Touch display panel and manufacturing method thereof, and display device

Abstract

The present invention provides a touch display panel and a preparation method thereof, and a display device. The touch display panel includes a driving backplane, a light-emitting device arranged in a display area of ​​the driving backplane, an inorganic encapsulation layer and an organic encapsulation layer are arranged on the light-emitting device, and a first touch electrode layer, a first insulating layer, and a second touch electrode layer are arranged on the organic encapsulation layer in sequence. The inorganic encapsulation layer, the organic encapsulation layer, and the first insulating layer all extend to the encapsulation area, and the three film layers play a packaging role together, which has a good packaging effect on the touch display panel. Compared with the traditional structure, the encapsulation layer reduces the preparation of one inorganic encapsulation layer, and simplifies the preparation process of the encapsulation layer.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a touch display panel, a manufacturing method thereof, and a display device. Background Art

[0002] With the continuous advancement of display technology, TSP (Touch Sensor Panel) can adopt the FMLOC (Flexible Multi-Layer On Cell) process to design the touch structure. OLED display panels based on FMLOC technology use a touch electrode layer on the OLED display panel's encapsulation layer to achieve touch control, eliminating the need for an external TSP. This process can reduce screen thickness while eliminating lamination tolerances.

[0003] Currently, OLED display panels based on FMLOC technology still need to explore how to further reduce panel thickness and simplify the manufacturing process in order to achieve thinner product design and further reduce costs.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present invention, and therefore may include information that does not constitute prior art known to ordinary technicians in this field. Summary of the Invention

[0005] An object of the present invention is to provide a touch display panel and a method for manufacturing the same, and a display device, to solve one or more problems existing in the prior art.

[0006] According to one aspect of the present invention, a touch display panel is provided, comprising:

[0007] A driving backplane, comprising a display area and a packaging area arranged around the display area;

[0008] A light emitting device is provided in the display area of ​​the driving backplane;

[0009] an encapsulation layer, comprising an inorganic encapsulation layer and an organic encapsulation layer, wherein the inorganic encapsulation layer is provided on a side of the light-emitting device away from the driving backplane and covers the display area and the encapsulation area, and the organic encapsulation layer is provided on a side of the inorganic encapsulation layer away from the driving backplane and covers the display area and at least a portion of the encapsulation area;

[0010] The touch layer includes a first touch electrode layer, a first insulating layer, and a second touch electrode layer stacked in sequence, wherein the first touch electrode layer is arranged on a side of the packaging layer away from the light-emitting device and is located in the display area, the first insulating layer is arranged on a side of the first touch electrode layer away from the packaging layer and covers the display area and the packaging area, and the second touch electrode layer is arranged on a side of the first insulating layer away from the first touch electrode layer and is located in the display area.

[0011] In an exemplary embodiment of the present invention, the touch layer further includes a second insulating layer, which is disposed between the encapsulation layer and the first touch electrode layer and covers the display area and the encapsulation area.

[0012] In an exemplary embodiment of the present invention, the first insulating layer includes an inorganic material, and the thickness of the first insulating layer is 0.3-0.4 μm; the second insulating layer includes an inorganic material, and the thickness of the second insulating layer is 0.4-0.6 μm.

[0013] In an exemplary embodiment of the present invention, the projected edge of the inorganic encapsulation layer on the driving backplane has a first distance from the edge of the driving backplane; the projected edge of the second insulating layer on the driving backplane has a second distance from the edge of the driving backplane, and the projected edge of the first insulating layer on the driving backplane has a third distance from the edge of the driving backplane; the first distance, the second distance and the third distance are all greater than zero.

[0014] In an exemplary embodiment of the present invention, the second interval and the third interval are equal.

[0015] According to a second aspect of the present invention, there is provided a method for preparing a touch display panel, comprising:

[0016] Providing a driving backplane, the driving backplane having a display area and a peripheral area surrounding the display area, the peripheral area including a packaging area;

[0017] forming a light-emitting device disposed in the display area of ​​the driving backplane;

[0018] An inorganic encapsulation layer and an organic encapsulation layer are sequentially formed on a side of the light-emitting device away from the driving backplane, so that the inorganic encapsulation layer covers the display area and the encapsulation area, and the organic encapsulation layer covers the display area and at least a portion of the encapsulation area, to form an encapsulation layer;

[0019] A first touch electrode layer, a first insulating layer, and a second touch electrode layer are stacked in sequence on a side of the packaging layer away from the light-emitting device, so that the first touch electrode layer is located in the display area, the first insulating layer covers the display area and the packaging area, and the second touch electrode layer is located in the display area to form a touch layer.

