System and method for edge ring loss compensation

Abstract

A controller for adjusting the height of an edge ring in a substrate processing system comprises: an edge ring loss calculation module configured to receive at least one input indicating one or more erosion rates of the edge ring, calculate at least one erosion rate of the edge ring based on the at least one input, and calculate an erosion amount of the edge ring based on the at least one erosion rate. An actuator control module is configured to adjust the height of the edge ring based on the erosion amount calculated by the edge ring loss calculation module.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of U.S. Provisional Patent Application No. 62 / 594,861, filed on December 5, 2017. The entire disclosure of the above-referenced application is incorporated herein by reference. Technical Field

[0003] The present disclosure relates to substrate processing, and more particularly to systems and methods for compensating for adjustable edge ring losses in substrate processing systems. Background Art

[0004] The background description provided here is for the purpose of generally presenting the context of the present disclosure. Work by the presently designated inventors to the extent described in this background section and in aspects of the description that could not be determined as prior art at the time of filing the application is neither explicitly nor implicitly admitted to be prior art against the present disclosure.

[0005] The substrate processing system can be used to process substrates such as semiconductor wafers. Exemplary processes that can be performed on the substrate include, but are not limited to, chemical vapor deposition (CVD), atomic layer deposition (ALD), conductor etching, and / or other etching, deposition, or cleaning processes. The substrate can be arranged on a substrate support, such as a pedestal, an electrostatic chuck (ESC), etc., in a processing chamber of the substrate processing system. During etching, a gas mixture can be introduced into the processing chamber, and a plasma can be used to induce a chemical reaction.

[0006] The substrate support may include a ceramic layer arranged to support a substrate. For example, a wafer may be clamped to the ceramic layer during processing. The substrate support may include an edge ring arranged around an outer portion of the substrate support (e.g., outer of the periphery and / or adjacent to the periphery). The edge ring may be provided to confine the plasma to a volume above the substrate, protect the substrate support from plasma-induced erosion, etc. Summary of the invention

[0007] A controller for adjusting the height of an edge ring in a substrate processing system includes: an edge ring loss calculation module configured to receive at least one input indicating one or more erosion rates of the edge ring, calculate at least one erosion rate of the edge ring based on the at least one input, and calculate an erosion amount of the edge ring based on the at least one erosion rate. An actuator control module is configured to adjust the height of the edge ring based on the erosion amount calculated by the edge ring loss calculation module.

[0008] In other features, the at least one input includes an erosion rate input by a user. The at least one input includes a plurality of erosion rates for various periods of use of the substrate processing system. The at least one input includes information indicating a type and duration of a process performed in the substrate processing system. The at least one input includes calibration data indicating at least one of a height, a thickness, and a position of the edge ring.

[0009] In other features, to calculate the at least one erosion rate, the edge ring loss calculation module is configured to calculate a plurality of erosion rates in respective periods of use of the substrate processing system. To calculate an amount of erosion of the edge ring, the edge ring loss calculation module is configured to calculate the amount of erosion based on the plurality of erosion rates calculated in the respective periods of use. Each of the plurality of erosion rates is different for the respective periods of use. The edge ring loss calculation module is configured to calculate the plurality of erosion rates using a lookup table that indexes erosion rates to periods of use. The edge ring loss calculation module is configured to calculate the plurality of erosion rates using a model.

[0010] In other features, a system includes the controller and further includes a user interface configured to receive the at least one input. The user interface is configured to receive a plurality of erosion rates as the at least one input. The user interface includes a display configured to display the erosion amount calculated by the edge ring loss calculation module.

[0011] A method for adjusting a height of an edge ring in a substrate processing system includes: receiving at least one input indicating one or more erosion rates of the edge ring; calculating at least one erosion rate of the edge ring based on the at least one input; calculating an erosion amount of the edge ring based on the at least one erosion rate; and adjusting the height of the edge ring based on the calculated erosion amount.

[0012] In other features, the at least one input includes at least one of: an erosion rate input by a user, a plurality of erosion rates for various periods of use of the substrate processing system, information indicating a type and duration of processing performed in the substrate processing system, and calibration data indicating at least one of a height, a thickness, and a position of the edge ring.

[0013] In other features, calculating the at least one erosion rate includes calculating a plurality of erosion rates in respective periods of use of the substrate processing system. Calculating an amount of erosion of the edge ring includes calculating an amount of erosion based on the plurality of erosion rates calculated in the respective periods of use. Each of the plurality of erosion rates is different for the respective periods of use. The method also includes using at least one of a lookup table and a model to calculate the plurality of erosion rates, the lookup table indexing erosion rates to periods of use. The method also includes receiving the at least one input via a user interface.

