Assembly jig set and method for manufacturing semiconductor module

Abstract

The present application provides an assembly jig set for coping with high-density mounting of semiconductor chips and a manufacturing method of a semiconductor module. An assembly jig set for a semiconductor module having a plurality of semiconductor chips is provided, which includes a first outer frame jig and a plurality of inner piece jigs positioned by the first outer frame jig and having a division shape corresponding to the first outer frame jig, one of the plurality of inner piece jigs having a plurality of opening portions for positioning the plurality of semiconductor chips. In addition, a manufacturing method of a semiconductor module using the assembly jig set is provided.

Description

Technical Field

[0001] This invention relates to a method for manufacturing assembly fixture kits and semiconductor modules. Background Technology

[0002] Previously, manufacturing methods using fixtures for assembling semiconductor modules were known (see, for example, Patent Document 1 and Patent Document 2).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2012-164841

[0004] Patent Document 2: Japanese Patent Application Publication No. 2009-267161 Summary of the Invention

[0005] Technical issues

[0006] However, conventional manufacturing methods have struggled to handle high-density mounting and prevent semiconductor chips from sinking beneath the fixture.

[0007] Technical solution

[0008] In a first aspect of the present invention, an assembly fixture kit is provided, which is an assembly fixture kit for a semiconductor module having a plurality of semiconductor chips, comprising: a first outer frame fixture; and a plurality of inner sheet fixtures positioned by the first outer frame fixture and having a segmented shape corresponding to the first outer frame fixture, wherein at least one of the plurality of inner sheet fixtures has a plurality of openings for positioning the plurality of semiconductor chips.

[0009] Multiple inner sheet fixtures may have: a main body having multiple openings; and an outer protrusion extending from the main body for snap-fitting onto the first outer frame fixture.

[0010] The outer protrusion can be positioned opposite one of the multiple openings.

[0011] Multiple openings in multiple inner die fixtures may have inner protrusions for positioning multiple semiconductor chips.

[0012] Multiple inner sheet fixtures may include a first inner sheet fixture and a second inner sheet fixture. The first inner sheet fixture may have an opening with three sides defined by the main body of the first inner sheet fixture and one side defined by the main body of the second inner sheet fixture.

[0013] Multiple inner sheet fixtures may have tapered portions at adjacent ends to prevent interference.

[0014] The assembly fixture kit may also include a second outer frame fixture, which positions the insulating substrate for mounting multiple semiconductor chips and overlaps with the first outer frame fixture. The second outer frame fixture may have positioning portions for alignment with the first outer frame fixture.

[0015] Multiple inner sheet fixtures can have identification marks for position identification.

[0016] The assembly fixture kit may also include partitions that separate multiple inner fixture pieces. The partitions may have mounting portions for snap-fit ​​installation onto the first outer frame fixture.

[0017] The material of the partition can be different from that of the first outer frame fixture and the multiple inner sheet fixtures.

[0018] The first outer frame fixture and multiple inner sheet fixtures can be made of carbon. The partition can be made of carbon fiber composite material.

[0019] The multiple inner sheet fixtures may include a pair of first inner sheet fixtures and a second inner sheet fixture. The pair of first inner sheet fixtures and the second inner sheet fixture may have a shape that allows them to be inserted into an opening of a first outer frame fixture.

[0020] Both the first inner die fixture and the second inner die fixture may have: a main body portion having at least one opening for positioning a semiconductor chip; and an outer protrusion portion extending from the main body portion for engaging with the edge of the opening of the first outer frame fixture.

[0021] The outer protrusion can be positioned opposite one of the openings of the first inner sheet fixture and the second inner sheet fixture.

[0022] In the first inner sheet fixture, the opening provided in the main body can have four sides when viewed from above, of which three sides are defined by the main body of the first inner sheet fixture and one side is defined by the main body of the second inner sheet fixture.

[0023] The first inner jig and the second inner jig may have tapered portions at their adjacent ends to prevent interference.

[0024] The first inner sheet fixture and the second inner sheet fixture may have identification marks for position identification.

[0025] The assembly fixture kit may also include: a pair of third inner sheet fixtures and a fourth inner sheet fixture; and a partition that separates the pair of first inner sheet fixtures and second inner sheet fixtures from the pair of third inner sheet fixtures and fourth inner sheet fixtures. The partition may have mounting portions for snapping onto the first outer frame fixture.

[0026] The first inner jig and the second inner jig may each further have other outer protrusions extending from the main body and used for attaching to the partition.

[0027] In a second aspect of the present invention, a manufacturing method is provided for manufacturing a semiconductor module having a plurality of semiconductor chips, comprising the following steps: providing an insulating substrate for mounting the plurality of semiconductor chips; providing a first outer frame fixture; mounting a plurality of inner wafer fixtures having a segmented shape corresponding to the first outer frame fixture onto the first outer frame fixture; placing the plurality of inner wafer fixtures together on the insulating substrate using the first outer frame fixture; and mounting the plurality of semiconductor chips on the insulating substrate by positioning them using the plurality of inner wafer fixtures, wherein at least one of the plurality of inner wafer fixtures has a plurality of openings for positioning the plurality of semiconductor chips.

[0028] The semiconductor module manufacturing method may also include the following steps: placing a second outer frame fixture on a substrate of the semiconductor module; and placing an insulating substrate on the substrate by positioning it using the second outer frame fixture.

[0029] The step of placing multiple inner sheet fixtures on an insulating substrate may include placing a first outer frame fixture on a second outer frame fixture.

