Liquid processing device and liquid processing method

Abstract

The present invention provides a liquid processing device and a liquid processing method, which are effective for improving the in-plane uniformity of liquid processing performed using a processing liquid ejected from a nozzle. The liquid processing device comprises: a processing liquid supply unit having a nozzle for ejecting the processing liquid; a nozzle moving unit that moves the nozzle between a coating position for supplying the processing liquid toward the surface of a substrate and a standby position different from the coating position; a cleaning unit that supplies cleaning liquid toward the standby position so as to clean the top surface of the nozzle located at the standby position with the cleaning liquid; a suction unit having a suction port open toward the top surface of the nozzle located at the standby position, the suction unit sucking the processing liquid ejected from the nozzle located at the standby position and the cleaning liquid supplied to the standby position by the cleaning unit; and a control device that controls the processing liquid supply unit, the nozzle moving unit, the suction unit, and the cleaning unit.

Description

Technical Field

[0001] The present disclosure relates to a liquid processing device and a liquid processing method. Background Art

[0002] Patent document 1 discloses a liquid processing device comprising: a plurality of liquid processing sections, each of which is composed of a substrate holding section arranged in a cup body for horizontally holding a substrate; a processing liquid nozzle for supplying processing liquid to the substrate; and a liquid removal section for removing droplets of processing liquid hanging from the processing liquid nozzle between the openings of the cup body.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2010-186974 Summary of the Invention

[0006] Problems to be solved by the invention

[0007] The present disclosure provides a liquid processing apparatus and a liquid processing method that are effective for achieving in-plane uniformity of liquid processing using a processing liquid ejected from a nozzle.

[0008] Solutions for solving problems

[0009] The liquid processing device involved in one aspect of the present disclosure comprises: a processing liquid supply part, which has a nozzle for spraying processing liquid; a nozzle moving part, which moves the nozzle between a coating position for supplying the processing liquid toward the surface of a substrate and a standby position different from the coating position; a cleaning part, which supplies cleaning liquid toward the standby position to clean the top end surface of the nozzle located at the standby position with the cleaning liquid; a suction part, which has a suction port opening toward the top end surface of the nozzle located at the standby position, the suction part sucking the processing liquid sprayed from the nozzle located at the standby position and the cleaning liquid supplied to the standby position by the cleaning part; and a control device, which controls the processing liquid supply part, the nozzle moving part, the suction part and the cleaning part.

[0010] Effects of the Invention

[0011] According to the present disclosure, a liquid processing apparatus and a liquid processing method that are effective for achieving in-plane uniformity of liquid processing using a processing liquid ejected from a nozzle are provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram showing an example of a schematic configuration of a liquid processing apparatus.

[0013] Figure 2This is a schematic cross-sectional view showing an example of a cleaning section and a suction section.

[0014] Figure 3 It is a schematic diagram showing an example of the structure of the liquid receiving part when viewed from above.

[0015] Figure 4 This is a block diagram showing an example of the functional configuration of the control device.

[0016] Figure 5 This is a block diagram showing an example of the hardware configuration of the control device.

[0017] Figure 6 This is a flowchart showing an example of a liquid processing process.

[0018] Figure 7 This is a flowchart showing an example of a nozzle cleaning process.

[0019] Figures 8a to 8d This is a schematic diagram for explaining the nozzle cleaning method.

[0020] Figure 9 This is a flowchart showing an example of a dummy ejection process.

[0021] Figures 10a to 10d This is a schematic diagram for explaining the false ejection method.

[0022] Description of Reference Numerals

[0023] 1: Liquid processing device; 20: Processing liquid supply unit; 25: Nozzle; 25a: Spray outlet; 25b: Top surface; 30: Driving mechanism; 40: Cleaning unit; 51: Cleaning tank; 51b: Bottom wall; 53a, 54a: Liquid discharge outlet; 60: Cleaning liquid supply unit; 80: Suction unit; 81: Suction head; 81a: Suction outlet; 81b: Top surface; 100: Control device; W: Wafer; Wa: Surface. DETAILED DESCRIPTION

[0024] Hereinafter, an example of an embodiment of the present disclosure will be described with reference to the accompanying drawings. In the following description, the same reference numerals are used for elements having the same elements or the same functions, and redundant descriptions are omitted.

[0025] [Liquid processing equipment]

[0026] Reference Figures 1 to 3 , to illustrate the structure of the liquid processing device 1. Figure 1As shown, the liquid processing apparatus 1 is configured to supply a processing liquid L1 to the surface Wa of the wafer W (substrate). The processing liquid L1 may be any liquid that can be applied to the surface Wa of the wafer W, for example, a photosensitive etch-resistant liquid for forming a photosensitive etch-resistant film, a non-photosensitive etch-resistant liquid for forming a non-photosensitive etch-resistant film, or a developer for performing a development process on the etch-resistant film.

[0027] The wafer W can be in the shape of a circular plate or a plate other than a circular plate, such as a polygon. The wafer W can also have a cutout portion where a portion is cut out. The cutout portion can be, for example, a notch (a U-shaped, V-shaped groove, etc.) or a straight portion extending in a straight line (i.e., an orientation plane). The wafer W can also be, for example, a semiconductor substrate, a glass substrate, a mask substrate, an FPD (Flat Panel Display) substrate, and various other substrates. The diameter of the wafer W can be, for example, about 200 mm to 450 mm.

[0028] Liquid processing apparatus 1 includes substrate holding unit 10 , processing liquid supply unit 20 , drive mechanism 30 (nozzle moving unit), cleaning unit 40 , suction unit 80 , and control device 100 .

[0029] The substrate holding portion 10 includes a rotating holding portion 11 and a cup 12. The rotating holding portion 11 includes a rotating portion 13, a shaft 14, and a holding portion 15. The rotating portion 13 operates based on an operation signal from the control device 100 and rotates the shaft 14. The rotating portion 13 is a power source such as an electric motor. The holding portion 15 is provided at the top end of the shaft 14. The wafer W can be placed on the holding portion 15. The holding portion 15 is, for example, a suction cup configured to hold the wafer W in a substantially horizontal position by suction or the like.

[0030] That is, the rotation holding unit 11 has a function of rotating the wafer W around an axis (rotation axis) perpendicular to the surface Wa of the wafer W while the wafer W is in a substantially horizontal position. In this embodiment, the rotation axis passes through the center of the circular wafer W and is therefore also the central axis.

