Antenna module of wireless communication system and electronic device including the antenna module

Abstract

The present disclosure relates to an antenna module for a wireless communication system that integrates a fifth generation (5G) communication system for supporting a higher data rate than a fourth generation (4G) system with an Internet of Things (IoT) technology and an electronic device including the antenna module. The present disclosure can be applied to smart services based on 5G communication technology and IoT-related technologies, such as smart homes, smart buildings, smart cities, smart cars, connected cars, health care, digital education, smart retail, security and safety services. The antenna module includes: a flexible printed circuit board, which includes a first surface oriented in a first direction and a second surface oriented in a second direction, the second direction forming a predetermined first angle relative to the first direction; a first antenna, the first antenna being disposed on one surface of the first surface; and a second antenna, the second antenna being disposed on one surface of the second surface.

Description

Technical Field

[0001] The present disclosure relates to an antenna module of a wireless communication system and an electronic device including the antenna module. Background Art

[0002] In order to meet the demand for wireless data services that have increased since the deployment of the fourth generation (4G) communication system, efforts have been made to develop an improved fifth generation (5G) or quasi-5G communication system. Therefore, 5G or pre-5G communication systems are also referred to as "beyond the fourth generation (4G) network" or "post-long term evolution (LTE) system". 5G communication systems are considered to be implemented in higher frequency (mmWave) bands (e.g., 60GHz bands) in order to achieve higher data rates. In order to reduce the propagation loss of radio waves and increase the transmission distance, beamforming, massive multiple input multiple output (MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, and massive antenna technology are discussed in 5G communication systems. In addition, in 5G communication systems, development of system network improvements is being carried out based on advanced small cells, cloud radio access networks (RAN), ultra-dense networks, device-to-device (D2D) communications, wireless backhaul, mobile networks, collaborative communications, coordinated multi-point (CoMP), receiving-end interference elimination, etc. In the 5G system, hybrid frequency shift keying (FSK) and quadrature amplitude modulation (QAM) (FQAM) and sliding window superposition coding (SWSC) have been developed as advanced coding modulation (ACM), and filter bank multi-carrier (FBMC), non-orthogonal multiple access (NOMA) and sparse code multiple access (SCMA) as advanced access technologies.

[0003] The Internet, which is a human-centered connection network where humans generate and consume information, is now evolving into the Internet of Things (IoT), in which distributed entities (such as things) exchange and process information without human intervention. The Internet of Everything (IoE), which is a combination of Internet of Things technology and big data processing technology connected to a cloud server, has emerged. As IoT implementation methods have required technical elements such as "sensing technology", "wired / wireless communication and network infrastructure", "service interface technology" and "security technology", sensor networks, machine-to-machine (M2M) communication, machine type communication (MTC), etc. have been studied recently. Such an IoT environment can provide intelligent Internet technology services that create new value for human life by collecting and analyzing data generated between connected things. Through the integration and combination between existing information technology (IT) and various industrial applications, IoT can be applied to various fields, including smart homes, smart buildings, smart cities, smart cars or connected cars, smart grids, health care, smart home appliances and advanced medical services.

[0004] In this regard, various attempts have been made to apply 5G communication systems to IoT networks. For example, technologies such as sensor networks, MTC, and M2M communications can be implemented through beamforming, MIMO, and array antennas. Cloud RAN as an application of the above-mentioned big data processing technology can also be considered an example of the fusion between 5G technology and IoT technology.

[0005] The above information is presented as background information only to assist with an understanding of the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with respect to the present disclosure. Summary of the invention

[0006] Aspects of the present disclosure are to solve at least the above-mentioned problems and / or disadvantages and provide at least the advantages described below. Therefore, one aspect of the present disclosure is to provide a structure for efficiently deploying antennas in a limited space inside an electronic device.

[0007] In 5G mobile communication systems, beamforming technology can be used to reduce the path loss of radio waves in high-frequency bands and increase the transmission distance of radio waves. At the same time, in order to form beams in various directions, the number of antennas deployed inside electronic devices should be increased.

[0008] Further, various structures (eg, metal) may be included inside the electronic device that may degrade radio waves. Therefore, in order to form beams in various directions in the electronic device, it is necessary to deploy antennas in multiple locations inside the electronic device.

[0009] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments.

[0010] According to one aspect of the present disclosure, an antenna module is provided. The antenna module includes: a flexible printed circuit board (FPCB), the flexible printed circuit board including a first surface oriented in a first direction and a second surface oriented in a second direction, the second direction forming a predetermined first angle relative to the first direction; a first antenna, the first antenna is disposed on one surface of the first surface and is configured to form a first radiation area in a third direction; and a second antenna, the second antenna is disposed on one surface of the second surface and is configured to form a second radiation area in a fourth direction.

[0011] According to another aspect of the present disclosure, an electronic device is provided. The electronic device includes: a front member, the front member is oriented in a first direction; a rear member, the rear member is oriented in a second direction opposite to the first direction; a side member, the side member surrounds the space between the front member and the rear member; and an antenna module, the antenna module is disposed in a closed space formed by the front member, the rear member and the side member, wherein the antenna module includes: a flexible printed circuit board (FPCB), the flexible printed circuit board includes a first surface facing the front member and a second surface facing the side member; a first antenna, the first antenna is disposed on one surface of the first surface and is configured to form a first radiation area in a third direction; and a second antenna, the second antenna is disposed on one surface of the second surface and is configured to form a second radiation area in a fourth direction.

[0012] According to another aspect of the present disclosure, an antenna module is provided. The antenna module includes: a flexible printed circuit board (FPCB), the flexible printed circuit board including a first surface oriented in a first direction and a second surface oriented in a second direction, the second direction forming a predetermined first angle relative to the first direction; a first antenna, the first antenna is disposed on one surface of the first surface and is configured to form a first radiation area in a third direction; a second antenna, the second antenna is disposed on one surface of the second surface and is configured to form a second radiation area in a fourth direction; a wireless communication chip, the wireless communication chip is disposed on another surface of the flexible printed circuit board and is configured to supply a radio frequency signal to the first antenna and the second antenna; and a modem, the modem is configured to send a baseband signal to the wireless communication chip, wherein the modem is configured to send a control signal for beamforming to the wireless communication chip, and the wireless communication chip is configured to send a radio frequency signal to the first antenna and the second antenna based on the control signal.

[0013] Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and other aspects, features and advantages of certain embodiments of the present disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0015] Figure 1 is a diagram illustrating a structure of an antenna module according to an embodiment of the present disclosure;

[0016] Figure 2is a diagram illustrating an antenna module deployed within an electronic device according to an embodiment of the present disclosure;

[0017] Figure 3 is a diagram illustrating a structure of an antenna module in which an antenna is disposed on a flexible printed circuit board according to an embodiment of the present disclosure;

[0018] Figure 4A is a diagram illustrating a side cross-section of an antenna module in which an antenna and a feed pad are disposed on a flexible printed circuit board according to an embodiment of the present disclosure;

[0019] Figure 4B is a diagram illustrating a structure of an antenna module in which an antenna is disposed on a first surface and a second surface of a flexible printed circuit board according to an embodiment of the present disclosure;

[0020] Figure 5A is a diagram illustrating a structure of an antenna module including a flexible printed circuit board, a printed circuit board, and a wireless communication chip according to an embodiment of the present disclosure;

[0021] Figure 5B is a diagram illustrating a structure of an antenna module including a flexible printed circuit board, a printed circuit board, and a wireless communication chip according to an embodiment of the present disclosure;

[0022] Figure 5C is a diagram illustrating a structure of an antenna module including a flexible printed circuit board, a printed circuit board, and a wireless communication chip according to an embodiment of the present disclosure;

[0023] Figure 5D is a diagram illustrating a structure of an antenna module including a flexible printed circuit board and a wireless communication chip according to an embodiment of the present disclosure;

[0024] Fig. 6A is a diagram illustrating a structure of an antenna module including a flexible printed circuit board, a printed circuit board, a wireless communication chip, and a thin film layer according to an embodiment of the present disclosure;

[0025] Figure 6B is a diagram illustrating a structure of an antenna module including a flexible printed circuit board, a printed circuit board, a wireless communication chip, and a thin film layer according to an embodiment of the present disclosure;

[0026] Figure 6C is a diagram illustrating a structure of an antenna module including a flexible printed circuit board, a printed circuit board, a wireless communication chip, and a thin film layer according to an embodiment of the present disclosure;

[0027] Fig.6D is a diagram illustrating a structure of an antenna module including a flexible printed circuit board, a wireless communication chip, and a thin film layer according to an embodiment of the present disclosure;

[0028] Fig. 7A is a diagram illustrating a side cross-section of an antenna module including a flexible printed circuit board, a printed circuit board, a first antenna, and a second antenna according to an embodiment of the present disclosure;

[0029] Figure 7B is a diagram illustrating a structure of an antenna module including a plurality of antennas according to an embodiment of the present disclosure;

[0030] Figure 7C is a diagram illustrating a structure of an antenna module including a plurality of antennas according to an embodiment of the present disclosure;

[0031] Figure 8 is a graph of s-parameters of an antenna module according to an embodiment of the present disclosure;

[0032] Fig.9A is a graph illustrating a degree of degradation of a gain value as the distance between coupling pads in an antenna module structure varies according to an embodiment of the present disclosure;

[0033] Fig. 9B is a graph illustrating a degree of degradation of a gain value according to a change in a distance between coupling pads in an antenna module structure including an adhesive layer according to an embodiment of the present disclosure;

[0034] Fig. 9C is a graph illustrating a degree of degradation of a gain value according to a change in a distance between coupling pads in an antenna module structure including a first dielectric layer according to an embodiment of the present disclosure;

[0035] Fig.9D is a graph illustrating a degree of degradation of a gain value according to a variation in a distance between coupling pads in an antenna module structure including a second dielectric layer according to an embodiment of the present disclosure;

[0036] Fig. 10A is a diagram illustrating a printed circuit board to which a coupling method is applied according to an embodiment of the present disclosure;

[0037] Fig. 10B is a diagram illustrating a printed circuit board to which a coupling method is applied according to an embodiment of the present disclosure;

[0038] Fig. 10C is a diagram illustrating a printed circuit board to which a coupling method is applied according to an embodiment of the present disclosure;

[0039] Fig.11 is a diagram illustrating a beamforming operation performed in an antenna module structure according to an embodiment of the present disclosure; and

[0040] Fig.12 is a diagram illustrating a structure of an antenna module including a wireless communication chip and a modem according to an embodiment of the present disclosure.

[0041] Throughout the drawings, it should be noted that like reference numbers are used to depict the same or similar elements, features, and structures. DETAILED DESCRIPTION

[0042] The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of the various embodiments of the present disclosure as defined by the claims and their equivalents. It includes various specific details to assist in understanding, but these are to be considered merely exemplary. Therefore, one of ordinary skill in the art will recognize that various changes and modifications may be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. In addition, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0043] The terms and words used in the following description and claims are not limited to the bibliographical meanings, but are merely used by the inventor to enable a clear and consistent understanding of the present disclosure. Therefore, it should be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustrative purposes only and not for the purpose of limiting the present disclosure as defined by the appended claims and their equivalents.

[0044] It should be understood that the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a component surface" includes reference to one or more of such surfaces.

[0045] When describing the embodiments of the present disclosure, descriptions of technical contents that are well known in the art to which the present disclosure belongs and are not directly related to the present disclosure will be omitted. This is to convey the subject matter of the present disclosure more clearly without obscuring the subject matter of the present disclosure by omitting unnecessary descriptions.

[0046] For the same reason, in the accompanying drawings, the size and relative size of some components may be enlarged, omitted or briefly illustrated. In addition, the size of the corresponding component does not fully reflect its actual size. In the accompanying drawings, the same reference numerals are used for the same or corresponding elements across the various figures.

[0047] By referring to the embodiments to be described in detail with reference to the accompanying drawings, various aspects and features of the present disclosure and methods for realizing various aspects and features will be apparent. However, the present disclosure is not limited to the embodiments disclosed hereinafter, and it can be implemented in various forms. Matters defined in the specification (such as detailed construction and elements) are only specific details provided to help those of ordinary skill in the art to fully understand the present disclosure, and the present disclosure is defined only within the scope of the appended claims. Throughout the description of the present disclosure, the same figure reference numerals are used for the same elements across the various figures.

