Soldering Tape Adjusting Device, Cell String Soldering Equipment and Soldering Tape Adjusting Method

Abstract

The present invention discloses a solder ribbon adjusting device, a cell string soldering equipment and a solder ribbon adjusting method. The solder ribbon adjusting device includes a frame, a solder ribbon feeding mechanism, a detection mechanism and a control unit. Among them, a plurality of solder ribbon feeding mechanisms are provided and arranged side by side on the frame. Each solder ribbon feeding mechanism is configured to be able to press a solder ribbon and feed the pressed solder ribbon in the extending direction of the solder ribbon. The detection mechanism is used to detect the node positions of a group of solder ribbons pressed by the plurality of solder ribbon feeding mechanisms at a detection station. The control unit can receive the node position information of the solder ribbons detected by the detection mechanism, and control each solder ribbon feeding mechanism to feed the solder ribbon according to the node position information so as to adjust the relative positions of the solder ribbons in the length direction. In the technical solution provided by the present invention, the position of the solder ribbon in the length direction can be adjusted, so that the nodes of a group of solder ribbons to be laid are aligned, thereby improving the quality of the cell string soldered by the solder ribbon.

Description

Technical Field

[0001] The present invention belongs to the field of photovoltaic cell production, and particularly relates to a solder ribbon adjusting device, a cell string soldering device, and a solder ribbon adjusting method. Background Art

[0002] The cell string soldering process is an important process in the production of solar panels, in which solder ribbons are used to weld cells into a cell string.

[0003] In the current soldering process, usually one section of the solder ribbon is welded to the back of one of the adjacent cells, and the other section is welded to the front of another cell. To facilitate the soldering operation of the solder ribbon connected to the back of the cell, the solder ribbon section connected to the back of the cell is usually set as a flat solder ribbon. In order to avoid the solder ribbon on the front of the cell affecting the light receiving area of the cell, the solder ribbon section connected to the front of the cell is usually set as a solder ribbon with a triangular or arc-shaped cross-section. That is to say, each solder ribbon connecting cells includes two sections of solder ribbons with different cross-sectional shapes.

[0004] In each group of solder ribbons connecting adjacent cells, as Figure 1 shown, the nodes 101 between the two sections of each solder ribbon 100 usually cannot be aligned on a straight line, which affects the quality of the product. Summary of the Invention

[0005] In view of this, the present invention aims to provide a solder ribbon adjusting device, a cell string soldering device, and a solder ribbon adjusting method to solve the problem that the nodes on each solder ribbon in a group of solder ribbons for soldering a cell string cannot be aligned in the prior art.

[0006] To achieve the above object, the technical solution of the present invention is realized as follows:

[0007] The present invention provides a solder ribbon adjusting device, which includes a frame, a solder ribbon feeding mechanism, a detection mechanism, and a control unit; wherein,

[0008] There are multiple solder ribbon feeding mechanisms arranged side by side on the frame, and each solder ribbon feeding mechanism is configured to be able to press a solder ribbon and feed the pressed solder ribbon in the extending direction of the solder ribbon;

[0009] The detection mechanism is used to detect the node positions of a group of solder ribbons pressed by the multiple solder ribbon feeding mechanisms at a detection station;

[0010] The control unit can receive the node position information of the solder ribbons detected by the detection mechanism, and control each solder ribbon feeding mechanism to feed the solder ribbon according to the node position information to adjust the relative positions of the solder ribbons in the length direction.

[0011] Preferably, each of the solder tape feeding mechanisms includes:

[0012] A carrier, the carrier having a bearing surface for bearing the solder tape;

[0013] A pressing block, the pressing block being disposed above the bearing surface;

[0014] A pressing drive mechanism, the pressing drive mechanism being mounted on the carrier, and the pressing drive mechanism being connected to the pressing block to drive the pressing block to move towards or away from the bearing surface;

[0015] A feeding drive mechanism, the feeding drive mechanism being connected to the carrier to drive the carrier to move back and forth relative to the machine frame along the feeding direction of the solder tape.

[0016] Preferably, the feeding drive mechanism is a feeding cylinder, the fixed end of the feeding cylinder being fixed relative to the machine frame, and the driving end being connected to the carrier.

