Silicon rod squaring equipment and side skin discharging device applied to silicon rod squaring equipment

Abstract

The present application discloses a silicon rod squaring device and a side skin discharging device applied to the silicon rod squaring device. The silicon rod squaring device includes a silicon rod bearing platform and a wire cutting device. The wire cutting device includes a liftable wire cutting support and a wire cutting unit provided on the wire cutting support. A cutting wire segment is provided in the wire cutting unit, and the single crystal silicon rod is penetrated by the cutting wire segment to form a cut silicon rod and side skins. The side skin discharging device includes: a side skin lifting mechanism for lifting the side skins so that the top ends of the side skins protrude from the cut silicon rod; and a clamping and transporting unit provided above the silicon rod bearing platform for clamping the top ends of the side skins and then pulling the side skins away from the cut silicon rod and transporting the side skins to a side skin unloading area. The present application can timely remove the side skins generated after cutting the silicon rod, which not only improves the work efficiency but also avoids the risks brought by manual handling.

Description

Technical Field

[0001] This application relates to the technical field of silicon rod processing, and particularly to a silicon rod squaring device and a side skin unloading device applied to the silicon rod squaring device. Background Art

[0002] Currently, with the increasing attention and development of the society towards the utilization and development of green renewable energy, the field of photovoltaic solar power generation has received more and more attention and development. In the field of photovoltaic power generation, ordinary crystalline silicon solar cells are made on high-quality silicon wafers, and such silicon wafers are cut from silicon ingots by wire saws after pulling or casting. Currently, due to characteristics such as high production efficiency, low operation cost, and high operation accuracy, the multi-wire cutting technology is widely used in the production of silicon rod cutting.

[0003] Generally, a squaring device is used to square the silicon rod. At this time, the cutting mechanism feeds along the length direction of the silicon rod and cuts out four pairwise parallel planes on the circumference of the silicon rod; after squaring, a multi-wire slicing machine is used to slice the squared silicon rod along the length direction to obtain the required silicon wafers.

[0004] In the related silicon rod squaring operation, side skins will be formed after the silicon rod is squared and cut. Therefore, it is necessary to unload the formed side skins first. Generally, most of the side skin unloading methods still rely on manual operation by operators to separate the side skins from the cut silicon rod and move them out of the silicon rod squaring device. This is not only inefficient, but also increases the risk of damage to the cut silicon rod due to the collision between the side skins and the cut silicon rod during the handling process. Summary of the Invention

[0005] In view of the above-mentioned disadvantages of the related technology, the purpose of this application is to provide a silicon rod squaring device and a side skin unloading device applied to the silicon rod squaring device.

[0006] To achieve the above purpose and other related purposes, in the first aspect of this application, a side skin unloading device applied to a silicon rod squaring device is disclosed. The silicon rod squaring device includes a silicon rod bearing platform and a wire cutting device. The silicon rod bearing platform is used to bear a single-crystalline silicon rod placed vertically. The wire cutting device includes a liftable wire cutting support and a wire cutting unit provided on the wire cutting support. The wire cutting unit has a cutting line segment, and the single-crystalline silicon rod is penetrated by the cutting line segment to form a cut silicon rod and side skins. The side skin unloading device includes: a side skin lifting mechanism for lifting the side skins so that the top ends of the side skins protrude from the cut silicon rod; and a clamping and transfer unit provided above the silicon rod bearing platform for clamping the top ends of the side skins and then pulling the side skins to separate from the cut silicon rod and transferring the side skins to a side skin unloading area.

[0007] In certain embodiments of the first aspect of the present application, the edge skin lifting mechanism includes a lifting member that is provided on the wire cutting support and can move telescopically. After the lifting member is controlled to perform an extension movement, it supports the bottom of the edge skin to lift the edge skin.

[0008] In certain embodiments of the first aspect of the present application, the edge skin lifting mechanism includes an adsorption member that is provided on the wire cutting support and can move telescopically. After the adsorption member is controlled to extend, it rests against the edge skin and adsorbs the edge skin to lift the edge skin.

[0009] In certain embodiments of the first aspect of the present application, the clamping and transfer unit includes: a moving mechanism that provides movement in at least one direction; and at least one liftable clamping assembly edge clamping mechanism, which is connected to the moving mechanism and is driven to move in at least one direction.

[0010] In certain embodiments of the first aspect of the present application, the edge skin clamping mechanism includes: a lifting drive structure; and a clamping assembly, disposed at the bottom of the lifting drive structure, for clamping or releasing the top end of the edge skin.

[0011] In certain embodiments of the first aspect of the present application, the clamping assembly includes: a cover body, used to cover the edge skin; and a retractable clamping member, provided inside the cover body; a clamping space for clamping the edge skin is formed between the clamping member and the cover body.

[0012] In certain embodiments of the first aspect of the present application, the clamping assembly includes: a curved plate; and a retractable clamping member, wherein a clamping space for clamping the edge skin is formed between the clamping member and the curved plate.

[0013] In certain embodiments of the first aspect of the present application, the clamping member is a movable pressure block controlled by a cylinder, and the movable pressure block is connected to the cylinder via a flip arm.

[0014] In certain embodiments of the first aspect of the present application, the flip arm has a mounting portion and a first connecting portion and a second connecting portion respectively located on opposite sides of the mounting portion, wherein the first connecting portion is connected to the piston rod of the cylinder and the second connecting portion is connected to the movable pressure block.

[0015] In certain embodiments of the first aspect of the present application, the movable pressing block is provided with a buffer pad for contacting the edge skin.

[0016] In certain embodiments of the first aspect of the present application, the edge skin unloading device applied to the silicon rod squaring equipment further includes: an edge skin cylinder, which is arranged in the edge skin unloading area.

[0017] In certain embodiments of the first aspect of the present application, the side skin unloading device applied to the silicon rod squaring device further includes: a side skin conveying structure disposed in the side skin unloading area.

[0018] The second aspect of the present application discloses a silicon rod squaring device for performing squaring operations on a single crystal silicon rod with a circular cross-section, including: at least two silicon rod bearing platforms for bearing the vertically placed single crystal silicon rods; a wire cutting device disposed above the at least two silicon rod bearing platforms, including a plurality of cutting wheels and a cutting wire around which at least one cutting line segment is formed; and the side skin unloading device as described in the first aspect of the present application.

[0019] In summary, through the silicon rod squaring device disclosed in the present application and the side skin unloading device applied to the silicon rod squaring device, the side skin generated after the silicon rod squaring device cuts the silicon rod can be timely unloaded by the clamping component, which not only improves the work efficiency but also avoids the risks brought by manual handling. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It shows a schematic diagram of the overall structure of the silicon rod squaring device of the present application in an embodiment.

[0021] Figure 2 It shows a schematic diagram of the workbench conversion mechanism as a rotating mechanism in an embodiment of the silicon rod squaring device of the present application.

[0022] Figure 3a It shows a schematic diagram of a state of the workbench conversion mechanism as a translation mechanism in an embodiment of the silicon rod squaring device of the present application.

[0023] Figure 3b It shows a schematic diagram of another state of the workbench conversion mechanism as a translation mechanism in an embodiment of the silicon rod squaring device of the present application.

[0024] Figure 4 It shows a schematic diagram of the structure of the silicon rod loading and unloading device in an embodiment of the silicon rod squaring device of the present application.

[0025] Figure 5 Shown as Figure 4 the top view of.

[0026] Figure 6 It shows a cross-sectional view of the first fixture of the silicon rod loading and unloading device in an embodiment of the silicon rod squaring device of the present application.

[0027] Figure 7 It shows a schematic diagram of the first driving structure in an embodiment of the silicon rod squaring device of the present application.

[0028] Figure 8It shows a schematic structural diagram of each cutting wheel set having a pair of cutting wheels in the wire cutting device of the silicon rod squaring equipment of the present application in an embodiment.

[0029] Figure 9 It shows a schematic structure of each cutting wheel set having two pairs of cutting wheels in the wire cutting device of the silicon rod squaring equipment of the present application in an embodiment.

[0030] Figure 10 Shown as Figure 9 the side structural schematic diagram.

[0031] Figure 11 It shows a schematic diagram of the wire winding of the guide wheel when each cutting wheel set in the wire cutting device of the silicon rod squaring equipment of the present application has two pairs of cutting wheels in an embodiment.

[0032] Figure 12 It shows a schematic structural diagram of the automatic groove changing mechanism cooperating with the wire cutting device of the silicon rod squaring equipment of the present application in an embodiment.

[0033] Figure 13 It shows a schematic sectional structural diagram of the automatic groove changing mechanism of the silicon rod squaring equipment of the present application in an embodiment.

[0034] Figure 14 Shown as Figure 13 the enlarged partial view of part B.

[0035] Figures 15a to 15d It shows a schematic structural diagram of the movement process of the automatic groove changing mechanism of the silicon rod squaring equipment of the present application in an embodiment.

[0036] Figure 16 It shows a schematic structural diagram of the silicon rod pressing device of the silicon rod squaring equipment of the present application in an embodiment.

[0037] Figure 17 It shows a schematic structural diagram of the side skin supporting mechanism of the silicon rod squaring equipment of the present application in an embodiment.

[0038] Figure 18 It shows a schematic structural diagram of the side skin lifting mechanism of the side skin discharging device applied to the silicon rod squaring equipment of the present application in an embodiment.

[0039] Figure 19 Shown as Figure 2 the enlarged partial view of part A in.

[0040] Figure 20 It shows a schematic external structural diagram of the side skin clamping mechanism of the side skin discharging device applied to the silicon rod squaring equipment of the present application in an embodiment.

[0041] Figure 21It shows a schematic cross-sectional structure diagram of a clamping component of the edge skin unloading device to which the present application is applied in a silicon rod squaring device in an embodiment. Detailed implementation manners

[0042] The following specific embodiments illustrate the implementation manners of the present application. Those skilled in this technology can easily understand other advantages and effects of the present application from the content disclosed in this specification.

[0043] In the following description, reference is made to the accompanying drawings, which describe several embodiments of the present application. It should be understood that other embodiments may also be used, and mechanical composition, structure, electrical, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is only defined by the claims of the published patent. The terms used herein are only for describing specific embodiments and are not intended to limit the present application. Spatially related terms, such as "upper", "lower", "left", "right", "below", "beneath", "lower part", "above", "upper part", etc., may be used in the text to facilitate the description of the relationship between one element or feature shown in the figure and another element or feature.

[0044] Although in some instances the terms first, second, etc. are used herein to describe various elements or parameters, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another. For example, the first wire groove may be referred to as the second wire groove, and similarly, the second wire groove may be referred to as the first wire groove, without departing from the scope of the various described embodiments. The first wire groove and the second wire groove are both describing a wire groove, but unless the context clearly indicates otherwise, they are not the same wire groove. Similar situations also include the first guide rail and the second guide rail, or the first direction and the second direction.

[0045] Furthermore, as used herein, the singular forms "a", "an", and "the" are intended to also include the plural forms unless the context indicates otherwise. It should be further understood that the terms "comprising", "including" indicate the presence of the described features, steps, operations, elements, components, items, types, and / or groups, but do not exclude the presence, appearance, or addition of one or more other features, steps, operations, elements, components, items, types, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or meaning any one or any combination. Thus, "A, B, or C" or "A, B, and / or C" means "any one of the following: A; B; C; A and B; A and C; B and C; A, B, and C". An exception to this definition only occurs when the combination of elements, functions, steps, or operations is mutually exclusive in some way.

[0046] In the operation of slicing silicon rods, after slicing the silicon rods, edge skins will be formed. Therefore, it is necessary to unload the formed edge skins first. Most of the existing edge skin unloading methods still rely on manual operation by operators to separate the edge skins from the sliced silicon rods and carry them out of the silicon rod slicing equipment. This not only has low efficiency but also increases the risk of damage to the sliced silicon rods due to the collision between the edge skins and the sliced silicon rods during the handling process. Therefore, it is necessary to propose a silicon rod slicing equipment and an edge skin unloading device applied to the silicon rod slicing equipment to enable timely unloading of the edge skins and improve the operation efficiency.

[0047] The following combines examples and Figures 1 to 21 will explain in detail the silicon rod slicing equipment of the present application and the edge skin unloading device applied to the silicon rod slicing equipment.

[0048] Please refer to Figure 1 , which shows the overall structural schematic diagram of the silicon rod slicing equipment of the present application in an embodiment. As shown in the figure, the silicon rod slicing equipment further includes a machine base 20. The machine base 20 is set as the main component of the silicon rod slicing equipment of the present application and is used to provide a slicing operation platform. Preferably, the machine base 20 has a relatively large volume and weight to provide a larger installation surface and a more stable overall machine stability.

[0049] At least two silicon rod bearing platforms 21 are used to bear the vertically placed silicon rods. Each of the silicon rod bearing platforms 21 has a rotating mechanism 210. The rotating mechanism 210 is used to drive the silicon rod placed on the silicon rod bearing platform 21 to rotate to adjust the surface to be sliced. In an exemplary embodiment, the rotating mechanism 210 is set as a rotating turntable located at the bottom of the silicon rod bearing platform 21. This rotating turntable is controlled by a driving device (not shown). The driving device can be, for example, a servo motor that drives the rotating turntable to rotate, but is not limited thereto. In an optional embodiment, the rotating mechanism 210 can adopt a lifting design. That is, after the rotating turntable at the bottom of the silicon rod bearing platform 21 is controlled, it can perform a telescopic action to drive the silicon rod bearing platform 21 to perform a lifting movement, thereby adjusting the height of the silicon rod to be sliced on the silicon rod bearing platform 21.

