Reinforcement elements and component systems for printed circuit boards

Abstract

The invention relates to a reinforcing element for a circuit board and a component system. The reinforcing element (2) is used to be arranged at one or more components (10, 11) arranged on a circuit board (1). The reinforcing element (2) has a structure (20) and connecting pins (210, 211, 212) arranged on its lower side. The structure (20) is formed in its shape so that it has a closed periphery and a hollow inner space formed by the periphery for surrounding one or more components (10, 11) after being installed on the circuit board (1). The component system has a circuit board, one or more components and at least one reinforcing element.

Description

Technical Field

[0001] The invention relates to a reinforcement element for a circuit board, in particular for use in a transmission or a transmission control unit, and to a component system. Background Art

[0002] It is known that printed circuit boards should be protected from vibrations in order to prevent damage to components arranged on the printed circuit boards. This can be achieved by providing completely different structures, as shown, for example, in US patent document US 2003 / 0038096 A1 or US patent US6880243 B2. However, there is still a need for improvement, especially within the scope of the optimum use of space and the number of process steps for providing reinforcement on the printed circuit board. Summary of the invention

[0003] The object of the present invention is therefore to provide an improved reinforcement element for a circuit board and a corresponding component method. The reinforcement element is in particular designed for use on a circuit board that is used in a transmission application. This object is achieved by the features of the independent claim. Advantageous embodiments are the subject of the dependent claims.

[0004] A reinforcement element is provided for arrangement at one or more components arranged on a circuit board. The reinforcement element has a structure and a connecting pin arranged on the structure at the lower side of the structure. The structure is shaped so that it has a closed perimeter and a hollow inner space formed by the perimeter for surrounding one or more components after being mounted on the circuit board. Thus, reinforcement can be provided with a small space requirement on the circuit board. In addition, additional functions can be realized without requiring space on the circuit board.

[0005] Furthermore, it is provided that the connecting pins are provided in a predetermined shape-dependent number.

[0006] Furthermore, it is provided that at least one of the connecting pins is formed from an electrically conductive material and can be fastened to the circuit board as a through-hole connector or as an SMD connector by means of a soldering process. At least one of the connecting pins is additionally or alternatively formed from a non-conductive material and has a thread for screwing to the circuit board. By providing individual connecting pins, completely different connections to the circuit board can be realized with minimal space requirements.

[0007] Furthermore, it is provided that the structure is formed as a polygon. The number of connecting pins advantageously corresponds to the number of corner regions of the polygon, and the connecting pins are respectively arranged on the corner regions. The reinforcement effect is increased by using a plurality of corners.

[0008] Furthermore, a component system is provided, which has a printed circuit board, one or more components arranged on the printed circuit board, and at least one of the described reinforcement elements.

[0009] Furthermore, it is provided that at least one of the components is a component to be cooled, and that the component to be cooled is introduced into the hollow interior of the structure and above the component to be cooled. Thus, heat can be cooled without requiring space on the circuit board.

[0010] Furthermore, it is provided that at least one of the components is a component to be dissipated of heat, and that the heat dissipating component is arranged on a region of the structure facing toward or facing away from the component to be dissipated of heat in such a way that the heat dissipating component at least partially spans the hollow interior of the structure. Thus, alternative components can be used to dissipate heat without requiring additional space on the circuit board.

[0011] Furthermore, it is provided that a heat-conducting paste is introduced between the component to be dissipated and the component to dissipate heat, the heat-conducting paste bringing the two components into contact with each other, thereby improving heat dissipation.

[0012] Furthermore, it is provided that the connecting pin is formed in such a way that the lower edge of the structure is substantially at the same height as the component to be dissipated heat or is slightly higher than the upper edge of the component to be dissipated heat. By appropriately selecting the height of the connecting pin, a reinforcement element suitable for dissipating heat and / or for reinforcement can be realized.

