Micro-electromechanical system sensor package and manufacturing method thereof

Abstract

The present disclosure relates to a micro-electromechanical system sensor package and a method for manufacturing the same. For example, a device includes: a first sidewall including a first opening extending through the first sidewall; a first sensor attached to an inner surface of the first sidewall, wherein the first sensor is aligned to at least partially cover the first opening; a second sidewall opposite the first sidewall; a third sidewall, attaching the first sidewall to the second sidewall; and a first contact pad disposed on an outer surface of the third sidewall, wherein the first contact pad is configured to provide at least one of a power connection or a signal connection for the first sensor.

Description

Technical Field

[0001] The present disclosure relates generally to sensors and, in particular embodiments, to microelectromechanical system (MEMS) sensor packages and methods of manufacturing the same. Background Art

[0002] Generally speaking, micro-electromechanical system (MEMS) sensor devices operate under physically sensitive environmental conditions. For example, MEMS devices can sense sound, air pressure, motion, etc. MEMS devices are generally simple sensor devices that generate raw electrical signals. MEMS sensors (such as MEMS microphones) have a movable membrane that reacts to pressure waves in the air in the inner cavity of the MEMS microphone to generate electrical signals. MEMS microphone packages typically include a control chip (such as an application-specific integrated circuit (ASIC)) to manage the MEMS microphone, read the raw data signal from the MEMS microphone, and convert the data signal into a desired data format. In a MEMS microphone package, the MEMS microphone and the control chip are arranged in the cavity of the device package. Summary of the invention

[0003] An embodiment device includes: a first sidewall, comprising a first opening extending through the first sidewall; a first sensor attached to an inner surface of the first sidewall, wherein the first sensor is aligned to at least partially cover the first opening; a second sidewall, opposite the first sidewall; a third sidewall, attaching the first sidewall to the second sidewall; and a first contact pad disposed on an outer surface of the third sidewall, wherein the first contact pad is configured to provide at least one of a power connection or a signal connection for the first sensor.

[0004] An embodiment of a MEMS microphone package includes: a first cover forming a first side wall of the MEMS microphone package, the first cover including a first acoustic input port extending through the first cover; a first MEMS microphone die attached to an inner surface of the first cover, wherein the first MEMS microphone die is aligned to at least partially cover the first acoustic input port; a second side wall opposite the first cover; a molding compound forming a third side wall and attaching the first cover to the second side wall; and a first input / output (I / O) pad disposed on an outer surface of the molding compound, wherein the first I / O pad is configured to provide at least one of a power connection or a signal connection for the first MEMS microphone die.

[0005] An embodiment method includes: attaching a first side of a sensor to a first side of a cover, the sensor having a contact pad disposed on a second side of the sensor opposite to the first side; providing an interconnect on the contact pad, wherein a first end of the interconnect is attached to the contact pad and the interconnect extends away from the contact pad; attaching a control chip to a first side of a substrate, and electrically connecting the control chip to a first platform pad disposed at the first side of the substrate, the substrate further comprising a second platform pad disposed at the first side of the substrate and an interconnect structure disposed in a body of the substrate and electrically coupled to the second platform pad; adhering the cover over the substrate, wherein an inner cavity defined by a molding compound is formed by adhering between the cover and the substrate, and the adhering is such that a second end of the interconnect (opposite to the first end of the interconnect) is attached to the second platform pad; and forming an external contact pad and a trace on an exposed surface of the molding compound, wherein a first end of the trace is coupled to the external contact pad, and a second end of the trace is coupled to the interconnect structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] In order to more fully understand the present invention and its advantages, the following description is now made in conjunction with the accompanying drawings, in which:

[0007] Figure 1A schematically illustrates a top perspective view of a top port MEMS microphone package;

[0008] Figure 1B Schematically shows Figure 1A Bottom perspective view of a top-port MEMS microphone package shown;

[0009] Figure 1C to Figure 1F Schematically shows Figure 1A Various cross-sectional views of a top-port MEMS microphone package;

[0010] Figure 2A schematically illustrates a top perspective view of a bottom port MEMS microphone package;

[0011] Figure 2B Schematically shows Figure 2A A bottom perspective view of a bottom port MEMS microphone package is shown;

[0012] Figure 2C Schematically shows Figure 2A A cross-sectional view of a bottom-port MEMS microphone package;

[0013] Figure 3 A top view of a microphone array is shown, wherein the microphone array includes a main board and a plurality of MEMS microphone packages disposed on the main board;

[0014] FIG. 4A to FIG. 4C shows the formation of a first portion of a MEMS microphone package according to some embodiments;

[0015] FIG. 5A to FIG. 5F illustrates the formation of a second portion of a MEMS microphone package according to some embodiments;

[0016] FIG. 6A to FIG. 6E shows the use of FIG. 4A to FIG. 4C The first part obtained and from FIG. 5A to FIG. 5F Assembling the obtained second part of the MEMS microphone package;

[0017] Fig. 7A and Fig. 8A Schematically illustrates the use of FIG. 4A to FIG. 4C , FIG. 5A to FIG. 5F as well as FIG. 6A to FIG. 6E A top isometric view of a MEMS microphone package formed by the process shown.

[0018] Figure 7B and Figure 8B Schematically illustrating the Fig. 7A and Fig. 8A A bottom isometric view of the MEMS microphone package shown;

[0019] Figure 7C Schematically illustrates a method according to some embodiments Fig. 7A A cross-sectional view of a MEMS microphone package;

[0020] 9A to 9E as well as FIG. 10A to FIG. 10E schematically illustrates various views of a MEMS microphone array according to some embodiments;

[0021] Fig.11 A MEMS microphone package including a metal cap is shown in accordance with some embodiments.

[0022] Unless otherwise indicated, corresponding numbers and symbols in different drawings generally represent corresponding parts. The drawings are drawn to clearly illustrate the relevant aspects of the preferred embodiments and are not necessarily drawn to scale. In order to more clearly illustrate a particular embodiment, letters representing variations of the same structure, material, or process step may follow the figure number. DETAILED DESCRIPTION

[0023] The manufacture and use of the preferred embodiment are discussed in detail below. However, it should be understood that the present invention provides many applicable inventive concepts that can be implemented in various specific contexts. The specific embodiments discussed only illustrate the specific ways to manufacture and use the present invention and do not limit the scope of the present invention.

[0024] As with the devices shown in the accompanying drawings, reference may be made herein to the spatial relationship between the components and the spatial orientation of the components in various aspects. However, as will be appreciated by those skilled in the art upon a thorough reading of this disclosure, the devices, components, apparatuses, etc. described herein may be positioned in any desired orientation. Thus, the devices as described herein may be oriented in any desired orientation, and the use of terms such as "upper," "lower," "upper," "lower," etc., which describe the spatial relationship between the components or describe the spatial orientation of various aspects of these components, should be understood to describe the relative relationship between the components or the spatial orientation of various aspects of such components, respectively.