[0030] The manufacturing method may also include the step of installing a partition that separates multiple inner sheet fixtures onto a first outer frame fixture.

[0031] It should be noted that the above description of the invention does not list all the features of the invention. Furthermore, sub-combinations of these feature groups can also constitute inventions. Attached Figure Description

[0032] Figure 1 An outline of the configuration of the semiconductor module 100 is shown.

[0033] Figure 2 This shows an outline of the composition of the assembly jig kit 300.

[0034] Figure 3A Show Figure 2 A cross-sectional view of section A of the assembly fixture kit 300.

[0035] Figure 3B Show Figure 2 The cross-sectional view of section B of the assembly jig kit 300.

[0036] Figure 3C Show Figure 2 A cross-sectional view of section C of the assembly fixture kit 300.

[0037] Figure 4 An example of a flowchart illustrating a method for manufacturing a semiconductor module 100 is shown.

[0038] Figure 5AAn example of the configuration of the second outer frame fixture 320 is shown.

[0039] Figure 5B An example is shown where the insulating substrate 20 is placed on the base substrate 10.

[0040] Figure 5C This is a top view showing an example of a state in which the first outer frame fixture 310 and the second outer frame fixture 320 overlap.

[0041] Figure 6A This is an example of a cross-sectional view showing a semiconductor chip 30 mounted on an insulating substrate 20 using the inner die fixture 330 of the embodiment.

[0042] Figure 6B This is an example of a cross-sectional view showing a semiconductor chip 30 mounted on an insulating substrate 20 using the inner die fixture 330 of the embodiment.

[0043] Figure 7 An example of the configuration of the comparative assembly fixture kit 500 is shown.

[0044] Figure 8A This is an example of a cross-sectional view showing a semiconductor chip 30 mounted on an insulating substrate 20 using a comparative assembly fixture kit 500.

[0045] Figure 8B This is an example of a cross-sectional view showing a semiconductor chip 30 mounted on an insulating substrate 20 using a comparative assembly fixture kit 500.

[0046] Symbol Explanation

[0047] 10…substrate, 20…insulating substrate, 21…conductive plate, 22…insulating plate, 25…under-substrate solder section, 30…semiconductor chip, 35…under-chip solder section, 100…semiconductor module, 300…assembly fixture kit, 310…first outer frame fixture, 312…positioning part, 316…opening, 318…groove, 320…second outer frame fixture, 322…positioning part, 324…positioning part, 326…opening, 328…groove, 329…inner protrusion, 330… Inner sheet fixture, 331…main body, 332…outer protrusion, 333…common part, 334…opening, 335…inner protrusion, 336…opening, 337…step, 338…identification mark, 339…cone, 340…partition, 341…main body, 342…mounting part, 350…partition, 351…main body, 352…mounting part, 500…assembly fixture kit, 510…outer frame fixture, 530…inner sheet fixture, 535…individual sheet, 540…partition Detailed Implementation

[0048] The present invention will now be described through embodiments thereof, but these embodiments do not limit the invention as defined in the claims. Furthermore, not all combinations of the features described in the embodiments are necessarily required for the solution of the invention.

[0049] Figure 1 This diagram shows an outline of the structure of the semiconductor module 100. The semiconductor module 100 includes a substrate 10, an insulating substrate 20, and a semiconductor chip 30. The semiconductor module 100 can be housed in a housing and sealed with sealing resin. The long side direction of the substrate 10 is defined as the X-axis, and the short side direction of the substrate 10 is defined as the Y-axis. The Z-axis forms a right-handed system with the X-axis and Y-axis.

[0050] In this specification, one side along the Z-axis is referred to as "upper" and the other side as "lower". One of the two main surfaces of a substrate, layer, or other component is referred to as the upper surface and the other as the lower surface. The directions of "upper", "lower", "front", and "back" are not limited to the direction of gravity or the direction of mounting the semiconductor chip 30 to the substrate, etc. Top view refers to the view of the assembly fixture kit 300 from the positive Z-axis direction.

[0051] The substrate 10 is disposed on the lower surface side of the semiconductor module 100. The substrate 10 may be a plate-shaped metal plate having a plane parallel to the XY plane. For example, the material of the substrate 10 may be a metal containing aluminum or copper. The substrate 10 may function as a heat sink and may be connected to cooling components such as heat sink fins.

[0052] The insulating substrate 20 is a substrate for mounting the semiconductor chip 30. The insulating substrate 20 is soldered to the base substrate 10 via the under-substrate solder portion 25. The insulating substrate 20 is, for example, a DCB (Direct Copper Bonding) substrate or an AMB (Active Metal Brazing) substrate. The insulating substrate 20 has a conductive plate 21 and an insulating plate 22. The insulating plate 22 is formed using a ceramic material such as alumina (Al2O3), aluminum nitride (AlN), or silicon nitride (Si3N4). The conductive plate 21 is a conductive wiring pattern disposed on the insulating plate 22. For example, the material of the conductive plate 21 is copper.

[0053] In one example, the semiconductor chip 30 is a semiconductor element such as a transistor. The semiconductor chip 30 can also be a vertical semiconductor switching element. The semiconductor chip 30 can be a power semiconductor composed of multiple transistors and diodes. The semiconductor chip 30 can be an insulated-gate bipolar transistor (IGBT), an RC-IGBT composed of an IGBT and a freewheeling diode (FWD), a MOS transistor, etc. Besides silicon, the semiconductor chip 30 can also be formed using semiconductor substrates such as silicon carbide and gallium nitride. The semiconductor chip 30 is soldered to the insulating substrate 20 via an under-chip solder portion 35. Heat generated in the semiconductor chip 30 is conducted to the base substrate 10.

