Polishing head cleaning device

By designing a polishing head cleaning device including a brush structure, a water spray structure and an automatic lifting and rotary driving structure, the problem of silicon wafer damage caused by wear of foreign objects on the polishing head is solved, and effective cleaning and improving working efficiency are achieved.

CN111070098BActive Publication Date: 2025-04-29ZHEJIANG XINHUI EQUIP TECH CO LTD
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Patent Information

Application Number
CN201911404893.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2019-12-31
Publication Date
2025-04-29
Estimated Expiration
2039-12-31

AI Technical Summary

Technical Problem

In the prior art, foreign objects on the polishing head wear lead to damage to the silicon wafer, affecting the performance of the silicon wafer.

Method used

A polishing head cleaning device is designed, including a substrate, a brush structure, a rotary drive structure, a lifting structure, a water spray structure and a control unit. The brush structure includes a detachable first brush portion and a second brush portion for cleaning the sides and the machining end surface of the polishing head. The water spray structure is used to flush the polishing head, the lifting structure and the rotary drive structure are used for automatic rising and rotary cleaning.

Benefits of technology

Effectively clean the polishing head to prevent foreign objects from scratching or falling on the silicon wafer, and ensure the performance of the silicon wafer. At the same time, the device can clean two polishing heads at the same time to improve working efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention is a polishing head cleaning device, comprising: a substrate, which can be fixedly connected to a machine body; a brush structure, comprising a first brush part and a second brush part which can be detachably arranged above the substrate, the first brush part and the second brush part can be lifted and rotated, the first brush part is used to brush the side of the polishing head, and the second brush part is used to brush the processed end surface of the polishing head; a rotary drive structure, comprising a first rotating part and a second rotating part; a lifting structure, which is connected to the bottom of the substrate and extends downward, and the lifting structure is used to drive the brush structure and the rotary drive structure to lift and lower in a vertical direction; a water spraying structure, which is used to spray water to rinse the polishing head; and a control part, the rotary drive structure, the lifting structure and the water spraying structure are all electrically connected to the control part. The device can effectively clean the polishing head, prevent foreign matter on the polishing head from scratching the silicon wafer or foreign matter from falling on the silicon wafer when sucking the silicon wafer, and ensure the performance of the silicon wafer.
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Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer grinding, and in particular to a polishing head cleaning device. Background Art

[0002] As an important semiconductor material, single crystal silicon has good electrical properties and thermal stability. Since it was discovered and used by people, it quickly replaced other semiconductor materials. Silicon material has become the most widely used semiconductor material because of its good high temperature resistance and radiation resistance, and is particularly suitable for the production of high-power devices. Most integrated circuit semiconductor devices are made of silicon material. Among the methods of manufacturing silicon single crystals with good performance, the Czochralski method for growing silicon single crystals has relatively simple equipment and processes and is easy to realize automatic control. After the Czochralski single crystal silicon rod is pulled out of the single crystal furnace, a series of processes need to be carried out. The early stage includes mechanical processing such as truncation, squaring, rounded corner grinding and plane grinding; in the middle stage, the single crystal silicon rod needs to be rolled, sliced, cleaned, chamfered, ground and cleaned again; in the later stage, the silicon wafers are subjected to processes such as texturing, diffusion, crystallization and sintering before they can be manufactured into semiconductor devices or solar cells for photovoltaic power generation.

[0003] In the mid-stage grinding process, the silicon wafer and the grinding disc are in dry friction, which can easily cause the grinding disc surface to heat up and damage, and the heat can also burn the silicon wafer. There are foreign objects on the polishing head and adsorption pad, which scratch the silicon wafer or fall on the silicon wafer during processing, affecting the performance of the silicon wafer.

[0004] Therefore, the inventor, relying on many years of experience and practice in related industries, proposes a polishing head cleaning device to overcome the defects of the prior art. Summary of the invention

[0005] The purpose of the present invention is to provide a polishing head cleaning device to overcome the problems existing in the prior art that foreign matter on the polishing head causes damage to the silicon wafer and affects the performance of the silicon wafer. The device can effectively clean the polishing head to prevent foreign matter on the polishing head from scratching the silicon wafer or foreign matter from falling on the silicon wafer when sucking the silicon wafer, thereby ensuring the performance of the silicon wafer.

