Semiconductor heat exchange component, clothes drying equipment and control method thereof

Abstract

The present invention discloses a semiconductor heat exchange component, a clothes drying device and a control method thereof. The semiconductor heat exchange component includes a semiconductor refrigeration plate, a laminar heat exchanger and a driving mechanism, wherein the laminar heat exchanger includes a first heat exchange part for exchanging the coldness of the cold end of the semiconductor refrigeration plate, and the laminar heat exchanger includes a second heat exchange part for exchanging the heat of the hot end of the semiconductor refrigeration plate. The first heat exchange part and the second heat exchange part respectively include multiple layers of circular blades, and the driving mechanism is used to drive the laminar heat exchanger to rotate; an air inlet area is formed between the through holes of the multiple layers of the circular blades, and an air outlet area is formed between two adjacent layers of the circular blades. The overall volume of the clothes drying device is reduced, and the operating noise is reduced to improve the user experience.

Description

Technical Field

[0001] The invention relates to refrigeration equipment, and in particular to a semiconductor heat exchange component, a clothes drying equipment and a control method thereof. Background Art

[0002] At present, the drying cabinets in the prior art usually use heat pump drying or electric heating to dry clothes. However, when the heat pump is running, the user experience is poor due to the high noise of the compressor and the fan, and the electric heating method has the disadvantages of high power consumption and high fan noise. With the development of semiconductor refrigeration technology, the technology of using semiconductor refrigeration technology to realize the function of drying cabinets has been gradually promoted. Chinese Patent No. 201210008372 discloses a new type of dryer, which realizes the function of drying clothes by using semiconductor refrigeration sheets in conjunction with the condenser and evaporator in the air duct. At the same time, a fan is configured in the air duct to realize the circulation of airflow. In actual use, the condenser, evaporator and fan need to occupy a large space, and the noise during the operation of the fan is still large. How to design a drying device with a compact structure, small volume and low operating noise to improve user experience is a technical problem to be solved by the present invention. Summary of the invention

[0003] The present invention provides a semiconductor heat exchange component, a clothes drying device and a control method thereof, which can reduce the overall volume of the clothes drying device and reduce operating noise to improve user experience.

[0004] In order to achieve the above technical objectives, the present invention adopts the following technical solutions:

[0005] A semiconductor heat exchange component includes a semiconductor refrigeration plate, a laminar flow heat exchanger and a driving mechanism, the laminar flow heat exchanger includes a first heat exchange part for exchanging cold at the cold end of the semiconductor refrigeration plate, the laminar flow heat exchanger includes a second heat exchange part for exchanging heat at the hot end of the semiconductor refrigeration plate, the first heat exchange part and the second heat exchange part respectively include multiple layers of annular blades, and the driving mechanism is used to drive the laminar flow heat exchanger to rotate; an air inlet area is formed between the through holes of the multiple layers of the annular blades, and an air outlet area is formed between two adjacent layers of the annular blades.

[0006] Furthermore, the cold end of the semiconductor refrigeration plate is connected to a first heat pipe, which is connected to the annular blades of the first heat exchange part; the hot end of the semiconductor refrigeration plate is connected to a second heat pipe, which is connected to the annular blades of the second heat exchange part.

[0007] Furthermore, the first heat pipe and the second heat pipe respectively include an arc-shaped pipe portion and a plurality of straight pipe portions connected together, the straight pipe portions penetrate the corresponding multiple layers of the annular blades, and the arc-shaped pipe portions are connected to the semiconductor refrigeration plate.

[0008] Furthermore, the first heat pipe and the second heat pipe are thermally insulated and fixed together.

[0009] Furthermore, the driving mechanism includes a motor and a rotating disk, the motor is used to drive the rotating disk to rotate, and the laminar heat exchanger is installed on the rotating disk.

[0010] Furthermore, the second heat exchange part is fixed on the rotating disk.