[0031] The cup 12 is provided around the rotating holding portion 11. The cup 12 functions as a liquid collection container for receiving liquid supplied to the wafer W for processing the wafer W. The cup 12 can be formed of, for example, polypropylene (PP), polyvinyl chloride (PVC), or polyphenylene sulfide (PPS).

[0032] The processing liquid supply unit 20 is configured to supply the processing liquid L1 to the surface Wa of the wafer W. The processing liquid supply unit 20 includes a liquid source 21 , a pump 22 , a valve 23 , a pipe 24 , and a nozzle 25 .

[0033] The liquid source 21 functions as a supply source for the processing liquid L1. The pump 22 operates based on an actuation signal from the control device 100, sucking the processing liquid L1 from the liquid source 21 and delivering the processing liquid L1 to the nozzle 25 via the pipe 24 and valve 23. The valve 23 operates based on an actuation signal from the control device 100, connecting or disconnecting the pipes 24 before and after the valve 23. The pipe 24 is connected to the liquid source 21, pump 22, valve 23, and nozzle 25 in order from the upstream side.

[0034] The nozzle 25 is configured to eject the processing liquid L1. Specifically, the nozzle 25 has a nozzle 25a (see FIG. 25 ) that ejects the processing liquid L1 sent from the pump 22 downward. Figure 2 ) function of ejecting. The ejection port 25a is provided on the top end surface 25b possessed by the nozzle 25. The top end surface 25b is, for example, the lower end surface located at the lower end of the nozzle 25. The top end surface 25b can be flat. For example, the top end surface 25b can be horizontal. In addition, the top end surface 25b can also be inclined relative to the horizontal direction. The top end surface 25b can also be partially cut off. The ejection port 25a can be circular or polygonal when viewed from the vertical direction (below). A flow path connected to the ejection port 25a is provided in the nozzle 25. The flow path in the nozzle 25 can have a substantially fixed diameter. Alternatively, the flow path in the nozzle 25 can be expanded near the ejection port 25a.

[0035] The drive mechanism 30 operates based on an operation signal from the control device 100, moving the nozzle 25 horizontally or vertically. The drive mechanism 30 may be, for example, a servo motor with an encoder to control the movement speed and position of the nozzle 25. The drive mechanism 30 moves the nozzle 25 between a coating position for supplying the processing liquid L1 toward the front surface Wa of the wafer W and a standby position different from the coating position.

[0036] The coating position is a position where the processing liquid L1 ejected from the ejection port 25a of the nozzle 25 can adhere to the surface Wa of the wafer W. For example, the coating position is any portion within the area defined by the outer edge of the cup 12, as viewed from above. Alternatively, the coating position is any portion within the area defined by the outer edge of the wafer W held by the holding portion 15, as viewed from above. The standby position is a position used for preparation (maintenance of the nozzle 25) for supplying the processing liquid L1 toward the surface Wa of the wafer W. For example, the standby position is any portion outside the area defined by the outer edge of the wafer W, as viewed from above. Alternatively, the standby position is any portion outside the area defined by the outer edge of the cup 12, as viewed from above. In this specification, the ejection of the processing liquid L1 from the nozzle 25 at the coating position toward the surface Wa of the wafer W is referred to as "true ejection." In addition, the ejection of the processing liquid L1 from the nozzle 25 at the standby position toward a location different from the wafer W, in preparation for true ejection, is referred to as "false ejection." Furthermore, the drive mechanism 30 may move the nozzle 25 between the center of the wafer W and the outer edge of the wafer W during the actual ejection.

[0037] The cleaning unit 40 is configured to clean the distal end surface 25b of the nozzle 25 at the standby position using the cleaning liquid L2. The cleaning unit 40 includes a liquid receiving portion 50 and a cleaning liquid supply portion 60.

[0038] The liquid receiving portion 50 functions as a liquid collecting container for receiving the processing liquid L1 and the cleaning liquid L2 during the dummy discharge. Figure 1 and Figure 2 As shown, the liquid receiving portion 50 includes a cleaning tank 51 and a nozzle 52. The cleaning tank 51 is set at the standby position. As mentioned above, when the standby position is outside the area divided by the outer edge of the cup 12, the cleaning tank 51 is arranged outside the cup 12. The cleaning tank 51 is a bottomed cylindrical shell with an open top. Figure 2 and Figure 3 As shown, the cleaning tank 51 has side walls 51a and a bottom wall 51b.

[0039] The nozzle 52 is provided on the side wall 51a of the cleaning tank 51 and is configured to spray the cleaning liquid L2 into the cleaning tank 51. The nozzle 52 may also be configured to generate a swirling flow within the cleaning tank 51 by the sprayed cleaning liquid L2. For example, when viewed from the vertical direction, the opening direction of the nozzle 52's spray port (the spray direction of the cleaning liquid L2 from the nozzle 52) may also extend along a circumferential direction centered approximately at the center of the bottom wall 51b.

[0040] The cleaning liquid supply unit 60 is configured to supply the cleaning liquid L2 into the cleaning tank 51. The cleaning liquid L2 may be any organic solvent (eg, a diluent). The cleaning liquid supply unit 60 includes a liquid source 61, a pump 62, a valve 63, and a pipe 64.

[0041] Liquid source 61 functions as a supply source for cleaning liquid L2. Pump 62 operates based on an actuation signal from control device 100, sucking cleaning liquid L2 from liquid source 61 and delivering cleaning liquid L2 to nozzle 52 via pipe 64 and valve 63. Valve 63 operates based on an actuation signal from control device 100, connecting or disconnecting pipe 64 before and after valve 63. Pipe 64 connects liquid source 61, pump 62, valve 63, and nozzle 52 in this order from the upstream side.

[0042] The cleaning unit 40 may further include a gas supply unit 70. The gas supply unit 70 is configured to supply gas toward the lower end of the nozzle 25. The gas G may be any inert gas, such as nitrogen (N2 gas). The gas supply unit 70 includes a gas source 71, a pump 72, a valve 73, a pipe 74, and a nozzle 75.

[0043] The gas source 71 functions as a supply source of the gas G. The pump 72 operates based on an operation signal from the control device 100, draws the gas G from the gas source 71, and delivers the gas G to the nozzle 75 via the pipe 74 and the valve 73. The valve 73 operates based on an operation signal from the control device 100, connecting or disconnecting the pipes 64 before and after the valve 73.

