Heat dissipation structure for portable Raman spectrometer and portable Raman spectrometer

By designing a heat dissipation structure for portable Raman spectrometers, the combination of thermal blocks and heat pipes is used to solve the problem of dark current noise caused by the rise in detector temperature, achieving lower operating temperature and higher measurement accuracy, and promoting the performance improvement and miniaturization of the instrument.

CN111060496BActive Publication Date: 2025-04-04ZOLIX ANALYTICAL INSTRUMENTS CO LTD
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Patent Information

Application Number
CN202010053098.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-01-17
Publication Date
2025-04-04
Estimated Expiration
2040-01-17

AI Technical Summary

Technical Problem

During the operation, the portable Raman spectrometer increases dark current noise due to the increase in the temperature of the detector, which affects the measurement accuracy and instrument performance.

Method used

A heat dissipation structure including a heat conducting block, a heat pipe pressing plate, a heat pipe and a heat pipe fixing plate is designed. It is connected to the heat pipe pressing plate through a heat conducting block, the evaporation section of the heat pipe is fixed to the bottom surface of the groove of the heat conducting block, and the condensation section is connected to the heat pipe fixing plate to achieve effective heat transfer and heat dissipation.

Benefits of technology

This heat dissipation structure can effectively reduce the operating temperature of the detector to -10°C, reduce dark current noise, improve the overall performance of the portable Raman spectrometer, and promote the miniaturization and modularization of the instrument.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a heat dissipation structure for a portable Raman spectrometer and a portable Raman spectrometer. The heat dissipation structure for the portable Raman spectrometer comprises a heat conducting block (2), a heat pipe pressing plate (3), a heat pipe (4) and a heat pipe fixing plate (6). The front of the heat conducting block (2) is provided with a groove (21), the heat conducting block (2) is connected to the heat pipe pressing plate (3), the evaporation section (41) of the heat pipe (4) is fixed between the bottom surface of the groove (21) and the heat pipe pressing plate (3), and the condensation section (43) of the heat pipe (4) is connected to the heat pipe fixing plate (6). The heat dissipation structure for the portable Raman spectrometer can effectively dissipate the heat of the heating end of the detector, control the detector to a working temperature of -10°C, directly improve the overall performance of the portable Raman spectrometer, and provide the possibility of further miniaturization and modularization of the instrument.
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Description

Technical Field

[0001] The invention relates to the field of optical testing equipment, in particular to a heat dissipation structure for a portable Raman spectrometer, and also to a portable Raman spectrometer comprising the heat dissipation structure for the portable Raman spectrometer. Background Art

[0002] Handheld Raman spectrometers have the characteristics of rich information, strong analytical ability, fast processing speed, no need for sample pretreatment, and easy use, making them widely used in water pollution detection, drug smuggling, air quality detection, cultural relics identification, drug testing and other fields.

[0003] Generally, Raman spectrometers are mainly composed of laser light source, sample stage, external optical path collection system, internal optical path, detector and data processing system. The laser emits excitation light, which is focused on the sample after passing through the reflector and focusing lens. The Raman scattered light of the sample is reflected by the reflector, collimated by the lens and sent to the spectroscopic element, and then detected by the detector and the data is sent to the host computer for processing, so that the Raman spectrum can be obtained. Since the Raman spectrum signal is very weak, higher requirements are placed on the imaging device. The array detector spectrometer will generate a lot of noise when working: including photon noise, transfer noise and dark current noise. For other noises, it can be well suppressed by circuit design, but for dark current noise, since its size is related to temperature, it is very important to control the working temperature of the detector in order to improve the working performance of the acquisition equipment. The semiconductor refrigeration method uses the Peltier effect of semiconductors. It is small in size and low in power consumption. It is the most commonly used refrigeration method for portable detection instruments.

[0004] When the working environment temperature increases by 5℃-7℃, the dark current of the detector will double, and the dark current will increase faster and faster with the increase of temperature. At the same time, Raman spectrum measurement requires a longer integration time, and the increase of integration time will also increase the dark current noise. Therefore, the detector needs to be cooled and heat dissipated well. Good heat dissipation is a prerequisite for obtaining the lowest cold end temperature. Summary of the invention

[0005] In order to improve the heat dissipation effect, the present invention provides a heat dissipation structure for a portable Raman spectrometer and a portable Raman spectrometer. The heat dissipation structure for the portable Raman spectrometer can effectively dissipate the heat at the heating end of the detector and control the working temperature of the detector at -10°C, which directly improves the overall performance of the portable Raman spectrometer and provides the possibility for further miniaturization and modularization of the instrument.