[0006] The object of the present invention is achieved by a polishing head cleaning device comprising:

[0007] A base plate, which can be fixedly connected to the machine body;

[0008] The brush structure comprises a first brush part and a second brush part which are arranged parallel and spaced above the substrate and can be detached, the first brush part and the second brush part can be raised and lowered and can rotate, the first brush part is used to brush the side surface of the polishing head, and the second brush part is used to brush the processed end surface of the polishing head;

[0009] The rotation driving structure comprises a first rotating part and a second rotating part capable of driving the first brush part and the second brush part to rotate respectively;

[0010] A lifting structure, connected to the bottom of the base plate and extending downward, the lifting structure is used to drive the brush structure and the rotary drive structure to lift in a vertical direction;

[0011] A water spray structure, used for spraying water to rinse the polishing head;

[0012] A control unit, the rotation drive structure, the lifting structure and the water spraying structure are all electrically connected to the control unit.

[0013] In a preferred embodiment of the present invention, the brush structure includes one first brush part and two second brush parts, the first brush part is arranged between the two second brush parts, and the brush structure can clean two polishing heads at the same time.

[0014] In a preferred embodiment of the present invention, the first rotating part includes a first rotating shaft arranged through the substrate, the first brush part is detachably connected to the top end of the first rotating shaft, one end of the first rotating shaft located below the substrate is connected to a first servo motor, the first servo motor is used to drive the first rotating shaft and the first brush part to rotate circumferentially, a first synchronous pulley is arranged at the bottom end of the first rotating shaft, a second synchronous pulley is arranged at the output end of the first servo motor, and a first synchronous belt is sleeved on the first synchronous pulley and the second synchronous pulley; the first servo motor is mounted on the first motor base, and the lifting structure includes a first cylinder capable of driving the first motor base, the first servo motor, the first rotating shaft and the first brush part to lift and lower;

[0015] The second rotating part includes a second rotating shaft arranged through the substrate, the second brush part is detachably connected to the top end of the second rotating shaft, a second servo motor is connected to one end of the second rotating shaft located below the substrate, the second servo motor is used to drive the second rotating shaft and the second brush part to rotate circumferentially, a third synchronous pulley is arranged at the bottom end of the second rotating shaft, a fourth synchronous pulley is arranged at the output end of the second servo motor, and a second synchronous belt is sleeved on the third synchronous pulley and the fourth synchronous pulley; the second servo motor is mounted on the second motor base, and the lifting structure includes a second cylinder capable of driving the second motor base, the second servo motor, the second rotating shaft and the second brush part to lift and lower;

[0016] The first servo motor, the first cylinder, the second servo motor, and the second cylinder are all electrically connected to the control unit.

[0017] In a preferred embodiment of the present invention, the first cylinder comprises a first cylinder barrel fixedly connected to the bottom of the base plate and extending downward, a first cylinder rod is sealed and slidably penetrated through the lower end of the first cylinder barrel, the lower end of the first cylinder rod is connected to the bottom of the first cylinder base, the first motor base is arranged on the top of the first cylinder base; a first housing base is arranged above the top of the first cylinder base, and the bottom end of the first rotating shaft rotates and passes through the first housing base;

[0018] The second cylinder includes a second cylinder barrel fixedly connected to the bottom of the base plate and extending downward, a second cylinder rod is sealed and slidably penetrated through the lower end of the second cylinder barrel, the lower end of the second cylinder rod is connected to the bottom of the second cylinder base, and the second motor base is arranged on the top of the second cylinder base; a second casing base is arranged above the top of the second cylinder base, and the bottom end of the second rotating shaft rotates and passes through the second casing base.

[0019] In a preferred embodiment of the present invention, the bottom of the base plate is further connected to a first guide shaft extending downward, and a first linear bearing is provided on the first motor base, and the first linear bearing can slide up and down along the first guide shaft along with the first motor base;

[0020] The bottom of the base plate is also connected to a second guide shaft extending downward, and a second linear bearing is passed through the second motor base. The second linear bearing can slide up and down along the second guide shaft along with the second motor base.