[0044] The pipe 74 is connected to the gas source 71, pump 72, valve 73 and nozzle 75 in order from the upstream side. The nozzle 75 is fixed in the cleaning tank 51 in such a way that the nozzle at the top faces obliquely downward. The nozzle 75 has the function of ejecting the gas G sent from the gas source 71 obliquely downward from the nozzle. Figure 1 In the example shown, the gas supply unit 70 supplies gas into the cleaning tank 51. However, the gas supply unit 70 may be configured to supply gas to a tank different from the cleaning tank 51. In this case, the nozzle 75 may eject gas toward the nozzle 25 located in the different tank.

[0045] The suction section 80 is configured to suck the treatment liquid L1 and the cleaning liquid L2. The suction section 80 includes a suction head 81 and a suction device 82. The suction head 81 is a rod-shaped body extending in the vertical direction. The suction head 81 can be formed into a cylindrical shape or a polygonal column shape, for example. A suction port 81a for sucking the treatment liquid L1 or the cleaning liquid L2 is provided on the top surface 81b (upper surface) of the suction head 81. The suction port 81a opens toward the top surface 25b of the nozzle 25 located in the standby position. In this example, the top surface 81b of the suction head 81 faces the top surface 25b of the nozzle 25 located in the standby position, and the suction port 81a opens toward the top surface 25b. The top surface 81b can be flat. The top surface 81b can be horizontal or inclined relative to the horizontal direction. A flow path connected to the suction port 81a is provided in the suction head 81. The flow path extends in the vertical direction. The flow path can have a substantially fixed diameter. The diameter of the flow path in the suction head 81 may be expanded near the suction port 81 a.

[0046] like Figure 2 As shown, the suction head 81 is configured such that the suction port 81a is located in the cleaning tank 51. Figure 3 As shown, the suction head 81 may be configured so that the suction port 81a is approximately centered on the bottom wall 51b when viewed from above. The suction head 81 may protrude upward relative to the inner surface of the bottom wall 51b of the cleaning tank 51. That is, the top surface 81b of the suction head 81 may be positioned at a higher height than the inner surface of the bottom wall 51b. The suction head 81 may be fixed to the cleaning tank 51. For example, the suction head 81 may be fixed to the bottom wall 51b of the cleaning tank 51 in a manner that vertically penetrates the bottom wall 51b of the cleaning tank 51. Alternatively, the suction head 81 may not protrude relative to the bottom wall 51b of the cleaning tank 51. For example, the top surface 81b of the suction head 81 may be positioned approximately at the same height as the bottom wall 51b. The suction head 81 may be fixed to the side wall 51a instead of the bottom wall 51b of the cleaning tank 51. The suction head 81 may also be positioned away from the side wall 51a and the bottom wall 51b. In this case, the suction head 81 may be fixed to the cleaning tank 51 via a fixing member.

[0047] When viewed from the vertical direction (above), the suction port 81a can be either circular or polygonal. When viewed from the vertical direction, the size (area) of the suction port 81a can be roughly the same as the size of the discharge port 25a of the nozzle 25, or it can be smaller than the size of the discharge port 25a, or it can be larger than the size of the discharge port 25a. For example, the diameter of the suction port 81a can be 0.7 to 1.3 times the diameter of the discharge port 25a. Alternatively, the diameter of the suction port 81a can be 0.75 to 1.25 times the diameter of the discharge port 25a. When both the suction port 81a and the discharge port 25a are circular, the diameter of the suction port 81a can be 0.7 to 1.3 times or 0.75 to 1.25 times the diameter of the discharge port 25a.

[0048] The suction device 82 is connected to the lower end of the suction head 81. The suction device 82 is a pump that performs a suction operation to cause the suction port 81a to suck the processing liquid L1 or the cleaning liquid L2. The suction device 82 performs the suction operation based on an operation signal from the control device 100.

[0049] The liquid receiving portion 50 may further include drain portions 53 and 54 (see Figure 2 ). The drain parts 53 and 54 are configured to drain the processing liquid L1 and the cleaning liquid L2 supplied to the cleaning tank 51. The drain parts 53 and 54 can be provided on the bottom wall 51b. The drain parts 53 and 54 have drain ports 53a and 54a opening in the cleaning tank 51 and drain pipes 53b and 54b extending downward from the bottom wall 51b. The accommodation space in the cleaning tank 51 is connected to the space outside the cleaning tank 51 (for example, inside the drain tank) via the drain ports 53a and 54a and the flow paths in the drain pipes 53b and 54b. Thus, the cleaning liquid L2 in the cleaning tank 51 is discharged to the outside of the cleaning tank 51 through the drain ports 53a and 54a.

[0050] The drain ports 53a and 54a are provided around the suction port 81a located approximately in the center of the bottom wall 51b. Figure 3 As shown, when viewed from above, the drain ports 53a and 54a are arranged so that the suction port 81a is sandwiched between the drain ports 53a and 54a. The drain ports 53a and 54a can also be formed to extend circumferentially centered approximately at the center of the bottom wall 51b. When viewed from the vertical direction, the size (area) of the drain port 53a and the size (area) of the drain port 54a can be smaller than the size of the suction port 81a. In addition, a single drain port can be provided on the bottom wall 51b of the cleaning tank 51, or three or more drain ports can be provided. The size of the drain port provided on the bottom wall 51b can be approximately the same as the size of the suction port 81a, or smaller than the suction port 81a. Alternatively, no drain port can be provided on the bottom wall 51b, and the cleaning liquid L2 in the cleaning tank 51 can be discharged by the suction unit 80.

[0051] The control device 100 controls the various elements of the liquid processing apparatus 1. The control device 100 is configured to execute the following control operations: With the nozzle 25 in the standby position, the processing liquid supply unit 20 discharges the processing liquid L1 from the nozzle 25; the suction unit 80 suctions the processing liquid L1 discharged from the nozzle 25 in the standby position; the cleaning unit 40 supplies the cleaning liquid L2 toward the standby position to clean the nozzle 25 in the standby position; and the suction unit 80 suctions the cleaning liquid L2 supplied to the standby position by the cleaning unit 40.

