An etching and drying integrated machine and drying mechanism

By designing an integrated machine including power mechanism, control mechanism, guide rail and arm rod, the problem of wafers not being able to be automatically cleaned and dried in the prior art is solved, and automatic drying is realized, and efficiency and safety are improved.

CN111312614BActive Publication Date: 2025-03-18FUJIAN FULIAN INTEGRATED CIRCUIT CO LTD
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Patent Information

Application Number
CN201911196366.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2019-11-29
Publication Date
2025-03-18
Estimated Expiration
2039-11-29

AI Technical Summary

Technical Problem

In the prior art, the wafer cannot be automatically cleaned and dried in time during the etching process, resulting in manual processing by the operator, which poses a risk of damage to the chips and chemical liquids and is inefficient.

Method used

An integrated etching and drying machine is designed, including a power mechanism, a control mechanism, a guide rail, a fixing frame and an arm rod. The sensor senses the position of the wafer and automatically extends out the guide rail and a arm rod to achieve automatic drying of the wafer.

Benefits of technology

The automatic drying of wafers is realized, which avoids safety hazards and inefficiency in manual operations, and improves process efficiency and safety.

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Abstract

The present invention discloses an integrated etching and drying machine and a drying mechanism, which realizes the drying of wafers through the cooperation of a power mechanism, a control mechanism, a guide rail, and a fixed frame. First, the guide rail at the bottom of the drying mechanism will extend from the fixed frame to place the wafer boat. Then, the guide rail will move the wafer boat into the fixed frame together, and then the power mechanism will work, and the control mechanism, the guide rail, the fixed frame and the wafer boat located in the fixed frame will rotate together to dry the residual liquid on the wafer. The cooperation of the power mechanism, the control mechanism, the guide rail, and the fixed frame will greatly improve the drying efficiency of the wafer, and the retractable setting of the guide rail will improve the transportation efficiency of the wafer boat.
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Description

Technical Field

[0001] The present invention relates to the field of wafer processing equipment, and in particular to an integrated etching and drying machine and a drying mechanism. Background Art

[0002] Wet etching uses chemical liquid to corrode and remove the parts of the material that are not covered by the photoresist, so as to achieve the depth and pattern we need. In this etching step, how to remove the liquid from the wafer and dry it is also an important step. The existing steps of removing the liquid and drying on the wafer are: when the wafer boat is etched from the chemical liquid tank, the robotic arm grabs the wafer boat to the output end, and then the operator opens the machine door and takes it to the dryer to dry and clean it. In the process of realizing the present invention, the inventor found that there are the following problems in the prior art: if the operator is not present, the wafer cannot be cleaned and dried in time. The operator holds the wet wafer boat in his hand. On the one hand, the wafer boat is slippery due to being wet, which is easy to cause fragmentation accidents; on the other hand, the operator directly holds the wafer boat with his hands, and there may be some chemical liquids on the surface, which is dangerous to the personal safety of the personnel. At the same time, the operation takes a long time and is less efficient. Summary of the invention

[0003] Therefore, it is necessary to provide an integrated etching and drying machine and a drying mechanism to avoid wafer breakage and chemical liquid harm to the human body when manually grabbing the wafer boat, and to improve the process efficiency at the same time.

[0004] To achieve the above-mentioned purpose, the inventor provides a spin-drying mechanism, including: a power mechanism, a control mechanism, a guide rail, and a fixing frame;

[0005] The power mechanism is connected to the control mechanism and is used to provide power;

[0006] The fixing frame is arranged on one side of the control mechanism for fixing the position of the wafer boat, and the fixing frame is also provided with holes for accommodating the wafer boat; the guide rail is retractably arranged on one side of the control mechanism and is slidably connected to the fixing frame for placing the wafer boat.

[0007] Furthermore, it also includes: an arm bar,

[0008] The arm rod is telescopically and rotatably arranged on the control mechanism; and a clamping plate is also arranged on one end of the arm rod away from the control mechanism and is used to fix the wafer boat.

[0009] Furthermore, the arm bar also includes: a soft plastic sheet, and the soft plastic sheet is used to fit and hold the crystal boat.

[0010] Furthermore, the guide rail is two guide rail rods, the distance between the two guide rail rods is the distance between the support parts at the bottom of the wafer boat, and the guide rail rods are respectively used to accommodate the two support parts at the bottom of the wafer boat.

