Wafer cleaning clamping device

Abstract

The present invention provides a wafer cleaning clamping device, which includes: a mounting head, a position adjustment plate and an angle adjustment assembly. The mounting head mounts the wafer. The position adjustment plate is connected to the mounting head, and the position adjustment plate is used to adjust the flushing position of the wafer relative to the flushing port. The angle adjustment assembly is connected to the position adjustment plate, and the angle adjustment assembly is used to adjust the flushing angle of the wafer relative to the flushing port. Since the mounting head can adjust the position of the mounting head relative to the flushing port through the position adjustment plate, and adjust the angle of the mounting head relative to the flushing port through the angle adjustment assembly, the wafer cleaning clamping device of the present application can realize rapid adjustment of the position and angle of the wafer relative to the flushing port, and ensure that the flushing port can always flush different types or sizes of wafers at the best angle and position, so that the wafer can achieve the best flushing effect, thereby reducing the wafer surface problems caused by flushing problems, and improving the wafer flushing efficiency and wafer surface quality.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing, and in particular to a wafer cleaning and clamping device. Background Art

[0002] Semiconductor materials such as GaAs, InP, Ge, GaP, SiC, GaN, etc., due to their unique electrical properties, are widely used in satellite communications, microwave devices, lasers and light-emitting diodes. The realization of these applications and the manufacture of devices are inseparable from high-quality substrates, and one of the keys is to provide a high-quality substrate surface.

[0003] At present, for the substrates of these semiconductor single crystals, one or both sides of the substrate are mirror polished, then cleaned with acid or alkali, rinsed with ultrapure water, and finally dried. Each step in the cleaning process is crucial, including the flushing of the wafer. If the angle is incorrect when flushing the wafer, or the position of the wafer and the flushing pipe is not properly adjusted when flushing, it may lead to incomplete flushing of the wafer surface, thus affecting the quality of the wafer surface. Summary of the invention

[0004] In view of the problems existing in the background technology, the purpose of the present invention is to provide a chip cleaning clamping device, which is convenient for adjusting the angle and position of the chip relative to the flushing port, so as to achieve the best flushing effect, thereby reducing chip surface problems caused by flushing problems.

[0005] In order to achieve the above-mentioned purpose, the present invention provides a wafer cleaning clamping device, which comprises: a mounting head, a position adjustment plate and an angle adjustment assembly. The mounting head is used to mount the wafer to be cleaned so that the flushing port can flush the wafer. The position adjustment plate is connected to the mounting head, and the position adjustment plate is used to adjust the flushing position of the wafer on the mounting head relative to the flushing port. The angle adjustment assembly is connected to the position adjustment plate, and the angle adjustment assembly is used to adjust the flushing angle of the wafer on the mounting head relative to the flushing port.

[0006] In a wafer cleaning clamping device according to some embodiments, the mounting head includes a connecting plate and a suspension beam, the connecting plate is connected to a position adjustment plate, and the suspension beam is fixed to the connecting plate and is used to suspend the wafer to be cleaned.

[0007] In the wafer cleaning clamping device according to some embodiments, the mounting head is further provided with a first connecting hole and a first fixing hole, and the position adjustment plate is provided with a second connecting hole and a guide groove. The mounting head is rotatably connected to the position adjustment plate through the first connecting hole and the second connecting hole, and the first fixing hole is arranged facing the guide groove and can be selectively fixedly connected to the corresponding position of the guide groove.

[0008] In the wafer cleaning clamping device according to some embodiments, the guide groove of the position adjustment plate is formed as an arc-shaped structure.

[0009] In a wafer cleaning clamping device according to some embodiments, the angle adjustment assembly includes a positioning plate and an angle adjustment plate, one end of the angle adjustment plate is rotatably connected to the positioning plate, and the other end can be selectively fixedly installed at a corresponding position on the positioning plate.

