Automatic temperature control dispensing device

Abstract

The present invention discloses an automatic temperature-controlled dispensing device, comprising: a cylinder body, a receiving cavity is defined within the cylinder body, and a glue cartridge can be installed within the receiving cavity; a Peltier semiconductor, which is connected to the cylinder body; a controller, which is electrically connected to the Peltier semiconductor, and the controller can switch the direction of the energizing current of the Peltier semiconductor; a temperature detector, which is respectively connected to the cylinder body and the controller. This automatic temperature-controlled dispensing device can automatically heat or cool the cylinder body by automatically switching the direction of the energizing current of the Peltier semiconductor connected to the cylinder body, and can effectively control the temperature of the glue liquid in the glue cartridge to be maintained within an ideal temperature range of the thermal equilibrium state.

Description

Technical Field

[0001] The present invention belongs to the technical field of dispensing machines, and particularly relates to an automatic temperature-controlled dispensing device. Background Art

[0002] The working principle of a syringe dispensing device is usually that the pushing force generated by the compressed air filled in the syringe extrudes the glue in the syringe from the end of the needle connected to the bottom of the syringe. Its structure is simple and easy to maintain, and it has great advantages compared with various dispensing valves.

[0003] When the syringe dispensing device is applied to conductive materials, structural bonding, etc. that require rapid and repeated dispensing processes, the inflation / exhaust process in the cavity of the syringe continuously alternates. During the alternating process, the heat generated by the rapid and repeated impact of high-pressure air does not dissipate quickly, causing the temperature of the syringe and the glue in the syringe to gradually rise and reach a thermal equilibrium state. In the thermal equilibrium state of syringe dispensing, the best dispensing state can be achieved, ensuring the stable state of glue discharging from the needle. However, in actual dispensing applications, the temperature for achieving this thermal equilibrium state is directly related to the frequency and rate of repeated dispensing. The frequency and rate of rapid and repeated dispensing need to be changed at any time according to process requirements and cannot be guaranteed to be stable at a fixed rhythm. Moreover, as the dispensing operation continues, the remaining amount of glue in the syringe also decreases. That is to say, the temperature of the thermal equilibrium state is dynamic, and its real-time temperature is constantly changing.

[0004] In order to improve the stability of glue discharging from the needle during dispensing operations and increase the stability and reliability of the quality of the final dispensed product, it is necessary to improve the structure of the glue cylinder, for example: configuring a temperature control device.

[0005] Existing syringe dispensing devices usually adopt conventional temperature control devices. This temperature control device usually only has a heating function and cannot meet the requirement of controlling the glue temperature within the ideal temperature range of the thermal equilibrium state. For example: when an existing syringe dispensing device applied to hot melt adhesive is in use, the syringe needs to be continuously heated to the temperature at which the hot melt adhesive remains in a molten state, and at this time, the temperature is much higher than the thermal equilibrium state of conventional glue. At this time, if it is required that the temperature control device control the glue temperature to the thermal equilibrium state (generally the same as the ambient temperature or only slightly higher than the ambient temperature), the temperature control device will not be able to meet this requirement, easily causing the syringe dispensing device to be in a non-thermal equilibrium state during the dispensing process. During the dispensing process in the non-thermal equilibrium state, the viscosity of the glue changes with temperature, and the glue discharge amounts of multiple dispensings show significant inconsistencies, resulting in too large fluctuations in the glue amount. When the discharging state is too viscous or too thin, the best dispensing state cannot be achieved, not meeting the requirements of the process. Syringe dispensing can only achieve the best dispensing state and ensure the stable state of glue discharging from the needle in the thermal equilibrium state.

[0006] In order to achieve a cooling effect, existing syringe dispensing devices use a thermoelectric cooler to cool the needle part in order to accelerate the heat dissipation rate. However, some existing thermoelectric coolers generally achieve refrigeration by transferring heat to a radiator, and they also do not have a temperature control function that can both heat up and cool down. When in use, other heating components need to be equipped for use, which takes up a large amount of space and has a relatively complex structure. Moreover, the existing solutions for cooling the needle area cannot ensure that the glue is in a thermal equilibrium state, so the best dispensing state cannot be achieved. Summary of the Invention

[0007] The technical problem to be solved by the present invention is to provide an automatic temperature control dispensing device that can automatically control the temperature of the glue cylinder.

[0008] To this end, the present invention proposes an automatic temperature control dispensing device that can automatically control the temperature of the glue cylinder.

[0009] The automatic temperature control dispensing device according to an embodiment of the present invention includes: a cylinder body, a receiving cavity is defined in the cylinder body, and a glue cylinder can be installed in the receiving cavity; a Peltier semiconductor, the Peltier semiconductor is connected to the cylinder body; a controller, the controller is electrically connected to the Peltier semiconductor, and the controller can switch the direction of the energizing current of the Peltier semiconductor; a temperature detector, the temperature detector is respectively connected to the cylinder body and the controller.

