A testing device and testing method for an infrared thermopile sensor

Abstract

The present invention provides a test device and a test method for an infrared thermopile sensor. The test device includes a blackbody, which serves as a standard radiation source to provide a standard object temperature Tobj for testing; a heat insulator made of a heat-insulating material, which has a cavity penetrating through the heat insulator, and the cavity includes a first port close to the blackbody and a second port far from the blackbody; a heat carrier, in which an infrared thermopile sensor is placed, and the heat carrier can enter and exit the cavity of the heat insulator. When the heat carrier is in the standard test position, the heat carrier with the infrared thermopile sensor placed therein is located in the cavity of the heat insulator. In this way, a high-efficiency measurement can be performed on the thermopile output voltage - ambient temperature - object temperature matrix table, and a high-precision measurement result can be obtained.

Description

Technical Field

[0001] The present invention belongs to the field of testing MEMS (Micro-Electro-Mechanical System) devices, and particularly relates to a testing device and a testing method for a thermopile output voltage - ambient temperature - object temperature matrix table.

Background Art

[0002] In the test of the thermopile output voltage - ambient temperature - object temperature matrix table, it is required that the temperature of the object (standard black body) changes from dozens of degrees below zero to over 100 degrees, and the ambient temperature changes near -20 to 100 degrees. However, the operating temperature of the vast majority of black bodies is between 0 and 40 degrees, which cannot meet the test requirements. Some black bodies that can work in the environment of -20 to 100 degrees are very expensive, worth hundreds of thousands of yuan. Moreover, for the high and low temperature test chamber that provides the ambient temperature for the test equipment, it takes a long time for the temperature to stabilize. Generally, the single-point temperature stabilization time requires at least 30 minutes, which is very unfavorable for the test of dense ambient temperature points. In the existing test, the measured matrix table quantity is insufficient, and most data are obtained by interpolation, which is also not conducive to the high-precision application of the client.

[0003] Therefore, it is necessary to propose a technical solution to overcome the above problems.

Summary of the Invention

[0004] One of the purposes of the present invention is to provide a testing device and a testing method for an infrared thermopile sensor, which can achieve low cost, high precision, and high efficiency in the test of the thermopile output voltage - ambient temperature - object temperature matrix table.

[0005] According to one aspect of the present invention, the present invention provides a testing device for an infrared thermopile sensor, which includes: a black body, which serves as a standard radiation source to provide a standard object temperature Tobj for the test; a heat insulator made of heat-insulating material, which has a cavity penetrating through the heat insulator, and the cavity includes a first port close to the black body and a second port far from the black body; a heat carrier, in which an infrared thermopile sensor is placed, and the heat carrier can enter and exit the cavity of the heat insulator. When the heat carrier is in the standard test position, the heat carrier with the infrared thermopile sensor placed therein enters the cavity of the heat insulator.

[0006] According to another aspect of the present invention, the present invention provides a test method for a test device of an infrared thermopile sensor, which includes: setting the temperature of a blackbody to provide a standard object temperature Tobj, heating a heat carrier to the highest temperature point or / and cooling the heat carrier to the lowest temperature point; moving the heat carrier to a standard test position to start the test, and during the test, sampling the output of the temperature detection unit of the infrared thermopile sensor at predetermined intervals to obtain the ambient temperature and sampling the output of the thermopile chip of the infrared thermopile sensor to obtain the thermopile output voltage, and storing the obtained ambient temperature and thermopile output voltage to form an output voltage-ambient temperature-object temperature matrix table.

[0007] Compared with the prior art, the present invention controls the heat flow direction and the distribution of the temperature field in the test device to efficiently measure the thermopile output voltage-ambient temperature-object temperature matrix table and obtain high-precision measurement results.

Description of the Drawings

[0008] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings. Among them:

[0009] Figure 1 It is a schematic structural diagram of the test device of the infrared thermopile sensor in an embodiment of the present invention when it is in an initial state;

[0010] Figure 2 It is a schematic structural diagram of the test device of the infrared thermopile sensor in an embodiment of the present invention when it is in a working state;

[0011] Figure 3 For Figure 1 and Figure 2 it is an exploded view of the heat carrier in an embodiment;

[0012] Figure 4 For Figure 3 it is a sectional view of the infrared thermopile sensor shown in an embodiment;

[0013] Figure 5 For the Figure 1 and Figure 2 it is a flowchart of the test method of the test device of the infrared thermopile sensor shown in an embodiment of the present invention;

[0014] Figure 6 It is a relationship diagram of the temperature difference between the thermistor and the thermopile chip and the heat dissipation power of the radiator of the test device of the infrared thermopile sensor in an embodiment of the present invention;

[0015] Figure 7 It is a comparative graph of the curves of the thermal carrier temperature changing with time under two different heat dissipation control methods for the test device of the invented infrared thermopile sensor.