[0025] The increasing complexity of electronic systems has placed demands on increased functionality of these electronic systems and reduced size of components used in the systems. Specifically, personal electronic devices have an increasing number of microphones to detect sound in various device directions, and have additional sensors for new features. As the number of sensors increases, the space allocated to each sensor (and thus to the microphone) decreases. An embodiment provides a MEMS microphone package and a method for manufacturing the same, which reduces the package size and improves reliability and sensitivity. Specifically, the disclosed embodiments: are compact in size (e.g., have a smaller package pin size); have a standard bill of materials, while being easily configured as a top port MEMS microphone package, a bottom port MEMS microphone package, or a side port MEMS microphone package; are modular in design, so that they can be easily combined with other similar MEMS microphone packages at the package level to form a compact microphone array that can be suitable for mobile applications; and are sensitive to sound waves traveling laterally (laterally) to the MEMS microphone package without the use of additional features (e.g., sound guides).

[0026] Figure 1A A top perspective view of a top port MEMS microphone package 100 is schematically shown. Figure 1B Schematically shows Figure 1A A bottom perspective view of a top port MEMS microphone package 100 is shown. Figure 1C , Figure 1E and Figure 1F Schematic diagram showing a cross section through line AA Figure 1A Various examples of cross-sectional views of a top-port MEMS microphone package 100 . Figure 1D Provides a cut across the BB line Figure 1A1. Another cross-sectional view of a top port MEMS microphone package 100. The MEMS microphone package 100 may be used in any of a variety of applications. For example, the MEMS microphone package 100 may be used in mobile phones, landline phones, computer equipment, video games, hearing aids, hearing instruments, biometric security systems, two-way radios, announcement systems, and other devices that convert signals. The MEMS microphone package 100 may have a first dimension D1 (e.g., thickness) between about 0.9 mm and 2 mm, a second dimension D2 (e.g., depth) between about 2 mm and 7 mm, and a third dimension D3 (e.g., width) between about 3 mm and 10 mm.

[0027] refer to Figure 1A , the MEMS microphone package 100 includes a cover component 101 and a sound input port 103 formed by the cover 101. As described in further detail below, the cover 101 can be an injection molded thermoplastic component or a laminate substrate with integrated electronic circuit traces. Figure 1C As shown, a hollow cavity is formed in the cover 101. The cover 101 is coupled to a substrate layer 105 to form a sealed cavity. The substrate layer 105 can be a laminate substrate, for example, including a printed circuit board (PCB) material such as FR-4. In other examples, the substrate layer 105 can be a pre-molded lead frame type package (also referred to as a "pre-molded package"). Other examples of the substrate layer 105 include a ceramic cavity package.

[0028] like Figure 1C As shown, the MEMS microphone die 107 is mounted to the cover 101, near or covering the acoustic port opening 103, so that the sound pressure (e.g., sound waves) entering the MEMS microphone package 100 through the acoustic input port 103 engages or interacts with the MEMS microphone die 107 to generate an electrical signal, which, together with additional (external and / or internal) components (e.g., a speaker and accompanying circuitry), generates an output sound signal corresponding to the input sound pressure. The MEMS microphone die 107 can be mounted to the cover 101 by an adhesive or other fastening mechanism known in the art.

[0029] Conductive traces 109 (e.g., metal traces) are deposited on at least a portion of the inner surface of the cover 101. When the substrate layer 105 is sealed to the cover 101 (e.g., via a conductive or non-conductive sealant as is known in the art), the conductive traces 109 are electrically coupled with corresponding traces 111 formed on the substrate layer 105. Figure 1C In the example of , the circuit traces 111 on the substrate layer 105 are coupled to one or more conductive vias 113, which in turn are coupled to one or more electrical contact pads 115 on the bottom surface of the substrate layer 105. Figure 1BThe electrical contact pads 115 are shown in more detail in the bottom perspective view of FIG. The electrical contact pads 115 (also referred to as package input / output (I / O) pads) electrically connect the MEMS microphone package 100 to another substrate (e.g., a motherboard, a printed circuit board, or other electrical interconnection device). The electrical contact pads 115 can provide power and signal connections for the MEMS microphone package 100.

[0030] Figure 1D A more detailed view of the inner surface of the cover 101 is provided, and a Figure 1A 10. A cross-sectional view of the top port MEMS microphone package 100 taken along line BB of the cover 101. As described above, the conductive traces 109 deposited on the inner wall of the cover 101 provide electrical wiring between the cover 101 and the substrate layer 105. However, in this example, the inner surface of the cover 101 that is not used for electrical wiring between the cover 101 and the substrate layer 105 is covered by a conductive layer 119 that is grounded to the substrate layer 105. The conductive layer 119, together with the substrate layer 105 (which may also include a conductive ground plate), forms a Faraday cage, which provides improved electromagnetic shielding for the MEMS microphone package 100. In some examples, the conductive layer 119 may additionally or alternatively be positioned at or around the outer surface of the cover 101, wherein the conductive layer 119 is coupled to the ground of the substrate 105 to provide electromagnetic shielding for the MEMS microphone package 100. In such an example, the conductive layer 119 may be a single layer that uniformly covers the cover 101, or may be in the form of through holes arranged in a zigzag manner along the cover 101. As shown in FIG. Figure 1C As shown, wires 117 extend from the MEMS microphone die 107 to connect the MEMS microphone die 107 to conductive traces 109 formed on the inner surface of the cover 101. In this way, the MEMS microphone die 107 is in electronic communication with one or more devices mounted on the substrate layer 105, in this example, electrical contact pads 115 on the outer surface of the MEMS microphone package 100.

[0031] exist Figure 1C In the example of , the MEMS microphone die 107 is a monolithically integrated MEMS die that includes an application specific integrated circuit (ASIC) component and a micro-electromechanical microphone membrane within a single die. Figure 1E As shown in the example of , the MEMS microphone membrane and the ASIC component can be provided as separate integrated circuits. Figure 1EAs shown, the cover 101 is provided with a MEMS microphone die 107' (including a micro-electromechanical microphone membrane) and an ASIC 121 at the same time. In other words, the MEMS microphone die 107' is mounted to the cover 101, near the acoustic input port 101 or above the acoustic input port 101, and the ASIC 121 is also mounted to the inner surface of the cover 101, near the MEMS microphone die 107'. In some examples, the ASIC 121 can be covered by a package (e.g., a top encapsulation). The MEMS microphone die 107' and the ASIC 121 can be mounted to the cover 101 by an adhesive or other fastening mechanism. When the cavity is sealed, the wires 117 electrically connect the MEMS microphone die 107' and the ASIC 121 to each other and to the substrate layer 105 (and thus to the electrical contact pads 115).

