Circuit board defect detection device and system

Abstract

The present invention provides a circuit board defect detection device and system, the device includes a base, and a processor, a mobile component, an image acquisition component, a first tray and a second tray fixed on the base, the mobile component and the image acquisition component are both connected to the processor in communication; wherein the first tray is provided with a circuit board to be detected; the mobile component is used to take the circuit board to be detected from the first tray, move the circuit board to be detected from the first tray to the second tray, and place the circuit board to be detected on the second tray; the image acquisition component is used to collect a circuit board image of the circuit board to be detected when the circuit board to be detected passes through a designated area; the processor is used to output a defect detection result corresponding to the circuit board image when receiving the circuit board image. The present invention can standardize the defect detection results of the circuit board, and can also effectively improve the accuracy of the circuit board defect detection results.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board detection, and in particular to a circuit board defect detection device and system. Background Art

[0002] At present, before a circuit board is put into use, it is necessary to perform a quality inspection on it. Taking the inspection of surface defects of a flexible printed circuit board (FPCB) as an example, since the size of the FPCB (such as 13.26*13.86mm) is small, when inspecting the surface defects of the FPCB, a 16x or 25x magnification microscope is usually used, and the operator visually inspects the FPCB and determines the surface condition of the FPCB. Since different operators have different understandings of the same specification, there will be certain differences in the inspection results, and the above inspection method also has the problem of low accuracy. Summary of the invention

[0003] The object of the present invention is to provide a circuit board defect detection device and system, which can standardize the circuit board defect detection results and effectively improve the accuracy of the circuit board defect detection results.

[0004] In the first aspect, an embodiment of the present invention provides a circuit board defect detection device, including a base, and a processor, a moving component, an image acquisition component, a first material tray and a second material tray fixed on the base, wherein the moving component and the image acquisition component are both communicatively connected to the processor; wherein the first material tray is placed with a circuit board to be detected; the moving component is used to take the circuit board to be detected from the first material tray, move the circuit board to be detected from the first material tray to the second material tray, and place the circuit board to be detected on the second material tray; wherein the circuit board to be detected passes through a designated area of ​​the image acquisition component during the movement; the image acquisition component is used to capture a circuit board image of the circuit board to be detected when the circuit board to be detected passes through the designated area, and send the circuit board image to the processor; the processor is used to output a defect detection result corresponding to the circuit board image when receiving the circuit board image.

[0005] In one embodiment, the moving component includes a moving shaft and a material picking device mounted on the moving shaft; wherein the material picking device picks up the circuit board to be tested from the first material tray; the moving shaft moves the circuit board to be tested from the first material tray to the second material tray; and the material picking device places the circuit board to be tested on the second material tray.

[0006] In one embodiment, the material picking device includes a plurality of suction nozzles, each of which is used to suck the circuit board to be inspected.

[0007] In one embodiment, the nozzle is made of antistatic material.

[0008] In one embodiment, the image acquisition component includes a light source unit and a shooting unit fixed under the light source unit; wherein the light source unit provides a designated light source required for capturing images; and the shooting unit captures a circuit board image of the circuit board to be inspected when the circuit board to be inspected passes through the designated area.

[0009] In one embodiment, the light source unit includes an ultraviolet ring light source and a white ring light source; the ultraviolet ring light source and the white ring light source are arranged in parallel.

[0010] In one embodiment, the photographing unit includes a first lens and a first camera fixed below the ultraviolet ring light source, and a second lens and a second camera fixed below the white ring light source.

[0011] In one embodiment, the image acquisition component further includes a light source controller connected to the light source unit, for controlling the on / off state of the light source unit.

[0012] In one embodiment, the circuit board to be inspected includes a flexible printed circuit board.

[0013] In a second aspect, an embodiment of the present invention provides a circuit board defect detection system, comprising: a circuit board defect detection device as described in any one of the first aspects, and a display connected to the circuit board defect detection device, wherein the display is used to display the defect detection results output by the circuit board defect detection device.

