Assembly and apparatus and method for performing temperature-dependent reactions
The thermoelectric components prepared by electrodeposition technology solve the shape and installation limitations of ceramic substrate thermoelectric components, achieving better temperature control and reaction efficiency.
Patent Information
- Application Number
- CN202010261017.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2016-09-01
- Filing Date
- 2017-08-18
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2037-08-18
AI Technical Summary
The existing ceramic base thermoelectric components have limited tolerances when constructing openings or holes, and are difficult to install and fix. Due to the rigidity of the structure, thermal interface materials are required, and the process is complex and costly.
The preparation of thermoelectric components using electrodeposition technology allows the production of any custom-shaped thermoelectric components, including porous or concave shapes, and can be made flexible to suit different shapes and layouts.
It achieves better control of the reaction temperature, reduces the thermal edge effect and corner effect, and improves temperature uniformity and reaction efficiency.
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Figure CN111504902B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to an assembly, to an apparatus for performing one or more temperature-dependent reactions and to a method for performing temperature-dependent reactions in an assembly. Background Art
[0002] The assembly in the sense of the present invention comprises a sample block, a heat sink and at least one thermoelectric element. Such a sample block is configured to accommodate at least one and preferably a plurality of sample containers. The thermoelectric element is designed as a thermoelectric cooler or a thermoelectric heater. The thermoelectric cooler uses the Peltier effect to generate a heat flux between two different types of material junctions. A Peltier cooler, heater or thermoelectric heat pump is a solid-state active heat pump that transfers heat from one side of the device to the other side depending on the direction of the current while consuming electrical energy. Such an instrument is also called a Peltier device, a Peltier heat pump, a solid-state refrigerator or a thermoelectric cooler. It can be used for both heating and cooling, but the main application in practice is cooling. In the field of the present invention, it is used as a temperature controller that can heat or cool a sample container to control the temperature-dependent reaction of a sample in the sample container. The heat sink is configured to remove excess heat. Thermoelectric elements and heat sinks allow a controlled temperature cycle to be applied to a sample for polymerase chain reaction, whereby the sample is amplified. In particular, when excitation light is applied to the sample, the thermoelectric element and the heat sink allow the detection of a photoreaction.
[0003] In particular, standard thermoelectric elements with ceramic as substrate are now widely used. Such thermoelectric elements are described in US 2008 / 0308140 A1.
[0004] Technical issues
[0005] The use of the above-mentioned thermoelectric elements provides advantages in terms of processing within such an assembly. However, there are still some disadvantages. In particular, the tolerances for constructing openings or holes in thermoelectric elements using ceramic as a substrate are very limited. The installation and fixing between different thermoelectric elements results in a minimum distance between them. In addition, the ceramic substrates are usually flat. They need to be strongly prestressed and assembled in a thermal sandwich using a thermal interface material. Thermal interface materials are required because their structure has very large rigidity. Now standard thermoelectric elements also provide uniform power density due to the fixed distance between the semiconductor legs. The production method of the semiconductor legs is to cut the required block size from, for example, bismuth telluride ingots (raw materials) and then weld them between two ceramic substrates with copper layers of the desired circuit layout. The processing and assembly of the semiconductor unit is mainly manual work. The final thermoelectric element assembly always shows thermal edge effects and corner effects on temperature uniformity, which are caused by the limited homogenization capacity of the interface pressure plate of the heating / cooling due to the variable heat loss generated by the cold neighboring objects.
[0006] It is therefore an object of the present invention to provide an assembly, an apparatus for carrying out a temperature-dependent reaction and a method for carrying out a temperature-dependent reaction which are configured to overcome the above-mentioned disadvantages and allow improved reaction temperature control. Summary of the invention
[0007] This problem is solved by an assembly, an apparatus for carrying out a temperature-dependent reaction and a method for carrying out a temperature-dependent reaction having the features of the independent claims. Embodiments which can be realized in isolation or in any arbitrary combination are listed in the dependent claims.
[0008] As used hereinafter, the terms "having", "including" or "comprising" or any grammatical variants thereof are used in a non-exclusive manner. Thus, these terms may refer to the absence of other features in the entity described in the context of the present application in addition to the features introduced by these terms, or to the presence of one or more other features. As an example, the expressions "A has B", "A includes B" and "A contains B" may refer to the absence of other elements in A in addition to B (i.e., A consists only of B), or to the presence of one or more other elements in entity A in addition to B (e.g., element C, elements C and D, or even other elements).
[0009] In addition, it should be noted that the terms "at least one", "more than one" or similar terms, which indicate that there may be one or more than one feature or element, are usually used only once when introducing the corresponding feature or element. In the following, in most cases, when referring to the corresponding feature or element, the expression "at least one" or "more than one" will not be repeated, although in fact there may be one or more than one corresponding feature or element.
[0010] The assembly disclosed in the present invention includes a sample block, a heat sink and at least one electrodeposited thermoelectric element. The production technology of the electrodeposited thermoelectric element allows any customized shape to be obtained, such as porous or concave thermoelectric elements, without losing the available power per unit area. The electrodeposited thermoelectric elements can also be made flexible. They can be made into many shapes such as cylinders or cones. Therefore, the production technology of the electrodeposited thermoelectric element allows almost any conceivable order of magnitude, shape, layout and size of particles (e.g., telluride crystals), and therefore can even provide certain power compensation near edges and corners.
