Display device and method of manufacturing the same

Abstract

A display device and a method for manufacturing the same are provided. The display device includes: a substrate and a display portion located on the substrate; a first processing region including a first processing surface located on at least one side surface of the substrate; and a second processing region adjacent to the first processing region and including a second processing surface having a shape different from that of the first processing surface of the first processing region.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2018-0159091, filed on December 11, 2018, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] Aspects of one or more embodiments relate to a display device and a method of manufacturing the same. Background Art

[0003] Recently, the use of display devices has become diversified. In particular, the thickness and weight of the display devices have been reduced, so that the use range of the display devices is wide.

[0004] The display apparatus enables graphic display of images and may include one or more display devices.

[0005] In addition, the display device may include one or more conductive layers or insulating layers connected to adjacent display devices. In this way, the display device includes multiple components and can therefore be manufactured through multiple complex processes.

[0006] Furthermore, when a plurality of processes are performed during the manufacture of a display device, defects or impurities may be introduced during the manufacturing process, which may result in degraded image quality characteristics of the display device.

[0007] The above information disclosed in this Background section is only for enhancement of understanding of the background technology and therefore it may contain information that does not constitute prior art. Summary of the Invention

[0008] One or more embodiments include a display device having improved electrical characteristics and picture quality characteristics and a method of manufacturing a display device with improved manufacturing process efficiency.

[0009] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments.

[0010] According to some example embodiments of the present disclosure, a display device includes: a substrate and a display portion located on the substrate; a first processing region including a first processing surface located on at least one side surface of the substrate; and a second processing region connected to the first processing region and including a second processing surface having a shape different from that of the first processing surface.

[0011] According to some example embodiments, the first processing surface and the second processing surface may be directly connected to each other.

[0012] According to some example embodiments, the first and second processed surfaces may correspond to the entire thickness of the substrate.

[0013] According to some example embodiments, the first processed surface and the second processed surface may be formed using different processing methods.

[0014] According to some example embodiments, the display device may further include one or more insulating layers formed on the substrate, wherein the first processed surface or the second processed surface is connected to the one or more insulating layers.

[0015] According to some example embodiments, the display device may further include one or more conductive layers formed on the substrate, wherein the first processed surface or the second processed surface is connected to the one or more conductive layers.

[0016] According to some example embodiments, the second processing surface may include a central processing surface and a connecting processing surface among the side surfaces of the substrate, the connecting processing surface being closer to the top surface of the substrate on which the display portion is disposed than the central processing surface, and the connecting processing surface may be inclined at a certain angle relative to the central processing surface.

[0017] According to some example embodiments, a plurality of second processing regions may be formed.

[0018] According to some example embodiments, two second process regions among the plurality of second process regions may be located at both sides of the first process region between the two second process regions.

[0019] According to some example embodiments, the peripheral area may be located on the substrate and may not overlap the display area, and the first and second treatment areas may correspond to the peripheral area.

[0020] According to some example embodiments, one or more pads may be located in the peripheral region.

[0021] According to some example embodiments, the wiring portion may be located in the peripheral region and may include one or more wiring members.

[0022] According to one or more example embodiments of the present disclosure, in a method of manufacturing a display device including a substrate and a display portion located on the substrate, the method includes: forming a first processing region including a first processing surface on at least one side surface of the substrate; and forming a second processing region to be connected to the first processing region, the second processing region including a second processing surface having a shape different from that of the first processing surface.

[0023] According to some example embodiments, the first processed surface and the second processed surface may be formed using different processing methods.

[0024] According to some example embodiments, forming the first processed surface may include a laser processing process.

[0025] According to some example embodiments, the step of forming the second processed surface may include a polishing process.

[0026] According to some example embodiments, after forming the first processed region, the second processed region may be formed to include at least one region of the first processed region.

[0027] According to some example embodiments, the method may further include: preparing a display device preliminary structure including a dummy region on the substrate; and removing the dummy region based on a cutting line of the display device preliminary structure.

[0028] According to some example embodiments, the first processed region may be formed in the step of removing the dummy region based on the cutting line, and the second processed region may be formed after the step of forming the first processed region.

[0029] According to some example embodiments, the method may further include performing an inspection process using the dummy region before removing the dummy region. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] These and / or other aspects will become more apparent and easier to understand through the following description of embodiments taken in conjunction with the accompanying drawings, in which:

[0031] Figure 1 is a plan view illustrating a display device according to some example embodiments;

[0032] Figure 2 It is along Figure 1 A cross-sectional view taken along line II-II;

[0033] Figure 3 It shows Figure 2 A view of a modified embodiment of the present invention;

[0034] Figure 4 It is from Figure 1 The view observed at position K;

[0035] Figure 5 It is along Figure 1 A cross-sectional view taken along line VV of FIG.

[0036] Figure 6 It is along Figure 1 A cross-sectional view taken along line VI-VI;

[0037] Figure 7 It shows Figure 6 A view of a modified embodiment of the present invention;

[0038] Figure 8 is a plan view illustrating a display device according to some example embodiments;

[0039] Figure 9 It is along Figure 8 A cross-sectional view taken along line IX-IX;

[0040] Figure 10 It is along Figure 8 A cross-sectional view taken along line XX;

[0041] Figure 11 It shows Figure 10 A view of a modified embodiment of the present invention;

[0042] Figure 12 is a plan view illustrating a display device according to some example embodiments;

[0043] Figure 13 It is from Figure 12 The view observed at position K;

[0044] Figure 14 is a plan view illustrating a display device according to some example embodiments;

[0045] Figure 15 It is along Figure 14 A sectional view taken along line XV-XV of FIG.

[0046] Figure 16 It is along Figure 14 A cross-sectional view taken along line XVI-XVI of FIG.

[0047] Figure 17 It shows Figure 15 A view of a modified embodiment of the present invention;

[0048] Figure 18 It shows Figure 16 A view of a modified embodiment of the present invention;

[0049] Figure 19 It is along Figure 14 A cross-sectional view taken along line XX-XX;

[0050] Figures 20 to 23 It shows Figure 19 A view of a modified embodiment of the present invention;

[0051] Figures 24 to 26 is a view illustrating a method of manufacturing a display device according to some example embodiments;

[0052] Figure 27 is a plan view illustrating a display device according to some example embodiments;

[0053] Figure 28is a plan view illustrating a display device according to some example embodiments;

[0054] Figure 29 is a plan view illustrating a display device according to some example embodiments;

[0055] Figure 30 is a plan view illustrating a display device according to some example embodiments;

[0056] Figure 31 It is along Figure 30 A cross-sectional view taken along line XXXI-XXXI of FIG.

[0057] Figure 32 It is along Figure 30 a cross-sectional view taken along line XXXII-XXXII of FIG; and

[0058] Figure 33 It shows Figure 31 FIG. 1 is a view of a modified embodiment of FIG. DETAILED DESCRIPTION

[0059] With reference now to embodiment in more detail, examples of embodiment are shown in the accompanying drawings, wherein the same reference numerals always indicate the same elements. In this regard, the present embodiment can have different forms and should not be construed as being limited to the description set forth herein. Therefore, the embodiments are described below only by reference to the drawings to explain aspects of this description. As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items. When a statement such as "at least one / kind of ... " is located after a column of elements, such a statement modifies the entire column of elements without modifying the individual elements in the column.

[0060] Since the present disclosure allows for various variations and numerous embodiments, example embodiments will be illustrated in the accompanying drawings and described in detail in the written description. The effects and features of the present disclosure and the manner in which they are achieved will become apparent by reference to the embodiments that will be described in detail later with reference to the accompanying drawings. However, the present disclosure is not limited to the following embodiments and may be embodied in various forms.

[0061] It will be understood that although the terms "first," "second," etc. may be used herein to describe various components, these components should not be limited by these terms. These terms are only used to distinguish one component from another.

[0062] As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0063] It will also be understood that the terms “comprises” and / or “comprising” used herein specify the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.

[0064] It will be understood that when a layer, region, or component is referred to as being "formed on" another layer, region, or component, it can be directly or indirectly formed on the other layer, region, or component. That is, for example, intervening layers, regions, or components may be present.

[0065] For the convenience of explanation, the size of the elements in the drawings may be exaggerated. In other words, since the size and thickness of the components are arbitrarily shown in the drawings for the convenience of explanation, the following embodiments are not limited thereto.

[0066] The x-axis, y-axis, and z-axis are not limited to the three axes of the rectangular coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0067] When a certain embodiment can be implemented differently, the specific process order can be performed differently from the described order. For example, two consecutively described processes can be performed substantially simultaneously or in the reverse order of the described order.

[0068] Hereinafter, various aspects of some exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Regardless of the figure number, those components that are the same or correspond are provided with the same reference numerals.

[0069] Figure 1 is a plan view illustrating a display device according to some example embodiments, Figure 2 It is along Figure 1 The cross-sectional view taken along line II-II is as follows: Figure 3 It shows Figure 2 FIG. 1 is a view of a modified embodiment of FIG.