[0017] Preferably, the feeding drive mechanism includes:

[0018] A motor;

[0019] A runner, the runner being driven by the motor to rotate, and the axial direction of the runner being consistent with the feeding direction of the solder tape, and a spiral groove extending spirally being formed on the circumferential surface of the runner;

[0020] A push rod, one end of the push rod being located in the spiral groove and the other end being connected to the carrier;

[0021] During the rotation of the runner, the push rod moves along the spiral groove so that the push rod pushes the carrier to move back and forth along the feeding direction of the solder tape.

[0022] Preferably, a roller is provided at one end of the push rod located in the spiral groove.

[0023] Preferably, a leaf spring is connected between the carrier and the machine frame so that the carrier can move relative to the machine frame.

[0024] Preferably, a connecting arm is connected between the carrier and the machine frame, and leaf springs are respectively connected between the connecting arm and the carrier and the machine frame.

[0025] Preferably, the feeding drive mechanism includes a motor, a lead screw driven by the motor to rotate, and a nut cooperating with the lead screw;

[0026] The carrier is connected to the nut to drive the carrier to move back and forth along the feeding direction of the solder tape by the nut.

[0027] Preferably, the solder strip adjusting device further includes a cutting mechanism for cutting the solder strip after the feeding mechanism adjusts the positions of the solder strips.

[0028] The cutting mechanism includes an upper cutting knife, a lower cutting knife, an upper driving mechanism for driving the upper cutting knife to move towards the lower cutting knife, and a lower driving mechanism for driving the lower cutting knife to move towards the upper cutting knife. The upper driving mechanism and the lower driving mechanism are installed on the frame.

[0029] According to another aspect of the present invention, there is also provided a cell string welding device, which includes a welding conveying device, a welding device, a cell feeding device, and a solder strip feeding device.

[0030] The cell feeding device provides cells to the welding conveying device.

[0031] The solder strip feeding device provides solder strips to the welding conveying device and stacks the cells and solder strips on the welding conveying device.

[0032] The welding conveying device conveys the stacked cells and solder strips to the welding station.

[0033] The welding device welds the cells and solder strips at the welding station to form a cell string.

[0034] Wherein, the solder strip feeding device includes the solder strip adjusting device as described above. Before the solder strip is placed on the welding conveying device, the solder strip is adjusted by the solder strip adjusting device so that the nodes of a set of solder strips to be laid are arranged in a straight line in the direction perpendicular to the length of the solder strip.

[0035] According to still another aspect of the present invention, there is also provided a solder strip adjusting method, which includes:

[0036] Using n solder strip feeding mechanisms to press n solder strips one by one, where n is a natural number greater than 1;

[0037] Obtaining the position information of the predetermined nodes on each pressed solder strip;

[0038] Determining the solder strips to be fed according to the position information of the predetermined nodes on each solder strip;

[0039] Feeding the solder strips to be fed forward in the length direction of the respective solder strips to be fed according to the position information of the predetermined nodes on the solder strips to be fed.

[0040] Preferably, the determining the solder strips to be fed according to the position information of the predetermined nodes on each solder strip includes:

[0041] Determine the position information of the foremost predetermined node among the n solder tapes as the target position, and determine the solder tapes with the predetermined nodes not at the target position as the solder tapes to be fed;

[0042] The feeding forward of the solder tape to be fed in the length direction of the solder tape according to the position information of the predetermined node on the solder tape to be fed includes:

[0043] For each solder tape to be fed, calculate the distance between the predetermined node on the solder tape to be fed and the target position, and feed the solder tape to be fed forward by this distance in the length direction of the solder tape to be fed.

[0044] In the technical solution provided by the present invention, before laying the solder tape on the conveying device of the cell string soldering equipment, the position of the solder tape in the length direction can be adjusted so that the nodes of a group of solder tapes are aligned in the width direction of the solder tape and arranged in a straight line, thereby improving the quality of the cell string soldered by the solder tape. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The drawings constituting a part of the present invention are used to provide a further understanding of the present invention. The schematic embodiments and descriptions thereof are used to explain the present invention and do not constitute an improper limitation to the present invention.