[0020] In an exemplary embodiment of the present invention, the method further includes: forming a second insulating layer between the encapsulation layer and the first touch electrode layer, so that the second insulating layer covers the display area and the encapsulation area.

[0021] In an exemplary embodiment of the present invention, forming the inorganic encapsulation layer, the second insulating layer and the first insulating layer includes:

[0022] forming the inorganic encapsulation layer on a side of the light-emitting device away from the driving backplane, so that a projection edge of the inorganic encapsulation layer on the driving backplane has a first distance from an edge of the driving backplane;

[0023] Depositing a second insulating layer covering the driving backplane on a side of the encapsulation layer away from the light-emitting device, and patterning the second insulating layer by a photolithography process so that a projected edge of the second insulating layer on the driving backplane has a second distance from an edge of the driving backplane;

[0024] The first insulating layer covering the driving backplane is deposited on a side of the first touch electrode layer facing away from the second insulating layer, and the first insulating layer is patterned by a photolithography process so that a projection edge of the first insulating layer on the driving backplane has a third distance from an edge of the driving backplane.

[0025] The first spacing, the second spacing and the third spacing are all greater than zero.

[0026] In an exemplary embodiment of the present invention, the second insulating layer and the first insulating layer are patterned by a same photolithography process to simultaneously form the second spacing and the third spacing, and the second spacing is equal to the third spacing.

[0027] According to a third aspect of the present invention, a display device is provided, comprising the touch display panel described above.

[0028] The display panel of the present invention integrates both display and touch control. The inorganic encapsulation layer, organic encapsulation layer, and the first insulating layer of the touch layer all extend into the encapsulation area. Together, these three layers provide encapsulation, resulting in a superior encapsulation effect for the touch display panel. Furthermore, because the first insulating layer in the touch layer participates in the encapsulation, the encapsulation layer eliminates one inorganic encapsulation layer compared to conventional structures, simplifying the encapsulation layer preparation process. This optimizes the overall process and reduces process costs.

[0029] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings are incorporated into and constitute a part of this specification, illustrate embodiments consistent with the present invention, and together with the description, serve to explain the principles of the present invention. Obviously, the drawings described below are only some embodiments of the present invention, and it is clear that those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0031] Figure 1 This is a schematic diagram of a first structure of a touch display panel according to an embodiment of the present invention;

[0032] Figure 2 This is a schematic diagram of a second structure of a touch display panel according to an embodiment of the present invention;

[0033] Figure 3 Schematic diagram of the third structure of the touch display panel according to an embodiment of the present invention;

[0034] Figure 4 Schematic diagram of the fourth structure of the touch display panel according to an embodiment of the present invention;

[0035] Figure 5 FIG. 4 is a flow chart of a method for manufacturing a touch display panel according to an embodiment of the present invention.

[0036] In the figure: 100, driving backplane; 200, light-emitting layer; 400, inorganic encapsulation layer; 500, organic encapsulation layer; 600, second insulating layer; 700, first touch electrode layer; 800, first insulating layer; 900, second touch electrode layer; 110, display area; 120, encapsulation area. DETAILED DESCRIPTION

[0037] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Like reference numerals in the figures represent like or similar structures, and thus their detailed description will be omitted.

