Antenna packaging structure and packaging method

Abstract

This invention provides an antenna packaging structure and packaging method. The antenna packaging method forms a first antenna structure on the lower layer and a second antenna structure on the first antenna structure on the second surface of the redistribution layer. When forming the second antenna metal layer in the second antenna structure, the projection of the second antenna metal layer on the first packaging layer can expose the antenna metal body layer. Thus, in subsequent processes, the antenna metal body layer can be exposed by removing the second packaging layer on the antenna metal body layer to form a cavity. While forming a multi-layer antenna structure with stacked arrangement, the attenuation and loss of electromagnetic waves of the antenna metal layer can be reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor packaging, and relates to an antenna packaging structure and a packaging method. Background Art

[0002] With the popularization of high-tech electronic products and the increase in people's needs, especially in order to meet the needs of mobility, most high-tech electronic products have added wireless communication functions.

[0003] Generally speaking, the existing antenna structure usually makes the antenna directly on the surface of the circuit board, which will cause the antenna to occupy additional circuit board area and poor integration. For various high-tech electronic products, if the antenna is directly made on the surface of the circuit board, a larger circuit board will be required, which will make the high-tech electronic products also occupy a larger volume, which is contrary to people's demand for miniaturization and convenience of high-tech electronic products.

[0004] With the rapid development of communication information, 5G (5th Generation), the fifth generation of mobile communication, has become the focus of research. In 5G high-frequency antennas, since the electromagnetic wave frequency of the antenna is very high, the communication wavelength becomes millimeter level (millimeter wave), and the antenna size is reduced to several millimeters. The propagation attenuation of high-frequency electromagnetic waves is also large, especially in antenna packaging. Since the antenna packaging material will cause the attenuation and loss of the antenna electromagnetic wave frequency, the selection of antenna packaging materials is particularly important. In order to reduce the attenuation and loss of the electromagnetic waves of high-frequency antennas, it is particularly important to develop a new antenna packaging structure and packaging method to reduce the attenuation and loss of the electromagnetic waves of the antenna.

[0005] In view of this, it is necessary to design a new antenna packaging structure and packaging method to reduce the attenuation and loss of electromagnetic waves of the antenna in the packaging material. Summary of the invention

[0006] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide an antenna packaging structure and a packaging method, which are used to solve the problems of attenuation and loss of electromagnetic waves of the antenna in the packaging material in the prior art.

[0007] To achieve the above object and other related objects, the present invention provides an antenna packaging method, comprising the following steps:

[0008] Providing a supporting substrate, and forming a separation layer on the supporting substrate;

[0009] forming a rewiring layer on the separation layer, wherein the rewiring layer comprises a first surface in contact with the separation layer and a second surface opposite to the separation layer;

[0010] forming a first metal connection column on the second surface of the rewiring layer, wherein the first metal connection column is electrically connected to the rewiring layer;

[0011] Using a first packaging layer to cover the first metal connection column and the second surface of the rewiring layer, and the first metal connection column is exposed on the top surface of the first packaging layer;

[0012] forming a first antenna metal layer on the surface of the first packaging layer, wherein the first antenna metal layer is electrically connected to the first metal connection column, and the first antenna metal layer includes an antenna metal interconnection layer and an antenna metal main layer;

[0013] forming a second metal connection column on the antenna metal interconnection layer;

[0014] Using a second packaging layer to cover the second metal connection column and the first antenna metal layer, and the second metal connection column is exposed on the top surface of the second packaging layer;

[0015] forming a second antenna metal layer on the surface of the second packaging layer, the second antenna metal layer being electrically connected to the second metal connecting column, and a projection of the second antenna metal layer on the first packaging layer revealing the antenna metal main layer;

[0016] Removing the second packaging layer located above and on both sides of the antenna metal main layer to form a cavity that exposes the entire antenna metal main layer;

[0017] removing the separation layer and the supporting substrate;

[0018] forming metal bumps on the first surface of the rewiring layer; and

[0019] A semiconductor chip is provided and bonded to the first surface of the rewiring layer.