[0048] In this case, it should be understood that each block of the flowchart illustration and the combination of blocks in the flowchart illustration can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device create a means for realizing the functions specified in one or more flowchart blocks. These computer program instructions can also be stored in a computer-usable or computer-readable memory, which can guide the computer or other programmable data processing device to act in a specific way, so that the instructions stored in the computer-usable or computer-readable memory produce a manufactured product including instruction means, which implements the functions specified in one or more flowchart blocks. Computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operations are performed on the computer or other programmable device to produce a computer-implemented process, so that the instructions executed on the computer or other programmable device provide operations for realizing the functions specified in one or more flowchart blocks.

[0049] In addition, each block of the flow chart illustration can represent a module, fragment or part of a code, which includes one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions indicated in each block may not occur in order. For example, depending on the functionality involved, two blocks shown in succession can actually be executed substantially simultaneously, or sometimes these blocks can be executed in reverse order.

[0050] In this case, the term "~ unit" as used in one embodiment means but is not limited to software or hardware components that perform certain tasks, such as field programmable gate arrays (FPGAs) or application specific integrated circuits (ASICs). However, "~ unit" is not intended to be limited to software or hardware. The term "~ unit" can be advantageously configured to reside on an addressable storage medium and be configured to execute on one or more processors. Therefore, "~ unit" can include components (such as, software components, object-oriented software components, class components and task components), processes, functions, attributes, programs, subroutines, fragments of program code, drivers, firmware, microcodes, circuits, data, databases, data structures, tables, arrays and variables by example. The functionality provided in components and "~ units" can be combined into fewer components and "~ units" or further divided into additional components and "~ units". In addition, components and "~ units" can be implemented as operating one or more central processing units (CPUs) in a device or a secure multimedia card. In addition, in one embodiment, "~ unit" can include one or more processors.

[0051] Figure 1 is a diagram illustrating a structure of an antenna module according to an embodiment of the present disclosure.

[0052] refer to Figure 1 , the antenna module 100 may include: a printed circuit board (PCB) 101 on which at least one layer is laminated; a first antenna 121, which is disposed on the upper end surface of the printed circuit board 101; a second antenna 123, which is disposed to be spaced apart from the first antenna 121 on the upper end surface of the printed circuit board 101 by a predetermined distance; a wireless communication chip 111, which is disposed on the lower end surface of the printed circuit board 101; a first feed line 131, which is configured to electrically connect the wireless communication chip 111 and the first antenna 121 to each other in the printed circuit board 101; and a second feed line 133, which is configured to electrically connect the wireless communication chip 111 and the second antenna 123 to each other in the printed circuit board 101.

[0053] According to one embodiment, it is difficult to dispose the antenna on the side surface of the printed circuit board 101. More specifically, a space sufficient to dispose the antenna therein may be ensured on the upper end surface or the lower end surface of the printed circuit board 101, and with reference to Figure 1 , the first antenna 121 and the second antenna 123 may be disposed on the upper end surface of the printed circuit board 101. In contrast, the side surface of the printed circuit board 101 is configured such that a plurality of layers are laminated thereon, and thus it is difficult to form a feed line on the side surface of the printed circuit board 101, and there is not enough space for disposing the antenna therein.

[0054] According to one embodiment, in order to dispose the antenna on the side surface of the printed circuit board 101, sufficient space should be secured on the side surface of the printed circuit board 101 by increasing the number of layers laminated in the printed circuit board 101. In addition, in order to form a feed line on the side surface of the printed circuit board 101, a separate feed line may be required.

[0055] In a 5G mobile communication system using a high frequency band, an antenna module structure in which an antenna can be disposed on a side surface of the printed circuit board 101 is required. Figure 2 Describe the antenna module structure required in 5G mobile communication systems.

[0056] Figure 2 is a diagram illustrating an antenna module disposed within an electronic device according to an embodiment of the present disclosure.

[0057] refer to Figure 2, an electronic device (eg, a terminal or a laptop) 200 may include a first antenna group 210 capable of radiating radio waves toward a front panel or a rear panel of the electronic device and a second antenna group 220 capable of radiating radio waves toward a side surface of the electronic device 200.

[0058] According to one embodiment, the upper end surface of the printed circuit board disposed inside the electronic device 200 may face the front panel or the rear panel of the electronic device. At the same time, from the perspective of the antenna performance of the electronic device and the use of the internal space, it is preferred that the second antenna group 220 radiating radio waves to the side surface of the electronic device 200 is disposed on the side surface of the printed circuit board disposed inside the electronic device 200.

[0059] In particular, in a 5G mobile communication system using a high frequency band, the number of antennas deployed inside will inevitably increase to form beams in various directions. Therefore, if it is assumed that the antenna cannot be deployed on the side surface of the printed circuit board in an electronic device using a 5G mobile communication system, the space in which the antenna can be deployed inside the electronic device will inevitably be narrow.

[0060] although Figure 2 Only the case where the first antenna group 210 includes four antennas and the second antenna group 220 includes four antennas is illustrated, but 16 or more antennas may be deployed in each of the first antenna group 210 and the second antenna group 220 in the 5G mobile communication system. That is, there is a need for an efficient antenna module structure for deploying a large number of antennas in an electronic device to which the 5G mobile communication system is applied. Therefore, an antenna module structure capable of efficiently deploying antennas will be disclosed hereinafter.

[0061] Figure 3 is a diagram illustrating a structure of an antenna module in which an antenna is disposed on a flexible printed circuit board according to an embodiment of the present disclosure.

[0062] refer to Figure 3 , the antenna module 300 may include: a flexible printed circuit board (FPCB) 301, the flexible printed circuit board 301 including a first surface oriented in a first direction and a second surface oriented in a second direction, the second direction forming a predetermined first angle relative to the first direction; a first antenna 311, the first antenna 311 is disposed on one surface of the first surface and configured to form a first radiation area in a third direction; and a second antenna 313, the second antenna 313 is disposed on one surface of the second surface and configured to form a second radiation area in a fourth direction. According to various embodiments, the flexible printed circuit board may be bent or folded by an external force.

[0063] According to one embodiment, the antenna module 300 may be included inside the electronic device. According to various embodiments, in the case where the antenna module 300 is installed inside the electronic device, the first direction may be the direction of the front panel or the rear panel of the electronic device, and the first antenna 311 disposed on the first surface may perform beam forming in the direction of the front surface or the rear surface of the electronic device.

[0064] According to one embodiment, in the case where the antenna module 300 is installed inside the electronic device, the second direction may be the direction of the side surface of the electronic device, and the second antenna 313 disposed on the second surface may perform beam forming in the direction of the side surface of the electronic device. The first antenna 311 may be a broadside antenna of the electronic device, and the second antenna 313 may be an end-fire antenna of the electronic device.

[0065] According to one embodiment, a portion of the area forming the first radiation area may overlap with a portion of the area forming the second radiation area, and a portion of the area forming the first radiation area may not overlap with a portion of the area forming the second radiation area.

[0066] According to one embodiment, the antenna module 300 may include a controller (not shown) electrically connected to the first antenna 311 and the second antenna 313 and configured to control the radiation direction of the radio waves radiated by the first antenna 311 and the second antenna 313. According to various embodiments, the controller may be disposed on the lower end surface of the flexible printed circuit board 301. For example, the controller may be included in a wireless communication chip disposed on the lower end surface of the flexible printed circuit board.

[0067] According to one embodiment, the first antenna 311 and the second antenna 313 included in the antenna module 300 may be disposed on the upper end surface of the same flexible printed circuit board 301, and the direction in which the first antenna 311 performs beamforming and the direction in which the second antenna 313 performs beamforming may be different from each other according to bending or folding of the flexible printed circuit board 301. According to various embodiments, two or more antennas that perform beamforming in different directions may be disposed on one flexible printed circuit board 301 even without adding a separate layer.

[0068] According to one embodiment, the first antenna 311 and the second antenna 313 may include at least one of a patch antenna, a monopole antenna, a helical antenna, a wave antenna, a yagiuda antenna, a loop antenna, a Vivaldi antenna, or a holographic antenna.

[0069] According to one embodiment, the patch antenna can be small and light, can be easily arranged, and can be easily integrated into a printed circuit board or a flexible printed circuit board. In addition, the polarization of the patch antenna can be easily adjusted. According to various embodiments, the patch antenna can be suitable for a printed circuit board or a flexible printed circuit board with a low dielectric constant and a large thickness.

[0070] According to one embodiment, the dipole antenna may have a shape in which a feed line is connected between two conductor bars. According to various embodiments, the dipole antenna may be used for high frequency or very high frequency.

[0071] According to one embodiment, the monopole antenna may have a straight line shape, and it may have a structure in which a non-conductor ground is disposed on one side. According to various embodiments, the monopole antenna may have a length shorter than that of a dipole antenna, and it may be a non-directional antenna. For example, the monopole antenna may be used in a mobile communication terminal or a frequency modulation (FM) radio receiver device.

[0072] According to one embodiment, the loop antenna may be a directional antenna and it may be used in fields where antenna efficiency is not as important as signal-to-noise ratio. According to various embodiments, the loop antenna may be used as a direction finding antenna or a probing antenna.

[0073] According to one embodiment, the helical antenna may have ultra-wideband characteristics and it may generate circular polarization. According to various embodiments, the helical antenna may be used for satellite communications or radar.

[0074] According to one embodiment, the Yagi antenna may have high directivity. According to various embodiments, the Yagi antenna may be mounted externally as an antenna for a wireless device or a television receiver.

[0075] According to one embodiment, the Vivaldi antenna may have broadband characteristics and high directivity. According to various embodiments, the Vivaldi antenna may be used as a reference antenna for measurement or an antenna for radar.

[0076] According to one embodiment, the holographic antenna may use a flat reflector as an antenna for creating a signal to tilt the beam. According to various embodiments, the holographic antenna may be used for satellite communications or radar.

[0077] on the other hand, Figure 3 The embodiments of the present disclosure are illustrated, and thus the scope of the present disclosure should not be limited to Figure 3 The flexible printed circuit board 301 may be bent or folded in various shapes, and the antenna module may perform beamforming in various directions corresponding to the shape of the folded flexible printed circuit board.

[0078] Figure 4Ais a diagram illustrating a side cross-section of an antenna module in which an antenna and a feed pad are disposed on a flexible printed circuit board according to an embodiment of the present disclosure.

[0079] refer to Figure 4A , the antenna module 400 may include: a flexible printed circuit board (FPCB) 401, the flexible printed circuit board 401 including a first surface oriented in a first direction and a second surface oriented in a second direction, the second direction forming a predetermined first angle relative to the first direction; a first antenna 411, the first antenna 411 is disposed on one surface of the first surface and is configured to form a first radiation area in a third direction; a second antenna 413, the second antenna 413 is disposed on one surface of the first surface and is disposed to be spaced apart from the first antenna 411, and is configured to form a second radiation area in the third direction; a third antenna 415, the third antenna 415 is disposed on one surface of the second surface and is configured to form a third radiation area in a fourth direction; a first feed pad 421, the first feed pad 421 is disposed on another surface of the first surface; a second feed pad 423, the second feed pad 423 is disposed on another surface of the first surface; and a third feed pad 425, the third feed pad 425 is disposed on another surface of the first surface. According to various embodiments, the first feed pad 421, the second feed pad 423, and the third feed pad 425 may be disposed spaced apart from each other on the other surface of the flexible printed circuit board 401. According to one embodiment, the antenna module 400 may include a first feed line 431 configured to electrically connect the first antenna 411 and the first feed pad 421 to each other in the flexible printed circuit board 401. According to various embodiments, the first feed line 431 may transfer a radio frequency (RF) signal supplied through the first feed pad 421 to the first antenna 411.

[0080] According to one embodiment, the antenna module 400 may include a second feed line 433 configured to electrically connect the second antenna 413 and the second feed pad 423 to each other in the flexible printed circuit board 401. According to various embodiments, the second feed line 433 may transfer a radio frequency (RF) signal supplied through the second feed pad 423 to the second antenna 413.

[0081] According to one embodiment, the antenna module 400 may include a third feed line 435 configured to electrically connect the third antenna 415 and the third feed pad 425 to each other in the flexible printed circuit board 401. According to various embodiments, the third feed line 435 may transfer a radio frequency (RF) signal supplied through the third feed pad 425 to the third antenna 415.

