A system for realizing automatic semiconductor packaging

Abstract

The present invention discloses a system for realizing automatic semiconductor packaging, including a film arrangement machine, a black glue feeding unit, a press machine, an automatic mold cleaning unit, a glue removal machine, an appearance inspection unit, a robot and a general controller. The present invention can realize full automation of the semiconductor packaging process, so that the semiconductor packaging operation efficiency and the quality of the packaged finished product can be significantly improved, and the production cost can be significantly reduced, which has significant industrial application value.

Description

Technical Field

[0001] The invention relates to a system for realizing automatic semiconductor packaging, and belongs to the technical field of semiconductor packaging. Background Art

[0002] The semiconductor packaging process usually includes the following operations: placing the blanks into a sheet sorting machine for sorting; placing the sorted blanks into a press, placing the black glue used to plasticize the blanks into the press, and completing the plasticization of the blanks through the press; taking the plasticized blanks out of the press; cleaning the mold surface of the press; placing the plasticized blanks into a glue removal machine, and removing excess black glue on the plasticized blanks through the glue removal machine; performing appearance inspection on the finished blanks after removing the black glue overflow, and sorting the finished blanks according to the inspection results.

[0003] Traditional semiconductor packaging operations have a low degree of automation. The placement and removal of sheets in the sheet arrangement machine, the placement of sheets and black glue in the press, the removal of sheets after plastic sealing, the cleaning of the press die surface, the placement of sheets after residual glue removal, appearance inspection, and the sorting of finished sheets are all done manually, which has many inevitable defects of manual operation. For example, the manual placement of sheets before and after plastic sealing and during glue removal is not only labor-intensive, but also prone to placement errors, affecting the packaging efficiency and packaging quality of the product; manual cleaning of the press die surface not only has a poor execution rate, but also the degree of cleaning cannot be effectively guaranteed, and it is easy to cause the material body to not be filled due to inadequate cleaning of the die surface, affecting the quality of plastic sealing; manual visual inspection of the appearance of the sheet after plastic sealing not only has low detection efficiency, but is also prone to missed detection and false detection, and the detection standards are highly subjective and the detection capabilities are limited. Although with the development of automation technology, some processes have been automated, but the feeding of vinyl is still done manually. Manual feeding of vinyl is not only inefficient, but also the hands of operators are prone to sweat during the feeding process. The secreted sweat will contaminate the vinyl and reduce the quality of the vinyl. Especially during the feeding process of vinyl, the high temperature in the press can easily burn the operator. Summary of the invention

[0004] In view of the above problems existing in the prior art, an object of the present invention is to provide a system for realizing automatic semiconductor packaging.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] A system for realizing automatic semiconductor packaging, comprising a sheet arrangement machine, a press machine, an automatic mold cleaning unit, a glue removal machine, an appearance inspection unit, a robot and a master controller; the respective controllers of the sheet arrangement machine, the press machine, the automatic mold cleaning unit, the glue removal machine, the appearance inspection unit and the robot are all connected to the master controller by signal; and further comprising a black glue feeding unit, the black glue feeding unit comprising a silo, a direct vibration feeding mechanism, a circular vibration, a direct vibration feeding mechanism, a rotary feeding mechanism, a black glue grabbing mechanism and a black glue feeding controller, the direct vibration feeding mechanism Located below the silo and connected with the silo, the circular shock is located between the outlet end of the direct shock feeding mechanism and the inlet end of the direct shock feeding mechanism, the rotary feeding mechanism is located at the outlet end of the direct shock feeding mechanism, the black glue grabbing mechanism is located near the rotary feeding mechanism, and a black glue placement area is provided near the black glue grabbing mechanism, the direct shock feeding mechanism, the circular shock, the direct shock feeding mechanism, the rotary feeding mechanism and the black glue grabbing mechanism are all electrically connected to the black glue feeding controller respectively, and the black glue feeding controller is connected to the main controller signal.

[0007] In one embodiment, the direct vibration feeding mechanism includes a feeding direct vibration and a direct vibration feeding track installed on the feeding direct vibration and connected to the silo.

[0008] In a preferred embodiment, the height of the inlet end of the straight vibration feeding track is higher than the height of the outlet end of the straight vibration feeding track, and the height of the outlet end of the straight vibration feeding track is higher than the height of the circular vibration feeding track.

[0009] In a preferred embodiment, a black glue shortage detection component is provided on the circular shock for detecting whether black glue is missing in the circular shock, and the black glue shortage detection component is connected to the signal of the black glue feeding controller.

[0010] In a preferred embodiment, the direct vibration feeding mechanism comprises a feeding direct vibration and a feeding direct vibration track installed on the feeding direct vibration, and a feeding limiting mechanism is provided at the outlet end of the feeding direct vibration track.

[0011] According to a further preferred embodiment, the feed limit mechanism includes a feed limit spring, a feed limit spring shaft, a feed limit spring and a feed limit spring baffle, wherein the feed limit spring is arranged in the feed straight vibration track along the extension direction of the feed straight vibration track, the feed limit spring baffle is arranged at the upper part of the feed straight vibration track, the end of the feed limit spring is connected to the feed limit spring baffle and can move up and down along the feed limit spring baffle, the feed limit spring shaft is horizontally penetrated in the feed straight vibration track and is perpendicular to the feed straight vibration track, the feed limit spring is sleeved on the feed limit spring shaft, and the two ends of the feed limit spring are respectively connected to the feed limit spring and the feed limit spring baffle.

[0012] According to a further preferred embodiment, the top of the feed straight vibration track is vertically provided with left-right symmetrical feed straight vibration track side plates along its extension direction, an inlet end sensor is provided at the inlet end of the feed straight vibration track, and an outlet end sensor is provided at the outlet end of the feed straight vibration track.

[0013] A preferred embodiment, the rotary feeding mechanism includes a rotary feeding motor, a rotary feeding shaft, a rotary feeding coupling, a rotary feeding bearing shaft seat A with a built-in bearing, and a rotary feeding bearing shaft seat B with a built-in bearing, one end of the rotary feeding shaft is inserted into the rotary feeding bearing shaft seat A, and the other end passes through the rotary feeding bearing shaft seat B and is connected to the shaft of the rotary feeding motor through the rotary feeding coupling, a rotary feeding head is provided on the rotary feeding shaft, and the rotary feeding motor is electrically connected to the black glue feeding controller.

[0014] A further preferred solution is that a rotating feed shading disc is provided at the end of the rotating feed shaft away from the rotating feed motor, two notches are provided on the rotating feed shading disc along the circumferential direction, two shading disc sensors for detecting the notches on the rotating feed shading disc are provided near the rotating feed shading disc, and the shading disc sensors are electrically connected to the vinyl feeding controller.

[0015] A further preferred solution is that a group of through-beam sensors A for detecting whether there is black glue at the outlet end of the direct vibration feeding mechanism and a group of through-beam sensors B for detecting the height of the black glue are provided at both ends of the rotating feeding shaft, and a group of through-beam sensors C for detecting whether there is black glue in the rotating feeding head are provided at both ends of the rotating feeding head, and the through-beam sensors A, B and C are electrically connected to the black glue feeding controller respectively.

[0016] According to a further preferred embodiment, the rotary feeding mechanism comprises a rotary feeding base plate, and the rotary feeding motor, the rotary feeding bearing shaft seat A and the rotary feeding bearing shaft seat B are all mounted on the rotary feeding base plate.

[0017] In a preferred embodiment, a waste box is provided near the rotary feeding mechanism.

[0018] A preferred solution is that the black glue grabbing mechanism includes an XY-axis moving mechanism and an XY-axis driving mechanism, a finger cylinder is slidably provided on the XY-axis moving mechanism, and the finger cylinder can move on the XY-axis moving mechanism under the drive of the XY-axis driving mechanism, and the finger cylinder and the XY-axis driving mechanism are respectively electrically connected to the black glue feeding controller.

[0019] In a further preferred embodiment, the XY-axis moving mechanism includes an X-axis guide rail, a Y-axis guide rail is slidably provided on the X-axis guide rail, and the finger cylinder is slidably provided on the Y-axis guide rail; the XY-axis driving mechanism includes an X-axis driving mechanism and a Y-axis driving mechanism, the X-axis driving mechanism is connected to the Y-axis guide rail, and the Y-axis guide rail can move linearly on the X-axis guide rail under the drive of the X-axis driving mechanism, and the Y-axis driving mechanism is connected to the finger cylinder, and the finger cylinder can move linearly on the Y-axis guide rail under the drive of the Y-axis driving mechanism.

[0020] A further preferred solution is that the XY-axis moving mechanism includes two X-axis guide rails parallel to each other, an X-axis guide rail slider is slidably provided on each X-axis guide rail, the top of the X-axis guide rail slider is connected to a Y-axis platform sliding substrate, a Y-axis mechanism platform is provided on the top of the Y-axis platform sliding substrate, the Y-axis guide rail is arranged on the Y-axis mechanism platform, a Y-axis guide rail slider is slidably provided on the Y-axis guide rail, and the finger cylinder is connected to the Y-axis guide rail via the Y-axis guide slider.

[0021] In a further preferred embodiment, the X-axis driving mechanism comprises an X-axis synchronous wheel A and an X-axis synchronous wheel B respectively arranged at both ends of the X-axis guide rail, an X-axis synchronous belt is connected between the X-axis synchronous wheel A and the X-axis synchronous wheel B, the X-axis synchronous wheel A is connected to an X-axis servo motor, and the X-axis synchronous belt is connected to the Y-axis guide rail; the Y-axis driving mechanism comprises a Y-axis synchronous wheel A and a Y-axis synchronous wheel B respectively arranged at both ends of the Y-axis guide rail, a Y-axis synchronous belt is connected between the Y-axis synchronous wheel A and the Y-axis synchronous wheel B, the Y-axis synchronous wheel A is connected to the Y-axis servo motor, and the Y-axis synchronous belt is connected to the finger cylinder.

[0022] According to a further preferred embodiment, an X-axis shading sheet is provided at one end of the Y-axis guide rail close to the X-axis guide rail, and a Y-axis shading sheet is provided at the finger cylinder, and the X-axis shading sheet and the Y-axis shading sheet are electrically connected to the black glue feeding controller respectively.

[0023] According to a further preferred embodiment, a plurality of guide rail sensors are provided near the X-axis guide rail and the Y-axis guide rail, and the guide rail sensors are electrically connected to the black glue feeding controller.

[0024] In a preferred solution, a plurality of groups of opposing beam sensors are provided on both sides of the vinyl placement area.

[0025] In one embodiment, the PVC feeding unit also includes a PVC feeding control box, the PVC feeding controller is arranged in the PVC feeding control box, and a PVC feeding work surface is provided on the top of the PVC feeding control box, and the silo, direct vibration feeding mechanism, circular vibration, direct vibration feeding mechanism, rotary feeding mechanism and PVC grabbing mechanism are all installed on the PVC feeding work surface.

[0026] In one implementation scheme, the film arrangement machine, the black glue loading unit, the press machine, the glue removal machine and the appearance inspection unit are arranged in a rectangular shape, and the robot is located at the center of the rectangle.

[0027] In one embodiment, the system for realizing automatic semiconductor packaging further comprises a frame, and the sheet arrangement machine, black glue loading unit, press, glue removal machine, appearance inspection unit and robot are respectively installed on or near the frame.

[0028] A preferred embodiment, the frame includes a frame bottom plate, a plurality of frame columns distributed in a rectangular shape are vertically arranged on the frame bottom plate, a frame cross beam is connected between the tops of the frame columns on the same side, and a top cross beam is connected between two mutually parallel frame cross beams, the robot is located below the top cross beam and connected to the top cross beam, the film arrangement machine, the black glue loading unit, the glue removal machine and the appearance inspection unit are all arranged on the frame bottom plate, the press is arranged on one side of the frame, and the appearance inspection unit, the glue removal machine, the press, the film arrangement machine and the black glue loading unit are arranged around the robot in sequence in a clockwise direction.

[0029] According to a further preferred embodiment, a safety door is provided between the appearance inspection unit and the vinyl loading unit.

[0030] In one embodiment, the system for realizing automatic semiconductor packaging also includes a plurality of material racks for placing material sheets; the sheet arrangement machine is provided with a material rack placement area for placing the material racks; the debonding machine is also provided with a material rack placement area for placing the material racks.

[0031] In a preferred embodiment, the material rack comprises a material rack body, the material rack body is provided with a material placement area for placing materials, material positioning pins are provided around the material placement area, and a robot quick-change tool tray compatible with the robot is installed on one side of the material rack body.

[0032] According to a further preferred embodiment, a material rack frame is provided around the material placement area, and a positioning pin bracket for mounting the material positioning pins is provided on the material rack frame.

[0033] In one embodiment, the system for realizing automatic semiconductor packaging further comprises a black glue jig for placing black glue, and the black glue feeding unit is provided with a black glue placement area for placing the black glue jig.

[0034] A preferred solution is that the vinyl jig comprises a vinyl jig frame, on which a plurality of hollow vinyl barrels for placing vinyl are disposed, a plurality of groups of through-shooting sensors are disposed near the vinyl barrels, and a barrel baffle adapted thereto is also disposed near the vinyl barrels, the barrel baffle being capable of blocking the hollow portion of the vinyl barrel, the barrel baffle being connected to a translation drive mechanism, a robot quick-change tool tray adapted to the robot being disposed on the outer side of the vinyl jig frame, and the through-shooting sensor being connected to a master controller signal.