[0070] Figure 4 It is from Figure 1 The view observed at position K, Figure 5 It is along Figure 1 The cross-sectional view taken along line VV is Figure 6 It is along Figure 1 The cross-sectional view taken along line VI-VI is as follows: Figure 7 It shows Figure 6 FIG. 1 is a view of a modified embodiment of FIG.

[0071] Reference Figures 1 to 7 , the display device 100 may include a substrate 101, a display portion 110, a first treatment area LA, and a second treatment area CA.

[0072] The substrate 101 may be formed using various transparent materials or opaque materials.

[0073] According to some example embodiments, the substrate 101 may be formed of glass, metal, or other organic materials.

[0074] Furthermore, according to some example embodiments, the substrate 101 may be formed of a flexible, bendable, foldable, or rollable material.

[0075] Furthermore, according to some example embodiments, the flexible material used to form the substrate 101 may include thin glass, metal, or plastic.

[0076] According to some example embodiments, the substrate 101 may include polyimide (PI), and according to some example embodiments, the substrate 101 may include different types of plastic materials.

[0077] The display portion (or display unit) 110 is formed or provided on the substrate 101. The display portion 110 may include one or more display devices and may be used to allow a user to recognize an image. These display devices may include devices of various shapes and types (e.g., an organic light emitting device (OLED) including a first electrode, a second electrode, and an organic emission layer).

[0078] According to some example embodiments, the encapsulation part 190 may be formed on the display portion 110 to protect the display portion 110. In addition, the encapsulation part 190 may be formed to cover or seal the display portion 110 to protect the display portion 110 and may prevent or reduce the penetration of moisture or gas into the display portion 110.

[0079] According to some example embodiments, the encapsulation part 190 may be formed to have a thin film shape, for example, may include one or more layers.

[0080] According to some example embodiments, encapsulation portion 190 may include one or more layers including an inorganic material such as silicon oxide or silicon nitride and one or more layers including an organic material such as epoxy resin or polyimide. According to some example embodiments, encapsulation portion 190 may also include a structure in which layers including inorganic materials and layers including organic materials are alternately stacked.

[0081] In addition, if Figure 3 As shown in FIG, a display device 100 ′ may include a substrate 101 , a display portion 110 , and an encapsulation substrate 190 ′.

[0082] The encapsulation substrate 190 ′ may be disposed to face the substrate 101 , and the display portion 110 may be disposed between the substrate 101 and the encapsulation substrate 190 ′.

[0083] The encapsulation substrate 190 ′ may be formed of various materials (eg, light-transmitting materials). In addition, according to some example embodiments, when light is transmitted in the direction of the substrate 101 , the encapsulation substrate 190 ′ may also be formed of an opaque material.

[0084] A sealing portion may be provided between the substrate 101 and the encapsulation substrate 190' to couple the substrate 101 to the encapsulation substrate 190'. For example, the space between the substrate 101 and the encapsulation substrate 190' may be sealed by the sealing portion. According to some example embodiments, a moisture absorbent or a filling material may be provided in the sealed space.

[0085] The first and second processed areas LA and CA may correspond to at least one side surface of the substrate 101 .

[0086] For example, when the surface of the substrate 101 on which the display portion 110 is formed is referred to as the "top surface" and the surface opposite thereto is referred to as the "bottom surface", the surface between the "top surface" and the "bottom surface" may be referred to as the "side surface".

[0087] According to some example embodiments, the first and second processed areas LA and CA may be disposed at one side surface of the substrate 101 , and the second processed area CA may be disposed adjacent to the first processed area LA so as to be connected to the first processed area LA.

[0088] According to some example embodiments, the first and second treated areas LA and CA may be formed to correspond to the entire one side surface of the substrate 101 .

[0089] The first and second processed areas LA and CA may have a certain length, for example, based on a longitudinal direction ( Figure 1 According to some example embodiments, the length of the first processed area LA may be greater than the length of the second processed area CA.

[0090] The first processed area LA may include a first processed surface LAS. The first processed surface LAS may be aligned with the entire thickness direction ( Figure 4 The Z-axis direction corresponds to

[0091] For example, the first processed surface LAS may be a region processed using various methods and may include a laser processed region. According to some example embodiments, the first processed surface LAS may include a laser cut region with respect to the substrate 101 and may include a cut section during laser cutting.

[0092] According to some example embodiments, the first processing surface LAS may include a regular or irregular pattern, for example, a linear pattern. According to some example embodiments, the first processing surface LAS may include a plurality of patterns along the thickness direction ( Figure 4 A linear pattern formed in the Z-axis direction).

[0093] The second processed area CA may include a second processed surface CAS. The second processed surface CAS may be adjacent to the first processed surface LAS and may be directly connected to the first processed surface LAS.

[0094] The second processed surface CAS may be aligned with the entire thickness direction ( Figure 4 The Z-axis direction corresponds to

[0095] For example, the second treated surface CAS may be a region processed using various methods and may include a polished region. According to some example embodiments, the second treated surface CAS may include a polished region where the substrate 101 has been processed using a polishing member.

[0096] According to some example embodiments, the second processed surface CAS may include a polished region of the substrate 101 processed using a computer numerical control (CNC) polishing process.

[0097] In addition, according to some example embodiments, the second treated surface CAS may be a region on which a treating process with respect to a cross section of the cutting region is performed.

[0098] According to some example embodiments, the second processing surface CAS may include a regular or irregular pattern, for example, a linear pattern. According to some example embodiments, the second processing surface CAS may include a Figure 4 A linear pattern is formed in a direction that intersects the Z-axis direction).

[0099] According to some example embodiments, Figure 6 As shown in FIG, the second processed area CA may include a second processed surface CAS, and the second processed surface CAS may include a central processed surface CAS1 and a connecting processed surface CAS2.

[0100] The central processing surface CAS1 may be formed closer to the central axis than the connection processing surface CAS2 based on the thickness direction of the substrate 101. According to some example embodiments, the central processing surface CAS1 may overlap the central axis based on the thickness direction of the substrate 101.

[0101] The connection processing surface CAS2 may be formed closer to the top surface of the substrate 101 (i.e., the surface of the substrate 101 on which the display portion 110 is formed) than the central processing surface CAS1. For example, the connection processing surface CAS2 may be connected to the top surface of the substrate 101 and may be located between the top surface of the substrate 101 and the central processing surface CAS1.

[0102] The angle formed between the central processing surface CAS1 and the top surface of the substrate 101 and the angle formed between the connection processing surface CAS2 and the top surface of the substrate 101 may be different from each other. For example, the angle formed between the top surface of the substrate 101 and the extension line of the central processing surface CAS1 may be about 90 degrees, while the angle formed between the top surface of the substrate 101 and the connection processing surface CAS2 may be greater than 90 degrees. According to some example embodiments, the angle formed between the top surface of the substrate 101 and the connection processing surface CAS2 may be between 110 degrees and 170 degrees.

[0103] For example, the connection processing surface CAS2 may include an inclined surface inclined with respect to the top surface of the substrate 101 .

[0104] According to some example embodiments, the connection processing surface CAS2 may also include a curved surface.

[0105] According to some example embodiments, Figure 7 As shown in FIG, the second processed area CA may include a second processed surface CAS, and the second processed surface CAS may include a central processed surface CAS1, a first connection processed surface CAS2, and a second connection processed surface CAS3.

[0106] Since the central processing surface CAS1 and the first connection processing surface CAS2 can be connected with the Figure 6 The center processing surface CAS1 and the connection processing surface CAS2 are the same or are the same as those described above. Figure 6 The center processing surface CAS1 and the connection processing surface CAS2 are modified in a similar manner, so only the second connection processing surface CAS3 will be described.

[0107] The second connection processing surface CAS3 can be formed as the bottom surface of the substrate 101 (that is, the surface opposite to the top surface on which the display portion 110 is formed) among the surfaces of the substrate 101 that are closer to the central processing surface CAS1. For example, the second connection processing surface CAS3 can be connected to the bottom surface of the substrate 101 and can be formed between the bottom surface of the substrate 101 and the central processing surface CAS1.

[0108] The angle formed between the central processing surface CAS1 and the bottom surface of the substrate 101 and the angle formed between the second connection processing surface CAS3 and the bottom surface of the substrate 101 may be different from each other. For example, the angle formed between the bottom surface of the substrate 101 and the extension line of the central processing surface CAS1 may be approximately 90 degrees, while the angle formed between the bottom surface of the substrate 101 and the second connection processing surface CAS3 may be greater than 90 degrees. According to some example embodiments, the angle formed between the bottom surface of the substrate 101 and the second connection processing surface CAS3 is between 110 degrees and 170 degrees.

[0109] For example, the second connection processing surface CAS3 may include an inclined surface inclined with respect to the bottom surface of the substrate 101 .

[0110] According to some example embodiments, the second connection processing surface CAS3 may include a curved surface.

