A photosensitive chip package and a manufacturing method thereof

Abstract

The present invention discloses a photosensitive chip package and a manufacturing method thereof, and relates to the field of semiconductor packaging technology. The photosensitive chip package of the present invention includes a base island, pins, a chip, transparent glue and a plastic encapsulation material. The base island is provided with a groove and a dam, and the transparent glue is provided inside the groove and the dam; the pins are electrically connected to the chip, and the plastic encapsulation material covers the upper part of the base island and the pins, the electrical connection part and the chip. The method of the present invention is to half-etch the upper part of the substrate to form the base island and the upper part of the pins, and then process the upper part of the base island to form the groove and the dam; add transparent glue into the groove and the dam, fit the photosensitive area of the chip with the transparent glue, and connect the chip to the pins; solidify the liquid transparent glue, and then use the plastic encapsulation material for plastic encapsulation; half-etch the lower part of the substrate to form a photosensitive through hole. The purpose of the present invention is to solve the problem that the plastic encapsulation material will contaminate the transparent glue and fail to realize the photosensitive characteristics of the chip. The present invention can prevent the transparent glue from being contaminated and further realize the photosensitive characteristics of the chip.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and more particularly to a photosensitive chip package and a manufacturing method thereof. Background Art

[0002] Packaging plays a crucial role for CPUs and other LSI integrated circuits. The housing used to house semiconductor integrated circuit chips houses, secures, seals, and protects the chip, enhancing its electrical and thermal performance. It also serves as a bridge between the chip's internal world and external circuitry. Wires connect the chip's contacts to the package's pins, which in turn connect to other components via wires on the printed circuit board. Prior art packaging for photosensitive chips typically uses a substrate or film frame as a carrier, supplemented with transparent adhesive to cover the photosensitive area. This achieves both light sensitivity and protection for the chip. However, the black plastic encapsulant can contaminate the adhesive during the encapsulation process, blocking light and negating its photosensitive properties.

[0003] To address the above-mentioned issues, several solutions have been proposed in the prior art. For example, the invention entitled "Proximity Sensor and Method for Manufacturing Thereof" (filing date: December 18, 2012; application number: CN201210552379.8) discloses a proximity sensor and method for manufacturing the same, comprising a photosensitive unit, a light-emitting unit, a plurality of transparent adhesive layers, and an encapsulation system. The encapsulation system covers the photosensitive unit and the light-emitting unit. The transparent adhesive layers are formed on the surfaces of the photosensitive unit and the light-emitting unit, respectively. The top surfaces of the transparent adhesive layers have an annular protrusion. The encapsulation system has a through hole formed in the region corresponding to the photosensitive portion and the light-emitting portion, respectively. The through hole connects the region surrounded by the annular protrusion to form a recess. During the encapsulation process, the uncured transparent adhesive layer has plasticity. When a mold is pressed against the transparent adhesive layer, the protrusion on the mold sinks into the transparent adhesive layer, ensuring close contact between the protrusion and the transparent adhesive layer. This prevents the black adhesive from seeping between the protrusion and the transparent adhesive layer when the black adhesive is injected.

[0004] The above solution has the following shortcomings: it is necessary to use a die to press in the transparent glue before the transparent glue is completely solidified, and then inject the black plastic sealant. The control of the state of the transparent glue increases the difficulty of the manufacturing process and reduces the stability of the product quality. If the fluidity of the transparent glue is too large, the die will bulge out and press the thick transparent glue, and the transparent glue will overflow everywhere, resulting in some parts lacking transparent glue and being covered by black glue. If the fluidity of the transparent glue is too small, the plasticity of the transparent glue is reduced, which is not conducive to the die pressing the transparent glue, and the black plastic sealant can easily enter between the die and the transparent glue. In this case, if the die is to be pressed to the set position, the pressure of the die on the transparent glue will increase, which may damage the photosensitive area and cause the chip to fail. In addition, after the black plastic sealant and the transparent glue are solidified, the transparent glue and the black plastic sealant will encapsulate the entire die protrusion, which is not conducive to the die demolding and removal operation, increases the difficulty of die removal operation, and affects demolding and production efficiency.

[0005] In summary, when manufacturing photosensitive chip packages, how to prevent the black plastic sealant from contaminating the transparent adhesive during the packaging process is a problem that urgently needs to be solved in the existing technology. Summary of the Invention

[0006] 1. Problem to be solved

[0007] The purpose of the present invention is to overcome the deficiency in the prior art that, when manufacturing a photosensitive chip package, the black plastic sealing adhesive will contaminate the transparent adhesive during the packaging process, resulting in the inability to realize the photosensitivity of the chip. The photosensitive chip package and the manufacturing method thereof of the present invention can avoid the transparent adhesive from being contaminated, and further can realize the photosensitivity of the chip.

