Communication device, dielectric waveguide filter and capacitance coupling adjustment method thereof

Abstract

The present invention relates to a communication device, a dielectric waveguide filter and a capacitive coupling adjustment method thereof. The dielectric waveguide filter includes a dielectric block and a metal layer. On the one hand, during the production design process, the capacitive coupling amount can be adjusted accordingly by adjusting the notch size of the blind groove or by adjusting the depth of the blind groove, without adjusting the capacitive coupling amount by adjusting the size of the partition ring, that is, it is no longer limited by the processing accuracy of the partition ring, which can reduce the processing difficulty, facilitate production and manufacturing, facilitate debugging, and achieve batch production; on the other hand, the partition ring only plays the role of capacitive coupling and is not used to adjust the capacitive coupling amount. When designing the partition ring, a relatively small partition ring can be used without increasing the size of the partition ring, thereby avoiding a large amount of signal leakage and serious signal crosstalk due to a large opening at the partition ring, and achieving only less signal leakage at the partition ring, and greatly reducing the mutual interference of the dielectric waveguide filter.

Description

Technical Field

[0001] The present invention relates to the technical field of communication devices, and in particular to a communication device, a dielectric waveguide filter and a capacitance coupling adjustment method thereof. Background Art

[0002] With the rapid development of communication systems entering the 5G era, the miniaturization of devices is the key to the development of communication equipment, and miniaturized, high-performance, and low-power filters are the key to the miniaturization of 5G equipment. Dielectric waveguide filters have all the characteristics of 5G equipment miniaturization, so they have broad application prospects in 5G communication equipment, and the design method of dielectric waveguide filters has become a hot topic of research. Dielectric waveguide filters improve the air filling form of traditional waveguide filters into high dielectric constant ceramic material filling. Ceramic dielectric materials play the role of transmitting signals and structural support. Metal materials are attached to the surface of ceramic dielectric materials as an electric wall to play an electromagnetic shielding role.

[0003] Among them, the traditional dielectric waveguide filters have several ways to achieve capacitive coupling, including deep blind hole method, through hole method and blind slot method. These dielectric waveguide filters with capacitive coupling methods have the problems of difficult processing, inconvenient debugging, poor batchability, and increased difficulty in subsequent automated debugging. Summary of the invention

[0004] Based on this, it is necessary to overcome the defects of the prior art and provide a communication device, a dielectric waveguide filter and a capacitive coupling adjustment method thereof, which can reduce the difficulty of processing, facilitate production and manufacturing, facilitate debugging, and realize mass production.

[0005] The technical scheme is as follows: a dielectric waveguide filter, comprising: a dielectric block, the dielectric block comprising a first surface and a second surface arranged opposite to each other, the first surface being provided with a blind groove, the bottom wall of the blind groove being provided with a capacitive coupling through hole, the capacitive coupling through hole extending from the bottom wall of the blind groove to the second surface; and a metal layer, the metal layer being provided on the outer surface of the dielectric block, the groove wall of the blind groove and the hole wall of the capacitive coupling through hole; a partition ring is provided on the metal layer on the hole wall of the capacitive coupling through hole, or a partition ring is provided on the metal layer on the second surface and is wound around the periphery of the capacitive coupling through hole.

[0006] In the dielectric waveguide filter described above, a blind groove and a capacitive coupling through hole are combined to replace the traditional straight-through capacitive coupling through hole. Thus, on the one hand, in the production design process, the capacitive coupling amount can be adjusted accordingly by adjusting the slot size of the blind groove (including the width of the blind groove and the length of the blind groove) or by adjusting the depth of the blind groove, without adjusting the capacitive coupling amount by adjusting the size of the partition ring, that is, it is no longer limited by the influence of the processing accuracy of the partition ring, which can reduce the processing difficulty, facilitate production and manufacturing, facilitate debugging, and realize batch production; on the other hand, the partition ring only plays the role of capacitive coupling and is not used to adjust the capacitive coupling amount. When designing the partition ring, the size of the partition ring can be relatively reduced without increasing the size of the partition ring, thereby avoiding a large amount of signal leakage and severe signal crosstalk due to a large opening at the partition ring, and achieving only less signal leakage at the partition ring, and greatly reducing the mutual interference of the dielectric waveguide filter.