[0010] The automatic temperature control dispensing device according to an embodiment of the present invention combines a cylinder body, a Peltier semiconductor, a controller and a temperature detector. The temperature detector collects the temperature of the cylinder body in real time and feeds it back to the controller. The controller switches the direction of the energizing current of the Peltier semiconductor to control the temperature of the glue liquid in the glue cylinder. When the temperature of the cylinder body is higher than the set temperature, the Peltier semiconductor is positively powered to cool the cylinder body; when the temperature of the cylinder body is lower than the set temperature, the Peltier semiconductor is reversely powered to heat the cylinder body. This automatic temperature control dispensing device can make the temperature of the glue liquid in the glue cylinder be in a thermal equilibrium state with the temperature of the cylinder body by cooling or heating the cylinder body with the Peltier semiconductor. It can not only heat the glue liquid, but also cool the glue liquid to maintain the best dispensing state and ensure the stable state of the glue output from the needle. This automatic temperature control dispensing device has the advantages of simple structure, flexible operation and the ability to automatically control the temperature of the glue cylinder.

[0011] According to an embodiment of the present invention, the Peltier semiconductor has a first working surface and a second working surface arranged oppositely, and the first working surface is attached to at least a part of the cylinder body.

[0012] According to an embodiment of the present invention, the cylinder body is provided with: a mounting groove, the mounting groove is spaced apart from the receiving cavity and arranged oppositely, and the temperature detector is installed in the mounting groove.

[0013] According to an embodiment of the present invention, the cylinder body is provided with: an observation window, and the observation window communicates with the accommodation cavity to observe the remaining amount of the glue liquid in the glue cylinder through the observation window.

[0014] According to an embodiment of the present invention, the automatic temperature-controlled dispensing device further includes: a cooling member, and the cooling member is connected to the second working surface of the Peltier semiconductor.

[0015] According to an embodiment of the present invention, the cooling member is provided with a cooling channel, and the cooling member includes: a fluid generator, and the fluid generator communicates with the cooling channel to convey a cooling fluid into the cooling channel.

[0016] According to an embodiment of the present invention, the cooling member includes: a bottom plate, the bottom plate contacts the second working surface of the Peltier semiconductor, and a plurality of inwardly recessed and interconnected cooling channels are provided on the bottom plate; a cover plate, the cover plate covers the bottom plate, and the cooling channel is located between the bottom plate and the cover plate.

[0017] According to an embodiment of the present invention, the cooling member includes a plurality of spaced-apart heat dissipation fins and a cooling fan connected to the heat dissipation fins.

[0018] According to an embodiment of the present invention, the accommodation cavity has: a first channel, and a glue cylinder is installed in the first channel; a second channel, the second channel is connected to the first channel, and the upper end of the second channel is connected to the lower end of the first channel, and the radial dimension of the second channel is smaller than the radial dimension of the first channel.

[0019] According to an embodiment of the present invention, the automatic temperature-controlled dispensing device further includes: a needle adapter, the needle adapter is installed in the second channel, the upper end of the needle adapter is detachably connected to the glue cylinder, and the lower end of the needle adapter is detachably connected to a needle.

[0020] According to an embodiment of the present invention, the automatic temperature-controlled dispensing device further includes: a positioning assembly, and the positioning assembly can limit the glue cylinder in the accommodation cavity.

[0021] According to an embodiment of the present invention, the positioning assembly includes: a pressing block fixing plate, the pressing block fixing plate is connected to the cylinder body; a limiting member, the limiting member is connected to the pressing block fixing plate and can limit the positioning state of the glue cylinder or a glue cylinder adapter connected to the glue cylinder.

[0022] According to one embodiment of the present invention, the limiting member includes: a rotating explosion-proof pressure block, one end of which is hinged to the pressure block fixing plate, and the other end of which is provided with an opening, and the opening position of the other end of the rotating explosion-proof pressure block corresponds to the rubber cartridge or the rubber cartridge adapter; a limiting adjustment member, a part of which is connected to the rotating explosion-proof pressure block, and the other part of which is abutted against the rubber cartridge or the rubber cartridge adapter.

[0023] According to one embodiment of the present invention, the other end of the rotating explosion-proof pressure block is provided with a mounting hole extending in the direction of the cylinder, and the limit adjustment component includes: an adjusting screw, which is provided in the mounting hole and can move along its axial direction; a limiting nut, which is threadedly connected to the adjusting screw to limit the relative position of the adjusting screw and the rubber cylinder.

[0024] According to one embodiment of the present invention, the positioning assembly further comprises: a positioning member, which is respectively connected to the pressure block fixing plate and one end of the rotating explosion-proof pressure block to limit the relative position of the rotating explosion-proof pressure block and the pressure block fixing plate.

