Display panel and driving circuit thereof, and display device

Abstract

The present invention discloses a display panel, comprising: an array substrate, comprising a display area and a non-display area; a driving unit, located on at least one side of the array substrate; a peripheral grounding trace, arranged at the periphery of the display area of ​​the array substrate and electrically connected to a first grounding pin of the driving unit; a silver glue dot, arranged in the non-display area of ​​the array substrate, and electrically connected to a second grounding pin of the driving unit through the silver glue dot grounding lead. The present invention also discloses a display device and a display panel driving circuit.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a driving circuit thereof, and a display device. Background Art

[0002] At present, in order to prevent external static electricity from affecting the display panel, major domestic display substrate manufacturers usually stick one end of the conductive tape on the color film substrate and the other end on the silver glue point during the modular stage of making liquid crystal displays, and ensure that the conductive tape is connected to the ground wire lead of the silver glue point to form an anti-static structure, so as to use the conductive tape to release the static electricity accumulated in the color film substrate and the array substrate into the ground wire lead.

[0003] Because conductive tape can enhance the anti-static performance of display modules, and silver glue dots can enhance the anti-static performance of display panels, existing products use the anti-static solution of silver glue dots + conductive tape; if the conductive tape is directly removed, it cannot meet the electrostatic discharge (ESD) test requirements. Although the traditional silver glue dots + conductive tape solution can meet the requirements, this setting method is time-consuming and labor-intensive for mass products, affecting production efficiency. Summary of the invention

[0004] In view of this, one of the objectives of the embodiments of the present invention is to provide a display panel and a driving circuit thereof, and a display device, which can improve production efficiency to a certain extent.

[0005] Based on the above purpose, a first aspect of an embodiment of the present invention provides a display panel, including:

[0006] An array substrate comprising a display area and a non-display area;

[0007] A driving unit, located on at least one side of the array substrate;

[0008] A peripheral grounding wiring is arranged at the periphery of the display area of ​​the array substrate and is electrically connected to the first grounding pin of the driving unit;

[0009] The silver glue dot is arranged in the non-display area of ​​the array substrate and is electrically connected to the second ground pin of the driving unit through a silver glue dot grounding lead.

[0010] Optionally, the number of the driving units is at least two, and at least one ground pin of adjacent driving units is electrically connected to each other.

[0011] Optionally, at least one ground pin of the adjacent driving units is electrically connected to each other through a first auxiliary lead, and the first auxiliary lead is electrically connected to the peripheral ground trace through an auxiliary ground lead.

[0012] Optionally, the number of the driving units is multiple, and the driving unit further includes a third grounding pin; the number of the silver glue dots is at least two, the number of the silver glue dot grounding leads is at least two, the silver glue dots are correspondingly connected to the silver glue dot grounding leads, and two of the silver glue dot grounding leads are respectively arranged on both sides of the non-display area of ​​the array substrate away from the display area;

[0013] The second grounding pins of two driving units among the plurality of driving units are respectively connected to the two silver glue dot grounding leads; the third grounding pin of one of the two driving units is connected to the second grounding pin of the adjacent driving unit through the first auxiliary lead, and the third grounding pin of the other of the two driving units is connected to the third grounding pin of the adjacent driving unit through the first auxiliary lead; the second grounding pins of the other driving units are respectively connected to the third grounding pins of the adjacent driving units through the first auxiliary lead;

[0014] Wherein, the first auxiliary lead is electrically connected to the peripheral grounding lead through an auxiliary grounding lead.

[0015] Optionally, the auxiliary grounding lead includes a first sub-lead and a second sub-lead;

[0016] The first sub-lead is configured to be parallel to a side edge of the array substrate where the driving unit is disposed, and both ends of the first sub-lead are electrically connected to the peripheral grounding trace;

[0017] Two ends of the second sub-lead are respectively connected to the first sub-lead and the first auxiliary lead.

[0018] Optionally, the driving unit further includes a fourth ground pin;

[0019] The first ground pins of two driving units among the multiple driving units are respectively connected to the two ends of the peripheral grounding wiring; the fourth ground pin of one of the two driving units is connected to the first ground pin of the driving unit adjacent to it through the second auxiliary lead, and the fourth ground pin of the other of the two driving units is connected to the fourth ground pin of the driving unit adjacent to it through the second auxiliary lead; the first ground pins of the other driving units are respectively connected to the fourth ground pins of the driving units adjacent to them through the second auxiliary leads.

[0020] Optionally, the driving unit is a chip-on-film circuit.

[0021] Optionally, there is an open circuit between the silver glue point grounding lead and the peripheral grounding wiring.

[0022] Optionally, the peripheral ground trace is located at the outermost side of the non-display area.

[0023] Optionally, the display panel further includes:

[0024] The test wiring is located at a side of the peripheral ground wiring in the non-display area close to the display area and is electrically connected to the test pin of the driving unit.

[0025] Optionally, the test line is arranged at the periphery of the display area of ​​the array substrate, and both ends of the test line are electrically connected to the driving unit.

[0026] Optionally, the test trace is configured to receive a test signal in a test phase and to receive a ground signal in a display phase.

[0027] According to a second aspect of the embodiments of the present invention, a display device is provided, comprising the display panel.