[0014] Further scope of applicability of the present disclosure will become apparent from the detailed description, claims and drawings.The detailed description and specific examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present disclosure will be more fully understood from the detailed description and accompanying drawings, in which:

[0016] Figure 1 is a functional block diagram of an exemplary processing chamber according to the present disclosure;

[0017] Figure 2A illustrates an exemplary movable edge ring in a lowered position according to the present disclosure;

[0018] Figure 2B illustrates an exemplary movable edge ring in a raised position according to the present disclosure;

[0019] Figure 3A An exemplary controller according to the present disclosure is shown;

[0020] Figure 3B An exemplary method of determining the amount of loss of an edge ring according to the present disclosure is shown;

[0021] Figure 4A , 4B , and 4C show example erosion rates and erosion calculations according to the present disclosure; and

[0022] Figure 5A , 5B 5C, and 5D illustrate exemplary user interfaces for inputting erosion rates according to the present disclosure.

[0023] Among the drawings, reference numerals may be repeated to identify similar and / or identical elements. DETAILED DESCRIPTION

[0024] A substrate support in a substrate processing system may include an edge ring. An upper surface of the edge ring may extend above an upper surface of the substrate support such that an upper surface of the substrate support (and in some examples, an upper surface of a substrate disposed on the substrate support) is recessed relative to the edge ring. The recessed portion may be referred to as a pocket. The distance between the upper surface of the edge ring and the upper surface of the substrate may be referred to as a "pocket depth" or "pocket height". Typically, the pocket depth is fixed according to the height of the edge ring relative to the upper surface of the substrate.

[0025] Some aspects of the etching process may vary due to different characteristics of the substrate processing system, substrate, gas mixture, etc. For example, the flow pattern and therefore the etching rate and etching uniformity may vary depending on the recess depth of the edge ring, the edge ring geometry (i.e., shape), etc. In some exemplary processes, the overall etching rate varies as the distance between the upper surface of the substrate and the lower surface of the gas distribution device increases. In addition, the etching rate may vary from the center of the substrate to the periphery of the substrate. For example, at the periphery of the substrate, the bending of the sheath and the ion tilting may cause the shallow trench isolation (STI) to tilt, and the chemical load associated with the reactive species (e.g., etchant and / or deposition precursor) may cause the hard mask critical dimension to deviate. Therefore, changing the configuration of the edge ring (e.g., including the edge ring height and / or geometry) can change the gas velocity distribution across the substrate surface.

[0026] Due to exposure to plasma and other process materials during substrate processing, portions of the edge ring may wear away (i.e., erode) over time. Therefore, the edge ring may be raised to compensate for an estimated amount of wear experienced by the edge ring. For example, the edge ring may be coupled to an actuator that is configured to raise and lower the edge ring in response to a controller, a user interface, etc. In systems that do not include a mechanism (e.g., a sensor, a camera, etc.) to directly measure edge ring erosion, an estimate of edge ring erosion may be made.

[0027] An edge ring loss compensation system and method according to the principles of the present disclosure estimates erosion of the edge ring and adjusts the edge ring height accordingly to compensate for the erosion. For example, the edge ring may have one or more associated erosion rates. In some examples, the erosion rate may vary over time (e.g., in radio frequency (RF) hours), may vary based on the processing performed, etc. In other words, the erosion rate may not be linear due to variable sensitivity to erosion. Therefore, the systems and methods described herein estimate erosion based on various operating parameters and adjust the height of the edge ring based on the estimated erosion. In one example, erosion may be estimated by determining different erosion rates (e.g., in mm / hr, μm / hr, etc.) for corresponding time periods (RF hours, or RFh) to calculate the amount of erosion for each time period. The total erosion may then be calculated by combining the calculated erosion amounts for each of these time periods.

[0028] Reference now Figure 1 , an exemplary substrate processing system 100 is shown. By way of example only, the substrate processing system 100 can be used to perform etching using RF plasma and / or to perform other suitable substrate processing. The substrate processing system 100 includes a processing chamber 102, which surrounds the other components of the substrate processing system 100 and contains the RF plasma. The substrate processing chamber 102 includes an upper electrode 104 and a substrate support 106, such as an electrostatic chuck (ESC). During operation, a substrate 108 is arranged on the substrate support 106. Although a specific substrate processing system 100 and chamber 102 are shown as examples, the principles of the present disclosure can be applied to other types of substrate processing systems and chambers, such as substrate processing systems that generate plasma in situ, substrate processing systems that implement remote plasma generation and delivery (e.g., using a plasma tube, a microwave tube), and the like.

