A symmetrical H-shaped microchannel liquid cooling plate

Abstract

The present invention discloses a symmetrical H-shaped microchannel liquid cooling plate, comprising a metal substrate and a metal cover plate, wherein the metal substrate is provided with a groove, the metal substrate with the groove is sealed and connected to the metal cover plate to form a liquid cooling plate; the groove in the metal substrate and the fitting surface of the metal cover plate together constitute a microchannel; the cross-section of the microchannel is rectangular; the liquid cooling plate further comprises a first inlet section, a second inlet section, an inlet manifold, an outlet manifold, a first outlet section and a second outlet section; the first and second inlet sections on one side of the liquid cooling plate are connected to the inlet manifold, the inlet manifold and the outlet manifold are connected through parallel microchannels, and the first and second outlet sections on the other side are connected to the outlet manifold; the width of the outlet manifold is greater than or equal to the width of the inlet manifold; the widths of the sides of the liquid cooling plate are all equal. The symmetrical H-shaped microchannel liquid cooling plate provided by the present invention has the advantages of simple structure, uniform flow in the parallel microchannels, good heat exchange performance, and low pressure drop.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation of power battery packs in electric vehicles, and in particular to a symmetrical H-shaped microchannel liquid cooling plate. Background Art

[0002] In recent years, with the rapid development of the global economy, energy crises and environmental pollution have become increasingly prominent. People's environmental awareness has gradually increased, and the government has placed increasing emphasis on businesses' use of clean energy. The development of the new energy electric vehicle industry has garnered widespread attention. Batteries, the core components of electric vehicles, are significantly affected by temperature. Operating batteries in adverse temperatures can even lead to safety accidents. The battery thermal management system is crucial for ensuring the safe and reliable operation of electric vehicles, maintaining battery temperature within the ideal operating range. Depending on the cooling medium, battery thermal management systems can be broadly categorized into three types: air cooling, liquid cooling, and phase change cooling. Liquid cooling systems, with their advantages of low noise, high temperature uniformity, and high heat transfer efficiency, are currently one of the most promising heat dissipation systems. Liquid cooling systems are categorized into direct cooling and indirect cooling, depending on whether the coolant comes into direct contact with the object being cooled.

[0003] The coolant of direct cooling is in direct contact with the heating element, and the cooling effect is better. However, the integration of this cooling system is low, which is prone to leakage problems. Therefore, the coolant is required to have good insulation, non-toxicity, harmlessness and non-corrosiveness and other physical and chemical properties, and the scope of application is relatively small. The coolant of indirect cooling has fixed pipelines and is not in direct contact with the battery pack. Therefore, the requirements for the coolant are lower. As long as the liquid pipeline is well sealed, the risk of leakage can be reduced. Among them, the liquid cooling plate is an indirect liquid cooling system with the advantages of high integration and strong heat exchange performance. At present, liquid cooling plates have been widely used in the heat dissipation of high heat flux density devices such as electric vehicles and electronic components.

[0004] However, traditional liquid cooling plates have the following defects: 1. Traditional liquid cooling plates are mostly single-inlet and single-outlet structures, with a long total flow channel length, resulting in high fluid resistance along the flow path. Furthermore, the numerous corner structures inside the liquid cooling plate increase the local pressure drop, making the total pressure drop of the liquid cooling plate relatively large. 2. The total length of the flow channel of traditional liquid cooling plates is relatively long, resulting in a large temperature rise of the coolant along the flow path. This results in a low coolant inlet temperature, which results in a good heat exchange effect, but a high coolant outlet temperature, which results in a poor heat exchange effect. The temperature difference between the inlet and outlet of the liquid cooling plate is large, resulting in poor temperature uniformity. 3. The flow distribution within each flow channel of the traditional liquid cooling plate is relatively uneven, resulting in poor temperature consistency of the liquid cooling plate. 4. Traditional liquid cooling plates are large in thickness, resulting in large volume and weight, and limited applicability. Summary of the Invention

[0005] The purpose of the present invention is to address the deficiencies of the prior art and provide a high-efficiency symmetrical H-shaped microchannel liquid cooling plate with a simple structure, uniform flow distribution in the microchannel, good heat exchange performance and low energy consumption.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] A symmetrical H-shaped microchannel liquid cooling plate comprises a metal base plate and a metal cover plate. The metal base plate is provided with a groove. The metal base plate with the groove is sealed and connected to the metal cover plate to form a liquid cooling plate. The groove in the metal base plate and the contact surface of the metal cover plate together form a microchannel.