[0054] Figure 2 This diagram illustrates an outline of the configuration of the assembly fixture kit 300. The assembly fixture kit 300 is used to assemble the semiconductor module 100. The assembly fixture kit 300 includes a first outer frame fixture 310, a second outer frame fixture 320, and a plurality of inner wafer fixtures 330. In this example, the assembly fixture kit 300 includes partitions 340 and 350.

[0055] The second outer frame fixture 320 is a fixture used to position the insulating substrate 20. The second outer frame fixture 320 can position the solder portion 25 under the substrate. The second outer frame fixture 320 can be disposed on the base substrate 10 and can position the insulating substrate 20 and other components at any position on the base substrate 10. The second outer frame fixture 320 has a positioning portion 322, a positioning portion 324, and an opening portion 326.

[0056] A positioning portion 322 is provided on the lower surface side of the second outer frame fixture 320. The positioning portion 322 determines the relative position between the base substrate 10 and the second outer frame fixture 320. In one example, the positioning portion 322 is a protrusion for insertion into a recess provided on the base substrate 10. It should be noted that the configuration of the positioning portion 322 is not limited to this.

[0057] The positioning part 324 determines the relative position between the first outer frame fixture 310 and the second outer frame fixture 320. In one example, the positioning part 324 is a protrusion for insertion into a recess provided in the first outer frame fixture 310. It should be noted that the configuration of the positioning part 324 is not limited to this.

[0058] The first outer frame fixture 310 is mounted on the second outer frame fixture 320. That is, the first outer frame fixture 310 overlaps with the second outer frame fixture 320. The first outer frame fixture 310 has a positioning part 312, an opening part 316, and a groove 318.

[0059] Positioning part 312 is provided correspondingly to positioning part 324. In this example, positioning part 312 is an opening for inserting positioning part 324.

[0060] The opening 316 is configured to mount the inner sheet fixture 330 and the partition 340 onto the first outer frame fixture 310. The opening 316 has a shape corresponding to the shape of the inner sheet fixture 330 and the partition 340. Thus, the inner sheet fixture 330 and the partition 340 are positioned. In this example, one opening 316 is provided for one first outer frame fixture 310, but multiple openings 316 may also be provided.

[0061] A groove 318 is provided on the upper surface of the first outer frame fixture 310. The groove 318 is located at a position corresponding to the outer protrusion 332 or the mounting portion 342. By designing the position of the groove 318, it is possible to prevent the inner sheet fixture 330 and the partition 340 from being installed in the wrong position.

[0062] Multiple inner sheet fixtures 330 are disposed inside the first outer frame fixture 310. In this example, three inner sheet fixtures 330 are provided. Each inner sheet fixture 330 has a main body portion 331, multiple outer protrusions 332, and multiple openings 334. In this example, the inner sheet fixture 330 has three outer protrusions 332.

[0063] The main body 331 has a segmented shape corresponding to the first outer frame fixture 310. The segmented shape is formed by dividing the shape of the opening 316 of the first outer frame fixture 310. That is, by merging the shapes of multiple inner sheet fixtures 330, a shape corresponding to the opening 316 can be obtained. The inner sheet fixtures 330 are positioned by the first outer frame fixture 310. The multiple inner sheet fixtures 330 can have an external shape that allows them to be inserted into and held within the opening 316 of the first outer frame fixture 310 in use. Each of the multiple inner sheet fixtures 330 can have an external shape corresponding to the area formed by dividing the opening 316.

[0064] The outer protrusion 332 is a protrusion extending from the main body 331. The outer protrusion 332 is mounted on the first outer frame fixture 310. In this example, the outer protrusion 332 is snap-fitted onto the first outer frame fixture 310.

[0065] The opening 334 is configured for positioning components such as the semiconductor chip 30. In this example, the opening 334 is rectangular, but not limited to this. Multiple openings 334 are provided in the inner die fixture 330.

[0066] A partition 340 separates the multiple inner sheet fixtures 330. The partition 340 is disposed between each inner sheet fixture 330. The partition 340 is configured to hold the inner sheet fixtures 330. The partition 340 has a main body 341 and a mounting part 342. The main body 341 is disposed adjacent to the inner sheet fixtures 330 and positions the inner sheet fixtures 330. In this example, the main body 341 positions the inner sheet fixtures 330 in the X-axis direction.

[0067] Mounting part 342 is used to mount partition 340 to first outer frame fixture 310. Mounting part 342 is a protrusion extending from main body part 341 to first outer frame fixture 310. Mounting part 342 can snap partition 340 onto first outer frame fixture 310. Mounting part 342 is positioned according to the position of groove 318 in first outer frame fixture 310.

[0068] A partition 350 separates the multiple inner sheet fixtures 330. The partition 350 is disposed below the partition 340. The partition 350 can be disposed between each inner sheet fixture 330. The partition 350 has a main body portion 351 and a mounting portion 352. The main body portion 351 is disposed adjacent to the inner sheet fixture 330 and positions the insulating substrate 20 and the substrate under solder portion 25.

[0069] Mounting part 352 is used to mount partition 350 onto second outer frame fixture 320. Mounting part 352 is a protrusion extending from main body part 351 toward second outer frame fixture 320. Mounting part 352 can snap partition 350 onto second outer frame fixture 320. Mounting part 352 is positioned according to the position of groove 328 in second outer frame fixture 320.

