Electronic atomization device and its atomization core

Abstract

The present invention discloses an electronic atomization device and its atomization core. The atomization core includes a porous substrate and a heating circuit. The porous substrate has a bottom surface and a side surface connected to the bottom surface; the heating circuit is combined on the bottom surface and at least part of the side surface, and the heating circuit is used to generate heat when powered on to heat and atomize the atomizable liquid matrix at and near the porous substrate covered by the heating circuit. By arranging the heating circuit on the bottom surface and at least part of the side surface of the atomization core, compared with the single atomization surface in the related art, the atomization area in this embodiment is increased, thereby increasing the aerosol amount. And when the heating circuit on one of the atomization surfaces is damaged and open-circuited, the heating circuits on the remaining atomization surfaces can continue to work to improve the reliability of the atomization core; and the risk of liquid leakage from the side surface of the atomization core can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic atomization, and particularly relates to an electronic atomization device and an atomization core thereof. Background Art

[0002] An electronic atomization device stores a liquid matrix such as e-liquid inside. The liquid matrix can be heated and atomized to generate an aerosol for users to inhale. The aerosol generated by the electronic atomization device generally does not contain harmful components such as tar and suspended particles, and can reduce the harm to the user's body.

[0003] Currently, the atomization core of an electronic atomization device generally uses the bottom surface as the atomization surface. The atomization area is small, the aerosol volume is small, and the atomization effect is not ideal. To obtain a large aerosol volume, the method of increasing the operating power of the atomization core is often adopted. However, increasing the operating power of the atomization core will cause the working temperature of the heating circuit to rise. In this way, it is easy to cause the dry burning phenomenon, which not only increases the risk of generating harmful and toxic substances, but also to obtain high reliability of the atomization core working. Once one point of the heating circuit of this atomization surface is open-circuited and fails, the atomization core will be scrapped and unable to work, affecting the service life of the electronic atomization device. Summary of the Invention

[0004] The present invention provides an electronic atomization device and an atomization core thereof to solve the technical problems of small atomization volume and low working reliability of the atomization core in the prior art.

[0005] To solve the above technical problems, a technical solution adopted by the present invention is: to provide an atomization core, including: a porous substrate having a bottom surface and a side surface connected to the bottom surface; and a heating circuit combined on the bottom surface and at least part of the side surface, the heating circuit being used to generate heat when powered on to heat and atomize the atomizable liquid matrix at the porous substrate covered by the heating circuit.

[0006] According to a specific embodiment of the present invention, the material for forming the heating circuit includes at least one of silver, silver palladium, gold, and platinum, and the thickness of the heating circuit is 0.1 μm - 10 μm.

[0007] According to a specific embodiment of the present invention, the material for forming the porous substrate includes silica-based porous ceramics, alumina porous ceramics, silicon carbide porous ceramics, silicon nitride porous ceramics, aluminum nitride porous ceramics, cordierite porous ceramics, or mullite porous ceramics; or the porosity of the porous substrate is 50% - 70%; or the pore diameter of the micropores on the porous substrate is 10 μm - 100 μm.

[0008] According to a specific embodiment of the present invention, the heating circuit is arranged in a mesh cross pattern, and the mesh diameter of the heating circuit is 10 μm - 100 μm; or the heating circuit includes a plurality of closed loops, and the plurality of closed loops are connected to each other.

[0009] According to a specific embodiment of the present invention, the porous substrate includes a liquid storage part and a heating part arranged in a stepped shape. The bottom surface is the surface of the heating part facing away from the liquid storage part. The porous substrate has a top surface opposite to the bottom surface. The top surface is the surface of the liquid storage part facing away from the heating part. A liquid storage groove is provided on the liquid storage part. The liquid storage groove has an opening located on the top surface. The liquid storage groove is used to accommodate the atomizable liquid matrix. The heating circuit is combined on at least part of the surface of the heating part.