Specific Embodiments

[0016] To make the above objects, features, and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0017] As used herein, "one embodiment" or "an embodiment" refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments. Unless otherwise specified, the words indicating electrical connection such as "connected", "coupled", and "joined" herein all mean directly or indirectly electrically connected.

[0018] Please refer to Figure 1 shown, which is a schematic structural diagram of the test device (or test system) of the infrared thermopile sensor in one embodiment of the present invention when it is in the initial state; please refer to Figure 2 shown, which is a schematic structural diagram of the test device (or test system) of the infrared thermopile sensor in one embodiment of the present invention when it is in the working state. Figure 1 and Figure 2 The test device of the infrared thermopile sensor shown in and includes a blackbody 110, a heat insulator 120, and a heat carrier 130.

[0019] The blackbody 110, as a standard radiation source, provides a standard object temperature source for the thermopile test.

[0020] The heat insulator 120 is made of heat insulating material, is located near the blackbody 110, and the heat insulator 120 has a cavity 122 passing through the heat insulator 120. The cavity 122 includes a first port close to the blackbody 110 and a second port far from the blackbody 110.

[0021] The heat carrier 130 has a heat conduction function, and the infrared thermopile sensor 140 is located in the heat carrier 130. The heat carrier 130 can enter or exit the cavity 122 of the heat insulator 120. When the heat carrier 130 is in the initial position, as Figure 1 shown, the heat carrier 130 with the infrared thermopile sensor 140 placed therein is outside the heat insulator 120 and far from the blackbody 110; when the heat carrier 130 is in the working position (or standard test position), as Figure 2As shown, the heat carrier 130 with the infrared thermopile sensor 140 placed thereon is located within the cavity 122 of the heat insulation body 120 and is close to the black body 110.

[0022] In Figure 1 and Figure 2 In the illustrated embodiment, the heat insulation body 120 includes a heat insulation frame 124 which is of a hollow structure. The cavity 122 is located within the heat insulation frame 124, and there is an empty area 126 surrounding the cavity 122 between the heat insulation frame 124 and the cavity 122.

[0023] The heat insulation frame 124 is processed from materials with low thermal conductivity, such as Teflon, PPS (polyphenylene sulfide), bakelite, etc. It is mainly used to isolate the heat exchange between the heat carrier 130 within the cavity 122 and the black body 110. The black body 110 is a high-precision temperature source, and changes in the ambient temperature will affect the temperature fluctuation of the radiation surface of the black body 110. Placing the heat insulation frame 124 between the heat carrier 130 and the black body 110 can increase the temperature stability of the black body 110.

[0024] The empty area 126 around the cavity 122 can be filled with high thermal resistance materials, such as foam, etc. The empty area 126 is mainly used to isolate the heat exchange between the heat carrier 130 within the cavity 122 and the surrounding environment.

[0025] In Figure 1 and Figure 2 In the illustrated embodiment, the test device for the infrared thermopile sensor further includes a slide rail 150 and a sliding base (which can be used as a placement table) 160 provided on the slide rail 150. During the test, first, the heat carrier 130 with the infrared thermopile sensor 140 placed thereon is placed on the sliding base 160, so that the heat carrier 130 is at an initial position outside the heat insulation body 120. As Figure 1 shown, the slide rail 150 extends from outside the cavity 122 to inside the cavity 122, and the heat carrier 130 is placed on the sliding base 160 and is far from the black body 110 and the heat insulation body 120. Then, the sliding base 160 is pushed to slide along the slide rail 150 into the cavity 122 of the heat insulation body 120 and is located at the standard test position, as Figure 2 shown.

[0026] In Figure 1 and Figure 2In the illustrated embodiment, the test device for the infrared thermopile sensor further includes an optical platform 170 and a small fan 180. The heat insulation frame 124 and the slide rail 150 are fixed on the optical platform 170 to ensure that the heat carrier 130 is in the same standard test position each time a test is performed. A small fan 180 is installed above the heat insulation frame 124 to control the temperature change rate of the heat carrier 130 by adjusting the air volume.

