Semiconductor package molding apparatus

Abstract

A semiconductor package molding apparatus is provided. The semiconductor package molding apparatus includes a chamber lower part including a lower mold configured to accommodate a molding target, a chamber upper part configured to be coupled with the chamber lower part to isolate an inside of the chamber from an outside of the chamber, the chamber upper part including an upper mold configured to form a cavity with the lower mold, a first exhaust hole between the chamber upper part and the chamber lower part, the first exhaust hole configured to exhaust gas from the inside of the cavity after the chamber upper part and the chamber lower part are coupled with each other, a pot formed in the lower mold in the chamber lower part, a plunger configured to push a molding material in the pot, a second exhaust hole formed in a side surface of the pot in the chamber lower part, and a cavity vacuum pump configured to exhaust the gas through the first exhaust hole and the second exhaust hole.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2018-0101936, filed on August 29, 2018, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] This disclosure relates to semiconductor package molding equipment and methods for manufacturing semiconductor devices using the semiconductor package molding equipment. Background Technology

[0004] Molding is a process used to protect semiconductor chips during the manufacture of semiconductor packages. Molding is accomplished by placing the semiconductor package in a mold and injecting molding material into the mold.

[0005] Here, the cavity within the mold is maintained in a vacuum to prevent voids from forming during the molding process. Voids can cause problems such as extrusion protrusions in subsequent processes. Therefore, the venting method for maintaining the cavity vacuum and the sensing method for detecting air leaks are important. Summary of the Invention

[0006] This disclosure provides a semiconductor package molding apparatus for preventing void formation.

[0007] However, the present invention is not limited to the embodiments described herein. The above and other aspects of this disclosure will become more apparent to those skilled in the art from the following detailed description of the disclosure.

[0008] According to one aspect of this disclosure, a semiconductor package molding apparatus is provided. The semiconductor package molding apparatus includes: a lower chamber portion including a lower mold configured to receive a molding target; an upper chamber portion configured to engage with the lower chamber portion to isolate the interior of the chamber from the exterior of the chamber, the upper chamber portion including an upper mold configured to form a cavity with the lower mold; a first vent located between the upper chamber portion and the lower chamber portion, the first vent configured to discharge gas from the interior of the cavity after the upper chamber portion and the lower chamber portion are engaged with each other; a can formed in the lower mold portion in the lower chamber portion; a plunger configured to push molding material in the can; a second vent formed in a side surface of the can portion in the lower chamber portion; and a cavity vacuum pump configured to discharge gas through the first vent and the second vent.

[0009] According to another exemplary embodiment of this disclosure, a semiconductor package molding apparatus is provided. The semiconductor package molding apparatus includes: a lower chamber portion including a lower mold, the lower mold including a first molding recess and a second molding recess configured to receive a first molding target and a second molding target, respectively; an upper chamber portion configured to engage with the lower chamber portion to isolate the interior of the chamber from the exterior of the chamber, the upper chamber portion including an upper mold configured to combine with the lower mold to form a cavity; a first vent located between the upper chamber portion and the lower chamber portion, the first vent configured to discharge air from the interior of the cavity after the upper chamber portion and the lower chamber portion are engaged with each other; a can formed in the lower chamber portion in a plan view between the first molding recess and the second molding recess; a plunger configured to push molding material in the can; a second vent formed in a side surface of the can in the lower chamber portion; a cavity vacuum pump configured to discharge air through the first vent and the second vent; and a sensor configured to detect air leakage in the first vent and the second vent.

[0010] According to another exemplary embodiment of this disclosure, a semiconductor package molding apparatus is provided. The semiconductor package molding apparatus includes: a chamber; a can configured to inject molding material into the chamber; a plunger configured to push the molding material through the can, the plunger being configured to contact the molding material in the can; a rod disposed below the plunger and configured to push the plunger; a spring disposed below the rod and configured to push the rod and the plunger; an internal suction port formed in the plunger and the rod; a plunger suction port formed in a side surface of the plunger in the can and connected to the internal suction port; a rod suction port formed in a side surface of the rod and connected to the internal suction port; and a suction section configured to discharge air from the interior of the can through the internal suction port, the plunger suction port, and the rod suction port. Attached Figure Description

[0011] These and / or other aspects will become apparent and more readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, in which:

[0012] Figure 1 This is a conceptual diagram of a semiconductor package molding apparatus according to some embodiments;

[0013] Figure 2 It is shown Figure 1 A conceptual diagram of the separated state of the chambers;

[0014] Figure 3 It is shown Figure 1 A conceptual diagram of the transition of a chamber from a separated state to a coupled state;

[0015] Figure 4 yes Figure 1 A conceptual diagram of the first modeling target;

[0016] Figure 5 yes Figure 1 A perspective view of the lower mold and plunger unit of a semiconductor packaging molding equipment;

[0017] Figure 6 It is along Figure 5 A sectional view taken by line A-A' in the middle;

[0018] Figure 7 It is shown in detail Figure 6 A cross-sectional view of the tank and plunger;

[0019] Figure 8 It is shown in detail Figure 7 A cross-sectional view of the shape of the first additional vent.