[0008] 2. Technical solution

[0009] In order to solve the above problems, the technical solutions adopted by the present invention are as follows:

[0010] A photosensitive chip package of the present invention includes a base island, which is provided with a groove and a dam, and the groove is connected to the dam; pins, which are arranged on both sides or four sides of the base island; a chip, which is electrically connected to the pins through an electrical connection part; transparent glue, which is arranged inside the groove and the dam, and the transparent glue is in contact with the photosensitive area of the chip; and plastic encapsulation material, which is used to cover the upper part of the base island, the upper part of the pins, the electrical connection part and the chip.

[0011] Furthermore, the dam is located between the chip and the groove, and the top area of the dam is greater than or equal to the photosensitive area of the chip; in addition, a photosensitive through hole is provided at the bottom of the base island, and the photosensitive through hole is connected to the groove.

[0012] Furthermore, the electrical connection part is a solder wire or a solder ball. If the chip is packaged in a face-down manner, the chip is electrically connected to the pin through the solder wire; if the chip is packaged in a flip-chip manner, the chip is electrically connected to the pin through the solder ball.

[0013] A method for manufacturing a photosensitive chip package of the present invention is characterized in that it includes the following steps: S1, half-etching the upper part of the substrate to form the upper part of the base island and the upper part of the pin, and then processing the upper part of the base island to form a groove and a dam; S2, filling the groove with liquid transparent glue so that the height h1 of the transparent glue is greater than or equal to the height h2 of the dam; S3, electrically setting the chip, affixing the transparent glue to the photosensitive area of the chip, and curing the transparent glue; S4, using a plastic encapsulating material to encapsulate the chip so that the plastic encapsulating material covers the upper part of the base island, the upper part of the pin, the electrical connection part and the chip; S5, half-etching the lower part of the substrate to form the lower part of the base island, the lower part of the pin and the photosensitive through hole in the lower part of the base island, so that the base island and the pin are separated from each other, the photosensitive through hole is connected to the groove and the transparent glue is exposed; S6, electroplating the lower part of the base island and the lower part of the pin with an anti-oxidation metal layer, and then cutting and separating the base island and the pin as a whole to obtain a single photosensitive chip package.

[0014] Furthermore, if the chip is packaged in a positive packaging manner, the specific process of step S3 is: S3-1, placing the chip on the transparent adhesive so that the photosensitive area of the chip fits the transparent adhesive; S3-2, curing the liquid transparent adhesive by baking; S3-3, electrically connecting the chip and the pins through welding wires.

[0015] Furthermore, in step S3 - 1 , the chip is pre-processed with TSV to form electrical conductive pillars, and then the photosensitive area of the chip is bonded with transparent adhesive.

[0016] Furthermore, if the chip is packaged in a flip-chip manner, the specific process of step S3 is: solder balls are set on both sides or four sides of the bottom of the chip in advance, the chip with solder balls is placed on transparent glue, and the corresponding solder balls are electrically connected to the pins, and the photosensitive area of the chip is bonded to the transparent glue; then the transparent glue is cured by baking.

[0017] 3. Beneficial effects

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] (1) A photosensitive chip package of the present invention is provided with transparent glue inside the groove and the dam, and the photosensitive area of the chip is adhered to the transparent glue. After the transparent glue is cured, it is plastic-sealed to prevent the transparent glue from being contaminated by the plastic sealing material. Furthermore, a photosensitive through hole is provided at the bottom of the groove so that light can be irradiated to the photosensitive area of the chip through the photosensitive through hole and the transparent glue, thereby further realizing the photosensitivity of the chip.

[0020] (2) The present invention provides a method for manufacturing a photosensitive chip package. The method includes placing transparent adhesive in the space formed by the groove, the dam, and the chip, and curing the transparent adhesive before plastic sealing, so that the plastic sealing material will not contaminate the transparent adhesive during the plastic sealing process. The method further includes half-etching the lower portion of the substrate to form a photosensitive through hole, so that the transparent adhesive at the bottom of the groove is exposed, and light can be irradiated to the photosensitive area of the chip through the photosensitive through hole and the transparent adhesive, thereby realizing the photosensitive characteristics of the chip. The method of the present invention is simple and easy to implement, greatly reduces the process difficulty, and further improves the stability and production efficiency of the process production. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the packaging process of the photosensitive chip package in the upright manner in Example 1;

[0022] Figure 2 This is a schematic structural diagram of the photosensitive chip package packaged in a normal packaging manner according to Example 1;

[0023] Figure 3 This is a schematic diagram of the flip-chip packaging process for the photosensitive chip package of Example 2;

[0024] Figure 4 This is a schematic structural diagram of the flip-chip package of the photosensitive chip according to Example 2.