[0032] Figure 1F It passes through Figure 1A FIG. 1 is a cross-sectional view of another example of a top-port MEMS microphone package 100 taken along line AA of FIG. 1 . The lid 101 and the substrate layer 105 form an inner chamber for housing a MEMS microphone die 107' and an ASIC 121 (for controlling and driving the MEMS microphone die 107'). In other examples, the ASIC 121 and the MEMS microphone die 107' may be integrated into a single die (e.g., as shown in FIG. 1 ). Figure 1C ).

[0033] Although Figures 1A to 1F An example of a top port MEMS microphone package 100 is shown, but some microphone packages position the acoustic input port 103 through the substrate layer 105 to form a bottom port MEMS microphone package 200, such as FIG. 2A to FIG. 2C . Figure 2A Schematically shows a top perspective view of a bottom port MEMS microphone package 200. In a corresponding manner, Figure 2B Schematically shows Figure 2A A bottom perspective view of a bottom port MEMS microphone package 200 is shown. Figure 2C Schematically shows Figure 2A FIG. 2 is a cross-sectional view of a bottom port MEMS microphone package 200 taken through line CC. Figure 2A As shown, the MEMS microphone package 200 may have a first dimension D1 (eg, thickness), a second dimension D2 (eg, depth), and a third dimension D3, which may be similar to Figure 1A The MEMS microphone package 100 is shown with a first dimension D1 , a second dimension D2 , and a third dimension D3 .

[0034] refer to Figure 2A and Figure 2B, the MEMS microphone package 200 includes a cover member 201 and a sound input port 203 formed by a substrate layer 205. The cover 201 is coupled (eg, adhered) to the substrate layer 205 to form a sealed cavity. The substrate layer 205 may include a reference Figures 1A to 1F The substrate layer 105 is made of similar materials as described above. Figure 2C As shown, a MEMS microphone die 207' (including a micro-electromechanical microphone membrane) is mounted to the substrate layer 205, close to or covering the acoustic port 203, so that the sound pressure (e.g., sound waves) entering the MEMS microphone package 200 through the acoustic input port 203 engages or interacts with the MEMS microphone die 207 to generate an electrical signal, which, together with additional (external and / or internal) components (e.g., a speaker and accompanying circuits), generates an output sound signal corresponding to the input sound pressure. The MEMS microphone die 207' can be mounted to the substrate layer 205 by an adhesive or other fastening mechanism known in the art. The cover 201 can be formed of one or more metals or another conductive material to protect the MEMS microphone die 207' from electromagnetic interference.

[0035] The circuit traces 211 on the substrate layer 205 are coupled to one or more conductive vias 213, which in turn are coupled to one or more electrical contact pads 215 on the bottom surface of the substrate 205. The electrical contact pads 215 on the bottom surface of the substrate 205 are also Figure 2B , is shown in a bottom perspective view of . Electrical contact pads 215 can electrically connect the MEMS microphone package 200 to another substrate (e.g., a motherboard, a printed circuit board, or other electrical interconnect device). Electrical contact pads 215 (also referred to as package input / output (I / O) pads) can provide power and signal connections for the MEMS microphone package 200. Wires 217 couple ASIC 221 (for controlling and driving the MEMS microphone die 207') and the MEMS microphone die 207' to each other. Wires 217 are also used to connect ASIC 221 to circuit traces 211 on substrate 205. In some examples, ASIC 221 can be covered by a package (e.g., a top encapsulation). In other examples, ASIC 221 and MEMS microphone die 207' can be arranged as an integrally integrated MEMS die (e.g., as Figure 1A ).

[0036] From the above reference Figures 1A to 1F as well as FIG. 2A to FIG. 2CThe overall structures of the described MEMS microphone packages 100 and 200 can be appreciated that the top port MEMS microphone package and the bottom port MEMS microphone package require different bills of materials (BOMs) and process steps for their respective manufacturing. In other words, the top port MEMS microphone package 100 and the bottom port MEMS microphone package 200 have different manufacturing steps, raw materials, sub-assemblies, intermediate assemblies, sub-components, parts, and quantities of each required to manufacture the final MEMS microphone package. For example, the top port MEMS microphone package 100 may require the use of two laminate substrates (e.g., one laminate substrate for the substrate layer 105 and another laminate substrate for the cover 101), while the bottom port MEMS microphone package 200 may require the use of one laminate substrate (e.g., for the substrate layer 205) and one metal cover 201. In addition, currently available MEMS microphone packages are either top port or bottom port. In other words, the current market only provides single package solutions for top port or bottom port.

[0037] Currently available single-package solutions can complicate the manufacture of microphone arrays. Figure 3 A top view of a microphone array 300 is shown, and the microphone array 300 includes a main board 301 (e.g., a PCB) and a plurality of MEMS microphone packages 303 disposed on the main board 301 (e.g., mounted on and electrically coupled to the main board 301). For example, the microphone array 300 can be used in smart consumer products and / or at least one of voice recognition, command capture and recognition, or noise suppression. Figure 3 The example of FIG. 3 shows a circular array of MEMS microphone packages 303; however, it should be noted that other spatial arrangements of MEMS microphone packages 303 are also possible (eg, a linear array or a matrix). A corresponding one of the plurality of MEMS microphone packages 303 may be used. Figure 1A The top port MEMS microphone package 100 or Figure 2A. The bottom port MEMS microphone package 200 is identified. Differently, the multiple MEMS microphone packages 303 of the microphone array 300 can all be top port MEMS microphone packages or all be bottom port MEMS microphone packages, or a mixture thereof. Using top port MEMS microphone packages and / or bottom port MEMS microphone packages (with different BOMs) in the microphone array 300 can lead to manufacturing and setup complexity, thereby increasing manufacturing costs. This is particularly true in examples where the multiple MEMS microphone packages 303 include a mixture of top port MEMS microphone packages and bottom port MEMS microphone packages (e.g., due to the need for different BOMs). In addition, since the multiple MEMS microphone packages 303 are mounted on the mainboard 301, the acoustic input port 103 of the top port MEMS microphone package can be oriented away from the main surface 305 (e.g., the top or upward-facing surface) of the mainboard 301, while the acoustic input port 203 of the bottom port MEMS microphone package can be oriented toward the main surface 305 of the mainboard 301 (and can extend through the thickness of the mainboard 301). Thus, Figure 3 The microphone array 300 may not be sensitive enough to the sound waves 307 that arrive transversely (eg, sideways) to the plurality of MEMS microphone packages 303. In other words, Figure 3 The microphone array 300 may not be able to adequately capture the sound waves 307 incident on the side walls of the covers 101, 201 of the multiple MEMS microphone packages 303. A current solution to this situation is to use additional features (e.g., sound guides) to guide the sound waves 307 to the upper and / or lower surfaces of the mainboard 301 to guide the sound waves 307 to the upward or downward sound input ports 103, 203 of the multiple MEMS microphone packages 303, so that the multiple MEMS microphone packages 303 can detect the sound waves 307. However, this solution further increases the cost and complexity of manufacturing the microphone array 300. Furthermore, since the microphone array 300 is typically manufactured at the board level (e.g., by mounting the multiple MEMS microphone packages 303 on the mainboard 301) rather than the package level, the microphone array 300 typically occupies an area that may limit its implementation in mobile applications. In view of these observations, there may be a need for an improved MEMS microphone package that: (1) is compact in size (e.g., has a smaller package pin size); (2) has a standard BOM while being easily configured as a top port MEMS microphone package, a bottom port MEMS microphone package, or a side port MEMS microphone package; (3) is modular in design so that it can be easily combined with other similar MEMS microphone packages at the package level to form a compact microphone array suitable for mobile applications; and (4) is sensitive to sound waves traveling laterally (e.g., sideways) to the MEMS microphone package without the use of additional features (e.g., sound guiding).