[0029] By way of example only, the upper electrode 104 may include a gas distribution device, such as a showerhead 109, which introduces and distributes the process gas. The showerhead 109 may include a stem portion including one end connected to the top surface of the process chamber. The base portion is generally cylindrical and extends radially outward from the opposite end of the stem portion at a position spaced apart from the top surface of the process chamber. The surface or faceplate of the base portion of the showerhead facing the substrate includes a plurality of holes for the process gas or purge gas to flow through. Alternatively, the upper electrode 104 may include a conductive plate, and the process gas may be introduced in another manner.

[0030] The substrate support 106 includes a conductive substrate 110 that serves as a lower electrode. The substrate 110 supports a ceramic layer 112. In some examples, the ceramic layer 112 may include a heating layer, such as a ceramic multi-zone heating plate. A thermal resistance layer 114 (e.g., a bonding layer) may be disposed between the ceramic layer 112 and the substrate 110. The substrate 110 may include one or more coolant channels 116 for flowing a coolant through the substrate 110.

[0031] The RF generation system 120 generates an RF voltage and outputs the RF voltage to one of the upper electrode 104 and the lower electrode (e.g., the substrate 110 of the substrate support 106). The other of the upper electrode 104 and the substrate 110 can be DC grounded, AC grounded, or floating. By way of example only, the RF generation system 120 can include an RF voltage generator 122 that generates an RF voltage that is fed to the upper electrode 104 or the substrate 110 by a matching and distribution network 124. In other examples, the plasma can be generated inductively or remotely. Although, as shown for exemplary purposes, the RF generation system 120 corresponds to a capacitively coupled plasma (CCP) system, the principles of the present disclosure can also be implemented in other suitable systems, such as, by way of example only, in a transformer coupled plasma (TCP) system, a CCP cathode system, a remote microwave plasma generation and delivery system, etc.

[0032] The gas delivery system 130 includes one or more gas sources 132-1, 132-2, ... and 132-N (collectively referred to as gas sources 132), where N is an integer greater than zero. The gas source provides one or more etching gases, carrier gases, inert gases, etc., and mixtures thereof. The gas source can also supply purge gas. The gas source 132 is connected to the manifold 140 through valves 134-1, 134-2, ... and 134-N (collectively referred to as valves 134) and mass flow controllers 136-1, 136-2, ... and 136-N (collectively referred to as mass flow controllers 136). The output of the manifold 140 is supplied to the processing chamber 102. By way of example only, the output of the manifold 140 is supplied to the showerhead 109.

[0033] The temperature controller 142 can be connected to a plurality of heating elements, such as thermal control elements (TCEs) 144 disposed in the ceramic layer 112. For example, the heating elements 144 can include, but are not limited to, large heating elements corresponding to the respective zones in the multi-zone heating plate and / or an array of micro-heating elements disposed across the plurality of zones of the multi-zone heating plate. The temperature controller 142 can be used to control the plurality of heating elements 144 to control the temperature of the substrate support 106 and the substrate 108.

[0034] The temperature controller 142 may be in communication with the coolant assembly 146 to control the flow of coolant through the channel 116. For example, the coolant assembly 146 may include a coolant pump and a reservoir. The temperature controller 142 operates the coolant assembly 146 to selectively flow coolant through the channel 116 to cool the substrate support 106.

[0035] The valve 150 and the pump 152 may be used to evacuate the reactants from the process chamber 102. The system controller 160 may be used to control the components of the substrate processing system 100. The robot 170 may be used to transport substrates to and remove substrates from the substrate support 106. For example, the robot 170 may transfer substrates between the substrate support 106 and the load lock 172. Although the temperature controller 142 is shown as a separate controller, the temperature controller 142 may be implemented within the system controller 160. In some examples, a protective seal 176 may be provided around the outer periphery of the bonding layer 114 between the ceramic layer 112 and the substrate 110.

[0036] The substrate support 106 includes an edge ring 180. The edge ring 180 according to the principles of the present disclosure can be movable relative to the substrate 108 (e.g., can be movable upward and downward in a vertical direction). For example, the edge ring 180 can be controlled by an actuator in response to the controller 160. In some examples, a user can input control parameters (e.g., erosion rate) to the controller 160 via a user interface 184, which can include one or more input mechanisms, a display, etc.