[0020] Figure 9 It is used for explanation Figure 1 A diagram showing the chamber coupling and venting operation of a semiconductor packaging molding equipment;

[0021] Figure 10 This is a cross-sectional view of a semiconductor package molding apparatus according to some embodiments;

[0022] Figure 11 This is a cross-sectional view of a semiconductor package molding apparatus according to some embodiments;

[0023] Figure 12 This is a cross-sectional view of a semiconductor package molding apparatus according to some embodiments;

[0024] Figure 13 This is a cross-sectional view of a semiconductor package molding apparatus according to some embodiments;

[0025] Figure 14 This is a cross-sectional view of a semiconductor package molding apparatus according to some embodiments; and

[0026] Figure 15 yes Figure 14 An enlarged sectional view of part B. Detailed Implementation

[0027] In the following text, reference will be made to Figures 1 to 9 This describes a semiconductor package molding apparatus according to some embodiments.

[0028] Figure 1 This is a conceptual diagram of a semiconductor package molding apparatus according to some embodiments.

[0029] Reference Figure 1The first direction X and the second direction Y can be directions that intersect each other in the horizontal direction. For example, the first direction X and the second direction Y can be directions that intersect each other perpendicularly. The third direction Z can be a direction that intersects both the first direction X and the second direction Y. For example, the third direction Z can be a direction that is vertically orthogonal to the first direction X and the second direction Y. Therefore, the first direction X, the second direction Y, and the third direction Z can be orthogonal to each other.

[0030] The semiconductor package molding apparatus according to an embodiment includes a chamber 100, an upper mold 210, a lower mold 220, a cavity 280, a pot 240, a plunger 250, a sealing member 290, an exhaust port 310, a first additional exhaust port 320, a cavity vacuum pump 330, a molding groove vacuum pump 340, and a sensor 350.

[0031] The chamber 100 may include a housing that forms the exterior of the semiconductor package molding apparatus of this disclosure. For example, the chamber 100 may include other components, such as an upper mold 210 and a lower mold 220. The housing can isolate the interior of the chamber 100 from the exterior of the chamber 100 and maintain the interior of the chamber 100 under a vacuum (distinct from the exterior of the chamber 100) when molding processes are performed within the chamber 100.

[0032] The chamber 100 may include an upper chamber portion 110 and a lower chamber portion 120. The upper chamber portion 110 may include an upper mold 210, and the lower chamber portion 120 may include a lower mold 220. The upper chamber portion 110 may be fixed, and the lower chamber portion 120 may be coupled to or separated from the upper chamber portion 110 when the lower chamber portion 120 moves upward or downward. However, the invention is not limited thereto. For example, in some embodiments, the lower chamber portion 120 may also be fixed while the upper chamber portion 110 moves vertically, or both the upper chamber portion 110 and the lower chamber portion 120 may also move vertically.

[0033] The first molding target 61 and the second molding target 62 can be placed on the lower mold 220. When the lower cavity 120 is coupled to the upper cavity 110 with the first molding target 61 and the second molding target 62 placed on the lower mold 220, a cavity 280 can be formed between the lower mold 220 and the upper mold 210. Here, the first molding target 61 and the second molding target 62 can be semiconductor packages. This will be described in more detail later.

[0034] In some embodiments, the lower mold 220 may include a first molding groove 231, a second molding groove 232, and a fixing hole 270.

[0035] The first molding groove 231 may be the portion for placing the first molding target 61. The second molding groove 232 may be the portion for placing the second molding target 62. The first molding groove 231 and the second molding groove 232 may be spaced apart from each other in the first direction X.

[0036] Fixing holes 270 can be formed below the first molding groove 231 and the second molding groove 232, respectively. Fixing holes 270 can penetrate the lower mold 220. Fixing holes 270 can be used to fix the first molding target 61 and the second molding target 62 through the molding groove vacuum pump 340.

[0037] Cavity 280 can be the space between upper mold 210 and lower mold 220. For example, cavity 280 can be formed by a combination of upper mold 210 and lower mold 220. Cavity 280 can be the space in which molding material 50 moves to be placed on first molding target 61 and second molding target 62. As molding material 50 becomes fluid with increasing temperature, it completely fills cavity 280 formed by upper mold 210 and lower mold 220 and solidifies into a molded film of each of first molding target 61 and second molding target 62.

[0038] For example, in a plan view, a can 240 may be formed in a first direction X between a first molding groove 231 and a second molding groove 232. The can 240 may be a hole extending in a third direction Z. A plunger 250 may be located inside the can 240 and may move vertically within the can 240. The plunger 250 may contact the molding material 50 in the can 240. As the plunger 250 moves vertically, the molding material 50 previously placed on the plunger 250 inside the can 240 may be fed into the cavity 280 to mold the first molding target 61 and the second molding target 62. It is understood that when an element is referred to as being "connected" or "coupled" to another element or "on" another element, it may be directly connected or coupled to another element or on another element, or there may be intermediate elements. Conversely, when an element is referred to as being "directly connected" or "directly coupled" to another element, or "in contact" with another element or "in contact" with another element, there are no intermediate elements. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., "between" and "directly between", "adjacent" and "directly adjacent", etc.). As used herein, the term "contact" means direct connection (i.e., touch) unless the context otherwise requires.

[0039] The molding material 50 may include, but is not limited to, epoxy molding compound (EMC). The molding material 50 may be in solid form inside the can 240 and may liquefy to become fluid as the temperature rises. When the molding material 50 is fluid, it is placed on the first molding target 61 and the second molding target 62 through the plunger 250 and then cured to mold the first molding target 61 and the second molding target 62.

[0040] The plunger 250 can move up and down within the can 240. As the plunger 250 moves upward, it pushes the molding material 50 into the cavity 280. The plunger 250 has nearly the same dimensions as the inner wall of the can 240, but a gap may exist between the outer surface of the plunger 250 and the inner wall of the can 240.