[0046] In the drawings:

[0047] Figure 1 is a schematic structural diagram of the nodes on a group of solder tapes in a non-aligned state;

[0048] Figure 2 is a schematic structural diagram of the nodes on a group of solder tapes adjusted to an aligned state;

[0049] Figure 3 is a schematic structural diagram of a solder tape adjusting device according to an embodiment of the present invention;

[0050] Figure 4 is Figure 3 a schematic structural diagram of the solder tape adjusting device shown from the other side;

[0051] Figure 5 is a partial structural schematic of the solder tape adjusting device;

[0052] Figure 6 is Figure 5 a partial enlarged structural schematic;

[0053] Figure 7 is a partial structural schematic of a solder tape adjusting device according to another embodiment of the present invention;

[0054] Figure 8 is Figure 7 a schematic structural diagram seen from the other side;

[0055] Figure 9 is Figure 8 a schematic structural view of a structure with some parts removed;

[0056] Figure 10 is a partial structural view of a solder tape adjusting device according to another embodiment of the present invention;

[0057] Figure 11 is Figure 10 a schematic structural view of the described structure as seen from the other side;

[0058] Figure 12 is Figure 11 a partial enlarged view of...

[0059] Description of reference numerals:

[0060] 1 - frame; 11 - mounting plate; 12 - connecting plate; 2 - carrier; 21 - carrying surface; 3 - pressing block; 4 - pressing drive mechanism; 5 - feeding drive mechanism; 51 - motor; 52 - push rod; 53 - runner; 531 - spiral groove; 54 - roller; 55 - lead screw; 56 - nut; 57 - connecting member; 58 - limiting plate; 6 - cutting mechanism; 61 - upper cutter; 62 - lower cutter; 63 - upper mounting plate; 64 - lower mounting plate; 65 - upper drive mechanism; 66 - lower drive mechanism; 7 - connecting arm; 8 - leaf spring; 100 - solder tape; 200 - detection station. Detailed Embodiments

[0061] Now, example embodiments will be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be more complete and comprehensive, and will fully convey the concept of the example embodiments to those skilled in the art. The drawings are only schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus repeated descriptions thereof will be omitted.

[0062] In addition, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of the embodiments of the present disclosure. However, those skilled in the art will realize that the technical solutions of the present disclosure can be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. can be used. In other cases, well-known structures, methods, devices, implementations, materials, or operations are not shown or described in detail to avoid obscuring the various aspects of the present disclosure.

[0063] For ease of explanation, spatial relative terms such as "upper", "lower", "left", "right", etc. can be used here to describe the relationship of one element or feature shown in the figure relative to another element or feature. It should be understood that, in addition to the orientations shown in the figure, spatial terms are intended to include different orientations during the use or operation of the device. For example, if the device in the figure is inverted, the element described as being "below" other elements or features will be positioned "above" other elements or features. Thus, the exemplary term "lower" can include both upper and lower orientations. The device can also be positioned in other ways, such as rotated 90 degrees or in other orientations, and the spatial relative descriptions used here can be interpreted accordingly.

[0064] The present invention provides a solder tape adjusting device, which includes a frame, a solder tape feeding mechanism, a detection mechanism and a control unit; wherein,

[0065] A plurality of the solder tape feeding mechanisms are provided and arranged side by side on the frame, and each solder tape feeding mechanism is arranged to be able to press a solder tape and feed the pressed solder tape in the extending direction of the solder tape;

[0066] The detection mechanism is used to detect the node positions of a group of solder tapes pressed by the plurality of solder tape feeding mechanisms at a detection station;

[0067] The control unit can receive the node position information of the solder tapes detected by the detection mechanism, and control each solder tape feeding mechanism to feed the solder tape according to the node position information to adjust the relative positions of the solder tapes in the length direction.

[0068] The solder tape adjusting device provided by the present invention can be used in a cell string soldering device for connecting cells in series with solder tapes. Before laying the solder tapes on the cell string soldering device, the positions of the solder tapes in the length direction are first adjusted by using the solder tape adjusting device, so that the nodes of a group of solder tapes are aligned in the width direction of the solder tapes and arranged in a straight line, which is beneficial to improving the quality of the cell string welded by the solder tapes and reducing the rejection rate. As Figure 1 shows a group of solder tapes 100 before adjustment, and the nodes 101 of this group of solder tapes are arranged in a disorderly manner, as Figure 2 shows a group of solder tapes 100 adjusted by the solder tape adjusting device, and the nodes 101 of this group of solder tapes are arranged in a straight line.