[0038] In an embodiment of the present invention, a touch display panel is provided. Figure 1 As shown, the touch display panel according to an embodiment of the present invention includes a driving backplane 100 having a display area 110 and an encapsulation area 120 disposed around the display area 110. The display area 110 of the driving backplane 100 is provided with a light-emitting device 200; the touch display panel further includes an encapsulation layer, which includes an inorganic encapsulation layer 400 and an organic encapsulation layer 500. The inorganic encapsulation layer 400 is disposed on a side of the light-emitting device 200 facing away from the driving backplane 100 and covers the display area 110 and the encapsulation area 120. The organic encapsulation layer 500 is disposed on a side of the inorganic encapsulation layer 400 facing away from the driving backplane 100 and covers the display area 110 and at least a portion of the encapsulation area 120. The touch display panel also includes a touch layer, which includes a first touch electrode layer 700, a first insulating layer 800, and a second touch electrode layer 900 stacked in sequence. The first touch electrode layer 700 is arranged on the side of the packaging layer away from the light-emitting device 200 and is located in the display area 110. The first insulating layer 800 is arranged on the side of the first touch electrode layer 700 away from the packaging layer and covers the display area 110 and the packaging area 120. The second touch electrode layer 900 is arranged on the side of the first insulating layer 800 away from the first touch electrode layer 700 and is located in the display area 110.

[0039] The display panel of the present invention integrates both display and touch control. The inorganic encapsulation layer 400, the organic encapsulation layer 500, and the first insulating layer 800 of the touch layer all extend into the encapsulation area 120. Together, these three layers provide encapsulation, resulting in a good encapsulation effect for the touch display panel. Furthermore, because the first insulating layer 800 of the touch layer participates in the encapsulation, the encapsulation layer eliminates one inorganic encapsulation layer 400 compared to conventional structures, simplifying the encapsulation layer preparation process. This, in turn, optimizes the overall process and reduces process costs.

[0040] The touch display panel according to the embodiment of the present invention is described in detail below:

[0041] Figures 1-4 Schematic cross-sections of the peripheral area and a portion of the display area 110 are shown. The display area 110 of the driver backplane 100 is provided with a pixel circuit, which includes a plurality of drive transistors (not shown in the figure). Each drive transistor can be used to connect to each light-emitting device 200 to drive each light-emitting device 200 to emit light.

[0042] The light-emitting device 200 is formed in the display area 110 of the driving backplane 100, and emits light under the drive of the pixel circuit. The light-emitting device 200 includes a first electrode layer and a second electrode layer arranged opposite to each other, and a light-emitting layer arranged between the first electrode layer and the second electrode layer. The first electrode layer can be an anode layer, which is arranged in each sub-pixel unit, and the second electrode layer can be a whole-surface cathode layer, which covers the light-emitting layer. The light-emitting layer may include a hole injection layer, a hole transport layer, a light-emitting material layer, an electron transport layer and an electron injection layer stacked in sequence on the first electrode. In other embodiments, the light-emitting device 200 may also include other functional layers, which are not listed here. In other embodiments, this film layer may not be provided or other film layers may also be provided. This application does not specifically limit the film layers below the encapsulation layer.

[0043] like Figure 1 As shown, the encapsulation layer needs to cover the display area 110 to prevent water and oxygen from invading the display area 110 and causing damage to the display device. Usually, drive circuits, signal lines and other structures are set around the display area 110, and the encapsulation layer also needs to extend and cover these areas to achieve comprehensive protection of drive circuits, signal lines and other structures to prevent water and oxygen from damaging the circuits. Therefore, the present invention regards the area covered by the encapsulation layer outside the display area 110 as the encapsulation area 120, and the encapsulation layer extends to the encapsulation area 120 to protect the display device and circuits, wiring, etc. In addition, there are some areas on the driving backplane 100 that cannot be covered by the encapsulation layer, such as the areas connected to the leads of the pad, so the encapsulation area only occupies a part of the periphery of the display area. The cross-sectional view of the present invention does not show the area not covered by the encapsulation layer.

[0044] The encapsulation layer includes an inorganic encapsulation layer 400 and an organic encapsulation layer 500 that are stacked. The inorganic encapsulation layer 400 is provided on the side of the light-emitting device 200 away from the driving backplane 100 and covers the display area 110 and the encapsulation area 120. The inorganic encapsulation layer 400 plays the most important encapsulation role and can be made of nitride, oxide, oxynitride, nitrate, carbide or any combination thereof. For example, the inorganic encapsulation layer 400 material may include silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, silicon nitrate, silicon oxynitride or any combination thereof. The organic encapsulation layer 500 is provided on the side of the inorganic encapsulation layer 400 away from the driving backplane 100 and covers the display area 110 and at least part of the encapsulation area 120, and is used to achieve a flattening effect, and can buffer the stress of the display panel when it is bent or folded, and cover particulate contaminants. The organic encapsulation layer 500 can be made of materials such as acrylic, hexamethyldisiloxane, polyacrylate, polycarbonate, and polystyrene.