[0052] like Figure 4As shown, the control device 100 has a false ejection control unit 101, a true ejection control unit 102, a cleaning liquid supply control unit 103, a first suction control unit 104, a second suction control unit 105, a nozzle movement control unit 106, a gas supply control unit 107 and a rotation control unit 108 as functional modules.

[0053] The dummy discharge control unit 101 has a function of controlling the processing liquid supply unit 20 so that the processing liquid L1 is discharged from the nozzle 25 in the standby position. Specifically, when the nozzle 25 is in the standby position (inside the cleaning tank 51), the dummy discharge control unit 101 controls the pump 22 and valve 23 of the processing liquid supply unit 20 to cause the nozzle 25 to discharge (dummy discharge) the processing liquid L1 toward the suction port 81a of the suction head 81.

[0054] The true discharge control unit 102 has the function of controlling the processing liquid supply unit 20 so that the processing liquid L1 is discharged from the nozzle 25 at the supply position. Specifically, when the nozzle 25 is at the supply position, the true discharge control unit 102 controls the pump 22 and valve 23 of the processing liquid supply unit 20 to cause the nozzle 25 to discharge (true discharge) the processing liquid L1 toward the surface Wa of the wafer W.

[0055] The cleaning liquid supply control unit 103 controls the cleaning liquid supply unit 60 to supply cleaning liquid L2 from the nozzle 52 to the standby position. Specifically, with the nozzle 25 housed in the cleaning tank 51, the cleaning liquid supply control unit 103 controls the pump 62 and valve 63 of the cleaning liquid supply unit 60 to supply the cleaning liquid L2 into the cleaning tank 51. The cleaning liquid supply control unit 103 supplies the cleaning liquid L2 into the cleaning tank 51 through the cleaning liquid supply unit 60 until the tip surface 25b of the nozzle 25 is submerged in the cleaning liquid L2 within the cleaning tank 51.

[0056] The first suction control unit 104 controls the suction unit 80 to suck the processing liquid L1 ejected from the nozzle 25 in the standby position. Specifically, during dummy discharge from the nozzle 25, the first suction control unit 104 controls the suction device 82 to cause the suction unit 80 to suck the processing liquid L1 ejected from the nozzle 25. In this case, the processing liquid L1 dummy discharged from the nozzle 25 is sucked in through the suction port 81a and the flow path within the suction head 81 connected to the suction port 81a.

[0057] The second suction control unit 105 controls the suction unit 80 to suck the cleaning liquid L2 supplied into the cleaning tank 51. Specifically, when the cleaning liquid L2 is supplied into the cleaning tank 51, the second suction control unit 105 controls the suction device 82 to cause the suction unit 80 to suck the cleaning liquid L2 from the cleaning tank 51. In this case, the cleaning liquid L2 supplied into the cleaning tank 51 is sucked from the suction port 81a through the flow path within the suction head 81 and discharged out of the cleaning tank 51.

[0058] The nozzle movement control unit 106 has a function of controlling the drive mechanism 30 to move the nozzle 25 between the supply position and the standby position. For example, after the nozzle 25 performs a false ejection and before the actual ejection from the nozzle 25 is performed, the nozzle movement control unit 106 moves the nozzle 25 from the standby position to the supply position through the drive mechanism 30. After the actual ejection from the nozzle 2 and before the cleaning of the nozzle 25 is performed, the nozzle movement control unit 106 moves the nozzle 25 from the supply position to the standby position through the drive mechanism 30. Alternatively, when the actual ejection is performed from the nozzle 25, the nozzle movement control unit 106 moves the nozzle 25 in a direction along the surface Wa of the wafer W through the drive mechanism 30. For example, the actual ejection may be performed from the nozzle 25 toward the surface Wa of the rotating wafer W, and the nozzle movement control unit 106 moves the nozzle 25 between the center axis of the wafer W and the outer edge of the wafer W through the drive mechanism 30.

[0059] The gas supply control unit 107 has a function of controlling the gas supply unit 70 so that the gas G is ejected from the nozzle 75 toward the top end surface 25b of the nozzle 25. Specifically, when the nozzle 25 is in the standby position (inside the cleaning tank 51), the gas supply control unit 107 controls the pump 72 and valve 73 of the gas supply unit 70 so that the gas G is ejected from the nozzle 75 toward the top end surface 25b of the nozzle 25. Thus, if there is any deposit attached to the top end surface 25b of the nozzle 25, the gas G is ejected toward the deposit.

[0060] The rotation control unit 108 has a function of controlling the rotation unit 13 so as to rotate the wafer W held by the holding unit 15 at a predetermined rotation speed. For example, the rotation control unit 108 may rotate the wafer W by driving the rotation unit 13 while the true discharge control unit 102 is performing true discharge from the nozzle 25.

[0061] The control device 100 is composed of one or more control computers. For example, the control device 100 has Figure 5The circuit 120 shown. The circuit 120 has one or more processors 121, a memory 122, a storage device 123, an input / output port 124, and a timer 125. The storage device 123 is, for example, a hard disk, etc., and has a storage medium that can be read by a computer. The storage medium stores a program for causing the control device 100 to execute the liquid treatment process described later. The storage medium can also be a removable medium such as a non-volatile semiconductor memory, a magnetic disk, and an optical disk. The memory 122 temporarily stores the program loaded from the storage medium of the storage device 123 and the calculation results of the processor 121. The processor 121 and the memory 122 coordinate to execute the above-mentioned program, thereby forming the above-mentioned functional modules. The input / output port 124 inputs and outputs electrical signals between the input / output port 124 and the components of the control object according to the instructions from the processor 121. The timer 125 measures the elapsed time by counting the reference pulses of a fixed period, for example.

[0062] Furthermore, the hardware configuration of the control device 100 is not limited to the configuration in which each functional module is constituted by a program. For example, each functional module of the control device 100 may be constituted by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) in which the logic circuit is integrated.

[0063] [Liquid treatment process]

[0064] Next, refer to Figure 6 to Figure 1 0, as an example of a liquid processing method, a liquid processing process performed in the liquid processing apparatus 1 is described.