[0021] In a preferred embodiment of the present invention, a first housing is coaxially sleeved on the outer side of the first rotating shaft, the first housing passes through the base plate, the bottom end of the first housing is fixedly supported on the first housing base, first bearing groups are respectively arranged at both ends of the inner wall of the first housing, the first rotating shaft rotatably passes through the first bearing group, and the first housing can be raised and lowered along with the first housing base and the first rotating shaft;

[0022] A second housing is coaxially sleeved on the outer side of the second rotating shaft, the second housing passes through the base plate, the bottom end of the second housing is fixedly supported on the second housing base, second bearing groups are respectively arranged at both ends of the inner wall of the second housing, the second rotating shaft rotatably passes through the second bearing group, and the second housing can be raised and lowered along with the second housing base and the second rotating shaft.

[0023] In a preferred embodiment of the present invention, a substrate cover is arranged above the substrate, a first protective tube with an open top is sleeved radially and spaced on the outside of the first housing, and the bottom of the first protective tube is fixedly connected to the substrate cover via a first fixing seat; a second protective tube is sleeved on the outside of the first protective tube, the bottom of the second protective tube is open, the top of the second protective tube is fixedly connected to the top of the first rotating shaft, and the second protective tube can be lifted and rotated along with the first rotating shaft;

[0024] A third protective tube with an opening at the top is radially spaced apart on the outer side of the second housing, and the bottom of the third protective tube is fixedly connected to the substrate cover via a second fixing seat; a fourth protective tube is sleeved on the outer side of the third protective tube, and the bottom of the fourth protective tube is open. The top of the fourth protective tube is fixedly connected to the top of the second rotating shaft, and the fourth protective tube can be raised, lowered and rotated along with the second rotating shaft.

[0025] In a preferred embodiment of the present invention, the first brush portion includes a first brush plate detachably connected to the top end of the first rotating shaft, and bristles are arranged on the side wall of the first brush plate in a horizontal direction.

[0026] In a preferred embodiment of the present invention, the second brush portion includes a second brush plate detachably connected to the top end of the second rotating shaft, and the top surface of the second brush plate is provided with bristles arranged in a vertical direction.

[0027] In a preferred embodiment of the present invention, the first brush disc is connected to the top end of the first rotating shaft via a connecting screw; the second brush disc is connected to the top end of the second rotating shaft via a connecting screw.

[0028] As described above, the polishing head cleaning device provided by the present invention has the following beneficial effects:

[0029] In the polishing head cleaning device provided by the present invention, a first brush part and a second brush part are provided, which can respectively clean and scrub the side surface of the polishing head and the processed end surface of the polishing head. Structurally, the first brush part and the second brush part adopt a detachable connection method, which is convenient for replacement and maintenance of the brush parts; functionally, after unloading the silicon wafer, the water spray structure automatically opens to rinse the polishing head, and the first brush part and the second brush part can automatically rise to clean the processed surface and side surface of the polishing head at the same time, which can effectively clean the polishing head and prevent foreign matter on the polishing head from scratching the silicon wafer or foreign matter from falling on the silicon wafer when sucking the silicon wafer, thereby ensuring the performance of the silicon wafer; in the polishing head cleaning device provided by the present invention, the brush structure includes a first brush part and two second brush parts, which can clean two polishing heads at the same time, and has high operating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The following drawings are only intended to illustrate and explain the present invention, and are not intended to limit the scope of the present invention.

[0031] in:

[0032] Figure 1 : It is a top view of the polishing head cleaning device of the present invention.

[0033] Figure 2 :for Figure 1 Sectional view at AA.

[0034] Figure 3 : It is a side view of the first cylinder of the present invention.

[0035] Figure 4 : It is a side view of the first rotating part of the present invention.

[0036] In the figure:

[0037] 100. Polishing head cleaning device;

[0038] 1. Base plate; 11. Base plate cover;

[0039] 2. Brush structure; 21. First brush part; 22. Second brush part;

[0040] 3. Rotation drive structure;

[0041] 31. first rotating part; 311. first rotating shaft; 312. first servo motor; 313. first synchronous pulley; 314. second synchronous pulley; 315. first synchronous belt; 316. first motor base; 317. first housing base;

[0042] 32. second rotating part; 321. second rotating shaft; 322. second servo motor; 323. third synchronous pulley; 324. fourth synchronous pulley; 325. second synchronous belt; 326. second housing base;

[0043] 4. Lifting structure;

[0044] 41. first cylinder; 411. first cylinder barrel; 412. first cylinder rod; 413. first cylinder base; 414. first guide shaft; 415. first linear bearing;

[0045] 42. Second cylinder;

[0046] 51. First housing; 52. Second housing; 53. First bearing group; 54. Second bearing group; 55. First protective tube; 56. Second protective tube. DETAILED DESCRIPTION

[0047] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, specific embodiments of the present invention are now described with reference to the accompanying drawings.