[0020] Optionally, the second surface of the rewiring layer includes N layers of antenna structures, where N≥3.

[0021] Optionally, a method of forming the first metal connecting column and the second metal connecting column includes one or a combination of wire bonding, electroplating and chemical plating.

[0022] Optionally, the method of forming the cavity includes one or a combination of a laser method and a dry etching method.

[0023] Optionally, the separation layer includes a LTHC light-to-heat conversion layer, and the method for removing the separation layer and the supporting substrate includes a laser heating method.

[0024] Optionally, the method further includes a step of filling a bottom filling layer between the semiconductor chip and the first surface of the rewiring layer, wherein the bottom filling layer includes an epoxy resin layer.

[0025] Optionally, the supporting substrate includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate and a ceramic substrate.

[0026] Optionally, the rewiring layer includes a dielectric layer and a metal wiring layer, the material of the dielectric layer includes one or a combination of two or more of epoxy resin, silicone, PI, PBO, BCB, silicon oxide, phosphosilicate glass and fluorine-containing glass; the material of the metal wiring layer includes one or a combination of two or more of copper, aluminum, nickel, gold, silver and titanium.

[0027] Optionally, the first metal connecting column and the second metal connecting column include one or a combination of gold wire, silver wire, copper wire and aluminum wire; the first metal connecting column and the second metal connecting column also include one or a combination of gold column, silver column, copper column and aluminum column.

[0028] Optionally, the material of the first packaging layer includes one or a combination of polyimide, silicone and epoxy resin; the material of the second packaging layer includes one or a combination of polyimide, silicone and epoxy resin.

[0029] Optionally, the material of the metal bump includes one of tin solder, silver solder and gold-tin alloy solder.

[0030] The present invention also provides an antenna packaging structure, the packaging structure comprising:

[0031] a redistribution layer, the redistribution layer comprising a first side and an opposite second side;

[0032] A first metal connection column is formed on the second surface of the rewiring layer and is electrically connected to the rewiring layer;

[0033] a first packaging layer, covering the first metal connection column and the second surface of the rewiring layer, and the first metal connection column is exposed on a top surface of the first packaging layer;

[0034] A first antenna metal layer is formed on the first packaging layer, the first antenna metal layer is electrically connected to the first metal connection column, and the first antenna metal layer includes an antenna metal interconnection layer and an antenna metal main layer;

[0035] A second metal connection column is formed on the antenna metal interconnection layer;

[0036] a second packaging layer, covering the second metal connection column and exposing the second metal connection column on a top surface of the second packaging layer; the second packaging layer covers the antenna metal interconnection layer and exposes the antenna metal main layer to form a cavity above the antenna metal main layer;

[0037] a second antenna metal layer formed on a surface of the first packaging layer, the second antenna metal layer being electrically connected to the second metal connecting column, and a projection of the second antenna metal layer on the first packaging layer revealing the antenna metal main layer;

[0038] A metal bump formed on the first surface of the rewiring layer; and

[0039] The semiconductor chip is bonded to the first surface of the rewiring layer.

[0040] Optionally, the second surface of the rewiring layer includes N layers of antenna structures, where N≥3.

[0041] Optionally, a bottom filling layer is further provided between the semiconductor chip and the first surface of the rewiring layer, and the bottom filling layer includes an epoxy resin layer.

[0042] Optionally, the rewiring layer includes a dielectric layer and a metal wiring layer, the dielectric layer includes one or a combination of two or more of an epoxy resin layer, a silicone layer, a PI layer, a PBO layer, a BCB layer, a silicon oxide layer, a phosphosilicate glass layer and a fluorine-containing glass layer; the metal wiring layer includes one or a combination of two or more of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer and a titanium layer.

[0043] Optionally, the first metal connecting column and the second metal connecting column include one or a combination of gold wire, silver wire, copper wire and aluminum wire; the first metal connecting column and the second metal connecting column also include one or a combination of gold column, silver column, copper column and aluminum column.

[0044] Optionally, the bottoms of the first metal connecting pillar and the second metal connecting pillar are further connected to metal connecting blocks having a larger cross-sectional area than the first metal connecting pillar and the second metal connecting pillar.