[0013] Further features and advantages of the invention are apparent from the following description of exemplary embodiments of the invention, from the accompanying drawings showing details according to the invention, and from the claims. The individual features can be realized in variants of the invention individually or in any combination of multiples. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The preferred embodiments of the present invention are explained in detail below with reference to the accompanying drawings.

[0015] Figure 1 shows a top view of a circuit board having components arranged thereon and a reinforcement element according to an embodiment of the present invention; and

[0016] Figure 2 The present invention shows a cross-sectional view of a component system having reinforcement elements according to various embodiments of the present invention.

[0017] In the following description of the figures, identical elements or functions are provided with the same reference symbols. DETAILED DESCRIPTION

[0018] Figure 11 shows a top view of a circuit board 1 having components 10, 11 arranged thereon and, according to one embodiment, a reinforcing element 2 arranged next to the components and formed in a hexagon. Figure 2 The cross-sectional view of the reinforcement element 2 shown in FIG. 1 is used to illustrate the fastening possibilities of the reinforcement element 2 on the circuit board 1 and to illustrate the necessary fastening of the reinforcement element 2 on the circuit board 1 for a specific component 10. Figure 2 The heat removal elements 30 , 31 are shown in FIG. 1 as insert elements 30 with a heat-conducting paste 31 .

[0019] As shown in the figure, the reinforcement element 2 is formed of two parts, namely a reinforcement structure formed in a frame-like manner, (referred to as structure 20 for short) and connecting pins 210, 211, 212 arranged on one side of the structure 20, advantageously the bottom side or the side facing the circuit board, which are used to fasten the structure 20 to the circuit board 1. The reinforcement element 2 is arranged in such a way that it surrounds, more precisely, frames, an individual component 10 or a component group consisting of a plurality of individual components 11. For this purpose, the reinforcement structure or structure 20 is arranged at a distance from the circuit board 1 via the connecting pins 210, 211, 212 and frames one or more components 10, 11. For this purpose, the structure 20 is selected in terms of its size in such a way that it is arranged at a distance from the one or more components 10, 11 in the lateral direction. The connecting pins 210 , 211 , 212 are advantageously designed in such a way that the structure 20 fastened to the printed circuit board 1 is at the same or uniform distance from the printed circuit board 1 over its entire area, ie is parallel thereto.

[0020] The reinforcing element 2 should have the smallest possible spacing from one or more components 10, 11, both in terms of the lateral proximity and in terms of the spacing in the height direction. In particular, the spacing in the height direction should be as small as possible, that is, the structure 20 should be as close as possible to the horizontal line of the upper edge of one of the components 10, 11. In particular in the case of a component 10, in which heat is to be dissipated, it is important to keep the spacing between the structure 20 (the lower edge) and the upper edge of the component as small as possible, but preferably approximately above the upper edge of the component. In other components 11, the structure 20 can also be arranged below the lower edge of one or all components 11.

[0021] The lower the connecting pins 210, 211, 212 are, that is, the smaller the spacing between the connecting pins 210, 211, 211 and the circuit board 1, the better the reinforcement effect can be utilized. However, according to the invention, the reinforcement element 2 is not fastened directly to the circuit board 1 in order not to block space. This free space can be used, for example, to guide conductor tracks or to arrange other components under the structure 20.

[0022] The shape of the reinforcing element 2 depends on the one or more components 10, 11 to be surrounded. Advantageously, a polygon is chosen, for example a hexagon as shown in the figures, formed by the structure 20. The structure 20 is not formed as a continuous structure 20, but as a frame-like structure 20, i.e. with a closed perimeter, so that the structure has no space as in Figure 1 Such a hollow interior is shown in . The structure is connected to the circuit board 1 only via the connecting pins 210 , 211 , 212 and thus requires very little space.

