Ultrasonic mainframe box and ultrasonic equipment

Abstract

18. The heat dissipation controller of claim 17, wherein the bridge has a first end configured to dissipate heat from a first portion of the top wall and a second portion of the bottom wall, the bridge having a first end configured to dissipate heat from a first portion of the top wall and a second portion of the bottom wall.

Description

Technical Field

[0001] The present application relates to an ultrasonic device, and in particular to a heat dissipation structure within a main chassis of the ultrasonic device. Background Art

[0002] Ultrasound equipment typically consists of a main unit, control panel, and display. The main unit contains numerous high-powered circuit boards, generating significant heat during use. The compact design of the main unit, designed for ease of transportation, makes it difficult to dissipate this heat. Consequently, this heat accumulates inside the main unit, causing the temperature to rise rapidly, often leading to high-temperature alarms and equipment freezes. Therefore, dissipating this accumulated heat in a timely manner has become an urgent issue. Summary of the Invention

[0003] In one embodiment, an ultrasound mainframe box is provided, comprising:

[0004] 14. The cabinet of claim 13, wherein the first and second side walls are connected to each other, and the second and third side walls are connected to each other, wherein the first and second side walls are connected to each other, and the cabinet is connected to the first and second side walls respectively.

[0005] a board assembly, the board assembly being accommodated in the accommodation cavity, being located below the wedge-shaped heat dissipation cavity, and being located on the heat dissipation path;

[0006] A fan is arranged in the box and located on the heat dissipation path.

[0007] In one embodiment, the fan includes a first fan connected to the box body and disposed between the air inlet and the board assembly.

[0008] In one embodiment, the fan includes a second fan connected to the box and disposed between the board assembly and the wedge-shaped heat dissipation cavity.

[0009] In one embodiment, the fan includes a third fan, and the third fan is arranged at the air inlet.

[0010] In one embodiment, the box body further includes a bottom wall, and the air inlet includes a first air inlet, and the first air inlet is arranged on the bottom wall.

[0011] In one embodiment, the air inlet includes a second air inlet, which is arranged on the first side wall and / or the second side wall and / or the third side wall and / or the fourth side wall, and the height of the second air inlet is lower than the height of the air outlet.

[0012] In one embodiment, an ultrasound mainframe box is provided, comprising:

[0013] A box body, the box body at least comprising a top wall, a first side wall, and a second side wall, the top wall comprising a first end and a second end, the first end of the top wall being connected to the first side wall, the second end of the top wall being connected to the second side wall, and the connection position of the first end of the top wall to the first side wall is lower than the connection position of the second end of the top wall to the second side wall, the top wall and at least the second side wall and the first side wall forming a receiving cavity including a wedge-shaped heat dissipation cavity, and the wedge-shaped heat dissipation cavity is located at the upper part of the receiving cavity, an air outlet is provided at the upper part of the second side wall, the air outlet is communicated with the wedge-shaped heat dissipation cavity, an air inlet is provided at the lower part of the box body, and the air inlet, the wedge-shaped heat dissipation cavity and the air outlet form a heat dissipation passage;

[0014] A board assembly is accommodated in the accommodating cavity, located below the wedge-shaped heat dissipation cavity, and on the heat dissipation passage.

[0015] In one embodiment, the box body further includes a bottom wall, and the air inlet is arranged on the bottom wall.

[0016] In one embodiment, the air inlet is provided on the second side wall and / or the first side wall.

[0017] In one embodiment, a fan is further included, and the fan is arranged in the box and located on the heat dissipation path.

[0018] In one embodiment, the fan includes a first fan connected to the box body and disposed between the air inlet and the board assembly.

[0019] In one embodiment, the fan includes a second fan connected to the box and disposed between the board assembly and the wedge-shaped heat dissipation cavity.

[0020] In one embodiment, the fan includes a third fan, and the third fan is arranged at the air inlet.

[0021] In one embodiment, an ultrasound mainframe box is provided, characterized in that it includes:

[0022] A box body, the box body comprising a top wall, a first side wall, and a second side wall, the top wall connecting the first side wall and the second side wall, the top wall comprising an inclined portion, the inclined portion comprising a first end adjacent to or connected to the first side wall and a second end adjacent to or connected to the second side wall, and the height of the first end of the inclined portion is lower than the height of the second end of the inclined portion, the inclined portion, the first side wall, and the second side wall forming a wedge-shaped heat dissipation cavity, an air outlet being provided on the top wall, the air outlet being located on a side of the inclined portion adjacent to the second side wall and communicating with the wedge-shaped heat dissipation cavity, an air inlet being provided at the lower portion of the box body, the air inlet, the wedge-shaped heat dissipation cavity, and the air outlet forming a heat dissipation passage;

[0023] A board assembly, the board assembly being located below the wedge-shaped heat dissipation cavity and on the heat dissipation path;

[0024] A fan is arranged in the box and located on the heat dissipation path.

