Heating circuit layout for smart susceptor induction heating device

Abstract

The present invention relates to a heating circuit layout for a smart susceptor induction heating device. A heating device (20) for heat treating a component (21) includes a stage (40) formed of a thermally conductive material and a stage induction heating circuit (52 or 121) thermally coupled to the stage (40). The stage induction heating circuit (52 or 121) includes a plurality of stage induction coil circuits (62 or 122, 124) electrically coupled to each other in parallel. Each stage induction coil circuit (62 or 122, 124) includes a stage electrical conductor (70) and a stage smart susceptor (72) having a Curie temperature. The first and second stage induction coil circuits have paired sections positioned adjacent to each other, the paired sections being configured to transmit current in opposite directions. In some embodiments, the stage induction coil circuits have a partially nested straight hook shape. In other embodiments, the stage induction coil circuits overlap each other at diamond turns.

Description

Technical Field

[0001] The present disclosure relates generally to apparatus and methods for heating a component to a process temperature and, more particularly, to apparatus and methods for inductively heating using smart susceptors to achieve a substantially uniform temperature across the component. Background Art

[0002] Smart susceptors for inductive heating have been used in heating blankets or stand-alone heating tools to cure or otherwise process parts that require the application of heat. While such devices are known to adequately achieve uniform temperatures over a given area, current designs have limited total area that can be provided with uniform heating, are limited to processing certain part shapes, and have excessively long heating / cooling cycles when processing multiple parts. Summary of the invention

[0003] According to one aspect of the present disclosure, a heating device for thermally treating a component includes a table formed of a thermally conductive material, the table defining a table surface configured to engage with a first surface of the component. A table induction heating circuit is thermally coupled to the table and configured to generate a treatment temperature at the table surface. The table induction heating circuit includes a plurality of table induction coil circuits electrically coupled in parallel to each other, wherein each of the plurality of table induction coil circuits includes a table electrical conductor and a table smart susceptor having a Curie temperature. The plurality of table induction coil circuits also include: a first table induction coil circuit that follows a first path across the table, the first path including first and second ends spaced apart and joined by a middle portion, wherein the first table induction coil circuit has a first table induction coil length; and a second table induction coil circuit that follows a second path across the table, wherein the second path is at least partially nested between the first and second ends of the first path, and the second table induction coil circuit has a second table induction coil length that is different from the first table induction coil length.

[0004] According to another aspect of the present disclosure, a heating device for thermally treating a component includes a stage formed of a thermally conductive material, the stage defining a stage surface configured to engage with a first surface of the component. A stage induction heating circuit is thermally coupled to the stage and configured to generate a treatment temperature at the stage surface. The stage induction heating circuit includes a plurality of stage induction coil circuits electrically coupled in parallel to each other, wherein each of the plurality of stage induction coil circuits includes a stage electrical conductor and a stage smart susceptor having a Curie temperature. The plurality of stage induction coil circuits include: a first stage induction coil circuit, the first stage induction coil circuit having first and second end sections spaced apart and joined by a middle section, wherein the first stage induction coil circuit has a first stage induction coil length; and a second stage induction coil circuit, the second stage induction coil circuit having first and second end sections spaced apart and joined by a middle section, wherein the second stage induction coil circuit has a second stage induction coil length, the second stage induction coil length being substantially equal to the first stage induction coil length. The middle section of the second stage induction coil circuit overlaps the middle section of the first stage induction coil circuit.

[0005] According to another aspect of the present disclosure, a heating device for heat treating a component includes a table formed of a thermally conductive material, the table defining a table surface configured to engage with a first surface of the component. A table induction heating circuit is thermally coupled to the table and configured to generate a treatment temperature at the table surface. The table induction heating circuit includes a plurality of table induction coil circuits electrically coupled to each other in parallel, wherein each of the plurality of table induction coil circuits includes a table electrical conductor and a table smart susceptor having a Curie temperature. The plurality of table induction coil circuits include a first table induction coil circuit having a plurality of first table induction coil circuit segments extending substantially parallel to each other, the plurality of first table induction coil circuit segments including at least a first pair of segments and a second pair of segments spaced apart from the first pair of segments, wherein the first table induction coil circuit segments of the first pair of segments are positioned directly adjacent to each other and are configured to transmit current in opposite directions to each other, and the first table induction coil circuit segments of the second pair of segments are positioned directly adjacent to each other and are configured to transmit current in opposite directions to each other. The plurality of induction coil circuits also include a second induction coil circuit having a plurality of second induction coil circuit segments extending substantially parallel to one another, the plurality of second induction coil circuit segments including at least a first pair of segments and a second pair of segments spaced apart from the first pair of segments, wherein the second induction coil circuit segments of the first pair of segments are positioned directly adjacent to one another and are configured to carry current in opposite directions from one another, and the second induction coil circuit segments of the second pair of segments are positioned directly adjacent to one another and are configured to carry current in opposite directions from one another.

[0006] The features, functions, and advantages that have been discussed can be achieved independently in various embodiments or may be combined in yet other embodiments further details of which can be seen with reference to the following description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a schematic diagram of a heating device according to the invention arranged at a processing location.

[0008] Figure 2 yes Figure 1 Side view of a heating device.

[0009] Figure 3 yes Figure 1 A sectional partial end view of a heating device.

[0010] Figure 4 is used for Figure 1 A cross-sectional end view of a table in a heating apparatus.

[0011] Figure 5 is used for Figure 1 Schematic block diagram of an induction heating circuit in a heating device.

[0012] Figure 6 is used for Figure 1 A perspective view of an embodiment of an induction heating circuit in a heating device of FIG. 1 , the induction heating circuit having a susceptor wrapped around an electrical conductor.

[0013] Fig. 7A and Figure 7B is used for Figure 1 Schematic plan view of an induction heating circuit layout with a linear hook structure in a heating device.

[0014] Fig. 8A and Figure 8B is used for Figure 1 Schematic plan view of an alternative embodiment of an induction heating circuit layout having diamond-shaped turns in a heating device of .

[0015] Fig.9A is used for Figure 1 A cross-sectional end view of a tool having a non-planar machining surface in a heating apparatus.

[0016] Fig. 9B yes Fig.9A A plan view of a heating device with some components removed for clarity.

[0017] Fig. 9C is a block diagram of a method of forming a component having a non-planar profile.

[0018] Fig. 10A is used for Figure 1A three-dimensional diagram of a thermal management system in a heating device.

[0019] Fig. 10B is used Fig. 10A A block diagram of a method of thermally managing a component using a thermal management system.

[0020] FIG. 11A to FIG. 11C They are used for Figure 1 Plan view, side view and end view of the support assembly in the heating device.

[0021] Fig.12 is used for Figure 1 An exploded perspective view of a hub and adapter interface in a heating device for connecting a support assembly to a lower heating assembly.

[0022] Fig.13 is used for Figure 1 An end view of a heating blanket assembly of an upper heating assembly in a heating apparatus.

[0023] Fig.14 It is through control Fig.13 A block diagram of a method of positioning a heating blanket by adjusting pressures within first and second pressure chambers within an upper heating assembly.

[0024] It should be understood that the drawings are not necessarily drawn to scale and that the disclosed embodiments are sometimes schematically illustrated. It should be further understood that the following detailed description is merely exemplary in nature and is not intended to limit the invention or its application and use. Therefore, although the disclosure is depicted and described as certain exemplary embodiments for ease of explanation, it should be understood that the disclosure may be implemented in various other types of embodiments and in various other systems and environments. DETAILED DESCRIPTION

[0025] The following detailed description is of the best mode currently implemented the invention. This description is not limiting but is merely intended to illustrate the general principles of the invention, since the scope of the invention is best defined by the appended claims.

[0026] Figure 1An embodiment of a heating device 20 for curing, forming or otherwise processing a component 21 according to the present disclosure is schematically shown. The heating device 20 is shown as a stand-alone tool disposed at a processing location 22. The processing location 22 includes a plurality of interfaces capable of operating the heating device 20, such as a pressurized fluid source 24 (which is capable of providing a fluid such as air or nitrogen at positive and / or negative pressure), a low-voltage power source 26, and a high-frequency power source 28. A controller 30 disposed with the heating device 20 or disposed at the processing location 22 is operably coupled to the pressurized fluid source 24, the low-voltage power source 26, and the high-frequency power source 28, controls the operation of the heating device 20, and receives feedback signals from the heating device 20. In the embodiments described below, the heating device 20 is portable so that a plurality of heating devices 20 can be used sequentially or simultaneously at the same processing location 22.

[0027] exist Figure 2 , the heating apparatus 20 is shown in more detail in . Generally, the heating apparatus 20 includes a support assembly 32 that supports a lower heating assembly 34 and an upper heating assembly 36. The upper heating assembly 36 is movable relative to the lower heating assembly 34 to allow insertion and removal of the part 21 to be heated. The type of movable connection between the lower heating assembly 34 and the upper heating assembly 36 is based in part on the size of the heating apparatus 20 and the size and shape of the part 21 to be treated. For example, when the part 21 has a flat or nearly flat shape, the upper heating assembly 36 can be pivotally coupled to the lower heating assembly 34, such as by a hinged connection. As will be understood in more detail below, each of the lower heating assembly 34 and the upper heating assembly 36 includes an induction heating circuit to supply heat to all exterior surfaces of the part 21.

[0028] The heating device 20 heats the component 21 to the processing temperature. That is, the induction heating circuit in either or both of the lower heating assembly 34 and the upper heating assembly 36 is operated to heat the component 21 to the desired temperature. In some embodiments, the component 21 is formed of a composite material, and the processing temperature is the curing temperature of the composite material. In other embodiments, the component 21 is formed of a thermoplastic material, and the processing temperature is the consolidation temperature of the material. However, the curing temperature and the consolidation temperature are only two exemplary processing temperatures, because the heating device 20 can be used for other types of processes, in which the components are formed of other materials with different properties.