[0011] The electrodeposited thermoelectric element can be arranged between the sample block and the heat sink. Thus, heat can be removed from the sample block and transferred to the heat sink.
[0012] The electro-deposited thermoelectric element may contact the sample block and / or the heat sink. Thus, direct heat transfer from the electro-deposited thermoelectric element to the sample block and / or the heat sink and from the sample block and / or the heat sink to the electro-deposited thermoelectric element is provided.
[0013] The sample block can be fixed to the electrodeposited thermoelectric element and the heat sink. Thus, the sample block is prevented from moving relative to the electrodeposited thermoelectric element and the heat sink. Thus, the orientation of these structural members is permanently maintained, so that the heat flux between these structural members can be reliably controlled.
[0014] For example, the sample block can be fixed to the electrodeposited thermoelectric element and the heat sink by a forced-fit connection and / or a non-forced-fit connection and / or an adhesive connection. The adhesive connection can be provided by using a thermally stable thermally conductive glue. Thus, these structural members can be independently connected to each other according to their respective shapes and applications.
[0015] In particular, the sample block may include at least one fixing bolt. The electrodeposited thermoelectric element may include at least one fixing hole, and the heat sink may include at least one fixing hole. At least one bolt may engage the fixing hole of the thermoelectric element and the fixing hole of the heat sink. Thus, a removable fixing is provided, allowing these structural members to be maintained and replaced.
[0016] The sample block may include more than one recess, each recess being configured to receive a sample container. The shape of the at least one electrodeposited thermoelectric element may be adapted to the shape of the more than one recess. Thus, substantially several sample container holders may be heated and cooled with a single electrodeposited thermoelectric element having corresponding shapes, complex recesses, holes, pits, through-holes, peninsulas, etc. Directly cooled sample holders or racks or trays may be easily produced using the electrodeposited thermoelectric element so formed. For example, the electrodeposited thermoelectric element may be a curved electrodeposited thermoelectric element around a ring of holders.
[0017] The sample block may include at least one recess configured to receive a sample container. The recess may include a through hole at its bottom end. The electro-deposited thermoelectric element may include at least one through hole. The heat sink may include at least one through hole. The through hole of the recess, the through hole of the electro-deposited thermoelectric cooling element, and the through hole of the heat sink may be arranged on a common axis. Thus, an optical path is provided by which light can be propagated and detected.
[0018] The recess may taper towards the electrodeposited thermoelectric element.Thus, the thermal interface may be achieved in a tapered form so that preloading may be achieved with reduced spring loads and reduced tolerance specifications or for radial thermal interfaces where height is a critical design parameter.
[0019] For example, the recess may be tapered. Thus, the thermal interface may be implemented in a tapered shape so that preloading may be achieved with reduced spring loads and reduced tolerance specifications or for radial thermal interfaces where height is a critical design parameter.
[0020] The electrodeposited thermoelectric element may include several thermoelectric regions. These regions may be operated independently. Therefore, these regions can be operated independently of each other. Therefore, different heating and / or cooling properties are provided between the various regions.
[0021] These thermoelectric zones can include the same or different cooling power or heating power characteristics. In particular, different zones can be built insulated from each other so that they can be powered independently and in different ways. In this way, thermal uniformity and / or various slope or cycle distribution curves can be achieved in a single hardware facility.
[0022] Each thermoelectric region may include several subsections. These subsections may include the same or different cooling power or heating power characteristics. Thus, the regions themselves may be divided into subsections that allow for smaller independent heat transfer zones. Thus, within one region, regions or subsections with different power characteristics may be implemented to compensate for edge effects or design-related asymmetries.
[0023] The electrodeposited thermoelectric element can basically include a planar, stone-shaped, cylindrical, conical, polygonal, or polygonal with rounded edges, a polyhedron, a polyhedron with rounded edges, or any three-dimensional form. Therefore, the electrodeposited thermoelectric element can be designed according to a variety of potential shapes. Therefore, the thermoelectric element made by the electrodeposition process can be independently formed with little effort.
[0024] The invention discloses an apparatus for performing temperature-dependent reactions, comprising an assembly as described above and at least one laboratory device. Thus, the assembly can be well integrated into different kinds of laboratory instruments.
[0025] The present invention discloses a method for carrying out a temperature-dependent reaction in an assembly as described above or in an apparatus as described above. The method comprises exposing a sample contained in a sample container arranged in a recess of a sample block to one or more specific temperatures by operating an electrodeposited thermoelectric element. Thus, the temperature-dependent reaction can be controlled in an improved and simplified manner.
[0026] The electrodeposited thermoelectric element can be operated to cool and / or heat a sample in a sample container. Thus, the temperature within the sample container can be controlled by supplying heat to the sample container or removing heat from the sample container.
[0027] The present invention discloses a method for determining the presence or absence of an analyte in a sample, the method comprising performing the above method in the presence of a detectable marker specific for the analyte, and detecting light emitted by the detectable marker, the light emitted by the detectable marker indicating the presence or absence of the analyte. Thus, the individual design of the electrodeposited thermoelectric element allows for application in optical detection methods.
[0028] The label may be a fluorophore or an electrochemiluminescent compound. Thus, well established labels may be used with the method.
[0029] The label can be a fluorophore, the sample can be exposed to excitation light during and / or after the temperature-dependent reaction, and then the emission light can be detected by a detector, wherein the "emission light" indicates the presence of the analyte. Thus, the analyte can be reliably detected with improved temperature-dependent reaction kinetics.