[0025] In one embodiment, the height of the inclined portion gradually increases from the first end of the inclined portion to the second end of the inclined portion.

[0026] According to the ultrasound main case of the above embodiment, the connection position of the first end of the top wall of the box body and the first side wall is lower than the connection position of the second end of the top wall and the second side wall, the third side wall and the fourth side wall are connected to the top wall, the first side wall and the second side wall, and the top wall, the first side wall, the second side wall, the third side wall and the fourth side wall form a receiving cavity including a wedge-shaped heat dissipation cavity, and the wedge-shaped heat dissipation cavity is located at the upper part of the receiving cavity, an air outlet is provided at the upper part of the second side wall of the box body, and the air outlet is communicated with the wedge-shaped heat dissipation cavity, and an air inlet is provided at the lower part of the box body, and the air inlet, the wedge-shaped heat dissipation cavity and the air outlet form a heat dissipation passage, the wedge-shaped heat dissipation cavity can reduce the energy loss of the hot air flow during the collision process, so that the speed of the hot air flow is reduced less, thereby improving the heat dissipation effect, and at the same time, the wedge-shaped heat dissipation cavity can increase the volume of the heat dissipation channel, so that the hot air flow away from the air outlet flows out more quickly, thereby making the heat dissipation in the box body more uniform, and further improving the heat dissipation effect.

[0027] In one embodiment, an ultrasound device is provided, comprising the ultrasound main case described in the above embodiment, and also comprising a display device, a control panel, and a support arm for supporting the control panel, wherein the support arm is arranged on the main case, and the support arm comprises a first end of the support arm and a second end of the support arm, the first end of the support arm is rotatably connected to the main case, and the second end of the support arm is rotatably connected to the control panel, the support arm can be rotated so that the ultrasound device enters a storage state, and in the storage state, the height of the first end of the support arm is greater than the height of the second end of the support arm.

[0028] According to the ultrasonic equipment of the above embodiment, the main unit is provided with a wedge-shaped heat dissipation cavity, which is beneficial to improving the heat dissipation effect. At the same time, the height of the first end of the support arm is greater than the height of the second end of the support arm. The connection position between the first end of the top wall of the main unit case and the first side wall is lower than the connection position between the second end of the top wall and the second side wall. The lower end of the main unit case top wall can accommodate the lower end of the support arm, which is beneficial to reducing the height of the control panel, reducing the height of the ultrasonic equipment, and facilitating storage and transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a structural diagram of an ultrasound mainframe box in one embodiment of the present application;

[0030] Figure 2 This is a structural diagram of an ultrasound mainframe box in one embodiment of the present application;

[0031] Figure 3 This is a schematic diagram of an ultrasonic device in a stored state in one embodiment of the present application. DETAILED DESCRIPTION

[0032] The present invention will be further described in detail below by means of specific embodiments in conjunction with the accompanying drawings. Similar elements in different embodiments are numbered with associated similar elements. In the following embodiments, many detailed descriptions are provided to enable the present application to be better understood. However, those skilled in the art will readily appreciate that some of the features may be omitted in different circumstances, or may be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification. This is to avoid the core portion of the present application being overwhelmed by excessive descriptions, and for those skilled in the art, it is not necessary to describe these related operations in detail. They will fully understand the related operations based on the description in the specification and the general technical knowledge in the art.

[0033] In addition, the features, operations, or characteristics described in the specification may be combined in any appropriate manner to form various embodiments. Furthermore, the steps or actions in the method description may be reordered or adjusted in a manner readily apparent to those skilled in the art. Therefore, the various sequences in the specification and drawings are provided solely for the purpose of clearly describing a particular embodiment and are not intended to be mandatory, unless otherwise specified.

[0034] Component numbers used herein, such as "first" and "second," are used solely to distinguish the components being described and do not convey any sequential or technical meaning. References to "connection" and "coupling" herein, unless otherwise specified, include both direct and indirect connections (couplings).