[0050] In order to better protect the silicon rod to be sliced on the silicon rod bearing platform, in an exemplary embodiment, a buffer pad is fixed on the supporting surface of each silicon rod bearing platform 21 (this supporting surface is the upper surface of the silicon rod bearing platform for supporting the silicon rod to be sliced), so that the buffer pad is located between the silicon rod bearing platform 21 and the silicon rod to be sliced when the silicon rod to be sliced is placed.

[0051] In one embodiment, referring to Figure 1 , the at least two silicon rod bearing platforms 21 are directly set on the machine base and are arranged at intervals in a straight line in the cutting area. When at least two silicon rod bearing platforms 21 bear the silicon rods to be sliced, the centers of these silicon rods to be sliced are located on the same straight line (in the form ofFigure 1 As shown, it is easy to understand that the cutting area is the area where the ingot slicing equipment slices the silicon ingot. Specifically, the cutting area is, for example, the area below the cutting device in the silicon ingot squaring equipment.

[0052] In practical applications, in order to improve work efficiency and enable the squaring equipment to perform cutting work and loading / unloading work simultaneously, please refer to Figure 2 , which shows a schematic diagram of the workbench conversion mechanism of the silicon ingot squaring equipment of the present application being a rotating mechanism in an embodiment. As shown in the figure, in another embodiment, at least two silicon ingot carriers 21 can be arranged on the silicon ingot workbench 22. A workbench conversion mechanism 220 is provided on the silicon ingot workbench 22 for driving the silicon ingot workbench 21 to perform a conversion movement so that the silicon ingot carriers on the silicon ingot workbench 21 are converted between the loading / unloading area and the cutting area. It is easy to understand that the loading / unloading area is the area for loading and unloading in the silicon ingot squaring equipment. Specifically, for example, it is the area corresponding to both sides of the silicon ingot workbench in the silicon ingot squaring equipment. The cutting area is the area for cutting the silicon ingot to be cut on the silicon ingot squaring equipment. Specifically, for example, it is the area below the cutting device in the silicon ingot squaring equipment.

[0053] In this embodiment, the silicon ingot workbench 22 is arranged on the machine base 20 and is set to be at least one. At least two silicon ingot carriers 21 are arranged on each silicon ingot workbench 22. At least one of the silicon ingot carriers 21 on each silicon ingot workbench 22 is located in the cutting area, and at least one silicon ingot carrier 21 is located in the loading / unloading area. The silicon ingot carriers 21 located in the cutting area on each silicon ingot workbench 22 are arranged at intervals in a straight line in sequence. Thus, when the silicon ingots to be cut are supported by the silicon ingot carriers 21 located in the cutting area, the centers of these silicon ingots to be cut are located on the same straight line. In an exemplary embodiment, refer to Figure 2 , two silicon ingot workbenches 22 are arranged on the machine base. Four silicon ingot carriers 21 are arranged on each silicon ingot workbench 22. Two of the silicon ingot carriers 21 on each silicon ingot workbench 22 are located in the cutting area, and the other two silicon ingot carriers 21 are located in the loading / unloading area. The four silicon ingot carriers 21 located in the cutting area on the two silicon ingot workbenches 22 are arranged at intervals in a straight line in sequence, but this is not limiting. In other exemplary embodiments, the silicon ingot workbench 22 can also be set to be one or more.

[0054] In an exemplary embodiment, please refer to Figure 2, as shown in the figure, the workbench conversion mechanism 220 is a rotating mechanism, and the rotating mechanism includes a rotating shaft 2200 and a rotation driving unit (not shown). The rotating shaft 2200 is axially connected to the silicon rod workbench 22, and the power output shaft of the rotation driving unit is axially connected to the rotating shaft 2200 for driving the rotating shaft 2200 to rotate so as to drive the silicon rod workbench 22 to rotate. In this embodiment, the rotating shaft 2200 is disposed in the central area at the bottom of the silicon rod workbench 22 and connected to the machine base 20. The silicon rod bearing platforms 21 located in the cutting area and the silicon rod bearing platforms 21 located in the loading and unloading area are centrosymmetric with respect to the rotating shaft 2200. Thus, by driving the rotation of the silicon rod workbench 22, the silicon rod bearing platforms 21 on the silicon rod workbench 22 can be switched between the cutting area and the loading and unloading area. It should be noted that in the embodiment where the workbench conversion mechanism 220 is set as a rotating mechanism, loading and unloading are performed on one side of the silicon rod squaring equipment. In actual operation, to convert the silicon rod between the cutting area and the loading and unloading area, first, the rotation driving unit (such as a common driving motor) drives the rotating shaft 2200 to drive the silicon rod workbench 22 to rotate (such as rotating 180°), so that the silicon rod bearing platform 21 originally located in the cutting area rotates to the loading and unloading area for unloading and loading new materials, and the silicon rod bearing platform 21 originally located in the loading and unloading area is converted to the cutting area for cutting. In this way, the silicon rod squaring equipment of the present application can perform cutting work and loading and unloading work simultaneously, improving work efficiency. In other embodiments, other methods can also be adopted for the rotating mechanism that drives the silicon rod workbench to rotate. For example, the rotating mechanism can also adopt a gear transmission method. Specifically, a transmission wheel is disposed at the bottom of the silicon rod workbench, and a driving wheel meshing with the transmission wheel is disposed on the machine base 20. The driving wheel is controlled by a rotation driving motor, and the driving motor drives the driving wheel to rotate to drive the driven wheel to rotate, so that the silicon rod workbench 22 follows the driven wheel to rotate to drive the silicon rod bearing platform 21 to be switched between the loading and unloading area and the cutting area.

[0055] In another exemplary embodiment, please refer to Figure 3a and Figure 3b , Figure 3a which shows a schematic diagram of a state where the workbench conversion mechanism of the silicon rod squaring equipment of the present application is a translation mechanism in an embodiment; Figure 3b which shows another schematic diagram of a state where the workbench conversion mechanism of the silicon rod squaring equipment of the present application is a translation mechanism in an embodiment. As shown in the figure, the workbench conversion mechanism 220 is a translation mechanism, and the translation mechanism includes a translation guide rail 2201, a slider 2202, and a translation driving unit (not shown). The translation guide rail 2201 is laid on the machine base 20. The slider 2202 is disposed at the bottom of the silicon rod workbench 22 and is adapted to the translation guide rail 2201 to provide translation guidance for the silicon rod workbench 22. The translation driving unit is used to drive the silicon rod workbench 22 to move along the translation guide rail 2201 (as shown inFigure 3a and Figure 3b The arrow direction in) so that the silicon rod carrier table 21 on the silicon rod workbench 22 switches between the cutting area and the loading and unloading area. The translation drive unit uses a cylinder assembly or a screw rod assembly driven by a motor. It should be noted that in the embodiment where the workbench conversion mechanism 220 is a translation mechanism, loading and unloading are performed on both sides of the silicon rod squaring equipment. In actual operation, while the silicon rod carried by the silicon rod carrier table 21 in the cutting area on the silicon rod workbench is being cut, after the silicon rod carrier table 21 in the loading and unloading area on one side has loaded the silicon rod to be cut (in the state shown in Figure 3a ) the translation drive unit drives the silicon rod workbench 22 to advance along the slide rail in the X direction (in the arrow direction shown in Figure 3a ) so that the silicon rod carrier table 21 carrying the cut silicon rod in the cutting area is translated to the other side loading and unloading area for unloading and loading the silicon rod to be cut, and at the same time, the silicon rod carrier table 21 carrying the silicon rod to be cut in the loading and unloading area on one side is translated to the cutting area for cutting the silicon rod to be cut (in the state shown in Figure 3b ), and then the translation drive unit drives the silicon rod workbench 22 to retreat along the slide rail (in the arrow direction shown in Figure 3b ) so that the silicon rod carrier table 21 loaded with the silicon rod to be cut on the other side returns to the cutting area for cutting operations, and at the same time, the silicon rod carrier table 21 that has completed the cutting operation in the cutting area returns to the loading and unloading area on one side to continue unloading and loading the silicon rod to be cut (in the position shown as 3a in the figure), and so on, enabling the silicon rod squaring equipment of the present application to perform cutting work and loading and unloading work simultaneously, significantly improving work efficiency. In other embodiments, the translation mechanism can also adopt a gear transmission method. Specifically, the translation mechanism includes a translation tooth rail and a rotating gear driven by a motor and adapted to the translation tooth rail. The translation tooth rail is provided at the bottom of the silicon rod workbench and can be, for example, at least one rack with a certain length. In order to enable the silicon rod workbench to move smoothly, each rack is equipped with at least two spaced rotating gears, and the motor drives the rotating gears to rotate to drive the silicon rod workbench to move so that the silicon rod carrier table on the silicon rod workbench switches between the cutting area and the loading and unloading area.

[0056] It should be added that, for the convenience of loading and unloading the silicon rod, the silicon rod squaring equipment of the present application further includes a silicon rod loading and unloading device. The silicon rod loading and unloading device is adjacent to the silicon rod bearing table. Further, the silicon rod loading and unloading device is arranged on one side or opposite sides of the silicon rod workbench, and is used to load the silicon rod to be cut located in the storage area onto the silicon rod bearing table located in the loading area on the silicon rod workbench so that the silicon rod workbench can send the silicon rod to be cut to the cutting area for cutting, and to transfer the cut silicon rod transferred by the silicon rod workbench from the cutting area to the loading and unloading area to the storage area to unload the cut silicon rod. In one embodiment, the silicon rod loading and unloading device is arranged on one side of the silicon rod workbench. At this time, the workbench conversion mechanism of the silicon rod workbench is the rotating mechanism as described above, and the silicon rod is loaded and unloaded on one side of the silicon rod workbench. In another embodiment, the silicon rod loading and unloading device is arranged on both sides of the silicon rod workbench. At this time, the workbench conversion mechanism of the silicon rod workbench is the translation mechanism as described above, and the silicon rod is loaded and unloaded on both sides of the silicon rod workbench. It is easy to understand that the storage area is an area adjacent to the silicon rod squaring equipment and used for placing or storing the silicon rod to be cut and the cut silicon rod.

[0057] Please refer to Figures 4 to 6 , Figure 4 which shows a schematic structural diagram of the silicon rod loading and unloading device in an embodiment of the silicon rod squaring equipment of the present application; Figure 5 shown as Figure 4 the top view of Figure 6 which shows a cross-sectional view of the first clamp of the silicon rod loading and unloading device in an embodiment of the silicon rod squaring equipment of the present application. As shown in the figure, the silicon rod unloading device 23 is arranged on a bottom mounting structure, and the bottom mounting structure protrudes from the machine base. The silicon rod unloading device 23 includes a reversing carrier 230, a first clamp, and a second clamp. The reversing carrier 230 is used for reversing movement. The first clamp and the second clamp are arranged on the reversing carrier 230. By driving the reversing carrier to perform reversing movement, the first clamp and the second clamp arranged on the reversing carrier 230 can be switched between the storage area and the loading and unloading area to transfer and clamp the cut silicon rod and the silicon rod to be cut.

[0058] The reversing carrier 230 is arranged on the bottom mounting structure and can perform reversing movement relative to the bottom mounting structure. In one embodiment, the reversing carrier 230 realizes reversing movement through a reversing mechanism. The reversing mechanism may include a rotating shaft and a reversing motor, and the reversing carrier 230 is connected to the bottom mounting structure thereunder through the rotating shaft. When implementing the steering movement, the reversing motor is started to drive the rotating shaft to rotate to drive the reversing carrier 230 to rotate to realize the reversing movement. The aforementioned driving rotating shaft rotation can be designed as unidirectional rotation or bidirectional rotation. The unidirectional rotation can be, for example, clockwise rotation or counterclockwise rotation, and the bidirectional rotation can be, for example, clockwise rotation and counterclockwise rotation. In addition, the angle of rotation of the driving rotating shaft can be set according to the actual structure of the silicon rod loading and unloading device 23, wherein the actual structure of the silicon rod loading and unloading device can be, for example, the angle of rotation of the driving rotating shaft can be set according to the positional relationship between the storage area and the loading and unloading area or the structure of the reversing carrier 230. The center of the reversing base within the reversing carrier 230 is connected to the rotating shaft. Generally, the reversing base is a circular disk, but this is not limiting. A square or oval disk is also possible. The first clamp is located in the first clamping area of the reversing carrier 230 and is used to hold the silicon ingot to be cut. The second clamp is located in the second clamping area of the reversing carrier 230 and is used to hold the cut silicon ingot. In an embodiment, the first fixture area and the second fixture area can be set according to the actual device structure. For example, the first fixture area and the second fixture area are two back-to-back locations in the reversing carrier 230. Furthermore, the first fixture area and the second fixture area can differ by 180°, so that the storage area and the loading and unloading area are connected in a straight line (of course, it can also be understood this way: the storage area and the loading and unloading area are connected in a straight line and are respectively located on opposite sides of the reversing carrier 230. Therefore, the first fixture area for setting the first fixture and the second fixture area for setting the second fixture in the reversing carrier 230 can differ by 180°). In this way, after the reversing carrier 230 is rotated 180°, the first fixture and the second fixture can be interchanged. However, in actual applications, the setting relationship between the first fixture area and the second fixture area or the loading and unloading stations and the operation stations does not need to be so demanding. The first fixture area and the second fixture area can also be, for example, 90° apart. Even, the first fixture area and the second fixture area can be at any position within a suitable range, as long as it is ensured that no unnecessary interference will occur between the first fixture area and the second fixture area.

