Method for producing a component carrier and component carrier

Abstract

The invention relates to a method for manufacturing a component carrier (100), wherein the method comprises: performing a test on each of a plurality of sections (102, 140) of a component carrier structure (104); inserting at least one functional component (110) into each of a plurality of sections (108) of a further component carrier structure (106) to be connected to the component carrier structure (104), so that each of a plurality of sections (108) assigned to a further component carrier structure (106) which successfully passes the test is provided with at least one functional component (110); and inserting at least one functionally invalid dummy component (112) into each of a plurality of sections (108) assigned to a further component carrier structure (106) which fails the test. The invention also relates to a computer-readable medium, a program element for manufacturing a component carrier, a semi-finished product obtainable during the manufacture of a component carrier, and a component carrier.

Description

Technical Field

[0001] The invention relates to a method for producing a component carrier, a semi-finished product, a component carrier, a computer-readable medium and a program element. Background Art

[0002] With the growth of product functionality of component carriers equipped with one or more electronic components and the increasing miniaturization of such electronic components and the increasing number of electronic components to be mounted on component carriers such as printed circuit boards, increasingly powerful array-like components or packages with several electronic components are used, which have a plurality of contacts or connections with increasingly smaller spacings between these contacts. Removing the heat generated by such electronic components and the component carriers themselves during operation is becoming an increasingly prominent problem. At the same time, the component carriers should be mechanically robust and electrically reliable in order to be able to operate even under harsh conditions.

[0003] Furthermore, yield loss in the manufacture of component carriers including embedded components is a problem. This is particularly important when valuable components, such as microprocessor chips, are electrically connected to other components of the component carrier.

[0004] US2009 / 229862 A1 discloses that a plurality of double-sided boards using films are attached to each other through a paste coupling layer sandwiched therebetween. In the paste coupling layer, a conductive paste is filled into a through hole formed in a temporarily hardened resin, which is hardened. At the same time, the second wirings are electrically coupled to each other by using the hardened conductive paste filled in the through hole pre-formed in the paste coupling layer. Summary of the invention

[0005] The object of the invention is to embed components in a component carrier reliably with a high production volume.

[0006] In order to achieve the above-mentioned object, a method for manufacturing a component carrier, a semi-finished product and a component carrier according to the present invention are provided.

[0007] According to an exemplary embodiment of the present invention, a method for manufacturing a component carrier is provided, wherein the method comprises: performing a test on each of a plurality of sections of a component carrier structure; inserting at least one functional component into each of additional sections of an additional component carrier structure to be connected to the component carrier structure, such that each of the additional sections assigned to the corresponding sections that successfully passed the test is provided with at least one functional component; and inserting at least one functionally invalid dummy component into each of the additional sections assigned to the corresponding sections that failed the test.

[0008] According to another exemplary embodiment of the present invention, a semi-finished product obtainable or obtained in a process of manufacturing a component carrier is provided, wherein the semi-finished product comprises: a component carrier structure, the component carrier structure comprising a plurality of functional sections and at least one non-functional section; a further component carrier structure, the further component carrier structure being connected to the component carrier structure and comprising a plurality of further sections; functional components, each of the functional components being inserted into a corresponding one of the further sections, so that each further section assigned to the corresponding functional section is provided with at least one of the functional components; and at least one functionally invalid dummy component, the at least one functionally invalid dummy component being inserted into a corresponding one of the further sections, so that each further section assigned to the corresponding non-functional section is provided with at least one dummy component.

[0009] According to another exemplary embodiment of the present invention, a component carrier is provided, wherein the component carrier comprises: a component carrier section; a further component carrier section; a functional component embedded in the further component carrier section; and an additively manufactured (in particular printed) connecting structure, by which the component carrier section and the further component carrier section are connected.

[0010] According to another exemplary embodiment of the present invention, a method for manufacturing a component carrier is provided, wherein the method comprises: providing a component carrier section of a component carrier structure and another component carrier section of another component carrier structure separated from the component carrier structure; embedding a functional component in the other component carrier section; forming a connecting structure on at least one of the component carrier section and the other component carrier section by additive manufacturing (particularly printing); and connecting the component carrier structure with the other component carrier structure, so that the component carrier section and the other component carrier section are connected by the additively manufactured (particularly printed) connecting structure.

[0011] According to a further exemplary embodiment of the present invention, a program element (eg a software program, source code or executable code) is provided, which, when executed by a processor (eg a microprocessor or a CPU), is suitable for controlling or implementing a method having the above-mentioned features.

[0012] According to a further exemplary embodiment of the invention, a computer-readable medium (e.g. a CD, a DVD, a USB stick, an SD card, a floppy disk or a hard disk, or any other (especially also smaller) storage medium) is provided, in which a computer program is stored, which, when executed by a processor (e.g. a microprocessor or a CPU), is suitable for controlling or implementing a method having the above-mentioned features.

[0013] The data processing that can be performed according to embodiments of the present invention can be realized by a computer program, ie by software, or by using one or more special electronic optimized circuits, ie in hardware or in a hybrid form, ie by means of software components and hardware components.

[0014] In the context of the present application, the term "component carrier" may particularly denote any supporting structure on which and / or in which one or more components can be accommodated to provide mechanical support and / or electrical connection. In other words, the component carrier may be configured as a mechanical carrier and / or an electronic carrier for the components. In particular, the component carrier may be one of a printed circuit board, an organic interposer and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board combining different component carriers of the above-mentioned types of component carriers.

[0015] In the context of the present application, the term "component-carrier structure" may in particular denote a preform that is a part of a plurality of component carriers obtained during the manufacture of a component carrier. For example, a component-carrier structure may be a panel that as a whole comprises a plurality of preforms of a component carrier currently being manufactured. It is also possible to divide such a panel into a plurality of arrays (for example into four quarter panels), wherein each array comprises a plurality of preforms of a component carrier currently being manufactured. Such a panel or array may be a stack of a plurality of electrically conductive layer structures and / or electrically insulating layer structures, which may or may not have cavities and may or may not be fully cured or at least partially uncured. A component-carrier structure may in particular be any body (in particular a stack of layers) that may be used during the manufacture of a component carrier and may form a part of an easily manufactured component carrier or of a plurality of easily manufactured component carriers.

[0016] In the context of the present application, the term "assigned" sections of the component carrier structure to be connected can particularly mean that the assigned sections are spatially assigned to face each other in the semi-finished product consisting of the component carrier structure. After singulation of the semi-finished product, the corresponding functionally active or inactive component carrier can include the assigned sections.

[0017] In the context of the present application, the term "testing" of a segment of a component-carrier structure may particularly denote a functional test of the respective segment. Such a test may be an electrical test in which at least one electrical stimulus signal is applied to the electrically conductive layer structure of the segment and at least one electrical response signal is detected which indicates whether the segment is electrically functional. However, the test may additionally or alternatively be a mechanical test which tests the robustness, warping properties, etc. of the segment. A visual inspection is also possible.

[0018] In the context of the present application, the term "connecting structure" may particularly denote any medium which is able to connect different component-carrier structures to one another in order to obtain a common, integrated body.

[0019] In the context of the present application, the term "component" may particularly denote any body embedded or surface mounted in a layer stack, a component carrier structure or a component carrier, in particular a body having electronic and / or thermal and / or mechanical functions. In particular, the component may be of non-layer type, i.e., may not be as flat as the layer structure forming the stack. For example, the component may extend vertically on the multilayer structure of the stack. In an embodiment, the component may be made of a material that at least partially deviates from the component carrier material. For example, the component may be a semiconductor chip.

[0020] In the context of the present application, the term "functional component" may particularly denote a component that is able to realize a specific, in particular electronic or thermal function. For example, such a functional component may be a semiconductor chip that realizes a certain electronic function. Furthermore, the functional component may be a semiconductor package, i.e. a bare chip encapsulated in an epoxy molding compound, which realizes a certain electronic function. However, for cooling purposes, the functional component may also be a copper block. For example, the functional component may have successfully passed a functional test, during which it has been successfully tested whether the functional component is complete and is therefore able to provide the assigned function.

