A large-stroke, high-speed and high-precision XY parallel decoupled micro-positioning platform

Abstract

A large-stroke, high-speed and high-precision XY parallel decoupling micro-positioning platform, comprising a central moving platform, a fixing mechanism, a bridge-type micro-displacement amplification mechanism, a flexible moving pair and a piezoelectric ceramic; the fixing mechanism is arranged between adjacent bridge-type micro-displacement amplification mechanisms, and is symmetrical about the positive and negative X axes and the Y axis of the central moving platform; the bridge-type micro-displacement amplification mechanisms are symmetrically arranged on the positive and negative X axes and the Y axis of the central moving platform, and include two first longitudinal beams, two second longitudinal beams and a plurality of cross beams; the two first longitudinal beams are arranged in parallel at intervals; the two second longitudinal beams are arranged between the two first longitudinal beams and are connected to the first longitudinal beams through cross beams; the cross beams are connected to each longitudinal beam through flexible moving pairs; the piezoelectric ceramic is arranged between the input ends of the two first longitudinal beams; the second longitudinal beam close to the central moving platform is provided with an output end; the output end is connected to the central moving platform and the fixing mechanism through a flexible moving pair. The decoupling micro-positioning platform provided by the present application can accurately position the defective position during the repair process of the Micro LED chip.

Description

Technical Field

[0001] The present application relates to the field of MicroLED repair, and particularly to a large-stroke, high-speed, and high-precision XY parallel decoupled micro-positioning platform. Background Art

[0002] With the rapid development of the information industry, the applications of various electronic products have become increasingly widespread. As a new generation of display technology, Micro LED has advantages such as higher brightness, better luminous efficiency, lower power consumption, smaller volume, higher resolution, and longer service life compared to the existing OLED technology, and has great development advantages. Nowadays, the mass transfer and mounting technologies of MicroLED chips are becoming increasingly mature, but there is still a large gap in the field of chip repair, and repair plays an indispensable role in improving the efficiency and reliability of MicroLED production.

[0003] Chinese Patent Document CN209983033U discloses a new type of detection, repair, and mounting device for MicroLED chips, which uses a linear motor to drive a moving shaft to position the MicroLED chips. However, the scale of MicroLED chips is relatively small, usually 3 - 10um, so it is difficult to accurately position the chips with this design.

[0004] To implement the defect repair technology of MicroLED and meet the increasingly high process requirements, it is urgent to conduct in-depth research on Micro LED repair technology. Summary of the Invention

[0005] In view of this, the purpose of the present application is to provide a large-stroke, high-speed, and high-precision XY parallel decoupled micro-positioning platform for MicroLED repair, which solves problems such as accurate and rapid positioning during the MicroLED defect repair process.

[0006] To achieve the above object, the present application provides a large-stroke, high-speed, and high-precision XY parallel decoupled micro-positioning platform, including a central moving platform, a plurality of fixing mechanisms, a plurality of bridge-type micro-displacement amplification mechanisms, a plurality of flexible moving pairs, and piezoelectric ceramics;

[0007] The bridge-type micro-displacement amplification mechanisms are symmetrically arranged on the positive and negative X axes and the positive and negative Y axes centered on the central moving platform respectively;

[0008] A plurality of the fixing mechanisms are respectively arranged in one-to-one correspondence between adjacent bridge-type micro-displacement amplification mechanisms, and are symmetrically distributed about the positive and negative X axes and / or the positive and negative Y axes centered on the central moving platform; the bridge-type micro-displacement amplification mechanism includes at least two first longitudinal beams, at least two second longitudinal beams, and a plurality of cross beams;

[0009] The two first longitudinal beams are parallel and spaced apart;

[0010] The two second longitudinal beams are arranged between the two first longitudinal beams and are spaced in the direction facing the central moving platform;

[0011] The two second longitudinal beams are respectively connected to the first longitudinal beams through the cross beams;

[0012] Each of the cross beams is respectively connected to the first longitudinal beam and the second longitudinal beam through a flexible hinge;

[0013] The piezoelectric ceramics are arranged between the two first longitudinal beams and are respectively connected to the input ends of the first longitudinal beams;

[0014] An output end is provided on the second longitudinal beam close to the central moving platform;

[0015] The output ends are respectively connected to the central moving platform and the fixing mechanism through the flexible moving pairs.

[0016] Preferably, the number of the cross beams used for connecting between the two second longitudinal beams and the two first longitudinal beams is equal and they are distributed in parallel.