[0038] FIG. 4A to FIG. 4C as well as FIG. 5A to FIG. 5F FIG. 1 shows a process flow of a method for manufacturing a MEMS microphone package according to an embodiment. Fig. 7A , Figure 7B , Fig. 8A and Figure 8B It is shown that the FIG. 4A to FIG. 4C and FIG. 5A to FIG. 5F An example MEMS microphone package manufactured using the process flow of FIG. The MEMS microphone package can then be used to conveniently and inexpensively (in a modular manner and at the package level) manufacture a MEMS microphone array that is sensitive to laterally traveling sound waves. 9A to 9E as well as FIG. 10A to FIG. 10E It is shown that the Fig. 7A , Figure 7B , Fig. 8A and Figure 8B An example of a MEMS microphone array fabricated using a MEMS microphone package.

[0039] First reference FIG. 4A to FIG. 4C , illustrating the formation of a first portion 413 of a MEMS microphone package according to some embodiments, Figure 4A A frame 401 of a MEMS microphone package is shown. The frame 401 includes portions that form one or more covers in an assembled MEMS microphone package (e.g., after singulation as described below). The frame 401 may have one or more ports 405 extending through the frame 401 (e.g., ultimately forming an acoustic input port of the assembled MEMS microphone package). The frame 401 may also have leak stop ridges 403 formed on one side of the frame 401. The leak stop ridges 403 may be raised areas on the top surface of the frame 401, and each leak stop ridge 403 may be formed to surround a corresponding port 405 and provide a physical barrier to prevent material applied to the top surface of the frame 401 from leaking or running outside the frame 401.

[0040] In some embodiments, the frame 401 may be formed of a conductive material to provide electromagnetic interference (EMI) shielding for the assembled MEMS microphone package. In some embodiments, the frame 401 may be made of copper, gold, aluminum, or other metals or alloys, and may be formed by molding, chemical or plasma etching, milling, stamping, or other forming processes. In other embodiments, the frame 401 may be made of a conductive material (such as a molding compound having a conductive material disposed therein) or a conductive polymer (such as an epoxy resin, a molding compound, etc.).

[0041] Figure 4BA MEMS microphone die 407 is shown mounted on a frame 401 to form a first portion 413 of a MEMS microphone package in accordance with some embodiments. Adhesive 411 (such as glue, epoxy, die attach film (DAF), etc.) is deposited on the top surface of the frame 401 within a leak stop ridge 403 containing adhesive 411. The leak stop ridge 403 prevents the adhesive 411 from flowing between areas designated for different covers or packages. In some embodiments, the MEMS microphone die 407 is mounted on the adhesive 411 (which may eventually be cured) such that the MEMS microphone die 407 is adhered to the top surface of the frame 401. In some embodiments, each MEMS microphone die 407 may be attached to the frame 401 across a respective port 405. Each MEMS microphone die 407 may have a sensor cavity 415 or the like that serves as a front chamber or front volume for the respective MEMS microphone die 407.

[0042] Figure 4C The interconnects 421 and 423 are shown mounted on the first portion 413 of the shielded MEMS microphone package according to some embodiments. The interconnects 421 and 423 may include a frame interconnect 423 mounted on and in electrical contact with the frame 401. In some embodiments, the frame interconnect 423 is mounted on the leakage stop ridge 403 or on another exposed portion of the frame 401 and may provide a ground connection for the frame 401 or the lid. The interconnects 421 and 423 may also include a die interconnect 421 mounted on a die platform pad 409 disposed on the top side of the MEMS microphone die 407. The interconnects 421 and 423 may be wire bond structures formed using a wire bonding machine, where a ball is formed at the exposed wire end, for example using electronic ignition, and heat, pressure, and / or ultrasonic vibrations may be used, for example, to weld, melt, or otherwise attach the ball end of the interconnect to the leakage stop ridge 403 and the die platform pad 409. After attaching the ball end of the wire to the contact pad 115, the wire bonding machine may cut the wire to form the second end of the interconnects 421 and 423. The first ends of the interconnects 421 and 423 are disposed on the frame 401 or on the MEMS microphone die 407 and extend away from the frame 401. The second ends of the interconnects 421 and 423 are opposite to the first ends of the interconnects 421 and 423. In some embodiments, the second ends of the interconnects 421 and 423 are substantially horizontal or coplanar to facilitate subsequent mounting of the substrate over the first portion 413. In other embodiments, the interconnects 421 and 423 are solder balls, solder balls with support structures, prefabricated structures placed on contact pads, printed structures, or structures appropriately formed on the frame 401 or the die platform pad 409.

[0043] Reference now FIG. 5A to FIG. 5F , illustrating the formation of a second portion of a MEMS microphone package according to some embodiments. Figure 5A A second portion 501 of the shielded MEMS microphone package is shown having one or more pads 505 (e.g., landing pads) disposed at a major surface of a substrate 513 (e.g., a PCB). The one or more pads 505 may be interconnected by one or more metal lines and / or vias 507 on the substrate 513 or in the substrate body 503. It should be noted that the one or more metal lines and / or vias 507 may be configured to provide power and signal connections for the assembled MEMS microphone package.