[0023] In this inner space, a heat dissipating element 30 can be arranged as an embedded element. In order to connect to the component 10 without gaps, before the heat dissipating element 30 is inserted into the structure, a heat conducting paste 31 is introduced between the heat dissipating element 30 and the upper side of the component 10, such as in Figure 2 As shown on the right in the figure. The heat dissipating element 30 can also extend in the height direction beyond the upper edge of the structure 20, for example in order to provide a larger surface for heat dissipation. The structure 20 can also be formed in the same shape and approximately the same size as the structure 10 or at least larger than the structure 10, so that the heat-conducting element 30 can be inserted approximately in a form-fitting manner. When provided for the application, only a heat-conducting paste 31 can also be introduced into the interior of the structure 20.

[0024] In an alternative embodiment, the heat dissipating element 30 can be arranged on the structure 20 and fastened thereto. The fastening can be carried out, for example, via a screw connection or via the snapping in of corresponding retaining means on the structure 20. The heat dissipating element 30 can be arranged on the upper side or on the lower side of the structure, that is, on the side of the structure 20 facing away from the component 10 or facing the component 10. In this embodiment, the heat dissipating element 30 can be formed as a metal plate, for example as a copper plate, which is then substantially parallel to the circuit board 1. It is also advantageous here to introduce a heat conducting paste 31 between the heat dissipating element 30 and the component 10 for connection to the component 10.

[0025] The heat dissipating element 30 can also additionally accommodate additional components, for example, in order to be able to establish a connection with the housing. Thus, the space on the circuit board 1 that would otherwise be required for this purpose can be used for other purposes. Such additional components can be, for example, nuts or other connecting elements that can be connected to corresponding elements on the housing.

[0026] The connection pins 210, 211, 212 are advantageously arranged in the corner region 21 of the structure 20. The connection pins can be made of a metallic or conductive material, such as copper, so that they can be fastened to the circuit board 1 by means of a suitable soldering process. For this purpose, the connection pins can be formed either as through-hole connection pins 211 passing through the circuit board 1 or as SMD connection pins 212. This can be achieved, for example, by means of THT soldering or SMD soldering.

[0027] Alternatively, the connecting pins can be formed from a non-conductive material. Then, they can also be formed in the same process as the structure 20, so that the connecting pins 210 and the structure 20 are formed in one piece. For connection with the circuit board 1, it is advantageous if the connecting pins 210 are formed from a non-conductive material, for example, an injection-coated plastic, to form the connecting pins in such a way that they have an internal thread in the area to be connected to the circuit board 1, so that the screws 3 can be screwed in from the bottom side U of the circuit board 1 toward the top side O of the circuit board 1 and thus screwed into the threads of the connecting pins 210. Alternatively, the snap-in can be achieved via corresponding retaining means.

[0028] The connection of the connecting pins 210 , 211 , 212 to the structure 20 is achieved, for example, by plugging, screwing, snapping in via corresponding retaining means or in a single production process in which the structure 20 and the connecting pins 210 are simultaneously formed, for example by a plastic injection molding method.

[0029] In certain applications, combinations of different connecting pins 210 , 211 , 212 can also be used within a single reinforcement element 2 in order, for example, to reduce tolerances during fastening by means of a single measure.

[0030] As already mentioned above, the shape of the reinforcement element 2 is matched to one or more components 10, 11 to be reinforced and / or to dissipate heat. For example, standardized reinforcement elements 2 can be pre-produced for a specific application and / or the reinforcement element 2 can be provided as a ready-made or pre-assembled component, for example as a hexagon or as a reinforcement element 2 matched to a special component 10 to dissipate heat.

[0031] Alternatively, the structure 20 and the connecting pins 210, 211, 212 can also be provided as an assembly, for example as a single element that can be plugged in or screwed, and the single element can be spliced ​​into a specific shape as required, for example into a polygon such as a hexagon, triangle, rectangle, or square.

[0032] The reinforcement element 2 can also be arranged on the underside of the circuit board 1, for example between the IGBT and the driver board. Thus, a sandwich structure is generated due to the support on the driver board.

[0033] The circuit board 1 can be designed as a PCB (printed circuit board). The circuit board can also be designed as another structural element equipped with components 10 , 11 to be reinforced and / or to dissipate heat.