[0011] Furthermore, it also includes: a first sensor; the first sensor is arranged on a side of the spin-drying mechanism close to the fixing frame, and is used to sense the position signal of the crystal boat, and when the guide rail is extended, it is located above the first sensor.

[0012] Furthermore, it also includes: a second sensor; the second sensor is arranged on the guide rail and is used to sense the position signal of the wafer boat.

[0013] Furthermore, it also includes: a dryer door; the dryer door is liftably arranged on the fixing frame.

[0014] The inventor provides an integrated etching and drying machine, comprising: a drying mechanism, a machine arm, and a chemical reaction tank as described in any embodiment of the present invention;

[0015] The chemical reaction tank is arranged at one side of the drying mechanism, and the machine arm is arranged at one side of the chemical reaction tank for transporting and grabbing the wafer boat.

[0016] Furthermore, it also includes: a loading end, an output end, a first shutter, and a second shutter;

[0017] The loading end is arranged at a side of the chemical reaction tank away from the drying mechanism, the output end is arranged at a side of the drying mechanism away from the chemical reaction tank, and the chemical reaction tank, the loading end and the output end are located on the same horizontal line;

[0018] The first shutter is disposed between the loading end and the chemical reaction tank to separate the loading end and the chemical reaction tank, and the second shutter is disposed between the drying mechanism and the chemical reaction tank to separate the drying mechanism and the chemical reaction tank.

[0019] Furthermore, it also includes: a controller; the controller is connected to the etching and drying integrated machine, and the controller is used to perform the following method steps:

[0020] Drive the machine arm to grab the wafer boat to the chemical reaction tank;

[0021] The machine arm is driven to grab the wafer boat after the process is completed in the chemical reaction tank and move it to above the first sensor;

[0022] The controller receives the first sensor signal and drives the dryer door to open;

[0023] The drive rail extends, and the machine arm is driven to place the wafer boat on the rail;

[0024] The controller receives the signal from the second sensor, drives the arm rod to extend, and then drives the arm rod to rotate;

[0025] The driving arm rod and the guide rail are extended into the drying mechanism together, and the drying machine door is driven to close;

[0026] Drive the power mechanism to work;

[0027] The drive arm rod and guide rail are extended, and the machine arm is driven to grab the crystal boat and move it out of the drying mechanism.

[0028] Different from the prior art, the above technical solution realizes the drying of wafers through the cooperation of the power mechanism, the control mechanism, the guide rail and the fixed frame. In actual operation, the guide rail at the bottom of the drying mechanism will extend from the fixed frame for the placement of the wafer boat. It should be noted that the guide rail can be a retractable plate arranged on the control mechanism, or other container that can accommodate the wafer boat; at the same time, the length of the guide rail should be greater than the thickness of the fixed frame, and less than or equal to the thickness of the control mechanism plus the thickness of the fixed frame, and the wafer boat can be placed stably on the guide rail, so the distance that the guide rail can extend is the length in the control mechanism; specifically, when the wafer boat needs to be placed, the guide rail will extend from the fixed frame for placing the wafer boat. Then, the crystal boat is moved to the fixed frame through the guide rail. It should be noted that the fixed frame is used to fix and limit the position of the crystal boat so that the crystal boat will not shake relative to the fixed frame when it is spun. Specifically, the fixed frame is provided with a hole for accommodating the crystal boat, and the hole corresponds to the size and shape of the crystal boat. When the guide rail with the crystal boat is retracted into the fixed frame, the crystal boat is just embedded in the fixed frame. Then, through the operation of the power mechanism, the control mechanism, the guide rail, the fixed frame and the crystal boat located in the fixed frame will rotate together to spin off the residual liquid on the wafer. The mutual cooperation of the power mechanism, the control mechanism, the guide rail and the fixed frame will greatly improve the drying efficiency of the wafer, and the retractable setting of the guide rail will improve the transportation efficiency of the crystal boat. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a structural diagram of the guide rail extending and drying mechanism;

[0030] Figure 2 A structural diagram showing the crystal boat being placed on the guide rail;

[0031] Figure 3 This is the structural diagram of the arm rod extending and drying mechanism;

[0032] Figure 4 This is the structural diagram of the arm rod and the crystal boat;

[0033] Figure 5 This is a structural diagram of the crystal boat placed in the drying mechanism;

[0034] Figure 6 It is a structural diagram of an integrated etching and drying machine;

[0035] Figure 7 This is the structural diagram of the arm bar;

[0036] Figure 8 This is the structural diagram of the guide rod.