[0010] In the wafer cleaning clamping device according to some embodiments, the positioning plate is provided with a second mounting hole and a plurality of first positioning holes, and the plurality of first positioning holes are arranged at intervals and arranged in an arc shape. The one end of the angle adjustment plate is rotatably connected to the positioning plate through the second mounting hole, and the other end can be selectively fixedly installed in the corresponding first positioning hole.

[0011] In the wafer cleaning clamping device according to some embodiments, the one end of the angle adjustment plate is provided with a third mounting hole, and the other end is provided with a fixing groove. The one end of the angle adjustment plate is rotatably connected to the positioning plate through the third mounting hole and the second mounting hole, and the other end is fixedly connected to the positioning plate through the fixing groove and the corresponding first positioning hole.

[0012] In a wafer cleaning clamping device according to some embodiments, for two adjacent first positioning holes, an angle between a line connecting one first positioning hole and the second mounting hole and a line connecting the other first positioning hole and the second mounting hole is θ, and 1°≤θ≤5°.

[0013] In the wafer cleaning clamping device according to some embodiments, the positioning plate is further provided with a plurality of second positioning holes, and the plurality of second positioning holes are spaced apart and arranged in an arc shape and are located inside the arc shape formed by the plurality of first positioning holes.

[0014] In the wafer cleaning clamping device according to some embodiments, the angle adjustment plate is further provided with a positioning groove, the position adjustment plate is further provided with a matching groove, and the matching groove of the position adjustment plate can be selectively fixedly connected with the corresponding position of the positioning groove of the angle adjustment plate.

[0015] The beneficial effects of the present invention are as follows:

[0016] In the wafer cleaning clamping device of the present application, since the mounting head can adjust the position of the mounting head relative to the flushing port through the position adjustment plate and adjust the angle of the mounting head relative to the flushing port through the angle adjustment component, the wafer cleaning clamping device of the present application can realize rapid adjustment of the position and angle of the wafer relative to the flushing port, and ensure that the flushing port can always flush wafers of different types or sizes at the optimal angle and position, so that the wafer can achieve the best flushing effect, thereby reducing wafer surface problems caused by flushing problems and improving wafer flushing efficiency and wafer surface quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional view of the wafer cleaning clamping device of the present invention.

[0018] Figure 2 yes Figure 1 A three-dimensional view of the connecting plate of the mounting head.

[0019] Figure 3 yes Figure 1 A three-dimensional view of the position adjustment plate in FIG.

[0020] Figure 4 yes Figure 1 A perspective view of the angle adjustment assembly in FIG.

[0021] Figure 5 yes Figure 4 A three-dimensional view of the positioning plate in FIG.

[0022] Figure 6 yes Figure 4 A perspective view of the angle adjustment plate.

[0023] The reference numerals are described as follows:

[0024] 1 Mounting head 312 first positioning hole

[0025] 11 Connecting plate 313 second positioning hole

[0026] 12 suspension beam 32 angle adjustment plate

[0027] 2 Position adjustment plate 321 main body

[0028] 21 first guide groove 321A first mounting groove

[0029] 22 second guide groove 322 extension portion

[0030] 3 Angle adjustment assembly 322A second mounting slot

[0031] 31 Positioning plate Z up and down direction

[0032] 311 connection hole DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field of this application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned figures are used to distinguish different objects, not to describe a specific order or a primary and secondary relationship. "Multiple" appearing in this application refers to more than two (including two).

[0035] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0036] The wafer cleaning clamping device according to the present application is described in detail below with reference to the accompanying drawings.

[0037] Reference Figures 1 to 6 The wafer cleaning clamping device of the present application comprises a mounting head 1, a position adjustment plate 2 and an angle adjustment assembly 3. The wafer to be cleaned can be clamped by a clamping clamp and then hung on the mounting head 1.

