A fixture for end face polishing and method of using the same

Abstract

This application discloses a fixture for end-face polishing and its use method. The fixture comprises: a receiving tank, an upper guard plate, a weight column, and several weights. The receiving tank comprises a bottom plate and side plates, each of which is provided with at least three adjustment screws. The upper guard plate is located within the receiving tank and is perpendicular to the adjustment screws. The weight column is fixed to the bottom plate and is perpendicular to the bottom plate. The center of the weight is provided with a sleeve hole, through which the weight is sleeved onto the weight column. This solves the problem that existing fixtures cannot apply different pressures to the sample at different polishing stages.

Description

Technical Field

[0001] The present application relates to a fixture, and more particularly to a fixture for end face polishing and a method of using the fixture. Background Art

[0002] Wafers made of crystalline materials without cleavage planes, such as sapphire, lithium niobate, and lithium tantalate, have rough cut surfaces after cutting and require further processing to a mirror finish before use. Existing processing methods generally use a polishing process, which requires clamping the sample with a fixture and placing the cut end of the sample on a polishing turntable for polishing. During the polishing process, a certain amount of pressure must be applied to the sample to achieve the desired polishing effect. The polishing process consists of multiple stages, with different pressures applied to the sample at different stages.

[0003] However, during the polishing operation, the existing technology cannot apply pressure to the sample through external means and can only rely on the weight of the fixture itself as the pressure applied to the sample. Since the weight of the fixture itself is fixed, the existing polishing fixture cannot apply different pressures to the sample at different polishing stages.

[0004] Therefore, how to provide a fixture that can adjust its own weight as needed to meet the requirements of applying different pressures to the sample at different polishing stages has become a technical problem that needs to be urgently solved by those skilled in the art. Summary of the Invention

[0005] The present application provides a fixture for end face polishing and a method for using the same, in order to solve the problem that existing fixtures cannot apply different pressures to a sample at different polishing stages.

[0006] In one aspect, a fixture for end surface polishing includes: a receiving tank, an upper guard plate, a weight column, and a plurality of weights;

[0007] The accommodating tank body includes a bottom plate and a side plate, and at least three adjustment screws are provided on the side plate; the upper guard plate is located in the accommodating tank body, and the upper guard plate is perpendicular to the adjustment screws; the weight column is fixed on the bottom plate, and is perpendicular to the bottom plate;

[0008] A sleeve hole is provided at the center of the weight, and the weight is sleeved on the weight column through the sleeve hole.

[0009] Optionally, the orthographic projection of the sleeve hole on the base plate covers the orthographic projection of the weight column on the base plate; the projection of the base plate in the extension direction of the weight column covers the weight sleeved on the weight column.

[0010] Optionally, the fixture for end face polishing further includes a lower guard plate, which is located in the accommodating tank and is arranged opposite to the upper guard plate.

[0011] Optionally, buffer layers are provided on the opposing surfaces of the upper guard plate and the lower guard plate.

[0012] Optionally, the material of the upper guard plate is copper, and the material of the lower guard plate is aluminum.

[0013] Optionally, the upper guard plate and the lower guard plate are both made of Teflon material.

[0014] Optionally, the buffer layer is a foam or soft plastic material structure.

[0015] In another aspect, a method for using a fixture for end surface polishing includes:

[0016] Place the sample in the receiving tank and below the upper guard plate, with the end surface of the sample to be polished extending beyond the preset length of the receiving tank; tighten the sample in the fixture by rotating the adjusting screw;

[0017] Place the fixture for end surface polishing with the sample into the carrier plate;

[0018] Start the polishing turntable and put the corresponding weights on the weight column according to the corresponding pressure requirements at different polishing stages.

[0019] Optionally, the step of placing the sample in a receiving tank and positioning the sample below the upper guard plate, with the end surface of the sample to be polished extending beyond a preset length of the receiving tank; and fastening the sample in the fixture by rotating an adjusting screw, comprises:

[0020] The sample is placed in the accommodating tank and located between the buffer layers provided on the opposite surfaces of the upper guard plate and the lower guard plate, and the end surface of the sample to be polished exceeds the preset length of the accommodating tank;

[0021] By turning the adjusting screw, the upper guard plate is pressed toward the sample until the sample is fastened between the two buffer layers.

