Contact chip detection device and method

Abstract

The present invention discloses a contact chip detection device and method, comprising a frame and a lifting detection assembly, a probe assembly, a multi-axis chip carrier assembly, and a camera assembly, all mounted directly or indirectly on the frame. The multi-axis chip carrier assembly is used to carry the chip to be detected. The lifting detection assembly is disposed at the bottom of the multi-axis chip carrier assembly. The lifting detection assembly includes a chip detection device and can drive the chip detection device upward so that the chip detection device contacts the chip to be detected on the multi-axis chip carrier assembly. The probe assembly can open a separation gap for the camera assembly to image and mark the chip to be detected. This contact chip detection device and method have advantages not possessed by existing technologies, such as a simple structure, low implementation cost, stable and reliable performance, high detection accuracy, high detection efficiency, and time savings.

Description

Technical Field

[0001] The present invention relates to the field of chip detection, and in particular to a contact chip detection device and method. Background Art

[0002] In the field of chip detection, in existing chip detection equipment, the chip needs to be turned on first during detection. After the chip emits light, its light needs to pass through an air space or air glass and then be detected and analyzed by the chip detection device. Due to the influence of the air space or air glass, the precision and accuracy of chip detection will be reduced, and it is easily affected by the surrounding environment, resulting in poor detection effect. In addition, in existing chip detection equipment, the probe assembly is closed and cannot be opened. When the chip needs to be positioned by camera, the entire equipment needs to perform large-scale and multi-step movements to complete the entire camera marking work, which is time-consuming and costly, reducing detection efficiency. Furthermore, in existing equipment, the probe of the probe assembly needs to move to the chip contact pin and turn on the chip. In this action mode, poor contact of the contact pin is easily caused. A detection process requires the coordinated movement of multiple components, and there are many detection action steps, which further consumes a lot of time and further reduces detection efficiency. The structure of the entire equipment is also more complicated, the installation is more difficult, the implementation cost is high, and the performance stability is poor.

[0003] In view of this, the purpose of the present invention is to provide a new technical solution to solve the existing technical defects. Summary of the Invention

[0004] In order to overcome the shortcomings of the existing technology, the present invention provides a contact chip detection device and method, which solves the technical defects of the existing technology such as complex structure, poor performance stability, low detection precision and accuracy, multiple detection action working procedures, high time cost, and low detection efficiency.

[0005] The technical solution adopted by the present invention to solve its technical problem is:

[0006] A contact chip detection device includes a frame and a lifting detection component, a probe component, a multi-axis chip carrier component, and a camera component directly or indirectly mounted on the frame. The multi-axis chip carrier component is used to carry the chip to be detected. The lifting detection component is arranged at the bottom of the multi-axis chip carrier component. The lifting detection component includes a chip detection device. The lifting detection component can drive the chip detection device to rise and make the chip detection device contact the chip to be detected on the multi-axis chip carrier component.

[0007] As an improvement of the above technical solution, the jacking detection component includes a detection component mounting plate directly or indirectly fixed on the frame and a detection component horizontal guide rail and a detection component horizontal cylinder arranged on the detection component mounting plate; the detection component guide rail is provided with a detection component horizontal sliding mounting plate; the output end of the detection component horizontal cylinder is connected to the detection component horizontal sliding mounting plate and can push the detection component horizontal sliding mounting plate to slide on the detection component horizontal guide rail; the detection component horizontal sliding mounting plate is provided with a detection component vertical mounting plate; the detection component vertical guide rail, the detection component jacking screw nut pair and the detection component jacking drive motor are provided on the detection component vertical guide rail; the detection component vertical sliding mounting seat is provided with a detection component vertical guide rail; the output end of the detection component jacking drive motor is connected to one end of the screw of the detection component jacking screw nut pair; the nut of the detection component jacking screw nut pair is connected to the detection component vertical sliding mounting seat; the chip detection device is fixedly installed on the detection component vertical sliding mounting seat.

[0008] As a further improvement of the above technical solution, the chip detection device is an integrating sphere detection device, and a transparent glass cover is provided at the upper opening of the integrating sphere detection device;

[0009] The horizontal cylinder of the detection component is fixedly installed on the bottom of the detection component mounting plate through a horizontal cylinder mounting seat, and the output end of the horizontal cylinder of the detection component is fixedly connected to the horizontal sliding mounting plate of the detection component through a horizontal cylinder connecting block;

[0010] As a further improvement of the above technical solution, a horizontal sliding limit block is provided on the side of the horizontal sliding mounting plate of the detection component, a horizontal sliding limit seat used in conjunction with the horizontal sliding limit block is provided at the bottom of the detection component mounting plate, and an elastic limit rod is provided on the horizontal sliding limit seat;

[0011] As a further improvement of the above technical solution, the detection component jacking drive motor is installed at the bottom of the detection component vertical mounting plate through the jacking drive motor mounting seat, and the output end of the detection component jacking drive motor is provided with a detection component coupling and connected to one end of the screw of the detection component jacking screw nut pair through the detection component coupling;

[0012] As a further improvement of the above technical solution, a detection component lifting sensor is provided on the side wall of the detection component vertical mounting plate, and a detection component lifting induction sheet cooperating with the detection component lifting sensor is provided on the detection component vertical sliding mounting seat;

[0013] As a further improvement of the above technical solution, the horizontal sliding mounting plate of the detection component is installed on the horizontal guide rail of the detection component through the horizontal slide of the detection component, and the vertical sliding mounting base of the detection component is installed on the vertical guide rail of the detection component through the vertical slide of the detection component;

[0014] As a further improvement of the above technical solution, a detection component side reinforcement plate is provided on the side of the vertical mounting plate of the detection component.

[0015] As a further improvement of the above technical solution, the probe assembly includes a probe assembly mounting base plate directly or indirectly mounted on the frame, an opening and closing sliding guide rail is provided on the probe assembly mounting base plate, a first probe sliding mounting plate and a second probe sliding mounting plate are provided on the opening and closing sliding guide rail, at least one first probe module is provided on the first probe sliding mounting plate, and a second probe module matching the number of the first probe modules is provided on the second probe sliding mounting plate, and a first opening and closing driving cylinder and a second opening and closing driving cylinder are also provided on the probe assembly mounting base plate, the output end of the first opening and closing driving cylinder is connected to the first probe sliding mounting plate and can drive the first probe sliding mounting plate to slide on the opening and closing sliding guide rail, and the output end of the second opening and closing driving cylinder is connected to the second probe sliding mounting plate and can drive the second probe sliding mounting plate to slide on the opening and closing sliding guide rail.