[0082] According to one embodiment, the antenna module 400 may be included inside the electronic device. According to various embodiments, in the case where the antenna module 400 is installed inside the electronic device, the first direction may be the direction of the front panel or the rear panel of the electronic device, and the first antenna 411 and the second antenna 413 disposed on the first surface may perform beamforming in the direction of the front surface or the rear surface of the electronic device.

[0083] According to one embodiment, in the case where the antenna module 400 is installed inside the electronic device, the second direction may be the direction of the side surface of the electronic device, and the third antenna 415 disposed on the second surface may perform beam forming in the direction of the side surface of the electronic device. According to various embodiments, the first antenna 411 and the second antenna 413 may be broadside antennas of the electronic device, and the third antenna 415 may be an end-fire antenna of the electronic device.

[0084] According to one embodiment, the area forming the first radiation area may be equal to the area forming the second radiation area. According to various embodiments, partial areas of the areas forming the first radiation area and the second radiation area may not overlap partial areas of the area forming the third radiation area.

[0085] According to one embodiment, the antenna module 400 may include a controller (not shown) electrically connected to the first antenna 411, the second antenna 413, and the third antenna 415 and configured to control the radiation direction of the radio waves radiated by the first antenna 411, the second antenna 413, and the third antenna 415. According to various embodiments, the controller may be disposed on the lower end surface of the flexible printed circuit board 401. For example, the controller may be included in a wireless communication chip disposed on the lower end surface of the flexible printed circuit board.

[0086] Figure 4B is an example of an embodiment according to the present disclosure Figure 4A FIG. 4 is a diagram of a structure of an antenna module 400 , in which the antenna is disposed on a first surface and a second surface of a flexible printed circuit board.

[0087] refer to Figure 4B , the antenna module 400 may include a first antenna 411 and a second antenna 413 disposed on the upper end surface of the flexible printed circuit board 401 and a third antenna 415 disposed on the side surface of the flexible printed circuit board 401. According to various embodiments, the antenna module 400 may be disposed in a closed space inside the electronic device. For example, the first antenna 411 and the second antenna 413 disposed on the upper end surface of the flexible printed circuit board 401 may radiate radio waves in the direction of the front surface or the rear surface of the electronic device, and the third antenna 415 disposed on the side surface of the flexible printed circuit board 401 may radiate radio waves toward the side surface of the electronic device.

[0088] According to one embodiment, when the antenna module 400 is deployed inside the electronic device, the first antenna 411 and the second antenna 413 may be broadside antennas of the electronic device, and the third antenna 415 may be an end-fire antenna of the electronic device. According to various embodiments, by deploying all broadside antennas and end-fire antennas in one flexible printed circuit board 401, a large number of antennas may be deployed inside the electronic device, and the antennas may be deployed at various locations inside the electronic device.

[0089] on the other hand, Figure 4A and Figure 4B The embodiments of the present disclosure are illustrated, and thus the scope of the present disclosure should not be limited to Figure 4A and Figure 4B For example, the number of antennas disposed on the first surface of the flexible printed circuit board and the number of antennas disposed on the second surface of the flexible printed circuit board may be changed.

[0090] Figure 5A is a diagram illustrating a structure of an antenna module including a flexible printed circuit board, a printed circuit board, and a wireless communication chip according to an embodiment of the present disclosure.

[0091] refer to Figure 5A , the antenna module 500a may include: a flexible printed circuit board 501, which is oriented in a first direction; a first antenna 511, which is disposed on one surface of the flexible printed circuit board 501; a first feed pad 521, which is disposed on another surface of the flexible printed circuit board 501; and a first feed line 561, which is configured to electrically connect the first antenna 511 and the first feed pad 521 to each other.

[0092] According to one embodiment, the antenna module 500a may include: a printed circuit board 531 disposed to be spaced apart from another surface of the flexible printed circuit board 501 by a predetermined first length and having at least one layer laminated therein; a second feed pad 541 disposed on one surface of the printed circuit board 531 corresponding to the first feed pad 521; a wireless communication chip 551 disposed on another surface of the printed circuit board 531; and a second feed line 571 configured to electrically connect the wireless communication chip 551 and the second feed pad 541 to each other in the printed circuit board 531. According to various embodiments, the first length may be determined based on the wavelength or coupling method of the radio wave radiated by the first antenna 511. For example, the first length may preferably be configured to be a value equal to or greater than 5 μm and equal to or less than 500 μm.

[0093] According to one embodiment, the flexible printed circuit board 501 and the printed circuit board 531 may be separated from each other because a space is formed between the flexible printed circuit board 501 and the printed circuit board 531. According to various embodiments, as a feeding method from the second feeding pad 541 to the first feeding pad 521, a capacitive coupling, an inductive coupling, or a resonant coupling method may be used.

[0094] According to one embodiment, the wireless communication chip 551 may transmit a signal for radiating radio waves (e.g., a basic signal, an intermediate frequency signal, and a local frequency signal) to the second feeding pad 541 through the second feeding line 571. According to various embodiments, the signal transmitted to the second feeding pad 541 may be transmitted to the first feeding pad 521 through a coupling pad method, and the signal transmitted to the first feeding pad 521 may be transmitted to the first antenna 511 through the first feeding line 561.

[0095] According to one embodiment, in order for the first feeding pad 521 and the second feeding pad 541 to perform feeding by the coupling method, at least a portion of the first feeding pad 521 and at least a portion of the second feeding pad 541 are required to face each other. According to various embodiments, in the coupling feeding method, it is most preferred that the first feeding pad 521 and the second feeding pad 541 are disposed to face each other.

[0096] Figure 5B is a diagram illustrating a structure of an antenna module including a flexible printed circuit board, a printed circuit board, and a wireless communication chip according to an embodiment of the present disclosure.

[0097] refer to Figure 5B , the antenna module 500b may include: a flexible printed circuit board (FPCB) 502, the flexible printed circuit board 502 including a first surface oriented in a first direction and a second surface oriented in a second direction, the second direction forming a predetermined first angle relative to the first direction; a first antenna 512, the first antenna 512 is disposed on one surface of the flexible printed circuit board 502 and is configured to form a first radiation area in a third direction; a second antenna 513, the second antenna 513 is disposed on one surface of the second surface and is configured to form a second radiation area in a fourth direction; a first feed pad 522, the first feed pad 522 is disposed on another surface of the first surface; a second feed pad 523, the second feed pad 523 is disposed on another surface of the first surface; a first feed line 562, the first feed line 562 is configured to electrically connect the first antenna 512 and the first feed pad 522 to each other; and a second feed line 563, the second feed line 563 is configured to electrically connect the second antenna 513 and the second feed pad 523 to each other.

[0098] According to one embodiment, the antenna module 500b may include: a printed circuit board 532, which is disposed to be spaced apart from another surface of the first surface by a predetermined first length and has at least one layer laminated therein; a third feed pad 542, which is disposed on one surface of the printed circuit board 532, and the third feed pad 542 corresponds to the first feed pad 522; a fourth feed pad 543, which is disposed on one surface of the printed circuit board 532 and corresponds to the first feed pad 522; and the fourth feed pad 543 corresponds to the second feed pad 523; a wireless communication chip 552, which is disposed on the other surface of the printed circuit board 532; a third feed line 572, which is configured to electrically connect the wireless communication chip 552 and the third feed pad 542 to each other in the printed circuit board 532; and a fourth feed line 573, which is configured to electrically connect the wireless communication chip 552 and the fourth feed pad 543 to each other in the printed circuit board 532. According to various embodiments, the first length may be determined based on the wavelength and coupling method of the radio wave radiated by the first antenna 512 or the second antenna 513. For example, preferably, the first length may be configured to be equal to or greater than 5 μm and equal to or less than 500 μm.

[0099] According to one embodiment, the flexible printed circuit board 502 and the printed circuit board 532 may be separated from each other because a space is formed between the flexible printed circuit board 502 and the printed circuit board 532. According to various embodiments, as a feeding method from the third feeding pad 542 to the first feeding pad 522 and a feeding method from the fourth feeding pad 543 to the second feeding pad 523, a capacitive coupling, an inductive coupling, or a resonant coupling method may be used.

[0100] According to one embodiment, the wireless communication chip 552 may transmit a signal for radiating radio waves (e.g., a basic signal, an intermediate frequency signal, and a local frequency signal) to the third feed pad 542 and the fourth feed pad 543 through the third feed line 572 and the fourth feed line 573. According to various embodiments, the signal transmitted to the third feed pad 542 may be transmitted to the first feed pad 522 through a coupling pad method, and it may be transmitted to the first antenna 512 through the first feed line 562 (the signal transfer through the fourth feed pad may also be the same as the signal transfer through the third feed pad).

[0101] Figure 5C is a diagram illustrating a structure of an antenna module including a flexible printed circuit board, a printed circuit board, and a wireless communication chip according to an embodiment of the present disclosure.

[0102] refer to Figure 5C , the antenna module 500c may include: a flexible printed circuit board 503, which is oriented in a first direction; a first antenna 514, which is disposed on one surface of the flexible printed circuit board 503; and a first feeding pad 524, which is disposed on another surface of the flexible printed circuit board 503. According to various embodiments, the first antenna 514 and the first feeding pad 524 may be directly connected to each other.

[0103] According to one embodiment, the antenna module 500c may include: a printed circuit board 533 disposed to be spaced apart from another surface of the flexible printed circuit board 503 by a predetermined first length and having at least one layer laminated in the printed circuit board 533; a second feed pad 544 disposed on one surface of the printed circuit board 533 corresponding to the first feed pad 524; a wireless communication chip 553 disposed to be spaced apart from the second feed pad 544 on one surface of the printed circuit board 533; and a first feed line 570 configured to electrically connect the wireless communication chip 553 and the second feed pad 544 to each other in the printed circuit board 533. According to various embodiments, the first length may be determined based on the wavelength or coupling method of the radio wave radiated by the first antenna 514. For example, preferably, the first length may be configured to be a value equal to or greater than 5 μm and equal to or less than 500 μm.

[0104] According to one embodiment, the flexible printed circuit board 503 and the printed circuit board 533 may be separated from each other because a space is formed between the flexible printed circuit board 503 and the printed circuit board 533. According to various embodiments, as a feeding method from the second feeding pad 544 to the first feeding pad 524, a capacitive coupling, an inductive coupling, or a resonant coupling method may be used.

[0105] According to one embodiment, the wireless communication chip 553 may transmit a signal for radiating radio waves (e.g., a basic signal, an intermediate frequency signal, and a local frequency signal) to the second feed pad 544 through the first feed line 570. According to various embodiments, the signal transmitted to the second feed pad 544 may be transmitted to the first feed pad 524 through a coupling pad method, and the signal transmitted to the first feed pad 524 may be directly transmitted to the first antenna 514.

[0106] Figure 5D is a diagram illustrating a structure of an antenna module including a flexible printed circuit board and a wireless communication chip according to an embodiment of the present disclosure.

[0107] refer to Figure 5D, the antenna module 500d may include: a flexible printed circuit board 504, the flexible printed circuit board 504 being oriented in a first direction; a first antenna 515, the first antenna 515 being disposed on one surface of the flexible printed circuit board 504; a first feed pad 525, the first feed pad 525 being disposed on another surface of the flexible printed circuit board 504; and a first feed line 564, the first feed line 564 being configured to electrically connect the first antenna 515 and the first feed pad 525 to each other. According to various embodiments, the flexible printed circuit board may include a plurality of layers, and by constituting the plurality of layers of the flexible printed circuit board 504, the distance between the first antenna 515 for radiating a radio frequency signal of a high frequency band and the wireless communication chip 554 may be ensured.

[0108] According to one embodiment, the antenna module 500d may include: a wireless communication chip 554 disposed to be spaced apart from another surface of the flexible printed circuit board 504 by a predetermined first length; and a second feed pad 545 disposed on one surface of the wireless communication chip 554 corresponding to the first feed pad 525. According to various embodiments, the first length may be determined based on a wavelength or a coupling method of a radio wave radiated by the first antenna 515. For example, preferably, the first length may be configured to be a value equal to or greater than 5 μm and equal to or less than 500 μm.