[0041] Because air within cavity 280 can leak through gaps, plunger 250 may include a first ring 260. The first ring 260 and other rings described herein may be formed of a natural or synthetic non-porous material, such as a Teflon ring. The first ring 260 may form an airtight barrier between the outer surface of plunger 250 and the inner wall of canister 240 to prevent air leakage. In some embodiments, the first ring 260 may block the space between the outer surface of plunger 250 and the inner wall of canister 240 to prevent air leakage within cavity 280, for example, through canister 240. The term "air" as used herein may refer to a gas used in the semiconductor package molding process described throughout the disclosure and may or may not include the atmosphere. For example, the gas may include nitrogen.

[0042] Similar to the first ring 260, the second ring 265 can also form an airtight barrier between the outer surface of the plunger 250 and the inner wall of the can 240 to prevent air leakage within the cavity 280. In some embodiments, the second ring 265 can also block the space between the outer surface of the plunger 250 and the inner wall of the can 240 to prevent air leakage within the cavity 280, for example, through the gap between the outer surface of the plunger 250 and the inner wall of the can 240. The second ring 265 will be described in more detail later.

[0043] The sealing member 290 may be located between the upper chamber 110 and the lower chamber 120. The sealing member 290 may be disposed at the junction of the upper chamber 110 and the lower chamber 120. For example, the upper chamber 110 and the lower chamber 120 may be physically connected to each other via the sealing member 290. The sealing member 290 may seal the junction of the lower chamber 120 and the upper chamber 110, except for the vent 310. For example, the vent 310 may be located at the interface / boundary of the upper chamber 110 and the lower chamber 120.

[0044] The volume of the sealing member 290 can vary (decrease / expand) according to the applied force. This allows the sealing member 290 to effectively perform sealing and venting. For example, the sealing member 290 can be formed of an elastic / flexible material, such as rubber or polytetrafluoroethylene (PTFE) (e.g., Teflon).

[0045] The vent 310 may be formed adjacent to the sealing member 290. In some embodiments, the vent 310 may penetrate the sealing member 290. The vent 310 may be provided between the upper chamber 110 and the lower chamber 120 at a position where they meet. Air can be removed from the cavity 280 through the vent 310.

[0046] For example, the vent 310 can be connected to the cavity vacuum pump 330 to expel air from the inside of the cavity 280 to the outside.

[0047] A first additional vent 320 may be formed in the outer wall of the canister 240. Similar to vent 310, the first additional vent 320 may be connected to a cavity vacuum pump 330. The first additional vent 320 may vent air between the canister 240 and the plunger 250 disposed within the canister 240 to the outside.

[0048] The first additional vent 320 can be disposed in the outer wall of the can 240 at a position between the first ring 260 and the second ring 265 of the plunger 250. As the plunger 250 moves up and down within the can 240, the portion of the plunger 250 between the first ring 260 and the second ring 265 can also move up and down. Even as the plunger 250 moves up and down, the first additional vent 320 can still be located between the first ring 260 and the second ring 265. For example, while the plunger 250 moves up and down within the can 240, the first additional vent 320 can be located at a lowest position below the first ring 260 and at a highest position above the second ring 265. For example, the first ring 260 can be configured to move up and down within a first region of the can, and the additional vent 320 can be located below the first region.

[0049] The chamber vacuum pump 330 can be connected to the exhaust port 310 and the first additional exhaust port 320 to exhaust air to the outside. For example, air confined within the chamber 280 can be exhausted to the outside through the exhaust port 310, and air confined within the tank 240 can be exhausted to the outside through the first additional exhaust port 320.

[0050] The molding groove vacuum pump 340 can be connected to the fixing hole 270 to fix the first molding target 61 and the second molding target 62, which are respectively placed in the first molding groove 231 and the second molding groove 232. For example, the first molding target 61 and the second molding target 62 can be attached to the bottom surface of the first molding groove 231 and the second molding groove 232 by suction and adsorption through the fixing hole 270 formed below the first molding groove 231 and the second molding groove 232, respectively.

[0051] Sensor 350 can be connected to vent 310 and first auxiliary vent 320. Sensor 350 can sense the pressure in the first auxiliary vent 320 to detect air leakage in canister 240. First ring 260 can seal the space between canister 240 and plunger 250 to maintain vacuum in cavity 280.

[0052] However, when the plunger 250 moves up and down repeatedly, the first ring 260 may wear, allowing air to flow into the cavity 280 through the gap between the plunger 250 and the canister 240 (e.g., between the first ring 260 and the sidewall of the canister 240).

[0053] Therefore, the second ring 265 can seal the canister 240 to prevent wear of the first ring 260, and the sensor 350 can detect air inflow caused by wear of the first ring 260. When the sensor 350 detects air inflow, the first ring 260 can be replaced, thereby improving the reliability of the molding process.

[0054] Figure 2 It is shown Figure 1 A conceptual diagram of the separated state of chamber 100. Figure 3 It is shown Figure 1 A conceptual diagram of the transition of chamber 100 from a separated state to a coupled state.

[0055] Reference Figure 2 and Figure 3 The upper chamber 110 and the lower chamber 120 can be coupled to each other in a separated state. For example, the upper chamber 110 and the lower chamber 120 can be combined to form a cavity 280 between them. The volume of the sealing member 290 can be larger when the upper chamber 110 and the lower chamber 120 are separated compared to when they are coupled together. For example, the sealing member 290 can contract when the upper chamber 110 and the lower chamber 120 are combined, and expand when they are separated. Here, the molding material 50 can be solidly located on the plunger 250 within the can 240.