[0010] According to a specific embodiment of the present invention, in the direction perpendicular to the connection direction of the liquid storage part and the heating part, the cross-sectional dimension of the liquid storage part is larger than the cross-sectional dimension of the heating part; or the cross-sectional dimension of the liquid storage part is smaller than the cross-sectional dimension of the heating part.

[0011] According to a specific embodiment of the present invention, the heating circuit is combined on the bottom surface and the side surface of the heating part. The cross-sectional area of the heating part remains unchanged or gradually decreases or gradually increases in the direction away from the liquid storage part.

[0012] According to a specific embodiment of the present invention, the side surface of the heating part is a cylindrical surface; or the side surface of the heating part is a plane, and two adjacent planes are perpendicular or inclined to each other.

[0013] According to a specific embodiment of the present invention, the liquid storage groove extends into the heating part and does not penetrate the heating part.

[0014] To solve the above technical problems, another technical solution adopted by the present invention is: to provide an electronic atomization device, the electronic atomization device includes a power supply component and the atomization core as described above. The power supply component is electrically connected to the heating circuit of the atomization core for supplying power to the heating circuit.

[0015] The beneficial effects of the present invention are as follows: Different from the prior art, in the embodiments of the present invention, heating circuits are provided on the bottom surface and at least part of the side surfaces of the atomization core, and the heating circuits are used to heat the atomizable liquid matrix at and near the porous base material covered by the heating circuits. Compared with the single atomization surface in the related art, the atomization area in this embodiment is increased, thereby increasing the aerosol amount. Moreover, when one of the heating circuits on the bottom surface or the side surface is damaged and open-circuited, the heating circuits on the remaining atomization surfaces can continue to work. Only when all the atomization surfaces are completely dry and open-circuited can the atomization core be scrapped. Therefore, the reliability of the atomization core during operation can be improved. In addition, the heating circuits provided on at least part of the side surfaces can heat the atomizable liquid matrix that penetrates to the side surfaces of the atomization core, thereby reducing the risk of liquid leakage from the side surfaces of the atomization core. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings, where:

[0017] Figure 1 is a three-dimensional structural schematic diagram of an atomization core in an embodiment of the present invention;

[0018] Figure 2 is Figure 1 the cross-sectional structural schematic diagram of the atomization core in

[0019] Figure 3 is a structural schematic diagram of a heating circuit in an embodiment of the present invention;

[0020] Figure 4 is a structural schematic diagram of a heating circuit in another embodiment of the present invention;

[0021] Figure 5 is the cross-sectional structural schematic diagram of an atomization core in another embodiment of the present invention;

[0022] Figure 6 is Figure 5 the top-view structural schematic diagram of the atomization core in

[0023] Figure 7 is the top-view structural schematic diagram of an atomization core in another embodiment of the present invention;

[0024] Figure 8 is Figure 7 the cross-sectional structural schematic diagram of the atomization core in

[0025] Figure 9It is a schematic cross-sectional structure diagram of an electronic atomization device in another embodiment of the present invention. Detailed implementation manners

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0027] An embodiment of the present invention provides an atomization core 100. Please refer to Figure 1 and Figure 2 , Figure 1 It is a schematic three-dimensional structure diagram of the atomization core in an embodiment of the present invention, Figure 2 is Figure 1 The schematic cross-sectional structure diagram of the atomization core in. The atomization core 100 includes a porous substrate 10 and a heating circuit 20. Among them, the porous substrate 10 has a bottom surface 14 and a side surface 16 connected to the bottom surface 14. The heating circuit 20 is combined on the bottom surface 14 and at least part of the side surface 16. The heating circuit 20 is used to generate heat when powered on to heat and atomize the atomizable liquid matrix at the porous substrate 10 covered by the heating circuit 20.