[0007] In one of the embodiments, the diameter of the capacitive coupling through hole is 1 mm to 3 mm; the width of the partition ring is 0.5 mm to 1 mm.

[0008] In one of the embodiments, the diameter of the capacitive coupling through hole is 2 mm; the width of the partition ring is 0.5 mm to 0.7 mm.

[0009] In one embodiment, two frequency holes are spaced apart from each other on the first surface, the blind groove and the capacitive coupling through hole are located between the two frequency holes, the frequency hole is a blind hole, and the metal layer is also provided on the hole wall of the frequency hole.

[0010] In one embodiment, the depth of the blind groove is not greater than the depth of the frequency hole.

[0011] In one embodiment, the blind groove has a notch shape of square, polygonal, circular, elliptical or waist-shaped; or, the blind groove is a conical groove or a cylindrical groove.

[0012] In one embodiment, the dielectric block is a ceramic dielectric block; the metal layer is a metal silver layer, a metal copper layer, a metal platinum layer or a metal gold layer plated, sprayed or adhered on the dielectric block.

[0013] A communication device comprises the dielectric waveguide filter.

[0014] For the above-mentioned communication device, on the one hand, during the production design process, the capacitive coupling amount can be adjusted accordingly by adjusting the slot size of the blind slot (including the width of the blind slot and the length of the blind slot) or by adjusting the depth of the blind slot, without adjusting the capacitive coupling amount by adjusting the size of the partition ring, that is, it is no longer limited by the influence of the processing accuracy of the partition ring, which can reduce the processing difficulty, facilitate production and manufacturing, facilitate debugging, and realize batch production; on the other hand, the partition ring only plays the role of capacitive coupling and is not used to adjust the capacitive coupling amount. When designing the partition ring, the size of the partition ring can be relatively reduced without increasing the size of the partition ring, thereby avoiding a large amount of signal leakage and serious signal crosstalk due to the large opening at the partition ring, and achieving only less signal leakage at the partition ring, and greatly reducing the mutual interference of dielectric waveguide filters.

[0015] A method for adjusting capacitive coupling of a dielectric waveguide filter comprises the following steps: when the capacitive coupling amount needs to be adjusted, corresponding adjustments are made by adjusting the depth of the blind groove, and / or adjusting the length of the blind groove, and / or adjusting the width of the blind groove.

[0016] The above-mentioned capacitive coupling adjustment method of the dielectric waveguide filter, on the one hand, in the production design process, the capacitive coupling amount can be adjusted accordingly by adjusting the slot size of the blind slot (including the width of the blind slot and the length of the blind slot) or by adjusting the depth of the blind slot, without adjusting the capacitive coupling amount by adjusting the size of the partition ring, that is, it is no longer limited by the influence of the processing accuracy of the partition ring, which can reduce the processing difficulty, facilitate production and manufacturing, facilitate debugging, and realize batch production; on the other hand, the partition ring only plays the role of capacitive coupling and is not used to adjust the capacitive coupling amount. When designing the partition ring, the size of the partition ring can be relatively reduced without increasing the size of the partition ring, thereby avoiding a large amount of signal leakage and severe signal crosstalk due to the large opening at the partition ring, and can achieve only less signal leakage at the partition ring, and the mutual interference of the dielectric waveguide filter is greatly reduced.

[0017] In one of the embodiments, the notch of the blind groove is a circular opening, and the opening of the capacitive coupling through hole is located in the middle part of the bottom wall of the blind groove. When the capacitive coupling amount needs to be increased, the depth of the blind groove is correspondingly increased, and / or the notch diameter of the blind groove is increased; when the capacitive coupling amount needs to be reduced, the depth of the blind groove is correspondingly reduced, and / or the notch diameter of the blind groove is reduced.