[0028] According to a third aspect of the embodiments of the present invention, a display panel driving circuit is provided, comprising at least one driving unit; the driving unit comprises a first grounding lead and a second grounding lead;

[0029] The first ground lead is configured to be electrically connected to a peripheral ground trace of the display panel;

[0030] The second grounding lead is configured to be electrically connected to the silver glue dot grounding lead of the display panel.

[0031] Optionally, the number of the driving units is at least two, and at least one ground pin of adjacent driving units is electrically connected to each other.

[0032] Optionally, at least one ground pin of the adjacent driving units is electrically connected to each other through a first auxiliary lead, and the first auxiliary lead is electrically connected to the peripheral ground trace through an auxiliary ground lead.

[0033] Optionally, there are multiple driving units, and the driving unit further includes a third ground pin;

[0034] The second grounding pins of two driving units among the plurality of driving units are respectively connected to the two silver glue point grounding leads; the third grounding pins of the two driving units are respectively connected to the second grounding pins of the adjacent driving units through the first auxiliary leads; the second grounding pins of the other driving units are respectively connected to the third grounding pins of the adjacent driving units through the first auxiliary leads;

[0035] Wherein, the first auxiliary lead is electrically connected to the peripheral grounding lead through an auxiliary grounding lead.

[0036] Optionally, the driving unit further includes a fourth ground pin;

[0037] The first ground pins of two driving units among the multiple driving units are respectively connected to the two ends of the peripheral grounding wiring; the fourth ground pins of the two driving units are respectively connected to the first ground pins of the driving units adjacent thereto through the second auxiliary leads; the first ground pins of the other driving units are respectively connected to the fourth ground pins of the driving units adjacent thereto through the second auxiliary leads.

[0038] Optionally, the driving unit is a chip-on-film circuit.

[0039] From the above description, it can be seen that the display panel and its driving circuit and display device provided by the embodiments of the present invention, by setting a peripheral grounding trace and a silver glue point grounding lead, and making these two grounding traces electrically connected to the grounding trace of the driving unit, and the driving unit itself is electrically connected to the external printed circuit board, so that the static electricity of the peripheral grounding trace and the silver glue point grounding lead can be guided to the grounding end of the printed circuit board, so that the peripheral grounding trace and the silver glue point grounding lead can both play a role in reducing static electricity, so that the conductive tape at the silver glue point position in the existing design scheme can be removed, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present invention, but are not intended to limit the present invention.

[0041] Figure 1 A schematic structural diagram of a display panel according to an embodiment of the present invention;

[0042] Figure 2 is a schematic structural diagram of yet another embodiment of a display panel according to an embodiment of the present invention;

[0043] Figure 3A A schematic diagram of pin distribution of a driving unit in a display panel according to an embodiment of the present invention;

[0044] Figure 3B Another schematic diagram of pin distribution of a driving unit in a display panel according to an embodiment of the present invention;

[0045] Figure 3C Schematic diagram of another pin distribution of a driving unit in a display panel according to an embodiment of the present invention. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] Unless otherwise defined, the technical terms or scientific terms used in this disclosure should be understood by people with ordinary skills in the field to which the present invention belongs. The "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0048] Figure 1 A schematic structural diagram of a display panel according to an embodiment of the present invention is shown.

[0049] like Figure 1 The display panel comprises:

[0050] An array substrate comprises a display area 12 and a non-display area 11;

[0051] A driving unit 20 is located on at least one side of the array substrate; optionally, the driving unit 20 is located on at least one side of the array substrate, which may mean that the driving unit 20 is arranged on the array substrate and is located at at least one side edge of the array substrate, or may mean that the driving unit 20 is not arranged on the array substrate but is only arranged on the outside of at least one side edge of the array substrate; for example, when the driving unit 20 is a circuit using a chip-on-glass (COG) packaging process, the driving unit 20 may be arranged on the array substrate; for another example, when the driving unit is a circuit using a chip-on-film (COF) packaging process, the driving unit 20 may be arranged on the outside of the array substrate, and in this case, the driving unit 20 may be arranged on a flexible printed circuit board (FPC);

[0052] like Figure 1 As shown, in this embodiment, the number of the driving units 20 is two, and each driving unit 20 includes a first ground pin GND1, a second ground pin GND2, a third ground pin GND3 and a fourth ground pin GND4;

[0053] A peripheral grounding trace 30 is disposed at the periphery of the display area 12 of the array substrate and is electrically connected to the first ground pin GND1 of the driving unit 20;

[0054] The silver glue dot 40 is disposed in the non-display area 11 of the array substrate and is electrically connected to the second ground pin GND2 of the driving unit 20 through a silver glue dot grounding lead 41 .

[0055] It can be seen from the above embodiments that the display panel provided by the embodiments of the present invention, by setting a peripheral grounding trace and a silver glue dot grounding lead, and making these two grounding traces electrically connected to the grounding trace of the driving unit, and the driving unit itself is electrically connected to the external printed circuit board, so that the static electricity of the peripheral grounding trace and the silver glue dot grounding lead can be guided to the grounding end of the printed circuit board, so that the peripheral grounding trace and the silver glue dot grounding lead can both play a role in reducing static electricity, so that the conductive tape at the silver glue dot position in the existing design scheme can be removed, thereby improving production efficiency.

