Test probes and electronics

Abstract

The present invention provides a test probe and electronic equipment, and relates to the field of signal testing technology. The test probe provided by the present invention comprises: an insulating part with a probe inserted therein and a metal part installed on the insulating part, wherein the metal part and the probe are isolated from each other by the insulating part. The test probe provided by the present invention can shield external interference through the metal part, and can form a grounding loop by grounding the metal part, thereby protecting the signal of the probe, alleviating the technical problem of high-frequency resonance of the signal to be tested, and making the test probe suitable for high-frequency signal testing.

Description

Technical Field

[0001] The present invention relates to the technical field of signal testing, and in particular to a testing probe and electronic equipment. Background Art

[0002] When testing multi-channel signals, multiple metal probes are installed in an insulated socket, and the metal probes are connected to the object to be tested to obtain the measured signal. During the test, the socket lacks stable grounding and cannot shield the influence of the external electromagnetic environment on the metal probe. When the high-frequency signal passes through the probe, resonance will occur, which will cause the high-frequency performance of the measured signal to be mismeasured. Summary of the invention

[0003] The object of the present invention is to provide a test probe to alleviate the technical problem in the prior art that high-frequency signals may generate resonance when passing through the probe.

[0004] In a first aspect, the test probe provided by the present invention comprises: an insulating member with a probe inserted therein and a metal member mounted on the insulating member;

[0005] The metal member and the probe are isolated from each other by the insulating member.

[0006] In combination with the first aspect, the present invention provides a first possible implementation manner of the first aspect, wherein the metal piece is used to be connected to the ground terminal of the object to be tested.

[0007] In combination with the first possible implementation manner of the first aspect, the present invention provides a second possible implementation manner of the first aspect, wherein the metal member is installed at an end of the insulating member close to the object to be measured;

[0008] When the testing end of the probe contacts the object to be tested, the metal member abuts against the grounding end of the object to be tested.

[0009] In combination with the first aspect, the present invention provides a third possible implementation of the first aspect, wherein the metal part is used to connect to the ground end of the adapter, and the adapter is connected to an end of the probe facing away from the test end.

[0010] In combination with the third possible implementation manner of the first aspect, the present invention provides a fourth possible implementation manner of the first aspect, wherein the adapter is configured as an adapter plate.

[0011] In combination with the third possible implementation manner of the first aspect, the present invention provides a fifth possible implementation manner of the first aspect, wherein the adapter is configured as an adapter wire.

[0012] In combination with the first aspect, the present invention provides a sixth possible implementation of the first aspect, wherein the metal part includes a first block and a second block that are isolated from each other, and a DUT installation area is formed between the first block and the second block.

[0013] In combination with the sixth possible implementation manner of the first aspect, the present invention provides a seventh possible implementation manner of the first aspect, wherein the insulating member is provided with a first notch for installing the first block and a second notch for installing the second block;

[0014] When the first block is installed in the first notch and the second block is installed in the second notch, end surfaces of the first block, the second block and the insulating member are flush.

[0015] In combination with the seventh possible implementation manner of the first aspect, the present invention provides an eighth possible implementation manner of the first aspect, wherein the inner side of the first block has a first groove, and the inner side of the second block has a second groove;

[0016] One end of the object to be tested is matched with the first groove, and the other end is matched with the second groove.

[0017] In combination with the first aspect, the present invention provides a ninth possible implementation manner of the first aspect, wherein the metal member is configured as an annular structure, and an interior of the annular structure forms an installation area for the object to be tested.

[0018] In combination with the first aspect, the present invention provides a tenth possible implementation manner of the first aspect, wherein the probe can extend into the DUT installation area or retract from the DUT installation area.

[0019] In combination with the ninth possible implementation of the first aspect, the present invention provides an eleventh possible implementation of the first aspect, wherein the insulating part is provided with an inlay groove for installing the metal part, and when the metal part is installed in the inlay groove, the end face of the metal part is flush with the end face of the insulating part.

[0020] In a second aspect, the present invention provides an electronic device configured with the test probe provided in the first aspect.

[0021] The embodiments of the present invention bring the following beneficial effects: by installing a metal part on an insulating part with a probe inserted, the metal part can shield external interference, and a grounding loop can be formed by grounding the metal part, thereby protecting the signal of the probe and alleviating the technical problem of resonance of the high-frequency signal to be tested through the probe, making the test probe suitable for high-frequency signal testing.