[0008] The cross-sections of the microchannels are all rectangular; the liquid cooling plate further includes a first inlet section, a second inlet section, an inlet manifold, an outlet manifold, a first outlet section and a second outlet section; the first inlet section and the second inlet section on one side of the liquid cooling plate are connected to the inlet manifold, the inlet manifold and the outlet manifold are connected through parallel microchannels, and the first outlet section and the second outlet section on the other side of the liquid cooling plate are connected to the outlet manifold; the width of the outlet manifold is greater than or equal to the width of the inlet manifold; the widths of the sides of the liquid cooling plate are all equal.

[0009] Furthermore, the two inlet sections and the two outlet sections are vertically connected to the inlet manifold and the outlet manifold respectively.

[0010] Furthermore, the first inlet section and the first outlet section are on the same horizontal line, the second inlet section and the second outlet section are on the same horizontal line, and both are parallel to the parallel microchannels.

[0011] Furthermore, the ratio of the distance between the center lines of the two inlet sections and the center lines of the two outlet sections and the edge of the liquid cooling plate to the total width of the liquid cooling plate is 0.125 to 0.375.

[0012] Furthermore, the lengths and widths of the first inlet section, the second inlet section and the first outlet section, the second outlet section are the same, and the coolant inlet flow rates of the two inlet sections are the same.

[0013] Furthermore, the liquid cooling plate is a centrosymmetrical structure.

[0014] Furthermore, the cross-section of the grooves in the metal substrate is rectangular, and the groove depth is 0.3mm to 0.9mm; the thickness of the metal substrate is 1mm to 1.6mm; and the thickness of the metal cover is 0.4mm to 1mm.

[0015] Furthermore, the width of the parallel microchannels is the same as the width of the inlet manifold, which is 8 mm to 15 mm; and the ratio of the width of the outlet manifold to the width of the inlet manifold is 1 to 8.

[0016] Furthermore, the ratio of the width of the parallel microchannels to the width of the solids sandwiched by the parallel microchannels is 0.6-1.

[0017] Furthermore, the width of the side of the liquid cooling plate is 1 mm to 7 mm.

[0018] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0019] 1. The symmetrical H-shaped microchannel liquid cooling plate provided by the present invention has a dual-inlet and dual-outlet structure. Compared to a single-inlet, single-outlet liquid cooling plate, a dual-inlet, dual-outlet liquid cooling plate doubles the cross-sectional area of ​​the microchannels in the inlet and outlet sections, significantly reducing the pressure drop of the liquid cooling plate. Furthermore, the liquid cooling plate's centrally symmetrical structure ensures identical velocity and temperature fields in the upper and lower halves of the symmetrical structure, evenly distributing flow within the microchannels and maintaining a highly consistent temperature field within the liquid cooling plate. This provides stable and uniform heat dissipation conditions for the cooled object, resulting in higher heat exchange efficiency.

[0020] 2. The present invention provides a symmetrical H-shaped microchannel liquid cooling plate, in which the microchannel cross-sections are all rectangular, and the width of the outlet manifold is greater than or equal to the width of the inlet manifold and the width of the parallel microchannels. The flow resistance of the coolant downstream of the parallel microchannels is reduced, thereby further reducing the pressure drop of the liquid cooling plate. In addition, since the volume of the solids enclosed by the parallel microchannels is reduced, the temperature rise of the fluid along the parallel microchannels is reduced, the heat exchange performance is improved, and the temperature uniformity of the liquid cooling plate is better.

[0021] 3. The symmetrical H-shaped microchannel liquid cooling plate provided by the present invention has the advantages of small size, light weight, compact structure, low operating cost, energy saving and environmental protection, good heat exchange effect, strong temperature balancing ability, safe and reliable operation, etc. It can be used in the heat dissipation of high heat flux density devices such as electric vehicles and electronic components, and has broad application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Schematic diagram of the metal substrate in the symmetrical H-shaped microchannel liquid cooling plate according to an embodiment of the present invention.

[0023] Figure 2 Schematic diagram of the metal cover plate in the symmetrical H-shaped microchannel liquid cooling plate according to an embodiment of the present invention.

[0024] Figure 3 Schematic diagram of a symmetrical H-shaped microchannel liquid cooling plate according to an embodiment of the present invention.

[0025] Figure 4 Schematic diagram of parameter naming of the symmetrical H-shaped microchannel liquid cooling plate according to an embodiment of the present invention.

