Display panel and method of manufacturing the same

Abstract

A display panel and a method for manufacturing the display panel are provided. The display panel may include: a first display substrate; a second display substrate disposed above the first display substrate; and a sealing member combining the first display substrate and the second display substrate. The sealing member may include: a glass frit sealing member including an outer region and an inner region, and the inner region is disposed adjacent to the inner side of the outer region, and the inner region has a first crystallization temperature lower than a second crystallization temperature of the outer region; and an organic sealing member disposed adjacent to the inner side of the glass frit sealing member.

Description

Technical Field

[0001] The inventive concept relates to a display device and a method of manufacturing the same, and more particularly, to a display device including a sealing member and a method of manufacturing the same. Background Art

[0002] Currently, research is being conducted to develop various display devices for use in multimedia devices such as televisions, mobile phones, tablet computers, navigation systems, and game consoles, and in particular, to develop those display devices with enhanced durability and reduced non-display areas. The display device may include a sealing member for combining a first display substrate and a second display substrate. In order to enhance durability, various sealing members are being developed to enhance the impact strength of the display device and effectively prevent moisture penetration. Summary of the invention

[0003] Example embodiments of the inventive concepts provide a display panel having high impact strength and effectively preventing penetration of moisture.

[0004] Example embodiments of the inventive concepts provide a method of reducing the amount of gas generated in a process of manufacturing a sealing member of a display panel.

[0005] According to an example embodiment of the inventive concept, a method of manufacturing a display panel may include: providing a first display substrate and a second display substrate; forming a preliminary glass frit sealing member on a surface of one of the first display substrate and the second display substrate, the preliminary glass frit sealing member including an outer region and an inner region; crystallizing the inner region of the preliminary glass frit sealing member; forming a preliminary organic sealing member on a surface of one of the first display substrate and the second display substrate; combining the first display substrate and the second display substrate so that the preliminary glass frit sealing member and the preliminary organic sealing member are disposed between the first display substrate and the second display substrate in a cross-sectional view, and the preliminary organic sealing member is disposed adjacent to an inner side of the preliminary glass frit sealing member in a plan view; crystallizing the outer region of the preliminary glass frit sealing member; and curing the preliminary organic sealing member.

[0006] In example embodiments of the present inventive concepts, crystallizing the inner region may include irradiating the inner region with a laser beam.

[0007] In an example embodiment of the present inventive concept, in the step of forming the preliminary frit sealing member, the preliminary frit sealing member may be formed on a surface of the second display substrate. In the step of forming the preliminary organic sealing member, the preliminary organic sealing member may be formed on a surface of the first display substrate.

[0008] In example embodiments of the present inventive concepts, in the step of bonding the first display substrate and the second display substrate, an inner region of the preliminary frit sealing member may be in contact with the preliminary organic sealing member.

[0009] According to an example embodiment of the inventive concept, a method of manufacturing a display panel may include the following steps: providing a first display substrate and a second display substrate, at least one of the first display substrate and the second display substrate including a display area where pixels are provided and a non-display area adjacent to the display area; forming a first preliminary frit sealing member on a surface of one of the first display substrate and the second display substrate; forming a second preliminary frit sealing member on a surface of one of the first display substrate and the second display substrate so that the second preliminary frit sealing member is disposed immediately outside the first preliminary frit sealing member in a plan view; crystallizing the first preliminary frit sealing member; forming a preliminary organic sealing member on a surface of one of the second display substrate and the first display substrate; combining the first display substrate and the second display substrate so that the first preliminary frit sealing member, the second preliminary frit sealing member, and the preliminary organic sealing member are disposed between the first display substrate and the second display substrate in a cross-sectional view and overlap the non-display area in a plan view, and so that the preliminary organic sealing member is disposed immediately inside the first preliminary frit sealing member in a plan view; crystallizing the second preliminary frit sealing member; and curing the preliminary organic sealing member.

[0010] In example embodiments of the present inventive concepts, a weight ratio of vanadium (V) to zinc (Zn) in the first preliminary frit sealing member may be lower than a weight ratio of vanadium (V) to zinc (Zn) in the second preliminary frit sealing member.

[0011] In example embodiments of the present inventive concepts, the first preliminary frit sealing member and the second preliminary frit sealing member may be simultaneously formed on the surface of the second display substrate.

[0012] In example embodiments of the present inventive concepts, the first preliminary frit sealing member and the second preliminary frit sealing member may contact each other.

[0013] In example embodiments of the present inventive concepts, crystallizing the first preliminary frit sealing member may include heating the first preliminary frit sealing member and the second preliminary frit sealing member.

[0014] In example embodiments of the present inventive concepts, a crystallization temperature of the first preliminary frit sealing member may be about 5° C. to about 50° C. lower than a crystallization temperature of the second preliminary frit sealing member.

[0015] In example embodiments of the present inventive concepts, a crystallization temperature of the first preliminary frit sealing member may range from about 240°C to about 260°C, and a crystallization temperature of the second preliminary frit sealing member may range from about 290°C to about 310°C.

[0016] In an example embodiment of the present inventive concept, in the step of heating the first and second preliminary frit sealing members, the first and second preliminary frit sealing members are heated to a temperature ranging from about 250°C to about 280°C.

[0017] In example embodiments of the present inventive concepts, a crystallization temperature of the first preliminary frit sealing member may range from about 390°C to about 410°C, and a crystallization temperature of the second preliminary frit sealing member may range from about 440°C to about 460°C.

[0018] In an example embodiment of the present inventive concept, in the step of heating the first and second preliminary frit sealing members, the first and second preliminary frit sealing members are heated to a temperature ranging from about 400°C to about 430°C.

[0019] In example embodiments of the present inventive concepts, crystallizing the second preliminary frit sealing member may include irradiating the second preliminary frit sealing member with a laser beam.

[0020] According to an example embodiment of the inventive concept, a display panel may include: a first display substrate including a base substrate, a circuit layer and a display element, the base substrate including a display area and a non-display area, the circuit layer is disposed on the base substrate, the display element is disposed on the circuit layer and overlaps the display area; a second display substrate disposed above the first display substrate; and a sealing member combining the first display substrate and the second display substrate. The sealing member may include: a glass frit sealing member including an outer region and an inner region, and the inner region is disposed adjacent to the inner side of the outer region, and the inner region has a first crystallization temperature lower than a second crystallization temperature of the outer region; and an organic sealing member disposed adjacent to the inner side of the glass frit sealing member.

[0021] In example embodiments of the present inventive concepts, a first crystallization temperature of the inner region may be about 5° C. to about 50° C. lower than a second crystallization temperature of the outer region.

[0022] In example embodiments of the present inventive concepts, the circuit layer may include an inorganic layer, and the frit sealing member may contact the bottom surface of the second display substrate and the inorganic layer.

[0023] In example embodiments of the present inventive concepts, the circuit layer may include an inorganic layer, the second display substrate may include a glass substrate and a buffer layer, and the buffer layer is disposed on a bottom surface of the glass substrate, and the frit sealing member may contact the inorganic layer and the buffer layer.

[0024] In an example embodiment of the present inventive concept, the display element may include an organic light emitting element. The first display substrate may further include a pixel defining layer, the pixel defining layer including an edge portion and a central portion, the edge portion overlapping the non-display area, the central portion overlapping the display area and disposed on the circuit layer. An opening corresponding to the organic light emitting element may be defined in the central portion. The organic sealing member may contact the edge portion.

[0025] In example embodiments of the present inventive concepts, the circuit layer may include a power supply electrode overlapping the edge portion and electrically connected to the organic light emitting element.

[0026] In example embodiments of the present inventive concepts, a weight ratio of vanadium (V) to zinc (Zn) in the inner region may be lower than a weight ratio of vanadium (V) to zinc (Zn) in the outer region.