[0018] In one embodiment, the opening of the blind slot is a waist-shaped opening, the long side direction of the waist-shaped opening is consistent with the direction of the line connecting the centers of the two frequency holes, and the opening of the capacitive coupling through hole is located in the middle part of the bottom wall of the blind slot. When the capacitive coupling amount needs to be increased, the depth of the blind slot and / or the length of the opening of the blind slot are increased accordingly, and / or the width of the opening of the blind slot is increased; when the capacitive coupling amount needs to be reduced, the depth of the blind slot is reduced accordingly, and / or the length of the opening of the blind slot is reduced, and / or the width of the opening of the blind slot is reduced.

[0019] In one embodiment, the opening of the blind slot is a waist-shaped opening, the long side direction of the waist-shaped opening is perpendicular to the direction of the line connecting the centers of the two frequency holes, and the opening of the capacitive coupling through hole is located in the middle part of the bottom wall of the blind slot. When the capacitive coupling amount needs to be increased, the depth of the blind slot is increased accordingly, and / or the length of the opening of the blind slot is reduced, and / or the width of the opening of the blind slot is reduced; when the capacitive coupling amount needs to be reduced, the depth of the blind slot is reduced accordingly, and / or the length of the opening of the blind slot is increased, and / or the width of the opening of the blind slot is increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 A schematic structural diagram of a first surface of a dielectric waveguide filter according to an embodiment of the present invention;

[0023] Figure 2 for Figure 1 Sectional view at AA;

[0024] Figure 3 A schematic structural diagram of a second surface of a dielectric waveguide filter according to an embodiment of the present invention;

[0025] Figure 4 A schematic structural diagram of a first surface of a dielectric waveguide filter according to another embodiment of the present invention;

[0026] Figure 5 for Figure 4 Cross-sectional view at BB;

[0027] Figure 6 A schematic structural diagram of a first surface of a dielectric waveguide filter according to another embodiment of the present invention;

[0028] Figure 7 A schematic structural diagram of a first surface of a dielectric waveguide filter according to yet another embodiment of the present invention;

[0029] Figure 8 FIG. 4 is an S-parameter diagram of the dielectric waveguide filter according to an embodiment of the present invention.

[0030] 10. Dielectric block; 11. Blind slot; 12. Capacitive coupling through hole; 13. Frequency hole; 14. Frequency hole; 15. Signal input port; 16. Signal output port; 17. Inductive coupling blind hole; 20. Metal layer; 21. Isolation ring. DETAILED DESCRIPTION

[0031] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0034] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0036] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0037] In the traditional dielectric waveguide filter, the capacitive coupling hole is explained by taking the through hole as an example. It is necessary to open a partition ring around the through hole on the metal layer on the surface of the dielectric block, and the partition ring can achieve the function of capacitive coupling. However, it is generally necessary to adjust the size and shape of the partition ring to adjust the capacitive coupling amount. Since the energy near the partition ring is relatively concentrated, the partition ring has high requirements for dimensional accuracy and is very sensitive to the coupling amount, which is not conducive to mass production. In addition, the location of the partition ring is directly exposed to the air environment, so the energy near the partition ring is very concentrated. The larger the area of ​​the partition ring, the more serious the signal leakage. In actual application, the signal crosstalk is more serious.

[0038] Based on this, see Figures 1 to 3 , Figure 1 FIG. 4 is a schematic structural diagram of a first surface of a dielectric waveguide filter according to an embodiment of the present invention. Figure 2 Shows Figure 1 The cross-sectional view at AA, Figure 3The schematic diagram of the structure of the second surface of the dielectric waveguide filter according to an embodiment of the present invention is shown. The dielectric waveguide filter provided in an embodiment of the present invention comprises a dielectric block 10 and a metal layer 20. The dielectric block 10 comprises a first surface and a second surface arranged opposite to each other. A blind groove 11 is provided on the first surface, and a capacitive coupling through hole 12 is provided on the bottom wall of the blind groove 11, and the capacitive coupling through hole 12 extends from the bottom wall of the blind groove 11 to the second surface. Specifically, two frequency holes 13 are also provided at intervals on the first surface. The blind groove 11 and the capacitive coupling through hole 12 are located between the two frequency holes 13. The frequency hole 13 is a blind hole. The metal layer 20 is provided on the outer surface of the dielectric block 10, the groove wall of the blind groove 11, the hole wall of the capacitive coupling through hole 12, and the hole wall of the frequency hole 13. A partition ring 21 is provided on the metal layer 20 of the hole wall of the capacitive coupling through hole 12, or a partition ring 21 is provided on the metal layer 20 of the second surface and is arranged around the periphery of the capacitive coupling through hole 12.