[0026] Figure 5 This is a front view of a symmetrical H-shaped microchannel liquid cooling plate according to an embodiment of the present invention.

[0027] Figure 6 This is a front view of a conventional Type I single-inlet and single-outlet liquid cooling plate.

[0028] Figure 7 2 is a comparison diagram of the flow distribution in the parallel microchannels of a conventional I-type liquid cooling plate and the symmetrical H-type microchannel liquid cooling plate of the present invention.

[0029] Among them, 1-metal substrate, 2-groove, 3-metal cover, 4-first inlet section, 5-second inlet section, 6-inlet manifold, 7-parallel microchannels, 8-outlet manifold, 9-first outlet section, 10-second outlet section, 11-liquid cooling plate side width, 12-solid sandwiched by parallel microchannels. DETAILED DESCRIPTION

[0030] The present invention will be described in further detail below with reference to the embodiments and drawings, but the embodiments of the present invention are not limited thereto.

[0031] Example:

[0032] like Figures 1 to 3 As shown, this embodiment provides a symmetrical H-shaped microchannel liquid cooling plate, comprising a metal substrate (1) and a metal cover plate (3), wherein the metal substrate (1) is provided with a groove (2), and the metal substrate (1) with the groove (2) is sealedly connected to the metal cover plate (3) to form a liquid cooling plate; the groove (2) in the metal substrate (1) and the bonding surface of the metal cover plate (3) together form a microchannel;

[0033] The cross-sections of the microchannels are all rectangular; the liquid cooling plate further comprises a first inlet section (4), a second inlet section (5), an inlet manifold (6), an outlet manifold (8), a first outlet section (9) and a second outlet section (10); the first inlet section (4) and the second inlet section (5) on one side of the liquid cooling plate are connected to the inlet manifold (6), and their function is to introduce the coolant from the outside of the liquid cooling plate through the first inlet section (4) and the second inlet section (5) into the inlet manifold (6); the inlet manifold (6) and the outlet manifold (8) are connected through parallel microchannels (7), and their function is to divert the coolant through the inlet manifold (6) and send it into the parallel microchannels (7) for sufficient heat exchange with the heat source, and then converge at the outlet manifold (8); the first outlet section (9) and the second outlet section (10) on the other side of the liquid cooling plate ) is connected to the outlet manifold (8), and its function is to discharge the coolant after heat exchange from the liquid cooling plate through the first outlet section (9) and the second outlet section (10); the width of the outlet manifold (8) is greater than or equal to the width of the inlet manifold (6), so that the flow resistance of the coolant in the downstream of the parallel microchannel (7) is reduced, thereby further reducing the pressure drop of the liquid cooling plate, and because the volume of the solid (12) sandwiched by the parallel microchannel is reduced, the temperature rise of the fluid along the parallel microchannel (7) is reduced, the heat exchange performance is improved, and the temperature uniformity of the liquid cooling plate is better; the widths of the side widths (11) of the liquid cooling plate are all equal, and the liquid cooling plate is a centrally symmetrical structure, so that the velocity field and temperature field of the upper and lower half-symmetrical structures are the same, the flow distribution in the microchannel is uniform, the consistency of the temperature field of the liquid cooling plate is high, and the heat exchange efficiency is also higher.

[0034] Specific considerations include Figure 4 The liquid cooling plate shown, the inlet section length (l in ) and outlet section length (l out ) are both 65 mm; the ratio of the distance between the centerline of the inlet section and the centerline of the outlet section and the edge of the liquid cooling plate to the total width of the liquid cooling plate is 0.25; the length (l) of the liquid cooling plate is 176 mm, the width (w) is 130 mm, and the thickness (δ) is 2 mm; the depth of the microchannel in the liquid cooling plate is 0.6 mm; the liquid cooling plate contains five parallel microchannels; the width of the inlet manifold (w dc ) and parallel microchannel width (w pc ) are both 12mm; outlet manifold width (w cc ) is 60mm; liquid cooling plate side width (w ec ) is 1 mm; the solid width (d) of the parallel microchannel is 17 mm; the contact area between the metal substrate and the metal cover of the liquid cooling plate and the heat source is 176 mm × 130 mm, and the equivalent heating power is 7000 W / m 2 ; Liquid cooling plate material is aluminum, density is 2702kg / m 3 , heat capacity is 903 J / (kg·K), thermal conductivity is 237 W / (m·K); the coolant is liquid water, its density is 997.56 kg / m 3, heat capacity is 4181.72 J / (kg·K), thermal conductivity is 0.62 W / (m·K), and dynamic viscosity is 8.89×10 -4 kg / (m·s); the cooling water flow rate of the two inlet sections is equal, both 0.025 kg / s, and the inlet water temperature is 303.15 K.