[0021] In the context of the present application, the term "dummy component" may particularly denote a physical body that has no function with respect to a component carrier. Therefore, such a dummy component may be merely a placeholder for a cavity or recess that fills a component carrier structure to avoid problems that may occur during processing (particularly lamination) if the cavity cannot be filled with a functional component or a dummy component. However, a dummy component may not provide any function, or at least may not provide the function provided by a functional component. For example, a dummy component may be a functionally invalid body (e.g., plastic or silicon) in a semi-finished product or a component carrier that is easy to manufacture. In particular, a dummy component may not provide any electrical function. For example, a dummy component may simply simulate the shape of a functional component. In other words, the shape and size of a dummy component may be determined as a functional component, but the function of a functional component is not provided. A dummy component may also be a non-functional component, i.e., a component that failed to pass a functional test before being inserted into a cavity of another component carrier structure.

[0022] In the context of the present application, the term "known good" may particularly mean that a structure (e.g. a stack, a chamber, a component or a component carrier) considered for the manufacture of a component carrier or a system of component carriers has previously, i.e. before use, the corresponding components have been installed or assembled, and have passed a test regarding its qualification to contribute to the formation of a trouble-free component carrier or system, and therefore the test has been successfully passed. In particular, such a test may be a quality test to test this qualification. The quality test may test whether the corresponding structure meets predetermined specifications, whether it is within a predetermined tolerance range and / or whether it meets predetermined functional requirements. Such a quality test may be an electrical test, which may, for example, include applying an electrical stimulus signal and measuring an electrical response signal that must meet certain conditions to consider that the corresponding structure has passed the test. Additionally or alternatively, such a test may also be an inspection (e.g. an optical inspection) of measuring the shape and / or size of the corresponding structure as at least part of the test. In one embodiment, a structure tested individually is classified as a "known good" structure only if it passes the test, while if the structure fails the test, it may be classified as an "unknown good" structure. In the event of failure of such a test, the corresponding structure may, for example, be disposed of as scrap, or may be subjected to a repair or reprocessing procedure, or may be used for other purposes.

[0023] In the context of the present application, the term "layer stack" can particularly represent a stack of multiple planar layer structures connected to each other. In particular, such a layer structure can be an electrically insulating layer structure and / or a conductive layer structure. The term "layer structure" can particularly represent one of a continuous layer, a patterned layer, and a plurality of connected and / or unconnected islands in a plane. For example, such a layer structure can be a continuous foil or sheet, and such a foil or sheet can also be patterned. The layer structure or stack as a whole can include a component carrier material, that is, a material for a conductive structure or an electrically insulating structure of a component carrier such as a printed circuit board or an IC substrate. The individual layer structures of the stack can be connected in particular by lamination, i.e. applying heat and / or pressure.

[0024] In the context of the present application, the term "additive manufacturing" may particularly denote a manufacturing process for a connection structure, according to which the connection structure is manufactured by adding materials constituting the connection structure, in particular sequential addition of partial materials. Additive manufacturing may particularly include printing, more particularly three-dimensional printing. By means of additive manufacturing, the connection structure may be applied, for example, in the form of a paste.

[0025] According to an exemplary embodiment of the present invention, a high-throughput manufacturing method for a multilayer component carrier with embedded components is provided, wherein a component carrier structure is connected to a further component carrier structure. Advantageously, the functional component can be inserted only in a section of the further component carrier structure, which section is to be connected to a known good section of the component carrier structure. In other words, before the functional component is inserted into the cavity of the further section of the further component carrier structure for connection with a section of the component carrier structure, a successful test indicating that the section of the component carrier structure works properly has been completed. By taking such measures, it can be ensured that the functional components, which are in many cases very expensive, are only used for these other sections of the semi-finished product in the form of connected component carrier structures, wherein the mating section is also known to be good. However, in order to ensure that the component carrier structure is processed without reliability problems, the cavity in the further section of the further component carrier structure corresponding to or assigned to the section of the component carrier structure that failed the test is also filled with a dummy component that simulates the corresponding functional component without having to perform the function of the functional component. In other words, by filling these cavities with non-functional dummy components, a suitable quality of the semi-finished product can be ensured, thereby ensuring a suitable mechanical integrity of even such ineffective parts of the semi-finished product. This is due to the fact that the presence of dummy components (in contrast to empty voids or cavities) provides a uniform structure for the component carrier structure and avoids undesirable phenomena such as warping. By suppressing such undesirable phenomena, the reliability of the manufactured component carrier can be increased. By taking this measure, a high yield of functionally valid component carriers singulated from the semi-finished product can be synergistically combined with suitable processing properties of the semi-finished product during the manufacturing process.

[0026] Thus, the gist of an exemplary embodiment of the invention may be to reassemble in the z-direction a fully tested circuit board (as a first component carrier structure) with an embedded core circuit board (as a second component carrier structure), the embedded core circuit board having known good components placed according to known good component carrier sections of the first component carrier structure. In particular, the use of a fully tested core in combination with a fully tested PCB may enable high yields. By taking such measures, a final die (bare chip) embedding technology may be provided which allows particularly significant advantages in the case of final assembly fan-out or formation of redistribution layers. In particular, the combination of a z-interconnect method and a layer with embedded components may be advantageous in order to match known good component carrier sections with known good components. Combining pre-tested electronic modules, such as HDI (high density integration) and embedded cores, may bring significant advantages in terms of higher yields and therefore costs.

[0027] In a preferred embodiment, the dielectric layer of the connection structure for the z-interconnect can be formed by additive manufacturing, in particular can be printed (e.g. screen printing, inkjet printing, etc.). In such a printing process, openings (e.g. via-shaped openings) can be formed, wherein the conductive layer can be printed / dispensed or formed by another additive manufacturing process. In particular, one or more printed dielectric sheets with openings as vias for the z-interconnect can be provided, wherein the conductive layer can be printed and / or dispensed. However, other additive manufacturing processes can also be used to form the connection structure or a part thereof.

[0028] Detailed Description of Exemplary Embodiments

[0029] In the following, further exemplary embodiments of a method, a semi-finished product, a component carrier, a computer-readable medium and a program element will be explained.

[0030] In particular, with reference to computer-readable media and program elements, corresponding software can provide traceability and data analysis functions to implement the method according to an exemplary embodiment of the present invention and the communication between the machines involved. The assembly of components, the manufacture of component carrier structures with functional components, etc. can be processed by referring to stored (especially emap, etest, imaging, testing and / or other) data. Then known good components and / or dummy parts can be selected accordingly. In particular, as at least part of the above-mentioned tests, such software can also control or implement the measurement of the shape and / or size of the corresponding structure.

[0031] In particular, exemplary embodiments of the present invention provide a method for combining known good electronic components. Using (i) a copper paste for establishing a conductive path in the z direction and (ii) a B-stage (e.g., not fully cured) resin sheet for mechanical bonding between two component carrier structures, a re-combination or assembly of two or more component carrier structures, such as two PCBs (printed circuit boards), can be obtained. For example, the PCB mentioned can be a substrate, a PCB with embedded components, a core with embedded components, etc.

[0032] In one embodiment, the component carrier structure is a panel or an array of multiple preforms comprising component carriers. In the context of the present application, the term "panel" may particularly denote a planar layer stack of at least one electrically insulating layer structure and / or at least one electrically conductive layer structure and having a format that enables the manufacture of multiple component carriers. For example, the area of ​​such a panel may be 18×12 square inches or more. By manufacturing multiple component carriers on a panel level, an efficient batch process with high throughput can be ensured. Thereby, many component carriers can be manufactured efficiently. The array may be part of a panel that includes multiple preforms of component carriers in a block.

[0033] In one embodiment, the additional component carrier structure is a core with a cavity in which the functional components and dummy components are embedded. In the context of the present application, the term "core" can particularly refer to a fully cured laminate made of a component carrier material. For example, such a core can be made of FR4 material, optionally in combination with a copper structure. When such a core is made of a fully cured material, a cavity can be formed in the core without the risk of resin flowing into the cavity during the lamination process. The size and shape of the cavity can be arranged so that it can accommodate functional components or dummy components.