[0037] Description of reference numerals:

[0038] 1. Drying mechanism;

[0039] 101. Power mechanism;

[0040] 102. Control agency;

[0041] 103. Guide rail;

[0042] 104, fixed frame;

[0043] 105. Arm bar;

[0044] 1051, pallet;

[0045] 1052, soft film;

[0046] 106. A first sensor;

[0047] 107. Second sensor;

[0048] 108. Dryer door;

[0049] 2. Machine arm;

[0050] 3. Chemical reaction tank;

[0051] 4. Loading end;

[0052] 5. Output terminal;

[0053] 6. First shutter;

[0054] 7. Second shutter;

[0055] 8. Crystal Boat;

[0056] 801. Supporting part. DETAILED DESCRIPTION

[0057] In order to explain the technical content, structural features, achieved objectives and effects of the technical solution in detail, the following is a detailed description in conjunction with specific embodiments and accompanying drawings.

[0058] See also Figures 1 to 5In this embodiment, the inventor provides a spin-drying mechanism, including: a power mechanism 101, a control mechanism 102, a guide rail 103, and a fixed frame 104; the power mechanism 101 is connected to the control mechanism 102 for providing power; the fixed frame 104 is arranged on one side of the control mechanism 102 for fixing the position of the wafer boat 8, and the fixed frame 104 is also provided with a hole for accommodating the wafer boat 8; the guide rail 103 is retractably arranged on one side of the control mechanism 102, and is slidably connected to the fixed frame 104 for placing the wafer boat 8. The above technical solution realizes the spin-drying of the wafer through the mutual cooperation of the power mechanism 101, the control mechanism 102, the guide rail 103, and the fixed frame 104. In actual operation, first, the guide rail 103 located at the bottom of the spin-drying mechanism 1 is connected to the fixed frame 104 through sliding, and the guide rail 103 will extend from the fixed frame 104 for placing the wafer boat 8. It should be noted that the guide rail 103 may be a plate that is retractably arranged on the control mechanism 102, or other containers that can accommodate the wafer boat 8; at the same time, the length of the guide rail 103 should be greater than the thickness of the fixing frame 104, and less than or equal to the thickness of the control mechanism 102 plus the thickness of the fixing frame 104, and can allow the wafer boat 8 to be stably placed on the guide rail 103, so the distance that the guide rail 103 can extend is the length located in the control mechanism 102; specifically, when the wafer boat 8 needs to be placed, the guide rail 103 will extend from the fixing frame 104 to place the wafer boat 8. When there is no wafer boat 8, the end of the guide rail 103 away from the control mechanism 102 is flush with the fixing frame 104. When the wafer boat 8 is moved thereon by other mechanisms or manually, it is then moved to the fixing frame 104 with the wafer boat 8 through the guide rail 103 until the end of the guide rail 103 away from the control mechanism 102 is flush with the fixing frame 104. It should be noted that the fixing frame 104 is used to fix and limit the position of the wafer boat 8 so that the wafer boat 8 will not shake relative to the fixing frame 104 during drying. Specifically, the fixing frame 104 is provided with a hole for accommodating the wafer boat 8, and the hole corresponds to the size and shape of the wafer boat 8. When the guide rail 103 with the wafer boat 8 is retracted into the fixing frame 104, the wafer boat 8 is just embedded in the fixing frame 104, further ensuring that the wafer boat 8 will not move relative to the drying mechanism 1 during the drying process, thereby avoiding damage to the wafer. Subsequently, through the operation of the power mechanism 101, the control mechanism 102, the guide rail 103, the fixing frame 104 and the wafer boat 8 located in the fixing frame 104 will rotate together to dry the residual liquid on the wafer. The power mechanism 101 can be a motor directly connected to the control mechanism 102. The cooperation among the power mechanism 101 , the control mechanism 102 , the guide rail 103 , and the fixing frame 104 will greatly improve the drying efficiency of the wafers. Meanwhile, the retractable setting of the guide rail 103 will further improve the transportation efficiency of the wafer boat 8 .