[0039] In the above-mentioned dielectric waveguide filter, one side area of ​​the blind slot 11 and the capacitive coupling through hole 12 is one of the resonant cavities, that is, one of the frequency holes 13 is arranged on one of the resonant cavities, which is used to adjust the frequency of one of the resonant cavities; the other side area of ​​the blind slot 11 and the capacitive coupling through hole 12 is another resonant cavity, that is, another frequency hole 13 is arranged on another resonant cavity, which is used to adjust the frequency of another resonant cavity. The blind groove 11 is combined with the capacitive coupling through hole 12 to replace the traditional straight-through capacitive coupling through hole 12. On the one hand, during the production design process, the capacitive coupling amount can be adjusted by adjusting the slot size of the blind groove 11 (including the width of the blind groove 11 and the length of the blind groove 11) or by adjusting the depth of the blind groove 11, without adjusting the capacitive coupling amount by adjusting the size of the partition ring 21, that is, it is no longer limited by the processing accuracy of the partition ring 21, which can reduce the processing difficulty, facilitate production and manufacturing, facilitate debugging, and achieve batch production; on the other hand, the partition ring 21 only plays a capacitive coupling role and is not used to adjust the capacitive coupling amount. When designing the partition ring 21, the size of the partition ring 21 can be relatively reduced without increasing the size of the partition ring 21, thereby avoiding a large amount of signal leakage and serious signal crosstalk due to the large opening of the partition ring 21, and achieving less signal leakage at the partition ring 21, and greatly reducing the mutual interference of the dielectric waveguide filter.

[0040] In one embodiment, the diameter of the capacitive coupling through hole 12 is 1 mm to 3 mm. The ring width of the isolation ring 21 is 0.5 mm to 1 mm. Specifically, the diameter of the capacitive coupling through hole 12 is 2 mm. The ring width of the isolation ring 21 is 0.5 mm to 0.7 mm. In this way, the ring width of the isolation ring 21 is relatively small, which can avoid a large amount of signal leakage and serious signal crosstalk due to the large opening at the isolation ring 21, and can achieve only less signal leakage at the isolation ring 21, and greatly reduce the mutual interference of the dielectric waveguide filter. It can be understood that the diameter of the capacitive coupling through hole 12 can also be other parameters, not limited to the 1 mm to 3 mm specified in this embodiment; the ring width of the isolation ring 21 can also be other parameters, not limited to the 0.5 mm to 1 mm specified in this embodiment.

[0041] It should be noted that there is no metal layer 20 at the partition ring 21. In this way, the metal layer 20 on the hole wall of the capacitive coupling through hole 12 and the metal layer 20 at the hole edge of the capacitive coupling through hole 12 are still connected to each other, and the metal layer 20 at the hole edge of the capacitive coupling through hole 12 is separated from the metal layer 20 in the remaining area of ​​the second surface by the partition ring 21. By setting the partition ring 21, on the one hand, the partition ring 21 plays a role of capacitive coupling, and on the other hand, the capacitive coupling amount can be adjusted accordingly when the width of the annular hollow area is adjusted, but the present embodiment is not limited to using this method to adjust the capacitive coupling amount. In addition, the shape of the partition ring 21 is not limited, and it can be a circular ring, an elliptical ring, or other irregular shapes, which are not limited here.

[0042] It should be noted that the metal layer 20 is not covered at the partition ring 21 and the wall surface of the dielectric block 10 is exposed. Specifically, the metal layer 20 at the partition ring 21 is removed to expose the wall surface. Of course, the wall surface of the dielectric block 10 corresponding to the partition ring 21 may not be electroplated or sprayed with the metal layer 20, so as to expose the wall surface of the dielectric block 10.