[0025] Explanation of the numbers in the schematic diagram:

[0026] 110, base island; 111, groove; 112, dam; 113, photosensitive through hole; 120, pin;

[0027] 200, chip; 210, electrical conductive column; 300, transparent adhesive; 400, plastic packaging material. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments; moreover, the various embodiments are not relatively independent and can be combined with each other as needed to achieve better results. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0029] In order to further understand the content of the present invention, the present invention is described in detail with reference to the accompanying drawings and embodiments.

[0030] Example 1

[0031] Combine Figure 1 As shown, a method for manufacturing a photosensitive chip package of the present invention, the specific steps of the method of the present invention are as follows:

[0032] S1. Half-etching the upper part of the substrate to form the upper part of the base island 110 and the upper parts of the pins 120 located on both sides or around the base island 110; then processing the upper part of the base island 110 to obtain the groove 111 and the dam 112; specifically, the upper part of the base island 110 is front-stamped to form the groove 111 and the dam 112; it is worth noting that the dam 112 is extruded from a ductile metal substrate. Specifically, during the stamping process, the metal material on the surface of the base island 110 is squeezed to form the groove 111 toward the inside of the base island 110, and at the same time, the metal material extends upward along the inner wall of the groove 111 to form the dam 112, and the dam 112 is connected to the groove 111. The groove 111 formed by stamping has relatively consistent size specifications and smoothness, so that the final packaging structure has good light transmittance.

[0033] S2. Fill the groove 111 and the dam 112 with liquid transparent adhesive 300, so that the height h1 of the transparent adhesive 300 is greater than or equal to the height h2 of the dam 112; the transparent adhesive 300 is filled to the top of the dam 112 or above the top of the dam 112, so that the photosensitive area of the chip 200 can be attached to the transparent adhesive 300 in the subsequent step of setting the chip 200. It should also be noted that the chip 200 of this embodiment is a TSV chip, and transparent adhesive 300 is also provided around the periphery of the dam 112 to support the surrounding area of the chip 200, thereby preventing the chip 200 from being broken due to the pressure of wire bonding in subsequent steps.

[0034] S3. Electrically configure the chip 200, attach the photosensitive area of the chip 200 to the transparent adhesive 300, and solidify the transparent adhesive 300. In this embodiment, the chip 200 is electrically connected to the pin 120 via a bonding wire. The specific steps are as follows S3-1 to S3-3.

[0035] S3-1. Place the chip 200 on the transparent adhesive 300, with the photosensitive area of the chip 200 facing the transparent adhesive 300 and the groove 111. Specifically, the photosensitive area of the chip 200 is bonded to the transparent adhesive 300. It is worth noting that in this embodiment, before the chip 200 is placed on the transparent adhesive 300, the chip 200 is pre-processed with TSV (Through Silicon Via) technology to form electrical conductive pillars 210. After the TSV process, the light sensing circuit on one side of the photosensitive area of the chip 200 extends through the electrical conductive pillars 210 to the opposite side of the chip 200.

[0036] S3-2, heating and curing the liquid transparent adhesive 300. In this embodiment, the liquid transparent adhesive 300 is cured by baking;

[0037] S3-3. Electrically connect the chip 200 to the pin 120. The present invention utilizes an electrical connection portion to achieve electrical connection between the chip 200 and the pin 120. Specifically, the chip 200 is electrically connected to the pin 120 via a welding wire.

[0038] S4. The chip 200 is then encapsulated with the encapsulating material 400. Specifically, the substrate connected with the chip 200 is placed in an injection mold, and then the molten encapsulating material 400 is injected into the injection mold so that the encapsulating material 400 covers the upper part of the base island 110, the upper part of the pin 120, the electrical connection part and the chip 200. It is worth noting that the injection mold of the present invention has a simple structure, which greatly improves the demoulding efficiency and production efficiency of the product. In addition, since the transparent glue 300 is cured before the encapsulation step, the photosensitive area of the chip 200 and the groove 111 and the dam 112 are all covered with the cured transparent glue 300, thereby preventing the encapsulating material 400 from contaminating the transparent glue 300. In addition, it is worth noting that the transparent glue 300 is formed according to the stamped groove 111 and the dam 112, and there is no need to press the transparent glue 300 into the mold during the encapsulation process, thereby reducing the process difficulty and greatly improving the stability of the process production.