[0006] The technical solution adopted by the present invention to solve its technical problem is: a heat dissipation structure for a portable Raman spectrometer, including a heat conductive block, a heat pipe pressing plate, a heat pipe and a heat pipe fixing plate, a groove is provided on the front side of the heat conductive block, the heat conductive block is connected to the heat pipe pressing plate, an evaporation section of the heat pipe is fixed between the bottom surface of the groove and the heat pipe pressing plate, and a condensation section of the heat pipe is connected to the heat pipe fixing plate.

[0007] The heat conductive block has a long strip structure. In a spatial rectangular coordinate system with X, Y, and Z axes as coordinate axes, the length direction of the heat conductive block is parallel to the Y axis, and the bottom surface of the groove is parallel to the plane where the X axis and the Y axis are located.

[0008] The groove has a first enclosure portion, a second enclosure portion, a third enclosure portion and a notch portion which are sequentially arranged around the groove.

[0009] The first enclosure portion includes a first heat fan, a first fixed block, and a second heat fan which are sequentially arranged along the Y-axis direction. The first heat fan is parallel to the second heat fan, and the first heat fan is parallel to the plane where the X-axis and the Z-axis are located. A first threaded hole is provided in the first fixed block, and the axis of the first threaded hole is parallel to the Z-axis.

[0010] A first mounting through hole is provided in both the second enclosure portion and the notch portion, the axis of the first mounting through hole is parallel to the Z axis, and the projection of the heat conducting block on the plane where the X axis and the Z axis are located is T-shaped.

[0011] The third enclosure portion includes a first baffle, a second fixed block, and a third heat fan which are sequentially arranged along the Y-axis direction. The first baffle is in a long strip structure, and the length direction of the first baffle is parallel to the Y-axis. A second threaded hole is provided in the second fixed block, and the axis of the second threaded hole is parallel to the Z-axis. The third heat fan is parallel to the plane where the X-axis and the Z-axis are located.

[0012] The heat pipe pressing plate has a rectangular structure. Both ends of the heat pipe pressing plate are connected to the first enclosure part and the third enclosure part one by one by screws respectively. The axis of the evaporation section of the heat pipe is parallel to the Y axis. A thermal conductive silicone sheet is connected between the evaporation section of the heat pipe and the bottom surface of the groove.

[0013] The cross section of the heat pipe fixing plate is concave-shaped, and second mounting holes are provided at both ends of the heat pipe fixing plate. The evaporation section of the heat pipe is located below the condensation section of the heat pipe. The evaporation section of the heat pipe is connected to the condensation section of the heat pipe by a connecting section, and the connecting section is a curved structure.

[0014] The portable Raman spectrometer comprises a metal shell, which contains a refrigerated array detector and the above-mentioned heat dissipation structure for the portable Raman spectrometer. The back side of the heat conductive block is laminated, connected and fixed to the back side of the refrigerated array detector, and the condensation section of the heat pipe and the heat pipe fixing plate are both connected to the inner surface of the metal shell.

[0015] A thermal conductive silicone grease layer is provided between the back of the heat conductive block and the back of the cooling array detector, a thermal conductive silicone sheet is connected between the condensation section of the heat pipe and the inner surface of the metal shell, and the heat pipe fixing sheet is fixed to the metal shell by screws.

[0016] The beneficial effects of the present invention are as follows: the heat dissipation structure for the portable Raman spectrometer can effectively dissipate the heat of the heating end of the detector, control the working temperature of the detector at -10°C, directly improve the overall performance of the portable Raman spectrometer, and provide the possibility for further miniaturization and modularization of the instrument. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings in the specification, which constitute a part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0018] Figure 1 Schematic diagram of the portable Raman spectrometer of the present invention.

[0019] Figure 2 This is the front view of the thermal block.

[0020] Figure 3 It is a top view of the thermal block.

[0021] Figure 4 This is the left side view of the thermal block.

[0022] Figure 5 It is a three-dimensional diagram of the heat conductive block.

[0023] Figure 6 It is the front view of the heat pipe pressing sheet.

[0024] Figure 7 It is the left view of the heat pipe pressing plate.

[0025] Figure 8 It is the front view of the heat pipe.

[0026] Fig. 9 It is the left side view of the heat pipe.

[0027] Fig.10 It is the front view of the heat pipe fixing plate.