[0027] According to an exemplary embodiment of the present invention, a display panel may include: a first display substrate including a base substrate, a circuit layer and a display element, the base substrate including a display area and a non-display area, the circuit layer is disposed on the base substrate, the display element is disposed on the circuit layer and overlapped with the display area; a second display substrate disposed above the first display substrate; and a glass frit sealing member and an organic sealing member, disposed between the first display substrate and the second display substrate, overlapped with the non-display area, surrounding the display element, and combining the first display substrate and the second display substrate. The organic sealing member is closer to the display element than the glass frit sealing member, and the organic sealing member is surrounded by the glass frit sealing member. The glass frit sealing member includes an outer glass frit sealing member and an inner glass frit sealing member, the outer glass frit sealing member is located at the edge of the first display substrate and the second display substrate or near the edge of the first display substrate and the second display substrate, and the inner glass frit sealing member is disposed adjacent to the inner side of the outer glass frit sealing member and adjacent to the outer side of the organic sealing member. The frit sealing member includes vanadium (V) and zinc (Zn), and a weight ratio of vanadium (V) to zinc (Zn) in the inner frit sealing member is lower than a weight ratio of vanadium (V) to zinc (Zn) in the outer frit sealing member.

[0028] In example embodiments of the present inventive concepts, the frit sealing member includes silver (Ag). BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Example embodiments of the inventive concept will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0030] Figure 1 is a perspective view showing a display panel according to an example embodiment of the inventive concept;

[0031] Figure 2 is a cross-sectional view illustrating a display panel according to an example embodiment of the inventive concept;

[0032] Figure 3 and Figure 4 is a plan view showing a display panel according to an example embodiment of the inventive concept;

[0033] Figure 5 is an equivalent circuit diagram illustrating a pixel according to an example embodiment of the inventive concept;

[0034] Figure 6 is an enlarged cross-sectional view illustrating a display panel according to an example embodiment of the inventive concept;

[0035] Fig. 7A is an enlarged cross-sectional view illustrating a display panel according to an example embodiment of the inventive concept;

[0036] Figure 7B is an enlarged cross-sectional view illustrating a display panel according to an example embodiment of the inventive concept;

[0037] Figure 7C is an enlarged cross-sectional view illustrating a display panel according to an example embodiment of the inventive concept;

[0038] Fig.7D is an enlarged cross-sectional view illustrating a display panel according to an example embodiment of the inventive concept;

[0039] Figure 8 is a flowchart illustrating a method of manufacturing a display panel according to an example embodiment of the inventive concept;

[0040] 9A to 9F is a cross-sectional view illustrating a method of manufacturing a display panel according to an example embodiment of the inventive concept;

[0041] Fig.10 is a flowchart illustrating a method of manufacturing a display panel according to an example embodiment of the inventive concept;

[0042] FIG. 11A to FIG. 11F is a cross-sectional view illustrating a method of manufacturing a display panel according to an example embodiment of the inventive concept;

[0043] Fig. 12A is a plan view of a first working substrate illustrating a method for manufacturing a display panel according to an example embodiment of the inventive concept; and

[0044] Fig. 12Bis a plan view of a second working substrate illustrating a method for manufacturing a display panel according to an example embodiment of the inventive concept.

[0045] because Figures 1 to 12B The drawings in the drawings are intended for illustrative purposes, so the elements in the drawings are not necessarily drawn to scale. For example, some of the elements may be enlarged or exaggerated for clarity. The use of similar or identical reference numerals in the various drawings is intended to indicate the presence of similar or identical elements or features. DETAILED DESCRIPTION

[0046] Example embodiments of the inventive concept will now be described more fully with reference to the accompanying drawings, in which the example embodiments are shown. However, the example embodiments of the inventive concept may be implemented in many different forms and should not be construed as being limited to the specific example embodiments set forth herein, but rather, these example embodiments are provided so that the inventive concept will be thorough and complete and will fully convey the concepts of the example embodiments to those of ordinary skill in the art. In the accompanying drawings, like reference numerals indicate like elements, and therefore, their redundant descriptions will be omitted.

[0047] It will be understood that when an element is referred to as being "connected" or "coupled" to another element, the element may be directly connected or directly coupled to another element, or there may be an intermediate element. Conversely, when an element is referred to as being "directly connected" or "directly coupled" to another element, there is no intermediate element. Other words used to describe the relationship between elements or layers should be interpreted in the same manner (e.g., "between" and "directly between", "adjacent" and "directly adjacent", "on" and "directly on"). The same reference numerals always refer to the same element. As used herein, the term "and / or" includes any and all combinations of one or more of the related listed items.

[0048] It will be understood that although the terms "first", "second", etc. may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer or part discussed below may be referred to as the second element, component, region, layer or part, and vice versa.

[0049] For ease of description, spatially relative terms such as "under," "below," "below," "above," "on," etc. may be used herein to describe the relationship of one element or feature to another (other) element or feature as shown in the accompanying drawings. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation other than the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, an element described as "under" or "beneath" other elements or features will subsequently be oriented to be "above" the other elements or features. Thus, the exemplary term "under" may encompass both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein interpreted accordingly.

[0050] The terms used herein are only for the purpose of describing specific example embodiments, and are not intended to be limitations of the example embodiments. As used herein, unless the context clearly indicates otherwise, the singular forms "one (kind / person)" and "the (the)" are also intended to include plural forms. It will also be understood that if the terms "comprise", "include" and variations thereof are used herein, these terms specify the existence of stated features, wholes, steps, operations, elements, components and / or their groups, but do not exclude the existence or addition of one or more other features, wholes, steps, operations, elements, components and / or their groups.

[0051] When the term "about" is used in conjunction with a numerical value in this specification, it is intended that the relevant numerical value includes a tolerance of no more than ±10% around the stated numerical value.

[0052] Example embodiments of the present inventive concept are described herein with reference to cross-sectional views that are schematic representations of idealized embodiments (and intermediate structures) of the example embodiments. As such, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances are expected to occur. Therefore, example embodiments of the present inventive concept should not be construed as limited to the specific shapes of the regions shown herein, but rather are to include deviations in shape that result, for example, from manufacturing.

[0053] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those of ordinary skill in the art to which the inventive concept belongs. It will also be understood that terms (such as those defined in general dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense, unless explicitly defined as such herein.

[0054] Figure 1 is a perspective view illustrating a display panel DP according to an example embodiment of the inventive concept. Figure 2 is a cross-sectional view illustrating a display panel DP according to an example embodiment of the inventive concept. Figure 3 and Figure 4 is a plan view illustrating a display panel DP according to an example embodiment of the inventive concept.

[0055] Reference Figures 1 to 4 The display panel DP may be one of a liquid crystal display panel, an electrophoretic display panel, a micro-electromechanical system (MEMS) display panel, an electrowetting display panel, an electrochromic display panel, and an organic light emitting display panel, but the inventive concept is not limited thereto.

[0056] The display panel DP may further include a frame member or a molding member, and may further include a backlight unit depending on the type of the display panel DP used. For example, a liquid crystal display panel may include a backlight unit and a plurality of frame members.

[0057] like Figure 1 and Figure 2 As shown in , the display panel DP may include a first display substrate (or lower display substrate) DS and a second display substrate (or upper display substrate) ES, the second display substrate ES being separated from and facing the first display substrate DS. A cell gap GP may be formed between the first display substrate DS and the second display substrate ES, and the cell gap GP may be maintained by sealing members S1 and SO that couple the first display substrate DS and the second display substrate ES to each other. For example, a combination of the sealing members S1 and SO, the first display substrate DS, and the second display substrate ES may form an enclosed space including the cell gap GP.

[0058] like Figure 1 As shown in , the display panel DP may include a display surface DP-IS that displays an image. The display surface DP-IS may be parallel to a plane defined by a first direction DR1 and a second direction DR2, and may include a display area DA and a non-display area NDA. The pixel PX may be disposed in the display area DA, but may not be disposed in the non-display area NDA. The pixel PX may include a light emitting element OLED, for example, an organic light emitting diode, as a display element to be described. The non-display area NDA may be defined along an edge of the display surface DP-IS. The display area DA may be surrounded by the non-display area NDA.

[0059] The normal direction of the display surface DP-IS (ie, the thickness direction of the display panel DP) will be referred to as a third direction DR3. The third direction DR3 may be used to distinguish the front surface (or top surface) from the rear surface (or bottom surface) of each element (eg, layer or unit).