[0011] Furthermore, a thermal insulation gasket is provided on the outer periphery of the semiconductor refrigeration plate, a cold end heat conductive block is provided at the cold end of the semiconductor refrigeration plate, a hot end heat conductive block is provided at the hot end of the semiconductor refrigeration plate, the thermal insulation gasket is clamped between the cold end heat conductive block and the hot end heat conductive block, the first heat pipe is connected to the cold end heat conductive block, and the second heat pipe is connected to the hot end heat conductive block.

[0012] Furthermore, a wind shielding sleeve is provided between the first heat exchange part and the second heat exchange part.

[0013] The present invention also provides a clothes drying device, comprising a cabinet, wherein a clothes drying cavity and an installation cavity are arranged in the cabinet, wherein the installation cavity is provided with a return air port and an air outlet connected to the clothes drying cavity, and further comprising the above-mentioned semiconductor heat exchange component, wherein the semiconductor heat exchange component is arranged in the installation cavity; the air in the clothes drying cavity enters the installation cavity through the return air port, exchanges heat with the first heat exchange part in the semiconductor heat exchange component for condensation and drying, and then enters the clothes drying cavity through the air outlet.

[0014] The present invention also provides a control method for the above-mentioned drying equipment, comprising: after the semiconductor refrigeration plate is energized, the driving mechanism drives the laminar flow heat exchanger to rotate, and the air between two adjacent annular blades flows outward due to the viscosity of the fluid and the centrifugal force to generate negative pressure in the air inlet area formed by the annular blades. Under the action of the negative pressure, the air in the drying chamber enters the air inlet area of ​​the first heat exchange part through the return air port and is condensed and dried by the cold energy released by the cold end of the semiconductor refrigeration plate. Then, the dry air enters the drying chamber from the air outlet.

[0015] Compared with the prior art, the advantages and positive effects of the present invention are as follows: the semiconductor heat exchange component realizes heat exchange between the hot and cold ends of the semiconductor refrigeration plate by utilizing a laminar flow heat exchanger. The two heat exchange parts of the laminar flow heat exchanger are composed of multiple layers of circular blades. The driving mechanism drives the laminar flow heat exchanger to rotate as a whole. During the rotation process, the space between the two adjacent circular blades drives the air to flow outward under the action of centrifugal force and by utilizing the viscosity of the fluid, so that a negative pressure is formed at the air inlet area of ​​the multiple layers of circular blades. The air inlet area of ​​the first heat exchange part sucks the air into the drying cavity for condensation and dehumidification, and the dried air is re-transported to the drying cavity for circulation to achieve the purpose of drying. The laminar flow heat exchanger plays the role of a fan on the one hand, and also plays the role of a heat exchanger on the other hand, so that the overall structure of the semiconductor heat exchange component is compact and small in size, so as to reduce the overall volume of the drying equipment; and the rotation of the multiple layers of circular blades realizes laminar air circulation, which can effectively reduce the operating noise to improve the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 A schematic diagram of the structure of the semiconductor heat exchange component of the present invention;

[0018] Figure 2 An exploded view of the semiconductor heat exchange component of the present invention;

[0019] Figure 3 The airflow principle of the semiconductor heat exchange component of the present invention Figure 1 ;

[0020] Figure 4 The airflow principle of the semiconductor heat exchange component of the present invention Figure 2 ;

[0021] Figure 5 A schematic diagram of the structure of the clothes drying device of the present invention;

[0022] Figure 6 Assembling the semiconductor heat exchange component in the clothes drying device of the present invention Figure 1 ;

[0023] Figure 7 Assembling the semiconductor heat exchange component in the clothes drying device of the present invention Figure 2 ;

[0024] Figure 8 Assembling the semiconductor heat exchange component in the clothes drying device of the present invention Figure 3 . DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] like Figure 1-Figure 4 As shown, the semiconductor heat exchange component of this embodiment includes a semiconductor refrigeration plate 1, a laminar heat exchanger 2 and a driving mechanism 3, the laminar heat exchanger 2 includes a first heat exchange part 21 for exchanging cold at the cold end of the semiconductor refrigeration plate 1, the laminar heat exchanger 2 includes a second heat exchange part 22 for exchanging heat at the hot end of the semiconductor refrigeration plate 1, the first heat exchange part 21 and the second heat exchange part 22 respectively include multiple layers of annular blades 20, the driving mechanism 3 is used to drive the laminar heat exchanger 2 to rotate; an air inlet area 201 is formed between the through holes of the multiple layers of the annular blades 20, and an air outlet area 202 is formed between two adjacent layers of the annular blades 20.

