Broadband intelligent seismic sensor

Abstract

The present application relates to a kind of broadband intelligent seismic sensor, including data acquisition device, with data acquisition device detachable connection and from the tail cone of insertion installation surface;Data acquisition device includes bottom shell, detection unit is installed in bottom shell, signal board is installed in bottom shell and is connected with detection unit, control board is installed in bottom shell and is electrically connected with signal board;Signal board receives the seismic response signal generated by detection unit, and the low-frequency component in seismic response signal is amplified to widen the bandwidth of intelligent seismic sensor.Processing, this broadband intelligent seismic sensor not only can collect wider range of seismic data, but also can widen bandwidth, detection precision is high, and sensitivity is good.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of seismic exploration, more particularly to a wideband intelligent seismic sensor. BACKGROUND

[0002] The existing seismic exploration equipment, such as the seismic sensor, generally only sets the geophone in one direction or sets the geophone in three directions to realize the seismic exploration through the detection data in three directions. However, the existing three-direction seismic sensor has a too narrow frequency band, and cannot detect the data of lower frequency on the low end side, so that the detection precision is low and the sensitivity is poor. SUMMARY

[0003] The present application aims at solving the above-mentioned defects of the prior art, and provides a wideband intelligent seismic sensor.

[0004] The technical scheme adopted by the present application to solve the technical problem is that a wideband intelligent seismic sensor is constructed, which comprises a data acquisition device, a tail cone which is detachably connected with the data acquisition device and is inserted from a mounting surface;

[0005] The data acquisition device comprises a bottom shell, a geophone unit installed in the bottom shell, a signal board installed in the bottom shell and connected with the geophone unit, and a control board installed in the bottom shell and electrically connected with the signal board.

[0006] The signal board receives the seismic induction signal generated by the geophone unit, and amplifies the low-frequency component in the seismic induction signal to widen the bandwidth of the intelligent seismic sensor.

[0007] Preferably, the geophone unit comprises a first geophone installed in the bottom shell and arranged along a first direction, a second geophone installed in the bottom shell and arranged along a second direction, and a third geophone installed in the bottom shell and arranged along a third direction.

[0008] The signal board comprises a first signal processing circuit, a second signal processing circuit and a third signal processing circuit which are correspondingly arranged with the first geophone, the second geophone and the third geophone.

[0009] The first signal processing circuit receives the first seismic induction signal generated by the first geophone, and amplifies the low-frequency component in the first seismic induction signal.

[0010] The second signal processing circuit receives the second seismic induction signal generated by the second geophone, and amplifies the low-frequency component in the second seismic induction signal.

[0011] The third signal processing circuit receives a third seismic induced signal generated by the third geophone and amplifies a low frequency component in the third seismic induced signal.

[0012] Preferably, the first signal processing circuit, the second signal processing circuit and the third signal processing circuit each comprise a first-stage inverting filter amplification circuit and a second-stage non-inverting filter amplification circuit.

[0013] An input end of the first-stage inverting filter amplification circuit receives a seismic induced signal, an output end of the first-stage inverting filter amplification circuit is connected with an input end of the second-stage non-inverting filter amplification circuit, and an output end of the second-stage non-inverting filter amplification circuit is connected with the control board.

[0014] Preferably, the first-stage inverting filter amplification circuit comprises a first resistor, a second resistor, a third resistor, a first capacitor and a first operational amplifier, and the second-stage non-inverting filter amplification circuit comprises a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, a second capacitor, a third capacitor and a second operational amplifier.

[0015] A first end of the first resistor receives a seismic induced signal, a second end of the first resistor is connected with a negative input end of the first operational amplifier, a positive input end of the first operational amplifier is connected with a signal ground, the second resistor and the first capacitor form an RC series circuit and are connected in parallel with the third resistor, an output end of the first operational amplifier is connected with a positive input end of the second operational amplifier, a negative input end of the second operational amplifier is connected with a signal ground through the fourth resistor, the fifth resistor is connected in parallel between the negative input end and an output end of the second operational amplifier, the sixth resistor and the second capacitor form an RC series circuit, the seventh resistor and the third capacitor form an RC series circuit, and the two RC series circuits are connected in parallel with the fifth resistor in sequence, and an output end of the second operational amplifier outputs a processed signal.

