Chip mounter

Abstract

The application provides a chip mounting machine, which comprises a chip supply mechanism, a first mounting station and a second mounting station, and the first mounting station and the second mounting station are symmetrically arranged on the two sides of the chip supply mechanism. The chip mounting machine of the application improves the mounting capacity and efficiency by adopting double-station mounting. Meanwhile, the chip mounting machine of the application also has high mounting precision, and fully meets the mounting requirements of modern industrial production.

Description

TECHNICAL FIELD

[0001] The present application relates to a chip mounter, in particular to a double-station chip mounter. BACKGROUND

[0002] The mounter is a key equipment in the semiconductor packaging production line, which has a very wide application in chip packaging. With the progress of technology, the mounting precision of the mounter is developing towards sub-micron level, thereby supporting the so-called micro-assembly technology in the industry. However, while improving the precision, in order to meet the demand of production capacity, the mounting efficiency of the mounter is also required in industrial production. Therefore, it is necessary to propose further solutions for how to improve the mounting efficiency of the mounter. SUMMARY

[0003] The present application aims to provide a chip mounter to overcome the deficiencies in the prior art.

[0004] To solve the above technical problems, the technical solution of the present application is:

[0005] A chip mounter, comprising: a chip supply mechanism, a first mounting station and a second mounting station, the first mounting station and the second mounting station are mirror-symmetrically arranged on both sides of the chip supply mechanism;

[0006] The chip supply mechanism comprises: a wafer table, a first vision located above the wafer table;

[0007] Any of the mounting stations comprises: a first conveying mechanism, a correction mechanism, a second conveying mechanism, a mounting mechanism;

[0008] The first conveying mechanism comprises: a first conveying arm, a suction nozzle arranged at one end of the first conveying arm, the first conveying arm performs reciprocating pivotal motion between the wafer table and the correction mechanism; the correction mechanism comprises: a correction table, a second vision arranged above the correction table, the correction table rotates around its own axis for rotation correction, and simultaneously performs XY motion correction with the center of the second vision as the target point;

[0009] The second conveying mechanism comprises: a second conveying arm, a suction nozzle arranged at one end of the second conveying arm, the second conveying arm performs reciprocating linear motion between the correction mechanism and the mounting mechanism, and the second conveying arm itself performs pivotal motion; the mounting mechanism comprises: a mounting table, a third vision located above the mounting table.

[0010] As an improvement of the chip mounter of the present application, the wafer table is arranged on an XY mechanism, and the XY mechanism adjusts the wafer table to perform XY direction motion between the first mounting station and the second mounting station.

[0011] As the improvement of the chip mounter of the present application, the first transfer mechanism further comprises a first motor connected with the other end of the first transfer arm, the first motor drives the first transfer arm to make reciprocating pivoting movement between the wafer table and the correction mechanism.

[0012] As the improvement of the chip mounter of the present application, the correction position of the correction table is defined by clockwise direction and counterclockwise direction, a second motor drives the correction table to rotate to the position defined by the preset clockwise direction or counterclockwise direction.

[0013] As the improvement of the chip mounter of the present application, the correction table is arranged on an XY mechanism, the XY mechanism adjusts the correction table to make XY direction movement between the first transfer mechanism and the second transfer mechanism.

[0014] As the improvement of the chip mounter of the present application, the second transfer mechanism further comprises a third motor connected with the other end of the second transfer arm, the third motor drives the second transfer arm to make pivoting movement.

[0015] As the improvement of the chip mounter of the present application, the base of the third motor is driven by a linear motor or a screw rod, the second transfer mechanism makes X direction movement between the correction mechanism and the mounting mechanism.

[0016] As the improvement of the chip mounter of the present application, the XY mechanism comprises a first base, a first guide rail for the first base to slide along X direction, a second base arranged on the first base, a second guide rail arranged on the first base for the second base to slide along Y direction.

[0017] As the improvement of the chip mounter of the present application, the mounting mechanism further comprises a horizontal calibration assembly, which comprises a horizontal calibration table and a plurality of calibration bolts, at least four corner positions of the mounting table are fixed on the horizontal calibration table through the calibration bolts.

[0018] As the improvement of the chip mounter of the present application, the length of the second transfer arm is smaller than the length of the first transfer arm.

[0019] Compared with the prior art, the chip mounter of the present application has the beneficial effects that: the chip mounter of the present application improves the mounting capacity and efficiency by adopting double-station mounting. At the same time, the chip mounter of the present application also has high mounting precision, which fully meets the mounting requirements of modern industrial production. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to make the technical solutions of the embodiments of the present application or the prior art clearer, the accompanying drawings needed in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description only represent some embodiments of the present application, and other drawings can be obtained by those of ordinary skill in the art without any creative effort.