[0035] In a further preferred embodiment, the black plastic jig frame is further provided with a plurality of groups of sheet detection needles for detecting the sheet to be plastic-sealed, and a corresponding sheet detection sensor is provided at each group of sheet detection needles, and the sheet detection sensor is connected to the master controller by signal.

[0036] In one embodiment, the automatic mold cleaning unit includes a mold cleaning controller and a mold cleaning component for cleaning the mold surface of a press, and also includes a mold cleaning horizontal moving mechanism, a mold cleaning vertical moving mechanism is slidably provided on the mold cleaning horizontal moving mechanism, the mold cleaning component is connected to the mold cleaning vertical moving mechanism, the mold cleaning component can move up and down under the drive of the mold cleaning vertical moving mechanism, the mold cleaning vertical moving mechanism is connected to a mold cleaning transmission mechanism that can make the mold cleaning vertical moving mechanism slide horizontally on the mold cleaning horizontal moving mechanism, the mold cleaning vertical moving mechanism and the mold cleaning transmission mechanism are both electrically connected to the mold cleaning controller, and the mold cleaning controller is connected to the main controller signal.

[0037] In a preferred embodiment, the mold clearing horizontal moving mechanism comprises two mold clearing guide rails parallel to each other, each mold clearing guide rail is slidably provided with a matching mold clearing guide rail slider, and the mold clearing vertical moving mechanism is connected to the mold clearing guide rail via the mold clearing guide rail slider.

[0038] A further preferred solution is that the automatic mold clearing unit comprises two mold clearing mechanism cross beams parallel to each other, the mold clearing guide rail is installed on the mold clearing mechanism cross beam, both ends of the mold clearing mechanism cross beam are respectively provided with mold clearing mounting plates, and the automatic mold clearing unit is installed in the press (specifically, installed on the upper mold surface mounting surface of the press) through the mold clearing mounting plates.

[0039] According to a further preferred embodiment, a vertically arranged mold cleaning column is connected between the mold cleaning mechanism crossbeam and the mold cleaning mounting plate.

[0040] A preferred solution is that the mold cleaning vertical moving mechanism includes a sliding follower base plate (specifically connected to the mold cleaning guide slider) slidably connected to the mold cleaning horizontal moving mechanism, the mold cleaning transmission mechanism is connected to the sliding follower base plate, a slider cylinder is vertically provided on the sliding follower base plate, and the slider cylinder has two cylinder sliders that can be opened and closed arranged up and down; the mold cleaning assembly includes two brush assemblies symmetrically distributed up and down, and the two brush assemblies are respectively connected to their corresponding cylinder sliders.

[0041] According to a further preferred embodiment, a translation beam suspension plate is vertically provided on the sliding follower bottom plate, a translation beam support plate is horizontally provided on the translation beam suspension plate, a translation beam is provided on the translation beam support plate, and the slider cylinder is provided on the translation beam.

[0042] A preferred solution is that the mold cleaning component includes two brush assemblies symmetrically distributed up and down, the brush assembly includes a brush seat connected to a mold cleaning vertical moving mechanism and capable of moving up and down driven by the mold cleaning vertical moving mechanism, a brush head shell is horizontally provided on the brush seat, a brush seat capable of linear reciprocating motion is horizontally provided on the brush head shell, the brush seat is provided with bristles, a plurality of suction heads are provided on the brush head shell, and the suction heads are externally connected to a dust extraction device.

[0043] A further preferred solution is that a telescopic cylinder and a brush guide rail are provided on the brush guide housing, a brush guide rail slider is slidably provided on the brush guide rail, a sliding block is provided on the brush guide slider, the piston rod of the telescopic cylinder is provided on the sliding block, the brush seat is provided on the sliding block, and the brush seat can make a linear reciprocating motion along the brush guide rail under the drive of the telescopic cylinder.

[0044] According to a further preferred embodiment, the automatic mold cleaning unit also includes a vacuum cleaner container, which is provided with a plurality of air inlets and air outlets, the air inlet of the vacuum cleaner container is connected to the outlet of the suction head, the air outlet of the vacuum cleaner container is connected to the air exhaust port of the dust extraction device, and at least one vacuum cleaner is provided in the dust extraction device.

[0045] According to a further preferred embodiment, the automatic mold cleaning unit further comprises a follower bracket (specifically mounted on the translation beam) slidably connected to the mold cleaning horizontal moving mechanism, and the vacuum cleaner container is mounted on the follower bracket.

[0046] According to a further preferred embodiment, a control box is provided on the outer wall of the dust extraction device, and a mold cleaning controller and a dust extraction device controller are provided in the control box, and both the mold cleaning controller and the dust extraction device controller are connected to the main controller by signal.

[0047] A preferred solution is that the mold clearing transmission mechanism includes a mold clearing transmission motor, a mold clearing driven sprocket assembly, a mold clearing driving sprocket assembly and a mold clearing transmission chain, the mold clearing driven sprocket assembly and the mold clearing driving sprocket assembly are respectively arranged at the front and rear ends of the mold clearing horizontal moving mechanism, the mold clearing transmission motor is transmission connected to the mold clearing driving sprocket assembly, the mold clearing transmission chain is connected to the mold clearing driving sprocket assembly after bypassing the mold clearing driven sprocket assembly, and the mold clearing vertical moving mechanism is connected to the mold clearing transmission chain.

[0048] According to a further preferred embodiment, the mold clearing transmission mechanism also includes a mold clearing transmission synchronous belt, a synchronous pulley is provided on the mold clearing active sprocket assembly, a mold clearing transmission motor is provided with a mold clearing transmission motor synchronous wheel, and the mold clearing transmission synchronous belt is connected to the mold clearing transmission motor synchronous wheel after passing around the synchronous pulley.

[0049] A preferred solution, the mold clearing transmission mechanism includes two mold clearing active sprocket assemblies, two mold clearing driven sprocket assemblies and two mold clearing transmission chains; the two mold clearing active sprocket assemblies are symmetrically arranged on the left and right sides of one end of the mold clearing horizontal moving mechanism away from the mold clearing driven sprocket assembly, and the two mold clearing active sprocket assemblies share a driving sprocket shaft; the two mold clearing driven sprocket assemblies are symmetrically arranged on the left and right sides of one end of the mold clearing horizontal moving mechanism away from the mold clearing active sprocket assembly; the mold clearing active sprocket assembly and the mold clearing driven sprocket assembly on the same side are connected through the corresponding mold clearing transmission chain.

[0050] In one embodiment, the system for realizing automatic semiconductor packaging also includes a finished product jig for picking up the sheet to be debonded after plastic packaging or the finished sheet after debonding, and the debonding machine is provided with a finished product jig placement place for placing the finished product jig.

[0051] A preferred solution is that the finished jig includes a finished jig body, on which a plurality of sheet suction nozzles for sucking sheets and a plurality of sheet suction nozzle exhaust pipe joints corresponding to and connected to the sheet suction nozzles are provided, and all sheet suction nozzle exhaust pipe joints are connected to the exhaust equipment.

[0052] According to a further preferred embodiment, a robot quick-change tool tray compatible with the robot is installed on one side of the finished fixture body.

[0053] According to a further preferred embodiment, the finished jig body is also provided with a plurality of black glue overflow suction nozzles for sucking up overflowed black glue and a plurality of black glue overflow suction nozzle exhaust pipe joints corresponding to and connected to the black glue overflow suction nozzles, and all the black glue overflow suction nozzle exhaust pipe joints are connected to the exhaust equipment.

[0054] According to a further preferred embodiment, the finished jig body is further provided with a plurality of air blowing joints, and all of the air blowing joints are connected to the compressed air supply device.

[0055] In a further preferred embodiment, a jig stand is vertically provided on one side of the finished jig body, the jig stand is connected to a jig arm, and the robot quick-change tool tray is provided on a side of the jig arm away from the jig stand.

[0056] According to a further preferred embodiment, the robot quick-change tool tray is mounted on the fixture arm via a quick-change head mounting plate.

[0057] In a further preferred embodiment, reinforcing ribs are provided at the connection between the fixture stand and the fixture arm and at the connection between the fixture arm and the quick-change head mounting plate.

[0058] According to a further preferred embodiment, the robot quick-change tool tray is provided with a plurality of air extraction pipe joints and compressed air pipe joints.

[0059] In one embodiment, the appearance detection unit includes an inspection platform for placing a sheet to be inspected, a visual inspection component for inspecting the appearance of the sheet, an inspection moving mechanism, a visual image processor and an appearance inspection controller, wherein the inspection moving mechanism is arranged around the inspection platform, and the visual inspection component can be moved to the inspection platform under the drive of the inspection moving mechanism, the visual inspection component is signal-connected to the visual image processor, the visual image processor and the inspection moving mechanism are respectively electrically connected to the appearance inspection controller, and the appearance inspection controller is signal-connected to the main controller.

[0060] In a preferred solution, the appearance detection unit further includes a film and television detection substrate, and the detection platform and the detection moving mechanism are both installed on the film and television detection substrate.

[0061] In a preferred solution, a product placement area for placing tested products is provided near the testing platform.

[0062] In a preferred embodiment, the visual detection component includes a light source and a camera disposed near the light source, and the camera is signal-connected to a visual image processor.

[0063] A preferred solution, the detection moving mechanism includes an XY moving mechanism and an XY driving mechanism arranged around the detection platform, the XY moving mechanism includes an X guide rail, a Y guide rail is slidably provided on the X guide rail, the visual detection component is slidably provided on the Y guide rail, the XY driving mechanism includes an X driving mechanism and a Y driving mechanism, the X driving mechanism is connected to the Y guide rail, the Y guide rail can move linearly on the X guide rail under the drive of the X driving mechanism, the Y driving mechanism is connected to the visual detection component, the visual detection component can move linearly on the Y guide rail under the drive of the Y driving mechanism, and the XY driving mechanism is electrically connected to the appearance detection controller.

[0064] In a further preferred embodiment, the XY moving mechanism comprises two X rails parallel to each other, an X rail slider is slidably provided on each X rail, a Y mechanism sliding base plate is connected to the top of the X rail slider, the Y rail is provided on the Y mechanism sliding base plate, a Y rail slider is slidably provided on the Y rail, a Y moving slide plate is provided on the Y rail slider, the Y moving slide plate is connected to a detection mounting frame, the visual detection component is provided on the detection mounting frame, the X drive mechanism is connected to the Y mechanism sliding base plate, and the Y drive mechanism is connected to the Y moving slide plate.

[0065] According to a further preferred embodiment, two visual inspection components are symmetrically arranged on the upper and lower parts of the inspection mounting frame.

[0066] In a further preferred embodiment, the X drive mechanism comprises an X synchronous wheel A and an X synchronous wheel B respectively arranged at both ends of the X guide rail, an X synchronous belt is connected between the X synchronous wheel A and the X synchronous wheel B, the X synchronous wheel A is connected to an X servo motor, and the X synchronous belt is connected to the Y guide rail; the Y drive mechanism comprises a Y synchronous wheel A and a Y synchronous wheel B respectively arranged at both ends of the Y guide rail, a Y synchronous belt is connected between the Y synchronous wheel A and the Y synchronous wheel B, the Y synchronous wheel A is connected to a Y servo motor, and the Y synchronous belt is connected to a visual detection component.

[0067] In one implementation scheme, the robot includes a robotic arm and a robot controller, the robotic arm is electrically connected to the robot controller, the robotic arm includes a robotic arm body, a mounting base is provided on the robotic arm body, a robot end mounting plate is provided at the end of the robotic arm body, a robot quick-change main disk is provided on the robot end mounting plate, and the robot controller is signal-connected to the main controller.

[0068] In a preferred embodiment, a plurality of air extraction pipe joints and compressed air pipe joints are provided on the robot quick-change main plate.

[0069] In a further preferred embodiment, the air extraction pipe joint is connected to a vacuum pump, and the compressed air pipe joint is connected to a compressed air source.