[0016] Preferably, the first-stage inverting filter amplification circuit performs inverting filter amplification processing on the received seismic induced signal and transmits the processed signal to the second-stage non-inverting filter amplification circuit, and the second-stage non-inverting filter amplification circuit performs non-inverting filter amplification processing on the seismic induced signal processed by the first-stage inverting filter amplification circuit, so as to improve the gain of the low frequency end of the wideband intelligent seismic sensor, extend the low end of the channel bandwidth to 0.2 Hz, or to less than 0.2 Hz.

[0017] Preferably, the data acquisition device further comprises a mounting seat for mounting the first geophone, the second geophone and the third geophone.

[0018] The mounting seat comprises an upper seat body and a lower seat body detachably connected with the upper seat body.

[0019] The top surface of the lower seat body is provided with a first installation groove for mounting the first detector, a second installation groove for mounting the second detector, and a third installation groove for mounting the third detector; the first installation groove is arranged in the first direction; the second installation groove is arranged in the second direction; and the third installation groove is arranged in the third direction.

[0020] The upper seat body is provided with a first cover groove, a second cover groove, and a third cover groove corresponding to the first installation groove, the second installation groove, and the third installation groove.

[0021] Preferably, the data acquisition device further comprises an upper cover; the control board is arranged close to the opening of the bottom shell and opposite to the upper cover; the signal board is arranged on the side opposite to the control board and the upper cover; and the control board and the signal board are electrically connected through a plug-in connector.

[0022] And / or, the upper cover is provided with a first interface and a second interface; the first interface and the second interface are connected to the control board through a flexible adapter plate.

[0023] The upper cover is further provided with a first end cover and a second end cover corresponding to the first interface and the second interface.

[0024] And / or, the upper cover is provided with a sealing structure in sealing connection with the bottom shell.

[0025] Preferably, the data acquisition device further comprises a shielding plate arranged on the side of the upper seat body opposite to the signal board to shield interference signals.

[0026] Preferably, the data acquisition device further comprises a power supply device installed in the bottom shell; the power supply device is electrically connected with the control board and the signal board to supply power to the control board and the signal board.

[0027] And / or, the power supply device comprises a fixing frame for fixing the power supply device.

[0028] The fixing frame is a ring-shaped fixing frame; the inner side of the ring-shaped fixing frame is provided with a receiving cavity for receiving the mounting seat.

[0029] Preferably, it further comprises a leveling assembly arranged at the bottom of the bottom shell for adjusting the horizontal state of the intelligent seismic sensor.

[0030] The wideband intelligent seismic sensor provided by the present application has the following beneficial effects: the wideband intelligent seismic sensor amplifies the low-frequency component in the seismic induction signal generated by the detection unit through the signal board, effectively widens the bandwidth of the intelligent seismic sensor, increases the collection range of the seismic data, thereby improving the detection precision of the seismic sensor, and makes the sensitivity of the seismic sensor better. BRIEF DESCRIPTION OF DRAWINGS

[0031] The present application will be further described below in conjunction with the drawings and embodiments, wherein:

[0032] Figure 1 is a structural schematic diagram of the wideband intelligent seismic sensor of some embodiments of the present application;

[0033] Figure 2 is an exploded schematic diagram of the wideband intelligent seismic sensor of some embodiments of the present application;

[0034] Figure 3 is a structural schematic diagram of the bottom of the upper cover of the wideband intelligent seismic sensor of the present application;

[0035] Figure 4 is a structural schematic diagram of the power supply of the wideband intelligent seismic sensor of the present application;

[0036] Figure 5 is a schematic diagram of the signal processing circuit of the present application. DETAILED DESCRIPTION

[0037] In order to have a clearer understanding of the technical features, objectives and effects of the present application, the specific embodiments of the present application will be described in detail with reference to the drawings.

[0038] It should be noted that, unless otherwise specified, when a certain feature is referred to as being "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or indirectly fixed or connected to the other feature. In addition, the up, down, left, right, front, back, etc. described in the present application are only relative to the relative positions of the components of the present application in the drawings. In addition, unless otherwise defined, all technical and scientific terms used in the present application have the same meaning as generally understood by those skilled in the art. The terms used in the specification of the present application are only used to describe the specific embodiments, and are not intended to limit the present application. The term "and / or" used in the present application includes any combination of one or more related listed items.