[0059] The first clamp further includes a first clamp mounting member 231 and at least two first clamping members 232. The at least two first clamping members 232 are spaced apart relative to the first clamp mounting member 231 and are used to clamp the silicon ingot to be cut. In one embodiment, the silicon ingot to be cut on the silicon ingot support platform is positioned vertically. Therefore, the at least two first clamping members 232 are spaced apart vertically relative to the first clamp mounting member 231, i.e., the at least two first clamping members 232 are arranged one above the other.

[0060] In a specific implementation manner, any one of the first clamping members 232 further includes: a first clamp arm mounting base 2320 and at least two first clamp arms 2321. Among them, the first clamp arm mounting base 2320 is provided on the first fixture mounting member 231, and at least two first clamp arms 2321 are movably provided on the first clamp arm mounting base 2320. Given that the cross-section of the silicon rod to be cut is circular, in an optional embodiment, the first clamping member 232 is generally a circular workpiece fixture, and the two first clamp arms 2321 constituting the first clamping member 232 are symmetrically designed. A single first clamp arm 2321 is designed to have an arc-shaped clamping surface. Preferably, the arc-shaped clamping surface of a single first clamp arm 2321 exceeds a quarter of the arc. In this way, the arc-shaped clamping surface of the first clamping member 232 composed of the two first clamp arms 2321 exceeds a half of the arc. Of course, a buffer pad can be additionally provided on the arc-shaped clamping surface in the first clamp arm 2321 to avoid damaging the surface of the silicon rod to be cut during the process of clamping the silicon rod to be cut, achieving a good effect of protecting the silicon rod to be cut. Generally, when the first clamp arms 2321 in the first clamping member 232 are in the clamping state, the center of the clamping space formed by the two first clamp arms 2321 coincides with the center of the silicon rod to be cut. Therefore, when using the first clamping member 232 to clamp the silicon rod to be cut standing in the placement area, the two first clamp arms 2321 in the first clamping member 232 contract, and the arc-shaped clamping surfaces in the first clamp arms 2321 abut against the silicon rod to be cut. During the process of the first clamp arms 2321 contracting and clamping the silicon rod to be cut, the silicon rod to be cut is pushed by the two first clamp arms 2321 on both sides and moves towards the central area of the clamping space until the silicon rod to be cut is clamped by the two first clamp arms 2321 in the first clamping member 232. At this time, the center of the silicon rod to be cut can be located at the center of the clamping space of the first clamping member 232.

[0061] To enable the at least two first clamp arms 2321 in the first clamping member 232 to smoothly and firmly clamp single-wafer silicon rods of different size specifications, the first clamping member 232 further includes a first clamp arm driving mechanism for driving the at least two first clamp arms 134 to perform opening and closing actions.

[0062] Please refer to Figure 6, as shown in the figure, in a specific implementation, the first clamping arm driving mechanism further includes: a first opening and closing gear 2322, a first gear driving member 2323, and a first driving source 2324. The first opening and closing gear 2322 is provided on the corresponding first clamping arm 2321. The first gear driving member 2323 has tooth patterns meshing with the first opening and closing gear 2322 on the first clamping arm 2321. The first driving source 2324 is connected to the first gear driving member 2323 and is used to drive the first gear driving member 2323 to move. In one implementation, the first gear driving member 2323 is a first rack, which is located in the middle of the two first clamping arms 2321. On the two outer side surfaces of the first rack facing the two first clamping arms 2321 on both sides, there are respectively tooth patterns corresponding to meshing with the first opening and closing gears 2322 on the two first clamping arms 2321. The first driving source 2324 can be, for example, a driving motor or a cylinder. Thus, according to the above implementation, in practical applications, when it is necessary to realize the clamping of the first clamping arm 2321, the driving motor or cylinder as the first driving source 2324 drives the first rack as the first gear driving member 2323 to move upward. The first rack drives the two meshing first opening and closing gears 2322 to perform an outward rotation action. During the outward rotation process, the first opening and closing gear 2322 drives the first clamping arm 2321 (the first opening and closing gear 2322 and the first clamping arm 2321 can be connected by a rotating shaft) to perform a lowering action to change from the loosening state to the clamping state; conversely, when it is necessary to realize the loosening of the first clamping arm 2321, the driving motor (or cylinder) as the first driving source 2324 drives the first rack as the first gear driving member 2323 to move downward. The first rack drives the two meshing first opening and closing gears 2322 to perform an inward rotation action. During the inward rotation process, the first opening and closing gear 2322 drives the first clamping arm 2321 (the first opening and closing gear 2322 and the first clamping arm 2321 can be connected by a rotating shaft) to perform a lifting action to change from the clamping state to the loosening state. Of course, the above is only one embodiment and is not used to limit the working state of the first clamping member 232. In fact, the above-mentioned state changes of "upward", "outward rotation", "lowering", "downward", "inward rotation", "lifting", as well as "loosening" and "clamping" can have other changes according to the structure and operation mode of the first clamping arm 2321 and the structure of the first clamping arm driving mechanism.

[0063] As is well known to those skilled in the art, the silicon rods to be cut are formed by truncating the original long silicon rods, which will inevitably result in significant differences in the sizes of the silicon rods to be cut. Since the first fixture is used to clamp the silicon rods to be cut in a vertically placed state, for the first fixture, the influence of the above-mentioned size differences is mainly manifested as the concern about whether the first clamping member 232 in the first fixture can correspondingly clamp the silicon rods to be cut due to the length differences of the silicon rods to be cut.

[0064] To reduce or even eliminate the risk that the above-mentioned first clamping member 232 may fail to clamp the silicon rod to be cut, different design solutions for the first fixture are available.

[0065] In one implementation, the first fixture uses a fixed clamping member. That is, as many first clamping members 232 as possible are fixedly arranged vertically on the commutation carrier 230, and the distance between two adjacent first clamping members 232 among these first clamping members 232 is as small as possible. In this way, various lengths of silicon rods to be cut can be covered by these first clamping members. For example, if the length of the silicon rod to be cut is long, more first clamping members 232 on the commutation carrier 230 are used for clamping; if the length of the silicon rod to be cut is short, fewer first clamping members 232 on the commutation carrier 230 are used for clamping. For example, several first clamping members 232 located below are used for clamping, and those first clamping members 232 located above and higher than the silicon rod to be cut do not participate.

[0066] In other implementations, the first fixture uses a movable clamping member. That is, the first clamping member 232 is arranged vertically and movably in the first fixture area of the commutation carrier 230. Since the first clamping member is of a movable design, the number of first clamping members 232 can be greatly reduced, and generally two or three are sufficient. In this way, various lengths of silicon rods to be cut can be covered by the movable clamping member. For example, if the length of the silicon rod to be cut is long, the movably arranged first clamping member 232 is moved to extend the clamping distance between the two first clamping members 232; if the length of the silicon rod to be cut is short, the movably arranged first clamping member 232 is moved to shorten the clamping distance between the two first clamping members 232. In the implementation where the first fixture uses a movable clamping member, to facilitate the smooth and stable up-and-down movement of the movable clamping member to adjust the position, the first fixture mounting member 231 in the first fixture can be used to guide the movably arranged first clamping member 232. In one achievable way, the first fixture mounting member 231 can adopt a guide post structure, and the first clamping arm mounting seat 2320 adopts a movable block structure sleeved on the guide post structure. Specifically, the guide post structure serving as the first fixture mounting member 231 includes two parallel guide posts arranged vertically. In the movable block structure serving as the first clamping arm mounting seat 2320, there are two through holes or two clamping clips corresponding to the two guide posts in the guide post structure. If through holes are adopted, the movable block is sleeved on the guide post and can slide along the guide post. If clamping clips are adopted, the movable block clamps on the guide post and can slide along the guide post. Among them, in practical applications, the clamping clip can clamp at least half of the guide post.

[0067] To achieve the movement of the first clamping member 232, the first clamping member 232 with a movable design may be provided with a first guiding and driving mechanism. The first guiding and driving mechanism can be used to drive the first clamping member 232 with a movable design to move up and down along the first fixture mounting member 231. In one implementation, the first guiding and driving mechanism may include, for example: a first guiding screw 2325 and a first guiding motor 2326. Among them, the first guiding screw 2325 is erected, one end of the first guiding screw 2325 is connected to the first clamping arm mounting seat 2320, and the other end of the first guiding screw 2325 is connected to the first guiding motor 2326. The first guiding motor 2326 can be arranged on the top of the reversing carrier 230, but it is not limited thereto.

[0068] In another alternative embodiment, both of the first clamping members 232 have a movable design. In this way, in practical applications, the clamping distance between them can be adjusted by the movement of the two first clamping members 232 with a movable design. Since the first clamping member 232 has a movable design, at least one of the two first clamping members 232 needs to be provided with a first guiding and driving mechanism for driving the two first clamping members 232 to move along the first fixture mounting member 231. Compared with the previous alternative embodiment, in this alternative embodiment, since both of the first clamping members 232 in the first fixture have a movable design, there will be a situation of whether to provide the first guiding and driving mechanism on one of the two first clamping members 232 or on both of the two first clamping members 232.

[0069] Taking the example that the first guiding drive mechanism is provided in the upper first clamping member 232 among the two first clamping members 232, in this case, on the one hand, the first clamping arm mounting seat 2320 in any of the two first clamping members 232 is movably connected to the first fixture mounting member 231. That is, the first clamping arm mounting seat 2320 and the first clamping arm 2321 thereon in any one of the first clamping members 232 move up and down along the first fixture mounting member 231. On the other hand, the provided first guiding drive mechanism includes a first guiding screw rod 2325 and a first guiding motor 2326. Among them, one end of the first guiding screw rod 2325 is connected to the first clamping arm mounting seat 2320 in the upper first clamping member 232, and the other end of the first guiding screw rod 2325 is connected to the first guiding motor 2326. The first guiding motor 2326 can be arranged on the top of the reversing carrier 230. Thus, when it is necessary to adjust the position of the upper first clamping member 232, the first guiding motor 2326 drives the first guiding screw rod 2325 to rotate. During the rotation of the first guiding screw rod 2325, it drives the first clamping member 232 to move up and down along the first fixture mounting member 231. For example, when the first guiding motor 2326 drives the first guiding screw rod 2325 to rotate clockwise, it drives the upper first clamping member 232 to move upward along the first fixture mounting member 231 to move away from the lower first clamping member 232, increasing the clamping distance between the two first clamping members 232; when the first guiding motor 2326 drives the first guiding screw rod 2325 to rotate reversely, it drives the upper first clamping member 232 to move downward along the first fixture mounting member 231 to approach the lower first clamping member 232, reducing the clamping distance between the two first clamping members 232. Thus, by controlling the movably designed first clamping member 232, the clamping distance between the two first clamping members 232 can be adjusted, so as to effectively clamp the silicon rods 101 to be cut with different specifications and lengths.

[0070] Actually, when both of the two first clamping members 232 are designed to be movable, the first guiding and driving mechanism can not only adjust the clamping distance between the two first clamping members 232 to effectively clamp the silicon rod 101 to be cut with different specifications and lengths, but also lift the clamped silicon rod 101 to be cut. After the two first clamping members 232 effectively clamp the silicon rod 101 to be cut, the silicon rod 101 to be cut is lifted or lowered by driving the up and down movement of the first clamping member 232. Specifically, still taking the first guiding and driving mechanism provided on the upper first clamping member 232 as an example, first, the upper first clamping member 232 moves up and down along the first fixture mounting member 231 through the first guiding and driving mechanism to adjust the clamping distance between it and the lower first clamping member 232; then, the first clamping arm driving mechanism in each first clamping member 232 is used to drive the corresponding two first clamping arms 2321 to perform a clamping action to smoothly and firmly clamp the silicon rod 101 to be cut; subsequently, the upper first clamping member 232 is driven by the first guiding and driving mechanism to move upward along the first fixture mounting member 231. At this time, due to the frictional force, the clamped silicon rod 101 to be cut and the lower first clamping member 232 move upward together. Among them, the upward movement of the clamped silicon rod 101 to be cut utilizes the frictional force between the upper first clamping member 232 and the silicon rod 101 to be cut, and the upward movement of the first clamping member 232 utilizes the frictional force between the silicon rod 101 to be cut and the lower first clamping member 232, so as to achieve the effect of lifting the silicon rod 101 to be cut. The process of the upper first clamping member 232 driving the silicon rod 101 to be cut and the lower first clamping member 232 to move downward under the drive of the first guiding and driving mechanism is the same, so as to achieve the effect of lowering the silicon rod 101 to be cut, which will not be elaborated here.