[0027] Specifically, the hot and cold ends of the semiconductor cooling plate 1 in the semiconductor heat exchange assembly of this embodiment are heat exchanged through the laminar heat exchanger 2, wherein the two heat exchange parts in the laminar heat exchanger 2 are respectively composed of multiple layers of circular blades 20. When the driving mechanism 3 drives the laminar heat exchanger 2 to rotate, the circular blades 20 will rotate accordingly. The air between the two adjacent layers of circular blades 20 will flow to the outside of the circular blades 20 under the action of centrifugal force due to fluid viscosity, so that the air inlet area 201 formed at the through hole of the circular blades 20 generates negative pressure, thereby realizing the flow of air. Among them, the flowing airflow formed by the rotation of the multiple layers of circular blades 20 in the first heat exchange part 21 will realize the heat exchange treatment of the cold end of the semiconductor cooling plate 1, and the flowing airflow formed by the rotation of the multiple layers of circular blades 20 in the second heat exchange part 22 will realize the heat exchange treatment of the hot end of the semiconductor cooling plate 1. The annular blades 20 can function as a fan on the one hand, and can also function as a heat exchanger for the semiconductor refrigeration plate 1 on the other hand, so that the overall volume of the semiconductor heat exchange assembly of this embodiment is relatively small; at the same time, the rotation of the annular blades 20 realizes laminar air circulation, which can effectively reduce operating noise to improve user experience. In addition, the driving mechanism 3 may include a motor 31 and a rotating disk 32, wherein the motor 31 is used to drive the rotating disk 32 to rotate, and the laminar heat exchanger 2 is mounted on the rotating disk 32; and in order to enable the first heat exchange part 21 to better condense and dry the air, the laminar heat exchanger 2 is fixed to the rotating disk 32 through the second heat exchange part 22, and the first heat exchange part 21 can avoid being blocked by the rotating disk 32 and has better ventilation efficiency, so as to improve the efficiency of condensation and drying.

[0028] Furthermore, in order to improve the heat exchange efficiency so that the hot and cold ends of the semiconductor refrigeration plate 1 can exchange heat quickly and efficiently, the cold end of the semiconductor refrigeration plate 1 is connected to a first heat pipe 11, and the first heat pipe 11 is connected to the annular blades 20 of the first heat exchange part 21, and the hot end of the semiconductor refrigeration plate 1 is connected to a second heat pipe 12, and the second heat pipe 12 is connected to the annular blades 20 of the second heat exchange part 22. Specifically, the cold end and the hot end of the semiconductor refrigeration plate 1 are respectively connected to the annular blades 20 of the corresponding heat exchange part through the heat pipes, and the heat pipes can quickly transfer heat and use the annular blades 20 to quickly dissipate heat. Preferably, the first heat pipe 11 and the second heat pipe 12 respectively include an arc-shaped pipe portion 101 and a plurality of straight pipe portions 102 connected together, and the straight pipe portion 102 passes through the corresponding multiple layers of the annular blades 20. The arc-shaped pipe portion 101 is connected to the semiconductor refrigeration plate 1. Specifically, the first heat pipe 11 and the second heat pipe 12 are each composed of an arc-shaped pipe portion 101 and a plurality of straight pipe portions 102 connected together. The arc-shaped tube portion 101 in the first heat pipe 11 is composed of a plurality of straight tube portions 102. Taking the assembly of the first heat pipe 11 and the first heat exchange portion 21 as an example, a plurality of straight tube portions 102 are arranged on the arc-shaped tube portion 101 in the first heat exchange portion 21. Each straight tube portion 102 passes through the multiple layers of the annular blades 20 of the first heat exchange portion 21. The first heat pipe 11 can be used to quickly transfer the cold end of the semiconductor refrigeration plate 1 to each layer of the annular blades 20. During the rotation process, the annular blades 20 can not only drive the air flow, but also act as heat dissipation fins to quickly and efficiently exchange heat with the cold end of the semiconductor refrigeration plate 1. In addition, with respect to the first heat exchange part 21 and the second heat exchange part 22, the first heat exchange part 21 and the second heat exchange part 22 can be fixedly connected together by means of a connecting column or a connecting frame. Preferably, the first heat pipe 11 and the second heat pipe 12 are thermally insulated and fixed together. Specifically, the first heat pipe 11 and the second heat pipe 12 are fixedly connected, so that the first heat exchange part 21 and the second heat exchange part 22 are connected together through the first heat pipe 11 and the second heat pipe 12. In addition to being used for heat transfer, the heat pipe is also used to connect the two heat exchange parts, which is more conducive to simplifying the structure and reducing the volume.