[0037] Reference now Figure 2A and 2B , shows a substrate support 200 with a substrate 204 disposed thereon in accordance with the principles of the present disclosure. The substrate support 200 may include a base or pedestal having an inner portion (e.g., corresponding to the ESC) 208 and an outer portion 212. In an example, the outer portion 212 may be independent of the inner portion 208 and may be movable relative to the inner portion 208. The substrate 204 is disposed on the inner portion 208 for processing. A controller 216 (e.g., corresponding to the system controller 160) communicates with one or more actuators 220 to selectively raise and lower an edge ring 224 to adjust the recess depth of the support 200. By way of example only, the edge ring 224 is Figure 2A 2B is shown in a fully lowered position and in an exemplary fully raised position. As shown, actuator 220 corresponds to a pin actuator configured to selectively extend and retract pin 228 in a vertical direction. Other suitable types of actuators may be used in other examples. By way of example only, edge ring 224 corresponds to a ceramic or quartz edge ring. Figure 2A, controller 216 communicates with actuator 220 to directly raise and lower edge ring 224 via pin 228. In some examples, inner portion 208 may move relative to edge ring 224. Edge ring 224 may have one or more associated erosion rates, as described in more detail below.

[0038] Reference now Figure 3A , the exemplary controller 300 includes an edge ring loss calculation module 304 configured to calculate the amount of loss of the edge ring (e.g., in mm or μm). For example, the edge ring loss calculation module 304 receives one or more inputs 308, which include (but are not limited to): calibration data representing initial edge ring thickness, height, position, etc. of the edge ring, process parameters (e.g., materials used, process type, information representing the duration of the process (e.g., start and end times), temperature in the process chamber, etc.), chamber characteristics, user-defined variables, user inputs, sensor measurements, etc. The user inputs may include one or more erosion rates. The edge ring loss calculation module 304 calculates the edge ring loss based on the received inputs 308. For example, the edge ring loss calculation module 304 may calculate the edge ring loss based on the erosion rates in each process period (e.g., input by the user via the user interface 310, stored in the memory 312, calculated based on various process parameters, and / or a combination thereof) and the duration of each process period (e.g., in RF hours). The data may include, but is not limited to, one or more lookup tables indexing erosion rates to usage periods, models to be executed by the edge ring loss calculation module 304, and the like.

[0039] The edge ring loss calculation module 304 is further configured to calculate an amount to adjust the edge ring height based on the calculated loss (i.e., edge ring adjustment data), and provide the edge ring adjustment data to the actuator control module 316. The actuator control module 316 outputs one or more control signals based on the edge ring adjustment data to control the corresponding actuator. For example, the control signal may be provided to a controller such as Figure 2A and 2B An actuator such as actuator 220 described in .

[0040] Reference now Figure 3B , an example method 320 for calculating an amount of edge ring loss begins at 324. At 328, the method 320 (e.g., the edge ring loss calculation module 304) initializes a height and / or thickness of an edge ring in a processing chamber. For example, the edge ring loss calculation module 304 may determine an initial height of the edge ring based on sensor measurements or physical measurements of the thickness of the edge ring during installation, maintenance, etc. At 332, the method 320 initializes a timer or counter to monitor the duration (in RF hours) of a process performed in the chamber. At 336, substrate processing in the chamber begins and a timer is started.

[0041] At 340, the method 320 (e.g., the edge ring loss calculation module 304) calculates the edge ring loss during the current usage period based on the associated erosion rate. At 344, the method 320 determines whether the process is complete. If so, the method 320 proceeds to 348. If not, the method 320 proceeds to 352. At 352, the method 320 (e.g., the edge ring loss calculation module 304) determines whether to select a different erosion rate. For example, when transitioning to a different usage period (e.g., in response to the timer exceeding one or more RF hour thresholds, such as 50 RF hours, 200 RF hours, etc.), the edge ring loss calculation module 304 may select a different erosion rate. If yes, the method 320 proceeds to 356. If no, the method 320 proceeds to 340. At 356, the method 320 (e.g., the edge ring loss calculation module 304) selects a new erosion rate and proceeds to 340.

[0042] At 348, the method 320 (e.g., the edge ring loss calculation module 304) calculates a total (e.g., cumulative) amount of erosion of the edge ring based on the edge ring losses calculated during each usage period at 340. In some examples, the height of the edge ring is adjusted based on the calculated amount of erosion at 350. For example, the edge ring may be raised by an amount equal to the amount of erosion, an amount equal to the amount of erosion that has occurred since the edge ring was last raised, etc. The method 320 ends at 360.