[0043] In one embodiment, the depth of the blind groove 11 is not greater than the depth of the frequency hole 13. When the depth of the blind groove 11 is greater, the capacitive coupling amount is greater; when the depth of the blind groove 11 is smaller, the capacitive coupling amount is smaller. In this way, the blind groove 11 is a shallow blind groove 11 with a relatively shallow depth, so that when the ceramic body is pressed by a mold to form the blind groove 11, the frequency hole 13, and the capacitive coupling through hole 12, it is easy to press and form, and the precision is high, and the capacitive coupling amount of the obtained product is consistent in batches.

[0044] In one embodiment, the shape of the blind groove 11 is not limited and can be any shape, such as square, polygonal, circular, elliptical or waist-shaped. In addition, the side wall of the blind groove 11 can be arranged perpendicularly relative to the first surface or the second surface, such as a cylindrical groove with a constant groove diameter, or can be arranged obliquely relative to the first surface or the second surface, such as a tapered groove with a groove diameter gradually increasing or decreasing.

[0045] In one embodiment, the dielectric block 10 is a ceramic dielectric block 10 ; the metal layer 20 is a metal silver layer, a metal copper layer, a metal platinum layer or a metal gold layer plated, sprayed or adhered on the dielectric block 10 .

[0046] See also Figure 4 and Figure 5 , Figure 4 FIG. 4 is a schematic structural diagram of a first surface of a dielectric waveguide filter according to another embodiment of the present invention. Figure 5 Shows Figure 4 Section view at AA. Figure 4 and Figure 5 The dielectric waveguide filter is shown relative to Figures 1 to 3 As for the dielectric waveguide filter shown in the diagram, the difference is that the setting direction of the capacitive coupling through hole 12 and the blind groove 11 has changed, and the setting position of the isolation ring 21 has also changed accordingly. In another embodiment, a dielectric waveguide filter is provided, and the dielectric waveguide filter includes a dielectric block 10 and a metal layer 20. The dielectric block 10 includes a first surface and a second surface that are arranged opposite to each other. A blind groove 11 is provided on the second surface, and a capacitive coupling through hole 12 is provided on the bottom wall of the blind groove 11. The capacitive coupling through hole 12 extends from the bottom wall of the blind groove 11 to the first surface. Two frequency holes 13 are also provided on the first surface. The blind groove 11 and the capacitive coupling through hole 12 are located between the two frequency holes 13, and the frequency hole 13 is a blind hole. The metal layer 20 is provided on the outer surface of the dielectric block 10, the groove wall of the blind groove 11, the hole wall of the capacitive coupling through hole 12, and the hole wall of the frequency hole 13. A partition ring 21 is provided on the metal layer 20 on the hole wall of the capacitive coupling through hole 12 , or a partition ring 21 is provided on the metal layer 20 on the first surface and is wound around the periphery of the capacitive coupling through hole 12 .

[0047] In the above-mentioned dielectric waveguide filter, one side area of ​​the blind slot 11 and the capacitive coupling through hole 12 is one of the resonant cavities, that is, one of the frequency holes 13 is arranged on one of the resonant cavities, which is used to adjust the frequency of one of the resonant cavities; the other side area of ​​the blind slot 11 and the capacitive coupling through hole 12 is another resonant cavity, that is, another frequency hole 13 is arranged on another resonant cavity, which is used to adjust the frequency of another resonant cavity. The blind groove 11 is combined with the capacitive coupling through hole 12 to replace the traditional straight-through capacitive coupling through hole 12. On the one hand, during the production design process, the capacitive coupling amount can be adjusted accordingly by adjusting the slot size of the blind groove 11 (including the width of the blind groove 11 and the length of the blind groove 11) or by adjusting the depth of the blind groove 11, without adjusting the capacitive coupling amount by adjusting the size of the partition ring 21, that is, it is no longer limited by the processing accuracy of the partition ring 21, which can reduce the processing difficulty, facilitate production and manufacturing, facilitate debugging, and achieve batch production; on the other hand, the partition ring 21 only plays a capacitive coupling role and is not used to adjust the capacitive coupling amount. When designing the partition ring 21, the size of the partition ring 21 can be relatively reduced without increasing the size of the partition ring 21, thereby avoiding a large amount of signal leakage and serious signal crosstalk due to the large opening of the partition ring 21, and achieving only less signal leakage at the partition ring 21, and greatly reducing the mutual interference of the dielectric waveguide filter.

