Bracket, camera module and mobile terminal

Abstract

The present invention relates to a bracket, a camera module and a mobile terminal. The bracket includes a support plate and a first protrusion. The support plate includes a first surface and a second surface. The first protrusion is provided on the first surface. The first protrusion is connected to the blank area of the circuit board of the camera module. The height of the first protrusion is greater than the height of the electronic components of the camera module, forming a first notch located circumferentially. The first notch is arranged adjacent to the electronic components to avoid the electronic components. The support plate is provided with a light through hole penetrating the first and second surfaces. The light through hole is arranged opposite to the photosensitive chip of the camera module. The second surface is used to connect the lens assembly of the camera module. The above-mentioned bracket omits at least part of the side wall compared with the traditional bracket, and the formed first notch can avoid the electronic components. Therefore, when assembling the above-mentioned bracket, there is no need to reserve a safety distance between the bracket and the electronic components, reducing the size of the bracket in the XY plane, and thus a camera module with a smaller size can be obtained.

Description

[0001] This invention claims the priority of a Chinese patent application with an application date of August 28, 2018 and an application number of 201810987852.2. Technical Field

[0002] This invention relates to the field of imaging technology, and particularly to a bracket, an imaging module, and a mobile terminal. Background Art

[0003] In recent years, electronic devices have increasingly shown a trend of miniaturization, which puts more stringent requirements on the size of the imaging module, one of the standard configurations of electronic devices. At the same time, the requirements for the pixels and quality of the imaging module are also getting higher and higher.

[0004] Traditional imaging modules usually include a circuit board, a photosensitive chip, electronic components, a bracket, and a lens. The photosensitive chip and electronic components are both disposed on the circuit board. The electronic components are located outside the photosensitive chip. The bracket is disposed on the circuit board. The bracket is a hollow structure with openings at both ends to accommodate the photosensitive chip and electronic components within the bracket. The lens is disposed at one end of the bracket away from the circuit board. When assembling the above imaging module, the side wall of the bracket is connected to the circuit board by glue applied to the circuit board. The side wall of the bracket needs to maintain a safe distance from the electronic components, resulting in a relatively large size of the imaging module. Summary of the Invention

[0005] Based on this, in view of the problem that the side wall of the bracket needs to maintain a safe distance from the electronic components, resulting in a relatively large size of the imaging module, it is necessary to provide a bracket, an imaging module, and a mobile terminal.

[0006] A bracket is used to connect the circuit board of the imaging module and the lens assembly. The circuit board includes a bearing surface, and the bearing surface includes a chip installation portion and a frame portion located outside the chip installation portion. The frame portion includes a component installation area and a blank area. The chip installation portion is used to install the photosensitive chip of the imaging module, and the component installation area is used to install the electronic components of the imaging module.

[0007] The bracket includes a support plate and a first protrusion. The support plate includes a first surface and a second surface opposite to each other. The first protrusion is disposed on the first surface. The end of the first protrusion away from the support plate is connected to the blank area. The height of the first protrusion is greater than the height of the electronic components, so that the support plate is suspended above the electronic components and forms a first notch in the circumferential direction. The first notch is disposed adjacent to the electronic components to avoid the electronic components.

[0008] The support plate is provided with a light passing hole penetrating through the first surface and the second surface. The light passing hole is disposed opposite to the photosensitive chip, and the second surface is used to connect the lens assembly.

[0009] In the above-mentioned bracket, the support plate is suspended above the electronic component and forms a first notch in the circumferential direction. As a result, at least part of the edge of the support plate lacks the side wall between the edge of the support plate and the frame portion. That is, the above-mentioned bracket omits at least part of the side wall compared with the traditional bracket, and the formed first notch can avoid the electronic component. Therefore, when assembling the above-mentioned bracket, there is no need to reserve a safety distance between the bracket and the electronic component, reducing the size of the bracket in the XY plane, and thus a camera module with a smaller size can be obtained.

[0010] In one embodiment, the height of the first protrusion is 200-500 microns. In this way, not only can the support plate be suspended above the electronic component, but also the bracket can have a smaller size in the Z-axis direction.

[0011] In one embodiment, the number of the first protrusions is multiple, and the multiple first protrusions are arranged at intervals. In this way, the support plate can be more stably fixed on the circuit board.

[0012] In one embodiment, the number of the first protrusions is one. The first protrusion is strip-shaped and extends from one side surface of the support plate to the opposite side surface of the bracket. In this way, it is easier to realize the pre-fixation of the support plate and the circuit board.

[0013] In one embodiment, the bracket is a bracket with part of the side wall missing, and there is a first protrusion whose outer side surface is flush with the outer side surface of the support plate. The first protrusion whose outer side surface is flush with the outer side surface of the support plate is the side wall of the bracket; the bracket is a bracket without a side wall, and all the first protrusions are located inside the outer side surface of the support plate. In this way, brackets with partial side wall missing and brackets without side walls can be obtained by arranging the positions of the first protrusions.

[0014] In one embodiment, there is a first protrusion located between the electronic component and the photosensitive chip. In this way, the first protrusion not only has the function of pre-fixing the support plate to the circuit board, but also has the function of preventing glue overflow.

[0015] In one embodiment, there is a first protrusion located at the corner of the support plate. In this way, the electronic component can be better avoided.

[0016] In one embodiment, the bracket further includes an anti-overflow glue member disposed on the first surface. When the anti-overflow glue member is used to block a flowable and viscous material from flowing into and closing the first notch, the material will not flow to the photosensitive part of the photosensitive chip. By setting the anti-overflow glue member, it can effectively prevent the photosensitive part of the photosensitive chip from being contaminated and avoid the reduction of imaging quality.

[0017] In one embodiment, the anti-overflow glue member is a closed ring structure surrounding the through-hole for light. In this way, the anti-overflow glue can be more comprehensive.

[0018] In one embodiment, the anti-overflow glue member includes a plurality of anti-overflow glue blocks, and the plurality of anti-overflow glue blocks are arranged at intervals around the through-hole for light. In this way, the anti-overflow glue can be better, and a space for avoiding electronic components can be formed between two adjacent anti-overflow glue blocks according to actual design needs.

[0019] In one embodiment, the support plate is provided with air escape holes penetrating through the opposite two surfaces of the support plate, and an air escape groove is provided on the surface of the support plate close to the circuit board. The two ends of the air escape groove are respectively communicated with the air escape holes and the through-hole for light. One end of the anti-overflow glue member is adjacent to one side of the air escape groove, and the other end extends around the through-hole for light to the other side of the air escape groove and is adjacent to the other side of the air escape groove. In this way, the anti-overflow glue can be better, and it is also beneficial for gas to escape.

[0020] In one embodiment, the anti-overflow glue member includes a first anti-overflow glue part and a second anti-overflow glue part. The first anti-overflow glue part and the second anti-overflow glue part respectively correspond to the connection area of the photosensitive chip and the non-connection area of the photosensitive chip, and the height of the first anti-overflow glue part is less than the height of the second anti-overflow glue part. By using the first anti-overflow glue part with a smaller height corresponding to the connection area, it can avoid interference between the first anti-overflow glue part and the conductive wires on the connection area. By using the second anti-overflow glue part with a larger height corresponding to the non-connection area, the glue passing channel can be made smaller, so as to have a better anti-overflow glue effect.