[0043] Reference now Figure 4A , 4B , and 4C, show exemplary erosion rates and loss compensation. Figure 4A , an exemplary erosion rate 400 (in μm / RFh) is shown over 1000 RF hours. For example, the erosion rate 400 can be calculated by measuring the corresponding amount of erosion on one or more edge rings over time (e.g., using sensors in a laboratory, physical measurements, etc.). As shown, the erosion rate 400 is substantially non-linear. For example, the erosion rate 400 can increase sharply from 0.7 gm / RFh in a first period of use (e.g., from 0 to 250 RF hours of use) and vary between 1.1 μm / RFh and 1.3 μm / RFh in a second period of use (e.g., from 250 to 800 RF hours of use).

[0044] exist Figure 4B, an exemplary erosion rate 404 (in μm / RFh) is shown during 6 RF hours. As shown, the erosion rate 404 can vary during even relatively small periods of use. For example, while the erosion rate 404 can be substantially linear over a period of use from 0 to 3 or 3.5 RF hours, the erosion rate 404 can vary (e.g., 0.05 mm / RFh to 0.08 mm / RFh) in each half-hour period during the same period of use.

[0045] Thus, the edge ring loss calculation module 304 determines the amount of loss of the edge ring based on the different erosion rates for each usage period. For example, the edge ring loss calculation module 304 can be configured to determine (and adjust (for loss calculation)) the erosion rate periodically (e.g., every half-hour usage period, every hundred-hour usage period, non-uniform predetermined usage period, etc.) using a model that adjusts one or more baseline erosion rates according to processing parameters (which are responsive to user input, etc.). The corresponding erosion rates can be calculated by the edge ring loss calculation module 304, stored in the memory 312 to be retrieved by the edge ring loss calculation module 304, input by the user at the beginning of the process or during the process, etc.

[0046] In the example of determining the erosion rate for a consistent and / or inconsistent predetermined period of use, the erosion rate may be based on, for example, Figure 4A and 4B The use period may be determined based on the previously observed / measured erosion rate shown. For example, a use period with an associated erosion rate may correspond to a period with an erosion rate that does not change by more than a predetermined variation (e.g., does not change by more than 0.1 μm / RFh, 0.2 μm / RFh, etc.). In another example, the use period may be defined based on the average erosion rate within adjacent use periods. For example, if the average erosion rate within a time window (e.g., 50 RFh) differs from the average erosion rate within a previous position of the window (e.g., offset 5 RFh, 10 RFh, etc.) by more than a predetermined amount (e.g., 0.1 μm / RFh, 0.2 μm / RFh, etc.), then a use period with an associated erosion rate may be defined accordingly.

[0047] For example, Figure 4CAs shown, the first use period 408 may be associated with a first erosion rate of 0.8 μm / RFh (a total of 0.8*300 microns, or 240 microns, during the first use period 408). In contrast, the second use period 412 may be associated with a second erosion rate of 1.0 μm / RFh (the sum of the erosion amount in the first use period (240 microns) and the erosion amount in the second use period 412 (1.0*200 microns, or 200 microns) totals a cumulative erosion of 440 microns), the third use period 416 may be associated with a third erosion rate of 1.1 μm / RFh (a total of 770 microns of cumulative erosion for the first use period 408, the second use period 412, and the third use period 416), and the fourth use period 420 may be associated with a fourth erosion rate of 0.9 μm / RFh (a total of 950 microns of cumulative erosion for 1000 RFh). The associated erosion rates may correspond to average erosion rates during the respective use periods.

[0048] In one example, the transition between adjacent use periods and their corresponding erosion rates may be defined based on the change in the average erosion rate during the sliding window of 50 RF hours. For example, the average erosion rate in the sliding window with a duration of 50 RF hours as shown at 424 may be within a range of 0.1 pm / RFh from the average erosion rate of 0.8 μm / RFh of the first use period 408. In contrast, the average erosion rate in the sliding window as shown at 428 may have an average erosion rate of 1.0 μm / RFh. Therefore, the transition from the first use period 408 with the first erosion rate to the second use period 412 with the second erosion rate may be defined at 300 RF hours.

[0049] In this manner, different erosion rates in various usage periods correspond to compensation sequences that are applied to control edge ring position during the life of the edge ring. For example, the erosion rates and associated usage periods are stored in memory 312. In one example, the erosion rates are stored as a table that indexes the erosion rates to corresponding usage periods. One or both of the erosion rates and usage periods may be input by a user.