[0038] In the chip cleaning clamping device of the present application, since the mounting head 1 can adjust the position of the mounting head 1 relative to the flushing port through the position adjustment plate 2 and adjust the angle of the mounting head 1 relative to the flushing port through the angle adjustment component 3, the chip cleaning clamping device of the present application can realize rapid adjustment of the position and angle of the chip relative to the flushing port, and ensure that the flushing port can always flush different types or sizes of chips at the best angle and position, so that the chip can achieve the best flushing effect, thereby reducing chip surface problems caused by flushing problems and improving chip flushing efficiency and chip surface quality.

[0039] In some embodiments, reference Figure 1 and Figure 2 , the mounting head 1 may include a connecting plate 11 and a suspension beam 12. The connecting plate 11 is connected to the position adjustment plate 2 so that the mounting head 1 can rotate relative to the position adjustment plate 2. The suspension beam 12 is fixed to the connecting plate 11 and is used to suspend the wafer to be cleaned. Specifically, the suspension beam 12 may be a connecting pin.

[0040] In some embodiments, reference Figure 1 and Figure 2 The connecting plate 11 may be formed into a U-shaped structure and provided with two opposite first mounting holes 11A, and the suspension beam 12 is fixedly mounted on the connecting plate 11 through the two opposite first mounting holes 11A.

[0041] In some embodiments, reference Figure 2 , the mounting head 1 is also provided with a first connection hole 11B and a first fixing hole 11C. The mounting head 1 is rotatably connected to the position adjustment plate 2 through the first connection hole 11B. When the mounting head 1 is rotated to the desired position through the first connection hole 11B, the mounting head 1 is fixed to the position adjustment plate 2 through the first fixing hole 11C, and then the water flushing port flushes the wafer on the mounting head 1. It should be noted that based on the setting of the first fixing hole 11C, the mounting head 1 remains fixed during the process of flushing the wafer on the mounting head 1 by the water flushing port, thereby ensuring the stability of the wafer during the flushing process.

[0042] Reference Figure 1 and Figure 3 The position adjustment plate 2 is connected to the mounting head 1. By adjusting the position of the position adjustment plate 2, the flushing position of the wafer on the mounting head 1 relative to the flushing port can be adjusted.

[0043] In some embodiments, reference Figure 1 and Figure 3 The position adjustment plate 2 is provided with a second connection hole 21, and the second connection hole 21 corresponds to the first connection hole 11B of the mounting head 1 in the axial direction of the hole, so that the position adjustment plate 2 is rotatably connected to the mounting head 1 through the second connection hole 21 and the first connection hole 11B.

[0044] In some embodiments, reference Figure 1 and Figure 3 , the position adjustment plate 2 is also provided with a guide groove 22. The first fixing hole 11C of the mounting head 1 is arranged facing the guide groove 22 and can be selectively fixedly connected with the corresponding position of the guide groove 21. It should be noted here that "the first fixing hole 11C can be selectively fixedly connected with the corresponding position of the guide groove 21" means that: the mounting head 1 can rotate relative to the guide groove 21 of the position adjustment plate 2. When the mounting head 1 rotates to the desired position, the mounting head 1 is fixedly connected with the guide groove 22 corresponding to the first fixing hole 11C through the first fixing hole 11C (such as bolt connection), thereby realizing the adjustment of the flushing angle of the wafer on the mounting head 1 by the mounting head 1 itself.

[0045] Here, adjusting the angle of the mounting head 1 relative to the flushing port by adjusting the angle adjustment component 3 is equivalent to a coarse adjustment of the wafer flushing angle, and further adjusting the wafer flushing angle by adjusting the angle of the mounting head 1 relative to the position adjustment plate 2 is equivalent to a fine adjustment of the wafer flushing angle. This combination of coarse adjustment and fine adjustment can ensure that the wafer is always flushed at the optimal angle, thereby greatly improving the wafer flushing effect.

[0046] In some embodiments, reference Figure 3 The guide groove 22 of the position adjustment plate 2 can be formed into an arc structure. The arc size of the arc structure represents the maximum angle that the mounting head 1 can rotate relative to the position adjustment plate 2, so the arc size of the arc structure can be set according to actual conditions.

