Chip packaging structure

Abstract

The present invention discloses a chip packaging structure, the packaging structure comprising: an antenna, a first adapter plate and a second adapter plate, the antenna being arranged on the upper surface of the first adapter plate; the second adapter plate being arranged below the first adapter plate, a chip being arranged between the first adapter plate and the second adapter plate; the shielding structure comprising a first shielding panel arranged between the chip and the antenna. The technical solution of the present invention can reduce the mutual influence and interference between the antenna and the chip, and ensure the normal operation of the chip and the antenna.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a chip packaging structure. Background Art

[0002] With the multifunctionalization and miniaturization of electronic products, microelectronics assembly technology has become the mainstream in the new generation of electronic products. In order to cooperate with the development of the new generation of electronic products, the technology of packaged antenna has gradually emerged. However, in the packaged antenna technology, the antenna is close to the chip, so it is easy for the antenna and chip to interfere with each other, resulting in the inability of both the chip and the antenna to work.

[0003] The above contents are only used to assist in understanding the technical solution of the present application and do not constitute an admission that the above contents are prior art. Summary of the invention

[0004] Based on this, in view of the problem that in existing packaged antennas, the antenna is close to the chip, and the antenna and the chip are prone to mutual interference, resulting in both the chip and the antenna failing to work, it is necessary to provide a chip packaging structure that can effectively reduce the mutual interference between the antenna and the chip.

[0005] To achieve the above object, the present invention provides a chip packaging structure, the packaging structure comprising:

[0006] antenna;

[0007] A first adapter plate, the antenna being arranged on a surface of the first adapter plate;

[0008] a second adapter board, the second adapter board being disposed below the first adapter board, a chip being disposed between the first adapter board and the second adapter board; and

[0009] A shielding structure includes a first shielding panel disposed between the chip and the antenna.

[0010] Optionally, the first shielding panel is arranged on the lower surface of the first adapter plate, and the shielding structure also includes a first key component arranged on the lower surface of the first shielding panel, and the shielding structure also includes a second shielding panel arranged on the upper surface of the second adapter plate, and a second key component arranged on the upper surface of the second shielding panel, and the lower surface of the first key component and the upper surface of the second key component are abutted.

[0011] Optionally, the second shielding panel is provided with a communication groove corresponding to the chip.

[0012] Optionally, the second bonding component includes a first surrounding portion provided on one side of the chip, and a second surrounding portion provided on the other side of the chip, the second shielding panel includes a first shielding portion and a second shielding portion, the first surrounding portion is provided on an upper surface of the first shielding portion, and the second surrounding portion is provided on an upper surface of the second shielding portion;

[0013] The communication groove includes a first groove and a second groove, and the second shielding panel also includes a signal connecting part arranged between the first shielding part and the second shielding part, the first shielding part and the signal connecting part are arranged at intervals to form the first groove, and the second shielding part and the signal connecting part are arranged at intervals to form the second groove.

[0014] Optionally, a first connection layer is provided on the lower surface of the first adapter board facing away from the antenna, a first connection hole is opened in the first adapter board between the antenna and the first connection layer, a first conductive member is provided in the first connection hole, and the first conductive member connects the antenna and the first connection layer.

[0015] Optionally, the first connection hole is vertically penetrated in the up-down direction, and the first conductive member is vertically connected to the antenna and the first connection layer.

[0016] Optionally, a second connection layer is provided on one side of the upper surface of the second adapter board, the first connection layer and the second connection layer are bonded to each other, the shielding structure includes an extension portion, the extension portion extends on the upper surface of the second adapter board in a direction away from the second connection layer, and the extension portion and the first connection layer are bonded to each other.

[0017] Optionally, the lower surface of the second adapter board is provided with a first mounting layer, a second mounting layer and a third mounting layer in sequence corresponding to the extension part, the chip and the second connecting layer, and the second adapter board is provided with second connecting holes corresponding to the extension part, the chip and the second connecting layer, and a second conductive member is arranged in the second connecting hole, and the second conductive member respectively connects the extension part and the first mounting layer, the chip and the second mounting layer, and the second connecting layer and the third mounting layer.

[0018] Optionally, the chip is connected to the first shielding portion, the second shielding portion and the signal connecting portion by welding.

[0019] Optionally, second solder balls are provided on the lower surfaces of the first mounting layer, the second mounting layer and the third mounting layer, and the first mounting layer, the second mounting layer and the third mounting layer are soldered to external electronic components through the second solder balls.