[0048] The specific embodiments of the present invention described herein are only used to explain the purpose of the present invention and cannot be understood as limiting the present invention in any way. Under the guidance of the present invention, technicians can conceive of any possible variations based on the present invention, which should be considered to belong to the scope of the present invention. It should be noted that when an element is referred to as "arranged on" another element, it can be directly on the other element or there can also be a central element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be a central element at the same time. The terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a mechanical connection or an electrical connection, or it can be the internal communication of two elements, it can be directly connected, or it can be indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are only for illustrative purposes and do not represent the only implementation method.

[0049] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0050] like Figures 1 to 4 As shown, the present invention provides a polishing head cleaning device 100, which is arranged at a silicon wafer unloading position and includes:

[0051] The base plate 1 can be fixedly arranged on the machine body (the machine body is fixedly installed on the ground and is used for the power structure of the housing device, such as the lifting structure, the rotating drive structure, etc., which are not shown in the figure); in a specific embodiment of the present invention, the base plate 1 is arranged in a rectangular shape;

[0052] The brush structure 2 includes a first brush portion 21 and a second brush portion 22 which are arranged above the substrate in parallel and detachably, the first brush portion 21 and the second brush portion 22 can be raised and lowered and can rotate, the first brush portion 21 is used to brush the side of the polishing head (existing technology), and the second brush portion 22 is used to brush the processed end surface of the polishing head (the end surface of the polishing head is provided with an adsorption pad to form the processed end surface, existing technology, not shown in the figure);

[0053] The rotation driving structure 3 includes a first rotating part 31 and a second rotating part 32 which can respectively drive the first brush part 21 and the second brush part 22 to rotate;

[0054] A lifting structure 4 is connected to the bottom of the base plate 1 and extends downward, and is used to drive the brush structure 2 and the rotary drive structure 3 to move up and down in a vertical direction;

[0055] A water spray structure is used to spray water to rinse the polishing head; in this embodiment, the water spray structure is a water spray head connected to the water supply device (a rinse spray head in the prior art can be used);

[0056] The control part, the rotation driving structure, the lifting structure and the water spraying structure are all electrically connected to the control part.

[0057] In the polishing head cleaning device provided by the present invention, a first brush part and a second brush part are provided, which can respectively clean and scrub the side surface of the polishing head and the processed end surface of the polishing head. Structurally, the first brush part and the second brush part adopt a detachable connection method, which is convenient for replacement and maintenance of the brush parts; functionally, after unloading the silicon wafer, the water spray structure automatically opens to rinse the polishing head, and the first brush part and the second brush part can automatically rise to clean the processed surface and side surface of the polishing head at the same time, which can effectively clean the polishing head and prevent foreign matter on the polishing head from scratching the silicon wafer or foreign matter from falling on the silicon wafer when sucking the silicon wafer, thereby affecting the performance of the silicon wafer.

[0058] Further, if Figure 1 , Figure 2 As shown, the brush structure 2 includes a first brush portion 21 and two second brush portions 22. The first brush portion 21 is arranged between the two second brush portions 22 for use by two polishing heads. The brush structure 2 can clean the two polishing heads at the same time. The first brush portion 21 and the two second brush portions 22 are arranged in parallel and spaced apart. The spacing between the three is sufficient for the first brush portion 21 to clean the side of the polishing head while the second brush portion 22 can clean the processed end surface of the polishing head. When grinding silicon wafers, a group of polishing heads is used for processing. A group of polishing heads generally includes two polishing heads. The polishing head cleaning device provided by the present invention can clean the sides and processed end surfaces of the two polishing heads at the same time.