[0045] Typically, the driver backplane 100 forms several annular packaging dams in the packaging area 120. The packaging dams extend the water and oxygen intrusion path, further preventing the intrusion of water and oxygen. Several annular packaging dams are concentric and arranged around the display area 110. The inorganic packaging layer 400 covers all the packaging dams at the same time, and the organic packaging layer 500 usually ends at the inner packaging dam. This is because the organic packaging material has a certain fluidity, and the packaging dam can restrict the flow of the organic packaging material. Therefore, the coverage area of ​​the organic packaging layer in the figure is smaller than the coverage area of ​​the inorganic packaging layer. In addition, the packaging area 120 of the driver backplane 100 can also form other structures such as barrier columns and grooves to further improve the packaging effect, which will not be repeated here.

[0046] In this embodiment, the touch layer may adopt a self-capacitive touch electrode or a mutual-capacitive touch electrode. The self-capacitive touch electrode has a thinner size and smaller parasitic capacitance, has a better touch effect and is easier to make into a thin size. In one embodiment, taking the self-capacitive touch electrode as an example, the touch layer of the present invention includes two touch electrode layers, one of which may be a metal mesh layer, and the other may be a bridging metal layer. The metal mesh layer includes a plurality of emitting electrodes and a plurality of sensing electrodes located on the same layer, and the plurality of emitting electrodes and the plurality of sensing electrodes are staggered with each other to form a grid shape. The plurality of sensing electrodes are interconnected in this layer, and the plurality of emitting electrodes are bridged by the bridging metal layer, and the emitting electrodes and the sensing electrodes are electrically insulated from each other. A first insulating layer 800 is provided between the two touch electrode layers, and a via is provided on the first insulating layer 800 to achieve the connection between the metal mesh and the bridging metal layer. In this exemplary embodiment, the first touch electrode layer is used as a bridging metal layer, and the second touch electrode layer is used as a metal mesh layer. The bridging metal layer with a smaller area is close to the cathode layer of the light-emitting device 200, while the metal mesh layer with a larger area is away from the cathode layer of the light-emitting device 200. This can make the parasitic capacitance formed between the touch layer and the cathode layer lower, reduce the influence of the parasitic capacitance on the touch capacitance, and ensure an ideal touch effect.

[0047] In other embodiments, one touch electrode layer may be used as an emitting electrode layer, and the other touch electrode layer may be used as a sensing electrode layer to form a mutual capacitance touch electrode. The specific structure will not be described in detail here.

[0048] In some embodiments, the first insulating layer 800 in the touch layer is made of an inorganic material, such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, titanium oxide, or titanium nitride. These materials can provide insulation and block the intrusion of water and oxygen. The thickness of the first insulating layer 800 is preferably 0.3 to 0.4 μm. Within the above thickness range, the first insulating layer 800 can take into account both insulation and encapsulation performance, replacing the top inorganic encapsulation layer 400 in the traditional inorganic / organic / inorganic three-layer encapsulation layer, thereby simplifying the structure of the encapsulation layer to an inorganic / organic double-layer structure.

[0049] In some embodiments, as Figure 2 As shown, the touch layer also includes a second insulating layer 600. The second insulating layer 600 is arranged between the encapsulation layer and the first touch electrode layer 700 and covers the display area 110 and the encapsulation area 120. It can isolate the first touch electrode layer 700 from the wiring in the peripheral area of ​​the driving backplane 100 to prevent short circuits. The second insulating layer 600 can be made of inorganic materials, such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, titanium oxide or titanium nitride. The second insulating layer 600 can be a single-layer or multi-layer structure. Since the second insulating layer 600 also extends to the encapsulation area 120 and is made of inorganic materials, it can also play a role in encapsulation. Together with the inorganic encapsulation layer 400, the organic encapsulation layer 500 and the first insulating layer 800, a total of four film layers are encapsulated, which has a better encapsulation effect on the touch display panel.