[0050] The edge ring loss calculation module 304 is further configured to monitor the total usage (i.e., cumulative usage, in RF hours) of the edge ring. For example, the edge ring loss calculation module 304 may include a timer or counter that monitors the usage and stores the total usage of the edge ring accordingly. When calculating erosion, the edge ring loss calculation module 304 calculates the total (i.e., cumulative) erosion based on the total usage and different erosion rates in each usage period. For example, if the total usage is 150 RF hours, the erosion may correspond to 0.8 μm / RFh×150 RF hours. Conversely, if the total usage is 400 RF hours, the erosion may correspond to 0.8 μm / RFh×300 RF hours+1.0 μm / RFh×100 RF hours.

[0051] Reference now Figure 5A , 5B , 5C, and 5D, showing an exemplary user interface 500 for inputting an erosion rate (eg, corresponding to Figure 1 User interface 184, Figure 3A 310, etc.). For example, a user may disable erosion rate calculation at 504, select a single (e.g., linear) erosion rate at 508 and enter the selected erosion rate at 512, or select multiple erosion rates (e.g., non-linear multiple rates) at 516. If multiple erosion rates are selected, the user may enter each erosion rate and the start time (in RF hours) associated with the usage period at 520. The calculated erosion amount for each usage period may be displayed (e.g., in real time) at 524. The user may add additional rows (i.e., usage period (via adding the start time, and the associated erosion rate)) and / or remove rows. The edge ring loss calculation module 304 calculates the erosion amount based on the input erosion rate for each period. For example, as shown, the edge ring loss calculation module 304 calculates the erosion amount for the usage period starting at ORF hours based on the erosion rate entered at 520. The total usage may be displayed at 528. The calculated erosion amount may be displayed at 532. In some examples, the total usage and erosion amounts may be reset (ie, reset to zero) at 536 .

[0052] Interface 500 can display a baseline recess height at 540. For example, the baseline recess height can correspond to the recess height of the edge ring before any adjustments are made due to erosion. In contrast, a current height can be displayed at 544. The current height corresponds to the baseline recess height minus the calculated erosion amount. Figure 5B As shown, the current height is the baseline recess height of 2.560 mm minus the calculated erosion amount of 0.290 mm. In other words, at the next adjustment (e.g., after the current processing step or recipe), the edge ring loss calculation module 304 may adjust the edge ring upward by 0.290 mm to compensate for the calculated erosion amount.

[0053] The interface 500 may also display a calibrated loss (erosion) amount at 548. For example, the calibrated loss amount may correspond to a physically measured erosion amount of the edge ring (e.g., measured during installation, maintenance / cleaning, periodic calibration, etc.), and may account for differences in edge ring thickness due to manufacturing tolerances, previous use, etc. In other words, over the hours of ORF use, the thickness of the edge ring may have been less than some predetermined or expected value. Thus, the total erosion amount 552 may correspond to the sum of the calibrated loss amount and the calculated erosion amount.

[0054] The interface 500 may include an edge ring life alarm as shown at 556, which may be selectively enabled or disabled. For example, if the total erosion amount 552 exceeds a predetermined erosion threshold, the interface 500 may alert the user (e.g., as shown in FIG. 5A ). Figure 5C 560, the percentage of edge ring that has been eroded or remains 564, the total RF hours 568, etc.). In some examples, the erosion threshold can be based at least in part on the thickness of the outer diameter of the edge ring. For example, the inner diameter of the edge ring can be lost at a greater rate than the outer diameter of the edge ring. Therefore, if the edge ring is adjusted upward to compensate for the erosion of the inner diameter of the edge ring, the outer diameter of the edge ring can be incrementally raised to a height that is greater than the original (i.e., installed or calibrated) height of the edge ring. In some examples, the raised outer diameter of the edge ring can interfere with the operation of the substrate processing system. For example, the outer diameter of the edge ring can interfere with other structures, robots, etc. above the edge ring. In this way, the edge ring loss calculation module 304 can be further configured to calculate the amount of erosion of the outer diameter of the edge ring and the height of the outer diameter of the edge ring based on the amount that the edge ring has been raised to compensate for the erosion and activate the ring life alarm accordingly.

[0055] In such Figure 5D In another example shown, interface 500 can allow a user to select one of a plurality of multi-rates 572. For example, multi-rates 572 can correspond to different predetermined multi-rates and / or customized (i.e., user-entered or adjusted) multi-rates. Each of multi-rates 572 can correspond to a different nonlinear erosion rate, a different erosion rate model, etc. For example, a user can select different ones of multi-rates 572 based on a current recipe, substrate type, and / or other process or system parameters. In this way, an erosion amount can be calculated based on a plurality of different selected linear erosion rates and / or nonlinear erosion multi-rates during a total usage period of an edge ring.