[0022] Optionally, the polishing turntable is started, and weights of corresponding weights are placed on the weight columns according to corresponding pressure requirements at different polishing stages, including:

[0023] The polishing turntable is started, and in the first polishing stage, a weight of a first weight corresponding to a required first pressure is placed on the weight column;

[0024] In the second polishing stage, a weight of a corresponding second weight is placed on the weight column according to the required second pressure.

[0025] As can be seen from the above technical solutions, the present application provides a fixture for end face polishing and a method for using the same. The fixture includes: a receiving tank body, an upper guard plate, a weight column and a number of weights; the receiving tank body includes a bottom plate and a side plate, and the side plate is provided with at least three adjustment screws; the upper guard plate is located in the receiving tank body, and the upper guard plate is perpendicular to the adjustment screws; the weight column is fixed to the bottom plate, and is perpendicular to the bottom plate; the center of the weight is provided with a sleeve hole, through which the weight is sleeved on the weight column. Through the fixture for end face polishing provided by the present application and a method for using the same, an adjustment screw is provided on the side plate, and the movement of the upper guard plate is pushed by rotating the adjustment screw to achieve the tightening of the sample. The upper guard plate plays a protective role for the sample, protecting the sample from being scratched or damaged by the adjustment screw. A weight column is provided on the side of the bottom plate away from the receiving tank body, and the weight can be sleeved on the weight column through the sleeve hole provided in the center. By adjusting the number of weights on the weight column, or selecting weights of different weight levels to be placed on the weight column, the weight of the weights pressing on the sample can be flexibly adjusted, and different pressures can be applied to the sample at different polishing stages during the polishing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0027] Figure 1 A front view of a fixture for end surface polishing provided in an embodiment of the present application;

[0028] Figure 2 for Figure 1 A top view of a fixture for end surface polishing is shown;

[0029] Figure 3 for Figure 1 A right side view of a fixture for end face polishing is shown;

[0030] Figure 4 for Figure 1 Left side view of the fixture used for end face polishing;

[0031] Figure 5 for Figure 1 A cross-sectional view of a fixture used for end face polishing is shown;

[0032] Figure 6 for Figure 1 A structural diagram of the weight shown;

[0033] Figure 7 for Figure 1 Another structural diagram of the weight shown;

[0034] Figure 8 for Figure 1 Another top view of the fixture shown for end face polishing;

[0035] Figure 9 for Figure 1 Another cross-sectional view of the fixture shown for end face polishing;

[0036] Figure 10 for Figure 1 Another cross-sectional view of the fixture shown for end surface polishing;

[0037] Figure 11 for Figure 5 The diagram shows the state of the sample being clamped by the fixture used for end face polishing;

[0038] Figure 12 This is a diagram showing the position relationship between the fixture, the loading plate, and the polishing turntable during the polishing process;

[0039] Figure 13 for Figure 10 The diagram shows the state of the sample being clamped by the fixture used for end face polishing;

[0040] Figure 14 for Figure 13 Left side view of the sample held in the fixture shown for end face polishing. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0042] Wafers made of crystalline materials without cleavage planes, such as sapphire, lithium niobate, and lithium tantalate, have rough cut surfaces after cutting and require further processing to a mirror finish before use. Existing processing techniques generally use polishing, which involves clamping the sample with a fixture and placing the cut end of the sample on a polishing turntable for polishing. During the polishing process, a certain amount of pressure must be applied to the sample to achieve the desired polishing effect. The polishing process consists of multiple stages, with varying pressures applied to the sample at different stages.

[0043] However, during the polishing operation, the existing technology cannot apply pressure to the sample through external means and can only rely on the weight of the fixture itself as the pressure applied to the sample. Since the weight of the fixture itself is fixed, the existing polishing fixture cannot apply different pressures to the sample at different polishing stages.