[0039] Reference Figure 1 and Figure 2 shows the structural schematic diagram of some preferred embodiments of each embodiment provided by the present application.

[0040] Specifically, reference is made to Figures 1 to 4In some embodiments, the broadband intelligent seismic sensor includes a data acquisition device and a tail cone 30. The data acquisition device can be used to acquire seismic data to detect seismic activity. The tail cone 30 is detachably connected to the data acquisition device and can be inserted from the mounting surface to facilitate the installation of the entire broadband intelligent seismic sensor at the detection location, enabling seismic exploration of the detected area.

[0041] Furthermore, such as Figure 1 As shown, in some embodiments, the data acquisition device may include a base shell 10, a top cover 20, a detector unit, a shielding plate 14, a signal board 13, a control board 12, and a power supply unit 19. The base shell 10 may be a hollow structure with an opening at one end, and the top cover 20 may be closed over its opening to house components such as the detector unit, shielding plate 14, signal board 13, control board 12, and power supply unit 19 within the base shell 10. The top cover 20 may be disposed at the opening of the base shell 10, and it may be used to seal components such as the detector unit, shielding plate 14, signal board 13, control board 12, and power supply unit 19 within the base shell 10.

[0042] In some embodiments, the detection unit can be installed in the base shell 10 to detect seismic data in the detection area of ​​the broadband seismic sensor. The detection unit may include: a first detector 161 installed in the base shell 10 and arranged along a first direction; a second detector 162 installed in the base shell 10 and arranged along a second direction; and a third detector 163 installed in the base shell 10 and arranged along a third direction. The first detector 161, the second detector 162, and the third detector 163 can be fixed inside the base shell 10 by a mounting base 15. Further, the first detector 161, the second detector 162, and the third detector 163 can acquire seismic data from three directions respectively, giving the broadband intelligent seismic sensor three detection channels. In some embodiments, the first direction, the second direction, and the third direction can be mutually perpendicular to form a three-axis Cartesian coordinate system, wherein the first direction can be the X-axis direction, the second direction can be the Y-axis direction, and the third direction can be the Z-axis direction.

[0043] In some embodiments, the signal board 13 is mounted in the base shell 10 and connected to the detection unit, receiving the seismic sensing signal generated by the detection unit, and amplifying the low-frequency components in the seismic sensing signal to broaden the bandwidth of the broadband intelligent seismic sensor. Further, the signal board 13 also processes the seismic sensing signal and transmits it to the control unit. In some embodiments, the signal board 13 may include a first signal processing circuit, a second signal processing circuit, and a third signal processing circuit corresponding to the first detector 161, the second detector 162, and the third detector 163.

[0044] Specifically, the first signal processing circuit receives the first seismic induction signal generated by the first geophone 161 and amplifies the low-frequency component in the first seismic induction signal; the second signal processing circuit receives the second seismic induction signal generated by the second geophone 162 and amplifies the low-frequency component in the second seismic induction signal; and the third signal processing circuit receives the third seismic induction signal generated by the third geophone 163 and amplifies the low-frequency component in the third seismic induction signal. That is, after the first seismic induction signal detected by the first geophone 161, the second seismic induction signal detected by the second geophone 162, and the third seismic induction signal detected by the third geophone 163 are transmitted to the signal board 13, the signal board 13 is correspondingly distributed to the first signal processing circuit, the second signal processing circuit, and the third signal processing circuit, and then amplified by the first signal processing circuit, the second signal processing circuit, and the third signal processing circuit before being transmitted to the control unit.

[0045] In the embodiments of the present application, the first signal processing circuit, the second signal processing circuit, and the third signal processing circuit can adopt the same circuit structure. In some embodiments, the first signal processing circuit, the second signal processing circuit, and the third signal processing circuit can each include a first-stage inverting filter amplification circuit and a second-stage same-phase filter amplification circuit; the input end of the first-stage inverting filter amplification circuit receives the seismic induction signal, the output end of the first-stage inverting filter amplification circuit is connected with the input end of the second-stage same-phase filter amplification circuit, and the output end of the second-stage same-phase filter amplification circuit is connected with the control board 12. In some embodiments, the first-stage inverting filter amplification circuit transmits the received seismic induction signal to the second-stage same-phase filter amplification circuit after inverting filter amplification processing; and the second-stage same-phase filter amplification circuit performs same-phase filter amplification processing on the seismic induction signal after the inverting filter amplification processing, so as to improve the gain of the low-frequency end of the wide-frequency intelligent seismic sensor and extend the low-end channel bandwidth to 0.2 Hz or less than 0.2 Hz.