[0034] In one embodiment, the method includes connecting a component carrier structure to another component carrier structure via a connecting structure. Thus, a stack having multiple layers can be formed by connecting two component carrier structures to each other via a connecting structure. The connecting structure can establish a mechanical connection between the component carrier structure and another component carrier structure. However, the connecting structure can also provide an additional electrical connection between the conductive structures of the connected component carrier structure. For example, such an electrical connection can form a conductive path from a functional component in another component carrier structure to the component carrier structure. It has been shown that, compared with a stack of single stacks formed by continuous lamination, etc., when two (or more) component carrier structures each including a corresponding stack are connected, the yield of manufacturing a component carrier having a multilayer structure is higher. The reason for this is that each component carrier structure can be tested individually before connection, thereby reducing the risk of failure compared with a single multilayer stack that is only tested at the end of the manufacturing process. For example, each of the component carrier structures connected by the connecting structure can have at least 6 layer structures, in particular at least 10 layer structures, more particularly at least 14 layer structures, so that a very large number of layered component carriers can be produced with high production volume.

[0035] In one embodiment, the method includes printing the connection structure on one or both of the component carrier structure and the additional component carrier structure. As an alternative to printing, all embodiments described in the present application can also be applied to other additive manufacturing processes. Highly advantageously, the connection structure can be printed on the corresponding component carrier structure. By printing the connection structure instead of the connection layer of the patterned layer pressure, the material (particularly the electrically insulating material) of the connection structure can be provided with low effort only when it is necessary to disable the electrical connection between the component carrier structures to be connected via the connection structure. Therefore, the cumbersome patterning process (for example, by lithography and / or by laser processing for lithography) can be omitted, while providing a high degree of freedom in design. In addition, printing not only allows the electrically insulating area of ​​the connection structure to be defined (for example, by applying a dielectric adhesive). On the contrary, it is also possible to define the conductive area by printing (for example, by printing a conductive paste on the desired part of a corresponding component carrier structure in the component carrier structure). After the connection structure is applied to one or two component carrier structures to be connected by the connection structure, the connection procedure can be implemented, for example, by lamination, curing, bonding, etc.

[0036] In one embodiment, printing comprises one of inkjet printing, screen printing and dispensing. This printing process can be implemented by a medium supply device that provides the medium of the connecting structure. These embodiments of the present invention can be implemented with various media supply devices such as dispensing devices, screen printing devices, inkjet devices, aerosol injection devices, etc. However, other printing technologies can also be applied. The mentioned media supply device can be constructed to supply the material of the connecting structure. In some embodiments, any suitable liquid, solid, aerosol, etc. medium can be applied to the connecting surface of the corresponding component carrier structure.

[0037] In one embodiment, the medium supply device is a distributor. The distributor may include a tubular component with a hollow inner cavity, through which the medium to be distributed or applied can be conveyed. On the open flange surface of the end portion of such a distributor, the medium can flow out of the tubular component onto the surface portion of the corresponding component carrier structure.

[0038] In another embodiment, the medium supply device is a screen printing device. The screen printing device may include a screen having at least one through hole as a medium supply opening, through which the medium to be distributed or applied can be conveyed. At least a portion of the screen may be placed on the connection surface of the corresponding component carrier structure to partially cover the connection surface of the component carrier structure. Subsequently, the medium to be applied can be supplied from the upper side of the screen and can pass through at least one through hole at one or more defined positions (the through hole can define a pattern according to which the medium will be applied to only selective surface portions of the chamber wall). Then, a scraper can be moved over the screen to facilitate the medium to pass through the at least one through hole and remove excess medium from the upper side of the screen.

[0039] In one embodiment, the printed connection structure is free of reinforcement structures, in particular free of reinforcement particles or reinforcement fibers. For example, reinforcement glass fibers or glass spheres may not form part of the printed connection structure. Thus, the material of the printed connection structure may be different from the prepreg or FR4 used as the resin layer with reinforcement particles therein. In contrast, the printed connection structure may consist, for example, of a resin or other material, such as an epoxy derivative, that does not include a reinforcement structure.

[0040] In another embodiment, the method includes laminating a connecting structure made of an at least partially uncured material on one of the component carrier structure and the further component carrier structure, so that the connecting structure remains at least partially uncured after lamination, and subsequently laminating the component carrier structure and the further component carrier structure together via the connecting structure.

[0041] In particular, the method may comprise substantially fully curing (in particular fully curing) the connecting structure by subsequent lamination. As known to the person skilled in the art, the polymer chains are highly crosslinked during curing, so that the final component carrier cannot be thermally reformed. However, the person skilled in the art is aware of the fact that even substantially fully curing does not necessarily correspond exactly to 100% crosslinking. Therefore, as an alternative to printing, the connecting structure can also be formed by soft lamination (i.e. lamination of the material of the connecting structure that is not fully cured) and then optionally patterning the layers forming the connecting structure. In the process of connecting the component carrier structures to form the overall structure, the material of the connecting structure can then be fully cured. Lamination can be carried out by applying thermal energy and / or mechanical pressure.

[0042] In one embodiment, the method comprises connecting a further component carrier structure to the component carrier structure and to the further component carrier structure by means of a further connecting structure (wherein the further connecting structure can be configured according to any of the above-described embodiments for connecting the component carrier structure to the further component carrier structure). Thus, the stacked parts architecture according to the exemplary embodiment of the invention can be continued by subsequently or simultaneously connecting at least one further component carrier structure to the component carrier structure and to the further component carrier structure. Thus, even highly complex component carriers with a large number of layer structures can be formed. Preferably, before connecting the individual sections of the further component carrier structure to the component carrier structure and to the further component carrier structure, the stacked parts architecture can be connected to the further component carrier structure. Before connecting a component carrier structure to another component carrier structure, individual sections of the other component carrier structure can be functionally tested. In particular, individual sections of the other component carrier structure related to sections of the component carrier structure and other sections of the other component carrier structure can be functionally tested before connection. In one embodiment, only sections of the component carrier structure that have successfully passed the functional test and the allocated sections of the other component carrier structure can be connected to corresponding other sections of the other component carrier structure in which functional components are embedded. If any of the above sections is found to have functional problems, dummy components can be filled in the corresponding chambers in the allocated other sections of the other component carrier structure instead of filling them with functional components.

[0043] In particular, the further component carrier structure can be arranged between the component carrier structure and the further component carrier structure. In such an embodiment, one or more functional components can be embedded deep into the interior of the multilayered component carrier.

[0044] In one embodiment, the method comprises separating a semi-finished product obtained by connecting a component carrier structure with another component carrier structure into individual component carriers, each component carrier comprising one of the sections and one of the other sections and one of the functional components or dummy components. A portion of the connection structure may also form a portion of each component carrier. The separated sections comprising the functional components can then be used as easily manufactured component carriers. In contrast, the monomers obtained having only dummy components will not be used as component carrier structures. They may be regarded as waste or may also be further processed to recycle the embedded dummy components for further procedures. However, the loss of functional components due to functionally problematic connection sections may be greatly reduced or even eliminated.

[0045] In one embodiment, the method comprises providing the connection structure as a patterned electrically insulating layer structure (in particular comprising at least partly uncured resin) having at least one recess filled with an electrically conductive material (in particular a copper paste). By configuring the connection structure to have both electrically insulating areas (e.g. for mechanical connection purposes and for electrically insulating surface portions of the connected component-carrier structures) and electrically conductive areas (e.g. for electrical connection between the connected component-carrier structures in the vertical direction), the component-carrier structures to be connected can also be electrically coupled without taking any further measures.

[0046] In one embodiment, the method comprises treating component carriers containing dummy components as scrap. However, dummy components can also be recovered from these non-functional component carriers.

[0047] In one embodiment, the method comprises: performing a test on each functional component before insertion and inserting the functional component into the corresponding further section in the further section only for those functional components that have passed the test. When the functional components are tested before being inserted into the cavities in the further sections of the further component carrier structure, it can be safely prevented that the sections of the component carrier structure that have been successfully tested before the connection between the component carrier structures are lost due to functional failure of the corresponding functional component. Therefore, by using only known good functional components when inserting them into the corresponding cavities of the further component carrier structure, the yield can be further increased and scrap can be further reduced.

[0048] In one embodiment, the component carrier structure and the further component carrier structure each comprise a stack comprising at least one electrically insulating layer structure and / or at least one electrically conductive layer structure. This allows a plurality of multilayer stacks to be connected to one another to form a component carrier having a high number of layers.

