SMD explosion-proof electrolytic capacitors
By introducing the suction layer and elastic film layer into the chip electrolytic capacitor, the gas generated during the welding process is absorbed, the shell is cracked and exploded, and the working state is judged by observing the expansion of the membrane layer, the capacitor during the welding process is solved. The problems of damage and explosion achieve a simple structure and low cost explosion-proof effect.
Patent Information
- Application Number
- CN202010689255.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-07-17
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2040-07-17
AI Technical Summary
The gas generated by the chip electrolytic capacitor during welding causes the sealing shell to rupture and explosion, and poor heat dissipation capacity increases the possibility of damage and explosion.
A patch explosion-proof electrolytic capacitor including a shell, an elastic film layer, a core, a bottom plate and a suction layer is designed. The shell has a longitudinal opening, and the elastic film layer is covered and attached to the outside of the side wall, and the suction layer is coated on the The inner surface of the elastic film layer is used to absorb internal gas, and the elastic film layer expands outward to accommodate gas.
It effectively avoids damage and explosion of chip electrolytic capacitors, and judges the working state by observing the expansion degree of the elastic film layer, ensuring the pre-set capacitance of the capacitor, while reducing production costs and overall structural complexity.
Smart Images
Figure CN111785525B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a chip type electrolytic capacitor, in particular to a chip type explosion-proof electrolytic capacitor. Background Art
[0002] Chip electrolytic capacitors have been widely used in basic components such as consumer home appliances, computer motherboards and their peripherals, power supplies, communication products, and automobiles. They are one of the indispensable components in electronic products. Their main functions include: charge storage, AC filtering, bypass, coupling, decoupling, phase shift, tuning, etc.
[0003] In order to comply with environmental regulations, when SMD electrolytic capacitors are placed on circuit boards, the selected wire materials require longer welding time and higher welding temperature, which in turn leads to an increase in the amount of gas generated inside the SMD electrolytic capacitors, which increases the pressure and breaks the sealed shell, causing damage to the SMD electrolytic capacitors and even causing them to explode. In addition, since the shell of the SMD electrolytic capacitor is a sealed structure, its heat dissipation capacity is extremely poor, which will further cause the gas generated inside the SMD electrolytic capacitors to expand due to heat, thereby increasing the possibility of the above adverse consequences.
[0004] Therefore, the main purpose of the present invention is to provide a chip-type explosion-proof electrolytic capacitor to solve the above-mentioned problems. Summary of the invention
[0005] The object of the present invention is to provide a chip-type explosion-proof electrolytic capacitor, which can absorb the gas generated inside the chip-type explosion-proof electrolytic capacitor to avoid damage or explosion of the chip-type explosion-proof electrolytic capacitor.
[0006] To achieve at least one of the above advantages or other advantages, an embodiment of the present invention provides a chip-type explosion-proof electrolytic capacitor, which includes a shell, an elastic film layer, a core, a bottom plate and an air-absorbing layer.
[0007] The housing has at least one longitudinal opening.
[0008] The elastic membrane layer covers the longitudinal opening and is attached to the outer side of the side wall of the shell.
[0009] The core is arranged inside the shell.
[0010] The bottom plate is connected to the bottom end of the shell and electrically connected to the core. The bottom plate includes a first conductive pattern and a second conductive pattern. The first conductive pattern and the second conductive pattern are located on both sides of the bottom plate and are electrically connected to the positive electrode and the negative electrode of the core respectively.
[0011] The air-absorbing layer is coated on the inner surface of the elastic film layer and arranged in the longitudinal openings for absorbing gas.
[0012] In some embodiments, the at least one longitudinal opening is two longitudinal openings, and the two longitudinal openings are arranged on opposite sides of the shell.
[0013] In some embodiments, the at least one longitudinal opening is three longitudinal openings, and the three longitudinal openings are symmetrically arranged around the shell with the central axis of the shell as the center.
[0014] In some embodiments, the housing is made of aluminum metal.
[0015] In some embodiments, the getter layer is an activated carbon layer.
[0016] In some embodiments, the getter layer is composed of zeolite.
[0017] In some embodiments, the thickness of the elastic film layer is between 30 um and 100 um.
[0018] In some embodiments, the elastic film layer is made of thermoplastic elastomer.
[0019] In some embodiments, the length of the longitudinal opening is less than two-thirds of the height of the housing.
[0020] In some embodiments, a plurality of support members are disposed in the longitudinal opening to support the elastic membrane layer.