[0022] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the related technologies, the drawings required for use in the specific embodiments or the related technical descriptions will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 The test probe and the explosion of the object to be tested provided by the embodiment of the present invention Figure 1 ;

[0025] Figure 2 A cross-sectional view of a test probe and an object to be tested provided by an embodiment of the present invention;

[0026] Figure 3 The test probe and the object to be tested provided by the embodiment of the present invention are viewed from above Figure 1 ;

[0027] Figure 4 The test probe and the explosion of the object to be tested provided by the embodiment of the present invention Figure 2 ;

[0028] Figure 5 The test probe and the object to be tested provided by the embodiment of the present invention are viewed from above Figure 2 ;

[0029] Figure 6 A schematic diagram of a test probe provided in an embodiment of the present invention.

[0030] Icon: 100 - insulating part; 200 - metal part; 210 - first block; 220 - second block; 300 - probe; 400 - adapter; 1` - object to be tested. DETAILED DESCRIPTION

[0031] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. Physical quantities in formulas, if not separately marked, should be understood as basic quantities of the base units of the International System of Units, or derived quantities derived from the basic quantities through mathematical operations such as multiplication, division, differentiation or integration.

[0033] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] At present, when different terminals of the test probe transmit signals of different frequencies, the signals are easily interfered, especially when performing multi-channel high-frequency signal testing, the high-frequency signal resonates through the probe, causing mismeasurement of the high-frequency performance of the signal to be tested. Among them, high-frequency signals include radio wave signals between 3MHz and 30MHz, and low-frequency signals include radio wave signals less than 3MHz.

[0035] Embodiment 1

[0036] like Figure 1 As shown, the test probe provided by the embodiment of the present invention includes: an insulating member 100 with a probe 300 inserted therein and a metal member 200 mounted on the insulating member 100 ; the metal member 200 and the probe 300 are isolated from each other by the insulating member 100 .

[0037] A plurality of probes 300 are installed in the insulating member 100 . The plurality of probes 300 are arranged in parallel and at intervals. Any two adjacent probes 300 are isolated by the insulating member 100 to achieve insulation between the adjacent probes.

[0038] The probe 300 is installed in the insulating member 100, and the metal member 200 is embedded in the insulating member 100. The metal member 200 can be grounded to form a complete grounding loop. The grounded metal member 200 can protect the signal transmitted by the probe 300, thereby ensuring the stable signal transmission quality, making the test probe suitable for high-frequency signal detection.

[0039] Regarding the solution of forming a complete grounding loop by grounding the metal piece 200 , specifically: the metal piece 200 can be connected to the grounding terminal of the object to be tested 1 ′, or the metal piece 200 is connected to the grounding terminal of the adapter 400 .

[0040] Method 1: The metal part 200 is connected to the ground terminal of the object to be tested 1':

[0041] See also Figure 2 and Figure 3 The metal component 200 is arranged at the end below the insulating component 100 (direction z), and the middle part of the metal component 200 has an installation space for installing the object to be tested 1'. When the object to be tested 1' is installed in the installation space, the side wall of the object to be tested 1' abuts against the inner wall of the metal component. In this case, the grounding terminal of the object to be tested 1' can be arranged on its side wall. When the side wall of the object to be tested contacts the inner wall of the metal component, the grounding circuit is conductive.

[0042] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the metal part 200 is installed on the end of the insulating part 100 close to the object to be tested 1'; when the test end of the probe 300 contacts the object to be tested 1', the metal part 200 abuts against the grounding end of the object to be tested 1'. The test end of the probe 300 is connected to the object to be tested 1', and at the same time, the metal part 200 contacts the grounding end of the object to be tested 1'. During the signal test, the metal part 200 is grounded to form a grounding loop. There is no need to connect the metal part 200 to the ground separately, which can simplify the wiring steps and improve the convenience of signal testing. In addition, the metal part 200 can also be connected to the grounding end of the object to be tested 1' through a wire, so that the metal part 200, the wire and the grounding end of the object to be tested 1' form a grounding loop.

[0043] Method 2: The metal component 200 is connected to the ground terminal of the adapter 400:

[0044] See also Figure 1 and Figure 4 The metal part 200 is used to connect to the ground end of the adapter 400, and the adapter 400 is connected to the end of the probe 300 away from the test end. The metal part 200 is connected to the ground end of the adapter 400 via a wire, and the metal part 200, the wire and the ground end of the adapter 400 form a ground loop.

[0045] Method 3: The ground terminal of the adapter 400 and the ground terminal of the object to be tested 1' are respectively connected to the metal part 200:

[0046] See also Figure 5 and Figure 6The metal part 200 is wrapped around the outside of the insulating part 100, one end of the metal part 200 extends in a direction away from the test end and is connected to the ground end of the adapter 400; the other end of the metal part 200 extends toward the test end and is connected to the ground end of the object under test 1', and the ground end of the adapter 400, the metal part 200 and the ground end of the object under test 1' form a grounding loop.