[0030] The excitation light source can be located above the sample block, while the detector can be located below the heat sink of the assembly as described above. Thus, light originating from the sample can be reliably detected in a simple manner.
[0031] The term "sample block" used in this application refers to a block-like structural member, including a cavity or recess configured to accommodate a sample container. The sample container can be a plastic container. In particular, the sample container can be constructed and arranged to allow optimal heat transfer between the sample block and the liquid sample contained in the container. This allows optimal conditions to be formed during or after thermal cycling, ensuring the specificity and efficiency of nucleic acid amplification. The liquid contains reactants that can be detected by irradiating with a light beam. An example of a reactant is a fluorescent marker associated with the formation of a reaction product in the liquid. An example of a reaction is an amplification reaction, such as TMA, NASBA or PCR. Such an amplification reaction is well known in the art. Alternatively, the sample container is a multi-well plate, that is, a well arranged in a microtiter plate.
[0032] As used herein, the term "heat sink" refers to a passive heat exchanger that transfers heat generated by an electronic or mechanical device to a moving coolant fluid. The transferred heat leaves the device with the moving fluid, allowing the device temperature to be regulated to a physically feasible level.
[0033] The term "electrodeposition" used in this application refers to a structure made by an electrodeposition process. The process of electrodeposition includes electrocoating, electroplating, cathode electrodeposition, anode electrodeposition and electrophoretic coating or electrophoretic painting. The characteristic feature of this process is that the colloidal particles suspended in the liquid medium migrate (electrophoresis) and are deposited on the electrode under the action of an electric field. All colloidal particles that can be used to form a stable suspension and can carry an electric charge can be used in the electrophoretic deposition process. This process includes materials such as polymers, pigments, dyes, ceramics and metals. This process is useful for applying materials to any conductive surface.
[0034] The term "force-fit connection" as used herein refers to a connection of at least two elements or structural members to be connected by the engagement or meshing of these elements. As a result, these elements cannot be separated from each other even if there is no force transmission or the force transmission is interrupted. In other words, with a force-fit connection, one element hinders another element or stands in its way. A force-fit connection is also called a forced locking connection.
[0035] The term "non-forced fit connection" as used in this application refers to a connection of at least two elements or structural members to be connected by pressure acting perpendicularly on the surfaces of these elements. Unless the reaction force caused by the adhesion force is overcome, these elements will not move relative to each other. Non-forced fit connection is also called non-forced locking connection.
[0036] The term "adhesive connection" as used herein refers to the connection of at least two elements or structural members to be connected by atomic or molecular forces. This connection can be achieved by applying an intermediate material to the elements or structural members to be connected to connect them to each other. The resulting connection can be soluble or insoluble. The intermediate material can be an adhesive or glue, in particular a thermally stable thermally conductive glue.
[0037] As used herein, the term "laboratory instrument" refers to any instrument including a light source configured to emit light toward a sample and a detector configured to detect light emitted from the sample.
[0038] The term "light source" used in this application can be any type of illuminator that can be used to generate light excitation in a sample to be analyzed. The light source of the present invention can be a primary light source or a secondary light source, wherein the primary light source changes electrical, electromagnetic, chemical, thermal, dynamic or any other form of energy into light suitable for exciting labeled molecules in a sample container, including, for example, a light emitting diode based on a fluorophore. A secondary light source is a light source that transforms the shape, direction and uniformity of a light beam into another light beam. It can be a white light source, or it can only contain a single wavelength, multiple wavelengths or more than one wavelength band or a combination thereof. A typical light source is an incandescent lamp, a gas discharge lamp or a light emitting diode (LED), including an organic LED (OLED). The light source includes a luminophore that emits light with a single frequency or multiple different frequencies. In addition, the light source can be a combination of more than one of the luminophores.
[0039] The term "detector" as used in this application relates to a specific combination of multiple independent detection sites located in the image plane of the field plane image. Each independent detection site is a device that can capture light and convert light intensity into a corresponding electrical signal. The image of the fluorescence generated from each sample contained in the hole or bottle or sample container coincides with at least one detection site. For example, the detector may include a charge coupled device (CCD) chip or a CMOS chip that is suitable for converting the light signal transmitted by the light beam into a graphic display on a monitor so that the user can identify its measurement results.
[0040] The term "light emitted from a sample or a marker" as used herein relates to light beams originating from the sample or the marker. These light beams may be light generated by exciting marker molecules in a sample contained in a well or sample container, i.e., emitted light, or, if fluorescent markers are used, re-emitted light.
[0041] The term "sample" as used herein refers to a material suspected of containing an analyte of interest. The sample may be from any biological source, such as physiological fluids, tissues, cells, etc. including blood, saliva, eye lens fluid, cerebrospinal fluid, sweat, urine, milk, ascites, mucus, synovial fluid, peritoneal fluid, amniotic fluid, etc. The test sample may be pretreated before use, such as preparing plasma from blood, diluting viscous fluids, lysing, etc.; the treatment method may include filtering, distilling, centrifuging, concentrating, inactivating, and adding reagents to interfering components. The sample may be used directly after being obtained from the source, or after being pretreated to change the sample properties after being obtained from the source, such as after being diluted with another solution or mixed with a reagent, for example, to perform one or more diagnostic tests, such as clinical chemistry tests, immunoassays, coagulation tests, nucleic acid tests, etc. Therefore, the term "sample" used in the present application is not only used for the original sample, but also refers to samples that have been processed (pipetted, diluted, mixed with reagents, concentrated, purified, amplified, etc.). The term "analyte" used in the present application refers to a compound or composition to be detected or measured.