[0048] in, Figure 1 , Figure 4 , Figure 6 and Figure 7 The dielectric waveguide filter shown in the figure is a six-cavity dielectric waveguide filter. In addition to two frequency holes 13, a capacitive coupling through hole 12 and a blind slot 11, the six-cavity dielectric waveguide filter has Figure 1 , Figure 4 , Figure 6 and Figure 7 The dielectric waveguide filter shown in the figure is also specifically provided with four frequency holes 14. In addition, a signal input port 15 and a signal output port 16 are also provided on the second surface. Signal transmission with an external device can be achieved through the signal input port 15 and the signal output port 16. In addition, Figure 1 , Figure 4 , Figure 6 and Figure 7 The dielectric waveguide filter illustrated in the figure is also specifically provided with an inductive coupling blind hole 17. The inductive coupling blind hole 17 is used to enhance the inductive coupling amount between the two adjacent resonant cavities. The depth, aperture and other parameters of the inductive coupling blind hole 17 can be adjusted. When the depth, aperture and other parameters of the inductive coupling blind hole 17 are adjusted, the inductive coupling amount between the two adjacent resonant cavities is adjusted accordingly. When the depth of the inductive coupling blind hole 17 is specifically 0, it is equivalent to not needing to provide the inductive coupling blind hole 17.

[0049] Please refer to Figure 8 , Figure 8 FIG. 1 schematically shows an S-curve diagram of a dielectric waveguide filter according to an embodiment of the present invention. Figure 8 It can be seen that a zero point is generated, that is, the dielectric waveguide filter in the above embodiment is a negative coupling structure.

[0050] In one embodiment, a communication device includes the dielectric waveguide filter described in any of the above embodiments. It should be noted that the communication device can be a 3G product, a 4G product or a 5G product, which is not limited here. In addition, the communication device can be a dielectric waveguide filter monomer structure, a duplexer or a multiplexer, which is not limited here.

[0051] For the above-mentioned communication device, on the one hand, during the production design process, the capacitive coupling amount can be adjusted accordingly by adjusting the slot size of the blind slot 11 (including the width of the blind slot 11 and the length of the blind slot 11) or by adjusting the depth of the blind slot 11, without adjusting the capacitive coupling amount by adjusting the size of the isolating ring 21, that is, it is no longer limited by the influence of the processing accuracy of the isolating ring 21, which can reduce the processing difficulty, facilitate production and manufacturing, facilitate debugging, and realize batch production; on the other hand, the isolating ring 21 only plays the role of capacitive coupling and is not used to adjust the capacitive coupling amount. When designing the isolating ring 21, the size of the isolating ring 21 can be relatively reduced without increasing the size of the isolating ring 21, thereby avoiding a large amount of signal leakage and serious signal crosstalk due to the large opening of the isolating ring 21, and can achieve only less signal leakage at the isolating ring 21, and the mutual interference of the dielectric waveguide filter is greatly reduced.

[0052] In one embodiment, a method for adjusting capacitive coupling of a dielectric waveguide filter as described in any of the above embodiments comprises the following steps: when the capacitive coupling amount needs to be adjusted, corresponding adjustments are made by adjusting the depth of the blind groove 11, and / or adjusting the length of the blind groove 11, and / or adjusting the width of the blind groove 11.