[0029] Furthermore, a thermal insulation gasket (not shown) is provided on the periphery of the semiconductor refrigeration plate 1, a cold end heat conductive block 13 is provided on the cold end of the semiconductor refrigeration plate 1, and a hot end heat conductive block 14 is provided on the hot end of the semiconductor refrigeration plate 1, the thermal insulation gasket is sandwiched between the cold end heat conductive block 13 and the hot end heat conductive block 14, the first heat pipe 11 is connected to the cold end heat conductive block 13, and the second heat pipe 12 is connected to the hot end heat conductive block 14. Specifically, the cold end and the hot end of the semiconductor refrigeration plate 1 are heat-transferred through the heat conductive blocks connected to each other, and the heat conductive blocks can be better connected to the heat pipes to improve the heat transfer efficiency. Preferably, in order to make the overall structure more compact, the semiconductor refrigeration plate 1 is arranged between the first heat exchange part 21 and the second heat exchange part 22, and with respect to the air circulation flow mode of the first heat exchange part 21 and the second heat exchange part 22, as Figure 3 As shown, the air inlet area 201 of the first heat exchange part 21 and the second heat exchange part 22 are interconnected, so that the external air enters the laminar flow heat exchanger 2 through the air inlet area 201 of the first heat exchange part 21, and part of the air is condensed and dried after heat exchange with the annular blades 20 of the first heat exchange part 21 to form dry air output, and the remaining part of the air is output after heat exchange with the annular blades 20 of the second heat exchange part 22. In order to reduce the leakage of air from the interval area between the first heat exchange part 21 and the second heat exchange part 22, a windshield sleeve (not shown) is further provided between the first heat exchange part 21 and the second heat exchange part 22. The windshield sleeve is used to block the wind, and at the same time, the windshield sleeve can also play the role of connecting the first heat exchange part 21 and the second heat exchange part 22. Similarly, as Figure 4 As shown, the cold-end heat conductive block 13 and the hot-end heat conductive block 14 are both disc-shaped structures, and the cold-end heat conductive block 13 and the hot-end heat conductive block 14 separate the air inlet area 201 of the first heat exchange part 21 and the air inlet area 201 of the second heat exchange part 22, so that external air enters from the air inlet area 201 of the first heat exchange part 21 and the air inlet area 201 of the second heat exchange part 22 independently, and at the same time, is output from the air outlet area 202 of the first heat exchange part 21 and the air outlet area 202 of the second heat exchange part 22 independently.

[0030] The present invention also provides a clothes drying device, such as Figure 1-Figure 5 As shown, the drying equipment includes a cabinet 4, in which a drying cavity 41 and an installation cavity 42 are provided, and the installation cavity 42 is provided with a return air port 401 and an air outlet 402 connected to the drying cavity 41, and also includes the semiconductor heat exchange component in the above embodiment, and the semiconductor heat exchange component is arranged in the installation cavity 42; the air in the drying cavity 41 enters the installation cavity 42 through the return air port 401, exchanges heat with the first heat exchange part 21 in the semiconductor heat exchange component for condensation and drying, and then enters the drying cavity 41 through the air outlet 402.