[0059] Further, if Figure 2 , Figure 4As shown, the first rotating part 31 includes a first rotating shaft 311 that passes through the substrate 1, the first brush part 21 is detachably connected to the top of the first rotating shaft 311, and the first servo motor 312 is connected to one end of the first rotating shaft 311 located below the substrate 1. The first servo motor 312 is used to drive the first rotating shaft 311 and the first brush part 21 to rotate circumferentially. A first synchronous pulley 313 is provided at the bottom end of the first rotating shaft 311, and a second synchronous pulley 314 is provided at the output end of the first servo motor 312. A first synchronous belt 315 is sleeved on the first synchronous pulley 313 and the second synchronous pulley 314; the first servo motor 312 is mounted on the first motor base 316, and the lifting structure includes a first cylinder 41 that can drive the first motor base 316, the first servo motor 312, the first rotating shaft 311 and the first brush part 21 to lift and lower;

[0060] The second rotating part 32 includes a second rotating shaft 321 passing through the substrate 1, the second brush part 22 is detachably connected to the top of the second rotating shaft 321, and the second servo motor 322 is connected to one end of the second rotating shaft 321 located below the substrate 1. The second servo motor 322 is used to drive the second rotating shaft 321 and the second brush part 22 to rotate circumferentially. A third synchronous pulley 323 is provided at the bottom end of the second rotating shaft 321, and a fourth synchronous pulley 324 is provided at the output end of the second servo motor 322. A second synchronous belt 325 is sleeved on the third synchronous pulley 323 and the fourth synchronous pulley 324; the second servo motor 322 is mounted on the second motor base, and the lifting structure includes a second cylinder 42 that can drive the second motor base, the second servo motor 322, the second rotating shaft 321, and the second brush part 22 to lift and lower;

[0061] The first servo motor 312 , the first air cylinder 41 , the second servo motor 322 , and the second air cylinder 42 are all electrically connected to the control unit.

[0062] The first servo motor 312 and the second servo motor 322 are driven by a servo motor. The control unit can control the start and stop of the servo motor, and the servo motor can accurately control the rotation speed. Synchronous belt transmission is used between the first servo motor 312 and the first rotating shaft 311, and between the second servo motor 322 and the second rotating shaft 321, so the operation is smoother.

[0063] Further, if Figure 2 , Figure 3As shown, the first cylinder 41 includes a first cylinder barrel 411 fixedly connected to the bottom of the base plate 1 and extending downward, a first cylinder rod 412 is sealed and slidably penetrated through the lower end of the first cylinder barrel 411, the lower end of the first cylinder rod 412 is connected to the bottom of the first cylinder base 413, and a first motor base 316 is arranged on the top of the first cylinder base 413. In this embodiment, the first cylinder base 413 includes a first base bottom plate, the first base bottom plate is connected to the first base top plate through a vertically arranged cylinder frame, and the first motor base 316 is arranged on the first base top plate;

[0064] A first housing base 317 is arranged above the top of the first cylinder base 413 (i.e., above the first base top plate). In this embodiment, the first base top plate is connected to the first housing base 317 via a vertically arranged hexagonal support. The bottom end of the first rotating shaft 311 rotates and passes through the first housing base 317. In this embodiment, a first fixing nut is sleeved on the position of the first rotating shaft 311 below the first housing base 317, and the first fixing nut axially fixes the first rotating shaft 311. A first synchronous pulley 313 is sleeved on the position of the first rotating shaft 311 below the first fixing nut.

[0065] The second cylinder 42 includes a second cylinder barrel fixedly connected to the bottom of the base plate 1 and extending downward, a second cylinder rod is sealed and slidably penetrated through the lower end of the second cylinder barrel, the lower end of the second cylinder rod is connected to the bottom of the second cylinder base, and a second motor base is arranged on the top of the second cylinder base; in this embodiment, the second cylinder base includes a second base bottom plate, the second base bottom plate is connected to the second base top plate through a vertically arranged cylinder frame, and a second motor base is arranged on the second base top plate;

[0066] A second casing base is arranged above the top of the second cylinder base (i.e., above the second base top plate). In the present embodiment, the second base top plate is connected to the second casing base via a vertically arranged hexagonal support. The bottom end of the second rotating shaft 321 rotates through the second casing base 326. In the present embodiment, the second rotating shaft 321 is located below the second casing base 326 and a second fixing nut is sleeved thereon, and the second fixing nut axially fixes the second rotating shaft 321. A second synchronous belt 325 is sleeved thereon, located below the second fixing nut.

