An anti-transfer electronic label

Abstract

The present invention provides an anti-transfer electronic tag, and relates to the technical field of electronic tags. The anti-transfer electronic tag provided by the present invention comprises: a base layer; an antenna layer, the antenna layer is located on the base layer, and the antenna layer comprises a first antenna and a second antenna connected to each other; a chip, the pins of the chip are connected to the antenna layer; a bottom glue layer, the bottom glue layer is located on the side of the antenna layer and the chip away from the base layer; wherein, when the anti-transfer electronic tag is working, the first antenna and the second antenna work together, and the binding force F1 between the first antenna and the base layer, the binding force F2 between the first antenna and the second antenna, and the binding force F3 between the second antenna and the bottom glue layer satisfy: F1>F2, F3>F2. The technical solution of the present invention can make the cost of the anti-transfer electronic tag lower and the anti-transfer effect better.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic labels, and in particular to an anti-transfer electronic label. Background Art

[0002] Radio frequency identification (RFID) is a contactless automatic identification technology that can identify moving objects and multiple tags at the same time. Anti-transfer electronic tags are a type of electronic tag with a large demand. When they are torn off from the original attached object, the torn electronic tags are damaged and cannot be used anymore. They are widely used in the traceability of tobacco, alcohol, medicine, cosmetics, auto parts and other items, in the warranty management of the electronics industry, and in the new unmanned retail industry.

[0003] The current anti-transfer electronic tags mainly achieve anti-transfer through the following three technologies:

[0004] The first method is to hot-stamp an antenna made of ultra-thin aluminum foil on the surface of the substrate, and then combine it with a fragile paper surface material to encapsulate it into an anti-transfer electronic tag; the second method is to use conductive silver paste to directly print the antenna pattern on the fragile substrate. The above two solutions require the use of fragile paper surface materials or fragile substrates, which not only increases the direct material cost, but also the fragile paper surface materials or fragile substrates have a high probability of damage during the production, processing and mounting of the electronic tag, further increasing the cost, making the price of this type of anti-transfer electronic tag high, which seriously limits its large-scale promotion and use.

[0005] The third method is to combine the aluminum etched antenna with a low-strength substrate other than fragile paper such as coated paper, and use a strong adhesive to stick the electronic tag. When criminals try to transfer the electronic tag, they need to use a lot of force, which will cause damage to the low-strength substrate such as coated paper and make the electronic tag ineffective. This type of electronic tag does not require the use of fragile paper surface material or fragile substrate, so the cost is low, but the anti-transfer effect of the electronic tag is limited. Criminals have a certain probability of successfully transferring the electronic tag without destroying the tag by blowing hot air, soaking in solvents, etc. Summary of the invention

[0006] The present invention provides an anti-transfer electronic tag, which can reduce the cost of the anti-transfer electronic tag and achieve better anti-transfer effect.

[0007] The present invention provides an anti-transfer electronic tag, which adopts the following technical solution:

[0008] The anti-transfer electronic label comprises:

[0009] basal layer;

[0010] an antenna layer, the antenna layer being located on the base layer, the antenna layer comprising a first antenna and a second antenna connected to each other;

[0011] A chip, wherein the pins of the chip are connected to the antenna layer;

[0012] A primer layer, the primer layer being located on a side of the antenna layer and the chip away from the base layer;

[0013] Among them, when the anti-transfer electronic tag is working, the first antenna and the second antenna work together, and the binding force F1 between the first antenna and the base layer, the binding force F2 between the first antenna and the second antenna, and the binding force F3 between the second antenna and the bottom glue layer satisfy: F1>F2, F3>F2.

[0014] Optionally, the binding force F1 between the first antenna and the base layer, and the binding force F4 between the first antenna and the base glue layer satisfy: F1>F4; the binding force F3 between the second antenna and the base glue layer, and the binding force F5 between the second antenna and the base layer satisfy: F3>F5.

[0015] Optionally, the second antenna is connected to the first antenna in a plurality of point structures.

[0016] Exemplarily, the second antenna is connected to the first antenna in a 3-20 point structure.

[0017] Exemplarily, the second antenna in a plurality of point-shaped structures is distributed at the connection between the antenna layer and the chip, and / or at the location of the electromagnetic coupling circuit.

[0018] Optionally, the melting point of the first antenna is higher than the operating temperature of the anti-transfer electronic tag, and the melting point of the second antenna is lower than the operating temperature of the anti-transfer electronic tag.