[0028] In the embodiment of the present invention, by arranging the heating circuit 20 on the bottom surface 14 and at least part of the side surface 16 of the atomization core 100, and using the heating circuit 20 to heat the atomizable liquid matrix at and near the porous substrate 10 covered by the heating circuit 20, compared with the single atomization surface in the related art, the atomization area in this embodiment is increased, thereby increasing the aerosol amount. Moreover, when one of the heating circuits 20 on the bottom surface 14 or the side surface 16 is damaged and an open circuit occurs, the heating circuit 20 on the remaining atomization surfaces can continue to work. Only when all the atomization surfaces are completely dry and open-circuited can the atomization core 100 be scrapped. Therefore, the working reliability of the atomization core 100 can be improved. And, the heating circuit 20 arranged on at least part of the side surface 16 can heat the atomizable liquid matrix penetrating to the side surface 16 of the atomization core 100, thereby reducing the risk of liquid leakage from the side surface 16 of the atomization core 100.

[0029] Specifically, in this embodiment, a liquid storage tank 11 is provided on the porous substrate 10. The liquid storage tank 11 can communicate with the liquid storage cavity of the electronic atomization device. The liquid storage cavity is used to store the atomizable liquid matrix, such as e-liquid. The liquid storage tank 11 is used to hold the atomizable liquid matrix. Due to the liquid conductivity of the porous substrate 10, the atomizable liquid matrix located in the liquid storage tank 11 will leak to the surface of the porous substrate 10 away from the liquid storage tank 11. The heating circuit 20 is disposed on the bottom surface 14 and at least part of the side surface 16 of the porous substrate 10 away from the liquid storage tank 11. When the heating circuit 20 generates heat, it will heat the atomizable liquid matrix leaking to the area covered by the heating circuit 20 and its vicinity to form an aerosol.

[0030] Optionally, the heating circuit 20 can be combined on one of the side surfaces 16 of the atomization core 100, or can be combined on two relatively arranged side surfaces 16 of the atomization core 100, or can also be combined on all the side surfaces 16 of the atomization core 100. The embodiments of the present invention do not specifically limit the number of side surfaces 16 of the atomization core 100 and the number of side surfaces 16 provided with the heating circuit 20, and can be flexibly set according to needs. For example, in one embodiment, the side surface 16 of the porous substrate 10 can be a cylindrical surface, and the heating circuit 20 is disposed on a part of the cylindrical surface. In another embodiment, the side surface 16 of the porous substrate 10 can be multiple flat surfaces, and the heating circuit 20 is disposed on at least one of the multiple flat surfaces. In yet another embodiment, the side surface 16 of the porous substrate 10 can further include a curved surface and a flat surface, the curved surface and the flat surface are connected to each other, and the heating circuit 20 is disposed on at least one of the curved surface or the flat surface.

[0031] Among them, the porous substrate 10 is made of a material with a porous structure. The porous ceramic has stable chemical properties and will not chemically react with the atomizable liquid matrix; the porous ceramic can withstand high temperatures and will not deform due to excessive heating temperature; the porous ceramic is an insulator and will not be electrically connected to the heating circuit 20 formed thereon to cause a short circuit; the porous ceramic is convenient to manufacture and has a low cost. Therefore, in this embodiment, porous ceramic is selected to make the porous substrate 10. And specifically, it can be silica-based porous ceramic, alumina porous ceramic, silicon carbide porous ceramic, silicon nitride porous ceramic, aluminum nitride porous ceramic, cordierite porous ceramic or mullite porous ceramic, etc. The present invention does not specifically limit the material of the porous substrate 10.

[0032] Optionally, the porosity of the porous substrate 10 is 50%-70%. The porosity refers to the ratio of the total volume of the tiny voids in the porous medium to the total volume of the porous medium. The size of the porosity can be adjusted according to the composition of the e-liquid. For example, when the viscosity of the e-liquid is relatively high, a higher porosity is selected to ensure the liquid guiding effect.

[0033] In a specific embodiment, the porosity of the porous substrate 10 can be set to 50 - 65%, 50 - 60%, 50 - 55%, 55 - 65%, 55 - 60% or 60 - 70%, etc., and the embodiments of the present invention do not make specific limitations.