[0109] According to one embodiment, the flexible printed circuit board 504 and the wireless communication chip 554 may be separated from each other because a space is formed between the flexible printed circuit board 504 and the wireless communication chip 554. According to various embodiments, as a feeding method from the second feeding pad 545 to the first feeding pad 525, a capacitive coupling, an inductive coupling, or a resonant coupling method may be used.

[0110] According to one embodiment, the wireless communication chip 554 may transmit a signal for radiating radio waves (e.g., a basic signal, an intermediate frequency signal, and a local frequency signal) to the second feeding pad 545. According to various embodiments, the signal transmitted to the second feeding pad 545 may be transmitted to the first feeding pad 525 by a coupling pad method, and may be transmitted to the first antenna 515 by the first feeding line 564.

[0111] According to one embodiment, in order for the first feeding pad 525 and the second feeding pad 545 to perform feeding by the coupling method, at least a portion of the first feeding pad 525 and at least a portion of the second feeding pad 545 are required to face each other. According to various embodiments, in the coupling feeding method, it is optimal that the first feeding pad 525 and the second feeding pad 545 are disposed to face each other.

[0112] On the other hand, because FIG. 5A to FIG. 5D Various embodiments of the present disclosure are illustrated, so the scope of the present disclosure should not be limited to FIG. 5A to FIG. 5D The antenna module structure can be changed according to the needs of the designer within the scope allowed by the ordinary technical level.

[0113] Fig. 6A is a diagram illustrating a structure of an antenna module including a flexible printed circuit board, a printed circuit board, a wireless communication chip, and a thin film layer according to an embodiment of the present disclosure.

[0114] refer to Fig. 6A The antenna module 600a may include: a flexible printed circuit board 601, which is oriented in a first direction; a first antenna 611, which is disposed on one surface of the flexible printed circuit board 601; a first feed pad 621, which is disposed on another surface of the flexible printed circuit board 601; and a first feed line 671, which is configured to electrically connect the first antenna 611 and the first feed pad 621 to each other.

[0115] According to one embodiment, the antenna module 600a may include: a thin film layer 631 configured to uniformly maintain a distance between the other surface of the first surface of the flexible printed circuit board 601 and one surface of the printed circuit board 641; a printed circuit board 641 in which at least one layer is laminated; a second feed pad 651 disposed on one surface of the printed circuit board 641 corresponding to the first feed pad 621; a wireless communication chip 661 disposed on the other surface of the printed circuit board 641; and a second feed line 681 configured to electrically connect the wireless communication chip 661 and the second feed pad 651 to each other in the printed circuit board 641. According to various embodiments, the flexible printed circuit board 601 may be uniformly spaced apart from the printed circuit board 641 by a predetermined first length through the thin film layer 631. For example, the first length may be determined based on the wavelength of the radio wave radiated by the first antenna 611 or a coupling method.

[0116] According to one embodiment, the flexible printed circuit board 601 and the printed circuit board 641 may be separated from each other because a space is formed between the flexible printed circuit board 601 and the printed circuit board 641 by the thin film layer 631. According to various embodiments, as a feeding method from the second feeding pad 651 to the first feeding pad 621, a capacitive coupling, an inductive coupling, or a resonant coupling method may be used.

[0117] According to one embodiment, the film layer 631 may further include an adhesive layer configured to adhere the other surface of the first surface of the flexible printed circuit board 601 to one surface of the printed circuit board 641 .

[0118] According to one embodiment, the adhesive layer may be composed of an adhesive, and after the adhesive is disposed between the flexible printed circuit board 601 and the printed circuit board 641, an additional process such as heating or photolithography may be performed. According to various embodiments, the adhesive layer may be composed of a material capable of adhering even at ambient temperature. According to one embodiment, in order to increase the coupling effect between the first feeding pad 621 and the second feeding pad 651, the thin film layer 631 may be composed of a material having a dielectric constant equal to or higher than a predetermined reference value.

[0119] According to one embodiment, the wireless communication chip 661 may transmit a signal for radiating radio waves (e.g., a basic signal, an intermediate frequency signal, and a local frequency signal) to the second feeding pad 651 through the second feeding line 681. According to various embodiments, the signal transmitted to the second feeding pad 651 may be transmitted to the first feeding pad 621 through a coupling pad method, and may be transmitted to the first antenna 611 through the first feeding line 671.

[0120] According to one embodiment, in order for the first feeding pad 621 and the second feeding pad 651 to perform feeding by a coupling method, at least a portion of the first feeding pad 621 and at least a portion of the second feeding pad 651 are required to face each other. According to various embodiments, in the coupling feeding method, it is most preferred that the first feeding pad 621 and the second feeding pad 651 are disposed to face each other.

[0121] Figure 6B is a diagram illustrating a structure of an antenna module including a flexible printed circuit board, a printed circuit board, a wireless communication chip, and a thin film layer according to an embodiment of the present disclosure.

[0122] refer to Figure 6B, the antenna module 600b may include: a flexible printed circuit board 602, the flexible printed circuit board 602 including a first surface oriented in a first direction and a second surface oriented in a second direction, the second direction forming a predetermined first angle relative to the first direction; a first antenna 612, the first antenna 612 being disposed on one surface of the flexible printed circuit board 602; a second antenna 613, the second antenna 613 being disposed on one surface of the second surface; a first feed pad 622, the first feed pad 622 being disposed on another surface of the first surface; a second feed pad 623, the second feed pad 623 being disposed on another surface of the first surface; a first feed line 672, the first feed line 672 being configured to electrically connect the first antenna 612 and the first feed pad 622 to each other; and a second feed line 673, the second feed line 673 being configured to electrically connect the second antenna 613 and the second feed pad 623 to each other.

[0123] According to one embodiment, the antenna module 600b may include: a thin film layer 632 disposed between the other surface of the first surface of the flexible printed circuit board 602 and one surface of the printed circuit board 642 and configured to uniformly maintain the distance between the other surface of the first surface of the flexible printed circuit board 602 and one surface of the printed circuit board 642; a printed circuit board 642 in which at least one layer is laminated; a third feed pad 652 disposed on one surface of the printed circuit board 642 and corresponding to the first feed pad 622; a fourth feed pad 653 disposed on one surface of the printed circuit board 642 and corresponding to the second feed pad 623; a wireless communication chip 662 disposed on another surface of the printed circuit board 642; a third feed line 682 configured to electrically connect the wireless communication chip 662 and the third feed pad 652 to each other in the printed circuit board 642; and a fourth feed line 683 configured to electrically connect the wireless communication chip 662 and the fourth feed pad 653 to each other in the printed circuit board 642. According to various embodiments, the flexible printed circuit board 602 may be uniformly spaced apart from the printed circuit board 642 by a predetermined first length through the thin film layer 632. For example, the first length may be determined based on the wavelength of the radio wave radiated by the first antenna 612 or the second antenna 613 or a coupling method.

[0124] According to one embodiment, the flexible printed circuit board 602 and the printed circuit board 642 can be separated from each other because a space is formed between the flexible printed circuit board 602 and the printed circuit board 642. According to various embodiments, as a feeding method from the third feeding pad 652 to the first feeding pad 622 and a feeding method from the fourth feeding pad 653 to the second feeding pad 623, a capacitive coupling, an inductive coupling, or a resonant coupling method may be used.

[0125] According to one embodiment, the wireless communication chip 662 can send signals for radiating radio waves (e.g., basic signals, intermediate frequency signals, and local frequency signals) to the third feed pads 652 and the fourth feed pads 653 through the third feed line 682 and the fourth feed line 683. According to various embodiments, the signal sent to the third feed pad 652 can be sent to the first feed pad 622 through a coupling pad method, and can be sent to the first antenna 612 through the first feed line 672 (the signal transfer through the fourth feed pad can also be the same as the signal transfer through the third feed pad).

[0126] Figure 6C is a diagram illustrating a structure of an antenna module including a flexible printed circuit board, a printed circuit board, a wireless communication chip, and a thin film layer according to an embodiment of the present disclosure.

[0127] refer to Figure 6C , the antenna module 600c may include: a flexible printed circuit board 603, which is oriented in a first direction; a first antenna 614, which is disposed on one surface of the flexible printed circuit board 603; and a first feeding pad 624, which is disposed on one surface of the flexible printed circuit board 603. According to various embodiments, the first antenna 614 and the first feeding pad 624 may be directly connected to each other.

[0128] According to one embodiment, the antenna module 600c may include: a thin film layer 633 disposed between the other surface of the first surface of the flexible printed circuit board 603 and one surface of the printed circuit board 643 and configured to uniformly maintain the distance between the other surface of the first surface of the flexible printed circuit board 603 and one surface of the printed circuit board 643; a printed circuit board 643 in which at least one layer is laminated; a second feed pad 654 disposed on one surface of the printed circuit board 643 corresponding to the first feed pad 624; a wireless communication chip 663 disposed to be spaced apart from the second feed pad 654 on one surface of the printed circuit board 643; and a first feed line 684 configured to electrically connect the wireless communication chip 663 and the second feed pad 654 to each other in the printed circuit board 643. According to various embodiments, through the thin film layer 633, the flexible printed circuit board 603 may be uniformly spaced apart from the printed circuit board 643 by a predetermined first length. For example, the first length may be determined based on the wavelength of radio waves radiated through the first antenna 614 or a coupling method.

[0129] According to one embodiment, the flexible printed circuit board 603 and the printed circuit board 643 may be separated from each other because a space is formed between the flexible printed circuit board 603 and the printed circuit board 643. According to various embodiments, as a feeding method from the second feeding pad 654 to the first feeding pad 624, a capacitive coupling, an inductive coupling, or a resonant coupling method may be used.

[0130] According to one embodiment, the wireless communication chip 663 may transmit a signal for radiating radio waves (e.g., a basic signal, an intermediate frequency signal, and a local frequency signal) to the second feed pad 654 through the first feed line 684. According to various embodiments, the signal transmitted to the second feed pad 654 may be transmitted to the first feed pad 624 through a coupling pad method, and the signal transmitted to the first feed pad 624 may be directly transmitted to the first antenna 614.

[0131] Fig.6D is a diagram illustrating a structure of an antenna module including a flexible printed circuit board, a wireless communication chip, and a thin film layer according to an embodiment of the present disclosure.

[0132] refer to Fig.6D, the antenna module 600d may include: a flexible printed circuit board 604, which is oriented in a first direction; a first antenna 615, which is disposed on one surface of the flexible printed circuit board 604; a first feed pad 625, which is disposed on another surface of the flexible printed circuit board 604; and a first feed line 685, which is configured to electrically connect the first antenna 615 and the first feed pad 625 to each other. According to various embodiments, the flexible printed circuit board 604 may include a plurality of layers, and by constituting the plurality of layers of the flexible printed circuit board, the distance between the first antenna 615 for radiating a radio frequency signal of a high frequency band and the wireless communication chip 664 may be ensured.

[0133] According to one embodiment, the antenna module 600d may include: a thin film layer 631 configured to uniformly maintain a distance between the other surface of the first surface of the flexible printed circuit board 601 and one surface of the wireless communication chip 661; a wireless communication chip 661, one surface of which faces the other surface of the thin film layer 634; and a second feed pad 655 disposed on one surface of the wireless communication chip 664 corresponding to the first feed pad 625. According to various embodiments, the flexible printed circuit board 604 may be uniformly spaced apart from the wireless communication chip 664 by a predetermined first length through the thin film layer 634. For example, the first length may be determined based on the wavelength of the radio wave radiated by the first antenna 615 or a coupling method.

[0134] According to one embodiment, the flexible printed circuit board 604 and the wireless communication chip 664 may be separated from each other because a space is formed between the flexible printed circuit board 604 and the wireless communication chip 664. According to various embodiments, as a feeding method from the second feeding pad 655 to the first feeding pad 625, a capacitive coupling, an inductive coupling, or a resonant coupling method may be used.

[0135] According to one embodiment, the wireless communication chip 664 may transmit a signal for radiating radio waves (e.g., a basic signal, an intermediate frequency signal, and a local frequency signal) to the second feeding pad 655. According to various embodiments, the signal transmitted to the second feeding pad 655 may be transmitted to the first feeding pad 625 by a coupling pad method, and may be transmitted to the first antenna 615 by the first feeding line 685.