[0056] For example, when the interior of chamber 100 is not isolated from the exterior of chamber 100, venting (e.g., the process of creating a vacuum in chamber 100) may not be performed. For example, venting may be performed after chamber 280 is isolated from the exterior of chamber 100.

[0057] When the lower chamber 120, together with the lower mold 220, moves upward in the third direction Z by a first distance d1 to engage with the upper chamber 110, the volume of the sealing member 290 can be reduced. For example, the first distance d1 can be the distance between the bottom of the lower chamber 120 and the top of the spring 420, as will be discussed below. Figure 6 Spring 420 is described. At this time, except for the vent 310 and the first additional vent 320, the interior of the chamber 100 can be isolated from the exterior of the chamber 100.

[0058] Figure 4 yes Figure 1 A conceptual diagram of the first molded target 61. The second molded target 62 may have the same or similar shape as the first molded target 61, but for convenience, the description of the second molded target 62 will be omitted.

[0059] Reference Figure 4 The first molding target 61 may include a substrate 10, solder balls 11, a chip 12, microbumps 13 and a molding film 14.

[0060] The substrate 10 may be a printed circuit board (PCB). Although not shown, wiring structures for electrically connecting the upper and lower surfaces of the substrate 10 may be provided in the substrate 10. For example, the wiring structures for electrically connecting the upper and lower surfaces of the substrate 10 may be through-holes, and the through-holes may electrically connect electronic devices or circuits formed on the upper surface of the substrate 10 to electronic devices or circuits formed on the lower surface of the substrate 10.

[0061] Solder ball 11 may be located on the lower surface of substrate 10. Solder ball 11 may be in the form of a conductive ball and is used for electrical connection of semiconductor package and other structures (e.g., circuits or devices).

[0062] Chip 12 can be stacked on substrate 10. Chip 12 can be, but is not limited to, an application processor (AP) chip or a memory chip. For example, an AP chip can be a mobile application processor used in a cellular phone. For example, an AP chip can be a microprocessor used in a mobile phone.

[0063] The microbump 13 can electrically connect the chip 12 and the substrate 10. The microbump 13 can be a structure of multiple conductor bumps.

[0064] The molding film 14 can be formed on the upper surface of the substrate 10, the side surface of the chip 12, and the lower surface of the chip 12. The molding film 14 can be formed using a semiconductor package molding apparatus according to an embodiment.

[0065] When the gap between the microbumps 13 of the molded film 14 that is to form a semiconductor package decreases, the likelihood of voids forming may increase if the vacuum in the cavity 280 is not properly maintained.

[0066] The gaps formed between the bump balls (e.g., microbumps 13) can cause bump extrusion, where the bump balls connect to each other along the surface of the gap as they melt during a thermal process (such as reflow soldering). In this case, the bump balls, which are intended to be insulated from each other, may short-circuit, thus significantly reducing the reliability of the semiconductor package.

[0067] Therefore, in order to prevent this problem, the semiconductor package molding apparatus according to the embodiment may include a first additional vent 320 to address the vacuum in the wear retaining can 240 of the first ring 260, and the air inflow may be detected by a sensor 350.

[0068] Therefore, according to the current embodiment, the reliability of semiconductor package molding equipment can be improved.

[0069] Figure 4 The structure of the first molding target 61 is an example, and the invention is not limited to this example. For example, the molding target of the semiconductor package molding apparatus according to the embodiment can have various structures and can be molded, such as package-on-package (POP) structures and POP structures with inserted inserts (i-POP).

[0070] Figure 5 yes Figure 1 A perspective view of the lower mold 220 and plunger unit 400 of a semiconductor package molding apparatus. Figure 5 For convenience, the lower part 120 of the chamber is not shown.

[0071] Reference Figure 5 The semiconductor package molding apparatus according to the embodiment also includes a plunger unit 400.

[0072] The plunger unit 400 may include a plurality of plungers 250. The plunger unit 400 may be disposed below the lower mold 220 to drive the plungers 250 upward and downward.

[0073] The lower mold 220 may include a plurality of cans 240. The cans 240 may be spaced apart from each other and aligned in the second direction Y. Each of the first molding groove 231 and the second molding groove 232 may extend in the lower mold 220 along the second direction Y. Here, extending along the second direction Y can mean that the direction in which the long side is formed between the long and short sides is the second direction Y. For example, each of the first molding groove 231 and the second molding groove 232 may include a plurality of sub-grooves, such as... Figure 5 As shown. For example, each of the sub-grooves can extend along the first direction X, such as... Figure 5 As shown.

[0074] The first molding groove 231 and the second molding groove 232 may be spaced apart from each other in the first direction X. The can 240 may be located between the first molding groove 231 and the second molding groove 232. The plungers 250 may be respectively disposed in the can 240. When the plungers 250 move in the third direction Z, the molding material 50 disposed in the can 240 may move to both sides, that is, toward the first molding groove 231 and the second molding groove 232, thereby performing molding.

[0075] The plunger unit 400 located below the lower mold 220 allows the plunger 250 to move in the third direction Z.

[0076] Figure 6 It is along Figure 5 The sectional view taken by line A-A' in the middle.

[0077] Reference Figure 6 The plunger unit 400 may include a plunger 250, a rod 410, and a spring 420.

[0078] As described above, the plunger 250 may be a portion of the molded material 50 within the can 240 for pushing in a third direction Z.