[0042] The term "sample container" used in this application refers to any type of container configured to store or contain a sample. Thus, the sample container may be a tubular container, a rack, a ball or a slide.
[0043] Summarizing the findings of the present invention, the following specific technical solutions are disclosed:
[0044] Technical Solution 1: An assembly comprising a sample block, a heat sink and at least one electrodeposited electrical element.
[0045] Technical Solution 2: An assembly according to Technical Solution 1, wherein the electro-deposited thermoelectric element is arranged between the sample block and the heat sink.
[0046] Technical Solution 3: An assembly according to Technical Solution 1 or 2, wherein the electrodeposited thermoelectric element contacts the sample block and / or the heat sink.
[0047] Technical Solution 4: An assembly according to any one of Technical Solutions 1 to 3, wherein the sample block is fixed to the electrodeposited thermoelectric element and the heat sink.
[0048] Technical Solution 5: An assembly according to any one of Technical Solutions 1 to 4, wherein the sample block is fixed to the electrodeposited thermoelectric element and the heat sink by forced fitting connection and / or non-forced fitting connection and / or adhesive connection.
[0049] Technical Solution 6: An assembly according to any one of Technical Solutions 1 to 5, wherein the sample block includes at least one fixing hole, wherein the electro-deposited thermoelectric element includes at least one fixing hole, and the heat sink includes at least one fixing hole, wherein at least one bolt, preferably a bolt, connects the fixing hole of the sample block, the fixing hole of the thermoelectric element and the fixing hole of the heat sink.
[0050] Technical Solution 7: An assembly according to any one of Technical Solutions 1 to 6, wherein the sample block comprises one or more recesses, each recess being configured to receive a sample container, wherein the shape of the at least one electrodeposited thermoelectric element is adapted to the one or more recesses.
[0051] Technical Solution 8: An assembly according to any one of Technical Solutions 1 to 7, wherein the sample block includes at least one recess configured to receive a sample container, wherein the recess includes a through hole at its bottom end, wherein the electro-deposited thermoelectric element includes at least one through hole, wherein the heat sink includes at least one through hole, wherein the through hole of the recess, the through hole of the electro-deposited thermoelectric cooling element and the through hole of the heat sink are arranged on a common axis.
[0052] Technical Solution 9: An assembly according to Technical Solution 7 or 8, wherein the recess tapers toward the electrodeposited thermoelectric element.
[0053] Technical Solution 10: An assembly according to any one of Technical Solutions 7 to 9, wherein the recess is conical.
[0054] Technical Solution 11: An assembly according to any one of Technical Solutions 1 to 10, wherein the electrodeposited thermoelectric element comprises several thermoelectric regions, wherein these regions can be operated independently.
[0055] Technical Solution 12: An assembly according to Technical Solution 11, wherein the thermoelectric regions include the same or different cooling power or heating power characteristics.
[0056] Technical Solution 13: An assembly according to Technical Solution 11 or 12, wherein each thermoelectric region includes several sub-sections, wherein the sub-sections include the same or different cooling power or heating power characteristics.
[0057] Technical Solution 14: An assembly according to any one of Technical Solutions 1 to 13, wherein the electrodeposited thermoelectric cooling element includes a planar, stone-shaped, cylindrical, conical, polygonal, or polygonal with rounded edges, a polyhedron, a polyhedron with rounded edges, or any three-dimensional form.
[0058] Technical Solution 15: An instrument for performing temperature-dependent reactions, comprising an assembly according to any one of Technical Solutions 1 to 14 and at least one laboratory device.
[0059] Technical Solution 16: A method for performing a temperature-dependent reaction in an assembly according to any one of Technical Solutions 1 to 14 or in an instrument according to Technical Solution 15, comprising exposing a sample contained in a sample container arranged in a recess of a sample block to one or more specified temperatures by operating an electro-deposited thermoelectric element.
[0060] Technical Solution 17: A method according to Technical Solution 16, wherein the electro-deposited thermoelectric element is operated to cool and / or heat a sample in a sample container.
[0061] Technical Solution 18: A method for determining the presence or absence of an analyte in a sample, comprising performing the method of Technical Solution 16 in the presence of a detectable marker specific to the analyte, and detecting light emitted by the detectable marker, wherein the light emitted by the detectable marker indicates the presence or absence of the analyte.
[0062] Technical Solution 19: A method according to Technical Solution 18, wherein the marker is a fluorophore or an electrochemiluminescent compound.
[0063] Technical solution 20: The method according to technical solution 19, wherein the marker is a fluorophore, the sample is exposed to excitation light during the temperature-dependent reaction, and the emitted light is detected by a detector, wherein the emitted light indicates the presence of an analyte.
[0064] Technical Solution 21: A method according to Technical Solution 19, wherein the excitation light source is located above the sample block and the detector is located below the heat sink of the assembly according to Technical Solution 8 or its subordinate technical solution. BRIEF DESCRIPTION OF THE DRAWINGS
[0065] Further details of the present invention can be obtained from the disclosure of the specific embodiments disclosed below. The features of the embodiments can be implemented in an isolated manner or in any combination. The present invention is not limited to these embodiments. These embodiments are schematically drawn in the accompanying drawings. The same reference numerals in the accompanying drawings refer to the same elements or functionally identical elements or elements corresponding to each other with respect to their functions.