[0056] Among them, the silver glue dots are electrically connected to the color film substrate, and the design of the silver glue dot grounding lead can guide the static electricity inside the display panel to the outside, while the peripheral grounding trace is arranged around the periphery of the display area of ​​the array substrate, so as to shield the external static electricity well. The combination of the two can achieve the anti-static effect on the display panel as a whole.

[0057] Alternatively, if Figure 1As shown, at least one ground pin of adjacent driving units 20 is electrically connected to each other. By electrically connecting the ground pins of adjacent driving units 20, the signal between the driving chips can be more stable and is not easily pulled by static electricity.

[0058] Alternatively, if Figure 1 As shown, at least one ground pin of the adjacent driving unit 20 is electrically connected to each other through a first auxiliary lead 31, and the first auxiliary lead 31 is electrically connected to the peripheral grounding trace 30 through an auxiliary grounding lead 33. Such a design enables the peripheral grounding trace 30, the auxiliary grounding lead 33, the first auxiliary lead 31 and the driving unit 20 to form a grounding trace closed loop, thereby better shielding static electricity, and thus being able to completely remove the conductive tape in the prior art.

[0059] For example, Figure 1 As shown, when there are two driving units 20, the driving unit 20 further includes a third ground pin GND3 and a fourth ground pin GND4, the fourth ground pin GND4 is electrically connected to the fourth ground pin GND4 of the adjacent driving unit 20 through the second auxiliary lead 32, and the third ground pin GND3 is electrically connected to the third ground pin GND3 of the adjacent driving unit 20 through the first auxiliary lead 31. The adjacent driving units 20 are electrically connected to the ground pins through the second auxiliary lead 32, so that the signal between the driving chips can be more stable and not easily pulled by static electricity; at the same time, the peripheral grounding wiring 30, the auxiliary grounding lead 33, the first auxiliary lead 31 and the driving unit 20 form a grounding wiring closed loop, so as to better shield static electricity, and thus the conductive tape in the prior art can be completely removed.

[0060] Alternatively, if Figure 1 As shown, the auxiliary grounding lead 33 includes a first sub-lead 331 and a second sub-lead 332; the first sub-lead 331 is configured to be parallel to a side edge of the array substrate where the driving unit 20 is set, and both ends of the first sub-lead 331 are electrically connected to the peripheral grounding trace 30; the two ends of the second sub-lead 332 are respectively connected to the first sub-lead 331 and the first auxiliary lead 31. This design of the auxiliary grounding lead 33 can better save wiring space. Of course, it can be imagined that the function of the auxiliary grounding lead 33 is mainly to form a closed loop design of the peripheral grounding trace 30. Therefore, as long as the ground pin of the driving chip can be electrically connected to the peripheral grounding trace 30 to form a closed loop, such a wiring design of the auxiliary grounding lead 33 should fall within the protection scope of the present invention.

[0061] Optionally, the driving unit 20 may be a chip-on-film circuit.

[0062] COF, the full name of which is Chip On Flex or Chip On Film, is called Chip On Film in Chinese. Compared with the traditional chip on glass (COG), the biggest improvement of COF is that the touch IC and other chips are fixed on the flexible circuit board with a soft film structure, and the soft additional circuit board is used as the chip carrier to connect the chip with the flexible substrate circuit. A more intuitive statement is that the IC is embedded in the flexible printed circuit (FPC), that is, attached to the cable between the screen and the printed circuit board (PCB).

[0063] COF packaging technology is a very important packaging technology in the current era of full-screen displays, and is generally used in flagship mobile phones. The so-called COF packaging refers to placing the driver IC originally packaged on the substrate on the cable, and can be folded back at the same time. The COF packaging process can be used for liquid crystal displays (LCDs) and organic electroluminescent screens (OLEDs).

[0064] In this way, the embodiment of the present invention is applied to a display screen that adopts the COF packaging process. On the one hand, the grounding of the ground lead can be more easily achieved by using the COF circuit; at the same time, because the COF process is adopted, the embodiment of the present invention can be applied to a full screen and can better achieve the anti-static performance of the full screen.

[0065] Alternatively, if Figure 1 As shown, there is an open circuit between the silver glue point grounding lead 41 and the peripheral grounding line 30. In this way, when static electricity breaks through the silver glue point grounding lead 41, the peripheral grounding line 30 can still work normally to play an anti-static role.

[0066] Alternatively, if Figure 1 As shown, the peripheral grounding trace 30 is located at the outermost side of the non-display area 11. In this way, the peripheral grounding trace is arranged at the outermost side to surround the internal circuit structure, thereby better preventing the influence of external static electricity on the internal circuit.

[0067] As an optional embodiment, Figure 1 As shown, the display panel also includes:

[0068] The test trace 50 is located on a side of the peripheral ground trace 30 close to the display area 12 in the non-display area 11 and is electrically connected to the test pin ADD of the driving unit 20 .

[0069] For example, the test trace 50 is an array test (AT) trace, which is usually electrically connected to an AT circuit disposed in an idle area of ​​a display panel motherboard, so as to complete the test under the test signal provided by the AT circuit. In this way, the AT trace needs to be connected to the AT circuit outside the display panel, and after the test is completed, the display panel motherboard needs to be cut into individual display panels, and the AT trace connected to the AT circuit will be cut off, thereby forming a trace break at the edge of the display panel, and such a break will cause static electricity, thereby affecting the operation of the display panel.