[0029] Reference Figure 3, the lower heating assembly 34 of the heating device includes a table 40 formed of a thermally conductive material, which defines a table top 42. Exemplary thermally conductive materials include steel, alloy steels (including nickel-iron alloys), and aluminum, but other thermally conductive materials may also be used. The table 40 is sized to accommodate the component 21. In some embodiments, the table 40 is four feet wide and eight feet long, but the table 40 may also have a smaller or larger width and length. In addition, in some embodiments, the thickness of the table 40 is in the range of approximately 1 / 4" to 1", but smaller or larger table thicknesses outside of this exemplary range may also be used. The heat generated at the rear surface 46 of the table 40 is conducted to the table top 42 through the thickness of the table 40. As Figure 3 As shown, the first surface 44 of the component 21 is placed directly on the table 42, thereby forming the component 21 having a substantially flat shape. Figure 4 Shown and referenced 9A to 9C Discussing in more detail, a tool 50 formed of a thermally conductive material is placed on the table 42 , and the component 21 is placed on top of the tool 50 .

[0030] The stage induction heating circuit 52 is thermally coupled to the stage 40 and is operable to heat at least the stage surface 42 to a processing temperature. Figure 4 In the illustrated embodiment, the table induction heating circuit 52 is disposed within a recess 54 formed in the rear surface 46 of the table 40 and extending partially through the table 40 toward the table surface 42. By positioning the table induction heating circuit 52 in the recess 54 provided on the rear surface 46, the table induction heating circuit 52 is prevented from direct contact with the component 21 and / or the tool 50, thereby protecting the table induction heating circuit 52 from wear. To further protect the table induction heating circuit 52, in some embodiments, a cover 56 is coupled to the rear surface 46 of the table 40 and is sized to close the recess 54, thereby completely enclosing the table induction heating circuit 52. The cover 56 is joined to the rear surface 46 of the table by an adhesive 58, welding, or other coupling means. Ribs 71 may be coupled to the cover 56 to structurally support the table 40 and promote air flow through the cover 56. The ribs 71 may be integrally formed with the cover 56 to facilitate easier assembly of the heating device 20. In Figure 4 In the illustrated embodiment, the ribs 71 are shown as having a trapezoidal cross-sectional shape, but it should be understood that the ribs 71 may be formed with other cross-sectional shapes, such as square or rectangular blades.

[0031] exist Figure 4 In the illustrated embodiment, the groove 54 includes a plurality of groove portions 60 spaced apart across the table 40. The table induction heating circuit 52 includes a plurality of table induction coil circuits 62, each of which is disposed in an associated groove portion 60. The groove portions 60 and the table induction coil circuits 62 are distributed over the area of ​​the table 40 to provide more uniform heating of the entire table surface 42.

[0032] To further promote uniform heating across the table 40, the table induction coil circuits 62 are connected in parallel with each other, such as Figure 5 As shown. The station induction coil circuit 62 is also connected in series with an AC power source 64, which provides an alternating current to each station induction coil circuit 62. Figure 5 , other embodiments may have more or less than three circuits to inductively heat the table 40 depending on the size of the table and the type of intended processing to be performed on the part 21. The AC power source 64 is configured as a portable or fixed power source and provides alternating current at a frequency and voltage suitable for the application. For example, but not limited to, the frequency of the AC current can be in the range of approximately 1 kHz to 300 kHz.

[0033] The heating device 20 may incorporate one or more sensors 66, which may be thermal sensors such as thermocouples, for monitoring the temperature at various locations across the table 40. Alternatively, the sensors 66 may be provided as thermal sensors coupled to the power source 64 to indicate the voltage applied to the table induction coil circuit 62. The controller 68 may be provided as a programmed computer or programmable logic controller (PLC) operably coupled to the power source 64 and the sensors 66, and operable to regulate the applied alternating current within a predetermined range to make the heating device 20 suitable for a wide range of components and structures having different heating requirements. Although feedback may be provided from the sensors 66 to the controller 68, it should be understood that the table induction coil circuit 62 employs an intelligent sensor that automatically limits the maximum temperature generated without adjusting the voltage, as will be more fully understood below.

[0034] In the illustrated embodiment, each station induction coil circuit 62 includes a plurality of components that interact to inductively generate heat in response to an applied current. Figure 6 As best shown in FIG. 1 , each station induction coil circuit 62 includes an electrical conductor 70 and a smart sensor 72. The electrical conductor 70 is configured to receive an electric current and to generate a magnetic field in response to the electric current. More specifically, the current flowing through the electrical conductor 70 generates a circular magnetic field around the electrical conductor 70, with the central axis of the magnetic field coinciding with the axis 74 of the electrical conductor 70. Alternatively, if the electrical conductor 70 is coiled into a spiral shape, the generated magnetic field is coaxial with the axis of the coiled spiral. In the illustrated embodiment, the electrical conductor 70 is formed of a plurality of electrical conductor strands 70a that are bundled in a Litz wire configuration, such as Figure 6 More specifically, each electrical conductor strand 70a may include a metal core 76 and a coating 78. The electrical conductors 70 are operably coupled to the power source 64 mentioned above.

[0035] The smart susceptor 72 is configured to inductively generate heat in response to the magnetic field generated by the electrical conductor 70. Therefore, the smart susceptor 72 is formed of a metal material that absorbs electromagnetic energy from the electrical conductor 70 and converts the energy into heat. Thus, the smart susceptor 72 serves as a heat source to transfer heat through a combination of conduction and radiation heat transfer depending on the distance between the smart susceptor 72 and the location to be heated.

[0036] The smart susceptor 72 is formed of a material selected to have a Curie point that approximates the desired maximum heating temperature of the heating device 20. The Curie point is the temperature at which a material loses its permanent magnetic properties. When used in an induction heating arrangement as described herein, where the smart susceptor 72 generates heat only when it responds to the magnetic field generated by the electrical conductor 70, the heat generated by the smart susceptor 72 will decrease as the Curie point is approached. For example, if the Curie point of the magnetic material used for the smart susceptor 72 is 500°F, the smart susceptor 72 can generate 2 watts per square inch at 450°F, can reduce heat generation to 1 watt per square inch at 475°F, and can further reduce heat generation to 0.5 watts per square inch at 490°F. In this way, each table induction coil circuit 62 will automatically generate more heat to the portion of the table 42 that is cooler due to the larger heat sink and automatically generate less heat to the portion of the table 42 that is warmer due to the smaller heat sink, thereby resulting in more uniform heating of the component 21 at approximately the same equilibrium temperature. Thus, each stage induction coil circuit will continue to heat portions of the heating area that have not yet reached the Curie point, while stopping the supply of heat to portions of the heating area that have reached the Curie point. In doing so, temperature-dependent magnetic properties, such as the Curie point of the magnetic material used in the smart susceptor 72, can prevent overheating or underheating of areas of the table 42.

[0037] The electrical conductor 70 and the smart susceptor 72 may be assembled in a configuration that facilitates insertion into the recess 54. Figure 6 In the illustrated embodiment, the smart susceptor 72 can be wrapped around the electrical conductor 70 in a spiral configuration. Wrapping the smart susceptor 72 around the electrical conductor 70 not only positions the smart susceptor 72 sufficiently close to the electrical conductor 70 to magnetically couple the wires, but also mechanically secures the electrical conductor 70 in place, which is particularly advantageous when the electrical conductor 70 is formed from a plurality of electrical conductor strands 70a. However, alternatively, the opposite configuration can be used, wherein the electrical conductor 70 is wrapped around the smart susceptor 72. In addition, other assembly configurations of the electrical conductor 70 and the smart susceptor 72 can be used to achieve the necessary electro-magnetic coupling of the wires.

[0038] Return to reference Figure 3, the upper heating assembly may include a heating blanket 80 for heating from above the component 21. The heating blanket 80 is flexible to conform to the second surface 84 of the component 21 and defines a heating surface 82 facing the component 21. For example, the heating blanket 80 may include a core formed of a pliable material (e.g., silicone or a polymer) in which a blanket induction heating circuit 86 is disposed. Alternatively, the blanket induction heating circuit 86 itself may be woven or knitted into a flexible layer that conforms to the component 21. The blanket induction heating circuit 86 is configured to generate a processing temperature at the heating surface 82 and may include electrical conductors and smart receptors similar to the above-described table induction heating circuit 52.

[0039] One or both of the table induction heating circuit 52 and the blanket induction heating circuit 86 have a circuit topology that advantageously cancels out the longer range electromagnetic fields generated by the induction coil circuit. Fig. 7A and 7B In the first embodiment shown at , the induction heating circuit 100 includes a plurality of induction coil circuits 102 that are coupled in parallel to each other and in series with the power source 64. The induction coil circuits 102 are arranged in a nested pattern, with some circuits at least partially surrounded by other circuits (i.e., "nested"). The plurality of induction coil circuits 102 are spaced apart to span the entire area of ​​the stage 40, thereby more evenly dispersing heat.

[0040] For example, Figure 7B As best shown, a first induction coil circuit 102b of the induction coil circuits follows a first path 104 across the stage 40, the first path including a first end 104a and a second end 104b spaced apart and joined by a middle portion 104c. This shape is referred to herein as a linear hook shape. Additionally, a second induction coil circuit 102d of the induction coil circuits follows a second path 106 across the stage 40, wherein the second path 106 is at least partially nested between the first end 104a and the second end 104b of the first path 104. The nested arrangement of the induction coil circuits allows the circuits to be placed side by side without overlapping, thereby allowing the circuits to be arranged in a common plane. Additionally, in order to reduce the global electromagnetic field imbalance at the middle portion 104c, the lengths of the induction coil circuits 102b, 102d are varied. That is, the first induction coil circuit 102b has a first induction coil length L1, and the second induction coil circuit 102d has a second induction coil length L2, wherein L2 is different from L1.