[0034] In addition, multiple reinforcement elements 2 can be arranged on the circuit board 1, wherein each reinforcement element 2 is arranged on a different component 10, 11 and can be implemented differently in terms of size, type of connecting pins 210, 211, 212, height of connecting pins 210, 211, 212, shape of structure 20, etc. depending on the application.

[0035] Furthermore, a plurality of structures 20 are connected to one another to form a multi-part structure 20, for example a honeycomb structure 20. For this purpose, two or more structures 20 can be divided into regions of further structures 20. For this purpose, corresponding connecting means must be provided.

[0036] By means of the proposed reinforcement element 2, which is variable in shape and provides a reinforcement structure 20 at a distance from the circuit board 1, it is possible to reinforce the circuit board 1 in a predetermined area. In addition, due to the distance from the circuit board 1, the space below the structure 20 is free for other applications, such as guiding conductor tracks. By the possibility of providing heat dissipating elements 30 in the interior of the structure 20 or on and below the structure 20, additional space is available and two functions, namely reinforcement and heat dissipation, are achieved by one structural element.

[0037] Reference numerals list

[0038] 1 Circuit Board

[0039] 2 Reinforcement elements

[0040] 20 Structure

[0041] 21 Corner area

[0042] 210 Screw connection pin

[0043] 21 via connection pins

[0044] 212 SMD connector pins

[0045] 30 Heat dissipation components

[0046] 31 Thermal paste

[0047] 3 Screws

[0048] 10.11 Components

[0049] U, O Lower and upper sides of the circuit board

Claims

1. A reinforcing element (2) for being arranged on one or more components (10, 11) arranged on a circuit board (1), wherein: The reinforcing element (2) comprises a structure (20) and connecting pins (210, 211, 212) arranged on the lower side of the structure for fastening the structure (20) to the circuit board (1), wherein the structure (20) is formed in its shape so that the structure has a closed periphery and a hollow inner space formed by the periphery for surrounding one or more components (10, 11) after being mounted on the circuit board (1), wherein the structure (20) and the connecting pins (210, 211, 212) form a single element that can be plugged in or screwed, and the single element is spliced ​​into a polygon and provided as an assembly.

2. The reinforcing element (2) according to claim 1, wherein: The connecting pins (210, 211, 212) are provided in a predetermined number depending on the shape.

3. The reinforcing element (2) according to claim 2, wherein: At least one of the connecting pins (211, 212) is formed of a conductive material and can be fastened to the circuit board (1) as a through-hole connector or an SMD connector by means of a soldering process, and / or at least one of the connecting pins (210) is formed of a non-conductive material and has a thread for screwing to the circuit board (1).

4. The reinforcing element (2) according to claim 1, wherein: The number of the connecting pins (210, 211, 212) corresponds to the number of the corner regions (21) of the polygon, and the connecting pins (210, 211, 212) are respectively arranged on the corner regions (21).

5. A component system comprising a printed circuit board (1), one or more components (10, 11) arranged on the printed circuit board (1), and at least one reinforcement element (2) according to any one of claims 1 to 4.

6. The component system according to claim 5, wherein: At least one of the components (10, 11) is a component (10) to dissipate heat, and a heat dissipating component (30) is introduced into the hollow interior space of the structure (20) and above the component (10) to dissipate heat.

7. The component system according to claim 5, wherein: At least one of the components (10, 11) is a component (10) to dissipate heat, and a heat dissipating component (30) is arranged on a region of the structure (20) facing toward or away from the component (10) to dissipate heat, so that the heat dissipating component at least partially spans the hollow inner space.

8. The component system according to claim 6 or 7, wherein: A heat-conducting paste (31) is introduced between a component (10) to be dissipated of heat and a component (30) for dissipating heat, said heat-conducting paste bringing the two components (10, 30) into contact with one another.

9. The component system according to any one of claims 5 to 7, wherein: The connecting pins (210, 211, 212) are formed so that the lower edge of the structure (20) has the same height as the component (10) to be dissipated heat or is higher than the upper edge of the component (10) to be dissipated heat.

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