[0045] Optionally, the first encapsulation layer includes one or a combination of a polyimide layer, a silicone layer and an epoxy resin layer; the second encapsulation layer includes one or a combination of a polyimide layer, a silicone layer and an epoxy resin layer.

[0046] Optionally, the metal bump includes one of a tin metal bump, a silver metal bump and a gold-tin alloy metal bump.

[0047] As described above, the antenna packaging structure and packaging method of the present invention can form a stacked antenna package with a multi-layer antenna structure, which has high efficiency and high integration. In the antenna packaging structure, a cavity is formed by removing the packaging layer, thereby revealing the open-air metal layer, which can reduce the attenuation and loss of electromagnetic waves in the antenna metal layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 Shown is a schematic flow chart of the antenna packaging method in the present invention.

[0049] Figure 2 to Figure 15 It is a schematic diagram showing the structure of each step of the antenna packaging method in the first embodiment, wherein: Fig.15 It also shows a schematic structural diagram of the antenna packaging structure in the second embodiment.

[0050] Component number description

[0051] 101 Support base

[0052] 102 Separation Layer

[0053] 103 Rewiring Layer

[0054] 113 Dielectric layer

[0055] 123 Metal Wiring Layer

[0056] 104 First antenna structure

[0057] 114 first metal connection block

[0058] 124 first metal connecting column

[0059] 134 First packaging layer

[0060] 144 Antenna metal interconnection layer

[0061] 154 Antenna metal body layer

[0062] 105 Second antenna structure

[0063] 115 second metal connection block

[0064] 125 second metal connecting column

[0065] 135 Second packaging layer

[0066] 145 Second antenna metal layer

[0067] 155 Cavity

[0068] 106 metal bumps

[0069] 107 Semiconductor Chip

[0070] 108 bottom fill layer DETAILED DESCRIPTION

[0071] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0072] See also Figure 1 to Figure 15 It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner, and the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0073] Embodiment 1

[0074] like Figure 1 This embodiment provides an antenna packaging method. This embodiment can form an antenna package with a stacked multi-layer antenna structure, which has high efficiency and high integration. In the antenna packaging structure, a cavity is formed by removing the packaging layer, thereby revealing the open-wire metal layer, which can reduce the attenuation and loss of electromagnetic waves in the antenna metal layer.

[0075] Specifically, Figure 2 to Figure 15 , which illustrates the structural schematic diagram presented in each step of the antenna packaging method in this embodiment.

[0076] like Figure 2 First, a supporting substrate 101 is provided, and a separation layer 102 is formed on the supporting substrate 101 .

[0077] As a further embodiment of this embodiment, the supporting substrate 101 includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate and a ceramic substrate, and the separation layer 102 includes a LTHC light-to-heat conversion layer.

[0078] Specifically, the supporting substrate 101 is preferably a glass substrate, and the separation layer 102 is preferably an LTHC light-to-heat conversion layer. The glass substrate has a low cost, and the LTHC light-to-heat conversion layer is easily formed on its surface, and the difficulty of the subsequent separation process of the LTHC light-to-heat conversion layer can be reduced, such as heating the LTHC light-to-heat conversion layer based on a laser to separate from the LTHC light-to-heat conversion layer.

[0079] like Figure 3, a rewiring layer 103 is formed on the separation layer 102, and the rewiring layer 103 includes a first surface in contact with the separation layer 102 and a second surface opposite to the separation layer 102.

[0080] As a further embodiment of this embodiment, the rewiring layer 103 includes a dielectric layer 113 and a metal wiring layer 123, and the material of the dielectric layer 113 includes one or a combination of more than one of epoxy resin, silicone, PI, PBO, BCB, silicon oxide, phosphosilicate glass and fluorine-containing glass; the material of the metal wiring layer 123 includes one or a combination of more than one of copper, aluminum, nickel, gold, silver and titanium.