[0066] In the attached picture:
[0067] Figure 1 shows an exploded view of an assembly according to a first embodiment of the present invention;
[0068] Figure 2 shows an exploded view of an assembly according to a second embodiment of the present invention;
[0069] Figure 3 shows an exploded view of an assembly according to a third embodiment of the present invention;
[0070] Figure 4shows an exploded view of an assembly according to a fourth embodiment of the present invention;
[0071] Figure 5 shows a plan view of an assembly according to a fifth embodiment of the present invention;
[0072] Figure 6 shows a perspective view of an apparatus according to a first embodiment of the invention;
[0073] Figure 7 shows a perspective view of an apparatus according to a second embodiment of the invention;
[0074] Figure 8 A perspective view of an apparatus according to a third embodiment of the invention is shown. DETAILED DESCRIPTION
[0075] Figure 1 1 shows an exploded view of an assembly 10 according to a first embodiment of the present invention. The assembly includes a sample block 12. The sample block 12 is substantially in the shape of a stone. The sample block 12 includes more than one recess 14. The sample block 12 is shown as an example only and includes six recesses 14 evenly distributed throughout the sample block 12. More specifically, the recesses 14 are arranged in two parallel rows, wherein each row includes three recesses 14. Needless to say, the sample block 12 may include more or less than six recesses 14. Each recess 14 is configured to receive a sample container (in Figure 1 The recesses 14 are conical. In particular, each recess 14 is shaped such that a hole 16 at a top end 18 is formed on an upper surface 20 of the sample block 12, and a conical tip 22 protrudes from a lower surface 24 of the sample block 12. Optionally, each recess 14 includes a through hole 26 at a bottom end 28 thereof.
[0076] The assembly 10 also includes a heat sink 30. The heat sink 30 is substantially in the shape of a strip stone. More particularly, the heat sink 30 includes a length 32, a width 34, and a height 36. The length 32 is greater than the width 34, which in turn is greater than the height 36. The heat sink 30 includes one or more fins 38 protruding perpendicularly from a lower surface 40 of the heat sink 30. Merely by way of example, the heat sink 30 is shown as including six fins 38 evenly distributed throughout the heat sink 30. Needless to say, the heat sink 30 may include more or less than six fins 38. The fins 38 are in the shape of a strip stone. In particular, the fins 38 are arranged parallel to the width 34 of the heat sink 30 and perpendicular to the length 32. The fins 38 are connected to the lower surface 40 at their upper ends 42. For example, the heat sink 30 and the fins 38 are integrally formed or form a single unit. The heat sink 30 also includes six through holes 44. The through holes 44 are evenly distributed throughout the heat sink 30. More particularly, the through holes 44 are arranged in two parallel rows, wherein each row includes three through holes 44. The rows extend parallel to the length 32. The through holes 44 extend from an upper surface 46 of the heat sink 30 and extend completely through the heat sink 30. The through holes 44 are arranged to open outwardly between the fins 38.
[0077] The assembly 10 also includes a thermoelectric element 48. More particularly, the thermoelectric element 48 is an electro-deposited thermoelectric element 48. In other words, the thermoelectric element 48 is formed by an electro-deposition method. The shape of the electro-deposited thermoelectric element 48 is adapted to the shape of one or more recesses 14 of the sample block 12, as will be described in further detail below. The electro-deposited thermoelectric element 48 is substantially flat and rectangular or thin-strip-shaped. The electro-deposited thermoelectric element 48 includes one or more hollow protrusions 50. Merely by way of example, the electro-deposited thermoelectric element 48 is shown as including six protrusions 50 evenly distributed throughout the electro-deposited thermoelectric element 48. Needless to say, the electro-deposited thermoelectric element 48 may include more or fewer protrusions 50. The protrusion 50 is conical. In particular, the protrusion 50 is shaped as a hole 52 at a top end 54 formed on an upper surface 56 of the electro-deposited thermoelectric element 48, and a conical tip 58 protrudes from a lower surface 60 of the electro-deposited thermoelectric element 48. Optionally, each protrusion 50 includes a through hole 62 at a bottom end 64 thereof.
[0078] Each protrusion 50 of the electrodeposited thermoelectric element 48 is configured to re-receive the recess 14 of the sample block 12. In addition, each through-hole 44 of the heat sink 30 is configured to receive the protrusion 50 of the electrodeposited thermoelectric element 48. The electrodeposited thermoelectric element 48 is disposed between the sample block 12 and the heat sink 30. When installed, the upper surface 56 of the electrodeposited thermoelectric element 48 faces the lower surface 24, and the lower surface 60 of the electrodeposited thermoelectric element 48 faces the upper surface 46 of the heat sink 30. In this state, the electrodeposited thermoelectric element 48 contacts the sample block 12 and the heat sink 30. In addition, each protrusion 50 of the electrodeposited thermoelectric element 48 receives the recess 14 of the sample block 12, and each through-hole 44 of the heat sink 30 receives the protrusion 50 of the electrodeposited thermoelectric element 48. Therefore, the sample block 12 is fixed to the electrodeposited thermoelectric element 48 and the heat sink 30 by a forced-fit connection because they cannot move laterally relative to each other, that is, cannot move in a direction parallel to their upper and lower surfaces. Figure 1 It can be further seen that each through hole 26 of each recess 14, each through hole 62 of the electro-deposited thermoelectric element 48 and each through hole 44 of the heat sink 30 are aligned on a common axis 65. In addition, each recess 14 tapers toward the electro-deposited thermoelectric element 48 in the installed state.