[0071] It should be noted that in other variants, for example, the first guiding and driving mechanism is provided on the lower first clamping member 232 among the two first clamping members 232. The structure, setting method and driving working mode of the first guiding and driving mechanism are similar to those of the first guiding and driving mechanism of the upper first clamping member 232 described above. For example, the lower first clamping member 232 moves up and down along the first fixture mounting member 231 under the drive of the first guiding and driving mechanism to adjust the clamping distance between it and the upper first clamping member 232, and the lower first clamping member 232 drives the silicon rod 101 to be cut and the upper first clamping member 232 to move up and down along the first fixture mounting member 231 under the drive of the first guiding and driving mechanism and other methods. Another example is that both of the two first clamping members 232 are provided with the first guiding and driving mechanism. Needless to say, the setting method and driving working mode of the first guiding and driving mechanism and the movement mode of the two first clamping members 232 will not be elaborated here.

[0072] In the case where the first clamping member 232 for the movable setting moves up and down along the first fixture mounting member 231 to adapt to clamping silicon rods to be cut with different specified lengths, in addition to the first clamping member 232 adopting a movable structural design and the first clamping member 232 needing to be provided with a first guiding and driving mechanism, etc., it is also necessary to know the specified length of the silicon rod to be cut that needs to be clamped currently. In view of this, the workpiece transfer device in the present application may further include a height detector (not shown in the drawings), which is used for the height of the silicon rod to be cut placed upright, so as to serve as the basis for the first clamping member 232 for the movable setting to move up or down along the first fixture mounting member 231 and the moving distance in the subsequent process.

[0073] Since the second fixture is arranged in the second fixture area and is used to clamp the cut silicon rods, the cross-section of the cut silicon rods in the present application is rectangular, so the structure of the second fixture is the same as the above-mentioned first fixture structure, including a second fixture mounting member 233 and at least two second clamping members 234. Any one of the second clamping members 234 further includes: a second clamping arm mounting seat 2340 and at least two second clamping arms 2341. Among them, the second clamping arm mounting seat 2340 is arranged on the second fixture mounting member 233, and at least two second clamping arms 2341 are movably arranged on the second clamping arm mounting seat 2340. The difference is only that the second clamping member of the second fixture is an overall square workpiece fixture. Specifically, the second clamping arms 2341 constituting the second clamping member 234 are two symmetrically designed ones, and a single second clamping arm 2341 is designed to have a single flat clamping surface (see Figure 4 and Figure 5 ), and the other structures of the second fixture will not be described in detail here.

[0074] Please refer to Figure 2 , as shown in the figure, the wire cutting device is arranged above the at least two silicon rod bearing platforms 21 and is used for cutting the silicon rods to be cut. In one embodiment, the wire cutting device includes a wire cutting support 241 and a wire cutting unit 25 arranged on the wire cutting support 241. The wire cutting unit 25 is supported by the wire cutting support 241 above the at least two silicon rod bearing platforms 21.

[0075] In one embodiment, the wire cutting support 241 is arranged astride two opposite support columns 240 fixed on the machine base 20. The wire cutting support 241 is used to place the wire cutting unit 25 and is driven to rise and fall by the first driving mechanism to perform cutting operations. In order to provide directional guidance for the wire cutting unit 25 to rise and fall, lifting guide rails 242 are provided on opposite sides of the two support columns. The wire cutting support 241 is provided with a slider (not marked in the figure) that matches the lifting guide rail 242. The first driving mechanism drives the wire cutting support 241 to drive the wire cutting unit 25 to rise and fall along the lifting guide rail 242 to perform cutting operations on the silicon rods to be cut.

[0076] In one embodiment, the first driving mechanism is configured as a cylinder assembly or a screw assembly. Figure 7 , which shows a schematic diagram of the first drive structure of the silicon ingot squaring device of the present application in one embodiment. As shown in the figure, the first drive mechanism is configured as a screw assembly, which includes a screw 243 and a motor 244. One end of the screw 243 is connected to the wire cutting support 241, and the other end is connected to the motor 244. The screw 243 is driven by the motor 244 to raise and lower the wire cutting support 241. However, this is not limited to this. In other embodiments, the first drive mechanism may also be a cylinder assembly.

[0077] See also Figure 2 As shown in the figure, the wire cutting unit 25 includes a plurality of cutting wheel groups 251 corresponding to the number of silicon rod supporting platforms 21. Each cutting wheel group 251 includes a pair of cutting wheels or two pairs of cutting wheels. A cutting line segment is formed between the two cutting wheels in any pair of cutting wheels. A transition wheel 252 is provided between two adjacent cutting wheel groups 251. The line grooves of the transition wheel 252 are in the same plane as the line grooves of the cutting wheels in the cutting wheel group 251. In order to be able to simultaneously perform cutting operations on multiple silicon rods to be cut, in this embodiment, the number of the plurality of cutting wheel groups 251 is the same as the number of silicon rod supporting platforms 21 located in the cutting area and they correspond one-to-one to each other. In this way, during the cutting operation, each cutting wheel group 251 cuts the silicon rod to be cut on its corresponding silicon rod supporting platform 21.

[0078] In view of the complex spatial layout of the cutting wheel of the existing wire cutting device, a large number of transition wheels are required to reverse the cutting line, which makes the winding complicated, the open device occupies a large space, and the manufacturing cost is high. Therefore, in one embodiment, Figure 2 As shown, the plurality of cutting wheel assemblies 251 are disposed on the wire cutting support 241 in a straight line distribution manner.

[0079] In one case, each cutting wheel set includes a pair of cutting wheels. The pair of cutting wheels in each cutting wheel set are sequentially arranged on the same side of the wire cutting support. Only one transition wheel is provided between the pair of cutting wheels in two adjacent cutting wheel sets to guide the cutting wire, so that a cutting wire segment is formed between the two cutting wheels in each pair of cutting wheels. The wire groove of the transition wheel and the wire grooves of the cutting wheels in its adjacent cutting wheel set are in the same plane, so that the cutting wire segments between the two cutting wheels of each cutting wheel set are on the same straight line. Preferably, the length of each formed cutting wire segment is slightly greater than the diameter of the cross-sectional circle of the silicon rod to be cut.

[0080] Please refer to Figure 8 , which shows a schematic structural diagram of each cutting wheel set having a pair of cutting wheels in the wire cutting device of the silicon rod squaring device of the present application in an embodiment. Taking the wire cutting unit in the figure including four cutting wheel sets as an example for wire winding description, the four cutting wheel sets are the first cutting wheel set 251a, the second cutting wheel set 251b, the third cutting wheel set 251c and the fourth cutting wheel set 251d respectively. A first transition wheel 252a is provided between the first cutting wheel set 251a and the second cutting wheel set 251b, a second transition wheel 252b is provided between the second cutting wheel set 251b and the third cutting wheel set 251c, and a third transition wheel 252c is provided between the third cutting wheel set 251c and the fourth cutting wheel set 251d. A single continuous cutting wire is sequentially wound around the pair of cutting wheels of the first cutting wheel set 251a, so that a first cutting wire segment L10 is formed on the pair of cutting wheels of the first cutting wheel set 251a. Then, after guiding the cutting wire through the first transition wheel 252a, it is sequentially wound around the pair of cutting wheels of the second cutting wheel set 251b, and a second cutting wire segment L20 is formed on the pair of cutting wheels of the second cutting wheel set 251b. Then, after guiding the cutting wire through the second transition wheel 252b, it is sequentially wound around the pair of cutting wheels of the third cutting wheel set 251c, and a third cutting wire segment L30 is formed on the pair of cutting wheels of the third cutting wheel set 251c. Finally, after guiding the cutting wire through the third transition wheel 252c, it is sequentially wound around the pair of cutting wheels of the fourth cutting wheel set 251d and then exits after forming a fourth cutting wire segment L40. In this case, when the wire cutting unit makes a single downward pressure cut, it can simultaneously complete the cutting of one axial section of four silicon rods to be cut. In the process of completing a single squaring operation, four axial section cutting processes need to be executed. After each axial section is cut, the silicon rod carrier 21 needs to be rotated (90 degrees each time) through the rotating mechanism 210 of the silicon rod carrier 21 to adjust the surface to be cut of the silicon rod to be cut. It should be noted that in order to ensure that the squared silicon rod is in a cuboid shape as a whole, the intersection points of the cutting wires when the wire cutting unit cuts the silicon rod for four single axial sections are located within the cross-sectional circle of the silicon rod to be cut (including the case where the intersection points are on the circumference of the cross-sectional circle).

[0081] In another case, each cutting wheel set includes two pairs of cutting wheels. The two pairs of cutting wheels in each cutting wheel set are sequentially arranged on the opposite sides of the wire cutting support. A guide wheel set is also arranged on the wire cutting support to reverse the cutting wire so as to guide the cutting wire from the cutting wheel on one side of the wire cutting support to the cutting wheel on the other side of the wire cutting support. A transition wheel set is arranged between two adjacent cutting wheel sets to guide the cutting wire. The transition wheel set includes two transition wheels. One transition wheel guides a pair of cutting wheels in two adjacent cutting wheel sets, and the other transition wheel guides the other pair of cutting wheels in two adjacent cutting wheel sets, so that a cutting wire segment is formed between the two cutting wheels in any pair of cutting wheels. The wire grooves of the transition wheels on the same side are in the same plane as the wire grooves of the cutting wheels, so that the cutting wire segments between the two cutting wheels on the same side in multiple cutting wheel sets are on the same straight line. Preferably, the length of each formed cutting wire segment is slightly greater than the diameter of the cross-sectional circle of the silicon rod to be cut.

[0082] Please refer to Figures 9 to 11 , Figure 9 which shows a schematic structural view of each cutting wheel set having two pairs of cutting wheels in the wire cutting device of the silicon rod squaring device of the present application in an embodiment; Figure 10 shown as Figure 9 the side structural schematic view of Figure 11Shown is a schematic diagram of wire winding of a guide wheel in the wire cutting device of the silicon rod squaring equipment of the present application when each cutting wheel group has two pairs of cutting wheels. Taking the wire cutting device in the figure including four cutting wheel groups as an example for wire winding description, the four cutting wheel groups are respectively the first cutting wheel group 251a, the second cutting wheel group 251b, the third cutting wheel group 251c and the fourth cutting wheel group 251d. A first transition wheel group is provided between the first cutting wheel group 251a and the second cutting wheel group 251b, a second transition wheel group is provided between the second cutting wheel group 251b and the third cutting wheel group 251c, and a third transition wheel group is provided between the third cutting wheel group 251c and the fourth cutting wheel group 251d. Given that the cutting wire is a single continuous cutting wire, a guide wheel group 253 is also provided between the two sides of the wire cutting support to reverse the cutting wire so as to guide the cutting wire from the cutting wheel on one side of the wire cutting support 241 to the cutting wheel on the other side of the wire cutting support 241.The cutting wire winds around from one side of the wire cutting support, and sequentially winds around a pair of cutting wheels 251a' of the first cutting wheel set 251a, thereby forming a first cutting line segment L11 on the pair of cutting wheels 251a' of the first cutting wheel set 251a. Then, after being guided by a transition wheel 252a' in the first transition wheel set, it sequentially winds around a pair of cutting wheels 251b' of the second cutting wheel set 251b, forming a second cutting line segment L21 on the pair of cutting wheels 251b' of the second cutting wheel set 251b. Then, after being guided by a transition wheel 252b' in the second transition wheel set, it sequentially winds around a pair of cutting wheels 251c' of the third cutting wheel set 251c, forming a third cutting line segment L31 on the pair of cutting wheels 251c' of the third cutting wheel set 251c. Finally, after being guided by a transition wheel 252c' in the third transition wheel set, it sequentially winds around a pair of cutting wheels 251d' of the fourth cutting wheel set 251d to form a fourth cutting line segment L41. Then, the cutting wire sequentially passes through the guide wheels 253a, 253b, and 253c in the guide wheel set 253 to guide the cutting wire from a pair of cutting wheels 251d' of the fourth cutting wheel set 251d on one side of the wire cutting support 241 to another pair of cutting wheels 251d" in the fourth cutting wheel set 251d on the other side of the wire cutting support 241. After forming a fifth cutting line segment L42 on another pair of cutting wheels 251d" in the fourth cutting wheel set 251d, it is then guided by another transition wheel 252c" in the third transition wheel set and sequentially winds around another pair of cutting wheels 251c" in the third cutting wheel set 251c, forming a sixth cutting line segment L32 on the other pair of cutting wheels 251c" of the third cutting wheel set 251c. After being guided by another transition wheel 252b" in the second transition wheel set, it sequentially winds around another pair of cutting wheels 251b" in the second cutting wheel set 251b, forming a seventh cutting line segment L22 on the other pair of cutting wheels 251b" of the second cutting wheel set 251b. Then, after being guided by another transition wheel 252a" in the first transition wheel set, it sequentially winds around another pair of cutting wheels 251a" in the first cutting wheel set 251a, forming an eighth cutting line segment L12 and then exiting. Among them, the first cutting line segment L11 and the eighth cutting line segment L12 are two cutting line segments of the first cutting wheel set, the second cutting line segment L21 and the seventh cutting line segment L22 are two cutting line segments of the second cutting wheel set, the third cutting line segment L31 and the sixth cutting line segment L32 are two cutting line segments of the third cutting wheel set, and the fourth cutting line segment L41 and the fifth cutting line segment L42 are two cutting line segments of the fourth cutting wheel set. The two cutting line segments of each cutting wheel set are used to cut two parallel axial sections of the silicon rod to be cut.In this case, the wire cutting unit performs a downward pressing cut once, and can simultaneously complete the cutting of two parallel-axis cut surfaces of four silicon rods to be cut. In completing one squaring operation, two processes of two parallel-axis cut surfaces need to be executed. After completing the cutting of two parallel-axis cut surfaces once, the silicon rod carrier is rotated (rotated 90 degrees) through the rotating mechanism of the silicon rod carrier to adjust the cut surface to be cut of the silicon rod to be cut. It should be noted that in order to ensure that the silicon rod after squaring is in the shape of a cuboid as a whole, the horizontal distance between the wire grooves of the two pairs of cutting wheel sets of the cutting wheel group is less than or equal to the side length of the inscribed square of the cross-sectional circle of the silicon rod to be cut, so as to ensure that the intersection point of the cutting lines when the wire cutting unit performs two horizontal-axis cut surfaces on the silicon rod is located within the cross-sectional circle of the silicon rod to be cut (including the case where the intersection point is located on the circumference of the cross-sectional circle).