[0041] Multiple induction coil circuits can be nested. For example, continue to refer to Figure 7B, the second path 106 followed by the second induction coil circuit 102d may include a first end 106a and a second end 106b spaced apart joined by a middle portion 106c. Additionally, a third induction coil circuit 102e of the induction coil circuits follows a third path 108 across the stage 40. The third path 108 is also at least partially nested between the first end 104a and the second end 104b of the first path 104, and may also be at least partially nested between the first end 106a and the second end 106b of the second path 106. Additionally, the third induction coil circuit has a third induction coil length L3 that is different from the first induction coil length L1 and the second induction coil length L2, thereby further reducing global electromagnetic field imbalance.

[0042] By arranging each induction coil circuit in a double back configuration where portions of the circuit are adjacent to each other, the longer range electromagnetic fields can be further reduced. Figure 7B As shown, the first induction coil circuit 102b includes: a first segment 110, the first segment being configured to transmit current in a first direction along the first path 104; and a second segment 112, the second segment being positioned adjacent to the first segment 110 and being configured to transmit current in a second direction along the first path 104, wherein the first direction along the first path 104 is opposite to the second direction along the first path 104. The first segment 110 of the first induction coil circuit 102b joins the second segment 112 of the first induction coil circuit 102b at a double back bend 114. The second induction coil circuit 102d may be similarly arranged, wherein the first segment 116 is configured to transmit current in a first direction along the second path 106, and the second segment 118 is positioned adjacent to the first segment 116 and being configured to transmit current in a second direction along the second path 106, wherein the first direction along the second path 106 is opposite to the second direction along the second path 106. Additionally, the first segment 116 of the second induction coil circuit 102d joins the second segment 118 of the second induction coil circuit 102d at the double-back bend 120. Because the first segment and the second segment of each circuit have the same current flowing in opposite directions, the double-back configuration advantageously at least partially cancels out the longer range electromagnetic fields generated by the induction coil circuits.

[0043] exist Fig. 8A and 8BAn alternative circuit layout is shown at , which shows a diamond turn configuration. In this embodiment, an induction heating circuit 121 having a plurality of induction coil circuits 122 is provided. As shown, the induction coil circuits 122 form three diamond turns 123, but a different number of diamond turns may also be provided. In this configuration, the first induction coil circuit 122 has a first end segment 122a and a second end segment 122b spaced apart and joined by a middle segment 122c. Similarly, the second induction coil circuit 124 has a first end segment 124a and a second end segment 124b spaced apart and joined by a middle segment 124c. In this embodiment, the first induction coil circuit 122 and the second induction coil circuit 124 have substantially the same length, such that the middle segment 122c of the first induction coil circuit 122 overlaps the middle segment 124c of the second induction coil circuit 124. As shown in FIG. Figure 8B As best shown in FIG. 1 , the middle section has a vertex. That is, the middle section 122c of the first induction coil circuit 122 includes a first portion and a second portion joined at the vertex 122d, and the middle section 124c of the second induction coil circuit 124 includes a first portion and a second portion joined at the vertex 124d. In this embodiment, the second portion of the middle section 122c overlaps the first portion of the middle section 124c.

[0044] Continue to refer Figure 8B , the first end segment 122a and the second end segment 122b of the first induction coil circuit 122 are substantially parallel and separated by a first lateral distance D1. Similarly, the first end segment 124a and the second end segment 124b of the second induction coil circuit 124 are substantially parallel and separated by a second lateral distance D2, wherein the first lateral distance D1 is substantially equal to the second lateral distance D2.

[0045] In addition, additional induction coil circuits 122 may be provided. For example, a third induction coil circuit 126 has a first end segment 126a and a second end segment 126b spaced apart and joined by a middle segment 126c. The third induction coil circuit 126 has a third induction coil length L3 that is substantially equal to the first induction coil length L1 and the second induction coil length L2. In addition, the middle segment 126c of the third induction coil circuit 126 overlaps the middle segments 122c, 124c of the first and second induction coil circuits 122, 124. Finally, in some embodiments, an insulating layer 128 is disposed between the middle segments (e.g., the middle segments 122c, 124c of the first and second induction coil circuits 122, 124).

[0046] In some applications, the heating device 20 can be configured to heat treat a component having a non-planar shape. For example, Fig.9A and Fig. 9BA tool 130 is shown placed on a table 40 to form a component 21 having a non-planar shape. The tool 130 is formed of a thermally conductive material so that the heat generated at the table 42 is further conducted through the tool 130 and eventually reaches the first surface 44 of the component 21. More specifically, the tool 130 has a base surface 132 configured to engage the table 42 of the table 40 and a machining surface 134 opposite to the base surface 132. The machining surface 134 is formed with a non-planar contour shape. Thus, the machining surface 134 of the tool 130 is configured to engage the first surface 44 of the component 21. In this embodiment, a heating blanket 80 may also be provided so that the heating surface 82 of the heating blanket 80 is configured to be thermally coupled with the second surface 84 of the component 21.

[0047] The heating apparatus 20 allows the use of additional tooling structures to more accurately form the desired shape of the component 21. For example, the contour shape of the tooling surface 134 may include a recessed portion 136, and a filler portion 140 formed of a thermally conductive material is configured to be inserted into the recessed portion 136 to more accurately form the center portion of the component 21. Additionally or alternatively, the sidewalls 142 of the tool 130 and the side guards 144 spaced from and extending around the perimeter of the tool 130 may be used to more accurately form the edges of the component 21. When such as Fig.9A When viewed in cross-section as shown, the sidewall 142 of the tool 130 extends from a first end 146 adjacent to the table 42 to a second end 148 spaced from the table 42. The side guard 144 has a bottom side 150 that engages the table 42, a lateral side 152 that engages the sidewall 142 of the machining surface 134, and an inclined side 154 that extends between the bottom side 150 and the lateral side 152. Although Fig.9A The embodiment of the side guard 144 shown in FIG. 1 has a triangular cross-sectional shape, but it should be understood that the side guard 144 can have other cross-sectional shapes. In addition, the contour shape of the machined surface 134 can include a raised portion 156 .

[0048] Fig. 9C 3 is a block diagram of a method 300 for heat treating a component 21 to have a non-planar shape. At block 302, the method includes providing a table 40 formed of a thermally conductive material and defining a table 42. Continuing to block 304, a tool 130 is placed on the table 42, wherein the tool 130 is formed of a thermally conductive material. The tool 130 has a base surface 132 configured to engage the table 42 and a machining surface 134 opposite the base surface 132. Fig.9AAs best shown, the machined surface 134 has a non-planar contoured shape. At block 306, the method 300 includes positioning the component 21 such that the first surface 44 engages at least the machined surface 134. At block 308, the heating blanket 80 is positioned over a second surface 84 of the component 21, the second surface 84 being opposite the first surface 44. At block 310, the method continues by heating the machined surface 134 and the heating blanket 80 to a processing temperature for a sufficient time until the component 21 at least partially conforms to the machined surface 134 of the tool 130.

[0049] exist Fig. 10A In the illustrated embodiment, the heating device 20 includes a thermal management system 160 that is capable of more rapidly heating and / or cooling the table top 42. More specifically, the thermal management system 160 is thermally coupled to the table 40 and includes a chamber 166 that defines an interior space 167. In the illustrated embodiment, the chamber 166 is formed by a housing sidewall 162 coupled to the rear surface 46 of the table 40 and a jacket 164 coupled to the housing sidewall 162 and spaced apart from the rear surface 46. Thus, the interior space 167 of the chamber 166 is adjacent to the rear surface 46 of the table 40. In addition, at least one heat sink 168 is coupled to the rear surface 46 of the table 40 and is disposed within the chamber 166. Fig. 10A In the illustrated embodiment, four heat sinks 168 are provided, but a greater or lesser number of heat sinks may be provided. An inlet 170 and an outlet 172 extend through the chamber 166. The air residing in the chamber 166 will act as an insulator to retain heat at the table 42, thereby allowing the heating device 20 to reach the processing temperature more quickly. Alternatively, cooling of the table 42 may be facilitated by the heat sink 168.

[0050] To increase the amount of cooling provided by the thermal management system 160, an air source 174 is placed in fluid communication with the inlet 170. The air source 174 is selectively operable to generate air flow through the chamber 166 only when cooling is desired. Thus, the thermal management system 160 is selectively operable in an insulator mode, during which air flow is blocked through the chamber 166, and a cooling mode, during which air flow is allowed through the chamber 166. Additionally, the air source may be a variable speed air source configured to generate air flow at different air flow rates, thereby further varying the cooling rate when in the cooling mode.

[0051] In order to more evenly distribute cooling across the stage 40, each fin 168 has a varying cross-sectional area. More specifically, each fin 168 has an upstream end 176 located closer to the inlet 170 and a downstream end 178 located closer to the outlet 172. The cross-sectional area of ​​each fin 168 varies from a smaller fin area at the upstream end 176 to a larger fin area at the downstream end 178. Thus, as the airflow travels through the chamber 166 from the inlet 170 to the outlet 172, its temperature will increase, potentially reducing cooling capacity. The larger cross-sectional area of ​​the fins 168 at the downstream end 178 will increase cooling capacity, thereby achieving more uniform cooling across the length of the stage 40.

