Headphone bass enhancement device and headphone with the same

Abstract

The present invention provides a headphone bass enhancement device, including a back cavity and a back cover; a first hole and a first groove are provided on the back cavity, the first groove is provided along the circumference of the first hole, and one end of the first groove is connected to the first hole, and the other end is connected to the external environment on any side of the back cavity; the back cover is tightly fitted with a side of the back cavity provided with the first groove, so that the first groove constitutes a sound outlet channel connecting the first hole and the external environment; the first hole is used to communicate with the back cavity of the headphone. With such a configuration, the low-frequency sound generated by the back cavity of the headphone is output to the environment after passing through a longer channel, so that the low-frequency sound output by the front and rear sound cavities of the headphone has a certain time difference, thereby reducing the impact of the low-frequency short circuit, enhancing the low-frequency effect of the headphone, and improving the sound quality. In addition, the damping effect of the sound channel itself can be used to ensure that the transient response of the speaker is not affected, thereby taking into account that the high-frequency sound in the headphone speaker is not affected.

Description

Technical Field

[0001] The present invention relates to the technical field of earphones, and in particular to an earphone bass enhancement device and an earphone with the device. Background Art

[0002] Disclaimer: Throughout the specification, any discussion of the background art should in no way be considered as an admission that such art is well known or forms part of the common general knowledge in the field.

[0003] Flat-head headphones do not produce a sense of tightness and pressure on the ears, so they are more comfortable to use and have always been the most comfortable and natural headphone design for wearing experience. At present, the acoustic design of flat-head headphones has always been to use a 14mm-15mm diameter dynamic speaker, add a cover in front of the speaker outlet to prevent the speaker diaphragm from directly touching the human ear, that is, a headphone structure with an open outlet, and then design air holes on the back shell of the speaker's back cavity, and attach air volume control damping inside for tuning. This traditional design method will inevitably have the following two problems or defects:

[0004] 1. There will be a serious lack of bass problem.

[0005] Since the distance between the sound outlet in front of the speaker and the air vent loop at the back of the speaker is relatively close, and the phase of the sound waves generated by the front and back of the speaker diaphragm is always opposite, it is easy to cause sound wave interference, resulting in a short circuit in the low-frequency loop, leading to low-frequency cancellation problems, and making the bass volume seriously insufficient.

[0006] 2. The transient response of the speaker will slow down

[0007] In order to reduce the problem of insufficient low-frequency volume caused by the low-frequency short circuit between the front sound outlet of the speaker and the air vent of the rear cavity of the speaker, it is necessary to adjust the damping of the air vents on the rear shell of the speaker and increase the low-frequency volume by reducing the air permeability of the damping. However, the low-frequency volume and transient response are inversely proportional to the air permeability of the damping. The larger the damping air volume, the better the low frequency will be, but the transient response will be slower (worse), resulting in the sound quality of the bass, midrange and treble bands of music cannot be perfectly expressed. Summary of the invention

[0008] Based on the above, in order to address the deficiencies of the prior art, a headphone bass enhancement device is provided which can improve the bass volume while taking transient response into consideration.

[0009] In addition, the present invention also provides a headset having the above-mentioned bass enhancement device.

[0010] A headphone bass enhancement device comprises a first back cavity body and a back cover; the first back cavity body is provided with a first hole and a first groove, the first end face of the first groove is connected to the first hole, and the second end face is connected to the external environment on any side of the first back cavity body; the back cover is tightly fitted to the first back cavity body, so that a sound outlet channel connecting the first hole and the external environment is formed between the first groove and the back cover; the first hole is used to communicate with the back cavity of the headphone.

[0011] In one embodiment, the first groove is a spiral groove.

[0012] In one of the embodiments, a second hole is disposed on the first back cavity body; the first groove is connected to the external environment of the back cavity body through the second hole.

[0013] In one of the embodiments, the first hole is a through hole or a blind hole.

[0014] In one of the embodiments, a connecting portion for connecting to the earphone rear cavity is disposed on the first back cavity body; the connecting portion is sealedly connected to the shell of the earphone rear cavity.

[0015] In one embodiment, the shape of the back cover is the same as that of the first groove, so that the back cover can be embedded in the first groove and form a sound outlet channel connecting the first hole with the external environment.

[0016] In one embodiment, the first groove is arranged along the circumference of the first hole.

[0017] In one embodiment, the center line of the first groove is zigzag or serpentine.

[0018] In one embodiment, the back cover is a planar cover.

[0019] The earphone bass enhancement device provided above forms a narrow and long sound channel by combining the first back cavity and the back cover, so that the low-frequency sound generated by the earphone back cavity with the opposite phase to the sound wave of the earphone front cavity is output to the environment after passing through the longer sound channel, so that a time difference is generated between the low-frequency sound output from the front and rear sound cavities of the earphone to the environment, thereby ensuring that the low-frequency sound output from the front cavity is not affected by the low-frequency sound with the opposite phase output from the rear cavity, or reducing the influence of the low-frequency sound with the opposite phase output from the rear cavity on the low-frequency sound output from the front cavity. In addition, the sound channel, that is, the damping effect of the air circuit itself, can be used to ensure that the transient response of the speaker is not affected, thereby enhancing the low-frequency sound effect of the earphone while taking into account that the high-frequency sound of the earphone speaker is not affected. The low-frequency effect of the earphone sound is enhanced and the sound quality of the earphone is improved.

[0020] According to the above content, the present invention also provides another headphone bass enhancement device.

[0021] A headphone bass enhancement device comprises a first back cavity body and a back cover; a first hole and a first groove are provided on the first back cavity body, a first end face of the first groove is connected to the first hole, and a distance between the second end face and any side of the first back cavity body is greater than 0; a third hole is provided on the back cover; the third hole is a through hole; the back cover fits tightly with the first back cavity body, and the third hole is connected to the first groove, so that a sound outlet channel connecting the first hole and the external environment is formed between the first groove and the back cover; the first hole is used to communicate with the back cavity of the headphone.

[0022] In one embodiment, the first groove is a spiral groove.

[0023] The above-mentioned earphone bass enhancement device forms a narrow and long sound channel by combining the first back cavity and the back cover, so that the low-frequency sound generated by the earphone back cavity with the opposite phase to the sound wave of the earphone front cavity is output to the environment after passing through the longer sound channel, thereby causing a time difference between the low-frequency sound output from the front and rear sound cavities of the earphone to the environment, thereby ensuring that the low-frequency sound output from the front cavity is not affected by the low-frequency sound with the opposite phase output from the back cavity, or reducing the influence of the low-frequency sound with the opposite phase output from the back cavity on the low-frequency sound output from the front cavity. In addition, the sound channel, that is, the damping effect of the air circuit itself, can be used to ensure that the transient response of the speaker is not affected, thereby enhancing the low-frequency sound effect of the earphone while taking into account that the high-frequency sound of the earphone speaker is not affected. The low-frequency effect of the earphone sound is enhanced and the sound quality of the earphone is improved.