[0069] Preferably, according to the position information of the predetermined nodes of a group of solder tapes detected by the detection mechanism, the position of the predetermined node at the forefront of this group of solder tapes can be determined as the target position, and then the solder tapes with the predetermined nodes not at the target position are determined as the solder tapes to be fed. According to the distance between the predetermined nodes of the solder tapes to be fed and the target position, the solder tape feeding mechanisms of the solder tapes to be fed are controlled to feed the solder tapes, so that the nodes of each solder tape are aligned with the nodes at the forefront target position.

[0070] Of course, the technical solution provided by the present invention is not limited to taking the position of the frontmost predetermined node as the target position. For example, a certain position in front of the predetermined node of each solder strip can also be set as the target position so that each solder strip is fed forward; or a certain position in the middle of each predetermined node can be set as the target position so that some solder strips are fed and some solder strips are retracted to align the predetermined nodes of a group of solder strips.

[0071] The specific structure of the solder strip adjusting device provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0072] As Figure 1 shown, the solder strip adjusting device includes a frame 1, and a plurality of solder strip feeding mechanisms are arranged side by side on the frame 1. Among them, each solder strip feeding mechanism includes:

[0073] A carrier 2, the carrier 2 having a bearing surface 21 for bearing the solder strip;

[0074] A pressing block 3, the pressing block 3 being arranged above the bearing surface 21;

[0075] A pressing driving mechanism 4, the pressing driving mechanism 4 being installed on the carrier 2, and the pressing driving mechanism 4 being connected to the pressing block 3 to drive the pressing block 3 to move towards or away from the bearing surface 21;

[0076] A feeding driving mechanism 5, the feeding driving mechanism 5 being connected to the carrier 2 to drive the carrier 2 to move back and forth relative to the frame 1 along the direction of solder strip feeding.

[0077] When feeding the solder strip, first, each pressing block 3 presses a group of solder strips on the corresponding bearing surface 21 of the carrier 2. A detection mechanism (not shown in the figure) detects the node position of the solder strip 100 located at the detection station 200, and then each feeding driving mechanism 5 drives the corresponding carrier 2 to move a certain distance according to the detection of the detection mechanism. The carrier 2 drives the pressing block 3, the pressing driving mechanism 4, and the pressed solder strip 100 to move as a whole, so that the nodes of the group of solder strips are arranged in alignment.

[0078] In Figures 3 - 6 the shown embodiment, the pressing driving mechanism 4 is a pressing cylinder, the fixed end of the pressing cylinder is fixed on the carrier 2, and the driving end is connected to the pressing block 3. The structure of driving the pressing block 3 by a cylinder is relatively simple. Of course, a motor and a transmission mechanism (for example) can also be used to drive the pressing block 3 to press the solder strip, but the structure is relatively complex.

[0079] In this embodiment, the feeding driving mechanism 5 is a feeding cylinder. The fixed end of the feeding cylinder is fixed relative to the frame 1, and the driving end is connected to the carrier 2.

[0080] Furthermore, as shown in Figure 5 and Figure 6 , an installation plate 11 is provided on the frame 1. The fixed ends of multiple feeding cylinders are fixed side by side on the installation plate 11, and the driving ends pass through the installation plate 11 and are connected to the carrier 2. In this way, the telescopic movement of the driving end of the feeding cylinder can drive the carrier 2 to move relative to the frame 1. Preferably, a slide rail can be provided between the carrier 2 and the frame 1, and the carrier 2 moves along the slide rail.

[0081] In another embodiment, the feeding driving mechanism 5 can also adopt other structural forms.

[0082] For example, in the embodiment shown in Figures 7 - 9 , the feeding driving mechanism 5 includes:

[0083] A motor 51;

[0084] A runner 53, the runner 53 is driven by the motor 51 to rotate, and the axial direction of the runner 53 is consistent with the feeding direction of the welding tape. A helical groove 531 extending spirally is formed on the circumferential surface of the runner 53;

[0085] A push rod 52, one end of the push rod 52 is located in the helical groove 531, and the other end is connected to the carrier 2;

[0086] During the rotation of the runner 53, the push rod 52 moves axially along the helical groove 531, so that the push rod 52 can push the carrier 2 to move back and forth along the feeding direction of the welding tape.

[0087] Preferably, a roller 54 is provided at one end of the push rod 52 located in the helical groove 531. When the end of the push rod 52 moves in the helical groove 531, the roller 54 rolls, which can increase the flexibility of the push rod 52 moving in the helical groove 531.