[0052] The thermal management system 160 allows for faster thermal processing of components. Fig. 10B 1 is a block diagram of a method 180 for thermally treating a component. At block 182, a first component is placed on a table 42 of a heating device 20. At block 183, the table 42 is then heated to a processing temperature using a table induction heating circuit 52. The table induction heating circuit may include a plurality of table induction coil circuits electrically coupled in parallel to each other, wherein each of the plurality of table induction coil circuits includes a table electrical conductor and a table smart susceptor having a Curie temperature. At block 184, a thermal management system 160 provided with the heating device 20 is then operated in an insulator mode to maintain the table 42 at the processing temperature until the first component is thermally treated. Subsequently, at block 185, the thermal management system 160 is operated in a cooling mode to cool the table 42 to a reduced temperature that allows safe processing of the component and / or the table. Although the thermal management system 160 may be used in combination with any of the features disclosed herein, providing the thermal management system 160 and positioning the stage induction heating circuit 52 in the recess 54 provided on the rear surface 46 as described above may advantageously improve the efficiency of raising or lowering the temperature of the stage 40 .

[0053] In some applications, the method 180 may be used to rapidly process multiple parts. In these applications, the method 180 optionally includes removing a first part from the table 42 of the heating apparatus 20 at block 186, placing a second part on the table 42 of the heating apparatus 20 at block 187, heating the table 42 to a processing temperature using the table induction heating circuit 52 at block 188, operating the thermal management system 160 in an adiabatic mode to maintain the table 42 at the processing temperature until the second part is cured at block 189, and operating the thermal management system 160 in a cooling mode to cool the table 42 to a reduced temperature at block 190.

[0054] The support assembly 32 of the heating device 20 can be configured to minimize heat transfer from the stage 40 to the surrounding environment, facilitate user access, and facilitate transfer of the heating device 20 to a different location. FIG. 11A to FIG. 11C and Fig.12 In the embodiment shown at , a plurality of hubs 200 are coupled to the rear surface 46 of the table 40. In order to adequately support the table 40, at least three hubs 200 are provided, but a greater number of hubs 200 may also be used. The hubs 200 are spaced apart from each other, and each hub 200 includes a rod 202.

[0055] The support assembly 32 is configured to support the lower and upper assemblies 34, 36 and engage the hub 200. Thus, the support assembly includes a frame 204 having a plurality of interconnected trusses 206. In some embodiments, the trusses 206 are configured as composite tubes, however other materials and configurations may also be used. The frame 204 has an upper end 208 and a lower end 212, the upper end 208 defining an upper end boundary 210 extending around an upper end cross-sectional area, and the lower end 212 defining a lower end boundary 214 extending around a lower end cross-sectional area. To facilitate access to the stage 40, the lower end cross-sectional area is smaller than the upper end cross-sectional area, so that the lower end boundary 214 is laterally offset inwardly relative to the upper end boundary 210. The support assembly also includes three adapters 220 coupled to the upper end 208 of the frame 204. Each adapter 220 is positioned to align with an associated hub 200 and defines a socket 222 sized to receive the rod 202 of the hub 200. By providing a reduced mass truss structure and providing minimally spaced contact points between the support assembly 32 and the table 40, heat transfer to the surrounding environment is minimized. Thus, while the support assembly 32 may be used in combination with any of the other features disclosed herein, it may be advantageous to combine the support assembly 32 with the thermal management system 160 to more effectively control the heating and / or cooling of the table 40. In addition, the rod / socket joint facilitates separation of the support assembly 32 from the lower and upper assemblies 34, 36, thereby facilitating the use of a single support assembly 32 with different lower and upper assemblies 34, 36.

[0056] The support assembly 32 may also include features to secure placement and improve the mobility of the heating device 20. For example, Figure 2 and Figure 3 As best shown in FIG. 2 , the caster 230 can be coupled to the lower end boundary 214 of the frame 204. In addition, a lifting sleeve 232 is disposed between the lower end boundary 214 of the frame 204 and each caster 230. Each lifting sleeve 232 defines a transverse lifting tool hole 234 that is sized to receive a lifting tool, such as a fork tine of a forklift. In addition, each caster 230 includes a brake operably coupled to a toggle switch 236. The toggle switches 236 are interconnected by a brake lever 238, which is in turn operably coupled to a rod 240. Thus, operation of the rod 240 is transmitted to the toggle switch 236 through the brake lever 238, thereby simultaneously actuating each toggle switch 236 between a braking position and an unbraking position.

[0057] The heating device 20 may also be configured to control multiple pressure zones in the upper heating assembly 36 to ensure adequate thermal coupling of the heating blanket 80 to the component 21 while avoiding excessive damage to the heating blanket 80. Fig.13 In the illustrated embodiment, the upper heating assembly 36 includes a first flexible layer 250 that is sized to extend over at least a portion of the stage 40 and is configured to form a first pressure chamber 252 between the stage 40 and the first flexible layer 250. The first pressure chamber 252 is sized to receive the component 21 and has a first pressure level P0. The upper heating assembly 36 also includes a second flexible layer 254 that extends over the first flexible layer 250 to form a second pressure chamber 256 between the first flexible layer 250 and the second flexible layer 254. The heating blanket 80 is disposed in the second pressure chamber 256. Each of the first flexible layer 250 and the second flexible layer 254 is formed of a pliable material such as silicone. The second flexible layer 254 has an outer surface 258 that faces away from the first flexible layer 250 and is exposed to an external pressure level P2. The second pressure chamber 256 has a second pressure level P1 that is higher than the first pressure level P0 and lower than the external pressure level P2. Thus, the pressure differential across the first flexible layer 250 causes the first flexible layer 250 to fit tightly to the component 21. The pressure differential across the second flexible layer 254 controls the amount of force applied to the heating blanket 80. Because the second pressure level P1 is higher than the first pressure level P0, the force applied by the second flexible layer 254 is less than if the second flexible layer 254 were omitted, causing the heating blanket 80 to not fit as tightly to the component 21 as the first flexible layer 250. Reducing the degree to which the heating blanket 80 stretches minimizes wear on the heating blanket 80. Thus, while the first flexible layer 250 and the second flexible layer 254 can be used in combination with any other features disclosed herein, it is not necessary to use them in conjunction with the above referenced features. Fig.9A The disclosed combination of additional tooling features may be advantageous to more accurately form a component 21 having a non-planar shape.

[0058] A pressurized fluid source 260 may be provided to actively manage the pressure levels in the first pressure chamber 252 and the second pressure chamber 256. Fig.13 As schematically shown in FIG. 2 , a pressurized fluid source 260 is in fluid communication with the first pressure chamber 252 and the second pressure chamber 256 and is configured to generate a first pressure level P0 in the first pressure chamber 252 and a second pressure level P1 in the second pressure chamber 256 .

[0059] The pressurized fluid source 260 can also be configured to manage the external pressure level P2. Fig.13As shown, the upper heating assembly 36 may include a housing 262 extending above the second flexible layer 254, thereby defining an external chamber 264 between the housing 262 and the second flexible layer 254. The pressurized fluid source 260 may also be in fluid communication with the external chamber 264, thereby generating an external pressure level P2. In some embodiments, the first pressure level is a vacuum pressure level, and the second pressure level is equal to or greater than the atmospheric pressure level.

[0060] Fig.14 4 is a block diagram of a method 400 for positioning a heating blanket by controlling pressure in chambers 252, 256, 264, thereby heat treating a component 21 using a heating device 20. The method 400 begins at block 402, i.e., forming a first pressure chamber 252 between a stage 40 of the heating device 20 for supporting the component 21 and a first flexible layer 250. At block 404, a second pressure chamber 256 is formed between the first flexible layer 250 and a second flexible layer 254, wherein the second flexible layer 254 has an outer surface 258 facing away from the first flexible layer 250 and exposed to an external pressure level P2. A heating blanket 80 is disposed in the second pressure chamber 256, the heating blanket 80 being formed of a pliable material and including a blanket induction heating circuit configured to generate a treatment temperature, the blanket induction heating circuit including a plurality of blanket induction coil circuits electrically coupled in parallel to each other, wherein each of the plurality of blanket induction coil circuits includes a blanket electrical conductor and a smart susceptor having a Curie temperature. At block 406 , the method 400 includes maintaining a first pressure level P0 in the first pressure chamber 252 below the external pressure level and maintaining a second pressure level P1 in the second pressure chamber 256 above the first pressure level P0 and below the external pressure level P2 .

[0061] The present disclosure includes implementations according to the following clauses:

[0062] Clause 1. A heating device (20) for heat treating a component (21), the heating device comprising:

[0063] a platform (40) formed of a thermally conductive material and defining a platform surface (42) configured to engage a first surface (44) of the component (21); and

[0064] A stage induction heating circuit (52) thermally coupled to the stage (40) and configured to generate a processing temperature on the stage surface (42), the stage induction heating circuit (52) comprising a plurality of stage induction coil circuits (62) electrically coupled in parallel to each other, wherein each of the plurality of stage induction coil circuits (62) comprises a stage electrical conductor (70) and a stage smart susceptor (72) having a Curie temperature, the plurality of stage induction coil circuits (62) comprising:

[0065] a first stage induction coil circuit (102b) that follows a first path (104) across the stage (40), the first path (104) comprising a first end (104a) and a second end (104b) spaced apart and joined by a middle portion (104c), wherein the first stage induction coil circuit (102b) has a first stage induction coil length; and

[0066] A second stage induction coil circuit (102d) follows a second path (106) across the stage (40), wherein the second path (106) is at least partially nested between the first end (104a) and the second end (104b) of the first path (104), and the second stage induction coil circuit (102d) has a second stage induction coil length that is different from the first stage induction coil length.

