Polyurethane resin composition

Abstract

The present invention addresses the problem of providing a polyurethane resin having excellent compatibility, workability, and cooling / heating cycle characteristics, by using a polybutadiene polyol having a hydroxyl value of 60 mgKOH / g or less. The present invention pertains to a polyurethane resin composition containing (A) a polyisocyanate compound, (B) a polyol compound, (C) an inorganic filler, and (D) a plasticizer, wherein the polyol compound (B) contains (b1) a polybutadiene polyol having a hydroxyl value of 60 mgKOH / g or less, and the polyurethane resin composition contains 50-85 mass%of the inorganic filler (C) and 1-30 mass% of the plasticizer (D) with respect to 100 mass% of the polyurethane resin composition.

Description

technical field

[0001] The present invention relates to polyurethane resin compositions. Background technique

[0002] In recent years, with the advancement of electronic circuit boards and electronic components, the stress on components caused by cooling and heating cycles has increased, and components that can maintain high heat resistance and long-term heat dissipation are required.

[0003] The polyurethane resin used for the sealing of these parts has the problem that it loses its flexibility due to long-term cooling and heating cycles, resulting in cracks. There is an urgent need to develop a part that can further reduce the temperature dependence of the elastic modulus and maintain it for a long time.

[0004] For example, Patent Documents 1 to 3 describe the use of polybutadiene polyols having a hydroxyl value of 20 to 120 mgKOH / g. However, these documents do not specifically disclose polyurethane resins using polybutadiene polyols having a hydroxyl value of 60 mgKO...

Examples

Embodiment 1～11 and comparative example 1～6

[0267] Each component and 0.01 weight% of SC-5570 (silicone antifoaming agent) as an antifoaming agent were mix|blended according to the composition shown in Table 1, and various polyurethane resin compositions were prepared according to the following procedure.

[0268] The (B) polyol compound, (C) inorganic filler, (D) plasticizer, and (E) crosslinking shown in Table 1 were carried out at 2000 rpm using an autorotation / revolution mixer (degassing Rentaro, manufactured by THINKY Co., Ltd. agent, (F) defoamer and (G) polymerization catalyst were mixed for 1 minute.

[0269] The (A) polyisocyanate compound shown in Table 1 was added to the said mixing component, and it mixed for 1 minute at 2000 rpm using the autorotation / revolution mixer (defoaming Rentaro, manufactured by THINKY company). The obtained mixture was degassed, and each polyurethane resin composition of Examples 1-11 and Comparative Examples 1-6 was obtained.

technical field

[0001] The present invention relates to polyurethane resin compositions. Background technique

[0002] In recent years, with the advancement of electronic circuit boards and electronic components, the stress on components caused by cooling and heating cycles has increased, and components that can maintain high heat resistance and long-term heat dissipation are required.

[0003] The polyurethane resin used for the sealing of these parts has the problem that it loses its flexibility due to long-term cooling and heating cycles, resulting in cracks. There is an urgent need to develop a part that can further reduce the temperature dependence of the elastic modulus and maintain it for a long time.

[0004] For example, Patent Documents 1 to 3 describe the use of polybutadiene polyols having a hydroxyl value of 20 to 120 mgKOH / g. However, these documents do not specifically disclose polyurethane resins using polybutadiene polyols having a hydroxyl value of 60 mgKO...

Examples

Embodiment 1～11 and comparative example 1～6

[0267] Each component and 0.01 weight% of SC-5570 (silicone antifoaming agent) as an antifoaming agent were mix|blended according to the composition shown in Table 1, and various polyurethane resin compositions were prepared according to the following procedure.

[0268] The (B) polyol compound, (C) inorganic filler, (D) plasticizer, and (E) crosslinking shown in Table 1 were carried out at 2000 rpm using an autorotation / revolution mixer (degassing Rentaro, manufactured by THINKY Co., Ltd. agent, (F) defoamer and (G) polymerization catalyst were mixed for 1 minute.

[0269] The (A) polyisocyanate compound shown in Table 1 was added to the said mixing component, and it mixed for 1 minute at 2000 rpm using the autorotation / revolution mixer (defoaming Rentaro, manufactured by THINKY company). The obtained mixture was degassed, and each polyurethane resin composition of Examples 1-11 and Comparative Examples 1-6 was obtained.

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