[0017] Preferably, the number of the cross beams of each of the bridge-type micro-displacement amplification mechanisms is specifically 8, the number of the first longitudinal beams is specifically 2, and the number of the second longitudinal beams is specifically 2;

[0018] There are 2 cross beams between the second longitudinal beam and the first longitudinal beam.

[0019] Preferably, the flexible hinge is specifically a filleted V-shaped flexible hinge.

[0020] Preferably, the top of the filleted V-shaped flexible hinge is rounded;

[0021] The fillet radius is 1 / 8 of the total length of the filleted V-shaped flexible hinge;

[0022] The fillet angle is π / 4.

[0023] Preferably, the flexible moving pairs are specifically double four-bar moving pairs formed by splicing S-shaped hinges.

[0024] Preferably, the fixing mechanism is a right-angle fixing mechanism;

[0025] Preferably, the number of the bridge-type micro-displacement amplification mechanisms and the fixing mechanisms is specifically 4.

[0026] Preferably, a first connection hole for fixing is provided at the end of the right-angle fixing mechanism.

[0027] A plurality of second connection holes for fixing are provided on the central moving platform.

[0028] On the second longitudinal beam of the two second longitudinal beams that is far from the central moving platform, there is a third connection hole for fixation.

[0029] Preferably, the central moving platform is specifically a 7075 aluminum alloy central moving platform.

[0030] As can be seen from the above technical solutions, this application adopts a plurality of bridge-type micro-displacement amplification mechanisms that are symmetrically distributed around the positive and negative X and Y axes of the central moving platform. Compared with other amplification mechanisms, such as lever mechanisms, it has higher lateral stiffness, can achieve high-speed response to input, and is not easily distorted during amplification. It also plays a role in decoupling and motion guiding in the entire moving platform, and can effectively amplify and accurately position the small stroke of the piezoelectric ceramic during the repair process; the flexible hinge mechanism utilizes the characteristics of the small deformation and self-recovery of elastic materials, eliminates the dead space and mechanical friction during transmission, and can achieve frictionless and gapless transmission of micro-motion; the overall structure adopts a mirror-symmetrical design, which can balance the stress inside the system, improve the stiffness and load-bearing characteristics of the central moving platform. When the dimensions of the mechanism itself are precise, it can eliminate the lateral additional displacement, reduce the longitudinal coupling displacement error of the mechanism itself, and at the same time, the natural frequency and bandwidth of the mechanism are relatively large, which can ensure the stability of the mechanism during operation. Description of the Drawings

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0032] Figure 1 It is a schematic diagram of the overall structure of a large-stroke, high-speed, and high-precision XY parallel decoupled micro-positioning platform provided in the present application;

[0033] Figure 2 It is a schematic diagram of the specific structure of a single bridge-type micro-displacement amplification mechanism provided in the present application;

[0034] In the figure: 1, central moving platform; 2, fixing mechanism; 3, flexible moving pair; 4, cross beam; 5, first longitudinal beam; 6, bridge-type micro-displacement amplification mechanism; 7, second longitudinal beam; 8, output end; 9, input end; 10, flexible hinge. Detailed Embodiments

[0035] The technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the embodiments of the present application.

[0036] In the description of the embodiments of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the embodiments of the present application. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0037] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a replaceable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0038] The embodiments of the present application disclose a large-stroke, high-speed, and high-precision XY parallel decoupling micro-positioning platform.