[0047] In the embodiment of the present invention, the probe 300 is connected to the adapter 400 , and the metal member 200 is connected to a ground terminal of the adapter 400 .

[0048] Specifically, the probe 300 extends from one end of the insulating member 100 and is used to match the object to be tested 1'; the adapter 400 is located at the other end of the insulating member 100, and the adapter 400 is connected to the probe 300, and the measured signal can be transmitted to the adapter 400 through the probe 300. The grounding end of the adapter 400 is connected to the metal member 200, and the signal transmitted by the probe 300 is protected by the grounded metal member 200. The adapter 400 is used to connect to the signal test equipment, and the signal of the object to be tested 1' is transmitted to the signal test equipment through the probe 300 and the adapter 400, and the signal is further processed by the signal test equipment.

[0049] The adapter 400 mentioned above is described in detail below:

[0050] like Figure 1 As shown, in one embodiment, the adapter 400 is configured as an adapter plate.

[0051] The adapter board is connected to the end of the insulating member 100 away from the object to be tested 1', and the probe 300 is connected to the signal test equipment through the adapter board. Multiple probes 300 are respectively connected to the adapter board, and the multi-channel test signal is integrated through the adapter board. The signal test equipment is connected to the adapter board to realize multi-channel signal acquisition.

[0052] like Figure 4 As shown, the adapter 400 is configured as an adapter cable.

[0053] Among them, multiple adapter wires are connected to multiple probes 300 one by one, and multiple adapter wires extend in the direction away from the object to be tested 1', respectively, and the probes 300 can be connected to the signal test equipment through the adapter wires. In addition, the end of the adapter wire can be connected to a connector compatible with the signal test equipment, so as to connect the adapter wire to the signal test equipment.

[0054] The shape and structure of the metal member 200 are described in detail below:

[0055] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, the metal member 200 includes a first block 210 and a second block 220 isolated from each other. The first block 210 and the second block 220 are respectively installed on the insulating member 100 , and a DUT installation area is formed between the first block 210 and the second block 220 .

[0056] Specifically, the first block 210 and the second block 220 are respectively used to connect the ground terminal of the object to be tested 1', or the first block 210 and the second block 220 are respectively connected to the ground terminal of the adapter 400. The probe 300 is located between the first block 210 and the second block 220, and is grounded together by the first block 210 and the second block 220, and a grounding loop is formed respectively, so that the first block 210 and the second block 220 jointly prevent the probe 300 from being interfered by the outside, thereby ensuring that the high-frequency signal transmitted by the probe 300 is stable and reliable.

[0057] In one implementation, a DUT installation area is formed between the first block 210 and the second block 220 .

[0058] Specifically, the object to be tested 1' is inserted in the object to be tested installation area between the first block 210 and the second block 220, and the object to be tested 1' contacts the test end of the probe 300, and the signal of the object to be tested 1' is tested by the probe 300. The slot formed between the first block 210 and the second block 220 serves as the object to be tested installation area, and the object to be tested 1' is inserted in the slot, so that the test probe and the object to be tested 1' are stably docked. The part where the object to be tested 1' contacts the probe 300 is located between the first block 210 and the second block 220. By grounding the first block 210 and the second block 220 respectively, the part where the object to be tested 1' contacts the probe 300 can be prevented from being affected by external interference, thereby ensuring signal stability.

[0059] like Figure 1 , Figure 3 and Figure 4 As shown, the insulating member 100 is provided with a first notch for installing the first block 210 and a second notch for installing the second block 220; when the first block 210 is installed in the first notch and the second block 220 is installed in the second notch, the end faces of the first block 210, the second block 220 and the insulating member 100 are flush. The first block 210 and the second block 220 are respectively embedded in the insulating member 100, and the insulating member 100 and the metal member 200 form a socket, which is grounded through the metal member 200, so that the socket has a stable grounding loop.

[0060] Preferably, the first block 210 has a first groove on its inner side, and the second block 220 has a second groove on its inner side; one end of the object to be tested 1' fits in the first groove, and the other end fits in the second groove. One end of the object to be tested 1' is inserted in the first groove, and the other end is inserted in the second groove. The inner side wall of the first groove and the inner side wall of the second groove are respectively fitted with the side wall of the object to be tested 1', so as to ensure that the object to be tested 1' is stably fitted between the first groove and the second groove.