[0079] A rod 410 may be disposed below and coupled to the plunger 250. The rod 410 may extend / move in a third direction Z to cause movement of the plunger 250 in the third direction Z. For example, a spring 420 may expand and contract to cause the rod 410 to move up and down in the third direction Z.

[0080] Spring 420 can be positioned below rod 410 and push rod 410 upward in the third direction Z. Therefore, rod 410 can move in the third direction Z, and plunger 250 can also move in the third direction Z while rod 410 moves upward, thereby enabling... Figure 1 The molding material 50 moves to Figure 1 The cavity is 280.

[0081] Similar to plunger 250, multiple rods 410 and springs 420 can be provided. Multiple rods 410 and multiple springs 420 can be spaced apart from each other and aligned in the second direction Y.

[0082] exist Figure 5 and Figure 6 In this configuration, the number of cans 240, plungers 250, rods 410, and springs 420 is eight. However, the invention is not limited to this configuration. For example, a semiconductor package molding apparatus according to certain embodiments may include seven or fewer cans 240, plungers 250, rods 410, and springs 420, or may include nine or more cans 240, plungers 250, rods 410, and springs 420.

[0083] Figure 7 It is shown in detail Figure 6 Cross-sectional view of tank 240 and plunger 250.

[0084] Reference Figure 7 The semiconductor package molding apparatus according to the embodiment may further include a can seal 241.

[0085] The can 240 may include a first annular groove 261 in its inner wall. The first annular groove 261 may be a portion forming a first ring 260. For example, the first ring 260 may be disposed in the first annular groove 261 to seal the space between the inner wall of the can 240 and the plunger 250.

[0086] The can seal 241 can be coupled to the lower part of the can 240 and guides the rod 410 and the plunger 250 to be properly inserted into the can 240. The can seal 241 can be formed of, but is not limited to, Teflon material.

[0087] The rod 410 may include a second annular groove 266 on its outer surface. A second ring 265 may be formed in the second annular groove 266. For example, the second ring 265 may be disposed in the second annular groove 266 to seal the space between the inner wall of the can seal 241 and the rod 410.

[0088] The second ring 265 may be an O-ring. The second ring 265 may include, but is not limited to, at least one of polyetheretherketone (PEEK), silicone, and urethane.

[0089] Multiple second rings 265 may be provided. However, the invention is not limited to this. For example, in some embodiments, only one second ring 265 may be provided.

[0090] Because the second rings 265 are formed in the tank seal 241, they are heat-resistant and contamination-resistant.

[0091] A first additional vent 320 may be formed in the outer wall of the tank 240. The first additional vent 320 may be located in the third direction Z between the first ring 260 and the second ring 265. For example, air may be drawn into the first additional vent 320 to prevent air from flowing in when the first ring 260 wears.

[0092] Figure 8 It is shown in detail Figure 7 A cross-sectional view of the shape of the first additional vent 320.

[0093] Reference Figure 8 The first additional vent 320 in the tank 240 may be quadrilateral, for example, in a side view. The first additional vent 320 may have a shape formed by removing a portion of the outer wall of the tank 240. Air can be discharged via the first additional vent 320 by a chamber vacuum pump 330.

[0094] Figure 9 It is used for explanation Figure 1 A diagram illustrating the chamber coupling and venting operation of a semiconductor packaging molding apparatus.

[0095] Reference Figure 2 , Figure 3 and Figure 9 In the chamber 100 of the semiconductor package molding apparatus according to the embodiment (e.g.), the upper chamber 110 and the lower chamber 120 can be combined / coupled in multiple stages (e.g., through multiple steps). Figure 9 The horizontal axis represents time, and the vertical axis represents... Figure 3 The first distance d1.

[0096] Until the first time t1, the first distance d1 can reach the first reference distance K1 at a constant speed. At the first time t1, the upper part 110 and the lower part 120 of the chamber 100 can be engaged with each other. Here, the entire chamber 100 except for the exhaust port 310 can be sealed by the sealing member 290.

[0097] From the first time t1 to the second time t2, the first distance d1 may not increase, and the force connecting the upper part 110 and the lower part 120 of the chamber may remain constant at the first force. At this time, the chamber vacuum pump 330 can draw / expel air from the inside of the chamber 280 through the exhaust port 310 and the first additional exhaust port 320.

[0098] The first distance d1 can be constantly increased to the second reference distance K2 from the second time t2 to the third time t3. At this time, although the lower part 120 and the upper part 110 of the chamber are in contact, the first distance d1 can increase as the volume of the sealing member 290 decreases.

[0099] From the third time t3 to the fourth time t4, the first distance d1 may not increase, and the force connecting the upper part 110 and the lower part 120 of the chamber may remain constant as a second force greater than the first force. At this time, the chamber vacuum pump 330 may also draw / expel air from the interior of the chamber 280 through the exhaust port 310 and the first additional exhaust port 320.

[0100] Since the volume of the sealing member 290 from the first time t1 to the second time t2 is greater than the volume of the sealing member 290 from the third time t3 to the fourth time t4, the size of the vent 310 from the first time t1 to the second time t2 can also be greater than the size of the vent 310 from the third time t3 to the fourth time t4.