[0024] According to the above content, the present invention also provides another headphone bass enhancement device.

[0025] A headphone bass enhancement device comprises a first back cavity body and a back cover; the first back cavity body is provided with a first hole, a first groove and a second groove; the first groove is an arc-shaped groove; the first end face of the first groove is connected to the first hole through the second groove, and the distance between the second end face and any side of the first back cavity body is greater than 0; a third hole is provided on the back cover; the third hole is a through hole; the back cover is connected to the first back cavity body bearing, and the third hole is connected to the first groove, so that the back cover and the first back cavity can rotate relative to each other, thereby changing the length of the sound outlet channel between the third hole and the first hole; the first back cavity body is provided with a There are a first annular sealing portion and a second annular sealing portion; a third annular sealing portion and a fourth annular sealing portion are arranged on the back cover; the first annular sealing portion and the third annular sealing portion constitute a first annular sound wave sealing structure to hinder the radial propagation of sound along the first groove; the second annular sealing portion and the fourth annular sealing portion constitute a second annular sound wave sealing structure to hinder the radial propagation of sound along the first groove; the annular diameters of the first annular sealing portion and the third annular sealing portion are both larger than the outer circumferential diameter of the first groove; the annular diameters of the second annular sealing portion and the fourth annular sealing portion are both smaller than the inner circumferential diameter of the first groove.

[0026] In one embodiment, the first annular sealing portion is an annular boss, the third annular sealing portion is an annular boss, and the diameter of the annular boss of the first annular sealing portion is greater than or smaller than the diameter of the annular boss of the third annular sealing portion. During installation and use, the rotation axis of the annular boss of the first annular sealing portion coincides with the rotation axis of the annular boss of the third annular sealing portion.

[0027] In one embodiment, the first annular sealing portion is an annular boss, the third annular sealing portion is an annular groove, and the diameter of the annular boss of the first annular sealing portion is equal to the diameter of the annular groove of the third annular sealing portion. During installation and use, the rotation axis of the annular boss of the first annular sealing portion coincides with the rotation axis of the annular groove of the third annular sealing portion.

[0028] In one embodiment, the first annular sealing portion is an annular groove, the third annular sealing portion is an annular boss, and the diameter of the annular groove of the first annular sealing portion is equal to the diameter of the annular boss of the third annular sealing portion. During installation and use, the rotation axis of the annular groove of the first annular sealing portion coincides with the rotation axis of the annular boss of the third annular sealing portion.

[0029] In one embodiment, the first annular sealing portion includes an annular groove and an annular boss with the same center, and the third annular sealing portion includes an annular boss and annular groove with the same center, and the diameter of the annular groove of the first annular sealing portion is equal to the diameter of the annular boss of the third annular sealing portion, and the diameter of the annular boss of the first annular sealing portion is equal to the diameter of the annular groove of the third annular sealing portion, so that they mesh with each other to form a labyrinth sealing structure.

[0030] In one embodiment, the second annular sealing portion is an annular boss, the fourth annular sealing portion is an annular boss, and the diameter of the annular boss of the second annular sealing portion is greater than or less than the diameter of the annular boss of the fourth annular sealing portion. During installation and use, the rotation axis of the annular boss of the second annular sealing portion coincides with the rotation axis of the annular boss of the fourth annular sealing portion.

[0031] In one embodiment, the second annular sealing portion is an annular boss, the fourth annular sealing portion is an annular groove, and the diameter of the annular boss of the second annular sealing portion is equal to the diameter of the annular groove of the fourth annular sealing portion. During installation and use, the rotation axis of the annular boss of the second annular sealing portion coincides with the rotation axis of the annular groove of the fourth annular sealing portion.

[0032] In one embodiment, the second annular sealing portion is an annular groove, the fourth annular sealing portion is an annular boss, and the diameter of the annular groove of the second annular sealing portion is equal to the diameter of the annular boss of the fourth annular sealing portion. During installation and use, the rotation axis of the annular groove of the second annular sealing portion coincides with the rotation axis of the annular boss of the fourth annular sealing portion.

[0033] In one embodiment, the second annular sealing portion includes an annular groove and an annular boss with the same center, and the fourth annular sealing portion includes an annular boss and annular groove with the same center, and the diameter of the annular groove of the second annular sealing portion is equal to the diameter of the annular boss of the fourth annular sealing portion, and the diameter of the annular boss of the second annular sealing portion is equal to the diameter of the annular groove of the fourth annular sealing portion, so that they mesh with each other to form a labyrinth sealing structure.

[0034] In one embodiment, a circular arc-shaped sealing portion is further provided on the first back cavity body, and a fifth circular ring-shaped sealing portion is further provided on the back cover; the circular arc-shaped sealing portion and the fifth circular ring-shaped sealing portion constitute a circular arc-shaped acoustic wave sealing structure; the diameters of the circular arc-shaped sealing portion and the fifth circular ring-shaped sealing portion are both larger than the circular ring diameters of the second circular ring-shaped sealing portion and the fourth circular ring-shaped sealing portion, and smaller than the inner circumference diameter of the first groove.

[0035] In one embodiment, the first annular acoustic wave sealing structure and the second annular acoustic wave sealing structure are labyrinth sealing structures.

[0036] In one embodiment, the arc-shaped sealing portion is an arc-shaped boss, the fifth annular sealing portion is an annular boss, and the diameter of the arc-shaped boss of the arc-shaped sealing portion is greater than or less than the diameter of the annular boss of the fifth annular sealing portion. During installation and use, the rotation axis of the annular arc boss of the arc-shaped sealing portion coincides with the rotation axis of the annular boss of the fifth annular sealing portion.

[0037] In one embodiment, the arc-shaped sealing portion is an arc-shaped boss, the fifth annular sealing portion is an annular groove, and the diameter of the arc-shaped boss of the arc-shaped sealing portion is equal to the diameter of the annular groove of the fifth annular sealing portion. During installation and use, the rotation axis of the arc-shaped boss of the arc-shaped sealing portion coincides with the rotation axis of the annular groove of the fifth annular sealing portion.

[0038] In one embodiment, the first arc-shaped sealing portion is an arc-shaped groove, the fifth annular sealing portion is an annular boss, and the diameter of the arc-shaped groove of the arc-shaped sealing portion is equal to the diameter of the annular boss of the fifth annular sealing portion. During installation and use, the rotation axis of the arc-shaped groove of the arc-shaped sealing portion coincides with the rotation axis of the annular boss of the fifth annular sealing portion.