[0035] In one embodiment, an ultrasound mainframe is provided, referring to Figure 1 , comprising a box body 1, the box body comprising a top wall 2, a second side wall 4, a first side wall 5, a third side wall and a fourth side wall (the third side wall and the fourth side wall are not marked in the figure), wherein the box body top wall 2 is the upper surface of the box body 1, the box body bottom wall is the lower surface of the box body 1, and the third side wall is Figure 1 The front surface of the fourth side wall is the rear surface opposite to the third side wall. The wall surface refers to a surface with a certain thickness. The top wall 2 of the box body includes a first end 8 and a second end 9. The first end 8 of the top wall is connected to the first side wall 5, and the second end 9 of the top wall is connected to the second side wall 4. The connection position of the first end 8 of the top wall and the first side wall 5 is lower than the connection position of the second end 9 of the top wall and the second side wall 4. The top wall 2 of the box body can be a plane or a non-plane. The third side wall and the fourth side wall are connected to the top wall 2, the first side wall 5 and the second side wall. 4, the top wall 2, the first side wall 5, the second side wall 4, the third side wall and the fourth side wall form a receiving cavity including a wedge-shaped heat dissipation cavity 10, and the wedge-shaped heat dissipation cavity 10 is located at the upper part of the receiving cavity, the upper part of the second side wall 4 of the box body is provided with an air outlet 11, the air outlet 11 is communicated with the wedge-shaped heat dissipation cavity 10, and the lower part of the box body is provided with an air inlet, for example, the air inlet can be provided on the bottom wall, and can also be provided on the side wall, the air inlet, the wedge-shaped heat dissipation cavity 10 and the air outlet 11 form a heat dissipation passage;

[0036] The main chassis also includes a board assembly 13, which is accommodated in the accommodating cavity, located below the wedge-shaped heat dissipation cavity 10, and located on the heat dissipation path. The board assembly 13 is fixedly connected to the box body 1. The fixed connection can be a direct connection or an indirect connection. The fixed connection is not limited to any form of fixed connection, such as a screw connection. The board assembly is located on the heat dissipation path.

[0037] The main chassis also includes a fan, which is arranged in the chassis. The fan can be directly fixedly connected to the chassis 1, or indirectly fixedly connected to the chassis 1. The fixed connection is not limited to any form of fixed connection, such as a screw connection. The fan is arranged on the heat dissipation path. The fan can be arranged below the wedge-shaped heat dissipation cavity 10, or near the bottom wall 3 of the chassis, or between the board assembly 13 and the wedge-shaped heat dissipation cavity 10, or other positions below the wedge-shaped heat dissipation cavity 10.

[0038] A heat dissipation passage is formed by the air inlet, the wedge-shaped heat dissipation cavity 10 and the air outlet 11. The wedge-shaped heat dissipation cavity 10 can reduce the energy loss of the hot air flow during the collision process, so that the speed of the hot air flow is reduced less, more hot air flow can flow out per unit time, and the heat dissipation effect is better. At the same time, the wedge-shaped heat dissipation cavity 10 can increase the volume of the heat dissipation channel. The hot air flow away from the air outlet is blocked by the hot air flow close to the air outlet and cannot flow out quickly. The wedge-shaped heat dissipation cavity 10 is used to increase the volume of the heat dissipation channel, so that the hot air flow away from the air outlet can flow out quickly, which not only increases the heat dissipation per unit time, but also makes the heat dissipation in the box more uniform, further improving the heat dissipation effect.

[0039] In one embodiment, based on the above embodiment, reference is made to Figure 1 The fan includes a first fan 14, which is arranged in the box body 1. The first fan 14 is fixedly connected to the box body 1. The fixed connection can be a direct connection or an indirect connection. The fixed connection is not limited to any form of fixed connection, such as a screw connection. The first fan 14 is arranged between the air inlet and the board assembly 13. A heat dissipation path is formed by the air inlet, the first fan 14, the wedge-shaped heat dissipation cavity 10 and the air outlet 11. The first fan 14 can accelerate the flow rate of the airflow from the air inlet to the board assembly, increase the airflow speed of the heat dissipation path, and further improve the heat dissipation effect.