[0111] A display device according to some example embodiments may include a substrate, a display portion, a first processing region, and a second processing region. Each of the first processing region and the second processing region may correspond to at least one side surface of the substrate and may include a first processing surface and a second processing surface.

[0112] In addition, for example, the first processed surface and the second processed surface can have different shapes and can include surfaces formed using different processing methods. Therefore, when various components are arranged in the area adjacent to the side surface of the substrate of the display device, the first processed surface and the second processed surface can be formed according to the characteristics of the components to be arranged, so that accurate design in the area adjacent to the side surface of the substrate can be easily achieved, the display device can be easily manufactured and inspected, and the display quality can be improved.

[0113] In addition, according to some example embodiments, the first processed surface may include a laser processed region, smooth cutting using laser may be performed on the second processed surface by including a polished region, and precise end determination of a position may be easily performed through polishing.

[0114] In addition, according to some example embodiments, laser cutting can be performed on one side surface of the substrate as a whole, and polishing can be performed on a certain portion of the substrate, so that, for example, after a first processing surface is formed on the entire one side surface of the substrate, polishing can be performed to convert a portion of the first processing surface into a second processing surface.

[0115] Therefore, a display device including the first processed surface and the second processed surface can be easily formed.

[0116] Figure 8 is a plan view illustrating a display device according to some example embodiments, Figure 9It is along Figure 8 The cross-sectional view taken along line IX-IX is as follows: Figure 10 It is along Figure 8 The cross-sectional view taken along line XX is Figure 11 It shows Figure 10 FIG. 1 is a view of a modified embodiment of FIG.

[0117] Reference Figures 8 to 10 , the display device 200 may include a substrate 201, a display portion, a first treatment area LA, and a second treatment area CA.

[0118] The substrate 201 may be formed using various transparent or opaque materials.

[0119] The description of the substrate 201 may be the same as that of the above-described embodiment or modified in a manner similar to that of the above-described embodiment, and thus, a detailed description of the substrate 201 is omitted.

[0120] The display portion is formed on the substrate 201. The display portion may include one or more display devices and may be used to allow a user to recognize an image. These display devices may include devices of various shapes and types (e.g., an OLED including a first electrode, a second electrode, and an organic emission layer).

[0121] According to some example embodiments, an encapsulation portion may be formed on a display portion to protect the display portion. The encapsulation portion may be formed to have a thin film shape, for example, may include one layer or a plurality of layers.

[0122] Furthermore, in a modified embodiment, an encapsulation substrate may be provided on an upper portion of the display portion to correspond to the substrate 201 .

[0123] The first and second processed areas LA and CA may correspond to at least one side surface of the substrate 201 .

[0124] For example, when the surface of the substrate 201 on which the display portion is formed is called the "top surface" and the surface opposite thereto is called the "bottom surface", the surface between the "top surface" and the "bottom surface" may be called the "side surface".

[0125] According to some example embodiments, the first and second processed areas LA and CA may be disposed at one side surface of the substrate 201 , and the second processed area CA may be disposed adjacent to the first processed area LA so as to be connected to the first processed area LA.

[0126] According to some example embodiments, the first and second treated areas LA and CA may be formed to correspond to the entire one side surface of the substrate 201 .

[0127] The first and second processed areas LA and CA may have a certain length, for example, a longitudinal direction ( Figure 8 According to some example embodiments, the length of the first processed area LA may be greater than the length of the second processed area CA.

[0128] The first processed area LA may include a first processed surface LAS. The first processed area LAS may be aligned with the entire thickness direction ( Figure 9 The Z-axis direction corresponds to

[0129] According to some example embodiments, the first treated surface LAS may correspond to one or more insulating layers 220 formed on the substrate 201. For example, the first treated surface LAS may extend to side surfaces of the substrate 201 and side surfaces of the insulating layers 220.

[0130] The insulating layer 220 may selectively include a plurality of layers, for example, a plurality of inorganic layers or a plurality of organic layers.

[0131] According to some example embodiments, the first treated surface LAS may be formed to correspond to at least one region of one or more conductive layers formed on the substrate 201 .

[0132] For example, the first processed surface LAS may be a region processed using various methods and may include a laser processed region. According to some example embodiments, the first processed surface LAS may include a laser cut region with respect to the substrate 201 and may include a cross section cut during the laser cutting.

[0133] According to some example embodiments, the first processing surface LAS may include a regular or irregular pattern, for example, a linear pattern. According to some example embodiments, the first processing surface LAS may include a plurality of patterns along the thickness direction ( Figure 9 A linear pattern formed in the Z-axis direction).

[0134] The second processed area CA may include a second processed surface CAS. The second processed surface CAS may be adjacent to the first processed surface LAS and may be directly connected to the first processed surface LAS.

[0135] The second processed surface CAS may be aligned with the entire thickness direction ( Figure 10 The Z-axis direction corresponds to

[0136] According to some example embodiments, the second processed surface CAS may be formed to correspond to one or more insulating layers 220 formed on the substrate 201. For example, the second processed surface CAS may extend to side surfaces of the substrate 201 and the insulating layer 220.

[0137] According to some example embodiments, the insulating layer 220 may selectively include a plurality of layers, for example, a plurality of inorganic layers or a plurality of organic layers.

[0138] In addition, in a modified embodiment, as Figure 11 As shown in , the second processed surface CAS may be formed to correspond to at least one region of one or more conductive layers 225 formed on the substrate 201 .

[0139] Additionally, in an alternative embodiment, the conductive layers 225 may be covered by the insulating layer 220 , and the second processed surface CAS may be formed to correspond to the conductive layers 225 and the insulating layer 220 .

[0140] For example, the second treated surface CAS may be a region processed using various methods and may include a polished region. According to some example embodiments, the second treated surface CAS may include a polished region where the substrate 201 is processed using a polishing member.

[0141] According to some example embodiments, the second processed surface CAS may include a polished region of the substrate 201 processed using a CNC polishing process.

[0142] In addition, according to some example embodiments, the second treatment surface CAS may be a region on which a treatment process of a cross section of the cutting region is performed.

[0143] According to some example embodiments, the second processing surface CAS may include a regular or irregular pattern, for example, a linear pattern. According to some example embodiments, the second processing surface CAS may include a Figure 10 A linear pattern is formed in a direction that intersects the Z-axis direction).

[0144] According to some example embodiments, the second processed area CA may include a second processed surface CAS, and the second processed surface CAS may include a central processed surface CAS1 and a first connection processed surface CAS2.

[0145] The central processing surface CAS1 may be formed closer to the central axis than the first connection processing surface CAS2 based on the thickness direction of the substrate 201. In an alternative embodiment, the central processing surface CAS1 may overlap the central axis based on the thickness direction of the substrate 201.

[0146] The first connection processing surface CAS2 may be formed to be closer to the top surface of the substrate 201 (i.e., the surface on which the display portion is formed) among the surfaces of the substrate 201 than the central processing surface CAS1. For example, the first connection processing surface CAS2 may be connected to the top surface of the substrate 201 and may be located between the top surface of the substrate 201 and the central processing surface CAS1.

[0147] The angle formed between the central processing surface CAS1 and the top surface of the substrate 201 and the angle formed between the first connection processing surface CAS2 and the top surface of the substrate 201 may be different from each other. For example, the angle formed between the top surface of the substrate 201 and the extension line of the central processing surface CAS1 may be approximately 90 degrees, while the angle formed between the top surface of the substrate 201 and the first connection processing surface CAS2 may be greater than 90 degrees. According to some example embodiments, the angle formed between the top surface of the substrate 201 and the first connection processing surface CAS2 may be between 110 degrees and 170 degrees.

[0148] For example, the first connection processing surface CAS2 may include an inclined surface inclined with respect to the top surface of the substrate 201 .

[0149] According to some example embodiments, the first connection processing surface CAS2 may also include a curved surface.

[0150] In addition, the first connection processing surface CAS2 may correspond to one or more insulating layers 220 formed on the substrate 201. For example, the first connection processing surface CAS2 may be adjacent to an edge of the insulating layer 220, and according to some example embodiments, may be parallel to a region of the edge of the insulating layer 220.

[0151] In addition, in a modified embodiment, as Figure 11 As shown in , the first connection processing surface CAS2 can be formed to correspond to at least one area of one or more conductive layers 225 formed on the substrate 201. In addition, as an optional embodiment, these conductive layers 225 can be covered by the insulating layer 220, and the first connection processing surface CAS2 can be formed to correspond to the conductive layer 225 and the insulating layer 220. In a specific example, the first connection processing surface CAS2 can be parallel to one of the edges of the insulating layer 220 and the conductive layer 225.

[0152] According to some example embodiments, the second processing surface CAS may include a second connection processing surface CAS3.

[0153] The second connection processing surface CAS3 can be formed as the bottom surface of the substrate 201 (that is, the surface opposite to the top surface on which the display portion is formed) among the surfaces closer to the substrate 201 than the central processing surface CAS1. For example, the second connection processing surface CAS3 can be connected to the bottom surface of the substrate 201 and can be formed between the bottom surface of the substrate 201 and the central processing surface CAS1.