[0034] Optionally, the pore diameter of the micropores on the porous substrate 10 is 10 μm - 100 μm. For example, in a specific embodiment, the pore diameter of the micropores on the porous substrate 10 can be 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm or 100 μm, etc.

[0035] In the above optional embodiments, by setting the pore diameter and proportion of the micropores with appropriate density, suitable size and uniform distribution, the liquid conduction of the porous substrate 10 can be made uniform, the liquid dropping can be smooth, and the atomization effect can be better.

[0036] Optionally, the material for forming the heating circuit 20 includes at least one of silver, silver palladium, gold, and platinum.

[0037] Among them, the heating circuit 20 can be combined with the surface of the porous substrate 10 by processes such as thick film printing or thin film sputtering, so as to improve the production efficiency of the heating circuit 20, and can also improve the bonding force between the heating circuit 20 and the porous substrate 10, and prevent the heating circuit 20 from falling off during use.

[0038] Optionally, the thickness of the heating circuit 20 is 0.1 μm - 10 μm. Among them, the thickness of the heating circuit 20 refers to the height of the heating circuit 20 protruding from the surface of the porous substrate 10. For example, in a specific embodiment, the thickness of the heating circuit 20 can be 0.1 μm, 0.5 μm, 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 5 μm, 5.5 μm, 6 μm, 6.5 μm, 7 μm, 7.5 μm, 8 μm, 8.5 μm, 9 μm, 9.5 μm or 10 μm, etc.

[0039] Further, as Figure 3 shown, Figure 3It is a schematic structural diagram of a heating circuit in an embodiment of the present invention. In this embodiment, the heating circuit 20 is arranged in a mesh cross pattern. By setting the heating circuit 20 in a mesh cross pattern, the heating circuit 20 can be evenly distributed, thereby making the atomization effect of the atomization core 100 more uniform. At the same time, the density of the mesh-shaped heating circuit 20 is relatively large, which can increase the effective atomization area, reduce the energy loss, and thus improve the effective power of the atomization core 100. Moreover, the mesh cross-shaped heating circuit 20 has more nodes. When one of the heating circuits 20 is damaged and broken, the adjacent heating circuits 20 can still work through the adjacent heating circuits 20, making the area of the open heating circuit 20 smaller and having a smaller impact on the atomization core 100.

[0040] Optionally, the mesh diameter of the heating circuit 20 is 10 μm - 100 μm. Herein, the mesh diameter of the heating circuit 20 refers to the diameter of the circumscribed circle of each mesh unit. By setting the diameter of the circumscribed circle of each mesh unit to 10 μm - 100 μm, the atomization effect of the mesh-shaped heating circuit 20 can be better.

[0041] In a specific embodiment, the diameter of the circumscribed circle of each mesh unit can be set to 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm or 100 μm, etc., and the embodiments of the present invention do not make specific limitations.

[0042] Optionally, the mesh diameters of the heating circuits 20 on the same surface can be equal or unequal, and the mesh diameters of the heating circuits 20 on different surfaces can be equal or unequal, which can be flexibly set according to needs, and the embodiments of the present invention do not make specific limitations.

[0043] Due to the action of gravity, there will be more atomizable liquid matrix on the bottom surface 14 of the porous substrate 10 than on the side surface 16. Therefore, in one embodiment, the mesh diameter of the heating circuit 20 on the bottom surface 14 of the porous substrate 10 can be set to be smaller than the mesh diameter of the heating circuit 20 on the side surface 16 to increase the atomization rate of the atomizable liquid matrix on the bottom surface 14.

[0044] In another embodiment, as Figure 4 shown, Figure 4 It is a schematic structural diagram of a heating circuit in another embodiment of the present invention. The heating circuit 20 includes a plurality of closed loops, and the plurality of closed loops are connected to each other. Specifically, in Figure 3In the illustrated embodiment, the heating circuit 20 is composed of multiple heating wires with a smaller diameter. In this embodiment, however, the heating circuit 20 includes a plurality of interconnected heating sheets, the heating sheets are arranged in a ring shape, and at least part of the adjacent ring-shaped heating sheets are shared to form a plurality of closed circuits connected to each other. By this arrangement, the width of the heating sheet can be enlarged to reduce the resistance of the heating circuit 20, reduce energy loss, and also enhance the strength of a single heating circuit 20 and extend the service life of the heating circuit 20.