[0081] Specifically, the preparation of the rewiring layer 103 includes the following steps: forming the dielectric layer 113 on the surface of the separation layer 102 by a physical vapor deposition process or a chemical vapor deposition process, and etching the dielectric layer 113 to form a patterned dielectric layer 113; forming the metal wiring layer 123 on the surface of the patterned dielectric layer 113 by a physical vapor deposition process, a chemical vapor deposition process, an evaporation process, a sputtering process, an electroplating process, or an electroless plating process, and etching the metal wiring layer 123 to form a patterned metal wiring layer 123. The material, number of layers, and distribution morphology of the dielectric layer 113 and the metal wiring layer 123 can be selected according to specific needs and are not limited here.

[0082] like Figures 4 to 13 A two-layer antenna structure is stacked on the second surface of the rewiring layer 103 , including a first antenna structure 104 and a second antenna structure 105 located on the first antenna structure 104 .

[0083] like Figures 4 to 7 , which illustrates a structural schematic diagram of each step of forming the first antenna structure 104.

[0084] like Figure 4 , a first metal connection column 124 is formed on the second surface of the re-distribution layer 103 , and the first metal connection column 124 is electrically connected to the re-distribution layer 103 .

[0085] Specifically, in this embodiment, the bottom of the first metal connecting column 124 may also include a first metal connecting block 114 having a cross-sectional area larger than that of the first metal connecting column 124, thereby increasing the contact area between the first metal connecting column 124 and the metal wiring layer 123 to improve electrical stability.

[0086] As a further embodiment of this embodiment, the first metal connecting column 124 includes one or a combination of gold wire, silver wire, copper wire and aluminum wire; the first metal connecting column may also include one or a combination of gold column, silver column, copper column and aluminum column; the method of forming the first metal connecting column 124 includes one or a combination of wire welding, electroplating and chemical plating.

[0087] Specifically, the first metal connecting column 124 can be made of copper wire and prepared by a wire welding process, such as one or a combination of a hot pressing wire welding process, an ultrasonic wire welding process, and a hot pressing ultrasonic wire welding process. The type and preparation method of the first metal connecting column 124 can also be selected according to needs and are not limited here.

[0088] like Figure 5-6 A first packaging layer 134 is used to cover the first metal connecting column 124 and the second surface of the rewiring layer 103 , and the first metal connecting column 124 is exposed on the top surface of the first packaging layer 134 .

[0089] As a further embodiment of this embodiment, the material of the first packaging layer 134 includes one or a combination of polyimide, silicone and epoxy resin; the method of forming the first packaging layer 134 includes one of compression molding, transfer molding, liquid sealing molding, vacuum lamination and spin coating.

[0090] Specifically, Figure 6 After the first encapsulation layer 134 is formed, a grinding or polishing method may be used on the upper surface of the first encapsulation layer 134 to provide a flat first encapsulation layer 134 and improve product quality.

[0091] like Figure 7 A first antenna metal layer is formed on the surface of the first packaging layer 134, the first antenna metal layer is electrically connected to the first metal connecting column 124, and the first antenna metal layer includes an antenna metal interconnection layer 144 and an antenna metal main layer 154; thereby forming the first antenna structure 104 including the first metal connecting column 124, the first packaging layer 134 and the first antenna metal layer.

[0092] As a further embodiment of this embodiment, a method for forming the first antenna metal layer includes one of a physical vapor deposition process, a chemical vapor deposition process, an evaporation process, a sputtering process, an electroplating process or a chemical plating process.

[0093] Specifically, the first antenna metal layer is formed on the upper surface of the first packaging layer 134 , and then an etching process is used to form the first antenna metal layer in the required pattern, including the antenna metal interconnection layer 144 and the antenna metal main layer 154 .

[0094] like Figure 8 to Figure 13 , which illustrates a structural schematic diagram of each step of the second antenna structure 105.

[0095] like Figure 8 , a second metal connecting column 125 is formed on the antenna metal interconnection layer 144.

[0096] Specifically, in this embodiment, the bottom of the second metal connection column 125 may further include a second metal connection block 115 having a cross-sectional area greater than that of the second metal connection column 125, thereby increasing the contact area between the second metal connection column 125 and the antenna metal interconnection layer 144 to improve electrical stability. The type and preparation method of the second metal connection column 125 are the same as those of the first metal connection column 124, and will not be repeated here.