[0031] Specifically, the semiconductor heat exchange component is installed in the installation cavity 42. During the drying process, the driving mechanism 3 drives the laminar heat exchanger 2 to rotate, and at the same time the semiconductor refrigeration plate 1 is energized. The air in the drying cavity 41 is sucked into the installation cavity 42 and enters the first heat exchange part 21 for condensation and drying. The dried air flows back into the drying cavity 41, and the clothes in the drying cavity 41 are dried in this reciprocating manner. Among them, the specific control method of the drying equipment includes a drying mode. In the drying mode, after the semiconductor refrigeration plate 1 is powered on, the driving mechanism 3 drives the laminar flow heat exchanger 2 to rotate, and the air between two adjacent annular blades 20 flows outward due to the viscosity of the fluid and the centrifugal force to generate negative pressure in the air inlet area formed by the annular blades 20. Under the action of the negative pressure, the air in the drying cavity 41 enters the air inlet area 201 of the first heat exchange part 21 through the return air port 401 and is condensed and dried by the cold released by the cold end of the semiconductor refrigeration plate 1. Then, the dry air enters the drying cavity 41 from the air outlet 402.

[0032] Based on the above technical solution, optionally, according to different arrangements of the semiconductor heat exchange components in the installation cavity 42, the semiconductor heat exchange components can be arranged longitudinally and transversely. Different arrangements have corresponding designs for related structures, which are described in detail as follows.

[0033] like Figure 6 As shown, for the longitudinal arrangement of the semiconductor heat exchange component, the first heat exchange part 21 and the second heat exchange part 22 are arranged up and down, and a transversely arranged partition 421 is provided in the installation cavity 42, and the partition 421 divides the installation cavity 42 into an upper cavity and a lower cavity, and a mounting hole is opened on the partition 421, and the laminar heat exchanger 2 passes through the mounting hole, the first heat exchange part 21 is located in the upper cavity, and the second heat exchange part 22 is located in the lower cavity; the upper cavity is provided with a return air port 401 and an air outlet 402 connected to the drying cavity 41. Specifically, the first heat exchange part 21 is in the upper cavity, and the air in the drying cavity 41 is sucked into the upper cavity through the return air port 401 and enters the first heat exchange part 21, and is transported back to the drying cavity 41 from the air outlet 402 after condensation and drying, wherein the return air port 401 is provided in the middle of the top plate of the upper cavity, and the return air port 401 is arranged opposite to the air inlet area 201 of the first heat exchange part 21; the air outlet 402 is provided on both sides of the top plate of the upper cavity. The second heat exchange part 22 in the lower cavity is used to dissipate the heat released by the hot end of the semiconductor refrigeration plate 1, wherein the air inlet area 201 in the second heat exchange part 22 has two air inlet methods. Method one, such as Figure 3As shown, the air inlet area of ​​the first heat exchange part 21 and the air inlet area of ​​the second heat exchange part 22 are interconnected; the two side walls of the lower cavity are provided with hot end air outlets 403, and part of the air entering the drying cavity 41 into the installation cavity 42 flows back to the drying cavity 41 after condensation and drying in the first heat exchange part 21, and the other part enters the second heat exchange part 22 for heat exchange, and the generated hot air is discharged from the hot end air outlet 403, and the drying cavity 41 can be replenished with air through the gap of the door. Method 2, such as Figure 4 As shown, the cold end heat conductive block 13 and the hot end heat conductive block 14 are located in the mounting hole to effectively separate the upper and lower cavities. The lower cavity is provided with a second connecting air duct (not marked) for introducing and conveying outside air to the air inlet area of ​​the second heat exchange part 22. The hot end air outlet 403 is provided on the two side walls of the lower cavity. The outside air enters the lower cavity from the second connecting air duct and passes through the second heat exchange part 22 for heat exchange, and the hot air is output from the hot end air outlet 403. Preferably, a water retaining ring 422 is provided on the partition 421 at the periphery of the mounting hole, and a drainage hole (not shown) is also provided on the partition 421, and the drainage hole is connected to a drainage pipe (not shown). Specifically, during the condensation and drying process of the annular blades 20 of the first heat exchange part 21, the condensed water formed on the surface of the annular blades 20 is thrown onto the side wall of the upper cavity, and finally the condensed water is collected and discharged from the drainage hole, and the water retaining ring 422 can ensure that the condensed water does not flow from the mounting hole into the lower cavity. A water collecting trough (not shown) is provided at the portion where the partition 421 is connected to the side wall of the upper cavity. Two adjacent water collecting troughs are interconnected, and the drainage hole is opened in one of the water collecting troughs. Specifically, the condensed water flowing down from the side wall of the upper cavity is collected by the water collecting trough and flows to the drainage hole.