[0061] For another implementation, see Figure 5 The metal part 200 is configured as a ring structure, and the interior of the ring structure forms a mounting area for the object to be tested.

[0062] like Figure 2 and Figure 5 As shown, the metal part 200 is surrounded to form a test object installation area with a rectangular cross section, the test object 1' is inserted into the test object installation area, and the probe 300 is in contact with the test object 1'. The probe 300 and the test object 1' are both surrounded by the metal part 200, and the metal part 200 is grounded to form a grounding loop, which can shield external interference and avoid resonance, thereby making the test probe suitable for testing high-frequency signals. The insulating part 100 is provided with an inlay groove adapted to the annular structure, and the metal part 200 is installed in the inlay groove. The end face of the metal part 200 is flush with the end face of the insulating part 100, so that the metal part 200 is tightly embedded in the insulating part 100. The insulating part 100 and the metal part 200 together form a socket, and the metal part 200 is grounded, so that the socket has a stable grounding loop, thereby avoiding resonance caused by the transmission of high-frequency signals by multiple probes 300 in the socket, ensuring stable signal transmission quality.

[0063] like Figure 1 and Figure 2 As shown, the probe 300 can extend into the installation area of ​​the object to be tested or retract from the installation area of ​​the object to be tested. The installation area of ​​the object to be tested is formed between the first block 210 and the second block 220. The probe 300 is extended relative to the insulating member 100, so that the test end extends into the installation area of ​​the object to be tested or retracts from the installation area of ​​the object to be tested. When the object to be tested 1' is matched in the installation area of ​​the object to be tested, the probe 300 can contact the object to be tested 1' for signal detection.

[0064] In summary, the test probe has the following technical advantages:

[0065] 1. The insulating member 100 is embedded in the metal member 200, and the insulating member 100 and the metal member 200 together form a socket, which can be grounded through the metal member 200 to form a complete grounding loop;

[0066] 2. The metal part 200 can be connected to the ground terminal of the object under test 1', or to the ground terminal of the adapter 400, which is convenient for wiring and testing;

[0067] 3. Grounding the metal part 200 can shield external interference and prevent high-frequency signals from resonating through the probe 300, so that the test probe can be suitable for multi-channel high-frequency signal testing.

[0068] Embodiment 2

[0069] The present invention provides an electronic device, which is equipped with the above-mentioned test probe, wherein the electronic device can be a mobile phone, a computer, a signal detector or other equipment.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A test probe, characterized in that: include: An insulating member (100) having a probe (300) inserted therein and a metal member (200) mounted on the insulating member (100); The metal part (200) and the probe (300) are isolated from each other by the insulating part (100); The metal member (200) comprises a first block (210) and a second block (220) which are isolated from each other, and a test object installation area is formed between the first block (210) and the second block (220); The insulating member (100) is provided with a first notch for installing the first block (210) and a second notch for installing the second block (220); When the first block (210) is installed in the first notch, and the second block (220) is installed in the second notch, the end surfaces of the first block (210), the second block (220) and the insulating member (100) are flush; The first block (210) has a first groove on its inner side, and the second block (220) has a second groove on its inner side; One end of the object to be tested (1') is fitted in the first groove, and the other end is fitted in the second groove; The metal piece (200) is used to be connected to the ground terminal of the object to be tested (1'); The metal piece (200) is used to be connected to a grounding end of a conversion piece (400), and the conversion piece (400) is connected to an end of the probe (300) that is away from the test end.

2. The test probe according to claim 1, characterized in that: The metal part (200) is mounted on an end of the insulating part (100) close to the object to be tested (1'); When the testing end of the probe (300) contacts the object to be tested (1'), the metal piece (200) abuts against the grounding end of the object to be tested (1').

3. The test probe according to claim 1, characterized in that: The adapter (400) is configured as an adapter plate.

4. The test probe according to claim 1, characterized in that: The adapter (400) is configured as an adapter wire.

5. The test probe according to claim 1, characterized in that: The metal piece (200) is arranged as an annular structure, and the interior of the annular structure forms an installation area for the object to be tested.

6. The test probe according to claim 1 or 5, characterized in that: The probe (300) can extend into the object to be tested installation area or retract from the object to be tested installation area.

7. The test probe according to claim 5, characterized in that: The insulating member (100) is provided with an embedding groove for mounting the metal member (200); when the metal member (200) is mounted in the embedding groove, the end surface of the metal member (200) is flush with the end surface of the insulating member (100).

8. An electronic device, characterized in that: The electronic device is provided with the test probe according to any one of claims 1 to 7.

Images