[0021] Fig. 1 A top view of a chip mounter according to an embodiment of the present application;

[0022] Fig. 2 A schematic view of an XY mechanism in a chip mounter;

[0023] Fig. 3 A schematic view of a horizontal calibration assembly in a chip mounter. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments only represent some embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without any creative effort fall within the protection scope of the present application.

[0025] As shown in Figs. 1-3 The present application provides a chip mounter for assembling chips and substrates in an integrated circuit. Specifically, the chip mounter comprises a chip supply mechanism 300, a first mounting station 100, and a second mounting station 200.

[0026] The chip supply mechanism 300 is configured to supply chips to be assembled, wherein the chips are from a large-size wafer, and the wafer is pre-cut into a plurality of small-size chips. The chip supply mechanism 300 comprises a wafer table 301 and a first vision 302 above the wafer table 301. The wafer table 301 is configured to carry the large-size wafer, and the first vision 302 above the wafer table 301 is configured to correct the position of the wafer table 301 to facilitate accurate chip picking by the first transfer mechanism 2. Otherwise, the error of the chip position during picking will affect the subsequent mounting.

[0027] In addition, the wafer table 301 is arranged on an XY mechanism 400, and the XY mechanism 400 adjusts the XY movement of the wafer table between the first mounting station 100 and the second mounting station 200.

[0028] The XY mechanism 400 adjusts the wafer table 301 to move in the XY direction. Specifically, the XY mechanism 400 includes a first base 401, a first guide rail 402 for sliding the first base 401 in the X direction, a second base 403 arranged on the first base 401, and a second guide rail 404 arranged on the first base 401 for sliding the second base 403 in the Y direction. Thus, the XY mechanism 400 can adjust the spatial position of the wafer table 301 according to the calibration result of the first vision 302.

[0029] The first loading station 100 and the second loading station 200 are arranged symmetrically on both sides of the chip supply mechanism 300, and the two loading stations can work independently and synchronously, thereby improving the productivity and efficiency of loading chips.

[0030] Specifically, any of the loading stations 100, 200 includes a first conveying mechanism 2, a correction mechanism 3, a second conveying mechanism 4, and a loading mechanism 5.

[0031] The first conveying mechanism 2 is used to transfer the chips on the chip supply mechanism 300 to the correction mechanism 3, and includes a first conveying arm 21 and a suction nozzle arranged at one end of the first conveying arm 21.

[0032] The first conveying arm 21 performs reciprocating pivotal movement between the wafer table 301 and the correction mechanism 3. In order to realize the pivotal movement of the first conveying arm 21, the first conveying mechanism 2 further includes a first motor 22 in driving connection with the other end of the first conveying arm 21, and the first motor 22 drives the first conveying arm 21 to perform reciprocating pivotal movement between the wafer table 301 and the correction mechanism 3. Correspondingly, the length and movement stroke of the first conveying arm 21 are designed to cover the distance between the wafer table 301 and the correction mechanism 3.

[0033] The correction mechanism 3 is used to perform secondary correction on the chips to overcome the position error when the first conveying mechanism 2 takes the chips, and includes a correction table 31 and a second vision 32 arranged above the correction table 31.

[0034] The correction table 31 can perform rotational correction with its own axis as the pivot, and can perform XY movement correction with the center of the second vision 32 as the target point.

[0035] Specifically, the correction position of the correction table 31 is defined by clockwise direction and counterclockwise direction, and a second motor 33 drives the correction table 31 to rotate to the position defined by the preset clockwise direction or counterclockwise direction. Thus, during correction, according to the detection result of the second vision 32, the second motor 33 drives the correction table 31 to rotate clockwise or counterclockwise to reach the position suitable for the second transfer mechanism 4 to accurately pick the chip.

[0036] Meanwhile, in order to make the correction table 31 have a suitable correction position, the correction table 31 is arranged on an XY mechanism, which adjusts the XY direction movement of the correction table between the first transfer mechanism and the second transfer mechanism. In this way, the XY mechanism can adjust the position of the correction table 31, which facilitates the first transfer arm 21 to place the chip on the correction table 31. Here, the XY mechanism is the same as the above-mentioned XY mechanism 400, and thus the structure thereof will not be repeated.

[0037] The second transfer mechanism 4 is used to transfer the chip on the correction mechanism 3 to the chip mounting mechanism 5, which includes a second transfer arm 41 and a suction nozzle arranged at one end of the second transfer arm 41.

[0038] Among them, the second transfer arm 41 performs reciprocating linear motion between the correction mechanism 3 and the chip mounting mechanism 5, and the second transfer arm 41 itself also performs pivoting motion. In this way, the subsequent mounting precision can be improved. This is because, since the second transfer arm 41 can perform linear motion, the above-mentioned motion mode allows the length of the second transfer arm 41 to be shorter, and the error caused by the pivoting of the short arm is correspondingly reduced, thereby realizing the improvement of the mounting precision.