[0025] According to one embodiment of the present invention, the accommodating cavity extends in the up-down direction, the pressure block fixing plate extends in the up-down direction, the pressure block fixing plate is provided with a first positioning hole extending in the horizontal direction, the rotating explosion-proof pressure block is formed into an L-shape, and the rotating explosion-proof pressure block comprises: a long limb, one end of which is connected to the adjustment screw; a short limb, one end of which is connected to the other end of the long limb and is hinged to the upper end of the pressure block fixing plate, the other end of the short limb can rotate around one end of the short limb, and the other end of the short limb is provided with a second positioning hole; the positioning member comprises: a positioning shaft, one end of which is able to pass through the second positioning hole and be plugged into the first positioning hole when the other end of the short limb is rotated to the second positioning hole and is arranged opposite to the second positioning hole and is connected to each other; a positioning portion, the positioning portion is provided at the other end of the positioning shaft and is located on one side of the pressure block fixing plate, the positioning portion is formed as a "匚"-shaped member with an opening toward the pressure block fixing plate, and the spacing between the two free ends of the positioning portion is greater than the thickness of the edge of the pressure block fixing plate adjacent to the direction where the positioning portion is located.

[0026] According to one embodiment of the present invention, a first limiting surface is provided at one end of the second positioning hole adjacent to the positioning portion, and a second limiting surface is provided on the outer peripheral surface of one end of the positioning shaft and spaced apart from the first limiting surface. The positioning member also includes: an elastic member, which is provided in the second positioning hole and located between the first limiting surface and the second limiting surface.

[0027] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. Description of the Drawings

[0028] The above and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, where:

[0029] Figure 1 is a perspective structural schematic diagram of the automatic temperature-controlled dispensing device according to an embodiment of the present invention at an angle when assembling the glue cylinder;

[0030] Figure 2 is a perspective structural schematic diagram of the automatic temperature-controlled dispensing device according to an embodiment of the present invention at another angle when assembling the glue cylinder;

[0031] Figure 3 is Figure 1 a left view schematic diagram of the automatic temperature-controlled dispensing device shown;

[0032] Figure 4 is along Figure 3 a sectional view taken along line A-A in

[0033] Figure 5 is Figure 1 a rear view schematic diagram of the automatic temperature-controlled dispensing device shown;

[0034] Figure 6 is along Figure 5 a sectional view taken along line B-B in

[0035] Figure 7 is a perspective structural schematic diagram of the automatic temperature-controlled dispensing device according to an embodiment of the present invention at an angle when not assembling the glue cylinder;

[0036] Figure 8 is a perspective structural schematic diagram of the automatic temperature-controlled dispensing device according to an embodiment of the present invention at another angle when not assembling the glue cylinder;

[0037] Figure 9 is a structural schematic diagram of the cylinder body of the automatic temperature-controlled dispensing device according to an embodiment of the present invention;

[0038] Figure 10 is a structural schematic diagram of the temperature detector of the automatic temperature-controlled dispensing device according to an embodiment of the present invention;

[0039] Figure 11 is a perspective structural schematic diagram of the Peltier semiconductor of the automatic temperature-controlled dispensing device according to an embodiment of the present invention;

[0040] Figure 12 is a perspective structural schematic diagram of the bottom plate of the automatic temperature-controlled dispensing device according to an embodiment of the present invention;

[0041] Figure 13 It is a schematic three-dimensional structure diagram of the cover plate of the automatic temperature-controlled dispensing device according to an embodiment of the present invention;

[0042] Figure 14 It is a schematic structure diagram of the cooling member of the automatic temperature-controlled dispensing device according to an embodiment of the present invention being a cooling fan;

[0043] Figure 15 It is a schematic three-dimensional structure diagram of the positioning assembly of the automatic temperature-controlled dispensing device according to an embodiment of the present invention;

[0044] Figure 16 It is a connection schematic diagram of the pressure block fixing plate, the limiting member and the positioning member in the automatic temperature-controlled dispensing device of the present invention;

[0045] Figure 17 It is a schematic three-dimensional structure diagram of the pressure block fixing plate of the automatic temperature-controlled dispensing device according to an embodiment of the present invention;

[0046] Figure 18 It is a schematic three-dimensional structure diagram of the rotary explosion-proof pressure block of the automatic temperature-controlled dispensing device according to an embodiment of the present invention;

[0047] Figure 19 It is a connection schematic diagram of the second positioning hole and the first limiting surface of the rotary explosion-proof pressure block of the automatic temperature-controlled dispensing device according to an embodiment of the present invention;

[0048] Figure 20 It is a schematic structure diagram of the positioning shaft of the automatic temperature-controlled dispensing device according to an embodiment of the present invention;

[0049] Figure 21 It is a schematic three-dimensional structure diagram of the adjusting screw of the automatic temperature-controlled dispensing device according to an embodiment of the present invention;

[0050] Figure 22 It is a schematic three-dimensional structure diagram of the limiting nut of the automatic temperature-controlled dispensing device according to an embodiment of the present invention;

[0051] Figure 23 It is a schematic three-dimensional structure diagram of the positioning portion of the automatic temperature-controlled dispensing device according to an embodiment of the present invention;

[0052] Figure 24 It is a circuit diagram realized by a single-pole double-throw switch of the Peltier semiconductor of the automatic temperature-controlled dispensing device according to an embodiment of the present invention.