[0070] Compared with the prior art, the beneficial technical effects of the present invention are:

[0071] By adopting the system provided by the present invention, the semiconductor packaging process can be fully automated, the semiconductor packaging operation efficiency and the quality of the packaged finished product can be significantly improved, and the production cost can be significantly reduced, which has significant industrial application value. BRIEF DESCRIPTION OF THE DRAWINGS

[0072] Figure 1 is an axonometric diagram of a system for realizing automatic semiconductor packaging provided by an embodiment of the present invention;

[0073] Figure 2 is a top view of the system according to an embodiment of the present invention;

[0074] Figure 3 is a schematic structural diagram of the mechanical arm described in an embodiment of the present invention;

[0075] Figure 4 is a schematic structural diagram of a robot quick-change main plate in an embodiment of the present invention;

[0076] Figure 5 is an axonometric view of the film arrangement machine described in an embodiment of the present invention;

[0077] Figure 6 is an axonometric view of the material support frame described in an embodiment of the present invention;

[0078] Figure 7 is an axonometric view of the vinyl loading unit described in an embodiment of the present invention;

[0079] Figure 8 is an axonometric diagram of the direct vibration feeding mechanism of the vinyl feeding unit described in the embodiment of the present invention;

[0080] Fig. 9 is an axonometric diagram of the rotary feeding mechanism of the vinyl feeding unit described in the embodiment of the present invention;

[0081] Fig.10 is an axonometric diagram of a black glue grabbing mechanism of a black glue feeding unit described in an embodiment of the present invention;

[0082] Fig.11 is a top view of the black glue grabbing mechanism of the black glue feeding unit described in the embodiment of the present invention;

[0083] Fig.12 It is a partial structural schematic diagram of a black glue grabbing mechanism of a black glue feeding unit described in an embodiment of the present invention;

[0084] Fig.13 is an axonometric view of the black glue jig described in an embodiment of the present invention;

[0085] Fig.14 is a front view of the black glue jig described in an embodiment of the present invention;

[0086] Fig.15 is a side view of the black glue jig described in an embodiment of the present invention;

[0087] Fig.16 is an axonometric view of the automatic mold clearing unit described in an embodiment of the present invention;

[0088] Fig.17 is a front view of the automatic mold clearing unit described in an embodiment of the present invention;

[0089] Fig.18 Schematic diagram of the partial structure of the automatic mold clearing unit in the embodiment of the present invention;

[0090] Fig.19 is a bottom view of the automatic mold clearing unit described in an embodiment of the present invention;

[0091] Fig. 20 is a side view of the brush assembly of the automatic mold cleaning unit in an embodiment of the present invention;

[0092] Fig.21 is an axonometric view of a brush assembly of the automatic mold cleaning unit described in an embodiment of the present invention;

[0093] Fig. 22 is an axonometric view of a vacuum cleaner container of the automatic mold cleaning unit described in an embodiment of the present invention;

[0094] Fig.23 is a schematic structural diagram of the dust extraction device described in an embodiment of the present invention;

[0095] Fig.24 is an axonometric view of the glue removal machine described in an embodiment of the present invention;

[0096] Fig.25 is an axonometric view of the finished fixture described in an embodiment of the present invention;

[0097] Fig.26 is a front view of the finished fixture described in an embodiment of the present invention;

[0098] Fig. 27 is an axonometric diagram of the appearance detection unit described in an embodiment of the present invention;

[0099] Fig.28 is an axonometric diagram of the appearance detection unit in an embodiment of the present invention at another viewing angle;

[0100] Fig.29 is an axonometric diagram of the detection moving mechanism of the appearance detection unit described in the embodiment of the present invention;

[0101] Fig.30 is an axonometric diagram of the detection moving mechanism of the appearance detection unit described in the embodiment of the present invention at another viewing angle;

[0102] The numbers in the figure are as follows:

[0103] 01. Film arrangement machine; 11. Material rack and hanger; 12. Film arrangement table;

[0104] 02, vinyl feeding unit; 21, silo; 22, direct vibration feeding mechanism; 221, direct vibration feeding; 222, direct vibration feeding track; 23, circular vibration; 24, direct vibration feeding mechanism; 241, direct vibration feeding; 242, direct vibration feeding track; 243, feeding limit mechanism; 2431, feeding limit spring; 2432, feeding limit spring shaft; 2433, feeding limit spring; 2434, feeding limit 244, feed straight vibration track side plate; 245, inlet end sensor; 246, outlet end sensor; 25, rotary feeding mechanism; 251, rotary feeding motor; 252, rotary feeding shaft; 253, rotary feeding coupling; 254, rotary feeding bearing seat A; 255, rotary feeding bearing seat B; 256, rotary feeding head; 257, rotary feeding shielding disc; 258, Shielding disc sensor; 259, through-beam sensor A; 2510, through-beam sensor B; 2511, through-beam sensor C; 2512, rotating feeding base plate; 2513, rotating feeding motor seat; 26, black glue grabbing mechanism; 261, finger cylinder; 262, X-axis guide rail; 263, Y-axis guide rail; 264, X-axis guide rail slider; 265, Y-axis platform sliding base plate; 266, Y-axis mechanism platform; 267, Y-axis guide rail slider; 268, X-axis synchronous wheel A; 269, X-axis synchronous wheel B; 2610, X-axis synchronous belt; 2611, X-axis servo motor; 2612, Y-axis synchronous wheel A; 2613, Y-axis synchronous wheel B; 2614, Y-axis synchronous belt; 2615, Y Axis servo motor; 2616, cylinder mounting slide; 2617, cylinder base plate; 2618, slide cylinder seat; 2619, slide cylinder; 2620, the gripper of the finger cylinder; 2621, the cylinder through-shooting sensor; 2622, the X-axis idler fixing frame; 2623, the X-axis idler shaft; 2624, the Y-axis idler fixing frame; 2625, the Y-axis idler shaft; 2626, the X-axis belt connecting block; 2627, the X-axis belt clamping block; 2628, the Y-axis belt connecting block; 2629, the Y-axis belt clamping block; 2630, the X-axis shading sheet; 2631, the Y-axis shading sheet; 2632, the guide rail sensor; 27, the black glue placement area; 28, the black glue shortage detection component; 29, the waste box; 210, the through-shooting sensor; 211, the in-position sensor; 212, the black glue feeding control box; 213, the black glue feeding work surface; 214, the fixture positioning pin;

[0105] 03. Press;

[0106] 04, automatic mold cleaning unit; 41, mold cleaning assembly; 411, brush assembly; 4111, brush seat; 4112, brush head housing; 4113, brush seat; 4114, head; 4115, telescopic cylinder; 4116, brush guide rail; 4117, brush guide rail slider; 4118, sliding block; 42, mold cleaning horizontal moving mechanism; 421, mold cleaning guide rail; 422, mold cleaning guide rail slider; 43, mold cleaning vertical moving mechanism; 431, sliding follower bottom plate; 432, slider cylinder; 433, translation beam suspension vertical plate; 434, translation beam support plate; 435, translation beam; 44, mold cleaning transmission mechanism; 441, mold cleaning transmission motor; 442, mold cleaning driven sprocket assembly; 443, mold cleaning driving sprocket assembly; 444, mold cleaning transmission chain; 445, driven sprocket bearing seat; 446, driving sprocket bearing seat; 447, chain pressure block; 448, mold cleaning transmission synchronous belt; 449, synchronous belt pulley; 4410, mold cleaning transmission motor synchronous wheel; 4411, driving sprocket shaft; 45, mold cleaning mechanism crossbeam; 46, mold cleaning mounting plate; 47, mold cleaning column; 48, vacuum cleaner container; 481, vacuum cleaner container air inlet; 482, vacuum cleaner container air outlet; 49, follower bracket;

[0107] 05. Glue removal machine; 51. Finished fixture hanger; 52. Glue removal work surface;

[0108] 06, appearance inspection unit; 61, inspection platform; 62, visual inspection component; 621, light source; 622, camera; 63, inspection moving mechanism; 631, X guide rail; 632, Y guide rail; 633, X guide rail slider; 634, Y mechanism sliding base plate; 635, Y guide rail slider; 636, Y moving slide plate; 637, inspection mounting frame; 638, X synchronous wheel A; 639, X synchronous wheel B; 6310, X synchronous belt; 6311, X servo motor; 6312, Y synchronous wheel A; 6313, Y synchronous wheel B; 6314, Y synchronous belt; 6315, Y servo motor; 6316, X belt connecting block; 6317, X belt pressing block; 6318, Y belt connecting block; 6319, Y belt pressing block; 6320, X idler shaft fixing frame; 6321, X idler shaft; 6322, Y idler shaft fixing frame; 6323, Y idler shaft; 64, film and television detection substrate; 65, product placement area; 66, platform pillar; 67, column; 68, appearance detection rack; 69, appearance detection chassis; 610, display; 611, protective cover; 612, safety door sensor; 613, bracket;

[0109] 07, robot; 71, robotic arm; 711, robotic arm body; 712, mounting base plate; 713, robot end mounting plate; 714, robot quick-change main plate; 7141, exhaust pipe joint; 7142, compressed air pipe joint; 72, robot controller;

[0110] 08, rack; 81, rack bottom plate; 82, rack column; 83, rack crossbeam; 84, top crossbeam;

[0111] 09. Security door;

[0112] 010, material rack; 101, sheet placement area; 102, sheet positioning pin; 103, robot quick-change tool tray on the material rack; 104, material rack frame; 105, positioning pin bracket; 106, tablet press; 107, quick-change head mounting plate on the material rack; 108, material arm; 109, reinforcing rib plate on the material rack;

[0113] 011, vinyl jig; 111, vinyl jig frame; 112, vinyl barrel; 113, through-beam sensor in vinyl jig; 114, barrel baffle; 115, translation drive mechanism; 116, robot quick-change tool tray in vinyl jig; 1161, air pipe joint; 117, mounting crossbeam; 118, baffle bracket; 119, spring; 1110, sheet detection needle; 1111, sheet detection sensor; 1112, sheet detection needle bracket; 1113, positioning sleeve;

[0114] 012, dust extraction equipment; 121, air extraction port; 122, control box; 123, gap;

[0115] 013, finished fixture; 131, finished fixture body; 132, sheet suction nozzle; 133, sheet suction nozzle exhaust pipe joint; 134, robot quick-change tool tray; 135, vinyl overflow suction nozzle; 136, vinyl overflow suction nozzle exhaust pipe joint; 137, blow joint; 138, fixture vertical plate; 139, fixture arm; 1310, quick-change head mounting plate; 1311, reinforcement rib; 1312, exhaust pipe joint; 1313, compressed air pipe joint; 1314, blow pipe joint. DETAILED DESCRIPTION

[0116] The technical solution of the present invention will be further described in detail below in conjunction with the embodiments and drawings.

[0117] Example

[0118] like Figures 1 to 30As shown: the present invention provides a system for realizing automatic semiconductor packaging, including a sheet arrangement machine 01, a press machine 03, an automatic mold cleaning unit 04, a glue removal machine 05, an appearance inspection unit 06, a robot 07 and a master controller (not shown), wherein the respective controllers of the sheet arrangement machine 01, the press machine 03, the automatic mold cleaning unit 04, the glue removal machine 05, the appearance inspection unit 06 and the robot 07 are all connected to the master controller by signal; and further includes a black glue feeding unit 02, wherein the black glue feeding unit 02 includes a silo 21, a straight vibration feeding mechanism 22, a circular vibration 23, a straight vibration feeding mechanism 24, a rotary feeding mechanism 25, a black glue grabbing mechanism Mechanism 26 and a black glue feeding controller (not shown), the direct vibration feeding mechanism 22 is located below the silo 21 and is connected to the silo 21, the circular vibration 23 is located between the outlet end of the direct vibration feeding mechanism 22 and the inlet end of the direct vibration feeding mechanism 24, the rotary feeding mechanism 25 is located at the outlet end of the direct vibration feeding mechanism 24, the black glue grabbing mechanism 26 is located near the rotary feeding mechanism 25, and a black glue placement area 27 is provided near the black glue grabbing mechanism 26, the direct vibration feeding mechanism 22, the circular vibration 23, the direct vibration feeding mechanism 24, the rotary feeding mechanism 25 and the black glue grabbing mechanism 26 are all electrically connected to the black glue feeding controller respectively, and the black glue feeding controller is connected to the main controller signal.

[0119] When the above system of the present invention is used for semiconductor packaging:

[0120] The sheets to be plastic-sealed are arranged by the sheet arranging machine 01, taken out by the robot 07 and placed in the press 03;

[0121] The black glue used for plastic sealing sheets is placed by the black glue loading unit 02 and then put into the press 03 by the robot 07. Specifically: the black glue falls into the direct vibration feeding mechanism 22 through the material bin 21 (the bottom of the material bin 21 has an opening or an openable and closable outlet, so that the material bin 21 is connected with the direct vibration feeding mechanism 22, so that the black glue falls into the direct vibration feeding mechanism 22 through the material bin 21), and then is transported to the circular vibration 23, and after being arranged by the circular vibration 23, it is transported to the direct vibration feeding mechanism 24 (the circular vibration 23 rotates and vibrates to arrange the black glue in the circular vibration 23 neatly and transport it to the direct vibration feeding mechanism 24), and then is obtained by the rotary feeding mechanism 25, the black glue grabbing mechanism 26 grabs the black glue on the rotary feeding mechanism 25 and places the black glue in the black glue placement area 27, and then is put into the press 03 by the robot 07;

[0122] After the blank and the black glue are placed in the press 03, the press 03 completes the plastic sealing process of the blank;

[0123] The plastic-sealed sheet is taken out by the robot 07 and placed in the de-glueing machine 05, which de-glueizes the plastic-sealed sheet.

[0124] The sheet after the debonding process is taken out by the robot 07 and placed in the appearance inspection unit 06, which automatically inspects the appearance of the sheet;

[0125] The sheet after appearance inspection is taken out by robot 07 and placed in the designated sheet storage place; the automatic mold cleaning unit 04 is installed in the press 03, and before the plastic-sealed sheet is placed in the press 03 and after the plastic-sealed sheet is taken out of the press 03, the automatic mold cleaning unit 04 moves to the upper and lower mold surfaces of the press 03 to automatically clean the upper and lower mold surfaces of the press 03, and then returns to its original position after cleaning;

[0126] In the system, the film arrangement machine 01, the black glue loading unit 02, the press 03, the automatic mold cleaning unit 04, the glue removal machine 05, the appearance inspection unit 06 and the robot 07 all have their own controllers (for example, the black glue loading unit 02 has a corresponding black glue loading controller). Since the main controller is signal-connected with the controllers of the film arrangement machine 01, the black glue loading unit 02, the press 03, the automatic mold cleaning unit 04, the glue removal machine 05, the appearance inspection unit 06 and the robot 07, the present invention can realize the automatic operation of the entire system by collecting signals from the controllers of the film arrangement machine 01, the black glue loading unit 02, the press 03, the automatic mold cleaning unit 04, the glue removal machine 05, the appearance inspection unit 06 and the robot 07 through the main controller, so as to integrate the existing discrete processes, effectively avoid the many defects existing in manual operation, significantly improve the efficiency of semiconductor packaging operations, ensure the quality of packaging products and significantly reduce production costs.