[0101] For example, venting from vent 310 from the first time t1 to the second time t2 can be easier than venting from vent 310 from the third time t3 to the fourth time t4. Therefore, sensor 350 can detect air leakage and inflow between the first time t1 and the second time t2. Air leakage and inflow detection by sensor 350 from the third time t3 to the fourth time t4 can be relatively inefficient compared to the period from the first time t1 to the second time t2. The vacuum rate in cavity 280 between the first time t1 and the second time t2 can be faster than the vacuum rate in cavity 280 between the third time t3 and the fourth time t4, and / or the pressure of cavity vacuum pump 330 between the first time t1 and the second time t2 can be lower than the pressure of cavity vacuum pump 330 between the third time t3 and the fourth time t4. For example, the amount of air removed from cavity 280 between the first time t1 and the second time t2 can be greater than the amount of air removed from cavity 280 between the third time t3 and the fourth time t4.

[0102] Even when the first ring 260 is worn, the semiconductor package molding apparatus according to the present embodiment can use the second ring 265 to block air from flowing into the canister 240, and can maintain the vacuum in the cavity 280 by discharging the air between the first ring 260 and the second ring 265 through the first additional vent 320.

[0103] Therefore, this prevents voids from forming in the molded film 14, thereby greatly improving the reliability of the entire semiconductor package. For example, by removing air from the cavity 280 and the canister 240, thus maintaining a vacuum in the cavity 280, void defects in the molded film 14 can be avoided or improved.

[0104] Now refer to Figure 10 This describes a semiconductor package molding apparatus according to some embodiments. Descriptions of elements and features identical to those in the above embodiments will be given briefly or omitted.

[0105] Figure 10This is a cross-sectional view of a semiconductor package molding apparatus according to some embodiments.

[0106] Reference Figure 10 The semiconductor package molding apparatus according to the embodiment includes a can second ring 245 and a can second ring groove 246.

[0107] A second annular groove 246 may be formed in the inner wall of the can 240. Multiple second annular grooves 246 may be provided. However, the invention is not limited to this, and in some embodiments, only one second annular groove 246 may be provided. Although Figure 10 The illustration shows two second annular grooves 246 on the can, but the invention is not limited to this. For example, the number of second annular grooves 246 on the can may also be three or more.

[0108] The second ring 245 of the can may be located in the groove 246 of the second ring of the can. Since the second ring 245 of the can is located in the inner wall of the can 240 rather than in the can seal 241, it can more tightly prevent the air flow associated with the first ring 260 from entering the can 240.

[0109] Because the can 240 is made of a more rigid material than the material of the can seal 241, the sealing between the can second ring 245 and the plunger 250 can be increased.

[0110] For example, the semiconductor package molding apparatus according to the current embodiment can better perform vacuum processing, thereby improving the reliability of the semiconductor package itself.

[0111] Now refer to Figure 11 This describes a semiconductor package molding apparatus according to some embodiments. Descriptions of elements and features identical to those in the above embodiments will be given briefly or omitted.

[0112] Figure 11 This is a cross-sectional view of a semiconductor package molding apparatus according to some embodiments.

[0113] Reference Figure 11 The semiconductor package molding apparatus according to the embodiment includes a second additional vent 321.

[0114] The second additional vent 321 may include the (2-1) additional vent 321a and the (2-2) additional vent 321b. The (2-1) additional vent 321a may be formed above the (2-2) additional vent 321b.

[0115] The shapes and sizes of the additional vent 321a (2-1) and the additional vent 321b (2-2) may be the same or different from each other. For example... Figure 11As shown, the (2-1) additional vent 321a and the (2-2) additional vent 321b can have different shapes. The (2-1) additional vent 321a and the (2-2) additional vent 321b can also have the same shape.

[0116] Because the semiconductor package molding apparatus according to the current embodiment includes multiple additional vents, it can more effectively prevent air from flowing into the can 240. Therefore, the reliability of the semiconductor package (i.e., the molding target) to which the molding process is performed can be improved.

[0117] Now refer to Figure 12 This describes a semiconductor package molding apparatus according to some embodiments. Descriptions of elements and features identical to those in the above embodiments will be given briefly or omitted.

[0118] Figure 12 This is a cross-sectional view of a semiconductor package molding apparatus according to some embodiments.

[0119] Reference Figure 12 The semiconductor package molding apparatus according to the embodiment includes a third additional vent 322.

[0120] The third additional vent 322 can be circular. Since the can 240 is the space where the plunger 250 moves up and down repeatedly, the durability of the can 240 can be important. If the shape of the additional vent is a polygon such as a quadrilateral, cracks may form at the vertices.

[0121] For example, in the case of a quadrilateral, cracks can form at one or more of the four vertices. Once formed, these cracks can gradually grow, leading to a significant reduction in the durability of can 240. Therefore, the durability of the entire semiconductor package molding apparatus can be significantly reduced by cracks, for example, those formed on can 240.

[0122] Therefore, the semiconductor package molding apparatus of the present embodiment may include a third additional vent 322 formed in a circular shape to easily maintain the vacuum inside the can 240 while preventing damage to the can 240 as much as possible.

[0123] Now refer to Figure 13 This describes a semiconductor package molding apparatus according to some embodiments. Descriptions of elements and features identical to those in the above embodiments will be given briefly or omitted.

[0124] Figure 13 This is a cross-sectional view of a semiconductor package molding apparatus according to some embodiments.

[0125] Reference Figure 13The semiconductor package molding apparatus according to the embodiment includes a fourth additional vent 323.

[0126] The fourth additional vent 323 may include the (4-1) additional vent 323a and the (4-2) additional vent 323b. The (4-1) additional vent 323a may be formed above the (4-2) additional vent 323b.