[0039] In order to realize the pivoting motion of the second transfer arm 41, the second transfer mechanism 4 further includes a third motor 42, which is in transmission connection with the other end of the second transfer arm 41, and the third motor 42 drives the second transfer arm 41 to perform reciprocating pivoting motion between the correction mechanism 3 and the chip mounting mechanism 5. Correspondingly, the length and motion stroke of the second transfer arm 41 are designed to just cover the distance between the correction mechanism 3 and the chip mounting mechanism 5.

[0040] Further, in order to realize the linear motion of the second transfer arm 41, the machine base where the third motor 41 is located is driven by a linear motor 43 or a lead screw 43, and the second transfer mechanism performs X direction movement between the correction mechanism and the chip mounting mechanism.

[0041] The chip mounting mechanism 5 is used for realizing the assembly between the chip and the substrate, and comprises a chip mounting table 51 and a third vision 52 above the chip mounting table 51.

[0042] In addition, when the chip is mounted, the chip mounting table 51 is required to have good levelness, and therefore the chip mounting mechanism 5 further comprises a horizontal calibration assembly, which comprises a horizontal calibration table 53 and a plurality of calibration bolts 54, and at least four corner positions of the chip mounting table 51 are fixed to the horizontal calibration table 53 through the calibration bolts 54.

[0043] In summary, the chip mounting machine of the present application improves the mounting capacity and efficiency by adopting double-station mounting. Meanwhile, the chip mounting machine of the present application also has high mounting precision, and fully meets the mounting requirements of modern industrial production.

[0044] It is apparent for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, but can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and range of the equivalent elements of the claims are intended to be embraced in the present application. Any reference signs in the claims should not be considered as limiting the claims involved.

[0045] In addition, it should be understood that, although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be properly combined to form other embodiments which can be understood by those skilled in the art.

Claims

1. A chip mounter characterized by comprising: The chip mounter comprises a chip supply mechanism, a first mounting station and a second mounting station, the first mounting station and the second mounting station are symmetrically arranged on both sides of the chip supply mechanism; The chip supply mechanism comprises a wafer table, a first vision arranged above the wafer table; Any of the mounting stations comprises a first transfer mechanism, a correction mechanism, a second transfer mechanism and a mounting mechanism; The first transfer mechanism comprises a first transfer arm and a suction nozzle arranged at one end of the first transfer arm, the first transfer arm performs reciprocating pivotal motion between the wafer table and the correction mechanism; the correction mechanism comprises a correction table and a second vision arranged above the correction table, the correction table rotates around its own axis for rotation correction, and the center of the second vision is taken as a target point for XY motion correction; The second transfer mechanism comprises a second transfer arm and a suction nozzle arranged at one end of the second transfer arm, the second transfer arm performs reciprocating linear motion between the correction mechanism and the mounting mechanism, and the second transfer arm itself performs pivotal motion; the mounting mechanism comprises a mounting table and a third vision arranged above the mounting table; The mounting mechanism further comprises a horizontal correction assembly, which comprises a horizontal correction table and a plurality of correction bolts, at least four corner positions of the mounting table are fixed to the horizontal correction table through the correction bolts.

2. The chip mounter according to Claim 1, characterized by The wafer table is arranged on an XY mechanism, the XY mechanism adjusts the wafer table to perform XY direction motion between the first mounting station and the second mounting station.

3. The chip mounter according to Claim 1, characterized by The first transfer mechanism further comprises a first motor in transmission connection with the other end of the first transfer arm, the first motor drives the first transfer arm to perform reciprocating pivotal motion between the wafer table and the correction mechanism.

4. The chip mounter according to Claim 1, characterized by The correction position of the correction table is defined by the clockwise direction and the counterclockwise direction, a second motor drives the correction table to rotate to a position defined by the preset clockwise direction or counterclockwise direction.

5. The chip mounter according to Claim 4, wherein The correction table is arranged on an XY mechanism, the XY mechanism adjusts the correction table to perform XY direction motion between the first transfer mechanism and the second transfer mechanism.

6. The chip mounter according to Claim 1, characterized by The second transfer mechanism further comprises a third motor in transmission connection with the other end of the second transfer arm, the third motor drives the second transfer arm to perform pivotal motion.

7. The chip mounter according to claim 6, characterized by The third motor is arranged on a linear motor or a screw rod, the second transfer mechanism performs X direction motion between the correction mechanism and the mounting mechanism.

8. The chip mounter according to claim 2 or 5, characterized by The XY mechanism comprises a first base, a first guide rail for the first base to slide along the X direction, a second base arranged on the first base, and a second guide rail arranged on the first base for the second base to slide along the Y direction.

9. The chip mounter according to Claim 1, characterized by The length of the second transfer arm is less than the length of the first transfer arm.

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