[0065] like Figure 6 As shown, in the liquid processing process, first, the control device 100 executes step S01. In step S01, the control device 100 controls the various elements of the liquid processing device 1 to supply the processing liquid L1 to the surface Wa of the wafer W. Specifically, in step S01, the nozzle movement control unit 106 first controls the driving mechanism 30 to move the nozzle 25 to configure the nozzle 25 to the supply position. Then, the true ejection control unit 102 controls the processing liquid supply unit 20 (pump 22 and valve 23) to make the nozzle 25 eject (true eject) the processing liquid L1 toward the surface Wa of the wafer W. At this time, the rotation control unit 108 controls the rotating unit 13 so that the wafer W supported by the holding unit 15 rotates at a specified rotation speed. Thus, the processing liquid L1 is applied to the surface Wa of the wafer W.

[0066] Next, the control device 100 executes steps S02 and S03. In step S02, the control device 100 controls the drive mechanism 30, the cleaning unit 40, and the suction unit 80 to clean the nozzle 25. The details of the cleaning process in step S02 will be described later. In step S03, the control device 100 controls the processing liquid supply unit 20, the drive mechanism 30, and the suction unit 80 to dummy-discharge the processing liquid L1 from the nozzle 25 and to suck the dummy-discharged processing liquid L1 from the suction port 81a. The details of the dummy-discharge process in step S03 will be described later. The control device 100 repeats the processes of steps S01 to S03.

[0067] When the treatment liquid L1 is applied in step S01 (after the application is completed), the treatment liquid L1 may adhere to the tip surface 25b of the nozzle 25 (see Figure 8a ). For example, when the processing liquid L1 is ejected toward the surface Wa of the wafer W with the top surface 25b of the nozzle 25 close to the surface Wa, the processing liquid L1 tends to adhere to the top surface 25b. In addition, "close contact" refers to a state in which the top surface 25b has not yet contacted the surface Wa but is slightly away from the surface Wa. As an example, the distance between the top surface 25b and the surface Wa can be approximately 0.01mm to 2.0mm. The cleaning process in step S02 is performed to remove the processing liquid L1 adhering to the top surface 25b.

[0068] When the nozzle 25 is cleaned in step S02, a small amount of the cleaning liquid L2 supplied to the lower end of the nozzle 25 sometimes enters the interior of the nozzle 25 from the ejection port 25a. Moreover, after a series of cleaning processes are performed, the cleaning liquid L2 that has entered the interior of the nozzle 25 sometimes remains (see Figure 8d In order to discharge the cleaning liquid L2 remaining in the nozzle 25, a dummy discharge process of step S03 is performed at the standby position. Thus, after the treatment liquid L1 is applied by the nozzle 25, steps S02 and S03 are performed. With the treatment liquid L1 removed from the top surface 25b of the nozzle 25 and the cleaning liquid L2 removed from the nozzle 25, the treatment liquid L1 in step S01 is applied again. By repeating steps S01 to S03, the dummy discharge process of step S03 is performed before each step S01.

[0069] (Cleaning process)

[0070] like Figure 7As shown, during the cleaning process of step S02, after the processing liquid L1 is applied to the surface Wa of the wafer W, the control device 100 executes step S21. In step S21, the nozzle movement control unit 106 controls the drive mechanism 30 to move the nozzle 25 from the supply position to the standby position, thereby positioning the nozzle 25 in the standby position. For example, the nozzle movement control unit 106 controls the drive mechanism 30 to accommodate the nozzle 25 in the cleaning tank 51 and position the nozzle 25 in the cleaning tank 51 such that the top surface 25b of the nozzle 25 faces the top surface 81b of the suction head 81.

[0071] Next, the control device 100 executes steps S22 and S23. In step S22, the cleaning liquid supply control unit 103 controls the cleaning liquid supply unit 60 to start spraying the cleaning liquid L2 from the nozzle 52 provided on the side wall 51a of the cleaning tank 51. In step S23, the control device 100 waits until a predetermined first specified time has passed. Figure 8b As shown, the cleaning liquid L2 is supplied into the cleaning tank 51. The nozzle 52 continues to supply the cleaning liquid L2 into the cleaning tank 51 from the start of spraying the cleaning liquid L2 from the nozzle 52 until the first predetermined time has passed.

[0072] At this time, while supplying the cleaning liquid L2 into the cleaning tank 51, a portion of the cleaning liquid L2 supplied into the cleaning tank 51 is discharged out of the cleaning tank 51 through the drain ports 53a and 54a. Therefore, the cleaning liquid supply control unit 103 may also cause the cleaning liquid supply unit 60 to continue supplying the cleaning liquid L2 from the nozzle 52 so that the liquid level of the cleaning liquid L2 in the cleaning tank 51 is maintained at a position above the top surface 25b of the nozzle 25. By performing steps S22 and S23, when the processing liquid L1 is attached to the top surface 25b of the nozzle 25 (around the ejection port 25a), the attached processing liquid L1 is removed by the cleaning liquid L2 (refer to FIG. Figure 8b ).

[0073] Next, the control device 100 executes steps S24 and S25. In step S24, the second suction control unit 105 controls the suction device 82 to suck the cleaning liquid L2 supplied to the cleaning tank 51 from the suction port 81a (via the flow path in the suction head 81). In step S25, the control device 100 waits until the predetermined second specified time has passed. Figure 8cAs shown, the cleaning liquid L2 is sucked into the suction head 81 from the suction port 81a. At this time, if the processing liquid L1 adheres to the inner surface of the flow path in the suction head 81 during the false ejection, the attached processing liquid L1 is removed by the cleaning liquid L2. In this way, the control device 100 first executes the process of causing the cleaning unit 40 to supply the cleaning liquid L2 into the cleaning tank 51 while the suction operation performed by the suction unit 80 is stopped. Thereafter, the control device 100 executes the following process: while causing the cleaning unit 40 to supply the cleaning liquid L2 into the cleaning tank 51, the suction unit 80 also sucks the cleaning liquid L2 in the cleaning tank 51.

[0074] Next, the control device 100 executes step S26. In step S26, the cleaning liquid supply control unit 103 controls the pump 62 and valve 63 of the cleaning liquid supply unit 60 to stop spraying the cleaning liquid L2 from the nozzle 52. As a result, the supply of the cleaning liquid L2 from the nozzle 52 to the cleaning tank 51 is stopped. Figure 8d As shown, the cleaning liquid L2 remaining in the cleaning tank 51 is discharged to the outside of the cleaning tank 51 through the drain ports 53a and 54a and the suction unit 80 which continues the suction operation.