[0039] S5. Half-etching the lower portion of the substrate to form the lower portion of the base island 110, the lower portion of the pin 120, and the photosensitive through hole 113 at the lower portion of the base island 110, and the base island 110 and the pin 120 are separated from each other. The formed photosensitive through hole 113 exposes the transparent glue 300 at the bottom of the groove 111; light can then be irradiated to the photosensitive area of the chip 200 through the photosensitive through hole 113 and the transparent glue 300, thereby realizing the photosensitivity of the chip 200.

[0040] S6. Electroplating an anti-oxidation metal layer on the lower part of the base island 110 and the lower part of the pin 120 can prevent the base island 110 and the pin 120 from being oxidized; subsequently cutting and separating them to obtain a single photosensitive chip package, in this embodiment, laser cutting is used.

[0041] The present invention provides a method for manufacturing a photosensitive chip package, which includes setting transparent glue 300 in the space formed by the groove 111, the dam 112 and the chip 200, and curing the transparent glue 300 before plastic sealing, so that the plastic sealing material 400 will not contaminate the transparent glue 300 during the plastic sealing process; further, a photosensitive through hole 113 is formed by half-etching the lower part of the substrate, so that the transparent glue 300 at the bottom of the groove 111 is exposed, and light can be irradiated to the photosensitive area of the chip 200 through the photosensitive through hole 113 and the transparent glue 300, thereby realizing the photosensitivity of the chip 200.

[0042] A photosensitive chip package of the present invention includes a base island 110, pins 120, a chip 200, a transparent adhesive 300 and a molding compound 400. The base island 110 is provided with a groove 111 and a dam 112. The groove 111 is connected to the dam 112. Specifically, the inner wall of the groove 111 extends upward to form the dam 112. The pins 120 of the present invention are provided on both sides or all around the base island 110. The pins 120 are electrically connected to the chip 200. Specifically, the chip 200 is electrically connected to the pins 120 through an electrical connection portion. Figure 2 As shown, the electrical connection portion of this embodiment is a bonding wire, the chip 200 is a TSV-processed chip in advance, and the chip 200 is connected to the pin 120 through the bonding wire.

[0043] In addition, the dam 112 is located between the chip 200 and the groove 111, and the top area of the dam 112 is greater than or equal to the area of the photosensitive area of the chip 200. The transparent adhesive 300 of the present invention is disposed within the dam 112 and the groove 111, and the transparent adhesive 300 is in contact with the photosensitive area of the chip 200. It is worth noting that the height h1 of the transparent adhesive 300 is greater than or equal to the height h2 of the dam 112. It is worth noting that the bottom of the groove 111 is provided with a photosensitive through hole 113, thereby exposing the transparent adhesive 300 located at the bottom of the groove 111. Light can then pass through the photosensitive through hole 113 and the transparent adhesive 300 to the photosensitive area of the chip 200, thereby achieving the photosensitivity of the chip 200. It should be noted that the transparent adhesive 300 of the present invention is a transparent and non-conductive thermosetting polymer material.

[0044] The molding compound 400 of the present invention is used to cover the upper part of the base island 110, the upper part of the pin 120, the electrical connection part and the chip 200. In this embodiment, the molding compound 400 is an epoxy resin molding compound. It is worth noting that since the transparent glue 300 is arranged inside the groove 111 and the dam 112, and the photosensitive area of the chip 200 is in contact with the transparent glue 300, the transparent glue 300 is cured and then molded, so that the transparent glue 300 is not contaminated by the molding compound 400.

[0045] Example 2

[0046] Combine Figure 3 As shown, the content of this embodiment is basically the same as that of embodiment 1, except that the chip 200 of this embodiment is a flip-chip package. Figure 4 As shown, the chip 200 is electrically connected to the pin 120 through the solder ball. In a method for manufacturing a photosensitive chip package of this embodiment, in step S3, solder balls are pre-arranged on both sides or around the bottom of the chip 200, the chip 200 provided with the solder balls is placed on the transparent glue 300, and the solder balls are electrically connected to the pin 120 accordingly, and the photosensitive area of the chip 200 is adhered to the transparent glue 300. Subsequently, the liquid transparent glue 300 is heated and cured. The dam 112 on the base island 110 can match the height of the solder balls, thereby raising the height of the transparent glue 300, so that the transparent glue 300 can be adhered to the photosensitive area of the chip 200; the remaining steps of the method for manufacturing the photosensitive chip package of this embodiment are consistent with those of Example 1.