[0154] The angle formed between the central processing surface CAS1 and the bottom surface of the substrate 201 and the angle formed between the second connection processing surface CAS3 and the bottom surface of the substrate 201 may be different from each other. For example, the angle formed between the bottom surface of the substrate 201 and the extension line of the central processing surface CAS1 may be about 90 degrees, while the angle formed between the bottom surface of the substrate 201 and the second connection processing surface CAS3 may be greater than 90 degrees. According to some example embodiments, the angle formed between the bottom surface of the substrate 201 and the second connection processing surface CAS3 may be between 110 degrees and 170 degrees.

[0155] For example, the second connection processing surface CAS3 may include an inclined surface inclined with respect to the bottom surface of the substrate 201 .

[0156] According to some example embodiments, the second connection processing surface CAS3 may include a curved surface.

[0157] A display device according to some example embodiments may include a substrate, a display portion, a first processing region, and a second processing region. Each of the first processing region and the second processing region may correspond to at least one side surface of the substrate and may include a first processing surface and a second processing surface.

[0158] In addition, the first and second processed surfaces may have different shapes and may include, for example, surfaces formed using different processing methods. Therefore, when various components are disposed in an area adjacent to the side surface of the substrate of the display device, the first and second processed surfaces may be formed according to the characteristics of the components to be disposed, making it easy to achieve precise design in the area adjacent to the side surface of the substrate, making it easy to manufacture and inspect the display device, and improving display quality.

[0159] In addition, according to some example embodiments, the first processed surface may include a laser processed region, smooth cutting using laser may be performed on the second processed surface by including a polished region, and precise end determination of a position may be easily performed through polishing.

[0160] In addition, according to some example embodiments, laser cutting can be performed on one side surface of the substrate as a whole, and polishing can be performed on a certain portion of the substrate, so that, for example, after a first processing surface is formed on the entire one side surface of the substrate, polishing can be performed to convert a portion of the first processing surface into a second processing surface.

[0161] Therefore, a display device including the first processed surface and the second processed surface can be easily formed.

[0162] In addition, in this case, the insulating layer or the conductive layer can be formed adjacent to the first processing surface and the second processing surface. Therefore, the product maturity at the end portion of the display (for example, the cutting area of the display) can be improved.

[0163] Furthermore, according to some example embodiments, the first processed surface of the first processed region may include an insulating layer, and the second processed surface of the second processed region may include a conductive layer. Thus, the first processed surface in the first processed region is processed (e.g., using a laser process) on the insulating layer, thereby improving cutting efficiency. Furthermore, according to some example embodiments, when the first processed surface does not include a metal layer, it is possible to prevent or reduce the reduction in cutting efficiency for metal layers having low transmittance.

[0164] At the same time, a polishing process can be performed when processing the second processing surface of the second processing area including an insulating layer and a conductive layer or including at least one conductive layer, so that certain residual parts and protrusions at the side surface of the substrate and the end of the conductive layer can be reduced or removed, thereby improving the uniformity characteristics at the edge of the display device.

[0165] According to some example embodiments, the first processed surface may be formed first as an overall process of the edge of the substrate, and then the second processed surface may be partially formed. When the first processed surface is formed, the remaining irregular portion (e.g., the remaining portion of the conductive layer) may be precisely polished using a polishing process (e.g., a CNC polishing process), thereby improving the overall precise appearance line characteristics at the side surface of the substrate.

[0166] Figure 12 is a plan view illustrating a display device according to some example embodiments, Figure 13 It is from Figure 12 The view observed at position K.

[0167] Reference Figure 12 and Figure 13 , the display device 300 may include a substrate 301, a display portion, a first treatment area LA, and second treatment areas CA1 and CA2.

[0168] The description of the substrate 301 and the display portion may be the same as that of the above-described embodiment or modified in a similar manner to that of the above-described embodiment, and thus, their detailed description is omitted.

[0169] The first treated area LA and the second treated areas CA1 and CA2 may correspond to at least one side surface of the substrate 301 .

[0170] For example, the side surface of the substrate 301 on which the display portion is formed is called the "top surface", the surface opposite thereto is called the "bottom surface", and the surface between the "top surface" and the "bottom surface" can be the "side surface".

[0171] According to some example embodiments, the first treated area LA and the second treated areas CA1 and CA2 may be disposed at one side surface of the substrate 301 .

[0172] The two second process areas CA1 and CA2 may be spaced apart from each other by a distance (eg, a predetermined distance), and each of the two second process areas CA1 and CA2 may be disposed adjacent to the first process area LA so as to be connected to the first process area LA.

[0173] In addition, the first process area LA may be located between the two second process areas CA1 and CA2.

[0174] According to some example embodiments, the first treated area LA and the second treated areas CA1 and CA2 may be formed to correspond to the entire one side surface of the substrate 301 .

[0175] The first processed area LA and the second processed areas CA1 and CA2 may have a certain length, for example, based on a longitudinal direction ( Figure 12 The length in the X-axis direction).

[0176] According to some example embodiments, a length of the first treated area LA may be greater than lengths of the second treated area CA1 and the second treated area CA2.

[0177] According to some example embodiments, a length of the first treatment area LA may be greater than a sum of lengths of the second treatment areas CA1 and CA2.

[0178] The first treated area LA may include a first treated surface LAS. The detailed description of the first treated surface LAS may be the same as one of the above-described embodiments and modified embodiments, or may be modified in a manner similar to the above-described embodiments and modified embodiments, and thus, the detailed description thereof is omitted.

[0179] The second processed area CA1 may include a second processed surface CA1S. The second processed area CA2 may include a second processed surface CA2S.

[0180] The second processed surface CA1S and the second processed surface CA2S may be adjacent to and directly connected to the first processed surface LAS.

[0181] The second processed surface CA1S and the second processed surface CA2S may be aligned with the entire thickness direction ( Figure 13The Z-axis direction corresponds to

[0182] The detailed description of the second processed surface CA1S and the second processed surface CA2S may be the same as one of the above-described embodiment and modified embodiments, or may be modified in a similar manner to the above-described embodiment and modified embodiments, and thus, the detailed description thereof is omitted.

[0183] The display device according to one or more embodiments may include a substrate, a display portion, a first processing area, and a second processing area. Each of the first processing area and the second processing area may correspond to at least one side surface of the substrate and may include a first processing surface and a second processing surface.

[0184] In addition, the plurality of second processing regions may be spaced apart from each other by a predetermined distance. Thus, the first processing region and the second processing region may correspond to one side surface of the substrate and may be formed at a determined position in various ways, so that the first processing region and the second processing region may be accurately positioned according to the positions of various components of the substrate (e.g., the position of an insulating layer or a conductive layer).

[0185] Figure 14 is a plan view illustrating a display device according to some example embodiments, Figure 15 It is along Figure 14 The cross-sectional view taken along line XV-XV is Figure 16 It is along Figure 14 A cross-sectional view taken along line XVI-XVI.

[0186] Figure 17 It shows Figure 15 A view of a modified embodiment, Figure 18 It shows Figure 16 FIG. 1 is a view of a modified embodiment of FIG.

[0187] Figure 19 It is along Figure 14 A cross-sectional view taken along line XX-XX.

[0188] Figures 20 to 23 It shows Figure 19 FIG. 1 is a view of a modified embodiment of FIG.

[0189] Reference Figures 14 to 19 , the display device 400 may include a substrate 401, a display portion, a first treatment area LA, and second treatment areas CA1 and CA2.

[0190] The substrate 401 may be formed using various transparent or opaque materials.

[0191] According to some example embodiments, the substrate 401 may be formed of glass, metal, or other organic materials.

[0192] Additionally, according to some example embodiments, the substrate 401 may be a flexible, bendable, foldable, or rollable material.

[0193] In addition, according to some example embodiments, the flexible material used to form the substrate 401 may include thin glass, metal, or plastic.

[0194] According to some example embodiments, the substrate 401 may include polyimide (PI), and according to some example embodiments, the substrate 401 may include various plastic materials.

[0195] A display area DA may be defined on the substrate 401. A display portion may be provided in the display area DA, and the display portion may include at least a display device (eg, an OLED).

[0196] The peripheral area PDA may be defined on the substrate 401. The peripheral area PDA may not overlap with the display area DA. The peripheral area PDA may be a non-display area. In an alternative embodiment, the peripheral area PDA may include an area in which one or more pads (or "pads") 470 are provided.

[0197] The pad portion 470 may be electrically connected to at least one region of the display area DA.

[0198] The peripheral area PDA may include an edge of one side surface of the substrate 401 .

[0199] One or more wiring portions 480 may be formed in the peripheral area PDA. The wiring portion 480 may include one or more wiring members 481 (eg, a plurality of wiring members 481).

[0200] According to some example embodiments, a plurality of wiring portions 480 may be provided in the peripheral area PDA, for example, at both sides of the pad portion 470 between two wiring portions 480, as shown in FIG. Figure 14 As shown in .

