Special dispensing needle and dispensing method for a quartz crystal resonator

Abstract

The present invention relates to a special dispensing needle and a dispensing method for a quartz crystal resonator, which includes a glue inlet head and a dispensing head connected to the glue inlet head. The structure of the dispensing head is as follows: it includes two circular needle tubes arranged parallel and close to each other, and the two circular needle tubes form a dispensing glue channel with a gourd-shaped cross-section. The dispensing method of the present invention utilizes two gourd-shaped glue dots to ensure that silver glue can cover two adjacent corners of the wafer, thereby enhancing the adhesion between the wafer and the ceramic bottom box. Even when used for low-frequency products or customers with special external force processes, the dispensing method of the present invention can effectively avoid problems such as glue cracking or chip dropping. Compared with the traditional dispensing process, the present invention redesigned the shape of the dispensing needle head and adopted a special four-point dispensing method, which can achieve the anti-external force effect of the traditional five / six-point dispensing, improve the production efficiency of the dispensing and wafer loading process, and at the same time improve the performance of the finished product impedance value.

Description

Technical Field

[0001] The present invention relates to the technical field of dispensing technology for quartz crystal resonators, in particular to a special dispensing needle and a dispensing method for quartz crystal resonators. Background Art

[0002] In the prior art, the bonding process of wafers and ceramic bottom cases used in the crystal resonator industry is as follows: First, silver paste is dispensed on the conductive bosses of the ceramic bottom case, then the wafer is planted on the silver paste, and then silver paste is dispensed on the upper layer of the wafer to make the upper and lower paste dots coincide as much as possible to wrap the wafer (commonly known as the 4-dispensing method), and then the paste curing operation is carried out, thus completing the bonding of the wafer and the ceramic bottom case.

[0003] If the low-frequency products in the above-mentioned method are used with special processes such as ultrasonic waves or dropping at the client side, the wafer and the ceramic bottom case will show the conditions of the paste peeling off from the bottom case or the wafer peeling off from the paste, which we commonly call the "wafer dropping" or "paste cracking" phenomenon; at this time, a lower dispensing dot will be dispensed on the support boss under the right wafer to support the wafer (commonly known as the 5-dispensing method); or two paste dots will be dispensed on the ceramic bottom case under the right wafer to support the wafer (commonly known as the 6-dispensing method)). The purpose of doing this is to prevent the abnormal wafer dropping of the product under the action of external force.

[0004] If the above 4-dispensing method has poor edge wrapping effect of the upper and lower paste dots due to the decrease in the mechanism accuracy during the production process of the machine, the paste cracking condition will occur, and in severe cases, the "wafer dropping" phenomenon will occur, ultimately resulting in abnormal electrical testing of the finished product. When encountering low-frequency products or when the client uses special processes such as ultrasonic waves or dropping, the wafer and the ceramic bottom case will show the conditions of the paste peeling off from the bottom case or the wafer peeling off from the paste; although the above 5-dispensing method and 6-dispensing method can prevent the wafer from "wafer dropping" or "paste cracking", the 5-dispensing method and 6-dispensing method will increase the impedance value of the finished crystal oscillator, resulting in a decrease in production yield, and in severe cases, it will affect the matching use effect of the client; and the 5-dispensing and 6-dispensing methods will reduce the production capacity of the dispensing and loading station by half, and the production cost is relatively large. Summary of the Invention

[0005] The applicant of the present invention aims at the above-mentioned disadvantages in the existing production technology, and provides a special dispensing needle and a dispensing method for quartz crystal resonators, thereby solving the phenomenon that the edge wrapping effect of the upper and lower paste dots of the 4-dispensing product is not good due to the dispensing mechanism accuracy problem, and improving the test yield. Solved the risk of wafer dropping or "paste cracking" of the low-frequency 4-dispensing product when the client uses special processes such as ultrasonic waves or dropping. Solved the problem of poor production efficiency of the dispensing and loading station in the production process due to the large number of dispensing times for the low-frequency 5-dispensing / 6-dispensing products. Solved the problem of the large impedance value of the finished product caused by the low-frequency 5-dispensing / 6-dispensing products.