[0079] Figure 2 An exploded view of an assembly 10 according to a second embodiment of the present invention is shown. Only the differences from the first embodiment will be explained below, and similar structural components are represented by the same reference numerals. The sample block 12 is fixed to the electro-deposited thermoelectric element 48 and the heat sink 30 by a non-forced connection. To this end, the sample block 12 includes at least one fixing hole 66, the electro-deposited thermoelectric element 48 includes at least one fixing hole 68, and the heat sink 30 includes at least one fixing hole 70. As just one example, two corresponding fixing holes 66, 68, 70 are shown to be arranged between the rows of recesses 14, the rows of protrusions 50 and the rows of through holes 44. The sample block, the electro-deposited thermoelectric element 48 and the heat sink 30 are fixed to each other by engaging at least one screw or bolt 72 with the fixing holes 66, 68, 70.
[0080] Figure 3 An exploded view of an assembly 10 according to a third embodiment of the present invention is shown. Only the differences from the first and second embodiments will be explained below, and similar structural components are represented by the same figure numerals. Basically, the electrodeposited thermoelectric element 48 may include a planar, stone-shaped, cylindrical, conical, polygonal, or polygonal with chamfered edges, a polyhedron, a polyhedron with chamfered edges, or any three-dimensional form. As an example only, if viewed in a plan view, the electrodeposited thermoelectric element 48 includes a general L-shape. If viewed in a plan view, the sample block 12 may also include a general L-shape. The heat sink 30 can be formed as described with reference to the first and second embodiments.
[0081] Figure 4 An exploded view of an assembly 10 according to a fourth embodiment of the present invention is shown. Only the differences from the first to third embodiments will be explained below, and similar structural components are represented by the same figure numbers. The sample block 12 includes an annular upper portion 74 and a tapered lower portion 76. The annular upper portion 74 includes a through hole 26. The shape of the electro-deposited thermoelectric element 48 is also tapered and is configured to receive and contact the lower portion 76 of the sample block 12. The heat sink 30 includes an annular or circular outer portion 78 and a tapered inner portion 80. The tapered inner portion 80 is configured to receive and contact the electro-deposited thermoelectric element. In addition, the fins 38 are arranged at the outer portion 78 and extend outward in a radial direction relative to the annular or circular outer portion 78.
[0082] Figure 5 A plan view of an electro-deposited thermoelectric element 48 according to a fifth embodiment of the present invention is shown. Only the differences from the first to fourth embodiments will be explained below, and similar structural members are represented by the same reference numerals. The electro-deposited thermoelectric element 48 may include a thermoelectric region 82. As just one example, the electro-deposited thermoelectric element 48 is shown as including four thermoelectric regions 82. Needless to say, the electro-deposited thermoelectric element 48 may include more or less than four thermoelectric regions 82. These thermoelectric regions 82 are independently operable. For example, each thermoelectric region 82 may be individually connected to a controllable power source. Alternatively, the thermoelectric region 82 may be connected to a common control circuit configured to operate the thermoelectric regions 82 individually. Therefore, each thermoelectric region 82 may be controlled to heat or cool independently of other thermoelectric regions 82. The thermoelectric region 82 may include the same or different cooling or heating power characteristics. For example, the regions 82 can be arranged so that the region 82 with a larger cooling characteristic is arranged in contact with the portion of the sample block 12 that requires a larger cooling power for cooling, and the other regions with a smaller cooling power characteristic are arranged in contact with the portion of the sample block 12 that requires less cooling power for cooling. Optionally, the thermoelectric regions 82 can be further divided into sub-portions (not shown in detail). Therefore, each thermoelectric region 82 includes several sub-portions. These sub-portions include the same or different cooling power or heating power characteristics. Therefore, smaller surface areas can be cooled or heated independently.
[0083] Figure 6A perspective view of an instrument 84 according to a first embodiment of the present invention is shown. The instrument 84 is configured to perform a temperature-dependent reaction, which will be described in further detail below. The instrument 84 includes an assembly 10 according to any one of the first to fifth embodiments described above. For the purpose of illustrating the basic principles and structure of the instrument 84 only, the instrument 84 will be described as including the assembly 10 according to the first embodiment. The instrument 84 also includes at least one laboratory device 86. The laboratory device 86 includes a light source 88 and a detector 90. The light source 88 is located above the sample block 12 and faces the upper surface 20 of the sample block 12. The light source 88 is configured to emit excitation light toward the sample block 12. The detector 90 is located below the heat sink 30 and faces the lower surface 40 of the heat sink 30. The detector 90 can be a charge coupled device sensor, a complementary metal oxide semiconductor sensor, or the like. In addition, optionally, a lens 92 and an optical filter 94 such as an emission bandpass filter can be provided between the heat sink 30 and the detector 90.