[0046] In some embodiments, as shown in FIG. 1, Figure 5 The first-stage inverting filter amplification circuit can include a first resistor R1.1, a second resistor R2.1, a third resistor R3.1, a first capacitor C1.1, and a first operational amplifier IOP1. The second-stage same-phase filter amplification circuit can include a fourth resistor R4.1, a fifth resistor R5.1, a sixth resistor R6.1, a seventh resistor R7.1, a second capacitor C2.1, a third capacitor C3.0, and a second operational amplifier IOP2.

[0047] The following describes one of the channels (assuming the first geophone 161) as an example:

[0048] The first terminal of the first resistor R1.1 receives the first seismic induction signal (VG1) generated by the first detector 161. The second terminal of the first resistor R1.1 is connected to the negative input terminal of the first operational amplifier IOP1. The positive input terminal of the first operational amplifier IOP1 is connected to signal ground. The third resistor R3.1 is connected in parallel between the negative input terminal and the output terminal of the first operational amplifier IOP1. The second resistor R2.1 and the first capacitor C1.1 form an RC series circuit and are then connected in parallel with the third resistor R3.1. The output terminal of the first operational amplifier IOP1 is connected to the positive input terminal of the second operational amplifier IOP2. The negative input terminal of the second operational amplifier IOP2 is connected to signal ground through the fourth resistor R4.1. The fifth resistor R5.1 is connected in parallel between the negative input terminal and the output terminal of the second operational amplifier IOP2. The sixth resistor R6.1 and the second capacitor C2.1 form an RC series circuit, and the seventh resistor R7.1 and the third capacitor C3.0 form an RC series circuit and are then connected in parallel with the fifth resistor R5.1. The output terminal of the second operational amplifier IOP2 outputs the processed signal (VF1).

[0049] like Figure 5 As shown, the first-stage inverting filter amplification: for the DC component, the first capacitor C1.1 is equivalent to an open circuit, with a gain of -R3.1 / R1.1. At the high-frequency end, the first capacitor C1.1 is equivalent to a short circuit, with a gain of -(R3.1*R2.1) / R1.1*(R3.1+R2.1). From DC to the high-frequency end, as the signal frequency increases, the gain gradually decreases from -R3.1 / R1.1 to -(R3.1*R2.1) / R1.1*(R3.1+R2.1). The second-stage in-phase filtering amplification: From DC to the high-frequency end, as the signal frequency increases, the gain gradually decreases from 1+R5.1 / R4.1 to R5.1*R6.1*R7.1 / (R5.1*R6.1+R5.1*R7.1+R6.1*R7.1). Through the above two-stage cascaded operational amplifier filtering amplification process, the gain at the low-frequency end of the detector can be improved, and the low end of the bandwidth of each channel can be extended to 0.2Hz, thereby enabling the data acquisition bandwidth of the broadband intelligent seismic sensor to reach 0.2Hz to 150Hz. In some embodiments, the first-stage inverting filtering amplification and the second-stage in-phase filtering amplification can extend the low end of the bandwidth of each channel even lower, reaching below 0.2Hz, thereby enabling the data acquisition bandwidth of the broadband intelligent seismic sensor to reach below 0.2Hz to 150Hz.

[0050] In some embodiments, the shape and size of the upper cover 20 can be adapted to the cross-sectional shape and size of the opening of the bottom shell 10. A sealing structure 18 can be provided between the upper cover 20 and the bottom shell 10, which can be a sealing rubber ring provided on the annular protrusion inside the upper cover 20, and can be embedded in the annular protrusion of the upper cover 20. In some embodiments, the sealing structure 18 can include a first sealing ring 181 and a second sealing ring 182, and the periphery of the annular protrusion is provided with a first groove 201 and a second groove 202 in which the first sealing ring 181 and the second sealing ring 182 can be embedded. When the upper cover 20 and the bottom shell 10 are assembled, the upper cover 20 and the bottom shell 10 are fixed by the locking screw 222, and the connection between the upper cover 20 and the bottom shell 10 is sealed by the sealing structure 18, which can prevent water or moisture from entering the inside of the seismic sensor.