[0067] Further, if Figure 2 , Figure 4As shown, the bottom of the base plate 1 is also connected to a first guide shaft 414 extending downward, and a first linear bearing 415 is provided on the first motor base 316, and the first linear bearing 415 can slide up and down along the first guide shaft 414 with the first motor base 316; the bottom of the base plate is also connected to a second guide shaft extending downward, and a second linear bearing is provided on the second motor base, and the second linear bearing can slide up and down along the second guide shaft with the second motor base. The cooperation between the first guide shaft 414 and the first linear bearing 415, the second guide shaft and the second linear bearing makes the first rotating shaft 311 and the second rotating shaft 321 rise and fall more smoothly.

[0068] Further, if Figure 2 As shown, the first housing 51 is coaxially sleeved on the outer side of the first rotating shaft 311, the first housing 51 passes through the base plate 1, the bottom end of the first housing 51 is fixedly supported on the first housing base 317, and the first bearing groups 53 are respectively arranged at both ends of the inner wall of the first housing 51. The first rotating shaft 311 rotates and passes through the first bearing group 53, and the first housing 51 can be raised and lowered along with the first housing base 317 and the first rotating shaft 311;

[0069] The second housing 52 is coaxially sleeved on the outer side of the second rotating shaft 321. The second housing 52 passes through the base plate 1. The bottom end of the second housing 52 is fixedly supported on the second housing base 326. Second bearing groups 54 are respectively arranged at both ends of the inner wall of the second housing 52. The second rotating shaft 321 rotatably passes through the second bearing group 54. The second housing 52 can be raised and lowered along with the second housing base 326 and the second rotating shaft 321.

[0070] Further, if Figure 2 As shown, a substrate cover plate 11 is arranged above the substrate 1, and a first protective tube 55 with an open top is sleeved radially and spacedly on the outer side of the first housing 51, and the bottom of the first protective tube 55 is fixedly connected to the substrate cover plate 11 through a first fixing seat; a second protective tube 56 is sleeved on the outer side of the first protective tube 55, and the bottom of the second protective tube 56 is open, and the top of the second protective tube 56 is fixedly connected to the top of the first rotating shaft 311, and the second protective tube 56 can be lifted and rotated along with the first rotating shaft 311;

[0071] A third protective tube with an opening on the top is radially spaced apart on the outer side of the second housing 52, and the bottom of the third protective tube is fixedly connected to the base plate cover via a second fixing seat; a fourth protective tube is sleeved on the outer side of the third protective tube, and the bottom of the fourth protective tube is open. The top of the fourth protective tube is fixedly connected to the top of the second rotating shaft, and the fourth protective tube can be raised, lowered and rotated along with the second rotating shaft.

[0072] Furthermore, the first brush portion 21 includes a first brush plate detachably connected to the top end of the first rotating shaft 311 , and bristles are arranged on the side wall of the first brush plate in a horizontal direction.

[0073] Furthermore, the second brush portion includes a second brush plate detachably connected to the top end of the second rotating shaft 321, and the top surface of the second brush plate is provided with bristles arranged in a vertical direction.

[0074] In this embodiment, the first brush disc is connected to the top end of the first rotating shaft 311 via a connecting screw; and the second brush disc is connected to the top end of the second rotating shaft 321 via a connecting screw.

[0075] In a specific embodiment of the present invention, the method of using the polishing head cleaning device 100 is as follows:

[0076] After the silicon wafer is ground, the silicon wafer is unloaded, and the unloading conveying unit automatically moves to the unloading position;

[0077] The control unit controls the first cylinder 41 and the two second cylinders 42 to start at the same time, the first cylinder rod 412 and the second cylinder rod are both retracted and moved upward, the first cylinder rod 412 drives the first brush part 21 to move upward through the first cylinder base 413, the first motor base 316, and the first rotating shaft 311, and the second cylinder rod drives the second brush part 22 to move upward through the second cylinder base, the second motor base, and the second rotating shaft 321, the first brush part 21 and the second brush part 22 are pulled up to the working position as a whole, the first cylinder 41 and the two second cylinders 42 stop working; the water spraying structure (water spraying head) starts to spray water;