[0067] Clause 2. The heating device (20) of clause 1, wherein:

[0068] The first induction coil circuit (102b) comprises:

[0069] a first segment (110) configured to carry current in a first direction along the first path (104); and

[0070] a second segment (112) located adjacent to the first segment (110) and configured to carry current in a second direction along the first path (104), wherein the first direction along the first path (104) is opposite to the second direction along the first path (104);

[0071] wherein the first section (110) of the first induction coil circuit (102b) joins the second section (112) of the first induction coil circuit (102b) at a double backrest bend (114); and

[0072] The second induction coil circuit (102d) comprises:

[0073] a first segment (116) configured to carry current in a first direction along the second path (106); and

[0074] a second segment (118) located adjacent to the first segment (116) and configured to carry current in a second direction along the second path (106), wherein the first direction along the second path (106) is opposite to the second direction along the second path (106);

[0075] The first section (116) of the second induction coil circuit (102d) joins the second section (118) of the second induction coil circuit (102d) at a double backrest bend (120).

[0076] Clause 3. A heating device (20) as described in clause 1 or 2, wherein the plurality of station induction coil circuits (62) also include a third station induction coil circuit (102e) that follows a third path (108) across the table (40), wherein the third path (108) is also at least partially nested between the first end (104a) and the second end (104b) of the first path (104), and the third station induction coil circuit (102e) has a third station induction coil length, which is different from the first station induction coil length and the second station induction coil length.

[0077] Clause 4. The heating device (20) of any one of clauses 1 to 3, wherein the second path (106) includes a first end (106a) and a second end (106b) spaced apart and joined by a middle portion (106c).

[0078] Clause 5. A heating device (20) as described in any of clauses 1 to 4, wherein the plurality of station induction coil circuits (62) also includes a third station induction coil circuit (102e) that follows a third path (108) across the table, wherein the third path (108) is at least partially nested between the first end (106a) and the second end (106b) of the second path (106), and the third station induction coil circuit (102e) has a third station induction coil length, which is different from the first station induction coil length and the second station induction coil length.

[0079] Clause 6. The heating device (20) of any one of Clauses 1 to 5, wherein each of the first path (104) and the second path (106) has a linear hook shape.

[0080] Clause 7. The heating device (20) as recited in any one of Clauses 1 to 6, wherein the first induction coil circuit (102b) and the second induction coil circuit (102d) are arranged in the same plane.

[0081] Clause 8. A heating device (20) according to any one of clauses 1 to 7, wherein:

[0082] The table electrical conductor (70) of each of the plurality of table induction coil circuits (62) comprises a plurality of electrical conductor strands (70a) in a Litz wire configuration; and

[0083] The smart susceptor (72) of each of the plurality of inductive coil circuits (62) is wound around the electrical conductor (70) in a spiral configuration.

[0084] Clause 9. A heating device (20) for heat treating a component (21), the heating device comprising:

[0085] a platform (40) formed of a thermally conductive material and defining a platform surface (42) configured to engage a first surface (44) of the component (21);

[0086] A stage induction heating circuit (121) thermally coupled to the stage (40) and configured to generate a processing temperature on the stage surface (42), the stage induction heating circuit (52) comprising a plurality of stage induction coil circuits (122, 124) electrically coupled in parallel to each other, wherein each of the plurality of stage induction coil circuits (122, 124) comprises a stage electrical conductor (70) and a stage smart susceptor (72) having a Curie temperature, the plurality of stage induction coil circuits (122, 124) comprising:

[0087] a first induction coil circuit (122) having a first end section (122a) and a second end section (122b) spaced apart and joined by a middle section (122c), wherein the first induction coil circuit (122) has a first induction coil length; and

[0088] a second induction coil circuit (124) having a first end segment (124a) and a second end segment (124b) spaced apart and joined by a middle segment (124c), wherein the second induction coil circuit (124) has a second induction coil length substantially equal to the length of the first induction coil; and

[0089] The middle section (124c) of the second induction coil circuit (124) overlaps with the middle section (122c) of the first induction coil circuit (122).

[0090] Clause 10. A heating device (20) as described in Clause 9, wherein the middle section (122c) of the first induction coil circuit (122) includes a first portion and a second portion joined at a vertex (122d), and wherein the middle section (124c) of the second induction coil circuit (124) includes a first portion and a second portion joined at a vertex (124d), and the second portion of the middle section (122c) of the first induction coil circuit (122) overlaps with the first portion of the middle section (124c) of the second induction coil circuit (124).

[0091] Clause 11. A heating device (20) as described in clause 9 or 10, wherein the first end segment (122a) and the second end segment (122b) of the first induction coil circuit (122) are substantially parallel and separated by a first lateral distance, the first end segment (124a) and the second end segment (124b) of the second induction coil circuit (124) are substantially parallel and separated by a second lateral distance, and the first lateral distance is substantially equal to the second lateral distance.

[0092] Clause 12. A heating device (20) as described in any one of clauses 9 to 11, wherein the plurality of induction coil circuits (122) further includes a third induction coil circuit (126), the third induction coil circuit having a first end section (126a) and a second end section (126b) spaced apart and joined by a middle section (126c), wherein the third induction coil circuit (126) has a third induction coil length substantially equal to the first induction coil length and the second induction coil length, and wherein the middle section (126) of the third induction coil circuit (126) overlaps the middle sections (122c, 124c) of the first induction coil circuit (122) and the second induction coil circuit (124).

[0093] Clause 13. The heating device (20) according to any one of clauses 9 to 12, wherein:

[0094] The table electrical conductor (70) of each of the plurality of table induction coil circuits (122, 124) comprises a plurality of electrical conductor strands (70a) in a Litz wire configuration; and

[0095] The smart susceptor (72) of each of the plurality of inductive coil circuits (122, 124) is wound around the electrical conductor (70) in a spiral configuration.

[0096] Clause 14. The heating device (20) of any one of clauses 9 to 13, further comprising an insulating layer (128) arranged between the intermediate sections (122c, 124c) of the first induction coil (122) and the second induction coil (124).

[0097] Clause 15. A heating device (20) for heat treating a component (21), the heating device comprising:

[0098] a platform (40) formed of a thermally conductive material and defining a platform surface (42) configured to engage a first surface (44) of the component (21); and

[0099] A stage induction heating circuit (52 or 121) thermally coupled to the stage (40) and configured to generate a processing temperature on the stage surface (42), the stage induction heating circuit (52 or 121) comprising a plurality of stage induction coil circuits (62 or 122, 124) electrically coupled in parallel to each other, wherein each of the plurality of stage induction coil circuits (62 or 122, 124) comprises a stage electrical conductor (70) and a stage smart susceptor (72) having a Curie temperature, the plurality of stage induction coil circuits (62 or 122, 124) comprising:

[0100] a first induction coil circuit (102d or 122), the first induction coil circuit comprising a plurality of first induction coil circuit segments extending substantially parallel to each other, the plurality of first induction coil circuit segments comprising at least a first pair of segments and a second pair of segments spaced apart from the first pair of segments, wherein the first induction coil circuit segments of the first pair of segments are positioned directly adjacent to each other and are configured to carry current in opposite directions from each other, and the first induction coil circuit segments of the second pair of segments are positioned directly adjacent to each other and are configured to carry current in opposite directions from each other; and

[0101] A second induction coil circuit (102b or 124), the second induction coil circuit comprising a plurality of second induction coil circuit segments extending substantially parallel to each other, the plurality of second induction coil circuit segments comprising at least a first pair of segments and a second pair of segments spaced apart from the first pair of segments, wherein the second induction coil circuit segments of the first pair of segments are positioned directly adjacent to each other and are configured to carry current in opposite directions from each other, and the second induction coil circuit segments of the second pair of segments are positioned directly adjacent to each other and are configured to carry current in opposite directions from each other.

[0102] Clause 16. A heating device (20) as described in Clause 15, wherein the first induction coil circuit segment of the first pair of segments is joined at a first double back bend (114) and the second induction coil circuit segment of the second pair of segments is joined at a second double back bend (120).

[0103] Clause 17. The heating device (20) of Clause 15 or 16, wherein the first induction coil circuit (102d) is at least partially nested within the second induction coil circuit (102b).

[0104] Clause 18. The heating device (20) according to any one of Clauses 15 to 17, wherein the first induction coil circuit (102d) and the second induction coil circuit (102b) are arranged in the same plane.

[0105] Clause 19. A heating device (20) as described in any one of clauses 15 to 18, wherein the first induction coil circuit (122) has a first middle portion (122c), and the second induction coil circuit (124) has a second middle portion (124c) overlapping the first middle portion (122c).

[0106] Clause 20. The heating device (20) according to any one of clauses 15 to 19, wherein:

[0107] The table electrical conductor (70) of each of the plurality of table induction coil circuits (62 or 122, 124) comprises a plurality of electrical conductor strands (70a) in a Litz wire configuration; and

[0108] The smart susceptor (72) of each of the plurality of inductive coil circuits (62 or 122, 124) is wound around the electrical conductor (70) in a spiral configuration.

[0109] Clause 21. A heating device (20) for heat treating a component (21), the heating device comprising:

[0110] A lower heating assembly (34), the lower heating assembly comprising:

[0111] a platform (40) formed of a thermally conductive material and defining a platform surface (42); and

[0112] a stage induction heating circuit (52) thermally coupled to the stage (40) and configured to generate a processing temperature at the stage surface (42), the stage induction heating circuit (52) comprising a plurality of stage induction coil circuits (62) electrically coupled in parallel to each other, wherein each of the plurality of stage induction coil circuits (62) comprises a stage electrical conductor (70) and a stage smart susceptor (72) having a Curie temperature; and

[0113] An upper heating assembly (36), wherein the upper heating assembly is movable relative to the lower heating assembly (34), and the upper heating assembly (36) comprises:

[0114] A heating blanket (80) having a heating surface (82), wherein the heating blanket (80) is formed of a pliable material and includes a blanket induction heating circuit (86) configured to generate a process temperature at the heating surface (82) of the heating blanket (80), the blanket induction heating circuit (86) including a plurality of blanket induction coil circuits (102) electrically coupled in parallel to each other, wherein each of the plurality of blanket induction coil circuits (102) includes a blanket electrical conductor (70) and a blanket smart susceptor (72) having a Curie temperature; and

[0115] a tool (130) formed of a thermally conductive material, the tool (130) having a base surface (132) configured to engage the table surface (42) of the table (40) and a machining surface (134) opposite the base surface (132), wherein the machining surface (134) has a non-planar contour shape;

[0116] wherein the machining surface (134) of the tool (130) is configured to engage with a first surface (44) of the component (21), and the heating surface (82) of the heating blanket (80) is configured to engage with a second surface (84) of the component (21) opposite to the first surface (44) of the component (21).