[0051] In some embodiments, a bubble level can be provided on the upper cover 20 for observing whether the seismic sensor is placed in a horizontal state when it is working. In some embodiments, an indicator light can also be provided on the upper cover 20, which can include a first LED indicator light for GPS state indication and a second LED indicator light for charging indication, one end of which penetrates the outer side of the upper cover 20, and the other end penetrates the inner side of the upper cover 20 and is electrically connected with the control board 12. When the seismic sensor receives a GPS signal for positioning and time synchronization and time correction, the first LED indicator light flashes, and after successful time correction, the first LED indicator light is extinguished. When charging, the second LED indicator light is always on, and when the seismic sensor is working for data acquisition, the second LED indicator light flashes. In some embodiments, a standard 3C seismic sensor step direction arrow and a capital letter N can be provided on the outer side of the upper cover 20, indicating that when the broadband 3C seismic sensor is arranged and installed, the direction should point to the geographic north pole to ensure that the seismic sensor normally senses signals.

[0052] In some embodiments, the upper cover 20 is provided with a first interface 21 and a second interface 22; the first interface 21 and the second interface 22 can be respectively provided on the upper cover 20 and connected to the control board 12 through a flexible adapter plate (FPC). In some embodiments, the first interface 21 can be a data download test interface, and the second interface 22 can be a charging interface or an external power supply interface connected to an external power supply to meet different endurance time requirements. The upper cover 20 is also provided with a first end cover 221 and a second end cover 211 corresponding to the first interface 21 and the second interface 22. The first end cover 221 and the second end cover 211 are respectively matched with the first interface 21 and the second interface 22, and when not in use, the first end cover 221 and the second end cover 211 are respectively tightened to cover and protect the first interface 21 and the second interface 22 from accidental damage, and also prevent water immersion from causing the pins in the first interface 21 and the second interface 22 to rust.

[0053] In some embodiments, the data acquisition device further includes a mounting seat 15 for mounting the first detector 161, the second detector 162, and the third detector 163. The mounting seat 15 can be provided in the bottom shell 10 and can include an upper seat body 151 and a lower seat body 152 detachably connected to the upper seat body 151. The upper seat body 151 and the lower seat body 152 cooperate to fix the first detector 161, the second detector 162, and the third detector 163. In some embodiments, the upper seat body 151 and the lower seat body 152 can be detachably connected through a threaded connection structure. The upper seat body 151 can be provided with a first cover groove, a second cover groove, and a third cover groove; the top surface of the lower seat body 152 is provided with a first mounting groove 1521 for mounting the first detector 161, a second mounting groove 1522 for mounting the second detector 162, and a third mounting groove 1523 for mounting the third detector 163. The first mounting groove 1521 can be arranged in a first direction for mounting the first detector 161, and the first cover groove can cover the first mounting groove 1521. The second mounting groove 1522 can be arranged in a second direction for mounting the second detector 162, and the second cover groove can cover the second mounting groove 1522. The third mounting groove 1523 can be arranged in a third direction for mounting the third detector 163, and the third cover groove can cover the third mounting groove 1523. During assembly, the first detector 161, the second detector 162, and the third detector 163 are respectively mounted in the first mounting groove 1521, the second mounting groove 1522, and the third mounting groove 1523, and then the upper seat body 151 is covered on the lower seat body 152 and tightened with screws, thereby fixing the upper seat body 151 and the lower seat body 152. The mounting seat 15 is provided with a through hole, and the lead-out wires of the first detector 161, the second detector 162, and the third detector 163 can be led out through the through hole to be connected to the signal board 13.

[0054] In some embodiments, a shielding plate 14 can be arranged on the side of the upper seat 151 opposite to the signal board 13, and the shielding plate 14 can be arranged on the top surface of the upper seat 151. The shielding plate 14 can be a magnetic shielding plate 14, which can be used to shield interference signals, such as to isolate the first detector 161, the second detector 162, the third detector 163, and the control board 12, thereby shielding electromagnetic radiation interference from the control board 12 or other external signal interference. In some embodiments, the shielding plate 14 can be made of soft magnetic alloy material, and of course, it can be understood that in some embodiments, the shielding plate 14 can also use other materials with good shielding effect. The seismic induction signals detected by the first detector 161, the second detector 162, and the third detector 163 are connected to the signal board 13 above the shielding plate 14 through wires.