[0127] The sheet arrangement machine 01, press machine 03, glue path removal machine 05 and robot 07 used in this embodiment are all commercially available products with built-in controllers.

[0128] See also Figure 7 As shown:

[0129] The direct vibration feeding mechanism 22 includes a feeding direct vibration 221 and a direct vibration feeding track 222 installed on the feeding direct vibration 221 and connected to the material bin 21. The black glue falls from the material bin 21 onto the direct vibration feeding track 222, and the feeding direct vibration 221 drives the direct vibration feeding track 222 to vibrate together, thereby feeding the black glue into the circular vibration 23.

[0130] In addition, the height of the inlet end of the straight vibration feeding track 222 is higher than the height of the outlet end of the straight vibration feeding track 222, and the height of the outlet end of the straight vibration feeding track 222 is higher than the height of the round vibration 23, so that the straight vibration feeding track 222 can transfer the black glue to the round vibration 23. The round vibration 23 is provided with a black glue shortage detection component 28 for detecting whether the black glue in the round vibration 23 is missing, and the black glue shortage detection component 28 is electrically connected to the black glue feeding controller. When in use, the black glue shortage detection component 28 detects whether the black glue in the round vibration 23 is missing, and feeds back the detection result to the black glue feeding controller to ensure the continuous delivery of the black glue.

[0131] See also Figure 8 As shown:

[0132] The direct vibration feeding mechanism 24 includes a feed direct vibration 241 and a feed direct vibration track 242 installed on the feed direct vibration 241. A feed limiting mechanism 243 is provided at the outlet end of the feed direct vibration track 242. The feed limiting mechanism 243 includes a feed limiting spring 2431, a feed limiting spring shaft 2432, a feed limiting spring 2433 and a feed limiting spring baffle 2434. The feed limiting spring 2431 is arranged in the feed direct vibration track 242 along the extension direction of the feed direct vibration track 242. The feed limiting spring baffle 2434 is arranged on the upper part of the feed direct vibration track 242. The end of the feed limiting spring 2431 is aligned with the feed limiting spring shaft 2432. The feed limit spring baffle 2434 is connected and can move up and down along the feed limit spring baffle 2434. The feed limit spring shaft 2432 is horizontally penetrated in the feed straight vibration track 242 and is perpendicular to the feed straight vibration track 242. The feed limit spring 2433 is sleeved on the feed limit spring shaft 2432, and the two ends of the feed limit spring 2433 are respectively connected to the feed limit spring 2431 and the feed limit spring baffle 2434. When in use, the black glue is sequentially sent to the feed straight vibration track 242 through the circular vibration 23, and the feed straight vibration 241 drives the feed straight vibration track 242 to vibrate together, and the black glue is sent toward the outlet end of the feed straight vibration track 242 until the black glue hits the feed limit spring 2431 and cannot move forward.

[0133] At the top of the feed straight vibration track 242, a left-right symmetrical feed straight vibration track side plate 244 is vertically provided along its extension direction. An inlet end sensor 245 is provided at the inlet end of the feed straight vibration track 242, and an outlet end sensor 246 is provided at the outlet end of the feed straight vibration track. The inlet end sensor 245 is used to detect whether the black glue enters the feed straight vibration track 242, and the outlet end sensor 246 is used to detect whether the black glue reaches the outlet end of the feed straight vibration track. The inlet end sensor 245 and the outlet end sensor 246 are electrically connected to the black glue feeding controller respectively. When the black glue is transmitted to the outlet end of the feed straight vibration track 242, the outlet end sensor 246 detects the black glue information and transmits the signal to the black glue feeding controller. The black glue feeding controller starts the rotary feeding mechanism 25, and the rotary feeding mechanism 25 presses down the feed limit spring piece 2431 in the feed limit mechanism 243 and mates with the feed. The material is connected to the straight vibration track 242, and the feed limit spring piece 2431 cannot limit the forward movement of the black glue, and the black glue can reach the rotating feeding mechanism 25 and be obtained by the rotating feeding mechanism 25. When the black glue is obtained by the rotating feeding mechanism 25, the rotating feeding mechanism 25 is separated from the feed straight vibration track 242, and the feed limit spring piece 2431 is not subjected to the pressure of the rotating feeding mechanism 25, and can return to the initial position under the action of the feed limit spring piece shaft 2432, so that it can play a blocking role for the next black glue that is about to arrive.

[0134] The rotary feeding mechanism 25 includes a rotary feeding motor 251, a rotary feeding shaft 252, a rotary feeding coupling 253, a rotary feeding bearing seat A254 with a built-in bearing, and a rotary feeding bearing seat B255 with a built-in bearing. One end of the rotary feeding shaft 252 is inserted into the rotary feeding bearing seat A254, and the other end passes through the rotary feeding bearing seat B255 and is connected to the shaft of the rotary feeding motor 251 through the rotary feeding coupling 253. A rotary feeding head 256 is provided on the rotary feeding shaft 252, and the rotary feeding motor 251 is electrically connected to the black glue feeding controller. When the black glue is conveyed to the exit end of the feeding straight vibration track 242, the rotary feeding motor 251 is started, and the rotary feeding motor 251 rotates, thereby driving the rotary feeding shaft 252 to rotate, and then driving the rotary feeding head 256 to rotate, until the rotary feeding head 256 is connected to the feeding straight vibration track 242, and the rotary feeding motor 251 stops rotating, and the black glue on the feeding straight vibration track 242 can enter the rotary feeding head 256 (the rotary feeding head 256 presses down the feeding limit spring piece 2431 on the feeding straight vibration track 242, so that the black glue is no longer blocked, and the black glue can enter the rotary feeding head 256 from the feeding straight vibration track 242), so that it can be obtained by the rotary feeding mechanism 25, After the vinyl is obtained, the rotary feeding motor 251 rotates in the opposite direction, driving the rotary feeding head 256 carrying the vinyl to separate from the feed straight vibration track 242 and return to the initial position. At this time, the vinyl grabbing mechanism 26 can move to the rotary feeding mechanism 25 and then grab the vinyl in the rotary feeding head 256 and place it in the vinyl placement area 27 to facilitate subsequent transportation by the robot 07.

[0135] A rotating feeding shielding disc 257 is provided at one end of the rotating feeding shaft 252 away from the rotating feeding motor 251, and two notches are provided on the rotating feeding shielding disc 257 along the circumferential direction (in this embodiment, the angle between the two notches can be set to 171 degrees), and two shielding disc sensors 258 for detecting the notches on the rotating feeding shielding disc 257 are provided near the rotating feeding shielding disc 257, and the shielding disc sensors 258 are electrically connected to the vinyl feeding controller. The shielding disc sensor 258 is used to detect the notches on the rotating feeding shielding disc 257, and then detect and control the rotation of the rotating feeding motor 251 and the rotating feeding shaft 252. Specifically, when the shielding disc sensor 258 detects the notches on the rotating feeding shielding disc 257 and feeds back the detection information to the vinyl feeding controller, the vinyl feeding controller controls the rotating feeding motor 251 to stop rotating. Therefore, the combination of the rotating feeding shielding disc 257 and the shielding disc sensor 258 can also be regarded as an automatic control switch of the rotating feeding motor 251.

[0136] A set of through-beam sensors A259 for detecting whether there is black glue at the outlet end of the direct vibration feeding mechanism 24 and a set of through-beam sensors B2510 for detecting the height of black glue are provided at both ends of the rotary feeding shaft 252; a set of through-beam sensors C2511 for detecting whether there is black glue in the rotary feeding head 256 are provided at both ends of the rotary feeding head 256, and the through-beam sensors A259, B2510 and C2511 are electrically connected to the black glue feeding controller respectively. During use, the through-beam sensor A259 is used to detect whether the black glue in the direct vibration feeding mechanism 24 is in place, so that the black glue feeding controller decides whether to start the rotary feeding mechanism 25 according to the through-beam sensor A259, the through-beam sensor B2510 is used to detect the height of black glue to prevent the black glue from being of unqualified quality, and the through-beam sensor C2511 is used to detect whether there is black glue in the rotary feeding head 256. The above design can better play a role in automatic detection and control of the operation of the rotary feeding mechanism 25.

[0137] The rotary feeding mechanism 25 includes a rotary feeding bottom plate 2512, and the rotary feeding motor 251, the rotary feeding bearing shaft seat A254, and the rotary feeding bearing shaft seat B255 are all installed on the rotary feeding bottom plate 2512, which plays a role in fixing the rotary feeding mechanism 25 as a whole. In addition, the rotary feeding mechanism 25 includes a rotary feeding motor seat 2513 for installing the rotary feeding motor 251. Specifically, the rotary feeding motor seat 2513 is installed at one end of the rotary feeding coupling 253 away from the rotary feeding bearing shaft seat B255.

[0138] In addition, a waste box 29 is provided near the rotating feeding mechanism 25. Specifically, a waste box 29 is provided below the rotating feeding mechanism 25. When the black glue has quality defects (for example, when the through-beam sensor B259 detects that the height of the black glue is unqualified), the black glue falls directly into the waste box 29 from the outlet end of the direct vibration feeding mechanism 24.

[0139] Recombination Figures 10 to 12 As shown:

[0140] The black glue grabbing mechanism 26 includes an XY axis moving mechanism and an XY axis driving mechanism arranged around the black glue placement area 27. A finger cylinder 261 is slidably arranged on the XY axis moving mechanism. The finger cylinder 261 can move on the XY axis moving mechanism under the drive of the XY axis driving mechanism. The finger cylinder 261 and the XY axis driving mechanism are electrically connected to the black glue feeding controller respectively. When in use, the black glue placement area 27 can be installed with a fixture for placing black glue. The black glue grabbing mechanism 26 moves the finger cylinder 261 to the rotating feeding mechanism 25, grabs the black glue from the rotating feeding mechanism 25, and uniformly places the black glue on the fixture. The robot uniformly puts the black glue in batches into the press 03 for subsequent sheet plastic sealing operations. Specifically, in this embodiment, the XY-axis moving mechanism includes an X-axis guide rail 262, on which a Y-axis guide rail 263 is slidably provided, and the finger cylinder 261 is slidably provided on the Y-axis guide rail 263; the XY-axis driving mechanism includes an X-axis driving mechanism and a Y-axis driving mechanism, the X-axis driving mechanism is connected to the Y-axis guide rail 263, and the Y-axis guide rail 263 can move linearly on the X-axis guide rail 262 under the drive of the X-axis driving mechanism, and the Y-axis driving mechanism is connected to the finger cylinder 261, and the finger cylinder 261 can move linearly on the Y-axis guide rail 263 under the drive of the Y-axis driving mechanism.

[0141] Furthermore, the XY axis moving mechanism includes two X axis guide rails 262 parallel to each other, each X axis guide rail 262 is slidably provided with an X axis guide rail slider 264, the top of the X axis guide rail slider 264 is connected with a Y axis platform sliding base plate 265, a Y axis mechanism platform 266 is provided on the top of the Y axis platform sliding base plate 265, the Y axis guide rail 263 is provided on the Y axis mechanism platform 266, a Y axis guide rail slider 267 is slidably provided on the Y axis guide rail 263, and the finger cylinder 261 is connected to the Y axis guide rail 263 through the Y axis guide rail slider 267. The X axis driving mechanism is connected to the Y axis platform sliding base plate 265, and then indirectly connected to the Y axis guide rail 263. The two X axis guide rails 262 can better balance and stabilize the Y axis guide rail 263, and can enhance the balance and stability of the XY axis moving mechanism.

[0142] Furthermore, the X-axis driving mechanism includes an X-axis synchronous wheel A268 and an X-axis synchronous wheel B269 respectively arranged at both ends of the X-axis guide rail 262, an X-axis synchronous belt 2610 is connected between the X-axis synchronous wheel A268 and the X-axis synchronous wheel B269, the X-axis synchronous wheel A268 is connected to an X-axis servo motor 2611, and the X-axis synchronous belt 2610 is connected to the Y-axis guide rail 263; the Y-axis driving mechanism includes a Y-axis synchronous wheel A2612 and a Y-axis synchronous wheel B2613 respectively arranged at both ends of the Y-axis guide rail 263, a Y-axis synchronous belt 2614 is connected between the Y-axis synchronous wheel A2612 and the Y-axis synchronous wheel B2613, the Y-axis synchronous wheel A2612 is connected to a Y-axis servo motor 2615, and the Y-axis synchronous belt 2614 is connected to the finger cylinder 261. The X-axis synchronous wheel A 268, the X-axis synchronous wheel B 269, the X-axis synchronous belt 2610, and the X-axis servo motor 2611 constitute a belt-transmission type X-axis driving mechanism. During installation, the X-axis synchronous belt 2610 is connected to the Y-axis platform sliding base plate 265, thereby connecting the X-axis driving mechanism to the Y-axis guide rail 263; the Y-axis synchronous wheel A 2612, the Y-axis synchronous wheel B 2613, the Y-axis synchronous belt 2614, and the Y-axis servo motor 2615 constitute a belt-transmission type Y-axis driving mechanism. During installation, the Y-axis synchronous belt 2614 is connected to the finger cylinder 261, thereby connecting the Y-axis driving mechanism to the finger cylinder 261.