[0016] As a further improvement of the above technical solution, the probe assembly mounting base has a mounting recess, and the opening and closing sliding guide rail, the first probe sliding mounting plate, the second probe sliding mounting plate and the first opening and closing driving cylinder and the second opening and closing driving cylinder are all arranged in the mounting recess;

[0017] As a further improvement of the above technical solution, the said opening and closing sliding guide rails have two, and the first probe sliding mounting plate and the second probe sliding mounting plate are both arranged across the two opening and closing sliding guide rails through an opening and closing sliding guide rail seat;

[0018] As a further improvement of the above technical solution, one end of the first probe sliding mounting plate and one end of the second probe sliding mounting plate are respectively fixedly provided with a first sliding mounting plate connecting block and a second sliding mounting plate connecting block, the output end of the first opening and closing driving cylinder is connected to the first sliding mounting plate connecting block through a first cylinder joint, and the output end of the second opening and closing driving cylinder is connected to the second sliding mounting plate connecting block through a second cylinder joint, the first opening and closing driving cylinder can drive the first probe sliding mounting plate to slide on the opening and closing sliding guide rail through the first cylinder joint and the first sliding mounting plate connecting block, and the second opening and closing driving cylinder can drive the second probe sliding mounting plate to slide on the opening and closing sliding guide rail through the second cylinder joint and the second sliding mounting plate connecting block;

[0019] As a further improvement of the above technical solution, the first probe sliding mounting plate and the second probe sliding mounting plate are provided with probe sliding mounting plate notches for the probes of the first probe module and the second probe module to pass through, and the probe assembly mounting base plate is provided with a base plate notch that matches the notch of the probe sliding mounting plate;

[0020] As a further improvement of the above technical solution, the first probe sliding mounting plate is provided with a first semicircular notch on a side close to the second probe sliding mounting plate, and the second probe sliding mounting plate is provided with a second semicircular notch on a side close to the first probe sliding mounting plate. After the first probe sliding mounting plate and the second probe sliding mounting plate are close to and closed, the first semicircular notch and the second semicircular notch together constitute a circular notch of the probe sliding mounting plate, the center of the circular notch of the probe sliding mounting plate is located at the closed line of the first probe sliding mounting plate and the second probe sliding mounting plate, the first probe module is evenly distributed around the first semicircular notch, and the second probe module is evenly distributed around the second semicircular notch, and a bottom plate circular notch is provided on the probe assembly mounting bottom plate, the position of which matches the circular notch of the probe sliding mounting plate, and the size of the bottom plate circular notch is greater than or equal to the size of the circular notch of the probe sliding mounting plate;

[0021] As a further improvement of the above technical solution, the first probe module includes a probe mounting base plate installed on a first probe sliding mounting plate, a probe X-axis linear bearing is provided on the probe mounting base plate, a probe Y-axis linear bearing is provided on the probe X-axis linear bearing, a probe intermediate mounting plate is provided on the Y-axis linear bearing, a probe Z-axis linear bearing is provided on the side of the probe intermediate mounting plate, a probe Z-axis linear bearing is provided on the side of the probe Z-axis linear bearing, and a chip probe is provided on the probe mounting plate; the probe X-axis linear bearing, the probe Y-axis linear bearing and the probe Z-axis linear bearing are respectively provided with a probe X-axis adjustment button, a probe Y-axis adjustment button and a probe Z-axis adjustment button, and the structure of the second probe module is the same as that of the first probe module.

[0022] As a further improvement of the above technical solution, the multi-axis chip carrier assembly includes a carrier assembly base plate directly or indirectly fixed on the frame and a carrier X-axis module arranged on the carrier assembly base plate, the output end of the carrier X-axis module is provided with a carrier Y-axis module that can move along the X-axis direction, and the output end of the carrier Y-axis module is provided with a rotating carrier disk module that can move along the Y-axis direction, and the chip product to be tested is carried on the rotating carrier disk module.

[0023] As a further improvement of the above technical solution, the rotating carrier plate module includes a carrier plate frame, a rotating bearing is provided at the center of the carrier plate frame, a rotating carrier plate is provided on the movable ring of the rotating bearing, and a carrier plate rotation drive device is further provided on the carrier plate frame, and the carrier plate rotation drive device can drive the rotating carrier plate to rotate and further drive the chip to be detected on the rotating carrier plate to rotate;

[0024] As a further improvement of the above technical solution, the carrier disk rotation drive device includes a rotation drive motor, a first synchronous pulley and a second synchronous pulley fixedly mounted on the carrier disk frame, an output end of the rotation drive motor is provided with a driving synchronous pulley, a rotation drive synchronous belt is wound between the driving synchronous pulley and the first synchronous pulley and the second synchronous pulley, a portion of the outer wall surface of the rotation drive synchronous belt located between the first synchronous pulley and the second synchronous pulley is in direct or indirect friction contact with the outer wall surface of the rotating carrier disk, and the rotation drive motor can drive the rotating carrier disk to rotate through the driving synchronous pulley, the first synchronous pulley, the second synchronous pulley and the rotation drive synchronous belt;

[0025] As a further improvement to the above technical solution, the carrier plate frame is provided with a synchronous belt guide wheel for guiding the rotation drive synchronous belt, and the synchronous belt guide wheel is mounted on the carrier plate frame through a guide wheel mounting seat; the carrier plate frame is provided with a rotation sensor, and a rotation sensing piece cooperating with the rotation sensor is directly or indirectly fixedly mounted on the side of the rotating carrier plate; the carrier plate frame includes a frame bottom shell and a frame upper shell;

[0026] As a further improvement of the above technical solution, the bearing X-axis module includes an X-axis guide rail, an X-axis drive motor and an X-axis screw nut pair fixedly mounted on the base plate of the bearing assembly, an X-axis sliding mounting plate is provided on the X-axis guide rail, the output end of the X-axis drive motor is connected to one end of the screw of the X-axis screw nut pair through an X-axis coupling, and the nut of the X-axis screw nut pair is connected to the X-axis sliding mounting plate and can drive the X-axis sliding mounting plate to slide on the X-axis guide rail;

[0027] As a further improvement of the above technical solution, the X-axis sliding mounting plate is mounted on the X-axis guide rail through the X-axis guide rail slide, the X-axis drive motor is mounted on the base plate of the bearing assembly through the X-axis motor mounting seat, and the X-axis screw nut pair is mounted on the base plate of the bearing assembly through the X-axis screw nut pair mounting seat;

[0028] As a further improvement of the above technical solution, the bearing Y-axis module includes a Y-axis guide rail, a Y-axis drive motor and a Y-axis screw nut pair fixedly mounted on the output end of the bearing X-axis module, the rotating bearing plate module is arranged on the Y-axis guide rail, the output end of the Y-axis drive motor is connected to one end of the screw of the Y-axis screw nut pair through a Y-axis coupling, and the nut of the Y-axis screw nut pair is connected to the rotating bearing plate module and can drive the rotating bearing plate module to slide on the Y-axis guide rail;

[0029] As a further improvement of the above technical solution, the rotating carrier plate module is installed on the Y-axis guide rail through the Y-axis guide rail slide, the Y-axis drive motor is installed on the output end of the carrier X-axis module through the Y-axis motor mounting seat, and the Y-axis screw nut pair is installed on the output end of the carrier X-axis module through the Y-axis screw nut pair mounting seat.

[0030] As a further improvement of the above technical solution, the camera assembly includes a camera assembly bottom adjustment guide rail directly or indirectly fixed on the frame and a camera assembly sliding mounting seat installed on the camera assembly bottom adjustment guide rail, the camera assembly sliding mounting seat is provided with a camera assembly vertical mounting plate, and a camera assembly vertical guide rail and a camera assembly linear bearing are respectively provided on both sides of the camera assembly vertical mounting plate, the camera assembly vertical guide rail is provided with a camera assembly vertical sliding mounting seat, and the camera module is fixedly provided with a camera module on the camera assembly linear bearing, the camera module includes a CCD camera, and the lower end of the camera module is fixedly connected to the camera assembly vertical sliding mounting seat, and the camera assembly lifting drive cylinder is directly or indirectly installed on the camera assembly sliding mounting seat, and the output end of the camera assembly lifting drive cylinder is connected to the camera assembly vertical sliding mounting seat and can drive the camera assembly vertical sliding mounting seat to slide on the camera assembly vertical guide rail and further drive the camera module to slide on the camera assembly linear bearing.