[0006] The technical solution adopted by the present invention is as follows:

[0007] A special dispensing needle for a quartz crystal resonator, comprising a glue inlet head and a dispensing head connected to the glue inlet head. The structure of the dispensing head is as follows: it includes two circular needle tubes arranged parallel and close to each other, and the two circular needle tubes form a dispensing glue channel with a gourd-shaped cross-section.

[0008] The inner diameters of the two circular needle tubes are M and N respectively, where N < M, and 0.1mm ≤ M ≤ 0.25mm, 0.08mm ≤ N ≤ 0.2mm.

[0009] A special dispensing method for a quartz crystal resonator, comprising the following process:

[0010] Loading operation: The mechanical gripper grabs the raw material bottom box and places it at the lower dispensing position on the rotating bearing vacuum platform. The upper surface of the platform is sequentially provided with a bottom box feeding position, a lower dispensing position, a wafer feeding position, an upper dispensing position, a CCD identification and discharging position in the counterclockwise direction. There is a defective product throwing box at the center position of the platform; the mechanical gripper first grabs the raw material bottom box and places it at the bottom box feeding position of the rotating bearing vacuum platform, and the platform rotates counterclockwise by 90 degrees to place the raw material bottom box at the lower dispensing position;

[0011] Lower layer dispensing operation: At both ends of one side of the raw material bottom box, there are respectively an A conductive boss and a B conductive boss. The glue moving mechanism moves the dispensing head downward along the dispensing axis Z to the A conductive boss. When the infrared detection reaches a certain height, a signal is triggered to the dispensing controller, and the dispensing controller controls the dispensing of a gourd-shaped A lower glue point through the control of dispensing pressure, speed, and time;

[0012] The dispensing moving mechanism moves the dispensing head along the dispensing axis X to the B conductive boss, drives the dispensing needle to rotate clockwise by 90° angle, moves the dispensing head downward along the dispensing axis Z to the B conductive boss, and the dispensing controller controls the dispensing of the B lower glue point through the control of dispensing pressure, speed, and time;

[0013] Wafer placing operation: The platform rotates counterclockwise by 60 degrees and is placed at the wafer feeding position; the gripper grabs the wafer and places it on the A lower glue point and the B lower glue point;

[0014] Upper layer dispensing operation: The platform rotates counterclockwise by 60 degrees and is placed at the upper dispensing position; the dispensing moving mechanism moves the dispensing head downward along the dispensing axis Z to the A conductive boss. When the infrared detection reaches a certain height, a signal is triggered to the dispensing controller, and the dispensing controller controls the dispensing of the A upper glue point through the control of dispensing pressure, speed, and time; the dispensing moving mechanism moves the dispensing head along the dispensing axis X to the B conductive boss, and the dispensing mechanism drives the glue needle to rotate clockwise by 90° angle; the dispensing moving mechanism moves the dispensing head downward along the dispensing axis Z to the B conductive boss, and the dispensing controller controls the dispensing of the B upper glue point through the control of dispensing pressure, speed, and time;

[0015] CCD Detection: The platform rotates counterclockwise by 60 degrees and is placed at the CCD identification and discharging position for glue dot size and angle identification. Electron-optical image identification and comparison are carried out, comparing with the glue dispensing template saved on the parent body. Score comparison is made for the glue dot size and angle. Those with a score greater than the target score pass, while those with a score less than the target score are grasped and thrown into the defective product discharge box.

[0016] The beneficial effects of the present invention are as follows:

[0017] The inner diameters of the two circular needle tubes of the glue dispensing needle of the present invention are both smaller than the inner diameter of the old glue dispensing needle tube, which can effectively prevent the problem of increased impedance of the finished product caused by the increased contact area of the glue dot. The glue dispensing method of the present invention uses two gourd-shaped glue dots to ensure that silver glue can be wrapped around two adjacent corners of the wafer, enhancing the adhesion between the wafer and the ceramic (raw material) bottom box.