[0084] The assembly 10 and the instrument 84 are respectively used to perform a temperature-dependent reaction. To this end, the sample contained in the sample container 96 is arranged in the recess 14 of the sample block 12. The sample is exposed to one or more specified temperatures by operating the electrodeposited thermoelectric element 48. More particularly, the electrodeposited thermoelectric element 48 is operated to cool and / or heat the sample in the sample container 96. During the temperature-dependent reaction, the presence or absence of an analyte in the sample can be determined. To this end, a detectable marker specific to the analyte is provided in the sample. The marker is a fluorescent or electroluminescent compound. In the present exemplary embodiment, the marker is a fluorophore. During the temperature-dependent reaction, the sample is exposed to excitation light emitted from the light source 88. The light passes through the recess 14, the electrodeposited thermoelectric element 48, and the through holes 26, 44, 62 of the heat sink 30. Therefore, the light also contacts the marker. The light emitted from the marker passes through the lens 92 and the optical filter 94, and is then detected by the detector 90. This detection light emitted from the marker indicates the presence or absence of the analyte.
[0085] Figure 7 1 shows a perspective view of an apparatus 84 according to a second embodiment of the invention. Only the differences from the apparatus 84 according to the first embodiment will be described below, and similar structural components are indicated by the same reference numerals. Basically, compared with the apparatus 84 of the first embodiment, Figure 7An inverted structure is shown. The light source 88 is located below the heat sink 30 and faces the lower surface 40 of the heat sink 30. The detector 90 is located above the sample block 12 and faces the upper surface 20 of the sample block 12. The lens 92 and the optical filter 94 are located between the sample block 12 and the detector 90. During operation, the light source 88 emits light toward the heat sink 30. The light passes through the recess 14, the electrodeposited thermoelectric element 48 and the through holes 26, 44, 62 of the heat sink 30. Therefore, the light also contacts the marker in the sample. The light emitted from the marker passes through the lens 92 and the filter 94 and is then detected by the detector 90. This detection light emitted from the marker indicates the presence or absence of the analyte.
[0086] Figure 8 A perspective view of an instrument 84 according to a third embodiment of the present invention is shown. Only the differences from the instrument 84 according to the first embodiment will be described below, and similar structural members are indicated by the same reference numerals. The through hole 26 of the recess 14 and the through hole 62 of the electrodeposited thermoelectric element 48 are omitted. A beam splitter 98 is located between the light source 88 and the sample block 12. A lens 92, an optical filter 94, and a detector 90 are also located above the sample block 12, but adjacent to or laterally offset from the light source 88. During the temperature-dependent reaction, the sample is exposed to the excitation light emitted from the light source 88. The light passes through the beam splitter 98 and contacts the marker within the sample. The light is emitted from the marker in an upward direction, i.e., away from the light source 88. The light emitted from the marker irradiates the beam splitter 98 and reflects toward the lens 92 and the optical filter 94, and is then detected by the detector. This detection light emitted from the marker indicates the presence or absence of the analyte.
[0087] In summary, the present invention includes but is not limited to the following technical items:
[0088] Technical item 1. An assembly 10, comprising a sample block 12, a heat sink 30 and at least one electro-deposited thermoelectric element 48, wherein the sample block 12 comprises one or more recesses 14, each of the one or more recesses 14 being configured to receive a sample container 96, wherein a shape of the at least one electro-deposited thermoelectric element 48 is adapted to a shape of the one or more recesses 14.
[0089] Technical item 2. The assembly 10 according to technical item 1, wherein the electrodeposited thermoelectric element 48 is disposed between the sample block 12 and the heat sink 30 .
[0090] Technical item 3. The assembly 10 according to technical item 1 or 2, wherein the electrodeposited thermoelectric element 48 contacts the sample block 12 and / or the heat sink 30.
[0091] Technical item 4. The assembly 10 according to any one of technical items 1 to 3, wherein the sample block 12 is fixed to the electrodeposited thermoelectric element 48 and the heat sink 30.
[0092] Technical item 5. The assembly 10 according to any one of technical items 1 to 4, wherein the sample block 12 is fixed to the electrodeposited thermoelectric element 48 and the heat sink 30 by forced fitting connection and / or non-forced fitting connection and / or adhesive connection.
[0093] Technical Item 6. An assembly 10 according to any one of Technical Items 1 to 5, wherein the sample block 12 includes at least one fixing hole 66, wherein the electro-deposited thermoelectric element 48 includes at least one fixing hole 68, and the heat sink 30 includes at least one fixing hole 70, wherein at least one bolt 72 engages the fixing hole 66 of the sample block 12, the fixing hole 68 of the electro-deposited thermoelectric element 48, and the fixing hole 70 of the heat sink 30.
[0094] Technical item 7. An assembly 10 according to any one of technical items 1 to 6, wherein the sample block 12 includes a recess 14 configured to receive at least one sample container 96, wherein the recess 14 includes a through hole 26 at its bottom end 28, wherein the electro-deposited thermoelectric element 48 includes at least one through hole 62, wherein the heat sink 30 includes at least one through hole 44, wherein the through hole 26 of the recess 14, the through hole 62 of the electro-deposited thermoelectric element 48, and the through hole 44 of the heat sink 30 are arranged on a common axis 64.
[0095] Technical item 8. The assembly 10 according to any one of technical items 1 to 7, wherein the recess 14 tapers toward the electrodeposited thermoelectric element 48 .
[0096] Technical item 9. The assembly 10 according to any one of technical items 1 to 8, wherein the recess 14 is conical in shape.