[0039] In one embodiment, the arc-shaped sealing portion includes an arc-shaped groove and an arc-shaped boss with the same center, and the fifth annular sealing portion includes an annular boss and an annular groove with the same center, and the diameter of the arc-shaped groove of the arc-shaped sealing portion is equal to the diameter of the annular boss of the fifth annular sealing portion, and the diameter of the arc-shaped boss of the arc-shaped sealing portion is equal to the diameter of the annular groove of the fifth annular sealing portion, so that they mesh with each other to form a labyrinth sealing structure.

[0040] In one embodiment, the first annular sonic sealing structure and the second annular sonic sealing structure are oil film sealing structures.

[0041] The above-mentioned earphone bass enhancement device forms a narrow and long sound channel by combining the first back cavity and the back cover, so that the low-frequency sound generated by the earphone back cavity with the opposite phase to the sound wave of the earphone front cavity is output to the environment after passing through the longer sound channel, thereby causing a time difference between the low-frequency sound output from the front and rear sound cavities of the earphone to the environment, thereby ensuring that the low-frequency sound output from the front cavity is not affected by the low-frequency sound with the opposite phase output from the back cavity, or reducing the influence of the low-frequency sound with the opposite phase output from the back cavity on the low-frequency sound output from the front cavity. In addition, the sound channel, that is, the damping effect of the air circuit itself, can be used to ensure that the transient response of the speaker is not affected, thereby enhancing the low-frequency sound effect of the earphone while taking into account that the high-frequency sound of the earphone speaker is not affected. The low-frequency effect of the earphone sound is enhanced and the sound quality of the earphone is improved.

[0042] In addition, the length of the sound channel can be changed by the rotation design of the back cover, so that the headphone bass enhancement device provided by the solution of the present invention can adapt to the adjustment of a wider frequency.

[0043] According to the above content, the present invention also provides another headphone bass enhancement device.

[0044] A headphone bass enhancement device, comprising a first back cavity, a second back cavity and a back cover; a first hole and a first groove are provided on the first back cavity, a first end face of the first groove is connected to the first hole, and a distance between the second end face and any side of the first back cavity is greater than 0; a fourth hole, a fifth hole and a third groove are provided on the second back cavity, a first end face of the third groove is connected to the fourth hole, and a second end face is connected to the fifth hole; the fifth hole is connected to the first groove; the second back cavity is tightly fitted with the first back cavity, so that a sound outlet channel connecting the first hole and the fifth hole is formed between the first groove and the second back cavity; a sixth hole is provided on the back cover; the sixth hole is a through hole; the back cover is tightly fitted with the second back cavity, and the sixth hole is connected to the fourth hole, so that a sound outlet channel connecting the fifth hole and the external environment is formed between the third groove and the back cover; the first hole is used to communicate with the back cavity of the headphone.

[0045] In one of the embodiments, the back cover is further provided with a seventh hole connected to the third groove; the seventh hole is a through hole; the back cover is also provided with a switch for controlling the opening and closing of the seventh hole.

[0046] In one embodiment, the back cover is also provided with a seventh hole connected to the third groove; the seventh hole is a through hole; and also includes a switch; the switch is used to control the opening and closing of the seventh hole; the switch is also used to control the opening and closing of the sound channel between the fifth hole and the fourth hole.

[0047] The earphone bass enhancement device provided above is provided with narrow and long sound channels on the first back cavity and the second back cavity respectively, and uses a hole to connect the two narrow and long sound channels to form a longer sound channel when the first back cavity and the second back cavity are attached to each other, so that when the space range is limited, the sound channel that meets the length requirement is designed by using this structure. The low-frequency sound generated by the earphone rear cavity with the opposite phase to the sound wave of the earphone front cavity is output to the environment after passing through the longer sound channel, so that the low-frequency sound output from the front and rear sound cavities of the earphone to the environment produces a designed time difference, so as to ensure that the low-frequency sound output from the front cavity is not affected by the low-frequency sound of the opposite phase output from the rear cavity, or reduce the influence of the low-frequency sound of the opposite phase output from the rear cavity on the low-frequency sound output from the front cavity, thereby enhancing the low-frequency effect of the earphone sound, thereby improving the sound quality of the earphone.

[0048] In addition, the sound channel, that is, the damping effect of the air circuit itself, can be used to ensure that the transient response of the speaker is not affected, thereby enhancing the low-frequency sound effect of the headphones while ensuring that the mid- and high-frequency sounds of the headphone speakers are not affected.

[0049] According to the above content, the present invention also provides another headphone bass enhancement device.

[0050] A headphone bass enhancement device comprises a third back cavity body; an eighth hole and a ninth hole are arranged on the third back cavity body, a first end face of the ninth hole is connected to the eighth hole, and a second end face is connected to the external environment on any side of the third back cavity body, so that the ninth hole constitutes a sound output channel connecting the eighth hole and the external environment; the back cavity body is an integrally formed structure.

[0051] The earphone bass enhancement device provided above forms a narrow and long sound channel by combining the third back cavity and the back cover, so that the low-frequency sound generated by the earphone rear cavity with the opposite phase to the sound wave of the earphone front cavity is output to the environment after passing through the longer sound channel, thereby causing a time difference between the low-frequency sound output from the front and rear sound cavities of the earphone to the environment, thereby ensuring that the low-frequency sound output from the front cavity is not affected by the low-frequency sound of the opposite phase output from the rear cavity, or reducing the influence of the low-frequency sound of the opposite phase output from the rear cavity on the low-frequency sound output from the front cavity. In addition, the sound channel, that is, the damping effect of the air circuit itself, can be used to ensure that the transient response of the speaker is not affected, thereby enhancing the low-frequency sound effect of the earphone while taking into account that the high-frequency sound of the earphone speaker is not affected. At the same time, the earphone bass enhancement device of the present invention can obtain better sealing through integrated molding technology (such as wax mold casting method and 3D printing technology).

[0052] According to the above content, the present invention also provides another earphone.

[0053] An earphone comprises the earphone bass enhancement device described in any one of the above embodiments.

[0054] In one of the embodiments, the first back cavity body and the earphone back cavity are an integrally formed structure.

[0055] In one of the embodiments, the third back cavity body and the earphone back cavity are an integrally formed structure.

[0056] The earphones provided above are provided with an earphone bass enhancement device so that the low-frequency sound generated by the earphone rear cavity with the opposite phase to the sound wave of the earphone front cavity is output to the environment after passing through a longer sound channel, thereby causing a time difference between the low-frequency sound output from the front and rear sound cavities of the earphone to the environment, thereby ensuring that the low-frequency sound output from the front cavity is not affected by the low-frequency sound with the opposite phase output from the rear cavity, or reducing the influence of the low-frequency sound with the opposite phase output from the rear cavity on the low-frequency sound output from the front cavity. The low-frequency effect of the earphone sound is enhanced, thereby improving the sound quality of the earphone. In addition, the sound channel, that is, the damping effect of the air circuit itself, can be used to ensure that the transient response of the speaker is not affected, thereby enhancing the low-frequency sound effect of the earphone while taking into account that the high-frequency sound of the earphone speaker is not affected.