[0083] In one embodiment, please refer to Figure 2 , as shown in the figure, the wire cutting device further includes a wire take-up reel 255 and a wire pay-out reel 254 provided on the machine base 20, and the wire take-up reel 255 and the wire pay-out reel 254 are used for taking in and paying out the cutting wire during the squaring operation.

[0084] The above-mentioned wire cutting device can be used to perform squaring cutting on the silicon rod to be cut to form a cut silicon rod and side skins. After the wire cutting device is used for a long time, the wire grooves around which the cutting wire is wound in the cutting wheel will be worn, affecting the cutting effect. Therefore, generally, multiple wire grooves are arranged on the cutting wheel of the wire cutting device, and a groove changing operation needs to be performed to rewind the cutting wire around other wire grooves of the cutting wheel. At this time, it is necessary to adjust the moving distance of the cutting wheel according to the groove distance between other wire grooves and the current wire groove.

[0085] In view of this, the silicon rod squaring equipment further includes an automatic groove changing mechanism. Please refer to Figure 12 and Figure 13 , Figure 12 which shows a schematic structural diagram of the automatic groove changing mechanism cooperating with the wire cutting device in one embodiment of the silicon rod squaring equipment of the present application; Figure 13Shown is a schematic cross-sectional structure of an automatic groove-changing mechanism in a silicon rod squaring device according to the present application. As shown in the figure, in an embodiment, the automatic groove-changing mechanism 29 includes a cutting wheel 290, a groove-changing cylinder 292, and a positioning member 291. The cutting wheel includes a first wire groove and a second wire groove for winding a cutting wire. The groove-changing cylinder is linked with the cutting wheel 290 and is used to drive the cutting wheel 290 to move axially to move the cutting wire from one wire groove to an adjacent other wire groove. The groove-changing cylinder 292 includes a cylinder body, and a first guide rail 293 and a second guide rail 294 opened on the cylinder body and communicating with each other. The drop between the first guide rail 293 and the second guide rail 294 corresponds to the groove pitch between the first wire groove and the second wire groove. The positioning member 291 is slidably disposed in the first guide rail 293 or the second guide rail 294 and is used to slide in the first guide rail 293 or the second guide rail 294 to drive the groove-changing cylinder 292 to rotate when the groove-changing cylinder 292 moves axially, so as to force the cutting wire on the cutting wheel 290 to switch from the first wire groove to the second wire groove.

[0086] Please refer to Figure 12 、 Figure 13 and Figure 14 , Figure 14 Shown as Figure 13 a partial enlarged view of part B of, the automatic groove-changing mechanism will be described in detail below by taking the cutting wheel including two wire grooves as an example.

[0087] The cutting wheel 290 includes a first wire groove and a second wire groove (not shown) for winding a cutting wire. In an embodiment, the cutting wheel 290 includes a first wire groove and a second wire groove. Taking Figure 13 the direction of the arrow shown in as the front and the direction opposite to the arrow as the rear, the cutting wire is initially wound on the first wire groove, and the second wire groove is located behind the first wire groove and adjacent to the first wire groove.

[0088] The groove-changing cylinder 292 is linked with the cutting wheel 290 and is used to drive the cutting wheel 290 to move axially to move the cutting wire from one wire groove to an adjacent other wire groove. The groove-changing cylinder 292 includes a cylinder body and a first guide rail 293 and a second guide rail 294 opened on the cylinder body and communicating with each other. The drop between the first guide rail 293 and the second guide rail 294 corresponds to the groove pitch between the first wire groove and the second wire groove.

[0089] The positioning member 291 is slidably disposed in the first guide rail 293 or the second guide rail 294 and is used to slide in the first guide rail 293 or the second guide rail 294 to drive the groove-changing cylinder 292 to rotate when the groove-changing cylinder 292 moves axially, so as to force the cutting wire on the cutting wheel 290 to switch from the first wire groove to the second wire groove.

[0090] In one embodiment, the groove changing cylinder 292 is disposed on the wire cutting support 241 of the aforementioned cutting frame 24. A positioning shaft (not shown) is provided at the front end of the groove changing cylinder 292. The cutting wheel 290 is rotatably disposed on the positioning shaft through a bearing. When the groove changing cylinder 292 moves axially, the cutting wheel 290 can be driven to move axially to move the cutting wire from the first wire groove to the second wire groove.

[0091] In one embodiment, the groove changing cylinder 292 is driven by a driving device 295 to perform telescopic movement axially. The driving device 295 includes a cylinder assembly or a screw rod assembly driven by a motor. In this embodiment, the driving device 295 is set as a cylinder assembly. The cylinder assembly includes a cylinder and a telescopic rod driven by the cylinder to expand and contract. The rear end of the groove changing cylinder 292 is disposed on the telescopic rod through a bearing, so that the groove changing cylinder 292 can be pushed by the cylinder assembly to move axially and can also be rotated under force. However, it is not limited thereto. In other embodiments, the driving device 295 can also be a screw rod assembly driven by a motor. The rear end of the groove changing cylinder 292 is disposed on the screw rod assembly through a bearing. The motor drives the screw rod assembly to extend or retract, so that the groove changing cylinder 292 moves axially and can also be rotated under force.

[0092] In order to be able to achieve automatic groove changing, the moving distance of the cutting wheel 290 is adjusted to the groove pitch between the first wire groove and the second wire groove each time. Therefore, the drop H between the first guide rail 293 and the second guide rail 294 corresponds to the groove pitch between the first wire groove and the second wire groove. In one embodiment, the first guide rail 293 has a first landing end 2930, and the first landing end 2930 has a first distance from the first wire groove. The second guide rail 294 has a second landing end 2940, and the second landing end 2940 has a second distance from the second wire groove. The first distance is equal to the second distance. Thus, the drop H between the first guide rail 293 and the second guide rail 294 is equal to the groove pitch between the first wire groove and the second wire groove.

[0093] In order to facilitate the guiding positioning member 291 to relatively slide from the first landing end 2930 of the first guide rail 293 to the second landing end 2940 of the second guide rail 294 to achieve automatic groove changing, in the embodiment, there is a transition end 296 between the first landing end 2930 and the second landing end 2940.

[0094] In order to further facilitate the rapid sliding of the positioning member 291 from the first landing end 2930 to the transition end 296 and from the transition end 296 to the second landing end 2940, an upward section 297 is provided between the first landing end 2930 and the transition end 296 to provide an upward channel for the positioning member 291, and a downward section 298 is provided between the transition end 296 and the second landing end 2940 to provide a downward channel for the positioning member 291. In an embodiment, the upward section 297 is in a contracted state from the direction of the first landing end to the direction of the transition end, and the downward section 298 is in a contracted state from the direction of the transition end to the direction of the second landing end.

[0095] Preferably, in order to guide the positioning member 291 to slide quickly and accurately through the transition end 296, the transition end 296 has a first channel 2960 communicating with the upward section 297, the transition end 296 has a second channel 2961 communicating with the downward section 297, and the width of the first channel 2960 is smaller than that of the second channel 2961.

[0096] In order to prevent the positioning member 291 from slipping back at the transition end 296, that is, the positioning member 291 cannot smoothly slide along the first channel 2960 of the transition end 296 to the second channel 2961 of the transition end 296 and enter the downward section 298, but enters the upward section 297 from the first channel 2960 of the transition end 296 and returns to the first landing end 2930, resulting in the inability to achieve automatic groove change. In an embodiment, the vertex of the transition end 296 adjacent to the cutting wheel 290 is located in the second channel 2961, that is, it can be understood that the horizontal distance between the first channel 2961 and the cutting wheel 290 is greater than the horizontal distance between the second channel 2961 and the cutting wheel 290, so that the running state of the positioning member 291 sliding from the first channel 2960 to the second channel 2961 is an upward slope. When the groove-changing cylinder 292 moves backward along its axis, the positioning member 291 slides from the first channel 2960 to the second channel 2961 and at the same time drives the groove-changing cylinder 292 to rotate to achieve the switching of the positioning member from the first guide rail 293 to the second guide rail 294. Similarly, in order to prevent the positioning member 291 from not smoothly sliding to the upward section 297 at the first landing end 2920, the projection of the first landing end 2930 away from the vertex of the cutting wheel 290 is located within the upward section 297.

[0097] The positioning member 291 is fixedly connected to a fixed seat 299, and the fixed seat 299 is connected to a wire cutting support 241 of the wire cutting device of the multi-station cutting equipment, and is used to dispose the positioning member 291 in the first guide rail 293 or the second guide rail 294. In an embodiment, the fixed seat 299 is provided as a cover body sleeving the groove-changing cylinder 292, one end of the positioning member 299 is fixed on the cylinder wall of the groove-changing cylinder 292, and the other end extends into the first guide rail 293 or the second guide rail 294. When the groove-changing cylinder 292 is driven to move axially along it, the positioning member 291 slides in the first guide rail 293 or the second guide rail 294. However, the fixed seat 299 is not limited thereto. In other embodiments, the fixed seat 299 can also be provided as a fixed rod disposed in the groove-changing cylinder 292, one end of the positioning member 291 is connected to the outer wall of the fixed rod, and the other end extends into the first guide rail 293 or the second guide rail 294. When the groove-changing cylinder 292 is driven to move axially along it, the positioning member 291 slides in the first guide rail 293 or the second guide rail 294.

[0098] Please refer to Figures 15a to 15b , Figures 15a to 15d which shows a schematic structural diagram of the movement process of the automatic groove-changing mechanism of the silicon rod squaring equipment of the present application in an embodiment. As shown in the figure, the cutting wire is initially located in the first wire groove of the cutting wheel 290. Correspondingly, the positioning member 291 is located at the first landing end 2930 of the first guide rail 293 (shown as Figure 15a ). When the automatic groove-changing mechanism performs groove changing, first drive the groove-changing cylinder 292 to move backward along its axis ( Figure 15a the arrow direction in the figure) so that the positioning member 291 enters the upward section 297 from the first landing 2930 and moves upward to the first channel 2960 of the transition end (shown as Figure 15b ). Then, drive the groove-changing cylinder 292 to continue to move backward along its axis so that the positioning member 291 cooperates with the transition end 296 to force the groove-changing cylinder 292 to rotate ( Figure 15b the arrow direction in the figure), so that the positioning member 291 slides from the first channel 2960 of the transition end to the second channel 2961 of the transition end (shown as Figure 15c ). Finally, drive the groove-changing cylinder 292 to move forward along its axis (such as Figure 15c the arrow direction in the figure) so that the positioning member 291 enters the downward section 298 from the second channel 2961 of the transition end and slides down to the second landing end 2940 (shown as Figure 15d ). In this way, the groove-changing cylinder 292 moves forward along its axis by the distance of the groove pitch between the first wire groove and the second wire groove, so that the cutting wire is switched from the first wire groove to the second wire groove.

[0099] It should be noted that in the above embodiments, the cutting wheel includes two wire grooves, namely the first wire groove and the second wire groove, and the groove-changing cylinder is provided with two guide rails, namely the first guide rail and the second guide rail. However, the number of wire grooves included in the cutting wheel and the number of guide rails provided in the groove-changing cylinder are not limited thereto.

[0100] In other embodiments, the cutting wheel includes three wire grooves. For example, in addition to the first wire groove and the second wire groove in the above embodiments, the cutting wheel further includes a third wire groove, and the third wire groove is adjacent to the rear side of the second wire groove.

[0101] The number of guide rails provided in the groove-changing cylinder is consistent with the number of wire grooves and is set to three. For example, in addition to the first guide rail and the second guide rail in the above embodiments, the groove-changing cylinder further includes a third guide rail. The third guide rail is connected to the second guide rail, and the drop between the third guide rail and the second guide rail corresponds to the groove pitch between the second wire groove and the third wire groove. That is, the third guide rail has a third landing end, and the third landing end has a third distance from the third wire groove, and the third distance is equal to the above-mentioned second distance.

[0102] In order to facilitate the guiding positioning member to relatively slide from the second landing end of the second guide rail to the third landing end of the third guide rail to realize the switching of the cutting wire from the second wire groove to the third wire groove, in the embodiment, there is also a transition end between the second landing end and the third landing end. Similarly, there is an upward section between the second landing end and the transition end, and the upward section has a side wall with a first slope. There is a downward section between the transition end and the third landing end, and the downward section has a side wall with a second slope. In the embodiment, the upward section is in a contracted state from the direction of the second landing end to the direction of the transition end, and the downward section is in a contracted state from the direction of the transition end to the direction of the third landing end.