[0031] As a further improvement of the above technical solution, a lifting and fine-tuning device is provided on the vertical mounting plate of the camera assembly, the output end of the lifting and fine-tuning device is directly or indirectly fixedly connected to the camera module, and the lifting and fine-tuning device is fixedly mounted on the vertical mounting plate of the camera assembly through a fine-tuning device mounting seat;

[0032] The camera module also includes a camera light source, which is arranged at the bottom of the CCD camera;

[0033] As a further improvement of the above technical solution, a camera module connecting plate is provided at the bottom of the vertical sliding mounting seat of the camera assembly, a through hole is opened in the middle of the camera module connecting plate, the CCD camera of the camera module passes through the through hole of the camera module connecting plate, the lower part of the camera module is fixedly connected to the camera module connecting plate, and a side reinforcing connecting plate is provided between the camera module connecting plate and the vertical sliding mounting seat of the camera assembly;

[0034] As a further improvement of the above technical solution, the camera assembly vertical sliding mounting seat is mounted on the camera assembly vertical guide rail through the camera assembly vertical guide rail seat, and the output end of the camera assembly lifting drive cylinder is fixedly connected to the camera assembly vertical sliding mounting seat through the camera assembly cylinder connecting block and can drive the camera assembly vertical sliding mounting seat to slide on the camera assembly vertical guide rail;

[0035] As a further improvement of the above technical solution, the camera assembly sliding mounting seat is an inverted L-shaped mounting seat, and a bottom slide plate is fixedly provided at the bottom of the camera assembly sliding mounting seat, and the bottom slide plate is installed on the bottom adjustment rail of the camera assembly through the bottom adjustment rail seat of the camera assembly;

[0036] As a further improvement of the above technical solution, a bottom limit block of the camera assembly is provided at the end of the bottom adjustment rail of the camera assembly, and a mounting seat locking limit plate is provided on the side of the bottom adjustment rail of the camera assembly, and a locking long groove is provided on the mounting seat locking limit plate.

[0037] A contact chip detection method, the method comprising:

[0038] A multi-axis chip carrying assembly is used to carry the chip to be tested and move the chip to be tested to a preset position; a camera assembly is used to complete the camera marking of the chip to be tested and record the marking information; a lifting detection assembly is used to move to the bottom of the chip to be tested and lift the chip detection device. After being lifted, the chip detection device directly contacts the bottom of the chip to be tested and drives the chip to be tested to move slightly upward. After the chip to be tested moves slightly upward, its two electrodes contact the probes of the probe assembly and are electrically connected. The connected chip to be tested emits light and is detected by the chip detection device in contact with the chip to be tested.

[0039] The beneficial effects of the present invention are as follows: the present invention provides a contact chip detection device and method, the contact chip detection device is provided with a lifting detection component, a probe component, a multi-axis chip supporting component, and a camera component, and the lifting detection component can drive the chip detection device to directly contact the chip to be detected, thereby eliminating the spacing space or spacing glass between the chip detection device and the chip to be detected, which can greatly improve the accuracy of the detection, reduce the impact of the surrounding environment on the detection, and achieve better detection results; in addition, the probe component can open a space for the camera component to photograph the chip to be detected, so that the camera component can quickly complete the photographing of the chip to be detected, and the entire device has fewer action steps, which improves the detection efficiency, saves time and cost, reduces the structural complexity of the device, reduces the implementation cost, and has higher stability and more convenient later maintenance.

[0040] In summary, this contact chip detection equipment and method solves the technical defects of the existing technology, such as complex structure, poor performance stability, low detection precision and accuracy, multiple detection action working procedures, high time cost, and low detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The present invention will be further described below with reference to the accompanying drawings and examples.

[0042] Figure 1 It is an assembly diagram of the present invention;

[0043] Figure 2 It is another assembly schematic diagram of the present invention;

[0044] Figure 3 It is a third assembly schematic diagram of the present invention;

[0045] Figure 4 It is a schematic diagram of the assembly of the jacking detection component in the present invention;

[0046] Figure 5 This is a schematic diagram of the assembly of the jacking detection component of the present invention from another angle;

[0047] Figure 6 This is a schematic diagram of the assembly of the jacking detection assembly at the third angle in the present invention;

[0048] Figure 7 This is a schematic diagram of the assembly of the jacking detection assembly at the fourth angle of the present invention;

[0049] Figure 8 It is a schematic diagram of the assembly of the probe assembly of the present invention;

[0050] Figure 9 This is a schematic diagram of the assembly of the probe assembly of the present invention after the probe assembly mounting base is removed;

[0051] Figure 10 This is another assembly diagram of the probe assembly of the present invention after the probe assembly mounting base is removed;

[0052] Figure 11 This is a schematic diagram of the assembly of the first probe module of the present invention;

[0053] Figure 12 It is a schematic diagram of the assembly of the multi-axis chip carrier assembly of the present invention;

[0054] Figure 13 This is a schematic diagram of the assembly of the X-axis bearing module and the Y-axis bearing module in the present invention;

[0055] Figure 14 This is a schematic diagram of the assembly of the rotating carrier plate module of the present invention;

[0056] Figure 15 This is a schematic diagram of the internal structure of the rotating carrier plate module of the present invention;

[0057] Figure 16 It is a schematic diagram of the assembly of the camera assembly in the present invention;

[0058] Figure 17 This is another assembly diagram of the camera assembly in the present invention;

[0059] Figure 18 This is the third assembly diagram of the camera assembly in the present invention;

[0060] Figure 19 This is the fourth assembly diagram of the camera assembly in the present invention. DETAILED DESCRIPTION

[0061] The following will clearly and completely describe the concept, specific structure and technical effects of the present invention in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention. In addition, all the connection / connection relationships involved in the patent do not refer to the direct connection of components, but refer to the fact that a better connection structure can be formed by adding or reducing connection accessories according to the specific implementation situation. The various technical features in the invention can be combined interchangeably without conflicting with each other; refer to Figure 1-19 .

[0062] Specific reference Figure 1-3A contact chip detection device includes a frame 1 and a lifting detection component 2, a probe component 3, a multi-axis chip carrier component 4, and a camera component 5 directly or indirectly installed on the frame 1. The multi-axis chip carrier component 4 is used to carry the chip to be detected 9. The lifting detection component 2 is arranged at the bottom of the multi-axis chip carrier component 4. The lifting detection component 2 includes a chip detection device 20. The lifting detection component 2 can drive the chip detection device 20 to rise and make the chip detection device 20 contact the chip to be detected 9 on the multi-axis chip carrier component 4.