[0059] See also Figures 2 to 4 In this embodiment, the drying mechanism further includes: an arm bar 105, the arm bar 105 is retractable and rotatable and is arranged on the control mechanism 102; please refer to Figure 7 , and a clamping plate 1051 is also provided on one end of the arm rod 105 away from the control mechanism 102, and is used to fix the crystal boat 8. When the crystal boat 8 is stably placed on the guide rail 103, the arm rod 105 will extend from the fixing frame 104 until the clamping plate 1051 reaches the end of the crystal boat 8, and then the arm rod 105 rotates, and the clamping plate 1051 is changed from the original outward setting to the rear of the crystal boat 8 by rotating toward the crystal boat 8, and moves the crystal boat 8 to the inside of the fixing frame 104 together with the guide rail 103. It should be noted that the arm rod 105 and the clamping plate 1051 will further assist in fixing and moving the crystal boat 8, and when the clamping plate 1051 is set outward, it does not contact the crystal boat 8. At the same time, the arm rod 105 also includes: a soft plastic sheet 1052, and the soft plastic sheet 1052 is used to fit and grasp the crystal boat 8. Please refer to Figures 2 to 4 as well as Figure 7 The setting direction of the soft plastic sheet 1052 is the same as that of the card plate 1051. Specifically, when the arm rod 105 is extended, the soft plastic sheet 1052 and the card plate 1051 are set outward together and do not contact the wafer boat 8. Then, the arm rod 105 rotates, thereby driving the soft plastic sheet 1052 and the card plate 1051 to rotate toward the wafer boat 8 until they are just engaged with the wafer boat 8, so as to achieve the purpose of fixing the wafer boat 8. At the same time, it is further ensured that the wafer boat 8 will not move relative to the drying mechanism 1 during the drying process, thereby avoiding damage to the wafers.

[0060] See also Figure 8 In this embodiment, the guide rail 103 is two guide rail rods, the distance between the two guide rail rods is the distance between the bottom support parts 801 of the wafer boat 8, and the guide rail rods are respectively used to accommodate the two support parts 801 at the bottom of the wafer boat 8. It should be noted that, please refer to Figure 4 The two rail rods correspond to the support parts 801 at the bottom of the wafer boat 8 respectively. When the wafer boat 8 is moved thereon by other mechanisms or manually, the two support parts 801 at the bottom of the wafer boat 8 will be placed on the two rail rods respectively. When the rail rods move toward the fixing frame 104, the wafer boat 8 will move into the fixing frame 104 together with the rail rods. The retractable setting of the rail 103 will further improve the transportation efficiency of the wafer boat 8 and save production and manufacturing costs.

[0061] Please refer to FIG. 6. In this embodiment, the spin-drying mechanism further includes: a first sensor 106; the first sensor 106 is arranged on one side of the spin-drying mechanism close to the fixing frame 104, and is used to sense the position signal of the wafer boat 8, and when the guide rail 103 is extended, it is located above the first sensor 106. The first sensor 106 is used to sense the position of the wafer boat 8. When the wafer boat 8 is transported to the first sensor 106 by an external machine or manually, the first sensor 106 senses the wafer boat 8, and then the guide rail 103 extends to receive the wafer boat 8. It should be noted that the height of the sensing area of ​​the first sensor 106 matches the height of the spin-drying mechanism 1. When the wafer boat 8 is higher than the spin-drying mechanism 1, the first sensor 106 cannot sense the position of the wafer boat 8, and the guide rail 103 will not work; on the contrary, when the wafer boat 8 is located at the height of the spin-drying mechanism 1, the first sensor 106 senses the position of the wafer boat 8, and the guide rail 103 extends to receive the wafer boat 8. The setting of the first sensor 106 will greatly improve the mechanization degree of the equipment, and also improve the efficiency of the wafer process.

[0062] See also Figure 8 In this embodiment, the drying mechanism further includes: a second sensor 107; the second sensor 107 is disposed on the guide rail 103, and is used to sense the position signal of the wafer boat 8. The second sensor 107 is used to sense the position of the wafer boat 8. When the wafer boat 8 is transported to the guide rail 103 by an external machine or manually, the second sensor 107 senses the wafer boat 8, and then the guide rail 103 is retracted into the fixed frame 104. It should be noted that when the wafer boat 8 is placed on the guide rail 103, when the second sensor 107 senses the position of the wafer boat 8, the guide rail 103 will be retracted, and the wafer boat 8 will be moved into the fixed frame 104 together. On the contrary, when the second sensor 107 cannot sense the position of the wafer boat 8, the guide rail 103 will not be retracted. The provision of the second sensor 107 will greatly improve the mechanization degree of the equipment, and also improve the mechanization and process efficiency.