[0060] In the exemplary embodiment of the inventive concept, the display surface DP-IS of the display panel DP is shown as a flat type, but the inventive concept is not limited thereto. For example, the display panel DP may have a curved display surface or a three-dimensional display surface. A three-dimensional display surface in which an image is generated within a display volume rather than on a static surface may include a plurality of display areas oriented in different directions.

[0061] like Figure 2 and Figure 3 As shown in , the sealing members SI and SO may overlap with the non-display area NDA in the third direction DR3. In the present application, the word "overlap" always refers to the overlap of one object with another object in the third direction DR3. The sealing members SI and SO may include a glass frit sealing member SI and an organic sealing member SO. The glass frit sealing member SI may be disposed outside the organic sealing member SO, and the glass frit sealing member SI may be aligned with the side surface of the display panel DP. When viewed in a plan view, each of the glass frit sealing member SI and the organic sealing member SO may have the shape of a closed line. For example, the glass frit sealing member SI and the organic sealing member SO may be disposed between the first display substrate DS and the second display substrate ES, may overlap with the non-display area NDA, may surround the display element disposed in the display area DA, and may combine the first display substrate DS with the second display substrate ES. The organic sealing member SO may be closer to the display area DA than the glass frit sealing member SI, and may be surrounded by the glass frit sealing member SI.

[0062] The glass frit sealing member SI may include glass frit. The glass frit may include a crystallized base glass or mother glass. The term "crystallized base glass" may refer to not only a completely crystallized base glass but also a partially crystallized base glass.

[0063] The matrix glass may be a vanadium-based glass or a palladium-based glass. In other words, the matrix glass may include vanadium (V) or palladium (Pd). The matrix glass may also include tellurium oxide (TeO 2 )、ZnO、BaO、BiO 2 O 3 ), boron oxide (B 2 O 3 ), alumina (A1 2 O 3 ), cerium oxide (CeO 2 ), titanium oxide (TiO 2 ), calcium oxide (CaO), tungsten oxide (WO 3) etc. The glass frit sealing member SI may further include a filler. The filler may include ceramics. In an exemplary embodiment of the inventive concept, a plurality of fillers may be dispersed in the mother glass to maintain the shape of the crystallized matrix glass. In an exemplary embodiment of the inventive concept, the filler may be provided in the glass frit to adjust the overall thermal expansion characteristics of the glass frit sealing member SI so that stress may be relaxed and cracks may be prevented in the bonding area.

[0064] The glass frit sealing member SI can prevent oxygen and / or moisture provided from the outside of the display panel DP from entering the cell gap GP. The glass frit sealing member SI can enhance the bonding strength between the first display substrate DS and the second display substrate ES. Inorganic materials are generally dense and impermeable to oxygen and / or moisture. Since the glass frit sealing member SI is formed of an inorganic material including a crystallized base glass and / or ceramic, the glass frit sealing member SI can prevent oxygen and / or moisture from entering the cell gap GP and causing degradation of the circuit components and display elements in the display area DA.

[0065] The organic sealing member SO may include a synthetic resin (e.g., an epoxy resin). The organic sealing member SO may also include an ultraviolet curing agent (e.g., bisphenol-F) or an additive material (e.g., bisphenol-A, acrylic or phenylsiloxane). The organic sealing member SO may also enhance the bonding strength between the first display substrate DS and the second display substrate ES. Because the organic sealing member SO has elastic properties, the organic sealing member SO may relieve the stress between the first display substrate DS and the second display substrate ES, and may absorb external shocks that may occur when the display panel DP falls. In addition, even when cracks appear in the region adjacent to the glass frit sealing member SI of the first display substrate DS and the second display substrate ES due to the fall of the display panel DP, the organic sealing member SO may prevent crack growth. In other words, the organic sealing member SO may prevent crack formation and / or crack extension from occurring in the region of the first display substrate DS and the second display substrate ES.

[0066] Figure 4 The arrangement of the signal lines SGL and the pixels PX in a plan view is schematically shown. The signal lines SGL may include a plurality of gate lines GL, a power line PL, and a plurality of data lines DL.

[0067] Each of the pixels PX may be connected to a corresponding gate line GL among the gate lines GL and a corresponding data line DL among the data lines DL, and may include a pixel driving circuit and a display element. The gate lines GL may be separated from each other in a first direction DR1 and may extend in a second direction DR2, and the data lines DL may be separated from each other in the second direction DR2 and may extend in the first direction DR1. Other types of signal lines may also be provided in the display panel DP according to the structure of the pixel driving circuit of the pixel PX.

[0068] exist Figure 4 , an example in which the pixels PX are arranged in a matrix shape is shown, but the inventive concept is not limited thereto. For example, the pixels PX may be arranged in a pentile matrix shape or a diamond shape.

[0069] The gate drive circuit DCV to which the gate line GL is connected may be arranged in the area of ​​the non-display area NDA. The control signal line CSL may provide a control signal to the gate drive circuit DCV. Each of the control signals provided by the control signal line CSL may include a vertical start signal for controlling the operation of the gate drive circuit DCV and at least one clock signal for determining the output timing of the signal. The gate drive circuit DCV may be integrated on the display panel DP by an oxide silicon gate driver circuit (OSG) process or an amorphous silicon gate driver circuit (ASG) process. The gate drive circuit DCV may include a plurality of transistors, a plurality of electrodes, and a plurality of wires. A plurality of transistors may constitute a stage circuit that sequentially outputs a scan signal (gate signal) to the gate line GL.

[0070] Figure 5 is an equivalent circuit diagram illustrating a pixel PX according to an example embodiment of the inventive concept. Figure 6 is an enlarged cross-sectional view illustrating a display panel DP according to an example embodiment of the inventive concept.

[0071] Figure 5 An example of a pixel PX connected to one gate line GL, one data line DL, and a power line PL is shown. The structure of the pixel PX may not be limited to this example and may be variously modified.

[0072] The pixel PX may include a light emitting element OLED used as a display element. The light emitting element OLED may be a top emission diode or a bottom emission diode. Selectively, the light emitting element OLED may be a double-side emission diode. The light emitting element OLED may be an organic light emitting diode. Therefore, the display element may include an organic light emitting element. The pixel PX may include a switching transistor T1, a driving transistor T2, and a capacitor CP, which constitute a circuit for driving the light emitting element OLED. The light emitting element OLED may generate light in response to an electrical signal transmitted from transistors T1 and T2. The capacitor CP may include a first electrode connected to the switching transistor T1 and a second electrode receiving a first power supply voltage ELVDD. The capacitor CP may be charged with a voltage corresponding to a data signal received from the switching transistor T1. The light emitting element OLED may emit light using a first power supply voltage ELVDD (positive output) and a second power supply voltage ELVSS (negative output), where the intensity of the light emitted from the light emitting element OLED may be determined by the amount of charge stored in the capacitor CP. The first power supply voltage ELVDD may be higher than the second power supply voltage ELVSS.

[0073] like Figure 6 As shown in , the first display substrate DS may include a first base substrate SUB, a circuit layer DP-CL disposed on the first base substrate SUB, and a display element layer DP-OLED disposed on the circuit layer DP-CL.

[0074] The first base substrate SUB may include a synthetic resin substrate or a glass substrate. Figure 1 The display area DA and the non-display area NDA shown in the figure may be defined in the first base substrate SUB. For example, the first display substrate DS may include a first base substrate SUB including the display area DA and the non-display area NDA, a circuit layer DP-CL that may be disposed on the first base substrate SUB, and a display element such as a light emitting element OLED that may be disposed on the circuit layer DP-CL and overlapped with the display area DA of the first base substrate SUB.

[0075] The circuit layer DP-CL may include circuit devices and at least one insulating layer. The circuit devices may include signal lines, pixel driving circuits, etc. The formation of the circuit layer DP-CL may include forming an insulating layer, a semiconductor layer, and a conductive layer using a coating or deposition process and patterning the insulating layer, the semiconductor layer, and the conductive layer using a photolithography process and / or an etching process.