[0063] Specific reference to Figures 4-7, the jacking detection component 2 includes a detection component mounting plate 21 directly or indirectly fixed to the frame 1 and a detection component horizontal guide rail 221 and a detection component horizontal cylinder 222 arranged on the detection component mounting plate 21. The detection component guide rail 221 is provided with a detection component horizontal sliding mounting plate 223. The output end of the detection component horizontal cylinder 222 is connected to the detection component horizontal sliding mounting plate 223 and can push the detection component horizontal sliding mounting plate 223 to slide on the detection component horizontal guide rail 221. The detection component horizontal sliding mounting plate 223 is provided with a detection component vertical mounting plate 23, and the detection component vertical mounting plate 23 is provided with a detection component. Component vertical guide rail 231, detection component jacking screw nut pair 232 and detection component jacking drive motor 233, the detection component vertical guide rail 231 is provided with a detection component vertical sliding mounting seat 234, the output end of the detection component jacking drive motor 233 is connected to one end of the screw of the detection component jacking screw nut pair 232, the nut of the detection component jacking screw nut pair 232 is connected to the detection component vertical sliding mounting seat 234, the detection component vertical sliding mounting seat 234 is fixedly mounted with the chip detection device 20, specifically, the chip detection device 20 is an integrating sphere detection device, and a transparent glass cover 202 is provided at the upper opening of the integrating sphere detection device;

[0064] Preferably, the horizontal cylinder 222 of the detection component is fixedly mounted on the bottom of the detection component mounting plate 21 through a horizontal cylinder mounting seat 2221, and the output end of the horizontal cylinder 222 of the detection component is fixedly connected to the horizontal sliding mounting plate 223 of the detection component through a horizontal cylinder connecting block 2222; a horizontal sliding limit block 2231 is provided on the side of the horizontal sliding mounting plate 223 of the detection component, and a horizontal sliding limit seat 211 used in conjunction with the horizontal sliding limit block 2231 is provided at the bottom of the detection component mounting plate 21, and an elastic limit rod 212 is provided on the horizontal sliding limit seat 211; the jacking drive motor 233 of the detection component is mounted on the bottom of the vertical mounting plate 23 of the detection component through the jacking drive motor mounting seat 2331, and the jacking drive motor 233 of the detection component is fixedly mounted on the bottom of the vertical mounting plate 23 of the detection component. The output end is provided with a detection component coupling 236 and is connected to one end of the screw of the detection component lifting screw nut pair 232 through the detection component coupling 236; the side wall of the detection component vertical mounting plate 23 is provided with a detection component lifting sensor 2371, and the detection component vertical sliding mounting seat 234 is provided with a detection component lifting sensing piece 2372 that cooperates with the detection component lifting sensor 2371; the detection component horizontal sliding mounting plate 223 is installed on the detection component horizontal guide rail 221 through the detection component horizontal slide 2211, and the detection component vertical sliding mounting seat 234 is installed on the detection component vertical guide rail 23 through the detection component vertical slide 2311; the side of the detection component vertical mounting plate 23 is provided with a detection component side reinforcement plate 238.

[0065] During the specific implementation, the horizontal cylinder 222 of the detection component will first drive the horizontal sliding mounting plate 223 of the detection component and other components arranged on the horizontal sliding mounting plate 223 of the detection component to slide along the horizontal guide rail 221 of the detection component and slide under the preset detection position of the equipment. After reaching the position, the detection component lifting drive motor 233 drives the detection component vertical sliding mounting seat 234 to slide upward along the vertical guide rail 231 of the detection component through the detection component lifting screw nut pair 232, further making the chip detection device 20 installed on the vertical sliding mounting seat 234 of the detection component move upward. During the sliding process of the chip detection device 20, the chip detection device 20 will directly contact the detected chip 9 and press the detected chip 9 upward, thereby making the two pole feet of the detection chip 9 contact the probe in the probe assembly 3, and the detected chip 9 is turned on and illuminated. The light generated after the detected chip 9 is energized can be detected by the chip detection device 20. The chip detection device 20 is directly in contact with the chip 9 to be detected after being lifted. There is no space or glass between the chip detection device 20 and the chip, which can improve the detection precision and accuracy. The chip detection device 20 is installed on the vertical sliding mounting seat 234 of the detection component through the detection device mounting seat 201.

[0066] Specific reference Figure 8-11 The probe assembly 3 includes a probe assembly mounting base plate 31 directly or indirectly mounted on the frame 1, and an opening and closing sliding guide rail 311 is provided on the probe assembly mounting base plate 31, and a first probe sliding mounting plate 321 and a second probe sliding mounting plate 322 are provided on the opening and closing sliding guide rail 311, and at least one first probe module 33 is provided on the first probe sliding mounting plate 321, and a second probe sliding mounting plate 34 matching the number of the first probe modules 33 is provided on the second probe sliding mounting plate 322, and a first opening and closing driving cylinder 351 and a second opening and closing driving cylinder 352 are also provided on the probe assembly mounting base plate 31, the output end of the first opening and closing driving cylinder 351 is connected to the first probe sliding mounting plate 321 and can drive the first probe sliding mounting plate 321 to slide on the opening and closing sliding guide rail 311, and the output end of the second opening and closing driving cylinder 352 is connected to the second probe sliding mounting plate 322 and can drive the second probe sliding mounting plate 322 to slide on the opening and closing sliding guide rail 311.

[0067] Preferably, the probe assembly mounting base 31 has a mounting recess 312, and the opening and closing sliding guide rail 311, the first probe sliding mounting plate 321, the second probe sliding mounting plate 322 and the first opening and closing driving cylinder 351, the second opening and closing driving cylinder 352 are all arranged in the mounting recess 312; the opening and closing sliding guide rail 311 has two, and the first probe sliding mounting plate 321 and the second probe sliding mounting plate 322 are both arranged across the two opening and closing sliding guide rails 311 through an opening and closing sliding guide rail seat 3111; one end of the first probe sliding mounting plate 321 and one end of the second probe sliding mounting plate 322 are respectively fixedly provided with a first sliding mounting The output end of the first opening and closing driving cylinder 351 is connected to the first sliding mounting plate connecting block 3211 through the first cylinder joint 3511, and the output end of the second opening and closing driving cylinder 352 is connected to the second sliding mounting plate connecting block 3221 through the second cylinder joint 3521. The first opening and closing driving cylinder 351 can drive the first probe sliding mounting plate 321 to slide on the opening and closing sliding guide rail 311 through the first cylinder joint 3511 and the first sliding mounting plate connecting block 3211. The second opening and closing driving cylinder 352 can drive the first probe sliding mounting plate 321 to slide on the opening and closing sliding guide rail 311 through the second cylinder joint 3521 and the second sliding mounting plate connecting block The block 3221 drives the second probe sliding mounting plate 322 to slide on the opening and closing sliding guide rail 311; the first probe sliding mounting plate 321 and the second probe sliding mounting plate 322 are provided with probe sliding mounting plate notches for the probes of the first probe module 33 and the second probe module 34 to pass through, and the probe assembly mounting base 31 is provided with a base plate notch that matches the probe sliding mounting plate notch; the first probe sliding mounting plate 321 is provided with a first semicircular notch on its side close to the second probe sliding mounting plate 322, and the second probe sliding mounting plate 322 is provided with a second semicircular notch on its side close to the first probe sliding mounting plate 321. After the sliding mounting plate 321 and the second probe sliding mounting plate 322 are closed, the first semicircular notch and the second semicircular notch together constitute a circular notch of the probe sliding mounting plate, the center of the circular notch of the probe sliding mounting plate is located at the closed line of the first probe sliding mounting plate 321 and the second probe sliding mounting plate 322, the first probe modules 33 are evenly distributed around the first semicircular notch, and the second probe modules 34 are evenly distributed around the second semicircular notch, the probe assembly mounting base plate 31 is provided with a base plate circular notch whose position matches the circular notch of the probe sliding mounting plate, and the size of the base plate circular notch is greater than or equal to the size of the circular notch of the probe sliding mounting plate;The first probe module 33 includes a probe mounting base plate 331 mounted on a first probe sliding mounting plate 321. A probe X-axis linear bearing 332 is disposed on the probe mounting base plate 331. A probe Y-axis linear bearing 333 is disposed on the probe X-axis linear bearing 332. A probe intermediate mounting plate 334 is disposed on the Y-axis linear bearing 333. A probe Z-axis linear bearing 335 is disposed on the side of the probe intermediate mounting plate 334. A probe mounting plate 336 is disposed on the side of the probe Z-axis linear bearing 335. A chip probe 337 is disposed on the probe mounting plate 336. The probe X-axis linear bearing 332, the probe Y-axis linear bearing 333, and the probe Z-axis linear bearing 335 are respectively provided with a probe X-axis adjustment button 3321, a probe Y-axis adjustment button 3331, and a probe Z-axis adjustment button 3351. The structure of the second probe module 34 is the same as that of the first probe module 33.