[0117] Clause 22. The heating device (20) of Clause 21, wherein the contoured shape of the machining surface (134) includes a concave portion (136).

[0118] Clause 23. The heating device (20) of Clause 21 or 22, further comprising a filling portion (140) configured to be inserted into the recessed portion (136) of the machining surface (134).

[0119] Item 24. A heating device (20) as described in any one of Items 21 to 23, wherein the contour shape of the processing surface (134) includes a side wall (142) extending from a first end (146) adjacent to the table surface (42) to a second end (148) spaced apart from the table surface (42), and the heating device (20) also includes a side baffle (144), the side baffle having a bottom side engaged with the table surface (42) of the table (40), a lateral side engaged with the side wall (142) of the processing surface (134) of the tool (130), and an inclined side extending between the bottom side and the lateral side, wherein the angle between the bottom side and the inclined side is an acute angle.

[0120] Clause 25. The heating device (20) of any one of Clauses 21 to 24, wherein the contoured shape of the processing surface (134) includes a convex portion (156).

[0121] Clause 26. The heating device (20) according to any one of clauses 21 to 25, wherein:

[0122] The table electrical conductor (70) of each of the plurality of table induction coil circuits (62) and the blanket electrical conductor (70) of each of the plurality of blanket induction coil circuits (102) each include a plurality of electrical conductor strands (70a) in a Litz wire configuration; and

[0123] The table smart susceptor (72) of each of the plurality of table induction coil circuits (62) and the blanket smart susceptor (72) of each of the plurality of blanket induction coil circuits (102) each include a smart susceptor (72) wound in a spiral configuration around a respective one of the table conductor (70) and the blanket conductor (70).

[0124] Clause 27. The heating apparatus (20) of any one of Clauses 21 to 26, wherein the upper heating assembly (36) is pivotally coupled to the lower heating assembly (34).

[0125] Clause 28. The heating device (20) of any one of clauses 21 to 27, wherein the upper heating assembly (36) further comprises:

[0126] a first flexible layer (250) extending over the stage (40) to form a first pressure chamber (252) between the stage (40) and the first flexible layer (250), wherein the first pressure chamber (252) is sized to receive the component (21) and has a first pressure level; and

[0127] A second flexible layer (254) extending over the first flexible layer (250) to form a second pressure chamber (256) between the first flexible layer (250) and the second flexible layer (254), wherein the heating blanket (80) is arranged in the second pressure chamber (256), the second flexible layer (254) having an outer surface (258) facing away from the first flexible layer (250) and exposed to an external pressure level, wherein the second pressure chamber (256) has a second pressure level higher than the first pressure level and lower than the external pressure level.

[0128] Item 29. A heating device (20) as described in any of Items 21 to 28, wherein a pressurized fluid source (260) is fluidly connected to the first pressure chamber (252) and the second pressure chamber (256), and is configured to generate the first pressure level in the first pressure chamber (252) and the second pressure level in the second pressure chamber (256).

[0129] Clause 30. The heating device (20) of any one of Clauses 21 to 29, wherein the first pressure level is a vacuum pressure level.

[0130] Clause 31. A heating device (20) for heat treating a component (21), the heating device comprising:

[0131] A lower heating assembly (34), the lower heating assembly comprising:

[0132] a table (40) made of a thermally conductive material and defining a table top (42); and

[0133] a stage induction heating circuit (52) thermally coupled to the stage (40) and configured to generate a processing temperature at the stage surface (42), the stage induction heating circuit (52) comprising a plurality of stage induction coil circuits (62) electrically coupled in parallel to each other, wherein each of the plurality of stage induction coil circuits (62) comprises a stage electrical conductor (70) and a stage smart susceptor (72) having a Curie temperature; and

[0134] An upper heating assembly (36), wherein the upper heating assembly is movable relative to the lower heating assembly (34), and the upper heating assembly (36) comprises:

[0135] a first flexible layer (250) extending over the stage (40) to form a first pressure chamber (252) between the stage (40) and the first flexible layer (250), wherein the first pressure chamber (252) is sized to receive the component (21) and has a first pressure level;

[0136] a second flexible layer (254) extending over the first flexible layer (250) to form a second pressure chamber (256) between the first flexible layer (250) and the second flexible layer (254), the second flexible layer (254) having an outer surface (258) facing away from the first flexible layer (250) and exposed to an external pressure level, wherein the second pressure chamber (256) has a second pressure level higher than the first pressure level and lower than the external pressure level;

[0137] a heating blanket (80) disposed in the second pressure chamber (256) and having a heating surface (82), wherein the heating blanket (80) is formed of a pliable material; and

[0138] a tool (130) formed of a thermally conductive material, the tool (130) having a base surface (132) configured to engage the table surface (42) of the table (40) and a machining surface (134) opposite the base surface (132), wherein the machining surface (134) has a non-planar contour shape;

[0139] wherein the machining surface (134) of the tool (130) is configured to engage with a first surface (44) of the component (21), and the heating surface (82) of the heating blanket (80) is configured to engage with a second surface (84) of the component (21) opposite to the first surface (44) of the component (21).

[0140] Clause 32. A heating device (20) as described in clause 31, wherein the heating blanket (80) includes a blanket induction heating circuit (86), which is configured to generate a processing temperature at the heating surface (82) of the heating blanket (80), and the blanket induction heating circuit (86) includes a plurality of blanket induction coil circuits (102) electrically coupled in parallel to each other, wherein each of the plurality of blanket induction coil circuits (102) includes a blanket electrical conductor (70) and a blanket smart sensor (72) having a Curie temperature.

[0141] Clause 33. The heating device (20) of Clause 31 or 32, wherein the contoured shape of the machining surface (134) includes a concave portion (136).

[0142] Clause 34. The heating device (20) of any one of clauses 31 to 33, further comprising a filling portion (140) configured to be inserted into the recessed portion (136) of the machining surface (134).

[0143] Clause 35. A heating device (20) as described in any one of clauses 31 to 34, wherein the contour shape of the processing surface (134) includes a side wall (142) extending from a first end (146) adjacent to the table surface (42) to a second end (148) spaced apart from the table surface (42), and the heating device (20) also includes a side baffle (144), the side baffle having a bottom side engaged with the table surface (42) of the table (40), a lateral side engaged with the side wall (142) of the processing surface (134) of the tool (130), and an inclined side extending between the bottom side and the lateral side, wherein the angle between the bottom side and the inclined side is an acute angle.

[0144] Clause 36. The heating device (20) of any one of Clauses 31 to 35, wherein the contoured shape of the processing surface (134) includes a convex portion (156).

[0145] Clause 37. A method (300) of heat treating a component (21) to have a non-planar shape, the method comprising:

[0146] providing (302) a table (40) formed of a thermally conductive material and defining a table surface (42);

[0147] Positioning (304) a tool (130) on the table (42), the tool (130) being formed of a thermally conductive material and having a base surface (132) configured to engage the table (42) of the table (40) and a machining surface (134) opposite the base surface (132), wherein the machining surface (134) has a non-planar contoured shape;

[0148] positioning (306) the component (21) such that a first surface (44) of the component (21) engages at least the machined surface (134);

[0149] placing (308) a heating blanket (80) over a second surface (84) of the component (21) opposite the first surface (44) of the component (21); and

[0150] The machining surface (134) and the heating blanket (80) are heated (310) to a processing temperature until the part (21) at least partially conforms to the machining surface (134) of the tool (130).

[0151] Clause 38. The method (300) of clause 37, wherein:

[0152] a stage induction heating circuit (52) thermally coupled to the stage (40) and configured to generate the process temperature at the stage surface (42);

[0153] The heating blanket (80) includes a blanket induction heating circuit (86) configured to generate the process temperature at a heating surface (82) of the heating blanket (80); and

[0154] Heating the table top (42) and the heating blanket (80) to the processing temperature includes inductively heating the table top (42) and the heating blanket (80).

[0155] Clause 39. The method (300) of Clause 37 or 38, wherein the contoured shape of the machined surface (134) includes a concave portion (136).

[0156] Clause 40. The method (300) of any one of Clauses 37 to 39, wherein the contoured shape of the machined surface (134) includes a raised portion (156).

[0157] Clause 41. A heating device (20) for heat treating a component (21), the heating device comprising:

[0158] a table (40) formed of a thermally conductive material and defining a table top (42) oriented to face the first surface (44) of the component (21) and a rear surface (46) opposite the table top (42);

[0159] a stage induction heating circuit (52) thermally coupled to the stage (40) and configured to generate a processing temperature at the stage surface (42), the stage induction heating circuit (52) comprising a plurality of stage induction coil circuits (62) electrically coupled in parallel to each other, wherein each of the plurality of stage induction coil circuits (62) comprises a stage electrical conductor (70) and a stage smart susceptor (72) having a Curie temperature; and

[0160] a thermal management system (160) coupled to the rear surface (46) of the stage (40), the thermal management system (160) comprising:

[0161] a chamber (166) defining an interior space (167);

[0162] at least one heat sink (168) disposed within the chamber (166);

[0163] an inlet (170) extending through the chamber (166) and in fluid communication with the interior space (167); and

[0164] An outlet (172) extends through the chamber (166) and is in fluid communication with the interior space (167).