[0070] In order to avoid such problems, the present application sets the test trace 50 inside the display panel and electrically connects it to the test pin of the driving unit 20, so that the test can be completed by providing a test signal to the driving unit 20, without leading the test trace 50 to the outside of the display panel, so that when the motherboard is cut, no cut end of the test lead will be left, thereby avoiding static electricity caused by the cut end.

[0071] Alternatively, if Figure 1 As shown, there is an open circuit between the test line 50 and the peripheral ground line 30, and there is also an open circuit between the test line 50 and the silver glue point ground lead 41. On the one hand, this prevents signals from interfering with each other. On the other hand, when one of the lines fails due to electrostatic breakdown, the other lines can still work normally.

[0072] As an optional embodiment, Figure 1 As shown, the test trace 50 is arranged outside the display area 12 of the array substrate, and both ends of the test trace 50 are electrically connected to the drive unit 20. In this way, the test trace 50 is arranged outside the display area 12, and the test trace 50 and the drive unit 20 form a closed loop together, so that when the peripheral ground trace 30 fails, the test trace 50 can replace the peripheral ground trace 30 and play the role of the peripheral ground trace 30, that is, the role of shielding static electricity. Optionally, when it is necessary to set an AT circuit, the AT circuit can be set on the top of the display panel (with Figure 2 For example), when the test trace 50 is arranged around the periphery of the display area 12, it can be connected to the top AT circuit at the same time.

[0073] Optionally, the test trace 50 is configured to receive a test signal in the test phase and to receive a ground signal in the display phase; thus, once the test is completed through the test trace 50 in the test phase, in the display phase, by receiving the ground signal, the test trace 50 can play the same role as the peripheral ground trace 30, thereby further improving the anti-static performance of the display panel.

[0074] In addition, if Figure 1As shown, in addition to the structure shown, the display panel may also include a color filter substrate. The dotted line 60 is the projection of the edge of the color filter substrate on the array substrate after the box is opened. The part outside the dotted line is the part of the array substrate that is not covered by the color filter substrate, which usually includes some external circuit structures and wiring, etc. Of course, there are fan-out areas and fan-out lines between the wiring area of ​​the array substrate and the driver chip. The fact that these lines are not shown in the figure does not mean that these lines are not arranged in the array substrate. Figure 1 As shown, the silver glue dots 40 are arranged between the edge of the color filter substrate and the array substrate, and are used to lead the static electricity of the color filter substrate through the silver glue dots 40 and the silver glue dot grounding leads 41 to the external circuit, thereby reducing the static electricity of the color filter substrate.

[0075] In addition, if Figure 1 As shown, the display panel also includes a printed circuit board 70, and the first ground pin GND1, the second ground pin GND2, the third ground pin GND3 and the fourth ground pin GND4 of the driving chip 20 are all electrically connected to the ground lead of the printed circuit board 70, so that grounding can be achieved by conducting the ground signal between the ground pin of the driving chip 20 and the ground lead of the printed circuit board 70.

[0076] Figure 2 A schematic structural diagram of yet another embodiment of a display panel according to an embodiment of the present invention is shown.

[0077] like Figure 2 As shown, the display panel comprises:

[0078] An array substrate, comprising a display area 12 and a non-display area 11; optionally, a gate driving circuit 13 (Gate on Array, GOA for short) may also be provided in the non-display area 11 of the array substrate;

[0079] The driving unit 20 is located on at least one side of the array substrate; optionally, the driving unit 20 may be arranged on both sides or multiple sides of the array substrate in addition to being arranged on one side of the array substrate; Figure 2 As shown, in this embodiment, there are multiple driving units 20, and each driving unit 20 includes a first ground pin GND1 / GND1', a second ground pin GND2 / GND2', a third ground pin GND3 / GND3', and a fourth ground pin GND4 / GND4'.

[0080] The peripheral grounding wiring 30 is arranged at the periphery of the display area 12 of the array substrate and is electrically connected to the first grounding pin GND1 of the driving unit 20; optionally, as Figure 1 As shown, the peripheral grounding trace 30 is arranged around the outside of the three sides of the display area 12 , so as to be formed at the periphery of the display area 12 .

[0081] The silver glue dot 40 is disposed in the non-display area 11 of the array substrate and is electrically connected to the second ground pin GND2 of the driving unit 20 through a silver glue dot grounding lead 41 .

[0082] There are multiple drive units 20, and at least one ground pin of adjacent drive units 20 is electrically connected to each other. By electrically connecting the ground pins of adjacent drive units 20, the signal between the drive chips can be more stable and is not easily pulled by static electricity.