[0044] Figure 5B A sidewall 509 is shown formed on the second portion 501 according to some embodiments. In some embodiments, the sidewall 509 is formed on the substrate body 503, while in other embodiments, the sidewall 509 may be formed on a stop pad, an oxide or sealing layer, etc. disposed on the surface of the substrate 513. In some embodiments, the sidewall 509 is formed of a molding compound suitable for an electroplating process. For example, the sidewall 509 may include an elastomeric molding compound, and the outer surface 509a of the sidewall 509 may subsequently be plated with a conductive material (e.g., copper) to form an electrical contact pad (also referred to as a package input / output (I / O) pad) that provides power and signal connections for the assembled MEMS microphone package and is electrically coupled to one or more metal lines and / or vias 507 disposed in the substrate body 503. Fig.6D and Fig. 6E This step is described in more detail in . The sidewall 509 can be formed by molding the sidewall into place, 3D printing, preforming the sidewall 509 and attaching the sidewall 509 to the substrate 513, or other forming processes. The sidewall 509 is formed to continuously surround the die area and one or more pads 505, and extend away from the substrate 513 to provide an inner cavity 511.

[0045] Figure 5C The attachment of a control chip 515 according to some embodiments is shown. The control chip 515 may be an ASIC, a communication device, an interface device, etc., and may have circuitry to control or read the MEMS microphone die 407. The control chip 515 is attached to the substrate 513 by a die attach structure 519 such as a DAF, adhesive, tape, etc. In other embodiments, the control chip 515 is attached to the substrate 513 by a mechanical retainer such as a clip, a socket, a screw, etc. The control chip 515 has one or more control chip bond pads 517 disposed on the top side facing away from the substrate 513. Figure 5D Wire bonds of a control chip 515 to one or more pads 505 are shown in accordance with some embodiments. In some embodiments, the control chip 515 is a wire bond control chip and is electrically connected to the one or more pads 505 using wire bond connections 523. Figure 5C and Figure 5DFIG. 5 shows that the control chip 515 can be wire-bonded to the substrate 513, but pad-mounted control chips are also possible (such as Figure 5E ).

[0046] Figure 5E Attachment of a pad mounted control chip 529 is shown in accordance with some embodiments. Conductive connectors 527 may be applied to one or more pads 505. In some embodiments, the package includes a control chip 529 mounted via mounting pads 531 disposed on the bottom side of the control chip 529. The pad mounted control chip 529 is attached to the pads 505 via the conductive connectors 527. The pad mounted control chip 529 may be an ASIC, a communication device, an interface device, etc., and may have circuitry to control or read the MEMS microphone die 407. Although Figure 5E The illustrated second portion 501 of the shielded sensor package is shown with a wire-bonded control chip 515 and a pad-mounted control chip 529 , but the different types of control chips 515 and 529 are shown for illustration purposes only and not for limitation. Fig. 5F A cover connector 537 is shown applied to the side wall 509 according to some embodiments. The cover connector is disposed on the second end of the side wall 509 and may be glue, DAF, epoxy or other adhesive or attachment structure.

[0047] FIG. 6A to FIG. 6E is a diagram illustrating the assembly of a shielded MEMS microphone package 600 according to some embodiments. Fig. 6A Shows Figure 4C The first portion 413 is attached to Fig. 5F The first portion 413 is inverted and adhered to the second portion 501 via a cover connector 537 to close the inner cavity 511. In addition, the interconnects 421 and 423 are attached to the pads 505 of the second portion and adhered via conductive connectors 527. In some embodiments, the top surface of the pads 505 is substantially horizontal so that the ends of the interconnects 421 and 423 are in consistent contact with the corresponding pads 505. In some embodiments, each interconnect 421 and 423 extends from the first portion 413 of the shielded MEMS microphone package 600 so that the second end of each interconnect 421 and 423 is in electrical contact with a different contact pad 505 on the surface of the substrate 513. In other embodiments, one or more interconnects 421 and 423 contact the control chip bonding pad 517 or other platform pads, contact pads, etc. Therefore, the MEMS microphone die 407 can be connected to the corresponding control chips 515 and 529 through the sensor interconnect 421, while the MEMS microphone die 407 and the corresponding control chips 515 and 529 are spaced apart and overlap each other. The spatial overlap of the MEMS microphone die 407 and the corresponding control chips 515 and 529 enables a compact package pin size. Fig. 6A As shown and with respect to the interconnect 421, one end of the interconnect 421 is attached to the die platform pad 409 of the MEMS microphone die 407, wherein the interconnect 421 extends away from the die platform pad 409. The other end of the interconnect 421 will then make contact (e.g., electrically and / or physically contact) with the platform pad 505 on the substrate 531, wherein the platform pad 505 is electrically connected to one or more metal lines and / or vias 507 disposed in the substrate body 503.

[0048] The sidewalls 509 and the frame 401 form a conductive housing that provides EMI shielding for the enclosed control chips 515 and 529 and the MEMS microphone die 407. In some embodiments, the substrate 513 also has a shielding layer (not shown) that increases the EMI shielding of the MEMS microphone package 600. In addition, in the illustrated arrangement, the inner cavity 511 serves as the back volume of the MEMS microphone die 407, while the sensor cavity 415 serves as the front volume. After the first portion 413 is mounted on the second portion 501, the package 600 can be cured, reflowed, etc. to set, cure, or reflow the cover connector 537 and the conductive connector 527. The MEMS microphone package 600 can also be mounted on a carrier 539 (such as tape, etc.).

[0049] Figure 6B 5 shows the singulation of the MEMS microphone package 600 according to some embodiments. For example, while the MEMS microphone package 600 is held on the carrier 539, the MEMS microphone package 600 is cut by die sawing, laser cutting, etc. to form the cutting area 541 and separate the individual packages 600. It should be noted that although Figure 6B The example of FIG. 4 shows singulation to form individual packages 600 (where each MEMS microphone package 600 includes a single MEMS microphone die 407), but may be adapted or modified. Figure 6B The single process makes Fig. 6A The structure is singulated to form a single package 602 (eg, Figure 6C 4 and 5. The MEMS microphone package 602 shown in FIG. 4 is a single package 602, wherein each MEMS microphone package 602 includes a plurality of MEMS microphone dies 407 (eg, Figure 6C Two MEMS microphone dies 407 are shown).

[0050] As mentioned above Figure 5B As discussed, the sidewall 509 may include an elastomeric molding compound, and the outer surface 509a of the sidewall 509 may subsequently be plated with a conductive material (e.g., copper) to form electrical contact pads (also referred to as package input / output (I / O) pads) that provide power and signal connections for the MEMS microphone package 600 and are electrically coupled to one or more metal lines and / or vias 507 disposed in the substrate body 503. Fig.6D As shown, Figure 6B Each singulated MEMS microphone package 600 can be picked up from carrier 539 and repositioned onto carrier 539' such that a first outer surface 509a1 of sidewall 509 of each singulated MEMS microphone package 600 is in contact (e.g., physically in contact) with and attached to carrier 539', while a second outer surface 509a2 of sidewall 509 faces upward and is directed away from carrier 539'. For simplicity, Fig.6D Only one MEMS microphone package 600 is shown.