[0021] In one embodiment, the bracket further includes a second protrusion disposed on the first surface. The outer side surface of the second protrusion is flush with the outer side surface of the support plate, and the height of the second protrusion is less than the height of the first protrusion, thereby forming a second notch in the circumferential direction, and the second notch is away from the electronic components. When there are multiple first notches, some first notches are near the electronic components, and some first notches are not near the electronic components. By setting the second protrusion, the first notch with a larger height can be changed into a second notch with a smaller height, so as to reduce the amount of the closing member for closing the notch and reduce the filling height of the closing member.

[0022] In one embodiment, the height of the second notch is greater than or equal to 100 microns so that a flowing and viscous material can flow into the second notch to close it. If the height of the second notch is too small, it is not conducive to the material flowing between the support plate and the circuit board. By controlling the height of the second notch to be greater than or equal to 100 microns, it is very conducive to the material flowing between the support plate and the circuit board.

[0023] An imaging module, comprising:

[0024] A circuit board, including a bearing surface, the bearing surface including a chip mounting portion and a frame portion located on the outer periphery of the chip mounting portion;

[0025] An image sensor chip, disposed on the chip mounting portion;

[0026] Electronic components, disposed on the frame portion;

[0027] The above-mentioned bracket, an installation groove surrounding the light passing hole is formed on the surface of the support plate away from the circuit board, or an installation groove surrounding the light passing hole is formed on the surface of the support plate close to the circuit board;

[0028] A sealing member, disposed in the first notch to seal the first notch, or disposed in the first notch and the second notch to seal the first notch and the second notch;

[0029] A filter, disposed in the installation groove; and

[0030] A lens assembly, disposed on the surface of the support plate away from the circuit board, the lens assembly being a fixed-focus lens assembly or a zoom lens assembly.

[0031] The above imaging module uses a photosensitive component with a smaller size, so that an imaging module with a smaller size can be obtained. Moreover, by arranging the position of the filter and the type of the lens assembly, the above imaging module can obtain a variety of different imaging modules to meet different application requirements.

[0032] In one embodiment, the number of the first protrusions is greater than or equal to 1. One of the first protrusions is strip-shaped and extends from one side surface of the support plate to the other side surface, and the pin is opposite to the strip-shaped first protrusion. The pin is opposite to the strip-shaped first protrusion, so that it is not necessary to apply glue on the side of the bracket corresponding to the pin to fill the notch, which can avoid affecting the electrical connection of the pin due to the glue covering the pads on the circuit board for electrical connection with the pin. Moreover, the pin will not interfere with the application of glue. The notch can be filled with glue first, and then the lens assembly can be assembled on the support plate, or the lens assembly can be assembled on the support plate first, and then the notch can be filled with glue.

[0033] In one embodiment, the lens assembly is a fixed-focus lens assembly, and the fixed-focus lens assembly is an integrated lens assembly. The integrated lens assembly includes a lens barrel and lenses disposed within the lens barrel. The lens barrel is disposed on the surface of the support plate away from the circuit board. The integrated lens assembly can make the structure of the above camera module simpler and easier to assemble.

[0034] A mobile terminal includes the above camera module. The above mobile terminal uses a camera module with a smaller size, so as to obtain a mobile terminal with a smaller size. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A cross-sectional schematic view of a camera module provided by an embodiment of the present invention;

[0036] Figure 2 An exploded schematic view of a circuit board and a bracket provided by an embodiment of the present invention;

[0037] Figure 3 is Figure 2 a plan view of the circuit board in

[0038] Figure 4 is Figure 2 a three-dimensional schematic view of the bracket in

[0039] Figure 5 is Figure 4 a plan view of the first surface of the bracket in

[0040] Figure 6 is Figure 4 a plan view of the second surface of the bracket in

[0041] Figure 7 is Figure 1 a comparison schematic view of the photosensitive component shown and a traditional photosensitive component;

[0042] Figure 8 is Figure 1 a cross-sectional schematic view of the camera module shown after removing the closure;

[0043] Figure 9 a plan view of a bracket with a missing border part provided by an embodiment of the present invention;

[0044] Figure 10 a plan view of a bracket with a missing border part provided by another embodiment of the present invention;

[0045] Figure 11 a plan view of a bracket with a completely missing border provided by another embodiment of the present invention;

[0046] Figure 12Schematic cross-sectional view of an imaging module provided by another embodiment of the present invention;

[0047] Figure 13 Schematic cross-sectional view of an imaging module provided by another embodiment of the present invention;

[0048] Figure 14 Schematic perspective view of the imaging module provided by another embodiment of the present invention after removing the closure;

[0049] Figure 15 is Figure 14 Schematic plan view of the imaging module shown;

[0050] Figure 16 is along Figure 15 Cross-sectional view taken along line A-A in;

[0051] Figure 17 is along Figure 15 Cross-sectional view taken along line B-B in;

[0052] Figure 18 is Figure 14 Schematic exploded perspective view of the circuit board and the bracket shown;

[0053] Figure 19 is Figure 18 Schematic perspective view of the bracket in;

[0054] Figure 20 An upper-mounted zoom imaging module provided by an embodiment of the present invention;

[0055] Figure 21 A lower-mounted zoom imaging module provided by an embodiment of the present invention;

[0056] Figure 22 Schematic cross-sectional view of an upper-mounted fixed-focus imaging module provided by an embodiment of the present invention;

[0057] Figure 23 Schematic cross-sectional view of a photosensitive component provided by another embodiment of the present invention;

[0058] Figure 24 is Figure 23 Local enlarged view at C in. Detailed Description of the Invention

[0059] To make the above objects, features, and advantages of the present invention more apparent and understandable, the following detailed description of the specific embodiments of the present invention will be made in conjunction with the accompanying drawings. Many specific details are set forth in the following description to facilitate a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0060] It should be noted that when an element is referred to as "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time.

[0061] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0062] As Figure 1 shown, an imaging module 10 provided by an embodiment of the present invention includes a photosensitive component 10a and a lens component 10b disposed on the photosensitive component 10a. The lens component 10b is disposed on the light-sensitive path of the photosensitive component 10a. Light reaches the photosensitive component 10a after passing through the lens component 10b, thereby realizing imaging.

[0063] In this embodiment, the imaging module 10 is applied to a mobile terminal. Specifically, in this embodiment, the mobile terminal includes a terminal body (not shown in the figure) and the imaging module 10 disposed on the terminal body. More specifically, in this embodiment, the mobile terminal is a portable mobile terminal such as a smart phone or a tablet computer.

[0064] As Figure 1 shown, the photosensitive component 10a includes a circuit board 100, a photosensitive chip 200, electronic components 300, conductive wires 400, a bracket 500, a closure 600, and a filter 700.

[0065] The circuit board 100 is used to carry components such as the photosensitive chip 200. As Figure 2 and Figure 3 shown, the circuit board 100 includes a carrying surface 110, and the carrying surface 110 includes a chip mounting portion 112 and a frame portion 114 located on the outer periphery of the chip mounting portion 112. In some embodiments, the frame portion 114 is a closed-loop structure. In this embodiment, the frame portion 114 is square. The frame portion 114 includes a component mounting area 1142 and a blank area 1144. The component mounting area 1142 is used to set the first pads 120 and mount electronic components 300 such as capacitors and resistors.