[0097] like Figure 9-10 A second packaging layer 135 is used to cover the second metal connecting column 125 and the first antenna metal layer, and the second metal connecting column 125 is exposed on the top surface of the second packaging layer 135 .

[0098] Specifically, the type and preparation method of the second encapsulation layer 135 are the same as those of the first encapsulation layer 134, and will not be described in detail herein. Fig.10 After the second encapsulation layer 135 is formed, a grinding or polishing method may be used on the upper surface of the second encapsulation layer 135 to provide a flat second encapsulation layer 135 and improve product quality.

[0099] like Fig.11 , a second antenna metal layer 145 is formed on the surface of the second packaging layer 135, the second antenna metal layer 145 is electrically connected to the second metal connecting column 125, and the projection of the second antenna metal layer 145 on the first packaging layer 134 reveals the antenna metal main layer 154. The method of forming the second antenna metal layer 145 is the same as the first antenna metal layer, which is not repeated here. The projection of the second antenna metal layer 145 on the first packaging layer 134 reveals the antenna metal main layer 154, so as to facilitate the subsequent process of revealing the antenna metal main layer 154 and reduce the process difficulty.

[0100] like Fig.12 , remove the second packaging layer 135 located above and on both sides of the antenna metal main layer 154 to form a cavity 155 that exposes the entire antenna metal main layer 154, thereby forming the second antenna structure 105 including the second metal connecting column 125, the second packaging layer 135 and the second antenna metal layer 145.

[0101] As a further embodiment of this embodiment, the method of forming the cavity 155 includes one or a combination of a laser method and a dry etching method.

[0102] Specifically, the second packaging layer 135 is removed to form the cavity 155 penetrating the second packaging layer 135 to expose part of the first antenna metal layer in the first antenna structure 104, that is, the antenna metal main layer 154. Thus, while forming the stacked first antenna structure 104 and the second antenna structure 105, part of the first antenna metal layer in the first antenna structure 104 below, that is, the antenna metal main layer 154, can be directly exposed without being covered by the second packaging layer 135. Since the air loss of the antenna's electromagnetic waves is 0, the attenuation and loss of the electromagnetic waves of the first antenna metal layer can be reduced during the packaging process.

[0103] As a further embodiment of this embodiment, the second surface of the rewiring layer 103 may include N layers of antenna structures, where N≥3, to further improve the integration and integration performance of the antenna packaging structure.

[0104] Specifically, in this embodiment, N is 2, that is, it includes the first antenna structure 104 and the second antenna structure 105 that are stacked. In another embodiment, the second surface of the rewiring layer 103 may also include N≥3 layers of the stacked antenna structure, such as 4 layers, 5 layers, etc., which is not limited here.

[0105] like Fig.13 , remove the separation layer 102 and the supporting substrate 101 to expose the first surface of the rewiring layer 103 .

[0106] Specifically, the LTHC light-to-heat conversion layer may be heated based on a laser to separate the rewiring layer 103 and the LTHC light-to-heat conversion layer.

[0107] like Fig.14 , forming metal bumps 106 on the first surface of the rewiring layer 103 .

[0108] As a further embodiment of this embodiment, the material of the metal bump 106 includes one of tin solder, silver solder and gold-tin alloy solder.

[0109] like Fig.15 , provide a semiconductor chip 107, and bond the semiconductor chip 107 to the first surface of the rewiring layer 103.

[0110] Specifically, the metal bumps 106 and the semiconductor chips 107 are electrically connected to the metal wiring layer 123. The type, quantity and distribution of the semiconductor chips 107 can be selected according to specific needs. The order of combining the metal bumps 106 and the semiconductor chips 107 on the first surface of the rewiring layer 103 can also be selected according to specific needs. There is no excessive restriction here. It is preferred to combine the metal bumps 106 first to reduce contamination of the semiconductor chips 107 and improve product quality.