[0040] In one embodiment, based on the above embodiment, reference is made to Figure 1 The fan includes a second fan 15, which is arranged in the box body 1. The second fan 15 is fixedly connected to the box body 1. The fixed connection can be a direct connection or an indirect connection. The fixed connection is not limited to any form of fixed connection, such as a screw connection. The second fan 15 is arranged between the board assembly 13 and the wedge-shaped heat dissipation cavity 10. A heat dissipation path is formed by the air inlet, the second fan 15 wedge-shaped heat dissipation cavity 10 and the air outlet 11. The second fan 15 can accelerate the flow rate of the airflow from the board assembly to the wedge-shaped heat dissipation cavity 10, increase the airflow speed of the heat dissipation path, and further improve the heat dissipation effect.

[0041] In one embodiment, based on the above embodiment, reference is made to Figure 1The fan includes a first fan 14 and a second fan 15. The first fan 14 and the second fan 15 are arranged in the box body 1. The first fan 14 and the second fan 15 are fixedly connected to the box body 1. The fixed connection can be a direct connection or an indirect connection. The fixed connection is not limited to any form of fixed connection, such as a screw connection. The first fan 14 is arranged between the first air inlet 12 and the board assembly 13, and the second fan 15 is arranged between the board assembly 13 and the wedge-shaped heat dissipation cavity 10. A heat dissipation path is formed by the air inlet, the first fan 14, the second fan 15, the wedge-shaped heat dissipation cavity 10 and the air outlet 11. The first fan 14 can accelerate the flow rate of the airflow from the air inlet to the board assembly, and the second fan 15 can accelerate the flow rate of the airflow from the board assembly to the wedge-shaped heat dissipation cavity 10, thereby increasing the airflow speed of the heat dissipation path and further improving the heat dissipation effect.

[0042] In one embodiment, based on the above embodiment, the fan includes a third fan 17, and the third fan 17 is arranged at the air inlet. The third fan 17 is fixedly connected to the wall where the air inlet is located. The fixed connection can be a direct connection or an indirect connection. The fixed connection is not limited to any form of fixed connection, such as a screw connection. The third fan 17 can at least partially accelerate the air intake speed of the airflow in the air inlet, increase the air flow speed of the heat dissipation path, and further improve the heat dissipation effect.

[0043] In one embodiment, based on the above embodiment, reference is made to Figure 2 The box body 1 also includes a bottom wall 3, and the air inlet includes a first air inlet 12. The first air inlet 12 is arranged on the bottom wall 3. A heat dissipation path is formed by the first air inlet 12, the fan, the wedge-shaped heat dissipation cavity 10 and the air outlet 11, and the heat dissipation path is a vertical heat dissipation path from bottom to top, which further improves the heat dissipation effect.

[0044] In one embodiment, based on the above embodiment, reference is made to Figure 2 The box body 1 also includes a second air inlet 16, which is arranged on the first side wall 5 and / or the second side wall 4 and / or the third side wall and / or the fourth side wall of the box body. The height of the second air inlet 16 is lower than the height of the air outlet 11. The second air inlet 16 increases the amount of cold air intake per unit time, further providing a heat dissipation effect.

[0045] In one embodiment, based on the above embodiment, the box body 1 includes a first air inlet 12, a first fan 14, a second fan 15 and a second air inlet 16. The first fan 14 and the second fan 15 are arranged in the box body 1. The first fan 14 and the second fan 15 are fixedly connected to the box body 1. The fixed connection can be a direct connection or an indirect connection. The fixed connection is not limited to any form of fixed connection, such as a screw connection. The first fan 14 is arranged between the first air inlet 12 and the board assembly 13. The second fan 15 is arranged between the board assembly 13 and the wedge-shaped heat dissipation cavity 10, and a heat dissipation path is formed by the first air inlet 12, the first fan 14, the second fan 15 wedge-shaped heat dissipation cavity 10 and the air outlet 11. The second air inlet 16 is arranged on the second side wall 4 and / or the first side wall 5 and / or the third side wall and / or the fourth side wall of the box body. The second air inlet 16 is located below the air outlet 11. Another heat dissipation path is formed by the second air inlet 16, the second fan 15, the wedge-shaped heat dissipation cavity 10 and the air outlet 11, which will further improve the heat dissipation effect.