[0063] See also Figure 6 In this embodiment, the drying mechanism further includes: a dryer door 108; the dryer door 108 is arranged on the fixed frame 104 in a liftable manner. The dryer door 108 is of a liftable type and is controlled by the first sensor 106. When the first sensor 106 is triggered, the dryer door 108 opens. The guide rail 103 inside the drying mechanism 1 can be extended freely. And a position sensor is installed on the top of the dryer door 108, and when an external mechanism grabs the crystal boat 8 to the upper end, the position state of the external connecting mechanism can be sensed. The setting of the dryer door 108 will protect the personal safety of the operator and prevent external mechanisms from damaging the drying mechanism 1.

[0064] Through the above embodiment, the drying mechanism 1 is composed of a fixed frame 104, two arm rods 105 and two guide rods. The fixed frame 104 is used to clamp the position of the crystal boat 8, and the position is consistent with the position where the crystal boat 8 is extended, playing a fixing role. The two arm rods 105 and the two guide rods are controlled by the control mechanism 102 and can be flexibly extended and retracted. When the external mechanism or manual grasps the crystal boat 8 to the top of the first sensor 106, the position sensing is triggered, the dryer door 108 opens, and the two guide rods extend from the inside of the drying mechanism 1. Then the external mechanism or manual places the crystal boat 8 on the guide rail, so that the second sensor 107 on the guide rail is triggered, and the two arm rods 105 above the drying mechanism 1 extend. After reaching a certain position, the arm rod 105 rotates at an angle, and the end with the clamping plate 1051 clamps the crystal boat 8. Then the four rods extend into the dryer at the same time, and the door automatically rises and closes. The power mechanism 101 drives the equipment to rotate and clean.

[0065] See also Figure 6In this embodiment, the inventor provides an integrated etching and drying machine, including: a drying mechanism 1, a machine arm 2, and a chemical reaction tank 3; the chemical reaction tank 3 is arranged on one side of the drying mechanism 1, and the machine arm 2 is arranged on one side of the chemical reaction tank 3, for transporting and grabbing the wafer boat 8. The chemical reaction tank 3 includes a plurality of chemical liquid tanks, water tanks, etc. It should be noted that the machine arm 2 is a mechanical arm responsible for moving the wafer boat 8. In this embodiment, the etching and drying integrated machine further includes: a loading end 4, an output end 5, a first shutter 6, and a second shutter 7; the loading end 4 is arranged on the side of the chemical reaction tank 3 away from the drying mechanism 1, the output end 5 is arranged on the drying mechanism 1 away from the chemical reaction tank 3, and the chemical reaction tank 3, the loading end 4, and the output end 5 are located on the same horizontal line; the first shutter 6 is arranged between the loading end 4 and the chemical reaction tank 3, and is used to separate the loading end 4 and the chemical reaction tank 3, and the second shutter 7 is arranged between the drying mechanism 1 and the chemical reaction tank 3, and is used to separate the drying mechanism 1 and the chemical reaction tank 3. It should be noted that the etching and drying integrated machine further includes a housing, and the loading end 4, the first shutter 6, the chemical reaction tank 3, the second shutter 7, the first sensor 106, and the output end 5 are arranged in the housing in sequence. The machine arm 2 is arranged on one side of the shell, and the shell is also provided with a hole for transporting the wafer boat 8 to the drying mechanism 1, and the hole is arranged on the side of the first sensor 106 close to the drying mechanism 1. An etching and drying integrated machine also includes: a controller; the controller is connected to the etching and drying integrated machine, and in actual operation, the wafer boat 8 is placed on the loading end 4, the machine parameters are selected, the process starts, and the controller drives the first shutter 6 to open. The controller drives the machine arm 2 to grab the wafer boat 8 and move it to the chemical solution and water tank for etching. After the chemical tank etching is completed, the controller drives the second shutter 7 to open, and at the same time drives the machine arm 2 to grab the wafer boat 8 to the second shutter 7. The position sensor at the upper end of the drying machine door 108 and the first sensor 106 sense the wafer boat 8, the drying machine door 108 automatically descends, the lower end guide rail 103 in the drying mechanism 1 extends, and the machine arm 2 places the wafer boat 8 on the guide rail 103. The second sensor 107 on the guide rail 103 senses the crystal boat 8, and the two arm rods 105 at the upper end of the drying mechanism 1 extend out, and then the arm rod 105 rotates to clamp the crystal boat 8. After the crystal boat 8 is firmly grasped, the arm rod 105 and the guide rod extend into the drying mechanism 1 together, and the drying machine door 108 automatically closes, and the crystal boat 8 rotates and is cleaned. After the drying is completed, the drying machine door 108 automatically opens, and the arm rod 105 and the guide rod send the crystal boat 8 out. The machine arm 2 picks up the goods to the output end 5. The invention designs a machine with an integrated etching tank and a drying mechanism, that is, after the operation of the chemical liquid tank and the water tank is completed, the wafer arrives at the sensing area, and then the arm grabs the crystal boat 8 and automatically extends it into the drying mechanism 1 for drying. In this process, no human operation is required, and the automation of the machine can be realized.The chemical liquid tank and the spin dryer are integrated, so there is no need for personnel to transfer, which reduces the risk of personnel directly contacting the chemical liquid, making it safer. At the same time, it shortens the operating time of personnel, automates the machine, and improves efficiency.