[0027] Please refer to Figure 3 as shown, which is Figure 1 and Figure 2 an exploded view of the heat carrier 130 in an embodiment. Figure 3 The heat carrier shown includes a front heat insulation plate 131, a pressing plate 132, an infrared thermopile sensor 140, a bottom plate 133, a device base 134, a circuit board 135, a radiator 137, which are stacked in sequence, and a heat conducting column 136 located between the bottom plate 133 and the radiator 137. When the heat carrier 130 is in the standard test position, the front heat insulation plate 131 is located at the first port of the cavity 122 of the heat insulation body 120; the radiator 137 is located at the second port of the cavity 122 of the heat insulation body 120.

[0028] The front heat insulation plate 131 is made of a material with low thermal conductivity and high temperature resistance, such as engineering plastics like PPS and Teflon. The pressing plate 132 and the bottom plate 133 are made of materials with high thermal conductivity, such as processed from copper, silver, aluminum, etc., mainly used to reduce the temperature gradient of the infrared thermopile sensor 140 and improve the measurement accuracy. And by applying a pre-pressure to the pressing plate 132, the infrared thermopile sensor 140 can be closely attached to the upper surface 1332 of the bottom plate 133 (or the surface close to the pressing plate 132). The device base 134 is used to place the infrared thermopile sensor 140 closely attached to the bottom plate 133 and form a good electrical connection between the infrared thermopile sensor 140 and the circuit board 135. The positioning relationship between the infrared thermopile sensor 140, the bottom plate 133, and the device base 134 can be ensured by the positioning pins 138 installed on the bottom plate 133. The heat conducting column 136 is located between the pressing plate 132 and the radiator 137. The heat conducting column 136 is used to control the direction of the heat flow of the heat carrier 130 located in the heat insulation body 120, so that most of the heat stored in the heat carrier 130 is transferred to the radiator 137 through the heat conducting column 136 for dissipation, minimizing the heat exchange between the heat carrier 130 and other objects or the environment to the greatest extent. At the same time, as long as the convective heat transfer coefficient of the radiator 137 is controlled by the fan 180, the temperature change rate of the heat carrier 130 can be accurately controlled.

[0029] Please refer to Figure 4 as shown, which is Figure 3 a sectional view of the infrared thermopile sensor shown in an embodiment.Figure 4 The infrared thermopile sensor shown includes a thermopile chip 142 and a thermistor 144 encapsulated together. The thermopile chip 142 is used to detect the temperature of the black body 110 (i.e., the object temperature) and output a thermopile output voltage reflecting the temperature of the black body 110. The thermistor 144 is used to detect the ambient temperature (or surrounding temperature) where the thermopile chip 142 is located.

[0030] In another embodiment, the small fan 180 can also be changed to other control modules, such as a hydrothermal exchange module. This control module can be used to control the convective heat transfer coefficient of the radiator of the heat carrier. Specifically, the control module adjusts the convective heat transfer coefficient of the radiator of the heat carrier based on the temperature difference between the ambient temperature obtained by the temperature detection unit of the infrared thermopile sensor and the room temperature, so that the product of the temperature difference between the current ambient temperature and the room temperature T0 and the convective heat transfer coefficient of the radiator is a set value.

[0031] Please refer to Figure 5 shown, which is the Figure 1 and Figure 2 flowchart of the test method of the test device for the infrared thermopile sensor shown in one embodiment. Figure 5 The test method of the test device for the infrared thermopile sensor shown is a dynamic test method, which includes the following steps.

[0032] Step 510, temperature detection unit calibration.

[0033] In one embodiment, the temperature detection unit is the thermistor 144. In order to obtain a high-precision ambient temperature value Tamb, it is necessary to perform temperature calibration on the thermistor 144 encapsulated in the infrared thermopile sensor 140. If the thermistor 144 is not temperature-calibrated, due to the existence of temperature gradients in the test system, the exact ambient temperature value where the thermopile chip 142 is located cannot be obtained. This test method uses the temperature value corresponding to the thermistor 144 as the ambient temperature where the thermopile chip 142 is located.

[0034] Step 520, set the temperature of the black body 110 to provide a standard object temperature Tobj for thermopile testing, and heat the heat carrier 130 to the highest temperature point or / and cool the heat carrier 130 to the lowest temperature point.