[0076] In the present exemplary embodiment, the circuit layer DP-CL may include a buffer layer BFL, a first insulating layer 10, a second insulating layer 20, and a third insulating layer 30. The first insulating layer 10 and the second insulating layer 20 may be inorganic layers, and the third insulating layer 30 may be an organic layer. The second insulating layer 20 may include, for example, a silicon oxynitride (SiON) layer, a silicon oxide (SiO 2 ) layer or silicon nitride (Si 3 N 4 In an example embodiment of the present inventive concept, the third insulating layer 30 may include a polymer such as an acrylic resin, but the present inventive concept is not limited thereto. For example, any suitable organic insulating layer may be used for the third insulating layer 30.

[0077] Figure 6 An example of relative positions or arrangements of some elements constituting the switching transistor T1 and the driving transistor T2 (eg, semiconductor patterns OSP1 and OSP2, control electrodes GE1 and GE2, input electrodes DE1 and DE2, and output electrodes SE1 and SE2) is shown. Figure 6 A first through hole CH1, a second through hole CH2, a third through hole CH3, a fourth through hole CH4, and a fifth through hole CH5 may also be exemplarily shown in FIG.

[0078] The display element layer DP-OLED may include a light emitting element OLED. In this example embodiment, the display element layer DP-OLED may include an organic light emitting diode used as the light emitting element OLED. The display element layer DP-OLED may include a pixel defining layer PDL. For example, the pixel defining layer PDL may be an organic layer.

[0079] The first electrode AE ​​may be disposed on the third insulating layer 30 and may be connected to the output electrode SE2 by a fifth through hole CH5 penetrating the third insulating layer 30. An opening OP may be defined in the pixel defining layer PDL and may expose at least a portion of the first electrode AE. In the present example embodiment, the pixel region PXA may be defined to correspond to a region of the first electrode AE ​​exposed by the opening OP. The light blocking region NPXA may be a region located adjacent to the pixel region PXA and configured to prevent light from being emitted therefrom.

[0080] The hole control layer HCL and the electron control layer ECL may be commonly disposed in the pixel region PXA and the light blocking region NPXA, and further, the hole control layer HCL and the electron control layer ECL may be commonly disposed in a plurality of pixel regions PXA.

[0081] The hole control layer HCL may include a hole transport layer, and in an exemplary embodiment of the present invention, the hole control layer HCL may further include a hole injection layer. The light emitting layer EML may generate colored light corresponding to the pixel. The light emitting layer EML may be disposed on the hole control layer HCL and may be disposed between the hole control layer HCL and the electron control layer ECL. The electron control layer ECL may include an electron transport layer, and in an exemplary embodiment of the present invention, the electron control layer ECL may further include an electron injection layer.

[0082] The second electrode CE may be disposed on the electronic control layer ECL and may be commonly disposed in a plurality of pixel areas PXA. Therefore, the second electrode CE may have an area larger than that of the first electrode AE. A cover layer for protecting the second electrode CE may also be disposed on the second electrode CE.

[0083] In the present example embodiment, the second display substrate ES may cover the second electrode CE and may include at least a base substrate (hereinafter, second base substrate). In the present example embodiment, the second display substrate ES composed of only the second base substrate is exemplarily shown.

[0084] The second display substrate ES may define a cell gap GP and may prevent external moisture from entering the light emitting element OLED. The second display substrate ES may be an encapsulation substrate. For example, a combination of the sealing members SI and SO, the first display substrate DS, and the second display substrate ES may surround the light emitting element OLED, thereby preventing external moisture from entering the light emitting element OLED.

[0085] FIG. 7A to FIG. 7D is an enlarged cross-sectional view illustrating a display panel DP according to an example embodiment of the inventive concept. Fig. 7A , Figure 7C and Fig.7D is along Figure 4 A cross-sectional view taken along line II' of FIG. Fig.7D Compared to the above, the magnification is shown Fig. 7A and Figure 7C For example, with Fig.7D In comparison, Fig. 7A and 7C More detailed components are shown in FIG.

[0086] exist Fig. 7A In the embodiment, the stacked structure of the circuit layer DP-CL and the display element layer DP-OLED arranged in the display area DA can be Figure 6 The stacking structure of the circuit layer DP-CL and the display element layer DP-OLED disposed in the display area DA is the same, and therefore, a detailed description thereof will be omitted. Figure 6 compared to, Fig. 7A and Figure 7C The light emitting element OLED is shown in a simplified manner.

[0087] Reference Fig. 7A , a transistor DCV-T of a gate driving circuit DCV is shown. A transistor DCV-T formed by the same process as that of the driving transistor T2 is exemplarily shown. In addition, a signal line DCV-SL provided on the same layer as that of the electrode of the transistor DCV-T of the gate driving circuit DCV is shown. In addition, a power supply electrode PWE for providing a second power supply voltage ELVSS is shown.

[0088] The power electrode PWE may be disposed outside the gate driving circuit DCV and may receive the second power voltage ELVSS from the outside. The connection electrode E-CNT may be disposed on the third insulating layer 30 and may connect the power electrode PWE to the second electrode CE. The connection electrode E-CNT may be formed by the same process as that for the first electrode AE, in which case the connection electrode E-CNT may have the same stacking structure as that of the first electrode AE.

[0089] The pixel defining layer PDL may include an edge portion PDL-E overlapping the non-display area NDA and a central portion PDL-C overlapping the display area DA. The central portion PDL-C and the edge portion PDL-E may be formed simultaneously by the same process. In this case, the central portion PDL-C and the edge portion PDL-E may be formed of the same material or include the same material. However, the inventive concept is not limited thereto. For example, the edge portion PDL-E may be formed separately from the formation of the central portion PDL-C and may be formed of a material different from that of the central portion PDL-C. The pixel defining layer PDL may further include a portion disposed on the third insulating layer 30 and overlapping the non-display area NDA.

[0090] An opening OP corresponding to the light emitting element OLED may be defined in the central portion PDL-C. An edge portion PDL-E may be disposed on the circuit layer DP-CL, and at least a portion of the edge portion PDL-E may overlap the power electrode PWE.

[0091] When viewed in a plan view, the edge portion PDL-E may have a closed line shape and may include a first region and a second region. Fig. 7A As shown in , the first region may be separated from the second display substrate ES. The second region may be in contact with the second display substrate ES and may be used as a spacer. The first region and the second region may be formed using a halftone mask. The region used as a spacer may be defined in the center portion PDL-C.

[0092] The organic sealing member SO may be disposed between the frit sealing member SI and the edge portion PDL-E and may contact each of the frit sealing member SI and the edge portion PDL-E. A portion of the organic sealing member SO may be disposed between the edge portion PDL-E and the second display substrate ES in the third direction DR3.

[0093] In example embodiments of the present inventive concepts, the frit sealing member SI may include a single region having the same crystallization temperature. In example embodiments of the present inventive concepts, the frit sealing member SI may include a plurality of regions having different crystallization temperatures.

[0094] The crystallization temperature of the glass frit sealing member SI may be determined by the chemical composition of the glass frit sealing member SI. The glass frit sealing member SI containing silver (Ag) may have a crystallization temperature lower than the crystallization temperature of the glass frit sealing member without silver. For example, the glass frit sealing member SI may include silver oxide (Ag 2 O).

[0095] like Figure 7B As shown in , the frit sealing member SI may include an outer region S-IO and an inner region S-II whose crystallization temperatures are different from each other. The crystallization temperature of the outer region S-IO may be about 5° C. to about 50° C. higher than that of the inner region S-II.

[0096] The difference in crystallization temperature between the outer region S-10 and the inner region S-II may be determined by the weight ratio of vanadium (V) to zinc (Zn). The lower the weight ratio of vanadium (V) to zinc (Zn), the lower the crystallization temperature. In an example embodiment of the present inventive concept, the glass frit sealing member S1 may include vanadium oxide (V 2 O 5 ) and zinc oxide (ZnO), and may optionally include silver oxide (Ag 2 O).