[0083] For example, Figure 2 As shown, the number of the silver glue dots 40 is at least two, the number of the silver glue dot grounding leads 41 is at least two, the silver glue dots 40 are connected to the silver glue dot grounding leads 41 correspondingly, and two of the silver glue dot grounding leads 41 are respectively arranged on both sides of the non-display area 11 of the array substrate away from the display area;

[0084] The second ground pins GND2 of two driving units 20 in the plurality of driving units 20 are respectively connected to the two silver glue point ground leads 41; one of the two driving units 20 (see Figure 2 The third ground pin GND3 of the leftmost driving unit in the figure is connected to the second ground pin GND2' of the adjacent driving unit 20 through the first auxiliary lead 31. The other of the two driving units (see Figure 2 The third ground pin GND3 of the rightmost driving unit in the embodiment is connected to the third ground pin GND3' of the adjacent driving unit through the first auxiliary lead 31; the second ground pins GND2' of other driving units are respectively connected to the third ground pins GND3' of the adjacent driving units through the first auxiliary lead 31; for example, Figure 2 As shown, the second ground pin GND2 of the leftmost driving unit 20 is connected to the silver glue dot ground lead 41, and the third ground pin GND3 of the leftmost driving unit 20 is connected to the second ground pin GND2' of the adjacent driving unit 20;

[0085] The first auxiliary lead 31 is electrically connected to the peripheral grounding wire 30 through an auxiliary grounding lead 33 .

[0086] Such a design enables the peripheral grounding line 30, the auxiliary grounding lead 33, the first auxiliary lead 31 and the driving unit 20 to form a grounding line closed loop, thereby better shielding static electricity and completely removing the conductive tape in the prior art.

[0087] For example, Figure 2As shown, the driving unit further includes a fourth ground pin; the first ground pins GND1 of two driving units 20 in the plurality of driving units 20 are respectively connected to the two ends of the peripheral ground trace 30; one of the two driving units 20 (see Figure 2 The fourth ground pin GND4 of the leftmost driving unit in the figure is connected to the first ground pin GND1' of the adjacent driving unit 20 through the second auxiliary lead 32. Figure 2 The fourth ground pin GND4 of the rightmost driving unit in the figure is connected to the fourth ground pin GND4' of the adjacent driving unit through the second auxiliary lead; the first ground pins GND1' of the other driving units 20 are respectively connected to the fourth ground pins GND4' of the adjacent driving units 20 through the second auxiliary lead 32; for example, Figure 2 As shown, the first ground pin GND1 of the leftmost driving unit 20 is connected to one end of the peripheral ground trace 30 , and the fourth ground pin GND4 of the leftmost driving unit 20 is connected to the first ground pin GND1 ′ of the adjacent driving unit 20 through the second auxiliary lead 32 .

[0088] Alternatively, if Figure 2 As shown, a plurality of the driver chips 20 are arranged in parallel on one side of the non-display area 11; the two driver chips 20 connected to the peripheral grounding trace 30 and the silver glue dot grounding lead 41 are respectively arranged at the head and tail positions of the entire row of driver chips. In this way, the two driver chips 20 connected to the peripheral grounding trace 30 and the silver glue dot grounding lead 41 are respectively arranged on the outermost sides to better avoid crossing of the traces, and the wiring is neater and simpler.

[0089] It should be noted that, according to the above description, the peripheral grounding wire 30 is connected to the first grounding pin of the driving unit 20, and the silver glue dot grounding wire 41 is connected to the second grounding pin of the driving unit 20. Figure 2 Although the ground pins of the left driving unit 20 are the first, second, third and fourth ground pins from left to right, the ground pins of the rightmost driving unit 20 should be the fourth, third, second and first ground pins from left to right for the sake of neat wiring (avoiding wiring crossing) (see the attached figure). Figure 3C ). However, it should be understood that although the ground pins are distinguished by the first, second, third, and fourth pins, they are actually all pins that play a grounding role, so there is actually no difference. How to connect with the wiring and how to connect the ground wiring between the driving units can also be selected as needed, and the protection scope should not be limited to the embodiments of the present invention.

[0090] Alternatively, if Figure 2As shown, the auxiliary grounding lead 33 includes a first sub-lead 331 and a second sub-lead 332; the first sub-lead 331 is configured to be parallel to a side edge of the array substrate where the driving unit 20 is set, and both ends of the first sub-lead 331 are electrically connected to the peripheral grounding trace 30; the number of the second sub-leads 332 includes multiple ones, and the two ends of each second sub-lead 332 are respectively connected to the first sub-lead 331 and the first auxiliary lead 31 corresponding thereto. This design of the auxiliary grounding lead 33 can better save wiring space. Of course, it can be imagined that the function of the auxiliary grounding lead 33 is mainly to form a closed loop design of the peripheral grounding trace 30. Therefore, as long as the ground pin of the driving chip can be electrically connected to the peripheral grounding trace 30 to form a closed loop, such a wiring design of the auxiliary grounding lead 33 should belong to the protection scope of the present invention.

[0091] It can be seen from the above embodiments that the display panel provided by the embodiments of the present invention, by setting a peripheral grounding trace and a silver glue dot grounding lead, and making these two grounding traces electrically connected to the grounding trace of the driving unit, and the driving unit itself is electrically connected to the external printed circuit board, so that the static electricity of the peripheral grounding trace and the silver glue dot grounding lead can be guided to the grounding end of the printed circuit board, so that the peripheral grounding trace and the silver glue dot grounding lead can both play a role in reducing static electricity, so that the conductive tape at the silver glue dot position in the existing design scheme can be removed, thereby improving production efficiency.