[0044] In view of this, on the one hand, Figure 1 A front view of a fixture for end surface polishing provided in an embodiment of the present application; Figure 2 for Figure 1 A top view of a fixture for end surface polishing is shown; Figure 3 for Figure 1 A right side view of a fixture for end face polishing is shown; Figure 4 for Figure 1 Left side view of the fixture used for end face polishing; Figure 5 for Figure 1 A cross-sectional view of a fixture used for end face polishing is shown; Figure 6 for Figure 1 A structural diagram of the weight shown. Figure 1-Figure 5 The present application provides a fixture for end face polishing, comprising: a receiving tank body 1, an upper guard plate 2, a weight column 3 and a plurality of weights 4; the receiving tank body 1 comprises a bottom plate 11 and a side plate 12, and the side plate 12 is provided with at least three adjustment screws 121; the upper guard plate 2 is located in the receiving tank body 1, and the upper guard plate 2 is perpendicular to the adjustment screws 121; the weight column 3 is fixed on the bottom plate 11, and is perpendicular to the bottom plate 11. It is easy to understand that the side plate 12 is provided with a threaded hole ( Figure 5 (not shown), the adjusting screw 121 is threadedly connected to the side plate 12 through a threaded hole. The upper guard plate 2 can be freely taken in or replaced in the accommodating tank 1. The weight column 3 is fixed to the side of the bottom plate 11 away from the accommodating tank 1. Figure 5 and Figure 6 The center of the weight 4 is provided with a sleeve hole 41, through which the weight 4 is sleeved on the weight column 3. The weight 4 can be set to different weight levels as needed, and the number of the weights 4 is not specifically limited.

[0045] It should be noted that the fixture for end face polishing provided in this application can set the total weight of the base plate 11, side plate 12, upper guard plate 2, and weight column 3 based on the basic pressure required during the polishing process, and then design the specific dimensions of the receiving tank 1 based on the size of the sample to be polished. The fixture's external shape can also be designed based on the shape of the limiting through-hole of the loading plate, which is not specifically limited in this application.

[0046] like Figure 3As shown, the orthographic projection of the sleeve hole 41 on the bottom plate 11 covers the orthographic projection of the weight column 3 on the bottom plate 11 ; the projection of the bottom plate 11 in the extension direction of the weight column 3 covers the weight 4 sleeved on the weight column 3 .

[0047] Figure 7 for Figure 1 Another structural diagram of the weights shown. Figure 7 As shown, the weight 4 can be circular, and the hole 41 can also be circular. Figure 6 and Figure 7 The shapes of the weight 4 and the hole 41 are merely schematically shown, and are not specifically limited in this application.

[0048] The shape of the weight 4 can be the same as or different from that of the base plate 11, but the dimensions of the weight 4 need to be smaller than those of the base plate 11 so that the fixture can be smoothly placed in the limiting through hole of the loading tray during the polishing process.

[0049] The fixture for end face polishing provided in this embodiment is provided with an adjustment screw 121 on the side plate 12. By rotating the adjustment screw 121, the upper guard plate 2 is pushed to move to achieve the tightening of the sample. The upper guard plate 2 plays a protective role for the sample, protecting the sample from being scratched or damaged by the adjustment screw 121. By adjusting the length of the adjustment screw 121 to be screwed into the accommodating tank 1, the fixture can be adapted to samples of different thicknesses, increasing the variety of samples that the fixture can process. A weight column 3 is provided on the side of the bottom plate 11 away from the accommodating tank 1, and the weight 4 can be mounted on the weight column 3 through a sleeve hole 41 set in the center. By adjusting the number of weights 4 mounted on the weight column 3, or selecting weights 4 of different weights to be mounted on the weight column 3, the weight of the weight pressing on the sample can be flexibly adjusted, that is, different pressures can be applied to the sample at different polishing stages during the polishing process, and it can also be achieved that the required pressure is applied to the sample during the polishing process of different samples. The fixture for end face polishing provided in this application can realize the application of one fixture to multiple samples.

[0050] For example, the polishing process includes two polishing stages: rough polishing and fine polishing. For the same sample, the pressure required for rough polishing is generally greater than that required for fine polishing. When the polishing speed is faster, the required pressure is also relatively greater, while when the polishing speed is slower, the required pressure is also relatively less. In addition, the sample needs to be ground before polishing, and the grinding process can also include two grinding stages: rough grinding and fine grinding. Generally, the pressure required for rough grinding is greater than that required for fine grinding, and the pressure required for fast grinding is greater than that required for slow grinding. During the four stages of rough grinding, fine grinding, rough polishing, and fine polishing, the pressure applied to the sample is achieved by placing weights 4 on the weight column 3. By placing weights 4 of different weights, the pressure applied to the sample can be adjusted. The more weights 4 installed, or the heavier the weights 4, the greater the pressure applied to the sample. Therefore, the weight of the weights 4 can be converted into gravity to correspond to the pressure value applied to the sample, and a corresponding relationship table between the weight of the weights 4 and the pressure value can be established. This is not described in detail here.