[0136] According to one embodiment, in order for the first feeding pad 625 and the second feeding pad 655 to perform feeding by a coupling method, at least a portion of the first feeding pad 625 and at least a portion of the second feeding pad 655 are required to face each other. According to various embodiments, in the coupling feeding method, it is most preferred that the first feeding pad 625 and the second feeding pad 655 are disposed to face each other.

[0137] On the other hand, because FIG. 6A to FIG. 6D The embodiments of the present disclosure are illustrated, so the scope of the present disclosure should not be limited to FIG. 6A to FIG. 6D The antenna module structure can be changed according to the needs of the designer within the scope allowed by the ordinary technical level.

[0138] Fig. 7A is a diagram illustrating a side cross-section of an antenna module including a flexible printed circuit board, a printed circuit board, a first antenna, and a second antenna according to an embodiment of the present disclosure.

[0139] refer to Fig. 7A , the antenna module may include a printed circuit board 701 in which a plurality of layers are laminated. For example, the printed circuit board 701 may be formed by lamination of 18 layers. According to various embodiments, a through hole may be formed on each layer of the printed circuit board 701. For example, the printed circuit board 701 may include a through hole formed by a laser process and a through hole formed by a plated through hole (PTH) process.

[0140] According to one embodiment, a feeder 711 supplied with an electrical signal for radiating radio waves may be disposed on one surface of the printed circuit board 701. For example, the feeder 711 may be disposed on a first layer laminated on an upper end surface of the printed circuit board 701. According to various embodiments, a through hole may be formed on the first layer by a laser process, and an electrical signal for radiating radio waves may be provided to the feeder 711 through the through hole.

[0141] According to one embodiment, through a laser process, vias may be formed even on the second and third layers disposed below (in the lamination direction) the first layer disposed on the upper end surface of the printed circuit board 701. According to various embodiments, a ground may be disposed on one surface of the third layer.

[0142] According to one embodiment, an electrical signal for creating a radio frequency may be supplied to another surface of the printed circuit board 701. For example, in order to generate a radio frequency, a basic signal for creating a radio frequency, an intermediate frequency signal for changing the frequency of the basic signal, and a local frequency signal may be necessary, and the basic signal, the intermediate frequency signal, and the local frequency signal may be supplied to another surface of the printed circuit board 701.

[0143] According to one embodiment, the basic signal may be supplied through "A" disposed on another surface of the printed circuit board 701. According to various embodiments, the basic signal supplied through "A" may be transmitted to the feeding part 711 disposed on one surface of the printed circuit board 701 through a through hole formed on the printed circuit board 701.

[0144] According to one embodiment, the intermediate frequency signal may be supplied through "B" disposed on another surface of the printed circuit board 701. According to various embodiments, the intermediate frequency signal supplied through "B" may be transmitted to the printed circuit board 701 through a through hole formed on the printed circuit board 701.

[0145] According to one embodiment, the local frequency signal may be supplied through "C" disposed on another surface of the printed circuit board 701. According to various embodiments, the local frequency signal supplied through "C" may be transmitted to the printed circuit board 701 through a via formed on the printed circuit board 701.

[0146] According to one embodiment, a flexible printed circuit board 721 on which an antenna is disposed may be combined with one surface of the printed circuit board 701. According to various embodiments, on one surface of the flexible printed circuit board 721 facing the feeding portion 711, a first antenna 731 for receiving an electric signal from the feeding portion 711 and radiating radio waves may be disposed. That is, according to the antenna module structure disclosed in the present disclosure, the first antenna 731 and the feeding portion 711 may have a coupling structure in which they are not directly connected to each other.

[0147] According to one embodiment, since the feed portion 711 and the first antenna 731 are not directly connected to each other, the antenna can be freely disposed in the antenna module. That is, according to the antenna module structure disclosed in the present disclosure, the degree of freedom of antenna module design can be improved.

[0148] According to one embodiment, the second antenna 741 may be disposed on another surface of the flexible printed circuit board 721. According to various embodiments, the performance of the antenna module may be determined based on a separation distance between the first antenna 731 and the second antenna 741.

[0149] Figure 7B is a diagram illustrating a structure of an antenna module including a plurality of antennas according to an embodiment of the present disclosure.

[0150] refer to Figure 7B, the antenna module may include a first antenna 740, a second antenna 742, a third antenna 743, and a fourth antenna 744 disposed on the upper end surface of the flexible printed circuit board 722, and a fifth antenna 761, a sixth antenna 762, a seventh antenna 763, and an eighth antenna 764 disposed on the side surface of the flexible printed circuit board 722. According to various embodiments, the antenna module may be disposed in a closed space on the inside of the electronic device. For example, the first antenna 740, the second antenna 742, the third antenna 743, and the fourth antenna 744 disposed on the upper end surface of the flexible printed circuit board 722 may radiate radio waves in the direction of the front surface or the rear surface of the electronic device, while the fifth antenna 761, the sixth antenna 762, the seventh antenna 763, and the eighth antenna 764 disposed on the side surface of the flexible printed circuit board 722 may radiate radio waves toward the side surface of the electronic device.

[0151] According to one embodiment, if the antenna module is deployed inside the electronic device, the first antenna 740, the second antenna 742, the third antenna 743, and the fourth antenna 744 may be broadside antennas of the electronic device, and the fifth antenna 761, the sixth antenna 762, the seventh antenna 763, and the eighth antenna 764 may be end-fire antennas of the electronic device. According to various embodiments, by deploying all broadside antennas and end-fire antennas on one flexible printed circuit board 722, a larger number of antennas may be deployed inside the electronic device, and the antennas may be deployed in various locations inside the electronic device.

[0152] According to one embodiment, the printed circuit board 702 on which a plurality of layers are laminated may be disposed on the lower end surface of the flexible printed circuit board 722. According to various embodiments, the lower end surface of the flexible printed circuit board 722 and the upper end surface of the printed circuit board 702 may be spaced apart from each other by a first length. For example, the first length may be determined based on the wavelength of the radio wave to be radiated by the antenna module.

[0153] According to one embodiment, on the upper end surface of the printed circuit board 702, a first feeding pad 710 for feeding the first antenna 740, a second feeding pad 712 for feeding the second antenna 742, a third feeding pad 713 for feeding the third antenna 743, and a fourth feeding pad 714 for feeding the fourth antenna 744 may be disposed. According to various embodiments, each feeding pad may be spaced apart from each broadside antenna by a first length. That is, for the first antenna 740, the second antenna 742, the third antenna 743, and the fourth antenna 744, feeding may be performed by a coupling method.

[0154] According to one embodiment, on the side surface of the printed circuit board 702, a fifth feeding pad 751 for feeding the fifth antenna 761, a sixth feeding pad 752 for feeding the sixth antenna 762, a seventh feeding pad 753 for feeding the seventh antenna 763, and an eighth feeding pad 754 for feeding the eighth antenna 764 may be disposed. According to various embodiments, each feeding pad may be spaced apart from each end-fire antenna by a first length. That is, for the fifth antenna 761, the sixth antenna 762, the seventh antenna 763, and the eighth antenna 764, feeding may be performed by a coupling method.

[0155] According to one embodiment, an electrical signal supplied through the fifth feeding pad 751 disposed on the upper end surface of the printed circuit board 702 may be transmitted to the fifth antenna 761 disposed on the side surface of the printed circuit board 702 through the first feeding line 771. In the same manner, an electrical signal supplied through the sixth feeding pad 752 may be transmitted to the sixth antenna 762 through the second feeding line 772, and an electrical signal supplied through the seventh feeding pad 753 may be transmitted to the seventh antenna 763 through the third feeding line 773, and an electrical signal supplied through the eighth feeding pad 754 may be transmitted to the eighth antenna 764 through the fourth feeding line 774.

[0156] On the other hand, because Fig. 7A and Figure 7B The embodiments of the present disclosure are illustrated, so the scope of the present disclosure should not be limited to Fig. 7A and Figure 7B The number of end-fire antennas disposed on the side surface of the flexible printed circuit board can be changed according to the needs of the designer.

[0157] Figure 7C is a diagram illustrating a structure of an antenna module including a plurality of antennas according to an embodiment of the present disclosure.

[0158] refer to Figure 7C, the antenna module may include a first antenna 731, a second antenna 732, a third antenna 733, and a fourth antenna 734 disposed on the upper end surface of the flexible printed circuit board 723, and a fifth antenna 791, a sixth antenna 792, a seventh antenna 793, an eighth antenna 794, a ninth antenna 795, a tenth antenna 796, an eleventh antenna 797, and a twelfth antenna 798 disposed on the side surface of the flexible printed circuit board 723. According to various embodiments, the antenna module may be disposed in a closed space on the inside of the electronic device. For example, the first antenna 731, the second antenna 732, the third antenna 733, and the fourth antenna 734 disposed on the upper end surface of the flexible printed circuit board 723 may radiate radio waves in the direction of the front surface or the rear surface of the electronic device, while the fifth antenna 791, the sixth antenna 792, the seventh antenna 793, the eighth antenna 794, the ninth antenna 795, the tenth antenna 796, the eleventh antenna 797, and the twelfth antenna 798 disposed on the side surface of the flexible printed circuit board 723 may radiate radio waves toward the side surface of the electronic device.

[0159] According to one embodiment, if the antenna module is deployed inside the electronic device, the first antenna 731, the second antenna 732, the third antenna 733, and the fourth antenna 734 may be broadside antennas of the electronic device, and the fifth antenna 791, the sixth antenna 792, the seventh antenna 793, the eighth antenna 794, the ninth antenna 795, the tenth antenna 796, the eleventh antenna 797, and the twelfth antenna 798 may be end-fire antennas of the electronic device. According to various embodiments, by deploying all broadside antennas and end-fire antennas on one flexible printed circuit board 723, a larger number of antennas may be deployed inside the electronic device, and the antennas may be deployed in various positions inside the electronic device.

[0160] According to one embodiment, a printed circuit board (not shown) on which a plurality of layers are laminated may be disposed on the lower end surface of the flexible printed circuit board 723. According to various embodiments, the lower end surface of the flexible printed circuit board 723 and the upper end surface of the printed circuit board may be spaced apart from each other by a first length. For example, the first length may be determined based on the wavelength of the radio wave to be radiated by the antenna module.

[0161] According to one embodiment, an electrical signal supplied through a plurality of feeding pads disposed on an upper end surface of the printed circuit board may be transmitted to a fifth antenna 791 disposed on a side surface of the printed circuit board through a first feeder 781. In the same manner, electrical signals for radiating radio waves may be supplied to sixth antenna 792 to twelfth antenna 798 through second feeders 782 to eighth feeders 788 corresponding to the respective antennas.

[0162] Figure 8is a graph of S-parameters of an antenna module according to an embodiment of the present disclosure.

[0163] Figure 8 A graph showing an s-parameter in the case of using the antenna module structure according to the present disclosure under the assumption that the frequency band to be radiated is 39 GHz.

[0164] refer to Figure 8 According to the antenna module structure according to the present disclosure, it can be determined that both vertical polarization and horizontal polarization have high gain values ​​in the 39 GHz band (about 15 dB in the case of horizontal polarization and about 20 dB in the case of vertical polarization). Figure 8 From the curve graph, it can be determined that the antenna module structure disclosed in the present disclosure can be applied to high frequency bands.

[0165] Fig.9A is a graph illustrating a degree of degradation of a gain value as the distance between coupling pads in an antenna module structure varies according to an embodiment of the present disclosure.

[0166] refer to Fig.9A , multiple antenna arrays can be deployed on one flexible printed circuit board constituting an antenna module. For example, in a 5G mobile communication system using a 6 GHz or higher frequency band, 256 antenna arrays can be deployed on one flexible printed circuit board. According to various embodiments, in the case where multiple antenna arrays are deployed on one flexible printed circuit board, a feed pad can be formed on one surface of the flexible printed circuit board corresponding to each antenna array and on one surface of the printed circuit board facing the flexible printed circuit board.

[0167] According to one embodiment, the feed pads formed on the flexible printed circuit board and the feed pads formed on the printed circuit board may be spaced apart from each other by a predetermined distance. According to various embodiments, the distances between the plurality of feed pads formed on the flexible printed circuit board and the plurality of feed pads formed on the printed circuit board may be uneven. For example, due to the flexibility of the flexible printed circuit board, the distance error between the plurality of feed pads formed on the flexible printed circuit board and the plurality of feed pads formed on the printed circuit board may be approximately 100 μm.