[0097] In the case where the frit sealing member SI contains silver (Ag), the outer region S-10 of the frit sealing member SI may have a crystallization temperature in the range of about 290° C. to about 310° C., and the inner region S-II of the frit sealing member SI may have a crystallization temperature in the range of about 240° C. to about 260° C. On the contrary, in the case where the frit sealing member SI does not contain silver (Ag), the outer region S-10 of the frit sealing member SI may have a crystallization temperature in the range of about 440° C. to about 460° C., and the inner region S-II of the frit sealing member SI may have a crystallization temperature in the range of about 390° C. to about 410° C. The crystallization temperature of the frit sealing member SI may be measured by differential scanning calorimetry (DSC) or differential thermal analysis (DTA).

[0098] The inner region S-II may be disposed between the outer region S-IO and the organic sealing member SO, and may be used as a heat-blocking partition in the manufacturing process. This will be described in more detail below.

[0099] The inner region S-II may have a crystallization temperature lower than that of the outer region S-IO. The inner region S-II and the outer region S-IO may have different chemical compositions. For example, the weight ratio of vanadium (V) to zinc (Zn) in the inner region S-II may be lower than the weight ratio of vanadium (V) to zinc (Zn) in the outer region S-IO.

[0100] The inner region S-II, the outer region S-IO, and the organic sealing member SO may be directly disposed on the second insulating layer 20 as an inorganic layer. The second insulating layer 20 is located in the first display substrate DS. The inner region S-II, the outer region S-IO, and the organic sealing member SO may be directly bonded to the bottom surface of the base substrate of the second display substrate ES. In other words, the inner region S-II, the outer region S-IO, and the organic sealing member SO may bond the first display substrate DS to the second display substrate ES.

[0101] like Figure 7C As shown in , the second display substrate ES may include a second base substrate E-BC and a buffer layer EI. The second base substrate E-BC may include a synthetic resin substrate or a glass substrate.

[0102] The buffer layer EI may be directly disposed on the bottom surface of the second base substrate E-BC. The buffer layer EI overlapping the display area DA and the non-display area NDA is shown as an example, but the inventive concept is not limited thereto. For example, in order to increase the bonding strength between the glass frit sealing member SI and the organic sealing member SO and the second display substrate ES, the buffer layer EI may be disposed in at least the non-display area NDA. When the buffer layer EI is disposed on the entire bottom surface of the second base substrate E-BC, the buffer layer EI may flatten the surface of the second base substrate E-BC and may prevent moisture and oxygen from penetrating into the cell gap GP.

[0103] The glass frit sealing member SI may be in contact with the buffer layer EI. For example, the circuit layer DP-CL may include an inorganic layer (e.g., a second insulating layer 20), the second display substrate ES may include a glass substrate (e.g., a second base substrate E-BC) and a buffer layer EI disposed on the bottom surface of the glass substrate (e.g., the second base substrate E-BC), and the glass frit sealing member SI may be in contact with the inorganic layer (e.g., the second insulating layer 20) and the buffer layer EI. The buffer layer EI may include an inorganic layer (e.g., a silicon oxynitride (SiON) layer, a silicon oxide (SiO 2 ) layer or silicon nitride (Si 3 N 4 ) layer). Optionally, the buffer layer EI may include a metal layer, a metal oxide layer and / or a metal nitride layer. For example, the buffer layer EI may include silicon nitride (Si 3 N 4 ), silicon oxide (SiO 2 ), titanium oxide (TiO 2 ), at least one of titanium nitride (TiN) and zinc oxide (ZnO). In an example embodiment of the inventive concept, the buffer layer EI, the second insulating layer 20, and the frit sealing member SI may all be formed of an inorganic material and together may prevent moisture and oxygen from penetrating into the cell gap GP.

[0104] like Fig.7D As shown in , when viewed in a cross-sectional view, the display panel DP may have a curved side surface SS. In a case where the frit sealing member SI is partially exposed during a process of manufacturing the frit sealing member SI, there may be a spatial difference in the internal stress of the frit sealing member SI. In a case where the edge portion of the display panel DP is cut using this stress distribution, the side surface SS may have a curved surface.

[0105] Figure 8 is a flowchart exemplarily illustrating a method of manufacturing a display panel DP according to an example embodiment of the inventive concept. 9A to 9FSchematically illustrates a method of manufacturing a display panel DP according to an exemplary embodiment of the inventive concept. 9A to 9F 1 and 2 simply show the first display substrate DS and the second display substrate ES. For the sake of brevity of description, the previously referenced Figures 1 to 7D The elements described are described without repeating their overlapping descriptions.

[0106] like Figure 8 As shown in FIG. 1 , a first display substrate DS may be provided ( S10 ). The first display substrate DS may be a reference Figures 1 to 7D The lower display substrate DS (ie, array substrate) described above may be manufactured through a known manufacturing process.

[0107] like Figure 8 As shown in , a second display substrate ES may be provided (S20). The second display substrate ES may be a glass substrate. The process of manufacturing the first display substrate DS and the second display substrate ES may not be limited to a specific manufacturing order. For example, the step S20 of providing the second display substrate ES may be before the step S10 of providing the first display substrate DS. Figure 8 The order of the steps shown in is preferred. However, the present invention is not limited to Figure 8 Many of the steps can also be performed in Figure 8 The first display substrate DS and the second display substrate ES may be provided in the form of working display substrates. This will be described in more detail below.

[0108] Then, if Figure 8 As shown in , a preliminary frit sealing member S-IP may be formed ( S30 ). The preliminary frit sealing member S-IP may be formed on a surface of one of the second display substrate ES and the first display substrate DS.

[0109] like Fig. 9A As shown in FIG. 1 , a preliminary frit sealing member S-IP may be formed on the surface of the second display substrate ES, and the preliminary frit sealing member S-IP may be formed to overlap the non-display area NDA. When viewed in a plan view, the preliminary frit sealing member S-IP may have a Figure 3 Therefore, like the frit sealing member SI, the preliminary frit sealing member S-IP may surround the display area DA in a plan view.

[0110] A glass frit paste or a glass frit composite may be printed on the surface of the second display substrate ES. The glass frit paste may include glass frit powder, an organic binder, and an organic solvent. The glass frit powder may refer to a granular matrix glass. The glass frit paste may also include a ceramic filler. The organic solvent may be removed by drying the printed glass frit paste. In the drying step, a portion of the organic binder may be removed.

[0111] Thereafter, a sintering step may be performed by providing heat to the glass frit paste from which the organic solvent has been removed. The organic binder may be removed by the sintering step. The process temperature of the sintering step may be in a range from the glass transition temperature of the glass frit powder to the crystallization temperature of the glass frit powder. Therefore, in the sintering step, the organic binder may be removed without crystallizing the preliminary glass frit sealing member S-IP.

[0112] Then, if Figure 8 As shown in , the inner region of the preliminary frit sealing member S-IP may be crystallized ( S40 ). A portion of the frit paste on which the sintering step has been performed may be crystallized.

[0113] like Fig. 9B As shown in , a region of the preliminary glass frit sealing member S-IP can be irradiated with a laser beam to crystallize the region of the preliminary glass frit sealing member S-IP on which the sintering step has been performed. The region crystallized by the laser source LS can be defined as the inner region S-II. Hereinafter, the region not irradiated by the laser beam will be referred to as the preliminary outer region S-IOP. The glass frit powder of the inner region S-II can be melted by a laser beam, and the molten glass frit can be cooled and crystallized. For example, the glass frit powder of the inner region S-II can be heated to a temperature higher than the crystallization temperature of the glass frit powder of the inner region S-II by a laser beam. The preliminary outer region S-IOP can be a glass frit paste in a dried and sintered state.

[0114] Then, if Figure 8 As shown in , a preliminary organic sealing member S-OP may be formed ( S50 ). The preliminary organic sealing member S-OP may be formed on a surface of one of the first display substrate DS and the second display substrate ES.

[0115] like Fig. 9C As shown in , a preliminary organic sealing member S-OP may be formed on the surface of the first display substrate DS. Fig. 7A As shown in , a preliminary organic sealing member S-OP may be formed on the second insulating layer 20 .