[0092] Optionally, the driving unit 20 is a chip-on-film circuit.

[0093] Figures 3A to 3C The pin distribution diagrams of three types of drive units are shown respectively. For example, Figure 3A The pinout diagram of the drive unit shown corresponds to Figure 2 The leftmost drive unit, Figure 3B The pinout diagram of the drive unit shown corresponds to Figure 2 The three drive units in the middle, Figure 3C The pinout diagram of the drive unit shown corresponds to Figure 2 The rightmost drive unit.

[0094] For example, the first ground pin GND1 of the leftmost driving unit 20 and the first ground pin GND1 of the rightmost driving unit 20 are respectively connected to the two ends of the peripheral grounding line 30; the second ground pin GND2 of the leftmost driving unit 20 and the second ground pin GND2 of the rightmost driving unit 20 are respectively connected to the silver glue point grounding leads 41 on both sides; the test pin ADD of the leftmost driving unit 20 and the test pin ADD of the rightmost driving unit 20 are respectively connected to the two ends of the test line 50; the third ground pin GND2 of the leftmost driving unit 20 is respectively connected to the two ends of the test line 50; Pin GND3 and the fourth ground pin GND4 are respectively connected to the second ground pin GND2' and the first ground pin GND1' of the adjacent driving unit; the third ground pin GND3 and the fourth ground pin GND4 of the rightmost driving unit 20 are respectively connected to the second ground pin GND2' and the first ground pin GND1' of the adjacent driving unit; the third ground pin GND3' and the fourth ground pin GND4' of other driving units are respectively connected to the second ground pin GND2' and the first ground pin GND1' of the adjacent driving unit.

[0095] Alternatively, if Figure 2 As shown, there is an open circuit between the silver glue point grounding lead 41 and the peripheral grounding line 30. In this way, when static electricity breaks through the silver glue point grounding lead 41, the peripheral grounding line 30 can still work normally to play an anti-static role.

[0096] Alternatively, if Figure 2 As shown, the peripheral grounding trace 30 is located at the outermost side of the non-display area 11. In this way, the peripheral grounding trace is arranged at the outermost side to surround the internal circuit structure, thereby better preventing the influence of external static electricity on the internal circuit.

[0097] As an optional embodiment, Figure 2 As shown, the display panel also includes:

[0098] The test trace 50 is located on a side of the peripheral ground trace 30 close to the display area 12 in the non-display area 11 and is electrically connected to the test pin ADD of the driving unit 20 .

[0099] For example, the test trace 50 is an array test (AT) trace, which is usually electrically connected to an AT circuit disposed in an idle area of ​​a display panel motherboard, and is used to complete the test under the test signal provided by the AT circuit. In this way, the AT trace needs to be connected to the AT circuit outside the display panel, and after the test is completed, the display panel motherboard needs to be cut into individual display panels, and the AT trace connected to the AT circuit will be cut off, thereby forming a trace break at the edge of the display panel, and such a port will cause static electricity, thereby affecting the operation of the display panel.

[0100] In order to avoid such problems, the present application sets the test trace 50 inside the display panel and electrically connects it to the test pin of the driving unit 20, so that the test can be completed by providing a test signal to the driving unit 20, without leading the test trace 50 to the outside of the display panel, so that when the motherboard is cut, no cut end of the test lead will be left, thereby avoiding static electricity caused by the cut end.

[0101] Alternatively, if Figure 1 As shown, the test line 50 is disconnected from the peripheral ground line 30 and the silver glue point ground lead 41, which prevents signals from interfering with each other on the one hand, and on the other hand, when one of the lines fails due to electrostatic breakdown, the other lines can still work normally.

[0102] As an optional embodiment, Figure 2 As shown, the test trace 50 is arranged outside the display area 12 of the array substrate, and both ends of the test trace 50 are electrically connected to the drive unit 20. In this way, the test trace 50 is arranged outside the display area 12, and the test trace 50 and the drive unit 20 form a closed loop together, so that when the peripheral ground trace 30 fails, the test trace 50 can replace the peripheral ground trace 30 and play the role of the peripheral ground trace 30, that is, the role of shielding static electricity. Optionally, when it is necessary to set an AT circuit, the AT circuit can be set on the top of the display panel (with Figure 2 For example), when the test trace 50 is arranged around the periphery of the display area 12, it can be connected to the top AT circuit at the same time.

[0103] Optionally, the test trace 50 is configured to receive a test signal in the test phase and to receive a ground signal in the display phase; thus, once the test is completed through the test trace 50 in the test phase, in the display phase, by receiving the ground signal, the test trace 50 can play the same role as the peripheral ground trace 30, thereby further improving the anti-static performance of the display panel.

[0104] In addition, if Figure 2As shown, in addition to the structure shown, the display panel may also include a color filter substrate. The dotted line 60 is the projection of the edge of the color filter substrate on the array substrate after the box is opened. The part outside the dotted line is the part of the array substrate that is not covered by the color filter substrate, which usually includes some external circuit structures and wiring, etc. Of course, there are fan-out areas and fan-out lines between the wiring area of ​​the array substrate and the driver chip. The fact that these lines are not shown in the figure does not mean that these lines are not arranged in the array substrate. Figure 2 As shown, the silver glue dots 40 are arranged between the edge of the color filter substrate and the array substrate, and are used to lead the static electricity of the color filter substrate through the silver glue dots 40 and the silver glue dot grounding leads 41 to the external circuit, thereby reducing the static electricity of the color filter substrate.