[0111] As a further embodiment of this embodiment, it also includes a step of filling a bottom filling layer 108 between the semiconductor chip 107 and the first surface of the rewiring layer 103 to improve the bonding strength between the semiconductor chip 107 and the rewiring layer 103 and to protect the rewiring layer 103 and the semiconductor chip 107, and the bottom filling layer 108 includes an epoxy resin layer.

[0112] Embodiment 2

[0113] like Fig.15 This embodiment illustrates a schematic diagram of the structure of the antenna packaging structure in the present invention, and the packaging structure includes:

[0114] A rewiring layer 103, wherein the rewiring layer 103 includes a first surface and an opposite second surface;

[0115] A first metal connection column 124 is formed on the second surface of the re-distribution layer 103 and is electrically connected to the re-distribution layer 103;

[0116] a first packaging layer 134 covering the first metal connection pillars 124 and the second surface of the re-distribution layer 103 , wherein the first metal connection pillars 124 are exposed on a top surface of the first packaging layer 134 ;

[0117] A first antenna metal layer is formed on the first packaging layer 134, the first antenna metal layer is electrically connected to the first metal connecting column 124, and the first antenna metal layer includes an antenna metal interconnect layer 144 and an antenna metal main layer 154; thereby forming a first antenna structure 104 including the first metal connecting column 124, the first packaging layer 134 and the first antenna metal layer;

[0118] A second metal connection column 125 formed on the antenna metal interconnection layer 144;

[0119] The second packaging layer 135 covers the second metal connection pillar 125 and the second metal connection pillar 125 is exposed on the top surface of the second packaging layer 135; the second packaging layer 135 covers the antenna metal interconnection layer 144 and exposes the antenna metal main layer 154, so as to form a cavity 155 above the antenna metal main layer 154;

[0120] A second antenna metal layer 145 is formed on the surface of the first packaging layer 135, the second antenna metal layer 145 is electrically connected to the second metal connecting column 125, and the projection of the second antenna metal layer 145 on the first packaging layer 134 reveals the antenna metal main layer 154; thereby forming a second antenna structure 105 including the second metal connecting column 125, the second packaging layer 135 and the second antenna metal layer 145;

[0121] A metal bump 106 formed on the first surface of the rewiring layer 103; and

[0122] The semiconductor chip 107 is bonded to the first surface of the re-distribution layer 103 .

[0123] This embodiment can form an antenna package with a stacked multi-layer antenna structure, which has high efficiency and high integration. In the antenna package structure, a cavity is formed by removing the packaging layer, thereby revealing the open-wire metal layer, which can reduce the attenuation and loss of electromagnetic waves in the antenna metal layer.

[0124] As a further embodiment of this embodiment, the rewiring layer 103 includes a dielectric layer 113 and a metal wiring layer 123, the dielectric layer 113 includes one or a combination of two or more of an epoxy resin layer, a silicone layer, a PI layer, a PBO layer, a BCB layer, a silicon oxide layer, a phosphosilicate glass layer and a fluorine-containing glass layer; the metal wiring layer 123 includes one or a combination of two or more of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer and a titanium layer.

[0125] As a further embodiment of this embodiment, the first metal connecting column 124 and the second metal connecting column 125 include one or a combination of gold wire, silver wire, copper wire and aluminum wire; the first metal connecting column 124 and the second metal connecting column 125 may also include one or a combination of gold column, silver column, copper column and aluminum column.

[0126] As a further embodiment of this embodiment, the bottoms of the first metal connecting pillar 124 and the second metal connecting pillar 125 are further connected with metal connecting blocks having a larger cross-sectional area than the first metal connecting pillar 124 and the second metal connecting pillar 125 .

[0127] Specifically, the first metal connection block 114 is located between the first metal connection column 124 and the metal wiring layer 123, and the second metal connection block 115 is located between the second metal connection column 125 and the antenna metal interconnection layer 144, thereby increasing the contact area and improving the electrical stability.