[0116] When viewed in plan view, Figure 3Like the organic sealing member SO shown in FIG. 1 , the preliminary organic sealing member S-OP may have a closed line shape and may be formed to overlap the non-display area NDA. The organic composite may be printed on the surface of the first display substrate DS. The organic composite may include a matrix resin (e.g., epoxy resin) and an organic solvent.

[0117] Then, if Figure 8 and Fig.9D As shown in , the first display substrate DS and the second display substrate ES may be bonded to each other (S60). The preliminary frit sealing member S-IP and the preliminary organic sealing member S-OP may be aligned so that both are disposed between the first display substrate DS and the second display substrate ES, and then the first display substrate DS and the second display substrate ES may be bonded or combined to each other.

[0118] Reference Fig.9D , although the inner edge of the preliminary glass frit sealing member S-IP is shown to be precisely aligned with the outer edge of the preliminary organic sealing member S-OP, the present inventive concept is not limited to this. For example, in order to make the preliminary glass frit sealing member S-IP contact with the preliminary organic sealing member S-OP after the bonding process, the preliminary glass frit sealing member S-IP and the preliminary organic sealing member S-OP can be aligned to overlap each other with a specific overlapping width. Therefore, the first display substrate DS and the second display substrate ES can be combined in such a manner that the preliminary glass frit sealing member S-IP and the preliminary organic sealing member S-OP are arranged between the first display substrate DS and the second display substrate ES in a cross-sectional view, and the preliminary organic sealing member S-OP is arranged to be adjacent to the inner side of the preliminary glass frit sealing member S-IP in a plan view. Here, the inner side is the side close to the center of the first display substrate DS and the second display substrate ES. For example, with Figure 3 Like the glass frit sealing member SI and the organic sealing member SO shown in FIG. 1 , when viewed in a plan view, the preliminary organic sealing member S-OP may be surrounded by the preliminary glass frit sealing member S-IP. In addition, in the step of combining the first display substrate DS and the second display substrate ES, the inner region S-II of the preliminary glass frit sealing member S-IP may be in contact with the preliminary organic sealing member S-OP.

[0119] Afterwards, if Figure 8 and Fig.9E As shown in , the preliminary outer region S-IOP may be crystallized (S70). The preliminary outer region S-IOP may be irradiated with a laser beam using a laser source LS. For example, the preliminary outer region S-IOP may be heated to a temperature higher than a crystallization temperature of the preliminary outer region S-IOP by the laser beam.

[0120] In the step of crystallizing the preliminary outer region S-IOP, the inner region S-II having a previously crystallized structure can be used as a heat-blocking partition. The inner region S-II can block the heat provided to the preliminary outer region S-IOP and can prevent the preliminary organic sealing member S-OP from being damaged by heat. Therefore, the outgassing problem can be prevented from occurring in the preliminary organic sealing member S-OP.

[0121] In an exemplary embodiment of the present inventive concept, the laser source LS may crystallize the preliminary outer region S-IOP and attach the first display substrate DS and the second display substrate ES by irradiating the laser beam onto the preliminary outer region S-IOP between the first display substrate DS and the second display substrate ES through the second display substrate ES. In this case, the preliminary outer region S-IOP may be melted by the laser beam, and the melted preliminary outer region S-IOP may be cooled and crystallized.

[0122] like Fig.9F As shown in , as a result of crystallization of the preliminary outer region S-IOP, a frit sealing member SI in which there is no boundary between the outer region and the inner region can be formed.

[0123] Then, if Figure 8 As shown in , the preliminary organic sealing member S-OP may be cured (S80). A thermal curing or photocuring process may be performed. Fig.9E and Fig.9F As shown in , in this example embodiment, the curing of the preliminary organic sealing member S-OP may be performed after the crystallization of the preliminary outer region S-IOP. However, the inventive concept is not limited thereto. For example, in an example embodiment of the inventive concept, the curing of the preliminary organic sealing member S-OP and the crystallization of the preliminary outer region S-IOP may be performed in a reversed order.

[0124] Fig.10 is a flowchart illustrating a method of manufacturing a display panel DP according to an example embodiment of the inventive concept. FIG. 11A to FIG. 11F 1 is a cross-sectional view showing a method of manufacturing a display panel DP according to an exemplary embodiment of the inventive concept. Figures 8 to 9F The characteristics of the manufacturing method have different characteristics.

[0125] like Fig.10 As shown in , an encapsulation substrate (ie, a second display substrate ES) may be provided (S100). In addition, a display substrate (ie, a first display substrate DS) may be provided (S200). The step S200 of providing the first display substrate DS may precede the step S100 of providing the second display substrate ES. Fig.10 The order of the steps shown in is preferred. However, the present invention is not limited to Fig.10 Many of the steps can also be performed in Fig.10 The steps shown in FIG. 1 are applied to the first display substrate DS and the second display substrate ES before, between, or after the steps shown in FIG.

[0126] Then, if Fig.10 As shown in , a preliminary inner glass frit sealing member or a first preliminary glass frit sealing member S-IP1 and a preliminary outer glass frit sealing member or a second preliminary glass frit sealing member S-IP2 may be formed (S300). For example, the second preliminary glass frit sealing member S-IP2 may be disposed adjacent to the outer side of the first preliminary glass frit sealing member S-IP1. In this example embodiment, the preliminary inner glass frit sealing member S-IP1 and the preliminary outer glass frit sealing member S-IP2 may be formed simultaneously.

[0127] like Fig.11A As shown in, a first glass frit paste for forming a preliminary inner glass frit sealing member S-IP1 and a second glass frit paste for forming a preliminary outer glass frit sealing member S-IP2 may be printed on the surface of the second display substrate ES. The first glass frit paste and the second glass frit paste may include glass frit powder, an organic binder, and an organic solvent. The first glass frit paste and the second glass frit paste may have different chemical compositions from each other.

[0128] The organic solvent may be removed by drying the printed first glass frit paste and the second glass frit paste. The dried first glass frit paste and the dried second glass frit paste may contact each other. Therefore, the first preliminary glass frit sealing member (preliminary inner glass frit sealing member) S-IP1 formed by the first glass frit paste and the second preliminary glass frit sealing member (preliminary outer glass frit sealing member) S-IP2 formed by the second glass frit paste may contact each other. The inventive concept is not limited to a specific method of forming the preliminary inner glass frit sealing member S-IP1 and the preliminary outer glass frit sealing member S-IP2. For example, two combined dispensers or screen printing methods may be used to form the preliminary inner glass frit sealing member S-IP1 and the preliminary outer glass frit sealing member S-IP2.

[0129] The chemical composition of the first glass frit paste and the second glass frit paste may be adjusted to control the crystallization temperature of the preliminary inner glass frit sealing member S-IP1 and the preliminary outer glass frit sealing member S-IP2. The first glass frit paste may have a glass frit powder whose weight ratio of vanadium (V) to zinc (Zn) is lower than the weight ratio of vanadium (V) to zinc (Zn) of the glass frit powder in the second glass frit paste, in which case the preliminary inner glass frit sealing member S-IP1 may have a crystallization temperature that is about 5°C to about 50°C lower than the crystallization temperature of the preliminary outer glass frit sealing member S-IP2. In other words, the weight percentage (wt%) of vanadium (V) contained in the first glass frit paste may be lower than the weight percentage (wt%) of vanadium (V) contained in the second glass frit paste. In this case, the chemical composition of the first glass frit paste and the second glass frit paste may be adjusted so that the crystallization temperature of the preliminary inner glass frit sealing member S-IP1 is lower than the crystallization temperature of the preliminary outer glass frit sealing member S-IP2.

[0130] In an exemplary embodiment of the present inventive concept, a preliminary inner glass frit sealing member S-IP1 and a preliminary outer glass frit sealing member S-IP2 may be sequentially formed on the surface of the second display substrate ES. In an exemplary embodiment of the present inventive concept, one of the preliminary inner glass frit sealing member S-IP1 and the preliminary outer glass frit sealing member S-IP2 may be formed on the surface of the second display substrate ES, and the other of the preliminary inner glass frit sealing member S-IP1 and the preliminary outer glass frit sealing member S-IP2 may be formed on the surface of the first display substrate DS. However, in order to prevent the circuit layer DP-CL and the display element layer DP-OLED from being damaged, the preliminary glass frit sealing members S-IP1 and S-IP2 may be preferably formed on the surface of the second display substrate ES.