[0050] In some embodiments, the thickness of the second insulating layer 600 is preferably 0.4 to 0.6 μm. Within the above thickness range, the second insulating layer 600 can provide good insulation and encapsulation effects. The encapsulation thickness after combining with the first insulating layer 800 reaches 0.7 to 1 μm, which is sufficient to replace the traditional upper inorganic encapsulation layer 400. In some embodiments, the thickness of the inorganic encapsulation layer 400 is preferably 0.8 to 1.2 μm, thereby making the total thickness of the encapsulation layer formed by the inorganic material in the entire encapsulation area 120 reach 1.5 to 2.2 μm, which has a good barrier effect against water and oxygen and has a good encapsulation effect. The thickness of the organic encapsulation layer 500 is preferably 6 to 12 μm, which can effectively buffer the stress of the display panel when it is bent or folded.

[0051] In some embodiments, as Figure 3As shown, the projected edge of the inorganic encapsulation layer 400 on the driver backplane 100 is spaced apart from the edge of the driver backplane 100 by a first distance d1; the projected edge of the second insulating layer 600 on the driver backplane 100 is spaced apart from the edge of the driver backplane 100 by a second distance d2; and the projected edge of the first insulating layer 800 on the driver backplane 100 is spaced apart from the edge of the driver backplane 100 by a third distance d3; the first distance d1, the second distance d2, and the third distance d3 are all greater than zero. In other words, the edges of the inorganic encapsulation layer 400, the second insulating layer 600, and the first insulating layer 800 maintain a certain distance from the edge of the driver backplane 100. As a result, when the display panel is cut from the motherboard along the cutting line, the inorganic encapsulation layer 400, the second insulating layer 600, and the first insulating layer 800 will not crack due to the cutting, ensuring a good encapsulation effect.

[0052] To minimize the impact of stress during cutting on the inorganic encapsulation layer 400, the second insulating layer 600, and the first insulating layer 800, the first spacing d1, the second spacing d2, and the third spacing d3 are preferably no less than 200 μm. Of course, these spacings can be specifically designed based on factors such as the size of the display panel and the film material, and are not specifically limited in the present invention.

[0053] Since the first insulating layer 800 originally requires a photolithography process to form structures such as vias, the area outside the packaging area 120 can be directly etched away through the photolithography process to form the third spacing d3. In order to simplify the process, when the first insulating layer 800 is subjected to a photolithography process, the area outside the packaging area 120 of the second insulating layer 600 can be etched away at the same time, that is, the second spacing d2 and the third spacing d3 are formed simultaneously through a photolithography process. In this way, there is no need to perform a separate photolithography process for the second insulating layer 600, which saves the mask and etching process, greatly improves production efficiency and saves costs. The edges of the second insulating layer 600 and the first insulating layer 800 prepared in this way are flush, that is, the second spacing d2 is equal to the third spacing d3, as shown in FIG. Figure 4 shown.

[0054] Since the stepless encapsulation layer is typically formed by evaporation, the first spacing d1 can be separated. Of course, the first spacing d1 can also be formed by the same photolithography process while the second spacing d2 and the third spacing d3 are formed. The edges of the first insulating layer 800 and the second insulating layer 600 can be coated on the edges of the inorganic encapsulation layer 400, that is, the second spacing d2 and the third spacing d3 are both greater than the first spacing d1, to achieve a better encapsulation effect.

[0055] The present invention also provides a method for preparing the touch display panel. Figure 5 , the preparation method comprises:

[0056] Step S100 , providing a driving backplane 100 , wherein the driving backplane 100 has a display area 110 and a peripheral area surrounding the display area 110 , wherein the peripheral area includes a packaging area 120 ;

[0057] Step S200 , forming a light emitting device 200 disposed in the display area 110 of the driving backplane 100 ;

[0058] Step S300, forming a stacked inorganic encapsulation layer 400 and an organic encapsulation layer 500 in sequence on a side of the light-emitting device 200 facing away from the driving backplane 100, so that the inorganic encapsulation layer 400 covers the display area 110 and the encapsulation area 120, and the organic encapsulation layer 500 covers the display area 110 and at least a portion of the encapsulation area 120, to form an encapsulation layer;

[0059] In step S400, a first touch electrode layer 700, a first insulating layer 800, and a second touch electrode layer 900 are sequentially formed on the side of the packaging layer facing away from the light-emitting device 200, so that the first touch electrode layer 700 is located in the display area 110, the first insulating layer 800 covers the display area 110 and the packaging area 120, and the second touch electrode layer 900 is located in the display area 110 to form a touch layer.