[0051] like Fig. 6E As shown, a plating and etching process known in the art may be performed on the second outer surface 509a2 of the sidewall 509, so that an electrical contact pad 543 (also referred to as a package input / output (I / O) pad) and a trace 545 are formed at the second outer surface 509a2 of the sidewall 509. The trace 545 is electrically and / or physically coupled to the electrical contact pad 543, and the trace 545 has a terminal portion 545a formed at a surface 513a of the substrate 513 adjacent to the second outer surface 509a2 of the sidewall 509. Fig. 6E As shown, trace 545 also extends into at least a portion of substrate 513 to electrically couple electrical contact pad 543 and one or more metal lines and / or vias 507 to each other. In some embodiments, the angle between the portion of trace 545 extending into substrate 513 and the portion of trace 545 disposed at surface 513a of substrate 513 may be approximately 90 degrees. Subsequently, each singulated MEMS microphone package 600 may be removed from carrier 539'.

[0052] Fig. 7A Schematically illustrates the use of FIG. 4A to FIG. 4C , FIG. 5A to FIG. 5F as well as FIG. 6A to FIG. 6E The process shown results in a top isometric view of an assembled MEMS microphone package 600 . Figure 7B Schematically shows Fig. 7A A bottom isometric view of the MEMS microphone package 600 is shown, and the electrical contact pads 543 and traces 545 formed at the bottom surface of the MEMS microphone package 600 are shown in greater detail. Figure 7C Schematically shows Fig. 7A A cross-sectional view of the MEMS microphone package taken along line DD. FIG. 7A to FIG. 7CThe MEMS microphone package 600 includes a single MEMS microphone having a single acoustic input port 405 and a cover 401 located at a first side L1 (e.g., a sidewall) of the MEMS microphone package 600. A second side L2 (opposite to the first side L1) of the MEMS microphone package 600 may be formed by an exposed surface of the substrate 513. A third side L3 and a fourth side L4 of the MEMS microphone package 600 may be formed by a molding compound of the sidewall 509. Thus, Fig. 7A and Figure 7B The illustrated MEMS microphone package 600 forms a single MEMS microphone having a side port located on one side (eg, side L1 ) of the package 600 . In other words, Fig. 7A and Figure 7B The MEMS microphone package 600 shown forms a single silicon microphone having one sound port located at one side wall of the package 600. Fig. 7A As shown, the MEMS microphone package 600 may have a first dimension D1 (e.g., thickness) of about 2 mm, a second dimension D2 (e.g., depth) of about 1 mm, and a third dimension D3 (e.g., width) of about 2 mm, thereby forming a compact package pin size (e.g., Figure 1A and Figure 2A ). As such, the assembled MEMS microphone package 600 (and method of manufacturing the same) achieves the following advantages: (1) being compact in size (e.g., having a smaller package pin size); (2) having a standard BOM while being easily configured as a top port MEMS microphone package, a bottom port MEMS microphone package, or a side port MEMS microphone package; and (3) being sensitive to acoustic waves traveling transversely (laterally) to the MEMS microphone package without using additional features (e.g., sound guiding).

[0053] As mentioned above, it is possible to Figure 6B The single process is adjusted or modified to make Fig. 6A The structure is singulated to form individual packages 602 (eg, Figure 6C 4 ), each MEMS microphone package 602 includes a plurality of MEMS microphone dies 407 (eg, Figure 6C Two MEMS microphone dies 407 in the example. Fig. 8A and Figure 8B An example of this is shown, where Fig. 8A schematically illustrates a top isometric view of an assembled MEMS microphone package 800 having two microphones, and Figure 8B Schematically shows Fig. 8A A bottom isometric view of MEMS microphone package 800 is shown. Figure 8BElectrical contact pads 543 and traces 545 formed at the bottom surface of MEMS microphone package 800 are also shown in greater detail.

[0054] Fig. 8A and Figure 8B The MEMS microphone package 800 includes two MEMS microphones and two acoustic input ports 405 located at the first side L1 of the MEMS microphone package 800. The third side L3 and the fourth side L4 of the MEMS microphone package 800 may be formed by the molding compound of the sidewall 509. The second side L2 (opposite to the first side L1) of the MEMS microphone package 800 may be formed by the exposed surface of the substrate 513 (it should be noted that the surface of the substrate 513 is not formed along the side L2). Fig. 8A The cross-sectional view of the EE line looks similar to Figure 7C similar). Therefore, Fig. 8A and Figure 8B The MEMS microphone package 800 shown forms a microphone array having two MEMS microphones and two side ports located on one side (eg, side L1) of the package 800. In other words, Fig. 8A and Figure 8B The MEMS microphone package 800 shown forms a microphone array (package level rather than board level) having two sound ports located at one side wall of the microphone package 800. Fig. 8A As shown, the MEMS microphone package 800 may have a first dimension D1 (e.g., thickness) of about 2 mm, a second dimension D2 (e.g., depth) of about 1 mm, and a third dimension D3 (e.g., width) of about 4 mm, thereby forming a compact microphone array pin size (e.g., similar to Figure 3 ). Thus, the assembled MEMS microphone package 800 (and its method of manufacturing) achieves the following advantages: (1) compact size (e.g., having a smaller package pin size); (2) having a standard BOM while being easily configured as a top port MEMS microphone package, a bottom port MEMS microphone package, or a side port MEMS microphone package; (3) being modular in design so that it can be easily combined with other similar MEMS microphone packages at the package level to form a compact microphone array suitable for mobile applications; and (4) being sensitive to sound waves traveling transversely (laterally) to the MEMS microphone package without using additional features (e.g., sound guiding).

[0055] like 9A to 9E As shown, Fig. 7A and Figure 7B A single MEMS microphone package 600 may be combined with another MEMS microphone package 600 to form a double-sided sound port microphone array. Fig.9A and 9BSchematically illustrates a top isometric view of a MEMS microphone package 900 having two microphones; Fig. 9C and Fig.9D Schematically shows Fig.9A and Fig. 9B A bottom isometric view of the MEMS microphone package 900 is shown. Fig.9E Shown through Fig.9A The cross-sectional view of the MEMS microphone package 900 is taken along the FF line. Fig.9E As shown, the MEMS microphone package 900 can be formed by bonding the substrates 513 of two MEMS microphone packages 600 to each other (eg, by an adhesive), thereby forming a double-sided sound port microphone array. In other words, 9A to 9E The resulting microphone array is shown to have a stereo configuration.