[0070] A groove 328 is provided on the upper surface of the second outer frame fixture 320. The groove 328 is located at a position corresponding to the mounting part 352. By designing the position of the groove 328, it is possible to prevent the partition 350 from being installed in the wrong position.

[0071] The materials of the components of the assembly jig kit 300 can be the same or different. The materials of the assembly jig kit 300 are selected from the perspectives of ease of processing, cost, and thermal conductivity.

[0072] For example, the first outer frame fixture 310, the second outer frame fixture 320, and the inner sheet fixture 330 are made of carbon. The first outer frame fixture 310 and the inner sheet fixture 330 can also be made of other materials such as ceramic or metal. The material of the first outer frame fixture 310 can be different from the material of the inner sheet fixture 330.

[0073] The partition 340 is made of a different material than the first outer frame fixture 310 and the inner sheet fixture 330. The partition 340 can be made of a material with higher strength than the first outer frame fixture 310 and the inner sheet fixture 330. For example, the partition 340 is made of carbon fiber composite material. The partition 340 can also be made of other materials such as carbon, ceramics, or metal.

[0074] As described above, the inner die fixture 330 and the partition 340 are mounted on the first outer frame fixture 310. Therefore, by loading the first outer frame fixture 310, the installation and removal of the inner die fixture 330 and the partition 340 can be performed simultaneously. This improves the operability of the semiconductor module 100 assembly process.

[0075] Figure 3A Show Figure 2 A cross-sectional view of section A of the assembly fixture kit 300. Section A passes through the inner sheet fixture 330 and the insulating substrate 20. Section A passes through the positioning part 312 and the positioning part 324. Figure 3A The image shows the second outer frame fixture 320 being placed on the base substrate 10. The first outer frame fixture 310 overlaps with the second outer frame fixture 320.

[0076] The positioning part 312 is provided at least on the lower surface of the first outer frame fixture 310. In this example, the positioning part 312 is an opening that extends from the lower surface of the first outer frame fixture 310 through the upper surface. The positioning part 312 is provided in a shape and position corresponding to the positioning part 324.

[0077] A positioning part 324 is provided on the upper surface of the second outer frame fixture 320. In this example, the positioning part 324 is a protrusion that protrudes onto the upper surface of the second outer frame fixture 320. The positioning part 324 is inserted into the positioning part 312. As a result, the relative position between the first outer frame fixture 310 and the second outer frame fixture 320 is determined.

[0078] Figure 3B Show Figure 2 The diagram shows a cross-sectional view of section B of the assembly fixture kit 300. Section B is a section passing through the partition 340. The partition 340 is positioned at any position on the first outer frame fixture 310 via the mounting part 342. The mounting part 342 can be snapped onto the first outer frame fixture 310 for installation.

[0079] The partition 350 is positioned at any position on the second outer frame fixture 320 via the mounting part 352. The partition 350 is configured to position the insulating substrate 20 and the solder part 25 under the substrate. The mounting part 352 can be snapped onto the second outer frame fixture 320 for mounting.

[0080] It should be noted that when the first outer frame fixture 310 is placed on the second outer frame fixture 320, the partition 340 can be disposed on the base plate 10. When the first outer frame fixture 310 is overlapped, the mounting portion 342 may not be in contact with the first outer frame fixture 310.

[0081] Figure 3C Show Figure 2The diagram shows a cross-sectional view of the assembly fixture kit 300 at section C. Section C is a cross-sectional view passing through the outer protrusion 332 of the inner sheet fixture 330. The inner sheet fixture 330 is positioned in the groove 318 of the first outer frame fixture 310 by the outer protrusion 332. The inner sheet fixture 330 is mounted on the insulating substrate 20. With the first outer frame fixture 310 overlapped, the outer protrusion 332 may not contact the first outer frame fixture 310.

[0082] Figure 4 An example flowchart illustrating a method for manufacturing a semiconductor module 100 is shown. In this example, the semiconductor module 100 is manufactured via steps S100 to S112.

[0083] In step S100, an insulating substrate 20 for mounting a plurality of semiconductor chips 30 is provided. For example, the insulating substrate 20 is placed on a base substrate 10. Alternatively, the insulating substrate 20 may not be placed on the base substrate 10, but may be disposed on an assembly fixture tray. In step S102, a second outer frame fixture 320 is disposed. For example, the second outer frame fixture 320 is disposed on the base substrate 10. In step S104, the insulating substrate 20 is placed on the base substrate 10 by positioning using the second outer frame fixture 320.

[0084] In step S106, a plurality of inner sheet fixtures 330 are mounted together on the insulating substrate 20 using the first outer frame fixture 310. Since a plurality of inner sheet fixtures 330 are mounted on the first outer frame fixture 310, the plurality of inner sheet fixtures 330 are mounted together on the insulating substrate 20 by mounting the first outer frame fixture 310 on the second outer frame fixture 320. The plurality of inner sheet fixtures 330 are mounted on the first outer frame fixture 310 before performing step S106. Alternatively, a partition 340 may be mounted on the first outer frame fixture 310 before performing step S106.

[0085] In step S108, multiple semiconductor chips 30 are positioned on the insulating substrate 20 using multiple inner die fixtures 330. In step S110, solder is melted using a heating furnace for soldering. For example, the insulating substrate 20 is soldered to the base substrate 10 via the under-substrate solder portion 25. The semiconductor chips 30 are soldered to the insulating substrate 20 via the under-chip solder portion 35.