[0165] Clause 42. The heating device (20) of Clause 41, further comprising an air source (174) in fluid communication with the inlet (170) and selectively operable to generate an air flow through the interior space (167).

[0166] Clause 43. A heating device (20) as described in clause 41 or 42, wherein the thermal management system (160) can be selectively operated in an insulator mode and a cooling mode, during which airflow through the chamber (166) is prevented, and during which airflow through the chamber (166) is allowed.

[0167] Clause 44. The heating device (20) of any one of Clauses 41 to 43, wherein the air source (174) comprises a variable speed air source configured to generate air flow at different air flow rates.

[0168] Clause 45. A heating device (20) as in any one of clauses 41 to 44, wherein the at least one heat sink (168) has an upstream end (176) closer to the inlet (170) and a downstream end (178) closer to the outlet (172), wherein a cross-sectional area of ​​the at least one heat sink (168) varies from a smaller heat sink area at the upstream end (176) to a larger heat sink area at the downstream end (178).

[0169] Clause 46. The heating apparatus (20) of any one of Clauses 41 to 45, wherein the at least one heat sink (168) comprises four heat sinks (168) spaced laterally across the rear surface (46) of the stage (40).

[0170] Clause 47. The heating device (20) of any one of clauses 41 to 46, further comprising:

[0171] three hubs (200) coupled to the rear surface (46) of the table (40) and spaced apart from one another, each of the three hubs (200) including a rod (202); and

[0172] A support assembly (32) coupled to the hub (200), the support assembly (32) comprising:

[0173] a frame (204) comprising a plurality of interconnected trusses (206), the frame (204) having an upper end (208) defining an upper end boundary (210) extending around an upper end cross-sectional area and a lower end (212) defining a lower end boundary (214) extending around a lower end cross-sectional area, wherein the lower end cross-sectional area is smaller than the upper end cross-sectional area; and

[0174] Three adapters (220) are coupled to the upper end (208) of the frame (204), each of the three adapters (220) being positioned to align with an associated hub (200) and defining a socket (222) sized to receive a rod (202) of the associated hub (200).

[0175] Clause 48. The heating apparatus (20) of any one of Clauses 41 to 47, wherein each truss of the plurality of interconnected trusses (206) comprises a composite tube.

[0176] Clause 49. A heating device (20) as described in any of clauses 41 to 48, wherein the rear surface (46) of the table (40) defines a groove (54) extending partially through the table (40) toward the table surface (42), and the table induction heating circuit (52) is arranged in the groove (54).

[0177] Clause 50. The heating device (20) of any one of clauses 41 to 49, further comprising a cover (56) coupled to the rear surface (46) of the table (40) and sized to enclose the recess (54) thereby enclosing the table induction heating circuit (52).

[0178] Clause 51. A heating device (20) according to any one of clauses 41 to 50, wherein:

[0179] Each electrical conductor (70) comprises a plurality of electrical conductor strands (70a) in a Litz wire configuration; and

[0180] Each smart susceptor (72) is wound around a corresponding electrical conductor (70) in a spiral configuration.

[0181] Clause 52. A method (180) of heat treating at least one component (21) using a heating device (20), the method (180) comprising:

[0182] placing (182) a first component (21) on a table (42) of a table (40) of the heating device (20);

[0183] heating (183) the table surface (42) to a processing temperature using a table induction heating circuit (52) provided with the heating device (20), the table induction heating circuit (52) comprising a plurality of table induction coil circuits (62) electrically coupled in parallel to each other, wherein each of the plurality of table induction coil circuits (62) comprises a table electrical conductor (70) and a table smart susceptor (72) having a Curie temperature;

[0184] operating a thermal management system (160) provided with the heating device (20) in an insulator mode (184) to maintain the table (42) at the processing temperature until the first component (21) is thermally processed; and

[0185] The thermal management system (160) is operated (185) in a cooling mode to cool the table (42) to a reduced temperature.

[0186] Clause 53. The method (180) of clause 52, wherein the thermal management system (160) comprises: a chamber (166) coupled to the rear surface (46) of the table (40) and defining an interior space (167); and an air source (174) in fluid communication with the interior space (167) and selectively operable to generate an air flow through the chamber (166), wherein:

[0187] Operating (184) the thermal management system (160) in the insulator mode includes preventing the air source (174) from generating air flow through the chamber (166); and

[0188] Operating (185) the thermal management system (160) in the cooling mode includes allowing the air source (174) to generate an air flow through the chamber (166).

[0189] Clause 54. The method (180) of Clause 52 or 53, wherein the thermal management system (160) further comprises at least one heat sink (168) coupledly disposed within the chamber (166).

[0190] Clause 55. A method (180) as described in any of clauses 52 to 54, wherein the at least one heat sink (168) has an upstream end (176) and a downstream end (178), and wherein the cross-sectional area of ​​the at least one heat sink (168) varies from a smaller heat sink area at the upstream end (176) to a larger heat sink area at the downstream end (178).

[0191] Clause 56. The method (180) of any one of clauses 52 to 55, further comprising:

[0192] removing (186) the first component (21) from the table (42) of the heating apparatus (20);

[0193] placing (187) a second component (21) on the table (42) of the heating device (20);

[0194] heating (188) the table surface (42) to the processing temperature using the table induction heating circuit (52);

[0195] operating (189) the thermal management system (160) in the insulator mode to maintain the table (42) at the process temperature until the second component (21) is cured; and

[0196] The thermal management system (160) is operated (190) in the cooling mode to cool the table (42) to the reduced temperature.

[0197] Clause 57. A heating device (20) for heat treating a component (21), the heating device comprising:

[0198] a platform (40) formed of a thermally conductive material and defining a platform surface (42) oriented to face the first surface (44) of the component (21) and a rear surface (46) opposite the platform surface (42), the rear surface (46) of the platform (40) defining a groove (54) extending partially through the platform (40) toward the platform surface (42);

[0199] a stage induction heating circuit (52) disposed in the groove (54) formed in the rear surface (46) of the stage (40) and configured to generate a processing temperature on the stage surface (42), the stage induction heating circuit (52) comprising a plurality of stage induction coil circuits (62) electrically coupled in parallel to each other, wherein each of the plurality of stage induction coil circuits (62) comprises a stage electrical conductor (70) and a stage smart susceptor (72) having a Curie temperature;

[0200] a thermal management system (160) coupled to the rear surface (46) of the stage (40), the thermal management system (160) comprising:

[0201] a chamber (166) defining an interior space (167);

[0202] at least one heat sink (168) disposed within the chamber (166);

[0203] an inlet (170) extending through the chamber (166) and in fluid communication with the interior space (167); and

[0204] an outlet (172) extending through the chamber (166) and in fluid communication with the interior space (167);

[0205] three hubs (200) coupled to the rear surface (46) of the table (40) and spaced apart from one another, each of the three hubs (200) including a rod (202); and

[0206] A support assembly (32) coupled to the hub (200), the support assembly (32) comprising:

[0207] a frame (204) comprising a plurality of interconnected trusses (206), the frame (204) having an upper end (208) defining an upper end boundary (210) extending around an upper end cross-sectional area and a lower end (212) defining a lower end boundary (214) extending around a lower end cross-sectional area, wherein the lower end cross-sectional area is smaller than the upper end cross-sectional area; and

[0208] Three adapters (220) are coupled to the upper end (208) of the frame (204), each of the three adapters (220) being positioned to align with an associated hub (200) and defining a socket (222) sized to receive a rod (202) of the associated hub (200).

[0209] Clause 58. The heating device (20) of Clause 57, further comprising an air source (174) in fluid communication with the inlet (170) and selectively operable to generate an air flow through the chamber (166).

[0210] Item 59. A heating device (20) as described in Item 57 or 58, wherein the thermal management system (160) can be selectively operated in an insulator mode and a cooling mode, during which air flow through the chamber (166) is prevented, and during which air flow through the chamber (166) is allowed.

[0211] Clause 60. A heating device (20) as described in any of clauses 57 to 59, wherein the at least one heat sink (168) has an upstream end (176) closer to the inlet (170) and a downstream end (178) closer to the outlet (172), wherein the cross-sectional area of ​​the at least one heat sink (168) varies from a smaller heat sink area at the upstream end (176) to a larger heat sink area at the downstream end (178).

[0212] Unless otherwise stated here or the context is obviously contradictory, all methods described herein can be performed in any suitable order. The use of any and all embodiments or exemplary language (e.g., "such as") provided here is intended to clarify the disclosed subject matter, rather than to limit the scope of the claims. Any statements about the nature or benefits of the exemplary embodiments here are not intended to be limiting, and the attached claims should not be considered to be limited by these statements. More generally, any language in the specification should not be interpreted as indicating that any unclaimed element is essential for the implementation of the claimed subject matter. The scope of the claims includes all modifications and equivalents of the subject matter described therein as permitted by applicable law. In addition, unless otherwise stated here or the context is obviously contradictory, the claims cover any combination of all possible variations of the above elements. In addition, various aspects of different embodiments can be combined or replaced with each other. Finally, the description of any reference or patent herein, even if identified as "previous", is not intended to constitute such a reference or patent as an admission of the prior art for the present disclosure.