[0053] Reference numerals:

[0054] Automatic temperature-controlled dispensing device 100;

[0055] Cylinder body 10; Accommodation cavity 11; Installation groove 12; Observation window 13; First channel 14; Second channel 15;

[0056] Peltier semiconductor 20; first working surface 21; second working surface 22;

[0057] Temperature detector 30;

[0058] Cooling member 40; bottom plate 43; cover plate 44; heat sink 45; cooling fan 46;

[0059] Needle adapter 50;

[0060] Positioning assembly 60;

[0061] Bushing fixing plate 61; first positioning hole 611;

[0062] Limiting member 62;

[0063] Rotating explosion-proof bushing 621; long limb 6211; short limb 6212; second positioning hole 6213; first limiting surface 6214; second limiting surface 6311;

[0064] Limiting adjustment member 622; adjusting screw 6221; limiting nut 6222;

[0065] Positioning member 63; positioning shaft 631; positioning portion 632; elastic member 633;

[0066] Cartridge 200. Detailed implementation manners

[0067] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0068] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for facilitating the description of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. In addition, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "plurality" is two or more.

[0069] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0070] The automatic temperature-controlled dispensing device 100 according to an embodiment of the present invention will be specifically described below with reference to the accompanying drawings.

[0071] As Figures 1 to 24 shown, the automatic temperature-controlled dispensing device 100 according to an embodiment of the present invention includes: a cylinder body 10, a Peltier semiconductor 20, a controller, and a temperature detector 30.

[0072] Specifically, a receiving cavity 11 is defined inside the cylinder body 10, a glue cartridge 200 can be installed inside the receiving cavity 11, the Peltier semiconductor 20 is connected to the cylinder body 10, the controller is electrically connected to the Peltier semiconductor 20, the controller can switch the direction of the energizing current of the Peltier semiconductor 20, and the temperature detector 30 is respectively connected to the cylinder body 10 and the controller.

[0073] In other words, the automatic temperature-controlled dispensing device 100 according to an embodiment of the present invention is mainly composed of a cylinder body 10, a Peltier semiconductor 20, a controller, and a temperature detector 30. The material of the cylinder body 10 is a material with good thermal conductivity, preferably aluminum. A receiving cavity 11 is defined inside the cylinder body 10, and the shape of the receiving cavity 11 matches the outer shape of the glue cartridge 200, which is convenient for installing the glue cartridge 200. During use, the glue cartridge 200 is installed inside the receiving cavity 11. Since the Peltier semiconductor 20 is connected to the cylinder body 10, the temperature of the cylinder body 10 can be controlled through the Peltier semiconductor 20, and then the temperature of the glue liquid inside the glue cartridge 200 inside the cylinder body 10 can be controlled. Specifically, the temperature detector 30 is connected to the cylinder body 10 and the controller. The temperature information of the cylinder body 10 can be obtained through the temperature detector 30 and fed back to the controller. When the temperature of the cylinder body 10 is higher than the set temperature, the controller can supply power to the Peltier semiconductor 20 in the forward direction to cool the cylinder body 10. When the temperature of the cylinder body 10 is lower than the set temperature, the controller can supply power to the Peltier semiconductor 20 in the reverse direction to heat the cylinder body 10.

[0074] It should be noted that as Figure 24 shown, the Peltier semiconductor 20 is powered by direct current. By switching the direction of the current, the Peltier semiconductor 20 can be switched between cooling and heating relative to the cylinder body 10. Among them, the switching method of the current direction can be realized by, but not limited to, a single-pole double-throw switch method.

[0075] Thus, the automatic temperature-controlled dispensing device 100 according to the embodiments of the present invention combines a cylinder body 10, a Peltier semiconductor 20, a controller, and a temperature detector 30. The temperature detector 30 collects the temperature of the cylinder body 10 in real time and feeds it back to the controller. The controller switches the direction of the energizing current of the Peltier semiconductor 20 to control the temperature of the glue in the glue cylinder 200. When the temperature of the cylinder body 10 is higher than the set temperature, the Peltier semiconductor 20 is positively powered to cool the cylinder body 10. When the temperature of the cylinder body 10 is lower than the set temperature, the Peltier semiconductor 20 is reversely powered to heat the cylinder body 10. Wherein: the set temperature refers to the temperature when the temperature of the glue in the glue cylinder 200 and the temperature of the cylinder body 10 are in a thermal equilibrium state. The automatic temperature-controlled dispensing device 100 can make the temperature of the glue in the glue cylinder 200 and the temperature of the cylinder body 10 in a thermal equilibrium state by cooling or heating the Peltier semiconductor 20 relative to the cylinder body 10. It can not only heat the glue but also cool the glue to maintain the best dispensing state and ensure the stable state of the glue output from the needle tip. The automatic temperature-controlled dispensing device 100 has the advantages of simple structure, flexible operation, and the ability to automatically control the temperature of the glue cylinder 200.