[0055] In some embodiments, the control board 12 is arranged close to the opening of the bottom shell 10, and the control board 12 is arranged horizontally relative to the upper cover 20, and an antenna can be arranged thereon, which can be arranged close to the opening of the bottom shell 10 to facilitate the reception of satellite signals. The antenna can be a GPS antenna, which can be used for positioning and time synchronization. The control board 12 can include a GPS module, a TF card storage unit, a Bluetooth module, an MCU control unit, and other components to complete GPS positioning and time synchronization, realize Bluetooth monitoring of seismic data acquisition quality, and store and recover the processed seismic data.

[0056] In some embodiments, the signal board 13 can be arranged at the opening of the bottom shell 10, and the signal board 13 can be arranged on the side opposite to the upper cover 20 relative to the control board 12, and the signal board 13 can be arranged between the control board 12 and the shielding plate 14, and can be arranged parallel to the control board 12. In some embodiments, the signal board 13 and the control board 12 can be mechanically connected through a plug-in connector, and the plug-in connector can be powered to achieve electrical connection between the signal board 13 and the control board 12. The first interface 21 and the second interface 22 can be connected to the control board 12 through a flexible adapter plate (FPC).

[0057] In the embodiments of the present application, the signal board 13 and the control board 12 are both PCBA boards.

[0058] Further, in some embodiments, the first detector 161, the second detector 162, and the third detector 163 can be moving coil detectors, each of which can be in a columnar shape. The first detector 161, the second detector 162, and the third detector 163 are correspondingly installed in the first mounting groove 1521, the second mounting groove 1522, and the third mounting groove 1523, and the third detector 163 is perpendicular to the plane in which the first detector 161 and the second detector 162 are located.

[0059] In some embodiments, the signal board 13 amplifies the seismic induced signals outputted from the first detector 161, the second detector 162 and the third detector 163, enhances the low frequency components of the seismic induced signals, and widens the frequency band of the seismic sensor acquisition channel, which can reach 0.2Hz-150Hz. The signal board 13 transmits the processed seismic signals of the three channels to the control board 12, which is processed by the MCU of the control board 12 and stored in the TF card in a predetermined format.

[0060] In some embodiments, the data acquisition device further comprises a power supply device 19 installed in the bottom shell 10, which is electrically connected with the control board 12 and the signal board 13 for powering the control board 12 and the signal board 13. In some embodiments, the power supply device 19 comprises a plurality of batteries 191 arranged in a ring shape and a connecting member connecting the plurality of batteries 191, which can be used to charge or power the data acquisition device. The plurality of batteries 191 can be rechargeable batteries 191. In some embodiments, the connecting member can comprise a first connecting member 193 and a second connecting member 194, which are respectively arranged at both ends of the battery 191 and connected with the electrodes of the plurality of batteries 191. In some embodiments, the first connecting member 193 can be one or two or more. The second connecting member 194 can also be one or two or more. In some embodiments, the first connecting member 193 and the second connecting member 194 can both be nickel strips.

[0061] In some embodiments, the power supply device 19 comprises a power management board 192 connected with the plurality of batteries 191 arranged in a ring shape, which can be installed in a fixing frame. The fixing frame is arranged at the bottom of the bottom shell 10. In some embodiments, the fixing frame can be a ring-shaped fixing frame, which can comprise an upper frame body 1951 and a lower frame body 1952. The upper frame body 1951 and the lower frame body 1952 can be detachably connected, and cooperate to fix the batteries 191 and the power management board 192. The lower frame body 1952 can be provided with a plurality of second receiving spaces in which the batteries 191 and the power management board 192 can be installed. The upper frame body 1951 is provided with a plurality of first receiving spaces 196 which can be fitted with the second receiving spaces to receive the batteries 191 and the power management board 192 therein. When assembled, the upper frame body 1951 and the lower frame body 1952 are respectively fitted on the battery 191 group to fix the batteries 191.