[0086] In step S112, the assembly fixture kit 300 is removed from the substrate 10. Step S112 includes two fixture removal processes: the first outer frame fixture 310 and the second outer frame fixture 320. By removing the first outer frame fixture 310, the inner wafer fixture 330 and the partition 340 are also removed from the substrate 10. It should be noted that the resin housing and sealing resin can be installed through any manufacturing process. Thus, the semiconductor module 100 is manufactured.

[0087] Figure 5A An example of the configuration of the second outer frame fixture 320 is shown. The second outer frame fixture 320 has a positioning part 324 and an opening part 326.

[0088] The positioning part 324 is a component used for positioning with the first outer frame fixture 310. In this example, the positioning part 324 has a pin shape, which is inserted into the positioning part 312 of the first outer frame fixture 310 to determine the relative position between the first outer frame fixture 310 and the second outer frame fixture 320. The shape of the positioning part 324 is not limited to this example, as long as it can determine the relative position between the first outer frame fixture 310 and the second outer frame fixture 320.

[0089] The opening 326 is used for positioning the insulating substrate 20. The insulating substrate 20 is placed on the base substrate 10 through the opening 326. The opening 326 can also be used for placing the solder section 25 under the substrate or other components.

[0090] An inner protrusion 329 is provided at the end of the opening 326. The inner protrusion 329 guides the position of the insulating substrate 20, etc., to any position. By providing multiple inner protrusions 329, the expansion area of ​​the molten solder during reflow can be defined between adjacent inner protrusions 329. Solder scattering can be suppressed through the area between adjacent inner protrusions 329. An inclined portion for guiding the position of the semiconductor chip 30 can be provided in the cross-section of the multiple inner protrusions 329.

[0091] Figure 5B An example is shown where an insulating substrate 20 is placed on a base substrate 10. The insulating substrate 20 is positioned and placed by a second outer frame fixture 320. In this example, three insulating substrates 20 are arranged along the long side of the first outer frame fixture 310. The three insulating substrates 20 have conductive plates 21 with different patterns, but they may also have conductive plates 21 with the same pattern.

[0092] Figure 5C This is a top view showing an example of a state where the first outer frame fixture 310 and the second outer frame fixture 320 are overlapped. Inner sheet fixtures 330 and partitions 340 are mounted on the first outer frame fixture 310. In this example, the first outer frame fixture 310 is equipped with six inner sheet fixtures 330 and two partitions 340.

[0093] The inner sheet fixture 330 includes inner sheet fixtures 330a to 330f. The inner sheet fixture 330 may include three sets: a pair of inner sheet fixtures 330a and 330b, a pair of inner sheet fixtures 330c and 330d, and a pair of inner sheet fixtures 330e and 330f. In this specification, a pair of inner sheet fixtures 330 refers to a fixture in which the inner sheet fixtures 330 contact each other to form a predetermined shape. The pair of inner sheet fixtures 330 has a shape that allows it to be inserted into the opening 316 of the first outer frame fixture 310. The pair of inner sheet fixtures 330a and 330b can be separated from the pair of inner sheet fixtures 330c and 330d by a partition 340. Similarly, the pair of inner sheet fixtures 330c and 330d can be separated from the pair of inner sheet fixtures 330e and 330f by a partition 340.

[0094] One of the multiple inner die fixtures 330 has multiple openings 334 corresponding to the multiple semiconductor chips 30. For example, inner die fixture 330a has four openings 334. Inner die fixture 330b has three openings 334. The number of openings 334 is not particularly limited.

[0095] The opening 334 is configured to define the position for mounting components such as the semiconductor chip 30 on the insulating substrate 20. The opening 334 has a shape corresponding to the components such as the semiconductor chip 30. The opening 334 is configured to correspond to the size and position of the components such as the semiconductor chip 30. As an example, a pair of inner die fixtures 330a and 330b can be used for one insulating substrate 20. As an example, when viewed from above, the insulating substrate 20 is a rectangle with a long side and a short side, and the pair of inner die fixtures 330a and 330b can form a line 343 that divides the long side of the insulating substrate 20 in use.

[0096] The outer protrusion 332 is a component used to mount the inner sheet fixture 330 onto the first outer frame fixture 310. In this example, the outer protrusion 332 is a protrusion used to snap the inner sheet fixture 330 onto the first outer frame fixture 310. In this example, three outer protrusions 332 are provided for each inner sheet fixture 330. For example, outer protrusion 332a is provided on the short side of the first outer frame fixture 310. Outer protrusion 332b is provided on the long side of the first outer frame fixture 310. Outer protrusion 332c is provided on the partition 340.

[0097] The outer protrusion 332c is positioned opposite the opening 334a. If the opening 334a is located at the end of the inner sheet fixture 330, the width of the main body 331 becomes narrower. Even in this case, by widening the width of the main body 331 with the outer protrusion 332c, the strength of the main body 331 can be improved. The outer protrusion 332c is arranged separately from the outer protrusion 332 of the inner sheet fixture 330c in a manner that does not interfere with it. The outer protrusion 332c can be configured for attachment to the partition 340.

[0098] An inner protrusion 335 is provided at the end of the opening 334. The inner protrusion 335 guides the semiconductor chip 30 and the like to any position. By providing multiple inner protrusions 335, the expansion area of ​​the molten solder during reflow can be defined between adjacent inner protrusions 335. The area between adjacent inner protrusions 335 can suppress solder scattering. Inclined portions for guiding the position of the semiconductor chip 30 can be provided in the cross-section of the multiple inner protrusions 335.