[0103] In order to guide the positioning member to quickly and accurately slide through the transition end, the transition end has a first channel connecting the upward section and a second channel connecting the downward section, and the width of the first channel is smaller than that of the second channel.

[0104] To prevent the positioning member from slipping back at the transition end, that is, the positioning member cannot smoothly slide along the first channel of the transition end to the second channel of the transition end and enter the downward section, but enters the upward section from the first channel of the transition end and returns to the second positioning end, so that the cutting line cannot be moved from the second wire groove to the third wire groove. In an embodiment, the vertex of the transition end adjacent to the cutting wheel is located in the second channel, that is, it can be understood that the horizontal distance between the first channel and the cutting wheel is greater than the horizontal distance between the second channel and the cutting wheel, so that the running state of the positioning member sliding from the first channel to the second channel is an upward slope. When the groove-changing cylinder moves backward along its axis, the positioning member slides from the first channel of the transition end to the second channel and at the same time drives the groove-changing cylinder to rotate to achieve the switching of the positioning member from the second guide rail to the third guide rail. Similarly, to prevent the positioning member from not smoothly sliding to the transition end at the second positioning end, the projection of the second positioning end far from the vertex of the cutting wheel is located in the first channel.

[0105] However, it is not limited to this. In actual implementation forms, the wire grooves on the cutting groove can also be 4, 5, and so on. The cutting wheel can also include multiple wire grooves, and the groove-changing cylinder can also be provided with multiple mutually connected guide rails consistent with the number of wire grooves. Of course, with the increase in the number of guide rails, the diameter of the groove-changing cylinder needs to be increased, which will not be elaborated here.

[0106] Generally, due to the large self-weight of the silicon rod to be cut, it can be stably placed vertically on the silicon rod bearing platform by its own self-weight. However, during the subsequent silicon rod cutting operation, the silicon rod to be cut will be pulled by the cutting wire in the wire cutting unit and there will be risks such as disturbance, misalignment, and even overturning. To avoid the occurrence of the above various risks, a silicon rod pressing device that can move up and down is further provided above the silicon rod bearing platform in the cutting area. The silicon rod pressing device is mounted on the lifting guide rail and is located above the wire cutting device. That is, the silicon rod pressing device and the wire cutting device share the same lifting guide rail. The silicon rod pressing device is used to press the top of the silicon rod to be cut when the wire cutting device cuts the silicon rod to be cut on the silicon rod bearing platform in the cutting area.

[0107] Please refer to Figure 16, which shows a schematic structural diagram of the silicon rod squaring device of the present application in an embodiment with a silicon rod pressing device. As shown in the figure, the silicon rod pressing device 26 includes a pressing bracket 260 and a pressing unit 261 provided on the pressing bracket and corresponding to the silicon rod bearing table 21 in the cutting area. A slider 262 cooperating with the lifting guide rail 242 is fixed on the pressing bracket 260. The pressing bracket 260 is erected on the support column 240 of the cutting machine frame 24 in a liftable manner through the cooperation of its slider 262 and the lifting guide rail 242 and is located above the wire cutting device. The pressing unit 261 is arranged on the pressing bracket 260 and can be lifted and lowered with the pressing bracket 260 to release or press the silicon rod to be cut on the silicon rod bearing table 21 in the cutting area.

[0108] Affected by the manufacturing process, the silicon rods to be cut on the silicon rod bearing table 21 in the cutting area are not completely consistent in height. The pressing unit 261 following the pressing bracket 260 to descend cannot ensure that each pressing unit 261 tightly presses the silicon rod to be cut carried by its corresponding silicon rod bearing table 21. In view of this, the pressing unit 261 includes a pressing block 2610 and a driving structure for driving the pressing block to move up and down. In one embodiment, the driving structure is set as a cylinder assembly. The cylinder assembly includes a cylinder 2611 and a telescopic member 2612 connected to the cylinder. The pressing block 2610 is arranged at the bottom of the telescopic member 2612 (that is, on the surface of the telescopic member 2612 facing the silicon rod bearing table 21 in the cutting area). The cylinder 2611 drives the telescopic member 2612 to carry the pressing block 2610 to move up and down to release or press the silicon rod to be cut on the silicon rod bearing table 21 in the cutting area.

[0109] In view of the fact that the silicon rod bearing table 21 has a rotating mechanism 210, which can drive the silicon rod to be cut on it to rotate to adjust the cutting surface. In one embodiment, in order to cooperate with the rotating mechanism 210 of the silicon rod bearing table 21, the pressing block 2610 is connected to the driving structure through a rotating shaft (not shown). Specifically, a bearing (not shown) is arranged at the bottom of the telescopic member 2612 of the cylinder assembly. The pressing block 2610 has a rotating shaft adapted to the bearing. The pressing block 2610 is rotatably installed on the bearing of the telescopic member 2612 through the rotating shaft. Thus, when the pressing block 2610 presses the silicon rod to be cut, the silicon rod bearing table 21 drives the silicon rod to be cut to rotate, and the pressing block 2610 can also rotate in cooperation with the silicon rod to be cut.

[0110] In order to better protect the silicon rod to be cut, a buffer pad (not shown) can be arranged between the pressing block 2610 and the silicon rod to be cut. The buffer pad is fixed on the pressing surface of the pressing block 2610 (this pressing surface is the lower surface of the pressing block).

[0111] In order to simplify the structure of the silicon rod squaring equipment of the present application and reduce the manufacturing cost of the equipment, in one embodiment, the silicon rod pressing device 26 is attached to the wire cutting support 241 for mounting the wire cutting unit by its own gravity and moves up and down along the lifting guide rail 242. The first driving mechanism drives the wire cutting support 241 to drive the wire cutting unit 25 to descend along the lifting guide rail 242. The silicon rod pressing device 26, attached to the wire cutting support 241, also descends along the lifting guide rail 242 to the top of the silicon rod to be cut supported by the silicon rod supporting platform 21 in the cutting area. The driving structure in the pressing unit 261 drives the pressing block 2610 to press the corresponding silicon rod to be cut, and the wire cutting support 241 continues to be driven by the first driving mechanism to descend with the wire cutting unit 25 to perform the cutting operation on the silicon rod to be cut. In order to prevent the silicon rod pressing device 26 from continuing to descend following the wire cutting support 241 and damaging the silicon rod to be cut, a guide rail locking unit 263 is provided on the pressing bracket 260 of the silicon rod pressing device 26. The guide rail locking unit 263 is used to position the silicon rod pressing device 26 at a predetermined position on the lifting guide rail 242. For example, the predetermined position is that the pressing unit 261 in the silicon rod pressing device 26 is located 0 to 5 cm above the corresponding silicon rod to be cut, but it is not limited to this. It is only necessary for the pressing unit 261 to be located above the corresponding silicon rod to be cut. When the pressing block 2610 in the pressing unit 261 is driven to descend, it can be pressed against the top surface of the corresponding silicon rod to be cut.

[0112] In one embodiment, the guide rail locking unit 263 adopts a pneumatic guide rail locking device. Specifically, the pneumatic guide rail locking device in this embodiment includes a locking clamp that cooperates with the lifting guide rail 242 and a cylinder that drives the locking clamp to move. The locking clamp is set on the clamping bracket 260 in the silicon rod clamping device 26. When the silicon rod clamping device 26 and the wire cutting support 241 are lowered to a predetermined position, the cylinder drives the locking clamp on the clamping bracket to hold the lifting guide rail 242 and position the silicon rod clamping device 26 at the predetermined position. The pressing unit 261 in the rod pressing device 26 presses its corresponding silicon rod to be cut, and the wire cutting support 241 continues to be driven to drive the wire cutting unit 25 to descend to complete the cutting of the silicon rod to be cut. After completing the cutting operation of the silicon rod to be cut, the wire cutting support 241 is driven by the first driving mechanism to drive the wire cutting unit 25 to rise to the position where the silicon rod pressing device 26 is positioned. The cylinder drives the locking clamp on the pressing bracket 260 to release the lifting guide rail 242 so that the silicon rod pressing device 26 continues to be attached to the wire cutting support 241 and rises.

[0113] In another embodiment, the silicon rod pressing device 26 is mounted on the lifting guide rail 242 and is driven by a second driving mechanism to move up and down along the lifting guide rail 242. The second driving mechanism is set as a cylinder assembly or a screw rod assembly driven by a motor. In practical applications, when the first driving mechanism drives the wire cutting support 241 to carry the wire cutting unit 25 down, and when the second driving mechanism drives the silicon rod pressing device 26 down to a predetermined position, the second driving mechanism stops driving the silicon rod pressing device 26 so that the silicon rod pressing device 26 is positioned at the predetermined position to press the silicon rod to be cut. Then, the first driving mechanism continues to drive the wire cutting support 241 to carry the wire cutting unit 25 down to complete the cutting of the silicon rod to be cut. After completing the cutting operation of the silicon rod to be cut, the first driving mechanism drives the wire cutting support 241 to carry the wire cutting unit 25 up, and the second driving mechanism drives the silicon rod pressing device 26 up.

[0114] In addition, considering the need to achieve complete cutting of the silicon rod to be cut and to avoid damage to the cutting wire due to obstruction, in one embodiment, the silicon rod bearing table is a tabletop structure with a circular cross-section or a rectangular cross-section. The size of the bearing surface in the tabletop structure that contacts the silicon rod is larger than the cross-section of the squared silicon rod formed after the silicon rod to be cut is squared. Therefore, a cutting groove for the cutting wire segment to enter is provided on the tabletop structure. Specifically, four cutting grooves for the cutting wire segment to enter are provided on the tabletop structure. In this way, when the wire cutting device follows the wire cutting support and descends, the cutting wire segment formed in the cutting device performs square cutting on the silicon rod to be cut carried by the silicon rod bearing table in the cutting area. When the cutting wire segment reaches the bottom of the silicon rod to be cut, it can continue to descend unobstructed until it penetrates the silicon rod to be cut, achieving complete cutting of the silicon rod to be cut. Of course, the structure of the silicon rod bearing table is not limited to this.

[0115] In other embodiments, the silicon rod bearing table is a tabletop structure with a rectangular cross-section. The size of the bearing surface in the tabletop structure that contacts the silicon rod is slightly smaller than the cross-section of the squared silicon rod formed after the silicon rod to be cut is squared. In this way, when the wire cutting unit in the wire cutting device follows the cutting machine frame and descends relative to the machine base, the cutting wire segment formed in the cutting unit performs square cutting on the silicon rod to be cut carried by the silicon rod bearing table in the cutting area. When the cutting wire segment reaches the bottom of the silicon rod to be cut, it can continue to descend unobstructed until it penetrates the silicon rod to be cut, achieving complete cutting of the silicon rod to be cut.

[0116] As described above, the silicon rod carrier is a tabletop structure with a rectangular cross-section. The size of the bearing surface in the tabletop structure that contacts the silicon rod is slightly smaller than the cross-section of the squared silicon rod formed after the silicon rod to be cut is squared. In this way, it can be ensured that the cutting segments in the wire cutting unit can square-cut the silicon rod to be cut carried by the silicon rod carrier in the cutting area without obstruction. However, such a design also brings a problem at the same time: after the silicon rod to be cut on the silicon rod carrier in the cutting area completes the square-cutting operation, the side skin formed after cutting may fall or overturn due to lack of corresponding support. Therefore, the silicon rod squaring device of the present application further includes a side skin supporting mechanism for supporting the side skin formed after the silicon rod to be cut is square-cut.

[0117] The side skin supporting mechanism disclosed in the present application is provided around the silicon rod carrier. After the wire cutting device makes a single cut on the silicon rod to be cut carried by the silicon rod carrier in the cutting area, side skins will be formed on the cut side surfaces. Therefore, in actual application, a side skin supporting mechanism is respectively provided at the four sides around the silicon rod carrier with a rectangular cross-section tabletop structure to support a corresponding side skin. Through the side skin supporting mechanism disclosed in the present application, the side skin formed after the wire cutting device squares the silicon rod to be cut can be supported, avoiding relative displacement between the side skin and the squared silicon rod, preventing the cutting segments in the wire cutting device from chipping when passing through the silicon rod to be cut, and avoiding situations such as the side skin falling and overturning, as well as damage to the squared silicon rod due to contact with the side skin.

[0118] In one embodiment, refer to Figure 17 , which shows a schematic structural diagram of the side skin supporting mechanism in one embodiment of the silicon rod squaring device of the present application. As shown in the figure, the side skin supporting mechanism 27 includes a supporting member. The supporting member includes a base 270 connected to one side surface of the silicon rod carrier 21 and a top supporting portion 271 extending upward from the base. In this embodiment, the base 270 is set as a flat plate structure adapted to the side surface of the silicon rod carrier 21, but it is not limited thereto. The base 270 can also be set as a curved plate structure or other special-shaped structures. The top supporting portion 271 is set as two top columns located on both sides of the base 270. The height of the extension of the top columns is the same as the height of the bearing surface of the silicon rod carrier 21. In practice, the top supporting portion 271 can also be a top plate or a top rod extending upward from the base 270. When the wire cutting device squares the silicon rod to be cut on the silicon rod carrier 21, the supporting member can support the corresponding side skin, effectively preventing the cutting segments in the wire cutting device from chipping when passing through the silicon rod to be cut, and avoiding the side skin from falling and overturning.