[0066] The photosensitive chip 200 is disposed in the chip mounting portion 112. In some embodiments, a bonding layer is provided between the photosensitive chip 200 and the chip mounting portion 112. The photosensitive chip 200 includes a photosensitive surface 210, and the photosensitive surface 210 includes a photosensitive portion 212 and a non-photosensitive portion 214 surrounding the photosensitive portion 212. The non-photosensitive portion 214 includes an independent connection area 2142 and a non-connection area 2144. The connection area 2142 is used for electrical connection with the circuit board 100. In some embodiments, a second pad 220 is provided on the connection area 2142, and the second pad 220 is connected to the first pad 120 through a conductive wire 400. In some embodiments, the conductive wire 400 is a gold wire.

[0067] The bracket 500 includes a support plate 510 and a first protrusion 520. The support plate 510 includes opposite first and second surfaces 512 and 514, that is, the support plate 510 has a flat plate structure. The second surface 514 is used to connect to the lens assembly 10b. The support plate 510 is provided with a light through hole 530 penetrating through the first surface 512 and the second surface 514. The first protrusion 520 is disposed on the first surface 512. The number of the first protrusions 520 is multiple, and the multiple first protrusions 520 are arranged at intervals and are used to be respectively connected to the multiple blank areas 1144.

[0068] When manufacturing the above photosensitive component 10a, first provide a circuit board 100 having a plurality of blank areas 1144; then provide a bracket 500 having a plurality of first protrusions 520, the number of the first protrusions 520 being less than or equal to the number of the blank areas 1144, and each first protrusion 520 corresponding to a blank area 1144; apply glue to the blank areas 1144 and place the first protrusions 520 on the blank areas 1144 after applying glue; after the glue between the blank areas 1144 and the first protrusions 520 is cured to form an adhesive layer, the pre-fixation between the bracket 500 and the circuit board 100 is achieved.

[0069] As Figure 7 shown, the traditional bracket 500a has a hollow structure with openings at both ends, and the side wall 502 of the bracket 500a is connected to the circuit board 100a through the adhesive applied to the circuit board 100a, and the side wall 502 of the traditional bracket 500a provides a supporting force for the lens assembly. The side wall 502 of the traditional bracket 500a is a complete closed-loop structure, which requires a relatively large space on the circuit board 100a, and when assembling the bracket 500a, a safety distance between the bracket 500a and the electronic component 300a needs to be reserved, which is not conducive to reducing the size of the XY plane of the camera module.

[0070] In the above camera module 10, as Figure 7 and Figure 8As shown, the first protrusions 520 provide a supporting force for the lens module 10b. The bracket 500 is connected to the circuit board 100 through a plurality of discrete first protrusions 520, so that at least a part of the edge of the support plate 510 forms a first notch 10c in the circumferential direction due to the lack of a side wall between the edge of the support plate 510 and the circuit board 100. That is, the bracket 500 in the above camera module 10 omits at least part of the side wall relative to the conventional bracket 500a, which is beneficial to reducing the size of the XY plane of the camera module 10. Moreover, the multi-point contact is easier to control the assembly flatness of the bracket 500 than the surface contact.

[0071] In some embodiments, the formed first notch 10c can avoid the electronic components 300. Thus, when assembling the above bracket 500, the safety distance between the bracket 500 and the electronic components 300 does not need to be reserved, reducing the size of the XY plane of the bracket 500, and then a camera module 10 with a smaller size can be obtained.

[0072] As Figure 8 shown, when manufacturing the above photosensitive component 10a, after the bracket 500 and the circuit board 100 are pre-fixed, there is a first notch 10c between the circuit board 100 and the support plate 510. The first notch 10c can be filled with a filler to form a seal 600 at the first notch 10c (as Figure 1 shown), so as to seal the photosensitive chip 200 in the circumferential direction of the photosensitive chip 200. That is, the seal 600 is used to replace the missing frame (side wall) of the bracket 500. Setting the seal 600 can prevent the photosensitive chip 200 from contacting the external air, better protect the photosensitive chip 200, and the seal 600 can increase the connection strength between the support plate 510 and the circuit board 100, making the structure of the entire photosensitive component 10a more stable. In some other embodiments, the seal 600 can also be omitted. For example, when the camera module 10 including the above photosensitive component 10a is applied to a mobile terminal, the housing of the mobile terminal can be used to isolate the photosensitive chip 200 from the outside atmosphere, or the limiting structure in the mobile terminal can be used to improve the stability of the entire photosensitive component 10a.

[0073] In some embodiments, the filler is a material that can flow and has viscosity. The seal 600 can be formed by flowing a material that can flow and has viscosity into the space between the support plate 510 and the circuit board 100 through the first notch 10c and then through a curing process. In this way, the seal 600 can not only seal the first notch 10c but also increase the connection firmness between the support plate 510 and the circuit board 100. Specifically, in some embodiments, the filler is an adhesive. In some other embodiments, a semi-cured and viscous rubber strip can also be made first, and then the rubber strip is pressed into the first notch 10c by an interference fit method, and finally the rubber strip is cured to obtain the seal 600.

[0074] In some other embodiments, when the first protrusion 520 is omitted, auxiliary tools such as a manipulator can be used to suspend the support plate 510 above the circuit board 100, and then dispense glue between the support plate 510 and the circuit board 100. After the glue is cured, fixing points are formed. The fixing points are similar in function to the first protrusion 520, mainly to achieve pre-fixation between the support plate 510 and the circuit board 100. Finally, filler is used to fill the first gap 10c between the fixing points.

[0075] In some embodiments, please refer to the attached Figure 8 , the circuit board 100 and the photosensitive chip 200 are arranged along the Z direction (i.e., the height direction). The distance between the end face of the electronic component 300 away from the circuit board 100 and the bearing surface 110 is H1, and the opening width of the first gap 10c in the Z-axis direction is H2. H2 is greater than H1. Thus, when the first gap 10c is arranged adjacent to the electronic component 300, the first gap 10c can well avoid the electronic component 300. Furthermore, during assembly, the safety distance between the bracket 500 and the electronic component 300 does not need to be reserved, reducing the size of the XY plane of the photosensitive component 10a. Consequently, a photosensitive component 10a with a smaller size can be obtained. Moreover, since H2 is greater than H1, it is very convenient for the filler to flow inward between the support plate 510 and the circuit board 100.

[0076] In some embodiments, the support plate 510 is a flat plate structure with a uniform thickness everywhere, that is, the distance between the first surface 512 and the second surface 514 is equal everywhere. In some other embodiments, the support plate 510 can also be a non-flat plate structure with a smaller thickness in the middle and a larger thickness at the edges, as long as H2 is greater than H1 can be ensured.

[0077] Generally, the height H1 of the electronic component 300 is greater than the height of the photosensitive chip 200 and also greater than the height of the conductive wire 400. In some embodiments, the number of electronic components 300 is usually multiple, and the specifications of each electronic component 300 are different. Some electronic components 300 have a larger height, and some electronic components 300 have a smaller height. In some embodiments, by controlling the opening width of the first gap 10c in the Z-axis direction to be H2 greater than the height H1 of the electronic component 300 with the largest height, the support plate 510 can be suspended above the photosensitive chip 200, the conductive wire 400, and all the electronic components 300. In some embodiments, H2 is 200 - 500 microns.