[0076] In addition, there is a technical solution in the prior art for cooling the glue in the needle. When the temperature of the glue in the needle is higher than the temperature of the needle, cooling the needle can cool the glue, enabling the temperature of the glue in the needle to be within the ideal temperature range of the thermal equilibrium state with the temperature of the needle, and preventing the glue in the needle from clogging the needle due to curing, thereby controlling the normal state of the glue output through cooling. However, the amount of glue that can be retained in the inner cavity of the needle in real time is very small, which is only suitable for dispensing operations with a low glue output rate, extremely limiting the production capacity and unable to meet the production requirements; if the glue output rate of the needle is increased to improve the production capacity, the glue in the inner cavity of the needle will be dispensed from the needle before reaching the ideal temperature of the thermal equilibrium state, and the fluctuation of the glue output amount cannot be controlled, affecting the dispensing quality. When controlling the temperature of the needle in the prior art, whether the temperature of the glue in the inner cavity of the needle can be accurately controlled depends on the glue output rate, and reducing the glue output rate will affect the production capacity. Compared with the prior art's technical solution for controlling the temperature of the needle, the automatic temperature-controlled dispensing device 100 according to the embodiments of the present invention automatically controls the temperature relative to the cylinder body 10, making the temperature of the glue in the barrel body of the glue cylinder 200 automatically within the ideal temperature range of the thermal equilibrium state with the temperature of the cylinder body. Since the amount of glue stored in the glue cylinder is sufficient, whether the temperature of the glue in the barrel body is lower or higher than the temperature of the cylinder body, cooling or heating the Peltier semiconductor 20 relative to the cylinder body 10 can make the temperature of the glue in the glue cylinder 200 and the temperature of the cylinder body 10 in a thermal equilibrium state, meeting the glue output rate and thus improving the production capacity, and also ensuring the dispensing quality.

[0077] Such as Figure 6 and Figure 11As shown, according to an embodiment of the present invention, the Peltier semiconductor 20 has a first working surface 21 and a second working surface 22 which are arranged oppositely. The first working surface 21 is attached to at least a part of the cylinder 10. When a forward current is passed through the first working surface 21, this surface cools, and when a reverse current is passed through, this surface heats up. When a forward current is passed through the second working surface 22, this surface heats up, and when a reverse current is passed through, this surface cools.

[0078] As Figure 9 shown, in some specific embodiments of the present invention, the cylinder 10 is provided with: a mounting groove 12, the mounting groove 12 is spaced apart from the accommodating cavity 11 and is oppositely arranged, and a temperature detector 30 is installed in the mounting groove 12. That is to say, during use, the temperature detector 30 can be installed in the mounting groove 12, which can not only accurately obtain the temperature of the cylinder 10, but also has the function of facilitating installation.

[0079] As Figures 7 to 9 shown, according to an embodiment of the present invention, the cylinder 10 is provided with an observation window 13, and the observation window 13 communicates with the accommodating cavity 11 to observe the remaining amount of the glue in the glue cylinder 200 through the observation window 13. By providing the observation window 13, the defect that there is no observation window for the glue cylinder 200 or the observation window is not opened to the arc area of the glue cylinder 200 in the existing temperature control device, and the operator cannot accurately track or view the remaining amount of the glue in the glue cylinder 200 can be solved. Among them, the observation window 13 can be arranged in the lower part area of the cylinder 10 to facilitate observing the glue in the glue cylinder 200.

[0080] As Figure 7 、 Figures 12 to 14 shown, in some specific embodiments of the present invention, the automatic temperature control dispensing device 100 further includes a cooling member 40, and the cooling member 40 is connected to the second working surface 22 of the Peltier semiconductor 20. Optionally, the cooling member 40 is attached to the second working surface 22 of the Peltier semiconductor 20. It should be noted that when the first working surface 21 of the Peltier semiconductor 20 cools relative to the cylinder 10, the second working surface 22 connected to the cooling member 40 will heat up. Therefore, by using the cooling member 40 to cool, the temperature of the second working surface 22 can be reduced, so as to be able to forcibly dissipate the heat of the second working surface 22 and ensure reliable cooling of the Peltier semiconductor 20. And when the first working surface 21 heats up relative to the cylinder 10, the second working surface 22 will cool. At this time, the cooling member 40 can be selected to be turned off.

[0081] Further, the cooling member 40 is provided with a cooling channel. The cooling member 40 includes: a fluid generator, and the fluid generator is communicated with the cooling channel to convey a cooling fluid into the cooling channel, where the fluid can be a liquid or a gas, and the flowing cooling fluid can quickly take away heat.

[0082] As Figure 7 、 Figure 8 、Figure 12 and Figure 13 As shown in Figure 13 , optionally, the cooling member 40 includes a bottom plate 43 and a cover plate 44. The bottom plate 43 is in contact with the second working surface 22 of the Peltier semiconductor 20. A plurality of inwardly recessed and interconnected cooling channels are provided on the bottom plate 43. By designing the cooling channels to cover the entire bottom plate 43, air flow (or liquid flow) can flow through the entire bottom plate 43. The cover plate 44 covers the bottom plate 43, and the cooling channels are located between the bottom plate 43 and the cover plate 44. To improve the cooling effect, a sealing plane and a heat dissipation plane are respectively provided on the bottom plate 43. The sealing plane cooperates with the cover plate 44 to seal the cooling channels and prevent the air flow (liquid flow) from not flowing along the cooling channels. The heat dissipation plane can be closely attached to the Peltier semiconductor 20 to absorb heat from the Peltier semiconductor 20. An inlet and an outlet can be provided on the cover plate 44. The inlet can be used to install a pipe joint to allow air flow to enter the bottom plate 43 from the inlet, and the outlet can be used to install a pipe joint to allow the air flow in the bottom plate 43 to flow out from the outlet.