[0047] The present invention has been described in detail above with reference to specific exemplary embodiments. However, it should be understood that various modifications and variations may be made without departing from the scope of the present invention as defined by the appended claims. The detailed description and accompanying drawings should be considered merely illustrative and not restrictive, and any such modifications and variations, if any, are intended to fall within the scope of the present invention as described herein. In addition, the background art is intended to illustrate the current status and significance of the present technology and is not intended to limit the present invention or the application and fields of application of the present invention.

Claims

1. A photosensitive chip package, characterized in that: The invention comprises a base island (110), wherein the base island (110) is provided with a groove (111) and a dam (112), wherein the groove (111) is connected to the dam (112); Pins (120), the pins (120) are arranged on both sides or around the base island (110); A chip (200), the chip (200) being electrically connected to the pin (120) via an electrical connection portion; Transparent adhesive (300), the transparent adhesive (300) is arranged inside the groove (111) and the dam (112), and the transparent adhesive (300) is adhered to the photosensitive area of the chip (200); A molding compound (400), the molding compound (400) being used to cover the upper portion of the base island (110), the upper portion of the pin (120), the electrical connection portion, and the chip (200); A photosensitive through hole (113) is provided at the lower portion of the base island (110), and the photosensitive through hole (113) is communicated with the groove (111); The top area of the dam (112) is greater than or equal to the photosensitive area of the chip (200).

2. The photosensitive chip package according to claim 1, wherein: The dam (112) is located between the chip (200) and the groove (111).

3. The photosensitive chip package according to claim 1 or 2, characterized in that: The electrical connection portion is a solder wire or a solder ball. If the chip (200) is packaged in a face-down manner, the chip (200) is electrically connected to the pin (120) via the solder wire; if the chip (200) is packaged in a flip-chip manner, the chip (200) is electrically connected to the pin (120) via the solder ball.

4. A method for manufacturing a photosensitive chip package according to any one of claims 1 to 3, characterized in that: The following steps are involved: S1, half-etching the upper portion of the substrate to form the upper portion of the base island (110) and the upper portion of the pin (120), and then processing the upper portion of the base island (110) to form a groove (111) and a dam (112); S2, filling the groove (111) with liquid transparent glue (300) so that the height h1 of the transparent glue (300) is greater than or equal to the height h2 of the dam (112); S3, electrically setting the chip (200), laminating the photosensitive area of the chip (200) with a transparent adhesive (300), and curing the transparent adhesive (300); S4, using a molding compound (400) to mold the chip (200), so that the molding compound (400) covers the upper portion of the base island (110), the upper portion of the pin (120), the electrical connection portion, and the chip (200); S5, half-etching the lower portion of the substrate to form the lower portion of the base island (110), the lower portion of the pin (120), and the photosensitive through hole (113) at the lower portion of the base island (110), so that the base island (110) and the pin (120) are separated from each other, and the photosensitive through hole (113) is connected to the groove (111) and the transparent glue (300) is exposed; S6. Electroplating an anti-oxidation metal layer on the lower portion of the base island (110) and the lower portion of the lead (120), and then cutting and separating the base island (110) and the lead (120) as a whole to obtain a single photosensitive chip package.

5. The method for manufacturing a photosensitive chip package according to claim 4, wherein: If the chip (200) is packaged in a normal packaging manner, the specific process of step S3 is: S3-1, placing the chip (200) on the transparent adhesive (300) so that the photosensitive area of the chip (200) is in contact with the transparent adhesive (300); S3-2, curing the liquid transparent adhesive (300) by baking; S3-3, electrically connecting the chip (200) and the pin (120) via a welding wire.

6. The method for manufacturing a photosensitive chip package according to claim 5, wherein: In step S3-1, the chip (200) is pre-processed with TSV to form an electrical conductive column (210), and then the photosensitive area of the chip (200) is bonded to the transparent adhesive (300).

7. The method for manufacturing a photosensitive chip package according to claim 5, wherein: If the chip (200) is packaged in a flip-chip manner, the specific process of step S3 is as follows: solder balls are pre-arranged on both sides or around the bottom of the chip (200), the chip (200) with the solder balls is placed on the transparent adhesive (300), and the corresponding solder balls are electrically connected to the pins (120), and the photosensitive area of the chip (200) is adhered to the transparent adhesive (300); and then the transparent adhesive (300) is cured by baking.

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