[0201] At least one wiring member 481 of the wiring portion 480 may be electrically connected to one region of the display area DA.

[0202] The display portion may be provided in the display area DA. The display portion may include one or more display devices (eg, OLED) 430. Figures 19 to 23 Provide a detailed description of them.

[0203] The first treated area LA and the second treated areas CA1 and CA2 may correspond to at least one side surface of the substrate 401 .

[0204] For example, when the surface of the substrate 401 on which the display portion is formed is referred to as the "top surface" and the surface opposite thereto is referred to as the "bottom surface", the surface between the "top surface" and the "bottom surface" may be referred to as the "side surface".

[0205] According to some example embodiments, the first treated area LA and the second treated areas CA1 and CA2 may be disposed at one side surface of the substrate 401 .

[0206] In addition, for example, the first process area LA and the second process areas CA1 and CA2 may be formed in the peripheral area PDA. In a specific example, the first process area LA and the second process areas CA1 and CA2 may be provided at side surfaces including edges of the peripheral area PDA among edges of the substrate 401.

[0207] The two second process areas CA1 and CA2 may be spaced apart from each other by a distance (eg, a predetermined distance), and each of the two second process areas CA1 and CA2 may be disposed adjacent to the first process area LA so as to be connected to the first process area LA.

[0208] In addition, the first treatment area LA may be located between the two second treatment areas CA1 and CA2.

[0209] According to some example embodiments, the first treated area LA and the second treated areas CA1 and CA2 may be formed to correspond to the entire one side surface of the substrate 401 .

[0210] The first processed area LA and the second processed areas CA1 and CA2 may have a certain length, for example, based on a longitudinal direction of one side surface of the substrate 401 (eg, Figure 14 The length in the X-axis direction).

[0211] According to some example embodiments, a length of the first treated area LA may be greater than lengths of the second treated area CA1 and the second treated area CA2.

[0212] According to some example embodiments, a length of the first treated area LA may be greater than a sum of lengths of the second treated area CA1 and the second treated area CA2.

[0213] Each of the second processing areas CA1 and CA2 may correspond to the wiring portion 480 (eg, the wiring member 481 of the wiring portion 480 ).

[0214] According to some example embodiments, all wiring members 481 of the wiring portion 480 may correspond to each of the second processing areas CA1 and CA2. For example, all wiring members 481 of the wiring portion 480 may be connected to each of the second processing areas CA1 and CA2 (specifically, to the second processing surface CAS).

[0215] The first processed area LA may include a first processed surface LAS. The first processed surface LAS may be aligned with the entire thickness direction ( Figure 15 The Z-axis direction corresponds to

[0216] For example, the first processed surface LAS may be a region processed using various methods and may include a laser processed region. According to some example embodiments, the first processed surface LAS may include a laser cut region with respect to the substrate 401 and may include a cut section during laser cutting.

[0217] According to some example embodiments, the first processing surface LAS may include a regular or irregular pattern, for example, a linear pattern. According to some example embodiments, the first processing surface LAS may include a plurality of patterns along the thickness direction ( Figure 15 A linear pattern formed in the Z-axis direction).

[0218] Figure 17 Shown Figure 15 FIG. 1 is a view of a modified embodiment of FIG. Figure 17 , according to some example embodiments, the first processed surface LAS may correspond to one or more insulating layers 420 formed on the substrate 401. For example, the first processed surface LAS may extend to side surfaces of the substrate 401 and the insulating layer 420.

[0219] According to some example embodiments, the insulating layer 420 may include a plurality of layers, for example, a plurality of inorganic layers or a plurality of organic layers.

[0220] According to some example embodiments, the first processed surface LAS may correspond to at least one region of one or more conductive layers formed on the substrate 401 .

[0221] Each of the second processed areas CA1 and CA2 may include a second processed surface CAS. The second processed surface CAS may be adjacent to the first processed surface LAS and may be directly connected to the first processed surface LAS.

[0222] The second processed surface CAS may be aligned with the entire thickness direction ( Figure 16 The Z-axis direction corresponds to

[0223] Reference Figure 16The second processed surface CAS may include a central processed surface CAS1 and a first connection processed surface CAS2. In addition, according to some example embodiments, the second processed surface CAS may include a second connection processed surface CAS3.

[0224] The description of the central processing surface CAS1, the first connection processing surface CAS2 and the second connection processing surface CAS3 may be the same as that of the above-mentioned embodiment or may be modified in a similar manner to the above-mentioned embodiment as occasion demands, and thus their detailed description is omitted.

[0225] The second processing surface CAS may correspond to one or more conductive layers (eg, the wiring member 481 of the wiring portion 480 ) formed on the substrate 401 . In a specific example, the first connection processing surface CAS2 of the second processing surface CAS may be connected to an end of the wiring member 481 .

[0226] According to some example embodiments, a boundary line of the first connection processing surface CAS2 of the second processing surface CAS may be connected to a boundary line of the wiring member 481 (eg, parallel to the boundary line of the wiring member 481 ).

[0227] Therefore, the wiring member 481 can be prevented from protruding from the edge of the substrate 401 or from being undesirably left over, or the protrusion or left over can be reduced, so that the manufacturing characteristics and electrical characteristics of the display device 400 can be improved and the picture quality can be enhanced.

[0228] According to some example embodiments, Figure 18 As shown in , the insulating layer 420 may be formed on the wiring member 481 , and the second processed surface CAS may correspond to the wiring member 481 and the insulating layer 420 .

[0229] For example, the first connection processing surface CAS2 of the second processing surface CAS may be connected to the end portion of the insulating layer 420 and the wiring member 481 .

[0230] According to some example embodiments, a boundary line of the first connection processing surface CAS2 of the second processing surface CAS may be connected to (e.g., parallel to) a boundary line of the wiring member 481 and a boundary line of the insulating layer 420.

[0231] The second processed surface CAS of the second processed area CA may be aligned with the entire thickness direction ( Figure 16 The Z-axis direction corresponds to

[0232] For example, the second treated surface CAS may be a region processed using various methods and may include a polished region. According to some example embodiments, the second treated surface CAS may include a polished region where the substrate 401 is processed using a polishing member.

[0233] According to some example embodiments, the second processed surface CAS may include a polished region of the substrate 401 processed using a CNC process.

[0234] Also, according to some example embodiments, a treatment process with respect to a cross section of a cutting region may be performed on the second treatment surface CAS.

[0235] According to some example embodiments, the second processing surface CAS may include a regular or irregular pattern, for example, a linear pattern. According to some example embodiments, the second processing surface CAS may include a Figure 16 A linear pattern is formed in a direction that intersects the Z-axis direction).

[0236] Will refer to Figures 19 to 23 Describes the display section.

[0237] Figure 19 It is along Figure 14 A cross-sectional view taken along line XX-XX.

[0238] Reference Figure 19 The display device 430 is formed on the substrate 401. For example, the display device 430 may be an OLED, and may include a first electrode 431, a second electrode 432, and an intermediate layer 433.

[0239] The first electrode 431 may function as an anode, and the second electrode 432 may function as a cathode. Of course, the order of these polarities may be reversed.

[0240] The first electrode 431 may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or In 2 O 3. In addition, the first electrode 431 may include a reflective layer formed of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), ytterbium (Yb), or calcium (Ca), depending on the purpose and design conditions.

[0241] The intermediate layer 433 may include an organic emission layer that emits visible light. In addition, the intermediate layer 433 may selectively include at least one of a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL).

[0242] The second electrode 432 may be formed using a metal such as Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, or Ca.

[0243] In addition, according to some example embodiments, the second electrode 432 may include ITO, IZO, ZnO, or In 2 O 3 , which may allow light to pass therethrough.

[0244] When a voltage is applied to the intermediate layer 433 through the first electrode 431 and the second electrode 432 , the organic emission layer of the intermediate layer 433 emits visible light, so that an image may be realized.

[0245] Figures 20 to 23 It shows Figure 19 FIG. 1 is a view of a modified embodiment of FIG.

[0246] First, refer to Figure 20 , a display device 430' is formed on a substrate 401'. For example, the display device 430' as an OLED includes a first electrode 431', a second electrode 432', and an intermediate layer 433'.

[0247] The first electrode 431' is formed on the substrate 401'. The pixel defining layer 419' is formed on the first electrode 431' so as to expose a certain region (eg, a predetermined region) of the first electrode 431'.

[0248] The pixel defining layer 419' may be formed using various materials. As an example, the pixel defining layer 419' may include an organic material, and according to some example embodiments, may include an inorganic material.

[0249] According to some example embodiments, the pixel defining layer 419 ′ may include a PI-based material or an acryl-based material.

[0250] The intermediate layer 433 ′ may be formed in a region of the first electrode 431 ′ that is not covered by the pixel defining layer 419 ′ but is exposed.

[0251] The second electrode 432 ′ may be formed on the intermediate layer 433 ′, and according to some example embodiments, the second electrode 432 ′ may be commonly formed on the entire pixel.