[0053] The above-mentioned capacitive coupling adjustment method of the dielectric waveguide filter, on the one hand, in the production design process, the capacitive coupling amount can be adjusted accordingly by adjusting the slot size of the blind slot 11 (including the width of the blind slot 11 and the length of the blind slot 11) or by adjusting the depth of the blind slot 11, without adjusting the capacitive coupling amount by adjusting the size of the partition ring 21, that is, it is no longer limited by the influence of the processing accuracy of the partition ring 21, which can reduce the processing difficulty, facilitate production and manufacturing, facilitate debugging, and achieve batch production; on the other hand, the partition ring 21 only plays a capacitive coupling role and is not used to adjust the capacitive coupling amount. When designing the partition ring 21, the size of the partition ring 21 can be relatively reduced, and the size of the partition ring 21 does not need to be increased, thereby avoiding a large amount of signal leakage and serious signal crosstalk due to the large opening of the partition ring 21, and can achieve only less signal leakage at the partition ring 21, and the mutual interference of the dielectric waveguide filter is greatly reduced.

[0054] In one embodiment, see Figure 6 The notch of the blind groove 11 is a circular opening, and the orifice of the capacitive coupling through hole 12 is located in the middle part of the bottom wall of the blind groove 11. When the capacitive coupling amount needs to be increased, the depth of the blind groove 11 is correspondingly increased, and / or the notch diameter of the blind groove 11 is increased; when the capacitive coupling amount needs to be reduced, the depth of the blind groove 11 is correspondingly reduced, and / or the notch diameter of the blind groove 11 is reduced.

[0055] In one embodiment, please refer to Figure 1 The blind slot 11 has a waist-shaped opening, the long side direction of which is consistent with the direction of the line connecting the centers of the two frequency holes 13, and the long side direction of which corresponds to Figure 1 In the x-axis direction, the wide side direction of the waist-shaped mouth corresponds to Figure 1 The capacitive coupling through hole 12 is located in the middle of the bottom wall of the blind groove 11. When the capacitive coupling amount needs to be increased, the depth of the blind groove 11 is increased, and / or the length of the notch of the blind groove 11 is increased, and / or the width of the notch of the blind groove 11 is increased; when the capacitive coupling amount needs to be reduced, the depth of the blind groove 11 is reduced, and / or the length of the notch of the blind groove 11 is reduced, and / or the width of the notch of the blind groove 11 is reduced.

[0056] In one embodiment, see Figure 7 The blind slot 11 has a waist-shaped opening, the long side of which is perpendicular to the line connecting the centers of the two frequency holes 13, and the long side of which corresponds to Figure 7 In the y-axis direction, the wide side direction of the waist-shaped mouth corresponds to Figure 7The capacitive coupling through hole 12 is located in the middle of the bottom wall of the blind groove 11. When the capacitive coupling amount needs to be increased, the depth of the blind groove 11 is increased accordingly, and / or the length of the notch of the blind groove 11 is reduced, and / or the width of the notch of the blind groove 11 is reduced; when the capacitive coupling amount needs to be reduced, the depth of the blind groove 11 is reduced accordingly, and / or the length of the notch of the blind groove 11 is increased, and / or the width of the notch of the blind groove 11 is increased.

[0057] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0058] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A dielectric waveguide filter, characterized in that: The dielectric waveguide filter comprises: A dielectric block, the dielectric block comprising a first surface and a second surface arranged opposite to each other, the first surface being provided with a blind groove, the bottom wall of the blind groove being provided with a capacitive coupling through hole, the capacitive coupling through hole extending from the bottom wall of the blind groove to the second surface; and A metal layer, the metal layer is arranged on the outer surface of the dielectric block, the groove wall of the blind groove and the hole wall of the capacitive coupling through hole; a partition ring is arranged on the metal layer of the hole wall of the capacitive coupling through hole, or a partition ring is arranged around the periphery of the capacitive coupling through hole on the metal layer of the second surface; Wherein, when the depth of the blind groove is adjusted, and / or the length of the blind groove is adjusted, and / or the width of the blind groove is adjusted, the capacitive coupling amount can be adjusted accordingly.

2. The dielectric waveguide filter according to claim 1, characterized in that The diameter of the capacitive coupling through hole is 1 mm to 3 mm; the width of the partition ring is 0.5 mm to 1 mm.