[0143] During installation, a cylinder mounting slider 2616 is provided on the Y-axis guide rail slider 267, a cylinder base plate 2617 is installed on the cylinder mounting slider 2616, a slide cylinder seat 2618 is provided on the cylinder base plate 2617, a slide cylinder seat 2618 is provided on the slide cylinder seat 2619, and the finger cylinder 261 is installed on the slide cylinder 2619, so that the finger cylinder 261 can be slidably installed on the Y-axis guide rail 263. In addition, a cylinder counter-shooting sensor 2621 is provided on the clamping claw 2620 of the finger cylinder 261 to detect the grasping condition of the finger cylinder 261.

[0144] During installation, an X-axis idler wheel fixing frame 2622 is installed at the X-axis synchronous wheel B 269, an X-axis idler wheel shaft 2623 is installed in the X-axis idler wheel fixing frame 2622, and the X-axis synchronous wheel B 269 is installed in the X-axis idler wheel fixing frame 2622 through the X-axis idler wheel shaft 2623; correspondingly, a Y-axis idler wheel fixing frame 2624 is installed at the Y-axis synchronous wheel B 2613, a Y-axis idler wheel shaft 2625 is installed in the Y-axis idler wheel fixing frame 2624, and the Y-axis synchronous wheel B 2613 is installed in the Y-axis idler wheel fixing frame 2624 through the Y-axis idler wheel shaft 2625.

[0145] During installation, an X-axis belt connecting block 2626 is provided on the Y-axis platform sliding base plate 265, and an X-axis belt clamping block 2627 is provided on the X-axis belt connecting block 2626. The X-axis belt clamping block is connected to the X-axis synchronous belt 2610, so that the X-axis synchronous belt 2610 is connected to the Y-axis platform sliding base plate 265, and then the X-axis drive mechanism is connected to the Y-axis guide rail 263; correspondingly, a Y-axis belt connecting block 2628 is provided on the cylinder mounting slider 2616, and a Y-axis belt clamping block 2629 is provided on the Y-axis belt connecting block 2628, and the Y-axis belt clamping block 2629 is connected to the Y-axis synchronous belt 2614, so that the cylinder mounting slider 2616 is connected to the Y-axis synchronous belt 2614, and then the Y-axis drive mechanism is connected to the finger cylinder 261.

[0146] In addition, an X-axis light shielding sheet 2630 is provided at one end of the Y-axis guide rail 263 close to the X-axis guide rail 262, and a Y-axis light shielding sheet 2631 is provided at the finger cylinder 261, and the X-axis light shielding sheet 2630 and the Y-axis light shielding sheet 2631 are respectively electrically connected to the black glue feeding controller. The X-axis light shielding sheet 2630 can be used to feedback the position of the Y-axis guide rail 263 running on the X-axis guide rail 262, and the Y-axis light shielding sheet 2631 can be used to feedback the position of the finger cylinder 261 running on the Y-axis guide rail 263. A plurality of guide rail sensors 2632 are provided near the X-axis guide rail 262 and the Y-axis guide rail 263, and the guide rail sensors 2632 are electrically connected to the black glue feeding controller.

[0147] In addition, a plurality of groups of beam sensors 210 are provided on both sides of the vinyl placement area 27 to detect the placement of the vinyl in the vinyl placement area 27. In addition, a position sensor 211 is provided at the vinyl placement area 27 to detect whether a fixture for placing the vinyl is in place.

[0148] In addition, the black glue feeding unit 02 also includes a black glue feeding control box 212, the black glue feeding controller is arranged in the black glue feeding control box 212, and a black glue feeding work surface 213 is arranged on the top of the black glue feeding control box 212. The silo 21, the direct vibration feeding mechanism 22, the circular vibration 23, the direct vibration feeding mechanism 24, the rotary feeding mechanism 25 and the black glue grabbing mechanism 26 are all installed on the black glue feeding work surface 213. The black glue placement area 27 is also arranged on the black glue feeding work surface 213. In addition, a plurality of fixture positioning pins 214 for positioning the fixture for placing the black glue are arranged at the black glue placement area 27 on the black glue feeding work surface 213.

[0149] Recombination Figure 1 and Figure 2 visible:

[0150] In this embodiment, the film arrangement machine 01, the black glue loading unit 02, the press machine 03, the glue removal machine 05 and the appearance inspection unit 06 are distributed in a rectangular shape as a whole. The robot 07 is located at the center of the rectangle formed by the film arrangement machine 01, the black glue loading unit 02, the press machine 03, the glue removal machine 05 and the appearance inspection unit 06, so that the robot 07 can transport the corresponding products (sheets, black glue, etc.) to the corresponding positions, and can effectively save the floor space of the entire system and make the layout more compact.

[0151] The system for realizing automatic semiconductor packaging also includes a rack 08 , and the sheet arrangement machine 01 , the black glue loading unit 02 , the press machine 03 , the glue removal machine 05 , the appearance inspection unit 06 and the robot 07 are respectively installed on the rack 08 or near the rack 08 . Specifically, the frame 08 includes a frame bottom plate 81, on which a plurality of frame columns 82 distributed in a rectangular shape are vertically arranged, a frame crossbeam 83 is connected between the tops of the frame columns 82 on the same side, and a top crossbeam 84 is connected between two mutually parallel frame crossbeams 83, the robot 07 is located below the top crossbeam 84 and connected to the top crossbeam 84, the film arrangement machine 01, the black glue loading unit 02, the glue removal machine 05 and the appearance inspection unit 06 are all arranged on the frame bottom plate 81, the press 03 is arranged on one side of the frame 01, and the appearance inspection unit 06, the glue removal machine 05, the press 03, the film arrangement machine 01 and the black glue loading unit 02 are arranged around the robot 07 in sequence in a clockwise direction.

[0152] In addition, a safety door 09 is provided between the appearance inspection unit 06 and the vinyl loading unit 02 .

[0153] The system for realizing automatic semiconductor packaging also includes a plurality of material racks 010 for placing material sheets; the sheet arranging machine 01 is provided with a material rack placement area (for example, a material rack hanger 11) for placing the material racks 010; the debonding machine 05 is also provided with a material rack placement area (not shown) for placing the material racks 010. When in use, the material racks 010 are placed on the sheet arranging table of the sheet arranging machine 01 for sheet arranging. After the sheet arranging is completed, the robot 07 places the material racks 010 carrying the material sheets into the press 03 for plastic sealing. After the plastic sealing is completed, the robot 07 takes out the material racks 010 carrying the plastic sealing from the press 03 and places it on the debonding machine 05 for debonding. The setting of multiple material receiving racks 010 can effectively ensure the circulation and continuation of material sheet packaging during the entire packaging process, and can effectively improve the packaging efficiency. For example, when packaging multiple batches of material sheets, first place a material receiving rack 010 of the sheet arranging machine 01 on the sheet arranging table 12 of the sheet arranging machine 01 to arrange the material sheets of the previous batch. After the arrangement is completed, plastic sealing, de-glueing and other subsequent operations are performed in sequence. When the previous batch of material sheets is subjected to subsequent operations after the arrangement, the robot places another material receiving rack 010 placed on the sheet arranging machine 01 on the sheet arranging table 12 of the sheet arranging machine 01 to arrange the material sheets of the next batch. After the arrangement is completed, plastic sealing, de-glueing and other subsequent operations are performed in sequence; and, after the de-glueing process is completed for the previous batch of material sheets, the robot can put the material receiving rack 010 used by the previous batch of material sheets back onto the sheet arranging machine 01; in this way, the circulation, uninterrupted and continuous packaging of the material sheets can be ensured.

[0154] See also Figure 6 As shown: the material support rack 010 includes a material support body, on which a material placement area 101 for placing material sheets is provided, material positioning pins 102 are provided around the material placement area 101, and a robot quick-change tool tray 103 adapted to the robot 07 is installed on one side of the material support body. When in use, the material sheet is placed in the material placement area 101, the material positioning pins 102 can position the placement of the material sheet, and the robot quick-change tool tray 103 facilitates the robot to quickly pick up and place the material support rack 010. A material support frame 104 is provided around the material placement area 101, and a positioning pin bracket 105 for mounting the material positioning pins 102 is provided on the material support frame 104. In addition, a pressing sheet 106 is provided on the material support body, and the positioning pin bracket 105 is fixed to the material support frame 104 through the pressing sheet 106. In order to facilitate the installation of the robot quick-change tool tray 103, a quick-change head mounting plate 107 is provided on one side of the material rack body, and the robot quick-change tool tray 103 is mounted on the material rack body through the quick-change head mounting plate 107. In addition, a material support arm 108 is provided between the material rack frame 104 and the quick-change head mounting plate 107, and a reinforcing rib plate 109 is provided at the connection between the material support arm 108 and the quick-change head mounting plate 107.

[0155] Recombination Figures 13 to 15 As shown:

[0156] The system for realizing automatic semiconductor packaging also includes a black glue jig 011 for placing black glue, and accordingly, the black glue feeding unit 02 is provided with a black glue placement area 27 for placing the black glue jig 011. When installing, the black glue jig 011 is installed in the black glue placement area 27 of the black glue feeding unit 02. When in use, the black glue is placed in the black glue jig 011 through the black glue feeding unit 02, and the robot moves the black glue jig 011 with the black glue placed to the press 03 so that the black glue in the black glue jig 011 is placed in the press 03. Specifically, the black glue grabbing mechanism 26 grabs the black glue from the rotating feeding mechanism 25 and places the black glue in the black glue jig 011 in turn.

[0157] The vinyl jig 011 includes a vinyl jig frame 111, on which are disposed a plurality of hollow vinyl barrels 112 for placing vinyl, and near the vinyl barrels 112 are disposed a plurality of groups of through-shooting sensors 113, and near the vinyl barrels 112 are disposed a barrel baffle 114 adapted thereto, which can block the hollow portion of the vinyl barrel 112, and the barrel baffle 114 is connected to a translation drive mechanism 115, and a robot quick-change tool tray 116 adapted to the robot 07 is disposed on the outer side of the vinyl jig frame 111, and the through-shooting sensor 113 is connected to the main controller signal. When in use, the barrel baffle 114 blocks the hollow part of the black glue barrel 112, and then the black glue feeding mechanism 02 puts the black glue into the black glue barrel 112 in turn, and then the robot 07 sends the black glue fixture 011 carrying the black glue to the press 03, and starts the translation drive mechanism 115. The barrel baffle 114 is separated from the black glue barrel 112 under the drive of the translation drive mechanism 115, so that the barrel baffle 114 cancels the blocking of the hollow part of the black glue barrel 112, and the hollow part of the black glue barrel 112 is opened, and the black glue can fall from the black glue barrel 112 into the press 03, and the black glue on the black glue fixture is released. After the black glue is released, the robot 07 puts the black glue fixture back to the initial position, and the barrel baffle 114 is separated from the black glue barrel 112 under the drive of the translation drive mechanism 115. The cylinder baffle 114 overlaps, so that the hollow part of the black glue cylinder 112 is blocked again, and then the black glue feeding mechanism 02 puts the black glue into the black glue cylinder 112 again, and the cycle is repeated, and the black glue batches can be continuously put into the press 03. When in use, the robot 07 extends into the robot quick-change tool tray 116 of the mobile black glue fixture 011 to conveniently combine with the black glue fixture 011, thereby facilitating the movement of the black glue fixture 011.

[0158] The translation drive mechanism 115 can be a general device, as long as it can automatically drive the barrel baffle 114 connected thereto to move horizontally. In this embodiment, the translation drive mechanism 115 uses a slide cylinder. In addition, the slide cylinder (translation drive mechanism 115) is connected to a horizontally arranged mounting beam 117, and the mounting beam 117 is connected to a baffle bracket 118. The barrel baffle 114 is arranged on the baffle bracket 118. When in use, the slide cylinder (translation drive mechanism 115) is started, and the slide cylinder (translation drive mechanism 115) drives the mounting beam 117 to translate, and then drives the baffle bracket 118 and the barrel baffle 114 to translate. The slide cylinder can be a double-acting slide cylinder or a single-acting slide cylinder. When the slide cylinder (translational drive mechanism 115) is a single-acting slide cylinder, a spring 119 is connected between the single-acting slide cylinder and the mounting beam 117. When the black glue needs to be released, the single-acting slide cylinder is opened, and the single-acting slide cylinder compresses the spring 119. The contraction of the spring 119 drives the barrel baffle 114 to separate from the black glue barrel 112, and the black glue is released from the black glue barrel 112. After the release is completed, the single-acting slide cylinder is closed, and the barrel baffle 114 returns to its initial position under the action of the rebound force of the spring 119, and the black glue can be put into the black glue barrel 112 again.

[0159] In addition, the robot quick-change tool tray 116 in this embodiment is provided with an air pipe joint 1161, which is connected to the external compressed air and is connected to the slide cylinder to provide compressed air as a driving power for the slide cylinder. Therefore, after the release of the black glue is completed, the slide cylinder can be closed by simply cutting off the compressed air supply to the slide cylinder.