[0057] In the above content, at least in some embodiments, the purpose of the present invention is to overcome or improve at least one disadvantage of the prior art, or to provide a useful alternative. The collection of overview embodiments provided is to predict potential patent claims based on the selection of technical features disclosed in the following "Detailed Description", and these collections of overview embodiments are not intended to limit the scope of the claims that can be expanded in any way. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] Figure 1 A schematic diagram of the three-dimensional structure of a headphone bass enhancement device provided by an embodiment;

[0059] Figure 2 A schematic diagram of a partial cross-sectional structure of the back side of a headphone bass enhancement device provided by an embodiment;

[0060] Figure 3 A schematic diagram of the AA cross-sectional structure of a headphone bass enhancement device provided by an embodiment;

[0061] Figure 4 A schematic diagram of a partial cross-sectional structure of the back side of a headphone bass enhancement device provided by an embodiment;

[0062] Figure 5 A schematic diagram of the BB cross-sectional structure of a headphone bass enhancement device provided by an embodiment;

[0063] Figure 6 A schematic diagram of the back structure of a headphone bass enhancement device provided by an embodiment;

[0064] Figure 7 A schematic diagram of the cross-sectional structure of a headphone bass enhancement device CC provided by an embodiment;

[0065] Figure 8 A schematic diagram of the back structure of a headphone bass enhancement device provided by an embodiment;

[0066] Fig. 9 A schematic cross-sectional structure diagram of a headphone bass enhancement device DD provided in an embodiment;

[0067] Fig.10 A schematic diagram of the structure of a back cover of a headphone bass enhancement device provided by an embodiment;

[0068] Fig.11 A schematic diagram of the structure of a back cover of a headphone bass enhancement device provided by an embodiment;

[0069] Fig.12 A schematic diagram of the structure of a back cover of a headphone bass enhancement device provided by an embodiment;

[0070] Fig.13 A schematic diagram of the structure of a back cover of a headphone bass enhancement device provided by an embodiment;

[0071] Fig.14 A schematic diagram of the structure of a back cover of a headphone bass enhancement device provided by an embodiment;

[0072] Fig.15 A schematic diagram of the three-dimensional structure of a headphone bass enhancement device provided by an embodiment;

[0073] Fig.16 A schematic diagram of the back structure of a headphone bass enhancement device provided by an embodiment;

[0074] Fig.17 A schematic diagram of the back structure of a headphone bass enhancement device provided by an embodiment;

[0075] Fig.18 A schematic cross-sectional structure diagram of an earphone bass enhancement device EE provided in an embodiment;

[0076] Fig.19 A schematic diagram of the back structure of a headphone bass enhancement device provided by an embodiment;

[0077] Fig. 20 A schematic diagram of the three-dimensional structure of the back cavity of a headphone bass enhancement device provided by an embodiment;

[0078] Fig.21 A schematic diagram of the back structure of a back cavity of a headphone bass enhancement device provided by an embodiment;

[0079] Fig. 22A schematic diagram of the FF cross-sectional structure of a headphone bass enhancement device provided by an embodiment;

[0080] Fig.23 It is a schematic diagram of an enlarged section A of the FF structure of a headphone bass enhancement device provided by an embodiment;

[0081] Fig.24 A schematic diagram of the back structure of a back cover of a headphone bass enhancement device provided by an embodiment;

[0082] Fig.25 A schematic cross-sectional structure diagram of a headphone bass enhancement device provided with two mutually superimposed back cavities provided in an embodiment;

[0083] Fig.26 A schematic diagram of the back structure of a first back cavity of an earphone bass enhancement device provided with two mutually superimposed back cavities provided in an embodiment;

[0084] Fig. 27 A schematic cross-sectional structure diagram of a headphone bass enhancement device provided with two mutually superimposed back cavities provided in an embodiment;

[0085] Fig.28 A schematic diagram of the back structure of a first back cavity of an earphone bass enhancement device provided with two mutually superimposed back cavities provided in an embodiment;

[0086] Fig.29 A schematic cross-sectional structure diagram of a headphone bass enhancement device provided with two mutually superimposed back cavities provided in an embodiment;

[0087] Fig.30 A schematic cross-sectional structure diagram of a headphone bass enhancement device provided with two mutually superimposed back cavities provided in an embodiment;

[0088] Fig.31 This is a schematic diagram of an integrated structure of a headphone bass enhancement device provided by an embodiment;

[0089] Fig.32 This is a schematic diagram of a left-side cross-sectional structure of an integrated headphone bass enhancement device provided by an embodiment;

[0090] Fig.33 This is a schematic diagram of an integrated structure of a headphone bass enhancement device provided by an embodiment;

[0091] Fig.34 This is a schematic diagram of a left-side cross-sectional structure of an integrated headphone bass enhancement device provided by an embodiment;

[0092] Fig.35 The present invention is a schematic diagram of a front cross-sectional structure of an earphone provided with an earphone bass enhancement device provided in an embodiment.

[0093] Explanation of the accompanying drawings: 100. First back cavity; 110. First hole; 111. Second hole; 120. First groove; 121. Second groove; 130. Bearing mounting seat; 140. First annular sealing portion; 141. Second annular sealing portion; 142. Arc-shaped sealing portion; 200. Back cover; 210. Third hole; 211. Bearing mounting seat; 220. Third annular sealing portion; 230. Fourth annular sealing portion; 240. Fifth annular sealing portion; 250. Sixth hole; 260. Seventh hole; 300. Bearing; 400. Second back cavity; 410. Fourth hole; 420. Fifth hole; 430. Third groove; 500. Switch; 600. Third back cavity; 610. Eighth hole; 611. Tenth hole; 620. Ninth hole. DETAILED DESCRIPTION

[0094] In this patent document, the following discussion Figure 1-35 The various embodiments used to describe the principles or methods of the present disclosure are for illustration only and should not be interpreted as limiting the scope of the present disclosure in any way. It should be understood by those skilled in the art that the principles or methods of the present disclosure can be implemented in any appropriately arranged earphone or earphone accessory structure. With reference to the accompanying drawings, the preferred embodiments of the present disclosure will be described below. In the following description, detailed descriptions of well-known functions or configurations will be omitted so as not to obscure the subject matter of the present disclosure with unnecessary details. Moreover, the terms used herein will be defined according to the functions of the present invention. Therefore, the terms may vary depending on the intention or usage of the user or operator. Therefore, the terms used herein must be understood based on the description made herein.