[0105] In addition, if Figure 2 As shown, the display panel also includes a printed circuit board 70, and the first ground pin GND1, the second ground pin GND2, the third ground pin GND3 and the fourth ground pin GND4 of the driving chip 20 are all electrically connected to the ground lead of the printed circuit board 70, so that grounding can be achieved by conducting the ground signal between the ground pin of the driving chip 20 and the ground lead of the printed circuit board 70.

[0106] Compared with the traditional solution, the display panel provided by the embodiment of the present invention has an ESD capability that ensures that the ESD test passes smoothly without the risk of burning circuits inside the screen.

[0107] An embodiment of the present invention further provides a display device, comprising any embodiment of the display panel as described above or an arrangement or combination of the embodiments.

[0108] It should be noted that the display device in this embodiment can be: electronic paper, mobile phone, tablet computer, television, notebook computer, digital photo frame, navigator, or any other product or component with a display function.

[0109] It can be seen from the above embodiments that the display device provided by the embodiments of the present invention, by setting a peripheral grounding trace and a silver glue dot grounding lead, and making these two grounding traces electrically connected to the grounding trace of the driving unit, and the driving unit itself is electrically connected to the external printed circuit board, so that the static electricity of the peripheral grounding trace and the silver glue dot grounding lead can be guided to the grounding end of the printed circuit board, so that the peripheral grounding trace and the silver glue dot grounding lead can both play a role in reducing static electricity, so that the conductive tape at the silver glue dot position in the existing design scheme can be removed, thereby improving production efficiency.

[0110] The embodiment of the present invention also provides a display panel driving circuit. Figure 1 As shown, the display panel driving circuit includes at least one driving unit 20; the driving unit 20 includes a first grounding lead GND1 and a second grounding lead GND2;

[0111] The first ground lead GND1 is configured to be electrically connected to the peripheral ground trace 30 of the display panel;

[0112] The second ground lead GND2 is configured to be electrically connected to the silver glue dot ground lead 41 of the display panel.

[0113] It can be seen from the above embodiments that the display panel driving circuit provided by the embodiments of the present invention, by setting the first grounding lead and the second grounding lead to connect the peripheral grounding trace and the silver glue point grounding lead of the display panel, and the driving unit itself is electrically connected to the external printed circuit board, so that the static electricity of the peripheral grounding trace and the silver glue point grounding lead can be guided to the grounding end of the printed circuit board, so that the peripheral grounding trace and the silver glue point grounding lead of the display panel can both play a role in reducing static electricity, so that the conductive tape at the silver glue point position in the existing design of the display panel can be removed, thereby improving production efficiency.

[0114] Optionally, the number of the driving units is at least two, and at least one ground pin of adjacent driving units is electrically connected to each other. By electrically connecting the ground pins of adjacent driving units, the signal between the driving chips can be more stable and is not easily pulled by static electricity.

[0115] Optionally, at least one ground pin of the adjacent driving units is electrically connected to each other through a first auxiliary lead, and the first auxiliary lead is electrically connected to the peripheral grounding line through an auxiliary grounding lead. With this design, the peripheral grounding line, the auxiliary grounding lead, the first auxiliary lead and the driving unit form a grounding line closed loop, thereby better shielding static electricity, and further completely removing the conductive tape in the prior art.

[0116] Optionally, the number of the driving units is multiple, and the driving unit further includes a third ground pin; the second ground pins of two driving units among the multiple driving units are respectively connected to the two silver glue point ground leads; the third ground pins of the two driving units are respectively connected to the second ground pins of the driving units adjacent thereto through the first auxiliary leads; the second ground pins of other driving units are respectively connected to the third ground pins of the driving units adjacent thereto through the first auxiliary leads; wherein the first auxiliary lead is electrically connected to the peripheral grounding wiring through the auxiliary grounding lead. Such a design can also enable the peripheral grounding wiring, the auxiliary grounding lead, the first auxiliary lead and the driving unit to form a closed loop of the grounding wiring, thereby better shielding static electricity, and further completely removing the conductive tape in the prior art.

[0117] Optionally, there are multiple driving units, and the driving units further include a fourth ground pin; the first ground pins of two driving units among the multiple driving units are respectively connected to the two ends of the peripheral grounding wire; the fourth ground pins of the two driving units are respectively connected to the first ground pins of the adjacent driving units through the second auxiliary lead; the first ground pins of other driving units are respectively connected to the fourth ground pins of the adjacent driving units through the second auxiliary lead. In this way, by electrically connecting the ground pins of adjacent driving units, the signals between the driving chips can be more stable and are not easily pulled by static electricity.

[0118] Optionally, the driving unit is a chip-on-film circuit.