[0068] In specific implementation, after the chip 9 to be tested is moved into position by the multi-axis chip carrier assembly 4, the first opening and closing driving cylinder 351 and the second opening and closing driving cylinder 352 respectively drive the first probe sliding mounting plate 321 and the second probe sliding mounting plate 322 to slide in opposite directions. There is an area for the camera to take pictures between the first probe sliding mounting plate 321 and the second probe sliding mounting plate 322. The CCD camera 571 in the camera assembly 5 corresponding to the device can use the area to take pictures and mark the chip located at the bottom of the probe assembly mounting base 31. The area of ​​the picture mark is large, which can greatly save time and improve the detection efficiency, and the operation is more convenient. After the chip 9 to be tested is marked by the camera, the first opening and closing driving cylinder 351 and the second opening and closing driving cylinder 352 respectively drive the first probe sliding mounting plate 321 and the second probe sliding mounting plate 322 to slide toward each other and close the first probe sliding mounting plate 321 and the second probe sliding mounting plate 322 to facilitate the next step of chip detection. The entire operation is simple and the application experience is better.

[0069] Specific reference Figure 12-15 The multi-axis chip carrier component 4 includes a carrier component base plate 41 directly or indirectly fixed on the frame 1 and a carrier X-axis module 42 arranged on the carrier component base plate 41. The output end of the carrier X-axis module 42 is provided with a carrier Y-axis module 43 that can move along the X-axis direction, and the output end of the carrier Y-axis module 43 is provided with a rotating carrier disk module 44 that can move along the Y-axis direction. The chip product to be tested is carried on the rotating carrier disk module 44.

[0070] Preferably, the rotating carrier plate module 44 includes a carrier plate frame 441, a rotating bearing is provided at the center of the carrier plate frame 441, a rotating carrier plate 442 is provided on the movable ring of the rotating bearing, and a carrier plate rotation driving device is also provided on the carrier plate frame 441, and the carrier plate rotation driving device can drive the rotating carrier plate 442 to rotate and further drive the chip to be detected on the rotating carrier plate 442 to rotate; the carrier plate rotation driving device includes a rotating driving motor 443 fixedly mounted on the carrier plate frame 441, a first synchronous pulley 444 and a second synchronous pulley 445, and the rotating driving motor The output end of the machine 443 is provided with an active synchronous pulley, and a rotation driving synchronous belt 446 is wound between the active synchronous pulley and the first synchronous pulley 444 and the second synchronous pulley 445. The outer wall surface of the rotation driving synchronous belt 446 located between the first synchronous pulley 444 and the second synchronous pulley 445 is in direct or indirect friction contact with the outer wall surface of the rotating carrier disk 442. The rotation driving motor 443 can drive the rotating carrier disk 442 to rotate through the active synchronous pulley, the first synchronous pulley 444, the second synchronous pulley 445 and the rotation driving synchronous belt 446; the carrier disk frame 441 is provided with a guide for guiding the rotation driving synchronous belt The synchronous belt guide wheel 447 of 446 is installed on the carrier plate frame 441 through the guide wheel mounting seat 448; the carrier plate frame 441 is provided with a rotation sensor 4491, and the side of the rotating carrier plate 442 is directly or indirectly fixedly mounted with a rotation sensing piece 4492 that cooperates with the rotation sensor 4491; the carrier plate frame 441 includes a frame bottom shell and a frame upper shell; the bearing X-axis module 42 includes an X-axis guide rail 421, an X-axis drive motor 422 and an X-axis screw nut pair 423 fixedly mounted on the bearing component bottom plate 41, and an X-axis sliding mounting plate is provided on the X-axis guide rail 421 424, the output end of the X-axis drive motor 422 is connected to one end of the screw of the X-axis screw nut pair 423 through the X-axis coupling 425, and the nut of the X-axis screw nut pair 423 is connected to the X-axis sliding mounting plate 424 and can drive the X-axis sliding mounting plate 424 to slide on the X-axis guide rail 421; the X-axis sliding mounting plate 424 is installed on the X-axis guide rail 421 through the X-axis guide rail slide 4211, the X-axis drive motor 422 is installed on the bearing assembly base 41 through the X-axis motor mounting seat 4221, and the X-axis screw nut pair 423 is installed on the bearing assembly base 41 through the X-axis screw nut pair mounting seat 4231;The Y-axis support module 43 includes a Y-axis guide rail 431 fixedly mounted on the output end of the X-axis support module 42, a Y-axis drive motor 432, and a Y-axis screw nut pair 433. The rotating carrier disc module 44 is disposed on the Y-axis guide rail 431. The output end of the Y-axis drive motor 432 is connected to one end of the screw of the Y-axis screw nut pair 433 via a Y-axis coupling 435. The nut of the Y-axis screw nut pair 433 is connected to the rotating carrier disc module 44 and can drive the rotating carrier disc module 44 to slide on the Y-axis guide rail 431. The rotating carrier disc module 44 is mounted on the Y-axis guide rail 431 via a Y-axis guide rail slide 4311. The Y-axis drive motor 432 is mounted on the output end of the X-axis support module 42 via a Y-axis motor mounting seat 4321. The Y-axis screw nut pair 433 is mounted on the output end of the X-axis support module 42 via a Y-axis screw nut pair mounting seat 4331.

[0071] During specific implementation, the chip 9 to be tested is first carried on the rotating carrier plate module 44. The carrier plate rotation drive device in the rotating carrier plate module 44 drives the rotating carrier plate 442 and the chip 9 to be tested to rotate to a suitable angle. The carrying X-axis module 42 and the carrying Y-axis module 43 respectively adjust the specific position of the rotating carrier plate module 44 and the chip 9 to be tested on the rotating carrier plate assembly 44 to cooperate with the detection work of the detection equipment. The entire carrying assembly has a simple structure, stable and reliable performance, and high operation efficiency, which is conducive to improving detection efficiency and saving time and cost.

[0072] Specific reference Figure 16-19 The camera assembly 5 includes a camera assembly bottom adjustment guide rail 51 directly or indirectly fixed on the frame 1 and a camera assembly sliding mounting seat 52 mounted on the camera assembly bottom adjustment guide rail 51. The camera assembly sliding mounting seat 52 is provided with a camera assembly vertical mounting plate 53. The camera assembly vertical mounting plate 53 is provided with a camera assembly vertical guide rail 54 and a camera assembly linear bearing 55 on both sides. The camera assembly vertical guide rail 54 is provided with a camera assembly vertical sliding mounting seat 56. The camera assembly linear bearing 55 is fixedly provided with a camera assembly vertical mounting plate 53. There is a camera module 57, which includes a CCD camera 571. The lower end of the camera module 57 is fixedly connected to the camera component vertical sliding mounting seat 56. The camera component sliding mounting seat 52 is directly or indirectly mounted with a camera component lifting drive cylinder 58. The output end of the camera component lifting drive cylinder 58 is connected to the camera component vertical sliding mounting seat 56 and can drive the camera component vertical sliding mounting seat 56 to slide on the camera component vertical guide rail 54 and further drive the camera module 57 to slide on the camera component linear bearing 55.