[0046] In one embodiment, based on the above embodiment, reference is made to Figure 2 The fan includes a first air inlet 12, a first fan 14, a second fan 15, a third fan 17 and a second air inlet 16. The first fan 14 and the second fan 15 are arranged in the box body 1. The first fan 14 and the second fan 15 are fixedly connected to the box body 1. The first fan 14 is arranged between the first air inlet 12 and the board assembly 13. The second fan 15 is arranged between the board assembly 13 and the wedge-shaped heat dissipation cavity 10. The second air inlet 16 is arranged on the second side wall 4 and / or the first side wall 5 and / or the third side wall and / or the fourth side wall of the box body. The second air inlet 16 is located on the Below the air outlet 11, the third fan 17 is fixedly connected to at least a portion of the wall where the first air inlet 12 and the second air inlet 16 are located. The above-mentioned fixed connections can be direct connections or indirect connections. The fixed connection is not limited to any form of fixed connection, such as screw connection. A heat dissipation path is formed by the first air inlet 12, the third fan 17, the first fan 14, the second fan 15 wedge-shaped heat dissipation cavity 10 and the air outlet 11, and another heat dissipation path is formed by the second air inlet 16, the third fan 17, the second fan 15, the wedge-shaped heat dissipation cavity 10 and the air outlet 11, which will further improve the heat dissipation effect.

[0047] In one embodiment, based on the above embodiment, the box body at least includes a top wall, a first side wall and a second side wall. For example, the box body can be a rectangular box body or a cylindrical box body or other cylindrical box body. The box body can have a bottom wall or not. The box body can also have only the first side wall and the second side wall or the box body has other side walls in addition to the first side wall and the second side wall. This embodiment is described by taking the box body as a cylindrical box body as an example. The top wall of the box body includes a first end and a second end. The connection position of the first end of the top wall and the first side wall is lower than the top wall. The connection position of the second end of the wall and the second side wall, the first side wall and the second side wall form the side surface of the entire cylinder, the top wall, the second side wall and the first side wall form a receiving cavity including a wedge-shaped heat dissipation cavity, and the wedge-shaped heat dissipation cavity is located at the upper part of the receiving cavity, the upper part of the second side wall is provided with an air outlet, the air outlet is connected to the wedge-shaped heat dissipation cavity, and the lower part of the box body is provided with an air inlet, for example, the air inlet can be provided on the bottom wall, and can also be provided on the side wall, and the air inlet, the wedge-shaped heat dissipation cavity and the air outlet form a heat dissipation passage;

[0048] The host chassis also includes a board assembly, which is accommodated in the accommodating cavity, located below the wedge-shaped heat dissipation cavity, and located on the heat dissipation path. The board assembly is fixedly connected to the chassis. The fixed connection can be a direct connection or an indirect connection. The fixed connection is not limited to any form of fixed connection, such as a screw connection. The board assembly is located on the heat dissipation path.

[0049] A heat dissipation passage is formed by the air inlet, the wedge-shaped heat dissipation cavity and the air outlet 11. The wedge-shaped heat dissipation cavity can reduce the energy loss of the hot air flow during the collision process, so that the speed of the hot air flow is reduced less, more hot air flow can flow out per unit time, and the heat dissipation effect is better. At the same time, the wedge-shaped heat dissipation cavity can increase the volume of the heat dissipation channel. The hot air flow away from the air outlet is blocked by the hot air flow close to the air outlet and cannot flow out quickly. The wedge-shaped heat dissipation cavity is used to increase the volume of the heat dissipation channel, so that the hot air flow away from the air outlet can flow out quickly, which not only increases the heat dissipation per unit time, but also makes the heat dissipation in the box more uniform, further improving the heat dissipation effect.

[0050] In one embodiment, based on the above embodiment, the box body also includes a bottom wall, the air inlet is arranged on the bottom wall, and a heat dissipation path is formed by the air inlet, the wedge-shaped heat dissipation cavity and the air outlet, and the heat dissipation path is a vertical heat dissipation path from bottom to top, which further improves the heat dissipation effect.

[0051] In one embodiment, based on the above embodiment, the air inlet is arranged on the second side wall and / or the first side wall, and the air inlet increases the amount of cold air intake per unit time, further providing a heat dissipation effect.

[0052] In one embodiment, based on the above embodiment, the main chassis also includes a fan, which is arranged in the chassis and located on the heat dissipation path. The fan can be directly fixedly connected to the chassis, or indirectly fixedly connected to the chassis. The fixed connection is not limited to any form of fixed connection, such as a screw connection. The fan is arranged on the heat dissipation path. The fan can be arranged below the wedge-shaped heat dissipation cavity, or near the bottom wall of the chassis, or between the board assembly and the wedge-shaped heat dissipation cavity, or other positions below the wedge-shaped heat dissipation cavity. The fan will increase the flow rate of the airflow in the heat dissipation channel and further improve the heat dissipation effect.

