A tin accumulation avoiding LED lamp substrate

Abstract

The application discloses an LED lamp substrate capable of avoiding tin accumulation, which comprises a substrate main body, first soldering pads are respectively welded on the upper side of the surface of the substrate main body, and a positioning adhesive tape is attached to the gap between the first soldering pads; a chip mounting position is formed on the lower side of the surface of the substrate main body, and a chip is welded on the surface of the chip mounting position; third soldering pads are respectively welded on the lower side of the bottom surface of the substrate main body, second soldering pads are installed on the left side of the third soldering pads, and the second soldering pads are welded on the substrate main body; when the LED lamp is welded with the substrate main body, tin accumulation is avoided at the soldering pads due to the surface tension of the soldering tin, and normal use of the substrate main body is ensured.

Description

Technical Field

[0001] This invention relates to the field of LED lights, and more particularly to an LED light substrate that avoids solder buildup. Background Technology

[0002] In the current LED light board production process, the soldering surface of the plug-in board is directly contacted with high-temperature liquid tin to achieve soldering, thereby forming the so-called light board. However, after the soldering surface of the plug-in board is directly contacted with high-temperature liquid tin and soldered, the surface tension of the solder easily forms solder lumps on the solder pads, which affects the production of the light board. Therefore, an LED light board substrate that avoids solder lumps is proposed. Summary of the Invention

[0003] To overcome the shortcomings mentioned above, the present invention aims to provide a technical solution that can solve the above problems.

[0004] An LED lamp substrate for preventing solder buildup includes a substrate body. First solder pads are soldered onto the upper side of the substrate body surface, and positioning strips are attached to the gaps between the first solder pads. Chip mounting positions are formed on the lower side of the substrate body surface, and chips are soldered onto the surface of the chip mounting positions. Third solder pads are soldered onto the lower side of the bottom surface of the substrate body, and second solder pads are mounted on the left side of the third solder pads and soldered onto the substrate body.

[0005] Preferably, chip spot welding positions are formed on both sides of the chip mounting position, and the chip spot welding positions are located on the substrate body; chip pins are formed on the left and right sides of the chip, and the chip pins are welded to the chip spot welding positions, so that the chip is welded and fixed on the substrate body; the chip is a control chip of the WS2811S series.

[0006] Preferably, a first resistor mounting position is formed on the left side of the middle position of the substrate body surface, and a second resistor spot welding position is formed on the surface of the first resistor mounting position, and a resistor is welded to the surface of the second resistor spot welding position.

[0007] Preferably, a second resistor mounting position is formed on the right side of the middle position of the substrate body surface, and a first resistor spot welding position is formed on the surface of the second resistor mounting position.

[0008] Compared with the prior art, the beneficial effects of the present invention are: when the LED lamp is soldered to the substrate body, the solder block is avoided from forming at the solder pad due to the surface tension of the solder, thus ensuring the normal use of the substrate body.

[0009] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 A schematic diagram of the structure of an LED lamp substrate that avoids solder buildup;

[0012] Figure 2 This is a schematic diagram of another structure for an LED lamp substrate that avoids solder buildup;

[0013] Figure 3 This is another schematic diagram of an LED lamp substrate structure that avoids solder buildup.

[0014] The figure shows: 1. Substrate body, 2. First solder pad, 3. Positioning strip, 4. Fixing hole, 5. First resistor mounting position, 6. Resistor, 7. Second resistor mounting position, 8. First resistor spot welding position, 9. Chip, 10. Chip pin, 11. Second solder pad, 12. Third solder pad, 13. Second resistor spot welding position, 14. Chip spot welding position, 15. Chip mounting position. Detailed Implementation

[0015] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0016] Please see Figure 1-3 In this embodiment of the invention, an LED lamp substrate that avoids solder buildup includes a substrate body 1. First solder pads 2 are soldered onto the upper side of the substrate body 1, and positioning strips 3 are attached to the gaps between the first solder pads 2 to determine the soldering positions of the first solder pads 2. A chip mounting position 15 is formed on the lower side of the substrate body 1, and a chip 9 is soldered onto the surface of the chip mounting position 15 to control the LED lamp (not shown in the figure). A third solder pad 12 is soldered onto the lower side of the bottom surface of the substrate body 1, and a second solder pad 11 is mounted on the left side of the third solder pad 12. The length of the second solder pad 11 is greater than that of the third solder pad 12, thus preventing the formation of solder lumps at the second solder pad 11 due to the surface tension of the solder during subsequent wave soldering.

[0017] Chip mounting positions 14 are formed on both sides of the chip mounting position 15, and the chip mounting positions 14 are located on the substrate body 1; chip pins 10 are formed on the left and right sides of the chip 9, and the chip pins 10 are welded to the chip mounting positions 14, so that the chip 9 is welded and fixed on the substrate body 1; the chip 9 is a control chip of the WS2811S series.

[0018] A first resistor mounting position 5 is formed on the left side of the middle position of the substrate body 1, and a second resistor spot welding position 13 is formed on the surface of the first resistor mounting position 5. A resistor 6 is welded to the surface of the second resistor spot welding position 13. A second resistor mounting position 7 is formed on the right side of the middle position of the substrate body 1, and a first resistor spot welding position 8 is formed on the surface of the second resistor mounting position 7, so that the remaining resistors can be installed later.

[0019] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within the present invention.

Claims

1. An LED lamp substrate that avoids solder buildup, comprising a substrate body, characterized in that, First solder pads are soldered onto the upper side of the substrate body surface, and positioning strips are attached to the gaps between the first solder pads. Chip mounting positions are formed on the lower side of the substrate body surface, and chips are soldered onto the surface of the chip mounting positions. Third solder pads are soldered onto the lower side of the bottom surface of the substrate body, and second solder pads are installed on the left side of the third solder pads and are soldered onto the substrate body. Chip spot welding positions are formed on both sides of the chip mounting position, and the chip spot welding positions are located on the substrate body; chip pins are formed on the left and right sides of the chip, and the chip pins are welded to the chip spot welding positions, so that the chip is welded and fixed to the substrate body; the chip is a control chip of the WS2811S series. A first resistor mounting position is formed on the left side of the middle position of the substrate body surface, and a second resistor spot welding position is formed on the surface of the first resistor mounting position, and a resistor is welded to the surface of the second resistor spot welding position. A second resistor mounting position is formed on the right side of the middle position of the substrate body surface, and a first resistor spot welding position is formed on the surface of the second resistor mounting position.

2. The LED lamp substrate for avoiding solder buildup according to claim 1, characterized in that, The second weld piece is longer than the third weld piece.

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