[0127] The dimensions and shapes of the (4-1) additional vent 323a and (4-2) additional vent 323b may be the same or different from each other. For example, although the (4-1) additional vent 323a and (4-2) additional vent 323b are similar... Figure 13 The figures shown have the same shape, but they can also have different shapes.

[0128] Both the (4-1) additional vent 323a and the (4-2) additional vent 323b can be circular. Circular additional vents are relatively less prone to breakage than polygonal additional vents. For example, by using circular additional vents, it is easy to maintain a vacuum within the tank 240 while minimizing damage to the tank 240.

[0129] Because the semiconductor package molding apparatus according to the current embodiment includes multiple circular additional vents, it can more effectively prevent air from flowing into the can 240 while maintaining the durability of the can 240. Therefore, the reliability of the semiconductor package (i.e., the molding target) to which the molding process is performed can be improved.

[0130] Now refer to Figure 14 and Figure 15 This describes a semiconductor package molding apparatus according to some embodiments. Descriptions of elements and features identical to those in the above embodiments will be given briefly or omitted.

[0131] Figure 14 This is a cross-sectional view of a semiconductor package molding apparatus according to some embodiments. Figure 15 yes Figure 14 An enlarged sectional view of part B.

[0132] Reference Figure 14 and Figure 15 The semiconductor package molding apparatus according to the embodiment includes a first blocking ring 261a, a second blocking ring 261b, a third blocking ring 261c, a suction hole 500, and a suction section 430.

[0133] The first blocking ring 261a can block the space between the outer surface of the plunger 250 and the inner wall of the can 240 to prevent air in the cavity 280 from leaking towards the can 240 and down to the first blocking ring 261a.

[0134] The second blocking ring 261b can be located below the first blocking ring 261a. The second blocking ring 261b can also block the space between the outer surface of the plunger 250 and the inner wall of the can 240 to prevent air in the cavity 280 from leaking below the second blocking ring 261b.

[0135] The third blocking ring 261c may be located below the first blocking ring 261a and the second blocking ring 261b. The third blocking ring 261c may be located between the rod 410 and the outer wall 401 of the plunger unit 400. The third blocking ring 261c can block the space between the rod 410 and the outer wall 401 of the plunger unit 400 to prevent air from being introduced into the plunger unit 400.

[0136] Air can be discharged from the inside of the canister 240 through the suction port 500 via the suction section 430. The suction port 500 may include a plunger suction port 510, an internal suction port 520, and a rod suction port 530.

[0137] The plunger suction port 510 can be used to expel air from the interior of the canister 240 into the plunger 250. Although the plunger suction port 510 extends in the second direction Y in the figure, it may extend in the first direction X or other horizontal directions.

[0138] The plunger intake port 510 can be located between the first blocking ring 261a and the second blocking ring 261b. Therefore, even when the first blocking ring 261a is worn, the inflow of air can be properly blocked.

[0139] An internal suction port 520 may extend from the plunger suction port 510. The internal suction port 520 may extend in a third direction (Z) within the plunger 250 and the rod 410. The internal suction port 520 may discharge air that has entered / drawn in through the plunger suction port 510 toward the rod suction port 530.

[0140] The rod suction port 530 can exhaust air from the interior of the internal suction port 520 through the suction section 430. Although the rod suction port 530 extends in the second direction Y in the figure, it may extend in the first direction X or other horizontal directions.

[0141] The suction section 430 can pass through the outer wall 401 of the plunger unit 400 and draw in / expel air through the suction port 500. Through this process, air disposed inside the tank 240 can be appropriately removed.

[0142] For example, air contained in the tank 240 can be discharged along the first path P1 through the suction port 500 and the suction section 430.

[0143] In the plurality of plungers 250 and the plurality of rods 410, the plunger intake port 510 and the internal intake port 520 may be formed as separate ports. However, the rod intake ports 530 may all be connected and extend into the intake section 430.

[0144] Therefore, multiple air intake holes 500 can effectively exhaust air through a single air intake section 430.

[0145] Hereinafter, a method for manufacturing a semiconductor device according to embodiments of the present disclosure will be described.

[0146] First, a substrate can be provided. The substrate can be a semiconductor substrate, such as a silicon wafer or a germanium substrate, but the present invention is not limited to these substrates. Various circuits can be formed on the substrate. Various circuits can be formed through multiple photolithography and other processes. After forming the various circuits, the substrate can be diced into multiple chips. Multiple chips can be provided to the semiconductor package molding apparatus described above according to various embodiments of the present disclosure to form a molding film 14 on each of the multiple chips, as per [the relevant information]. Figure 4 As described above. Before the chip is fed to the semiconductor packaging molding equipment, microbumps 13 can be formed on the surface of each chip, such as... Figure 4 As shown.

[0147] Although the inventive concept has been specifically shown and described with reference to exemplary embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, it is intended that the embodiments of the invention be considered illustrative rather than restrictive in all respects, and that reference be made to the appended claims rather than the foregoing description to indicate the scope of the invention.