[0160] In addition, the black plastic jig frame 111 is provided with a plurality of groups of sheet detection needles 1110 for detecting the sheet to be plastic-sealed, and each group of sheet detection needles 1110 is provided with a sheet detection sensor 1111, and the sheet detection sensor 1111 is connected to the master controller by signal. Correspondingly, the black plastic jig frame 111 is provided with a plurality of sheet detection needle brackets 1112, and the sheet detection needles 1110 are installed on the sheet detection needle brackets 1112. When the sheet is plastic-sealed, both the black glue and the sheet are placed in the press 03, and then the sheet is plastic-sealed by the black glue through the press 03. In this embodiment, a sheet detection needle 1110 is provided on the black glue jig 011 for placing the black glue (specifically, on the black glue jig frame 111), so that when the robot 07 moves the black glue jig 011 carrying the black glue into the press 03, the sheet detection needle 1110 on the black glue jig 011 can be used to simultaneously detect the placement of the sheet already placed in the press 03, so as to better plastic-seale the sheet with the black glue. Therefore, the black glue jig 011 in this embodiment not only has the function of placing the black glue but also has the function of detecting the placement position of the sheet. Of course, in order to cooperate with the detection of the placement of the sheet, the setting of the sheet detection needle 1110 on the black glue jig 011 corresponds to the sheet placed on the material support frame 010 for placing the sheet. When the vinyl jig 011 is moved to the press 03 and the placement position of the sheet in the press 03 needs to be detected, the robot 07 drives the vinyl jig 011 to move so that the sheet detection needle 1110 contacts the sheet. When the sheet detection needle 1110 at a certain position is raised, it means that the sheet at the corresponding position is not placed properly. At this time, the sheet detection sensor 1111 at the corresponding position of the sheet detection needle 1110 will feed back the detected situation to the main controller, so that the sheet placement situation can be automatically detected.

[0161] In addition, a plurality of positioning sleeves 1113 are evenly arranged on the PVC jig frame 111 for installing and positioning the PVC jig 011. For example, in this embodiment, when the PVC jig 011 is installed in the sheet placement area 27 in the PVC loading unit 02, the positioning sleeves 1113 are aligned with the jig positioning pins 214 of the sheet placement area 27, so that the PVC jig 011 can be positioned and installed on the sheet placement area 27.

[0162] In this embodiment, the vinyl jig 011 is connected to the main controller via a signal, and the main controller controls the automatic operation of the vinyl jig 011 .

[0163] Recombination Figures 16 to 22 As shown:

[0164] The automatic mold cleaning unit 04 includes a mold cleaning controller (not shown) and a mold cleaning component 41 for cleaning the mold surface of the press 03, and also includes a mold cleaning horizontal moving mechanism 42, on which a mold cleaning vertical moving mechanism 43 is slidably provided, the mold cleaning component 42 is connected to the mold cleaning vertical moving mechanism 43, the mold cleaning component 41 can move up and down under the drive of the mold cleaning vertical moving mechanism 43, the mold cleaning vertical moving mechanism 43 is connected to a mold cleaning conveying mechanism 44 that can make the mold cleaning vertical moving mechanism 43 slide horizontally on the mold cleaning horizontal moving mechanism 42, the mold cleaning vertical moving mechanism 43 and the mold cleaning conveying mechanism 44 are both electrically connected to the mold cleaning controller, and the mold cleaning controller is connected to the main controller signal. During use, when the mold surface of the press 03 needs to be cleaned, the mold cleaning conveying mechanism 44 is started, and the mold cleaning vertical moving mechanism 43 and the mold cleaning assembly 41 are moved to the mold to be cleaned along the mold cleaning horizontal moving mechanism 42 under the drive of the mold cleaning conveying mechanism 44, and then the mold cleaning assembly 41 is moved up and down under the drive of the mold cleaning vertical moving mechanism 43 to make it fit with the mold surface to be cleaned, and then the mold cleaning assembly 41 is started to clean the mold. After cleaning, the mold cleaning assembly 41 returns to the initial position under the action of the mold cleaning vertical moving mechanism 43 and the mold cleaning conveying mechanism 44, and the automatic cleaning process is completed.

[0165] The mold clearing horizontal moving mechanism 42 includes two mold clearing guide rails 421 parallel to each other, each mold clearing guide rail 421 is slidably provided with a corresponding mold clearing guide rail slider 422, and the mold clearing vertical moving mechanism 43 is connected to the mold clearing guide rail 421 through the mold clearing guide rail slider 422, which can effectively ensure the balanced stability of the mold clearing vertical moving mechanism 43.

[0166] The automatic mold clearing unit 04 includes two mold clearing mechanism cross beams 45 parallel to each other, the mold clearing guide rail 421 is installed on the mold clearing mechanism cross beam 45, and mold clearing mounting plates 46 are respectively provided at both ends of the mold clearing mechanism cross beam 45. The automatic mold clearing unit 04 is installed in the press 03 (specifically installed on the upper mold surface mounting surface of the press 03) through the mold clearing mounting plate 46, which plays a role in the stable installation and support of the automatic mold clearing unit 04 as a whole. In addition, a vertically arranged mold clearing column 47 is connected between the mold clearing mechanism cross beam 45 and the mold clearing mounting plate 46. In addition, in order to increase the adjustability of the automatic mold clearing unit 04 as a whole, the mold clearing column 47 can be set as a height-adjustable column.

[0167] The mold cleaning vertical moving mechanism 43 includes a sliding follower base plate 431 (specifically connected to the mold cleaning guide slider 422) which is slidably connected to the mold cleaning horizontal moving mechanism 42, and the mold cleaning transmission mechanism 44 is connected to the sliding follower base plate 431, and a slider cylinder 432 is vertically provided on the sliding follower base plate 431, and the slider cylinder 432 has two cylinder sliders (not shown) that are arranged vertically and can be opened and closed; the mold cleaning assembly 41 includes two brush assemblies 411 that are symmetrically distributed vertically, and the two brush assemblies 411 are respectively connected to the two cylinder sliders. When the mold needs to be cleaned, the sliding follower base plate 431 and the slider cylinder 432 are driven by the mold cleaning conveying mechanism 44 to be sent to the mold to be cleaned, and then the slider cylinder 432 is opened, and the two sliders of the slider cylinder 432 move up and down respectively, thereby driving the two brush assemblies 411 to move up and down respectively, so that the two brush assemblies 411 are respectively fitted with the upper and lower mold surfaces of the press 03, and the upper and lower mold surfaces of the press 03 can be cleaned by the brush assemblies 411.

[0168] Furthermore, a translation beam suspension upright plate 433 is vertically provided on the sliding follower bottom plate 431 , a translation beam support plate 434 is horizontally provided on the translation beam suspension upright plate 433 , a translation beam 435 is provided on the translation beam support plate 434 , and the slider cylinder 432 is arranged on the translation beam 435 .

[0169] Recombination Fig. 20 and Fig.21 As shown:

[0170] The mold cleaning component 41 includes two brush assemblies 411 symmetrically distributed up and down, and the brush assembly 411 includes a brush seat 4111 connected to the mold cleaning vertical moving mechanism 43 and can move up and down under the drive of the mold cleaning vertical moving mechanism 43, and a brush head shell 4112 is horizontally provided on the brush seat 4111, and a brush seat 4113 that can perform linear reciprocating motion is horizontally provided on the brush head shell 4112, and bristles (not shown) are provided on the brush seat 4113, and a plurality of suction heads 4114 are provided on the brush head shell 4112, and the suction heads 4114 are externally connected to the dust extraction equipment 012. In this embodiment, the brush row seats 4111 in the two brush row assemblies 411 are respectively connected to the two sliders of the slider cylinder 432, so that the brush row assembly 411 is connected to the slider cylinder 432, and then the mold cleaning assembly 41 is connected to the mold cleaning vertical moving mechanism 43. Therefore, when cleaning the mold, the brush row assembly 411 can be sent to the mold to be cleaned together with the slider cylinder 432 under the drive of the mold cleaning transmission mechanism 44. When the slider cylinder 432 is opened to make the two brush row assemblies 411 respectively fit the upper and lower mold surfaces of the press 03, the bristles on the brush seat 4113 in the brush row assembly 411 can clean the upper and lower mold surfaces of the press 03. In addition, the suction head 4114 provided allows the brush assembly 411 to perform dust removal on the upper and lower mold surfaces of the press 03 through the external dust removal device 012 while cleaning. In addition, the remaining bristles of the brush assembly 411 during the working process can also be sucked away by the dust removal device 012 through the suction head 4114. While cleaning the mold surface, the remaining bristles of the brush assembly 411 itself can be effectively avoided, and the cleaning effect is good.

[0171] The brush suction head housing 4112 is provided with a telescopic cylinder 4115 and a brush guide rail 4116, the brush guide rail 4116 is slidably provided with a brush guide rail slider 4117, the brush guide rail slider 4117 is provided with a sliding block 4118, the piston rod of the telescopic cylinder 4115 is provided on the sliding block 4118, the brush holder 4113 is provided on the sliding block 4118, and the brush holder 4113 can make a linear reciprocating motion along the brush guide rail 4116 under the drive of the telescopic cylinder 4115. When cleaning the mold, when the brush assembly 411 is respectively in contact with the upper and lower mold surfaces of the press 03, which means that the bristles on the brush holder 4113 are in contact with the upper and lower mold surfaces of the press 03, the telescopic cylinder 4115 is driven, and the brush holder 4113 can make a linear reciprocating motion along the brush guide rail 4116 under the drive of the telescopic cylinder 4115, so that the bristles on the brush holder 4113 can clean the mold surface of the press 03.

[0172] The automatic mold cleaning unit 04 also includes a vacuum cleaner container 48, which is provided with a plurality of air inlets 481 and air outlets 482. The air inlet 481 of the vacuum cleaner container is connected to the outlet of the suction head 4114, and the air outlet 482 of the vacuum cleaner container is connected to the air extraction port 121 of the dust extraction device 012. At least one vacuum cleaner (not shown) is provided in the dust extraction device 012. The vacuum cleaner container 48 provided can connect all the brush assembly 411 in the mold cleaning component 41 to one dust extraction device 012 at the same time through the vacuum cleaner container 48, which can effectively reduce the overall occupied space of the automatic mold cleaning unit 04 and the dust extraction device 012. In this embodiment, in order to match the mold cleaning component 41, one dust extraction device 012 can be provided with two vacuum cleaners, and the two vacuum cleaners are respectively connected to the suction heads 4114 on the two brush assembly 411 through the vacuum cleaner container 48. Such a design can further enhance the dust extraction and cleaning ability of the automatic mold cleaning unit 04.

[0173] The automatic mold cleaning unit 04 includes a follower bracket 49 slidably connected to the mold cleaning horizontal moving mechanism 42, and the vacuum cleaner container 48 is installed on the follower bracket 49. In this embodiment, the follower bracket 49 is installed on the translation beam 435, so that the follower bracket 49 is connected to the mold cleaning vertical moving mechanism 43, and then the follower bracket 49 is slidably connected to the mold cleaning horizontal moving mechanism 42. When in use, the vacuum cleaner container 48 can move with the horizontal movement of the follower bracket 49.

[0174] A control box 122 is provided on the outer wall of the dust extraction device 012, and a mold cleaning controller and a dust extraction device controller (not shown) are provided in the control box 121. The mold cleaning controller and the dust extraction device controller are both connected to the master controller by signal, integrating the control of mold cleaning and dust extraction into one, which is convenient for control. In this embodiment, the dust extraction device 012 is a dust extraction box, and a gap 123 is provided at the lower part of the box body of the dust extraction box to facilitate air circulation in the dust extraction box, and also to achieve a certain heat dissipation effect on the dust extraction box.

[0175] The mold clearing transmission mechanism 44 includes a mold clearing transmission motor 441, a mold clearing driven sprocket assembly 442, a mold clearing driving sprocket assembly 443 and a mold clearing transmission chain 444. The mold clearing driven sprocket assembly 442 and the mold clearing driving sprocket assembly 443 are respectively arranged at the front and rear ends of the mold clearing horizontal moving mechanism 42. The mold clearing transmission motor 441 is connected to the mold clearing driving sprocket assembly 443 through transmission. The mold clearing transmission chain 444 is connected to the mold clearing driving sprocket assembly 443 after bypassing the mold clearing driven sprocket assembly 442. The mold clearing vertical moving mechanism 43 is connected to the mold clearing transmission chain 444. When in use, start the mold cleaning transmission motor 441, which drives the mold cleaning driven sprocket assembly 442 and the mold cleaning active sprocket assembly 443 to rotate, and then drives the mold cleaning transmission chain 444 to move, so that the mold cleaning vertical moving mechanism 43 connected to the mold cleaning transmission chain 444 moves horizontally along the mold cleaning horizontal moving mechanism 42 as the mold cleaning transmission chain 444 moves.

[0176] Specifically, the mold clearing driven sprocket assembly 442 and the mold clearing driving sprocket assembly 443 are respectively arranged at the front and rear ends of the mold clearing guide rail 421. More specifically, it includes a driven sprocket bearing seat 445 and a driving sprocket bearing seat 446, and the driven sprocket bearing seat 445 and the driving sprocket bearing seat 446 are respectively fixed on the mold clearing mechanism crossbeam 45 at the front and rear ends of the mold clearing horizontal moving mechanism 42 (specifically, the mold clearing guide rail 421), and the mold clearing driven sprocket assembly 442 and the mold clearing driving sprocket assembly 443 are respectively installed on the mold clearing mechanism crossbeam 45 through the driven sprocket bearing seat 445 and the driving sprocket bearing seat 446, and then installed on the front and rear ends of the mold clearing horizontal moving mechanism 42.