[0035] In one embodiment, the heat carrier 130 is heated to the highest temperature point or cooled to the lowest temperature point in a high and low temperature chamber (not shown). Specifically, the heat carrier 130 with the infrared thermopile sensor 140 placed on it is placed in the high and low temperature chamber for heating or cooling to a certain temperature. After that, the heat carrier 130 is taken out and placed on a stage (such as the sliding base 160) and slid to the standard test position. The specific standard test position is shown inFigure 2 。

[0036] Step 530, start the thermopile test, that is, sample the output of the temperature detection unit at a predetermined time interval to obtain the ambient temperature and the output of the thermopile chip to obtain the thermopile output voltage, and store the obtained ambient temperature and thermopile output voltage to form an output voltage - ambient temperature - object temperature matrix table.

[0037] In one embodiment, the predetermined time can be set as needed. Read the thermistor value R(Tamb) of the thermistor 144, and convert the read thermistor value R into the ambient temperature Tamb according to the calibrated data. Store the obtained thermopile output voltage V in the [Tamb, Tobj] of the thermopile output - ambient temperature - object temperature matrix table.

[0038] Step 540, determine whether the obtained ambient temperature Tamb is close to the room temperature T0. Here, being close can mean that the temperature difference between the ambient temperature Tamb and the room temperature T0 is less than or equal to a predetermined temperature threshold. If so, return to step 520 until the temperature of the black body 110 covers the standard object temperature range, such as from 0 to 40 degrees; if not, enter step 550.

[0039] Step 550, the control module adjusts the convective heat transfer coefficient of the radiator of the heat carrier according to the difference between the current ambient temperature and the room temperature T0. Then, return to step 530 to continue the test.

[0040] In one embodiment, the rotation speed of the fan 4 can be adjusted to adjust the product of the convective heat transfer coefficient h of the radiator 137 and Tamb - T0 (the temperature difference between the ambient temperature Tamb and the room temperature T0) to a set value, and return to step 530. In this way, since the present invention actively adjusts the convective heat transfer coefficient of the radiator, the speed at which the ambient temperature Tamb increases from the lowest temperature point to the room temperature T0 and decreases from the highest temperature point to the room temperature T0 is greatly accelerated, which can not only ensure the measurement accuracy but also greatly shorten the test time and improve the test efficiency.

[0041] It should be noted that in order to enable the ambient temperature Tamb to cover from the highest temperature point to the lowest temperature point, the heat carrier 130 needs to be heated to the highest temperature point. After performing steps 530, 540, and 550, the heat carrier 130 is cooled to the highest temperature point, and then steps 530, 540, and 550 are executed again.

[0042] The present invention can achieve the control of the measurement accuracy. The temperature difference between the thermistor 144 and the thermopile chip 142 is related to the heat dissipation power of the radiator 137 and the temperature gradient on the pressing plate 132 and the bottom plate 133. The present invention greatly reduces the temperature difference between the thermistor 144 and the thermopile chip 142 by improving the temperature uniformity. The simulation results are asFigure 6 as shown Figure 6 This is a graph showing the relationship between the temperature difference between the thermistor 144 and the thermopile chip 142 of the test device for the infrared thermopile sensor in an embodiment of the present invention and the heat dissipation power of the heat sink 137. Among them, the thermopile chip 142 can also be called a thermocouple, and the thermistor 144 is an NTC (negative temperature coefficient). The heat dissipation power of the heat sink 137 needs to be set according to the measurement accuracy. For example, on the premise that the ambient temperature Tamb changes by 1 degree, if a measurement accuracy of 99% is required, then the temperature difference between the thermistor 144 and the thermopile chip 142 should be less than 0.01 degree, and the heat dissipation power of the test device of the present invention should not be greater than 11W.

[0043] The present invention adopts active heat dissipation control to shorten the measurement time. For the test device of the present invention, the transient heat conduction equation during the cooling process can be expressed as:

[0044]

[0045] where Q is the heat generation rate. Since there is no heat source inside the heat carrier 130, Q is 0; ρVC p is the heat capacity of the entire heat carrier 130, h is the convective heat transfer coefficient of the heat sink 137, A is the surface area of the heat sink 137, T is the instantaneous temperature of the heat carrier 130 which is basically the same as the ambient temperature Tamb of the thermopile chip 142, and T0 is the temperature of the air in the test environment (i.e., room temperature). Solving Equation 1 can obtain the heat dissipation power of the heat sink 137:

[0046]