[0053] In one embodiment, based on the above embodiment, the fan includes a first fan, which is connected to the box and is arranged between the air inlet and the board assembly. The first fan is fixedly connected to the box. The fixed connection can be a direct connection or an indirect connection. The fixed connection is not limited to any form of fixed connection, such as a screw connection. The first fan is arranged between the air inlet and the board assembly. A heat dissipation path is formed by the air inlet, the first fan, the wedge-shaped heat dissipation cavity and the air outlet. The first fan can accelerate the flow rate of the airflow from the air inlet to the board assembly, increase the airflow speed of the heat dissipation path, and further improve the heat dissipation effect.

[0054] In one embodiment, based on the above embodiment, the fan includes a second fan, the second fan is arranged in the box body, the second fan is fixedly connected to the box body, the fixed connection can be a direct connection or an indirect connection, and the fixed connection is not limited to any form of fixed connection, such as a screw connection, the second fan is arranged between the board assembly and the wedge-shaped heat dissipation cavity, and a heat dissipation path is formed by the air inlet, the second fan wedge-shaped heat dissipation cavity and the air outlet, the second fan can accelerate the flow rate of the airflow from the board assembly to the wedge-shaped heat dissipation cavity, increase the airflow speed of the heat dissipation path, and further improve the heat dissipation effect.

[0055] In one embodiment, based on the above embodiment, the fan includes a third fan, and the third fan is arranged at the air inlet. The third fan is fixedly connected to the wall where the air inlet is located. The fixed connection can be a direct connection or an indirect connection. The fixed connection is not limited to any form of fixed connection, such as a screw connection. The third fan can at least partially accelerate the air intake speed of the air flow in the air inlet, increase the air flow speed of the heat dissipation path, and further improve the heat dissipation effect.

[0056] In one embodiment, an ultrasound mainframe case is provided, comprising a case body, wherein the case body comprises a top wall, a first side wall, and a second side wall, the top wall connecting the first side wall and the second side wall, the top wall comprising an inclined portion, the inclined portion comprising a first end adjacent to or connected to the first side wall and a second end adjacent to the second side wall, and the height of the first end of the inclined portion is lower than the height of the second end of the inclined portion, the inclined portion may be approximately in the same plane as other parts of the top wall, or the inclined portion may be not in the same plane as other parts of the top wall, for example, the inclined portion may protrude from other parts of the top wall, or the inclined portion may be arranged below other parts of the top wall, the inclined portion, the first side wall, and the second side wall form a wedge-shaped heat dissipation cavity, an air outlet is provided on the top wall, the air outlet is located on a side of the inclined portion adjacent to the second side wall and communicates with the wedge-shaped heat dissipation cavity, an air inlet is provided at the lower portion of the case body, and the air inlet, the wedge-shaped heat dissipation cavity, and the air outlet form a heat dissipation passage;

[0057] The host chassis also includes a board assembly, which is located below the wedge-shaped heat dissipation cavity and on the heat dissipation path. The board assembly is fixedly connected to the chassis. The fixed connection can be a direct connection or an indirect connection. The fixed connection is not limited to any form of fixed connection, such as a screw connection. The board assembly is located on the heat dissipation path.

[0058] The main chassis also includes a fan, which is arranged in the chassis. The fan can be directly fixedly connected to the chassis, or indirectly fixedly connected to the chassis. The fixed connection is not limited to any form of fixed connection, such as a screw connection. The fan is arranged on the heat dissipation path. The fan can be arranged below the wedge-shaped heat dissipation cavity, or near the bottom wall of the chassis, or between the board assembly and the wedge-shaped heat dissipation cavity, or other positions below the wedge-shaped heat dissipation cavity.

[0059] A heat dissipation passage is formed by the air inlet, the wedge-shaped heat dissipation cavity and the air outlet. The wedge-shaped heat dissipation cavity can reduce the energy loss of the hot air flow during the collision process, so that the speed of the hot air flow is reduced less, more hot air flow can flow out per unit time, and the heat dissipation effect is better. At the same time, the wedge-shaped heat dissipation cavity can increase the volume of the heat dissipation channel. The hot air flow away from the air outlet is blocked by the hot air flow close to the air outlet and cannot flow out quickly. The wedge-shaped heat dissipation cavity is used to increase the volume of the heat dissipation channel, so that the hot air flow away from the air outlet can flow out quickly, which not only increases the heat dissipation per unit time, but also makes the heat dissipation in the box more uniform, further improving the heat dissipation effect.