[0083] As Figure 14 shown in Figure 14 , according to an embodiment of the present invention, the cooling member 40 includes a plurality of spaced-apart heat dissipation fins 45 and a cooling fan 46 connected to the heat dissipation fins 45. The cooling fan 46 can deliver cooling air flow to the heat dissipation fins 45.

[0084] As Figure 6 and Figure 9 shown in Figure 6 and Figure 9 , in some specific embodiments of the present invention, the accommodation cavity 11 has a first channel 14 and a second channel 15. A glue cylinder 200 is installed in the first channel 14. The second channel 15 is connected to the first channel 14, and the upper end of the second channel 15 is connected to the lower end of the first channel 14. The radial dimension of the second channel 15 is smaller than the radial dimension of the first channel 14. The needle can pass through the second channel 15 and be connected to the glue cylinder 200.

[0085] As Figures 1 to 8 shown in Figures 1 to 8 , further, the automatic temperature-controlled dispensing device 100 further includes a needle conversion joint 50. The needle conversion joint 50 is installed in the second channel 15. The upper end of the needle conversion joint 50 is detachably connected to the glue cylinder 200, and the lower end of the needle conversion joint 50 is detachably connected to the needle. It should be noted that by using the needle conversion joint 50, when connecting the needle to the lower end of the needle conversion joint 50 and replacing the glue cylinder 200, the needle height will not be affected, eliminating the needle height adjustment step caused by replacing the glue cylinder 200.

[0086] According to an embodiment of the present invention, the automatic temperature-controlled dispensing device 100 further includes a positioning component 60, and the positioning component 60 can limit the glue cylinder 200 within the accommodation cavity 11.

[0087] Further, the positioning assembly 60 includes: a pressing block fixing plate 61 and a limiting member 62. The pressing block fixing plate 61 is connected to the cylinder body 10, and the limiting member 62 is connected to the pressing block fixing plate 61 and can limit the positioning state of the rubber cylinder 200 or the rubber cylinder adapter connected to the rubber cylinder 200.

[0088] Optionally, the limiting member 62 includes: a rotating explosion-proof pressing block 621 and a limiting adjusting member 622. One end of the rotating explosion-proof pressing block 621 is hinged to the pressing block fixing plate 61. An opening is provided at the other end of the rotating explosion-proof pressing block 621. The opening position at the other end of the rotating explosion-proof pressing block 621 corresponds to the rubber cylinder 200 or the rubber cylinder adapter. A part of the limiting adjusting member 622 is connected to the rotating explosion-proof pressing block 621, and the other part of the limiting adjusting member 622 abuts against the rubber cylinder 200 or the rubber cylinder adapter and can press the rubber cylinder 200 tightly.

[0089] Further, an installation hole extending in the direction of the cylinder body 10 is provided at the other end of the rotating explosion-proof pressing block 621. The limiting adjusting member 622 includes: an adjusting screw 6221 and a limiting nut 6222. The adjusting screw 6221 is arranged in the installation hole and can move along its axial direction. The limiting nut 6222 is threadedly connected to the adjusting screw 6221 to limit the relative position between the adjusting screw 6221 and the rubber cylinder 200.

[0090] Optionally, the positioning assembly 60 further includes a positioning member 63. The positioning member 63 is respectively connected to the pressing block fixing plate 61 and one end of the rotating explosion-proof pressing block 621 to limit the relative position between the rotating explosion-proof pressing block 621 and the pressing block fixing plate 61.

[0091] According to an embodiment of the present invention, the accommodating cavity 11 extends in the up and down direction, the pressing block fixing plate 61 extends in the up and down direction, a first positioning hole 611 extending in the horizontal direction is provided on the pressing block fixing plate 61, and the rotating explosion-proof pressing block 621 is formed in an L shape. As Figure 18 shown, the rotating explosion-proof pressing block 621 includes: a long limb 6211 and a short limb 6212. One end of the long limb 6211 is connected to the adjusting screw 6221. One end of the short limb 6212 is connected to the other end of the long limb 6211 and is hinged to the upper end of the pressing block fixing plate 61. The other end of the short limb 6212 can rotate around one end of the short limb 6212, and a second positioning hole 6213 is provided at the other end of the short limb 6212.