[0075] Next, the control device 100 executes step S27. In step S27, the second suction control unit 105 controls the suction device 82 of the suction unit 80 to stop suction of the cleaning liquid L2 by the suction port 81a. After the suction port 81a stops sucking the cleaning liquid L2, if any cleaning liquid L2 remains in the cleaning tank 51, the remaining cleaning liquid L2 is discharged from the cleaning tank 51 through the drain ports 53a and 54a.

[0076] Next, the control device 100 executes step S28. In step S28, the gas supply control unit 107 controls the pump 72 and valve 73 of the gas supply unit 70 to supply gas from the nozzle 75 (see Figure 2 ) ejects gas G toward the top surface 25b of the nozzle 25. In step S27, a small amount of cleaning liquid L2 may remain on the top surface 25b. In this case, the gas G is supplied to blow away the attached cleaning liquid L2, thereby removing the cleaning liquid L2 from the top surface 25b. This completes the cleaning process.

[0077] Furthermore, during a series of cleaning processes, the control device 100 may cause the suction unit 80 to draw the cleaning liquid L2 during the entire period during which the cleaning liquid supply unit 60 is supplying the cleaning liquid L2 into the cleaning tank 51 (hereinafter referred to as the "cleaning liquid supply period"). As in the above-described cleaning process, when the control device 100 causes the suction unit 80 to draw the cleaning liquid L2 supplied into the cleaning tank 51 during a portion of the cleaning liquid supply period, the usage period of the suction device 82 is reduced, thereby suppressing the progression of deterioration of the suction device 82. Alternatively, after the cleaning liquid supply period ends, the control device 100 may cause the suction unit 80 to draw the cleaning liquid L2 remaining in the cleaning tank 51. Alternatively, if the liquid processing apparatus 1 is not provided with a gas supply unit 70, the ejection of gas G in step S28 may be omitted.

[0078] (Fake ejection process)

[0079] like Figure 9 As shown, in the false ejection process in step S03, after the nozzle 25 is cleaned, the control device 100 executes step S31. In step S31, the nozzle movement control unit 106 controls the drive mechanism 30 to move the nozzle 25 so that the ejection port 25a of the nozzle 25 is located near the suction port 81a of the suction head 81. In other words, the nozzle movement control unit 106 arranges the nozzle 25 at a position near the suction port 81a (see FIG. Figure 10a ).

[0080] The position near the suction port 81a refers to a position where, in the standby position, the discharge port 25a and the suction port 81a are close enough that the processing liquid L1 discharged from the nozzle 25 can be sucked into the suction port 81a without spreading to the top surface 25b. In this case, the nozzle movement control unit 106 may also arrange the nozzle 25 at the aforementioned near position so that the center of the discharge port 25a and the center of the suction port 81a are substantially aligned with each other.

[0081] Next, the control device 100 executes step S32. In step S32, the first suction control unit 104 controls the suction device 82 of the suction unit 80 so that the suction port 81a can suck the processing liquid L1. In other words, the first suction control unit 104 causes the suction unit 80 to start the suction operation.

[0082] Next, the control device 100 executes steps S33 and S34. In step S33, the false ejection control unit 101 controls the pump 22 and valve 23 of the treatment liquid supply unit 20 to falsely eject the treatment liquid L1 from the ejection port 25a of the nozzle 25. In step S34, the control device 100 waits until a predetermined third predetermined time has passed. In step S32, the suction by the suction unit 80 is started, and the false ejected treatment liquid L1 is sucked by the suction port 81a (refer to FIG. Figure 10b ). In this manner, when the nozzle 25 is in the standby position, the control device 100 controls the processing liquid supply unit 20 and the suction unit 80 to eject the processing liquid L1 from the nozzle 25, and to cause the suction unit 80 to suck the processing liquid L1 ejected from the nozzle 25. Thus, a temporary ejection of the processing liquid L1 is performed, and the cleaning liquid L2 remaining in the nozzle 25 during the cleaning process is discharged from the nozzle 25.

[0083] Next, the control device 100 executes step S35. In step S35, the dummy ejection control unit 101 controls the pump 22 and valve 23 of the treatment liquid supply unit 20 to stop the dummy ejection of the treatment liquid L1 from the ejection port 25a of the nozzle 25. As a result, the ejection of the treatment liquid L1 from the ejection port 25a is stopped, and the treatment liquid L1 remaining in the suction head 81 is sucked and removed (see Figure 10c ).

[0084] Next, the control device 100 executes steps S36 and S37. In step S36, the control device 100 waits until a predetermined fourth predetermined time has elapsed. In step S37, the first suction control unit 104 controls the suction device 82 so that it is unable to suck the processing liquid L1 from the suction port 81a. In other words, the first suction control unit 104 stops the suction operation of the suction unit 80.

[0085] Thus, from the time the treatment liquid L1 stops being ejected in step S35 until the fourth predetermined time has passed, the suction of the suction port 81a continues. During this period, the treatment liquid L1 remaining in the nozzle 25 is sucked by the suction port 81a, so that Figure 10d As shown, the processing liquid L1 in the nozzle 25 rises (also called "suck-back"). That is, the lowest level of the processing liquid L1 in the nozzle 25 rises. By adjusting the fourth predetermined time, the amount of processing liquid L1 rising in the nozzle 25 during the period from when the discharge of the processing liquid L1 from the nozzle 25 stops until the suction operation by the suction port 81a stops changes. This completes the dummy discharge sequence.

[0086] Furthermore, during a series of dummy ejection processes, the control device 100 may also stop the ejection of the processing liquid L1 from the nozzle 25 and the suction operation by the suction unit 80 at approximately the same timing. Alternatively, the nozzle 25 may be positioned at the aforementioned near position in step S12 of the cleaning process performed before the dummy ejection process, and a series of cleaning processes may be performed. In this case, the processing of step S31 may be omitted during the dummy ejection process.

[0087] [Effects of the embodiment]

[0088] The liquid processing device 1 involved in the present embodiment described above includes: a processing liquid supply part 20, which has a nozzle 25 that sprays the processing liquid L1; a driving mechanism 30, which moves the nozzle 25 between a coating position for supplying the processing liquid L1 toward the surface Wa of the wafer W and a standby position different from the coating position; a suction part 80, which has a suction port 81a opening toward the top end surface 25b of the nozzle 25 located at the standby position; a cleaning part 40, which cleans the top end surface 25b of the nozzle 25 at the standby position with the cleaning liquid L2; and a control device 100, which controls the processing liquid supply part 20, the driving mechanism 30, the suction part 80 and the cleaning part 40. The control device 100 performs the following control: when the nozzle 25 is located in the standby position, the processing liquid supply part 20 sprays the processing liquid L1 from the nozzle 25; the suction part 80 sucks the processing liquid L1 sprayed from the nozzle 25 located in the standby position; the cleaning part 40 supplies the cleaning liquid L2 toward the standby position to clean the nozzle 25 located in the standby position; and the suction part 80 sucks the cleaning liquid L2 supplied to the standby position through the cleaning part 40.