[0051] Figure 8 for Figure 1 Another top view of the fixture used for end face polishing is shown in FIG. Figure 8 As shown, there can be four adjusting screws 121 provided on the side panel 12. Since the end face of the sample to be polished needs to extend a certain length from the open end of the receiving tank body 1, at least two adjusting screws 121 need to be provided near the open end of the receiving tank body 1 to ensure that the end face of the sample to be polished can be firmly fixed. When only one adjusting screw 121 is provided near the open end of the receiving tank body 1, the sample is prone to slippage, resulting in an inability to smoothly perform the polishing operation. Therefore, adjusting screws 121 are provided at the open end of the receiving tank body 1 and at one end of the receiving tank body 1 near the weight column 3, respectively, so that the sample can be more firmly fixed.

[0052] It should be noted that Figure 2 and Figure 8 The number and arrangement of the adjusting screws 121 shown are only schematic. As long as the total number of adjusting screws 121 is at least 3 and the number of adjusting screws 121 near the open end of the accommodating tank body 1 is at least 2, this application does not make any specific restrictions.

[0053] Figure 9 for Figure 1 Another cross-sectional view of the fixture used for end face polishing is shown in FIG. Figure 9As shown, the fixture for end face polishing also includes a lower guard plate 5. The lower guard plate 5 is located in the receiving tank body 1 and is arranged opposite to the upper guard plate 2. The lower guard plate 5 can be freely taken in and out or replaced in the receiving tank body 1. The lower guard plate 5 can protect the sample. The upper guard plate 2 can be made of a harder material such as copper, and the lower guard plate 5 can be made of a softer material such as aluminum, which is conducive to better fastening the sample in the receiving tank body 1 of the fixture. The materials of the upper guard plate 2 and the lower guard plate 5 can also be Teflon. This application does not make specific restrictions on the selection of materials for the upper guard plate 2 and the lower guard plate 5. At the same time, by using lower guard plates 5 of different thicknesses or upper guard plates 2 of different thicknesses, and using adjustment screws 121 of different lengths, the fixture can be suitable for samples of different thicknesses, expanding the range of sample types that can be processed by the fixture.

[0054] Figure 10 for Figure 1 Another cross-sectional view of the fixture for end surface polishing is shown in FIG. Figure 10 As shown, the opposing surfaces of the upper guard plate 2 and the lower guard plate 5 are both provided with a buffer layer 6. The material of the buffer layer 6 can be foam or soft plastic, or a colloid coating. The buffer layer 6 can be attached to the opposing surfaces of the upper guard plate 2 and the lower guard plate 5 by gluing, or can be applied to the opposing surfaces of the upper guard plate 2 and the lower guard plate 5 by coating. The present application does not impose any specific restrictions on the material selection of the buffer layer 6 or the arrangement of the buffer layer 6.

[0055] on the other hand, Figure 11 for Figure 5 The state diagram of the fixture holding the sample for end face polishing is shown. Figure 12 The diagram shows the position relationship between the fixture, the loading plate and the polishing turntable during the polishing process. Figure 11 and Figure 12 The present application provides a method for using a fixture for end face polishing, comprising:

[0056] S1: Place sample A into the receiving tank 1 and below the upper guard plate 2. The end surface B of sample A to be polished exceeds the preset length L of the receiving tank 1. Fasten sample A into the fixture by rotating the adjusting screw 121.

[0057] like Figure 11 As shown, sample A is placed in the receiving tank 1 of the fixture and positioned below the upper guard plate 2, so that the end surface B of sample A to be polished extends beyond the receiving tank 1 by a predetermined length L. The predetermined length L can be set based on actual process capabilities and is not specifically limited here. Adjustment screw 121 is rotated into the receiving tank 1 to push the upper guard plate 2 toward sample A until sample A is securely fastened within the fixture.

[0058] S2: Place the end surface polishing fixture 01 with sample A into the carrier plate 02.

[0059] like Figure 12 As shown, the loading plate 02 is located above the polishing turntable 04, and the loading plate 02 also needs to be connected to the fixing rod ( Figure 12 (not shown), the fixing rod is used to fix the carrier plate 02; a plurality of limiting through holes 03 are provided on the carrier plate 02, and the limiting through holes 03 are used to accommodate the fixture 01 for end surface polishing with sample A to limit the position of the fixture 01 for end surface polishing with sample A. The polishing turntable 04 also needs to be connected to the rotating assembly ( Figure 12 The rotating assembly is used to drive the polishing turntable to rotate. The fixture 01 for end surface polishing with the sample A is placed into the limiting through hole 03.