Claims

1. A heating device (20) for heat treating a component (21), the heating device comprising: a platform (40) formed of a thermally conductive material and defining a platform surface (42) configured to engage a first surface (44) of the component (21); A stage induction heating circuit (52) is thermally coupled to the stage (40) and is configured to generate a processing temperature on the stage surface (42), the stage induction heating circuit (52) comprising a plurality of stage induction coil circuits (62) electrically coupled in parallel to each other, wherein each of the plurality of stage induction coil circuits (62) comprises a stage electrical conductor (70) and a stage smart susceptor (72) having a Curie temperature, the plurality of stage induction coil circuits (62) comprising: a first stage induction coil circuit (102b) that follows a first path (104) across the stage (40), the first path (104) comprising a first end (104a) and a second end (104b) spaced apart and joined by a middle portion (104c), wherein the first stage induction coil circuit (102b) has a first stage induction coil length; and a second stage induction coil circuit (102d) that follows a second path (106) across the stage (40), wherein the second path (106) is at least partially nested between the first end (104a) and the second end (104b) of the first path (104), and the second stage induction coil circuit (102d) has a second stage induction coil length that is different from the first stage induction coil length; and A thermal management system (160) comprising a chamber (166) having an interior space (167) adjacent to a rear surface (46) of the table (40), the chamber (166) having an inlet (170) and an outlet (172) in communication with an air source (174), the thermal management system (160) being selectively operable between an insulator mode that blocks air flow through the chamber (166) and a cooling mode that allows air flow through the chamber (166), in: The first induction coil circuit (102b) comprises: a first segment (110) configured to carry current in a first direction along the first path (104); and a second segment (112) located adjacent to the first segment (110) and configured to carry current in a second direction along the first path (104), wherein the first direction along the first path (104) is opposite to the second direction along the first path (104); wherein the first section (110) of the first induction coil circuit (102b) joins the second section (112) of the first induction coil circuit (102b) at a double backrest bend (114); and The second induction coil circuit (102d) comprises: a first segment (116) configured to carry current in a first direction along the second path (106); and A second segment (118) is located adjacent to the first segment (116) and is configured to carry current in a second direction along the second path (106), wherein the first direction along the second path (106) is opposite to the second direction along the second path (106).

2. The heating device (20) according to claim 1, wherein: The first section (116) of the second induction coil circuit (102d) joins the second section (118) of the second induction coil circuit (102d) at a double backrest bend (120).

3. The heating apparatus (20) of claim 2, wherein the plurality of station induction coil circuits (62) further comprises a third station induction coil circuit (102e) that follows a third path (108) across the station (40), wherein the third path (108) is also at least partially nested between the first end (104a) and the second end (104b) of the first path (104), and the third station induction coil circuit (102e) has a third station induction coil length that is different from the first station induction coil length and the second station induction coil length.

4. The heating device (20) of claim 2, wherein the second path (106) includes a first end (106a) and a second end (106b) spaced apart and joined by a middle portion (106c).

5. The heating apparatus (20) of claim 4, wherein the plurality of station induction coil circuits (62) further comprises a third station induction coil circuit (102e) following a third path (108) across the station, wherein the third path (108) is at least partially nested between the first end (106a) and the second end (106b) of the second path (106), and the third station induction coil circuit (102e) has a third station induction coil length that is different from the first station induction coil length and the second station induction coil length.

6. The heating device (20) of claim 4, wherein each of the first path (104) and the second path (106) has a linear hook shape.

7. The heating device (20) according to any one of claims 1 to 6, wherein the first induction coil circuit (102b) and the second induction coil circuit (102d) are arranged in the same plane.

8. The heating device (20) according to any one of claims 1 to 6, wherein: The table electrical conductor (70) of each of the plurality of table induction coil circuits (62) comprises a plurality of electrical conductor strands (70a) in a Litz wire configuration; and The smart susceptor (72) of each of the plurality of inductive coil circuits (62) is wound around the electrical conductor (70) in a spiral configuration.

9. A heating device (20) for heat treating a component (21), the heating device comprising: a platform (40) formed of a thermally conductive material and defining a platform surface (42) configured to engage a first surface (44) of the component (21); A stage induction heating circuit (121) thermally coupled to the stage (40) and configured to generate a processing temperature on the stage surface (42), the stage induction heating circuit (52) comprising a plurality of stage induction coil circuits (122, 124) electrically coupled in parallel to each other, wherein each of the plurality of stage induction coil circuits (122, 124) comprises a stage electrical conductor (70) and a stage smart susceptor (72) having a Curie temperature, the plurality of stage induction coil circuits (122, 124) comprising: a first induction coil circuit (122) having a first end section (122a) and a second end section (122b) spaced apart and joined by a middle section (122c), wherein the first induction coil circuit (122) has a first induction coil length; and a second induction coil circuit (124) having a first end segment (124a) and a second end segment (124b) spaced apart and joined by a middle segment (124c), wherein the second induction coil circuit (124) has a second induction coil length substantially equal to the length of the first induction coil; and wherein the middle section (124c) of the second induction coil circuit (124) overlaps with the middle section (122c) of the first induction coil circuit (122); and A thermal management system (160) comprising a chamber (166) having an interior space (167) adjacent to a rear surface (46) of the table (40), the chamber (166) having an inlet (170) and an outlet (172) in communication with an air source (174), the thermal management system (160) being selectively operable between an insulator mode that blocks air flow through the chamber (166) and a cooling mode that allows air flow through the chamber (166).

10. The heating device (20) of claim 9, wherein the middle section (122c) of the first induction coil circuit (122) includes a first portion and a second portion joined at a vertex (122d), and wherein the middle section (124c) of the second induction coil circuit (124) includes a first portion and a second portion joined at a vertex (124d), and the second portion of the middle section (122c) of the first induction coil circuit (122) overlaps the first portion of the middle section (124c) of the second induction coil circuit (124).

11. The heating device (20) of claim 10, wherein the first end segment (122a) and the second end segment (122b) of the first induction coil circuit (122) are substantially parallel and separated by a first lateral distance, the first end segment (124a) and the second end segment (124b) of the second induction coil circuit (124) are substantially parallel and separated by a second lateral distance, and the first lateral distance is substantially equal to the second lateral distance.

12. The heating apparatus (20) of claim 9, wherein the plurality of induction coil circuits (122) further comprises a third induction coil circuit (126) having a first end segment (126a) and a second end segment (126b) spaced apart joined by a middle segment (126c), wherein the third induction coil circuit (126) has a third induction coil length substantially equal to the first induction coil length and the second induction coil length, and wherein the middle segment (126) of the third induction coil circuit (126) overlaps the middle segments (122c, 124c) of the first induction coil circuit (122) and the second induction coil circuit (124).

13. The heating device (20) according to any one of claims 9 to 12, wherein: The table electrical conductor (70) of each of the plurality of table induction coil circuits (122, 124) comprises a plurality of electrical conductor strands (70a) in a Litz wire configuration; and The smart susceptor (72) of each of the plurality of inductive coil circuits (122, 124) is wound around the electrical conductor (70) in a spiral configuration.

14. The heating device (20) according to any one of claims 9 to 12, further comprising an insulating layer (128) arranged between the middle sections (122c, 124c) of the first induction coil (122) and the second induction coil (124).

15. A heating device (20) for heat treating a component (21), the heating device comprising: a platform (40) formed of a thermally conductive material and defining a platform surface (42) configured to engage a first surface (44) of the component (21); A stage induction heating circuit (52 or 121) thermally coupled to the stage (40) and configured to generate a processing temperature on the stage surface (42), the stage induction heating circuit (52 or 121) comprising a plurality of stage induction coil circuits (62 or 122, 124) electrically coupled in parallel to each other, wherein each of the plurality of stage induction coil circuits (62 or 122, 124) comprises a stage electrical conductor (70) and a stage smart susceptor (72) having a Curie temperature, the plurality of stage induction coil circuits (62 or 122, 124) comprising: a first induction coil circuit (102d or 122), the first induction coil circuit comprising a plurality of first induction coil circuit segments extending substantially parallel to each other, the plurality of first induction coil circuit segments comprising at least a first pair of segments and a second pair of segments spaced apart from the first pair of segments, wherein the first induction coil circuit segments of the first pair of segments are positioned directly adjacent to each other and are configured to carry current in opposite directions from each other, and the first induction coil circuit segments of the second pair of segments are positioned directly adjacent to each other and are configured to carry current in opposite directions from each other; and a second induction coil circuit (102b or 124), the second induction coil circuit comprising a plurality of second induction coil circuit segments extending substantially parallel to each other, the plurality of second induction coil circuit segments comprising at least a first pair of segments and a second pair of segments spaced apart from the first pair of segments, wherein the second induction coil circuit segments of the first pair of segments are positioned directly adjacent to each other and are configured to carry current in opposite directions from each other, and the second induction coil circuit segments of the second pair of segments are positioned directly adjacent to each other and are configured to carry current in opposite directions from each other; and A thermal management system (160) comprising a chamber (166) having an interior space (167) adjacent to a rear surface (46) of the table (40), the chamber (166) having an inlet (170) and an outlet (172) in communication with an air source (174), the thermal management system (160) being selectively operable between an insulator mode that blocks air flow through the chamber (166) and a cooling mode that allows air flow through the chamber (166).

16. The heating device (20) of claim 15, wherein the first induction coil circuit segment of the first pair of segments is joined at a first double back bend (114) and the second induction coil circuit segment of the second pair of segments is joined at a second double back bend (120).

17. The heating device (20) of claim 15, wherein the first induction coil circuit (102d) is at least partially nested within the second induction coil circuit (102b).

18. The heating device (20) of claim 17, wherein the first induction coil circuit (102d) and the second induction coil circuit (102b) are arranged in the same plane.

19. The heating device (20) of claim 15, wherein the first induction coil circuit (122) has a first middle portion (122c), and the second induction coil circuit (124) has a second middle portion (124c) overlapping the first middle portion (122c).

20. The heating device (20) according to any one of claims 15 to 19, wherein: The table electrical conductor (70) of each of the plurality of table induction coil circuits (62 or 122, 124) comprises a plurality of electrical conductor strands (70a) in a Litz wire configuration; and The smart susceptor (72) of each of the plurality of inductive coil circuits (62 or 122, 124) is wound around the electrical conductor (70) in a spiral configuration.

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