[0060] In step S300, the inorganic encapsulation layer 400 may be formed by chemical vapor deposition, but is not limited thereto. Physical vapor deposition or evaporation may also be used. The organic encapsulation layer 500 may be formed by inkjet printing, but is not limited thereto. Spray coating or other processes may also be used.

[0061] In some embodiments, in order to make the projected edge of the inorganic encapsulation layer 400 on the driving backplane 100 have a first distance from the edge of the driving backplane 100, if a deposition process is used, the edge of the inorganic encapsulation layer 400 can be etched through a photolithography process. If an evaporation method is used, the first distance d1 can be directly formed through the mask plate of the evaporation step, thereby simplifying the process.

[0062] In step S400, the material layers of the first touch electrode layer 700 and the second touch electrode layer 900 can be made of at least one metal material selected from copper, aluminum, molybdenum, and silver, which has relatively high conductivity. A film layer can be formed on the entire surface by methods such as magnetron sputtering, and then the metal of the film layer can be patterned to form the first touch electrode layer 700 and the second touch electrode layer 900. The patterning process can be chemical wet etching. Another method for forming the two touch electrode layers can be inkjet printing. Compared to etching, this method eliminates the need for preparing a photoresist layer and then exposing and developing it before etching, saving steps and eliminating the need for etching impurities introduced by chemical wet etching.

[0063] The first insulating layer 800 and the second insulating layer 600 can be made using a deposition process, such as chemical deposition or physical deposition. In some embodiments, in order to make the projected edge of the second insulating layer 600 on the driving backplate 100 have a second spacing d2 with the edge of the driving backplate 100, and the projected edge of the first insulating layer 800 on the driving backplate 100 have a third spacing d3 with the edge of the driving backplate 100, the two insulating layers can be patterned using a photolithography process so that the area close to the edge of the driving backplate 100 is etched away. As mentioned above, since the first insulating layer 800 originally requires a photolithography process to form structures such as vias, the area outside the packaging area 120 can be directly etched away using this photolithography process to form the third spacing d3. In order to simplify the process, when the first insulating layer 800 is subjected to the photolithography process, the area outside the packaging area 120 of the second insulating layer 600 can be etched away at the same time, that is, the second spacing d2 and the third spacing d3 are formed simultaneously through a single photolithography process. This eliminates the need for a separate photolithography process for the second insulating layer 600, eliminating the need for a mask and etching process, significantly improving production efficiency and reducing costs. The edges of the second insulating layer 600 and the first insulating layer 800 produced in this manner are flush, meaning the second spacing d2 is equal to the third spacing d3. Of course, in other embodiments, the second spacing d2 and the third spacing d3 can also be formed on the two insulating layers using separate photolithography processes.

[0064] The embodiment of the present invention further provides a display device, which includes the touch display panel of the above embodiment. Since the display device includes the above touch display panel, it has the same beneficial effects, and the present invention will not elaborate on them here.

[0065] The present invention does not impose any specific restrictions on the applicability of the display device, which can be any product or component with a display function, such as a television, a laptop computer, a tablet computer, a wearable display device, a mobile phone, a car display, a navigation, an e-book, a digital photo frame, an advertising light box, etc.

[0066] Although relative terms such as "upper" and "lower" are used in this specification to describe the relationship of one illustrated component to another, these terms are used herein for convenience only, such as in accordance with the orientation of the illustrations in the accompanying drawings. It will be understood that if the illustrated device were flipped upside down, the component described as "upper" would become the component "lower." When a structure is referred to as "on" another structure, this may mean that the structure is integrally formed with the other structure, that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via the other structure.

[0067] The terms "a," "an," "the," "said," and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "comprising" and "having" are used to express an open-ended inclusive meaning and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc.