[0018] Using the new glue dispensing method of the present invention can effectively avoid the problems of glue cracking or chip dropping even when dealing with low-frequency products or customers with special external force processes. Compared with the traditional glue dispensing process, the present invention redesigned the shape of the glue dispensing needle head. Using the special 4-glue dispensing method of the present invention can achieve the anti-external force effect of the traditional 5 / 6 glue dispensing, improve the production efficiency of the glue dispensing and wafer loading process, and at the same time improve the impedance value performance of the finished product. Description of the Drawings

[0019] Figure 1 It is the front view of the glue dispensing needle of the present invention.

[0020] Figure 2 It is the side view of the glue dispensing needle of the present invention.

[0021] Figure 3 It is the structural schematic diagram of the rotating bearing vacuum platform used during glue dispensing of the present invention.

[0022] Figure 4 It is the structural schematic diagram of the product after the lower layer glue dispensing operation during glue dispensing of the present invention.

[0023] Figure 5 It is the structural schematic diagram of the product after the wafer placing operation during glue dispensing of the present invention.

[0024] Figure 6 It is the structural schematic diagram of the product after the upper layer glue dispensing operation during glue dispensing of the present invention.

[0025] Wherein: 1. Glue inlet head; 2. Circular needle tube; 3. A conductive boss; 4. B conductive boss; 5. A lower glue dot; 6. B lower glue dot; 7. Raw material bottom box; 8. Wafer; 9. A upper glue dot; 10. B upper glue dot; 11. Electrode; 12. Support boss. Detailed Embodiment

[0026] The following will describe the specific implementation manners of the present invention in conjunction with the accompanying drawings.

[0027] As Figure 1 and Figure 2 shown, the special dispensing needle of the quartz crystal resonator in this embodiment includes a glue inlet head 1 and a dispensing head connected to the glue inlet head 1. The structure of the dispensing head is as follows: it includes two circular needle tubes 2 arranged parallel and close to each other, and the two circular needle tubes 2 form a dispensing glue channel with a gourd-shaped cross-section.

[0028] The inner diameters of the two circular needle tubes 2 are M and N respectively, where N < M, and 0.1 mm ≤ M ≤ 0.25 mm, 0.08 mm ≤ N ≤ 0.2 mm.

[0029] As Figures 3 - 6 shown, the special dispensing method of the quartz crystal resonator in this embodiment includes the following processes:

[0030] Loading operation: The mechanical gripper first grabs the raw material bottom box 7 and places it at the lower dispensing position on the rotating carrying vacuum platform. As Figure 3 shown, the upper surface of the platform is sequentially provided with a bottom box feeding position, a lower dispensing position, a wafer feeding position, an upper dispensing position, a CCD identification and discharging position in the counterclockwise direction. There is a defective product throwing box at the center position of the platform; the mechanical gripper first grabs the raw material bottom box 7 and places it at the bottom box feeding position of the rotating carrying vacuum platform, and the platform rotates counterclockwise by 90 degrees to place the raw material bottom box 7 at the lower dispensing position;

[0031] Lower layer dispensing operation: As Figure 4 shown, at both ends of one side of the raw material bottom box 7, there are respectively an A conductive boss 3 and a B conductive boss 4. The glue moving mechanism moves the dispensing head downward along the dispensing axis Z to the A conductive boss 3. When the infrared detection reaches a certain height, a signal is triggered to the dispensing controller, and the dispensing controller controls the dispensing pressure, speed, and time to dispense a gourd-shaped A lower glue dot 5;

[0032] The dispensing moving mechanism moves the dispensing head along the dispensing axis X to the B conductive boss 4, drives the dispensing needle to rotate clockwise by 90° angle, and moves the dispensing head downward along the dispensing axis Z to the B conductive boss 4. The dispensing controller controls the dispensing pressure, speed, and time to dispense a B lower glue dot 6;