[0060] S3: Start the polishing turntable 04. In different polishing stages, according to the corresponding pressure requirements, the weights 4 of corresponding weights are placed on the weight columns 3.

[0061] S3, start the polishing turntable 04, and at different polishing stages, according to the corresponding pressure requirements, set the corresponding weights 4 on the weight column 3, including:

[0062] S31: Start the polishing turntable 04. In the first polishing stage, according to the required first pressure, the corresponding first weight 4 is placed on the weight column 3.

[0063] S32: In the second polishing stage, according to the required second pressure, a weight 4 of a corresponding second weight is placed on the weight column 3.

[0064] Combine Figure 12 For example, the polishing stages may include: coarse grinding, fine grinding, rough polishing, and fine polishing. The first polishing stage may be coarse polishing or coarse grinding, and the second polishing stage may be fine polishing or fine grinding, although this application does not impose specific limitations. A table of correspondences between weights and pressure values ​​can be developed for different samples based on process experience. During polishing, the polishing turntable 04 is started and rotated at a set speed. A polishing pad or sandpaper may be attached to the polishing turntable 04 depending on the polishing or grinding stage. This is not described in detail here. In the first polishing stage, a first weight corresponding to a first pressure is searched in the table of correspondences between weights and pressure values. Based on the first weight, a weight 4 of the first weight is placed on the weight column 3. In the second polishing stage, a second weight corresponding to a second pressure is searched in the table of correspondences between weights and pressure values. Based on the second weight, a weight 4 of the second weight is placed on the weight column 3. The first pressure can be greater than, less than, or equal to the second pressure. Therefore, the weights 4 on the weight column 3 can be added, removed, or left unchanged during the second polishing stage, depending on actual conditions. This is just an illustrative description and is not intended to limit the present application.

[0065] Figure 13 for Figure 10 The state diagram of the fixture holding the sample for end face polishing is shown. Figure 14 for Figure 13 Left side view of the sample held by the fixture shown for end face polishing. Figure 13 and Figure 14 S1: Place sample A into the receiving tank 1 and below the upper guard plate 2, with the end surface B of sample A to be polished extending beyond the preset length L of the receiving tank; secure sample A in the fixture by rotating the adjusting screw 121, including:

[0066] S11: Place sample A into the accommodating tank 1 and between the buffer layers 6 provided on the opposite surfaces of the upper guard plate 2 and the lower guard plate 5. The end surface B of sample A to be polished exceeds the preset length L of the accommodating tank.

[0067] S12: By rotating the adjusting screw 121 , the upper guard plate 2 is pressed toward the sample A until the sample A is fastened between the two buffer layers 6 .

[0068] like Figure 13 and Figure 14 As shown, sample A is located between the upper guard plate 2 and the lower guard plate 5, with both sides of sample A abutting against the buffer layer 6, and the end face B of sample A is the end face to be polished. When the upper guard plate 2 and the lower guard plate 5 are made of a harder material, if the upper guard plate 2 and the lower guard plate 5 directly contact the surfaces on both sides of the sample, it is easy to cause damage to the surface of the sample, and the harder material is prone to sliding when clamping sample A, resulting in insufficient clamping and affecting the polishing operation. Buffer layers 6 are provided on the opposite surfaces of the upper guard plate 2 and the lower guard plate 5. The buffer layer 6 can be made of a relatively elastic material, such as foam or soft plastic, which can protect the sample and at the same time make the upper guard plate 2 and the lower guard plate 5 clamp the sample more firmly and not prone to sliding.

[0069] The present application provides a fixture for end face polishing and a method for using the same. The fixture is provided with an adjustment screw 121 on the side plate 12. By rotating the adjustment screw 121, the upper guard plate 2 is pushed to move, thereby achieving the tightening of the sample. The upper guard plate 2 protects the sample and protects the sample from being scratched or damaged by the adjustment screw 121. By adjusting the length of the adjustment screw 121 to be screwed into the receiving tank 1, the fixture can be adapted to samples of different thicknesses, thereby increasing the types of samples that can be processed by the fixture. A weight column 3 is provided on the side of the bottom plate 11 away from the receiving tank 1, and the weight 4 can be mounted on the weight column 3 through a sleeve hole 41 provided in the center. By adjusting the number of weights 4 mounted on the weight column 3, or selecting weights 4 of different weights to be mounted on the weight column 3, the weight of the weights pressing on the sample can be flexibly adjusted, so that different pressures can be applied to the sample at different polishing stages during the polishing process, and it can also be achieved that the required pressure is applied to the sample during the polishing process of different samples. The fixture for end face polishing provided in this application can be used for multiple samples.