[0078] The control unit controls the first servo motor 312 and the second servo motor 322 to rotate forward, and the servo motor drives the first rotating shaft 311 and the second rotating shaft 321 to rotate through the synchronous belts (the first synchronous belt 315 and the second synchronous belt 325), and the first brush part 21 and the second brush part 22 rotate synchronously accordingly, the first brush part 21 brushes the side of the polishing head, and the second brush part 22 brushes the processed end surface (mainly the adsorption pad) of the polishing head;

[0079] After cleaning, the control unit controls the first servo motor 312 and the second servo motor 322 to stop rotating, and controls the first cylinder 41 and the two second cylinders 42 to start simultaneously, the first cylinder rod 412 and the second cylinder rod both extend and move downward, and the first brush part 21 and the second brush part 22 return to their original state.

[0080] As described above, the polishing head cleaning device provided by the present invention has the following beneficial effects:

[0081] In the polishing head cleaning device provided by the present invention, a first brush part and a second brush part are provided, which can respectively clean and scrub the side surface of the polishing head and the processed end surface of the polishing head. Structurally, the first brush part and the second brush part adopt a detachable connection method, which is convenient for replacement and maintenance of the brush parts; functionally, after unloading the silicon wafer, the water spray structure automatically opens to rinse the polishing head, and the first brush part and the second brush part can automatically rise to clean the processed surface and side surface of the polishing head at the same time, which can effectively clean the polishing head and prevent foreign matter on the polishing head from scratching the silicon wafer or foreign matter from falling on the silicon wafer when sucking the silicon wafer, thereby affecting the performance of the silicon wafer; in the polishing head cleaning device provided by the present invention, the brush structure includes a first brush part and two second brush parts, which can clean two polishing heads at the same time, and has high operating efficiency.

[0082] The above description is only an illustrative embodiment of the present invention and is not intended to limit the scope of the present invention. Any equivalent changes and modifications made by any person skilled in the art without departing from the concept and principle of the present invention shall fall within the scope of protection of the present invention.

Claims

1. A polishing head cleaning device, characterized in that: include, A base plate, which can be fixedly connected to the machine body; The brush structure comprises a first brush part and a second brush part which are arranged parallel and spaced above the substrate and can be detached, the first brush part and the second brush part can be raised and lowered and can rotate, the first brush part is used to brush the side surface of the polishing head, and the second brush part is used to brush the processed end surface of the polishing head; The rotation driving structure comprises a first rotating part and a second rotating part capable of driving the first brush part and the second brush part to rotate respectively; A lifting structure, connected to the bottom of the base plate and extending downward, the lifting structure is used to drive the brush structure and the rotary drive structure to lift in a vertical direction; A water spray structure, used for spraying water to rinse the polishing head; A control unit, the rotation drive structure, the lifting structure and the water spraying structure are all electrically connected to the control unit; The brush structure includes one first brush part and two second brush parts, the first brush part is arranged between the two second brush parts, and the brush structure can clean two polishing heads at the same time; The first rotating part includes a first rotating shaft arranged through the substrate, the first brush part is detachably connected to the top end of the first rotating shaft, a first servo motor is connected to one end of the first rotating shaft located below the substrate, the first servo motor is used to drive the first rotating shaft and the first brush part to rotate circumferentially, a first synchronous pulley is arranged at the bottom end of the first rotating shaft, a second synchronous pulley is arranged at the output end of the first servo motor, and a first synchronous belt is sleeved on the first synchronous pulley and the second synchronous pulley; the first servo motor is mounted on the first motor base, and the lifting structure includes a first cylinder capable of driving the first motor base, the first servo motor, the first rotating shaft and the first brush part to lift and lower; The second rotating part includes a second rotating shaft arranged through the substrate, the second brush part is detachably connected to the top end of the second rotating shaft, a second servo motor is connected to one end of the second rotating shaft located below the substrate, the second servo motor is used to drive the second rotating shaft and the second brush part to rotate circumferentially, a third synchronous pulley is arranged at the bottom end of the second rotating shaft, a fourth synchronous pulley is arranged at the output end of the second servo motor, and a second synchronous belt is sleeved on the third synchronous pulley and the fourth synchronous pulley; the second servo motor is mounted on the second motor base, and the lifting structure includes a second cylinder capable of driving the second motor base, the second servo motor, the second rotating shaft and the second brush part to lift and lower; The first servo motor, the first cylinder, the second servo motor and the second cylinder are all electrically connected to the control unit; The first cylinder comprises a first cylinder barrel fixedly connected to the bottom of the base plate and extending downward, a first cylinder rod is sealed and slidably penetrated through the lower end of the first cylinder barrel, the lower end of the first cylinder rod is connected to the bottom of the first cylinder base, the first motor base is arranged on the top of the first cylinder base; a first housing base is arranged above the top of the first cylinder base, and the bottom end of the first rotating shaft rotates and passes through the first housing base; The second cylinder comprises a second cylinder barrel fixedly connected to the bottom of the base plate and extending downward, a second cylinder rod is sealed and slidably penetrated through the lower end of the second cylinder barrel, the lower end of the second cylinder rod is connected to the bottom of the second cylinder base, and the second motor base is arranged on the top of the second cylinder base; a second housing base is arranged above the top of the second cylinder base, and the bottom end of the second rotating shaft rotates and passes through the second housing base; The first brush portion includes a first brush plate detachably connected to the top end of the first rotating shaft, and bristles are arranged on the side wall of the first brush plate in a horizontal direction.