[0168] Fig.9A is a graph illustrating a change in the s parameter as the distance error between the plurality of feed pads formed on the flexible printed circuit board and the plurality of feed pads formed on the printed circuit board varies. More specifically, Fig.9Ais a graph illustrating a degree of degradation of a gain value with frequency when a distance error between the plurality of feeding pads formed on the flexible printed circuit board and the plurality of feeding pads formed on the printed circuit board is formed within 0 μm to 100 μm at intervals of 10 μm.

[0169] according to Fig.9A , when the distance error between the plurality of feeding pads formed on the flexible printed circuit board and the plurality of feeding pads formed on the printed circuit board is 100 μm, it can be determined that a gain value degradation of about 13 dB occurs compared to a case without a distance error.

[0170] Fig. 9B is a graph illustrating a degree of degradation of a gain value according to a distance between coupling pads in an antenna module structure including an adhesive layer according to an embodiment of the present disclosure.

[0171] Fig. 9B The graph illustrated in FIG. 1 is a graph illustrating a change in the s parameter with a distance error between the plurality of feed pads formed on the flexible printed circuit board and the plurality of feed pads formed on the printed circuit board when the thin film layer includes an adhesive layer (e.g., a double-sided tape) between the plurality of feed pads formed on the flexible printed circuit board and the plurality of feed pads formed on the printed circuit board. More specifically, Fig.9A In the same way as the curve graph, Fig. 9B The graph of is a graph illustrating a change in the degree of degradation of the gain value with frequency when the distance error between the plurality of feeding pads formed on the flexible printed circuit board and the plurality of feeding pads formed on the printed circuit board is formed within 0 μm to 100 μm at intervals of 10 μm.

[0172] According to one embodiment, Fig. 9B The dielectric constant of the thin film layer used in the simulation illustrated in the graph of may be about 2.7. Fig. 9B According to the curve graph, when the distance error between the multiple feeding pads formed on the flexible printed circuit board and the multiple feeding pads formed on the printed circuit board at a specific frequency (for example, 32.5 GHz) is 100 μm, it can be determined that a gain value degradation of approximately 5 dB occurs compared to a case without a distance error.

[0173] That is, by comparing Fig.9A The graphs and Fig. 9BAccording to the curve graph illustrated in FIG. 1 , by disposing a thin film layer having a specific dielectric constant between the flexible printed circuit board and the printed circuit board, it can be determined that the gain value degradation of the antenna module is reduced. In addition, in the case where one surface of the flexible printed circuit board is combined with one surface of the printed circuit board by a double-sided tape, the distance between the multiple feed pads formed on the flexible printed circuit board and the multiple feed pads formed on the printed circuit board can be minimized.

[0174] Fig. 9C is a graph illustrating a degree of degradation of a gain value as a function of a distance between coupling pads in an antenna module structure including a first dielectric layer according to an embodiment of the present disclosure.

[0175] Fig. 9C The graph illustrated in FIG. 1 is a graph illustrating a variation of the s parameter with a distance error between the plurality of feed pads formed on the flexible printed circuit board and the plurality of feed pads formed on the printed circuit board when the first dielectric layer is disposed between the plurality of feed pads formed on the flexible printed circuit board and the plurality of feed pads formed on the printed circuit board. More specifically, Fig.9A In the same way as the curve graph, Fig. 9C The graph of is a graph illustrating a change in the degree of degradation of the gain value with frequency when the distance error between the plurality of feeding pads formed on the flexible printed circuit board and the plurality of feeding pads formed on the printed circuit board is formed within 0 μm to 100 μm at intervals of 10 μm.

[0176] According to one embodiment, Fig. 9C The dielectric constant of the first dielectric layer used in the simulation illustrated in the graph of may be about 5.5. Fig. 9C According to the curve graph, when the distance error between the multiple feeding pads formed on the flexible printed circuit board and the multiple feeding pads formed on the printed circuit board at a specific frequency (for example, 32.5 GHz) is 100 μm, it can be determined that a gain value degradation of approximately 1.8 dB occurs compared to a case without a distance error.

[0177] That is, by comparing Fig.9A The graphs and Fig. 9C According to the graph illustrated in FIG. 1 , by disposing a dielectric layer having a specific dielectric constant between the flexible printed circuit board and the printed circuit board, it can be determined that the gain value degradation of the antenna module is reduced.

[0178] Fig.9D is a graph illustrating a degree of degradation of a gain value as a function of a distance between coupling pads in an antenna module structure including a second dielectric layer according to an embodiment of the present disclosure.

[0179] Fig.9D The graph illustrated in FIG. 1 is a graph illustrating a variation of the s parameter with a distance error between the plurality of feed pads formed on the flexible printed circuit board and the plurality of feed pads formed on the printed circuit board when the second dielectric layer is disposed between the plurality of feed pads formed on the flexible printed circuit board and the plurality of feed pads formed on the printed circuit board. More specifically, Fig.9A In the same way as the curve graph, Fig.9D The graph of is a graph illustrating a change in the degree of degradation of the gain value with frequency when the distance error between the plurality of feeding pads formed on the flexible printed circuit board and the plurality of feeding pads formed on the printed circuit board is formed within 0 μm to 100 μm at intervals of 10 μm.

[0180] According to one embodiment, Fig.9D The dielectric constant of the second dielectric layer used in the simulation illustrated in the graph of may be about 10. Fig.9D According to the curve graph, when the distance error between the multiple feeding pads formed on the flexible printed circuit board and the multiple feeding pads formed on the printed circuit board at a specific frequency (for example, 32.5 GHz) is 100 μm, it can be determined that a gain value degradation of approximately 0.5 dB occurs compared to a case without a distance error.

[0181] That is, by comparing Fig.9A The graphs and Fig.9D By disposing a dielectric layer with a specific dielectric constant between the flexible printed circuit board and the printed circuit board according to the curve graph illustrated in FIG. 1 , it can be determined that the gain value degradation of the antenna module is reduced. Further, by comparing FIG. 9B to FIG. 9D From the graph disclosed in , it can be determined that the gain value degradation of the antenna module is reduced when the dielectric material having a high dielectric constant is disposed between the flexible printed circuit board and the printed circuit board.

[0182] Fig. 10A is a diagram illustrating a printed circuit board to which a coupling method is applied according to an embodiment of the present disclosure.

[0183] refer to Fig. 10A According to various embodiments, on one surface of the printed circuit board 1001, a first feeding pad 1011 and a second feeding pad 1013 for supplying an electrical signal transmitted from a wireless communication chip (not shown) disposed on another surface of the printed circuit board 1001 may be disposed.

[0184] According to one embodiment, the flexible printed circuit board on which the antenna is disposed may be disposed to be spaced apart by a predetermined length from one surface of the printed circuit board 1001. According to various embodiments, in the case where the antenna module uses a capacitive coupling method, most preferably, the distance between the printed circuit board 1001 and the flexible printed circuit board is configured to be 50 μm.

[0185] According to one embodiment, if the distance between the printed circuit board 1001 and the flexible printed circuit board is 50 μm, the error tolerance range of the distance between the printed circuit board 1001 and the flexible printed circuit board may be 20 μm. According to various embodiments, the error tolerance range may be determined within a range where the degradation degree of the gain value of the antenna module is equal to or lower than 6 dB.

[0186] Fig. 10B is a diagram illustrating a printed circuit board to which a coupling method is applied according to an embodiment of the present disclosure.

[0187] refer to Fig. 10B According to various embodiments, on one surface of the printed circuit board 1002, a feed pad 1012 and a feed line 1021 for supplying an electrical signal transmitted from a wireless communication chip (not shown) disposed on another surface of the printed circuit board 1002 may be disposed.

[0188] According to one embodiment, the flexible printed circuit board on which the antenna is disposed may be disposed to be spaced apart by a predetermined length from one surface of the printed circuit board 1002. According to various embodiments, in the case where the antenna module uses a proximity coupling method, most preferably, the distance between the printed circuit board 1002 and the flexible printed circuit board is configured to be 50 μm.

[0189] According to one embodiment, if the distance between the printed circuit board 1002 and the flexible printed circuit board is 50 μm, the error tolerance range of the distance between the printed circuit board 1002 and the flexible printed circuit board may be 10 μm. According to various embodiments, the error tolerance range may be determined within a range where the degradation degree of the gain value of the antenna module is equal to or lower than 6 dB.

[0190] Fig. 10C is a diagram illustrating a printed circuit board to which a coupling method is applied according to an embodiment of the present disclosure.

[0191] refer to Fig. 10C, the antenna module may use an aperture coupling method (e.g., a resonant coupling method). According to various embodiments, on the inside of the printed circuit board 1003, a feed pad 1014 and a feed line 1022 for supplying an electrical signal transmitted from a wireless communication chip (not shown) disposed on another surface of the printed circuit board 1003 may be disposed. According to various embodiments, an opening 1031 for passing an electrical signal supplied from the feed line 1022 therethrough may be formed on one surface of the printed circuit board 1003.

[0192] According to one embodiment, the flexible printed circuit board on which the antenna is disposed may be disposed to be spaced apart by a predetermined length from one surface of the printed circuit board 1003. According to various embodiments, in the case where the antenna module uses an aperture coupling method, most preferably, the distance between the printed circuit board 1003 and the flexible printed circuit board is configured to be 130 μm.

[0193] According to one embodiment, if the distance between the printed circuit board 1003 and the flexible printed circuit board is 130 μm, the error tolerance range of the distance between the printed circuit board 1003 and the flexible printed circuit board may be 60 μm. According to various embodiments, the error tolerance range may be determined within a range where the degradation degree of the gain value of the antenna module is equal to or lower than 6 dB.

[0194] refer to FIG. 10A to FIG. 10C , the distance between coupling pads in the antenna module structure according to the present disclosure (for example, the distance between pads formed on a flexible printed circuit board on which an antenna is deployed and pads formed on a printed circuit board on which a wireless communication chip is deployed) can be determined based on the coupling method or the frequency (or wavelength) of the radio waves to be radiated by the antenna.

[0195] Fig.11 is a diagram illustrating a beamforming operation performed in an antenna module structure according to an embodiment of the present disclosure.

[0196] refer to Fig.11 The antenna module may include: a first antenna 1101, which forms a first radiation area in a first direction; a second antenna 1103, which forms a second radiation area in a second direction; a wireless communication chip 1111, which is configured to supply radio frequency signals to the first antenna 1101 and the second antenna 1103; and a modem 1121, which is configured to send a baseband signal for creating a radio frequency to the wireless communication chip 1111.

[0197] According to one embodiment, the modem 1121 may transmit a control signal for beamforming to the wireless communication chip 1111. According to various embodiments, the wireless communication chip 1111 may transmit a radio frequency signal having a specific phase to the first antenna 1101 and the second antenna 1103 based on the control signal.

[0198] According to one embodiment, the wireless communication chip 1111 may include a first phase shifter 1113 corresponding to the first antenna 1101 and a second phase shifter 1115 corresponding to the second antenna 1103. According to various embodiments, the wireless communication chip 1111 may control the first phase shifter 1113 based on a control signal to control the first antenna 1101 to perform beamforming in a first direction. For example, if the modem 1121 transmits a first digital signal of a specific bit to the wireless communication chip 1111, the wireless communication chip 1111 having received the first digital signal may adjust the phase of the first phase shifter 1113 so that the first antenna 1101 forms a beam at a specific angle (e.g., 50°).

[0199] According to one embodiment, the wireless communication chip 1111 may control the second phase shifter 1115 based on the control signal to control the second antenna 1103 to perform beamforming in the second direction. For example, if the modem 1121 sends a second digital signal of a specific bit to the wireless communication chip 1111, the wireless communication chip 1111 having received the second digital signal may adjust the phase of the second phase shifter 1115 so that the second antenna 1103 forms a beam at a specific angle (e.g., 70°).

[0200] According to one embodiment, the wireless communication chip 1111 may include a mixer 1117 configured to generate a radio frequency component based on a local frequency signal and an intermediate frequency signal. According to various embodiments, the wireless communication chip 1111 may include an analog-to-digital converter (ADC) for converting an analog signal received from the first antenna 1101 or the second antenna 1103 into a digital signal or a digital-to-analog converter (DAC) for converting a digital signal received from the modem 1121 into an analog signal.