[0047] In some embodiments, reference Figure 3 The position adjustment plate 2 is also provided with a matching groove 23. The position adjustment plate 2 can move relative to the angle adjustment assembly 3 along the vertical direction Z through the matching groove 23 to adjust the flushing position of the wafer on the mounting head 1 relative to the flushing port in the vertical direction Z.

[0048] Reference Figure 1 as well as Figures 4 to 6 The angle adjustment component 3 is connected to the position adjustment plate 2, and the position adjustment plate 2 is connected to the mounting head 1. By adjusting the position of the angle adjustment component 3, the flushing angle of the wafer on the mounting head 1 relative to the flushing port can be adjusted.

[0049] In some embodiments, reference Figure 4 , the angle adjustment assembly 3 may include a positioning plate 31 and an angle adjustment plate 32. One end of the angle adjustment plate 32 is rotatably connected to the positioning plate 31, and the other end can be selectively fixedly installed at a corresponding position on the positioning plate 31. It should be noted here that "the other end of the angle adjustment plate 32 can be selectively fixedly installed at a corresponding position on the positioning plate 31" means that the angle adjustment plate 32 can rotate relative to the positioning plate 31, and when the angle adjustment plate 32 rotates to the desired position, the angle adjustment plate 32 is fixedly installed at the corresponding position of the positioning plate 31, thereby realizing the angle adjustment assembly 3 to adjust the flushing angle of the wafer on the mounting head 1 (i.e., the coarse adjustment of the flushing angle as described above).

[0050] In some embodiments, reference Figure 4 and Figure 5 The positioning plate 31 is provided with a second mounting hole 311 and a plurality of first positioning holes 312. The plurality of first positioning holes 312 are arranged at intervals and arranged in an arc shape. One end of the angle adjustment plate 32 is rotatably connected to the positioning plate 31 through the second mounting hole 311, and the other end can be selectively fixedly installed in the corresponding first positioning hole 312.

[0051] It should be noted that the size of the arc formed by the plurality of first positioning holes 312 indicates the maximum angle at which the angle adjustment plate 32 can rotate relative to the positioning plate 31, and the size of the arc formed by the plurality of first positioning holes 312 is determined by the number of first positioning holes 312 and the spacing between adjacent first positioning holes 312. Therefore, in order to ensure the adjustment range, the number of first positioning holes 312 and the spacing between adjacent first positioning holes 312 can be reasonably set according to actual conditions.

[0052] In some embodiments, the plurality of first positioning holes 312 may be arranged at equal intervals.

[0053] In some embodiments, for two adjacent first positioning holes 312, the angle between the line connecting one first positioning hole 312 and the second mounting hole 311 and the line connecting the other first positioning hole 312 and the second mounting hole 311 is θ (in other words, the spacing between adjacent first positioning holes 312 is θ), and in order to ensure the angle adjustment accuracy, it is preferably 1°≤θ≤5°.

[0054] In some embodiments, when θ=1°, if the flushing angle is selected to be 15°, 15 first positioning holes 312 are directly counted on the positioning plate 31, and the angle adjustment plate 32 is fixed on the 15th first positioning hole 312 of the positioning plate 31. After the position of the angle adjustment component 3 is fixed, the position of the wafer relative to the flushing port can be adjusted by the position adjustment plate 2, and at the same time, the position of the mounting head 1 relative to the position adjustment plate 2 can be adjusted to adjust the wafer to the optimal flushing position.

[0055] In some embodiments, reference Figure 4 and Figure 6 , the one end of the angle adjustment plate 32 is provided with a third mounting hole 321, and the other end is provided with a fixing slot 322. The one end of the angle adjustment plate 32 is rotatably connected to the positioning plate 31 through the third mounting hole 321 and the second mounting hole 311 of the positioning plate 31 (such as a pin connection), and the other end is fixedly connected to the positioning plate 31 through the fixing slot 322 and the corresponding first positioning hole 312.