[0020] In the technical solution proposed by the present invention, by setting a first shielding panel between the antenna and the chip, the first shielding panel can block the wireless signal transmitted between the antenna and the chip, thereby allowing the antenna and the chip to operate independently without being interfered by the mutually transmitted signals. The technical solution of the present invention can effectively reduce the mutual interference between the antenna and the chip and ensure the normal operation of the antenna and the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0022] Figure 1 It is a schematic structural diagram of an embodiment of a chip packaging structure of the present invention;

[0023] Figure 2 for Figure 1 Schematic diagram of the exploded structure of the chip package structure;

[0024] Figure 3 for Figure 1 A schematic diagram of the structure of the second adapter board and the chip in the chip packaging structure;

[0025] Figure 4 for Figure 3 Schematic diagram of the structure of the second adapter board.

[0026] Description of Figure Numbers:

[0027]

[0028]

[0029] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings.

[0030] Specific implementation party

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0033] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0034] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0036] See also Figure 1 and Figure 2 As shown, the present invention provides a chip packaging structure, which includes: an antenna 10, a first adapter board 20, a second adapter board 30, a chip 40 and a shielding structure 50. The antenna 10 is arranged on the upper surface of the first adapter board 20, the second adapter board 30 is arranged below the first adapter board 20, the chip 40 is arranged between the first adapter board 20 and the second adapter board 30, and the shielding structure 50 is used to shield the mutual interference signals between the antenna 10 and the chip 40.

[0037] The upper surface of the first adapter board 20 is provided with an antenna 10; the antenna 10 is provided in the form of a packaged antenna, namely, an antenna-in-package (AIP antenna). The AIP antenna can reduce the installation space of the antenna 10 in the chip packaging structure. The first adapter board 20 is made of a silicon-based material. Packaging the antenna on the silicon-based first adapter board 20 can increase the wiring density of the antenna.

[0038] The second adapter plate 30 is arranged below the first adapter plate 20, and a chip 40 is arranged between the first adapter plate 20 and the second adapter plate 30; a certain installation space is arranged between the first adapter plate 20 and the second adapter plate 30, and the chip 30 is arranged in the installation space between the first adapter plate 20 and the second adapter plate 30. Similarly, the material of the second adapter plate 30 is silicon-based material, which is a semiconductor material developed based on silicon material. When the first adapter plate 20 and the second adapter plate 30 are both silicon-based materials, the thermal expansion coefficient of each component in the chip packaging structure can be effectively reduced. In other words, the thermal expansion matching degree is more suitable, so that the chip packaging structure obtains a better packaging effect.

[0039] The shielding structure 50 includes a first shielding panel 51 disposed between the chip 40 and the antenna 10. For example, the first shielding panel 51 is deposited on the lower surface of the first adapter plate 20. The shielding structure 50 is generally made of metal, and is disposed between the chip 40 and the antenna 10 through the first shielding panel 51, and the signal emitted by the antenna 10 is blocked by the first shielding panel 51.

[0040] In the technical solution proposed in this embodiment, by setting a first shielding panel 51 between the antenna 10 and the chip 40, the first shielding panel 51 can block the wireless signal transmitted between the antenna 10 and the chip 40, thereby allowing the antenna 10 and the chip 40 to operate independently without being interfered by the mutually transmitted signals. The technical solution of the present invention can effectively reduce the mutual interference between the antenna 10 and the chip 40, and ensure the normal operation of the antenna 10 and the chip 40.

[0041] See also Figure 3 As shown, the first shielding surface 51 is arranged on the lower surface of the first adapter plate 20, the shielding structure 50 also includes a first bonding component 52 arranged on the lower surface of the first shielding panel 51, the shielding structure 50 also includes a second shielding panel 53 arranged on the upper surface of the second adapter plate 30, and a second bonding component 54 arranged on the upper surface of the second shielding panel 53, and the lower surface of the first bonding component 52 and the upper surface of the second bonding component 54 are arranged in abutment. That is to say, the first shielding panel 51 is arranged above the chip 40, the second shielding panel 53 is arranged below the chip 40, and the first bonding component 52 and the second bonding component 54 are arranged on the side of the chip 40. It can be seen that the shielding structure 50 is arranged around the chip 40 to further prevent the chip 40 from being interfered by the signal transmitted by the antenna 10.

[0042] The connection between the first bonding component 52 and the second bonding component 54 is through bonding. For example, the first bonding component 52 and the second bonding component 54 are metals or alloys, and the first bonding component 52 and the second bonding component 54 are softened or even melted by heating, and then the first bonding component 52 and the second bonding component 54 are abutted against each other, so that the first bonding component 52 and the second bonding component 54 can be bonded together.