[0028] Fig.11 It is the left side view of the heat pipe fixing plate.

[0029] Fig.12 This is the front view of the metal casing.

[0030] Fig.13 It is the left side view of the metal casing.

[0031] Fig.14 This is the rear view of the metal housing.

[0032] 1. Refrigeration array detector; 2. Heat conduction block; 3. Heat pipe pressing plate; 4. Heat pipe; 5. Metal shell; 6. Heat pipe fixing plate; 7. Test sample platform; 8. External light path collection system; 9. Laser light source; 10. Internal light path collection system;

[0033] 21. groove; 22. first enclosure portion; 23. second enclosure portion; 24. third enclosure portion; 25. notch portion; 26. first mounting through hole;

[0034] 221, first heat fin; 222, first fixing block; 223, second heat fin; 224, first threaded hole;

[0035] 241, first baffle; 242, second fixing block; 243, third heat fin; 244, second threaded hole;

[0036] 41. Evaporation section; 42. Connection section; 43. Condensation section;

[0037] 61. Second mounting through hole. DETAILED DESCRIPTION

[0038] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0039] A heat dissipation structure for a portable Raman spectrometer includes a heat conducting block 2, a heat pipe pressing plate 3, a heat pipe 4 and a heat pipe fixing plate 6. A groove 21 is provided on the front of the heat conducting block 2. The heat conducting block 2 is connected to the heat pipe pressing plate 3. An evaporation section 41 of the heat pipe 4 is fixed between the bottom surface of the groove 21 and the heat pipe pressing plate 3. A condensation section 43 of the heat pipe 4 is connected to the heat pipe fixing plate 6. Figure 1 shown.

[0040] The heat pipe 4 is a product in the prior art, and comprises an evaporation section 41, a connection section 42 and a condensation section 43 connected in sequence. The heat pipe 4 draws a closed metal tubular shell into a 1.3×(10 -1 -10 -4 )pa negative pressure and then filled with an appropriate amount of refrigerant. When the evaporation section 41 of the heat pipe 4 is heated, the refrigerant evaporates and vaporizes. The gaseous refrigerant flows to the condensation section 43 of the heat pipe 4 under a small pressure difference to release heat and condense into liquid again. The liquid refrigerant flows back to the evaporation section 41 by capillary force (or gravity). This cycle continues, and heat is transferred from the evaporation section 41 of the heat pipe 4 to the condensation section 43.

[0041] In this embodiment, the heat conducting block 2 is made of copper, which is a good heat conducting material, and the heat pipe pressing plate 3, the heat pipe 4 and the heat pipe fixing plate 6 are all made of metal materials. The function of the heat pipe pressing plate 3 is to connect and fix the evaporation section 41 of the heat pipe 4 to the heat conducting block 2. The heat conducting block 2 is a long rectangular cubic structure. In the spatial rectangular coordinate system with the X, Y and Z axes as the coordinate axes, the length direction of the heat conducting block 2 is parallel to the Y axis, and the bottom surface of the groove 21 is parallel to the plane where the X axis and the Y axis are located. Figures 2 to 5 The groove 21 has a bottom surface, and the groove 21 has a first enclosure portion 22, a second enclosure portion 23, a third enclosure portion 24 and a notch portion 25 arranged in sequence along the circumferential direction.

[0042] In this embodiment, the first enclosure portion 22 contains a first heat fin 221, a first fixed block 222, and a second heat fin 223 which are arranged in sequence along the Y-axis direction. There are multiple first heat fins 221 and second heat fins 223. The first heat fin 221 is parallel to the second heat fin 223. The first heat fin 221 is parallel to the plane where the X-axis and the Z-axis are located. A first threaded hole 224 is provided in the first fixed block 222, and the axis of the first threaded hole 224 is parallel to the Z-axis.

[0043] In this embodiment, the second enclosure 23 and the notch 25 are both provided with a first mounting through hole 26, the axis of the first mounting through hole 26 is parallel to the Z axis, and the projection of the heat conductive block 2 on the plane where the X axis and the Z axis are located is T-shaped. The third enclosure 24 includes a first baffle 241, a second fixing block 242, and a third fan heat plate 243 sequentially arranged along the Y axis direction, the first baffle 241 is a long strip structure, the length direction of the first baffle 241 is parallel to the Y axis, the second fixing block 242 is provided with a second threaded hole 244, the axis of the second threaded hole 244 is parallel to the Z axis, the third fan heat plate 243 is parallel to the plane where the X axis and the Z axis are located, and there are multiple third fan heat plates 243.