[0014] The embodiments of the present invention bring the following beneficial effects:

[0015] A circuit board defect detection device and system provided by an embodiment of the present invention comprises a base, and a processor, a moving component, an image acquisition component, a first tray and a second tray fixed on the base, wherein the moving component and the image acquisition component are both connected to the processor in communication; wherein the first tray is provided with a circuit board to be detected; the moving component is used to take the circuit board to be detected from the first tray, move the circuit board to be detected from the first tray to the second tray, and place the circuit board to be detected on the second tray; wherein the circuit board to be detected passes through a designated area of ​​the image acquisition component during the movement; the image acquisition component is used to collect a circuit board image of the circuit board to be detected when the circuit board to be detected passes through the designated area, and send the circuit board image to the processor; the processor is used to output a defect detection result corresponding to the circuit board image when receiving the circuit board image. The above device collects the circuit board image of the circuit board to be detected when the circuit board to be detected passes through the designated area of ​​the image acquisition component, so that the circuit board image is processed by the processor to obtain the defect detection result of the circuit board to be detected. Compared with the method of visually inspecting the circuit board to be detected by the operator in the prior art, the embodiment of the present invention helps to standardize the defect detection result and can also effectively improve the accuracy of the circuit board defect detection result.

[0016] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0017] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A schematic structural diagram of a circuit board defect detection device provided by an embodiment of the present invention;

[0020] Figure 2 A schematic structural diagram of another circuit board defect detection device provided by an embodiment of the present invention;

[0021] Figure 3 A schematic diagram of a defect detection result provided by an embodiment of the present invention;

[0022] Figure 4 A schematic structural diagram of a circuit board defect detection system provided by an embodiment of the present invention.

[0023] Icons: 100 - circuit board defect detection device; 200 - display; 110 - base; 120 - processor; 130 - moving component; 140 - image acquisition component; 150 - first material tray; 160 - second material tray; 132 - material picking device; 141 - light source unit; 142 - shooting unit. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described in combination with the embodiments below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] At present, when defect detection is performed on circuit boards such as FPCB, the operator's visual inspection is usually adopted, which leads to certain differences in the detection results and low accuracy of the detection results. Based on this, an embodiment of the present invention provides a circuit board defect detection device and system, which can standardize the defect detection results of the circuit board and effectively improve the accuracy of the circuit board defect detection results.

[0026] To facilitate understanding of this embodiment, a circuit board defect detection device disclosed in an embodiment of the present invention is first described in detail. Figure 1 A structural schematic diagram of a circuit board defect detection device is shown, which includes a base 110, and a processor 120, a moving component 130, an image acquisition component 140, a first material tray 150 and a second material tray 160 fixed on the base 110, and the moving component 130 and the image acquisition component 140 are both communicatively connected to the processor 120.

[0027] The first material tray 150 is provided with a circuit board to be tested. The first material tray can be divided into a plurality of areas, each of which can be used to place the circuit board to be tested. For example, if the circuit board to be tested is divided into 12 areas, the first material tray can place 12 circuit boards to be tested. The circuit board to be tested may include a flexible printed circuit board FPCB, which is a printed circuit board with a pattern made of a flexible substrate, and is composed of an insulating substrate and a conductive layer, and an adhesive may be provided between the insulating substrate and the conductive layer.

[0028] The moving component 130 is used to pick up the circuit board to be inspected from the first tray (also referred to as the incoming material tray or the material taking tray), move the circuit board to be inspected from the first tray to the second tray (also referred to as the discharge material tray), and place the circuit board to be inspected on the second tray. The circuit board to be inspected passes through the designated area of ​​the image acquisition component during the movement, and the designated area of ​​the image acquisition component may be directly above the image acquisition component. In one embodiment, the moving component picks up a plurality of circuit boards to be inspected from the first tray, and then moves from the first tray to the second tray at a uniform speed, and should pass directly above the image acquisition component during the movement, so that the image acquisition component can collect the circuit board images of each circuit board to be inspected.