[0043] Furthermore, the second shielding panel 53 is provided with a communication groove 531 corresponding to the chip 40. When the chip 40 is in operation, the chip 40 is usually welded to the second shielding panel 53, and the second shielding panel 53 is also connected to the outside, and the chip 40 can transmit signals to the outside through the second shielding panel 53. In addition, a communication groove 531 is provided on the second shielding panel 53, and the communication groove 531 is not limited to one, and there can be several. In this way, two communication grooves 531 are provided on the second shielding panel 53. The chip 40 can also transmit radio frequency signals, and the radio frequency signals transmit signals to the outside through the communication grooves.

[0044] See also Figure 4 As shown, the second bonding component 54 includes a first surrounding portion 541 disposed on one side of the chip 40, and a second surrounding portion 542 disposed on the other side of the chip 40, and the second shielding panel 53 includes a first shielding portion 532 and a second shielding portion 533, the first surrounding portion 541 is disposed on the upper surface of the first shielding portion 532, and the second surrounding portion 542 is disposed on the upper surface of the second shielding portion 533. A certain distance is spaced between the first shielding portion 532 and the second shielding portion 533. The chip 40 is respectively connected to the first shielding portion 532 and the second shielding portion 533 by soldering.

[0045] The communication groove 531 includes a first groove 531a and a second groove 531b, and the second shielding panel 53 also includes a signal connection part 534 disposed between the first shielding part 532 and the second shielding part 533. The first shielding part 532 and the signal connection part 534 are arranged to form the first groove 531a, and the second shielding part 533 and the signal connection part 534 are arranged to form the second groove 531b. Similarly, the chip 40 is also connected to the signal connection part 534 by soldering, and the chip 40 can transmit signals to the outside through the signal connection part 534, the first shielding part 532 and the second shielding part 533, and can also transmit signals to the outside through the first groove 531a and the second groove 531b.

[0046] In one embodiment, a first connection layer 21 is provided on the lower surface of the first adapter plate 20 facing away from the antenna 10, and a first connection hole (not shown) is provided between the antenna 10 and the first connection layer 21 of the first adapter plate 20, and a first conductive member 22 is provided in the first connection hole, and the first conductive member 22 connects the antenna 10 and the first connection layer 21. The first conductive member 22 is made of metal or alloy, and the antenna 10 and the first connection layer 21 are connected by the first conductive member 22, so as to facilitate the mutual transmission of signals between the antenna 10 and the first connection layer 21. That is, when transmitting a signal, the first connection layer 21 transmits the transmission signal to the antenna 10 through the first conductive member 22. When receiving a signal, the antenna 10 receives an external signal and transmits it to the first connection layer 22 through the first conductive member 22.

[0047] In one of the embodiments, the first connecting hole is vertically penetrated in the up and down directions, and the first conductive member 22 is vertically connected to the antenna 10 and the first connecting layer 21. By setting the first conductive member 22 on the first adapter board 20, a straight line vertical connection is formed between the two points, and the vertical connection distance is shorter, thereby shortening the connection line distance between the antenna 10 and the first connecting layer 21.

[0048] In one embodiment, a second connection layer 31 is provided on one side of the upper surface of the second adapter board 30, the first connection layer 21 and the second connection layer 31 are bonded, and the shielding structure 50 includes an extension portion (not shown), the extension portion extends on the upper surface of the second adapter board 30 in a direction away from the second connection layer 31, and the extension portion and the first connection layer 21 are bonded. In other words, the first connection layer 21 is arranged in an annular shape on the lower surface of the first adapter board 20. In other words, the first connection layer 21 is arranged on both sides of the lower surface of the first adapter board 20. The first connection layer 21 and the second connection layer 31 are bonded, and the extension portion and the first connection layer 21 are bonded, so that the first adapter board 20 and the second adapter board 30 are packaged and connected.

[0049] In one embodiment, the lower surface of the second adapter board 30 is provided with a first mounting layer 61, a second mounting layer 62 and a third mounting layer 63 in sequence corresponding to the extension part, the chip 40 and the second connection layer 31, and the second adapter board 30 is provided with a second connection hole (not shown) corresponding to the extension part, the chip 40 and the second connection layer 31, and a second conductive member 32 is provided in the second connection hole, and the second conductive member 32 respectively connects the extension part and the first mounting layer 61, the chip 40 and the second mounting layer 62, and the second connection layer 31 and the third mounting layer 63. In other words, the extension part and the first mounting layer 61 are conductively connected through the second conductive member 32, the chip 40 and the second mounting layer 62 are conductively connected through the second conductive member 32, and the second connection layer 31 and the third mounting layer 63 are conductively connected through the second conductive member 32.