[0119] Those skilled in the art should understand that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A display panel, characterized in that: include: An array substrate comprising a display area and a non-display area; A driving unit, located on at least one side of the array substrate; A peripheral grounding wiring is arranged at the periphery of the display area of ​​the array substrate and is electrically connected to the first grounding pin of the driving unit; A silver glue dot is disposed in a non-display area of ​​the array substrate and is electrically connected to a second ground pin of the driving unit through a silver glue dot grounding lead; A color filter substrate, wherein the silver glue dots are located between the color filter substrate and the array substrate, and the silver glue dots are electrically connected to the color filter substrate; There are multiple driving units, at least one grounding pin of adjacent driving units is electrically connected to each other, and the driving unit further includes a third grounding pin; there are at least two silver glue dots, and there are at least two silver glue dot grounding leads, the silver glue dots are connected to the silver glue dot grounding leads correspondingly, and two of the silver glue dot grounding leads are respectively arranged on both sides of the non-display area of ​​the array substrate away from the display area; The second grounding pins of two driving units among the plurality of driving units are respectively connected to the two silver glue dot grounding leads; the third grounding pin of one of the two driving units is connected to the second grounding pin of the adjacent driving unit through the first auxiliary lead, and the third grounding pin of the other of the two driving units is connected to the third grounding pin of the adjacent driving unit through the first auxiliary lead; the second grounding pins of the other driving units are respectively connected to the third grounding pins of the adjacent driving units through the first auxiliary lead; Wherein, the first auxiliary lead is electrically connected to the peripheral grounding lead through an auxiliary grounding lead.

2. The display panel according to claim 1, characterized in that: At least one ground pin of the adjacent driving units is electrically connected to each other through a first auxiliary lead, and the first auxiliary lead is electrically connected to the peripheral ground trace through an auxiliary ground lead.

3. The display panel according to claim 1, characterized in that: The auxiliary grounding lead includes a first sub-lead and a second sub-lead; The first sub-lead is configured to be parallel to a side edge of the array substrate where the driving unit is disposed, and both ends of the first sub-lead are electrically connected to the peripheral grounding trace; Two ends of the second sub-lead are respectively connected to the first sub-lead and the first auxiliary lead.

4. The display panel according to claim 1, characterized in that: The driving unit further includes a fourth ground pin; The first ground pins of two driving units among the multiple driving units are respectively connected to the two ends of the peripheral grounding wiring; the fourth ground pin of one of the two driving units is connected to the first ground pin of the driving unit adjacent to it through the second auxiliary lead, and the fourth ground pin of the other of the two driving units is connected to the fourth ground pin of the driving unit adjacent to it through the second auxiliary lead; the first ground pins of the other driving units are respectively connected to the fourth ground pins of the driving units adjacent to them through the second auxiliary leads.

5. The display panel according to claim 1, characterized in that: The driving unit is a chip-on-film circuit.

6. The display panel according to claim 1, characterized in that: There is an open circuit between the silver glue point grounding lead and the peripheral grounding wiring.

7. The display panel according to claim 1, characterized in that: The peripheral grounding wiring is located at the outermost side of the non-display area.

8. The display panel according to claim 1, characterized in that: Also includes: The test wiring is located at a side of the peripheral ground wiring in the non-display area close to the display area and is electrically connected to the test pin of the driving unit.

9. The display panel according to claim 8, characterized in that: The test line is arranged at the periphery of the display area of ​​the array substrate, and both ends of the test line are electrically connected to the driving unit.

10. The display panel according to claim 9, characterized in that: The test trace is configured to receive a test signal in a test phase and to receive a ground signal in a display phase.

11. A display device, characterized in that: Comprising the display panel as described in any one of claims 1-10.

12. A display panel driving circuit, applied to the display device according to claim 11, characterized in that: The device comprises at least one driving unit; the driving unit comprises a first grounding lead and a second grounding lead; The first ground lead is configured to be electrically connected to a peripheral ground trace of the display panel; The second grounding lead is configured to be electrically connected to a silver glue dot grounding lead of the display panel; There are multiple driving units, and the driving unit further includes a third ground pin; The second grounding pins of two driving units among the plurality of driving units are respectively connected to the two silver glue point grounding leads; the third grounding pins of the two driving units are respectively connected to the second grounding pins of the adjacent driving units through the first auxiliary leads; the second grounding pins of the other driving units are respectively connected to the third grounding pins of the adjacent driving units through the first auxiliary leads; Wherein, the first auxiliary lead is electrically connected to the peripheral grounding lead through an auxiliary grounding lead.

13. The display panel driving circuit according to claim 12, characterized in that: The number of the driving units is at least two, and at least one ground pin of adjacent driving units is electrically connected to each other.

14. The display panel driving circuit according to claim 13, characterized in that: At least one ground pin of the adjacent driving units is electrically connected to each other through a first auxiliary lead, and the first auxiliary lead is electrically connected to the peripheral ground trace through an auxiliary ground lead.

15. The display panel driving circuit according to claim 12, characterized in that: The driving unit further includes a fourth ground pin; The first ground pins of two driving units among the multiple driving units are respectively connected to the two ends of the peripheral grounding wiring; the fourth ground pins of the two driving units are respectively connected to the first ground pins of the driving units adjacent thereto through the second auxiliary leads; the first ground pins of the other driving units are respectively connected to the fourth ground pins of the driving units adjacent thereto through the second auxiliary leads.

16. The display panel driving circuit according to claim 12, characterized in that: The driving unit is a chip-on-film circuit.

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