[0089] The liquid processing method involved in this embodiment includes: causing the nozzle 25 for spraying the processing liquid L1 included in the processing liquid supply part 20 to move between a coating position for supplying the processing liquid L1 toward the surface Wa of the wafer W and a standby position different from the coating position; when the nozzle 25 is located at the standby position, causing the processing liquid supply part 20 to spray the processing liquid L1 from the nozzle 25; causing the suction part 80 to suck the processing liquid L1 sprayed from the nozzle 25 located at the standby position, and the suction part 80 has a suction port 81a opening toward the top end surface 25b of the nozzle 25 located at the standby position; causing the cleaning part 40 that cleans the top end surface 25b of the nozzle 25 at the standby position through the cleaning liquid L2 to supply the cleaning liquid L2 toward the standby position to clean the nozzle 25 located at the standby position; and causing the suction part 80 to suck the cleaning liquid L2 supplied to the standby position by the cleaning part 40.

[0090] In the above-mentioned liquid processing apparatus 1 and liquid processing method, when the nozzle 25 is in the standby position, the suction unit sucks the processing liquid L1 and the processing liquid L1 is falsely ejected from the nozzle 25. When the processing liquid L1 is falsely ejected from the nozzle 25, the ejected processing liquid L1 may adhere to the top surface 25b of the nozzle 25. However, by sucking the processing liquid L1 by the suction unit 80, it is difficult for the processing liquid L1 to adhere to the top surface 25b. Therefore, it is possible to suppress the processing liquid L1 from adhering to the top surface 25b of the nozzle 25 due to false ejection. When the processing liquid L1 adheres to the top surface 25b due to false ejection, the supply amount of the processing liquid L1 increases at the time when the processing liquid L1 starts to be ejected from the nozzle 25 toward the wafer W. In this case, the processing performed by the processing liquid L1 will produce deviations within the surface of the wafer W. However, in the above-mentioned structure, since the adhesion of the processing liquid L1 to the top surface 25b can be suppressed, the surface uniformity of the wafer W in the liquid processing performed by the processing liquid L1 can be improved.

[0091] Furthermore, when cleaning liquid L2 is used to clean tip surface 25b of nozzle 25, cleaning liquid L2 used for cleaning is sucked in by suction unit 80, thereby removing any processing liquid L1 that was sucked in during the dummy discharge and remains within suction unit 80. Therefore, the suction effect of suction unit 80 can be maintained. Thus, the above-described liquid processing apparatus 1 and liquid processing method are effective in improving the in-plane uniformity of wafer W during liquid processing using processing liquid L1 discharged from nozzle 25.

[0092] In the above embodiment, the control device 100 further performs the following control: after the treatment liquid supply unit 20 stops discharging the treatment liquid L1 from the nozzle 25 in the standby position, the suction unit 80 stops sucking the treatment liquid L1 from the suction port 81a. In this case, suction through the suction port 81a continues even after the treatment liquid L1 is stopped from being ejected from the nozzle 25. Therefore, the treatment liquid L1 in the nozzle 25 rises compared to after the treatment liquid L1 is stopped. For example, by adjusting the time that the suction unit 80 continues sucking after the treatment liquid L1 is stopped, the position (lowest height position) of the treatment liquid L1 in the nozzle 25 can be adjusted.

[0093] In the above embodiment, the cleaning unit 40 includes a cleaning tank 51 positioned in a standby position, and a cleaning liquid supply unit 60 that supplies cleaning liquid L2 into the cleaning tank 51. The suction port 81a opens into the cleaning tank 51. The control device 100 controls the cleaning liquid supply unit 60 to supply cleaning liquid L2 into the cleaning tank 51 while the nozzle 25 is stored in the cleaning tank 51, and controls the suction unit 80 to suck the cleaning liquid L2 supplied into the cleaning tank 51 by the cleaning liquid supply unit 60. In this case, while the nozzle 25 is stored in the cleaning tank 51, the cleaning liquid L2 is supplied into the cleaning tank 51, thereby accumulating within the cleaning tank 51. Therefore, since the tip surface 25b of the nozzle 25 remains submerged in the cleaning liquid L2, any processing liquid L1 adhering to the tip surface 25b can be more reliably removed. Furthermore, by sucking the cleaning liquid L2 stored in the cleaning tank 51 by the suction portion 80 , the cleaning liquid L2 can be efficiently fed to the suction port 81 a .

[0094] In the above embodiment, the suction portion 80 further includes a suction head 81 that protrudes relative to the bottom wall 51b of the cleaning tank 51. The suction port 81a opens on the upper surface of the suction head 81. Sometimes, after the nozzle 25 is cleaned, the cleaning liquid L2 remains on the bottom wall 51b in the cleaning tank 51. In this case, the cleaning liquid L2 after cleaning the nozzle 25 may adhere to the top surface 25b of the nozzle 25 through the suction port 81a. In the above structure, since the suction head 81 protrudes relative to the bottom wall 51b, the cleaning liquid L2 after cleaning the nozzle 25 is difficult to adhere to the suction port 81a. Therefore, it is possible to suppress the contamination of the top surface 25b of the nozzle 25 caused by the cleaning liquid L2 after cleaning the nozzle 25.

[0095] The cleaning section 40 also includes drain ports 53a and 54a disposed on the bottom wall 51b of the cleaning tank 51 for discharging the cleaning liquid L2 from the cleaning tank 51. The drain ports 53a and 54a are located around the suction head 81. The suction head 81 protrudes relative to the bottom wall 51b, so even if the suction section 80 performs suction, the cleaning liquid L2 tends to remain in the height difference formed by the top surface 81b of the suction head 81 and the bottom wall 51b. In the above structure, the cleaning liquid L2 remaining in the height difference is discharged via the drain ports 53a and 54a, thereby preventing the accumulation of the cleaning liquid L2 in the bottom wall 51b (height difference). Therefore, contamination of the top surface 25b of the nozzle 25 caused by the accumulation of the cleaning liquid L2 can be prevented.