[0095] A headphone bass enhancement device, such as Figure 1 or Figure 2As shown, it includes a first back cavity body 100 and a back cover 200. The first back cavity body 100 is provided with a first hole 110 and a first groove 120, the first end face of the first groove 120 is connected to the first hole 110, and the second end face is connected to the external environment on any side of the first back cavity body 100. The back cover 200 fits tightly with the first back cavity body 100, so that a sound outlet channel connecting the first hole 110 and the external environment is formed between the first groove 120 and the back cover 200. The first hole 110 is used to communicate with the back cavity of the earphone. The second end face of the above-mentioned first groove 120 directly extends to any side of the first back cavity body 100. In this way, the first back cavity body 100 and the back cover 200 are combined to form a narrow and long sound channel, so that the low-frequency sound generated by the earphone back cavity with the opposite phase to the sound wave of the earphone front cavity is output to the environment after passing through a longer sound channel, so that a time difference is generated between the low-frequency sound output from the front and rear sound cavities of the earphone to the environment, thereby ensuring that the low-frequency sound output from the front cavity is not affected by the low-frequency sound of the opposite phase output from the rear cavity, or reducing the influence of the low-frequency sound of the opposite phase output from the rear cavity on the low-frequency sound output from the front cavity. In addition, the sound channel, that is, the damping effect of the air circuit itself, can be used to ensure that the transient response of the speaker is not affected, thereby enhancing the low-frequency sound effect of the earphone while taking into account that the high-frequency sound of the earphone speaker is not affected. The low-frequency effect of the earphone sound is enhanced and the sound quality of the earphone is improved.

[0096] In one embodiment, if Figure 1 or Figure 2 As shown, the first groove 120 is a spiral groove. Such an arrangement can obtain a relatively smooth sound channel curve.

[0097] In one embodiment, if Figure 1 or Figure 2 As shown, a second hole 111 is disposed on the first back cavity body 100. The first groove 120 is connected to the external environment of the back cavity body through the second hole 111.

[0098] In one embodiment, if Figure 3 As shown, it is characterized in that the first hole 110 is a through hole.

[0099] In one embodiment, if Figure 4 Figure 5 As shown, it is characterized in that the first hole 110 is a blind hole.

[0100] In one embodiment, if Figure 3 Figure 5 As shown, a connecting portion for connecting to the earphone rear cavity is provided on the first back cavity body 100. The connecting portion is sealedly connected to the housing of the earphone rear cavity.

[0101] In one embodiment, if Figure 1-5As shown, the first groove 120 is disposed at a circumferential position of the first hole 110 , that is, the first groove 120 is disposed along the circumference of the first hole 110 .

[0102] In one embodiment, if Figure 6 Figure 7 As shown, the first groove 120 is disposed on one side of the first hole 110 and is disposed in a serpentine shape.

[0103] In one embodiment, the center line of the first groove 120 is in a zigzag or snake shape.

[0104] In one embodiment, if Figure 8 Fig. 9 As shown, the first groove 120 is disposed on one side of the first hole 110 and is circular in shape.

[0105] In one embodiment, if Fig.10 As shown, the back cover 200 is a planar cover.

[0106] In one embodiment, if Fig.11 Fig.12 Fig.13 Fig.14 As shown, the shape of the back cover 200 is the same as that of the first groove 120 , so that the back cover 200 can be embedded in the first groove 120 , and together with the first groove 120 , form a sound outlet channel connecting the first hole 110 with the external environment.

[0107] The earphone bass enhancement device provided above forms a narrow and long sound channel by combining the first back cavity body 100 and the back cover 200, so that the low-frequency sound generated by the earphone back cavity with the opposite phase to the sound wave of the earphone front cavity is output to the environment after passing through a longer sound channel, so that a time difference is generated between the low-frequency sound output from the front and rear sound cavities of the earphone to the environment, thereby ensuring that the low-frequency sound output from the front cavity is not affected by the low-frequency sound of the opposite phase output from the back cavity, or reducing the influence of the low-frequency sound of the opposite phase output from the back cavity on the low-frequency sound output from the front cavity. In addition, the sound channel, that is, the damping effect of the air circuit itself, can be used to ensure that the transient response of the speaker is not affected, thereby enhancing the low-frequency sound effect of the earphone while taking into account that the high-frequency sound of the earphone speaker is not affected. The low-frequency effect of the earphone sound is enhanced and the sound quality of the earphone is improved.

[0108] According to the above content, the present invention also provides another headphone bass enhancement device.

[0109] A headphone bass enhancement device, such as Fig.15 Fig.16 Fig.17 Fig.18As shown, it includes a first back cavity body 100 and a back cover 200. A first hole 110 and a first groove 120 are provided on the first back cavity body 100, the first end face of the first groove 120 is connected to the first hole 110, and the distance between the second end face and any side of the first back cavity body 100 is greater than 0. A third hole 210 is provided on the back cover 200. The third hole 210 is a through hole. The back cover 200 fits tightly with the first back cavity body 100, and the third hole 210 is connected with the first groove 120, so that a sound outlet channel connecting the first hole 110 and the external environment is formed between the first groove 120 and the back cover 200. The first hole 110 is used to communicate with the back cavity of the earphone.

[0110] In one embodiment, if Fig.15 Fig.16 Fig.17 As shown, the first groove 120 is a spiral groove.

[0111] The earphone bass enhancement device provided above forms a narrow and long sound channel by combining the first back cavity body 100 and the back cover 200, so that the low-frequency sound generated by the earphone back cavity with the opposite phase to the sound wave of the earphone front cavity is output to the environment after passing through the longer sound channel, thereby causing a time difference between the low-frequency sound output from the front and rear sound cavities of the earphone to the environment, thereby ensuring that the low-frequency sound output from the front cavity is not affected by the low-frequency sound of the opposite phase output from the rear cavity, or reducing the influence of the low-frequency sound of the opposite phase output from the rear cavity on the low-frequency sound output from the front cavity. In addition, the sound channel, that is, the damping effect of the air circuit itself, can be used to ensure that the transient response of the speaker is not affected, thereby enhancing the low-frequency sound effect of the earphone while taking into account that the high-frequency sound of the earphone speaker is not affected. The low-frequency effect of the earphone sound is enhanced and the sound quality of the earphone is improved.

[0112] According to the above content, the present invention also provides another headphone bass enhancement device.