[0078] The bracket 500 can be a bracket with all the borders missing, that is, a borderless bracket (a bracket without side walls), or the bracket 500 can also be a bracket with some borders missing (a bracket with some side walls missing). Figure 4 As shown, the bracket 500 is a bracket with some borders missing. Several specific embodiments will be used below to elaborate in detail on the borderless bracket and the bracket with some borders missing.

[0079] In some embodiments, as Figure 9 and Figure 10 shown, the edge of the end face of at least one first protrusion 520 coincides with the edge of the first surface 512 of the support plate 510, that is, there is a first protrusion 510 whose outer side is flush with the outer side of the support plate 510, that is, at least one first protrusion 520 is located at the edge of the support plate 510. This first protrusion 520 can be regarded as a part of the frame (part of the side wall) of the bracket 500. At this time, the bracket 500 is a bracket with a missing frame part.

[0080] In some embodiments, as Figure 11 shown, the edges of the end faces of all the first protrusions 520 are spaced from the edge of the first surface 512 of the support plate 510, that is, all the first protrusions 520 are located inside the outer side of the support plate 510, that is, all the first protrusions 520 are located in the middle of the support plate 510. At this time, the bracket 500 is a bracket with a completely missing frame.

[0081] As Figure 9 shown, Figure 9 illustrates a bracket with a missing frame part provided by an embodiment of the present invention. The bracket 500 includes four first protrusions 520 with the same size and shape. The four first protrusions 520 are respectively located at the four corners of the support plate 510 and are all located at the edge of the support plate 510. These four first protrusions 520 can all be regarded as part of the frame of the bracket 500. After the bracket 500 is pre-fixed to the circuit board 100, there are four first gaps 10c between the circuit board 100 and the support plate 510. During the formation of the enclosure 600, glue can be applied to the four sides of the bracket 500 to seal all the four first gaps 10c.

[0082] After applying the glue, the filler will flow inward (toward the photosensitive chip 200) to cover the electronic components 300, the first pad 120, and the end of the conductive wire 400 connected to the first pad 120. The filler will also flow outward. As Figure 12 shown, the flexible circuit board 20 corresponds to one first gap 10c. After the filler flows outward onto the flexible circuit board 20, it can serve as the reinforcing glue 22 of the flexible circuit board 20 to increase the strength of the flexible circuit board 20, that is, a part of the same enclosure 600 is located in the first gap 10c, and another part is located at the connection between the circuit board 100 and the flexible circuit board 20. The other end of the flexible circuit board 20 is provided with a connector 30.

[0083] It should be noted that the situation of the filler covering the components can be determined by controlling the amount of the filler. Taking Figure 2Taking the shown perspective as an example, the photosensitive chip 200 is square, and multiple electronic components 300 are arranged in two rows. The two rows of electronic components 300 are distributed on the opposite left and right sides of the photosensitive chip 200. Multiple conductive wires 400 are arranged in three rows. The three rows of conductive wires 400 are distributed on the upper side, lower side, and right side of the photosensitive chip 200. One row of conductive wires 400 on the right side is arranged in parallel and spaced apart from one row of electronic components 300 on the right side. When dicing and filling (with filler), if the amount of glue is extremely small, in the radial direction, the filler may not wrap the electronic components 300, the first pad 120, and the end of the conductive wire 400 connected to the first pad 120. If the amount of glue is relatively small, in the radial direction, the filler can only cover a part of the left electronic components 300 and cannot completely cover the left electronic components 300. The filler can only cover the first pads 120 on the upper and lower sides and the end of the conductive wire 400 connected to the first pad 120, and cannot completely cover the conductive wire 400 and the second pad 220. The filler can only cover a part or all of the right electronic components 300, but cannot cover the right conductive wire 400.

[0084] The greater the amount of filler used, the easier it is to seal the first notch 10c, and the higher the connection firmness between the support plate 510 and the circuit board 100. However, the greater the amount of filler used, the correspondingly higher the probability that the filler will overflow to the photosensitive part 212 of the photosensitive chip 200, which affects the photosensitive performance of the photosensitive chip 200 and results in a reduction in imaging quality. In some embodiments, considering the above factors comprehensively, by controlling the amount of filler used, in the radial direction, the seal 600 covers at least part of the electronic components 300, and the seal 600 covers at least the first pad 120 and the end of the conductive wire 400 connected to the first pad 120.

[0085] As Figure 10 shown, Figure 10 illustrates a bracket with a missing border portion provided by another embodiment of the present invention. The bracket 500 includes four first protrusions 520, and the four first protrusions 520 can all be regarded as partial borders of the bracket 500. In this embodiment, the first protrusion 520 at the top is strip-shaped, that is, the first protrusion 520 at the top extends from one side surface of the support plate 510 to the opposite side surface, that is, one side of the bracket 500 has a complete side wall. The shapes and sizes of the other three first protrusions 520 are the same and are square-shaped. That is, the bracket 500 has a continuous border and three discrete border portions. After the bracket 500 is pre-fixed to the circuit board 100, there are three first notches 10c between the circuit board 100 and the support plate 510. During the formation of the seal 600, glue can be applied to three sides of the bracket 500 to seal all three first notches 10c. As Figure 13As shown, the first protrusion 520 in a long strip shape is located on the side of the bracket 500 close to the flexible circuit board 20, and it is the bearing stress position of the bracket 500. In this way, in a predetermined step, glue can be applied only at the blank area 1144 corresponding to the first protrusion 520 in a long strip shape, and not at other blank areas 1144, thereby making the pre-curing step simpler.

[0086] In Figure 13 In the illustrated embodiment, the flexible circuit board 20 faces the first protrusion 520 in a long strip shape, so there is no need to apply glue on the side of the bracket 500 corresponding to the flexible circuit board 20 to fill the gap, which can avoid affecting the electrical connection of the flexible circuit board 20 due to the glue covering the interface on the circuit board 100 for electrical connection with the flexible circuit board 20. Moreover, the gap can be filled with glue first, and then the flexible circuit board 20 can be assembled on the circuit board 100, or the flexible circuit board 20 can be assembled on the circuit board 100 first, and then the gap can be filled with glue.

[0087] As Figure 11 shown, Figure 11 It schematically shows a bracket with all the frames missing provided by an embodiment of the present invention. The bracket 500 includes four first protrusions 520, and all four first protrusions 520 are located in the middle of the support plate 510 and cannot form the frame of the bracket 500. After the bracket 500 is pre-fixed to the circuit board 100, there are four first gaps 10c between the circuit board 100 and the support plate 510. During the formation of the closure 600, glue can be applied on the four sides of the bracket 500 to close all four first gaps 10c. The frames of the bracket 500 are all formed by the closure 600.

[0088] It should be noted that although Figures 9 - 11 the first protrusions 520 shown are all square, the shape of the first protrusion 520 is not limited to square, and can be any regular shape (such as cylindrical, frustum-shaped, prismatic) or irregular shape, as long as it can support the support plate 510.