[0092] As Figure 16 shown, in some specific embodiments of the present invention, the positioning member 63 includes: a positioning shaft 631 and a positioning portion 632. One end of the positioning shaft 631 can pass through the second positioning hole 6213 and be inserted into the first positioning hole 611 when the other end of the short limb 6212 rotates to the second positioning hole 6213 is opposite to and communicated with the second positioning hole 6213. The positioning portion 632 is arranged at the other end of the positioning shaft 631 and is located on one side of the pressing block fixing plate 61. AsFigure 23 As shown, the positioning portion 632 is formed as a "C"-shaped member with an opening facing the pressure block fixing plate 61. The distance between the two free ends of the positioning portion 632 is greater than the thickness of the edge of the pressure block fixing plate 61 adjacent to the direction where the positioning portion 632 is located, which can limit the rotation of the rotary explosion-proof pressure block 621.

[0093] As Figure 19 and Figure 20 shown, further, a first limiting surface 6214 is provided at one end of the second positioning hole 6213 adjacent to the positioning portion 632, and a second limiting surface 6311 spaced apart from the first limiting surface 6214 is provided on the outer peripheral surface of one end of the positioning shaft 631. The positioning member 63 further includes an elastic member 633, and the elastic member 633 is disposed in the second positioning hole 6213 and located between the first limiting surface 6214 and the second limiting surface 6311. The elastic member 633 can be formed as a spring, which has a wide source and a low price. The positioning member 63 can also be formed as a pull-out pin structure, a cylindrical pin structure, a bolt structure, etc.

[0094] The assembly process and assembly features of the automatic temperature-controlled dispensing device 100 according to the embodiments of the present invention will be specifically described below.

[0095] (1) One side of the cylinder body 10 can be a plane, and the plane can be closely attached to the first working surface 21 of the Peltier semiconductor 20. The cylinder body 10 can absorb or release heat from the first working surface 21. The side of the cylinder body 10 away from the Peltier semiconductor 20 has a receiving cavity 11, and a glue cylinder 200 with a suitable volume can be closely embedded in the receiving cavity 11.

[0096] (2) An observation window 13 is reserved at the lower part of the cylinder body 10. The observation window 13 can be opened to the arc area at the bottom of the cylinder body 10, and the position of the piston in the glue cylinder 200 can be directly observed, so as to judge the remaining amount of the glue.

[0097] (3) A needle head adapter 50 can be fixed in the second channel 15 of the receiving cavity 11. The needle head adapter 50 and the cylinder body 10 can be fastened by threaded connection, or can be connected and fastened by means of a bayonet, etc. According to different types of needles, different needle head adapters 50 can be replaced, so as to realize the adaptation of the cylinder body 10 to different types of needles.

[0098] (4) A temperature detector 30 is installed on the cylinder body 10. The temperature detector 30 can be a temperature sensor, and the temperature detector 30 can be closely attached to the cylinder body 10 to ensure the accuracy of real-time temperature measurement.

[0099] (5) The bottom plate 43 and the cover plate 44 are sealed to ensure that the cooling channel is in a sealed state, so that the air flow (liquid flow) can completely flow along the trend of the cooling channel.

[0100] (6) Fix the pipe joint on the inlets and outlets of the cover plate 44. After assembling the cooling member 40, press the bottom plate 43 tightly against the second working surface 22, and then assemble the cooling member 40 and the cylinder 10.

[0101] (7) Hinge one end of the rotary explosion-proof pressing block 621 to the pressing block fixing plate 61. Specifically, the boss provided on the pressing block fixing plate 61 can be inserted into the groove at one end of the rotary explosion-proof pressing block 621, and a dowel pin is used to connect the two.

[0102] (8) Install the spring (elastic member 633) into the second positioning hole 6213, then pass the positioning shaft 631 through the inner hole of the spring, and lock the positions of the rotary explosion-proof pressing block 621 and the pressing block fixing plate 61 through the positioning portion 632.

[0103] (9) Install the limit nut 6222 on the adjusting screw 6221, and then install the adjusting screw 6221 and the limit nut 6222 together on the rotary explosion-proof pressing block 621.

[0104] In summary, the automatic temperature-controlled dispensing device 100 according to the embodiment of the present invention combines the cylinder 10, the Peltier semiconductor 20, the controller, and the temperature detector 30. When the temperature of the cylinder 10 is higher than the set temperature, the Peltier semiconductor 20 is positively powered to cool the cylinder 10. If the cylinder temperature is lower than the set temperature, the Peltier semiconductor 20 is reversely powered to heat the cylinder 10. Moreover, a needle adapter 50 is installed in the second channel 15, and there is no need to recalibrate the needle height when replacing the cartridge 200. And, a positioning assembly 60 is provided at the top of the accommodation cavity 11, which can quickly clamp and release the cartridge 200, and can further improve the efficiency of replacing the cartridge 200 and save working hours.