[0068] Other embodiments of the present invention will readily occur to those skilled in the art after considering the specification and practicing the invention disclosed herein. The present invention is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the invention being indicated by the appended claims.

Claims

1. A touch display panel, characterized in that: The touch display panel comprises: A driving backplane, comprising a display area and a packaging area arranged around the display area; A light emitting device, arranged in the display area of ​​the driving backplane; An encapsulation layer, comprising an inorganic encapsulation layer and an organic encapsulation layer, wherein the inorganic encapsulation layer is disposed on a side of the light-emitting device away from the driving backplane and covers the display area and the encapsulation area, and the organic encapsulation layer is disposed on a side of the inorganic encapsulation layer away from the driving backplane and covers the display area and at least a portion of the encapsulation area; A touch layer, comprising a first touch electrode layer, a first insulating layer, a second touch electrode layer, and a second insulating layer which are sequentially stacked, wherein the first touch electrode layer is arranged on a side of the encapsulation layer away from the light-emitting device and is located in the display area, the first insulating layer is arranged on a side of the first touch electrode layer away from the encapsulation layer and covers the display area and the encapsulation area, the second touch electrode layer is arranged on a side of the first insulating layer away from the first touch electrode layer and is located in the display area, and the second insulating layer is arranged between the encapsulation layer and the first touch electrode layer and covers the display area and the encapsulation area; Wherein, the first insulating layer comprises an inorganic material, and the second insulating layer comprises an inorganic material; Among them, the projected edge of the inorganic encapsulation layer on the driving backplane has a first distance from the edge of the driving backplane; the projected edge of the second insulating layer on the driving backplane has a second distance from the edge of the driving backplane, and the projected edge of the first insulating layer on the driving backplane has a third distance from the edge of the driving backplane; the first distance, the second distance and the third distance are all greater than zero, and the second distance and the third distance are equal.

2. The touch display panel according to claim 1, characterized in that: The thickness of the first insulating layer is 0.3-0.4 μm, and the thickness of the second insulating layer is 0.4-0.6 μm.

3. A method for preparing a touch display panel, characterized in that: include: Providing a driving backplane, the driving backplane having a display area and a peripheral area surrounding the display area, the peripheral area including a packaging area; forming a light emitting device disposed in the display area of ​​the driving backplane; Sequentially forming a stacked inorganic encapsulation layer and an organic encapsulation layer on a side of the light-emitting device away from the driving backplane, so that the inorganic encapsulation layer covers the display area and the encapsulation area, and the organic encapsulation layer covers the display area and at least a portion of the encapsulation area, to form an encapsulation layer; A first touch electrode layer, a first insulating layer, and a second touch electrode layer are sequentially stacked on a side of the packaging layer away from the light-emitting device, so that the first touch electrode layer is located in the display area, the first insulating layer covers the display area and the packaging area, and the second touch electrode layer is located in the display area to form a touch layer; forming a second insulating layer between the encapsulation layer and the first touch electrode layer, so that the second insulating layer covers the display area and the encapsulation area; Wherein, forming the inorganic encapsulation layer, the second insulating layer and the first insulating layer comprises: forming the inorganic encapsulation layer on a side of the light emitting device away from the driving backplane, so that a projection edge of the inorganic encapsulation layer on the driving backplane has a first distance from an edge of the driving backplane; Depositing the second insulating layer covering the driving backplane on the side of the encapsulation layer away from the light-emitting device, and patterning the second insulating layer by photolithography so that a projection edge of the second insulating layer on the driving backplane has a second spacing from an edge of the driving backplane; The first insulating layer covering the driving backplane is deposited on a side of the first touch electrode layer away from the second insulating layer, and the first insulating layer is patterned by a photolithography process so that a projection edge of the first insulating layer on the driving backplane has a third distance from an edge of the driving backplane, The first spacing, the second spacing and the third spacing are all greater than zero; the second insulating layer and the first insulating layer are patterned by the same photolithography process to simultaneously form the second spacing and the third spacing, and the second spacing is equal to the third spacing.

4. A display device, characterized in that: Comprising the touch display panel according to claim 1 or 2.

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