[0097] Technical item 10. An assembly 10 according to any one of technical items 1 to 9, wherein the electro-deposited thermoelectric element 48 includes a plurality of thermoelectric regions 82, wherein the thermoelectric regions 82 are capable of operating independently.
[0098] Technical item 11. The assembly 10 according to technical item 10, wherein the thermoelectric region 82 includes the same or different cooling power or heating power characteristics.
[0099] Technical item 12. An assembly 10 according to technical item 10 or 11, wherein each thermoelectric region 82 includes several sub-portions, wherein the sub-portions include the same or different cooling power or heating power characteristics.
[0100] Technical item 13. An apparatus 84 for performing a temperature-dependent reaction, the apparatus 84 comprising the assembly 10 according to any one of technical items 1 to 12 and at least one laboratory device 86.
[0101] Technical item 14. A method for performing a temperature-dependent reaction in an assembly 10 according to any one of technical items 1 to 12 or in an instrument 84 according to technical item 13, the method comprising exposing a sample contained in a sample container 96 arranged in a recess 14 of a sample block 12 to one or more specified temperatures by operating the electro-deposition thermoelectric element 48.
[0102] Reference numerals list
[0103] 10 assemblies of 12 sample blocks
[0104] 14 recesses 16 holes
[0105] 18 top 20 upper surface
[0106] 22 conical tip 24 lower surface
[0107] 26 through hole 28 bottom
[0108] 30 Radiator 32 Length
[0109] 34 width 36 height
[0110] 38 fins 40 lower surface
[0111] 42 upper end 44 through hole
[0112] 46 upper surface 48 electrodeposited thermoelectric element
[0113] 50 protrusions 52 holes
[0114] 54 top 56 upper surface
[0115] 58 conical tip 60 lower surface
[0116] 62 through hole 64 bottom
[0117] 65 common axis 66 fixing hole
[0118] 68 fixing hole 70 fixing hole
[0119] 72 bolt 74 upper part
[0120] 76 lower part 78 outer part
[0121] 80 internal part 82 thermoelectric area
[0122] 84 Instruments 86 Laboratory Equipment
[0123] 88 light source 90 detector
[0124] 92 lens 94 optical filter
[0125] 96 sample containers 98 beam splitters
Claims
1. A temperature control assembly (10) comprising a sample block (12), a heat sink (30) and at least one electrodeposited thermoelectric element (48), wherein: The sample block (12) includes at least one fixing hole (66), wherein the electro-deposited thermoelectric element (48) includes at least one fixing hole (68), and the heat sink (30) includes at least one fixing hole (70), wherein at least one peg (72) engages the fixing hole (66) of the sample block (12), the fixing hole (68) of the electro-deposited thermoelectric element (48), and the fixing hole (70) of the heat sink (30).
2. The temperature control assembly (10) according to claim 1, wherein: The electrodeposited thermoelectric element (48) is disposed between the sample block (12) and the heat sink (30).
3. The temperature control assembly (10) according to claim 1, wherein: The electrodeposited thermoelectric element (48) contacts the sample block (12) and / or the heat sink (30).
4. The temperature control assembly (10) according to claim 1, wherein: The sample block (12) is fixed to the electrodeposited thermoelectric element (48) and the heat sink (30).
5. The temperature control assembly (10) according to claim 1, wherein: The sample block (12) is fixed to the electrodeposited thermoelectric element (48) and the heat sink (30) by a forced-fit connection or a non-force-fit connection or an adhesive connection.
6. The temperature control assembly (10) according to claim 1, wherein: The sample block (12) includes a recess (14) configured to receive at least one sample container (96), wherein the recess (14) includes a through hole (26) at a bottom end (28) thereof, wherein the electro-deposited thermoelectric element (48) includes at least one through hole (62), wherein the heat sink (30) includes at least one through hole (44), wherein the through hole (26) of the recess (14), the through hole (62) of the electro-deposited thermoelectric element (48), and the through hole (44) of the heat sink (30) are arranged on a common axis (64).
7. The temperature control assembly (10) according to claim 6, wherein: The recess (14) tapers toward the electrodeposited thermoelectric element (48).
8. The temperature control assembly (10) according to claim 6, wherein: The recess (14) is conical in shape.
9. The temperature control assembly (10) according to claim 1, wherein: The electrodeposited thermoelectric element (48) includes a plurality of thermoelectric regions (82), wherein the thermoelectric regions (82) are independently operable.
10. The temperature control assembly (10) according to claim 9, wherein: The thermoelectric regions (82) include the same or different cooling power or heating power characteristics.
11. The temperature control assembly (10) according to claim 9 or 10, wherein: Each thermoelectric region (82) includes a number of subsections, wherein the subsections include the same or different cooling power or heating power characteristics.
12. An apparatus (84) for performing a temperature-dependent reaction, the apparatus (84) comprising a temperature control assembly (10) according to any one of claims 1 to 11 and at least one laboratory device (86), wherein the laboratory device (86) comprises a light source (88) and a detector (90).
13. A method of performing a temperature-dependent reaction in a temperature control assembly (10) according to any one of claims 1 to 11 or in an apparatus (84) according to claim 12, the method comprising exposing a sample contained in a sample container (96) arranged in a recess (14) of a sample block (12) to one or more specified temperatures by operating the electrodeposition thermoelectric element (48).
Citation Information
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