[0019] Furthermore, the material of the first antenna is liquid metal with a melting point higher than room temperature, a composite material formed by adding functional powder to liquid metal with a melting point higher than room temperature, copper foil or anodized aluminum foil, and the material of the second antenna is liquid metal with a melting point lower than room temperature.

[0020] Furthermore, the liquid metal having a melting point higher than room temperature is one of bismuth-indium-tin alloy, indium element, bismuth element, tin element, and tin-bismuth alloy; the liquid metal having a melting point lower than room temperature is one of gallium-indium alloy, gallium-indium-tin alloy, and gallium-tin alloy.

[0021] Optionally, the first antenna and the second antenna have the same thickness; the thickness of the first antenna is 1 micron to 10 microns.

[0022] Exemplarily, the base layer is PC, the first antenna is a bismuth-indium-tin eutectic alloy, the second antenna is a gallium-tin eutectic alloy, and the primer layer is polyacrylate.

[0023] Exemplarily, the base layer is coated paper, the first antenna is bismuth-indium-tin eutectic alloy, the second antenna is gallium-tin eutectic alloy, and the primer layer is polyacrylate.

[0024] Exemplarily, the base layer is PET, the first antenna is copper foil, the second antenna is gallium indium tin eutectic alloy, and the base glue layer is polyurethane.

[0025] The invention provides an anti-transfer electronic tag, which comprises a base layer, an antenna layer, a chip and a base glue layer, wherein the antenna layer comprises a first antenna and a second antenna connected to each other, and when the anti-transfer electronic tag is working, the first antenna and the second antenna need to work together, and the binding force F1 between the first antenna and the base layer, the binding force F2 between the first antenna and the second antenna, and the binding force F3 between the second antenna and the base glue layer satisfy: F1>F2, F3>F2, so that when the anti-transfer electronic tag is pasted on an object through the base glue layer, when an illegal element attempts to tear off the anti-transfer electronic tag, the first antenna and the second antenna will be disconnected, the first antenna will at least partially remain on the base layer and then be torn off, and the second antenna will at least partially remain on the base glue layer and undergo an irreversible deformation, so that the first antenna and the second antenna cannot work together, that is, the antenna layer cannot work, and the anti-transfer electronic tag fails. Therefore, the anti-transfer electronic tag in the invention has a good anti-transfer effect, and the anti-transfer electronic tag does not need to use a fragile substrate, and the cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0027] Figure 1 A schematic diagram of the structure of an anti-transfer electronic tag provided by an embodiment of the present invention;

[0028] Figure 2 A schematic diagram of an anti-transfer electronic tag provided by an embodiment of the present invention being attached to an object;

[0029] Figure 3 A schematic diagram of the transfer process of the anti-transfer electronic tag provided in an embodiment of the present invention;

[0030] Figure 4A schematic diagram of a connection method between a first antenna and a second antenna is provided for an embodiment of the present invention. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] It should be noted that the various technical features in the embodiments of the present invention can be combined with each other without conflict.

[0033] The embodiment of the present invention provides an anti-transfer electronic tag, specifically, as Figure 1 As shown, Figure 1 A schematic diagram of the structure of an anti-transfer electronic tag provided in an embodiment of the present invention, the anti-transfer electronic tag comprises:

[0034] Basal layer 1;

[0035] Antenna layer 2, the antenna layer 2 is located on the base layer 1, and the antenna layer 2 includes a first antenna 21 and a second antenna 22 connected to each other. When the anti-transfer electronic tag is working, the first antenna 21 and the second antenna 22 work together, that is, the first antenna 21 and the second antenna 22 are indispensable;

[0036] Chip 3, the pins of chip 3 are connected to antenna layer 2;

[0037] A base glue layer 4, the base glue layer 4 is located on a side of the antenna layer 2 and the chip 3 away from the base layer 1;

[0038] The bonding force F1 between the first antenna 21 and the base layer 1 , the bonding force F2 between the first antenna 21 and the second antenna 22 , and the bonding force F3 between the second antenna 22 and the base glue layer 4 satisfy the following conditions: F1>F2, F3>F2.

[0039] The magnitude of the bonding force mentioned in the embodiment of the present invention can be reflected by the magnitude of the anti-peel strength and the adhesion.