[0033] Chip placing operation: As Figure 3 、 Figure 5 shown, the platform rotates counterclockwise by 60 degrees and is placed at the wafer feeding position; the gripper grabs the wafer 8 and places it on the A lower glue dot 5 and the B lower glue dot 6; in the figure, a layer of medium (shown in the hatched area) attached to the wafer 8 is the electrode 11;

[0034] Upper layer dispensing operation: As Figure 3 、 Figure 6As shown in the figure, the platform rotates counterclockwise by 60 degrees and is placed at the upper dispensing position. The dispensing moving mechanism moves the dispensing head downward along the dispensing axis Z to point A of the conductive boss 3. When the infrared detection reaches a certain height, a signal is triggered to the dispensing controller. The dispensing controller controls the dispensing of the glue point A 9 through the control of dispensing pressure, speed, and time. The dispensing moving mechanism moves the dispensing head along the dispensing axis X to point B of the conductive boss 4, and the dispensing mechanism drives the glue needle to rotate clockwise by 90°. The dispensing moving mechanism moves the dispensing head downward along the dispensing axis Z to point B of the conductive boss 4, and the dispensing controller controls the dispensing of the glue point B 10 through the control of dispensing pressure, speed, and time.

[0035] CCD detection: As Figure 3 shown in the figure, the platform rotates counterclockwise by 60 degrees and is placed at the CCD identification and discharging position for the identification of the size and angle of the glue point. Electronic optical image identification and comparison are carried out. The glue point template saved on the parent body is compared, and the scores of the glue point size and angle are compared. Those greater than the target score pass, and those less than the target score are grabbed and thrown into the defective product discharge box.

[0036] In the dispensing process of the present invention, it is necessary to design a special dispensing needle structure and adjust the angle control of the dispensing needle. Since the dispensing head of the present invention is composed of two circular needle tubes and the cross-section is in a gourd shape structure, when installing the glue needle on the dispensing mechanism, the center line of the glue needle needs to form a 45° angle with the edge in the width direction of the raw material bottom box, as Figure 4 shown in the figure. And because the dispensing end of the traditional dispensing needle is a single circular tube, angle control is not required. The inner diameter of the traditional glue needle is usually 0.15 mm to 0.3 mm. The inner diameters of the two circular needle tubes of the dispensing needle of the present invention are both smaller than the inner diameter of the old glue needle tube, which can effectively prevent the problem of increased impedance of the finished product caused by the increase in the contact area of the glue point.

[0037] The dispensing method of the present invention uses two gourd-shaped glue points to ensure that both adjacent corners of the wafer can be coated with silver glue, which can enhance the adhesion between the wafer and the ceramic bottom box. Using the new dispensing method of the present invention can effectively avoid the problems of glue cracking or chip dropping even when used for low-frequency products or customers with special external force processes. Compared with the traditional dispensing process, the present invention redesigned the shape of the dispensing needle head and used a new special 4-dispensing method, which can achieve the anti-external force effect of 5 / 6 dispensing, improve the production efficiency of the dispensing and wafer loading process, and improve the performance of the finished product impedance value compared with the 5 / 6 dispensing using the new special 4-dispensing method.

[0038] The design principle of the dispensing product of the present invention:

[0039] The wafer 8 is the main component for the oscillation of the quartz crystal resonator. The electrode 11 is a layer of dielectric (usually silver or gold) attached to the wafer 8, and its area and thickness determine the different frequencies of the crystal. The silver paste dispensed by the dispensing needle not only fixes the wafer 8 but also conducts signals through the electrode 11 on the wafer 8 and the raw material bottom box 7 (ceramic bottom box). The conductive boss facilitates the image position determination and grasping by the dispensing machine for precise dispensing on the one hand, and conducts signals among the electrode 11, the silver paste, and the ceramic bottom box on the other hand.