[0021] Therefore, by using the SMD explosion-proof electrolytic capacitor provided by the present invention, the gas generated inside the SMD explosion-proof electrolytic capacitor is absorbed by the air absorption layer, and the elastic film layer expands outward to accommodate the gas, thereby preventing the SMD explosion-proof electrolytic capacitor from being damaged or exploded. In addition, by observing the degree of outward expansion of the elastic film layer, the working state of the SMD explosion-proof electrolytic capacitor can be judged and corresponding measures can be taken.
[0022] Furthermore, since the air-absorbing layer is arranged in the longitudinal opening and coated on the inner surface of the elastic film layer, the air-absorbing layer will not occupy the space of the core inside the shell, effectively ensuring the pre-set capacitance of the SMD explosion-proof electrolytic capacitor. The SMD explosion-proof electrolytic capacitor has a simple overall structure and low production cost.
[0023] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following lists the preferred embodiments and describes them in detail with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and are not used to limit the implementation methods of the present invention to only these. For ordinary technicians in this field, other drawings can be derived from these drawings without paying creative labor. The drawings include:
[0025] Figure 1 It is a perspective schematic diagram of the appearance of the chip-type explosion-proof electrolytic capacitor of the present invention;
[0026] Figure 2 yes Figure 1 Schematic cross-sectional view of ;
[0027] Figure 2A yes Figure 2 The local schematic diagram of the A in the middle;
[0028] Figure 3 It is a perspective schematic diagram of the appearance of the elastic film layer of the SMD explosion-proof electrolytic capacitor of the present invention when it is expanded;
[0029] Figure 4 is a schematic structural diagram of an embodiment of the present invention in which a support member is disposed in a longitudinal opening; and
[0030] Figure 5 It is a structural schematic diagram of another embodiment of the present invention in which the support member is arranged in the longitudinal opening.
[0031] Figure markings: 10 - chip-type explosion-proof electrolytic capacitor; 12 - shell; 122 longitudinal opening; 124 outer side of the side wall; 14 - elastic membrane layer; 16 - bottom plate; 162 first conductive pattern; 164 second conductive pattern; 18 - core; 20 - air absorption layer; 22 - support member; H1 - length of the longitudinal opening; H2 - height of the shell. DETAILED DESCRIPTION
[0032] The specific structural and functional details disclosed herein are merely representative and are for the purpose of describing exemplary embodiments of the present invention. However, the present invention may be embodied in many alternative forms and should not be construed as being limited to only the embodiments set forth herein.
[0033] In the description of the present invention, it should be understood that the terms "center", "lateral", "up", "down", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more. In addition, the term "including" and any variation thereof all mean "at least including".
[0034] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrally formed connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0035] The terms used herein are only for describing specific embodiments and are not intended to limit exemplary embodiments. Unless the context clearly indicates otherwise, the singular forms "one", "one" and "one" used herein are also intended to include plural numbers. It should also be understood that the terms "include" and / or "comprise" used herein specify the existence of stated features, integers, steps, operations, units and / or components, without excluding the existence or addition of one or more other features, integers, steps, operations, units, components and / or combinations thereof.
[0036] See also Figure 1 , Figure 1 FIG. 1 is a perspective view of the appearance of a SMD explosion-proof electrolytic capacitor 10 of the present invention. In order to achieve at least one of the above advantages or other advantages, an embodiment of the present invention provides a SMD explosion-proof electrolytic capacitor 10. Figure 1 As shown, the SMD explosion-proof electrolytic capacitor 10 includes a housing 12 , an elastic membrane layer 14 and a bottom plate 16 .
[0037] A longitudinal opening 122 ( Figure 1The elastic membrane layer 14 covers the longitudinal opening 122 and is attached to the outer side 124 of the side wall of the housing 12. The bottom plate 16 is connected to the lower end of the housing 12.
[0038] Please combine Figure 1 See also Figure 2 and Figure 2A , Figure 2 yes Figure 1 A cross-sectional diagram of Figure 2A yes Figure 2 The partial schematic diagram of the A in the middle. As shown in the figure, the SMD explosion-proof electrolytic capacitor 10 also includes a core 18 and an air-absorbing layer 20. Further, the bottom plate 16 includes a first conductive pattern 162 and a second conductive pattern 164.