[0049] In one embodiment, the component carrier comprises a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier may be a stack of the mentioned (one or more) electrically insulating layer structures and (one or more) electrically conductive layer structures, in particular formed by applying mechanical pressure and / or heat. The stack may provide a plate-like component carrier that can provide a large mounting surface for other components and yet be very thin and compact. The term "layer structure" may in particular denote a continuous layer, a patterned layer or a plurality of non-continuous islands in the same plane.

[0050] In one embodiment, the component carrier is formed as a plate. This facilitates a compact design, wherein the component carrier still provides a large base for mounting components thereon. Furthermore, in particular, for example, bare dies as an example of embedded electronic components can be conveniently embedded in thin boards such as printed circuit boards due to their small thickness.

[0051] In one embodiment, the component carrier is configured as one of a printed circuit board, a substrate (particularly an IC substrate) and an interposer.

[0052] In the context of the present application, the term "printed circuit board" (PCB) may particularly denote a plate-like component carrier formed by combining several conductive layer structures with several electrically insulating layer structures, for example, by applying pressure and / or by supplying thermal energy. As a preferred material for PCB technology, the conductive layer structure is made of copper, and the electrically insulating layer structure may contain resin and / or glass fiber, so-called prepreg or FR4 material. The various conductive layer structures may be connected to each other in a desired manner by the following process: for example, through holes are formed through the laminate by laser drilling or mechanical drilling, and the through holes are filled with conductive material (particularly copper), thereby forming a via as a through-hole connection. In addition to being embedded in one or more components in the printed circuit board, the printed circuit board is generally configured to accommodate one or more components on one or two opposite surfaces of the plate-like printed circuit board. They may be connected to the corresponding main surface by welding. The dielectric part of the PCB may be composed of a resin with reinforcing fibers (such as glass fibers).

[0053] In the context of the present application, the term "substrate" may specifically refer to a small component carrier having substantially the same size as the components (especially electronic components) to be mounted thereon. More specifically, a substrate may be understood as a carrier for electrical connections or electrical networks and a component carrier comparable to a printed circuit board (PCB), but the substrate has a relatively high density of lateral and / or vertically arranged connections. The lateral connections are, for example, conductive paths, while the vertical connections may be, for example, drill holes. These lateral and / or vertical connections are arranged in the substrate and may be used to provide electrical and / or mechanical connections between accommodated components (especially IC chips) or unaccommodated components (such as bare dies) and a printed circuit board or an intermediate printed circuit board. Therefore, the term "substrate" may also include an "IC substrate". The dielectric portion of the substrate may be composed of a resin having reinforcing particles (such as reinforcing balls, especially glass balls).

[0054] The substrate or interposer may include: at least one layer of glass, silicon (Si) or a photoimageable organic material or a dry-etched organic material; or the substrate or interposer may be composed of at least one layer of glass, silicon (Si) or a photoimageable organic material or a dry-etched organic material, wherein the organic material is, for example, an epoxy-based laminated material (e.g., an epoxy-based laminated film) or a polymer composite such as polyimide, polybenzoxazole or benzocyclobutene.

[0055] In one embodiment, the at least one electrically insulating layer structure comprises at least one of the following: a resin (such as a reinforced resin or a non-reinforced resin, for example an epoxy resin or a bismaleimide-triazine resin), a cyanate resin, a polyphenylene derivative, a glass (particularly glass fiber, multilayer glass, a glass-like material), a prepreg (such as FR-4 or FR-5), a polyimide, a polyamide, a liquid crystal polymer (LCP), an epoxy-based laminated film, polytetrafluoroethylene (Teflon), a ceramic and a metal oxide. Reinforcement materials such as meshes, fibers or balls made of glass (multilayer glass) may also be used. Although prepregs, especially FR4, are generally preferred for rigid PCBs, other materials, especially epoxy-based laminated films, may also be used for the substrate. For high-frequency applications, high-frequency materials such as polytetrafluoroethylene, liquid crystal polymers and / or cyanate resins, low-temperature co-fired ceramics (LTCC) or other low DK materials, lower DK materials, ultra-low DK materials may be applied in the component carrier as an electrically insulating layer structure.

[0056] In one embodiment, at least one of the conductive layer structures may comprise at least one of copper, aluminum, nickel, silver, gold, palladium and tungsten. Although copper is generally preferred, other materials or their coating forms are also possible, in particular coated with superconducting materials such as graphene.

[0057] At least one functional component may be embedded in the component carrier and may in particular be selected from: a non-conductive inlay, a conductive inlay (such as a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (such as a heat pipe), a light-conducting element (such as an optical waveguide or a light conductor connection), an electronic component, or a combination thereof. For example, the component may be an active electronic component, a passive electronic component, an electronic chip, a memory device (such as a DRAM or other data memory), a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a light-emitting diode, an optocoupler, a voltage converter (such as a DC / DC converter or an AC / DC converter), a cryptographic component, a transmitter and / or a receiver, an electromechanical transducer, a sensor, an actuator, a micro-electromechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductor, an accumulator, a switch, a camera, an antenna, a logic chip, and an energy harvesting unit. However, other components may be embedded in the component carrier. For example, a magnetic element may be used as a component. Such a magnetic element may be a permanent magnetic element (such as a ferromagnetic element, an antiferromagnetic element, a multiferroic element or a ferrimagnetic element, for example a ferrite core), or such a magnetic element may be a paramagnetic element. However, the component may also be, for example, a substrate, an intermediate layer or another component carrier of a plate-in-plate configuration. The component may be surface mounted on the component carrier and / or may be embedded inside the component carrier. In addition, other components may also be used as components, in particular those that generate and emit electromagnetic radiation and / or are sensitive to electromagnetic radiation propagated from the environment.

[0058] In one embodiment, the component carrier is a laminated component carrier. In such an embodiment, the component carrier is an assembly of multilayer structures that are stacked and connected together by applying pressure and / or heat.

[0059] The aspects defined above and further aspects of the invention will become apparent from the examples of embodiment to be described hereinafter and will be explained with reference to these examples of embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] Figures 1 to 4 A cross-sectional view of a structure obtained during implementation of a method for producing a component carrier according to an exemplary embodiment of the invention is shown.

[0061] Figure 5 A cross-sectional view of a component carrier according to an exemplary embodiment of the invention is shown.

[0062] Figure 6 A sectional view of a component carrier according to a further exemplary embodiment of the present invention is shown.

[0063] Figures 7 to 12A cross-sectional view of a structure obtained during implementation of a method for producing a component carrier according to an exemplary embodiment of the invention is shown.

[0064] Figures 13 to 15 A cross-sectional view shows a component carrier structure connected during the implementation of a method for producing a component carrier according to an exemplary embodiment of the present invention. DETAILED DESCRIPTION

[0065] The illustrations in the drawings are schematic. In different drawings, similar or identical elements are provided with the same reference numerals.

[0066] Before describing the exemplary embodiments in more detail with reference to the drawings, some basic considerations based on which the exemplary embodiments of the invention have been developed will be summarized.

[0067] According to an exemplary embodiment of the present invention, a method of assembling known good component carrier structures is provided. With this manufacturing architecture, the overall yield of highly complex component carrier systems can be greatly improved compared to conventional methods. In one embodiment, a last die embedding architecture can be achieved, especially in the case of last assembly of fan-out structures or redistribution layers. Moreover, reorganization of high-level count boards can be achieved, for example based on advanced HDI (high density interconnect) technology.

[0068] Two electronic components, i.e. two printed circuit boards (PCBs), can be reassembled or reassembled. Such a PCB can also be an IC (integrated circuit) substrate, a PCB with embedded components, a core with embedded components, etc.

[0069] In one embodiment, copper paste can be used in the connection structure between different component carrier structures to establish a conductive path in the vertical direction. It is also possible to use an at least partially uncured electrically insulating layer structure (e.g., a B-stage resin sheet) to mechanically bond between multiple component carrier structures, i.e., between electronic component carrier structures.

[0070] The yield (yield) improvement that can be obtained according to the exemplary embodiment of the present invention can be described as follows: In the case of a higher number of PCB layers, each additional layer (yield is not 100%) may result in waste, which relates to the complete card achieved by the previous stack-up. Therefore, it can be expected that the production of (for example) a 28-layer PCB by a subsequent lamination process may result in a lower yield than combining two 14-layer PCBs together.

[0071] According to an exemplary embodiment of the invention, a well-tested component carrier structure (e.g. a printed circuit board) can therefore be combined in the vertical direction with a further embedded core component carrier structure having known good functional components placed according to known good parts in the first-mentioned component carrier structure.