[0047] It can be seen from Equation 2 that the heat dissipation power is a quantity that changes with time and has a maximum value at t = 0. In order to ensure the measurement accuracy in the full temperature range, it is necessary to select a suitable heat sink 137 and the temperature characteristics of the heat carrier 130, and the heat dissipation power at t = 0 should be less than our set power. If natural convection temperature regulation is adopted, although the measurement accuracy can be guaranteed, the entire cooling process requires 3 to 5 times the system thermal time constant, and the entire test time will be very long. The test method of the present invention controls the heat dissipation actively to keep the heat dissipation power hA(T - T0) fixed, or always less than the heat dissipation power that needs to be set, and this heat dissipation power can be adjusted in different temperature segments according to requirements. In this way, the test time can be minimized on the premise of ensuring the measurement accuracy. The temperature change after adopting active heat dissipation control is as Figure 7 as shown Figure 7The following is a comparison of the curves of the heat carrier temperature changing with time under two different heat dissipation control modes for the invented infrared thermopile sensor test device. The solid line represents the curve of the heat carrier temperature changing with time under the natural convection heat transfer temperature control mode; the dotted line represents the curve of the heat carrier temperature changing with time under the active heat dissipation control mode. Figure 7 It can be obtained that, under the premise of ensuring that the temperature difference between thermistor 144 and thermopile chip 142 is less than 0.01 degrees, the time required for natural convection temperature adjustment to T0 is 140 minutes.

[0048] The time after adopting the main heat dissipation control was 50 minutes, which shortened the test time by 64%.

[0049] In summary, the infrared thermopile sensor testing device and testing method of the present invention have the following advantages:

[0050] 1. In the test process, the present invention separates the black body from the high and low temperature box, so that the ordinary black body radiation source can meet the test requirements, greatly reducing the cost of the test system;

[0051] 2. The present invention can obtain higher measurement accuracy, such as Figure 6 As shown, under the premise of a 1 degree change in the object temperature, this test system can achieve a measurement accuracy of 99%.

[0052] 3. The present invention adopts an active heat dissipation control method, which can shorten the test time by about 64%, thereby greatly improving the test efficiency.

[0053] 4. The present invention adopts a dynamic test method that does not require a high and low temperature test chamber to achieve stability, and can shorten the conventional heating time of about 30 minutes to 15 minutes. In addition, it can collect enough data points to dig out the nonlinear characteristics of the device, which is of certain significance for basic research and analysis.

[0054] 5. The present invention can strictly control the heat flow and temperature field distribution in the test device during the test process, actively control the temperature change gradient, and use the shortest measurement time while ensuring the measurement accuracy.

[0055] The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiment. Any equivalent modifications or changes made by ordinary technicians in this field based on the content disclosed in the present invention should be included in the protection scope recorded in the claims.

Claims

1. A test device for an infrared thermopile sensor, characterized in that, It includes: A blackbody, which serves as a standard radiation source to provide a standard object temperature Tobj for testing; A heat insulator made of heat-insulating material, which has a cavity penetrating through the heat insulator, and the cavity includes a first port close to the blackbody and a second port far from the blackbody; A heat carrier, in which an infrared thermopile sensor is placed, and the heat carrier can enter and exit the cavity of the heat insulator. When the heat carrier is at the standard test position, the heat carrier with the infrared thermopile sensor enters the cavity of the heat insulator; The heat carrier includes a front heat-insulating plate and a radiator, and the infrared thermopile sensor is located between the front heat-insulating plate and the radiator. When the heat carrier is at the standard test position, the front heat-insulating plate is located at the first port of the cavity of the heat insulator; The radiator is located at the second port of the cavity of the heat insulator.

2. The test device for the infrared thermopile sensor according to claim 1, characterized in that, The heat insulator includes a heat-insulating frame, the heat-insulating frame is a hollow structure, the cavity is located inside the heat-insulating frame, and there is an empty area surrounding the cavity between the heat-insulating frame and the cavity. The heat-insulating frame is made of a material with low thermal conductivity, and the empty area is filled with a material with high thermal resistance.

3. The test device for an infrared thermopile sensor according to claim 2, wherein The material with low thermal conductivity is one or more of Teflon, PPS (polyphenylene sulfide), and bakelite; the material with high thermal resistance is one or more of foam, plastic, and Teflon.

4. The test device for the infrared thermopile sensor according to claim 1, wherein The heat carrier further includes a pressing plate, a bottom plate, a device base, a circuit board, and a heat conducting column, The front heat-insulating plate, the pressing plate, the infrared thermopile sensor, the bottom plate, the device base, the circuit board, and the radiator are stacked in sequence, and the heat conducting column is located between the bottom plate and the radiator.