[0056] 9A to 9E The MEMS microphone package 900 includes a MEMS microphone and an acoustic input port 405 located at each of the first side L1 and the second side L2 of the MEMS microphone package 900. The third side L3 and the fourth side L4 of the MEMS microphone package 800 may be formed by the molding material of the sidewall 509. Thus, 9A to 9E The illustrated MEMS microphone package 900 forms a microphone array having a first MEMS microphone and a side port 901 positioned opposite a second MEMS microphone and a side port 903. In other words, 9A to 9E The MEMS microphone package 900 shown forms a microphone array (package level rather than board level) having two sound ports 405 located on opposite sides of the package 900. Fig.9A As shown, the MEMS microphone package 900 may have a first dimension D1 (e.g., thickness) of about 2 mm, a second dimension D2 (e.g., depth) of about 2.5 mm, and a third dimension D3 (e.g., width) of about 2 mm, thereby obtaining a compact microphone array pin size (e.g., Figure 3 ). Thus, the assembled MEMS microphone package 900 (and its method of manufacturing) achieves the following advantages: (1) compact size (e.g., having a smaller package pin size); (2) having a standard BOM while being easily configured as a top port MEMS microphone package, a bottom port MEMS microphone package, or a side port MEMS microphone package; (3) being modular in design so that it can be easily combined with other similar MEMS microphone packages at the package level to form a compact microphone array suitable for mobile applications; and (4) being sensitive to sound waves traveling transversely (laterally) to the MEMS microphone package without using additional features (e.g., sound guiding).

[0057] like FIG. 10A to FIG. 10E As shown, Fig. 8A and Figure 8B The illustrated MEMS microphone array 800 may be combined with another MEMS microphone package 800 to form a double-sided sound port microphone array. Fig. 10A and Fig. 10B Schematically illustrates a top isometric view of a MEMS microphone package 1000 having four microphones; Fig. 10C and Fig. 10D The schematic diagrams show Fig. 10A and Fig. 10B The bottom isometric view of the MEMS microphone package 1000 is shown. Fig. 10E Shown through Fig. 10A The cross-sectional view of the MEMS microphone package 1000 is taken along the GG line. Fig. 10E As shown, the MEMS microphone package 1000 can be formed by bonding the substrates 513 of two MEMS microphone packages 800 to each other (eg, by an adhesive), thereby forming a double-sided sound port microphone array. In other words, FIG. 10A to FIG. 10E The resulting microphone array is shown to have a stereo configuration.

[0058] FIG. 10A to FIG. 10E The MEMS microphone package 1000 includes two MEMS microphones and two acoustic input ports 405 located at each of the first side L1 and the second side L2 of the MEMS microphone package 1000. The third side L3 and the fourth side L4 of the MEMS microphone package 1000 may be formed by the molding material of the sidewall 509. Thus, FIG. 10A to FIG. 10E The MEMS microphone package 1000 shown forms a microphone array having a first MEMS microphone array 1001 positioned opposite to a second MEMS microphone array 1002. In other words, FIG. 10A to FIG. 10E The MEMS microphone package 1000 shown forms a microphone array (package level rather than board level) having two sound ports 405 located at one side of the package 1000 and another two sound ports 405 located at the opposite side of the package 1000. Fig. 10A As shown, the MEMS microphone package 1000 may have a first dimension D1 (e.g., thickness) of about 2 mm, a second dimension D2 (e.g., depth) of about 2.5 mm, and a third dimension D3 (e.g., width) of about 4 mm, thereby obtaining a compact microphone array pin size (e.g., Figure 3). Thus, the assembled MEMS microphone package 1000 (and its method of manufacturing) achieves the following advantages: (1) compact size (e.g., having a small package pin size); (2) having a standard BOM while being easily configured as a top port MEMS microphone package, a bottom port MEMS microphone package, or a side port MEMS microphone package; (3) being modular in design so that it can be easily combined with other similar MEMS microphone packages at the package level to form a compact microphone array suitable for mobile applications; and (4) being sensitive to sound waves traveling transversely (laterally) to the MEMS microphone package without using additional features (e.g., sound guiding).

[0059] In summary, a package and method for manufacturing the same are provided. The proposed method results in a MEMS microphone package that is: compact in size (e.g., having a small package pin size); has a standard BOM while being easily configurable as a top-port MEMS microphone package, a bottom-port MEMS microphone package, or a side-port MEMS microphone package; is modular in design so that it can be easily combined with other similar MEMS microphone packages at the package level to form a compact microphone array that can be suitable for mobile applications; and is sensitive to sound waves traveling transversely (laterally) to the MEMS microphone package without using additional features (e.g., sound guiding).

[0060] In the above-described embodiment, the lid or lids of the assembled MEMS microphone package are formed by a frame 401, which can be envisioned as a flat metal material attached or fixed to the sidewalls 509, which include packaging materials such as molding compounds, stop pads, oxides or sealing layers. However, the proposed assembled MEMS microphone package can also be formed by a metal cap. Fig.11 A cross-sectional view of an assembled MEMS microphone package 700 including a metal cap 701 is shown according to one embodiment. Fig.11 The example of FIG. 700 shows that the metal cap 701 is encapsulated by the molding material 703. The surface 703a of the molding material 703 forms the upper surface of the MEMS microphone package 700, and the opposite surface 703b of the molding material 703 forms the lower surface of the MEMS microphone package 700. Fig. 6E The method described (e.g., electroplating process) forms an electrical contact pad 543 and a trace 545 at the lower surface 703b of the MEMS microphone package 700. The metal cap 701 can be coupled (e.g., electrically and / or physically attached to) to the contact pad 705 provided on the substrate 513. The contact pad 705 can be electrically coupled to the trace 545 and / or the metal line 507 through the through hole 707. Therefore, a ground connection can be provided to the metal cap 701 through the electrical contact pad 543 and the trace 545. Fig.11 The MEMS microphone package 700 may be used to form Fig. 7A , Figure 7B , Fig. 8A , Figure 8B , 9A to 9D as well as FIG. 10A to FIG. 10D The MEMS microphone package / array shown.

[0061] An embodiment device includes: a first sidewall, comprising a first opening extending through the first sidewall; a first sensor attached to an inner surface of the first sidewall, wherein the first sensor is aligned to at least partially cover the first opening; a second sidewall, opposite the first sidewall; a third sidewall, attaching the first sidewall to the second sidewall; and a first contact pad disposed on an outer surface of the third sidewall, wherein the first contact pad is configured to provide at least one of a power connection or a signal connection for the first sensor.