[0056] During the adjustment process of the angle adjustment component 3, first, one end of the angle adjustment plate 32 is rotated to the desired position through the third mounting hole 321 and the second mounting hole 311 of the positioning plate 31, and then the other end of the angle adjustment plate 32 is fixed to the positioning plate 31 through the fixing groove 322 and the corresponding first positioning hole 312 of the positioning plate 31, thereby realizing the flushing angle adjustment of the chip on the mounting head 1 by the angle adjustment component 3.

[0057] In some embodiments, reference Figure 4 and Figure 5The positioning plate 31 is also provided with a plurality of second positioning holes 313, and the plurality of second positioning holes 313 are arranged at intervals and arranged in an arc shape and are located inside the arc shape formed by the plurality of first positioning holes 312. The arrangement of the plurality of second positioning holes 313 is consistent with the arrangement of the plurality of first positioning holes 312.

[0058] When the angle adjustment plate 32 is rotated to a desired position, the fixing groove 322 of the angle adjustment plate 32 is fixedly mounted on the positioning plate 31 (e.g., bolted) through the corresponding first positioning hole 312 and the corresponding second positioning hole 313. Since the second positioning hole 313 and the first positioning hole 312 are used together to fix the angle adjustment plate 32 to the positioning plate 31, the connection reliability between the angle adjustment plate 32 and the positioning plate 31 is improved.

[0059] In some embodiments, reference Figure 4 and Figure 5 The positioning plate 31 is further provided with a plurality of third positioning holes 314, and the plurality of third positioning holes 314 are arranged at intervals and arranged in an arc shape and are located inside the arc shape formed by the plurality of second positioning holes 313. The arrangement of the plurality of third positioning holes 314 is consistent with the arrangement of the plurality of second positioning holes 313.

[0060] When the angle adjustment plate 32 is rotated to a desired position, the fixing groove 322 of the angle adjustment plate 32 is fixedly mounted on the positioning plate 31 through the corresponding first positioning hole 312, the corresponding second positioning hole 313, and the corresponding third positioning hole 314. Since the second positioning hole 313, the first positioning hole 312, and the third positioning hole 314 are used together to fix the angle adjustment plate 32 to the positioning plate 31, the connection reliability between the angle adjustment plate 32 and the positioning plate 31 is further improved.

[0061] In some embodiments, reference Figure 4 and Figure 6 , the angle adjustment plate 32 can be formed into an L-shaped structure.

[0062] In some embodiments, reference Figure 4 and Figure 6, the angle adjustment plate 32 is also provided with a positioning groove 323. Among them, the matching groove 23 of the position adjustment plate 2 can be selectively fixedly connected with the corresponding position of the positioning groove 323 of the angle adjustment plate 32 (such as bolt connection). It should be noted here that "the matching groove 23 can be selectively fixedly connected with the corresponding position of the positioning groove 323 of the angle adjustment plate 32" means that: the position adjustment plate 2 can move along the up and down direction Z relative to the angle adjustment plate 32. When the position adjustment plate 2 moves to the desired position, the position adjustment plate 2 is fixed to the corresponding position of the positioning groove 323 of the angle adjustment plate 32 through the matching groove 23, thereby realizing the flushing position adjustment of the wafer on the mounting head 1 by the position adjustment plate 2.

[0063] Finally, it should be noted that the flushing angle (or the angle of the chip relative to the flushing port) mentioned above means: when the position of the fixed flushing port remains unchanged, the chip is erected and perpendicular to the horizontal direction as the reference plane, the flushing port flushes water perpendicular to the chip surface, and the angle of the chip rotating clockwise is the flushing angle when the chip is flushed. When it comes to chips of different types or sizes, the commonly used flushing angles are generally 15°, 20°, 30°, 40°, and 55°. Each time a different chip is replaced for cleaning, the angle and position of the chip need to be readjusted. When the chip cleaning clamping device of the present application is used for flushing, based on the connection and matching relationship between the mounting head 1, the position adjustment plate 2 and the angle adjustment component 3, the angle and position of the chip on the mounting head 1 relative to the flushing port can be quickly adjusted to achieve the best flushing effect, thereby improving the flushing efficiency and flushing effect, and then improving the surface quality of the chip.