[0044] In this embodiment, the heat pipe pressing plate 3 is in a rectangular structure, and the two ends of the heat pipe pressing plate 3 are connected to the first threaded hole 224 of the first enclosure 22 and the second threaded hole 244 of the third enclosure 24 by screws, respectively, and the axis or center line of the evaporation section 41 of the heat pipe 4 is parallel to the Y axis, and the axis or center line of the evaporation section 41 of the heat pipe 4 is parallel to the bottom surface of the groove 21, and a thermally conductive silicone sheet is connected between the evaporation section 41 of the heat pipe 4 and the bottom surface of the groove 21. The heat in the heat conductive block 2 can be transferred to the evaporation section 41 of the heat pipe 4 through the thermally conductive silicone sheet.

[0045] In this embodiment, the cross section of the heat pipe fixing plate 6 is concave-shaped, and both ends of the heat pipe fixing plate 6 are provided with second mounting through holes 61. The heat pipe 4 is in an upright state, and the evaporation section 41 of the heat pipe 4 is located below the condensation section 43 of the heat pipe 4. The evaporation section 41 of the heat pipe 4 is connected to the condensation section 43 of the heat pipe 4 by a connecting section 42, and the connecting section 42 is a curved structure, such as Figures 6 to 11 The function of the heat pipe fixing plate 6 is to connect and fix the condensing section 43 of the heat pipe 4 with other heat dissipation objects.

[0046] A portable Raman spectrometer is described below. The portable Raman spectrometer includes a metal shell 5. The metal shell 5 contains a refrigerated array detector 1 and the above-mentioned heat dissipation structure for the portable Raman spectrometer. The back of the heat conductive block 2 is laminated, connected and fixed to the back of the refrigerated array detector 1. The condensation section 43 of the heat pipe 4 and the heat pipe fixing plate 6 are both in contact with the inner surface of the metal shell 5. The heat pipe fixing plate 6 connects and fixes the condensation section 43 of the heat pipe 4 to the metal shell 5 through the second mounting through hole 61 and screws. Figure 1 , Fig.12 , Fig.13 and Fig.14 shown.

[0047] In this embodiment, a thermally conductive silicone grease layer is provided between the back side of the heat conductive block 2 and the back side of the cooling array detector 1, and the heat in the cooling array detector 1 can be transferred to the cooling array detector 1 through the thermally conductive silicone grease layer. A thermally conductive silicone sheet is connected between the condensation section 43 of the heat pipe 4 and the inner surface of the metal shell 5. The heat pipe fixing sheet 6 and the metal shell 5 are fixed by screws. The condensation section 43 of the heat pipe 4 is located between the heat pipe fixing sheet 6 and the metal shell 5, and the heat in the condensation section 43 of the heat pipe 4 can be transferred to the metal shell 5 through the thermally conductive silicone sheet.

[0048] In this embodiment, the metal shell 5 also contains a test sample platform 7, an external light path collection system 8, a laser light source 9 and an internal light path collection system 10. The refrigerated array detector 1, the test sample platform 7, the external light path collection system 8, the laser light source 9 and the internal light path collection system 10 are all prior art products. It can be understood that the present invention adds the refrigerated array detector 1 and the above-mentioned heat dissipation structure for the portable Raman spectrometer on the basis of the existing portable Raman spectrometer.

[0049] The front of the refrigerated array detector 1 is connected to the internal optical path collection system 10. The refrigerated array detector 1 is refrigerated after being powered on to cool the detector. The back of the refrigerated detector 1 is the heating end. The heat dissipation structure for the portable Raman spectrometer can effectively transfer the heat of the heating end of the refrigerated array detector 1 to the metal shell through the heat pipe 4. At the same time, the metal shell adopts a multi-groove design, and then dissipates heat through the larger area of ​​the heat dissipation surface of the metal shell. The heat dissipation structure for the portable Raman spectrometer mainly dissipates heat for the refrigerated array detector 1, controls the refrigerated array detector 1 at a constant low temperature, reduces noise, and improves product performance.

[0050] The above is only a specific embodiment of the present invention, and cannot be used to limit the scope of the invention. Therefore, the replacement of equivalent components, or equivalent changes and modifications made according to the protection scope of the present invention, should still fall within the scope of this patent. In addition, the technical features of the present invention can be freely combined with each other, with technical features and technical solutions, and with technical solutions.