[0062] An embodiment of a MEMS microphone package includes: a first cover forming a first side wall of the MEMS microphone package, the first cover including a first acoustic input port extending through the first cover; a first MEMS microphone die attached to an inner surface of the first cover, wherein the first MEMS microphone die is aligned to at least partially cover the first acoustic input port; a second side wall opposite the first cover; a molding compound forming a third side wall and attaching the first cover to the second side wall; and a first input / output (I / O) pad disposed on an outer surface of the molding compound, wherein the first I / O pad is configured to provide at least one of a power connection or a signal connection for the first MEMS microphone die.

[0063] An embodiment method includes: attaching a first side of a sensor to a first side of a cover, the sensor having a contact pad disposed on a second side of the sensor opposite to the first side; providing an interconnect on the contact pad, wherein a first end of the interconnect is attached to the contact pad and the interconnect extends away from the contact pad; attaching a control chip to a first side of a substrate, and electrically connecting the control chip to a first platform pad disposed at the first side of the substrate, the substrate further comprising a second platform pad disposed at the first side of the substrate and an interconnect structure disposed in a substrate body and electrically coupled to the second platform pad; adhering the cover over the substrate, wherein an inner cavity defined by a molding compound is formed by adhering between the cover and the substrate, and the adhering is such that a second end of the interconnect (opposite to the first end of the interconnect) is attached to the second platform pad; and forming an external contact pad and a trace on an exposed surface of the molding compound, wherein a first end of the trace is coupled to the external contact pad, and a second end of the trace is coupled to the interconnect structure.

[0064] Although the present invention has been described with reference to illustrative embodiments, this description is not intended to be limiting. Those skilled in the art will understand various modifications and combinations of the illustrative embodiments and other embodiments of the present invention after reference to the description. Therefore, the appended claims include any such modifications or embodiments.

Claims

1. A micro-electromechanical system (MEMS) sensor device, comprising: a first sidewall comprising a first opening extending through the first sidewall; a first sensor attached to an inner surface of the first sidewall, wherein the first sensor is aligned to at least partially cover the first opening, the first sensor having contact pads disposed on a side of the first sensor opposite another side of the first sensor attached to the first sidewall; a second side wall, opposite to the first side wall; a third sidewall having a first thickness, attaching the first sidewall to the second sidewall at first ends of the first sidewall and the second sidewall; a first contact pad disposed on an outer surface of the third sidewall, wherein the first contact pad is configured to provide at least one of a power connection or a signal connection for the first sensor; as well as a fourth sidewall having a second thickness, attaching the first sidewall to the second sidewall at second ends of the first sidewall and the second sidewall, wherein the first thickness is greater than the second thickness, and wherein the first sidewall and the second sidewall are substantially perpendicular to the third sidewall and the fourth sidewall, wherein an interconnect is provided on the contact pad of the first sensor, wherein a first end of the interconnect is attached to the contact pad of the first sensor, wherein the interconnect is formed as a wire that is cut to form a second end of the interconnect, wherein the second end of the interconnect is opposite the first end of the interconnect and the second end is flush, and wherein the interconnect extends away from the contact pad of the first sensor, The second sidewall includes a platform pad disposed at a side of the second sidewall facing the first sensor, and the second end of the interconnect is attached to the platform pad. 2 . The apparatus of claim 1 , wherein the first sensor comprises a first micro-electromechanical system (MEMS) microphone die.

3. The device according to claim 1, further comprising: A cover is formed for the first side wall. 4 . The device of claim 3 , wherein the cover comprises a conductive material and provides electromagnetic interference (EMI) shielding for the first sensor.

5. The apparatus of claim 1, further comprising a substrate, wherein the substrate comprises an interconnect structure disposed with a body of the substrate.

6. The device of claim 5 , further comprising a trace disposed on the outer surface of the third sidewall and electrically coupling the interconnect structure and the first contact pad to each other, wherein a first end of the trace is coupled to the first contact pad, and a second end of the trace is coupled to the interconnect structure.

7. The apparatus of claim 6, wherein a first portion of the trace is disposed on the outer surface of the third sidewall, wherein a second portion of the trace extends through the substrate, and wherein the first portion of the trace is perpendicular to the second portion of the trace.

8. The apparatus of claim 5, wherein the substrate forms the second sidewall.

9. The device of claim 1, further comprising a second opening and a second sensor aligned to at least partially cover the second opening.

10. The apparatus of claim 9, wherein the second opening extends through the first sidewall adjacent to the first opening, and wherein the second sensor is attached to the inner surface of the first sidewall.

11. The device according to claim 10, further comprising: a third opening and a fourth opening extending through the second side wall, wherein the third opening is adjacent to the fourth opening; as well as The third sensor and the fourth sensor are aligned to at least partially cover the third opening and the fourth opening, respectively.

12. The apparatus of claim 9, wherein the second opening extends through the second sidewall and is oriented away from the first opening, and wherein the second sensor is attached to an inner surface of the second sidewall.

13. The apparatus of claim 9, further comprising a second contact pad disposed on the outer surface of the third sidewall, wherein the second contact pad is configured to provide at least one of a power connection or a signal connection for the second sensor.

14. The device according to claim 9, further comprising an inner cavity and a control chip disposed in the inner cavity, the control chip being configured to electrically communicate with the first sensor.

15. A method of manufacturing a micro-electromechanical system (MEMS) sensor device, comprising: attaching a first side of a sensor to a first side of a cover, the sensor having contact pads disposed on a second side of the sensor opposite the first side; providing an interconnect on the contact pad, wherein a first end of the interconnect is attached to the contact pad, wherein the interconnect is formed as a wire that is cut to form a second end of the interconnect, wherein the second end of the interconnect is opposite the first end of the interconnect and the second end is flush, and wherein the interconnect extends away from the contact pad; attaching a control chip to a first side of a substrate and electrically connecting the control chip to a first platform pad disposed at the first side of the substrate, the substrate further comprising a second platform pad disposed at the first side of the substrate and an interconnect structure disposed in a body of the substrate and electrically coupled to the second platform pad; adhering the cover over the substrate, wherein the adhering forms an inner cavity defined by the molding compound between the cover and the substrate, and the adhering causes a second end of the interconnect opposite the first end of the interconnect to be attached to the second platform pad; as well as forming an external contact pad and a trace on an exposed surface of the molding compound, wherein a first end of the trace is coupled to the external contact pad and a second end of the trace is coupled to the interconnect structure, The molding compound includes a first sidewall having a first thickness and a second sidewall having a second thickness smaller than the first thickness. The method of claim 15 , wherein the first end of the trace is perpendicular to the second end of the trace. 17 . The method of claim 15 , wherein forming the external contact pads and the traces on the exposed surface of the molding compound comprises an electroplating process.

18. The method of claim 15, wherein providing the interconnect comprises: A wire bonding interconnect is formed with the first end of the interconnect being a ball end.

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