As shown, the detection device includes a light-emitting diode D and a power supply, and the conductive sheet 201 is connected in series to the circuit of the power supply to the light-emitting diode D; wherein the first conductive sheet 203 is connected to the light-emitting diode D, and the second conductive sheet 204 is connected to the power supply. During the detection, the flatness of the pin is good only when the light-emitting diode D is emitting light. In fact, in this embodiment, the detection plane 200 is a printed circuit board, the conductive sheet 201 is two mutually insulated copper sheets attached to the surface of the printed circuit board, and the circuit of the power supply and the light-emitting diode D is the circuit on the printed circuit board.

[0026] like Figure 5 The following is a schematic diagram of the circuit on the printed circuit board for the flatness detection of the pins of a single SMD component. In practice, multiple SMD components can be tested simultaneously on the same tooling, such as Figure 6 As shown, a 4×4 group of conductive sheets 201 is attached to a larger printed circuit board 300 to form a testing tool for simultaneously testing 16 patch components.

[0027] Example 2 Figure 7 and Figure 8 As shown, the difference between this embodiment and embodiment 1 is that the detection device for detecting whether the first conductive sheet 203 and the second conductive sheet 204 are conductive is different. Figure 7As shown, the detection device circuit includes a power supply VCC and a current-limiting resistor R; the power supply VCC is connected to the first conductive sheet 203 in the conductive sheet 2011, and the second conductive sheet 204 is grounded through the current-limiting resistor R, and a voltage detection device detects the voltage of the second conductive sheet 204. The voltage detection device is a single-chip microcomputer. When the patch component 100 is pressed on it, the single-chip microcomputer scans the voltage of the second conductive sheet 204. If there is a low voltage, it means that the flatness of the pin of the corresponding patch component 100 does not meet the requirements. Similar to Example 1, in this embodiment, the detection plane 200 is a printed circuit board, on which 4×6 groups of conductive sheets 301 are formed, and each group of conductive sheets 201 forms a flatness detection area for a patch component 100, so that 24 patch components can be detected at the same time. Figure 8 As shown, the conductive sheet 201 is formed by two mutually isolated solders on the printed circuit board to form a first conductive sheet 203 and a second conductive sheet 204, and all the second conductive sheets 204 are connected to the single-chip microcomputer through wires on the printed circuit board. In practice, the single-chip microcomputer can determine whether there is a component with unqualified flatness among the 24 patch components by scanning the voltage of each second conductive sheet 204.

Claims

1. A device for detecting the flatness of a lead of a patch component, comprising a detection plane (200); characterized in that: The detection plane (200) is provided with conductive sheets (201) corresponding to all pins (101) of the patch element (100) to be detected, respectively, and the conductive sheets (201) include two mutually insulated first conductive sheets (203) and second conductive sheets (204) separated by a gap (202); It also includes a detection device for detecting whether the first conductive sheet (203) and the second conductive sheet (204) are conductive when a bent portion (102) at the end of a pin (101) of a patch element (100) is pressed on the conductive sheet (201).

2. The device for detecting flatness of lead pins of patch components according to claim 1, characterized in that: The detection device comprises a light-emitting diode D and a power supply, wherein the conductive sheet (201) is connected in series to a circuit in which the power supply supplies power to the light-emitting diode D; wherein the first conductive sheet (203) is connected to the light-emitting diode D, and the second conductive sheet (204) is connected to the power supply.

3. The device for detecting flatness of lead of a patch component according to claim 1, characterized in that: The gaps (202) are mutually meshing zigzag gaps.

4. The device for detecting flatness of lead of a patch component according to claim 1, characterized in that: The gap (202) is an irregular gap.

5. The device for detecting flatness of lead pins of patch components according to claim 2, characterized in that: The detection plane (200) is a printed circuit board, the conductive sheets (201) are two mutually insulated copper sheets attached to the surface of the printed circuit board, and the circuit of the power supply and the light-emitting diode D is a circuit on the printed circuit board.

6. The device for detecting flatness of lead of a patch component according to claim 1, characterized in that: The detection device comprises a power supply VCC and a current limiting resistor R; the power supply VCC is connected to a first conductive sheet (203) in the conductive sheet (201), and the second conductive sheet (204) is grounded via the current limiting resistor R, and a voltage detection device detects the voltage of the second conductive sheet (204).

7. The device for detecting flatness of lead pins of a patch component according to claim 6, characterized in that: It also includes a single-chip microcomputer, wherein the detection plane (200) is a printed circuit board, on which N×M groups of conductive sheets (201) are formed, each group of conductive sheets (201) forming a flatness detection area of ​​a patch component (100), the conductive sheets (201) being a first conductive sheet (203) and a second conductive sheet (204) formed by two mutually isolated solders soldered on the printed circuit board, and all the second conductive sheets (204) are connected to the single-chip microcomputer via wires on the printed circuit board.

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