[0066] It should be noted that, although the above embodiments have been described in this article, the patent protection scope of the present invention is not limited thereby. Therefore, based on the innovative concept of the present invention, changes and modifications made to the embodiments described herein, or equivalent structures or equivalent process changes made using the contents of the present invention specification and drawings, directly or indirectly applying the above technical solutions to other related technical fields, are all included in the patent protection scope of the present invention.

Claims

1. A drying mechanism, characterized in that: include: Power mechanism, control mechanism, guide rail, and fixing frame; The power mechanism is connected to the control mechanism and is used to provide power; The fixing frame is arranged on one side of the control mechanism, and is used to fix the position of the wafer boat, and the fixing frame is also provided with a hole for accommodating the wafer boat; the guide rail is retractably arranged on one side of the control mechanism, and is slidably connected with the fixing frame, and is used to place the wafer boat; An arm rod, the arm rod is telescopically and rotatably arranged on the control mechanism; and a clamping plate is also arranged on the end of the arm rod away from the control mechanism and is used to fix the crystal boat, the arm rod is arranged on both sides of the crystal boat, and the clamping plate is clamped on the upper part of the crystal boat; the arm rod also includes a soft plastic sheet, and the soft plastic sheet is used to fit and grasp the crystal boat; the setting direction of the soft plastic sheet is the same as that of the clamping plate; the guide rail is two guide rail rods, the distance between the two guide rail rods is the distance between the bottom support parts of the crystal boat, and the guide rail rods are respectively used to accommodate the two support parts at the bottom of the crystal boat.

2. A drying mechanism according to claim 1, characterized in that: Also includes: The first sensor is arranged on a side of the spin-drying mechanism close to the fixing frame, and is used to sense the position signal of the crystal boat, and when the guide rail is extended, it is located above the first sensor.

3. A drying mechanism according to claim 1, characterized in that: Also includes: The second sensor is arranged on the guide rail and is used for sensing the position signal of the wafer boat.

4. A drying mechanism according to claim 3, characterized in that: Also includes: The dryer door is liftably arranged on the fixing frame.

5. An integrated etching and drying machine, characterized in that: include: A drying mechanism, a machine arm, and a chemical reaction tank as described in any one of claims 1 to 4; The chemical reaction tank is arranged at one side of the drying mechanism, and the machine arm is arranged at one side of the chemical reaction tank for transporting and grabbing the wafer boat.

6. The etching and drying integrated machine according to claim 5, characterized in that: Also includes: Loading end, output end, first shutter, second shutter; The loading end is arranged at a side of the chemical reaction tank away from the drying mechanism, the output end is arranged at a side of the drying mechanism away from the chemical reaction tank, and the chemical reaction tank, the loading end and the output end are located on the same horizontal line; The first shutter is disposed between the loading end and the chemical reaction tank to separate the loading end and the chemical reaction tank, and the second shutter is disposed between the drying mechanism and the chemical reaction tank to separate the drying mechanism and the chemical reaction tank.

7. The etching and drying integrated machine according to claim 5, characterized in that: Also includes: Controller; The controller is connected to the one-piece etching and drying machine, and the controller is used to perform the following method steps: Drive the machine arm to grab the wafer boat to the chemical reaction tank; The machine arm is driven to grab the wafer boat after the process is completed in the chemical reaction tank and move it to above the first sensor; The controller receives the first sensor signal and drives the dryer door to open; The drive rail extends, and the machine arm is driven to place the wafer boat on the rail; The controller receives the signal from the second sensor, drives the arm rod to extend, and then drives the arm rod to rotate; The driving arm rod and the guide rail are extended into the drying mechanism together, and the drying machine door is driven to close; Drive the power mechanism to work; The drive arm rod and guide rail are extended, and the machine arm is driven to grab the crystal boat and move it out of the drying mechanism.

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