[0034] like Figure 7As shown, for the horizontal arrangement of the semiconductor heat exchange component, the first heat exchange part 21 and the second heat exchange part 22 are arranged side by side on the left and right, and a longitudinally arranged partition 421 is provided in the installation cavity 42. The partition 421 divides the installation cavity into a first cavity and a second cavity arranged on the left and right. A mounting hole is opened on the partition 421, and the laminar heat exchanger 2 is arranged horizontally and passes through the mounting hole. The first heat exchange part 21 is located in the first cavity, and the second heat exchange part 22 is located in the second cavity; the first cavity is provided with a return air port 401 and an air outlet 402 connected to the drying cavity 41. Specifically, the first heat exchange part 21 is in the first cavity, and the air in the drying cavity 41 is sucked into the first cavity through the return air port 401 and enters the first heat exchange part 21, and is transported back to the drying cavity 41 from the air outlet 402 after condensation and drying, wherein a first connecting air duct (not shown) is arranged between the return air port 401 and the air inlet area 201 of the first heat exchange part 21, specifically, the air in the drying cavity 41 enters the first cavity through the return air port 401 and flows along the first connecting air duct, so that the humid air can effectively enter the first cavity. Condensation and drying are carried out in the heat exchange section 21 to meet the air intake requirements of the horizontal arrangement of the laminar heat exchanger 2, and the condensed water formed on the surface of the annular blades 20 in the first heat exchange section 21 is thrown to the front and rear side walls and the upper and lower parts of the upper cavity, and a water receiving pan 423 is provided in the first cavity below the first heat exchange section 21. The water receiving pan 423 can collect condensed water at the bottom of the first cavity. Preferably, the front and rear sides of the water receiving pan 423 are connected to the front and rear side walls of the first cavity, so that the condensed water flowing from the front and rear side walls can effectively flow into the water receiving pan 423. In addition, there are two air intake methods for the air intake area 201 in the second heat exchange section 22. Method 1, such as Figure 3 As shown, the air inlet area of ​​the first heat exchange part 21 and the air inlet area of ​​the second heat exchange part 22 are interconnected, and the top of the second cavity is also provided with a hot end air outlet 403 connected to the drying cavity 41. In this way, part of the air entering the installation cavity 42 from the drying cavity 41 passes through the first heat exchange part 21 for condensation and drying, and then flows back to the drying cavity 41 through the air outlet 402. The other part enters the second heat exchange part 22 for heat exchange, and the hot air generated also flows back to the drying cavity 41 from the hot end air outlet 403. The hot air can increase the temperature in the drying cavity 41, so that after the drying is completed, the temperature of the clothes in the drying cabinet will not be too low, so as to improve the user experience. Method 2, such as Figure 4 and Figure 8As shown, the semiconductor refrigeration plate 1 is arranged between the first heat exchange part 21 and the second heat exchange part 22, the cold end heat conductive block 13 and the hot end heat conductive block 14 are located in the mounting hole to effectively separate the first cavity and the second cavity, and the second cavity is provided with an air inlet 404 for introducing and conveying outside air to the air inlet area of ​​the second heat exchange part, and the front and rear side walls of the lower cavity are provided with a hot end air outlet (not shown in the figure). Specifically, the air inlet area 201 of the second heat exchange part 22 is arranged opposite to the air inlet 404, and the outside air is sucked into the second cavity and enters the air inlet area 201 for heat exchange, and the air after heat exchange is output from the hot end air outlet, and a second connecting air duct (not shown in the figure) can also be configured between the air inlet 404 and the air inlet area 201 of the second heat exchange part 22.