[0039] Please refer to Figure 1 and Figure 2An embodiment of a large-stroke, high-speed, and high-precision XY parallel decoupled micro-positioning platform provided in the embodiments of the present application includes: a central mobile platform 1, a plurality of fixing mechanisms 2, a plurality of bridge-type micro-displacement amplifying mechanisms 6, a plurality of flexible mobile pairs 3, and piezoelectric ceramics; the central mobile platform 1 is symmetrically provided with the bridge-type micro-displacement amplifying mechanisms 6 on the positive and negative X-axes and the positive and negative Y-axes centered on itself; a plurality of fixing mechanisms 2 are respectively arranged one by one between adjacent bridge-type micro-displacement amplifying mechanisms 6, and are symmetrically distributed about the positive and negative X-axes and / or the positive and negative Y-axes centered on the central mobile platform 1; the bridge-type micro-displacement amplifying mechanism 6 adopts a composite bridge-type amplifying mechanism, which is composed of two bridge-type displacement amplifying mechanisms connected in parallel; the bridge-type micro-displacement amplifying mechanism 6 It at least includes two first longitudinal beams 5, two second longitudinal beams 7 and multiple cross beams 4; the two first longitudinal beams 5 are parallel and spaced apart; the two second longitudinal beams 7 are arranged between the two first longitudinal beams 5 and spaced apart in the direction facing the central movable platform 1; the two second longitudinal beams 7 are respectively connected to the two first longitudinal beams 5 through the cross beams 4; each cross beam 4 is respectively connected to the two first longitudinal beams 5 and the two second longitudinal beams 7 through a flexible hinge 10; an input terminal 9 is arranged in the middle of the two first longitudinal beams 5; the piezoelectric ceramics are arranged between the two first longitudinal beams 5 and are respectively connected to the input terminals 9 on the two first longitudinal beams 5; an output terminal 8 is arranged on the second longitudinal beam 7 close to the central movable platform 1; the output terminal 8 is connected to the central movable platform through the flexible movable pair 3, and is connected to the fixing mechanism 2 through the flexible movable pair 3.

[0040] Specifically, the flexible hinge 10 can be a right-angle, leaf-shaped, circular flexible hinge, etc., so that the two ends connected by the flexible hinge can be elastically rotated and deformed.

[0041] Specifically, in the schematic diagram of the present embodiment, the piezoelectric ceramic is arranged between the two first longitudinal beams 5 and between the two second longitudinal beams 7; the piezoelectric ceramic may also be arranged only between the two first longitudinal beams 5 but not between the second longitudinal beams 7, such as when the piezoelectric ceramic is spatially above the second longitudinal beams 7, etc., without specific limitation.

[0042] Compared with other amplifying mechanisms such as lever amplifying mechanisms, the bridge-type micro-displacement amplifying mechanism 6 has the advantages of compact structure, small space occupation, less distortion of amplification ratio and full utilization of piezoelectric ceramic drive, and the composite bridge-type amplifying mechanism has inherently higher rigidity.

[0043] The above is the first embodiment of a large-stroke, high-speed, high-precision XY parallel decoupled micro-positioning platform provided by the embodiment of the present application. The following is the second embodiment provided by the embodiment of the present application. For details, please refer to Figures 1 to 2 .

[0044] A large-stroke, high-speed and high-precision XY parallel decoupled micro-positioning platform, comprising: a central moving platform 1, a plurality of fixing mechanisms 2, a plurality of bridge-type micro-displacement amplification mechanisms 6, a plurality of flexible moving pairs 3 and piezoelectric ceramics; the central moving platform 1 is symmetrically provided with the bridge-type micro-displacement amplification mechanisms 6 on the positive and negative X axes and the positive and negative Y axes centered on itself; a plurality of fixing mechanisms 2 are respectively arranged in one-to-one correspondence between adjacent bridge-type micro-displacement amplification mechanisms 6, and are symmetrically distributed about the positive and negative X axes and / or the positive and negative Y axes centered on the central moving platform 1; the bridge-type micro-displacement amplification mechanism 6 adopts a composite bridge-type amplification mechanism, which is composed of two bridge-type displacement amplification mechanisms in parallel; the bridge-type micro-displacement amplification mechanism 6 at least includes two first longitudinal beams 5, two second longitudinal beams 7 and a plurality of cross beams 4; the two first longitudinal beams 5 are parallel and spaced apart; the two second longitudinal beams 7 are arranged between the two first longitudinal beams 5 and are spaced apart in the direction facing the central moving platform 1; the two second longitudinal beams 7 are respectively connected to the two first longitudinal beams 5 through cross beams 4; each cross beam 4 is respectively connected to the two first longitudinal beams 5 and the two second longitudinal beams 7 through flexible hinges 10; an input end 9 is arranged in the middle of the two first longitudinal beams 5; the piezoelectric ceramics are arranged between the two first longitudinal beams 5 and are respectively connected to the input ends 9 on the two first longitudinal beams 5; an output end 8 is arranged on the second longitudinal beam 7 close to the central moving platform 1; the output end 8 is connected to the central moving platform through the flexible moving pair 3 and is connected to the fixing mechanism 2 through the flexible moving pair 3.

[0045] Further, the number of cross beams used to connect between the two second longitudinal beams 7 and the two first longitudinal beams 5 is equal and they are parallelly distributed.