[0045] Furthermore, as Figure 1 and Figure 2 shown, in this embodiment, the porous substrate 10 includes a liquid storage part 13 and a heating part 15 arranged in a stepped shape. The bottom surface 14 is the surface of the heating part 15 facing away from the liquid storage part 13. The porous substrate 10 has a top surface 12 opposite to the bottom surface 14. The top surface 12 is the surface of the liquid storage part 13 facing away from the heating part 15. A liquid storage tank 11 is provided on the liquid storage part 13. The liquid storage tank 11 has an opening located on the top surface 12. The liquid storage tank 11 is used to accommodate the atomizable liquid matrix. The heating circuit 20 is combined on at least part of the surface of the heating part 15.

[0046] Specifically, in the direction perpendicular to the connection direction of the liquid storage part 13 and the heating part 15, as Figure 2 shown by the arrow direction D in

[0047]

[0048]

[0049]

[0050] Furthermore, in this embodiment, the heating circuit 20 is formed on the bottom surface 14 of the heating part 15 and all the side surfaces 16 connecting the bottom surface 14 and the surface of the liquid storage part 13 to increase the area of the atomization surface.

[0050] Among them, in this embodiment, as Figure 1 and Figure 2 shown, the side surface of the heating part 15 can be set as a plane to form a prismatic heating part 15.

[0051] Further, when the side surface of the heating part 15 includes multiple planes, two adjacent planes may be perpendicular to each other to form a rectangular cross-section; two adjacent planes may also be inclined relative to each other to form other regular or irregular polygon cross-sections, which are not specifically limited in the embodiments of the present invention.

[0052] Alternatively, in another embodiment, as Figure 5 and Figure 6 shown, Figure 5 is a schematic cross-sectional structure diagram of an atomization core in another embodiment of the present invention, Figure 6 is Figure 5 a schematic top view structure diagram of the atomization core in. The side surface of the heating part 15 may be set as a cylindrical surface to form a cylindrical heating part 15. By setting the side surface of the heating part 15 as a cylindrical surface, it is convenient for the processing and manufacturing of the heating circuit 20, and the coverage area of the heating circuit 20 can also be increased.

[0053] Optionally, in a direction perpendicular to the connection direction of the liquid storage part 13 and the heating part 15, the cross-sectional shape of the liquid storage part 13 and the cross-sectional shape of the heating part 15 may be the same or different.

[0054] For example, in one embodiment, the cross-sectional shape of the liquid storage part 13 and the cross-sectional shape of the heating part 15 are the same. Specifically, as Figure 1 shown, in a direction perpendicular to the connection direction of the liquid storage part 13 and the heating part 15, the cross-sectional shape of the liquid storage part 13 is rectangular, and the cross-sectional shape of the heating part 15 is rectangular. The heating circuit 20 may be formed by sputtering on the bottom surface 14 and all side surfaces 16 of the heating part 15 by means of thin film sputtering.

[0055] Or, in another embodiment, the cross-sectional shape of the liquid storage part 13 and the cross-sectional shape of the heating part 15 are different. Specifically, as Figure 5 and Figure 6 shown, in a direction perpendicular to the connection direction of the liquid storage part 13 and the heating part 15, the cross-sectional shape of the liquid storage part 13 is rectangular, and the cross-sectional shape of the heating part 15 is circular. The heating circuit 20 may be formed by printing on the bottom surface 14 and all side surfaces 16 of the heating part 15 by means of thick film printing.

[0056] Further, as Figure 2 and Figure 5 shown, the cross-sectional area of the heating part 15 remains unchanged in the direction away from the liquid storage part 13, and the heating circuit 20 is combined on the surface of the heating part 15 facing away from the liquid storage part 13 and the side surface 16 of the heating part 15.