[0089] In some embodiments, the closure 600 is connected to the first protrusion 520. Among them, when the bracket 500 is a bracket with some frames missing, the closure 600 needs to be connected to the first protrusion 520 to form a closed structure to enclose the photosensitive chip 200. In some embodiments, when the bracket 500 is a bracket with all frames missing, the closure 600 may not be connected to the first protrusion 520, as long as it can close the first gap 10c between the circuit board 100 and the support plate 510. Of course, in some embodiments, when the bracket 500 is a bracket with all frames missing, the closure 600 may also be connected to the first protrusion 520.

[0090] In some embodiments, as Figure 1As shown, the enclosure 600 covers the electronic component 300, the first pad 120, and the end of the conductive wire 400 connected to the first pad 120. In this way, the enclosure 600 can well protect the electronic component 300, the first pad 120, and the end of the conductive wire 400 connected to the first pad 120.

[0091] As Figure 1 shown, in some embodiments, the first protrusion 520 is located between the electronic component 300 and the photosensitive chip 200. In some embodiments, the electronic component 300 can also be located between the first protrusion 520 and the photosensitive chip 200.

[0092] In some embodiments, as Figure 12 and Figure 13 shown, the bracket 500 further includes a second protrusion 540. The second protrusion 540 is provided on the first surface 512 and corresponds to the border portion 114 of the bearing surface 110. The height of the second protrusion 540 is less than the height of the first protrusion 520, and an enclosure 600 is provided between the second protrusion 540 and the border portion 114. By providing the second protrusion 540 and making its height less than that of the first protrusion 520, the amount of the enclosure 600 can be reduced when forming the enclosure 600, so as to reduce the filling height of the enclosure 600. The number of the second protrusions 540 can be one or more. When the number of the second protrusions 540 is multiple, the multiple second protrusions 540 are arranged at intervals.

[0093] When the outer side surface of the second protrusion 540 is flush with the outer side surface of the support plate 510, the second protrusion 540 can serve as the border of the bracket 500. When the outer side surface of the second protrusion 540 is located inside the outer side surface of the support plate 510, the second protrusion 540 does not serve as the border of the bracket 500. As Figure 12 and Figure 13 shown, the outer side surface of the second protrusion 540 is flush with the outer side surface of the support plate 510, and the second protrusion 540 serves as the border of the bracket 500.

[0094] The second protrusion 540 can be connected to the first protrusion 520 or can be arranged at intervals from the second protrusion 540. As Figure 14 shown, the second protrusion 540 is connected to the first protrusion 520.

[0095] In Figures 14 - 19 the shown embodiment, both the first protrusion 520 and the second protrusion 540 serve as the border of the bracket 500, and the second protrusion 540 is connected to the first protrusion 520.

[0096] When the outer side surface of the second protrusion 540 is flush with the outer side surface of the support plate 510 and the height of the second protrusion 540 is less than the height of the first protrusion 520, after the bracket 500 and the circuit board 100 are pre-cured, the second protrusion 540 and the circuit board 100 are arranged at intervals, and a second notch 10f located in the circumferential direction is formed. As Figures 17 - 19 shown, the second notch 10f is far from the electronic component 300. When there are multiple first notches 10c, some electronic components 300 are near some of the first notches 10c, and there are no electronic components 300 near some of the first notches 10c. By setting the second protrusion 540, the first notch 10c with a larger height can be changed into the second notch 10f with a smaller height, so that the amount of the sealant 600 can be reduced and the filling height of the sealant 600 can be decreased.

[0097] In some embodiments, as Figures 17 - 19 shown, the second notch 10f is arranged adjacent to the conductive wire 400 to avoid the conductive wire 400. Since the height of the conductive wire 400 is usually less than the height of the electronic component 300, the second notch 10f with a smaller height can avoid the conductive wire 400. Thus, when assembling, the safety distance between the bracket 500 and the conductive wire 400 does not need to be reserved, and a photosensitive component 10a with a smaller size can be obtained.

[0098] The opening width H3 of the second notch 10f in the first direction 12 is too small, and the resistance is large, which is not conducive to the filler flowing into the space between the circuit board 100 and the support plate 510. In some embodiments, the opening width H3 of the second notch 10f in the first direction 12 is greater than 100 microns, so that the filler that can flow and has viscosity can flow through the second notch 10f to seal the second notch 10f. Specifically, H3 is 100 - 200 microns.

[0099] In some embodiments, as Figure 18 and Figure 19 shown, the photosensitive chip 200 is square. Two rows of electronic components 300 correspond to the opposite sides of the photosensitive chip 200. Each row of electronic components 300 includes a plurality of spaced-apart electronic components 300. Two rows of conductive wires 400 correspond to the other two sides of the photosensitive chip 200 respectively. Each row of conductive wires 400 includes a plurality of spaced-apart conductive wires 400. There are two first notches 10c, and the two first notches 10c respectively correspond to the two rows of electronic components 300. There are two second notches 10f, and the two second notches 10f respectively correspond to the two rows of conductive wires 400.

[0100] In some embodiments, as Figures 15 - 19As shown, the bracket 500 further includes a stopper 550. The stopper 550 is disposed on the first surface 512, adjacent to the edge of the light-passing hole 530, and corresponds to the frame portion 114 of the bearing surface 110. Thus, when forming the closure 600, it can prevent the filler from flowing into the chip mounting portion 112 and avoid contaminating the photosensitive chip 200 with the filler.

[0101] In some embodiments, the stopper 550 corresponds to the boundary line between the frame portion 114 and the chip mounting portion 112.

[0102] In some embodiments, the height of the stopper 550 is the same as the height of the first protrusion 520. Wherein, when the height of the stopper 550 is the same as the height of the first protrusion 520, the stopper 550 not only has the function of the first protrusion 520, that is, to realize the pre-fixation of the bracket 500 and the circuit board 100, but also has the function of preventing the filler from contaminating the photosensitive chip 200. That is, when the first protrusion 520 is located between the electronic component 300 and the photosensitive chip 200, the first protrusion 520 can be used to realize the pre-fixation of the bracket 500 and the circuit board 100 and prevent the filler from contaminating the photosensitive chip 200.

[0103] In some embodiments, the stopper 550 is connected to the first protrusion 520, and the stopper 550 and the second protrusion 540 are independent of each other, that is, the stopper 550 is not connected to the second protrusion 540.

[0104] In Figure 18 and Figure 19 the illustrated embodiment, the number of the first protrusions 520 is three, and the three first protrusions 520 are distributed at three corners of the support plate 510. The number of the second protrusions 540 is two, and the two second protrusions 540 are oppositely arranged. One of the second protrusions 540 connects two adjacent first protrusions 520, and the other second protrusion 540 connects one first protrusion 520. The number of the stoppers 550 is two, and the two stoppers 550 are oppositely arranged and located between the two second protrusions 540. The height of the stopper 550 is the same as the height of the first protrusion 520, and the stopper 550 is connected to the first protrusion 520 and is in an L shape. The overall L shape formed by the stopper 550 and the first protrusion 520 can be regarded as an L-shaped first protrusion 520. The electronic component 300 is located between the stopper 550 and the edge of the support plate 510, that is, the electronic component 300 is adjacent to the first notch 10c. The conductive wire 400 is located between the second protrusion 540 and the light-passing hole 530, that is, the conductive wire 400 is adjacent to the second notch 10f.