[0046] Further, each bridge-type micro-displacement amplification mechanism 6 specifically includes 8 cross beams 4 and 16 flexible hinges 10, there are specifically 2 first longitudinal beams 5, and specifically 2 second longitudinal beams 7;

[0047] There are 2 cross beams 4 between the second longitudinal beam 7 and the first longitudinal beam 5.

[0048] Further, in order to make the flexible hinge 10 have higher stiffness, the flexible hinge 10 is specifically a filleted V-shaped flexible hinge; the top of the filleted V-shaped flexible hinge is filleted; the fillet radius is 1 / 8 of the total length of the flexible V-shaped hinge, and the fillet angle is π / 4.

[0049] The filleted flexible V-shaped hinge meeting the above conditions has higher stiffness compared with other flexible hinges such as circular and leaf-shaped ones, and can achieve a fast response to the input.

[0050] Further, in order to make the flexible moving pair 3 have greater flexibility and reduce the displacement transfer loss to the bridge-type micro-displacement amplification mechanism 6, the flexible moving pairs 3 are specifically double four-bar moving pairs spliced by S-shaped hinges, which can effectively transfer the displacement output by the output end 8 to the central moving platform 1.

[0051] Furthermore, the fixing mechanism 2 is a right-angle fixing mechanism.

[0052] Specifically, the fixing mechanism can also be a rounded-corner type, a straight-line type, etc. Both ends of the fixing mechanism 2 can be connected to adjacent bridge-type micro-displacement amplification mechanisms 6, and it only needs to be fixed.

[0053] Furthermore, there are specifically 4 bridge-type micro-displacement amplification mechanisms 6 and 4 fixing mechanisms 2.

[0054] Specifically, the bridge-type micro-displacement amplification mechanisms 6 and the fixing mechanisms 2 are symmetrically distributed about the positive and negative X axes and / or the positive and negative Y axes of the central displacement platform 1. In order to enable the entire system to be as fast and accurate as possible during the repair process of the MicroLED chip, in this embodiment, both the bridge-type micro-displacement amplification mechanisms 6 and the fixing mechanisms 2 are set to 4.

[0055] Furthermore, the end of the fixing mechanism 2 is provided with a first connection hole for fixing; the central moving platform 1 is provided with a plurality of second connection holes for fixing.

[0056] Furthermore, the second longitudinal beam 7 far from the central moving platform 1 among the two second longitudinal beams 7 is provided with a third connection hole for fixing.

[0057] Specifically, the connection holes described in this article can be countersunk holes, bolt holes, etc., as long as the connecting piece can be fixed; in this embodiment, there are 2 first connection holes, 2 second connection holes, and 8 third connection holes. In practical applications, the number of connection holes can also be set according to actual needs, and there is no specific limit.

[0058] Furthermore, the central moving platform 1 is specifically a 7075 aluminum alloy central moving platform. 7075 aluminum alloy has high stiffness and low mass, which can effectively improve the stiffness and bandwidth of the platform, ensure the stability of the platform during operation, and enable the platform to have good dynamic performance.

[0059] As a further description of the above-mentioned large-stroke, high-speed, and high-precision XY parallel decoupled micro-positioning platform, this platform uses piezoelectric ceramics as the drive. Piezoelectric ceramics utilize the inverse piezoelectric effect and achieve precise displacement output by controlling the current input. It has the advantages of compact structure, high motion resolution, large output force, high energy conversion efficiency, no mechanical loss, no magnetic field, and fast response, which can make the large displacement output of the platform more precisely controllable.

[0060] Using the above large-stroke, high-speed, and high-precision XY parallel decoupled micro-positioning platform, when the Micro LED chip is transferred to the repair device and the defect repair position is roughly positioned with large stroke and high speed by the macro platform, if micro-displacement compensation in one degree of freedom in the Y direction is required, the piezoelectric ceramic inputs displacement to the input end 9. At this time, the left cross beam of the second longitudinal beam 7 close to the central moving platform 1 undergoes translation and counterclockwise rotation, and the right cross beam undergoes translation and clockwise rotation. The left cross beam of the second longitudinal beam 7 far from the central moving platform 1 undergoes translation and clockwise rotation, and the right cross beam undergoes translation and counterclockwise rotation. Finally, the output end 8 outputs displacement towards the direction of the central moving platform 1, and then the displacement is transmitted to the MicroLED repair workbench connected to the central moving platform 1 through the flexible moving pair 3, enabling the MicroLED chip to quickly and accurately reach above the defective substrate and replace the faulty RGB chip. If micro-displacement compensation in both the X and Y directions is required, the input end 9 of the bridge-type micro-displacement amplification mechanism 6 on the X-axis and Y-axis can be driven by the piezoelectric ceramic to quickly and accurately perform micro-displacement compensation in the X and Y directions. Using the above large-stroke, high-speed, and high-precision XY parallel decoupled micro-positioning platform, the displacement compensation performed belongs to micro-displacement compensation, which can realize micro-displacement compensation for the macro-positioning device for MicroLED defect repair and achieve precise positioning of the chip defect position.