[0201] Fig.12 is a diagram illustrating a structure of an antenna module including a wireless communication chip and a modem according to an embodiment of the present disclosure.

[0202] refer to Fig.12The antenna module may include: a flexible printed circuit board 1201, which includes a first surface oriented in a first direction and a second surface oriented in a second direction, the second direction forming a predetermined first angle relative to the first direction; a first antenna 1211, which is disposed on one surface of the first surface and is configured to form a first radiation area in a third direction; a second antenna 1221, which is disposed on one surface of the second surface and is configured to form a second radiation area in a fourth direction; a wireless communication chip 1231, which is disposed on another surface of the flexible printed circuit board 1201 and is configured to supply radio frequency signals to the first antenna 1211 and the second antenna 1221; and a modem 1241, which is configured to send a baseband signal for creating a radio frequency to the wireless communication chip 1231.

[0203] According to one embodiment, the modem 1241 may transmit a control signal for beamforming to the wireless communication chip 1231. According to various embodiments, the wireless communication chip 1231 may transmit a radio frequency signal having a specific phase to the first antenna 1211 and the second antenna 1221 based on the control signal.

[0204] According to one embodiment, the wireless communication chip 1231 may include a first phase shifter corresponding to the first antenna 1211 and a second phase shifter corresponding to the second antenna 1221. According to various embodiments, the wireless communication chip 1231 may control the first phase shifter based on the control signal so that the first antenna 1211 performs beamforming in the third direction. For example, if the modem 1241 sends a first digital signal of a specific bit to the wireless communication chip 1231, the wireless communication chip 1231 that has received the first digital signal may adjust the phase of the first phase shifter so that the first antenna 1211 forms a beam at a specific angle (e.g., 50°).

[0205] According to one embodiment, the wireless communication chip 1231 may control the second phase shifter based on the control signal so that the second antenna 1221 performs beamforming in the fourth direction. For example, if the modem 1241 sends a second digital signal of a specific bit to the wireless communication chip 1231, the wireless communication chip 1231 that has received the second digital signal may adjust the phase of the second phase shifter so that the second antenna 1221 forms a beam at a specific angle (e.g., 70°).

[0206] According to one embodiment, the wireless communication chip 1231 may include a mixer configured to generate a radio frequency component based on a local frequency signal and an intermediate frequency signal. According to various embodiments, the wireless communication chip 1231 may include an analog-to-digital converter (ADC) for converting an analog signal received from the first antenna 1211 or the second antenna 1221 into a digital signal or a digital-to-analog converter (DAC) for converting a digital signal received from the modem 1241 into an analog signal.

[0207] According to one embodiment, an antenna module may include: a flexible printed circuit board (FPCB), the flexible printed circuit board including a first surface oriented in a first direction and a second surface oriented in a second direction, the second direction forming a predetermined first angle relative to the first direction; a first antenna, the first antenna being deployed on a surface of the first surface and configured to form a first radiation area in a third direction; and a second antenna, the second antenna being deployed on a surface of the second surface and configured to form a second radiation area in a fourth direction.

[0208] According to one embodiment, at least a portion of the first radiation area and at least a portion of the second radiation area may not overlap with each other.

[0209] According to one embodiment, the antenna module may further include a controller, which is electrically connected to the first antenna and the second antenna and is configured to control the radiation direction of the radio waves radiated by the first antenna and the second antenna, wherein the controller is configured to control the first antenna to perform beamforming for the first radiation area and control the second antenna to perform beamforming for the second radiation area.

[0210] According to one embodiment, the antenna module may further include: a first feed pad, which is disposed on another surface of the first surface; a first feed line, which is configured to electrically connect the first feed pad and the first antenna to each other in the flexible printed circuit board; a second feed pad, which is disposed on another surface of the first surface; and a second feed line, which is configured to electrically connect the second feed pad and the second antenna to each other in the flexible printed circuit board.

[0211] According to one embodiment, the antenna module may further include: a printed circuit board having a surface disposed to be spaced apart from another surface of the first surface by a predetermined first length and at least one layer laminated therein; a third feed pad disposed on one surface of the printed circuit board and corresponding to the first feed pad; and a fourth feed pad disposed on one surface of the printed circuit board and corresponding to the second feed pad.

[0212] According to one embodiment, the first length may be determined based on a wavelength of a radio wave radiated by the first antenna or the second antenna.

[0213] According to one embodiment, the first length may be equal to or greater than 5 μm and equal to or less than 500 μm.

[0214] According to one embodiment, the antenna module may further include: a wireless communication chip, which is disposed on another surface of the printed circuit board; a third feed line, which is configured to electrically connect the wireless communication chip and the third feed pad to each other in the printed circuit board; and a fourth feed line, which is configured to electrically connect the wireless communication chip and the fourth feed pad to each other in the printed circuit board.

[0215] According to one embodiment, the antenna module may further include a thin film layer, which is disposed between the other surface of the first surface of the flexible printed circuit board and one surface of the printed circuit board and is configured to uniformly maintain the distance between the other surface of the first surface of the flexible printed circuit board and one surface of the printed circuit board.

[0216] According to one embodiment, the film layer may further include an adhesive layer configured to adhere the other surface of the first surface of the flexible printed circuit board and one surface of the printed circuit board to each other.

[0217] According to one embodiment, the antenna module may further include: a wireless communication chip having a surface deployed to be spaced apart from another surface of the first surface by a predetermined second length; a third feed pad deployed on a surface of the wireless communication chip corresponding to the first feed pad; and a fourth feed pad deployed on a surface of the wireless communication chip corresponding to the second feed pad.

[0218] According to the antenna module according to one embodiment, the flexible printed circuit board may include a first layer deployed on its upper end surface and a second layer deployed below the first layer, and the first antenna may be deployed on a surface of the first surface on the first layer oriented in the first direction, the second antenna may be deployed on a surface of the second surface on the first layer oriented in the second direction, and a third antenna may be deployed on a surface of the first surface on the second layer oriented in the first direction.

[0219] According to one embodiment, the antenna module may further include a third antenna, which is deployed on a surface of the third surface of the flexible printed circuit board oriented in a third direction, wherein the third direction and the first direction form a predetermined second angle, and the third direction and the second direction form a predetermined third angle.

[0220] According to one embodiment, the first antenna or the second antenna may include at least one of the following: a patch antenna, a monopole antenna, a helical antenna, a wave antenna, a Yagi antenna, a loop antenna, a Vivaldi antenna, or a holographic antenna.

[0221] According to one embodiment, an electronic device may include: a front member, which is oriented in a first direction; a rear member, which is oriented in a second direction opposite to the first direction; a side member, which surrounds the space between the front member and the rear member; and an antenna module, which is deployed in a closed space formed by the front member, the rear member and the side member, wherein the antenna module may include: a flexible printed circuit board (FPCB), the flexible printed circuit board including a first surface facing the front member and a second surface facing the side member; a first antenna, which is deployed on one surface of the first surface and is configured to form a first radiation area in a third direction; and a second antenna, which is deployed on one surface of the second surface and is configured to form a second radiation area in a fourth direction.

[0222] According to one embodiment, at least a portion of the first radiation area and at least a portion of the second radiation area may not overlap with each other.

[0223] According to one embodiment, the antenna module may further include a controller, which is electrically connected to the first antenna and the second antenna and is configured to control the radiation direction of the radio waves radiated by the first antenna and the second antenna, wherein the controller may be configured to control the first antenna to perform beamforming for the first radiation area and control the second antenna to perform beamforming for the second radiation area.

[0224] According to one embodiment, the first radiation area may be a radiation area formed when radio waves are radiated through the front member or the rear member, and the second radiation area may be a radiation area formed when the radio waves are radiated through the side member.

[0225] According to one embodiment, the antenna module may further include: a first feed pad, which is disposed on another surface of the first surface; a first feed line, which is configured to electrically connect the first feed pad and the first antenna to each other in the flexible printed circuit board; a second feed pad, which is disposed on another surface of the first surface; and a second feed line, which is configured to electrically connect the second feed pad and the second antenna to each other in the flexible printed circuit board.

[0226] According to one embodiment, the antenna module may further include: a printed circuit board having a surface disposed to be spaced apart from another surface of the first surface by a predetermined first length and at least one layer laminated therein; a third feed pad disposed on one surface of the printed circuit board and corresponding to the first feed pad; and a fourth feed pad disposed on one surface of the printed circuit board and corresponding to the second feed pad.

[0227] According to one embodiment, the first length may be determined based on a wavelength of a radio wave radiated by the first antenna or the second antenna.

[0228] According to one embodiment, the first length may be equal to or greater than 5 μm and equal to or less than 500 μm.

[0229] According to one embodiment, the antenna module may further include: a wireless communication chip, which is disposed on another surface of the printed circuit board; a third feed line, which is configured to electrically connect the wireless communication chip and the third feed line to each other in the printed circuit board; and a fourth feed line, which is configured to electrically connect the wireless communication chip and the fourth feed pad to each other in the printed circuit board.

[0230] According to one embodiment, the antenna module may further include a thin film layer, which is disposed between the other surface of the first surface of the flexible printed circuit board and the one surface of the printed circuit board and is configured to uniformly maintain the distance between the other surface of the first surface of the flexible printed circuit board and the one surface of the printed circuit board.

[0231] According to one embodiment, the film layer may further include an adhesive layer configured to adhere the other surface of the first surface of the flexible printed circuit board and one surface of the printed circuit board to each other.

[0232] According to one embodiment, the antenna module may further include: a wireless communication chip having a surface deployed to be spaced apart from another surface of the first surface by a predetermined second length; a third feed pad deployed on a surface of the wireless communication chip corresponding to the first feed pad; and a fourth feed pad deployed on a surface of the wireless communication chip corresponding to the second feed pad.

[0233] According to one embodiment, the flexible printed circuit board may include a first layer deployed on its upper end surface and a second layer deployed below the first layer, and the first antenna may be deployed on a surface of the first surface on the first layer oriented in the first direction, the second antenna may be deployed on a surface of the second surface on the first layer oriented in the second direction, and a third antenna may be deployed on a surface of the first surface on the second layer oriented in the first direction.

[0234] According to one embodiment, the antenna module may further include a third antenna, which is deployed on a surface of the third surface of the flexible printed circuit board formed in a third direction, and the third direction and the first direction can form a predetermined second angle, and the third direction and the second direction can form a predetermined third angle.

[0235] According to one embodiment, the first antenna may include a broadside antenna array and the second antenna may include an endfire antenna array.

[0236] According to one embodiment, the first antenna or the second antenna may include at least one of the following: a patch antenna, a monopole antenna, a helical antenna, a wave antenna, a Yagi antenna, a loop antenna, a Vivaldi antenna, or a holographic antenna.

[0237] According to one embodiment, an antenna module may include: a flexible printed circuit board (FPCB), the flexible printed circuit board including a first surface oriented in a first direction and a second surface oriented in a second direction, the second direction forming a predetermined first angle relative to the first direction; a first antenna, the first antenna being disposed on one surface of the first surface and configured to form a first radiation area in a third direction; a second antenna, the second antenna being disposed on one surface of the second surface and configured to form a second radiation area in a fourth direction; a wireless communication chip, the wireless communication chip being disposed on another surface of the flexible printed circuit board and configured to supply a radio frequency signal to the first antenna and the second antenna; and a modem, the modem being configured to send a baseband signal to the wireless communication chip, wherein the modem can be configured to send a control signal for beamforming to the wireless communication chip, and the wireless communication chip can be configured to send a radio frequency signal to the first antenna and the second antenna based on the control signal.

[0238] According to one embodiment, the wireless communication chip may include a first phase shifter corresponding to the first antenna and a second phase shifter corresponding to the second antenna, and the wireless communication chip may be configured to control the first phase shifter based on the control signal so that the first antenna performs beamforming in the third direction, and the wireless communication chip may be configured to control the second phase shifter based on the control signal so that the second antenna performs beamforming in the fourth direction.

[0239] According to one embodiment, the modem may be configured to send a first control signal to the first phase shifter to cause the first antenna to perform beamforming in the third direction, and the modem may be configured to send a second control signal to the second phase shifter to cause the second antenna to perform beamforming in the fourth direction.

[0240] According to one embodiment, the wireless communication chip may include a mixer configured to generate a radio frequency component based on a local frequency signal and an intermediate frequency signal.