[0040] Of course, in order to facilitate the use and transportation of anti-transfer electronic tags, such as Figure 1 As shown, the anti-transfer electronic tag in the embodiment of the present invention may further include a release paper 5, and the release paper 5 is located on a side of the base glue layer 4 away from the antenna layer 2 and the chip 3, as shown in FIG. Figure 2 As shown, Figure 2This is a schematic diagram of an anti-transfer electronic label provided by an embodiment of the present invention being affixed to an object. When using the anti-transfer electronic label, it is only necessary to tear off the release paper 5 and then affix the anti-transfer electronic label to the object through the base adhesive layer 4.

[0041] Since the above relationship is satisfied among the bonding force F1 between the first antenna 21 and the base layer 1, the bonding force F2 between the first antenna 21 and the second antenna 22, the bonding force F3 between the first antenna 21 and the base glue layer 4, the bonding force F4 between the second antenna 22 and the base glue layer 4, and the bonding force F5 between the second antenna 22 and the base layer 1, when the anti-transfer electronic tag is attached to the object through the base glue layer 4, if the criminals attempt to tear off the anti-transfer electronic tag, such as Figure 3 As shown, Figure 3 The schematic diagram of the transfer process of the anti-transfer electronic tag provided in the embodiment of the present invention shows that the first antenna 21 and the second antenna 22 will be disconnected, the first antenna 21 will at least partially remain on the base layer 1 and then be torn off, and the second antenna 22 will at least partially remain on the base glue layer 4 and undergo irreversible deformation, so that the first antenna 21 and the second antenna 22 cannot work together, that is, the antenna layer 2 cannot work, and the anti-transfer electronic tag fails. Therefore, the anti-transfer electronic tag in the present invention has a good anti-transfer effect, and the anti-transfer electronic tag does not need to use a fragile substrate and has a low cost.

[0042] In addition, the anti-transfer electronic tag also has the advantages of simple processing technology, high yield rate, wide applicability of substrates, and fixed-point positioning destruction. Moreover, the base glue layer 4 in the anti-transfer electronic tag in the embodiment of the present invention does not need to use a particularly strong base glue, and the base glue is easy to clean. The anti-transfer electronic tag has a wider range of applications and can be suitable for scenes that need to be replaced regularly, such as annual vehicle inspection logos, fixed asset tags, etc.

[0043] Furthermore, the binding force F1 between the first antenna 21 and the base layer 1, and the binding force F4 between the first antenna 21 and the base glue layer 4 satisfy: F1>F4; the binding force F3 between the second antenna 22 and the base glue layer 4, and the binding force F5 between the second antenna 22 and the base layer 1 satisfy: F3>F5, so that when the anti-transfer electronic tag is torn off, the first antenna 21 will be retained on the base 1 as much as possible or even completely and then torn off, and the second antenna 22 will be retained on the base glue layer 4 as much as possible or even completely and undergo irreversible deformation.

[0044] The following embodiments of the present invention describe in detail the various structures included in the anti-transfer electronic tag.

[0045] Optionally, the base layer 1 in the embodiment of the present invention may be a common base material such as PET, PI, PVC, PBT, rubber, ABS, coated paper, printing paper, etc.

[0046] Optionally, in the antenna layer 2 in the embodiment of the present invention, as Figure 4 As shown, Figure 4 A schematic diagram of the connection method of the first antenna and the second antenna is provided for an embodiment of the present invention. The second antenna 22 is connected to the first antenna 21 in a plurality of point-like structures. At this time, the first antenna 21 is in surface contact with the base layer 1, and the first antenna 21 and the second antenna 22 are in point contact, which can make the binding force F1 between the first antenna 21 and the base layer 1, and the binding force F2 between the first antenna 21 and the second antenna 22 more likely to satisfy F1>F2. The second antenna 22 can be connected to the first antenna 21 in one or more point-like structures, preferably 3-20, so that even if one or several point-like structures are not separated from the first antenna 21 during the process of tearing off the anti-transfer electronic tag, other point-like structures will still be separated from the first antenna 21, ensuring the realization of the anti-transfer effect.

[0047] Typically, the antenna of an electronic tag is composed of an electromagnetic coupling circuit and an electromagnetic reflection circuit. The former determines whether the chip in the electronic tag is working, and the latter determines the distance of signal transmission. Based on this, the embodiment of the present invention selects a second antenna 22 with a plurality of point structures to be distributed at the connection between the antenna layer 2 and the chip 3, and / or at the position of the electromagnetic coupling circuit. On the one hand, such a setting can ensure that after the second antenna 22 is separated from the first antenna 21, the chip cannot work, thereby achieving an anti-transfer effect. On the other hand, it can also avoid significant changes in the impedance of the antenna layer 2 caused by the second antenna 22 being connected to the first antenna 21 in other ways, and will not have an adverse effect on the communication distance.