Claims

1. A wafer cleaning and clamping device, characterized in that: It comprises a mounting head (1), a position adjustment plate (2) and an angle adjustment component (3); The mounting head (1) is used to mount the wafer to be cleaned so that the flushing port can flush the wafer; The position adjustment plate (2) is connected to the mounting head (1), and the position adjustment plate (2) is used to adjust the flushing position of the wafer on the mounting head (1) relative to the flushing port; The angle adjustment component (3) is connected to the position adjustment plate (2), and the angle adjustment component (3) is used to adjust the flushing angle of the wafer on the mounting head (1) relative to the flushing port; The flushing angle refers to: when the position of the fixed flushing port remains unchanged, the wafer is erected and perpendicular to the horizontal direction as the reference plane, the flushing port flushes water perpendicular to the wafer surface, and the angle of the wafer rotating clockwise is the flushing angle of the wafer when flushing; The mounting head (1) is further provided with a first connecting hole (11B) and a first fixing hole (11C), and the position adjustment plate (2) is provided with a second connecting hole (21) and a guide groove (22); The mounting head (1) is rotatably connected to the position adjustment plate (2) via a first connection hole (11B) and a second connection hole (21), and the first fixing hole (11C) is arranged facing the guide groove (22) and can be selectively fixedly connected to a corresponding position of the guide groove (22); The angle adjustment assembly (3) comprises a positioning plate (31) and an angle adjustment plate (32), wherein one end of the angle adjustment plate (32) is rotatably connected to the positioning plate (31) and the other end of the angle adjustment plate (32) is selectively fixedly mounted at a corresponding position on the positioning plate (31); The positioning plate (31) is provided with a second mounting hole (311) and a plurality of first positioning holes (312), and the plurality of first positioning holes (312) are arranged at intervals and in an arc shape; The one end of the angle adjustment plate (32) is rotatably connected to the positioning plate (31) via the second mounting hole (311), and the other end can be selectively fixedly mounted in the corresponding first positioning hole (312).

2. The wafer cleaning and clamping device according to claim 1, characterized in that: The mounting head (1) comprises a connecting plate (11) and a suspension beam (12); the connecting plate (11) is connected to the position adjustment plate (2); the suspension beam (12) is fixed to the connecting plate (11) and is used to suspend a wafer to be cleaned.

3. The wafer cleaning and clamping device according to claim 1, characterized in that: The guide groove (22) of the position adjustment plate (2) is formed into an arc-shaped structure.

4. The wafer cleaning and clamping device according to claim 1, characterized in that: The one end of the angle adjustment plate (32) is provided with a third mounting hole (321), and the other end is provided with a fixing groove (322); One end of the angle adjustment plate (32) is rotatably connected to the positioning plate (31) via the third mounting hole (321) and the second mounting hole (311), and the other end is fixedly connected to the positioning plate (31) via the fixing groove (322) and the corresponding first positioning hole (312).

5. The wafer cleaning and clamping device according to claim 1, characterized in that: For two adjacent first positioning holes (312), the angle between a line connecting one of the first positioning holes (312) and the second mounting hole (311) and a line connecting the other first positioning hole (312) and the second mounting hole (311) is θ, and 1°≤θ≤5°.

6. The wafer cleaning and clamping device according to claim 1, characterized in that: The positioning plate (31) is further provided with a plurality of second positioning holes (313), and the plurality of second positioning holes (313) are arranged at intervals and in an arc shape and are located inside the arc shape formed by the plurality of first positioning holes (312).

7. The wafer cleaning and clamping device according to claim 1, characterized in that: The angle adjustment plate (32) is further provided with a positioning groove (323), and the position adjustment plate (2) is further provided with a matching groove (23), and the matching groove (23) of the position adjustment plate (2) can be selectively fixedly connected to a corresponding position of the positioning groove (323) of the angle adjustment plate (32).

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