[0050] In one embodiment, the chip 40 is welded and connected to the first shielding portion 532, the second shielding portion 533 and the signal connecting portion 534. Specifically, a first solder ball 41 is provided between the chip 40 and the second shielding panel 53, and the chip 40 is welded and connected to the first shielding portion 532, the second shielding portion 533 and the signal connecting portion 534 through the first solder ball 41. The chip 40 transmits or receives signals through three signal transmission channels of the first shielding portion 532, the second shielding portion 533 and the signal connecting portion 534.

[0051] In addition, in other embodiments, a second solder ball 64 is provided on the lower surface of the first mounting layer 61, the lower surface of the second mounting layer 62, and the lower surface of the third mounting layer 63. The first mounting layer 61, the second mounting layer 62, and the third mounting layer 63 are connected to external electronic components through the second solder ball 64, that is, the chip 40 is soldered and connected to the external electronic components through the second solder ball 64 to receive or send signals to the external electronic components.

[0052] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A chip packaging structure, characterized in that: The packaging structure comprises: antenna; A first adapter plate, the antenna being arranged on a surface of the first adapter plate; a second adapter board, the second adapter board being disposed below the first adapter board, a chip being disposed between the first adapter board and the second adapter board; and a shielding structure, the shielding structure comprising a first shielding panel disposed between the chip and the antenna; The first shielding panel is arranged on the lower surface of the first adapter plate, and the shielding structure also includes a first key component arranged on the lower surface of the first shielding panel. The shielding structure also includes a second shielding panel arranged on the upper surface of the second adapter plate, and a second key component arranged on the upper surface of the second shielding panel. The lower surface of the first key component and the upper surface of the second key component are abutted and bonded to each other.

2. The chip packaging structure according to claim 1, characterized in that: The second shielding panel is provided with a communication groove corresponding to the chip.

3. The chip packaging structure according to claim 2, characterized in that: The second bonding component includes a first surrounding portion provided on one side of the chip and a second surrounding portion provided on the other side of the chip, the second shielding panel includes a first shielding portion and a second shielding portion, the first surrounding portion is provided on an upper surface of the first shielding portion, and the second surrounding portion is provided on an upper surface of the second shielding portion; The communication groove includes a first groove and a second groove, and the second shielding panel also includes a signal connecting part arranged between the first shielding part and the second shielding part, the first shielding part and the signal connecting part are arranged at intervals to form the first groove, and the second shielding part and the signal connecting part are arranged at intervals to form the second groove.

4. The chip packaging structure according to claim 3, characterized in that: A first solder ball is disposed on the lower surface of the chip, and the chip is soldered and connected to the first shielding portion, the second shielding portion and the signal connecting portion.

5. The chip packaging structure according to any one of claims 1 to 4, characterized in that: A first connection layer is disposed on the lower surface of the first adapter board facing away from the antenna. A first connection hole is formed between the antenna and the first connection layer. A first conductive member is disposed in the first connection hole. The first conductive member connects the antenna and the first connection layer.

6. The chip packaging structure according to claim 5, characterized in that: The first connection hole is vertically penetrated in the up-down direction, and the first conductive member is vertically connected to the antenna and the first connection layer.

7. The chip packaging structure according to claim 5, characterized in that: A second connection layer is provided on one side of the upper surface of the second adapter board, the first connection layer and the second connection layer are bonded to each other, the shielding structure includes an extension portion, the extension portion is on the upper surface of the second adapter board and extends in a direction away from the second connection layer, and the extension portion and the first connection layer are bonded to each other.

8. The chip packaging structure according to claim 7, characterized in that: The lower surface of the second adapter board is provided with a first mounting layer, a second mounting layer and a third mounting layer in sequence corresponding to the extension part, the chip and the second connecting layer. The second adapter board is provided with second connecting holes corresponding to the extension part, the chip and the second connecting layer. A second conductive member is arranged in the second connecting hole. The second conductive member respectively connects the extension part and the first mounting layer, the chip and the second mounting layer, and the second connecting layer and the third mounting layer.

9. The chip packaging structure according to claim 8, characterized in that: Second solder balls are provided on the lower surfaces of the first mounting layer, the second mounting layer and the third mounting layer, and the first mounting layer, the second mounting layer and the third mounting layer are soldered to external electronic components through the second solder balls.

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