[0128] As a further embodiment of this embodiment, the first packaging layer 134 includes one or a combination of a polyimide layer, a silicone layer and an epoxy resin layer; the second packaging layer 135 includes one or a combination of a polyimide layer, a silicone layer and an epoxy resin layer.

[0129] As a further embodiment of this embodiment, the second surface of the rewiring layer 103 may include N layers of antenna structures, where N≥3, to further improve the integration and integration performance of the antenna packaging structure.

[0130] Specifically, in this embodiment, N is 2, that is, it includes the first antenna structure 104 and the second antenna structure 105 that are stacked. In another embodiment, the second surface of the rewiring layer 103 may also include N≥3 layers of the stacked antenna structure, such as 4 layers, 5 layers, etc., which is not limited here.

[0131] As a further embodiment of this embodiment, the metal bump 106 includes one of a tin metal bump, a silver metal bump and a gold-tin alloy metal bump, and the metal bump 106 is electrically connected to the metal wiring layer 123 .

[0132] As a further embodiment of this embodiment, an underfill layer 108 is further provided between the semiconductor chip 107 and the first surface of the rewiring layer 103, and the underfill layer 108 includes an epoxy resin layer to improve the bonding strength between the semiconductor chip 107 and the rewiring layer 103 and protect the rewiring layer 103 and the semiconductor chip 107. The semiconductor chip 107 is electrically connected to the metal wiring layer 123, and the type, quantity and distribution of the semiconductor chip 107 can be selected according to specific needs.

[0133] In summary, the antenna packaging structure and packaging method of the present invention can form an antenna packaging with a stacked multi-layer antenna structure, which has high efficiency and high integration. In the antenna packaging structure, the packaging layer is removed to form a cavity, thereby revealing the open-air metal layer, which can reduce the attenuation and loss of electromagnetic waves in the antenna metal layer. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has a high industrial utilization value.

[0134] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. An antenna packaging method, characterized in that: The following steps are involved: Providing a supporting substrate, and forming a separation layer on the supporting substrate; forming a rewiring layer on the separation layer, wherein the rewiring layer comprises a first surface in contact with the separation layer and a second surface opposite to the separation layer; forming a first metal connection column on the second surface of the rewiring layer, wherein the first metal connection column is electrically connected to the rewiring layer; Using a first packaging layer to cover the first metal connection column and the second surface of the rewiring layer, and the first metal connection column is exposed on the top surface of the first packaging layer; forming a first antenna metal layer on the surface of the first packaging layer, wherein the first antenna metal layer is electrically connected to the first metal connection column, and the first antenna metal layer includes an antenna metal interconnection layer and an antenna metal main layer; forming a second metal connection column on the antenna metal interconnection layer; Using a second packaging layer to cover the second metal connection column and the first antenna metal layer, and the second metal connection column is exposed on the top surface of the second packaging layer; forming a second antenna metal layer on the surface of the second packaging layer, the second antenna metal layer being electrically connected to the second metal connecting column, and a projection of the second antenna metal layer on the first packaging layer revealing the antenna metal main layer; Removing the second packaging layer located above and on both sides of the antenna metal main layer to form a cavity that exposes the entire antenna metal main layer; removing the separation layer and the supporting substrate; forming metal bumps on the first surface of the rewiring layer; as well as A semiconductor chip is provided and bonded to the first surface of the rewiring layer.

2. The antenna packaging method according to claim 1, characterized in that: The second surface of the rewiring layer includes N layers of antenna structures, wherein N≥3.

3. The antenna packaging method according to claim 1, characterized in that: The method of forming the first metal connecting column and the second metal connecting column includes one or a combination of wire bonding, electroplating and chemical plating.

4. The antenna packaging method according to claim 1, characterized in that: The method of forming the cavity includes one or a combination of a laser method and a dry etching method.

5. The antenna packaging method according to claim 1, characterized in that: The separation layer includes an LTHC light-to-heat conversion layer, and the method for removing the separation layer and the supporting substrate includes a laser heating method.

6. The antenna packaging method according to claim 1, characterized in that: The method further includes a step of filling an underfill layer between the semiconductor chip and the first surface of the rewiring layer, wherein the underfill layer includes an epoxy resin layer.