[0099] The opening 336 is an opening provided in the inner sheet fixture 330b. A portion of the opening 336 is defined by the inner sheet fixture 330a. In this example, the opening 336 is rectangular. The opening 336 may have at least four sides when viewed from above. Three sides of the opening 336 are defined by the main body 331 of the inner sheet fixture 330b, and the remaining side is defined by the main body 331 of the inner sheet fixture 330a. It should be noted that the inner sheet fixture 330a is an example of a first inner sheet fixture, and the inner sheet fixture 330b is an example of a second inner sheet fixture. An inner protrusion 335 may also be provided on the inner side of the opening 336.

[0100] The common portion 333 is the side opposite to the opening portion 336. The common portion 333 serves as both one side of the opening portion 334 and one side of the opening portion 336. In short, by providing the common portion 333 when the two openings are adjacent, the width of the main body portion 331 can be widened. As a result, even when the semiconductor chips 30 are mounted at high density, the strength of the inner die fixture 330 can be improved.

[0101] The step portion 337 is an L-shaped area provided at the end of an adjacent inner sheet fixture 330. By providing the step portion 337, it is possible to position the adjacent inner sheet fixtures 330 while following the warping of the insulating substrate 20. For example, the step portion 337 can be provided between inner sheet fixtures 330a and 330b, between inner sheet fixtures 330c and 330d, and between inner sheet fixtures 330e and 330f. The position and shape of the step portion 337 can be appropriately modified taking into account factors such as the position of the opening 334 and the strength of the inner sheet fixtures 330.

[0102] The identification mark 338 is used to identify the position of the inner die fixture 330. By setting the identification mark 338, the position of the inner die fixture 330 can be identified by devices such as pick-and-place machines. This enables automatic placement of the inner die fixture 330. Furthermore, the position of the opening 334 can be determined based on the position of the inner die fixture 330, thus automatically placing the semiconductor chip 30. The identification mark 338 marks each inner die fixture 330 with two circular marks. The number and shape of the identification marks 338 are not limited to this.

[0103] Figure 6A This diagram shows an example of a cross-sectional view of a semiconductor chip 30 mounted on an insulating substrate 20 using the inner die fixture 330 of the embodiment. In this example, a cross-section is shown passing through both inner die fixtures 330 and through all four semiconductor chips 30.

[0104] The film thickness t is the sum of the film thicknesses of the semiconductor chip 30 and the solder portion 35 under the chip. If the solder portion 35 under the chip melts, the semiconductor chip 30 may move. When the film thickness t is thin, the semiconductor chip 30 is prone to sinking under the inner die fixture 330.

[0105] The warpage magnitude W represents the degree of warpage of the insulating substrate 20. The warpage of the insulating substrate 20 is caused by the thermal stress during solder bonding. The warpage magnitude W of the insulating substrate 20 varies depending on the shape and material of the insulating substrate 20, etc.

[0106] The gap G represents the distance between the inner wafer fixture 330 and the insulating substrate 20. The gap G varies depending on the warpage W and the following behavior of the inner wafer fixture 330 towards the insulating substrate 20. If the gap G becomes larger than the film thickness t, the semiconductor chip 30 may sink beneath the inner wafer fixture 330. By setting the gap G to be smaller than the film thickness t, it is possible to prevent the semiconductor chip 30 from sinking beneath the inner wafer fixture 330.

[0107] The inner die fixture 330 is disposed in a segmented manner relative to the insulating substrate 20. In this example, the inner die fixture 330 is disposed in a segmented manner, consisting of an inner die fixture 330g and an inner die fixture 330h. By segmenting the inner die fixture 330, the warp-following capability of the insulating substrate 20 is improved. As a result, high-density mounting of the semiconductor chip 30 can be accommodated, and costs can be suppressed.

[0108] The number of divisions in the inner die fixture 330 is not particularly limited. In this example, two divisions are shown, but it can also be divided into three or more. By increasing the number of divisions in the inner die fixture 330, the ability to follow the warpage of the insulating substrate 20 is improved, the gap G is reduced, and thus it is easier to further suppress the insertion of the semiconductor chip 30. On the other hand, if the number of divisions in the inner die fixture 330 is increased, there are issues with cost and the strength of the inner die fixture 330. The number of divisions in the inner die fixture 330 can be appropriately varied according to factors such as the area of ​​the insulating substrate 20 and the thickness of the semiconductor chip 30.

[0109] The inner die fixture 330 is provided corresponding to a plurality of semiconductor chips 30. That is, the inner die fixture 330 is not provided for each individual semiconductor chip 30. For example, the inner die fixture 330g is provided corresponding to semiconductor chips 30a and 30b. The inner die fixture 330h is provided corresponding to semiconductor chips 30c and 30d. By providing the inner die fixture 330 corresponding to a plurality of semiconductor chips 30, the strength of the inner die fixture 330 can be improved.

[0110] Figure 6B This is an example of a cross-sectional view showing a semiconductor chip 30 mounted on an insulating substrate 20 using the inner die fixture 330 of the embodiment. The inner die fixture 330 in this example has a tapered portion 339. Inner die fixtures 330g and 330h are examples of inner die fixtures 330 arranged adjacent to each other.