[0072] Advantageously, a dielectric connection layer providing vertical interconnection between the two mentioned component carrier structures may be printed (eg screen printed, by inkjet printing, etc.). Openings (eg via-like openings) may be left, where a conductive layer may be printed or dispensed.

[0073] According to an exemplary embodiment of the present invention, the production of high-layer component carriers is implemented by the reorganization of two or more component carrier structures. For example, a PCB structure with embedded components can be combined with other PCB structures to achieve interconnection purposes. The significant advantage that can be obtained by this concept is to thoroughly test a PCB structure before lamination with another PCB structure to identify possible fault areas. Therefore, defective units can be identified on the entire panel. Once this step is performed, an embedded core containing known good (i.e., fully tested) components and dummy components can be prepared. The dummy components can be located on a carrier that matches those defective units pre-tested on the PCB structure. Due to the reduction of the loss of known good components, this method can allow the overall cost of electronic packaging to be reduced. After the PCB structure and the embedded core are combined, the singulation of the components can be performed. Another product that can be manufactured according to an exemplary embodiment of the present invention is an electronic module based on different combination levels, for example, an embedded core in the middle and two PCB structures, i.e., on the top side and bottom side of the embedded core.

[0074] According to an exemplary embodiment, different component carrier structures can be connected to each other by soft lamination. This can refer to the fact that a laminate layer, i.e. a layer that is not fully cured, can be connected (e.g. by partial lamination) to one of the component carrier structures. Thereafter, the two component carrier structures can be connected to each other via the soft laminate layer. More specifically, this can be achieved by fully curing a laminate layer that was previously only partially cured. This can be done by lamination, i.e. applying thermal energy and / or mechanical pressure to a previously only partially cured electrically insulating layer structure between the two component carrier structures to be connected. In different embodiments, the above-mentioned soft lamination process can be applied on any one PCB structure (e.g., on an embedded core). Further combinations of multi-stage component carrier structures can be achieved, depending on how many modules should be combined in a specific application.

[0075] Instead of implementing a soft lamination process for connecting different component carrier structures to one another, according to another exemplary embodiment, a dielectric connection layer can also be printed on the surface of one of the component carrier structures or on the core surface. Openings may remain in the design, which can be used as connection vias. A significant advantage of this embodiment is that stricter design rules are achieved compared to laser via formation.

[0076] In one embodiment, a post-chip manufacturing architecture can be provided in combination with a central core embedding. By softly laminating a resin sheet on a central core board of a PCB to be combined therewith, better design rules can be achieved than conventional methods. The final architecture of the chip can reduce the waste of components by combining a known good die with a known good section or component carrier unit. In particular, the final embedding of the chip can be performed very advantageously or in a high-layer board. Exemplary applications of exemplary embodiments of the present invention relate to Wi-Fi modules, Bluetooth modules, radio frequency power amplifiers, and the like.

[0077] In particular, exemplary embodiments of the present invention can provide a board-to-board connection manufacturing architecture that combines a pre-tested electronic block (e.g., a high-density integrated block) as a first component carrier structure and an embedded core as a second component carrier structure to achieve substantial advantages in terms of yield and manufacturing effort.

[0078] Figures 1 to 4 A cross-sectional view of a structure obtained during the implementation of a method for manufacturing a component carrier 100 according to an exemplary embodiment of the present invention is shown.

[0079] Reference Figure 1 , shows a panel-type component carrier structure 104 composed of a plurality of segments 102. Each segment 102 corresponds to a portion of the component carrier structure 104 that forms part of a separate component carrier 100 that is easy to manufacture (compare Figure 4 and Figure 5 ). For example, the component carrier structure 104 may be an array or panel of a plurality of preforms including the component carrier 100 .

[0080] As shown, the component carrier structure 104 comprises a planar laminated stack 118, which comprises, for example, a central electrically insulating layer structure 121, which is covered with corresponding conductive layer structures 122 on two opposite main surfaces. In the embodiment shown, the electrically insulating layer structure 121 can contain a resin (particularly an epoxy resin), which optionally contains reinforcing particles such as glass fibers or glass particles. The conductive layer structure 122 can be, for example, a metal layer, such as a copper foil. Although not shown, the stack 118 of the component carrier structure 104 can include, for example, 14 layer structures.

[0081] A functional test can be performed on each of the plurality of sections 102 of the component carrier structure 104. The section denoted by reference numeral 102 has passed the functional test, while the section denoted by reference numeral 140 has not passed the functional test. Figure 1 A component carrier structure 104 is shown with a plurality of segments 102, 140, which have been subjected to individual electrical tests with respect to their functionality. The result of this test is that the segment marked 102 has passed the electrical test for this function and can therefore be used to produce a functionally complete component carrier 100. However, the segment marked 140 has failed this electrical test and cannot be used as part of a functionally complete component carrier 100.

[0082] Reference Figure 2 , showing Figure 1 The component carrier structure 104 and the attached connection structure 114. In addition, Figure 2 A further component carrier structure 106 is shown aligned relative to the component carrier structure 104. The further component carrier structure 106 is to be connected to the component carrier structure 104 via a connecting structure 114.

[0083] As shown, the additional component carrier structure 106 also includes a planar laminated stack 118, which includes, for example, a central electrical insulation layer structure 121, which is covered with a corresponding conductive layer structure 122 on two opposite main surfaces. Although not shown, the stack 118 of the additional component carrier structure 106 can include, for example, 14 layer structures. In the embodiment shown, the electrical insulation layer structure 121 of the additional component carrier structure 106 can include a resin (particularly an epoxy resin), and the resin can optionally include reinforcing particles such as glass fibers or glass particles. The conductive layer structure 122 of the additional component carrier structure 106 can be, for example, a metal layer, such as a copper foil. More specifically, the additional component carrier structure 106 includes a core 124 with a chamber 126, in which the functional component 110 and the dummy component 112 are embedded, as described in detail below. The core 124 corresponds to the stack 118 of the additional component carrier structure 106.

[0084] In order to obtain Figure 2 The further component carrier structure 106 shown has a functional component 110 inserted into each of the further sections 108 of the further component carrier structure 106, but not into the further sections, so that the functional component 110 is assigned to the components that have been successfully assigned to the components 108 of the further component carrier structure 106. Figure 1Each additional segment 108 of the respective segment 102 of the test is provided with one of the functional components 110. No functional component 110 is inserted into an additional segment 108 spatially coincident with a segment 140 which has not been tested by reference. Figure 1 The segment-specific functional test described is not performed. However, a functionally invalid dummy component 112 is inserted into a cavity 126 of a further segment 108, which is to be directly mechanically connected and assigned to the segment 140 that has not passed the test. No dummy component 112 is inserted into a further segment 108 corresponding to a segment 102 that has already passed the functional test. As with the segments 102 of the component-carrier structure 104, each functional component 110 can also be subjected to a functional test separately before being inserted into the cavity 126 of the further component-carrier structure 106. Therefore, a functional component 110 is only inserted into a corresponding segment in the further segment 108 if the corresponding functional component 110 has previously successfully passed the functional test. As Figure 2 As shown, no functional component 110 is inserted into the additional segments 108 assigned to the segments 140 that failed the test. Accordingly, no dummy component 112 is inserted into each additional segment 108 assigned to the respective segment 102 that has successfully passed the test.