[0057] Specifically, in this embodiment, the side surface 16 of the heating part 15 is vertically arranged relative to the bottom surface 14, so that the cross-sectional area of the heating part 15 remains unchanged in the direction away from the liquid storage part 13. By setting the cross-sectional area of the heating part 15 to remain unchanged in the direction away from the liquid storage part 13, it is convenient for the processing of the heating circuit 20. In another embodiment, as Figure 7 and Figure 8 shown, Figure 7 is a top view structural schematic diagram of the atomization core in another embodiment of the present invention, Figure 8 is Figure 7 the cross-sectional view structural schematic diagram of the atomization core in. The cross-sectional area of the heating part 15 gradually decreases in the direction away from the liquid storage part 13, and the heating circuit 20 is combined on the bottom surface 14 of the heating part 15 facing away from the liquid storage part 13 and the side surface 16 of the heating part 15.

[0058] Specifically, in this embodiment, in the direction perpendicular to the connection direction of the liquid storage part 13 and the heating part 15, the cross-sectional shape of the liquid storage part 13 is rectangular, the cross-sectional shape of the heating part 15 is rectangular, and in the direction parallel to the connection direction of the liquid storage part 13 and the heating part 15, the cross-sectional shape of the heating part 15 is trapezoidal, so as to form a trapezoidal columnar structure. The heating circuit 20 can be formed by thin film sputtering on the bottom surface 14 and all side surfaces 16 of the heating part 15.

[0059] Alternatively, in yet another embodiment, it is also possible to set the cross-sectional area of the heating part 15 to gradually increase in the direction away from the liquid storage part 13, and the heating circuit 20 is combined on the bottom surface 14 of the heating part 15 facing away from the liquid storage part 13 and the side surface 16 of the heating part 15. By setting the cross-sectional area of the heating part 15 to gradually increase, the coverage area of the heating circuit 20 can be increased, and the aerosol amount can be improved.

[0060] Furthermore, as Figure 6 and Figure 7 shown, the atomization core 100 further includes an electrode 17, which is connected to the heating circuit 20 and is used to conduct the heating circuit 20 to a power supply component (not shown in the figure).

[0061] Among them, the material used to form the electrode 17 generally selects a metal material with low resistivity, such as gold, silver, etc., and the present invention does not make specific limitations. In this embodiment, silver is selected as the electrode 17, which not only has good electrical conductivity but also relatively low cost.

[0062] Optionally, in this embodiment, the number of electrodes 17 is two, and the two electrodes 17 are respectively located on opposite sides of the heating part 15 and are respectively electrically connected to the heating circuits 20 on the opposite side surfaces of the heating part 15. In another embodiment, the number of electrodes 17 can also be one.

[0063] Furthermore, as Figure 2As shown, the liquid storage tank 11 can be disposed only within the liquid storage portion 13, and the liquid storage tank 11 can also extend into the heating portion 15 without penetrating the heating portion 15. By this arrangement, the distance between the bottom surface 14 of the atomization core 100 and the bottom wall of the liquid storage tank 11 can be shortened, thereby shortening the transmission path of the atomizable liquid matrix, reducing the transmission resistance of the atomizable liquid matrix, and facilitating liquid supply.

[0064] Please refer to Figure 9 , Figure 9 which is a schematic cross-sectional structure view of an electronic atomization device in another embodiment of the present invention. On the other hand, the present invention provides an electronic atomization device 200, which includes a power supply assembly 210 and an atomization core 220. The power supply assembly 210 is electrically connected to the heating circuit of the atomization core 220 for supplying power to the heating circuit.

[0065] Among them, the structure of the atomization core 220 in this embodiment is the same as that of the atomization core 100 in the above embodiment. Please refer to the description in the above embodiment and will not be elaborated here.