[0048] Optionally, in the embodiment of the present invention, the melting point of the first antenna 21 is higher than the operating temperature of the anti-transfer electronic tag, and the melting point of the second antenna 22 is lower than the operating temperature of the anti-transfer electronic tag, so that the bonding force F1 between the first antenna 21 and the base layer 1, the bonding force F2 between the first antenna 21 and the second antenna 22, the bonding force F4 between the first antenna 21 and the bottom glue layer 4, the bonding force F3 between the second antenna 22 and the bottom glue layer 4, and the bonding force F5 between the second antenna 22 and the base layer 1 are more likely to satisfy the relationship F1>F2, F1>F4, F3>F2, F3>F5. For the anti-transfer electronic tag used at room temperature, in the embodiment of the present invention, the melting point of the first antenna 21 is selected to be higher than room temperature, and the melting point of the second antenna 22 is selected to be lower than room temperature.

[0049] The material of the first antenna 21 and the material of the second antenna 22 can be a single substance or an alloy that meets the above conditions. Of course, the first antenna 21 or the second antenna 22 can also be a composite material added with functional powder (such as conductive filler).

[0050] In the first example, the material of the first antenna 21 is a liquid metal with a melting point higher than room temperature (melting point below 300°C), such as bismuth indium tin alloy, indium element, bismuth element, tin element, and tin-bismuth alloy. The material of the second antenna 22 is a liquid metal with a melting point lower than room temperature, such as gallium indium alloy, gallium indium tin alloy, gallium tin alloy, etc.

[0051] In the second example, the material of the first antenna 21 is a composite material formed by adding functional powder to liquid metal with a melting point higher than room temperature, and the material of the second antenna 22 is liquid metal with a melting point lower than room temperature.

[0052] In the third example, the material of the first antenna 21 is anodized aluminum foil, and the material of the second antenna 22 is liquid metal with a melting point lower than room temperature.

[0053] In the fourth example, the material of the first antenna 21 is copper foil, and the material of the second antenna 22 is liquid metal with a melting point lower than room temperature.

[0054] Optionally, in the embodiment of the present invention, the thickness of the first antenna 21 and the second antenna 22 are consistent, so that the thickness of the antenna layer 2 is consistent, the electrical connection between the first antenna 21 and the second antenna 22 is good, and the electrical performance of the antenna layer 2 is good. Preferably, the thickness of the first antenna 21 is 1 micron to 10 microns, and the thickness of the second antenna 22 is 1 micron to 10 microns, so that the electrical performance of the first antenna 21 and the second antenna 22 is good and easier to manufacture.

[0055] Optionally, the chip 3 can be connected to the first antenna 21 in the antenna layer 2, or to the second antenna 22. In addition, the connection between the chip 3 and the antenna layer 2 can be reinforced by ordinary fixing glue or anisotropic conductive glue. When the melting point of the first antenna 21 is higher than room temperature and the melting point of the second antenna 22 is lower than room temperature, the chip 3 is connected to the second antenna 22, so that the pins of the chip 3 can be immersed in the second antenna 22, and the two can have a better electrical connection. At this time, it is sufficient to use ordinary fixing glue to reinforce the connection between the chip 3 and the antenna layer 2, without using the more expensive anisotropic conductive glue.

[0056] Optionally, the adhesive layer 4 in the embodiment of the present invention is a double-sided adhesive layer, one side of which can be directly attached to the antenna layer 2 and the chip 3, and the other side is used to attach the anti-transfer electronic tag to the object, which is simple to operate and convenient to use. Exemplarily, the adhesive layer is polyurethane or polyacrylate.

[0057] Preferably, the bonding force F1 between the first antenna 21 and the base layer 1, the bonding force F2 between the first antenna 21 and the second antenna 22, and the bonding force F3 between the second antenna 22 and the base glue layer 4 satisfy F1-F2≥9N / cm, F3-F2≥4N / cm, so that the anti-transfer electronic tag can better achieve the anti-transfer effect.