[0241] According to one embodiment, at least a portion of the first radiation area and at least a portion of the second radiation area may not overlap with each other.

[0242] According to one embodiment, the antenna module may further include: a first feed pad, which is disposed on another surface of the first surface; a first feed line, which is configured to electrically connect the first feed pad and the first antenna to each other in the flexible printed circuit board; a second feed pad, which is disposed on another surface of the first surface; and a second feed line, which is configured to electrically connect the second feed pad and the second antenna to each other in the flexible printed circuit board.

[0243] According to one embodiment, the antenna module may further include: a printed circuit board having a surface disposed to be spaced apart from another surface of the first surface by a predetermined first length and at least one layer laminated therein; a third feed pad disposed on one surface of the printed circuit board and corresponding to the first feed pad; and a fourth feed pad disposed on one surface of the printed circuit board and corresponding to the second feed pad.

[0244] According to one embodiment, the first length may be determined based on a wavelength of a radio wave radiated by the first antenna or the second antenna.

[0245] According to one embodiment, the first length may be equal to or greater than 5 μm and equal to or less than 500 μm.

[0246] According to one embodiment, the wireless communication chip may be deployed on another surface of the printed circuit board, and the antenna module may further include: a third feed line, which is configured to electrically connect the wireless communication chip and the third feed pad to each other in the printed circuit board; and a fourth feed line, which is configured to electrically connect the wireless communication chip and the fourth feed pad to each other in the printed circuit board.

[0247] According to one embodiment, the antenna module may further include a thin film layer, which is disposed between the other surface of the first surface of the flexible printed circuit board and the one surface of the printed circuit board and is configured to uniformly maintain the distance between the other surface of the first surface of the flexible printed circuit board and the one surface of the printed circuit board.

[0248] According to one embodiment, the film layer may further include an adhesive layer configured to adhere the other surface of the first surface of the flexible printed circuit board and one surface of the printed circuit board to each other.

[0249] According to one embodiment, the wireless communication chip may have a surface deployed to be spaced apart from another surface of the first surface by a predetermined second length, and the antenna module may further include: a third feed pad, which is deployed on a surface of the wireless communication chip corresponding to the first feed pad; and a fourth feed pad, which is deployed on a surface of the wireless communication chip corresponding to the second feed pad.

[0250] According to one embodiment, the flexible printed circuit board may include a first layer deployed on its upper end surface and a second layer deployed below the first layer, and the first antenna may be deployed on a surface of the first surface on the first layer oriented in the first direction, the second antenna may be deployed on a surface of the second surface on the first layer oriented in the second direction, and a third antenna may be deployed on a surface of the first surface on the second layer oriented in the first direction.

[0251] According to one embodiment, the antenna module may further include: a third antenna, which is deployed on a surface of the third surface of the flexible printed circuit board oriented in a third direction, wherein the third direction and the first direction can form a predetermined second angle, and the third direction and the second direction can form a predetermined third angle.

[0252] According to one embodiment, the first antenna or the second antenna may include at least one of the following: a patch antenna, a monopole antenna, a helical antenna, a wave antenna, a Yagi antenna, a loop antenna, a Vivaldi antenna, or a holographic antenna.

[0253] According to the embodiments of the present disclosure, antennas can be efficiently deployed in various locations within an electronic device, and thus the gain value and coverage of radio waves can be improved.

[0254] According to an embodiment of the present disclosure, an antenna module of a wireless communication system may include: a first printed circuit board, the first printed circuit board including a first surface oriented in a first direction and a second surface oriented in a second direction; and an antenna, the antenna being disposed on a first area of ​​the first surface of the first printed circuit board and configured to form a first radiation area; a second printed circuit board, the second printed circuit board including a first surface disposed to be spaced apart from the second surface of the first printed circuit board by a predetermined length; a first feed pad, the first feed pad being disposed on a first area of ​​the second surface of the first printed circuit board; a first feed line, the first feed line being configured to electrically connect the first feed pad and the first antenna to each other in the first printed circuit board; a second feed pad, the second feed pad being disposed on a first surface of the second printed circuit board corresponding to the first feed pad; a wireless communication chip, the wireless communication chip being disposed on a second surface of the second printed circuit board; and a second feed line, the second feed line being configured to electrically connect the wireless communication chip and the second feed pad to each other on the second printed circuit board; wherein the first printed circuit board may be a flexible printed circuit board (FPCB).

[0255] According to an embodiment of the present disclosure, the first length may be determined based on a wavelength of a radio wave radiated by at least one of the first antenna or the second antenna.

[0256] In addition, according to the embodiments of the present disclosure, the feed pad of the printed circuit board and the antenna are not directly connected to each other, so the degree of freedom of antenna arrangement design within the electronic device can be improved.

[0257] While the present disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. An antenna circuit of a wireless communication system, the antenna circuit comprising: a first printed circuit board, the first printed circuit board comprising a first surface oriented in a first direction and a second surface oriented in a second direction, the second direction being bent from the first surface at a predetermined first angle; a first feeding pad and a second feeding pad, the first feeding pad and the second feeding pad being arranged on a third surface of the first printed circuit board opposite to the first surface, the first feeding pad and the second feeding pad being separated; a first antenna, the first antenna being disposed on a first surface of the first printed circuit board and forming a first radiation area in a third direction; a second antenna, the second antenna being disposed on a second surface of the first printed circuit board and forming a second radiation area in a fourth direction; a first feed line electrically connecting the first feed pad to the first antenna in the first printed circuit board by extending from the third surface of the first printed circuit board to the first surface; and a second feed line electrically connecting the second feed pad to the second antenna in the first printed circuit board by extending from the third surface to the second surface of the first printed circuit board; and a circuit that is not physically connected to the first printed circuit board, the circuit being separated from the first printed circuit board by a predetermined first length based on at least one feeding method of capacitive coupling, inductive coupling or resonant coupling, wherein the circuit feeds a radio frequency signal to the first printed circuit board according to the at least one feeding method, and Wherein, the first printed circuit board comprises a flexible printed circuit board.

2. The antenna circuit according to claim 1, wherein: At least a portion of the first radiation area and at least a portion of the second radiation area do not overlap with each other.

3. The antenna circuit according to claim 1, further comprising: a processor, the processor being electrically connected to the first antenna and the second antenna, the processor being configured to: controlling the radiation direction of radio waves radiated by the first antenna and the second antenna, controlling the first antenna to perform beamforming for the first radiation area, and The second antenna is controlled to perform beamforming with respect to the second radiation area.

4. The antenna circuit according to claim 1, wherein: The antenna circuit comprises: A second printed circuit board, wherein the second printed circuit board comprises: a first surface spaced apart from a third surface of the first printed circuit board by the first length, and at least one layer laminated in said second printed circuit board; a third feeding pad, the third feeding pad being disposed on the first surface of the second printed circuit board and corresponding to the first feeding pad; and A fourth feeding pad is disposed on the first surface of the second printed circuit board and corresponds to the second feeding pad.

5. The antenna circuit according to claim 1, wherein: The first length is determined based on a wavelength of a radio wave radiated by at least one of the first antenna or the second antenna.

6. The antenna circuit according to claim 1, wherein: The first length is equal to or greater than 5 μm, or equal to or less than 500 μm.

7. The antenna circuit according to claim 4, further comprising: a wireless communication chip, wherein the wireless communication chip is disposed on the second surface of the second printed circuit board; a third feed line, the third feed line electrically connecting the wireless communication chip to the third feed pad in the second printed circuit board; as well as A fourth feed line electrically connects the wireless communication chip to the fourth feed pad in the second printed circuit board.

8. The antenna circuit according to claim 4, further comprising: a thin film layer, wherein the thin film layer is disposed between the third surface of the first printed circuit board and the first surface of the second printed circuit board, The film layer uniformly maintains the distance between the third surface of the first printed circuit board and the first surface of the second printed circuit board.

9. The antenna circuit according to claim 8, wherein: The film layer includes an adhesive layer that adheres the third surface of the first printed circuit board to the first surface of the second printed circuit board.

10. The antenna circuit according to claim 1, wherein: The antenna circuit comprises: a wireless communication chip, the wireless communication chip comprising a first surface spaced apart from a third surface of the first printed circuit board by a predetermined second length; a third feed pad, the third feed pad being disposed on the first surface of the wireless communication chip and corresponding to the first feed pad; and A fourth feeding pad is disposed on the first surface of the wireless communication chip, and corresponds to the second feeding pad.

11. The antenna circuit according to claim 1, in, The first printed circuit board includes a first layer disposed on an upper end surface thereof and a second layer disposed below the first layer. The first antenna is arranged on a first surface of the first layer of the first printed circuit board facing the first direction. The second antenna is arranged on a second surface of the first layer of the first printed circuit board facing the second direction, and A third antenna is arranged on a surface of the second layer of the first printed circuit board facing the first direction.

12. The antenna circuit according to claim 1, further comprising: a third antenna, the third antenna being disposed on a surface of the first printed circuit board facing a third direction; wherein the third direction and the first direction form a predetermined second angle, and Wherein, the third direction and the second direction form a predetermined third angle.

13. The antenna circuit according to claim 1, wherein: At least one of the first antenna or the second antenna includes at least one of the following: a patch antenna, a monopole antenna, a helical antenna, a wave antenna, a Yagi antenna, a loop antenna, a Vivaldi antenna, or a holographic antenna.

14. The antenna circuit according to claim 1, wherein: The antenna circuit comprises: a wireless communication chip that supplies a radio frequency signal to the first antenna and the second antenna; and a modem, the modem sending a baseband signal to the wireless communication chip, wherein the modem sends a control signal for beamforming to the wireless communication chip, and The wireless communication chip sends a radio frequency signal to the first antenna and the second antenna based on the control signal.

15. The antenna circuit according to claim 14, in, The wireless communication chip includes a first phase shifter corresponding to the first antenna and a second phase shifter corresponding to the second antenna, and The wireless communication chip controls the first phase shifter based on the control signal so that the first antenna performs beamforming in the third direction, and controls the second phase shifter based on the control signal so that the second antenna performs beamforming in the fourth direction.

16. The antenna circuit according to claim 15, in, The modem sends a first control signal to the first phase shifter to cause the first antenna to perform beamforming in the third direction, and The modem sends a second control signal to the second phase shifter to enable the second antenna to perform beamforming in the fourth direction.

17. The antenna circuit according to claim 14, wherein: The wireless communication chip includes a mixer that generates a radio frequency component based on a local frequency signal and an intermediate frequency signal.

18. The antenna circuit according to claim 1, wherein: The second feeding line extending from the third surface of the first printed circuit board to the second surface is bent at the predetermined first angle.

19. An electronic device comprising: a front member oriented in a first direction; a rear member oriented in a second direction opposite to the first direction; a side member surrounding a space between the front member and the rear member; as well as an antenna module disposed in a closed space formed by the front member, the rear member and the side member, Wherein, the antenna module comprises: a first printed circuit board, the first printed circuit board comprising a first surface oriented in a first direction and a second surface oriented in a second direction, the second direction being bent from the first surface at a predetermined first angle; a first feeding pad and a second feeding pad, the first feeding pad and the second feeding pad being arranged on a third surface of the first printed circuit board opposite to the first surface, the first feeding pad and the second feeding pad being separated; a first antenna, the first antenna being disposed on the first surface of the first printed circuit board and forming a first radiation area in a third direction; a second antenna, the second antenna being disposed on the second surface of the first printed circuit board and forming a second radiation area in a fourth direction; a first feed line electrically connecting the first feed pad to the first antenna in the first printed circuit board by extending from the third surface to the first surface of the first printed circuit board; and a second feed line electrically connecting the second feed pad to the second antenna in the first printed circuit board by extending from the third surface to the second surface of the first printed circuit board; and a circuit that is not physically connected to the first printed circuit board, the circuit being separated from the first printed circuit board by a predetermined first length based on at least one feeding method of capacitive coupling, inductive coupling or resonant coupling, wherein the circuit feeds a radio frequency signal to the first printed circuit board according to the at least one feeding method, and Wherein, the first printed circuit board comprises a flexible printed circuit board.

20. The electronic device according to claim 19, in, The first radiation area is a radiation area formed when radio waves are radiated through the front member or the rear member, and The second radiation area is a radiation area formed when the radio waves are radiated through the side member.

Images