5. The test device for an infrared thermopile sensor according to claim 4, characterized in that The front heat-insulating plate is made of a material with low thermal conductivity and high temperature resistance; The pressing plate and the bottom plate are made of materials with high thermal conductivity, which are used to reduce the temperature gradient of the infrared thermopile sensor, and by applying a pre-pressure to the pressing plate, the infrared thermopile sensor can be closely attached to the surface of the bottom plate close to the pressing plate; The device base is used to place the infrared thermopile sensor closely attached to the bottom plate and form a good electrical connection between the infrared thermopile sensor and the circuit board; The heat conducting column is used to control the direction of the heat flow of the heat carrier located in the heat insulator, so that most of the heat stored in the heat carrier is dissipated through the heat conducting column to the radiator.

6. The test device for the infrared thermopile sensor according to claim 1, characterized in that, It further includes a control module, and the control module is used to control the convective heat transfer coefficient of the radiator of the heat carrier.

7. The test device for the infrared thermopile sensor according to claim 6, wherein, The control module includes a fan, and the fan controls the convective heat transfer coefficient of the radiator of the heat carrier by changing the wind speed, wherein the control module adjusts the convective heat transfer coefficient of the radiator of the heat carrier based on the temperature difference between the ambient temperature obtained by the temperature detection unit of the infrared thermopile sensor and the room temperature, so that the product of the temperature difference between the current ambient temperature and the room temperature T0 and the convective heat transfer coefficient of the radiator is a set value.

8. The test device for the infrared thermopile sensor according to claim 1, characterized in that, The infrared thermopile sensor includes a thermopile chip and a temperature detection unit packaged together, The thermopile chip is used to detect the temperature of an external object and output a thermopile output voltage reflecting the temperature of the external object; The temperature detection unit is used to detect the ambient temperature where the thermopile chip is located. The test device further includes a memory for storing the measured thermopile output voltage - ambient temperature - object temperature matrix table.

9. The test device for an infrared thermopile sensor according to claim 8, wherein the temperature detection unit is a thermistor.

10. The test device for an infrared thermopile sensor according to claim 1, wherein it further includes a slide rail and a sliding bracket. The heat carrier is placed on the sliding bracket, and the sliding bracket slides on the slide rail to enable the heat carrier to enter or exit the cavity of the heat insulator. The test device further includes a high and low temperature chamber that heats the heat carrier to the highest temperature point or cools it to the lowest temperature point. The temperature of the black body can be controlled to vary within a temperature range.

11. The test device for an infrared thermopile sensor according to claim 10, wherein it further includes an optical platform, and the heat insulator and the slide rail are fixed on the optical platform.

12. A testing method for a testing device of an infrared thermopile sensor as described in any one of claims 1 - 11, characterized in that, It includes: Setting the temperature of the black body to provide the standard object temperature Tobj, heating the heat carrier to the highest temperature point or / and cooling the heat carrier to the lowest temperature point; Moving the heat carrier to the standard test position to start the test. During the test, at every predetermined time, sample the output of the temperature detection unit of the infrared thermopile sensor to obtain the ambient temperature, and obtain the thermopile output voltage from the output of the thermopile chip of the infrared thermopile sensor, and store the obtained ambient temperature and thermopile output voltage to form an output voltage - ambient temperature - object temperature matrix table.

13. The testing method of the testing device for the infrared thermopile sensor according to claim 12, characterized in that It further includes: Judging whether the obtained ambient temperature Tamb is close to the room temperature T0. If so, adjust the temperature of the black body, and re-heat the heat carrier to the highest temperature point or / and the lowest temperature point, and then continue the test until the temperature of the black body has covered the standard object temperature range; if not, the control module adjusts the convective heat transfer coefficient of the radiator of the heat carrier according to the difference between the current ambient temperature and the room temperature T0, and then continues the test.

14. The test method of the test device for an infrared thermopile sensor according to claim 13, wherein The convective heat transfer coefficient of the radiator is controlled by the control module so that the product of the difference between the current ambient temperature sampling value and the room temperature T0 and the convective heat transfer coefficient of the radiator is a set value.

15. The test method of the test device for an infrared thermopile sensor according to claim 13, wherein The heat carrier is heated to the highest temperature point or / and cooled to the lowest temperature point by the high and low temperature chamber. The temperature detection unit is a thermistor, and the thermistor needs to be calibrated before the test.

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