Claims

1. A heat dissipation structure for a portable Raman spectrometer, characterized in that: The heat dissipation structure for a portable Raman spectrometer comprises a heat conducting block (2), a heat pipe pressing plate (3), a heat pipe (4) and a heat pipe fixing plate (6); a groove (21) is provided on the front surface of the heat conducting block (2); the heat conducting block (2) is connected to the heat pipe pressing plate (3); an evaporation section (41) of the heat pipe (4) is fixed between the bottom surface of the groove (21) and the heat pipe pressing plate (3); and a condensation section (43) of the heat pipe (4) is connected to the heat pipe fixing plate (6); The heat conducting block (2) is in the shape of a long strip. In a spatial rectangular coordinate system with the X, Y and Z axes as coordinate axes, the length direction of the heat conducting block (2) is parallel to the Y axis, and the bottom surface of the groove (21) is parallel to the plane where the X axis and the Y axis are located. The groove (21) has a first enclosure portion (22), a second enclosure portion (23), a third enclosure portion (24) and a notch portion (25) arranged in sequence around the periphery; The first enclosure (22) comprises a first heat fin (221), a first fixing block (222), and a second heat fin (223) which are sequentially arranged along the Y-axis direction; the first heat fin (221) is parallel to the second heat fin (223); the first heat fin (221) is parallel to the plane where the X-axis and the Z-axis are located; a first threaded hole (224) is arranged in the first fixing block (222); and the axis of the first threaded hole (224) is parallel to the Z-axis.

2. The heat dissipation structure for a portable Raman spectrometer according to claim 1, characterized in that: A first mounting through hole (26) is provided in both the second enclosure portion (23) and the notch portion (25); the axis of the first mounting through hole (26) is parallel to the Z axis; and the projection of the heat conducting block (2) on the plane where the X axis and the Z axis are located is T-shaped.

3. The heat dissipation structure for a portable Raman spectrometer according to claim 1, characterized in that: The third enclosure portion (24) comprises a first baffle (241), a second fixing block (242), and a third heat fan (243) which are sequentially arranged along the Y-axis direction; the first baffle (241) is in a long strip structure; the length direction of the first baffle (241) is parallel to the Y-axis; a second threaded hole (244) is arranged in the second fixing block (242); the axis of the second threaded hole (244) is parallel to the Z-axis; and the third heat fan (243) is parallel to the plane where the X-axis and the Z-axis are located.

4. The heat dissipation structure for a portable Raman spectrometer according to claim 1, characterized in that: The heat pipe pressing plate (3) has a rectangular structure. The two ends of the heat pipe pressing plate (3) are connected to the first enclosure portion (22) and the third enclosure portion (24) respectively by screws in a one-to-one correspondence. The axis of the evaporation section (41) of the heat pipe (4) is parallel to the Y axis. A heat-conducting silicone sheet is connected between the evaporation section (41) of the heat pipe (4) and the bottom surface of the groove (21).

5. The heat dissipation structure for a portable Raman spectrometer according to claim 1, characterized in that: The cross section of the heat pipe fixing plate (6) is in a concave shape, and second mounting through holes (61) are provided at both ends of the heat pipe fixing plate (6). The evaporation section (41) of the heat pipe (4) is located below the condensation section (43) of the heat pipe (4), and the evaporation section (41) of the heat pipe (4) is connected to the condensation section (43) of the heat pipe (4) via a connecting section (42), and the connecting section (42) is a curved structure.

6. A portable Raman spectrometer, characterized in that: The portable Raman spectrometer comprises a metal shell (5), wherein the metal shell (5) contains a refrigerated array detector (1) and the heat dissipation structure for a portable Raman spectrometer according to claim 1, the back side of the heat conductive block (2) is laminated and fixedly connected to the back side of the refrigerated array detector (1), and the condensation section (43) of the heat pipe (4) and the heat pipe fixing plate (6) are both connected to the inner surface of the metal shell (5).

7. The portable Raman spectrometer according to claim 6, characterized in that: A thermally conductive silicone grease layer is provided between the back side of the heat conductive block (2) and the back side of the refrigeration array detector (1), a thermally conductive silicone sheet is connected between the condensation section (43) of the heat pipe (4) and the inner surface of the metal shell (5), and the heat pipe fixing sheet (6) and the metal shell (5) are fixedly connected by screws.

Citation Information

Patent Citations

  • Hot pipe heat conduction heat radiator

    CN201111626Y

  • Heat dissipation structure for portable Raman spectrometer and portable Raman spectrometer

    CN211453366U