2. The polishing head cleaning device according to claim 1, characterized in that: The bottom of the base plate is also connected to a first guide shaft extending downward, and the first motor base is provided with a first linear bearing, and the first linear bearing can slide up and down along the first guide shaft along with the first motor base; The bottom of the base plate is also connected to a second guide shaft extending downward, and a second linear bearing is passed through the second motor base. The second linear bearing can slide up and down along the second guide shaft along with the second motor base.

3. The polishing head cleaning device according to claim 1, characterized in that: A first housing is coaxially sleeved on the outer side of the first rotating shaft, the first housing passes through the base plate, the bottom end of the first housing is fixedly supported on the first housing base, first bearing groups are respectively arranged at both ends of the inner wall of the first housing, the first rotating shaft rotatably passes through the first bearing group, and the first housing can be raised and lowered along with the first housing base and the first rotating shaft; A second housing is coaxially sleeved on the outer side of the second rotating shaft, the second housing passes through the base plate, the bottom end of the second housing is fixedly supported on the second housing base, second bearing groups are respectively arranged at both ends of the inner wall of the second housing, the second rotating shaft rotatably passes through the second bearing group, and the second housing can be raised and lowered along with the second housing base and the second rotating shaft.

4. The polishing head cleaning device according to claim 3, characterized in that: A substrate cover is arranged above the substrate, a first protective tube with an opening at the top is sleeved radially and spaced on the outer side of the first housing, and the bottom of the first protective tube is fixedly connected to the substrate cover via a first fixing seat; a second protective tube is sleeved on the outer side of the first protective tube, and the bottom of the second protective tube is open, and the top of the second protective tube is fixedly connected to the top of the first rotating shaft, and the second protective tube can be lifted and rotated along with the first rotating shaft; A third protective tube with an opening at the top is radially spaced apart on the outer side of the second housing, and the bottom of the third protective tube is fixedly connected to the substrate cover via a second fixing seat; a fourth protective tube is sleeved on the outer side of the third protective tube, and the bottom of the fourth protective tube is open. The top of the fourth protective tube is fixedly connected to the top of the second rotating shaft, and the fourth protective tube can be raised, lowered and rotated along with the second rotating shaft.

5. The polishing head cleaning device according to claim 1, characterized in that: The second brush portion comprises a second brush plate detachably connected to the top end of the second rotating shaft, and the top surface of the second brush plate is surrounded by bristles arranged in a vertical direction.

6. The polishing head cleaning device according to claim 5, characterized in that: The first brush disc is connected to the top end of the first rotating shaft via a connecting screw; the second brush disc is connected to the top end of the second rotating shaft via a connecting screw.

Citation Information

Patent Citations

  • Polishing head cleaning device

    CN211867496U

  • Cleaning brush, cleaning method and cleaning apparatus for work chuck

    JP2006120757A