[0252] According to some example embodiments, referring to Figure 21 , a display device 430 ″ and a thin film transistor (TFT) are formed on a substrate 401 ″. For example, the display device 430 ″ may be an OLED, and may include a first electrode 431 ″, a second electrode 432 ″, and an intermediate layer 433 ″.

[0253] The TFT may include an active layer 403 ″, a gate electrode 405 ″, a source electrode 407 ″, and a drain electrode 408 ″.

[0254] The active layer 403 ″ is formed on the substrate 401 ″. According to some example embodiments, a buffer layer 402 ″ may be formed between the substrate 401 ″ and the active layer 403 ″.

[0255] The active layer 403 ″ may include an inorganic semiconductor material such as silicon, an organic semiconductor material, or an oxide semiconductor material, and may also be formed by implanting a p-type or n-type dopant.

[0256] A gate insulating layer 404" is formed on the active layer 403". A gate electrode 405" is formed on the gate insulating layer 404" so as to correspond to the active layer 403".

[0257] An interlayer insulating layer 406 ″ is formed to cover the gate electrode 405 ″, and a source electrode 407 ″ and a drain electrode 408 ″ are formed on the interlayer insulating layer 406 ″ so as to be in contact with predetermined regions of the active layer 403 ″.

[0258] A passivation layer 409 ″ is formed to cover the source electrode 407 ″ and the drain electrode 408 ″. In an alternative embodiment, a top surface of the passivation layer 409 ″ may be a flat surface. In another example, a planarization layer may be further formed on the passivation layer 409 ″.

[0259] The first electrode 431 ″ is formed on the passivation layer 409 ″. The first electrode 431 ″ is electrically connected to one of the source electrode 407 and the drain electrode 408 ″. Figure 21 , for convenience of explanation, the first electrode 431 ″ is connected to the drain electrode 408 ″.

[0260] A pixel defining layer 419″ is formed on the first electrode 431″. The pixel defining layer 419″ does not cover at least a predetermined area of the top surface of the first electrode 431″. An intermediate layer 433″ is formed on the top surface of the first electrode 431″ and includes an organic emission layer. A second electrode 432″ is formed on the intermediate layer 433″.

[0261] According to some example embodiments, an encapsulation part is formed on the display device 430 ″ in order to protect the display device 430 ″.

[0262] For example, Figure 22 As shown in FIG, the encapsulation part 491 ″ may be formed on the second electrode 432 ″. According to some example embodiments, the encapsulation part 491 ″ may have a thin film shape, for example, may include one layer or a plurality of layers.

[0263] According to some example embodiments, the encapsulation portion 491″ may include one or more layers containing an inorganic material (such as silicon oxide or silicon nitride) and one or more layers containing an organic material (such as epoxy resin and polyimide). In another example, the encapsulation portion 491″ may include a structure in which layers containing inorganic materials and layers containing organic materials are alternately stacked.

[0264] In another example, Figure 23 As shown in FIG, an encapsulation portion 492 ″ having a substrate shape may also be provided on the second electrode 432 ″.

[0265] A display device according to some example embodiments may include a substrate, a display portion, a first processing region, and a second processing region. Each of the first processing region and the second processing region may correspond to at least one side surface of the substrate and may include a first processing surface and a second processing surface.

[0266] Furthermore, for example, the first and second processed surfaces may have different shapes and may include surfaces formed using different processing methods. Therefore, when various components are disposed in an area adjacent to the side surface of the substrate of a display device, the first and second processed surfaces may be formed according to the characteristics of the components to be disposed, making it easy to accurately design the area adjacent to the side surface of the substrate, making it easy to manufacture and inspect the display device, and improving display quality.

[0267] Furthermore, according to some example embodiments, the first processed surface may include a laser processed region and the second processed surface may include a polished region, so that smooth cutting using laser may be performed and precise end determination of a position may be easily performed through polishing.

[0268] In addition, according to some example embodiments, laser cutting can be performed on the entire one side surface of the substrate, and polishing can be performed on a determined portion of the one side surface of the substrate, and, for example, polishing can be performed after a first processing surface is formed on the entire one side surface of the substrate so that a portion of the first processing surface can be converted into a second processing surface.

[0269] Therefore, a display device including the first processed surface and the second processed surface can be easily formed.

[0270] Furthermore, in this case, the insulating layer or the conductive layer can be formed adjacent to the first processing surface and the second processing surface.Therefore, the product quality at the edge (eg, cutting area) of the display can be improved.

[0271] Furthermore, according to some example embodiments, the first processed surface of the first processed region may include an insulating layer, and the second processed surface of the second processed region may include a wiring member. Thus, the first processed surface of the first processed region may be processed (e.g., using a laser process) on the insulating layer, thereby improving cutting efficiency. Furthermore, when the first processed surface does not include a wiring member, it is possible to prevent or reduce the reduction in cutting efficiency of metal having a low transmittance of the wiring member during laser cutting.

[0272] At the same time, a polishing process can be performed when processing the second processing surface of the second processing area including the insulating layer and the wiring member or including at least the wiring member, so that certain residual portions and protrusions at the side surface of the substrate and the end of the wiring member can be reduced or removed, thereby improving the uniformity characteristics of the edge of the display device.

[0273] According to some example embodiments, after first forming the first processing surface as the entire process of the edge of the substrate, the second processing surface may be partially formed. When forming the first processing surface, the remaining irregular portion (e.g., the remaining portion of the wiring member) may be accurately polished using a polishing process (e.g., a CNC polishing process), thereby improving the overall precise appearance line characteristics at the side surface of the substrate.

[0274] Furthermore, the first connection processing surface of the second processing surface can be connected to the wiring member, and the end of the wiring member and the end of the first connection processing surface can be connected to each other. Therefore, a certain area and the remaining area of the wiring member can be removed, so that the end of the wiring member can at least not extend beyond the edge of the substrate, or can be inside the edge of the substrate, thereby reducing certain electrical or physical defects, improving the precise edge characteristics of the display device, and improving electrical characteristics and picture quality characteristics.

[0275] Furthermore, after forming the first processed surface with high efficiency, the second processed surface with respect to the wiring portion including the wiring member can be formed, so that the process cost can be reduced.

[0276] Figures 24 to 26 are views illustrating a method of manufacturing a display device according to some example embodiments.

[0277] For the sake of convenience of explanation, in this embodiment, the above-described Figure 14 display device 400.

[0278] First, refer to Figure 24 , showing the display device preparatory structure 400PS.

[0279] In the display device preparation structure 400PS, a dummy area DMA may be formed on the substrate 401 , and the dummy area DMA may be an area to be removed based on the cutting line CL.

[0280] One or more dummy pads DMP are formed in the dummy area DMA. For example, the dummy pads DMP may be electrically connected to the wiring member 481 via the connection member DMW.

[0281] An electrical signal for inspection may be applied to the display area DA using the dummy pad DMP. Thus, various electrical inspections including defect inspection of the display area DA may be performed.

[0282] After performing an inspection using the dummy pad DMP, the dummy area DMA may be removed based on the cutting line CL.

[0283] For example, Figure 25 As shown in FIG, the first processed area LA may be formed to correspond to the entire cutting line CL. For example, a cutting process may be performed along the cutting line CL by irradiating laser light onto the substrate 401.

[0284] Therefore, the first processed area LA may be formed throughout the cutting line CL of the substrate 401 and the first processed surface may be formed at the side surface of the substrate 401. For example, the first processed area LA may be formed even in an area including an end portion of the wiring member 481.

[0285] Then, refer to Figure 26 , two second processing areas CA1 and CA2 may be formed in a region including at least the wiring portion 480. For example, the second processing areas CA1 and CA2 may be formed to correspond to the wiring member 481 of the wiring portion 480, and the second processing surface may be formed in a region including an end portion of the wiring member 481.

[0286] According to some example embodiments, the second processing region CA1 or CA2 may be formed in a region including at least the wiring portion 480 .

[0287] Therefore, the display device 400 can be finally formed.

[0288] In the step of forming the first processed area LA, when laser light is irradiated onto the wiring member 481, the transmittance of the wiring member 481 is not high. Therefore, the efficiency of the cutting process of the wiring member 481 may be lower than the efficiency of the cutting process of the substrate 401 and the insulating layer, and the cutting quality of the cutting process of the wiring member 481 may be lower than the cutting quality of the cutting process of the substrate 401 and the insulating layer.

[0289] For example, some residual material may remain in the edge of the wiring member 481, and less cut protrusions of the wiring member 481 may protrude irregularly from the edge of the wiring member 481. Therefore, it may not be easy to obtain the desired substrate 401 and the desired edge of the wiring member 481.

[0290] According to some example embodiments, the second processed area CA may be processed by a polishing process (in a specific example, by a CNC polishing process) in the area including the wiring portion 480. Through this polishing process, residual materials of the wiring member 481 and protrusions from the edge of the wiring member 481 may be effectively polished, and according to some example embodiments, the wiring member 481 may be processed so as to be connected to the boundary line of the second processed surface of the second processed area CA.