[0040] The raw material bottom box 7 is also provided with a support boss 12, which only plays a role in supporting the fifth glue point to hold up the wafer in the case of the 5 - point dispensing method; the ceramic bottom box mainly functions in external signal conduction, protecting the internal structure of the product, and supporting the internal silver paste and the wafer.

[0041] The above description is an explanation of the present invention, not a limitation of the invention. The scope defined by the present invention can be seen in the claims, and within the protection scope of the present invention, any form of modification can be made.

Claims

1. A special dispensing method for a quartz crystal resonator, using a special dispensing needle, characterized in that: The special dispensing needle includes a glue inlet head (1) and a dispensing head connected to the glue inlet head (1). The structure of the dispensing head is as follows: it includes two circular needle tubes (2) arranged closely in parallel. The two circular needle tubes (2) form a dispensing glue channel with a calabash-shaped cross-section. The inner diameters of the two circular needle tubes (2) are M and N respectively, where N < M, and 0.1mm ≤ M ≤ 0.25mm, 0.08mm ≤ N ≤ 0.2mm. Ensure that the center line of the dispensing needle forms a 45° angle with the edge in the width direction of the raw material bottom box (7). During dispensing, the following process is included: Loading operation: The mechanical gripper first grabs the raw material bottom box (7) and places it at the lower dispensing position on the rotating and bearing vacuum platform. The upper surface of the platform is sequentially provided with a bottom box feeding position, a lower dispensing position, a wafer feeding position, an upper dispensing position, a CCD recognition and discharging position in the counterclockwise direction. There is a defective product throwing box at the center position of the platform. The mechanical gripper first grabs the raw material bottom box (7) and places it at the bottom box feeding position of the rotating and bearing vacuum platform. The platform rotates counterclockwise by 90 degrees and places the raw material bottom box (7) at the lower dispensing position. Lower layer dispensing operation: At both ends of one side of the raw material bottom box (7), there are respectively an A conductive boss (3) and a B conductive boss (4). The glue moving mechanism moves the dispensing head downward along the dispensing axis Z to the A conductive boss (3). Infrared detection reaches a certain height and triggers a signal to the dispensing controller. The dispensing controller controls the dispensing of a calabash-shaped A lower glue point (5) through the control of dispensing pressure, speed, and time. The dispensing moving mechanism moves the dispensing head along the dispensing axis X to the B conductive boss (4), drives the dispensing needle to rotate clockwise by 90º, moves the dispensing head downward along the dispensing axis Z to the B conductive boss (4), and the dispensing controller controls the dispensing of a B lower glue point (6) through the control of dispensing pressure, speed, and time. Wafer placing operation: The platform rotates counterclockwise by 60 degrees and is placed at the wafer feeding position. The gripper grabs the wafer (8) and places it on the A lower glue point (5) and the B lower glue point (6). Upper layer dispensing operation: The platform rotates counterclockwise by 60 degrees and is placed at the upper dispensing position. The dispensing moving mechanism moves the dispensing head downward along the dispensing axis Z to the A conductive boss (3). Infrared detection reaches a certain height and triggers a signal to the dispensing controller. The dispensing controller controls the dispensing of an A upper glue point (9) through the control of dispensing pressure, speed, and time. The dispensing moving mechanism moves the dispensing head along the dispensing axis X to the B conductive boss (4), and the dispensing mechanism drives the glue needle to rotate clockwise by 90º. The dispensing moving mechanism moves the dispensing head downward along the dispensing axis Z to the B conductive boss (4), and the dispensing controller controls the dispensing of a B upper glue point (10) through the control of dispensing pressure, speed, and time. CCD detection: The platform rotates counterclockwise by 60 degrees and is placed at the CCD recognition and discharging position for the recognition of the size and angle of the glue points. Electronic optical image recognition and comparison are carried out. The glue point template saved on the parent body is compared. The size and angle of the glue points are scored and compared. Those greater than the target score pass, and those less than the target score are grabbed and thrown into the defective product throwing box.

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