[0061] It should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the examples, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing examples, or perform equivalent replacements for some of the technical features. However, any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A large-stroke, high-speed and high-precision XY parallel decoupled micro-positioning platform, characterized in that, It includes a central moving platform, multiple fixing mechanisms, multiple bridge-type micro-displacement amplification mechanisms, multiple flexible moving pairs and piezoelectric ceramics; The bridge-type micro-displacement amplification mechanisms are symmetrically arranged on the positive and negative X axes and the positive and negative Y axes centered on the central moving platform respectively; Multiple fixing mechanisms are respectively arranged in one-to-one correspondence between adjacent bridge-type micro-displacement amplification mechanisms, and are symmetrically distributed about the positive and negative X axes and / or the positive and negative Y axes centered on the central moving platform; The bridge-type micro-displacement amplification mechanism includes at least two first longitudinal beams, at least two second longitudinal beams and multiple cross beams; The two first longitudinal beams are parallel and spaced apart; The two second longitudinal beams are arranged between the two first longitudinal beams and are spaced apart in the direction facing the central moving platform; The two second longitudinal beams are respectively connected to the first longitudinal beams through the cross beams; Each cross beam is respectively connected to the first longitudinal beam and the second longitudinal beam through a flexible hinge; The piezoelectric ceramic is arranged between the two first longitudinal beams and is respectively connected to the input ends of the first longitudinal beams; Output ends are provided on the second longitudinal beams close to the central moving platform among the two second longitudinal beams; The output ends are respectively connected to the central moving platform and the fixing mechanism through the flexible moving pairs.

2. The large-stroke, high-speed, and high-precision XY parallel decoupled micro-positioning platform according to claim 1, characterized in that, The number of cross beams used for connecting between the two second longitudinal beams and the two first longitudinal beams is equal and parallel to each other.

3. The large-stroke, high-speed, and high-precision XY parallel decoupled micro-positioning platform according to claim 2, wherein The cross beams of each bridge-type micro-displacement amplification mechanism are specifically 8, the first longitudinal beams are specifically 2, and the second longitudinal beams are specifically 2; 2 cross beams are provided between the second longitudinal beam and the first longitudinal beam.

4. A large-stroke, high-speed, and high-precision XY parallel decoupled micro-positioning platform according to claim 1, wherein, The flexible hinge is specifically a fillet V-shaped flexible hinge; The fillet radius of the fillet V-shaped flexible hinge is 1 / 8 of the total length of the fillet V-shaped flexible hinge; The fillet angle of the fillet V-shaped flexible hinge is π / 4.

5. A large-stroke, high-speed, high-precision XY parallel decoupled micro-positioning platform according to claim 1, characterized in that, The flexible moving pairs are specifically double four-bar moving pairs formed by splicing S-shaped hinges.

6. The large-stroke, high-speed and high-precision XY parallel decoupled micro-positioning platform according to claim 1, characterized in that The fixing mechanism is a right-angle fixing mechanism.

7. A large-stroke, high-speed and high-precision XY parallel decoupled micro-positioning platform according to claim 1, characterized in that, The bridge-type micro-displacement amplification mechanisms and the fixing mechanisms are specifically 4 each.

8. A large-stroke, high-speed, and high-precision XY parallel decoupled micro-positioning platform according to claim 1, characterized in that A first connection hole for fixing is provided at the end of the fixing mechanism; Multiple second connection holes for fixing are provided on the central moving platform.

9. A large-stroke, high-speed, high-precision XY parallel decoupled micro-positioning platform according to claim 1, characterized in that, A third connection hole for fixing is provided on the second longitudinal beam far from the central moving platform among the two second longitudinal beams.

10. A large-stroke, high-speed and high-precision XY parallel decoupled micro-positioning platform according to claim 1, characterized in that, The central moving platform is specifically a 7075 aluminum alloy central moving platform.

Images