[0111] The cone 339 is an inclined portion of the upper surface of the inner die fixture 330. The cone 339 is provided at the adjacent ends of the inner die fixtures 330g and 330h. The cone 339 prevents interference between the inner die fixtures 330. In this example, the cone 339 is provided on both the inner die fixtures 330g and 330h. The cone 339 may also be provided only on either the inner die fixture 330g or the inner die fixture 330h. By providing the cone 339, interference between the inner die fixtures 330 that occurs when the insulating substrate 20 warps can be suppressed. Since the inner die fixtures 330 easily follow the warping of the insulating substrate 20, the gap G can be reduced. This improves the positioning accuracy of the semiconductor chip 30, making it easier to handle high-density mounting.

[0112] As described above, the assembly fixture kit 300 can also handle situations where the spacing between semiconductor chips 30 is small in high-density mounting, or where the semiconductor chips 30 are positioned at the ends of the substrate 10. The assembly fixture kit 300 improves operability and enhances the positioning accuracy of the semiconductor chips 30.

[0113] Figure 7An example of the configuration of a comparative assembly fixture kit 500 is shown. The assembly fixture kit 500 includes an outer frame fixture 510, an inner sheet fixture 530, and a partition 540. In the assembly fixture kit 500, the inner sheet fixture 530 and the partition 540 are not mounted on the outer frame fixture 510, therefore the fixture mounting operation needs to be repeated a number of times corresponding to the number of inner sheet fixtures 530 and partitions 540.

[0114] For example, in the installation process of the assembly jig kit 500, six installation operations are required for the outer frame jig 510, the three inner jigs 530, and the two partitions 540, respectively. Similarly, in the disassembly process of the assembly jig kit 500, six disassembly operations are required for the outer frame jig 510, the three inner jigs 530, and the two partitions 540, respectively. Therefore, if the assembly jig kit 500 is used, a total of twelve jig placement operations are required.

[0115] On the other hand, in the installation process of the assembly fixture kit 300 in this embodiment, only two installation operations are required for the first outer frame fixture 310 and the second outer frame fixture 320. Similarly, in the disassembly process of the assembly fixture kit 300, only two disassembly operations are required for the first outer frame fixture 310 and the second outer frame fixture 320. Therefore, if the assembly fixture kit 300 is used, a total of four fixture placement operations are required. Once the inner sheet fixture 330 and the partition 340 are installed on the first outer frame fixture 310, the inner sheet fixture 330 and the partition 340 do not need to be installed or disassembled thereafter.

[0116] Figure 8A This diagram shows an example of a cross-sectional view of a semiconductor chip 30 mounted on an insulating substrate 20 using the comparative example assembly fixture kit 500. In this example, the inner die fixture 530 is an integral, undivided type and cannot follow the warping of the insulating substrate 20. Therefore, the gap G becomes larger than in the embodiment. Thus, in the comparative example, there is a situation where the gap G is greater than the film thickness t. In this case, because the semiconductor chip 30 is submerged under the inner die fixture 530 when the solder under the chip melts, it is difficult to place it in the correct position.

[0117] Figure 8B This is an example of a cross-sectional view showing a semiconductor chip 30 mounted on an insulating substrate 20 using a comparative assembly fixture kit 500. The assembly fixture kit 500 in this example has individual wafer types with individual wafers 535 at each opening of the inner wafer fixture 530.

[0118] Individual wafers 535 are disposed corresponding to each of the plurality of semiconductor chips 30. The length of the individual wafers 535 in the thickness direction of the semiconductor chip 30 can be individually adjusted according to the position and shape of the semiconductor chip 30. The length of the individual wafers 535 is adjusted to prevent the semiconductor chip 30 from being recessed. While the use of individual wafers 535 facilitates handling the recessing of the semiconductor chip 30, it cannot handle high-density mounting with small spacing between the semiconductor chips 30. In particular, when the semiconductor chip 30 is disposed at the end of the substrate 10, the strength of the inner wafer jig 530 and the individual wafers 535 becomes a problem. Furthermore, since individual wafers 535 corresponding to the shape of each semiconductor chip 30 need to be prepared, the number of components increases, leading to higher costs.

[0119] The present invention has been described above using embodiments, but the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various modifications or improvements can be made to the above embodiments. As can be seen from the claims, methods obtained by such modifications or improvements can also be included within the technical scope of the present invention.

[0120] It should be noted that the execution order of actions, processes, steps, and stages in the apparatus, system, program, and method shown in the claims, specification, and drawings can be implemented in any order unless specifically stated as "earlier than" or "before," and as long as the results of previous processes are not used in subsequent processes. Even if the flow of actions in the claims, specification, and drawings is described using terms such as "firstly" or "next" for convenience, it does not mean that they must be implemented in that order.

Claims

1. An assembly jig kit, characterized in that, It is an assembly fixture kit for semiconductor modules with multiple semiconductor chips, which includes: First outer frame fixture; and Multiple inner sheet fixtures are positioned by the first outer frame fixture and have a segmentation shape corresponding to the first outer frame fixture. At least one of the plurality of inner wafer fixtures has a plurality of openings for positioning the plurality of semiconductor chips. The plurality of inner sheet fixtures are inner sheet fixtures that are separated from each other. The first outer frame fixture has an opening configured to mount the plurality of inner sheet fixtures onto the first outer frame fixture. The plurality of inner sheet fixtures have an shape that is inserted into and held in the opening of the first outer frame fixture in the use state.