[0085] As Figure 1The results of the electrical tests of the individual sections 102, 140 of the component carrier structure 104 of the component carrier structure 104 of the embodiment of the present invention can be adapted accordingly to the process of embedding the components in the chambers 126 of the further component carrier structure 106. The further sections 108 of the further component carrier structure 106, which are aligned and thus assigned to the corresponding section 102 of the component carrier structure 104, are filled with known good functional components 110, i.e. components that have passed the functional test before embedding. Therefore, these components are only classified as functional components 110 and are considered for embedding in the further sections 108 assigned to the known good sections 102, when they have successfully passed the electrical tests with respect to their electronic functions. In the embodiment shown, the functional components 110 are semiconductor chips that have successfully passed the corresponding functional tests that can be implemented by a testing device (not shown). However, another section 108 of the further component carrier structure 106 which is spatially and functionally assigned to the section of the component carrier structure 104 which failed in the electrical test and is marked as 140 will only be equipped with a functionally invalid dummy component 112 and not with a functional component 110. The shape and size of the dummy component 112 can be set to be the same as the functional component 110, but does not provide the function of the functional component 110. Since the corresponding section 140 cannot be used for the component carrier 100, the corresponding section 108 of the further component carrier structure 106 will also be wasted. Therefore, the corresponding chamber 126 is not filled with expensive functional components 110, but with another dummy component 112 of the same shape and size, but functionally invalid. From the description, only the known good section 102 is connected to the section 108 that accommodates the known good function. In contrast, the known bad section 140 of the component carrier structure 104 is combined with the dummy component 112 of the further component carrier structure 106. The dummy component 112 can be a completely ineffective space holder, as long as the dummy component 112 is designed to be the same in shape and size as the functional component 110. The dummy component 112 can exhibit similar properties (e.g., with respect to stability, stiffness or flexibility, surface roughness, thermal properties, etc.) when manufacturing the component carrier 100. Such a dummy component can be selected to have the same properties as described above, but with much shorter durability, degradability, easier recycling, etc., because the dummy component 112 only needs to be used as a space holder and can then optionally be recycled.

[0086] As described above, the component carrier structure 104 is to be connected to the further component carrier structure 106 via the connection structure 114. The connection structure 114 is implemented here as a patterned electrically insulating layer structure 120, which comprises an at least partially uncured resin and has an array of recesses filled with an electrically conductive material 132 in the form of a copper paste. The connection structure 114 can be formed by printing, such as Fig. 9 and Fig.10 Printing the connection structure 114 on the component carrier structure 104 allows for a precise definition of the electrically insulating areas (cf. reference numeral 120 ) and the electrically conductive areas (cf. reference numeral 132 ) of the connection structure 114 .

[0087] like Figure 2 As shown, each of the functional components 110 includes a conductive terminal 123 (e.g., a pad) having an external non-copper surface connected to the printed connection structure 114. Therefore, the embedded component 110 does not have to be provided with a copper terminal as is usually required for central core embedding. However, according to an exemplary embodiment of the present invention, the contact terminal material at the component level is not a problem because the two component carrier structures 104, 106 can be interconnected using a paste. Additional work associated with traditional PCB processes, such as decontamination, chemical copper plating, laser drilling, etc., which are only compatible with the surface of the copper terminal, may be unnecessary.

[0088] Reference Figure 3 The result of connecting the component carrier structures 104, 106 via the above-described connecting structure 114 is shown as a semi-finished product 134. The connection can be established by lamination.

[0089] The semi-finished product 134 comprises a component carrier structure 104 having a plurality of functional sections 102 and non-functional sections 140. A further component carrier structure 106 connected to the component carrier structure 104 also forms part of the semi-finished product 134. Functional components 110 are inserted into some of the further sections 108 in order to provide one functional component of the functional components 110 for each further section 108 assigned to the respective functional section 102. Functionally invalid dummy components 112 are inserted into the further sections 108 of the non-functional sections 140 that have not passed the functional test and are assigned to the respective sections 102, 140 of the component carrier structure 104.

[0090] Figure 3 The semi-finished product 134 shown can be Figure 2 The structures shown are laminated together, in particular by applying pressure and heat. As a result, the electrically insulating layer structure 120 of the connecting structure 114 can be cured. For example, the electrically insulating layer structure 120 can be a previously uncured resin with a polymer that is cross-linked in the presence of heat and pressure. As a result, the resin becomes fully cured, so that the component carrier structures 104, 106 adhere to each other. The conductive material 132, which is a copper paste in the embodiment shown, can also be cured by this lamination procedure. For example, the solvent in the copper paste may evaporate, so that the remaining copper particles are connected to each other by sintering and provide a reliable electrical connection between the relative component carrier structures 104, 106.

[0091] Figure 3 The left side also shows (with Figure 1 and Figure 2 Compared to another feature of an exemplary embodiment of the present invention. The component carrier 100 shown on the left, which can be formed based on the central core embedding, can have a component pad or terminal 123 that directly faces the outside (i.e., there is no additional layer on the top). If the spacing d of the component pads (i.e., the distance from the center of the pad to the center of the pad) is too tight (e.g., less than 300μm), one or more redistribution layers (not shown) can also be formed on top of the terminal 123 to fan out. This can relax the design rules so as to meet other component carrier structures.

[0092] Reference Figure 4 , singulate the semi-finished product 134 into a plurality of functionally effective component carriers 100 and functionally ineffective component carriers 100 ′. The dividing line 199 indicates the Figure 4 How the semi-finished product 134 is separated into functionally active component carriers 100 and functionally inactive component carriers 100 ′. Separation along line 199 can be achieved by mechanical cutting, by laser cutting or by chemical etching.

[0093] A component carrier 100' comprising a dummy component 112 can be classified as scrap. The component carrier 100 can be operated according to the respective application. Considering the combination of a known good segment 102 with a known good functional component 110, the component carrier 100 is likely to be functionally usable without reliability issues. In contrast, considering the combination of a known bad segment 140 with a known bad dummy component 112, the component carrier 100' is functionally invalid and can be classified as scrap. Alternatively, the component carrier 100' can be subjected to a recycling procedure, which is used, for example, to recover the dummy component 112 to be used in a subsequent process of manufacturing another batch of component carriers 100.

[0094] Figure 5 A cross-sectional view of such a component carrier 100 according to an exemplary embodiment of the invention is shown, which has been formed according to Figures 1 to 4 The component carrier 100 shown comprises a component carrier section 102, a further component carrier section 108, a functional component 110 embedded in the further component carrier section 108, and a part of a printed and now solidified connecting structure 114, by which the component carrier section 102 and the further component carrier section 108 are connected. Figure 5 Shown in reference Figure 4 The component carrier 100 obtained after the described singulation process.

[0095] Figure 6 2 shows a cross-sectional view of a component carrier 100 according to another exemplary embodiment of the present invention. Figures 1 to 5 In contrast to the manufacturing method described, according to Figure 6 The component carrier 100 includes additional procedures during its manufacture. Figure 6 100, a further component carrier structure 128 (the further component carrier structure 128 can be constructed in a similar manner to the component carrier structure 104 or the section 102 of the component carrier structure 104) is connected to a semi-finished product 134 consisting of the component carrier structure 104 and the further component carrier structure 106 (or a section thereof). For this additional connection, a further connecting structure 130 can be used, which can correspond to Figure 2 The connection structure 114 may be shown or constructed according to any other embodiment of the connection structure described herein.

[0096] therefore, Figure 6 A component carrier 100 according to another exemplary embodiment is shown, in which during the mass production of the component carrier 100 not only two component carrier structures 104 , 106 are connected to one another, but also a further component carrier structure 128 is already connected to a further component carrier structure 106 with an embedded functional component 110 . Figure 6 Particularly high numbers of layers can be achieved in the component carrier 100 of the embodiment of the present invention, but still with a high yield. Likewise, only after successful functional testing of individual sections of the further component carrier structure 128 can the sections of the further component carrier structure 128 be connected to the section with the functional component 110.

[0097] Figures 7 to 12 A cross-sectional view of a structure obtained during the performance of a method for manufacturing a component carrier 100 according to an exemplary embodiment of the present invention is shown.

[0098] Reference Figure 7, a connecting structure 114 made of an at least partially uncured material (for example an epoxy resin that has not yet been cross-linked) is soft-laminated onto the component-carrier structure 104 or the segment 102 of the component-carrier structure 104, so that the connecting structure 114 remains at least partially uncured after lamination. More precisely, such a connection of the connecting structure 114 to the component-carrier structure 104 or the segment 102 can involve only partial cross-linking and therefore only partial curing of the material of the electrically insulating layer structure 120. Such soft lamination can be achieved by applying a sufficiently moderate amount of heat and / or a sufficiently moderate amount of pressure. When the applied heat and / or the applied amount of pressure is limited so that after the soft lamination, the electrically insulating layer structure 120 is still at least partially uncured, the soft-laminated electrically insulating layer structure 120 can still be used for the interconnection of the segment 102 with a further segment 108 in a subsequent lamination procedure (see Fig.11 ).