[0029] The image acquisition component 140 is used to capture the circuit board image of the circuit board to be detected when the circuit board to be detected passes through the designated area, and send the circuit board image to the processor. In one embodiment, the image acquisition component can use flying shooting technology to capture the circuit board image of each circuit board to be detected taken by the mobile component.

[0030] The processor 120 is used to output a defect detection result corresponding to the circuit board image when receiving the circuit board image. In one embodiment, the processor performs image processing on the circuit board image to identify and mark the defect location in the circuit board image, and then uses the circuit board image with the defect location marked as the defect detection result.

[0031] The circuit board defect detection device provided by the present invention will capture a circuit board image of the circuit board to be detected when the circuit board to be detected passes through a designated area of ​​an image acquisition component, and then perform image processing on the circuit board image through a processor to obtain a defect detection result of the circuit board to be detected. Compared with the prior art method of performing defect detection on the circuit board to be detected by visual inspection by an operator, the embodiment of the present invention helps to standardize the defect detection results and can also effectively improve the accuracy of the circuit board defect detection results.

[0032] To facilitate understanding of the circuit board defect detection device provided in the above embodiment, the present invention provides another circuit board defect detection device, see Figure 2 The structural schematic diagram of another circuit board defect detection device is shown in FIG. Figure 2 The moving assembly 130 includes a moving shaft 131 ( Figure 2 ), and a material picking device 132 mounted on the moving axis; the image acquisition component 140 includes a light source unit 141, and a shooting unit 142 fixed below the light source unit 141.

[0033] In one embodiment, the material picking device takes the circuit board to be detected from the first material tray, the moving axis moves the circuit board to be detected from the first material tray to the second material tray, and the material picking device places the circuit board to be detected on the second material tray, wherein the moving axis can be an XYZ axis, and the material picking device can be mounted on the XYZ axis and move with the XYZ axis. In a specific embodiment, the material picking device includes a plurality of suction nozzles, each of which is used to suck the circuit board to be detected. For example, the material picking device includes 7 suction nozzles, each of which can suck a circuit board to be detected. At this time, the moving axis will drive the 7 circuit boards to be detected to move from the first material tray to the second material tray, and the 7 circuit boards to be detected will pass through the designated area of ​​the image acquisition component during the movement. In addition, considering that the size of the circuit board to be detected may be small, the suction nozzle provided in the embodiment of the present invention can be made of antistatic material so that the suction nozzle can suck the circuit board to be detected steadily and correctly.

[0034] In one embodiment, for the above-mentioned image acquisition component, the light source unit can provide the designated light source required for acquiring the image, and then the shooting unit captures the circuit board image of the circuit board to be detected when the circuit board to be detected passes through the designated area. Since the FPCB includes an insulating substrate and a conductive terminal, the visual image effects of the insulating substrate and the conductive terminal are quite different. In order to better reflect the visual image effects of the insulating substrate and the conductive terminal, the embodiment of the present invention can provide different light sources for the insulating substrate and the conductive terminal when shooting the circuit board image, thereby obtaining a circuit board image with better visual image effect, wherein the circuit board image includes the conductive terminal image and the insulating substrate image. In a specific embodiment, the light source unit includes an ultraviolet ring light source and a white ring light source, and the ultraviolet ring light source and the white ring light source are arranged in parallel, and the ultraviolet ring light source and the white ring light source are respectively used to detect the surface conditions of the insulating substrate and the conductive terminal.

[0035] In addition, the shooting unit includes a first lens and a first camera fixed below the ultraviolet ring light source, and a second lens and a second camera fixed below the white ring light source. In a specific embodiment, assuming that the circuit board to be inspected first passes through the ultraviolet ring light source and then passes through the white ring light source during the process of moving from the first material tray to the second material tray, when the circuit board to be inspected passes through the ultraviolet ring light source, the first camera captures the insulating substrate image of the circuit board to be inspected based on the first lens, and when the circuit board to be inspected passes through the white ring light source, the second camera captures the conductive terminal image of the circuit board to be inspected based on the second lens, so as to obtain the insulating substrate image and the conductive terminal image of the circuit board to be inspected respectively.