2. The assembly fixture kit according to claim 1, characterized in that, The plurality of inner sheet fixtures have: The main body, which is provided with the plurality of openings; and An outer protrusion, extending from the main body, is used for snap-fit ​​mounting to the first outer frame fixture.

3. The assembly fixture kit according to claim 2, characterized in that, The outer protrusion is positioned opposite one of the plurality of openings.

4. The assembly fixture kit according to any one of claims 1 to 3, characterized in that, The plurality of openings of the plurality of inner die fixtures have inner protrusions for positioning the plurality of semiconductor chips.

5. The assembly fixture kit according to any one of claims 1 to 3, characterized in that, The plurality of inner sheet fixtures include a first inner sheet fixture and a second inner sheet fixture. The first inner sheet fixture has an opening with three sides defined by the main body of the first inner sheet fixture and one side defined by the main body of the second inner sheet fixture.

6. The assembly fixture kit according to any one of claims 1 to 3, characterized in that, The plurality of inner sheet fixtures have tapered portions at their adjacent ends to prevent interference.

7. The assembly fixture kit according to any one of claims 1 to 3, characterized in that, The assembly fixture kit also includes a second outer frame fixture, which positions the insulating substrate for mounting the plurality of semiconductor chips and overlaps with the first outer frame fixture. The second outer frame fixture has a positioning part for aligning with the position of the first outer frame fixture.

8. The assembly fixture kit according to any one of claims 1 to 3, characterized in that, The plurality of inner sheet fixtures have identification marks for position identification.

9. The assembly fixture kit according to any one of claims 1 to 3, characterized in that, The assembly fixture kit also includes partitions that separate the multiple inner fixture pieces. The partition has a mounting portion for being snapped onto the first outer frame fixture.

10. The assembly fixture kit according to claim 9, characterized in that, The partition is made of a different material than the first outer frame fixture and the plurality of inner sheet fixtures.

11. The assembly fixture kit according to claim 10, characterized in that, The first outer frame fixture and the plurality of inner sheet fixtures are made of carbon. The partition is made of carbon fiber composite material.

12. The assembly fixture kit according to claim 1, characterized in that, The plurality of inner sheet fixtures includes a first inner sheet fixture and a second inner sheet fixture. The pair of first inner sheet fixtures and second inner sheet fixtures have a shape that allows them to be inserted into the opening of the first outer frame fixture.

13. The assembly fixture kit according to claim 12, characterized in that, Both the first inner sheet fixture and the second inner sheet fixture have: The main body has at least one opening for positioning a semiconductor chip; and An outer protrusion, extending from the main body, is used to engage with the edge of the opening of the first outer frame fixture.

14. The assembly fixture kit according to claim 13, characterized in that, The outer protrusion is positioned opposite one of the openings of the first inner sheet fixture and the second inner sheet fixture.

15. The assembly fixture kit according to claim 13, characterized in that, In the first inner sheet fixture, the opening provided in the main body has four sides when viewed from above, three of which are defined by the main body of the first inner sheet fixture, and one side is defined by the main body of the second inner sheet fixture.

16. The assembly fixture kit according to any one of claims 12 to 15, characterized in that, The first inner sheet fixture and the second inner sheet fixture have tapered portions at their adjacent ends to prevent interference.

17. The assembly fixture kit according to any one of claims 12 to 15, characterized in that, The first inner sheet fixture and the second inner sheet fixture have identification marks for position identification.

18. The assembly fixture kit according to claim 13, characterized in that, The assembly fixture kit also includes: A pair of third inner sheet fixtures and a fourth inner sheet fixture; and A partition separates the pair of first and second inner sheet fixtures from the pair of third and fourth inner sheet fixtures. The partition has a mounting portion for attaching to the first outer frame fixture.

19. The assembly fixture kit according to claim 18, characterized in that, Both the first inner sheet fixture and the second inner sheet fixture further have other outer protrusions extending from the main body portion and used for engaging with the partition.

20. A manufacturing method, characterized in that, It is a method for manufacturing a semiconductor module having multiple semiconductor chips, the method comprising the following steps: An insulating substrate is provided for mounting the plurality of semiconductor chips; Provide the first outer frame fixture; Multiple inner piece fixtures having a segmented shape corresponding to the first outer frame fixture are installed on the first outer frame fixture; The first outer frame fixture is used to place the plurality of inner sheet fixtures onto the insulating substrate; as well as The multiple semiconductor chips are positioned and mounted on the insulating substrate using the multiple inner wafer fixtures. At least one of the plurality of inner wafer fixtures has a plurality of openings for positioning the plurality of semiconductor chips. The plurality of inner sheet fixtures are inner sheet fixtures that are separated from each other. The first outer frame fixture has an opening configured to mount the plurality of inner sheet fixtures onto the first outer frame fixture. The plurality of inner sheet fixtures have an shape that is inserted into and held in the opening of the first outer frame fixture in the use state.

21. The manufacturing method according to claim 20, characterized in that, The manufacturing method further includes the following steps: The second outer frame fixture is placed on the substrate of the semiconductor module; and The insulating substrate is positioned on the base substrate by means of the second outer frame fixture.

22. The manufacturing method according to claim 21, characterized in that, The step of placing the plurality of inner sheet fixtures on the insulating substrate includes the step of placing the first outer frame fixture on the second outer frame fixture.

23. The manufacturing method according to any one of claims 20 to 22, characterized in that, The manufacturing method further includes the step of installing a partition that separates the plurality of inner sheet fixtures onto the first outer frame fixture.

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