[0113] A headphone bass enhancement device, such as Fig.19 Fig. 20 As shown, it includes a first back cavity body 100 and a back cover 200. The first back cavity body 100 is provided with a first hole 110, a first groove 120 and a second groove 121. The first groove 120 is an arc-shaped groove. The first end surface of the first groove 120 is connected to the first hole 110 through the second groove 121, and the distance between the second end surface and any side of the first back cavity body 100 is greater than 0. The back cover 200 is provided with a third hole 210. The third hole 210 is a through hole. Fig. 22 As shown, the back cover 200 is connected to the first back cavity body 100 bearing 300, and the third hole 210 is connected to the first groove 120, so that the back cover 200 and the first back cavity body 100 can rotate relative to each other, thereby changing the length of the sound outlet channel between the third hole 210 and the first hole 110. Fig.21As shown, the first back cavity body 100 is provided with a first annular sealing portion 140 and a second annular sealing portion 141. Fig.23 As shown, a third annular sealing portion 220 and a fourth annular sealing portion 230 are provided on the back cover 200. The first annular sealing portion 140 and the third annular sealing portion 220 constitute a first annular acoustic wave sealing structure to prevent sound from propagating radially along the first groove 120. The second annular sealing portion 141 and the fourth annular sealing portion 230 constitute a second annular acoustic wave sealing structure to prevent sound from propagating radially along the first groove 120. The annular diameters of the first annular sealing portion 140 and the third annular sealing portion 220 are both larger than the outer circumferential diameter of the first groove 120. The annular diameters of the second annular sealing portion 141 and the fourth annular sealing portion 230 are both smaller than the inner circumferential diameter of the first groove 120.

[0114] In one embodiment, if Fig. 20 Fig.21 As shown, a bearing mounting seat 130 is further provided on the first back cavity body 100 for mounting the bearing 300 . The axis of the bearing mounting seat 130 coincides with the axis of the arc-shaped first groove 120 .

[0115] In one embodiment, if Fig.24 As shown, the rear cover 200 is circular. A bearing mounting seat 211 is also provided on the rear cover 200 for mounting the bearing 300. The axis of the bearing mounting seat 211 coincides with the axis of the circular rear cover 200.

[0116] In one embodiment, in combination Fig.21 Fig. 22 Fig.23 and Fig.24 As shown, the first annular sealing portion 140 is an annular boss, the third annular sealing portion 220 is an annular boss, and the diameter of the annular boss of the first annular sealing portion 140 is greater than or less than the diameter of the annular boss of the third annular sealing portion 220. During installation and use, the rotation axis of the annular boss of the first annular sealing portion 140 coincides with the rotation axis of the annular boss of the third annular sealing portion 220.

[0117] In one embodiment, in combination Fig.21 Fig. 22 Fig.23 and Fig.24 As shown, the first annular sealing portion 140 is an annular boss, the third annular sealing portion 220 is an annular groove, and the diameter of the annular boss of the first annular sealing portion 140 is equal to the diameter of the annular groove of the third annular sealing portion 220. During installation and use, the rotation axis of the annular boss of the first annular sealing portion 140 coincides with the rotation axis of the annular groove of the third annular sealing portion 220.

[0118] In one embodiment, in combination Fig.21 Fig. 22 Fig.23 and Fig.24 As shown, the first annular sealing portion 140 is an annular groove, the third annular sealing portion 220 is an annular boss, and the diameter of the annular groove of the first annular sealing portion 140 is equal to the diameter of the annular boss of the third annular sealing portion 220. During installation and use, the rotation axis of the annular groove of the first annular sealing portion 140 coincides with the rotation axis of the annular boss of the third annular sealing portion 220.

[0119] In one embodiment, in combination Fig.21 Fig. 22 Fig.23 and Fig.24 As shown, the first annular sealing portion 140 includes an annular groove and an annular boss with the same center, and the third annular sealing portion 220 includes an annular boss and annular groove with the same center, and the diameter of the annular groove of the first annular sealing portion 140 is equal to the diameter of the annular boss of the third annular sealing portion 220, and the diameter of the annular boss of the first annular sealing portion 140 is equal to the diameter of the annular groove of the third annular sealing portion 220, so that they mesh with each other to form a labyrinth sealing structure.

[0120] In one embodiment, in combination Fig.21 Fig. 22 Fig.23 and Fig.24 As shown, the second annular sealing portion 141 is an annular boss, the fourth annular sealing portion 230 is an annular boss, and the diameter of the annular boss of the second annular sealing portion 141 is greater than or less than the diameter of the annular boss of the fourth annular sealing portion 230. During installation and use, the rotation axis of the annular boss of the second annular sealing portion 141 coincides with the rotation axis of the annular boss of the fourth annular sealing portion 230.

[0121] In one embodiment, in combination Fig.21 Fig. 22 Fig.23 and Fig.24 As shown, the second annular sealing portion 141 is an annular boss, the fourth annular sealing portion 230 is an annular groove, and the diameter of the annular boss of the second annular sealing portion 141 is equal to the diameter of the annular groove of the fourth annular sealing portion 230. During installation and use, the rotation axis of the annular boss of the second annular sealing portion 141 coincides with the rotation axis of the annular groove of the fourth annular sealing portion 230.

[0122] In one embodiment, in combination Fig.21 Fig. 22 Fig.23 and Fig.24 As shown, the second annular sealing portion 141 is an annular groove, the fourth annular sealing portion 230 is an annular boss, and the diameter of the annular groove of the second annular sealing portion 141 is equal to the diameter of the annular boss of the fourth annular sealing portion 230. During installation and use, the rotation axis of the annular groove of the second annular sealing portion 141 coincides with the rotation axis of the annular boss of the fourth annular sealing portion 230.

[0123] In one embodiment, in combination Fig.21 Fig. 22 Fig.23 and Fig.24 As shown, the second annular sealing portion 141 includes an annular groove and an annular boss with the same center, and the fourth annular sealing portion 230 includes an annular boss and annular groove with the same center, and the diameter of the annular groove of the second annular sealing portion 141 is equal to the diameter of the annular boss of the fourth annular sealing portion 230, and the diameter of the annular boss of the second annular sealing portion 141 is equal to the diameter of the annular groove of the fourth annular sealing portion 230, so that they mesh with each other to form a labyrinth sealing structure.

[0124] In one embodiment, in combination Fig.21 Fig. 22 Fig.23 and Fig.24 As shown, a circular arc-shaped sealing portion 142 is also provided on the first back cavity body 100, and a fifth circular ring-shaped sealing portion 240 is also provided on the back cover 200. The circular arc-shaped sealing portion 142 and the fifth circular ring-shaped sealing portion 240 constitute a circular arc-shaped acoustic wave sealing structure. The diameters of the circular arc-shaped sealing portion 142 and the fifth circular ring-shaped sealing portion 240 are both larger than the diameters of the second circular ring-shaped sealing portion 141 and the fourth circular ring-shaped sealing portion 230, and smaller than the inner circumference diameter of the first groove 120.

[0125] In one embodiment, in combination Fig. 22 As shown, the first annular acoustic wave sealing structure and the second annular acoustic wave sealing structure are labyrinth-shaped sealing structures.