[0177] Specifically, the sliding follower bottom plate 431 is connected to the mold clearing conveying chain 444, so that the mold clearing vertical moving mechanism 43 is connected to the mold clearing conveying chain 444, and finally the mold clearing vertical moving mechanism 43 is connected to the mold clearing conveying mechanism 44. During installation, a chain pressing block 447 is provided on the mold clearing conveying chain 444, and the chain pressing block 447 is connected to the sliding follower bottom plate 431. The mold clearing conveying chain 444 is pressed on the sliding follower bottom plate 431 by the chain pressing block 447, so that the mold clearing conveying chain 444 is connected to the sliding follower bottom plate 431, and then the mold clearing vertical moving mechanism 43 is connected to the mold clearing conveying mechanism 44.

[0178] In addition, the mold clearing transmission mechanism 44 includes a mold clearing transmission synchronous belt 448, the mold clearing active sprocket assembly 443 is provided with a synchronous pulley 449, and the mold clearing transmission motor 441 is provided with a mold clearing transmission motor synchronous wheel 4410. The mold clearing transmission synchronous belt 448 is connected to the mold clearing transmission motor synchronous wheel 4410 after passing around the synchronous pulley 449, thereby ensuring the synchronization of transmission.

[0179] See also Fig.16 As shown, in the present embodiment, in order to be compatible with the mold clearing horizontal moving mechanism 42 and to ensure the balance of transmission, the mold clearing transmission mechanism 44 includes two mold clearing active sprocket assemblies 443, two mold clearing driven sprocket assemblies 442 and two mold clearing transmission chains 444; the two mold clearing active sprocket assemblies 443 are symmetrically arranged on the left and right sides of one end of the mold clearing horizontal moving mechanism 42 away from the mold clearing driven sprocket assemblies 442, and the two mold clearing active sprocket assemblies 443 share a driving sprocket shaft 4411; the two mold clearing driven sprocket assemblies 442 are symmetrically arranged on the left and right sides of one end of the mold clearing horizontal moving mechanism 42 away from the mold clearing active sprocket assemblies 443; the mold clearing active sprocket assembly 443 and the mold clearing driven sprocket assembly 442 on the same side are connected via the corresponding mold clearing transmission chain 444.

[0180] Recombination Figure 24 to Figure 26 As shown, the system for realizing automatic semiconductor packaging also includes a finished product jig 013 for picking up the sheet to be debonded after plastic packaging or the finished sheet after debonding, and the debonding machine 05 is provided with a finished product jig placement place (for example, a finished product jig rack 51) for placing the finished product jig 013. When in use, robot 07 places the material rack 010 carrying the plastic-sealed sheets on the degumming machine 05, and robot 07 uses the finished product fixture 013 to pick up the sheets on the material rack 010 and place them on the degumming work surface 52 of the degumming machine 05 for degumming. After the degumming is completed, robot 07 places the degummed sheets into the appearance inspection unit 06 for appearance inspection. After the inspection is completed, robot 07 uses the finished product fixture 013 to pick up the finished sheet after inspection, and places the qualified sheets in the qualified product storage area and the defective sheets in the defective product storage area according to the inspection results, and repeats this process. After the sheets on the degumming machine 05 are degummed, appearance inspected and sorted and placed, robot 07 puts the finished product fixture 013 back on the degumming machine 05, and places the material rack 010 on the degumming machine 05 back on the sheet arrangement machine 01.

[0181] Specifically, see Fig.25 and Fig.26As shown, the finished jig 013 includes a finished jig body 131, on which are disposed a plurality of sheet suction nozzles 132 for sucking sheets (specifically, they can be disposed on the front of the finished jig body 131), and the finished jig body 131 is also provided with a plurality of sheet suction nozzle exhaust pipe joints 133 corresponding to and connected to the sheet suction nozzles 132 (specifically, they can be disposed on the back of the finished jig body 131), and a robot quick-change tool tray 134 adapted to the robot 07 is installed on one side of the finished jig body 131. An airway (not shown) is disposed in the finished jig body 131, and the sheet suction nozzle 132 is connected to the sheet suction nozzle exhaust pipe joint 133 through the airway in the finished jig body 131. When in use, all the sheet suction nozzle exhaust pipe joints 133 are connected to an external exhaust device (for example, a vacuum pump). When the finished jig 013 is needed to pick up the sheet, the robot 07 reaches into the robot quick-change tool tray 134 to move the finished jig 013 to the sheet, and then the sheet suction nozzle exhaust pipe joints 133 are connected to the exhaust device. The exhaust device draws air, and the sheet can be sucked up through the sheet suction nozzle 132, and the sheet can be adsorbed on the finished jig 013.

[0182] In addition, the finished jig body 131 is also provided with a plurality of black glue overflow suction nozzles 135 (specifically, they can be arranged on the front of the finished jig body 131) for sucking the overflowed black glue and a plurality of black glue overflow suction nozzle exhaust pipe joints 136 (specifically, they can be arranged on the back of the finished jig body 131) corresponding to and connected to the black glue overflow suction nozzles 135. Specifically, the black glue overflow suction nozzles 135 are connected to the black glue overflow suction nozzle exhaust pipe joints 136 through the air passage in the finished jig body 131. When in use, the black glue overflow suction nozzle exhaust pipe joint 136 is connected to an exhaust device (for example, a vacuum pump). When the finished jig 013 is needed to pick up the sheet to be de-glueed after plastic sealing, the sheet suction nozzle exhaust pipe joint 133 and the black glue overflow suction nozzle exhaust pipe joint 136 are both connected to the exhaust device. The exhaust device exhausts air, and the sheet to be de-glueed can be sucked up through the sheet suction nozzle exhaust pipe joint 133 and the black glue overflow suction nozzle exhaust pipe joint 136, and the sheet to be de-glueed can be adsorbed on the finished jig 013. The setting of the black glue overflow suction nozzle 135 allows the finished jig 013 to be used not only for picking up the finished sheet after de-glueing, but also for picking up the sheet to be de-glueed after plastic sealing, and the function is more diversified.

[0183] The number of the sheet suction nozzles 132, the sheet suction nozzle exhaust pipe joints 133, the black glue overflow suction nozzle 135, and the black glue overflow suction nozzle exhaust pipe joints 136 can be flexibly set according to usage requirements. For example, in the present embodiment, 20 sheet suction nozzles 132 are provided, 5 sheet suction nozzle exhaust pipe joints 133 are provided, i.e., 4 sheet suction nozzles 132 share one sheet suction nozzle exhaust pipe joint 133; 4 black glue overflow suction nozzles 135 and 1 black glue overflow suction nozzle exhaust pipe joint 136 are provided, i.e., 4 black glue overflow suction nozzles 135 share one black glue overflow suction nozzle exhaust pipe joint 136.

[0184] In addition, the finished jig body 131 is provided with a plurality of air blowing joints 137 (specifically, provided on the side wall of the finished jig body 131), and all the air blowing joints 137 are connected to compressed air. In this way, when the finished jig 013 is used to pick up a sheet, the sheet can be blown through the air blowing joints 137 to blow away the dust or residual vinyl debris on the surface of the sheet.

[0185] A jig stand 138 is vertically provided on one side of the finished jig body 131, and the jig stand 138 is connected to a jig arm 139, and the robot quick-change tool tray 134 is provided on the side of the jig arm 139 away from the jig stand 138. During installation, the robot quick-change tool tray 134 is installed on the jig arm 139 through the quick-change head mounting plate 1310. In addition, reinforcing ribs 1311 are provided at the connection between the jig stand 138 and the jig arm 139 and at the connection between the jig arm 139 and the quick-change head mounting plate 1310.

[0186] In addition, the robot quick-change tool tray 134 is provided with a plurality of air extraction pipe joints 1312 and compressed air air pipe joints 1313. The air extraction pipe joints 1312 and compressed air air pipe joints 1313 can be connected to an external air extraction device and a compressed air source, respectively. The air extraction pipe joints 1312 are respectively connected to the sheet suction nozzle air extraction pipe joints 133 and the black glue overflow suction nozzle air extraction pipe joints 136, and the compressed air air pipe joints 1313 are connected to the blowing joints 137, which provide air extraction pressure and a compressed air source for the sheet suction nozzle air extraction pipe joints 133 and the black glue overflow suction nozzle air extraction pipe joints 136 and the blowing joints 137, respectively.

[0187] In addition, the finished jig body 131 is provided with a plurality of air blowing pipe joints 1314 corresponding to the air blowing joint 137 (specifically, they can be provided on the back of the finished jig body 131), and the air blowing pipe joint 1314 is connected to the air blowing joint 137. Specifically, the air blowing pipe joint 1314 is connected to the air blowing joint 137 through the air channel in the finished jig body 131, and then the air blowing joint 137 is externally connected to compressed air. When in use, the air blowing joint 137 can be connected to the compressed air air pipe joint 1313 through a pipeline (for example, a hose).

[0188] In addition, in order to facilitate the control of the finished product jig 013, a finished product jig controller can be provided, and the finished product jig is controlled by the finished product jig controller, specifically controlling the operation of the sheet suction nozzle exhaust pipe joint 133 and the black glue overflow suction nozzle exhaust pipe joint 136 on the finished product jig. Of course, the finished product jig 013 can also be directly connected to the main controller, and the operation of the finished product jig 013 can be directly controlled by the main controller. The finished product jig controller or the main controller is electrically connected to the equipment that provides the exhaust pressure and the compressed air source, and the operation of the finished product jig 013 is controlled by controlling the opening and closing of the exhaust pressure and the compressed air. For example, when it is necessary to pick up the sheet, the exhaust device is started, and the exhaust device provides the exhaust pressure, and the sheet can be sucked onto the finished product jig 013 by the sheet suction nozzle exhaust pipe joint 133 and the black glue overflow suction nozzle exhaust pipe joint 136. When it is necessary to release the sheet, the exhaust device is directly turned off, the exhaust pressure supply is cut off, and the sheet can automatically fall off from the finished product jig 013.

[0189] Recombination Figures 27 to 30 As shown:

[0190] The appearance inspection unit 06 includes an inspection platform 61 for placing the sheet to be inspected, a visual inspection component 62 for inspecting the appearance of the sheet, an inspection moving mechanism 63, a visual image processor and an appearance inspection controller (not shown), wherein the inspection moving mechanism 63 is arranged around the inspection platform 61, and the visual inspection component 62 can be moved to the inspection platform 61 under the drive of the inspection moving mechanism 63, wherein the visual inspection component 62 is connected to the visual image processor signal, wherein the visual image processor and the inspection moving mechanism are respectively electrically connected to the appearance inspection controller, and wherein the appearance inspection controller is connected to the main controller signal. When in use, the robot 07 places the sheet after the glue path is removed onto the inspection platform 61, and starts the inspection moving mechanism 63. The visual inspection component 62 is sent to the inspection platform 61 under the action of the inspection moving mechanism 63, and the appearance of the sheet on the inspection platform 61 can be visually captured and transmitted to the visual image processor, and the visual image processor compares the image and sends the judgment result to the appearance inspection controller, and the appearance inspection controller further feeds back to the main controller, thereby realizing automatic inspection of the appearance of the packaged finished sheet.

[0191] The appearance inspection unit 06 also includes a film and television inspection substrate 64, and the inspection platform 61 and the inspection moving mechanism 63 are both installed on the film and television inspection substrate 64. In addition, a product placement area 65 for placing the inspected product is provided near the inspection platform 61. After the appearance inspection of the sheet is completed, the robot 07 takes the sheet out from the inspection platform 61 and places it in the product placement area 65, and a material box for placing the product may be provided on the product placement area 65. During installation, a plurality of platform pillars 66 are vertically provided on the film and television inspection substrate 64, and the inspection platform 61 is horizontally provided on the top of the platform pillars 66, and is installed on the film and television inspection substrate 64 through the platform pillars 66. A plurality of columns 67 are vertically provided on the film and television inspection substrate 64, and the product placement area 65 is provided on the top of the columns 67, and is installed on the film and television inspection substrate 64 through the columns 67. The product placement area 65 is actually equivalent to a horizontally arranged product placement board.

[0192] In this embodiment, the visual detection component 62 includes a light source 621 and a camera 622 disposed near the light source 621 , and the appearance of the sheet is photographed by the camera 622 , wherein the camera 622 is connected to a visual image processor signal.

[0193] Recombination Fig.29 and Fig.30 visible:

[0194] The detection moving mechanism 63 includes an XY moving mechanism and an XY driving mechanism arranged around the detection platform 61, the XY moving mechanism includes an X guide rail 631, a Y guide rail 632 is slidably provided on the X guide rail 631, the visual detection component 62 is slidably provided on the Y guide rail 632, the XY driving mechanism includes an X driving mechanism and a Y driving mechanism, the X driving mechanism is connected to the Y guide rail 632, the Y guide rail 632 can move linearly on the X guide rail 631 under the drive of the X driving mechanism, the Y driving mechanism is connected to the visual detection component 62, the visual detection component 62 can move linearly on the Y guide rail 632 under the drive of the Y driving mechanism, and the XY driving mechanism is electrically connected to the appearance detection controller.