[0099] refer to Figure 8 , shows the reference Figure 7 Result of the soft lamination process described. Furthermore, the laminated connection structure 114 is patterned at the same time, so that surface portions of the upper electrically conductive layer structure 122 of the component carrier structure 104 or the segment 102 are exposed by the recesses 131 .

[0100] Figure 8 The result of the patterning of the electrically insulating layer structure 120 is shown to expose the electrically conductive layer structure 122 on the outer surface of the component carrier structure 104 or the section 102. The patterning can be done, for example, by laser drilling, optionally in combination with a subsequent dry etching procedure. Alternatively, the patterning can be carried out by photolithography and chemical etching. The patterning and the final exposure of the electrically conductive layer structure 122 allow the now exposed electrically conductive layer structure 122 to be electrically connected to a corresponding electrically conductive layer structure 122 of a further component carrier structure 104 or its section 108 (compare Fig.11 and Fig.12 ).

[0101] Reference Fig. 9 , shows an alternative method of forming the connecting structure 114. Fig. 9 , the connection structure 114 is printed on the component carrier structure 104 or the section 102 in an already patterned manner. For example, the printing can be embodied as a dispense. For example, the connection structure 114 can include an uncured resin (in particular an epoxy resin). Fig. 9 The printed connection structure 114 may be free of reinforcing structures, in particular free of reinforcing glass fibers.

[0102] Therefore, as a reference Figure 7 and Figure 8 An alternative to the formation of the connection structure 114 described, Fig. 9It is described how such a connecting structure 114 can also be applied by printing. For this purpose, a medium supply device 197 can be used which is filled with a medium 195, which medium 195 is to be supplied to the component carrier structure 102 for forming the connecting structure 114. The medium supply device 197 can be controlled by a control unit 193. As indicated by the double arrow 191, the medium supply device 197 can be moved along the main surface of the component carrier structure 104 or the segment 102 in order to apply the connecting structure 114 according to the desired pattern. Via the injection port 189 of the medium supply device 197, the medium 195 can be applied to the desired surface portion of the component carrier structure 104 or the segment 102, so that a patterned connecting structure 114 is defined without carrying out a patterning procedure. By reference to Fig. 9 By the described process, the electrically insulating layer structure 120 of the connecting structure 114 can be formed.

[0103] Reference Fig.10 , a conductive material 132 is selectively printed (eg dispensed) into the recesses 131 of the electrically insulating layer structure 120 extending through the connection structure 114 .

[0104] like Fig.10 As shown, the further medium supply device 185 can be used to selectively apply the conductive medium 183 to the exposed surface portions of the conductive layer structure 122. For example, the medium 183 can be a copper paste, which can optionally contain an evaporable solvent or any other sacrificial material that facilitates the correct application of the medium 183. By controlled movement of the further medium supply device 185 along the surface of the component-carrier structure 104 or the segment 102, the exposed conductive portions of the conductive layer structure 122 can be selectively covered with the conductive material 132.

[0105] In the previously described embodiment, in which the electrically insulating layer structure 120 of the connecting structure 114 is applied by soft lamination, Figure 8 The exposed portion of the conductive layer structure 122 shown may also be formed by Fig.10 The process is filled with conductive paste.

[0106] Reference Fig.11 , the subsequent lamination of the component carrier structure 104 (or the segment 102 ) and the further component carrier structure 106 (or the segment 108 ) by means of the connecting structure 114 is shown.

[0107] Fig.11 Shows that on the one hand Fig.10The connection of the component carrier structure 102 covered by the connecting structure 114 shown and covered by the other component carrier structure 106. This connection can be implemented, for example, by applying pressure and / or heat. When the electrically insulating layer structure 120 of the connecting structure 114 has been applied by soft lamination, it can be connected according to Fig.11 The additional lamination is performed to completely cure the component carrier structure 102. When the electrically insulating layer structure 120 of the connecting structure 114 has been formed by the Fig. 9 The printing described is formed according to Fig.11 The connection may be performed by curing the connection structure 114, which may also be achieved by mechanical pressure and / or heat.

[0108] Fig.12 Shown is a reference Fig.11 The fully laminated result is described. Fig.12 The resulting component carrier 100 is shown. Figures 7 to 12 When the process is carried out in a manner similar to that of processing and connecting the component carrier structures 104, 106 instead of the segments 102, 108, the semi-finished product 134 obtained still needs to be singulated (e.g. Figure 4 ) to obtain an individual component carrier 100.

[0109] Fig.13 , Fig.14 and Fig.15 A cross-sectional view of component carrier structures 104 , 106 connected during the implementation of a method for producing a component carrier 100 according to an exemplary embodiment of the present invention is shown. Figures 13 to 15 Shown is a reference Figures 7 to 12 The described manufacturing process can also be implemented in a corresponding manner using a plurality of integrally formed component carrier structures 104, 106, i.e. at panel or array level. Furthermore, two functional components 110 are embedded in each obtained component carrier 100 and two dummy components 112 are embedded in each obtained non-functional component carrier 100'.

[0110] Although not shown in the figures, the component carrier structures 104 and 106 can also be without components 110 when connected. This is particularly applicable to highly complex panel structures (e.g., multi-layer) to reduce the situation of bad cards / bad unit multipliers. In that case, all units or sections 102, 108 of the two component carrier structures 104, 106 can be tested before being connected to each other. In that case, it is possible to singulate one of the component carrier structures 104 or 106 and reconfigure it to adjust it to the position of the known good units or sections 102, 108 of the corresponding other component carrier structure 104 or 106.

[0111] The latter embodiments of the present invention may be more generally described in the following manner:

[0112] A method 100 for manufacturing a component carrier, wherein the method comprises:

[0113] Performing a test on each of the plurality of sections 102 , 140 of the component carrier structure 104 ;

[0114] performing a test on each of the plurality of sections 108 of the individual further component carrier structure 108;

[0115] connecting a corresponding one of the segments 102 that have successfully passed the test with a corresponding one of the other segments 108 that have successfully passed the test;

[0116] If at least one section 140 , 108 fails the test, the at least one section 140 , 108 is rejected.

[0117] All features described herein and not related to the embedding of component 110 may also be applied to this method.

[0118] It should be noted that the term "comprising" does not exclude other elements or steps and "a" or "an" does not exclude a plurality. Furthermore, elements described in connection with different embodiments may be combined.

[0119] It should also be noted that reference signs in the claims should not be construed as limiting the scope of the claims.

[0120] The implementation of the invention is not limited to the preferred embodiments shown in the drawings and described above. On the contrary, the solutions shown and numerous variants of the principle according to the invention can be used, even in the case of fundamentally different embodiments.

Claims

1. A method for manufacturing a component carrier (100) at panel level, the method include: Conducting a test on each of a plurality of sections (102, 140) of a component carrier structure (104), wherein the component carrier structure (104) is a panel or array comprising a plurality of preforms of a component carrier (100); providing a further component carrier structure (106) comprising a core (124) having a plurality of further sections (108), each further section (108) comprising a chamber (126); assigning each further section (108) of the core (124) of the further component carrier structure (106) to a corresponding section (102) of the component carrier structure (104) that has successfully passed the test or to a corresponding section (140) of the component carrier structure (104) that has not passed the test; inserting at least one functional component (110) into the chamber (126) of the further component carrier structure (106) which is assigned to the respective further section (108) of the respective section (102) which has successfully passed the test; and inserting at least one functionally ineffective dummy component (112) into a cavity (126) of a respective further segment (108) assigned to the respective segment (140) that failed the test, The further component carrier structure (106) comprising at least one of the functional components (110) and at least one of the functionally inactive dummy components (112) is connected to the component carrier structure (104) via a connecting structure (114).

2. The method according to claim 1, comprising at least one of the following features: in, The method comprises forming at least a portion of the connection structure (114) on at least one of the component carrier structure (104) and the further component carrier structure (106) by additive manufacturing; The method comprises: laminating the connecting structure (114) comprising at least partially uncured material onto at least one of the component carrier structure (104) and the further component carrier structure (106), such that the connecting structure (114) remains at least partially uncured after the lamination; and subsequently laminating the component carrier structure (104) and the further component carrier structure (106) together via the connecting structure (114); wherein the method comprises connecting a further component carrier structure (128) to the component carrier structure (104) and the further component carrier structure (106) via a further connecting structure (130). a further component carrier structure (106) connected to the component carrier structure (104) such that the further component carrier structure (106) is arranged between the component carrier structure (104) and the further component carrier structure (128); wherein the method comprises separating a semi-finished product (134) obtained by connecting the component carrier structure (104) with the further component carrier structure (106) into individual component carriers (100), each component carrier (100) comprising a segment (102, 140), a further segment (108), a part of the connecting structure (114), and one of at least one functional component (110) or at least one dummy component (112); Therein, the method comprises providing the connection structure (114) as a patterned electrically insulating layer structure (120).