[0105] In the description of this specification, the descriptions referring to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0106] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An automatic temperature-controlled dispensing device, characterized in that, include: A cylinder body, wherein a receiving cavity is defined in the cylinder body, and a rubber cylinder can be installed in the receiving cavity; A Peltier semiconductor, wherein the Peltier semiconductor is connected to the cylinder; A controller, the controller being electrically connected to the Peltier semiconductor, the controller being capable of switching a current direction of the Peltier semiconductor; A temperature detector, the temperature detector is connected to the cylinder and the controller respectively; The Peltier semiconductor has a first working surface and a second working surface arranged opposite to each other, and the first working surface is in contact with at least a portion of the cylinder; A positioning assembly, wherein the positioning assembly can restrict the rubber cartridge within the accommodating cavity; The positioning component comprises: A pressing block fixing plate, the pressing block fixing plate is connected to the cylinder; A limiting member, the limiting member is connected to the pressing block fixing plate and can limit the positioning state of the rubber cylinder or a rubber cylinder adapter connected to the rubber cylinder; The limiting member comprises: A rotating explosion-proof pressure block, one end of which is hinged to the pressure block fixing plate, and the other end of which is provided with an opening, the opening position of which corresponds to the rubber cartridge or the rubber cartridge adapter; A limit adjustment member, a portion of which is connected to the rotary explosion-proof pressure block, and another portion of which is abutted against the rubber cartridge or the rubber cartridge adapter; The other end of the rotating explosion-proof pressure block is provided with a mounting hole extending in the direction of the cylinder, and the limit adjustment member comprises: An adjusting screw, the adjusting screw being arranged in the mounting hole and being movable along the axial direction thereof; A limiting nut, the limiting nut being threadably connected to the adjusting screw to limit the relative position of the adjusting screw and the rubber cylinder; The positioning component also includes: A positioning member, the positioning member is respectively connected to the pressure block fixing plate and one end of the rotary explosion-proof pressure block to limit the relative position of the rotary explosion-proof pressure block and the pressure block fixing plate; The accommodating cavity extends in the up-down direction, the pressure block fixing plate extends in the up-down direction, the pressure block fixing plate is provided with a first positioning hole extending in the horizontal direction, the rotating explosion-proof pressure block is formed in an L shape, and the rotating explosion-proof pressure block includes: A long limb, one end of which is connected to the adjusting screw; A short limb, one end of which is connected to the other end of the long limb and is hinged to the upper end of the pressing block fixing plate, the other end of which can rotate around the one end of the short limb, and the other end of which is provided with a second positioning hole; The positioning member comprises: A positioning shaft, one end of which is rotated to the second positioning hole at the other end of the short limb so that the second positioning hole is arranged opposite to the second positioning hole and is connected to each other so that the second positioning hole can pass through the second positioning hole and be inserted into the first positioning hole; A positioning portion is arranged at the other end of the positioning shaft and is located on one side of the pressure block fixing plate. The positioning portion is formed as a "匚"-shaped piece with an opening toward the pressure block fixing plate. The spacing between the two free ends of the positioning portion is greater than the thickness of the edge of the pressure block fixing plate adjacent to the direction where the positioning portion is located.

2. The automatic temperature-controlled dispensing device according to claim 1, characterized in that, The cylinder is provided with: An installation groove, the installation groove is spaced apart from and oppositely arranged with the accommodating cavity, and the temperature detector is installed in the installation groove.

3. The automatic temperature-controlled dispensing device according to claim 1, characterized in that, The cylinder body is provided with: An observation window, the observation window communicates with the accommodating cavity to observe the remaining amount of the adhesive liquid in the rubber cylinder through the observation window.

4. The automatic temperature-controlled dispensing device according to claim 1, characterized in that, It further includes: A cooling member, the cooling member is connected to the second working surface of the Peltier semiconductor.

5. The automatic temperature-controlled dispensing device according to claim 4, characterized in that, A cooling channel is provided in the cooling member, and the cooling member includes: A fluid generator, the fluid generator communicates with the cooling channel to convey cooling fluid into the cooling channel.

6. The automatic temperature-controlled dispensing device according to claim 5, characterized in that, The cooling member includes: A bottom plate, the bottom plate contacts the second working surface of the Peltier semiconductor, and a plurality of inwardly recessed and interconnected cooling channels are provided on the bottom plate; A cover plate, the cover plate covers the bottom plate, and the cooling channel is located between the bottom plate and the cover plate.

7. The automatic temperature-controlled dispensing device according to claim 4, wherein, The cooling member includes a plurality of spaced-apart heat dissipation fins and a cooling fan connected to the heat dissipation fins.

8. The automatic temperature-controlled dispensing device according to claim 1, wherein The accommodating cavity has: A first channel, the rubber cylinder is installed in the first channel; A second channel, the second channel is connected to the first channel, and the upper end of the second channel is connected to the lower end of the first channel, and the radial dimension of the second channel is smaller than the radial dimension of the first channel.

9. The automatic temperature-controlled dispensing device according to claim 8, wherein It further includes: A needle adapter, the needle adapter is installed in the second channel, the upper end of the needle adapter is detachably connected to the rubber cylinder, and the lower end of the needle adapter is detachably connected to the needle.

10. The automatic temperature-controlled dispensing device according to claim 1, characterized in that, A first limiting surface is provided at one end of the second positioning hole adjacent to the positioning portion, and a second limiting surface spaced apart from the first limiting surface is provided on the outer peripheral surface of one end of the positioning shaft. The positioning member further includes: An elastic member, the elastic member is provided in the second positioning hole and is located between the first limiting surface and the second limiting surface.

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