[0088] When feeding the welding tape, the pressing block 3 presses the welding tape against the bearing surface 21 of the carrier 2. Then, according to the detection of the detection mechanism, the motors 51 of each feeding driving mechanism 5 adjust the feeding length according to the needs of the welding tape, drive the runner 53 to rotate a certain angle in the preset direction, and the helical groove 531 on the runner 53 drives the push rod 52 to move along the helical groove 531. The axial movement of the push rod 52 can drive the carrier 2 to feed axially (i.e., move along the feeding direction of the welding tape), and the welding tape pressed between the carrier 2 and the pressing block 3 is fed.

[0089] In this embodiment, in order to enable the carrier 2 to move relative to the frame 1, a leaf spring 8 is connected between the carrier 2 and the frame 1. When the feeding drive mechanism 5 drives the carrier 2 to move relative to the frame 1, the leaf spring 8 deforms. Of course, it is also possible to adopt a method of arranging a slide rail between the carrier 2 and the frame 1 so that the carrier 2 moves relative to the frame 1 along the slide rail.

[0090] Furthermore, a connecting arm 7 is connected between the carrier 2 and the frame 1, and leaf springs 8 are respectively connected between the connecting arm 7 and the carrier 2 and the frame 1.

[0091] In the embodiment as Figures 10 - 12 shown, the feeding drive mechanism 5 includes a motor 51, a lead screw 55 driven by the motor 51 to rotate, and a nut 56 engaged with the lead screw 55;

[0092] The carrier 2 is connected to the nut 56 so that the nut 56 drives the carrier 2 to move back and forth along the feeding direction of the welding tape.

[0093] Specifically, a connecting plate 12 is provided on the frame 1. The motors 51 of each feeding drive mechanism 5 are respectively connected to the connecting plate 12. On the side of the connecting plate 12 facing away from the motor 51, a lead screw 55 driven by the motor 51 and a nut 56 engaged with the lead screw 55 to rotate are provided. A connecting member 57 is fixedly connected to the nut 56, and the carrier 2 is connected to the nut 56 through the connecting member 57. Thus, the axial movement of the nut 56 along the lead screw can drive the axial movement of the carrier 2 to achieve the feeding of the carrier 2.

[0094] In addition, in this embodiment, a limiting plate 58 fixed relative to the frame 1 is further provided outside each nut 56 to prevent the nut 56 from disengaging from the lead screw, and the limiting plate 58 also plays a safety protection role.

[0095] In addition, in the technical solution provided by the present invention, the welding tape adjusting device further includes a cutting mechanism 6, and the cutting mechanism 6 is used to cut the welding tape after the welding tape feeding mechanism adjusts the positions of the welding tapes;

[0096] As Figure 4 shown, the cutting mechanism 6 includes an upper cutter 61, a lower cutter 62, an upper driving mechanism 65 for driving the upper cutter 61 to move towards the lower cutter 62, and a lower driving mechanism 66 for driving the lower cutter 62 to move towards the upper cutter 61. The upper driving mechanism 65 and the lower driving mechanism 66 are installed on the frame 1.

[0097] Specifically, the upper cutting knife 61 is fixed on the upper mounting plate 63. The upper driving mechanism 65 is a cylinder with its fixed end fixed on the frame 1. The driving end of the upper driving mechanism 65 is connected to the upper mounting plate 63 to drive the upper cutting knife 61 to move downward. Similarly, the lower cutting knife 62 is fixed on the lower mounting plate 64. The lower driving mechanism 66 is a cylinder with its fixed end fixed on the frame 1. The driving end of the lower driving mechanism 66 is connected to the lower mounting plate 64 to drive the lower cutting knife 62 to move upward. When the upper cutting knife 61 and the lower cutting knife 62 jointly move to the position of the solder tape pressed by the solder tape feeding mechanism, the solder tape is cut to a preset length suitable for connecting the battery cells.

[0098] In addition, in the technical solution provided by the present invention, the detection mechanism may include a camera for taking pictures of the solder tape at the detection station, obtaining the image of the solder tape through the camera, so as to obtain the position information of the nodes of the solder tape, and adjusting the solder tape according to the position information. Of course, other components that can detect the position of the solder tape nodes can also be used for the detection mechanism.