[0105] In some embodiments, such as Figure 1 and Figure 18As shown, a filter mounting groove 516 is recessed in the second surface 514 to surround the light transmission hole 530. A filter 700 is disposed in the mounting groove 516, and an adhesive layer 810 is provided between the filter 700 and the bottom of the mounting groove 516. At this time, the photosensitive component 10a is an upper-mounted photosensitive component.

[0106] In some embodiments, a filter mounting groove 516 is recessed in the first surface 512 to surround the light transmission hole 530. A filter 700 is disposed in the mounting groove 516. At this time, the photosensitive component 10a is a lower-mounted photosensitive component.

[0107] As Figure 4 , Figure 5 and Figure 6 shown, the support plate 510 is provided with an air escape hole groove 560. The air escape hole groove 560 includes an air escape hole 562 penetrating through the first surface 512 and the second surface 514, and an air escape groove 564 opened on the first surface 512. The air escape hole 562 is independent of the mounting groove 516. Both ends of the air escape groove 564 are respectively communicated with the air escape hole 562 and the light transmission hole 530, and the air escape groove 564 is located between the air escape hole 562 and the light transmission hole 530. When the closure 600 is formed and the filter 700 is fixed on the mounting groove 516, during baking to simultaneously cure the closure 600 and the glue bonding the filter 700, the gas that expands due to heat can be discharged through the air escape groove 564 and the air escape hole 562.

[0108] In some embodiments, the filter 700 may not be disposed on the bracket 500. At this time, the filter 700 can be received within a pattern formed by enclosing of a plurality of first protrusions 520 and is directly disposed on the photosensitive surface 210 of the photosensitive chip 200.

[0109] In some embodiments, the photosensitive component 10a may not include the filter 700. At this time, the filter 700 can be disposed in the lens assembly 10b. The lens assembly 10b can be a fixed-focus lens assembly or a zoom lens assembly.

[0110] As Figure 1 shown, the lens assembly 10b is fixed on the second surface 514 of the support plate 510 through an adhesive layer 820. As Figure 1 and Figure 17 shown, Figure 1 and Figure 17 shown, the imaging module 10 is a fixed-focus imaging module, and its lens assembly 10b is an integrated lens assembly. The integrated lens assembly includes a lens barrel and lenses disposed in the lens barrel. Figure 1 and Figure 17 shown, the imaging module 10 is an upper-mounted fixed-focus imaging module.

[0111] As Figure 20 shown, Figure 20The illustrated camera module 10 is a zoom camera module. Its lens assembly 10b includes a voice coil motor 910, a lens barrel 920 disposed within the voice coil motor 910, and lenses disposed within the lens barrel 920. The voice coil motor 910 is connected to the circuit board 100 through pins 930. The voice coil motor 910 drives the lens barrel 920 to drive the lenses to move, thereby achieving autofocus. Figure 20 The illustrated camera module 10 is an upper-mounted zoom camera module. Figure 21 The illustrated camera module 10 is a lower-mounted zoom camera module.

[0112] In some embodiments, as Figure 20 shown, the pins 930 are located on the outer periphery of the support plate 510, and the pins 930 are aligned with the elongated first protrusion 520. Among them, the elongated first protrusion 520 extends from one side surface of the support plate 510 to the other side surface. The pins 930 are aligned with the elongated first protrusion 520, so that it is not necessary to apply glue on the side of the bracket 500 corresponding to the pins 930 to fill the gap, which can avoid the influence on the electrical connection of the pins 930 due to the glue covering the pads on the circuit board 100 for electrically connecting with the pins 930. Moreover, the pins 930 will not interfere with the application of glue. The gap can be filled with glue first, and then the lens assembly 10b can be assembled on the support plate 510, or the lens assembly 10b can be assembled on the support plate 510 first, and then the gap can be filled with glue.

[0113] In some embodiments, as Figure 22 shown, the camera module 10 further includes a protection member 10d, and the protection member 10d covers the conductive wire 400. In some embodiments, while the protection member 10d covers the conductive wire 400, both ends of the protection member 10d are respectively connected to the circuit board 100 and the non-photosensitive portion 214 of the photosensitive chip 200 to cover the second pad 220 and the first pad 120. In some embodiments, the protection member 10d is a cured adhesive. The material of the protection member 10d and the closure member 600 may be the same or different. When manufacturing the camera module 10, the protection member 10d is formed first, then the bracket 500 is predetermined on the circuit board 100, and then the closure member 600 is formed.

[0114] During the formation of the encapsulant 600, the first pad 120 located on the circuit board 100 and connected to the conductive wire 400, the end of the conductive wire 400 close to the circuit board 100, and even the second pad 220 located on the photosensitive chip 200 and connected to the conductive wire 400 may all be wrapped by the filler. That is, the first pad 120, the conductive wire 400, and the second pad 220 may all be wrapped by the filler. During the process of the fluid filler curing to form the encapsulant 600, due to the shrinkage rate of the filler, the conductive wire 400 may be strained, resulting in the disconnection of the conductive wire 400 from the first pad 120 and the second pad 220, or the conductive wire 400 may be broken, causing an electrical malfunction problem. Moreover, once the encapsulant 600 is formed, when an electrical malfunction problem occurs, it is very inconvenient to disassemble, making it difficult to repair the electrical malfunction problem.

[0115] In some embodiments, before forming the encapsulant 600, a protective member 10d is first provided. The protective member 10d at least covers the first pad 120 and the end of the conductive wire 400 close to the circuit board 100, so that when the flowable and viscous material flows into the space between the support plate 510 and the circuit board 100 through the first notch 10c or the second notch 10f to cure and form the encapsulant 600, the protective member 10d can prevent the material forming the encapsulant 600 from directly contacting the first pad 120 and the end of the conductive wire 400 close to the circuit board 100. At this time, by controlling the amount of the material, it is possible to prevent the material from directly contacting the end of the conductive wire 400 close to the second pad 220 and the second pad 220. In some embodiments, the protective member 10d covers the first pad 120, the conductive wire 400, and the second pad 220.

[0116] By providing the protective member 10d, it is possible to prevent the material forming the encapsulant 600 from directly covering the first pad 120, the conductive wire 400, and the second pad 220. Thus, when the material forming the encapsulant 600 cures, due to the shrinkage rate of the material, an electrical malfunction problem can be avoided. Moreover, since the step of forming the protective member 10d can precede the step of pre-fixing the bracket 500 to the circuit board 100 and the step of forming the encapsulant 600, even if an electrical malfunction problem occurs due to other reasons, it is convenient to disassemble, so that the repair of the electrical malfunction problem can be achieved.

[0117] In some embodiments, the protective member 10d has the same material as the encapsulant 600. At this time, since the amount of the material of the protective member 10d is much smaller than the amount of the material of the encapsulant 600, the effect of the shrinkage rate of the material of the protective member 10d is relatively small, and an electrical malfunction problem can be avoided.

[0118] In some embodiments, the material of the protection member 10d is different from that of the sealing member 600. Among them, the shrinkage rate of the material forming the protection member 10d is less than that of the material forming the sealing member 600, the fluidity of the material forming the protection member 10d is greater than that of the material forming the sealing member 600, the hardness of the protection member 10d is less than that of the sealing member 600, and the elasticity of the protection member 10d is greater than that of the sealing member 600.