[0131] Then, if Fig.10 As shown in , the preliminary inner frit sealing member S-IP1 can be crystallized (S400). In this example embodiment, even when the preliminary inner frit sealing member S-IP1 and the preliminary outer frit sealing member S-IP2 are heated to the same temperature, only the preliminary inner frit sealing member S-IP1 can be selectively crystallized. For example, the crystallization of the first preliminary frit sealing member (preliminary inner frit sealing member) S-IP1 may include heating the first preliminary frit sealing member (preliminary inner frit sealing member) S-IP1 and the second preliminary frit sealing member (preliminary outer frit sealing member) S-IP2.

[0132] like Fig. 11BAs shown in, the preliminary inner glass frit sealing member S-IP1 and the preliminary outer glass frit sealing member S-IP2 can be heated to a specific temperature. The specific temperature can be in the range from the crystallization temperature of the glass frit powder of the preliminary inner glass frit sealing member S-IP1 to the crystallization temperature of the glass frit powder of the preliminary outer glass frit sealing member S-IP2. Because the specific temperature is below the crystallization temperature of the glass frit powder of the preliminary outer glass frit sealing member S-IP2, the preliminary outer glass frit sealing member S-IP2 will not crystallize at the specific temperature.

[0133] Radiant heat may be provided to the preliminary inner frit sealing member S-IP1 and the preliminary outer frit sealing member S-IP2, and only the preliminary inner frit sealing member S-IP1 heated to a temperature higher than its crystallization temperature may be selectively crystallized. In a case where the crystallization temperature of the preliminary inner frit sealing member S-IP1 is in a range from about 240° C. to about 260° C., and the crystallization temperature of the preliminary outer frit sealing member S-IP2 is in a range from about 290° C. to about 310° C., the preliminary inner frit sealing member S-IP1 and the preliminary outer frit sealing member S-IP2 may be heated to a temperature of about 250° C. to about 280° C. In a case where the crystallization temperature of the preliminary inner frit sealing member S-IP1 is within a range from about 390° C. to about 410° C., and the crystallization temperature of the preliminary outer frit sealing member S-IP2 is within a range from about 440° C. to about 460° C., the preliminary inner frit sealing member S-IP1 and the preliminary outer frit sealing member S-IP2 may be heated to a temperature of about 400° C. to about 430° C. The crystallization temperatures of the preliminary inner frit sealing member S-IP1 and the preliminary outer frit sealing member S-IP2 may be measured by differential scanning calorimetry (DSC) or differential thermal analysis (DTA).

[0134] Afterwards, if Fig.10 As shown in , a preliminary organic sealing member S-OP may be formed (S500). The preliminary organic sealing member S-OP may be formed on a surface of one of the first display substrate DS and the second display substrate ES. Fig. 11C As shown in , a preliminary organic sealing member S-OP may be formed on a surface of the first display substrate DS.

[0135] Then, if Fig.10 and Fig.11D As shown in FIG. 5 , the first display substrate DS and the second display substrate ES (encapsulation substrate) may be coupled to each other ( S600 ).

[0136] Afterwards, if Fig.10 and Fig.11EAs shown in , the preliminary outer frit sealing member S-IP2 can be crystallized (S700). The laser source LS can be used to irradiate the preliminary outer frit sealing member S-IP2 with a laser beam. For example, the crystallization of the second preliminary frit sealing member (preliminary outer frit sealing member) S-IP2 may include irradiating the second preliminary frit sealing member (preliminary outer frit sealing member) S-IP2 with a laser beam.

[0137] like Fig.11F As shown in , when the preliminary outer frit sealing member S-IP2 is crystallized, an outer frit sealing member S-IO continuously extending from the inner frit sealing member S-II may be formed. The inner frit sealing member S-II and the outer frit sealing member S-IO may constitute a single frit sealing member.

[0138] Afterwards, if Fig.10 As shown in , the preliminary organic sealing member S-OP may be cured (S800). A thermal curing or photocuring process may be performed. In an exemplary embodiment of the inventive concept, the preliminary organic sealing member S-OP may include epoxy resin, and the epoxy resin may be irradiated with ultraviolet rays and cured to combine the first display substrate DS and the second display substrate ES. Fig.11E and Fig.11F As shown in , in the present exemplary embodiment, after the crystallization of the preliminary outer glass frit sealing member S-IP2, the preliminary organic sealing member S-OP may be solidified. However, the inventive concept is not limited thereto. For example, in an exemplary embodiment of the inventive concept, the solidification of the preliminary organic sealing member S-OP and the crystallization of the preliminary outer glass frit sealing member S-IP2 may be performed in a reversed order.

[0139] Reference Figure 3 , Fig. 7A and Fig.11F In an exemplary embodiment of the present inventive concept, the glass frit sealing member SI and the organic sealing member SO may be disposed between the first display substrate DS and the second display substrate ES, may overlap the non-display area NDA, may surround the display element, and may combine the first display substrate DS and the second display substrate ES. The organic sealing member SO may be closer to the display element than the glass frit sealing member SI and may be surrounded by the glass frit sealing member SI. The glass frit sealing member SI may include an outer glass frit sealing member S-IO and an inner glass frit sealing member S-II, wherein the outer glass frit sealing member S-IO is located at or near the edges of the first display substrate DS and the second display substrate ES, and the inner glass frit sealing member S-II is disposed adjacent to the inner side of the outer glass frit sealing member S-IO and adjacent to the outer side of the organic sealing member SO.

[0140] Fig. 12A 2 is a plan view of a first working substrate WS1 illustrating a process for manufacturing a display panel DP according to an example embodiment of the inventive concept. Fig. 12B 2 is a plan view of a second working substrate WS2 illustrating a process for manufacturing a display panel DP according to an example embodiment of the inventive concept.

[0141] Fig. 12A Each of the first unit regions US1 shown in FIG. Figures 1 to 11F The same process may be performed on each of the first unit regions US1 to form a circuit layer DP-CL and a display element layer DP-OLED in each of the first unit regions US1.

[0142] exist Fig. 12A , wherein each of the preliminary organic sealing members S-OP is formed in a corresponding one of the first unit regions US1. Fig. 9C The steps described correspond.

[0143] Fig. 12B Each of the second unit regions US2 shown in FIG. Figures 1 to 11F The second display substrate ES described above corresponds to one of the following. Fig. 12B , wherein each of the preliminary frit sealing members S-IP is formed in a corresponding one of the second unit regions US2. Fig. 9B The steps described correspond.

[0144] The first working substrate WS1 and the second working substrate WS2 may be combined with each other to perform Fig.9D You can perform the following steps on each cell area in the work panel: Fig.9E and Fig.9F The preliminary organic sealing member S-OP may be solidified, and the entire preliminary frit sealing member S-IP may be crystallized. Here, the working panel may refer to a first working substrate WS1 and a second working substrate WS2 that are combined with each other. Next, a display panel may be formed by dividing the unit regions of the working panel.

[0145] The first working substrate WS1 and the second working substrate WS2 can also be used to perform the above-mentioned Figures 10 to 11F A process for manufacturing a display panel is described.

[0146] Because the inner region of the glass frit sealing member is pre-crystallized as described above, the inner region can be used as a heat-blocking partition in the step of crystallizing the outer region. Therefore, the organic sealing member can be protected from the influence of the heat provided for the step of crystallizing the outer region, thereby preventing the organic sealing member from being damaged by heat. In addition, the outgassing problem can be prevented from occurring in the organic sealing member.