3. The method according to claim 1, in, The method comprises forming at least a portion of the connection structure (114) on at least one of the component carrier structure (104) and the further component carrier structure (106) by printing.

4. The method according to claim 3, in, The printing includes one of inkjet printing and screen printing.

5. The method according to claim 1, in, The method comprises forming at least a portion of the connecting structure (114) on at least one of the component carrier structure (104) and the further component carrier structure (106) by dispensing.

6. The method according to claim 2, in, The method includes fully curing the connection structure (114) by subsequent lamination.

7. The method according to claim 2, in, The patterned electrically insulating layer structure (120) comprises an at least partially uncured resin and has at least one recess (131) filled with a conductive material (132).

8. The method according to claim 7, in, The conductive material is copper paste.

9. The method according to claim 1, comprising at least one of the following features: in, The method includes treating one or more component carriers (100') containing dummy components (112) as scrap; The method comprises: before the inserting, performing a test on each of the functional components (110); and inserting only those functional components (110) of the functional components (110) that have successfully passed the test into corresponding further sections of the further sections (108); Therein, each of the component carrier structure (104) and the further component carrier structure (106) comprises a stack (118) comprising at least one electrically insulating layer structure (121) and / or at least one electrically conductive layer structure (122).

10. The method according to claim 9, in, The stack (118) of at least one of the component carrier structure (104) and the further component carrier structure (106) comprises at least 6 layer structures.

11. The method according to claim 9, in, The stack (118) of at least one of the component carrier structure (104) and the further component carrier structure (106) comprises at least 10 layer structures.

12. The method according to claim 9, in, The stack (118) of at least one of the component carrier structure (104) and the further component carrier structure (106) comprises at least 14 layer structures.

13. The method according to claim 1, in, No functional component (110) is inserted into each of the other segments (108) assigned to the corresponding segment (140) that failed the test and / or no dummy component (112) is inserted into each of the other segments (108) assigned to the corresponding segment (102) that successfully passed the test.

14. The method according to claim 1 or 2, in, The method comprises: Providing the component carrier section (102) of the component carrier structure (104) and the further component carrier section (108) of the further component carrier structure (106) separate from the component carrier structure (104); additively manufacturing a connection structure (114) on at least one of the component carrier section (102) and the further component carrier section (108); The component carrier structure (104) is connected to the further component carrier structure (106) such that the component carrier section (102) and the further component carrier section (108) are connected via the additively manufactured connecting structure (114).

15. The method according to claim 14, in, The method comprises printing a connecting structure (114) on at least one of the component carrier section (102) and the further component carrier section (108).

16. A computer readable medium having stored therein a computer program for manufacturing a component carrier (100), the computer program being adapted to implement or control the method according to claim 1 when being executed by one or more processors.

17. A program element for manufacturing a component carrier (100), which, when executed by one or more processors, is adapted to carry out or control the method according to claim 1.

18. A semi-finished product (134) obtainable during the manufacture of a component carrier (100), in, The semi-finished product (134) comprises: An integrated component carrier structure (104), the integrated component carrier structure (104) comprising a plurality of functional sections (102) and at least one non-functional section (140), wherein the component carrier structure (104) is an integrated panel or array of a plurality of preforms integrally comprising a component carrier (100); an integral further component carrier structure (106), the integral further component carrier structure (106) being connected to the integral component carrier structure (104) and comprising a plurality of further sections (108), wherein the further component carrier structure (106) is connected to the component carrier structure (104) via a connecting structure (114); functional components (110), each of the functional components (110) being inserted into a respective one of the further sections (108), such that each further section (108) assigned to the respective functional section (102) is provided with at least one of the functional components (110); At least one functionally ineffective dummy component (112) is inserted into a corresponding one of the further sections (108) so that each further section (108) assigned to a corresponding non-functional section (140) is provided with at least one dummy component (112).

19. A component carrier (100) produced by the method according to claim 1 or 2, in, The component carrier (100) comprises: The component carrier section (102); the further component carrier section (108); The functional component (110) is embedded in the further component carrier section (108); and an additively manufactured connecting structure (114) by which the component carrier section (102) and the further component carrier section (108) are connected.

20. The component carrier (100) according to claim 19, in, The connecting structure (114) is a printed connecting structure.

21. The component carrier (100) according to claim 19 or 20, in, The additively manufactured connection structure (114) is selected from a screen-printed connection structure and an inkjet-printed connection structure.

22. The component carrier (100) according to claim 19 or 20, in, The additively manufactured connection structure (114) has no reinforcement structure.

23. The component carrier (100) according to claim 19 or 20, in, The additively manufactured connection structure (114) is free of reinforcing particles or reinforcing fibers.

24. The component carrier (100) according to claim 19 or 20, in, The functional component (110) includes at least one conductive terminal (123) having a non-copper outer surface connected to the additively manufactured connection structure (114).

25. The component carrier (100) according to claim 19 or 20, comprising at least one of the following features: in, The functional component (110) is selected from the group consisting of: photoconductive elements, storage devices, filters, power management components, optoelectronic interface components, voltage converters, cryptographic components, electromechanical transducers, actuators, microprocessors, capacitors, resistors, inductors, accumulators, switches, cameras, antennas, magnetic elements, other component carriers and logic chips; wherein at least one electrically conductive layer structure (122) of at least one of the component carrier segment (102, 140) and the further component carrier segment (108) comprises at least one of copper, aluminum, nickel, silver, gold, palladium and tungsten, any of the mentioned materials being coated with a superconducting material; wherein at least one electrically insulating layer structure (121) of at least one of the component carrier section (102, 140) and the further component carrier section (108) comprises at least one of the following: epoxy resin or bismaleimide-triazine resin; FR-4; FR-5; cyanate ester; polyphenylene derivative; glass; prepreg; polyimide; polyamide; liquid crystal polymer; epoxy-based laminate material; polytetrafluoroethylene; ceramic and metal oxide; wherein the component carrier (100) is formed as a plate; The component carrier (100) is designed as a laminated component carrier.

26. The component carrier (100) according to claim 19 or 20, in, The functional component (110) is an electronic component.

27. The component carrier (100) according to claim 19 or 20, in, The functional component (110) is a non-conductive inlay and / or a conductive inlay.

28. The component carrier (100) according to claim 19 or 20, in, The functional component (110) is a heat transfer unit.

29. The component carrier (100) according to claim 19 or 20, in, The functional component (110) is an energy collection unit.

30. The component carrier (100) according to claim 19 or 20, in, The functional component (110) is an active electronic component.

31. The component carrier (100) according to claim 19 or 20, in, The functional component (110) is a passive electronic component.

32. The component carrier (100) according to claim 19 or 20, in, The functional component (110) is an electronic chip.

33. The component carrier (100) according to claim 19 or 20, in, The functional component (110) is a signal processing component.

34. The component carrier (100) according to claim 19 or 20, in, The functional component (110) is a transmitter and / or a receiver.

35. The component carrier (100) according to claim 19 or 20, in, The functional component (110) is a micro-electromechanical system.

36. The component carrier (100) according to claim 19 or 20, in, The functional component (110) is an integrated circuit.

37. The component carrier (100) according to claim 25, in, The superconducting material is graphene.

38. The component carrier (100) according to claim 19 or 20, in, At least one electrically insulating layer structure (121) of at least one of the component carrier section (102, 140) and the further component carrier section (108) contains a resin.

39. The component carrier (100) according to claim 19 or 20, in, At least one electrically insulating layer structure (121) of at least one of the component carrier section (102, 140) and the further component carrier section (108) comprises a reinforced resin or a non-reinforced resin.

40. The component carrier (100) according to claim 19 or 20, in, The component carrier (100) is designed as a printed circuit board.

41. The component carrier (100) according to claim 19 or 20, in, The component carrier (100) is designed as a base plate.

Images