[0066] In summary, those skilled in the art can easily understand that in the embodiment of the present invention, by arranging the heating circuit 20 on the bottom surface 14 and at least part of the side surface 16 of the atomization core 100, and using the heating circuit 20 to heat the atomizable liquid matrix at and near the porous substrate 10 covered by the heating circuit 20, compared with the single atomization surface in the related art, the atomization area in this embodiment is increased, thereby increasing the aerosol amount. Moreover, when one of the heating circuits 20 on the bottom surface 14 or the side surface 16 is damaged and open-circuited, the heating circuits 20 on the remaining atomization surfaces can continue to work. Only when all the atomization surfaces are completely dry and open-circuited can the atomization core 100 be scrapped. Therefore, the working reliability of the atomization core 100 can be improved. In addition, the heating circuit 20 arranged on at least part of the side surface 16 can heat the atomizable liquid matrix penetrating the side surface 16 of the atomization core 100, thereby reducing the risk of liquid leakage from the side surface 16 of the atomization core 100.

[0067] The above are only the embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present invention, or directly or indirectly applied to other related technical fields, shall be equally included in the patent protection scope of the present invention.

Claims

1. An atomization core, characterized in that, Comprising: A porous substrate having a bottom surface and a side surface connected to the bottom surface; the porous substrate includes a liquid storage portion and a heating portion arranged in a stepped manner, and the bottom surface is the surface of the heating portion facing away from the liquid storage portion; in a direction perpendicular to the connection direction of the liquid storage portion and the heating portion, the cross-sectional dimension of the liquid storage portion is smaller than the cross-sectional dimension of the heating portion; A heating circuit bonded to the bottom surface and the side surface of the heating portion, and the heating circuit is configured to generate heat when powered on to heat and atomize the atomizable liquid matrix at the porous substrate covered by the heating circuit; Two electrodes are arranged on the surface of the liquid storage portion close to the heating portion and are respectively located on opposite sides of the heating portion, and the two electrodes are electrically connected to the heating circuits on the opposite side surfaces of the heating portion respectively; Wherein, the heating circuits are arranged in a mesh cross pattern, and the mesh diameter of the heating circuits is 10 µm - 100 µm; the mesh diameter of the heating circuits on the bottom surface of the porous substrate is smaller than the mesh diameter of the heating circuits on the side surface of the heating portion.

2. The atomization core according to claim 1, characterized in that, The material for forming the heating circuits includes at least one of silver, silver palladium, gold, and platinum, and the thickness of the heating circuits is 0.1 µm - 10 µm.

3. The atomization core according to claim 1, characterized in that, The material for forming the porous substrate includes silica-based porous ceramics, alumina porous ceramics, silicon carbide porous ceramics, silicon nitride porous ceramics, aluminum nitride porous ceramics, cordierite porous ceramics, or mullite porous ceramics; or The porosity of the porous substrate is 50% - 70%; or The pore diameter of the micropores on the porous substrate is 10 µm - 100 µm.

4. The atomization core according to any one of claims 1-3, characterized in that, The porous substrate has a top surface opposite to the bottom surface, and the top surface is the surface of the liquid storage portion facing away from the heating portion. A liquid storage groove is provided on the liquid storage portion, and the liquid storage groove has an opening on the top surface, and the liquid storage groove is used to accommodate the atomizable liquid matrix.

5. The atomization core according to claim 4, characterized in that, The cross-sectional area of the heating portion remains unchanged, gradually decreases, or gradually increases in a direction away from the liquid storage portion.

6. The atomization core according to claim 4, characterized in that, The side surface of the heating portion is a cylindrical surface; or The side surface of the heating portion is a flat surface, and two adjacent flat surfaces are perpendicular or inclined to each other.

7. The atomization core according to claim 4, characterized in that, The liquid storage groove extends into the heating portion and does not penetrate the heating portion.

8. An electronic atomization device, characterized in that, The electronic atomization device includes a power supply component and an atomization core according to any one of claims 1 - 7, and the power supply component is electrically connected to the heating circuit of the atomization core for supplying power to the heating circuit.

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