[0099] According to another aspect of the present invention, a battery cell string welding device is further provided. The battery cell string welding device includes a welding conveying device, a welding device, a battery cell feeding device, and a solder tape feeding device;

[0100] The battery cell feeding device provides battery cells to the welding conveying device;

[0101] The solder tape feeding device provides solder tapes to the welding conveying device and stacks the battery cells and solder tapes on the welding conveying device;

[0102] The welding conveying device conveys the stacked battery cells and solder tapes to the welding station;

[0103] The welding device welds the battery cells and solder tapes at the welding station to form a battery string.

[0104] Among them, the solder tape feeding device includes the solder tape adjusting device as described above. Before the solder tape is placed on the welding conveying device, the solder tape is adjusted by the solder tape adjusting device so that the nodes of a set of solder tapes to be laid are arranged in a straight line in the direction perpendicular to the length of the solder tape.

[0105] In the battery cell string welding device provided by the present invention, the solder tapes are neatly laid, which is beneficial to improving the quality of the battery string and reducing the rejection rate.

[0106] According to still another aspect of the present invention, a solder tape adjusting method is further provided. The solder tape adjusting method includes:

[0107] Using n solder tape feeding mechanisms to press n solder tapes one by one correspondingly, where n is a natural number greater than 1;

[0108] Obtain the position information of the predetermined nodes on each compacted solder strip;

[0109] Determine the solder strips to be fed in according to the position information of the predetermined nodes on each solder strip;

[0110] Feed forward the solder strips to be fed in in the length direction of their respective solder strips to be fed in according to the position information of the predetermined nodes on the solder strips to be fed in.

[0111] Among them, the determining the solder strips to be fed in according to the position information of the predetermined nodes on each solder strip includes:

[0112] Determine the position information of the foremost predetermined node among the n solder strips as the target position, and determine the solder strips with predetermined nodes not at the target position as the solder strips to be fed in;

[0113] The feeding forward the solder strips to be fed in in the length direction of the solder strips according to the position information of the predetermined nodes on the solder strips to be fed in includes:

[0114] For each solder strip to be fed in, calculate the distance between the predetermined node on the solder strip to be fed in and the target position, and feed forward the solder strip to be fed in in the length direction of the solder strip to be fed in by the distance.

[0115] Of course, the technical solution provided by the present invention is not limited to taking the position of the foremost predetermined node as the target position. For example, a certain position in front of each predetermined node can also be set as the target position so that each solder strip is fed forward; or a certain intermediate position of each predetermined node can be set as the target position so that some solder strips are fed in and some solder strips are retracted to align the predetermined nodes of a group of solder strips.

[0116] The solder strip adjustment method provided by the present invention can be implemented by using the solder strip adjustment device provided by the present invention, and its specific implementation process will not be elaborated here.

[0117] Those of ordinary skill in the technical field to which the present invention belongs should understand that the specific structures and technological processes shown in the above specific implementation parts are merely exemplary and not restrictive. Moreover, those of ordinary skill in the technical field to which the present invention belongs can combine the various technical features shown above in various possible ways to form new technical solutions, or make other modifications, and all belong to the scope of the present invention.

Claims

1. A solder strip adjusting device, characterized in that, the solder strip adjusting device includes a frame, a solder strip feeding mechanism, a detection mechanism and a control unit; wherein, a plurality of the solder strip feeding mechanisms are provided and arranged side by side on the frame, and each solder strip feeding mechanism is configured to be able to press a solder strip and be able to feed the pressed solder strip in the extending direction of the solder strip; the detection mechanism is used for detecting the node positions of a group of solder strips pressed by the plurality of solder strip feeding mechanisms at a detection station; the control unit can receive the node position information of the solder strips detected by the detection mechanism, and control each solder strip feeding mechanism to feed the solder strip according to the node position information so as to adjust the relative positions of the solder strips in the length direction; each solder strip feeding mechanism includes: a carrier, the carrier having a bearing surface for bearing the solder strip; a pressing block, the pressing block being arranged above the bearing surface; a pressing driving mechanism, the pressing driving mechanism being installed on the carrier, and the pressing driving mechanism being connected to the pressing block to drive the pressing block to move towards or away from the bearing surface; a feeding driving mechanism, the feeding driving mechanism being connected to the carrier to drive the carrier to move back and forth relative to the frame along the direction of solder strip feeding; Before the solder strip is placed on the welding conveying device, the solder strip is adjusted by the solder strip adjusting device so that the nodes of a group of solder strips to be laid are arranged in a straight line in a direction perpendicular to the length of the solder strip.