[0060] In one embodiment, based on the above embodiment, the height of the inclined portion gradually increases from the first end of the inclined portion to the second end of the inclined portion. The gradual increase of the inclined portion is beneficial to reducing the energy loss of the hot air flow during the collision process, so that the speed of the hot air flow decreases less, and more hot air flow can flow out per unit time, further improving the heat dissipation effect.

[0061] According to the ultrasound main case of the above embodiment, the connection position of the first end 8 of the top wall of the box body and the first side wall 5 is lower than the connection position of the second end 9 of the top wall and the second side wall 4, the third side wall and the fourth side wall are connected to the top wall, the first side wall 5 and the second side wall 4, the top wall 2, the first side wall 5, the second side wall 4, the third side wall and the fourth side wall form a receiving cavity including a wedge-shaped heat dissipation cavity 10, and the wedge-shaped heat dissipation cavity 10 is located at the upper part of the receiving cavity, the upper part of the second side wall 4 is provided with an air outlet 11, and the air outlet 11 is connected to the wedge-shaped heat dissipation cavity 10, and the lower part of the box body 1 is provided with an air inlet, the air inlet, the wedge-shaped heat dissipation cavity 10 and the air outlet 11 form a heat dissipation passage, the wedge-shaped heat dissipation cavity 10 can reduce the energy loss of the hot air flow during the collision process, so that the speed of the hot air flow is reduced less, so that the heat dissipation effect is better, and at the same time, the wedge-shaped heat dissipation cavity can increase the volume of the heat dissipation channel, so that the hot air flow away from the air outlet flows out more quickly, thereby making the heat dissipation in the box body more uniform, further improving the heat dissipation effect.

[0062] In one embodiment, reference Figure 3 , provides an ultrasound device, including the ultrasound box 1 described in the above embodiment, and also including a display device 18, a control panel 19 and a support arm 20 for supporting the control panel. The box 1 can be provided with casters 21 to facilitate the movement of the ultrasound device. The display device 13 is used to display information about the processing process, the results of the processing or other information. The control panel 19 is generally provided with buttons, knobs, etc., and the user can operate the ultrasound diagnostic instrument through the control panel 19. The control panel 19 is mounted on the box 1 through the support arm 20. The ultrasound device can also be configured with components such as a handle, which will not be repeated here.

[0063] The support arm 20 includes a first end 23 and a second end 24. The first end 23 is rotatably connected to the housing 1, and the second end 24 is rotatably connected to the control panel 19. The rotatable connection between the first end 23 and the housing 1 and the rotatable connection between the second end 24 and the control panel 19 are not limited to any form of rotatable connection, such as an axial hole connection, a bearing connection, etc. The support arm 20 can be rotated to allow the ultrasonic device to enter a storage state, and in the storage state, the height of the first end 23 of the support arm is greater than the height of the second end 24 of the support arm. The storage state refers to the state when the support arm 20 and the control panel 19 are both lowered to their lowest height. The support arm is tilted, and the control panel connected to the second end of the support arm is further lowered, thereby further reducing the height of the ultrasonic device, making it easier to store and transport.

[0064] The box body 1 is provided with a wedge-shaped heat dissipation cavity 10, which is conducive to improving the heat dissipation effect. At the same time, the height of the first end 23 of the support arm is greater than the height of the second end 24 of the support arm. The connection position between the first end 8 of the top wall of the main box and the first side wall 5 is lower than the connection position between the second end 9 of the top wall and the second side wall 4. The lower end of the top wall of the main box can accommodate the lower end of the support arm, which is conducive to reducing the height of the control panel, reducing the height of the ultrasonic equipment, and facilitating storage and transportation.

[0065] The above specific examples are used to illustrate the present invention, which are only used to help understand the present invention and are not intended to limit the present invention. For those skilled in the art, according to the concept of the present invention, the above specific embodiments can be modified.