[0195] Further, the XY moving mechanism includes two X rails 631 parallel to each other, each X rail 631 is slidably provided with an X rail slider 633, the top of the X rail slider 633 is connected with a Y mechanism sliding base plate 634, the Y rail 632 is provided on the Y mechanism sliding base plate 634, the Y rail 632 is slidably provided with a Y rail slider 635, the Y rail slider 635 is provided with a Y moving slide plate 636, the Y moving slide plate 636 is connected with a detection mounting frame 637, the visual detection component 62 is provided on the detection mounting frame 637, the X drive mechanism is connected with the Y mechanism sliding base plate 634, and the Y drive mechanism is connected with the Y moving slide plate 636. The two X rails 631 strengthen the balance and stability of the movement of the Y rail 632, and further strengthen the balance and stability of the movement of the visual detection component 62. When in use, the Y mechanism sliding base plate 634 can move linearly on the X guide rail 631 under the drive of the X driving mechanism, and the Y moving slide plate 636 can move linearly on the Y guide rail 632 under the drive of the Y driving mechanism, thereby driving the visual inspection component 62 to move linearly on the Y guide rail 632, so that the visual inspection component 62 can move freely in two-axis directions on the inspection platform 61, and can be easily and quickly moved to the inspection platform 61 to automatically inspect the appearance of the sheet on the inspection platform 61.

[0196] Two visual inspection components 62 symmetrically distributed in the upper and lower parts of the inspection mounting frame 637 are symmetrically arranged, so that the appearance of the sheet can be inspected in all directions, and the inspection result is more accurate.

[0197] The X drive mechanism includes an X synchronous wheel A 638 and an X synchronous wheel B 639 respectively arranged at both ends of the X guide rail, an X synchronous belt 6310 is connected between the X synchronous wheel A 638 and the X synchronous wheel B 639, the X synchronous wheel A 638 is connected to an X servo motor 6311, and the X synchronous belt 6310 is connected to the Y axis guide rail 632; the Y drive mechanism includes a Y synchronous wheel A 6312 and a Y synchronous wheel B 6313 respectively arranged at both ends of the Y guide rail, a Y synchronous belt 6314 is connected between the Y synchronous wheel A 6312 and the Y synchronous wheel B 6313, the Y synchronous wheel A 6312 is connected to a Y servo motor 6315, and the Y synchronous belt 6314 is connected to the visual detection component 62. Among them, the X synchronous wheel A638, the X synchronous wheel B 639, the X synchronous belt 6310, and the X axis servo motor 6311 constitute a belt transmission type X driving mechanism, and the Y synchronous wheel A6312, the Y synchronous wheel B 6313, the Y synchronous belt 6314, and the Y servo motor 6315 constitute a belt transmission type Y driving mechanism. Among them, the X axis synchronous belt 6310 is connected to the Y axis guide rail 632, specifically, the X axis synchronous belt 6310 is connected to the Y mechanism sliding base plate 634, and then indirectly connected to the Y axis guide rail 632; the Y synchronous belt 6314 is connected to the visual detection component 62, specifically, the Y synchronous belt 6314 is connected to the Y moving slide plate 636, and then indirectly connected to the visual detection component 62.

[0198] During installation, an X-belt connecting block 6316 is provided on the X-belt connecting block 6316, an X-belt pressing block 6317 is provided on the X-belt connecting block 6316, and the X-belt pressing block 6317 is connected to the Y-mechanism sliding base plate 634, thereby pressing and fixing the X-synchronous belt 6310 on the Y-mechanism sliding base plate 634; a Y-belt connecting block 6318 is provided on the Y-belt connecting block 6318, and a Y-belt pressing block 6319 is provided on the Y-belt connecting block 6318, and the Y-belt pressing block 6319 is connected to the Y-moving slide plate 636, thereby pressing and fixing the Y-synchronous belt 6314 on the Y-moving slide plate 636.

[0199] In addition, an X idler shaft fixing frame 6320 is provided at the X synchronous wheel B 639, an X idler shaft 6321 is provided in the X idler shaft fixing frame 6320, and the X synchronous wheel B 639 is installed in the X idler shaft fixing frame 6320 through the X idler shaft 6321; a Y idler shaft fixing frame 6322 is provided at the Y synchronous wheel B6313, a Y idler shaft 6323 is provided in the Y idler shaft fixing frame 6322, and the Y synchronous wheel B6313 is installed in the Y idler shaft fixing frame 6322 through the Y idler shaft 6323.

[0200] In addition, the appearance detection unit 06 also includes an appearance detection frame 68, and the film and television detection substrate 64 is arranged on the top table of the appearance detection frame 68. The lower part of the appearance detection frame 68 is provided with an appearance detection chassis 69, and the visual image processor can be installed in the appearance detection chassis 69.

[0201] A display 610 is provided on the video inspection substrate 64 to display the appearance inspection result. In addition, a protective cover 611 may be provided on the side of the product placement area 65 to protect the inspected product.

[0202] In addition, since the safety door 09 is arranged between the appearance detection unit 06 and the vinyl loading unit 02, a safety door sensor 612 for detecting the switch of the safety door 09 can be provided on the appearance detection unit 06. Specifically, it is installed on the side of the appearance detection unit 06 close to the vinyl loading unit 02. In this embodiment, a bracket 613 is provided on the outer side of the column 67, and the safety door sensor 612 is installed on the bracket 613.

[0203] Recombination Figure 1 , Figure 3 and Figure 4 As shown:

[0204] The robot 07 includes a robot arm 71 and a robot controller 72, the robot arm 71 is electrically connected to the robot controller 72, the robot arm 71 includes a robot body 711, a mounting base plate 712 is provided on the robot body 711, a robot end mounting plate 713 is provided at the end of the robot body 711, a robot quick-change main plate 714 is provided on the robot end mounting plate 713, and the robot controller is connected to the main controller signal. During installation, the robot arm 71 is connected to the top crossbeam 84 of the frame 8 through the mounting base plate 712, so that the robot 07 is connected to the frame 8; the robot controller 72 can be installed on the side of the frame 8.

[0205] The robot quick-change main plate 714 is provided with a plurality of air extraction pipe joints 7141 and compressed air pipe joints 7142. The air extraction pipe joints are connected to a vacuum pump (not shown), and the compressed air pipe joints are connected to a compressed air source (not shown).

[0206] When in use, robot 07 connects the robot quick-change main plate 714 with the robot quick-change tool plates 103, 116, and 134 on the material rack 010, the vinyl jig 011, and the finished jig 013 respectively, so that the material rack 010, the vinyl jig 011, and the finished jig 013 can be moved conveniently and quickly.

[0207] In addition, the exhaust pipe joint 7141 and the compressed air pipe joint 7142 on the robot quick-change main disk 714 can be respectively connected to the air pipe joints on the robot quick-change tool disk. For example, in this embodiment, the exhaust pipe joint 7141 and the compressed air pipe joint 7142 on the robot quick-change main disk 714 can be respectively connected to the exhaust pipe joint 1312 and the compressed air pipe joint 1313 on the robot quick-change tool disk 134 on the finished jig 013, thereby providing exhaust pressure and compressed air source for the sheet suction nozzle exhaust pipe joint 133 and the black glue overflow suction nozzle exhaust pipe joint 136 and the blowing joint 137 of the finished jig 013 respectively. In this way, when in use, it is only necessary to control the on and off of the exhaust pipe joint 7141 and the compressed air pipe joint 7142 on the robot quick-change main disk 714 to control the operation of the finished jig 013.

[0208] Finally, it is necessary to point out here that the above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily thought of by any technician familiar with the technical field within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention.

Claims

1. A system for realizing automatic semiconductor packaging, comprising a wafer arranging machine, a press machine, an automatic mold clearing unit, a glue path removing machine, an appearance inspection unit, a robot and a master controller, wherein the respective controllers of the wafer arranging machine, the press machine, the automatic mold clearing unit, the glue path removing machine, the appearance inspection unit and the robot are all connected to the master controller by signal; Features: It also includes a black glue feeding unit, which includes a silo, a direct vibration feeding mechanism, a circular vibration, a direct vibration feeding mechanism, a rotary feeding mechanism, a black glue grabbing mechanism and a black glue feeding controller. The direct vibration feeding mechanism is located below the silo and is connected to the silo. The circular vibration is located between the outlet end of the direct vibration feeding mechanism and the inlet end of the direct vibration feeding mechanism. The rotary feeding mechanism is located at the outlet end of the direct vibration feeding mechanism. The black glue grabbing mechanism is located near the rotary feeding mechanism, and a black glue placement area is provided near the black glue grabbing mechanism. The direct vibration feeding mechanism, the circular vibration, the direct vibration feeding mechanism, the rotary feeding mechanism and the black glue grabbing mechanism are all connected to the black glue feeding controller. The devices are electrically connected respectively, and the black glue feeding controller is signal-connected with the main controller; the rotary feeding mechanism includes a rotary feeding motor, a rotary feeding shaft, a rotary feeding coupling, a rotary feeding bearing shaft seat A with a built-in bearing and a rotary feeding bearing shaft seat B with a built-in bearing, one end of the rotary feeding shaft is inserted into the rotary feeding bearing shaft seat A, and the other end passes through the rotary feeding bearing shaft seat B and is connected to the shaft of the rotary feeding motor through the rotary feeding coupling, a rotary feeding head is provided on the rotary feeding shaft, and a rotary feeding shading disc is provided at the end of the rotary feeding shaft away from the rotary feeding motor, and the rotary feeding motor is electrically connected with the black glue feeding controller.

2. The system for realizing automatic semiconductor packaging according to claim 1, Features: The direct vibration feeding mechanism includes a feeding direct vibration and a direct vibration feeding track installed on the feeding direct vibration and connected to the silo; the direct vibration feeding mechanism includes a feeding direct vibration and a feeding direct vibration track installed on the feeding direct vibration, and a feeding limiting mechanism is provided at the outlet end of the feeding direct vibration track.

3. The system for realizing automatic semiconductor packaging according to claim 2, Features: The feed limit mechanism includes a feed limit spring, a feed limit spring shaft, a feed limit spring and a feed limit spring baffle. The feed limit spring is arranged in the feed straight vibration track along the extension direction of the feed straight vibration track, and the feed limit spring baffle is arranged at the upper part of the feed straight vibration track. The end of the feed limit spring is connected to the feed limit spring baffle and can move up and down along the feed limit spring baffle. The feed limit spring shaft is horizontally penetrated in the feed straight vibration track and is perpendicular to the feed straight vibration track. The feed limit spring is sleeved on the feed limit spring shaft, and the two ends of the feed limit spring are respectively connected to the feed limit spring and the feed limit spring baffle.

4. The system for realizing automatic semiconductor packaging according to claim 1, Features: The black glue grabbing mechanism includes an XY-axis moving mechanism and an XY-axis driving mechanism arranged around the black glue placement area. A finger cylinder is slidably provided on the XY-axis moving mechanism. The finger cylinder can move on the XY-axis moving mechanism under the drive of the XY-axis driving mechanism. The finger cylinder and the XY-axis driving mechanism are electrically connected to the black glue feeding controller respectively.

5. The system for realizing automatic semiconductor packaging according to claim 1, Features: The system also includes a plurality of material racks for placing the sheets; the sheet arrangement machine is provided with a material rack placement area for placing the material racks; the debonding machine is also provided with a material rack placement area for placing the material racks.

6. The system for realizing automatic semiconductor packaging according to claim 1, Features: The system also includes a black glue jig for placing black glue, and the black glue feeding unit is provided with a black glue placement area for placing the black glue jig.

7. The system for realizing automatic semiconductor packaging according to claim 1, Features: The automatic mold cleaning unit includes a mold cleaning controller and a mold cleaning component for cleaning the mold surface of the press, and also includes a mold cleaning horizontal moving mechanism, a mold cleaning vertical moving mechanism is slidably provided on the mold cleaning horizontal moving mechanism, the mold cleaning component is connected to the mold cleaning vertical moving mechanism, the mold cleaning component can move up and down under the drive of the mold cleaning vertical moving mechanism, the mold cleaning vertical moving mechanism is connected to a mold cleaning transmission mechanism that can make the mold cleaning vertical moving mechanism slide horizontally on the mold cleaning horizontal moving mechanism, the mold cleaning vertical moving mechanism and the mold cleaning transmission mechanism are both electrically connected to the mold cleaning controller, and the mold cleaning controller is connected to the main controller signal.

8. The system for realizing automatic semiconductor packaging according to claim 1, Features: The system also includes a finished product jig for picking up the sheet to be debonded after plastic packaging or the finished sheet after debonding, and the debonding machine is provided with a finished product jig placement for placing the finished product jig.

9. The system for realizing automatic semiconductor packaging according to claim 1, Features: The appearance detection unit includes an inspection platform for placing a sheet to be inspected, a visual inspection component for inspecting the appearance of the sheet, an inspection moving mechanism, a visual image processor and an appearance detection controller. The inspection moving mechanism is arranged around the inspection platform. The visual inspection component can be moved to the inspection platform under the drive of the inspection moving mechanism. The visual inspection component is electrically connected to the visual image processor, and the visual image processor and the inspection moving mechanism are respectively electrically connected to the appearance detection controller. The appearance detection controller is signal-connected to the main controller.

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