3. The dielectric waveguide filter according to claim 2, characterized in that: The diameter of the capacitive coupling through hole is 2 mm; the width of the partition ring is 0.5 mm to 0.7 mm.

4. The dielectric waveguide filter according to claim 1, wherein: Two spaced frequency holes are also arranged on the first surface, the blind groove and the capacitive coupling through hole are located between the two frequency holes, the frequency hole is a blind hole, and the metal layer is also arranged on the hole wall of the frequency hole.

5. The dielectric waveguide filter according to claim 4, characterized in that: The depth of the blind groove is not greater than the depth of the frequency hole.

6. The dielectric waveguide filter according to claim 1, wherein: The blind groove has a notch shape of a polygon or an ellipse.

7. The dielectric waveguide filter according to claim 6, characterized in that: The notch of the blind groove is square, waist-shaped or circular.

8. The dielectric waveguide filter according to claim 1, wherein: The blind groove is a conical groove or a cylindrical groove.

9. The dielectric waveguide filter according to any one of claims 1 to 8, characterized in that: The dielectric block is a ceramic dielectric block; the metal layer is a metal silver layer, a metal copper layer, a metal platinum layer or a metal gold layer plated, sprayed or adhered on the dielectric block.

10. A communication device, characterized in that: Comprising the dielectric waveguide filter according to any one of claims 1 to 9.

11. A method for adjusting capacitive coupling of a dielectric waveguide filter according to any one of claims 1 to 3 and 6 to 9, characterized in that: The method comprises the following steps: when the capacitive coupling amount needs to be adjusted, corresponding adjustments are made by adjusting the depth of the blind groove, and / or adjusting the length of the blind groove, and / or adjusting the width of the blind groove.

12. The capacitive coupling adjustment method of the dielectric waveguide filter according to claim 11, characterized in that: The notch of the blind groove is a circular opening, and the orifice of the capacitive coupling through hole is located in the middle part of the bottom wall of the blind groove. When the capacitive coupling amount needs to be increased, the depth of the blind groove is correspondingly increased, and / or the notch diameter of the blind groove is increased; when the capacitive coupling amount needs to be reduced, the depth of the blind groove is correspondingly reduced, and / or the notch diameter of the blind groove is reduced.

13. The capacitive coupling adjustment method of the dielectric waveguide filter according to claim 11, characterized in that: Two frequency holes are also arranged at intervals on the first surface, the blind groove and the capacitive coupling through hole are located between the two frequency holes, the frequency hole is a blind hole, and the metal layer is also arranged on the hole wall of the frequency hole; the notch of the blind groove is a waist-shaped opening, the long side direction of the waist-shaped opening is consistent with the direction of the line connecting the centers of the two frequency holes, and the opening of the capacitive coupling through hole is located in the middle part of the bottom wall of the blind groove. When the capacitive coupling amount needs to be increased, the depth of the blind groove and / or the notch length of the blind groove are increased, and / or the notch width of the blind groove are increased accordingly; when the capacitive coupling amount needs to be reduced, the depth of the blind groove is reduced, and / or the notch length of the blind groove is reduced, and / or the notch width of the blind groove is reduced accordingly.

14. The capacitive coupling adjustment method of the dielectric waveguide filter according to claim 11, characterized in that: Two frequency holes are also arranged at intervals on the first surface, the blind groove and the capacitive coupling through hole are located between the two frequency holes, the frequency hole is a blind hole, and the metal layer is also arranged on the hole wall of the frequency hole; the notch of the blind groove is a waist-shaped opening, the long side direction of the waist-shaped opening is perpendicular to the direction of the line connecting the centers of the two frequency holes, and the opening of the capacitive coupling through hole is located in the middle part of the bottom wall of the blind groove. When the capacitive coupling amount needs to be increased, the depth of the blind groove is increased accordingly, and / or the notch length of the blind groove is reduced, and / or the notch width of the blind groove is reduced; when the capacitive coupling amount needs to be reduced, the depth of the blind groove is reduced accordingly, and / or the notch length of the blind groove is increased, and / or the notch width of the blind groove is increased.

Images