Claims

1. A semiconductor package molding apparatus, comprising: The lower part of the chamber includes a lower mold configured to accommodate the molding target; The upper part of the chamber is configured to engage with the lower part of the chamber to isolate the interior of the chamber from the exterior of the chamber, and the upper part of the chamber includes an upper mold configured to form a cavity with the lower mold; A first exhaust port is located between the upper part of the chamber and the lower part of the chamber, and the first exhaust port is configured to discharge gas from the interior of the chamber after the upper part of the chamber and the lower part of the chamber are joined together; A can, which is formed in the lower mold in the lower part of the chamber; A plunger configured to push molded material in the can; A second vent is formed in the side surface of the can in the lower part of the chamber; A cavity vacuum pump, configured to discharge gas through the first exhaust port and the second exhaust port; and A sealing member is located between the upper and lower portions of the chamber and is configured to block the space between the upper and lower portions of the chamber, except for the first vent. Wherein, the first vent hole is formed in the sealing member, and The sealing member is an elastic member, and its volume changes according to the applied force.

2. The semiconductor package molding apparatus according to claim 1 further includes: A groove formed in the side surface of the plunger; as well as The first ring that engages with the groove.

3. The semiconductor package molding apparatus of claim 2, wherein, The first ring is configured to move up and down within a first region of the can, and the second vent is located below the first region.

4. The semiconductor package molding apparatus according to claim 2 further includes a second ring disposed below the second vent hole to seal the interior of the can.

5. The semiconductor package molding apparatus according to claim 4, further comprising: A rod is disposed below and coupled to the plunger, and is configured to move up and down to move the plunger up and down; as well as A can seal, coupled to the lower part of the can and configured to guide the rod and the plunger into the can. The second ring is located between the inner wall of the can seal and the rod.

6. The semiconductor package molding apparatus of claim 4, wherein, The second ring is located between the can and the plunger.

7. The semiconductor package molding apparatus of claim 1, further comprising a sensor configured to detect gas leakage in the first vent and the second vent. wherein The first vent is formed in the interface between the upper part of the chamber and the lower part of the chamber.

8. A semiconductor package molding apparatus, comprising: The lower part of the chamber includes a lower mold, the lower mold including a first molding groove and a second molding groove configured to respectively accommodate a first molding target and a second molding target; The upper part of the chamber is configured to engage with the lower part of the chamber to isolate the interior of the chamber from the exterior of the chamber, and the upper part of the chamber includes an upper mold configured to combine with the lower mold to form a cavity; A first vent is located between the upper part of the chamber and the lower part of the chamber, and the first vent is configured to discharge air from the interior of the chamber after the upper part of the chamber and the lower part of the chamber are joined together; A can, which is formed in the lower part of the chamber in a plan view between the first molded groove and the second molded groove; A plunger configured to push molded material in the can; A second vent is formed in the side surface of the can in the lower part of the chamber; A cavity vacuum pump is configured to discharge the air through the first exhaust port and the second exhaust port; The sensor is configured to detect air leakage in the first exhaust port and the second exhaust port; as well as A sealing member is located between the upper and lower portions of the chamber and is configured to block the space between the upper and lower portions of the chamber, except for the first vent. Wherein, the first vent hole is formed in the sealing member, and The sealing member is an elastic member, and its volume changes according to the applied force.

9. The semiconductor package molding apparatus according to claim 8, wherein, The second vent is circular in the cross-sectional view.

10. The semiconductor package molding apparatus of claim 8, further comprising a third vent hole formed in the side surface of the can in the lower part of the chamber.

11. The semiconductor package molding apparatus according to claim 8, wherein, The lower part of the chamber and the upper part of the chamber are configured to join in multiple steps, wherein the lower part of the chamber and the upper part of the chamber are joined with a first force in a first step, and the lower part of the chamber and the upper part of the chamber are joined with a second force greater than the first force in a second step, wherein the volume of the sealing member in the second step is smaller than the volume of the sealing member in the first step.

12. The semiconductor package molding apparatus according to claim 11, wherein, The semiconductor package molding apparatus is configured such that the amount of air removed by the cavity vacuum pump in the first step is greater than the amount of air removed by the cavity vacuum pump in the second step.

13. The semiconductor package molding apparatus according to claim 11, wherein, The sensor is configured to detect air leaks in the first step.

14. A semiconductor package molding apparatus, comprising: Chamber; The first can is configured to inject molding material into the chamber through the first can; A first plunger is configured to push the molding material through the first can, and the first plunger is configured to contact the molding material in the first can; A first lever is positioned below the first plunger and configured to push the first plunger; A first spring is disposed below the first rod and configured to push the first rod and the first plunger; A first internal air intake port is formed in the first plunger and the first rod; A first plunger suction port is formed in the side surface of the first plunger in the first can and connected to the first internal suction port; A first rod suction hole is formed in the side surface of the first rod and connected to the first internal suction hole; as well as The air intake section is configured to discharge air from the interior of the first canister through the first internal air intake port, the first plunger air intake port, and the first rod air intake port. The chamber includes an upper chamber portion and a lower chamber portion configured to be separated and then joined together. The semiconductor package molding apparatus further includes a sealing member located between the upper chamber portion and the lower chamber portion, and an vent is formed in the sealing member. The sealing member is configured to block the space between the upper part and the lower part of the chamber, except for the exhaust port. The sealing member is an elastic member, and its volume changes according to the applied force.

15. The semiconductor package molding apparatus according to claim 14, further comprising: A second tank spaced apart from the first tank; The second plunger corresponds to the second can; The second rod corresponds to the second plunger; as well as The second spring corresponds to the second rod.

16. The semiconductor package molding apparatus according to claim 15, further comprising: The second plunger suction port corresponds to the second plunger; The second rod suction port corresponds to the second rod; as well as The second internal air intake hole corresponds to the second rod.

17. The semiconductor package molding apparatus according to claim 16, wherein, The first rod suction port and the second rod suction port are connected to each other.

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