[0147] In addition, because the display panel includes two types of glass frit sealing components, the organic sealing component can be prevented from being damaged in the manufacturing process. Because the inner area of ​​the glass frit sealing component is crystallized by a sintering process, it is easy to control the inner area used as a heat-resistant partition. Therefore, the organic sealing component can be prevented from being damaged by heat, and the outgassing problem can be prevented from occurring in the organic sealing component. The glass frit sealing component can prevent oxygen and / or moisture from entering the center of the unit area, and can enhance the bonding strength between the first unit area US1 of the first working substrate WS1 and the second unit area US2 of the second working substrate WS2. The organic sealing component can prevent crack formation and crack propagation in a certain part or parts of the first unit area US1 and the second unit area US2.

[0148] While example embodiments of the inventive concept have been particularly shown and described, it will be understood by those skilled in the art that changes in form and details may be made therein without departing from the spirit and scope of the inventive concept as defined by the claims.

Claims

1. A method for manufacturing a display panel, the method comprising the following steps: Providing a first display substrate and a second display substrate, at least one of the first display substrate and the second display substrate comprises a display area and a non-display area adjacent to the display area; forming a preliminary frit sealing member on a surface of one of the first display substrate and the second display substrate and corresponding to the non-display area, the preliminary frit sealing member including an outer area and an inner area; crystallizing the inner region of the preliminary frit seal member; forming a preliminary organic sealing member on a surface of one of the first display substrate and the second display substrate; combining the first display substrate and the second display substrate so that the preliminary frit sealing member and the preliminary organic sealing member are disposed between the first display substrate and the second display substrate in a cross-sectional view, and the preliminary organic sealing member is disposed immediately inside the preliminary frit sealing member in a plan view; crystallizing the outer region of the preliminary frit seal member; as well as The preliminary organic sealing member is cured.

2. The method according to claim 1, wherein: The step of crystallizing the inner region includes irradiating the inner region with a laser beam.

3. The method according to claim 1, wherein: In the step of forming the preliminary frit sealing member, the preliminary frit sealing member is formed on a surface of the second display substrate, and In the step of forming the preliminary organic sealing member, the preliminary organic sealing member is formed on a surface of the first display substrate.

4. The method according to claim 1, wherein: In the step of bonding the first display substrate and the second display substrate, the inner region of the preliminary frit sealing member is in contact with the preliminary organic sealing member.

5. A method for manufacturing a display panel, the method comprising the following steps: Providing a first display substrate and a second display substrate, at least one of the first display substrate and the second display substrate includes a display area provided with pixels and a non-display area adjacent to the display area; forming a first preliminary frit sealing member on a surface of one of the first display substrate and the second display substrate and corresponding to the non-display area; forming a second preliminary frit sealing member on the surface of the one of the first display substrate and the second display substrate and corresponding to the non-display area so that the second preliminary frit sealing member is disposed immediately outside the first preliminary frit sealing member in a plan view; crystallizing the first preliminary frit seal member; forming a preliminary organic sealing member on a surface of one of the second display substrate and the first display substrate and corresponding to the non-display area; combining the first display substrate and the second display substrate so that the first preliminary frit sealing member, the second preliminary frit sealing member, and the preliminary organic sealing member are disposed between the first display substrate and the second display substrate in a cross-sectional view, and so that the preliminary organic sealing member is disposed immediately inside the first preliminary frit sealing member in a plan view; crystallizing the second preliminary frit seal member; as well as The preliminary organic sealing member is cured.

6. The method according to claim 5, wherein: A weight ratio of vanadium to zinc in the first preliminary frit sealing member is lower than a weight ratio of vanadium to zinc in the second preliminary frit sealing member.

7. The method according to claim 5, wherein: The first preliminary frit sealing member and the second preliminary frit sealing member are simultaneously formed on a surface of the second display substrate.

8. The method according to claim 5, wherein: The first preliminary frit sealing member and the second preliminary frit sealing member are in contact with each other.

9. The method according to claim 5, wherein: The step of crystallizing the first preliminary frit seal member includes heating the first preliminary frit seal member and the second preliminary frit seal member.

10. The method according to claim 9, wherein: The crystallization temperature of the first preliminary frit sealing member is 5° C. to 50° C. lower than the crystallization temperature of the second preliminary frit sealing member.

11. The method according to claim 9, wherein: A crystallization temperature of the first preliminary frit sealing member is in a range from 240°C to 260°C, and a crystallization temperature of the second preliminary frit sealing member is in a range from 290°C to 310°C.

12. The method according to claim 11, wherein: In the step of heating the first preliminary frit sealing member and the second preliminary frit sealing member, the first preliminary frit sealing member and the second preliminary frit sealing member are heated to a temperature ranging from 250°C to 280°C.

13. The method according to claim 9, wherein: A crystallization temperature of the first preliminary frit sealing member is in a range from 390°C to 410°C, and a crystallization temperature of the second preliminary frit sealing member is in a range from 440°C to 460°C.

14. The method according to claim 13, wherein: In the step of heating the first preliminary frit sealing member and the second preliminary frit sealing member, the first preliminary frit sealing member and the second preliminary frit sealing member are heated to a temperature ranging from 400°C to 430°C.

15. The method according to claim 5, wherein: The step of crystallizing the second preliminary frit sealing member includes irradiating the second preliminary frit sealing member with a laser beam.

16. A display panel, comprising: A first display substrate, comprising a base substrate, a circuit layer and a display element, wherein the base substrate comprises a display area and a non-display area, the circuit layer is arranged on the base substrate, and the display element is arranged on the circuit layer and overlaps the display area; A second display substrate, disposed above the first display substrate; as well as a sealing member to combine the first display substrate and the second display substrate, The sealing component includes: a glass frit sealing component including an outer region and an inner region, wherein the inner region is arranged adjacent to the inner side of the outer region, and the inner region has a first crystallization temperature lower than a second crystallization temperature of the outer region; and an organic sealing component arranged adjacent to the inner side of the glass frit sealing component.

17. The display panel according to claim 16, wherein: The first crystallization temperature of the inner region is 5° C. to 50° C. lower than the second crystallization temperature of the outer region.

18. The display panel according to claim 16, wherein: The circuit layer includes an inorganic layer, and The frit sealing member contacts a bottom surface of the second display substrate and the inorganic layer.

19. The display panel according to claim 16, wherein: The circuit layer includes an inorganic layer, The second display substrate includes a glass substrate and a buffer layer, and the buffer layer is disposed on a bottom surface of the glass substrate, and The frit sealing member is in contact with the inorganic layer and the buffer layer.

20. The display panel according to claim 16, wherein: The display element includes an organic light emitting element, The first display substrate further includes a pixel defining layer, the pixel defining layer including an edge portion and a central portion, the edge portion overlaps the non-display area, the central portion overlaps the display area and is disposed on the circuit layer, An opening corresponding to the organic light emitting element is defined in the central portion, and The organic sealing member is in contact with the edge portion.

21. The display panel according to claim 20, wherein: The circuit layer includes a power supply electrode overlapping the edge portion and electrically connected to the organic light emitting element.

22. The display panel according to claim 16, wherein: The weight ratio of vanadium to zinc in the inner region is lower than the weight ratio of vanadium to zinc in the outer region.

23. A display panel, comprising: A first display substrate, comprising a base substrate, a circuit layer and a display element, wherein the base substrate comprises a display area and a non-display area, the circuit layer is arranged on the base substrate, and the display element is arranged on the circuit layer and overlaps the display area; A second display substrate, disposed above the first display substrate; as well as a frit sealing member and an organic sealing member disposed between the first display substrate and the second display substrate, overlapping the non-display area, surrounding the display element, and bonding the first display substrate and the second display substrate, wherein the organic sealing member is closer to the display element than the frit sealing member, and the organic sealing member is surrounded by the frit sealing member, The frit sealing member includes an outer frit sealing member and an inner frit sealing member, the outer frit sealing member being located at or near edges of the first display substrate and the second display substrate, the inner frit sealing member being disposed adjacent to an inner side of the outer frit sealing member and adjacent to an outer side of the organic sealing member, and The frit seal member includes vanadium and zinc, and a weight ratio of vanadium to zinc in the inner frit seal member is lower than a weight ratio of vanadium to zinc in the outer frit seal member.

24. The display panel according to claim 23, wherein: The frit sealing member includes silver.

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