[0119] In another embodiment, the edge skin supporting mechanism includes a movable supporting member and a locking control member. In this embodiment, the movable supporting member includes a movable base connected to one side surface of the silicon rod bearing table, a supporting portion extending upward from the movable base, and a power generating structure for providing the up and down movement of the supporting portion. In one implementation, the movable base can be, for example, a flat plate structure adapted to the side surface of the silicon rod bearing table, but is not limited thereto. The movable base can also be, for example, a curved plate structure or other special-shaped structures. The supporting portion is at least two ejector rods extending upward from the movable base, but is not limited thereto. The supporting portion can also be, for example, a top plate or a top column extending upward from the movable base. The power generating structure includes two support feet provided at the movable base and two springs respectively sleeved on the two support feet, but is not limited thereto. The power generating structure can also adopt, for example, a torsion spring, a spring piece and other structures. By using the elastic force of the spring, the support feet and the connected ejector rods can move up and down relative to the silicon rod bearing table. In this embodiment, the locking control member is used to control the movable supporting member in a locked state when the movable supporting member abuts against the bottom of the silicon rod to be cut. In one implementation, the locking control member can be, for example, an electromagnetic lock. In the initial state, the ejector rod protrudes from the bearing surface of the silicon rod bearing table under the action of the support feet and the spring. When the silicon rod to be cut is placed, the ejector rod moves downward against the elastic force of the spring after being pressed by the silicon rod to be cut until the silicon rod to be cut is completely placed on the bearing surface of the silicon rod bearing table. At this time, the electromagnetic lock as the locking control member is energized and tightly adsorbs the movable base in the movable supporting member by the strong magnetic force generated by the principle of electro-magnetic induction, so as to control the ejector rod in a locked state. When the wire cutting device performs squaring cutting on the silicon rod to be cut carried by the silicon rod bearing table corresponding to the cutting area in the silicon rod conversion device, the movable supporting member in the locked state can support the corresponding edge skin, effectively preventing the cutting wire mesh in the wire cutting unit from chipping when passing through the silicon rod to be cut, and avoiding the falling and overturning of the edge skin, etc.

[0120] As can be seen from the above, after the silicon rod to be cut is subjected to squaring cutting, an edge skin will be formed. In order not to hinder the rise of the wire cutting device, it is necessary to unload the edge skin in time. For the unloading of the edge skin, the general edge skin unloading method mostly still requires the operator to manually operate to separate the edge skin from the squared silicon rod and move it out of the silicon rod squaring equipment, which is not only inefficient, but also increases the risk of damage to the squared silicon rod due to the collision between the edge skin and the squared silicon rod during the handling process. In view of this, the silicon rod squaring equipment of the present application further includes an edge skin unloading device for unloading the edge skin formed after the wire cutting device performs squaring cutting on the silicon rod to be cut.

[0121] Please refer to Figure 18, which is a schematic diagram of the structure of the edge peel lifting mechanism in one embodiment of the edge peel unloading device of the present application for silicon ingot squaring equipment. The edge peel unloading device 28 includes an edge peel lifting mechanism 280 for lifting the edge peel so that the top of the edge peel 10 protrudes from the cut silicon ingot. The edge peel lifting mechanism 280 includes a lifting member 2800 disposed on the wire cutting support 241. The lifting member 2800 is driven by a telescopic component 2801 to perform telescopic movement. After the lifting member 2800 is controlled to extend, it supports the bottom of the edge peel 10 to lift the edge peel 10.

[0122] In one embodiment, the lifting member 2800 includes a support plate and a supporting plate, wherein the support plate extends upward from the bottom of the supporting plate. Furthermore, the support plate can be a curved plate adapted to the curved surface of the edge skin 10. When the support plate is against the edge skin 10, it can fully contact the curved surface of the edge skin 10. The portion where the support plate contacts the edge skin 10 is of a smooth design, or a buffer pad is provided on the inner surface of the support plate that contacts the edge skin 10. The supporting plate is used to support the bottom of the edge skin 10. Furthermore, the supporting plate can be a bow-shaped plate adapted to the bottom surface of the edge skin 10. In other embodiments, the chord side of the bow-shaped plate serving as the supporting plate can be further provided with a protrusion to increase the contact area with the bottom surface of the edge skin 10.

[0123] In one embodiment, the telescopic component 2801 may be, for example, a cylinder with a telescopic rod, wherein the telescopic rod may be connected to the support plate in the lifting member 2800 via a connecting structure, and the cylinder may drive the telescopic rod to drive the lifting member 2800 to perform telescopic movement. Here, the telescopic movement of the lifting member 2800 includes the contraction movement of the lifting member 2800 and the extension movement of the lifting member, wherein the contraction movement of the lifting member 2800 specifically refers to the cylinder driving the telescopic rod to contract to drive the lifting member 2800 away from the side skin 10, and the extension movement of the lifting member 2800 specifically refers to the cylinder driving the telescopic rod to extend to drive the lifting member 2800 toward the side skin 10. Of course, the telescopic component 2801 may also be implemented in other ways. For example, the telescopic component 2801 may also be a servo motor with a lead screw, and the lead screw is connected to the lifting member. The servo motor drives the lead screw to rotate to drive the connected lifting member 2800 to perform telescopic movement. For example, the lead screw is driven to rotate forward to drive the lifting member 2800 to perform contraction movement and the lead screw is driven to rotate reversely to drive the lifting member 2800 to perform extension movement, or the lead screw is driven to rotate forward to drive the lifting member 2800 to perform extension movement and the lead screw is driven to rotate reversely to drive the lifting member 2800 to perform contraction movement.

[0124] In practical applications, in the initial state, the telescopic rod drives the lifting member 2800 to be in a contracted state. The wire cutting unit 25 is driven to descend along with the wire cutting support 241 so that the cutting lines formed by each cutting segment in the wire cutting unit 25 perform squaring cutting on the silicon rod to be cut located in the cutting area until the cutting segment penetrates through the silicon rod to be cut, completing a complete cutting of the silicon rod to be cut and forming the side skin 10. At this time, the side skin lifting mechanism 280 has descended to the bottom along with the wire cutting support 241. The air cylinder drives the telescopic rod to extend to drive the lifting member 2800 close to the side skin 10 until the abutting plate in the lifting member 2800 contacts and abuts against the side skin 10. Subsequently, the wire cutting unit 25 is driven to ascend along with the wire cutting support 241, and the side skin lifting mechanism 280 ascends along with the wire cutting support 241, driving the side skin 10 to have an upward displacement relative to the silicon rod that has been cut once, making the top end of the side skin 10 protrude from the silicon rod to be cut. When the protruding part of the top end of the side skin 10 relative to the silicon rod to be cut meets the set condition, the ascent of the wire cutting support 241 can be controlled to stop. In this way, the top end of the side skin can be used as the force-applying part for grasping, enabling the side skin to be grasped and unloaded. Then, the air cylinder drives the telescopic rod to contract to drive the lifting member 2800 back to the initial state while controlling the wire cutting support 241 to drive the wire cutting unit 25 and the side skin lifting mechanism 280 to continue ascending above the silicon rod to be cut to prepare for the next cutting operation.

[0125] In other embodiments, the side skin lifting mechanism may include an adsorbing member and a telescopic member for driving the adsorbing member to perform telescopic movement. The adsorbing member is controlled by the telescopic member to abut against and adsorb the side skin. The adsorbing member may further include an abutting plate and an adsorbing element. The abutting plate may be, for example, an arc-shaped plate adapted to the arc surface of the side skin. When the abutting plate abuts against the side skin, it can fully contact the arc surface of the side skin. The adsorbing element may be, for example, a vacuum chuck. Multiple vacuum chucks may be arranged on the contact surface of the abutting plate that is to contact the side skin. The telescopic member may be, for example, an air cylinder with a telescopic rod or a servo motor with a lead screw. Taking the air cylinder with a telescopic rod as an example, the telescopic rod may be connected to the abutting plate in the lifting member through a connecting structure. The air cylinder can drive the telescopic rod to contract to drive the abutting plate away from the side skin, and the air cylinder can drive the telescopic rod to extend to drive the abutting plate close to the side skin and, after the abutting plate contacts the side skin, the adsorbing element adsorbs the side skin. Subsequently, the wire cutting support is driven to ascend, and the side skin lifting mechanism and the wire cutting device ascend along with the wire cutting support. The side skin lifting mechanism can drive the side skin to have an upward displacement relative to the silicon rod that has been cut once by using the adsorption force, making the top end of the side skin protrude from the silicon rod that has been cut once.

[0126] It should be noted that since the silicon rod squaring device of the present application is provided with multiple cutting wheel groups to cut multiple silicon rods to be cut simultaneously, multiple edge skin lifting mechanisms are provided on the wire cutting support corresponding to the multiple cutting wheel groups to discharge the edge skins of the multiple silicon rods that have undergone cutting operations simultaneously. When a pair of cutting wheels is provided in each cutting wheel group, one edge skin is formed by one downward pressing cut of the wire cutting device, and an edge skin lifting mechanism is provided above the pair of cutting wheels corresponding to each cutting wheel group on the wire cutting support to timely discharge the edge skin formed during the cutting operation. When two pairs of cutting wheels are provided in each cutting wheel group, two edge skins are formed by one downward pressing cut of the wire cutting device, and an edge skin lifting mechanism is provided above each of the two pairs of cutting wheels corresponding to each cutting wheel group on the wire cutting support to timely discharge the edge skin formed during the cutting operation.

[0127] The edge skin discharging device 28 further includes a clamping and transporting unit 281, which is arranged above the silicon rod bearing table 21 located in the cutting area, and is used for clamping the top end of the edge skin and lifting the edge skin to separate it from the squared silicon rod and transporting the edge skin to the edge skin discharging area.

[0128] Please refer to Figure 2 , as shown in the figure, the clamping and transporting unit 281 includes a moving mechanism 283 that provides movement in at least one direction and an edge skin clamping mechanism 284, and the edge skin clamping mechanism 284 is connected to the moving mechanism 283 and is driven to move in at least one direction.

[0129] In an embodiment, a support plate 282 for supporting the clamping and transporting unit 281 is spanned at the top ends of two opposite support columns 240 of the cutting frame 24, and the clamping and transporting unit 281 is arranged on the support plate 282 and corresponds to the upper part of the silicon rod bearing table located in the cutting area.

[0130] In an embodiment, the edge skin clamping mechanism 284 can be set to be multiple corresponding to the silicon rod bearing tables located in the cutting area one by one. In order to simplify the mechanism, reduce the manufacturing cost, and reduce the working energy consumption, in the embodiment, two adjacent edge skin clamping mechanisms 284 share a moving mechanism 283 that provides movement in at least one direction.

[0131] In an embodiment, refer to Figure 2 and Figure 19 , Figure 19 Shown as Figure 2Partial enlarged view of part A, as shown in the figure. The moving mechanism 283 that moves in at least one direction is an X-direction moving mechanism. The X-direction moving mechanism includes an X-direction guide rail 2830, an X-direction slider 2831, and an X-direction driving source 2832. Among them, the X-direction guide rail 2830 is laid on the support plate 282. The X-direction slider 2831 is adapted to the X-direction guide rail 2830, and a mounting seat 2833 is provided on the X-direction slider 2831. Two side skin clamping mechanisms 284 are respectively located on the left and right sides of the mounting seat 2833. The X-direction driving source 2832 can be, for example, an X-direction telescopic cylinder assembly or an X-direction motor. In order to enable the side skin clamping mechanism 284 to move smoothly in the X direction, in this embodiment, a double guide rail design is adopted, that is, two X-direction guide rails 2830 are used, and these two X-direction guide rails 2830 are arranged in parallel along the X direction. Thus, the mounting seat 2833 on the X-direction slider 2831 driven by the X-direction driving source 2832 carries the two side skin clamping mechanisms 284 thereon and moves in the X direction along the X-direction guide rail 2830. In practical applications, the moving direction of the moving mechanism 283 is not limited to this. In other embodiments, the moving mechanism may further include a Y-direction moving mechanism and may further include a Z-direction moving mechanism.

[0132] Please refer to Figure 20 , Figure 20 shown in the figure is the external structural schematic diagram of the side skin clamping mechanism in an embodiment of the side skin discharging device to which the present application is applied to a silicon rod squaring device. As shown in the figure, the side skin clamping mechanism 284 includes a lifting driving structure 2841 and a clamping component provided at the bottom of the lifting driving structure. In the embodiment, the lifting driving structure 2841 is used to drive the clamping component to perform a lifting movement. The lifting driving structure 2841 can be, for example, a lifting cylinder with a lifting rod, and the lifting rod is connected to the clamping component. The lifting cylinder can be used to control the telescopic movement of the lifting rod to drive the clamping component to perform a lifting movement, but it is not limited thereto. For example, the lifting driving structure can also be a screw rod component driven by a motor, and the screw rod component is connected to the clamping component. The motor is used to drive the screw rod component to lift to drive the clamping component to perform a lifting movement.