[0073] Preferably, a lifting and fine-tuning device 59 is provided on the vertical mounting plate 53 of the camera assembly, and the output end of the lifting and fine-tuning device 59 is directly or indirectly fixedly connected to the camera module 57, and the lifting and fine-tuning device 59 is fixedly mounted on the vertical mounting plate 53 of the camera assembly through a fine-tuning device mounting seat 591; the camera module 57 also includes a camera light source 572, and the camera light source 572 is arranged at the bottom of the CCD camera 571; a camera module connecting plate 561 is provided at the bottom of the vertical sliding mounting seat 56 of the camera assembly, and a through hole is opened in the middle position of the camera module connecting plate 561, and the CCD camera 571 of the camera module 57 passes through the through hole of the camera module connecting plate 561, and the lower part of the camera module 57 is fixedly connected to the camera module connecting plate 561, and a side reinforcing connecting plate 562 is provided between the camera module connecting plate 561 and the vertical sliding mounting seat 56 of the camera assembly; The camera assembly vertical sliding mounting seat 56 is installed on the camera assembly vertical guide rail 54 through the camera assembly vertical guide rail seat 541, and the output end of the camera assembly lifting drive cylinder 58 is fixedly connected to the camera assembly vertical sliding mounting seat 56 through the camera assembly cylinder connecting block 581 and can drive the camera assembly vertical sliding mounting seat 56 to slide on the camera assembly vertical guide rail 54; the camera assembly sliding mounting seat 52 is an inverted L-shaped mounting seat, and a bottom slide plate 521 is fixedly provided at the bottom of the camera assembly sliding mounting seat 52, and the bottom slide plate 521 is installed on the camera assembly bottom adjustment guide rail 51 through the camera assembly bottom adjustment guide rail seat 511; the end of the camera assembly bottom adjustment guide rail 51 is provided with a camera assembly bottom limit block 512, and the side of the camera assembly bottom adjustment guide rail 51 is provided with a mounting seat locking limit plate 513, and the mounting seat locking limit plate 513 has a locking long strip groove.

[0074] During specific implementation, the specific positions of the setting module 57 and the CCD camera 571 on the camera module 57 are adjusted by adjusting the guide rail 51 at the bottom of the camera assembly, the vertical guide rail 54 of the camera assembly, the linear bearing 55 of the camera assembly and the lifting drive cylinder 58 of the camera assembly to adapt to different detection positions; further, the position of the CCD camera 571 is fine-tuned by the linear bearing 55 of the camera assembly and the lifting fine-tuning device 59, so that the camera accuracy and camera effect are good, which is conducive to improving the detection accuracy and improving the detection accuracy, with high application flexibility, strong versatility and good user experience.

[0075] The present invention also provides a contact chip detection method, the method comprising:

[0076] A multi-axis chip carrying assembly 4 is used to carry the chip 9 to be tested and move the chip 9 to a preset position;

[0077] After the camera assembly 5 completes the camera marking of the chip 9 to be inspected, the marking information is recorded;

[0078] The lifting detection component 2 is moved to the bottom of the chip 9 to be detected and the chip detection device 20 is lifted. After being lifted, the chip detection device 20 directly contacts the bottom of the chip 9 to be detected and drives the chip 9 to move slightly upward. After the chip 9 to be detected moves slightly upward, its two electrodes contact the probes of the probe component 3 and are electrically connected. The conductive chip 9 to be detected emits light and is detected by the chip detection device 20 in contact with the chip 9 to be detected.

[0079] When implementing the present invention, the chip detection device 20 can be driven to directly contact the chip 9 to be detected through the lifting detection component 2, thereby eliminating the spacing space or spacing glass between the chip detection device 20 and the chip 9 to be detected, which can greatly improve the accuracy of the detection, reduce the impact of the surrounding environment on the detection, and achieve better detection results; in addition, the probe component 3 can open a space for the camera component 5 to shoot the chip 9 to be detected, so that the camera component 5 can quickly complete the shooting of the chip 9 to be detected, and the entire device has fewer action steps, which improves the detection efficiency, saves time and cost, reduces the structural complexity of the equipment, reduces the implementation cost, and the stability of the equipment is higher, and the subsequent maintenance is more convenient.

[0080] The above is a specific description of the preferred implementation of the present invention, but the invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A contact chip detection device, characterized in that: The invention comprises a frame (1) and a lifting detection component (2), a probe component (3), a multi-axis chip carrier component (4), and a camera component (5) directly or indirectly mounted on the frame (1); the multi-axis chip carrier component (4) is used to carry a chip to be detected (9); the lifting detection component (2) is arranged at the bottom of the multi-axis chip carrier component (4); the lifting detection component (2) comprises a chip detection device (20); the lifting detection component (2) can drive the chip detection device (20) to rise and make the chip detection device (20) contact with the chip to be detected (9) on the multi-axis chip carrier component (4); The probe assembly (3) includes a probe assembly mounting base plate (31) mounted directly or indirectly on the frame (1); an opening and closing sliding guide rail (311) is provided on the probe assembly mounting base plate (311); a first probe sliding mounting plate (321) and a second probe sliding mounting plate (322) are provided on the opening and closing sliding guide rail (311); at least one first probe module (33) is provided on the first probe sliding mounting plate (321); a second probe module (34) whose number matches the first probe module (33) is provided on the second probe sliding mounting plate (322); a first opening and closing driving cylinder (35) is also provided on the probe assembly mounting base plate (31); 1) and a second opening and closing driving cylinder (352), wherein the output end of the first opening and closing driving cylinder (351) is connected to the first probe sliding mounting plate (321) and can drive the first probe sliding mounting plate (321) to slide on the opening and closing sliding guide rail (311), and the output end of the second opening and closing driving cylinder (352) is connected to the second probe sliding mounting plate (322) and can drive the second probe sliding mounting plate (322) to slide on the opening and closing sliding guide rail (311); the first opening and closing driving cylinder (351) and the second opening and closing driving cylinder (352) respectively drive the first probe sliding mounting plate (321) and the second probe sliding mounting plate (322) to slide in opposite directions or towards each other.

2. The contact chip detection device according to claim 1, characterized in that: The lifting detection component (2) includes a detection component mounting plate (21) fixed directly or indirectly on the frame (1), a detection component horizontal guide rail (221) and a detection component horizontal cylinder (222) arranged on the detection component mounting plate (21), a detection component horizontal sliding mounting plate (223) arranged on the detection component horizontal guide rail (221), an output end of the detection component horizontal cylinder (222) is connected to the detection component horizontal sliding mounting plate (223) and can push the detection component horizontal sliding mounting plate (223) to slide on the detection component horizontal guide rail (221), and a detection component vertical mounting plate (223) is arranged on the detection component horizontal sliding mounting plate (223). 3), a detection component vertical guide rail (231), a detection component lifting screw nut pair (232) and a detection component lifting drive motor (233) are provided on the detection component vertical mounting plate (23), a detection component vertical sliding mounting seat (234) is provided on the detection component vertical guide rail (231), an output end of the detection component lifting drive motor (233) is connected to one end of the screw of the detection component lifting screw nut pair (232), and a nut of the detection component lifting screw nut pair (232) is connected to the detection component vertical sliding mounting seat (234), and the chip detection device (20) is fixedly mounted on the detection component vertical sliding mounting seat (234).