[0291] Therefore, electrical defects in the edge of the display device (for example, in the edge including the wiring member) can be reduced, so that the electrical characteristics and picture quality characteristics of the display device can be improved.

[0292] In addition, a first processing area can be first formed as a whole in one side surface of the substrate by laser processing with high process efficiency and low cost, and then the desired area can be selected and polishing such as CNC polishing can be performed, so that process efficiency can be maintained, process cost can be reduced, and manufacturing characteristics of the display device can be improved.

[0293] Figure 27 is a plan view illustrating a display device according to some example embodiments.

[0294] Reference Figure 27 , the display device 500 may include a substrate 501, a display portion, a first treatment area LA, and second treatment areas CA1 and CA2.

[0295] A display area DA may be defined in the substrate 501. A display portion may be provided in the display area DA, and the display portion may include at least a display device (eg, an OLED).

[0296] The peripheral area PDA may be defined on the substrate 501. The peripheral area PDA may not overlap the display area DA. The peripheral area PDA may be a non-display area. According to some example embodiments, the peripheral area PDA may include an area in which one or more pads 570 are provided.

[0297] The pad part 570 may be electrically connected to at least one region of the display area DA.

[0298] The peripheral area PDA may include an edge of one side surface of the substrate 501 .

[0299] One or more wiring portions 580 may be formed in the peripheral area PDA, and the wiring portion 580 may include one or more wiring members 581 (eg, a plurality of wiring members 581 ).

[0300] According to some example embodiments, a plurality of wiring portions 580 may be provided in the peripheral area PDA, for example, two wiring portions 580 may be provided at both sides of the pad portion 570 located therebetween.

[0301] At least one wiring member 581 of the wiring portion 580 may be electrically connected to one region of the display area DA.

[0302] The first treated area LA and the second treated areas CA1 and CA2 may correspond to at least one side surface of the substrate 501 .

[0303] In addition, for example, the first and second processed areas LA and CA1 and CA2 may be formed in the peripheral area PDA. According to some example embodiments, the first and second processed areas LA and CA1 and CA2 may be disposed at side surfaces including edges of the peripheral area PDA among edges of the substrate 501.

[0304] The two second process areas CA1 and CA2 may be separated from each other, and each of the second process areas CA1 and CA2 may be adjacent to the first process area LA so as to be connected to the first process area LA.

[0305] In addition, the first treatment area LA may be located between the two second treatment areas CA1 and CA2.

[0306] According to some example embodiments, the edges of the two second treatment areas CA1 and CA2 may not be parallel to the edge of the first treatment area LA, but may be bent at a certain angle. For example, the angle formed between the edges of the two second treatment areas CA1 and CA2 and the edge of the first treatment area LA may be greater than 90 degrees and less than 180 degrees.

[0307] Therefore, when the second processed areas CA1 and CA2 are formed, the influence on the first processed area LA can be reduced. In an alternative embodiment, damage to the already formed first processed area LA can be reduced.

[0308] Furthermore, the position of the wiring portion 580 of the display device 500 can be easily displayed.

[0309] Figure 28 is a plan view illustrating a display device according to some example embodiments.

[0310] Reference Figure 28, the display device 600 may include a substrate 601, a display portion, a first treatment area LA, and second treatment areas CA1 and CA2.

[0311] A display area DA may be defined on the substrate 601. A display portion may be provided in the display area DA and may include at least a display device (eg, an OLED).

[0312] The peripheral area PDA may be defined on the substrate 601 and may not overlap the display area DA. The peripheral area PDA may be a non-display area and, according to some example embodiments, may include an area in which one or more pads 670 are provided.

[0313] The pad portion 670 may be electrically connected to at least one region of the display area DA.

[0314] The peripheral area PDA may include an edge of one side surface of the substrate 601 .

[0315] One or more wiring portions 680 may be formed in the peripheral area PDA, and the wiring portion 680 may include one or more wiring members 681 (eg, a plurality of wiring members 681 ).

[0316] According to some example embodiments, a plurality of wiring portions 680 may be provided in the peripheral area PDA. For example, two wiring portions 680 may be provided at both sides of the pad portion 670 located between the two wiring portions 680.

[0317] At least one wiring member 681 of the wiring portion 680 may be electrically connected to one region of the display area DA.

[0318] The first treated area LA and the second treated areas CA1 and CA2 may correspond to at least one side surface of the substrate 601 .

[0319] In addition, for example, the first and second processed areas LA and CA1 and CA2 may be formed in the peripheral area PDA. According to some example embodiments, the first and second processed areas LA and CA1 and CA2 may be disposed at side surfaces including edges of the peripheral area PDA among edges of the substrate 601.

[0320] The two second process areas CA1 and CA2 may be separated from each other, and each of the second process areas CA1 and CA2 may be adjacent to the first process area LA so as to be connected to the first process area LA.

[0321] In addition, the first process area LA may be provided between the two second process areas CA1 and CA2.

[0322] According to some example embodiments, edges of the two second treatment areas CA1 and CA2 may not be parallel to the edge of the first treatment area LA, but may be bent at a certain angle.

[0323] Therefore, when forming the second treated areas CA1 and CA2 , the influence on the first treated area LA may be reduced, and according to some example embodiments, damage to the already formed first treated area LA may be reduced.

[0324] Furthermore, the position of the wiring portion 680 of the display device 600 can be easily displayed.

[0325] In addition, the edges of the second treated areas CA1 and CA2 may include a curved line. For example, the second treated surfaces of the second treated areas CA1 and CA2 may include a curved surface based on a direction intersecting the thickness direction of the substrate 601.

[0326] Through the structure of the second processed areas CA1 and CA2 including the curved surface, damage such as occurrence of cracks at the edge of the display device 600 may be reduced.

[0327] Furthermore, the overall aesthetics of the display device 600 may be enhanced, and the display device 600 may be easily applied to various devices and housings.

[0328] Figure 29 is a plan view illustrating a display device according to some example embodiments.

[0329] Reference Figure 29 , the display device 700 may include a substrate 701, a display portion, a first treatment area LA, and second treatment areas CA1 and CA2.

[0330] A display area DA may be defined on the substrate 701. A display portion may be provided in the display area DA and may include at least a display device (eg, an OLED).

[0331] The peripheral area PDA may be defined on the substrate 701 and may not overlap the display area DA. The peripheral area PDA may be a non-display area and, according to some example embodiments, may include an area in which one or more pads 770 are provided.

[0332] The pad portion 770 may be electrically connected to at least one region of the display area DA.

[0333] The peripheral area PDA may include an edge of one side surface of the substrate 701 .

[0334] One or more wiring portions 780 may be formed in the peripheral area PDA. The one or more wiring portions 780 may include one or more wiring members 781 (eg, a plurality of wiring members 781).

[0335] According to some example embodiments, a plurality of wiring portions 780 may be provided in the peripheral area PDA, eg, may be provided at both sides of the pad portion 770 located between two wiring portions 780 .

[0336] At least one wiring member 781 of the wiring portion 780 may be electrically connected to one region of the display area DA.

[0337] The first treated area LA and the second treated areas CA1 and CA2 may correspond to at least one side surface of the substrate 701 .

[0338] In addition, for example, the first and second processed areas LA and CA1 and CA2 may be formed in the peripheral area PDA. According to some example embodiments, the first and second processed areas LA and CA1 and CA2 may be disposed at side surfaces including edges of the peripheral area PDA among edges of the substrate 701.

[0339] In addition, the second process areas CA1 and CA2 may be separated from each other, and each of the two second process areas CA1 and CA2 may be adjacent to the first process area LA so as to be connected to the first process area LA.

[0340] In addition, the first process area LA may be provided between the two second process areas CA1 and CA2.

[0341] According to some example embodiments, edges of the two second treatment areas CA1 and CA2 may not be parallel to the edge of the first treatment area LA, but may be bent at a certain angle.

[0342] In addition, the edges of the second treated areas CA1 and CA2 may include a curved line. For example, the second treated surfaces of the second treated areas CA1 and CA2 may include a curved surface based on a direction intersecting the thickness direction of the substrate 701 .

[0343] For example, the edges of the second processing areas CA1 and CA2 may include curves such as a convex line CV and a concave line CC. The convex line CV may have a convex shape relative to the display area DA (e.g., a shape in which the curve gradually moves away from the display area DA). The concave line CC may be connected to the convex line CV and may have a concave shape relative to the display area DA (e.g., a shape in which the curve gradually moves closer to the display area DA). Therefore, rapid changes at the ends of the wiring member 781 of the wiring portion 780 can be reduced, thereby improving the durability of the display device 700.

[0344] Furthermore, according to some example embodiments, a region in which the pad portion 770 is provided may easily protrude from other regions, so that the pad portion 770 may be easily applied to various mechanical components and a housing of the display device 700 .