[0039] The core 18 is disposed inside the shell 12, and the shell 12 has the function of protecting the core 18 and isolating the core 18 from the outside. The air absorption layer 20 is disposed on the inner surface of the elastic film layer 14 and is disposed in the longitudinal opening 122 to absorb the gas generated inside the shell 12. The first conductive pattern 162 and the second conductive pattern 164 are located on both sides of the bottom plate 16, and are respectively electrically connected to the positive electrode and the negative electrode of the core 18, so that the bottom plate 16 is electrically connected to the core 18 and conducts current. In one embodiment, the air absorption layer 20 can be formed on the inner surface of the elastic film layer 14 by coating, bonding, etc. The first conductive pattern 162 and the second conductive pattern 164 are formed on the surface of the bottom plate 16 by electroplating, or are fixed to the surface of the bottom plate 16 by welding, bonding, etc.
[0040] The length H1 of the longitudinal opening 122 is less than two-thirds of the height H2 of the housing 12 to avoid affecting the fixing effect of the insulating filler at the lower end of the housing 12 on the core 18. However, the present invention is not limited thereto, and the length H1 of the longitudinal opening 122 may also be greater than or equal to two-thirds of the height H2 of the housing 12 to increase space to accommodate a larger area of the elastic membrane layer 14.
[0041] In this embodiment, the air absorption layer 20 is an activated carbon layer. The elastic film layer 14 is made of a thermoplastic elastomer. However, the present invention is not limited thereto, and the air absorption layer 20 may also be made of a material that can absorb gas, such as zeolite, diatomaceous earth, etc. The elastic film layer 14 may also be made of a material that has a certain elasticity and good toughness, such as rubber, a non-thermoplastic elastomer, etc.
[0042] It should be noted that, in one embodiment, two longitudinal openings 122 are provided on the side wall of the shell 12, arranged on opposite sides of the shell 12, and each longitudinal opening 122 is covered with an elastic film layer 14. Alternatively, three longitudinal openings 122 are provided on the side wall of the shell 12, symmetrically arranged around the shell 12 with the central axis of the shell 12 as the center, and each longitudinal opening 122 is covered with an elastic film layer 14. In other words, the number of longitudinal openings 122 can be set according to actual needs. For example, in order to increase the air intake of the air intake layer 20, multiple longitudinal openings 122 can be provided to arrange multiple elastic film layers 14, and the inner surface of each elastic film layer 14 is provided with an air intake layer 20.
[0043] To further illustrate, the housing 12 may be made of aluminum, stainless steel, etc. The longitudinal opening 122 is more suitable for the characteristics of the SMD explosion-proof electrolytic capacitor 10 than the transverse opening or other types of openings.
[0044] When gas is generated inside the housing 12 due to reflow, high welding temperature, long welding time, etc., the gas absorption layer 20 will absorb the gas to prevent the chip explosion-proof electrolytic capacitor 10 from being damaged or exploded. In addition, since the gas absorption layer 20 expands due to gas absorption, or gas accumulates around the gas absorption layer 20 and squeezes the elastic film layer 14, the elastic film layer 14 will expand outward to accommodate the gas, and by observing the degree of outward expansion of the elastic film layer 14, the working state of the chip explosion-proof electrolytic capacitor 10 can be judged and corresponding measures can be taken.
[0045] For example, if Figure 3 As shown, when the elastic membrane layer 14 is observed to expand outward to a nearly limit degree, it is determined that the chip-type explosion-proof electrolytic capacitor 10 is in a state close to damage or explosion, and the chip-type explosion-proof electrolytic capacitor 10 should be stopped immediately for replacement.
[0046] See also Figure 4 , Figure 4 FIG. 2 is a schematic diagram of a structure of an embodiment of the present invention in which the support member 22 is disposed in the longitudinal opening 122. Figure 4 As shown, in one embodiment, a plurality of cross-connected support members 22 are disposed in the longitudinal opening 122, and the support members 22 are located on the inner surface of the air-absorbing layer 20. At this time, the air-absorbing layer 20 and the support members 22 are both in the longitudinal opening 122. The support members 22 are used to support the elastic film layer 14 to prevent the elastic film layer 14 from being sunken inward due to external force, thereby affecting the operation of the SMD explosion-proof electrolytic capacitor 10. In one embodiment, the support members 22 can be integrally formed with the housing 12 to reduce manufacturing costs.