[0119] In some embodiments, the second pad 220 is disposed on the non-photosensitive portion 214 of the photosensitive chip 200, and the protection member 10d surrounds the photosensitive portion 212 for one week to block the material forming the sealing member 600 from flowing to the photosensitive portion 212 of the photosensitive chip 200. At this time, the protection member 10d not only has the function of preventing electrical defects but also has the function of preventing glue overflow.

[0120] In some embodiments, the distance between the protection member 10d and the photosensitive portion 212 of the photosensitive chip 200 is greater than or equal to 300 microns. In this way, even if the material forming the sealing member 600 crosses the protection member 10d and flows toward the photosensitive portion 212, due to the large distance between the protection member 10d and the photosensitive portion 212, the material forming the sealing member 600 is difficult to reach the photosensitive portion 212, thereby better avoiding the material forming the sealing member 600 from flowing to the photosensitive portion 212 of the photosensitive chip 200.

[0121] In some embodiments, the protection member 10d has an asymmetric structure, and the width of the protection member 10d located on the connection area 2142 of the photosensitive chip 200 is greater than the width of the protection member 10d located on the non-connection area 2144. Since the second pad 220 is provided on the connection area 2142 and the second pad 220 is connected to the conductive wire 400, and the second pad 220 is not provided on the non-connection area 2144, the larger width of the protection member 10d located on the connection area 2142 of the photosensitive chip 200 can better cover the second pad 220 and the conductive wire 400, while the smaller width of the protection member 10d located on the non-connection area 2144 can save the amount of the protection member 10d.

[0122] In some embodiments, as Figure 23 and Figure 24 shown, the camera module 10 further includes an anti-glue overflow member 10e. The anti-glue overflow member 10e is disposed on the first surface 512 of the support plate 510, and the anti-glue overflow protrusion 10e is closer to the photosensitive chip 200 than the first protrusion 520, and is used to block the filler forming the sealing member 600 from flowing to the photosensitive portion 212 of the photosensitive chip 200. The anti-glue overflow member 10e is disposed on the support plate 510, which can avoid the anti-glue overflow member 510 occupying the area of the circuit board 100 for arranging the electronic components 300.

[0123] In some embodiments, the anti-overflow glue member 10e is disposed adjacent to the light-passing hole 530. By disposing the anti-overflow glue member 10e adjacent to the light-passing hole 530, interference between the anti-overflow glue member 10e and the electronic components 300 on the circuit board 100 can be avoided.

[0124] In some embodiments, the anti-overflow glue member 10e is a closed annular structure surrounding the light-passing hole 530 for one week. In this way, anti-overflow glue can be more comprehensively prevented. In some embodiments, the anti-overflow glue member 10e includes a plurality of anti-overflow glue blocks, and the plurality of anti-overflow glue blocks are disposed at intervals around the light-passing hole 530. In this way, anti-overflow glue can be preferably prevented, and a space for avoiding the electronic components 300 can be formed between two adjacent anti-overflow glue blocks according to actual design requirements. In some embodiments, as Figure 4 shown, the support plate 510 is provided with an air escape hole 562 penetrating through the opposite two surfaces of the support plate 510, and an air escape groove 564 is provided on the surface of the support plate 510 close to the circuit board 100. Two ends of the air escape groove 564 are respectively communicated with the air escape hole 562 and the light-passing hole 530. One end of the anti-overflow glue member 10e is adjacent to one side of the air escape groove 564, and the other end extends around the light-passing hole 530 to the other side of the air escape groove 564 and is adjacent to the other side of the air escape groove 564. In this way, anti-overflow glue can be preferably prevented, and gas can escape smoothly.

[0125] In some embodiments, as Figure 23 and Figure 24 shown, the anti-overflow glue member 10e1 is directly opposite to the non-photosensitive portion 214 of the photosensitive chip 200, that is, the orthographic projection of the anti-overflow glue member 10e1 on the photosensitive surface 210 is located on the photosensitive surface 210. In some embodiments, as Figure 23 and Figure 24 shown, a part of the anti-overflow glue member 10e2 is directly opposite to the non-photosensitive portion 214, and another part is directly opposite to the frame portion 114 of the circuit board 100. In some embodiments, the anti-overflow glue member 10e2 may not be directly opposite to the non-photosensitive portion 214 at all. At this time, the anti-overflow glue member 10e2 is completely directly opposite to the frame portion 114 of the circuit board 100.

[0126] In some embodiments, as Figure 23 and Figure 24 shown, the anti-overflow glue member 10e is disposed at intervals from the non-photosensitive portion 214 to avoid the conductive wire 400. In other embodiments, the anti-overflow glue member 10e may also be in direct contact with the non-photosensitive portion 214.

[0127] In some embodiments, one end of the anti-overflow glue member 10e away from the support plate 510 is disposed at an interval from the plane where the surface of the photosensitive chip 200 away from the circuit board 100 is located. In this way, interference between the anti-overflow glue member 10e and the conductive wire 400 on the photosensitive chip 200 can be avoided. In some embodiments, the distance between the anti-overflow glue member 10e and the non-connection area 2144 is less than or equal to 150 microns, and the distance between the anti-overflow glue member 10e and the conductive wire 400 is less than or equal to 150 microns. The distance being less than or equal to 150 microns means that the glue passage is relatively small, thus having a better anti-overflow glue effect.

[0128] In some embodiments, in the radial direction of the light passing hole 530, at least a part of the anti-overflow glue member 10e is disposed opposite to the connection area 2142, and at least a part of the anti-overflow glue member 10e is disposed opposite to the non-connection area 2144. In this way, interference between the anti-overflow glue member 10e and the electronic component 300 on the circuit board 100 can be avoided.

[0129] As Figure 23 and Figure 24 As shown, in some embodiments, the anti-overflow glue member 10e includes a first anti-overflow glue part 10e1 and a second anti-overflow glue part 10e2. The first anti-overflow glue part 10e1 and the second anti-overflow glue part 10e2 correspond to the connection area 2142 and the non-connection area 2144 respectively, and the height of the first anti-overflow glue part 10e1 is less than the height of the second anti-overflow glue part 10e2. By using the first anti-overflow glue part 10e1 with a smaller height to correspond to the connection area 2142, interference between the first anti-overflow glue part 10e1 and the conductive wire 400 on the connection area 2142 can be avoided, while by using the second anti-overflow glue part 10e2 with a larger height to correspond to the non-connection area 2144, the glue passage can be made smaller, thus having a better anti-overflow glue effect.

[0130] In some embodiments, the first anti-overflow glue part 10e1 is disposed opposite to the connection area 2142. The second anti-overflow glue part 10e2 can be disposed opposite to the non-connection area 2144, or can be disposed opposite to the frame part 114 of the circuit board 100, or can be partially disposed opposite to the non-connection area 2144 and partially disposed opposite to the frame part 114 of the circuit board 100. That is, in the radial direction of the light passing hole 530, at least a part of the first anti-overflow glue part 10e1 is disposed opposite to the connection area 2142, and at least a part of the second anti-overflow glue part 10e2 is disposed opposite to the non-connection area 2144.