[0056] Thus, erosion compensation (e.g., the amount by which the edge ring is adjusted to compensate for a calculated erosion amount) may be controlled based on a corresponding recipe. In other words, a first erosion compensation amount may be calculated based on a first erosion multi-rate selected for a first recipe, and the edge ring may be adjusted accordingly. Conversely, a second erosion calculation amount may be calculated based on a second erosion multi-rate selected for a second recipe. Thus, the amount by which the edge ring is adjusted may vary based on the selected recipe and / or the particular one of the multi-rates selected for the recipe. After the recipe and / or edge ring adjustments are performed, the erosion rate may return to a default erosion rate for the system or processing tool, prompt a user to enter a new erosion rate, etc.

[0057] The foregoing description is merely illustrative in nature and is by no means intended to limit the present disclosure, its application or use. The broad teachings of the present disclosure can be implemented in various forms. Therefore, although the present disclosure includes specific examples, the true scope of the present disclosure should not be so limited, because when studying the drawings, the specification and the appended claims, other modifications will become apparent. It should be understood that, without changing the principles of the present disclosure, one or more steps in the method can be performed in different orders (or simultaneously). In addition, although each embodiment is described above as having certain features, any one or more of those features described relative to any embodiment of the present disclosure can be implemented in the features of any other embodiment and / or combined with the features of any other embodiment, even if the combination is not clearly described. In other words, the described embodiments are not mutually exclusive, and the replacement of one or more embodiments with each other remains within the scope of the present disclosure.

[0058] Various terms are used to describe the spatial and functional relationships between elements (e.g., between modules, between circuit elements, between semiconductor layers, etc.), including "connected," "engaged," "coupled," "adjacent," "next to," "on top of," "above," "below," and "disposed." Unless the relationship between a first and a second element is explicitly described as "direct," when such a relationship is described in the above disclosure, the relationship can be a direct relationship, in which there are no other intervening elements between the first and second elements, but can also be an indirect relationship, in which there are one or more intervening elements (spatially or functionally) between the first and second elements. As used herein, the phrase "at least one of A, B, and C" should be interpreted to mean a logical (A or B or C), using a non-exclusive logical OR, and should not be interpreted to mean "at least one of A, at least one of B, and at least one of C."

[0059] In some implementations, the controller is part of a system, which can be part of the above examples. Such a system can include a semiconductor processing device, which includes one or more processing tools, one or more chambers, one or more platforms for processing, and / or specific processing components (wafer pedestals, gas flow systems, etc.). These systems can be integrated with electronic devices for controlling their operation before, during, and after the processing of semiconductor wafers or substrates. The electronic device can be referred to as a "controller", which can control various components or subcomponents of one or more systems. Depending on the processing requirements and / or system type, the controller can be programmed to control any of the processes disclosed herein, including the delivery of process gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, wafer transfer in and out of tools and other transfer tools and / or load locks connected to or connected to a specific system through an interface.

[0060] In general, a controller can be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operations, enable cleaning operations, enable endpoint measurements, etc. The integrated circuit can include a chip in the form of firmware that stores program instructions, a digital signal processor (DSP), a chip defined as an application specific integrated circuit (ASIC), and / or one or more microprocessors, or a microcontroller that executes program instructions (e.g., software). The program instructions can be instructions sent to the controller in the form of various individual settings (or program files) that define operating parameters for performing specific processing on or for a semiconductor wafer or system. In some embodiments, the operating parameters can be part of a recipe defined by a process engineer to complete one or more processing steps during the manufacture of one or more (kinds of) layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0061] In some implementations, the controller may be part of or coupled to a computer that is integrated with the system, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be in the "cloud" or all or part of a wafer fab host system that may allow remote access to wafer processing. The computer may enable remote access to the system to monitor the current progress of a manufacturing operation, check the history of past manufacturing operations, check trends or performance criteria for multiple manufacturing operations, change parameters of a current process, set processing steps to follow the current process, or start a new process. In some examples, a remote computer (e.g., a server) may provide a processing recipe to the system via a network (which may include a local network or the Internet). The remote computer may include a user interface that enables input or programming of parameters and / or settings, which are then sent from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify parameters for each processing step to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool that the controller is configured to engage with or control. Thus, as described above, the controller may be distributed, for example, by including one or more discrete controllers networked together and working toward a common purpose (e.g., processing and control as described herein). An example of a distributed controller for such a purpose is one or more integrated circuits on a chamber that communicate with one or more integrated circuits remotely (e.g., at a platform level or as part of a remote computer), which combine to control processing on the chamber.