[0062] In some embodiments, the ring-shaped fixing frame has a receiving cavity 1953 for receiving the mounting base 15. The shape and size of the receiving cavity 1953 are adapted to the shape and size of the mounting base 15, so that the mounting base 15 is mounted in cooperation with the ring-shaped fixing frame. In assembly, the upper frame body 1951 and the lower frame body 1952 are respectively sleeved on the ring-shaped batteries 191, so as to fix the batteries 191. The lead-out wires of the batteries 191 and the lead-out wires of the power management board 192 are led out from the end surface of the fixing frame. Then, the fixing frame is mounted in the bottom shell 10, and the mounting base 15 is mounted in the ring-shaped fixing frame, so as to form a closely coupled structure.

[0063] In some embodiments, the bottom of the bottom shell 10 is provided with a leveling assembly 40 which is detachably connected with the bottom shell 10. The leveling assembly 40 can be used to adjust the horizontal state of the intelligent seismic sensor. The leveling assembly 40 can include a plurality of threaded columns, and the height of each threaded column is adjustable. When the intelligent seismic sensor is arranged, the height of the intelligent seismic sensor can be adjusted according to the actual terrain of the arrangement, so that the intelligent seismic sensor can be adjusted to the required horizontal state for work, and accurately sense the seismic signal. In some embodiments, the leveling assembly 40 can include a first threaded column 41 arranged at the bottom of the bottom shell 10, a second threaded column 42 arranged at the bottom of the bottom shell 10, and a third threaded column 43 arranged at the bottom of the bottom shell 10. The bottom of the bottom shell 10 is provided with a first threaded hole, a second threaded hole and a third threaded hole corresponding to the first threaded column 41, the second threaded column 42 and the third threaded column 43. The first threaded column 41 is relatively rotated with the first threaded hole, and / or the second threaded column 42 is relatively rotated with the second threaded hole, and / or the third threaded column 43 is relatively rotated with the third threaded hole, so as to adjust the height of the intelligent seismic sensor.

[0064] In some embodiments, the tail cone 30 is arranged at the bottom of the bottom shell 10 and detachably connected with the bottom shell 10. The tail cone 30 can insert the intelligent seismic sensor from the mounting surface, so that the intelligent seismic sensor can meet different arrangement occasions.

[0065] The above embodiments are only for illustrating the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and implement it accordingly, and cannot limit the protection scope of the present application. Any equivalent changes and modifications made within the scope of the claims of the present application shall belong to the scope of the claims of the present application.

Claims

1. A broadband intelligent seismic sensor, characterized in that, Includes a data acquisition device, a tail cone (30) detachably connected to the data acquisition device, and inserted from the mounting surface; The data acquisition device includes a bottom shell (10), a detector unit installed in the bottom shell (10), a signal board (13) installed in the bottom shell (10) and connected to the detector unit, and a control board (12) installed in the bottom shell (10) and electrically connected to the signal board (13). The signal board (13) receives the seismic sensing signal generated by the detector unit and amplifies the low-frequency components in the seismic sensing signal to broaden the bandwidth of the intelligent seismic sensor. The signal board (13) includes a signal processing circuit corresponding to the detection unit; The signal processing circuit includes a first-stage inverting filter amplifier circuit and a second-stage non-inverting filter amplifier circuit. The input terminal of the first-stage inverting filter amplifier circuit receives the seismic induction signal, the output terminal of the first-stage inverting filter amplifier circuit is connected to the input terminal of the second-stage non-inverting filter amplifier circuit, and the output terminal of the second-stage non-inverting filter amplifier circuit is connected to the control board (12). The first-stage inverting filter amplifier circuit includes: a first resistor, a second resistor, a third resistor, a first capacitor, and a first operational amplifier; the second-stage non-inverting filter amplifier circuit includes: a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, a second capacitor, a third capacitor, and a second operational amplifier. The first end of the first resistor receives the seismic induction signal. The second end of the first resistor is connected to the negative input terminal of the first operational amplifier. The positive input terminal of the first operational amplifier is connected to signal ground. The second resistor and the first capacitor form an RC series circuit and are then connected in parallel with the third resistor. The output terminal of the first operational amplifier is connected to the positive input terminal of the second operational amplifier. The negative input terminal of the second operational amplifier is connected to signal ground through the fourth resistor. The fifth resistor is connected in parallel between the negative input terminal and the output terminal of the second operational amplifier. The sixth resistor and the second capacitor form an RC series circuit, and the seventh resistor and the third capacitor form an RC series circuit and are then connected in parallel with the fifth resistor. The output terminal of the second operational amplifier outputs the processed signal. The first-stage inverting filter amplifier circuit performs inverting filter amplification on the received seismic sensing signal and then transmits it to the second-stage in-phase filter amplifier circuit. The second-stage in-phase filter amplifier circuit performs in-phase filter amplification on the seismic sensing signal after inverting filter amplification to improve the gain of the low-frequency end of the broadband intelligent seismic sensor, so that the low end of the channel bandwidth is extended to 0.2Hz or to less than 0.2Hz.