[0131] In some embodiments, the anti-overflow glue member 10e can be an annular structure surrounding the light passing hole 530 for one circle. At this time, the first anti-overflow glue part 10e1 is connected to the second anti-overflow glue part 10e2.

[0132] In some embodiments, as Figure 16 and Figure 19As shown, the anti-overflow glue member 10e can also be the stopper 550. At this time, the anti-overflow glue member 10e faces the border portion 114 of the circuit board 100, that is, the orthographic projection of the anti-overflow glue member 10e on the circuit board 100 is located on the circuit board 100.

[0133] In some embodiments, such as Figure 16 and Figure 19 As shown, the overflow glue member 10e is located on the outer periphery of the photosensitive chip 200, and the anti-overflow glue member 10e is in direct contact with the circuit board 100. In other embodiments, the overflow glue member 10e is located on the outer periphery of the photosensitive chip 200, and the anti-overflow glue member 10e can also be spaced from the circuit board 100. The space between the anti-overflow glue member 10e and the circuit board 100 can be filled with the bonding glue of the pre-cured first protrusion 520, can also be filled with the filler of the closing member 600, or can not be filled.

[0134] During the formation of the closing member 600, if the amount of the material for forming the closing member 600 is not properly controlled, the material for forming the closing member 600 will flow to the photosensitive portion 212 of the photosensitive chip 200, affecting the photosensitive performance of the photosensitive chip 200 and resulting in a reduction in imaging quality. By providing the anti-overflow glue member 10e between the circuit board 100 and the support plate 510, when the closing member 600 is formed by curing after flowing through the first notch 10c or the second notch 10f into the space between the support plate 510 and the circuit board 100 from a material that can flow and has viscosity, the anti-overflow glue member 10e is used to block the material for forming the closing member 600 from flowing to the photosensitive portion 212 of the photosensitive chip 200. The anti-overflow glue member 10e can be Figure 19 the baffle 550 as shown, the baffle 550 connects the circuit board 100 and the support plate 510, and the anti-overflow glue member 10e can also be Figure 22 the protection member 10d that surrounds the photosensitive portion 212 for one week as shown, and the anti-overflow glue member 10e can also be Figure 23 and Figure 24 the anti-overflow glue member 10e as shown.

[0135] An embodiment of the present invention further provides a method for manufacturing a photosensitive component, including the following steps:

[0136] Step S1: Provide a packaging substrate, which includes a circuit board, a photosensitive chip, and electronic components. The circuit board includes a bearing surface, the bearing surface includes a chip mounting portion and a border portion located outside the chip mounting portion. The photosensitive chip is disposed on the chip mounting portion, and the electronic components are disposed on the border portion.

[0137] Step S2: Place the support plate on the side of the photosensitive chip and the electronic components away from the bearing surface. The light passing hole is aligned with the photosensitive chip, and the edge of the support plate is spaced from the border portion to form a first notch located in the circumferential direction and adjacent to the electronic components.

[0138] Step S3: Close the first gap and form a sealant located between the support plate and the circuit board, with the sealant connecting the support plate and the circuit board.

[0139] In some embodiments, in step S2, the first protrusion provided on the surface of the support plate close to the circuit board is fixed to the blank area of the circuit board.

[0140] In some embodiments, in step S3, a flowable and viscous material flows into the space between the support plate and the circuit board through the first gap and then solidifies to obtain the sealant.

[0141] In some embodiments, before performing step S2, a step of setting a protective member is further included.

[0142] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0143] The above-described embodiments merely represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims.

Claims

1. A bracket for connecting a circuit board of a camera module to a lens assembly. The circuit board includes a bearing surface, which includes a chip mounting portion and a frame portion located outside the chip mounting portion. The frame portion includes a component mounting area and a blank area. The chip mounting portion is used for mounting a photosensitive chip of the camera module, and the component mounting area is used for mounting electronic components of the camera module. It is characterized in that the bracket includes a support plate and a first protrusion. The support plate includes an opposite first surface and a second surface. The first protrusion is provided on the first surface. One end of the first protrusion away from the support plate is connected to the blank area. The height of the first protrusion is greater than the height of the electronic component, so that the support plate is suspended above the electronic component and forms a first notch in the circumferential direction. The first notch is arranged adjacent to the electronic component to avoid the electronic component; the support plate is provided with a light through hole penetrating the first surface and the second surface. The light through hole is arranged opposite to the photosensitive chip, and the second surface is used for connecting the lens assembly; the number of the first protrusions is multiple, and the multiple first protrusions are arranged at intervals; or, the number of the first protrusions is one, and the first protrusion is strip-shaped and extends from one side surface of the support plate to the opposite side surface of the bracket; the bracket further includes an anti-overflow glue member, which is arranged on the first surface. The anti-overflow glue member is used to prevent a flowing and sticky material from flowing into and closing the first notch through the first notch, and the material flows to the photosensitive part of the photosensitive chip; the anti-overflow glue member is closer to the photosensitive chip than the first protrusion; the support plate is provided with an air escape hole penetrating the opposite two surfaces of the support plate. An air escape groove is provided on the surface of the support plate close to the circuit board. Two ends of the air escape groove are respectively communicated with the air escape hole and the light through hole; one end of the anti-overflow glue member is adjacent to one side of the air escape groove, and the other end extends around the light through hole to the other side of the air escape groove and is adjacent to the other side of the air escape groove.

2. The bracket according to claim 1, characterized in that, The height of the first protrusion is 200-500 microns.

3. The bracket according to claim 1, characterized in that, The bracket is a bracket with a missing part of the side wall. There is a first protrusion whose outer side surface is flush with the outer side surface of the support plate. The first protrusion whose outer side surface is flush with the outer side surface of the support plate is the side wall of the bracket; or, the bracket is a bracket without a side wall, and all the first protrusions are located inside the outer side surface of the support plate.

4. The bracket according to claim 1, wherein There is a first protrusion located between the electronic component and the photosensitive chip; and / or There is a first protrusion located at the corner of the support plate.

5. The stent according to any one of claims 1-4, characterized in that, The bracket further includes a second protrusion, which is arranged on the first surface. The outer side surface of the second protrusion is flush with the outer side surface of the support plate. The height of the second protrusion is less than the height of the first protrusion, so as to form a second notch in the circumferential direction. The second notch is far away from the electronic component.

6. The bracket according to claim 5, wherein The height of the second notch is greater than or equal to 100 microns so that a flowing and viscous material can flow through the second notch and seal the second notch.

7. An imaging module, characterized in that, Comprising: A circuit board including a bearing surface, the bearing surface including a chip mounting portion and a frame portion located on the outer periphery of the chip mounting portion; A photosensitive chip disposed on the chip mounting portion; Electronic components disposed on the frame portion; The bracket according to any one of claims 1-6, wherein an installation groove surrounding the light passing hole is formed on the surface of the support plate away from the circuit board, or an installation groove surrounding the light passing hole is formed on the surface of the support plate close to the circuit board; A closing member disposed in the first notch to close the first notch, or disposed in the first notch and the second notch to close the first notch and the second notch; A filter disposed in the installation groove; And A lens assembly disposed on the surface of the support plate away from the circuit board, the lens assembly being a fixed-focus lens assembly or a zoom lens assembly.

8. A mobile terminal, characterized in that, Including the camera module according to claim 7.

Images