2. The solder strip adjusting device according to claim 1, characterized in that, the feeding driving mechanism is a feeding cylinder, the fixed end of the feeding cylinder is fixed relative to the frame, and the driving end is connected to the carrier.

3. The solder strip adjusting device according to claim 1, characterized in that, the feeding driving mechanism includes: a motor; a runner, the runner being driven by the motor to rotate, and the axial direction of the runner being consistent with the feeding direction of the solder strip, and a helically extending spiral groove being formed on the circumferential surface of the runner; a push rod, one end of the push rod being located in the spiral groove and the other end being connected to the carrier; During the rotation of the runner, the push rod moves along the spiral groove, so that the push rod pushes the carrier to move back and forth along the direction of solder strip feeding.

4. The solder strip adjusting device according to claim 3, characterized in that, a roller is arranged at one end of the push rod located in the spiral groove.

5. The solder strip adjusting device according to claim 3, characterized in that, a leaf spring is connected between the carrier and the frame so that the carrier can move relative to the frame.

6. The solder strip adjusting device according to claim 5, characterized in that, a connecting arm is connected between the carrier and the frame, and leaf springs are respectively connected between the connecting arm and the carrier and the frame.

7. The solder strip adjusting device according to claim 1, characterized in that, the feeding driving mechanism includes a motor, a lead screw driven by the motor to rotate, and a nut cooperating with the lead screw; The carrier is connected to the nut, and the nut drives the carrier to move back and forth along the feeding direction of the solder tape.

8. The solder tape adjusting device according to any one of claims 1-7, characterized in that, the solder tape adjusting device further includes a cutting mechanism, and the cutting mechanism is used to cut the solder tape after the solder tape feeding mechanism adjusts the positions of the solder tapes; the cutting mechanism includes an upper cutting knife, a lower cutting knife, an upper driving mechanism for driving the upper cutting knife to move towards the lower cutting knife, and a lower driving mechanism for driving the lower cutting knife to move towards the upper cutting knife, and the upper driving mechanism and the lower driving mechanism are installed on the frame.

9. A cell string soldering device, characterized in that, the cell string soldering device includes a welding conveying device, a welding device, a cell feeding device and a solder tape feeding device; the cell feeding device provides cells to the welding conveying device; the solder tape feeding device provides solder tapes to the welding conveying device and stacks the cells and solder tapes on the welding conveying device; the welding conveying device conveys the stacked cells and solder tapes to the welding station; the welding device welds the cells and solder tapes at the welding station to form a cell string; wherein, the solder tape feeding device includes the solder tape adjusting device according to any one of claims 1-8, and before the solder tape is placed on the welding conveying device, the solder tape is adjusted by the solder tape adjusting device so that the nodes of a group of solder tapes to be laid are arranged in a straight line in the direction perpendicular to the length of the solder tape.

10. A method for adjusting a solder tape, characterized in that, the solder tape adjusting method is applied to the cell string soldering device according to claim 9, and the solder tape adjusting method includes: using n solder tape feeding mechanisms to press n solder tapes one by one correspondingly, where n is a natural number greater than 1; acquiring the position information of the predetermined nodes on each pressed solder tape; determining the solder tapes to be fed according to the position information of the predetermined nodes on each solder tape; feeding the solder tapes to be fed forward in the length direction of the respective solder tapes to be fed according to the position information of the predetermined nodes on the solder tapes to be fed; before the solder tape is placed on the welding conveying device, the solder tape is adjusted by the solder tape adjusting device so that the nodes of a group of solder tapes to be laid are arranged in a straight line in the direction perpendicular to the length of the solder tape.

11. The solder tape adjusting method according to claim 10, characterized in that, the determining the solder tapes to be fed according to the position information of the predetermined nodes on each solder tape includes: determining the position information of the foremost predetermined node among the n solder tapes as the target position, and determining the solder tapes with the predetermined nodes not at the target position as the solder tapes to be fed; the feeding the solder tapes to be fed forward in the length direction of the solder tape according to the position information of the predetermined nodes on the solder tapes to be fed includes: for each solder tape to be fed, calculating the distance between the predetermined node on the solder tape to be fed and the target position, and feeding the solder tape to be fed forward by the distance in the length direction of the solder tape to be fed.

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