3. The contact chip detection device according to claim 2, characterized in that: The chip detection device (20) is an integrating sphere detection device, and a transparent glass cover (202) is provided at the upper opening of the integrating sphere detection device; The detection assembly horizontal cylinder (222) is fixedly mounted on the bottom of the detection assembly mounting plate (21) via a horizontal cylinder mounting seat (2221), and the output end of the detection assembly horizontal cylinder (222) is fixedly connected to the detection assembly horizontal sliding mounting plate (223) via a horizontal cylinder connecting block (2222); A horizontal sliding limit block (2231) is provided on the side of the detection component horizontal sliding mounting plate (223); a horizontal sliding limit seat (211) used in conjunction with the horizontal sliding limit block (2231) is provided at the bottom of the detection component mounting plate (21); and an elastic limit rod (212) is provided on the horizontal sliding limit seat (211); The detection component lifting drive motor (233) is mounted on the bottom of the detection component vertical mounting plate (23) via a lifting drive motor mounting seat (2331); an output end of the detection component lifting drive motor (233) is provided with a detection component coupling (236) and is connected to one end of the screw of the detection component lifting screw nut pair (232) via the detection component coupling (236); A detection component lifting sensor (2371) is provided on the side wall of the detection component vertical mounting plate (23), and a detection component lifting induction sheet (2372) cooperating with the detection component lifting sensor (2371) is provided on the detection component vertical sliding mounting seat (234); The detection component horizontal sliding mounting plate (223) is mounted on the detection component horizontal guide rail (221) via the detection component horizontal slide seat (2211), and the detection component vertical sliding mounting seat (234) is mounted on the detection component vertical guide rail (231) via the detection component vertical slide seat (2311); A detection component side reinforcement plate (238) is provided on the side of the detection component vertical mounting plate (23).

4. The contact chip detection device according to claim 1, characterized in that: The probe assembly mounting base plate (31) has a mounting recess (312), and the opening and closing sliding guide rail (311), the first probe sliding mounting plate (321), the second probe sliding mounting plate (322), the first opening and closing driving cylinder (351), and the second opening and closing driving cylinder (352) are all arranged in the mounting recess (312); The opening and closing sliding guide rails (311) have two, and the first probe sliding mounting plate (321) and the second probe sliding mounting plate (322) are both arranged across the two opening and closing sliding guide rails (311) via an opening and closing sliding guide rail seat (3111); One end of the first probe sliding mounting plate (321) and one end of the second probe sliding mounting plate (322) are respectively fixedly provided with a first sliding mounting plate connecting block (3211) and a second sliding mounting plate connecting block (3221); the output end of the first opening and closing driving cylinder (351) is connected to the first sliding mounting plate connecting block (3211) via a first cylinder joint (3511); the output end of the second opening and closing driving cylinder (352) is connected to the second sliding mounting plate connecting block (3211) via a second cylinder joint (3521). On the mounting plate connecting block (3221), the first opening and closing driving cylinder (351) can drive the first probe sliding mounting plate (321) to slide on the opening and closing sliding guide rail (311) through the first cylinder joint (3511) and the first sliding mounting plate connecting block (3211), and the second opening and closing driving cylinder (352) can drive the second probe sliding mounting plate (322) to slide on the opening and closing sliding guide rail (311) through the second cylinder joint (3521) and the second sliding mounting plate connecting block (3221); The first probe sliding mounting plate (321) and the second probe sliding mounting plate (322) are provided with probe sliding mounting plate notches for the probes of the first probe module (33) and the second probe module (34) to pass through, and the probe assembly mounting base plate (31) is provided with a base plate notch that matches the probe sliding mounting plate notch; The first probe sliding mounting plate (321) is provided with a first semicircular notch on a side thereof close to the second probe sliding mounting plate (322), and the second probe sliding mounting plate (322) is provided with a second semicircular notch on a side thereof close to the first probe sliding mounting plate (321). When the first probe sliding mounting plate (321) and the second probe sliding mounting plate (322) are closed, the first semicircular notch and the second semicircular notch together form a circular notch of the probe sliding mounting plate. The center of the circular notch of the probe sliding mounting plate is located at the closed line of the first probe sliding mounting plate (321) and the second probe sliding mounting plate (322). The first probe module (33) is evenly distributed around the first semicircular notch, and the second probe module (34) is evenly distributed around the second semicircular notch. A bottom plate circular notch is provided on the probe assembly mounting bottom plate (31) whose position matches the circular notch of the probe sliding mounting plate. The size of the bottom plate circular notch is greater than or equal to the size of the circular notch of the probe sliding mounting plate. The first probe module (33) includes a probe mounting base plate (331) mounted on a first probe sliding mounting plate (321), a probe X-axis linear bearing (332) is provided on the probe mounting base plate (331), a probe Y-axis linear bearing (333) is provided on the probe X-axis linear bearing (332), a probe middle mounting plate (334) is provided on the Y-axis linear bearing (333), a probe Z-axis linear bearing (335) is provided on the side of the probe middle mounting plate (334), and the probe Z A probe mounting plate (336) is provided on the side of the axis linear bearing (335), and a chip probe (337) is provided on the probe mounting plate (336); a probe X-axis adjustment button (3321), a probe Y-axis adjustment button (3331) and a probe Z-axis adjustment button (3351) are provided on the probe X-axis linear bearing (332), the probe Y-axis linear bearing (333) and the probe Z-axis linear bearing (335), respectively. The structure of the second probe module (34) is the same as that of the first probe module (33).

5. The contact chip detection device according to claim 1, characterized in that: The multi-axis chip carrier assembly (4) comprises a carrier assembly base plate (41) directly or indirectly fixed on the frame (1) and a carrier X-axis module (42) arranged on the carrier assembly base plate (41); the output end of the carrier X-axis module (42) is provided with a carrier Y-axis module (43) movable along the X-axis direction; the output end of the carrier Y-axis module (43) is provided with a rotating carrier disk module (44) movable along the Y-axis direction; the chip product to be tested is carried on the rotating carrier disk module (44).