[0062] Example systems may include, but are not limited to, plasma etch chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, chamfer edge etch chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etch (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, and any other semiconductor processing system that may be associated with or used in the manufacture and / or preparation of semiconductor wafers.

[0063] As described above, depending on one or more processing steps to be performed by the tool, the controller can communicate with one or more of the following: other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout the factory, a host computer, another controller, or tools used in material transport to transport wafer containers to and from tool locations and / or load ports in a semiconductor manufacturing facility.

Claims

1. A controller for adjusting the height of an edge ring disposed around an outer portion of a substrate support in a substrate processing system, the controller comprising: an edge ring loss calculation module; and Actuator Control Module, The edge ring loss calculation module is configured to receiving at least one input from a user interface indicating one or more erosion rates of the edge ring, wherein the at least one input includes a plurality of erosion rates for various periods of use of the substrate processing system, determining at least one erosion rate of the edge ring using the plurality of erosion rates for the respective usage periods, monitoring a total usage of the edge ring and storing the total usage of the edge ring in a memory, and calculating an erosion amount of the edge ring based on the determined at least one erosion rate and the total usage of the edge ring; and The actuator control module is configured to adjust the height of the edge ring to compensate for the calculated erosion amount based on the erosion amount calculated by the edge ring loss calculation module. 2 . The controller of claim 1 , wherein the at least one input comprises an erosion rate input by a user.

3. The controller of claim 1, wherein the at least one input includes information indicative of a type and duration of a process performed in the substrate processing system. 4 . The controller of claim 1 , wherein the at least one input comprises calibration data indicative of at least one of a height, a thickness, and a position of the edge ring.

5. The controller according to claim 1, wherein: To determine the at least one erosion rate, the edge ring loss calculation module is configured to calculate the plurality of erosion rates during the respective periods of use of the substrate processing system.

6. The controller according to claim 5, wherein: To calculate the erosion amount of the edge ring, the edge ring loss calculation module is configured to calculate the erosion amount based on the plurality of erosion rates calculated in the respective usage periods.

7. The controller of claim 5, wherein each of the plurality of erosion rates is different for the respective periods of use. 8 . The controller of claim 5 , wherein the edge ring loss calculation module is configured to calculate the plurality of erosion rates using a lookup table that indexes erosion rates to usage periods. 9 . The controller of claim 5 , wherein the edge ring loss calculation module is configured to calculate the plurality of erosion rates using a model.

10. A substrate processing system comprising the controller of claim 1 and further comprising a user interface configured to receive the at least one input.

11. The system of claim 10, wherein the user interface is configured to receive the plurality of erosion rates as the at least one input. 12 . The system of claim 10 , wherein the user interface comprises a display configured to display the erosion amount calculated by the edge ring loss calculation module.

13. A method for adjusting a height of an edge ring disposed around an outer portion of a substrate support in a substrate processing system, the method comprising: receiving at least one input from a user interface indicating one or more erosion rates of the edge ring, wherein the at least one input includes a plurality of erosion rates for various periods of use of the substrate processing system; determining at least one erosion rate of the edge ring using the plurality of erosion rates for the respective usage periods, monitoring a total usage of the edge ring and storing the total usage of the edge ring in a memory, and calculating an erosion amount of the edge ring based on the determined at least one erosion rate and the total usage of the edge ring; as well as A height of the edge ring is adjusted based on the calculated amount of erosion to compensate for the calculated amount of erosion.

14. The method of claim 13, wherein the at least one input comprises at least one of: an erosion rate input by a user, information indicating a type and duration of a process performed in the substrate processing system, and calibration data indicating at least one of a height, a thickness, and a position of the edge ring.

15. The method of claim 13, wherein calculating the at least one erosion rate comprises: A plurality of erosion rates are calculated for respective periods of use of the substrate processing system. 16 . The method of claim 15 , wherein calculating the erosion amount of the edge ring comprises calculating the erosion amount based on the plurality of erosion rates calculated in the respective usage periods.

17. The method of claim 15, wherein each of the plurality of erosion rates is different for the respective periods of use.

18. The method of claim 15, further comprising using at least one of a lookup table and a model to calculate the plurality of erosion rates, the lookup table indexing erosion rates to periods of use.

19. The method of claim 13, further comprising receiving the at least one input via a user interface.

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