[0070] In this specification, the same or similar parts between the various embodiments can be referred to each other. In particular, for the embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the description in the method embodiments.

Claims

1. A fixture for end surface polishing, characterized in that: The fixture for end face polishing is applied to a wafer of a crystal material without a cleavage face, and the fixture comprises: a receiving tank (1), an upper guard plate (2), a weight column (3) and a plurality of weights (4); The accommodating tank body (1) comprises a bottom plate (11) and a side plate (12), and at least three adjusting screws (121) are provided on the side plate (12); the upper guard plate (2) is located in the accommodating tank body (1), and the upper guard plate (2) is perpendicular to the adjusting screws (121); the weight column (3) is fixed on the bottom plate (11) and is perpendicular to the bottom plate (11); A sleeve hole (41) is provided at the center of the weight (4), and the weight (4) is sleeved on the weight column (3) through the sleeve hole (41); The orthographic projection of the hole (41) on the bottom plate (11) covers the orthographic projection of the weight column (3) on the bottom plate (11); the projection of the bottom plate (11) in the extension direction of the weight column (3) covers the weight (4) sleeved on the weight column (3); by adjusting the number of weights (4) sleeved on the weight column (3), or selecting weights (4) of different weight levels to be sleeved on the weight column (3), the weight of the weight (4) pressed on the sample can be adjusted to apply different pressures to the sample at different polishing stages, or to apply required pressures to the sample during the polishing process of different samples; wherein, a corresponding relationship table between weight and pressure value is prepared for different samples, so that the weight corresponding to the required pressure at different polishing stages is found in the corresponding relationship table, and the weight corresponding to the required pressure is sleeved on the weight column according to the weight corresponding to the required pressure, and polishing of the stage is performed; It also includes a lower guard plate (5), the lower guard plate (5) is located in the accommodating tank (1) and is arranged opposite to the upper guard plate (2); Buffer layers (6) are provided on the opposing surfaces of the upper guard plate (2) and the lower guard plate (5).

2. The fixture for end surface polishing according to claim 1, characterized in that: The material of the upper guard plate (2) is copper, and the material of the lower guard plate (5) is aluminum.

3. The fixture for end surface polishing according to claim 1, characterized in that: The upper guard plate (2) and the lower guard plate (5) are both made of Teflon material.

4. The fixture for end surface polishing according to claim 1, characterized in that: The buffer layer (6) is a foam or soft plastic material structure.

5. A method for using a fixture for end surface polishing, characterized in that: The method for using the fixture for end surface polishing is applied to the fixture for end surface polishing according to any one of claims 1 to 4, and the method comprises: The sample is placed in the accommodating tank and located between the buffer layers provided on the opposite surfaces of the upper guard plate and the lower guard plate, and the end surface of the sample to be polished exceeds the preset length of the accommodating tank; Pressing the upper guard plate toward the sample by rotating the adjusting screw until the sample is fastened between the two buffer layers; Place the fixture for end surface polishing with the sample into the carrier plate; Start the polishing turntable and put the corresponding weights on the weight column according to the corresponding pressure requirements at different polishing stages; In which, the loading plate is located above the polishing turntable, and the loading plate is connected to a fixing rod, and the fixing rod is used to fix the loading plate; a limiting through hole is provided on the loading plate, and the limiting through hole is used to accommodate a fixture for end face polishing with a sample to limit the position of the fixture; the polishing turntable is connected to a rotating assembly, and the rotating assembly is used to drive the rotation of the polishing turntable.

6. The method according to claim 5, characterized in that The polishing turntable is started, and weights of corresponding weights are placed on the weight columns according to corresponding pressure requirements at different polishing stages, including: The polishing turntable is started, and in the first polishing stage, a weight of a first weight corresponding to a required first pressure is placed on the weight column; In the second polishing stage, a weight of a corresponding second weight is placed on the weight column according to the required second pressure.

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