[0036] Furthermore, the image acquisition component provided by the embodiment of the present invention also includes a light source controller connected to the light source unit, which is used to control the on and off state of the light source unit. In one embodiment, the light source controller can control the above-mentioned ultraviolet ring light source and white ring light source to turn on after the suction nozzle sucks the FPCB from the first material tray, and control the above-mentioned ultraviolet ring light source and white ring light source to turn off after the suction nozzle places the FPCB on the second material tray. Optionally, the embodiment of the present invention can also be provided with a manual control button, which is manually operated to turn on or off the ultraviolet ring light source and the white ring light source.

[0037] In one embodiment, an embodiment of the present invention provides a specific implementation method in which a processor (also referred to as an industrial computer) outputs defect detection results of a circuit board to be inspected. When the processor receives a circuit board image (including an insulating substrate image and a conductive terminal image) of the circuit board to be inspected, it starts to perform image processing on the insulating substrate image and the conductive terminal image respectively.

[0038] Among them, the two terminals on the upper left of the conductive terminal image are NG terminals. The first step of the image analysis is to first distinguish the NG terminals from the insulating substrate part, and then compare the conductive terminal image with the intact conductive terminal image. By comparing, the differences between the conductive terminal image and the intact conductive terminal image are found out, and the defect detection results of the conductive terminals of the circuit board to be inspected are determined according to the judgment specifications, and the differences are marked in sequence with long frames of specified colors, wherein the specified colors can be red or yellow.

[0039] There is a foreign object NG in the right half of the insulating substrate image. Due to its own spectral characteristics, the ultraviolet ring light source can clearly present the foreign object status. In order to further improve the effect of the insulating substrate image, the first camera mentioned above can use a color camera, so that the insulating substrate image has the best blue effect among the three primary colors of R / G / B (Red / Green / Blue). Therefore, the first step of the insulating substrate image processing should be to extract the blue in the insulating substrate image, and then remove the interference between the edge part and the NG terminal part, and then extract the outline of the effective area that can be detected, and use the binary parameter to present the NG part that meets the conditions, and determine the defect detection result of the circuit board to be inspected for the insulating substrate according to the judgment specification, and mark the NG part in sequence with a long frame of a specified color, where the specified color can be such as red or yellow.

[0040] The embodiment of the present invention further provides an implementation method for processing an insulating substrate image. In a specific implementation, a blue layer in the insulating substrate image can be extracted, and then the effective contour extraction is performed on the insulating substrate image after the blue layer is extracted to eliminate the interference of NG terminals in the conductive terminals. The insulating substrate image after the contour extraction is subjected to image binarization processing, so that the insulating substrate image after the binarization processing presents all defective parts. Finally, defects that meet the requirements are filtered out according to the judgment specifications, and the defects are marked in the insulating substrate impact.

[0041] The present invention exemplarily provides a defect detection result, such as Figure 3 A schematic diagram of a defect detection result annotation is shown in FIG. Figure 3 The oblique line portion is the location where the defect exists in the image to be tested. The above defect detection results may include that the circuit board to be tested is a good product or that the circuit board to be tested is a defective product. Optionally, the defective product judgment of the insulating substrate part: (1) The circuit is damaged or abraded and metal is leaking; (2) Scratches or foreign matter with a length or width greater than 20um. When the circuit board to be tested has the above problems, it can be determined that the circuit board to be tested is a defective product, otherwise it is determined that the circuit board to be tested is a good product. Optionally, the defective product judgment of the conductive terminal part: (1) Dirt, discoloration: area within 0.0108mm 2 Above; (2) Indentation: The total area of ​​the indentation is 0.0108mm 2 (3) The nickel or copper layer is exposed. When the circuit board to be tested has the above problems, the circuit board to be tested can be determined to be a defective product. Otherwise, the circuit board to be tested is determined to be a good product.