[0345] Figure 30 is a plan view illustrating a display device according to some example embodiments, Figure 31 It is along Figure 30 The cross-sectional view taken along line XXXI-XXXI is Figure 32 It is along Figure 30 A cross-sectional view taken along line XXXII-XXXII, Figure 33 It shows Figure 31 FIG. 1 is a view of a modified embodiment of FIG.

[0346] Reference Figures 30 to 33 , the display device 800 may include a substrate 801, a display portion, a first treatment area LA, and second treatment areas CA1 and CA2.

[0347] A display area DA may be defined on the substrate 801. A display portion may be provided in the display area DA. The display portion may include at least a display device (eg, an OLED).

[0348] The peripheral area PDA may be defined on the substrate 801. The peripheral area PDA may not overlap the display area DA. The peripheral area PDA may be a non-display area. In an alternative embodiment, the peripheral area PDA may include an area in which one or more pads 870 are provided.

[0349] The pad portion 870 may be electrically connected to at least one region of the display area DA.

[0350] The peripheral area PDA may include an edge of one side surface of the substrate 801 .

[0351] One or more wiring portions 880 may be formed in the peripheral area PDA. The wiring portion 880 may include one or more wiring members 881 (eg, a plurality of wiring members 881).

[0352] According to some example embodiments, a plurality of wiring portions 880 may be provided in the peripheral area PDA, for example, two wiring portions 880 may be provided at both sides of the pad portion 870 located therebetween.

[0353] At least one wiring member 881 of the wiring portion 880 may be electrically connected to one region of the display area DA.

[0354] The first treated area LA and the second treated areas CA1 and CA2 may correspond to at least one side surface of the substrate 801 .

[0355] In addition, for example, the first process area LA and the second process areas CA1 and CA2 may be formed in the peripheral area PDA. In a specific example, the first process area LA and the second process areas CA1 and CA2 may be provided at side surfaces including edges of the peripheral area PDA among edges of the substrate 801.

[0356] The two second process areas CA1 and CA2 may be separated from each other, and each of the two second process areas CA1 and CA2 may be adjacent to the first process area LA so as to be connected to the first process area LA.

[0357] In addition, the first process area LA may be provided between the two second process areas CA1 and CA2.

[0358] According to some example embodiments, each of the second processed areas CA1 and CA2 may include a second processed surface CAS, and the second processed surface CAS may include a central processed surface CAS1 and a first connection processed surface CAS2a.

[0359] Furthermore, according to some example embodiments, the second processing surface CAS may include a second connection processing surface CAS3.

[0360] The width of the first connection processing surface CAS2a may be determined in various ways. For example, the width of the first connection processing surface CAS2a may be a width based on a direction away from the central processing surface CAS1, for example, a polished width during a polishing process.

[0361] The width of the first connection processing surface CAS2a can be increased, so that the polishing amount of the wiring member 881 can be increased, and the defect reduction characteristics of the display device can be improved.

[0362] According to some example embodiments, the width of the first connection processing surface CAS2a may be different from, eg, greater than, the width of the second connection processing surface CAS3. Therefore, the efficiency of the polishing process may be improved.

[0363] According to some example embodiments, Figure 33 As shown in , the polishing amount of the second connection processing surface CAS3a may be increased so that the width of the second connection processing surface CAS3a may be the same as that of the first connection processing surface CAS2a.

[0364] In addition, according to some example embodiments, Figure 31 and Figure 32 As shown in the difference between the two, the width of the first connection processing surface CAS2a can be Figure 32The width of the first connection processing surface CAS2b is different. For example, Figure 31 The first connection processing surface CAS2a can be a large polishing area, while Figure 32 The first connection processing surface CAS2b may be a small polishing area.

[0365] Therefore, the polishing amount of a certain area within the second processing area can be increased, and for example, the polishing amount in an area where a large number of wiring members of the wiring portion are provided can be increased, so that the width of the first connection processing surface can be increased.

[0366] According to some example embodiments, edges of the two second treatment areas CA1 and CA2 may not be parallel to the edge of the first treatment area LA, but may be bent at a certain angle.

[0367] In addition, the edges of the second processed areas CA1 and CA2 may include a curve. For example, the second processed surfaces of the second processed areas CA1 and CA2 may include a curved surface based on a direction intersecting with the thickness direction of the substrate 801.

[0368] Through the structure of the second processed areas CA1 and CA2 including the curved surface, damage such as occurrence of cracks at the edge of the display device 800 may be reduced.

[0369] The particular implementations shown and described herein are illustrative examples of one or more embodiments and are not intended to otherwise limit the scope of one or more embodiments in any way. Furthermore, no item or component is essential to the practice of one or more embodiments unless the element is expressly described as "essential" or "critical."

[0370] The terms "one" and "one / the" and "said" and similar designations used in the context of describing one or more embodiments (especially in the context of claims) will be understood to include both singular and plural. In addition, unless otherwise indicated herein, the numerical ranges narrated here are merely intended to be used as a shortcut method for indicating each individual numerical value falling within the scope, and each individual numerical value is incorporated into the specification, as if each individual numerical value is individually narrated here. The steps of all methods described herein can be performed in any appropriate order, unless otherwise indicated herein or clearly contradicted by context. Any and all examples or exemplary language (e.g., "such as") are provided herein to better illustrate one or more embodiments, and unless otherwise stated, they do not cause limitation to the scope of one or more embodiments. Without departing from the spirit and scope of one or more embodiments, various changes and modifications will be apparent to those skilled in the art.

[0371] As described above, in the display device and the method of manufacturing the display device according to the embodiment, a display device having improved electrical characteristics and picture quality characteristics can be easily provided, and the efficiency of the manufacturing process can be improved.

[0372] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each embodiment should typically be considered as available for other similar features or aspects in other embodiments.

[0373] While one or more embodiments have been described with reference to the drawings, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope as defined by the claims and their equivalents.

Claims

1. A display device, comprising: a substrate and a display portion located on the substrate; a first processing region comprising a first processing surface located on at least one side surface of the substrate; as well as a second processing region adjacent to the first processing region and comprising a second processing surface having a shape different from that of the first processing surface of the first processing region, the second processing surface being located on the at least one side surface of the substrate, wherein the second processed surface includes a central processed surface and a connecting processed surface among the side surfaces of the substrate, the connecting processed surface being closer to the top surface of the substrate on which the display portion is disposed than the central processed surface, and the connecting processed surface being inclined at a certain angle relative to the central processed surface, and The display device further includes a wiring portion located on the substrate, wherein the second processing surface is connected to the wiring portion.

2. The display device according to claim 1, wherein The first processing surface and the second processing surface are directly connected to each other.

3. The display device according to claim 1, wherein The first treated surface and the second treated surface correspond to the entire thickness of the substrate.

4. The display device according to claim 1, wherein The first treated surface and the second treated surface are formed using different treatment methods.

5. The display device according to claim 1, further comprising one or more insulating layers on the substrate, wherein The first processed surface or the second processed surface is connected to the one or more insulating layers. The display device according to claim 1 , wherein: A plurality of second processing regions are formed.

7. The display device according to claim 6, wherein: Two second processing areas among the plurality of second processing areas are located at both sides of the first processing area between the two second processing areas.

8. The display device according to claim 1, wherein A peripheral area is located on the substrate and does not overlap with a display area of the display device, and the first processing area and the second processing area correspond to the peripheral area.

9. The display device according to claim 8, wherein One or more pads are located in the peripheral region.

10. The display device according to claim 8, wherein The wiring portion is located in the peripheral area and includes one or more wiring members.

11. A method for manufacturing a display device, the display device comprising a substrate and a display portion located on the substrate, the method comprising: forming a first processing region including a first processing surface on at least one side surface of the substrate; as well as forming a second processing region adjacent to the first processing region and including a second processing surface on the at least one side surface of the substrate having a shape different from that of the first processing surface, wherein the second processed surface includes a central processed surface and a connecting processed surface among the side surfaces of the substrate, the connecting processed surface being closer to the top surface of the substrate on which the display portion is disposed than the central processed surface, and the connecting processed surface being inclined at a certain angle relative to the central processed surface, and The display device further includes a wiring portion located on the substrate, wherein the second processing surface is connected to the wiring portion.

12. The method according to claim 11, wherein The first treated surface and the second treated surface are formed using different treatment methods.

13. The method according to claim 11, wherein The step of forming the first processed surface includes a laser processing process.

14. The method according to claim 11, wherein The step of forming the second treated surface includes a polishing process.

15. The method according to claim 11, wherein After forming the first processing region, the second processing region is formed, the second processing region including at least one region of the first processing region.

16. The method according to claim 11, further comprising: preparing a preliminary structure for a display device, the preliminary structure for the display device including a dummy area on the substrate; as well as The dummy area is removed based on a cutting line of the preliminary structure of the display device.

17. The method according to claim 16, wherein: The first processed region is formed in the step of removing the dummy region based on the cutting line, and the second processed region is formed after the step of forming the first processed region.

18. The method according to claim 16, further comprising: Before removing the dummy region, an inspection process is performed using the dummy region.

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