[0047] See also Figure 5 , Figure 5FIG. 2 is a schematic diagram of another embodiment of the present invention in which the support member 22 is disposed in the longitudinal opening 122. Figure 5 As shown, in another embodiment, a plurality of laterally arranged support members 22 are disposed in the longitudinal opening 122, and the support members 22 are located on the inner surface of the air absorption layer 20. At this time, the air absorption layer 20 and the support members 22 are both in the longitudinal opening 122. The support members 22 are used to support the elastic film layer 14 to prevent the elastic film layer 14 from being sunken inward due to external force, thereby affecting the operation of the SMD explosion-proof electrolytic capacitor 10. The support members 22 can be rigid structures such as ribs and metal support plates. However, the present case is not limited to this. In one embodiment, at least one longitudinally arranged support member 22 can also be disposed in the longitudinal opening 122. In addition, in one embodiment, these support members 22 can be integrally formed with the housing 12 to reduce manufacturing costs.
[0048] In addition, in one embodiment, the thickness of the elastic film layer 14 is between 30um and 100um, so as to ensure the elasticity of the film layer while taking into account the structural strength. In one embodiment, the elastic film layer 14 can fully cover the outer surface of the shell 12 to replace the plastic layer of the traditional aluminum electrolytic capacitor shell. However, the present invention is not limited to this. In one embodiment, the outer side of the elastic film layer 14 can be coated with plastic, and the plastic layer can fully cover the outer surface of the shell 12.
[0049] In summary, the present invention provides a chip-type explosion-proof electrolytic capacitor 10, in which the gas generated inside the chip-type explosion-proof electrolytic capacitor 10 is absorbed by the air absorption layer 20, and the elastic film layer 14 expands outward to accommodate the gas, thereby preventing the chip-type explosion-proof electrolytic capacitor 10 from being damaged or exploded. In addition, by observing the degree of outward expansion of the elastic film layer 14, the working state of the chip-type explosion-proof electrolytic capacitor 10 can be judged, and corresponding measures can be taken.
[0050] Furthermore, since the air-absorbing layer 20 is disposed in the longitudinal opening 122 and coated on the inner surface of the elastic film layer 14, the air-absorbing layer 20 does not occupy the space of the core 18 inside the housing 12, effectively ensuring the pre-set capacitance of the SMD explosion-proof electrolytic capacitor 10. The SMD explosion-proof electrolytic capacitor 10 has a simple overall structure and low production cost.
[0051] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the methods and technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.
Claims
1. A chip-type explosion-proof electrolytic capacitor, characterized in that: The SMD explosion-proof electrolytic capacitor comprises: a housing having at least one longitudinal opening; An elastic membrane layer, covering the longitudinal opening and attached to the outer side of the side wall of the shell; A core, disposed inside the shell; a bottom plate connected to one end of the housing and electrically connected to the core, the bottom plate comprising a first conductive pattern and a second conductive pattern, the first conductive pattern and the second conductive pattern being located on both sides of the bottom plate and electrically connected to a positive electrode and a negative electrode of the core, respectively; and The air-absorbing layer is coated on the inner surface of the elastic membrane layer and is arranged in the longitudinal opening.
2. The SMD explosion-proof electrolytic capacitor according to claim 1, characterized in that: The at least one longitudinal opening is two longitudinal openings, and the two longitudinal openings are arranged on opposite sides of the shell.
3. The SMD explosion-proof electrolytic capacitor according to claim 1, characterized in that: The at least one longitudinal opening is three longitudinal openings, which are symmetrically arranged around the shell with the central axis of the shell as the center.
4. The SMD explosion-proof electrolytic capacitor according to claim 1, characterized in that: The housing is made of aluminum metal.
5. The chip-type explosion-proof electrolytic capacitor according to claim 1, characterized in that: The getter layer is an activated carbon layer.
6. The SMD explosion-proof electrolytic capacitor according to claim 1, characterized in that: The getter layer is made of zeolite.
7. The chip-type explosion-proof electrolytic capacitor according to claim 1, characterized in that: The thickness of the elastic film layer is between 30um and 100um.
8. The SMD explosion-proof electrolytic capacitor according to claim 1, characterized in that: The elastic film layer is made of thermoplastic elastomer.
9. The SMD explosion-proof electrolytic capacitor according to claim 1, characterized in that: The length of the longitudinal opening is less than two-thirds of the height of the housing.
10. The SMD explosion-proof electrolytic capacitor according to claim 1, characterized in that: A plurality of supporting members are arranged in the longitudinal opening to support the elastic membrane layer.