[0126] In one embodiment, in combination Fig.21 Fig. 22 Fig.23 and Fig.24 As shown, the arc-shaped sealing portion 142 is an arc-shaped boss, the fifth annular sealing portion 240 is an annular boss, and the diameter of the arc-shaped boss of the arc-shaped sealing portion 142 is greater than or less than the diameter of the annular boss of the fifth annular sealing portion 240. During installation and use, the rotation axis of the annular boss of the arc-shaped sealing portion 142 coincides with the rotation axis of the annular boss of the fifth annular sealing portion 240.

[0127] In one embodiment, in combination Fig.21 Fig. 22 Fig.23 and Fig.24 As shown, the arc-shaped sealing portion 142 is an arc-shaped boss, the fifth annular sealing portion 240 is an annular groove, and the diameter of the arc-shaped boss of the arc-shaped sealing portion 142 is equal to the diameter of the annular groove of the fifth annular sealing portion 240. During installation and use, the rotation axis of the arc-shaped boss of the arc-shaped sealing portion 142 coincides with the rotation axis of the annular groove of the fifth annular sealing portion 240.

[0128] In one embodiment, in combination Fig.21 Fig. 22 Fig.23 and Fig.24 As shown, the first arc-shaped sealing portion 142 is an arc-shaped groove, the fifth annular sealing portion 240 is an annular boss, and the diameter of the arc-shaped groove of the arc-shaped sealing portion 142 is equal to the diameter of the annular boss of the fifth annular sealing portion 240. During installation and use, the rotation axis of the arc-shaped groove of the arc-shaped sealing portion 142 coincides with the rotation axis of the annular boss of the fifth annular sealing portion 240.

[0129] In one embodiment, in combination Fig.21 Fig. 22 Fig.23 and Fig.24 As shown, the arc-shaped sealing portion 142 includes an arc-shaped groove and an arc-shaped boss with the same center, and the fifth annular sealing portion 240 includes an annular boss and an annular groove with the same center, and the diameter of the arc-shaped groove of the arc-shaped sealing portion 142 is equal to the diameter of the annular boss of the fifth annular sealing portion 240, and the diameter of the arc-shaped boss of the arc-shaped sealing portion 142 is equal to the diameter of the annular groove of the fifth annular sealing portion 240, so that they mesh with each other to form a labyrinth sealing structure.

[0130] In one embodiment, the first annular sonic sealing structure and the second annular sonic sealing structure are oil film sealing structures.

[0131] The earphone bass enhancement device provided above forms a narrow and long sound channel by combining the first back cavity body 100 and the back cover 200, so that the low-frequency sound generated by the earphone back cavity with the opposite phase to the sound wave of the earphone front cavity is output to the environment after passing through the longer sound channel, thereby causing a time difference between the low-frequency sound output from the front and rear sound cavities of the earphone to the environment, thereby ensuring that the low-frequency sound output from the front cavity is not affected by the low-frequency sound of the opposite phase output from the rear cavity, or reducing the influence of the low-frequency sound of the opposite phase output from the rear cavity on the low-frequency sound output from the front cavity. In addition, the sound channel, that is, the damping effect of the air circuit itself, can be used to ensure that the transient response of the speaker is not affected, thereby enhancing the low-frequency sound effect of the earphone while taking into account that the high-frequency sound of the earphone speaker is not affected. The low-frequency effect of the earphone sound is enhanced and the sound quality of the earphone is improved.

[0132] In addition, the length of the sound channel can be changed by the rotation design of the back cover 200, so that the headphone bass enhancement device provided by the solution of the present invention can adapt to the adjustment of a wider frequency.

[0133] According to the above content, the present invention also provides another headphone bass enhancement device.

[0134] A headphone bass enhancement device, such as Fig.25 Fig.26 Fig.28 Fig.29 Fig.30 As shown, it includes a first back cavity body 100, a second back cavity body 400 and a back cover 200. The first back cavity body 100 is provided with a first hole 110 and a first groove 120, the first end surface of the first groove 120 is connected to the first hole 110, and the distance between the second end surface and any side of the first back cavity body 100 is greater than 0. The second back cavity body 400 is provided with a fourth hole 410, a fifth hole 420 and a third groove 430, the first end surface of the third groove 430 is connected to the fourth hole 410, and the second end surface is connected to the fifth hole 420. The fifth hole 420 is connected to the first groove 120. The second back cavity body 400 is closely attached to the first back cavity body 100, so that the first groove 120 and the second back cavity body 400 form a sound outlet channel connecting the first hole 110 and the fifth hole 420. The back cover 200 is provided with a sixth hole 250. The sixth hole 250 is a through hole. The back cover 200 is tightly fitted with the second back cavity body 400, and the sixth hole 250 is connected with the fourth hole 410, so that the third groove 430 and the back cover 200 form a sound outlet channel connecting the fifth hole 420 with the external environment. The first hole 110 is used to communicate with the earphone back cavity.

[0135] In one embodiment, if Fig.25 Fig.26 As shown, the first groove 120 is a spiral groove, and the first hole 110 is a blind hole.

[0136] In one embodiment, if Fig. 27 Fig.28 As shown, the first groove 120 is a spiral groove, and the first hole 110 is a through hole.

[0137] In one embodiment, if Fig.29 As shown, the rear cover 200 is further provided with a seventh hole 260 communicating with the third groove 430. The seventh hole 260 is a through hole.

[0138] In one embodiment, if Fig.30As shown, the rear cover 200 is further provided with a seventh hole 260 communicating with the third groove 430. The seventh hole 260 is a through hole. The rear cover 200 is further provided with a switch 500 for controlling the opening and closing of the seventh hole 260.

[0139] In one embodiment, if Fig.30 As shown, the rear cover 200 is also provided with a seventh hole 260 communicating with the third groove 430. The seventh hole 260 is a through hole. A switch 500 is also included. The switch 500 is used to control the opening and closing of the seventh hole 260. The switch 500 is also used to control the opening and closing of the sound channel between the fifth hole 420 and the fourth hole 410.

[0140] The earphone bass enhancement device provided above provides narrow and long sound channels on the first back cavity body 100 and the second back cavity body 400 respectively, and uses a hole to connect the two narrow and long sound channels to form a longer sound channel when the first back cavity body 100 and the second back cavity body 400 are attached to each other, so that when the space range is limited, this structure is used to design a sound channel that meets the length requirements. The low-frequency sound generated by the earphone rear cavity with the opposite phase to the sound wave of the earphone front cavity is output to the environment after passing through the longer sound channel, so that the low-frequency sound output from the front and rear sound cavities of the earphone to the environment produces a designed time difference, so as to ensure that the low-frequency sound output from the front cavity is not affected by the low-frequency sound of the opposite phase output from the rear cavity, or reduce the influence of the low-frequency sound of the opposite phase output from the rear cavity on the low-frequency sound output from the front cavity, thereby enhancing the low-frequency effect of the earphone sound, thereby improving the sound quality of the earphone.