[0058] The embodiment of the present invention provides an anti-transfer electronic tag, which includes a base layer 1, an antenna layer 2, a chip 3 and a bottom glue layer 4, wherein the antenna layer 2 includes a first antenna 21 and a second antenna 22 connected to each other. When the anti-transfer electronic tag is working, the first antenna 21 and the second antenna 22 need to work together, and the binding force F1 between the first antenna 21 and the base layer 1, the binding force F2 between the first antenna 21 and the second antenna 22, and the binding force F3 between the second antenna 22 and the bottom glue layer 4 satisfy: F1>F2, F3>F2, so that when the anti-transfer electronic tag is transferred through the bottom glue layer 4 After the transfer electronic tag is affixed to an object, when criminals attempt to tear off the anti-transfer electronic tag, the first antenna 21 and the second antenna 22 will be disconnected, and the first antenna 21 will at least partially remain on the base layer 1 and then be torn off, while the second antenna 22 will at least partially remain on the base glue layer 4 and undergo irreversible deformation, making it impossible for the first antenna 21 and the second antenna 22 to work together, that is, the antenna layer 2 cannot work, and the anti-transfer electronic tag is invalid. Therefore, the anti-transfer electronic tag in the embodiment of the present invention has a good anti-transfer effect, and the anti-transfer electronic tag does not require the use of a fragile substrate and has a low cost.

[0059] In order to facilitate those skilled in the art to better understand and implement the anti-transfer electronic tag in the embodiment of the present invention, the present invention provides several specific embodiments below.

[0060] Example 1

[0061] structure Material Thickness(μm) Basal layer PC 100 First Antenna Bismuth Indium Tin Eutectic Alloy 15 Second Antenna Gallium-tin eutectic alloy 15 Base glue layer Polyacrylate 40

[0062]

[0063] After the anti-transfer electronic tag is torn off, part of the first antenna remains in the base layer, part remains in the base glue layer, and the second antenna remains entirely in the base glue layer. The base layer and the base glue layer are peeled off, the antenna layer is broken, and the anti-transfer electronic tag becomes invalid.

[0064] Example 2

[0065]

[0066]

[0067] Part of the first antenna remains in the base layer, part of it remains in the base glue layer, and the second antenna remains entirely in the base glue layer. The base layer and the base glue layer are peeled off, the antenna layer is broken, and the anti-transfer electronic tag becomes invalid.

[0068] Example 3

[0069] structure Material Thickness(μm) Basal layer PET 150 First Antenna Copper foil with adhesive backing 15 Second Antenna Gallium Indium Tin Eutectic Alloy 15 Base glue layer Polyurethane 30

[0070]

[0071] Part of the first antenna remains in the base layer, part of it remains in the base glue layer, and the second antenna remains entirely in the base glue layer. The base layer and the base glue layer are peeled off, the antenna layer is broken, and the anti-transfer electronic tag becomes invalid.

[0072] The above peel strength and adhesion tests refer to the following standards: Peel strength standard GBT2792-2014 Adhesion test standard GBT5210-2006.

[0073] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An anti-transfer electronic tag, characterized in that: include: basal layer; an antenna layer, the antenna layer being located on the base layer, the antenna layer comprising a first antenna and a second antenna connected to each other; A chip, wherein the pins of the chip are connected to the antenna layer; A primer layer, the primer layer being located on a side of the antenna layer and the chip away from the base layer; When the anti-transfer electronic tag is working, the first antenna and the second antenna work together, and the bonding force F1 between the first antenna and the base layer, the bonding force F2 between the first antenna and the second antenna, and the bonding force F3 between the second antenna and the base glue layer satisfy the following conditions: F1>F2, F3>F2; The base layer is PC, the first antenna is a bismuth indium tin eutectic alloy, the second antenna is a gallium tin eutectic alloy, and the primer layer is polyacrylate; or, the base layer is coated paper, the first antenna is a bismuth indium tin eutectic alloy, the second antenna is a gallium tin eutectic alloy, and the primer layer is polyacrylate; or, the base layer is PET, the first antenna is copper foil, the second antenna is a gallium indium tin eutectic alloy, and the primer layer is polyurethane; The second antenna is connected to the first antenna in a plurality of point-shaped structures; The second antenna in a plurality of point-shaped structures is distributed at the connection between the antenna layer and the chip, and / or at the location of the electromagnetic coupling circuit.

2. The anti-transfer electronic tag according to claim 1, characterized in that: The second antenna is connected to the first antenna in a 3-20 point structure.

3. The anti-transfer electronic tag according to claim 1, characterized in that: The thickness of the first antenna is consistent with that of the second antenna; the thickness of the first antenna is 1 micron to 10 microns.

Images