[0133] Please refer to Figure 21 shown in the figure is the cross-sectional structural schematic diagram of the clamping component in an embodiment of the side skin discharging device to which the present application is applied to a silicon rod squaring device. As shown in the figure, the clamping component includes a cover body 2842 and a telescopic clamping member. The telescopic clamping member is arranged inside the cover body 2842, and a clamping space 2843 for clamping the side skin is formed between the clamping member and the cover body 2842. In the embodiment, the cover body 2842 is used to cover the side skin. The size that the cover body 2842 can be inserted into is slightly larger than the cross-sectional circle of the silicon rod to be cut. The cover body 2842 is set as a closed or non-closed circular cover, but it is not limited thereto.

[0134] The structure of the clamping component is not limited to this. In other embodiments, the clamping component includes an arc-shaped plate and a telescopic clamping member, and a clamping space for clamping the edge skin is formed between the clamping member and the arc-shaped plate.

[0135] As Figure 21 shown, the clamping member is a movable pressing block 2844 controlled by a cylinder 2845, and the movable pressing block 2844 is connected to the cylinder 2845 through a turning arm 2846. In the embodiment, the turning arm 2846 has a mounting portion and a first connecting portion and a second connecting portion respectively located on opposite sides of the mounting portion. Among them, the first connecting portion connects the piston rod 2848 of the cylinder 2845, and the second connecting portion connects the movable pressing block 2844.

[0136] In one embodiment, a base 2847 for carrying the clamping member is provided inside the cover 2842. The base 2847 carries the clamping member and extends into the depression area between the cut silicon rod and the edge skin. The cylinder 2845 is fixed on the side wall of the base 2847 and has a piston rod 2848. The mounting portion of the turning arm 2846 is hinged to a support seat 2849 fixed to the bottom of the base 2847 so that the turning arm 2846 can rotate up and down around the mounting portion. The movable pressing block 2844 is fixedly connected to the second connecting portion of the turning arm 2846. The first connecting portion of the turning arm 2846 is hinged to the piston rod 2848 of the cylinder. The cylinder 2845 pushes the piston rod 2848 to expand and contract to drive the first connecting portion of the turning arm 2846 to descend or ascend around the support seat 2849, so that the second connecting portion of the turning arm 2846 ascends or descends around the support seat 2849, so that the movable pressing block 2844 connected to the second connecting portion of the turning arm moves away from or close to the cover 2842, and adjusts the clamping space 2843 between it and the cover 2842. Specifically, see Figure 21 , in the initial state, the second connecting portion of the turning arm 2846 is higher than its first connecting portion, and the movable pressing block 2844 is away from the cover 2842. When it is necessary to clamp the edge skin, the cylinder 2845 drives the piston rod 2848 to retract, thereby lifting the first connecting portion of the turning arm 2846 to rise around the support seat 2849. The second connecting portion of the turning arm 2846 then descends around the support seat 2849 and drives the movable pressing block 2844 to approach the cover 2842 (as Figure 21(in the direction of the arrow in the figure), the clamping space 2843 between the movable pressing block 2844 and the cover body 2842 is reduced to clamp the edge skin. When it is necessary to release the edge skin, the air cylinder 2845 drives the piston rod 2848 to extend, thereby driving the first connecting portion of the flipping arm 2846 to descend with the support seat 2849 as the center point, and the second connecting portion of the flipping arm 2846 rises with the support seat 2849 as the center point, driving the movable pressing block 2844 away from the cover body 2842 and returning to the initial state, increasing the clamping space 2843 between the movable pressing block 2844 and the cover body 2842 to facilitate the release of the edge skin. In order to prevent the movable pressing block 2844 from contacting the edge skin during long-term clamping and causing wear and damage to each other, in one embodiment, the movable pressing block 2844 is provided with a buffer pad for contacting the edge skin.

[0137] It should be noted that, as described above, the wire cutting unit 24 includes a plurality of cutting wheel groups 251. In some embodiments, each cutting wheel group 251 includes a pair of cutting wheels. Four single-axis surface cutting steps need to be performed to cut the silicon rod to be cut using the pair of cutting wheels. In this embodiment, the number of the clamping members is set to one. Perform the first single-axis surface cutting to form an edge skin, clamp the edge skin with one clamping member, and then transfer the edge skin through the lifting drive structure 2841 and the X-direction moving mechanism. Then adjust the cutting surface of the silicon rod to be cut (for example, rotate 90 degrees), perform the second single-axis surface cutting to form another edge skin, clamp the edge skin with one clamping member again, and then transfer the edge skin through the lifting drive structure 2841 and the X-direction moving mechanism. The edge skins formed by performing the third and fourth single-axis surface cuttings are transferred in the same way, which will not be elaborated here. In other embodiments, each cutting wheel group 251 includes two pairs of cutting wheels. Two parallel-axis surface cuttings need to be performed to cut the silicon rod to be cut using the two pairs of cutting wheels. In this embodiment, the clamping members are set to two that are oppositely arranged. Perform the first two parallel-axis surface cuttings to form two edge skins, clamp the two edge skins formed at the corresponding positions with two clamping members, and transfer the two edge skins through the lifting drive structure 2841 and the X-direction moving mechanism. Then adjust the cutting surface of the silicon rod to be cut (for example, rotate 90 degrees), perform the second two parallel-axis surface cuttings to form two more edge skins, clamp the two edge skins formed at the corresponding positions with two clamping members again, and transfer the two edge skins through the lifting drive structure 2841 and the X-direction moving mechanism.

[0138] In one embodiment, the edge skin discharging device includes an edge skin conveying structure disposed in the edge skin unloading area for conveying the edge skins transported by the clamping and transferring unit. In one implementation, the edge skin conveying structure may be, for example, a conveyor belt. It is easy to understand that the edge skin unloading area is the area where the edge skins are unloaded in the silicon rod squaring equipment. Specifically, the edge skin unloading area is the area corresponding to the lower part of the clamping and transferring unit after it transports the edge skins away from the cutting area. In actual operation, the clamping and transferring unit transfers the edge skins from the cutting area to the edge skin unloading area, and the clamping component in the clamping and transferring unit releases the edge skins to the conveyor belt serving as the edge skin conveying structure, and the conveyor belt conveys the edge skins out.

[0139] In another embodiment, the edge skin discharging device includes an edge skin barrel disposed in the edge skin unloading area. The barrel opening of the edge skin barrel can be designed to be relatively large or in a flared shape to facilitate the unobstructed placement of the edge skins. Moreover, the height of the barrel wall of the edge skin barrel is also relatively high to ensure that the placed edge skins will not tip over, etc. Thus, the clamping and transferring unit moves the edge skins from the cutting area to the edge skin barrel, and then the operator can take out the edge skins from the edge skin barrel.

[0140] Of course, discharging the edge skins formed after cutting the silicon rod to be cut is not limited to this. For example, in other embodiments, the edge skin discharging device may include an edge skin barrel and an edge skin conveying structure at the same time. Among them, the edge skin conveying structure may be, for example, a conveyor belt, and the edge skin barrel is adjacent to the starting end of the conveyor belt (for example, the edge skin barrel is located beside the starting end of the conveyor belt or directly above the starting end of the conveyor belt, etc.). The barrel opening of the edge skin barrel can be designed to be relatively large or in a flared shape to facilitate the unobstructed placement of the edge skins. Moreover, the height of the barrel wall of the edge skin barrel is also relatively high to ensure that the placed edge skins will not tip over, etc. In actual application, the edge skin barrel can be designed to be flip - able. By flipping the edge skin barrel, the edge skins in the edge skin barrel are smoothly transferred to the conveyor belt. For example, a flipping drive mechanism is provided at the bottom of the edge skin barrel, and the flipping drive mechanism may include a flipping plate, a rotating shaft, and a flipping drive source (such as a flipping motor or a flipping cylinder, etc.). Thus, after the clamping and transferring unit transfers the edge skins from the cutting area to the edge skin barrel, the edge skin barrel flips to drive the edge skins in the barrel to be transferred to the conveyor belt, and the conveyor belt conveys the edge skins out.

[0141] Through the silicon rod squaring equipment disclosed in this application and the edge skin discharging device applied to the silicon rod squaring equipment, the edge skins generated after the silicon rod squaring equipment cuts the silicon rod can be timely unloaded by the clamping component, which not only improves the work efficiency but also avoids the risks brought by manual handling.

[0142] The above embodiments are only illustrative of the principles and effects of the present application and are not intended to limit the present application. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in the present application should still be covered by the claims of the present application.

Claims

1. A silicon rod edge unloading device for silicon rod squaring equipment, characterized in that: The silicon rod squaring equipment includes a silicon rod supporting platform and a wire cutting device. The silicon rod supporting platform is used to support a vertically placed single crystal silicon rod. The wire cutting device includes a liftable wire cutting support and a wire cutting unit provided on the wire cutting support. The wire cutting unit has a cutting wire segment, which passes through the single crystal silicon rod to form a cut silicon rod and a skin. The skin unloading device includes: The edge skin supporting mechanism is arranged at the periphery of the silicon rod supporting platform and is used to support the edge skin; the edge skin supporting mechanism includes a supporting member, the supporting member includes a base and a supporting portion extending upward from the base, the supporting portion is a top column, and the height of the top column extension is consistent with the height of the supporting surface of the silicon rod supporting platform; or, the edge skin supporting mechanism includes a movable supporting member and a locking control member, the movable supporting member includes a movable base, a supporting portion, and a power generating structure for providing the supporting portion with up and down movement, the supporting portion is a top rod extending upward from the movable base, and the power generating structure includes The movable base comprises a support leg and a spring sleeved on the support leg, wherein the locking control member is an electromagnetic lock. In an initial state, the push rod protrudes from the supporting surface of the silicon rod supporting platform under the action of the support leg and the spring. When the silicon rod to be cut is placed, the push rod is pressed by the silicon rod to be cut and overcomes the elastic force of the spring to move downward until the silicon rod to be cut is completely placed on the supporting surface of the silicon rod supporting platform. At this time, the electromagnetic lock is energized and tightly adsorbs the movable base in the movable supporting member through the strong magnetic force generated by the electromagnetism principle, thereby controlling the push rod to be locked. a side skin lifting mechanism, configured to lift the side skin so that the top of the side skin protrudes from the cut silicon rod; and The clamping and transferring unit is arranged above the silicon rod supporting platform, and is used for clamping the top of the edge skin, pulling up the edge skin to separate it from the cut silicon rod, and transferring the edge skin to the edge skin unloading area.

2. The edge skin unloading device for silicon rod squaring equipment according to claim 1 is characterized in that: The edge skin lifting mechanism includes a lifting member which is arranged on the wire cutting support and can move telescopically. After the lifting member is controlled to move in an extension manner, it supports the bottom of the edge skin to lift the edge skin.

3. The edge skin unloading device for silicon rod squaring equipment according to claim 1, characterized in that: The edge skin lifting mechanism includes an adsorption member which is arranged on the wire cutting support and can move telescopically. After the adsorption member is controlled to move in an extended manner, it abuts against the edge skin and adsorbs the edge skin to lift the edge skin.

4. The edge skin unloading device for silicon rod squaring equipment according to claim 1, characterized in that: The clamping and transporting unit comprises: Providing a moving mechanism capable of moving in at least one direction; and At least one lifting and lowering clamping assembly edge skin clamping mechanism is connected to the moving mechanism and is driven to move in at least one direction.

5. The edge skin unloading device for silicon rod squaring equipment according to claim 4 is characterized in that: The edge skin clamping mechanism includes: a lifting drive structure; and The clamping assembly is arranged at the bottom of the lifting drive structure and is used for clamping or releasing the top end of the side skin.

6. The edge skin unloading device for silicon rod squaring equipment according to claim 5, characterized in that: The clamping assembly comprises: A cover body, used for covering the side skin; and A retractable clamping piece is arranged inside the cover body; a clamping space for clamping the edge skin is formed between the clamping piece and the cover body.

7. The edge skin unloading device for silicon rod squaring equipment according to claim 5, characterized in that: The clamping assembly comprises: curved plates; and A retractable clamping piece is provided, wherein a clamping space for clamping the edge skin is formed between the clamping piece and the arc-shaped plate.

8. The edge skin unloading device for silicon rod squaring equipment according to any one of claims 6 or 7, characterized in that: The clamping member is a movable pressing block controlled by a cylinder, and the movable pressing block is connected to the cylinder through a flip arm.

9. The edge skin unloading device for silicon rod squaring equipment according to claim 8, characterized in that: The flip arm has a mounting portion and a first connecting portion and a second connecting portion respectively located on opposite sides of the mounting portion, wherein the first connecting portion is connected to the piston rod of the cylinder, and the second connecting portion is connected to the movable pressing block.

10. The edge skin unloading device for silicon rod squaring equipment according to claim 8, characterized in that: The movable pressing block is provided with a buffer pad for contacting the edge skin.

11. The edge skin unloading device for silicon rod squaring equipment according to claim 1, characterized in that: Also includes: The side leather drum is arranged in the side leather unloading area.

12. The edge skin unloading device for silicon rod squaring equipment according to claim 1, characterized in that: Also includes: The side skin conveying structure is arranged in the side skin unloading area.

13. A silicon rod squaring device for squaring a single crystal silicon rod with a circular cross section, characterized in that: include: At least two silicon rod supporting platforms for supporting vertically placed single crystal silicon rods; a wire cutting device, disposed above the at least two silicon rod supporting platforms, comprising a plurality of cutting wheels and a cutting wire wound around the plurality of cutting wheels to form at least one cutting line segment; as well as The edge skin unloading device according to any one of claims 1 to 12.

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