[0035] The numerical simulation method is used to calculate the symmetrical H-shaped microchannel liquid cooling plate of this embodiment (such as Figure 5 As shown) and conventional I-type single-inlet single-outlet liquid cooling plate (as shown Figure 6 The temperature field of . Figure 7 The flow distribution in the parallel microchannels of the symmetrical H-type microchannel liquid cooling plate of this embodiment and the conventional liquid cooling plate is compared. The results show that the flow distribution of the liquid cooling plate of this embodiment is significantly more uniform than that of the conventional liquid cooling plate. In addition, the hot spot temperatures of the I-type single-inlet single-outlet liquid cooling plate and the liquid cooling plate of this embodiment are 309.4K and 306.3K respectively, and the hot spot temperature of the liquid cooling plate of this embodiment is reduced by 3.1K; the maximum temperature difference corresponding to the two liquid cooling plates is 6.2K and 3.0K respectively, and the maximum temperature difference of the liquid cooling plate of this embodiment is reduced by 52%. In addition, the power consumption of the liquid cooling plate of this embodiment is 4.13W, which is 61% lower than the power consumption of the conventional I-type single-inlet single-outlet liquid cooling plate of 10.51W. It can be seen that the liquid cooling plate of this embodiment can obtain better heat dissipation performance and higher cooling efficiency under lower power consumption.

[0036] The above is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes based on the technical solution and invention concept of the present invention within the scope disclosed by the present invention, which falls within the scope of protection of the present invention.

Claims

1. A symmetrical H-shaped microchannel liquid cooling plate, comprising a metal base plate and a metal cover plate, wherein the metal base plate is provided with a groove, and the metal base plate with the groove is sealedly connected to the metal cover plate to form a liquid cooling plate; the groove in the metal base plate and the contact surface of the metal cover plate together form a microchannel; characterized in that: The cross-sections of the microchannels are all rectangular; the liquid cooling plate further includes a first inlet section, a second inlet section, an inlet manifold, an outlet manifold, a first outlet section and a second outlet section; the first inlet section and the second inlet section on one side of the liquid cooling plate are connected to the inlet manifold, and the inlet manifold and the outlet manifold are connected through parallel microchannels, and the first outlet section and the second outlet section on the other side of the liquid cooling plate are connected to the outlet manifold; the first inlet section, the second inlet section, the first outlet section and the second outlet section are vertically connected to the inlet manifold and the outlet manifold respectively, the first inlet section and the first outlet section are on the same horizontal line, the second inlet section and the second outlet section are on the same horizontal line, and are both parallel to the parallel microchannels, and the width of the outlet manifold is greater than or equal to the width of the inlet manifold; the liquid cooling plate has a centrally symmetrical structure, and the widths of the side widths of the liquid cooling plate are all equal; the ratio of the width of the parallel microchannels to the width of the solids sandwiched by the parallel microchannels is 0.6 to 1, and the width of the side width of the liquid cooling plate is 1 mm to 7 mm.

2. The symmetrical H-shaped microchannel liquid cooling plate according to claim 1, characterized in that: The ratio of the distance from the center line of the first inlet section, the center line of the second inlet section, the center line of the first outlet section, and the center line of the second outlet section to the edge of the liquid cooling plate to the total width of the liquid cooling plate is 0.125 to 0.

375.

3. The symmetrical H-shaped microchannel liquid cooling plate according to claim 2, characterized in that: The first inlet section, the second inlet section, the first outlet section, and the second outlet section have the same length and width, and the first inlet section and the second inlet section have the same coolant inlet flow rate.

4. The symmetrical H-shaped microchannel liquid cooling plate according to claim 1, characterized in that: The cross-section of the grooves in the metal substrate is rectangular, and the groove depth is 0.3 mm to 0.9 mm; the thickness of the metal substrate is 1 mm to 1.6 mm; the thickness of the metal cover is 0.4 mm to 1 mm.

5. The symmetrical H-shaped microchannel liquid cooling plate according to claim 4, characterized in that: The width of the parallel microchannels is the same as the width of the inlet manifold, which is 8 mm to 15 mm; the ratio of the width of the outlet manifold to the width of the inlet manifold is 1 to 8.

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