2. The broadband intelligent seismic sensor according to claim 1, characterized in that, The detection unit includes: a first detector (161) installed in the bottom shell (10) and arranged along a first direction; a second detector (162) installed in the bottom shell (10) and arranged along a second direction; and a third detector (163) installed in the bottom shell (10) and arranged along a third direction. The signal board (13) includes a first signal processing circuit, a second signal processing circuit, and a third signal processing circuit, which are respectively arranged corresponding to the first detector (161), the second detector (162), and the third detector (163); The first signal processing circuit receives the first seismic induction signal generated by the first detector (161) and amplifies the low-frequency components in the first seismic induction signal. The second signal processing circuit receives the second seismic induction signal generated by the second detector (162) and amplifies the low-frequency components in the second seismic induction signal; The third signal processing circuit receives the third seismic induction signal generated by the third detector (163) and amplifies the low-frequency components in the third seismic induction signal.

3. The broadband intelligent seismic sensor according to claim 2, characterized in that, The first signal processing circuit, the second signal processing circuit, and the third signal processing circuit all include: a first-stage inverting filter amplifier circuit and a second-stage non-inverting filter amplifier circuit; The input terminal of the first-stage inverting filter amplifier circuit receives the seismic induction signal, the output terminal of the first-stage inverting filter amplifier circuit is connected to the input terminal of the second-stage in-phase filter amplifier circuit, and the output terminal of the second-stage in-phase filter amplifier circuit is connected to the control board (12).

4. The broadband intelligent seismic sensor according to claim 2, characterized in that, The data acquisition device also includes a mounting base (15) for mounting the first detector (161), the second detector (162) and the third detector (163). The mounting base (15) includes an upper base (151) and a lower base (152) detachably connected to the upper base (151). The top surface of the lower base (152) is provided with a first mounting slot (1521) for mounting the first detector (161), a second mounting slot (1522) for mounting the second detector (162), and a third mounting slot (1523) for mounting the third detector (163); the first mounting slot (1521) is located in the first direction; the second mounting slot (1522) is located in the second direction; and the third mounting slot (1523) is located in the third direction. The upper seat (151) is provided with a first cover groove, a second cover groove and a third cover groove corresponding to the first mounting groove (1521), the second mounting groove (1522) and the third mounting groove (1523).

5. The broadband intelligent seismic sensor according to claim 1, characterized in that, The data acquisition device also includes an upper cover (20); the control board (12) is located near the opening of the bottom shell (10) and is opposite to the upper cover (20); the signal board (13) is located on the side of the control board (12) opposite to the upper cover (20); the control board (12) and the signal board (13) are electrically connected by a connector; And / or, the upper cover (20) is provided with a first interface and a second interface; the first interface and the second interface are connected to the control board (12) through a flexible adapter plate. The upper cover (20) is also provided with a first end cover and a second end cover corresponding to the first interface and the second interface; And / or, the upper cover (20) is provided with a sealing structure (18) that is sealed to the bottom shell (10).

6. The broadband intelligent seismic sensor according to claim 1, characterized in that, The data acquisition device further includes a shielding plate (14) disposed on the side of the upper body (151) opposite to the signal plate (13) to shield interference signals.

7. The broadband intelligent seismic sensor according to claim 1, characterized in that, The data acquisition device also includes a power supply device (19) installed in the bottom shell (10); the power supply device (19) is electrically connected to the control board (12) and the signal board (13) to supply power to the control board (12) and the signal board (13); And / or, the power supply device (19) includes a mounting bracket for securing the power supply device (19); The fixing frame is a ring-shaped fixing frame; the inner side of the ring-shaped fixing frame is provided with a receiving cavity (1953) for accommodating the mounting base (15).

8. The broadband intelligent seismic sensor according to claim 1, characterized in that, Also includes: A leveling assembly (40) is disposed at the bottom of the base shell (10) for adjusting the horizontal state of the smart seismic sensor.

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