Claims

1. An ultrasound main box, characterized in that: include:

14. The cabinet of claim 13, wherein the cooling fan is configured to connect the cooling fan to the cooling fan, and the cooling fan is connected to the cooling fan at the top end. The cooling fan is configured to connect the cooling fan to the cooling fan, and the cooling fan is connected to the cooling fan at the top end. The wedge-shaped heat dissipation cavity can reduce the energy loss of the hot air flow during the collision process, so that the speed of the hot air flow decreases less. At the same time, the wedge-shaped heat dissipation cavity can increase the volume of the heat dissipation channel, so that the hot air flow away from the air outlet flows out more quickly; a board assembly, the board assembly being accommodated in the accommodation cavity, being located below the wedge-shaped heat dissipation cavity, and being located on the heat dissipation path; A fan is arranged in the box and located on the heat dissipation path.

2. The ultrasound main box according to claim 1, wherein: The fan includes a first fan connected to the box body and arranged between the air inlet and the board assembly.

3. The ultrasound mainframe box according to claim 1, wherein: The fan includes a second fan connected to the box body and arranged between the board assembly and the wedge-shaped heat dissipation cavity.

4. The ultrasound mainframe box according to any one of claims 1 to 3, wherein: The fan includes a third fan, and the third fan is arranged at the air inlet.

5. The ultrasound mainframe box according to any one of claims 1 to 3, characterized in that: The box body further includes a bottom wall, and the air inlet includes a first air inlet, which is arranged on the bottom wall.

6. The ultrasound mainframe box according to any one of claims 1 to 3, characterized in that: The air inlet includes a second air inlet, which is arranged on the first side wall and / or the second side wall and / or the third side wall and / or the fourth side wall, and the height of the second air inlet is lower than the height of the air outlet.

7. An ultrasound main box, characterized in that: include:

18. The heat dissipation device of claim 17, wherein the cover has a first end and a second end, the cover having a first end and a second end, the cover having a first end and a second end, and the cover having a first end and a second end. The wedge-shaped heat dissipation cavity can reduce the energy loss of the hot air flow during the collision process, so that the speed of the hot air flow decreases less. At the same time, the wedge-shaped heat dissipation cavity can increase the volume of the heat dissipation channel, so that the hot air flow away from the air outlet flows out more quickly; A board assembly is accommodated in the accommodating cavity, located below the wedge-shaped heat dissipation cavity, and on the heat dissipation passage.

8. The ultrasound mainframe box according to claim 7, wherein: The box body further includes a bottom wall, and the air inlet is arranged on the bottom wall.

9. The ultrasound mainframe box according to claim 7, wherein: The air inlet is arranged on the second side wall and / or the first side wall.

10. The ultrasound mainframe box according to any one of claims 7 to 9, characterized in that: A fan is also included, and the fan is arranged in the box body and located on the heat dissipation path.

11. The ultrasound mainframe box according to claim 10, wherein: The fan includes a first fan connected to the box body and arranged between the air inlet and the board assembly.

12. The ultrasound mainframe box according to claim 10, wherein: The fan includes a second fan connected to the box body and arranged between the board assembly and the wedge-shaped heat dissipation cavity.

13. The ultrasound mainframe box according to claim 10, wherein: The fan includes a third fan, and the third fan is arranged at the air inlet.

14. An ultrasound main box, characterized in that: include:

14. The cabinet of claim 13, wherein the at least one first side wall and the at least one second side wall are connected to each other via a channel configured to extend from one end of the cabinet to the other end of the at least one second side wall. The at least one second side wall comprises a channel configured to extend from one end of the cabinet to the other end of the at least one second side wall. The wedge-shaped heat dissipation cavity can reduce the energy loss of the hot air flow during the collision process, so that the speed of the hot air flow decreases less. At the same time, the wedge-shaped heat dissipation cavity can increase the volume of the heat dissipation channel, so that the hot air flow away from the air outlet flows out more quickly; A board assembly, the board assembly being located below the wedge-shaped heat dissipation cavity and on the heat dissipation path; A fan is arranged in the box and located on the heat dissipation path.

15. The ultrasound mainframe box according to claim 14, wherein: The height of the inclined portion gradually increases from a first end of the inclined portion to a second end of the inclined portion.

16. An ultrasonic device, characterized in that It includes the ultrasound main case according to any one of claims 1 to 15, and also includes a display device, a control panel and a support arm for supporting the control panel, the support arm is arranged on the main case, the support arm includes a first support arm end and a second support arm end, the first support arm end is rotatably connected to the main case, the second support arm end is rotatably connected to the control panel, the support arm can be rotated so that the ultrasound device enters a storage state, and in the storage state, the height of the first support arm end is greater than the height of the second support arm end.

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