[0035] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor heat exchange component, comprising a semiconductor refrigeration sheet, characterized in that: It also includes a laminar heat exchanger and a driving mechanism, wherein the laminar heat exchanger includes a first heat exchange part for exchanging the cold end coldness of the semiconductor refrigeration plate, and the laminar heat exchanger includes a second heat exchange part for exchanging the heat of the hot end of the semiconductor refrigeration plate, the first heat exchange part and the second heat exchange part respectively include multiple layers of annular blades, and the driving mechanism is used to drive the laminar heat exchanger to rotate; an air inlet area is formed between the through holes of the multiple layers of the annular blades, and an air outlet area is formed between two adjacent layers of the annular blades; The cold end of the semiconductor refrigeration plate is connected to a first heat pipe, and the first heat pipe is connected to the annular blade of the first heat exchange part; the hot end of the semiconductor refrigeration plate is connected to a second heat pipe, and the second heat pipe is connected to the annular blade of the second heat exchange part; The first heat pipe and the second heat pipe respectively include an arc-shaped pipe portion and a plurality of straight pipe portions connected together, the straight pipe portions penetrate the corresponding multiple layers of the annular blades, and the arc-shaped pipe portions are connected to the semiconductor refrigeration sheet; The first heat pipe and the second heat pipe are thermally insulated and fixed together; The first heat exchange part and the second heat exchange part are connected together through the first heat pipe and the second heat pipe; The driving mechanism comprises a motor and a rotating disk, the motor is used to drive the rotating disk to rotate, and the laminar heat exchanger is installed on the rotating disk.

2. The semiconductor heat exchange component according to claim 1, characterized in that: The second heat exchange part is fixed on the rotating disk.

3. The semiconductor heat exchange component according to claim 1, characterized in that: A thermal insulation gasket is arranged on the periphery of the semiconductor refrigeration plate, a cold end heat conductive block is arranged at the cold end of the semiconductor refrigeration plate, a hot end heat conductive block is arranged at the hot end of the semiconductor refrigeration plate, the thermal insulation gasket is sandwiched between the cold end heat conductive block and the hot end heat conductive block, the first heat pipe is connected to the cold end heat conductive block, and the second heat pipe is connected to the hot end heat conductive block.

4. The semiconductor heat exchange component according to claim 1, characterized in that: A wind shielding sleeve is also arranged between the first heat exchange part and the second heat exchange part.

5. A clothes drying device, comprising a cabinet, wherein a clothes drying cavity and an installation cavity are arranged in the cabinet, wherein the installation cavity is provided with an air return port and an air outlet communicating with the clothes drying cavity, wherein: It also includes a semiconductor heat exchange component as described in any one of claims 1 to 4, wherein the semiconductor heat exchange component is arranged in the installation cavity; the air in the drying cavity enters the installation cavity through the return air port, exchanges heat with the first heat exchange part in the semiconductor heat exchange component for condensation and drying, and then enters the drying cavity through the air outlet.

6. A method for controlling a clothes drying device as claimed in claim 5, characterized in that: include: After the semiconductor refrigeration plate is energized, the driving mechanism drives the laminar flow heat exchanger to rotate, and the air between two adjacent circular blades flows outward due to the viscosity of the fluid and the centrifugal force to generate negative pressure in the air inlet area formed by the circular blades. Under the action of negative pressure, the air in the drying chamber enters the air inlet area of ​​the first heat exchange part through the return air port and is condensed and dried by the cold energy released by the cold end of the semiconductor refrigeration plate. Then, the dry air enters the drying chamber from the air outlet.

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