[0096] The size of the liquid discharge ports 53a and 54a is larger than the suction port 81a. In this case, the cleaning liquid L2 after cleaning the nozzle 25 can be discharged from the liquid discharge ports 53a and 54a as soon as possible.

[0097] The diameter of the suction port 81a is 0.7 to 1.3 times the diameter of the discharge port 25a of the nozzle 25. If the diameter of the suction port 81a is too small relative to the diameter of the discharge port 25a, a portion of the treatment liquid L1 ejected from the discharge port 25a cannot be sucked by the suction unit 80, and the unsucked portion of the treatment liquid L1 may diffuse toward the top surface 25b surrounding the discharge port 25a. On the other hand, if the diameter of the suction port 81a is too large relative to the diameter of the discharge port 25a, the liquid column of treatment liquid L1 formed between the discharge port 25a and the suction port 81a during suction may expand to approximately the same diameter as the suction port 81a. As the liquid column expands (its cross-section increases), it may cause the treatment liquid to adhere to the top surface 25b surrounding the discharge port 25a. In the above configuration, since the diameter of the suction port 81a is neither too small nor too large relative to the diameter of the discharge port 25a, it is possible to prevent the treatment liquid L1 from adhering to the top surface 25b surrounding the discharge port 25a during false discharge.

[0098] Although the embodiment has been described above, the present disclosure is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit and scope of the present disclosure.

Claims

1. A liquid processing device, characterized in that: have: a treatment liquid supply portion having a nozzle for spraying the treatment liquid; a nozzle moving portion that moves the nozzle between a coating position for supplying the processing liquid toward a surface of a substrate and a standby position different from the coating position; a cleaning portion that supplies a cleaning liquid toward the standby position to clean the top surface of the nozzle located at the standby position with the cleaning liquid; a suction portion having a suction port opened toward the top end surface of the nozzle located at the standby position, the suction portion sucking the treatment liquid ejected from the nozzle located at the standby position and the cleaning liquid supplied to the standby position by the cleaning portion; as well as a control device for controlling the processing liquid supply unit, the nozzle moving unit, the suction unit, and the cleaning unit; The cleaning section comprises a cleaning tank which is arranged at the standby position. The suction portion further comprises a suction head, the suction head protruding relative to the bottom wall of the cleaning tank. The suction port opens on the upper surface of the suction head.

2. The liquid processing device according to claim 1, characterized in that After the processing liquid supply portion stops discharging the processing liquid from the nozzle located at the standby position, the suction portion stops sucking the processing liquid from the suction port.

3. The liquid processing device according to claim 1 or 2, characterized in that: The cleaning unit further includes a cleaning liquid supply unit that supplies the cleaning liquid into the cleaning tank. The cleaning liquid supply unit supplies the cleaning liquid into the cleaning tank in which the nozzle is housed; and The suction unit sucks the cleaning liquid supplied into the cleaning tank by the cleaning liquid supply unit.

4. The liquid processing device according to claim 1, characterized in that The cleaning portion further comprises a drain port, which is provided on the bottom wall of the cleaning tank and discharges the cleaning liquid out of the cleaning tank. The liquid discharge port is located around the suction head.

5. The liquid processing device according to claim 4, characterized in that The suction head protrudes toward the top end surface of the nozzle accommodated in the cleaning tank, The liquid discharge port is located on a lower surface of a step portion formed by the suction head and the bottom wall.

6. The liquid processing device according to claim 4 or 5, characterized in that: A plurality of the liquid discharge ports are provided, and the plurality of liquid discharge ports are provided at positions sandwiching the suction head.

7. The liquid processing device according to claim 4 or 5, characterized in that: A plurality of the liquid discharge ports are provided, and the plurality of liquid discharge ports are formed along a circumferential direction with the suction port as the center.

8. The liquid processing device according to claim 4 or 5, characterized in that: The size of the liquid discharge port is larger than that of the suction port.

9. The liquid processing device according to claim 1 or 2, characterized in that: The diameter of the suction port is 0.7 to 1.3 times the diameter of the discharge port of the nozzle.

10. The liquid processing device according to claim 1 or 2, characterized in that: When the nozzle is located in the standby position, the nozzle and the suction part are configured so that the center of the nozzle's ejection outlet is consistent with the center of the suction port of the suction part, and are close to each other to the extent that the processing liquid ejected from the nozzle does not spread to the top surface of the nozzle and is sucked by the suction port.

11. The liquid processing device according to claim 1 or 2, characterized in that: The cleaning unit further includes a gas supply unit configured to supply gas toward a lower end portion of the nozzle located at the standby position.

12. A liquid treatment method, characterized in that: include: moving a nozzle for ejecting the processing liquid included in the processing liquid supply portion between a coating position for supplying the processing liquid toward a surface of a substrate and a standby position different from the coating position; In a state where the nozzle is located at the standby position, causing the treatment liquid supply unit to spray the treatment liquid from the nozzle; The suction portion sucks the treatment liquid ejected from the nozzle located at the standby position, the suction portion having a suction port opened toward the tip end surface of the nozzle located at the standby position, causing a cleaning unit that cleans the top surface of the nozzle at the standby position with a cleaning liquid to supply the cleaning liquid toward the standby position to clean the nozzle at the standby position; as well as causing the suction unit to suck the cleaning liquid supplied to the standby position by the cleaning unit, The cleaning section comprises a cleaning tank which is arranged at the standby position. The suction portion further comprises a suction head, the suction head protruding relative to the bottom wall of the cleaning tank. The suction port opens on the upper surface of the suction head.

13. The liquid treatment method according to claim 12, characterized in that: The standby position is a position where the center of the nozzle's ejection port coincides with the center of the suction port and the nozzle and the suction portion are close enough that the processing liquid ejected from the nozzle does not spread to the top surface of the nozzle but is sucked into the suction port.

14. The liquid treatment method according to claim 12 or 13, characterized in that: After the cleaning liquid is supplied to the nozzle located at the standby position, gas is supplied toward the lower end portion of the nozzle while the nozzle is located at the standby position. 15 . A computer program product comprising a computer program, wherein when the computer program is executed by a processor, the computer program implements the liquid processing method according to claim 12 .

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