[0042] In summary, the circuit board defect detection device provided by the embodiment of the present invention has at least the following characteristics:

[0043] (1) Since the size of the FPCB is small, the suction nozzle is made of anti-static material to ensure that the suction nozzle can suck the FPCB steadily and correctly; and since the surface of the FPCB is relatively smooth and there is reflection interference, the flatness requirements for the production and installation of the suction nozzle are relatively high.

[0044] (2) The high-efficiency flying shot technology is used to collect the circuit board image of the FPCB. Two cameras can be used to collect the FPCB sucked by each suction nozzle within 900ms. For example, the embodiment of the present invention uses seven suction nozzles to suck seven FPCBs respectively, so the two cameras can use the flying shot technology to obtain two circuit board images of each FPCB, a total of 14 circuit board images.

[0045] (3) Based on the visual selection of different FPCB materials, different image processing methods are customized to achieve more accurate and stable detection results.

[0046] For the circuit board defect detection device provided in the above embodiment, the present invention also provides a circuit board defect detection system, see Figure 4 A structural schematic diagram of a circuit board defect detection system is shown, which includes a circuit board defect detection device 100 as provided in the aforementioned embodiment, and a display 200 connected to the circuit board defect detection device 100, and the display 200 is used to display the defect detection results output by the circuit board defect detection device 100.

[0047] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the system described above can refer to the corresponding process in the aforementioned embodiment, and will not be repeated here.

[0048] In addition, in the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A circuit board defect detection device, characterized in that: It includes a base, and a processor, a moving component, an image acquisition component, a first material tray and a second material tray fixed on the base, wherein the moving component and the image acquisition component are both connected to the processor in communication; wherein, The first tray is loaded with a circuit board to be tested; The moving component is used to take the circuit board to be tested from the first material tray, move the circuit board to be tested from the first material tray to the second material tray, and place the circuit board to be tested on the second material tray; wherein the circuit board to be tested passes through the designated area of ​​the image acquisition component during the moving process; The image acquisition component is used to acquire a circuit board image of the circuit board to be inspected when the circuit board to be inspected passes through the designated area, and send the circuit board image to the processor; The processor is used to output a defect detection result corresponding to the circuit board image when receiving the circuit board image; The image acquisition component includes a light source unit and a shooting unit fixed below the light source unit; wherein the light source unit provides a designated light source required for capturing images; and the shooting unit captures a circuit board image of the circuit board to be detected when the circuit board to be detected passes through the designated area; The light source unit comprises an ultraviolet ring light source and a white ring light source; the ultraviolet ring light source and the white ring light source are arranged in parallel; The shooting unit includes a first lens and a first camera fixed below the ultraviolet ring light source, and a second lens and a second camera fixed below the white ring light source; when the circuit board to be inspected passes through the ultraviolet ring light source, the first camera collects an image of the insulating substrate of the circuit board to be inspected based on the first lens, and when the circuit board to be inspected passes through the white ring light source, the second camera collects an image of the conductive terminal of the circuit board to be inspected based on the second lens; The image acquisition component also includes a light source controller connected to the light source unit, which is used to control the on / off state of the light source unit.

2. The circuit board defect detection device according to claim 1, characterized in that: The moving assembly includes a moving shaft and a material taking device mounted on the moving shaft; wherein, The material taking device takes the circuit board to be tested from the first material tray; The moving shaft moves the circuit board to be inspected from the first material tray to the second material tray; The material picking device places the circuit board to be inspected on the second material tray.

3. The circuit board defect detection device according to claim 2, characterized in that: The material picking device comprises a plurality of suction nozzles, each of which is used for sucking the circuit board to be inspected.

4. The circuit board defect detection device according to claim 3, characterized in that: The suction nozzle is made of antistatic material.

5. The circuit board defect detection device according to claim 1, characterized in that: The circuit board to be inspected includes a flexible printed circuit board.

6. A circuit board defect detection system, characterized in that: include: A circuit board defect detection device as described in any one of claims 1 to 5, and a display connected to the circuit board defect detection device, wherein the display is used to display the defect detection results output by the circuit board defect detection device.

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