6. The contact chip detection device according to claim 5, characterized in that: The rotating carrier plate module (44) includes a carrier plate frame (441), a rotating bearing is provided at the center of the carrier plate frame (441), a rotating carrier plate (442) is provided on the movable ring of the rotating bearing, and a carrier plate rotation driving device is further provided on the carrier plate frame (441), and the carrier plate rotation driving device can drive the rotating carrier plate (442) to rotate and further drive the chip to be detected on the rotating carrier plate (442) to rotate; The carrier disk rotation drive device comprises a rotation drive motor (443), a first synchronous pulley (444) and a second synchronous pulley (445) fixedly mounted on the carrier disk frame (441); an active synchronous pulley is provided at the output end of the rotation drive motor (443); a rotation drive synchronous belt (446) is wound between the active synchronous pulley and the first synchronous pulley (444) and the second synchronous pulley (445); a portion of the outer wall surface of the rotation drive synchronous belt (446) located between the first synchronous pulley (444) and the second synchronous pulley (445) is in direct or indirect frictional contact with the outer wall surface of the rotating carrier disk (442); the rotation drive motor (443) can drive the rotating carrier disk (442) to rotate via the active synchronous pulley, the first synchronous pulley (444), the second synchronous pulley (445) and the rotation drive synchronous belt (446); The carrier disc frame (441) is provided with a synchronous belt guide wheel (447) for guiding the rotation drive synchronous belt (446), and the synchronous belt guide wheel (447) is mounted on the carrier disc frame (441) via a guide wheel mounting seat (448); a rotation sensor (4491) is provided on the carrier disc frame (441), and a rotation sensing piece (4492) cooperating with the rotation sensor (4491) is directly or indirectly fixedly mounted on the side of the rotating carrier disc (442); the carrier disc frame (441) includes a frame bottom shell and a frame upper shell; The bearing X-axis module (42) comprises an X-axis guide rail (421), an X-axis drive motor (422) and an X-axis screw nut pair (423) fixedly mounted on the bearing assembly base plate (41); an X-axis sliding mounting plate (424) is provided on the X-axis guide rail (421); the output end of the X-axis drive motor (422) is connected to one end of the screw of the X-axis screw nut pair (423) via an X-axis coupling (425); the nut of the X-axis screw nut pair (423) is connected to the X-axis sliding mounting plate (424) and can drive the X-axis sliding mounting plate (424) to slide on the X-axis guide rail (421); The X-axis sliding mounting plate (424) is mounted on the X-axis guide rail (421) via the X-axis guide rail slide (4211), the X-axis drive motor (422) is mounted on the bearing assembly base plate (41) via the X-axis motor mounting seat (4221), and the X-axis screw nut pair (423) is mounted on the bearing assembly base plate (41) via the X-axis screw nut pair mounting seat (4231); The Y-axis bearing module (43) includes a Y-axis guide rail (431) fixedly mounted on the output end of the X-axis bearing module (42), a Y-axis drive motor (432) and a Y-axis screw nut pair (433); the rotating bearing disk module (44) is arranged on the Y-axis guide rail (431); the output end of the Y-axis drive motor (432) is connected to one end of the screw of the Y-axis screw nut pair (433) via a Y-axis coupling (435); the nut of the Y-axis screw nut pair (433) is connected to the rotating bearing disk module (44) and can drive the rotating bearing disk module (44) to slide on the Y-axis guide rail (431); The rotating carrier disc module (44) is mounted on the Y-axis guide rail (431) via the Y-axis guide rail slide (4311), the Y-axis drive motor (432) is mounted on the output end of the carrier X-axis module (42) via the Y-axis motor mounting seat (4321), and the Y-axis screw nut pair (433) is mounted on the output end of the carrier X-axis module (42) via the Y-axis screw nut pair mounting seat (4331).

7. The contact chip detection device according to claim 1, characterized in that: The camera assembly (5) comprises a camera assembly bottom adjustment guide rail (51) fixed directly or indirectly on the frame (1) and a camera assembly sliding mounting seat (52) mounted on the camera assembly bottom adjustment guide rail (51), a camera assembly vertical mounting plate (53) is provided on the camera assembly sliding mounting seat (52), a camera assembly vertical guide rail (54) and a camera assembly linear bearing (55) are respectively provided on both sides of the camera assembly vertical mounting plate (53), a camera assembly vertical sliding mounting seat (56) is provided on the camera assembly vertical guide rail (54), and a camera assembly linear bearing (55) is fixedly provided on the camera assembly linear bearing (55). A camera module (57), the camera module (57) includes a CCD camera (571), the lower end of the camera module (57) is fixedly connected to the camera assembly vertical sliding mounting seat (56), the camera assembly sliding mounting seat (52) is directly or indirectly mounted with a camera assembly lifting drive cylinder (58), the output end of the camera assembly lifting drive cylinder (58) is connected to the camera assembly vertical sliding mounting seat (56) and can drive the camera assembly vertical sliding mounting seat (56) to slide on the camera assembly vertical guide rail (54) and further drive the camera module (57) to slide on the camera assembly linear bearing (55).

8. The contact chip detection device according to claim 7, characterized in that: The camera assembly vertical mounting plate (53) is provided with a lifting and fine-tuning device (59), the output end of the lifting and fine-tuning device (59) is directly or indirectly fixedly connected to the camera module (57), and the lifting and fine-tuning device (59) is fixedly mounted on the camera assembly vertical mounting plate (53) via a fine-tuning device mounting seat (591); The camera module (57) further includes a camera light source (572), and the camera light source (572) is arranged at the bottom of the CCD camera (571); A camera module connecting plate (561) is provided at the bottom of the camera assembly vertical sliding mounting seat (56), a through hole is provided in the middle of the camera module connecting plate (561), and a CCD camera (571) of the camera module (57) passes through the through hole of the camera module connecting plate (561), the lower part of the camera module (57) is fixedly connected to the camera module connecting plate (561), and a side reinforcement connecting plate (562) is provided between the camera module connecting plate (561) and the camera assembly vertical sliding mounting seat (56); The camera assembly vertical sliding mounting seat (56) is mounted on the camera assembly vertical guide rail (54) via the camera assembly vertical guide rail seat (541); the output end of the camera assembly lifting drive cylinder (58) is fixedly connected to the camera assembly vertical sliding mounting seat (56) via the camera assembly cylinder connecting block (581) and can drive the camera assembly vertical sliding mounting seat (56) to slide on the camera assembly vertical guide rail (54); The camera assembly sliding mounting seat (52) is an inverted L-shaped mounting seat, and a bottom slide plate (521) is fixedly provided at the bottom of the camera assembly sliding mounting seat (52), and the bottom slide plate (521) is mounted on the camera assembly bottom adjustment guide rail (51) via the camera assembly bottom adjustment guide rail seat (511); The end of the camera assembly bottom adjustment rail (51) is provided with a camera assembly bottom limit block (512), and the side of the camera assembly bottom adjustment rail (51) is provided with a mounting seat locking limit plate (513), and the mounting seat locking limit plate (513) is provided with a locking long strip groove.

9. A contact chip detection method, characterized in that: The contact chip detection device according to any one of claims 1 to 8 comprises: A multi-axis chip carrying assembly (4) is used to carry the chip to be tested (9) and to move the chip to be tested (9) to a preset position; When the chip to be tested (9) is moved into position by the multi-axis chip carrier assembly (4), the first opening and closing driving cylinder (351) and the second opening and closing driving cylinder (352) respectively drive the first probe sliding mounting plate (321) and the second probe sliding mounting plate (322) to slide in opposite directions, and an area for a camera to take photos is present between the first probe sliding mounting plate (321) and the second probe sliding mounting plate (322), and the camera assembly (5) is used to take photos and mark the chip to be tested (9) through the area; After completing the camera marking of the chip to be inspected (9) using the camera assembly (5), the marking information is recorded; The lifting detection component (2) is moved to the bottom of the detected chip (9) and the chip detection device (20) is lifted. After being lifted, the chip detection device (20) directly contacts the bottom of the detected chip (9) and drives the detected chip (9) to move slightly upward. After the detected chip (9) moves slightly upward, its two electrodes contact the probes of the probe component (3) and are electrically connected. The connected detected chip (9) emits light and is detected by the chip detection device (20) in contact with the detected chip (9).

Images