7. The antenna packaging method according to claim 1, characterized in that: The supporting substrate includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate and a ceramic substrate.

8. The antenna packaging method according to claim 1, characterized in that: The rewiring layer includes a dielectric layer and a metal wiring layer, the material of the dielectric layer includes one or a combination of two or more of epoxy resin, silicone, PI, PBO, BCB, silicon oxide, phosphosilicate glass and fluorine-containing glass; the material of the metal wiring layer includes one or a combination of two or more of copper, aluminum, nickel, gold, silver and titanium.

9. The antenna packaging method according to claim 1, characterized in that: The first metal connecting column and the second metal connecting column include one or a combination of gold wire, silver wire, copper wire and aluminum wire; the first metal connecting column and the second metal connecting column also include one or a combination of gold column, silver column, copper column and aluminum column.

10. The antenna packaging method according to claim 1, characterized in that: The material of the first packaging layer includes one or a combination of polyimide, silicone and epoxy resin; the material of the second packaging layer includes one or a combination of polyimide, silicone and epoxy resin.

11. The antenna packaging method according to claim 1, characterized in that: The material of the metal bump includes one of tin solder, silver solder and gold-tin alloy solder.

12. An antenna packaging structure, characterized in that: The packaging structure comprises: a redistribution layer, the redistribution layer comprising a first side and an opposite second side; A first metal connection column is formed on the second surface of the rewiring layer and is electrically connected to the rewiring layer; a first packaging layer, covering the first metal connection column and the second surface of the rewiring layer, and the first metal connection column is exposed on a top surface of the first packaging layer; A first antenna metal layer is formed on the first packaging layer, the first antenna metal layer is electrically connected to the first metal connection column, and the first antenna metal layer includes an antenna metal interconnection layer and an antenna metal main layer; A second metal connection column is formed on the antenna metal interconnection layer; a second packaging layer, covering the second metal connection column and exposing the second metal connection column on a top surface of the second packaging layer; the second packaging layer covers the antenna metal interconnection layer and exposes the antenna metal main layer to form a cavity above the antenna metal main layer; a second antenna metal layer formed on a surface of the first packaging layer, the second antenna metal layer being electrically connected to the second metal connecting column, and a projection of the second antenna metal layer on the first packaging layer revealing the antenna metal main layer; A metal bump formed on the first surface of the rewiring layer; and A semiconductor chip bonded to the first surface of the rewiring layer; The rewiring layer includes a dielectric layer and a metal wiring layer, the dielectric layer includes one or a combination of two or more of an epoxy resin layer, a silicone layer, a PI layer, a PBO layer, a BCB layer, a silicon oxide layer, a phosphosilicate glass layer and a fluorine-containing glass layer; the metal wiring layer includes one or a combination of two or more of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer and a titanium layer; the metal bump includes one of a tin metal bump, a silver metal bump and a gold-tin alloy metal bump.

13. The antenna packaging structure according to claim 12, characterized in that: The second surface of the rewiring layer includes N layers of antenna structures, wherein N≥3.

14. The antenna packaging structure according to claim 12, characterized in that: An underfill layer is further provided between the semiconductor chip and the first surface of the rewiring layer, and the underfill layer includes an epoxy resin layer.

15. The antenna packaging structure according to claim 12, characterized in that: The first metal connecting column and the second metal connecting column include one or a combination of gold wire, silver wire, copper wire and aluminum wire; the first metal connecting column and the second metal connecting column also include one or a combination of gold column, silver column, copper column and aluminum column.

16. The antenna packaging structure according to claim 12, characterized in that: The bottoms of the first metal connecting pillar and the second metal connecting pillar are further connected with metal connecting blocks whose cross-sectional areas are respectively larger than those of the first metal connecting pillar and the second metal connecting pillar.

17. The antenna packaging structure according to claim 12, characterized in that: The first packaging layer includes one or a combination of a polyimide layer, a silicone layer and an epoxy resin layer; the second packaging layer includes one or a combination of a polyimide layer, a silicone layer and an epoxy resin layer.

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