[0141] In addition, the sound channel, that is, the damping effect of the air circuit itself, can be used to ensure that the transient response of the speaker is not affected, thereby enhancing the low-frequency sound effect of the headphones while ensuring that the mid- and high-frequency sounds of the headphone speakers are not affected.

[0142] According to the above content, the present invention also provides another headphone bass enhancement device.

[0143] A headphone bass enhancement device, such as Fig.31 Fig.32 Fig.33 Fig.34 As shown, it includes a third back cavity body 600. The third back cavity body 600 is provided with an eighth hole 610 and a ninth hole 620, the first end face of the ninth hole 620 is connected to the eighth hole 610, and the second end face is connected to the external environment on any side of the third back cavity body 600, so that the ninth hole 620 constitutes a sound outlet channel connecting the eighth hole 610 and the external environment. The back cavity body is an integrally formed structure.

[0144] The earphone bass enhancement device provided above forms a narrow and long sound channel by combining the third back cavity body 600 and the back cover 200, so that the low-frequency sound generated by the earphone rear cavity with the opposite phase to the sound wave of the earphone front cavity is output to the environment after passing through the longer sound channel, so that a time difference is generated between the low-frequency sound output from the front and rear sound cavities of the earphone to the environment, thereby ensuring that the low-frequency sound output from the front cavity is not affected by the low-frequency sound of the opposite phase output from the rear cavity, or reducing the influence of the low-frequency sound of the opposite phase output from the rear cavity on the low-frequency sound output from the front cavity. In addition, the sound channel, that is, the damping effect of the air circuit itself, can be used to ensure that the transient response of the speaker is not affected, thereby enhancing the low-frequency sound effect of the earphone while taking into account that the high-frequency sound of the earphone speaker is not affected. At the same time, the earphone bass enhancement device of the present invention can obtain better sealing through integrated molding technology (such as wax mold casting method and 3D printing technology).

[0145] According to the above content, the present invention also provides another earphone.

[0146] An earphone comprises the earphone bass enhancement device in any one of the above embodiments.

[0147] In one embodiment, if Fig.35 As shown, the first back cavity body 100 and the earphone back cavity are an integrally formed structure.

[0148] In one embodiment, the third back cavity body 600 and the earphone back cavity are an integrally formed structure.

[0149] In one embodiment, a tenth hole 611 is further disposed on the third back cavity body 600 . A first end surface of the ninth hole 620 is communicated with the eighth hole 610 , and a second end surface is communicated with the tenth hole 611 .

[0150] The earphones provided above are provided with an earphone bass enhancement device so that the low-frequency sound generated by the earphone rear cavity with the opposite phase to the sound wave of the earphone front cavity is output to the environment after passing through a longer sound channel, thereby causing a time difference between the low-frequency sound output from the front and rear sound cavities of the earphone to the environment, thereby ensuring that the low-frequency sound output from the front cavity is not affected by the low-frequency sound with the opposite phase output from the rear cavity, or reducing the influence of the low-frequency sound with the opposite phase output from the rear cavity on the low-frequency sound output from the front cavity. The low-frequency effect of the earphone sound is enhanced, thereby improving the sound quality of the earphone. In addition, the sound channel, that is, the damping effect of the air circuit itself, can be used to ensure that the transient response of the speaker is not affected, thereby enhancing the low-frequency sound effect of the earphone while taking into account that the high-frequency sound of the earphone speaker is not affected.

[0151] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0152] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A headphone bass enhancement device, characterized in that: It includes a first back cavity body and a back cover; the first back cavity body is provided with a first hole, a first groove and a second groove; the first groove is an arc-shaped groove; the first end face of the first groove is connected to the first hole through the second groove, and the distance between the second end face and any side of the first back cavity body is greater than 0; the back cover is provided with a third hole; the third hole is a through hole; the back cover is connected to the first back cavity body bearing, and the third hole is connected to the first groove, so that the back cover and the first back cavity body can rotate relative to each other, thereby changing the length of the sound outlet channel between the third hole and the first hole; the first back cavity body is provided with a first annular sealing part and a second annular sealing part; the back cover is provided with a third annular sealing part and a fourth annular sealing part; the first annular sealing part and the third annular sealing part constitute a first annular sound wave sealing structure to hinder the radial propagation of sound along the first groove; the second annular sealing part and the fourth annular sealing part constitute a second annular sound wave sealing structure to hinder the radial propagation of sound along the first groove; The annular diameters of the first annular sealing portion and the third annular sealing portion are both larger than the outer circumferential diameter of the first groove; the annular diameters of the second annular sealing portion and the fourth annular sealing portion are both smaller than the inner circumferential diameter of the first groove.

2. The headphone bass enhancement device according to claim 1, characterized in that: A circular arc-shaped sealing portion is also provided on the first back cavity body, and a fifth circular ring-shaped sealing portion is also provided on the back cover; the circular arc-shaped sealing portion and the fifth circular ring-shaped sealing portion constitute a circular arc-shaped acoustic wave sealing structure; the diameters of the circular arc-shaped sealing portion and the fifth circular ring-shaped sealing portion are both larger than the circular ring diameters of the second circular ring-shaped sealing portion and the fourth circular ring-shaped sealing portion, and smaller than the inner circumference diameter of the first groove.

3. The headphone bass enhancement device according to claim 1 or 2, characterized in that: The first annular sonic wave sealing structure and the second annular sonic wave sealing structure are labyrinth sealing structures or oil film sealing structures.

4. A headphone bass enhancement device, characterized in that: The invention comprises a first back cavity body, a second back cavity body and a back cover; a first hole and a first groove are arranged on the first back cavity body, a first end face of the first groove is connected to the first hole, and a distance between the second end face and any side of the first back cavity body is greater than 0; a fourth hole, a fifth hole and a third groove are arranged on the second back cavity body, a first end face of the third groove is connected to the fourth hole, and a second end face is connected to the fifth hole; the fifth hole is connected to the first groove; the second back cavity body is tightly fitted with the first back cavity body, so that a hole connecting the first hole and the second groove is formed between the first groove and the second back cavity The sound outlet channel of the fifth hole; the sixth hole is arranged on the back cover; the sixth hole is a through hole; the back cover fits tightly with the second back cavity, and the sixth hole is connected with the fourth hole, so that a sound outlet channel connecting the fifth hole with the external environment is formed between the third groove and the back cover; the first hole is used to communicate with the back cavity of the earphone; the back cover is also provided with a seventh hole connected with the third groove; the seventh hole is a through hole; the back cover also includes a switch; the switch is used to control the opening and closing of the seventh hole; the switch is also used to control the on and off of the sound channel between the fifth hole and the fourth hole.

5. A headset, characterized in that: The invention comprises the headphone bass enhancement device according to any one of claims 1 to 4.

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